Tape replacing method, tape winding device, wafer edge polishing method and wafer edge polishing equipment

Abstract

The invention provides a tape replacing method, a tape winding device, a wafer edge polishing method and wafer edge polishing equipment. The tape replacement method comprises: a preparation stage comprising: mounting an unwinding drum around which a tape is wound and an empty winding drum to a tape cartridge; the connector of the winding tape extends out of the winding tape outlet of the winding tape box, and the guide tape on the winding drum extends out of the winding tape inlet of the winding tape box; the replacement stage comprises the steps that the tape winding box is installed on the wafer edge polishing equipment, the unwinding drum is located above the winding drum, and the axes of the unwinding drum and the winding drum extend horizontally; a guide plate is connected with the box cover, the guide plate extends towards the polishing head, and a tape guide groove hole of the guide plate is matched with the winding path of the tape around the rollers; the belt guiding column penetrates through the belt guiding groove hole and is connected with the connector; the tape guiding column moves along the tape guiding groove hole to drive the tape to be wound around the rollers, and then the tape is wound back towards the tape inlet to be connected with the guiding tape; and the winding drum is driven to rotate to tighten the winding tape. According to the invention, the winding tape can be quickly replaced, and the pollution of the winding tape is reduced.

Description

Technical Field

[0001] This application relates to the field of wafer processing technology, specifically to a tape replacement method, tape reel device, wafer edge polishing method and equipment. Background Technology

[0002] Edge polishing equipment for wafer edge polishing utilizes polishing tape to polish the edges of wafers. In a tape-and-reel system, the polishing tape is wound into a reel, which extends from the winding position and is then conveyed to the working position. When a tape replacement is needed in the tape-and-reel assembly, existing tape replacement techniques typically involve manual disassembly and replacement. First, the tape reel connected to the take-up and unwind motors is manually removed from the machine. The discarded tape is taken out, and a new, complete reel is loaded onto the reel. Then, it is reinstalled onto the unwind motor, from which the tape is pulled out. The tape is manually wound onto the rollers of the polishing head, and finally, it is attached to the tape roller at the take-up motor and secured with the tape reel, completing the tape replacement process.

[0003] When the tape needs to be replaced or broken, it needs to be manually wound around the tape according to the positions of multiple rollers. During this process, the operator will inevitably touch the working surface of the tape and the surface of the rollers, causing contamination to the tape. There is even a possibility that improper operation may cause creases to appear on the polishing tape. The existing tape winding device has a compact layout and little space for installing the tape. When replacing the tape separately, the winding and unwinding positions need to be disassembled separately. The disassembly process is inconvenient, the winding process is complicated, the equipment downtime is long, and the time cost is high. Summary of the Invention

[0004] In view of this, this application provides a tape replacement method, tape reel apparatus, wafer edge polishing method and equipment, thereby solving or at least alleviating one or more of the above-mentioned problems and other problems existing in the prior art.

[0005] To achieve the aforementioned objective, this application provides a tape replacement method, wherein the tape is wound around a plurality of horizontally extending rollers of a wafer edge polishing device for polishing the edge of a wafer, the method comprising:

[0006] The preparation stage includes: opening the cover of the tape box, installing the unwinding drum with the tape wound on and the empty take-up drum into the tape box respectively; making the tape joint extend from the tape outlet of the tape box, and making the guide tape attached to the take-up drum extend from the tape inlet of the tape box, and closing the cover.

[0007] The replacement phase includes: installing the tape cassette onto the wafer edge polishing equipment such that the unwinding drum is positioned above the take-up drum and their axes extend horizontally; connecting a guide plate parallel to the cassette cover such that the guide plate extends toward the polishing head and the guide slot of the guide plate matches the winding path of the tape around the plurality of rollers; inserting a guide post through the guide slot and connecting it to the connector; moving the guide post along the guide slot to drive the tape to wind around the plurality of rollers, and then winding it back toward the tape inlet to connect with the guide belt; and driving the take-up drum to rotate to tighten the tape.

[0008] Optionally, the method further includes: after the guide post is connected to the connector, opening a nozzle that moves synchronously with the guide post to spray cleaning gas, the nozzle being located in front of the guide post, the cleaning gas blowing towards the connecting groove and cleaning the rollers close to the guide post, so as to keep the guide post clean and pre-clean the rollers to be wound.

[0009] Optionally, inserting the guide post through the guide post slot and connecting it to the connector includes: attaching the connector to the connecting groove of the guide post, wherein the position of the connecting groove matches the winding position of the tape on the outer periphery of the plurality of rollers.

[0010] Optionally, passing the guide post through the guide post slot and connecting it to the connector includes: setting the guide post such that the guide groove of the guide post is located in the guide post slot, and the first flange and the second flange at both ends of the guide groove are located on both sides of the guide plate.

[0011] Optionally, the method further includes: when the connector is connected to the guide post, snapping the guide post onto a first snap-fit ​​member on the side wall of the tape cassette corresponding to the tape exit; and when the connector is connected to the guide belt, snapping the guide post onto a second snap-fit ​​member on the side wall of the tape cassette corresponding to the tape inlet.

[0012] Optionally, the guide plate is detachably connected to the cover via a pin. When the tape released from the unwinding drum is wound onto the polishing head and the tape is guided back to the take-up drum, the guide plate is fixed relative to the cover via the pin. After the tape winding is completed, the pin is removed to remove the guide plate from the cover. The pin is configured with three legs arranged in a triangular array, and the guide plate and the cover are respectively provided with three mounting holes for inserting the three legs.

[0013] Optionally, the guide plate is foldably connected to the cover; as the tape released from the unwinding drum is wound onto the polishing head and guided back to the take-up drum, the guide plate unfolds toward the polishing head so that the guide slots align with the positions of the plurality of rollers; after the tape winding is completed, the guide plate folds back to the cover.

[0014] Optionally, a first opening and a second opening are respectively constructed on opposite sidewalls of the reel cassette, the first opening being located on the side of the unwinding drum opposite to the take-up drum, and the second opening being located on the side of the take-up drum opposite to the unwinding drum; the method further includes: after installing the reel cassette into the wafer edge polishing equipment, turning on the self-cleaning nozzle above the first opening, the self-cleaning nozzle spraying self-cleaning gas from top to bottom into the reel cassette through the first opening to clean the reel on the unwinding drum and prevent contaminants below the unwinding drum from flying upwards, and to prevent contaminants carried by the reel wound onto the take-up drum from flying upwards and contaminating the reel on the unwinding drum.

[0015] Optionally, the method further includes: after the tape on the unwinding drum has been completely released, removing the tape cassette from the wafer polishing equipment as a whole, and then installing a tape cassette with a new unwinding drum and a new take-up drum.

[0016] According to another aspect of this application, a wafer edge polishing method is provided, comprising: performing a tape replacement by the tape replacement method described above; activating a drive roller among a plurality of rollers of a polishing head to drive the tape, and synchronously driving the unwinding drum and the take-up drum to release and retract the tape; and moving the polishing head toward a horizontally positioned wafer so that the tape contacts the edge of the wafer for polishing.

[0017] Optionally, the plurality of rollers includes two vertically spaced feed rollers facing the wafer, and the polishing head moves toward the wafer so that the tape between the two feed rollers contacts the wafer and polishes the edge of the wafer; driving the tape includes: the drive roller driving the tape to move from top to bottom between the two feed rollers.

[0018] According to another aspect of this application, a tape reel apparatus is provided for performing the aforementioned tape replacement method, comprising:

[0019] A reel cassette, which is integrally replaceable in the wafer edge polishing equipment, is provided with an unwinding spool and a rewinding spool;

[0020] A guide belt assembly, including a guide plate and guide belt posts, is used to wind a roll of tape released from the unwinding drum onto the polishing head of the wafer polishing equipment and guide the roll of tape back to the take-up drum; the guide plate has guide belt slots that match the winding path of the roll of tape around the plurality of rollers; the guide belt posts are connected to the roll of tape released from the unwinding drum and move along the guide belt slots to drive the roll of tape to wind onto the plurality of rollers and then retract it back to the unwinding drum.

[0021] Optionally, the tape cassette has a tape outlet corresponding to the unwinding drum and a tape inlet corresponding to the take-up drum on its sidewall facing the polishing head. A first locking member and a second locking member are respectively provided on the outer sidewall of the tape cassette at positions corresponding to the tape outlet and the tape inlet. The guide post is locked to the first locking member to connect with the connector of the tape extending from the tape outlet. The guide post is locked to the second locking member to connect the connector with the guide belt extending from the tape inlet. The guide belt is connected to the take-up drum to drive the tape to wind onto the take-up drum.

[0022] Optionally, the guide plate is provided with a first guide hole and a second guide hole that respectively match the positions of the first snap-fit ​​and the second snap-fit, the first guide hole being the starting point of the guide strip groove and the second guide hole being the ending point of the guide strip groove.

[0023] Optionally, the plurality of rollers includes two vertically spaced feed rollers facing the wafer, the wafer being placed horizontally; the polishing head is movable toward the wafer so that the tape between the two feed rollers contacts the wafer and polishes the edge of the wafer; the plurality of rollers also includes a drive roller configured to drive the tape to move so that the tape moves from top to bottom past the two feed rollers, thereby polishing the edge of the wafer from top to bottom.

[0024] Optionally, the plurality of rollers may further include a driven roller located between the two feed rollers and the tape cassette, the driven roller being used to guide the tape winding around the polishing head.

[0025] Optionally, the tape cassette has a lid and a bottom. A first reel and a second reel are rotatably disposed on the bottom of the cassette. The unwinding drum and the take-up drum are respectively sleeved onto the first reel and the second reel and are driven to rotate by the first reel and the second reel, respectively. The lid can be opened to replace the unwinding drum and the take-up drum after use. The bottom of the cassette is also provided with a first guide roller and a second guide roller that cooperate with the unwinding drum and the take-up drum, respectively, to guide the tape release or retraction.

[0026] Optionally, the guide post is provided with a first flange and a second flange spaced apart along the axial direction, and a guide groove is formed between the first flange and the second flange. The guide groove is inserted into the guide groove hole, and the first flange and the second flange are engaged on both sides of the guide plate.

[0027] Optionally, the guide post further includes a third flange spaced apart from the second flange, and a connecting groove is formed between the second flange and the third flange, wherein the joint of the tape extending from the tape outlet is bonded to the connecting groove.

[0028] Optionally, a nozzle is provided on the side of the guide post facing the polishing head. The nozzle is configured to spray cleaning gas toward the connecting groove during the movement of the guide post to clean the connecting groove and the rollers close to the guide post, so as to keep the guide post clean and pre-clean the rollers to be wound.

[0029] Optionally, the tape cassette has a lid and a bottom perpendicular to the first reel, and the guide plate is detachably connected to the lid; the guide plate is connected to the lid when the tape released from the unwinding drum is wound onto the polishing head of the wafer polishing equipment and the tape is guided back to the take-up drum; the guide plate is removed from the lid after the tape winding is completed.

[0030] Optionally, the tape cassette has a lid and a bottom perpendicular to the first reel, and the guide plate is foldably connected to the lid; when the tape released from the unwinding drum is wound onto the polishing head of the wafer polishing equipment and the tape is guided back to the take-up drum, the guide plate unfolds toward the polishing head so that the guide slots match the positions of the plurality of rollers; after the tape winding is completed, the guide plate folds back to the lid.

[0031] Optionally, a first opening and a second opening are respectively constructed on opposite sidewalls of the reel cassette. The first opening is located on the side of the unwinding drum opposite to the take-up drum, and the second opening is located on the side of the take-up drum opposite to the unwinding drum. When the reel cassette is installed to the wafer edge polishing equipment, a self-cleaning nozzle above the first opening sprays self-cleaning gas from top to bottom into the reel cassette through the first opening to clean the reel on the unwinding drum and prevent contaminants carried on the reel wound onto the take-up drum from flying upwards and contaminating the reel on the unwinding drum.

[0032] According to another aspect of this application, a wafer edge polishing apparatus is provided, comprising:

[0033] A support platform is used to support wafers;

[0034] The tape winding device described in the foregoing aspects;

[0035] A polishing head, the tape of the tape winding device is wound onto the polishing head, the polishing head being configured to move toward the wafer so that the tape wound on it contacts the edge of the wafer to perform wafer edge polishing.

[0036] According to the technical solution of this application, a tape cassette can be used to simultaneously replace the take-up and unwrap spools, simplifying the tape disassembly and installation process on the machine. The replacement of the unwrap and take-up spools in the tape cassette can be performed offline without stopping the wafer edge polishing equipment, significantly reducing downtime for tape changes and improving the overall efficiency of wafer processing. Simultaneously, it avoids introducing contaminants into the wafer edge polishing equipment during unwrap and take-up spool replacement, improving the cleanliness and quality of wafer processing. The tape cassette is matched with the guide tape assembly. This combined method utilizes a guide belt assembly to quickly wind the tape onto the polishing head, reducing tape contamination, damage, and creases caused by operator tape winding. It also reduces the transfer of creases and cracks from tape twisting or damage to the wafer edge during polishing, preventing scratches and contamination. Furthermore, it minimizes tape contamination that can transfer to the wafer during polishing, improving wafer processing quality and reducing wafer breakage. This method integrates the installation process into the tape cassette preparation, simplifying the replacement phase and effectively reducing machine downtime. Tape change time can be reduced by 40-50%, and machine uptime can be increased by 0.104-0.138%, thereby significantly improving wafer processing quality and efficiency. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.

[0038] Figure 1 A tape reel system for a wafer edge polishing apparatus is shown;

[0039] Figure 2 It shows Figure 1 A side view of a tape reel device;

[0040] Figure 3 Flowchart for replacing existing tape / reel;

[0041] Figure 4 A tape reel device according to one embodiment of this application is shown;

[0042] Figure 5 It shows Figure 4 A perspective view;

[0043] Figure 6 It shows Figure 4 A bottom view of the tape reel device in the middle;

[0044] Figure 7 It shows Figure 4 Right view of the tape reel device;

[0045] Figure 8 It shows Figure 4 A schematic diagram of the tape cassette in the image;

[0046] Figure 9 It shows Figure 4 A schematic diagram of the guide plate in the middle;

[0047] Figure 10 It shows Figure 4 A schematic diagram of the latch in the middle;

[0048] Figure 11 A schematic diagram of a guide post according to one embodiment of this application is shown;

[0049] Figure 12 A flowchart illustrating a method for tape replacement using this tape reel device is shown.

[0050] Figure label:

[0051] Belt winding device 10; belt winding 101; guide belt 1010; unwinding reel 102; take-up reel 103; belt box 11; box bottom 111; guide roller 1110; box cover 112; unwinding drum 113; first reel 1130; take-up drum 114; second reel 1140; first snap-fit ​​115; second snap-fit ​​116; guide plate 120; guide groove 121; first guide hole 1211; second guide hole 1212; strip groove 1213; guide post 130; guide groove 1301; connecting groove 1302; first flange 131; second flange 132; third flange 133; nozzle 134; pin 140; unwinding motor 51; take-up motor 52; motor mounting plate 53.

[0052] Polishing head 20; roller mounting plate 22; roller 21; drive roller 211; drive motor 2110; feed roller 212; support platform 30; wafer 40. Detailed Implementation

[0053] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.

[0054] In the description of this application, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0055] In addition, in the description of this application, unless otherwise specified and limited, it should be noted that the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to mechanical or electrical connections, or internal connections between two components. They can be direct connections or indirect connections through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms according to the specific circumstances.

[0056] Figure 1 A tape reel system for a wafer edge polishing apparatus is shown, which may include two tape reel units 10. Figure 2 It shows Figure 1 A side view of a tape reel device 10, wherein the dashed line represents the tape 101, and at the same time... Figure 2 The image also shows a polishing head 20, a stage 30, and a wafer 40 disposed on the stage 30 of a wafer edge polishing apparatus. The polishing head 20 has a horizontal extension ( Figure 2 Multiple rollers 21 (vertical to the paper surface) are wound around the multiple rollers 21, and a tape 101 is able to move along the multiple rollers 21 while they rotate. The wafer 40 is placed horizontally on a support stage 30, which can drive the wafer 40 to rotate. The polishing head 20 moves toward the wafer 40 so that the tape 101 contacts the edge of the wafer 40. The tape 101 moves along the multiple rollers 21 to rub the edge of the wafer 40 to polish the edge of the wafer 40. The polishing head 20 can be moved horizontally toward the wafer 40, or it can swing up and down at the edge of the wafer 40 to polish the edge of the wafer 40 into a smooth arc shape. Figure 2 The winding device 10 includes an unwinding reel 102 and a take-up reel 103. The unwinding reel 102 and the unwinding drum 113 (see...) Figure 8The connection, for example, includes an annular protrusion at the center of the unwind reel 102, and an unwind drum 113 that can be fitted onto the outside of the annular protrusion. Unused tape 101 is wound on the unwind drum 113. The unwind motor 51 (see...) Figure 7 The unwinding reel 102 rotates, which in turn drives the unwinding drum 113 to rotate, releasing the winding 101. The take-up reel 103 is connected to the take-up drum 114 (see...). Figure 8 ) is used to wind up used, discarded tape 101, and a take-up motor 52 (see Figure 7 The drive reel 103 and the reel 114 rotate to retract the waste tape 101.

[0057] Figure 3 The existing tape replacement process is shown, and the specific steps are as follows:

[0058] S01: After all the tape 101 on the unwinding drum 113 has been released, the wafer edge polishing equipment is stopped.

[0059] S02: The operator disassembles the unwinding reel 102 and the take-up reel 103, as well as the unwinding drum 113 and the take-up drum 114, respectively.

[0060] S03: Remove the discarded tape 101 from the unwinding drum 113;

[0061] S04: Install the new unwinding drum 113 with the whole roll of tape 101 onto the unwinding reel 102;

[0062] S05: Install reel 102;

[0063] S06: Manually wind the tape 101 onto the multiple rollers 21 of the polishing head 20;

[0064] S07: Attach the tape 101 to the unwinding drum 114;

[0065] S08: Install the unwinding drum 114 and the take-up reel 103 to complete the replacement of the tape 101.

[0066] When replacing the tape 101, the existing tape winding device 10 requires the separate disassembly and installation of the take-up reel 103 and the unwind reel 102. Due to its compact layout, the space for installing the tape 101 is limited, the disassembly process is inconvenient, and the manual winding process is complex, requiring 30 to 40 minutes for tape replacement, resulting in significant equipment downtime and high time costs. Furthermore, when the tape 101 needs replacement or breaks, it must be manually wound according to the positions of the multiple rollers 21. During this process, operators inevitably touch the working surface of the tape 101 and the surface of the rollers 21, causing contamination of the tape 101. This contaminates the wafer 40 during polishing, and improper operation may even cause creases in the tape 101. These creases can then scratch the edges of the wafer 40 during polishing, increasing stress concentration at the wafer 40 edges and increasing the risk of edge breakage.

[0067] Therefore, this application provides a tape reel device 10 and a tape reel replacement method.

[0068] Figure 4 The present application illustrates a tape reel device 10 according to one embodiment, which can be used in wafer edge polishing equipment. The tape reel device 10 mainly includes a tape reel cassette 11 and a tape guide assembly, which mainly includes a guide plate 120 and a tape guide post 130. Figure 5 It shows Figure 4 A perspective view showing the internal structure of the tape cassette 11 and the polishing head 20, which is blocked by the guide plate 120, with gray dashed lines. Figure 6 It shows Figure 4 A bottom view of the tape winding device 10 in the middle. Figure 7 It shows Figure 4 The right view of the tape winding device 10 shows that it also includes a motor mounting plate 53, an unwinding motor 51, and a take-up motor 52. Additionally, the polishing head 20 includes a plurality of rollers 21, a roller mounting plate 22 for mounting the rollers 21, and a drive motor 2110 for driving the drive roller 211 among the rollers 21. The guide plate 120 is parallel to the motor mounting plate 53 and the roller mounting plate 22, or perpendicular to the axis of the rollers 21 or the unwinding drum 113 and the take-up drum 114.

[0069] Figure 8 It shows Figure 4A schematic diagram of the tape cassette 11 is shown, with the tape cassette 11 in an open state. The tape cassette 11 has a bottom 111 and an openable cover 112 opposite to the bottom 111. There are four side walls between the cover 112 and the bottom 111. When the tape cassette 11 is installed in the wafer edge polishing equipment, the tape cassette 11 is placed vertically, with the cover 112 and the bottom 111 extending vertically. The tape cassette 11 is integrally and replaceably installed in the wafer edge polishing equipment, and an unwinding spool 113 and a take-up spool 114 are detachably installed inside. When the tape cassette 11 is installed in the wafer edge polishing equipment, the axes of the unwinding spool 113 and the take-up spool 114 extend horizontally. In the vertical direction, the unwinding spool 113 is positioned above the take-up spool 114 so that after the subsequent tape 101 is wound onto the polishing head 20, the tape 101 can move from top to bottom, thereby facilitating the downward discharge of polishing debris. The center of the unwinding drum 113 is fitted onto the first spool 1130 in the tape cassette 11, and the center of the take-up drum 114 is fitted onto the second spool 1140 in the tape cassette 11. The first spool 1130 and the second spool 1140 are rotatably connected to the bottom 111 of the tape cassette 11, for example, via bearings or other connecting members. Like the axes of the unwinding drum 113 and the take-up drum 114, the first spool 1130 and the second spool 1140 also extend horizontally, i.e., parallel to the plurality of rollers 21 of the polishing head 20, so that the surface of the tape 101 does not twist during the entire release, winding, and retraction process. The first spool 1130 and the second spool 1140 can be driven to rotate by the unwinding motor 51 and the take-up motor 52, respectively, to drive the unwinding drum 113 and the take-up drum 114 to rotate for unwinding and rewinding, thereby synchronously releasing and retracting the tape 101. The rotational speeds of the first reel 1130 and the second reel 1140 can be the same to ensure that the release and retraction amounts of the tape 101 are identical. Alternatively, when the tape 101 is slack, the rotational speed of the second reel 1140 can be greater than that of the first reel 1130 to ensure that the winding speed is greater than the unwinding speed, thereby appropriately tightening the tape 101 and ensuring the required tension of the tape 101 for wafer edge polishing. In other words, the rotational speeds of the first reel 1130 and the second reel 1140, or the unwinding drum 113 and the take-up drum 114, can be adjusted to regulate the tension of the tape 101 wound onto the polishing head 20. The bottom of the housing 111 can also be provided with two guide rollers 1110 corresponding to the unwinding drum 113 and the take-up drum 114, respectively, to guide the tape 101.In the above embodiments, the unwinding reel 102 and the take-up reel 103 are not included; however, in optional embodiments, the unwinding reel 102 and the take-up reel 103 may be provided respectively connected to the unwinding drum 113 and the take-up drum 114. In this case, the unwinding drum 113 and the take-up drum 114 are fitted onto the first reel 1130 and the second reel 1140 but are not connected to them. The first reel 1130 and the second reel 1140 are respectively connected to the unwinding reel 102 and the take-up reel 103, so that the driving force of the motor is transmitted to the unwinding drum 113 and the take-up drum 114 through the first reel 1130 and the second reel 1140, the unwinding reel 102 and the take-up reel 103 respectively.

[0070] The guide belt assembly is used to wind the tape 101 released from the unwinding drum 113 onto the polishing head 20 of the wafer edge polishing equipment and guide the tape 101 to the recovery drum 114. It mainly includes a guide plate 120 and a guide belt post 130. Figure 9 It shows Figure 4 A schematic diagram of the guide plate 120 is shown. During the winding operation of the tape 101, the guide plate 120 is arranged vertically, and the plane of the guide plate 120 is parallel to the plane of the cover 112. The guide plate 120 extends from the tape cassette 11 toward the polishing head 20 and has guide slots 121 that match the winding path of the tape 101 around the multiple rollers 21. The guide post 130 is inserted into the guide slot 121, connects to the tape 101 released from the unwinding drum 113, and moves along the guide slot 121 to drive the tape 101 to wind around the multiple rollers 21 and then return it to the unwinding drum 113.

[0071] In a specific embodiment, the side wall of the tape cassette 11 facing the polishing head 20 is provided with a tape outlet corresponding to the unwinding drum 113 and a tape inlet corresponding to the take-up drum 114. A first locking member 115 and a second locking member 116 are respectively provided on the outer side of this side wall at positions corresponding to the tape outlet and tape inlet. The connector of the tape 101 can be pulled out from the tape outlet and temporarily attached to the side wall of the tape cassette 11. The guide post 130 can be locked into the first locking member 115. Then, the temporarily attached connector of the tape 101 can be removed and bonded to the guide post 130. The locking of the guide post 130 into the first locking member 115 improves its stability, ensures the accuracy of the bonding position of the connector to the guide post 130, and improves bonding efficiency. The guide belt 1010 on the take-up drum 114 can be pulled out from the tape inlet and then temporarily attached to the side wall of the tape box 11. When the guide post 130 drives the tape 101 to wind around the multiple rollers 21 of the polishing head 20 and then returns to the tape inlet, the guide post 130 can be engaged with the second snap-fit ​​116 to connect the connector to the guide belt 1010. The guide belt 1010 can drive the tape 101 to wind onto the take-up drum 114.

[0072] like Figure 9The guide plate 120 is provided with a first guide hole 1211 and a second guide hole 1212 that respectively match the positions of the first snap-fit ​​member 115 and the second snap-fit ​​member 116. The first guide hole 1211 is the starting point of the guide strip groove 121, and the second guide hole 1212 is the ending point of the guide strip groove 121. The first guide hole 1211 and the second guide hole 1212 can be the same size and match the maximum outer diameter of the guide strip post 130, for example, slightly larger than the maximum outer diameter of the guide strip post 130, so that the guide strip post 130 can be inserted into the guide plate 120 or removed from the guide plate 120 through the first guide hole 1211 and the second guide hole 1212.

[0073] In an optional embodiment, the guide plate 120 is via, as Figure 10 The pin 140 shown is detachably connected to the cover 112. During the winding operation, when the tape 101 released from the unwinding drum 113 is wound onto the polishing head 20 and guided to the rewind drum 114, the guide plate 120 is fixed relative to the cover 112 via the pin 140. After the tape 101 is wound, the pin 140 is removed to remove the guide plate 120 from the cover 112. The pin 140 is constructed with three legs arranged in a triangular array. The guide plate 120 and the cover 112 are respectively provided with three mounting holes for inserting the three legs to securely connect the guide plate 120 and the cover 112.

[0074] In another embodiment, the guide plate 120 is foldably connected to the cover 112. When the tape 101 released from the unwinding drum 113 is wound onto the polishing head 20 and the tape 101 is guided to the take-up drum 114, the guide plate 120 unfolds toward the polishing head 20 so that the guide slot 121 is aligned with the positions of the plurality of rollers 21. After the tape 101 is wound, the guide plate 120 is folded to the cover 112 to avoid interfering with the operation of other components.

[0075] Figure 11 A schematic diagram of a guide post 130 according to one embodiment of this application is shown. The guide post 130 is provided with a first flange 131 and a second flange 132 spaced apart along the axial direction. A guide groove 1301 is formed between the first flange 131 and the second flange 132. Figure 6 As shown, the guide post 130 is inserted into the guide slot 121 with its guide groove 1301, and the outer diameter of the first flange 131 and the second flange 132 exceeds the width of the strip-shaped slot 1213 of the guide slot 121, so as to be locked on both sides of the guide plate 120, thereby limiting the position of the guide post 130 along the axial direction of the first reel 1130 (that is, along the axial direction of the plurality of rollers 21), so as to facilitate the accurate winding position of the tape 101 onto the rollers 21. Specifically, in conjunction with Figure 9The diameters of the first flange 131 and the second flange 132 match the diameters of the first guide hole 1211 and the second guide hole 1212 to allow insertion into the first guide hole 1211 and the second guide hole 1212. The portion of the guide strip slot 121 other than the first guide hole 1211 and the second guide hole 1212 is a strip-shaped slot 1213 with a width smaller than the diameters of the first guide hole 1211 and the second guide hole 1212 and smaller than the diameters of the first flange 131 and the second flange 132, such that the first flange 131 and the second flange 132 of the guide strip post 130 can pass through the first guide hole 1211 and the second guide hole 1212, and the guide groove... When 1301 moves in the strip slot 1213, the first flange 131 and the second flange 132 can be engaged on both sides of the guide plate 120 to limit the guide post 130 in the axial direction of the guide post 130, so that the guide post 130 keeps the guide groove 1301 always matched with the position of the winding roll 101 of the multiple rollers 21 during the movement, so that the roll 101 led by the guide groove 1301 does not twist or deform and is accurately wound onto the multiple rollers 21.

[0076] Furthermore, the guide post 130 also includes a third flange 133 spaced apart from the second flange 132, and a connecting groove 1302 is formed between the second flange 132 and the third flange 133. The joint of the tape 101 extending from the tape exit is bonded to the connecting groove 1302. In the axial direction of the guide post 130 or the roller 21, i.e. Figure 6 In the vertical direction, the position of the connecting groove 1302 matches the winding position of the tape 101 on the outer periphery of the multiple rollers 21. On the one hand, the connecting groove 1302 can position the joint, so that the pasting position of the joint of the tape 101 matches its winding position on the outer periphery of the multiple rollers 21, thus avoiding creases, damage or breakage of the tape 101 due to twisting during the winding process. On the other hand, the second flange 132 and the third flange 133 on both sides of the connecting groove 1302 can resist possible impacts from other components during the movement of the guide belt 1010, preventing other components from directly impacting or scratching the tape 101, thus providing a certain degree of protection for the tape 101, especially the joint of the tape 101, and reducing its damage and detachment.

[0077] like Figure 6 and Figure 11In the illustrated embodiment, a nozzle 134 may be detachably mounted on the guide post 130, and the nozzle 134 may be connected to a gas source in the wafer edge polishing equipment. The nozzle 134 may be positioned in front of the guide post 130, i.e., on the side of the guide post 130 facing the polishing head 20, so that the cleaning gas sprayed by the nozzle 134 blows towards the connecting groove 1302 during the movement of the guide post 130, and blows towards the rollers 21 near the guide post 130 and within the range of the cleaning gas when the guide post 130 moves close to one or more of the rollers 21, thereby maintaining the cleanliness of the guide post 130, especially near the connecting groove 1302 of the joint where the tape 101 is attached, and pre-cleaning the rollers 21 to be wound with the tape 101 during the movement of the guide post 130. The cleaning gas may be GN2 (high-purity nitrogen). This avoids introducing contaminants into the polishing head 20 during the winding process of the tape 101, thus keeping the polishing head 20 clean. In addition, during the previous edge polishing process of wafer 40, contaminants such as processing debris may fall onto multiple rollers 21. By pre-cleaning the rollers 21, contaminants on the rollers 21 can be prevented from adhering to the tape 101 and moving to the vicinity of wafer 40 with the tape 101 during the subsequent edge polishing process, thus contaminating or scratching wafer 40. It can also reduce contaminants between rollers 21 and tape 101, improve the smoothness of tape 101 moving around rollers 21, and prevent contaminants from scratching rollers 21 or tape 101.

[0078] like Figure 5As shown, a plurality of rollers 21 of the polishing head 20 are mounted to a roller mounting plate 22 of the polishing head 20. The plurality of rollers 21 include two vertically spaced feed rollers 212 facing the wafer 40. The polishing head 20 and the tape winding device 10 can be mounted together or separately to a drive device capable of driving the polishing head 20 to move toward the horizontally positioned wafer 40, so that the tape 101 between the two feed rollers 212 contacts the wafer 40 and polishes the edge of the wafer 40. The roller mounting plate 22 is constructed with a notch between the two feed rollers 212 to avoid the wafer 40, allowing the edge of the wafer 40 to be partially inserted into the notch when it contacts the tape 101 for polishing, thereby increasing the contact area with the tape 101 and forming an arc-shaped contact profile, thereby improving polishing efficiency and forming an arc-shaped wafer edge to reduce stress concentration at the edge. The plurality of rollers 21 also includes a drive roller 211 configured to drive the tape 101 to move it from top to bottom between two feed rollers 212 for top-down edge polishing of the wafer 40. The plurality of rollers 21 also includes a driven roller located between the two feed rollers 212 and the tape cassette 11, the driven roller guiding the tape 101 as it winds around the polishing head 20; in practice, the feed rollers 212 may be configured identically to the driven roller. A driven roller located downstream of the drive roller 211 along the winding path of the tape 101 is positioned adjacent to the drive roller 211, and the tape 101 winds in an S-shape between them (see [link to documentation]). Figure 2 This increases the wrap angle of the tape 101 around the drive roller 211, thereby increasing the contact area between the tape 101 and the drive roller 211, making the frictional driving force received by the tape 101 from the drive roller 211 more stable.

[0079] To achieve rapid replacement of the tape 101, saving machine downtime and reducing contamination, this application employs a tape cassette 11 in conjunction with a guide plate 120 for convenient and rapid replacement of the tape 101. The tape cassette 11 allows for complete replacement of the wafer edge polishing equipment, facilitating transport and simple and quick replacement operations. Furthermore, the replacement of the unwinding spool 113 and the take-up spool 114 within the tape cassette 11 can be performed offline without stopping the wafer edge polishing equipment, significantly reducing downtime for tape replacement and improving the overall efficiency of wafer processing. Simultaneously, it avoids introducing contaminants into the wafer edge polishing equipment during the replacement of the unwinding spool 113 and the take-up spool 114, improving the cleanliness and quality of wafer processing. The guide plate 120 is provided with a guide strip slot 121, which can be used to wind the tape 101 onto the corresponding roller 21 of the polishing head 20 using the guide strip post 130. This can reduce the operation error during the manual tape winding process, reduce the twisting, damage or contamination of the tape 101, thereby improving the service life of the tape 101 itself. It also reduces the transfer of creases, cracks or other damage caused by the twisting or damage of the tape 101 to the edge of the wafer 40 during polishing, resulting in scratches on the edge of the wafer 40. Furthermore, it reduces the transfer of contamination from the tape 101 to the wafer 40 during polishing, which would cause wafer contamination or scratches by contaminants.

[0080] Additionally, in a preferred embodiment, the tape cassette 11 is configured such that when the tape cassette 11 is mounted to the wafer edge polishing equipment, the upper sidewall and the lower sidewall of the tape cassette (i.e., Figure 4 and Figure 5 The upper and lower sidewalls of the cassette 11 are respectively provided with a first opening and a second opening. It should be understood that "when the cassette 11 is mounted to the wafer edge polishing equipment" is merely a limitation on the orientation of the cassette 11 for the convenience of describing the location of the sidewalls containing the first and second openings; that is, the cassette 11 is positioned as follows: Figure 4 or Figure 5In that position, the first opening and the second opening are located on the upper sidewall and the lower sidewall, respectively, rather than meaning that the first opening and the second opening are only present when the tape cassette 11 is mounted to the wafer edge polishing equipment. It can also be understood that the first opening is located on the sidewall of the tape cassette 11 on the side of the unwinding drum 113 opposite to the take-up drum 114, and the second opening is located on the sidewall of the tape cassette 11 on the side of the take-up drum 114 opposite to the unwinding drum 113. The wafer edge polishing equipment has a self-cleaning nozzle above the first opening. The self-cleaning nozzle is configured to spray self-cleaning gas from top to bottom into the reel 11 through the first opening to clean the unused reel 101 on the unwound drum 113 and prevent contaminants below the unwound drum 113 from flying upwards. During wafer edge polishing, it also prevents contaminants carried on the used reel 101 wound onto the take-up drum 114, such as polishing debris generated during wafer edge polishing, from flying upwards and contaminating the unused reel 101 on the unwound drum 113. This allows for self-cleaning of unused tape 101 on the unwind spool 113. The self-cleaning gas blows downwards, creating a clean airflow to protect the space occupied by the unwind spool 113, ensuring the cleanliness of the tape 101 released from the unwind spool 113. This prevents the tape 101 wound onto the polishing head 20 and in contact with the wafer 40 for edge polishing from carrying contaminants that could contaminate or scratch the wafer 40, thus ensuring the cleanliness of the wafer 40 and the processing quality. The second opening at the bottom allows contaminants to drain downwards and facilitates airflow within the tape cassette 11.

[0081] In an optional embodiment, the first opening and the second opening can be configured as a strip-shaped slot, and the self-cleaning nozzle is configured as a flat, flared opening to spray a fan-shaped airflow pattern that matches the shape of the first opening.

[0082] Figure 12 A flowchart illustrating a method for replacing tape 101 using the tape reel assembly 10 is shown. Generally, this tape replacement method divides the tape replacement process into two stages: a preparation stage and a replacement stage. In the preparation stage, the unwinding spool 113 and the take-up spool 114 in the tape cassette 11 are installed in preparation for tape replacement. In the replacement stage, the wafer edge polishing equipment needs to be stopped for tape 101 replacement. First, the tape cassette 11 is installed according to the positions of the motor shafts of the take-up motor 52 and the unwinding motor 51. Then, the guide post 130 is moved within the guide slot 121 to complete the winding of tape 101 onto the polishing head 20. By placing some of the work in the preparation stage, the process required for stopping the wafer edge polishing equipment to replace tape 101 can be reduced, saving machine downtime. Tape replacement time can be reduced by 40% to 50%, and equipment uptime can be increased by 0.104% to 0.138%, thereby improving wafer 40 processing efficiency.

[0083] The preparation stage requires the tape box 11 to be installed, which includes the following steps:

[0084] S1: Open the cover 112 of the tape box 11, and install the unwinding drum 113 with the tape 101 wound on it and the empty take-up drum 114 into the tape box 11 respectively. If the tape 101 is replaced during the processing, the operation of disassembling the old unwinding drum 113 and take-up drum 114 is also included.

[0085] S2: Extend the connector of the tape 101 from the tape exit of the tape cassette 11 and extend the guide tape 1010 attached to the take-up drum 114 from the tape inlet of the tape cassette 11. Then close the cassette cover 112. The connector of the tape 101 and the guide tape 1010 extending from the tape cassette 11 can be temporarily fixed to the side wall of the tape cassette 11 to prevent the tape 101 or the guide tape 1010 from retracting into the tape cassette 11 during movement or installation.

[0086] Thus, while the wafer edge polishing equipment continues normal wafer 40 processing without stopping, the setup of the take-up spool 114 and unwind spool 113 in the tape cassette 11 is completed. Next, the machine can be stopped to enter the replacement phase, where the tape 101 is wound onto the polishing head 20, specifically including the following steps:

[0087] S3: Install the tape cassette 11 onto the wafer edge polishing equipment, such that the unwind spool 113 is positioned above the take-up spool 114 and their axes extend horizontally, with the tape exit and inlet facing the polishing head 20. For example, the center of the unwind spool 113 is fitted onto the first spool 1130, and the center of the take-up spool 114 is fitted onto the second spool 1140. The center of the unwind spool 113 may have a hexagonal through-hole, and the first spool 1130 may have a hexagonal shape matching the hexagonal through-hole, so that the unwind spool 113 can rotate with the first spool 1130 after being fitted onto it. The take-up spool 114 and the second spool 1140 may also adopt a similar structural design.

[0088] S4: Connect the guide plate 120 parallel to the cover 112 on the outside of the cover 112, so that the guide plate 120 extends toward the polishing head 20. Specifically, part of the guide plate 120 is connected to the cover 112, and the rest extends out of the tape cassette 11 and toward the polishing head 20. The guide slot 121 of the guide plate 120 is located on the part extending out of the tape cassette 11 and the guide slot 121 matches the winding path of the tape 101 around the multiple rollers 21.

[0089] S5: Insert the guide post 130 into the guide slot 121 and connect it to the connector.

[0090] S6: Move the guide post 130 along the guide slot 121 to drive the winding belt 101 to wind around multiple rollers 21, and then wind it back toward the winding inlet to connect with the guide belt 1010.

[0091] S7: Drive the take-up drum 114 to rotate to tighten the belt 101.

[0092] In a specific implementation, step S5 involves inserting the guide post 130 into the guide slot 121. Specifically, this means inserting the guide post 130 into the first guide hole 1211, with the insertion distance ensuring that the guide groove 1301 of the guide post 130 is within the guide slot 121, and the first flange 131 and the second flange 132 at both ends of the guide groove 1301 are located on both sides of the guide plate 120. During the subsequent movement of the guide post 130 along the guide slot 121, the guide groove 1301 moves along the strip-shaped slot 1213 of the guide slot 121, and the first flange 131 and the second flange 132 are engaged on both sides of the guide plate 120.

[0093] Additionally, in step S5, connecting the guide post 130 to the connector may include: attaching the connector to the connecting groove 1302 of the guide post 130 to position the connector through the connecting groove 1302. Since the connecting groove 1302 matches the winding position of the roll 101 on the outer periphery of the multiple rollers 21, when the roll 101 moves with the guide post 130 via the connection between the connector and the connecting groove 1302, it can maintain the matching position of the roll 101 on the outer periphery of the multiple rollers 21, thereby smoothly winding onto the outer periphery of the multiple rollers 21 under the guidance of the guide post 130 without twisting, which would cause creases, damage, or breakage.

[0094] Optionally, the method may further include: when connecting the connector to the guide post 130, snapping the guide post 130 onto a first snap-fit ​​member 115 on the side wall of the reel cassette 11 facing the polishing head 20, corresponding to the reel outlet; and when connecting the connector to the guide belt 1010, snapping the guide post 130 onto a second snap-fit ​​member 116 on the side wall of the reel cassette 11 facing the polishing head 20, corresponding to the reel inlet. This ensures the stability of the guide post 130 during the reel 101 connection operation, improves the accuracy of the reel 101 connection, and facilitates operation.

[0095] Preferably, the method may further include: after the guide post 130 is connected to the connector, activating a nozzle 134 that moves synchronously with the guide post 130 to spray cleaning gas. The nozzle 134 is located in front of the guide post 130, and the cleaning gas blows towards the connecting groove 1302 and can also blow the roller 21 close to the guide post 130, so as to keep the guide post 130, especially near the connecting groove 1302, clean and pre-clean the roller 21 to be wound with the tape 101. This can avoid introducing contaminants into the polishing head 20 during the winding process of the tape 101, and keep the polishing head 20 clean. In addition, during the previous edge polishing process of wafer 40, contaminants such as processing debris may fall onto multiple rollers 21. By pre-cleaning the rollers 21, contaminants on the rollers 21 can be prevented from adhering to the tape 101 and moving to the vicinity of wafer 40 with the tape 101 during the subsequent edge polishing process, thus contaminating or scratching wafer 40. It can also reduce contaminants between rollers 21 and tape 101, improve the smoothness of tape 101 moving around rollers 21, and prevent contaminants from scratching rollers 21 or tape 101.

[0096] When the guide plate 120 is detachably connected to the cover 112 via the pin 140, the method may include: fixing the guide plate 120 relative to the cover 112 via the pin 140 while winding the tape 101 released from the unwinding spool 113 onto the polishing head 20 and guiding the tape 101 to the recovery spool 114; and removing the pin 140 after the tape 101 has been wound to remove the guide plate 120 from the cover 112.

[0097] When the guide plate 120 is foldably connected to the cover 112, the method may include: as the tape 101 released from the unwinding spool 113 is wound onto the polishing head 20 and the tape 101 is guided to the take-up spool 114, the guide plate 120 unfolds toward the polishing head 20 so that the guide slot 121 is aligned with the positions of the plurality of rollers 21; after the tape 101 is wound, the guide plate 120 is folded toward the cover 112.

[0098] In a more preferred embodiment, the tape cassette 11 is configured such that when the tape cassette 11 is mounted to the wafer edge polishing apparatus, the upper sidewall and the lower sidewall of the tape cassette (i.e., Figure 4 and Figure 5The upper and lower sidewalls of the cassette 11 are respectively provided with a first opening and a second opening. The method further includes: after the tape cassette is installed into the wafer edge polishing equipment, opening a self-cleaning nozzle above the first opening, the self-cleaning nozzle spraying self-cleaning gas from top to bottom into the tape cassette 11 through the first opening to clean the unused tape 101 on the unwinding drum 113 and prevent contaminants below the unwinding drum 113 from flying upwards, and during wafer edge polishing, preventing contaminants, such as polishing debris generated during wafer edge polishing, from being carried by the used tape 101 wound onto the take-up drum 114 and flying upwards to contaminate the unused tape 101 on the unwinding drum 113. This allows for self-cleaning of unused tape 101 on the unwinding drum 113. The self-cleaning gas blows from top to bottom, creating a clean airflow to protect the space where the unwinding drum 113 is located, ensuring the cleanliness of the tape 101 released from the unwinding drum 113. As a result, the tape 101 wound onto the polishing head 20 and in contact with the wafer 40 for wafer edge polishing will not carry contaminants that could contaminate or scratch the wafer 40, thus ensuring the cleanliness of the wafer 40 and the processing quality.

[0099] In a specific implementation, the method further includes: after the unwinding roll 101 on the unwinding drum 113 has been completely released, removing the roll cassette 11 entirely from the wafer edge polishing equipment, and then installing a new roll cassette 11 with a new unwinding drum 113 and a new take-up drum 114, which is prepared while the wafer edge polishing equipment is running. The replaced roll cassette 11 with the old unwinding drum 113 and take-up drum 114 can replace the new unwinding drum 113 and take-up drum 114 according to step S1.

[0100] This application also provides a method for polishing the edge of a 40-inch wafer, including:

[0101] S10: Replace tape 101 using the aforementioned tape replacement method;

[0102] S20: Start the drive roller 211 of the multiple rollers 21 of the polishing head 20 to drive the belt 101, and simultaneously drive the unwinding drum 113 and the take-up drum 114 to release and retract the belt 101.

[0103] S30: Move the polishing head 20 toward the horizontally positioned wafer 40 so that the tape 101 contacts the edge of the wafer 40 for polishing.

[0104] The polishing head 20 moves toward the wafer 40 so that the tape 101 between the two feed rollers 212 contacts the wafer 40 and polishes the edge of the wafer 40. The drive tape 101 includes a drive roller 211 that drives the tape 101 to move from top to bottom between the two feed rollers 212, thereby grinding and polishing the edge of the wafer 40 from top to bottom, and enabling polishing debris to be discharged from top to bottom along the moving direction of the tape 101, reducing the contamination or scratching of the wafer 40 by debris.

[0105] To address the problems of complex tape replacement operations, tape contamination, and long replacement times in existing technologies, this application proposes a new and convenient method for replacing tape 101. This method uses a tape reel cassette 11, which can simultaneously replace the corresponding unwound and retracted tape 101, simplifying the disassembly and installation process of tape 101 on the machine. By using the tape reel cassette 11 in conjunction with the guide plate 120, and utilizing the guide post 130 moving within the guide slot 121, the tape 101 can be quickly wound onto the corresponding driven roller, reducing contamination and creases caused by operator winding and rapidly completing the tape 101 replacement. This method integrates the installation process into the preparation of the tape reel cassette 11, simplifying the replacement process and effectively reducing machine downtime. Tape replacement time can be reduced by 40-50%, and machine uptime can be increased by 0.104-0.138%.

[0106] The tape box 11 can be used as a whole to replace the individual tape 101. The tape box 11 can be prepared as a separate accessory and can be replaced at any time when the tape 101 needs to be replaced. It has the advantages of being highly portable, easy to replace, and having low replacement time cost.

[0107] This application also provides a tape winding system including the tape winding device 10, and a wafer edge polishing apparatus including the tape winding system.

[0108] The above embodiments are only used to illustrate the embodiments of this application, and are not intended to limit the embodiments of this application. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the embodiments of this application. Therefore, all equivalent technical solutions also fall within the scope of the embodiments of this application, and the patent protection scope of the embodiments of this application should be defined by the claims.

Claims

1. A tape replacement method, characterized in that, The tape is wound around a plurality of horizontally extending rollers of a wafer edge polishing apparatus for polishing the edges of a wafer, the method comprising: The preparation phase includes: Open the cover of the tape box and install the unwinding drum with the tape wound on and the empty take-up drum into the tape box; Make the joint of the tape extend from the tape exit of the tape cassette, and make the guide tape attached to the take-up drum extend from the tape inlet of the tape cassette, and close the cassette cover; The replacement phase includes: The tape cassette is mounted to the wafer edge polishing equipment such that the unwinding drum is positioned above the take-up drum and their axes extend horizontally. The guide plate is connected parallel to the box cover, such that the guide plate extends toward the polishing head and the guide groove of the guide plate matches the winding path of the tape around the plurality of rollers; The guide post is inserted into the guide slot and connected to the connector; The guide post is moved along the guide groove to drive the tape to wind around the multiple rollers, and then wound back toward the tape inlet to connect with the guide belt; The take-up drum is driven to rotate to tighten the tape.

2. The tape replacement method as described in claim 1, characterized in that, The method further includes: after the guide post is connected to the connector, opening a nozzle that moves synchronously with the guide post to spray cleaning gas. The nozzle is located in front of the guide post, and the cleaning gas blows towards the connecting groove and cleans the rollers close to the guide post, so as to keep the guide post clean and pre-clean the rollers to be wound.

3. The tape replacement method as described in claim 1, characterized in that, Inserting the guide post into the guide post slot and connecting it to the connector includes: attaching the connector to the connecting groove of the guide post, wherein the position of the connecting groove matches the winding position of the tape on the outer periphery of the plurality of rollers.

4. The tape replacement method as described in claim 1, characterized in that, Inserting the guide post through the guide post slot and connecting it to the connector includes: setting the guide post such that the guide groove of the guide post is located in the guide post slot, and the first flange and the second flange at both ends of the guide groove are located on both sides of the guide plate.

5. The tape replacement method as described in claim 1, characterized in that, The method further includes: when the connector is connected to the guide post, snapping the guide post onto a first snap-fit ​​member on the side wall of the tape cassette corresponding to the tape exit; and when the connector is connected to the guide belt, snapping the guide post onto a second snap-fit ​​member on the side wall of the tape cassette corresponding to the tape inlet.

6. The tape replacement method as described in claim 1, characterized in that, The guide plate is detachably connected to the cover via a pin. When the tape released from the unwinding drum is wound onto the polishing head and the tape is guided back to the take-up drum, the guide plate is fixed relative to the cover via the pin. After the tape winding is completed, the pin is removed to remove the guide plate from the cover. The pin is configured with three legs arranged in a triangular array. The guide plate and the cover are respectively provided with three mounting holes for inserting the three legs.

7. The tape replacement method as described in claim 1, characterized in that, The guide plate is foldably connected to the cover; as the tape released from the unwinding drum is wound onto the polishing head and guided back to the take-up drum, the guide plate unfolds toward the polishing head so that the guide slots align with the positions of the plurality of rollers; after the tape winding is completed, the guide plate folds back to the cover.

8. The tape replacement method according to any one of claims 1-7, characterized in that, A first opening and a second opening are respectively constructed on opposite side walls of the tape box. The first opening is located on the side of the unwinding drum opposite to the take-up drum, and the second opening is located on the side of the take-up drum opposite to the unwinding drum. The method further includes: after installing the tape cassette into the wafer edge polishing equipment, opening the self-cleaning nozzle above the first opening, and spraying self-cleaning gas from top to bottom into the tape cassette through the first opening to clean the tape on the unwinding drum and prevent contaminants below the unwinding drum from flying upwards, and to prevent contaminants carried by the tape wound onto the take-up drum from flying upwards and contaminating the tape on the unwinding drum.

9. The tape replacement method according to any one of claims 1-7, characterized in that, The method further includes: after the tape on the unwinding drum is completely released, removing the tape cassette from the wafer polishing equipment as a whole, and then installing a tape cassette with a new unwinding drum and a new winding drum.

10. A method for polishing wafer edges, characterized in that, include: Tape replacement is performed using the tape replacement method as described in any one of claims 1-9; The drive roller among the multiple rollers of the polishing head is activated to drive the tape, and the unwinding drum and the take-up drum are driven synchronously to release and retract the tape. The polishing head is moved toward the horizontally positioned wafer so that the tape contacts the edge of the wafer for polishing.

11. The wafer edge polishing method as described in claim 10, characterized in that, The plurality of rollers includes two vertically spaced feed rollers facing the wafer, and the polishing head moves toward the wafer so that the tape between the two feed rollers contacts the wafer and polishes the edge of the wafer; Driving the tape includes: the drive roller driving the tape to move from top to bottom between the two feed rollers.

12. A tape reel device for performing the tape replacement method as described in any one of claims 1-9, characterized in that, include: A reel cassette, which is integrally replaceable in the wafer edge polishing equipment, is provided with an unwinding spool and a rewinding spool; A guide belt assembly, including a guide plate and guide belt posts, is used to wind a roll of tape released from the unwinding drum onto the polishing head of the wafer polishing equipment and guide the roll of tape back to the take-up drum; the guide plate has guide belt slots that match the winding path of the roll of tape around the plurality of rollers; the guide belt posts are connected to the roll of tape released from the unwinding drum and move along the guide belt slots to drive the roll of tape to wind onto the plurality of rollers and then retract it back to the unwinding drum.

13. A wafer edge polishing device, characterized in that, include: A support platform is used to support wafers; The tape winding device as described in claim 12; A polishing head, the tape of the tape winding device is wound onto the polishing head, the polishing head being configured to move toward the wafer so that the tape wound on it contacts the edge of the wafer to perform wafer edge polishing.

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