Thermal stress analysis and reliability test equipment for chip packaging material

Abstract

The invention relates to the technical field of testing equipment, in particular to chip packaging material thermal stress analysis and reliability testing equipment which comprises an equipment machine table, a base, a heating base and a temperature box, the heating base is fixed to the base, the temperature box is installed on the top of the heating base and provided with a detachable housing, and a feeding hole is formed in the housing; a rapid heat dissipation mechanism is integrated in the temperature box and comprises two sets of cooling units which are symmetrically arranged, each set of unit is composed of an upper guide pipe located at the top of the temperature box, a lower guide pipe located at the bottom and a through pipe communicating the upper guide pipe and the lower guide pipe, heat absorption pieces are arranged on the outer walls of the through pipes, and the two sets of through pipes are arranged in a staggered mode. The cooling water route is driven by an alternate water storage system and comprises a first storage box and a second storage box which are movably installed on a housing through a guide rail, the two storage boxes are in linkage with a steering gear through a combined rack to achieve reverse displacement, and when the first storage box is in butt joint with an upper guide pipe, the second storage box is automatically aligned with the lower guide pipe; when the second storage box is butted with the upper conduit, the first storage box automatically aligns to the lower conduit; the purpose of improving the packaging material testing efficiency can be achieved.

Description

Technical Field

[0001] This invention relates to the field of testing equipment technology, specifically to a device for thermal stress analysis and reliability testing of chip packaging materials. Background Technology

[0002] In the semiconductor manufacturing field, chip packaging materials are crucial components for protecting chips, enabling electrical interconnection, and heat dissipation. Their reliability directly determines the lifespan and performance stability of electronic products. Currently, mainstream chip packaging materials include organic substrates, inorganic substrates, underfill adhesives, molding compounds, and thermal interface materials. These materials require strict matching in terms of thermal expansion coefficients, thermal conductivity, mechanical strength, and interfacial adhesion to avoid failures caused by thermomechanical stress.

[0003] During thermal cycling testing, rapid heat dissipation is required after each cycle of heating a single workpiece to shorten waiting time and facilitate subsequent experiments or repeated testing, which is especially important in high-throughput or time-sensitive studies. Currently, thermal stress analysis and reliability testing are typically performed in thermal cycling equipment, but the heat dissipation efficiency of existing equipment is insufficient, severely restricting the research and verification efficiency of packaging materials. Summary of the Invention

[0004] The purpose of this invention is to provide a thermal stress analysis and reliability testing device for chip packaging materials, so as to improve the testing efficiency of packaging materials and solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a thermal stress analysis and reliability testing device for chip packaging materials, comprising a machine base, a base, a heating seat and a temperature box, wherein the heating seat is fixed on the base, the temperature box is installed on the top of the heating seat and configured with a detachable cover, and the cover has a feed hole. The warm box integrates a rapid heat dissipation mechanism, which includes two sets of cooling units arranged symmetrically. Each set of units consists of an upper tube at the top of the warm box, a lower tube at the bottom, and a connecting tube between the two. The outer wall of the connecting tube is equipped with heat-absorbing fins, and the two sets of connecting tubes are staggered. The cooling water route is driven by an alternating water storage system, including a first storage box and a second storage box that are movably installed on the cover via guide rails. The two storage boxes are moved in opposite directions through a combination rack and a steering gear, so that when the first storage box is connected to the upper conduit, the second storage box automatically aligns with the lower conduit, and when the second storage box is connected to the upper conduit, the first storage box automatically aligns with the lower conduit. Both the upper and lower conduits are connected to end pipes. The bottom of the storage box is equipped with a magnetically controlled sealing interface, which includes a movable tube with elastic elements and a sealing seat. When the storage box moves to the end pipe position, the magnetic ring inside the end pipe attracts the movable tube and detaches from the sealing seat to form a water channel. The outer casing is equipped with a drive mechanism for the first storage box. The drive mechanism includes a panel with a rotating shaft and a handle. The rotating shaft is connected to a central rotating shaft via a belt drive pair. The drive gear on the central rotating shaft meshes with the drive rack of the first storage box.

[0006] Preferably, a sealing component is fixedly installed on the top of the cover, and guide rails are provided on both sides of the sealing component; Two brackets are movably mounted on the guide rail, and the first and second storage boxes are fixed on their respective brackets.

[0007] Preferably, a combination rack is fixedly installed on the bracket, and a steering gear meshes between the two combination racks. The steering gear is installed on the enclosure via a hanger.

[0008] Preferably, the belt drive pair consists of a large pulley on the rotating shaft and a small pulley on the intermediate rotating shaft. When the handle drives the rotating shaft to rotate half a turn, the intermediate rotating shaft rotates 1-2 turns.

[0009] Preferably, the front end of the movable tube is provided with a ferromagnetic end, and a magnetic ring is assembled inside the end tube; When the movable tube moves to the docking position, the magnetic ring attracts the ferromagnetic end, overcoming the elastic force of the elastic element, causing the movable tube to detach from the closed seat and form a water channel.

[0010] Preferably, a bottom ring is installed at the bottom of the cover, and a locking key is provided on the base. The cover can be detached and assembled by the cooperation of the locking key and the bottom ring.

[0011] Preferably, the tubes are arranged in an array inside the cooling box, and the tubes of the two sets of cooling units are staggered; heat-absorbing fins are fixedly installed on the outer wall of all tubes.

[0012] Preferably, the first and second storage boxes are staggered by a bracket, with one high and one low. When the first storage box is connected to the upper conduit, the second storage box is simultaneously connected to the lower conduit located in the same cooling unit.

[0013] Preferably, a lifting rail is fixedly installed on the machine platform, the lifting rail is driven and connected to the material platform, and a clamping head is installed at the bottom of the material platform. The clamping head is equipped with replaceable clamps for installing workpieces and applying mechanical loads. The feed hole in the cover allows the fixture head to extend into the warming box.

[0014] Preferably, the elastic element is a spring or an elastic rubber element, which, under normal conditions, presses the end of the movable tube against the sealing seat to achieve a seal.

[0015] Compared with the prior art, the present invention has the following beneficial effects: 1. The chip packaging material thermal stress analysis and reliability testing equipment provided by this invention effectively solves the problems of low heat dissipation efficiency and long testing cycle of traditional testing equipment through a rapid heat dissipation mechanism and modular design. The equipment adopts an alternating storage box structure and a magnetically driven water cooling system, which can quickly reduce the temperature inside the box after thermal cycling test. This not only significantly shortens the workpiece cooling waiting time, but also avoids thermal stress residue or material property drift caused by slow cooling, thereby ensuring the accuracy and repeatability of subsequent test data.

[0016] 2. The modular design of the housing, combined with the detachable cooling pipes, facilitates maintenance and allows for flexible adjustment of heat dissipation intensity according to testing requirements. Through the automatic docking of the magnetic ring and the ferromagnetic movable tube, the cooling water forms a closed loop only when needed, saving resources and improving the immediacy of heat dissipation response. In addition, the bidirectional staggered arrangement of the through pipes and heat absorption fins further optimizes the heat exchange efficiency, resulting in a more uniform temperature distribution inside the temperature chamber and reducing the interference of local thermal stress on the test results.

[0017] 3. The device of the present invention improves testing efficiency while taking into account the convenience and reliability of operation. Through gear and rack transmission and belt speed-up mechanism, the position of the storage box can be precisely controlled by simply rotating the handle, realizing the automatic switching of the cooling process. It is suitable for high-throughput testing scenarios and provides more efficient and stable support for the testing and verification of chip packaging materials. Attached Figure Description Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 This is a schematic diagram of the heating structure of the present invention.

[0019] Figure 3 This is a schematic diagram of the installation structure of the temperature box of the present invention.

[0020] Figure 4 This is a schematic diagram of the heat-absorbing structure of the present invention.

[0021] Figure 5 This is a schematic diagram of the internal structure of the casing of the present invention.

[0022] Figure 6 This is a first schematic diagram of the alternating storage box structure of the present invention.

[0023] Figure 7 This is a second schematic diagram of the alternating storage box structure of the present invention.

[0024] Figure 8 This is a schematic diagram of the drive mechanism of the first storage box structure of the present invention.

[0025] Figure 9 This is a schematic diagram of the internal structure of the first storage box of the present invention.

[0026] Figure 10 This is a schematic diagram of the positioning structure of the present invention.

[0027] In the diagram: 1. Equipment platform; 2. Base; 3. Heating seat; 4. Temperature box; 5. Cover; 6. Feed hole; 7. Lifting rail; 8. Material platform; 9. Clamp head; 10. Upper guide tube; 11. Lower guide tube; 12. Through pipe; 13. Heat absorber; 14. End pipe; 15. Sealing component; 16. Guide rail; 17. Bracket; 18. First storage box; 19. Second storage box; 20. Combined rack and pinion; 21. Hanger; 22. Steering gear; 23. Drive rack and pinion; 24. Panel; 25. Rotating shaft; 26. Handle; 27. Central rotating shaft; 28. Belt drive pair; 29. ​​Drive gear; 30. Sealing seat; 31. Elastic component; 32. Movable tube; 33. Connecting ring; 34. Magnetic ring; 35. Bottom ring; 36. Locking key. Detailed Implementation

[0028] The present invention will now be further described with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments. It should be understood that the described embodiments are merely some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0029] Please see Figures 1 to 10 The present invention provides a technical solution: a thermal stress analysis and reliability testing device for chip packaging materials. The device can perform thermal cycling on chip packaging materials, observe their dimensional changes under temperature changes, perform thermal stress analysis, and then apply mechanical force to analyze their reliability.

[0030] The testing equipment includes a machine base 1, on which a base 2 is installed. A heating seat 3 is set up through the base 2, and a temperature box 4 is fixedly installed on the heating seat 3. The heating seat 3 can heat the air inside the temperature box 4 to heat the workpiece to be tested inside the temperature box 4 and complete the specific analysis. Furthermore, a cover 5 can be installed through the base 2 to keep the temperature box 4 warm.

[0031] A lifting rail 7 is fixedly installed on the machine base 1. The lifting rail 7 drives the installation of the material platform 8. A clamping head 9 is installed at the bottom of the material platform 8. Various clamps can be assembled through the clamping head 9. Workpieces are installed and corresponding mechanical forces are applied through different clamps. The cover 5 is provided with a feeding hole 6. After the workpiece is installed, the material platform 8 is lowered to send the workpiece into the temperature box 4 for testing.

[0032] To shorten waiting time, facilitate subsequent experiments or repeated tests, and improve testing efficiency, a rapid heat dissipation mechanism is provided in the warming box 4. This rapid heat dissipation mechanism is set on both sides of the warming box 4 and can be used alternately. It includes an upper conduit 10 installed on the top of the warming box 4 and a lower conduit 11 installed on the bottom of the warming box 4. The upper conduit 10 and the lower conduit 11 of one set of rapid heat dissipation mechanism are located on both sides of the warming box 4, and a connecting pipe 12 is connected between the upper conduit 10 and the lower conduit 11. The connecting pipes 12 are arranged in a staggered manner, and heat-absorbing fins 13 are installed on the outer wall of the connecting pipe 12. When water enters the upper conduit 10, the water can flow through the connecting pipe 12 through the internal space of the warming box 4 to achieve rapid heat dissipation of the internal space of the warming box 4.

[0033] Both the upper conduit 10 and the lower conduit 11 are equipped with end pipes 14. Water is introduced into the upper conduit 10 through the end pipes 14, and then water is discharged from the lower conduit 11 through the end pipes 14. The cover 5 is equipped with a water storage structure that can be connected to the end pipes 14 for water input and output.

[0034] A sealing element 15 is fixedly installed on the top of the cover 5. When the cover 5 is fixed to the base 2, the sealing element 15 can seal the top of the temperature box 4 to prevent temperature exchange. The clamp head 9 is also usually equipped with a sealing element to block the feed hole 6. Guide rails 16 are fixedly installed on both sides of the sealing element 15. A bracket 17 is installed by limiting the movement of the bracket 16. The bracket 17 is divided into left and right sides, which can be used to install the first storage box 18 and the second storage box 19 respectively. The first storage box 18 and the second storage box 19 can be adjusted to different heights by the bracket 17. The staggered arrangement is such that a combined rack 20 is fixedly installed on each of the two brackets 17, and a steering gear 22 meshes between the two combined racks 20. The steering gear 22 is installed on the closure 15 through the hanger 21. When the first storage box 18 moves to the position of the upper conduit 10, the second storage box 19 can move to the position of the opposite lower conduit 11, so that the water in the first storage box 18 flows into the second storage box 19 through the rapid heat dissipation mechanism. Conversely, when the second storage box 19 moves to the top, the water can flow back to the first storage box 18 for alternation.

[0035] The first storage box 18 has a drive structure on the casing 5, which includes a panel 24 mounted on the outside of the casing 5. A rotating shaft 25 is rotatably mounted in the panel 24, and a handle 26 is connected to the rotating shaft 25. The handle 26 can drive the rotating shaft 25 to rotate. A central rotating shaft 27 is provided inside the panel 24. The central rotating shaft 27 and the rotating shaft 25 are connected by a belt drive pair 28 that can increase the angular velocity. The rotating shaft 25 is provided with a large-sized pulley, while the central rotating shaft 27 is provided with a small-sized pulley. When the handle 26 drives the rotating shaft 25 to rotate half a turn via a belt connection, the central rotating shaft 27 can rotate 1-2 turns. A drive gear 29 is also fixedly installed on the central rotating shaft 27, and a drive rack 23 is fixedly installed on the bracket 17 of the first storage box 18. The drive gear 29 meshes with the drive rack 23, so the handle 26 can control the up and down movement of the first storage box 18, thereby driving the second storage box 19 to move in the opposite direction. The first storage box 18 and the second storage box 19 are respectively connected to the upper conduit 10 and the lower conduit 11.

[0036] Both the first storage box 18 and the second storage box 19 have water outlets at their bottoms, and these outlets are automatically closed, only opening when moved to the end pipe 14 for connection. A sealing seat 30 is installed at each outlet, and a movable pipe 32 is connected to the sealing seat 30 via an elastic element 31. The movable pipe 32 is located at the outlet position. The elastic element 31 is a spring or elastic rubber component. Under the action of the elastic element 31, the tail end of the movable pipe 32 is connected to the sealing seat 30, allowing the movable pipe 32 to be closed by the sealing seat 30. To prevent water from flowing out, a connecting ring 33 is installed in the end pipe 14, and a magnetic ring 34 is provided on the connecting ring 33. The front end of the movable pipe 32 is made of ferromagnetic material. When the movable pipe 32 moves to the end pipe 14, it can overcome the elastic force of the elastic element 31 under the action of magnetic force and move into the connecting ring 33. At the same time, the sealing seat 30 is disengaged from the movable pipe 32, so that the first storage box 18, the second storage box 19 are connected to the end pipe 14 to form a cooling flow passage.

[0037] The cover 5 adopts an assembly structure to facilitate disassembly from the temperature box 4. A bottom ring 35 is installed at its bottom, and a locking key 36 is provided on the base 2. The cover 5 can be fixedly assembled by connecting the locking key 36 and the bottom ring 35. When it is necessary to inspect the first storage box 18, the second storage box 19 and the internal pipeline, or when faster heat dissipation is required, the cover 5 can be disassembled.

[0038] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A device for thermal stress analysis and reliability testing of chip packaging materials, comprising a machine base, a base, a heating seat, and a temperature chamber, characterized in that: The base is used to fix the heating seat, and a temperature box is installed on the top of the heating seat and a detachable cover is provided. The cover has a feeding hole. The warm box integrates a rapid heat dissipation mechanism, which includes two sets of cooling units arranged symmetrically. Each set of units consists of an upper tube at the top of the warm box, a lower tube at the bottom, and a connecting tube between the two. The outer wall of the connecting tube is equipped with heat-absorbing fins, and the two sets of connecting tubes are staggered. The cooling water route is driven by an alternating water storage system, including a first storage box and a second storage box that are movably installed on the cover via guide rails. The two storage boxes are moved in opposite directions through a combination rack and a steering gear, so that when the first storage box is connected to the upper conduit, the second storage box automatically aligns with the lower conduit, and when the second storage box is connected to the upper conduit, the first storage box automatically aligns with the lower conduit. Both the upper and lower conduits are connected to end pipes. The bottom of the storage box is equipped with a magnetically controlled sealing interface, which includes a movable tube with elastic elements and a sealing seat. When the storage box moves to the end pipe position, the magnetic ring inside the end pipe attracts the movable tube and detaches from the sealing seat to form a water channel. The outer casing is equipped with a drive mechanism for the first storage box. The drive mechanism includes a panel with a rotating shaft and a handle. The rotating shaft is connected to a central rotating shaft via a belt drive pair. The drive gear on the central rotating shaft meshes with the drive rack of the first storage box.

2. The thermal stress analysis and reliability testing equipment for chip packaging materials according to claim 1, characterized in that: A sealing component is fixedly installed on the top of the cover, and guide rails are provided on both sides of the sealing component; Two brackets are movably mounted on the guide rail, and the first and second storage boxes are fixed on their respective brackets.

3. The thermal stress analysis and reliability testing equipment for chip packaging materials according to claim 2, characterized in that: The bracket is fixedly installed with a combination rack, and a steering gear meshes between the two combination racks. The steering gear is installed on the enclosure via a hanger.

4. The thermal stress analysis and reliability testing equipment for chip packaging materials according to claim 1, characterized in that: The belt drive pair consists of a large pulley on the rotating shaft and a small pulley on the central rotating shaft. When the handle drives the rotating shaft to rotate half a turn, the central rotating shaft rotates 1-2 turns.

5. The thermal stress analysis and reliability testing equipment for chip packaging materials according to claim 1, characterized in that: The front end of the movable tube is provided with a ferromagnetic end, and a magnetic ring is assembled inside the end tube; When the movable tube moves to the docking position, the magnetic ring attracts the ferromagnetic end, overcoming the elastic force of the elastic element, causing the movable tube to detach from the closed seat and form a water channel.

6. The thermal stress analysis and reliability testing equipment for chip packaging materials according to claim 1, characterized in that: The bottom of the cover is fitted with a bottom ring, and the base is equipped with a locking key. The cover can be detached and assembled by the cooperation of the locking key and the bottom ring.

7. The thermal stress analysis and reliability testing equipment for chip packaging materials according to claim 1, characterized in that: The tubes are arranged in an array inside the temperature box, and the tubes of the two sets of cooling units are staggered; heat-absorbing fins are fixedly installed on the outer wall of all tubes.

8. The thermal stress analysis and reliability testing equipment for chip packaging materials according to claim 1, characterized in that: The first and second storage boxes are staggered by a bracket, with one high and one low. When the first storage box is connected to the upper conduit, the second storage box is simultaneously connected to the lower conduit located in the same cooling unit.

9. The thermal stress analysis and reliability testing equipment for chip packaging materials according to claim 1, characterized in that: The equipment is fixedly mounted on a lifting rail, which is connected to a material platform. A clamping head is installed at the bottom of the material platform. The clamping head is equipped with replaceable clamps for installing workpieces and applying mechanical loads. The feed hole in the cover allows the fixture head to extend into the warming box.

10. The thermal stress analysis and reliability testing equipment for chip packaging materials according to claim 1, characterized in that: The elastic element is a spring or an elastic rubber component, which normally presses the end of the movable tube against the sealing seat to achieve a seal.

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