Temperature control module based on serial port communication of single chip microcomputer

Abstract

The invention relates to a temperature control module based on serial port communication of a single chip microcomputer, a temperature adjusting unit outputs a control signal to meet the temperature control requirement of a temperature control object, and a temperature sampling unit samples the real-time temperature of the temperature control object. The interactive processing unit obtains an expected temperature value, receives real-time temperature data fed back by the temperature sampling unit, performs control processing based on preset control logic and outputs a temperature adjusting signal to the temperature adjusting unit, and the interface unit is connected to an external power supply and is matched with the temperature adjusting unit, the temperature sampling unit and the interactive processing unit. The modular degree is high, standardized modules are integrated, the development threshold is lowered, cost is low, plug and play is achieved, and the overall occupied space is small; a temperature set value can be modified in real time and temperature, power and fault information can be fed back through interaction equipment; an optimized temperature control strategy is automatically obtained according to the temperature deviation, and the response speed and the steady-state precision are both considered; the maximum temperature measurement error can reach + / -0.1 K, and the detection precision is higher.

Description

Technical Field

[0001] This invention relates to the technical field of control or regulation systems for non-electrical variables, and in particular to a temperature control module based on microcontroller serial communication. Background Technology

[0002] Temperature control, an open-loop or closed-loop control system with temperature as the controlled variable, plays an indispensable role in various fields of modern society. In many production processes, especially those involving biochemical reactions or applications in biochemical-related fields, temperature stability directly determines the quality of the reaction or application. In these scenarios, temperature control can track temperature changes in real time and quickly adjust the temperature through automatic regulation devices, thereby maintaining the stability and consistency of the production process.

[0003] Existing temperature control circuits typically employ fixed threshold comparison or static PID parameter control, which generally have the following limitations:

[0004] (1) Insufficient interactivity; unable to adjust the set temperature or monitor historical data in real time via the host computer; the adjustment is inflexible; the response or application process is fixed.

[0005] (2) Low temperature control accuracy; Traditional on / off temperature control, such as “ON / OFF” control, is prone to temperature overshoot, and generally uses two-wire or three-wire thermometers, resulting in low temperature measurement accuracy.

[0006] (3) Limited scalability; hardware relies on customized circuits, which are costly and difficult to reuse.

[0007] Chinese patent application CN117055651A discloses a PWM-based MEMS sensor temperature control circuit. A temperature sensing module detects the ambient temperature of the MEMS sensor and outputs a corresponding voltage signal. A reference module sets a constant reference voltage corresponding to a constant temperature. A comparison and amplification module compares and amplifies the voltage value output by the temperature sensing module with the reference voltage output by the reference module. The resulting deviation voltage is input to a PWM heating control module, which adjusts the duty cycle of its output PWM signal based on the deviation voltage to control the heating duration of the heating element. The drawbacks of this solution are that it only allows static temperature control, requiring manual resistor replacement to modify the set temperature. It cannot be remotely monitored or dynamically adjusted, its temperature control accuracy depends on hardware consistency, and it has poor anti-interference capabilities.

[0008] Chinese patent application CN118939027A discloses a PID temperature control method, device, computer equipment, and medium. The method involves obtaining the parameters to be adjusted from an initial fuzzy neural network, generating N sets of first candidate parameters using a genetic algorithm and replacing the parameters to be adjusted in the initial fuzzy neural network, thus constructing N candidate fuzzy neural networks. These candidate fuzzy neural networks are then iteratively trained using a sample dataset. If, during the iterative training, the objective function value of a candidate fuzzy neural network satisfies the training conditions, it is selected as the target fuzzy neural network. The target fuzzy neural network is used to process the difference between the obtained first temperature and the target preset temperature to generate the change in the PID control parameters, thereby adjusting the PID control parameters. This technical solution introduces AI algorithms, making it more suitable for parameter optimization in complex environments, but it does not emphasize the interactivity of temperature control, focusing instead on algorithmic intelligence. Summary of the Invention

[0009] This invention solves the problems existing in the prior art and provides a temperature control module based on microcontroller serial communication, which builds a closed-loop temperature control system and realizes real-time adjustment of set temperature, dynamic feedback of heating power and fault diagnosis functions through serial communication.

[0010] The technical solution adopted in this invention is a temperature control module based on microcontroller serial communication, the module comprising:

[0011] A temperature regulation unit is used to output control signals to meet the temperature control requirements of the object being controlled.

[0012] A temperature sampling unit is used to sample the real-time temperature of the temperature-controlled object;

[0013] An interactive processing unit is used to acquire the desired temperature value, receive real-time temperature data fed back by the temperature sampling unit, perform control processing based on preset control logic, and output temperature adjustment signals to the temperature adjustment unit.

[0014] An interface unit is provided for connecting an external power supply and is configured to work in conjunction with the temperature regulation unit, temperature sampling unit, and interactive processing unit.

[0015] Preferably, the temperature control module includes the following steps for temperature control:

[0016] S1 initialization, configuring control parameters;

[0017] S2 interactive processing unit obtains the desired temperature value;

[0018] S3 If there is a desired temperature value that needs to be updated, update the set temperature and proceed to the next step; otherwise, proceed directly to the next step.

[0019] The S4 interactive processing unit obtains the temperature sampling data from the temperature sampling unit. If the set temperature is 0 and the unit is K, the process ends; otherwise, it proceeds to the next step. That is, 0K is used as the command code for "stop heating".

[0020] S5 calculates the temperature deviation and obtains the temperature control strategy based on the temperature deviation;

[0021] S6, based on the optimized temperature control strategy, outputs a temperature adjustment signal to the temperature adjustment unit, processes it for a preset time, clears the desired temperature value, and returns to S2.

[0022] Preferably, S4 includes the following steps:

[0023] S4.1 The temperature sampling unit acquires sampling data and calculates the resistance;

[0024] S4.2 After converting the resistance value into a temperature value, it is input into the interactive processing unit; there is a preset calibration table between the resistance value and the temperature value here;

[0025] S4.3 If the set temperature is 0 (K) at this time, the process will be forcibly terminated; otherwise, proceed to S5.

[0026] Preferably, in S5, the temperature deviation is the difference between the temperature value in S4.2 and the set temperature.

[0027] Preferably, obtaining the temperature control strategy includes the following steps:

[0028] S5.1 Establish a thermodynamic model of the temperature-controlled object;

[0029] S5.2 Define the prediction time domain and the control time domain;

[0030] S5.3 Construct the objective function for rolling optimization, which is related to the output tracking error and the control increment;

[0031] S5.4 Based on the constraints, the objective function is optimized and solved to obtain the optimized temperature control strategy; that is, the PWM signal is converted into the heating voltage across the heating resistor by the temperature adjustment unit.

[0032] Preferably, a temperature control strategy is obtained by PID control. Based on the obtained temperature deviation and preset PID parameters, the interactive processing unit performs PID calculation and outputs a PWM signal. The temperature adjustment unit then converts the PWM signal into a heating voltage across the heating resistor.

[0033] Preferably, the interactive processing unit is an Arduino nano microcontroller; the microcontroller is connected to the visualization platform via a communication terminal.

[0034] Preferably, the temperature regulating unit is a Darlington tube; the Darlington tube is connected to the heating element on the temperature-controlled object.

[0035] Preferably, the temperature sampling unit is a four-wire platinum resistance thermometer configured to be used with the temperature-controlled object, and the four-wire platinum resistance thermometer is connected to a digital output converter.

[0036] Preferably, the interface unit is a busbar terminal; the busbar terminal is connected to an external power supply through a DC power conversion module.

[0037] This invention relates to a temperature control module based on microcontroller serial communication. The module uses a temperature adjustment unit to output control signals to meet the temperature control requirements of the object being controlled, a temperature sampling unit to sample the real-time temperature of the object being controlled, an interactive processing unit to obtain the desired temperature value, receive the real-time temperature data fed back by the temperature sampling unit and perform control processing based on preset control logic, and output a temperature adjustment signal to the temperature adjustment unit. An interface unit is connected to an external power supply and works in conjunction with the temperature adjustment unit, the temperature sampling unit and the interactive processing unit.

[0038] The beneficial effects of this invention are as follows:

[0039] (1) High degree of modularity, integrated standardized modules, reduced development threshold, low cost, plug-and-play with standard 12V DC power conversion module, small overall space occupation;

[0040] (2) Set up bidirectional serial communication, which can modify the temperature setpoint and provide feedback on temperature, power and fault information in real time through interactive devices;

[0041] (3) The optimized temperature control strategy is automatically obtained based on the temperature deviation, taking into account both response speed and steady-state accuracy; a four-wire platinum resistance thermometer is used, and the temperature measurement error can reach up to ±0.1K, with higher detection accuracy. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the module structure of the present invention;

[0043] Figure 2 This is a schematic diagram of the present invention;

[0044] Figure 3 This is a schematic diagram of the circuit principle of the present invention;

[0045] Figure 4 Flow chart of the method of the present invention. Detailed Implementation

[0046] The present invention will be further described in detail below with reference to embodiments, but the scope of protection of the present invention is not limited thereto.

[0047] This invention relates to a temperature control module based on microcontroller serial communication, the module comprising:

[0048] A temperature regulation unit is used to output control signals to meet the temperature control requirements of the object being controlled.

[0049] A temperature sampling unit is used to sample the real-time temperature of the temperature-controlled object;

[0050] An interactive processing unit is used to acquire the desired temperature value, receive real-time temperature data fed back by the temperature sampling unit, perform control processing based on preset control logic, and output temperature adjustment signals to the temperature adjustment unit.

[0051] An interface unit is provided for connecting an external power supply and is configured to work in conjunction with the temperature regulation unit, temperature sampling unit, and interactive processing unit.

[0052] In an embodiment of the present invention, the following settings are made:

[0053] The temperature regulation unit is a Darlington tube; the Darlington tube is connected to the heating element on the temperature-controlled object.

[0054] The temperature sampling unit is a four-wire platinum resistance thermometer designed to work with the temperature control object, and the four-wire platinum resistance thermometer is connected to a digital output converter.

[0055] The interface unit is a busbar terminal; the busbar terminal is connected to an external power supply through a DC power conversion module.

[0056] The busbar terminal has 8 pins. It is connected to an external 220V AC power supply through an external standard DC power conversion module, such as a 220VAC to 12VDC power module, to output a 12V voltage. It is configured to work with the temperature adjustment unit, temperature sampling unit, and interactive processing unit through different pins. The Arduino nano microcontroller receives the temperature signal, outputs a control signal to the temperature adjustment unit, and interacts with the host computer. The Darlington transistor (ULN2003a) is used to amplify the microcontroller's control signal so that the voltage reaches the required heating voltage, such as 0-12V, and is applied to the heating element, such as a heating resistor, on the temperature-controlled object. The temperature sampling unit outputs the temperature signal from a four-wire platinum resistance thermometer to the digital output converter. The MAX31865 chip is used here to convert the temperature signal into a current signal. The MAX31865 chip has a built-in fault diagnosis function. When an abnormal voltage occurs, it determines the fault code according to the voltage range and sends it to the serial port.

[0057] It should be noted that the automatic control device of the present invention also includes a refrigeration unit, which is used for temperature control of the low-temperature refrigeration device. That is, the actual temperature control range of the present invention is from the lowest refrigeration temperature to room temperature, or from room temperature to the highest heating temperature (e.g., 100°C).

[0058] The following explanation is based on a specific temperature control process.

[0059] In this invention, the temperature control of the temperature control module includes the following steps:

[0060] S1 initialization, configuring control parameters;

[0061] Specifically, this includes initializing the serial port, initializing the MAX31865 to four-wire mode, configuring PID parameters (e.g., using PID control), then setting the initial PWM value to 0, and initializing the desired temperature value to 0 (K).

[0062] S2 interactive processing unit obtains the desired temperature value;

[0063] Here, the desired temperature value is obtained by reading data from the serial port buffer, meaning that the current temperature to be controlled can be manually modified in the host computer.

[0064] S3 If there is a desired temperature value that needs to be updated, update the set temperature and proceed to the next step; otherwise, proceed directly to the next step.

[0065] Obviously, since the temperature control operation has already started, the expected temperature value cannot be empty during the first cycle. Generally speaking, it is set to 0 (K) by default.

[0066] The S4 interactive processing unit acquires the temperature sampling data from the temperature sampling unit. If the temperature is set to 0 and the unit is K, the process ends; otherwise, it proceeds to the next step.

[0067] S4 includes the following steps:

[0068] S4.1 The temperature sampling unit acquires sampling data and calculates the resistance;

[0069] S4.2 After converting the resistance value into a temperature value, it is input into the interactive processing unit;

[0070] S4.3 If the set temperature is 0 at this time, the process will be forcibly terminated; otherwise, proceed to S5.

[0071] S5 calculates the temperature deviation and obtains the temperature control strategy based on the temperature deviation;

[0072] In S5, the temperature deviation is the difference between the temperature value in S4.2 and the set temperature.

[0073] The following describes the process of obtaining a temperature control strategy, using a miniature throttling refrigerator cold head load as an example, with specific implementation methods. The process includes the following steps:

[0074] S5.1 Establish a thermodynamic model of the temperature-controlled object;

[0075] In this embodiment, the micro throttling refrigerator cold head structure includes a flat evaporator with an area of ​​approximately 1×1 cm. 2 The evaporator has a thickness of approximately 1 mm. A thin, uniformly heated silicon wafer of the same area and approximately 0.1 mm thickness is bonded to the upper surface of the evaporator via a thermally conductive interface material. Thermometers, heating elements, and temperature control components are also bonded to the upper surface of the silicon wafer via the same thermally conductive interface material. According to simulation results, due to the high thermal conductivity of the silicon wafer, the surface temperature difference is less than 0.001 K even with localized hot spots. Therefore, the upper and lower surfaces of the silicon wafer can be approximated as maintaining a uniform temperature in real time. Neglecting the thermal resistance of the interface material, this temperature is the temperature measured by the thermometer. Meanwhile, the glass layer of the evaporator is relatively thin, so its longitudinal temperature difference can be ignored; that is, its temperature is assumed to be the same as the temperature of the object being controlled. Based on this, the lumped heat capacity method is used to model the entire cold head.

[0076] Furthermore, the effect of the fluid's mass change rate dm / dt on temperature is much smaller than that of the dominant heat source or cooling effect; therefore, the fluid mass change can be ignored. From this, we can derive the expression for temperature change.

[0077]

[0078] in, For the equivalent heat capacity of the cold head system, satisfy , The equivalent heat capacity of the coolant. The equivalent heat capacity of the evaporator. The equivalent heat capacity of the silicon wafer, For the sensor's equivalent heat capacity, The equivalent heat capacity of the heater. The equivalent heat capacity of the equipment;

[0079] The heat generated by the heating element is defined as V is voltage. For resistance;

[0080] The amount of heat generated by the temperature-controlled object depends only on the operating mode of the temperature-controlled object. In a fixed operating mode, it is a constant, denoted as . ;

[0081] The heat loss from the environment to the cold head mainly comes from radiative heat loss, which meets the requirements. , It is the blackbody radiation coefficient. The Stefan-Boltzmann constant is... Where A is the ambient absolute temperature, T is the measured temperature, and A is the outer surface area of ​​the cold head.

[0082] The heat carried away by the fluid. , The mass flow rate at each cross-section is... and These are the enthalpy of the outlet and the inlet, respectively.

[0083] When the system is in steady state, it satisfies

[0084]

[0085] in, It can be obtained through experimental measurement, and its expression as a function of temperature can be fitted by interpolation. Substituting this expression into the original equation yields the final temperature change model.

[0086]

[0087] S5.2 Define the prediction time domain and the control time domain;

[0088] For the prediction time domain Np, it refers to the number of time steps the controller uses the model to predict the future state (temperature y) of the system. The selection of Np should be long enough to cover the main dynamic response process of the controlled object. Generally speaking, it should be greater than the thermal time constant of the system to ensure that the controller can estimate the long-term impact of its decisions, thereby avoiding overshoot caused by short-sightedness.

[0089] For the control time domain, Nc refers to the number of future control inputs (PWM duty cycle u) calculated by the controller within one optimization cycle;

[0090] Generally speaking, Nc ≤ Np.

[0091] S5.3 Construct the objective function for rolling optimization, which is related to the output tracking error and the control increment;

[0092] In this invention, at each discrete time t, the temperature control strategy aims to find a control sequence U(t) = [u(t|t), u(t+1|t), ..., u(t+Nc-1|t)] for the next Nc steps, and minimize the objective function J;

[0093] In practical applications, the objective function is related to the output tracking error and the control increment, and is expressed as follows:

[0094]

[0095] The first term is the output tracking error penalty term, and the second term is the control increment (or energy consumption) penalty term; specifically:

[0096] Let be the system temperature at the current time t, predicted by the model for the k-th future step;

[0097] The desired temperature setpoint for the k-th step in the future can be a constant value or a preset temperature rise curve.

[0098] λ1 is the tracking performance weighting coefficient, which is an adjustable parameter. The larger the value of λ1, the more "aggressively" the temperature deviation will be eliminated, resulting in a faster response speed, but it may increase energy consumption and the risk of overshoot. λ1 emphasizes the importance of maintaining the system in the target thermodynamic state.

[0099] by This represents the squared error between the predicted temperature and the target temperature. By minimizing the first term of the objective function, the system temperature is driven to be as close as possible to the desired value throughout the prediction time domain.

[0100] Let PWM duty cycle be the control input planned to be applied to the (k-1)th time interval in the future at the current time t, which will be used as the decision variable for the optimization problem;

[0101] The steady-state control input reference value is not simply set to 0, but is calculated through the steady-state model established in S5.1. This is to maintain the temperature at... The required theoretical PWM value;

[0102] λ2 is the control cost weighting coefficient. A larger λ2 value means that the controller will be more "conservative" and tend to use smoother and closer pressures. The control quantity is adjusted, but the response speed may be slower. The relative size of λ1 and λ2 determines the trade-off between "fast response" and "energy saving and stability" of the controller. By adjusting the relative size of λ1 and λ2, temperature control during temperature change and temperature control after reaching the preset temperature can also be achieved.

[0103] This represents the deviation between the actual optimized control input and the theoretically optimal steady-state input. By minimizing this term, energy saving and smooth control can be achieved. For the former, the controller is encouraged to use the most economical energy input to maintain the target temperature, rather than unnecessarily overheating or undercooling. For the latter, it avoids drastic fluctuations in the control output u, protects actuators such as heaters, and extends their service life.

[0104] S5.4 The objective function is optimized based on constraints to obtain the optimized temperature control strategy.

[0105] Generally, the constraints set include the system's physical limitations and operational requirements:

[0106] Input constraints: u min ≤ u(t+k|t) ≤ u max ;

[0107] The PWM duty cycle u must be between 0% and 100%, where 0 ≤ u(t+k|t) ≤ 100;

[0108] Output / State Constraints: y min ≤ y(t+k|t) ≤ y max ;

[0109] To prevent material damage, the system temperature must not exceed the upper limit of 200K at any time.

[0110] After setting the constraints, the system executes the following "rolling optimization" loop in each control cycle t:

[0111] (1) Measurement: Obtain the current actual temperature y(t) of the system through a sensor;

[0112] Using y(t) as the initial state, we solve the above constrained optimization problem to obtain the optimal control sequence U*(t) = [u*(t|t), u*(t+1|t), ..., u*(t+Nc-1|t)]. Since the objective function is quadratic and the constraints are linear, this problem is usually a quadratic programming problem, which can be solved efficiently by an embedded processor.

[0113] (2) Execution: Apply only the first element u*(t|t) in the optimal control sequence to the system;

[0114] (3) Rolling: Wait for the next control cycle (t becomes t+1), then repeat;

[0115] This "rolling" execution strategy gives the system strong robustness. Even if the model is not completely accurate or there are unexpected disturbances (such as a sudden drop in temperature caused by opening and closing a door), the controller can correct itself in the next cycle based on the latest measurement value and replan the optimal control path. By dynamically adjusting the control strategy through model prediction and rolling optimization, the response speed of temperature control is improved and overshoot and steady-state error are reduced.

[0116] S6, based on the optimized temperature control strategy, outputs a temperature adjustment signal to the temperature adjustment unit, processes it for a preset time, clears the desired temperature value, and returns to S2.

[0117] In this invention, there is another implementation method, which has the advantage of not requiring modeling of the temperature control object. That is, the temperature control strategy is obtained by PID control. By presetting relatively aggressive or relatively mild PID parameters for large or small temperature deviations, the interactive processing unit performs PID calculation based on the obtained temperature deviation and the preset PID parameters, and outputs a PWM signal. The temperature adjustment unit converts the PWM signal into a heating voltage across the heating resistor.

[0118] The logic of PID calculation here is easily understood by those skilled in the art, and they can configure the PID controller according to their needs.

[0119] In S6, the preset processing time is generally 100ms.

[0120] In this invention, after controlling the temperature, the sensor fault code will be read, formatted together with the current real-time temperature and voltage values, and sent to the interactive processing unit for monitoring by the host computer.

[0121] In practical applications, the microcontroller is connected to the visualization platform via a communication terminal.

[0122] Specifically, a graphical human-computer interaction interface is developed using the LabVIEW software platform to achieve visualized monitoring and remote control of the temperature control system. The LabVIEW and Arduino serial communication process is as follows:

[0123] (1) Initialize the serial communication port and set the baud rate to 9600;

[0124] (2) Delay for about 3 seconds to ensure that the Arduino completes initialization and enters the ready state;

[0125] (3) Enter the While loop to execute the main control process:

[0126] a) Read the formatted string received from the serial port within the set delay;

[0127] b) Parse the string content and extract parameters such as the set temperature value, current temperature, PWM output value, heating voltage, and fault code;

[0128] c) Display each parameter on the front panel as both a numerical display and a real-time line graph to achieve data visualization;

[0129] d) Package the parsed data and write it to a local text file named after the date to achieve automatic archiving of historical data;

[0130] e) Determine if the "Set Temperature" operation is triggered: If the user clicks the "Set Temperature" button on the interface, proceed with the temperature setting process; otherwise, skip the current loop.

[0131] f) If a temperature setting operation is triggered, the program will continuously read the contents of the "Temperature Setting Value" input box until a non-empty input value is obtained;

[0132] g) The user-input temperature setting value is sent to the Arduino microcontroller via serial port. After receiving the setting value, the Arduino program uses it for subsequent temperature control logic.

[0133] h) If the user clicks the "STOP" button, the loop termination condition is triggered, and the While loop exits;

[0134] (4) Close the serial port connection to end the current communication process.

[0135] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0136] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A temperature control module based on microcontroller serial communication, characterized in that: The module includes: A temperature regulation unit is used to output control signals to meet the temperature control requirements of the object being controlled. A temperature sampling unit is used to sample the real-time temperature of the temperature-controlled object; An interactive processing unit is used to acquire the desired temperature value, receive real-time temperature data fed back by the temperature sampling unit, perform control processing based on preset control logic, and output temperature adjustment signals to the temperature adjustment unit. An interface unit is provided for connecting an external power supply and is configured to work in conjunction with the temperature regulation unit, temperature sampling unit, and interactive processing unit.

2. The temperature control module based on microcontroller serial communication according to claim 1, characterized in that: The temperature control module includes the following steps: S1 initialization, configuring control parameters; S2 interactive processing unit obtains the desired temperature value; S3 If there is a desired temperature value that needs to be updated, update the set temperature and proceed to the next step; otherwise, proceed directly to the next step. The S4 interactive processing unit acquires the temperature sampling data from the temperature sampling unit. If the temperature is set to 0 and the unit is K, the process ends; otherwise, it proceeds to the next step. S5 calculates the temperature deviation and obtains the temperature control strategy based on the temperature deviation; S6, based on the optimized temperature control strategy, outputs a temperature adjustment signal to the temperature adjustment unit, processes it for a preset time, clears the desired temperature value, and returns to S2.

3. The temperature control module based on microcontroller serial communication according to claim 2, characterized in that: S4 includes the following steps: S4.1 The temperature sampling unit acquires sampling data and calculates the resistance; S4.2 After converting the resistance value into a temperature value, it is input into the interactive processing unit; S4.3 If the set temperature is 0 at this time, the process will be forcibly terminated; otherwise, proceed to S5.

4. The temperature control module based on microcontroller serial communication according to claim 3, characterized in that: In S5, the temperature deviation is the difference between the temperature value in S4.2 and the set temperature.

5. A temperature control module based on microcontroller serial communication according to claim 4, characterized in that: Obtaining the temperature control strategy includes the following steps: S5.1 Establish a thermodynamic model of the temperature-controlled object; S5.2 Define the prediction time domain and the control time domain; S5.3 Construct the objective function for rolling optimization, which is related to the output tracking error and the control increment; S5.4 The objective function is optimized based on constraints to obtain the optimized temperature control strategy.

6. A temperature control module based on microcontroller serial communication according to claim 2, characterized in that: Alternatively, a temperature control strategy can be obtained using PID control. Based on the obtained temperature deviation and preset PID parameters, the interactive processing unit performs PID calculations and outputs a PWM signal. The temperature regulation unit then converts the PWM signal into a heating voltage across the heating resistor.

7. A temperature control module based on microcontroller serial communication according to claim 1 or 2, characterized in that: The interactive processing unit is an Arduino nano microcontroller; the microcontroller is connected to the visualization platform via a communication terminal.

8. A temperature control module based on microcontroller serial communication according to claim 1 or 2, characterized in that: The temperature regulation unit is a Darlington tube; the Darlington tube is connected to the heating element on the temperature-controlled object.

9. A temperature control module based on microcontroller serial communication according to claim 1 or 2, characterized in that: The temperature sampling unit is a four-wire platinum resistance thermometer designed to work with the temperature control object, and the four-wire platinum resistance thermometer is connected to a digital output converter.

10. A temperature control module based on microcontroller serial communication according to claim 1, characterized in that: The interface unit is a busbar terminal; the busbar terminal is connected to an external power supply through a DC power conversion module.

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