Bearing device

Abstract

A bearing device comprises a bearing assembly and a driving assembly, and the bearing assembly comprises a bearing disc, an edge locking piece, a conveying piece and a driving mechanism; wherein the bearing disc comprises an adsorption part and a bearing part surrounding the adsorption part, and the edge locking piece and the conveying piece are arranged on the bearing part; the driving mechanism is used for driving the edge locking piece to lift, so that the frame part of the tested piece is supported and fixed through the edge locking piece, and the tested piece is separated from the bearing disc; and the driving assembly is used for driving the conveying piece to lift so as to receive or release the tested piece through the conveying piece. The adsorption part is used for adsorbing the tested piece, so that the tested piece can be stably fixed on the bearing disc in a front-side placement posture; based on the cooperation of the edge locking piece and the conveying piece, the frame part is supported and fixed by using the edge locking piece, so that the detected piece can be prevented from being in contact with the adsorption part, and the detected piece is supported and fixed in a back surface placement posture; therefore, the bearing device is endowed with double functions of front surface bearing and back surface bearing, and support is provided for realizing front detection and back detection operation based on the same detection equipment.

Description

Technical Field

[0001] This application relates to the field of semiconductor process equipment technology, and specifically to a carrier device. Background Technology

[0002] In semiconductor manufacturing processes, carrier devices are commonly used to support and fix semiconductor workpieces such as wafers, enabling the processing, transportation, and inspection of these workpieces. Taking wafers as an example, since the front side of a wafer is generally designed with circuit patterns, the front side of the wafer cannot directly contact the carrier device.

[0003] Common wafer carriers typically only support the front side, meaning the wafer is fixed to the carrier with its front side facing up. This limits inspection equipment to inspecting only the front side of the wafer. However, with increasingly demanding inspection requirements, it is necessary to inspect both the front and back sides of the wafer. Therefore, developing a wafer carrier that can perform both front and back side support functions to meet the inspection needs of semiconductor workpieces has become a pressing technical problem in this field. Summary of the Invention

[0004] The main technical problem this application addresses is to provide a support device that has both frontal and rear support functions.

[0005] To achieve the above objectives, one embodiment provides a carrying device, including a carrying component and a driving component, wherein the carrying component includes a carrying disk, a locking edge member, a conveying member, and a driving mechanism; wherein: The carrier plate includes an adsorption part and a support part surrounding the adsorption part, the upper surface of the adsorption part is higher than the upper surface of the support part, and the locking member and the conveying member are respectively disposed on the support part; The driving mechanism is configured to drive the locking member to move up and down relative to the carrier plate, so as to support and fix the frame part of the test piece through the locking member, thereby spacing the test piece from the adsorption part. The drive component is configured to drive the conveyor to move up and down relative to the carrier plate, so as to receive or release the test object through the conveyor.

[0006] In one embodiment, the locking edge component includes a locking edge portion and a support portion. The locking edge portion is used to receive and fix the frame portion. The support portion passes through the load-bearing portion and is disposed at a first end of the support portion. The driving mechanism acts on a second end of the support portion to drive the support portion to move the locking edge portion up and down.

[0007] In one embodiment, the locking edge portion has an adsorption structure for adsorbing and fixing the frame portion, the adsorption structure including at least one of a vacuum adsorption structure, an electromagnet structure, and a magnet structure.

[0008] In one embodiment, the driving mechanism includes a first driving member and a first lifting plate, and the locking member further includes an elastic portion; wherein: One end of the elastic part is connected to the bearing plate, and the other end is connected to the second end of the support part. The elastic part is used to provide an elastic force that causes the support part to drive the locking edge part to descend. The body of the first driving member is connected to the bearing plate, and the power end of the first driving member is connected to the first lifting plate. The first driving member drives the first lifting plate to rise and fall. The first lifting plate acts on the second end of the support part, driving the support part to drive the locking edge part to rise.

[0009] In one embodiment, the conveying component includes a lifting column and an elastic element. The lifting column extends through the support portion, and a first end of the lifting column is used to contact the frame portion. One end of the elastic element is connected to the support plate, and the other end is connected to a second end of the lifting column. The driving component acts on the second end of the lifting column to drive the lifting column to rise. The elastic element is used to provide an elastic force that causes the lifting column to descend.

[0010] In one embodiment, each of the carrier components further includes one or more first line connectors; the first line connectors are configured to be detachably connected to a second line connector of an external control source to enable pneumatic or electrical connection between the carrier component and the external control source.

[0011] In one embodiment, the test piece includes a die-expanding ring iron ring wafer, the die-expanding ring iron ring wafer including a wafer, a die-expanding ring surrounding the wafer, and an iron ring surrounding the die-expanding ring, the iron ring being the frame portion; wherein, the height difference between the upper surface of the adsorption portion and the upper surface of the support portion is not less than the thickness of the die-expanding ring.

[0012] In one embodiment, the support device further includes a first positioning seat for mounting on the motion platform, and the support assembly further includes a second positioning seat for supporting the support plate; the first positioning seat and the second positioning seat are detachably connected to detachably connect the support assembly to the motion platform.

[0013] In one embodiment, the first positioning seat is provided with at least three first positioning elements, and the second positioning seat is provided with at least three second positioning elements arranged around the center of the carrier plate; the first positioning elements and the second positioning elements correspond one-to-one and are inserted and connected to prevent the carrier component from rotating and translating relative to the first positioning seat.

[0014] In one embodiment, the first positioning seat is further provided with a first magnetic suction member, and the second positioning seat is provided with a second magnetic suction member; the first magnetic suction member and the second magnetic suction member are aligned and attracted to prevent the first positioning seat and the second positioning seat from moving along the thickness direction of the bearing plate.

[0015] In one embodiment, the support device further includes the motion platform, and the number of the support components is set to multiple, with different support components used to support test pieces of different dimensions; each support component includes a second positioning seat that matches the first positioning seat, so that the multiple support components can be interchangeably connected to the motion platform.

[0016] In one embodiment, the driving assembly includes a second driving member and a second lifting plate. The second driving member is disposed on the motion platform and is used to drive the second lifting plate to rise and fall. The second lifting plate has a support structure corresponding to the transmission member in different bearing assemblies, and the second lifting plate drives the corresponding transmission member to rise and fall through the support structure.

[0017] In one embodiment, the motion platform includes a platform and a rotating part that can be controllably rotated relative to the platform; the first positioning seat is connected to the rotating part and rotates synchronously, and the bearing assembly rotates synchronously with the first positioning seat; The platform portion is provided with a first limiting member, and the bearing assembly further includes a second limiting member connected to the bearing disk; the first limiting member and the second limiting member cooperate to limit the rotational stroke of the bearing assembly.

[0018] The carrier device according to the above embodiment includes a carrier assembly and a drive assembly. The carrier assembly includes a carrier plate, a locking edge member, a conveying member, and a drive mechanism. The carrier plate includes an adsorption portion and a support portion surrounding the adsorption portion. The locking edge member and the conveying member are respectively disposed on the support portion. The drive mechanism drives the locking edge member to move up and down, thereby supporting and fixing the frame portion of the test piece through the locking edge member, thus spacing the test piece from the adsorption portion. The drive assembly drives the conveying member to move up and down, thereby receiving or releasing the test piece through the conveying member. By adsorbing the test piece using the adsorption portion, the test piece can be securely fixed to the carrier plate in a front-facing position. Furthermore, based on the cooperation of the locking edge member and the conveying member, the locking edge member supports and fixes the frame portion, preventing the test piece from contacting the adsorption portion, thus allowing the test piece to be carried and fixed in a back-facing position. Therefore, the carrier device is endowed with the dual function of front and back-facing support, providing support for front and back inspection operations based on the same testing equipment. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the planar structure of a conventional iron ring wafer.

[0020] Figure 2 This is a schematic diagram of the cross-sectional structure of an expanded-ring iron ring wafer.

[0021] Figure 3 This is a schematic diagram of the structure of a support device according to one embodiment (I).

[0022] Figure 4 This is a schematic diagram (II) of the structure of a support device according to one embodiment.

[0023] Figure 5 This is a schematic cross-sectional view of the load-bearing device according to one embodiment, omitting the locking edge component.

[0024] Figure 6 This is a schematic diagram of the structure of the support component in a support device according to one embodiment.

[0025] Figure 7 This is a schematic diagram of the cross-sectional structure of the locking element in a bearing device according to one embodiment (I).

[0026] Figure 8 This is a schematic diagram (II) of the cross-sectional structure of the locking element in a bearing device according to one embodiment.

[0027] Figure 9 This is a schematic diagram of the front bearing principle of a bearing device according to one embodiment.

[0028] Figure 10 This is a schematic diagram of the back-side bearing principle of a bearing device according to one embodiment.

[0029] Figure 11 This is a schematic diagram of the structure of the first positioning seat in a carrying device according to one embodiment.

[0030] Figure 12 This is a schematic diagram of the structural combination of the first positioning seat and the second positioning seat in a carrying device according to one embodiment.

[0031] In the picture: 100. Bearing assembly; 110. Bearing plate; 111. Adsorption part; 112. Isolation part; 113. Bearing part; 120. Sealing edge piece; 121. Sealing edge part; 122. Support part; 123. Air pipe connector; 124. Elastic part; 130. Transmission part; 131. Lifting column; 132. Elastic element; 140. Drive mechanism; 141. First drive element; 142. First lifting plate; 150. Second positioning seat; 151. Second positioning element; 152. Second magnetic suction element; 160. Second limiting element; 200. Drive assembly; 210. Second drive component; 220. Second lifting plate; 230. Support structure; 300. Motion platform; 310. First positioning seat; 311. First positioning component; 312. First magnetic suction component; 320. Platform section; 330. Rotating section; 340. First limiting component; 400a, Frame section; 400b, Diode expansion ring section; 400c, Adhesive film section; 400d, Wafer section; 410, Wafer wafer; 420, Blue film; 430, Iron ring sheet; 440, Inner ring; 450, Outer ring. Detailed Implementation

[0032] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0033] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0034] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0035] In the back-end processes of semiconductor manufacturing, wafers are often mounted on a blue film with an iron ring around the edge for processing, transportation, and inspection. This type of wafer is generally called an iron ring wafer (also known as a surface mount ring wafer, frame wafer, etc.). Please refer to [link to relevant documentation]. Figure 1 A conventional iron ring wafer includes a wafer 410, a blue film 420, and an iron ring 430 surrounding the wafer 410. Typically, after multiple processing steps, the front side of the wafer 410 has been etched with circuit patterns, while the back side of the wafer 410 is generally an unprocessed surface. Therefore, by attaching and fixing the back side of the wafer 410 and the back side of the iron ring 430 to the front side of the blue film 420 respectively, and using the blue film 420 to connect the wafer 410 and the iron ring 430 together, a conventional iron ring wafer can be formed.

[0036] In addition, there is a special type of iron ring wafer, which, in addition to wafer 410, blue film 420, and iron ring 430, also includes a die-expanding ring disposed between the iron ring 430 and wafer 410; this type of iron ring wafer with added die-expanding ring is generally called a die-expanding ring iron ring wafer; for details, please refer to Figure 2 The expansion ring is divided into an inner ring 440 and an outer ring 450. The inner ring 440 is sandwiched between the blue film 420 and the inner ring 450. The blue film 420 is clamped and fixed between the inner ring 440 and the outer ring 450 by the inner ring 440, which can stretch the blue film 420 and keep it in a taut state. The outer ring 450 is sandwiched between the inner ring of the iron ring plate 430. Thus, the wafer 410 and the iron ring plate 430 are connected together by the expansion ring and the blue film 420 to form an expansion ring iron ring wafer.

[0037] Currently, vacuum chucks, designed based on the principle of vacuum adsorption, are the most commonly configured carrier devices in testing equipment. When iron ring wafers (i.e., conventional iron ring wafers or expanded iron ring wafers) are placed on the carrier device with the wafer 410 facing upwards, the wafer 410 can be indirectly clamped and fixed by adsorption and fixation of the blue film 420. Since there is a layer of blue film 420 between the wafer 410 and the carrier device, the back side of the wafer 410 will not be contaminated by the carrier device. Therefore, by acquiring an image of the front side of the wafer 410, the front side of the wafer 410 can be inspected (commonly known as positive inspection).

[0038] However, if the back side of wafer 410 is inspected using the same testing equipment (commonly known as back inspection), the iron ring wafer needs to be fixed to the carrier with the front side of wafer 410 facing down. In this case, the front side of wafer 410 will directly contact the carrier, causing contamination of the front side of wafer 410 (e.g., damage to the circuit patterns already processed on the front side of wafer 410). Obviously, this situation is unacceptable in the manufacturing process. Existing carrier devices do not have the function of back-side support for conventional iron ring wafers and expanded ring iron ring wafers, thus failing to meet the requirement of performing both front and back inspections on the same iron ring wafer using the same testing equipment, leading to a series of problems such as low equipment utilization and low testing efficiency.

[0039] Meanwhile, regarding the expansion ring iron ring wafer, since the stretching amount of the blue film 420 is usually positively correlated with the thickness of the expansion ring (for example, the thickness of the expansion ring is usually around 5mm), the presence of the expansion ring will form a step higher than the iron ring 430, resulting in a significant structural difference between the expansion ring iron ring wafer and the conventional iron ring wafer. Therefore, related technologies usually use different support devices to support and fix the conventional iron ring wafer and the expansion ring iron ring wafer respectively, which will obviously further reduce the utilization rate of the equipment and the detection efficiency.

[0040] The carrier device provided in this application has dual functions of front and back bearing, and can be used to support and fix conventional iron ring wafers, expansion ring iron ring wafers and other semiconductor workpieces, so as to realize the front and back inspection of semiconductor workpieces based on the same inspection equipment, thereby providing support for effectively improving equipment utilization and inspection efficiency.

[0041] The following description mainly uses the expanded ring iron ring wafer as the test piece as an example to describe the structure and working principle of the carrier device. However, it should be noted that the test piece can also be a conventional iron ring wafer or other semiconductor workpieces, such as semiconductor workpieces with similar structure and detection methods to expanded ring iron ring wafers or conventional iron ring wafers.

[0042] Meanwhile, for a clearer and more detailed description of the carrier device provided in the embodiments of this application, please refer to [link to relevant documentation]. Figure 2 , Figure 9 and Figure 10 The device under test includes a frame portion 400a, a die-expanding ring portion 400b, a film portion 400c, and a wafer portion 400d; wherein, for die-expanding ring wafers or semiconductors with similar structures, please refer to [link to relevant documentation]. Figure 2 The frame portion 400a refers to the area occupied by the iron ring plate 430 in the expander ring iron ring wafer. The expander ring portion 400b refers to the area occupied by the inner ring 440, outer ring 450, and the blue film 420 clamped and fixed between the inner ring 440 and outer ring 450 in the expander ring iron ring wafer. The wafer portion 400d refers to the area occupied by the wafer plate 410 in the expander ring iron ring wafer. The adhesive film portion 400c refers to the blue film 420 located between the wafer plate 410 and the inner ring 440 of the expander ring iron ring wafer. It can be understood that, for conventional iron ring wafers or semiconductor workpieces with similar structural forms, it only includes the frame portion 400a, the adhesive film portion 400c, and the wafer portion 400d, and the adhesive film portion 400c refers to the blue film located between the wafer plate 410 and the iron ring plate 430 in a conventional iron ring wafer.

[0043] Please see Figures 3 to 12The carrier device provided in some embodiments of this application includes a carrier component 100 and a drive component 200; wherein, the carrier component 100 includes a carrier disk 110, a locking edge member 120, a conveying member 130, a drive mechanism 140, and other functional components as needed, which are described in detail below.

[0044] Please see Figures 3 to 5 , Figures 7 to 10 The support plate 110 is disposed on the motion platform 300. The support plate 110 includes a centrally located adsorption part 111, an isolation part 112 surrounding the adsorption part 111, and a support part 113 surrounding the isolation part 112. It should be noted that... Figure 9 and Figure 10 The bold dashed lines in the text represent the approximate boundaries between the adsorption part 111 and the isolation part 112, as well as between the isolation part 112 and the support part 113.

[0045] The adsorption section 111 may include a porous ceramic part, a microporous ceramic part, a metal groove part, or other forms of adsorption structure, and the adsorption section 111 is connected to an external control source (specifically, a negative pressure gas source) through a gas path; when the expansion ring iron ring wafer is placed with the wafer 410 facing upwards, the adsorption section 111 indirectly fastens the wafer 410 to the carrier disk 110 by adsorbing the blue film 420 of the wafer section 400d under negative pressure, thereby achieving the front-side support of the expansion ring iron ring wafer.

[0046] The isolation portion 112 serves as a structural transition between the adsorption portion 111 and the support portion 113. For example, please refer to... Figure 5 , Figure 7 and Figure 8 The adsorption section 111 includes a microporous ceramic component, and the isolation section 112 includes an isolation ring fixed to the main body of the support plate 110. The microporous ceramic component is snapped into the inner ring of the isolation ring, and the isolation ring fixes the microporous ceramic component to the main body of the support plate 110 to form the overall outline of the support plate 110, thereby forming the corresponding adsorption section 111 and isolation section 112. Exemplarily, the isolation section 112 can also be part of the adsorption section 111. For example, the adsorption section 111 includes an adsorption area and an isolation area surrounding the adsorption area; the adsorption area is provided with a gas channel or adsorption structure for negative pressure adsorption of the test object; the isolation area is not provided with a gas channel or adsorption structure, and this isolation area is the isolation section 112.

[0047] The upper surface of the support portion 113 is set to be lower than the upper surface of the adsorption portion 111 and the upper surface of the isolation portion 112. For example, the upper surface of the adsorption portion 111 is flush with the upper surface of the isolation portion 112, and the height difference between the upper surface of the adsorption portion 111 and the upper surface of the support portion 113 is not less than the thickness of the expansion ring. For example, the height difference between the upper surface of the adsorption portion 111 and the upper surface of the support portion 113 is 0-1 mm greater than the thickness of the expansion ring.

[0048] When the wafer with the expansion ring is placed with its front side facing up, the thickness of the expansion ring 400b (i.e., the thickness of the expansion ring) can be accommodated based on the height difference between the upper surfaces of the adsorption part 111 and the support part 113. The support part 113 supports the expansion ring 400b and the frame part 400a, so that the upper surface of the expansion ring 400b is not higher than the upper surface of the adsorption part 111, avoiding the gap between the wafer part 400d and the adsorption part 111, thereby ensuring the adsorption and fixation effect of the adsorption part 111 on the wafer part 400d.

[0049] Please see Figure 3 , Figure 4 , Figures 6 to 8 The locking edge 120 is provided in the bearing part 113, and the driving mechanism 140 is configured to drive the locking edge 120 to rise and fall relative to the bearing plate 110, so as to support and fix the frame part 400a of the expansion ring iron ring wafer through the locking edge 120, thereby realizing the bearing and fixing of the expansion ring iron ring wafer. For example, the locking edge member 120 is provided with the bearing portion 113 passing through it along the thickness direction of the bearing disk 110; one end of the locking edge member 120 is used to support the frame portion 400a of the expansion ring iron ring wafer, and the frame portion 400a is fastened by vacuum adsorption, magnetic attraction, clamping or other means to prevent the expansion ring iron ring wafer from slipping relative to the bearing disk 110; the body of the drive mechanism 140 is connected to the bearing disk 110, and the power end of the drive mechanism 140 is coupled to the other end of the locking edge member 120; the drive mechanism 140 can be an electric, hydraulic or pneumatic push rod assembly or cylinder assembly, or other power components that can output linear motion and can be controlled, so as to achieve the purpose of automatically driving the locking edge member 120 to lift and lower.

[0050] Please see Figure 10 When the expansion ring iron ring wafer is placed with the wafer 410 facing down, the drive mechanism 140 drives the locking member 120 to rise to a position where the upper surface of the locking member 120 is higher than the upper surface of the adsorption part 111, and the height difference between the upper surface of the locking member 120 and the upper surface of the adsorption part 111 is greater than the thickness of the expansion ring, the locking member 120 can support and fix the frame part 400a, so that the expansion ring iron ring wafer (specifically wafer 410) and the carrier disk 110 (specifically adsorption part 111) are kept apart, preventing the front of the wafer 410 from contacting the adsorption part 111, thereby realizing the back side support of the expansion ring iron ring wafer.

[0051] Please see Figure 9When the wafer 410 is placed with the front side of the expansion ring iron ring sheet facing upwards, the driving mechanism 140 drives the locking member 120 to descend to a position where the upper surface of the locking member 120 is lower than the upper surface of the support part 113. Based on the height difference between the adsorption part 111 and the support part 113, the support part 113 supports the frame part 400a and the expansion ring part 400b, the adsorption part 111 supports the wafer part 400d, and the adsorption part 111 uses negative pressure to adsorb the wafer part 400d, thus achieving front-side support of the expansion ring iron ring sheet wafer. During this process, since the upper surface of the locking member 120 is lower than the upper surface of the support part 113, it can effectively prevent the locking member 120 from lifting the frame part 400a and affecting the adsorption and fixing effect of the adsorption part 111 on the wafer part 400d.

[0052] Please see Figures 3 to 6 The conveyor 130 is disposed on the support portion 113. For example, the conveyor 130 can be a column structure that passes through the support portion 113 along the thickness direction of the support plate 110. The drive assembly 200 is configured to drive the conveyor 130 to move up and down relative to the support plate 110. The drive assembly 200 can be an electric, hydraulic, or pneumatic push rod assembly or cylinder assembly, or other power assembly capable of outputting linear motion and controllable, to achieve automated driving of the conveyor 130 to move up and down. The body of the drive assembly 200 can be connected to the support plate 110 or disposed on the motion platform 300, and the power end of the drive assembly 200 is coupled to the conveyor 130. By driving the conveyor 130 to move up and down with the help of the drive assembly 200, the conveyor 130 can receive or release the expanded die ring iron ring wafer.

[0053] For example, please combine Figure 9 Before the positive inspection, an external gripping device (e.g., a robotic arm) transfers the expanded die ring wafer to above the carrier tray 110, ensuring the front side of the wafer 410 faces upwards. The drive mechanism 140 drives the locking edge member 120 to descend until its upper surface is no higher than the upper surface of the carrier portion 113. At this time, the drive assembly 200 drives the conveyor member 130 to rise until its upper surface is higher than the upper surface of the adsorption portion 111. The external gripping device then transfers the expanded die ring wafer, and the conveyor member 130 catches or supports the expanded die ring wafer. The circular part (specifically the frame part 400a) receives the expansion ring iron ring wafer. Subsequently, the external gripping device is removed, and the drive component 200 drives the conveyor 130 to lower the expansion ring iron ring wafer until the wafer part 400d falls on the adsorption part 111, thereby releasing the expansion ring iron ring wafer. Finally, the adsorption part 111 adsorbs the blue film 420 of the wafer part 400d, thereby indirectly securing the wafer 410 to the carrier disk 110, thus achieving front-side support of the expansion ring iron ring wafer for inspection of the front side of the wafer 410.

[0054] For example, please combine Figure 10 Before back inspection, an external gripping device (e.g., a robotic arm) flips the wafer with the expansion ring iron ring so that the front side of the wafer 410 faces down, and then moves the wafer with the expansion ring iron ring above the carrier tray 110. At this time, the drive assembly 200 drives the conveyor 130 to rise to a first position where the upper surface of the conveyor 130 is higher than the upper surface of the adsorption part 111 (at the first position, the height difference between the upper surface of the adsorption part 111 and the upper surface of the conveyor 130 is greater than the thickness of the expansion ring). The external gripping device conveys the wafer with the expansion ring iron ring so that the conveyor 130 catches and supports the frame part 400a. This allows for the acceptance of the expanded ring iron ring wafer; simultaneously, the drive mechanism 140 drives the locking member 120 to rise to a second position where the upper surface of the locking member 120 is higher than the upper surface of the adsorption part 111 (in the second position, the height difference between the upper surface of the adsorption part 111 and the upper surface of the locking member 120 is greater than the thickness of the expanded ring, but the upper surface of the locking member 120 is lower than the upper surface of the conveying member 130); subsequently, the external gripping device is removed, and the drive assembly 200 drives the conveying member 130 to descend until the frame part 400a falls on the locking member 120, thereby releasing the expanded ring iron ring wafer.

[0055] Finally, the locking element 120 supports the back side of the expansion ring iron ring wafer through the fixed frame part 400a. Since the height of the upper surface of the locking element 120 above the upper surface of the adsorption part 111 is greater than the thickness of the expansion ring, the wafer part 400d (specifically the wafer 410) can be horizontally suspended above the adsorption part 111, avoiding the wafer 410 from contacting the support disk 110 and being contaminated or damaged, so as to inspect the back side of the wafer 410.

[0056] In summary, by designing a partitioned structure for the carrier plate 110 to form corresponding adsorption sections 111 and carrier sections 113, and utilizing the height difference between the carrier section 113 and the adsorption section 111 (which is not less than the thickness of the expansion ring), the carrier device, in conjunction with the drive mechanism 140 and the locking edge member 120 and the conveying member 130 and the drive assembly 200, is endowed with the dual functions of front and back bearing, enabling the same testing equipment to perform both front and back inspections of the tested components. Furthermore, for conventional iron ring wafers and expansion ring iron ring wafers with the same specifications and dimensions, this carrier device can be used for both front and back bearing of these two different types of iron ring wafers, thereby providing support for effectively improving equipment utilization and testing efficiency.

[0057] As described above, the carrier device provided in this application embodiment can follow the following principle when carrying a conventional iron ring wafer: Before the positive inspection, the driving mechanism 140 drives the locking edge member 120 to descend to a position where the upper surface of the locking edge member 120 is lower than the upper surface of the adsorption part 111 or lower than the upper surface of the carrier part 113. The driving component 200 drives the conveying member 130 to rise and catch the frame part 400a of the conventional iron ring wafer. Then, the driving component 200 drives the conveying member 130 to drive the conventional iron ring wafer to descend, so that the wafer part 400d of the conventional iron ring wafer falls on the adsorption part 111. Thus, by using the negative pressure of the adsorption part 111 to adsorb the wafer part 400d, the conventional iron ring wafer can be carried and fixed so as to inspect the front side of the wafer 410.

[0058] Before back inspection, the drive assembly 200 drives the conveyor 130 to rise to a position where the upper surface of the conveyor 130 is higher than the upper surface of the adsorption part 111, so that the conventional iron ring wafer can be received by the support frame part 400a. At the same time, the drive mechanism 140 drives the locking edge part 120 to rise to a position where the upper surface of the locking edge part 120 is higher than the upper surface of the adsorption part 111 but lower than the upper surface of the conveyor 130. Subsequently, the drive assembly 200 drives the conveyor 130 to lower the received conventional iron ring wafer, so that the frame part 400a falls on the locking edge part 120 to complete the release of the conventional iron ring wafer. Finally, the locking edge part 120 fixes the frame part 400a to realize the support and fixation of the conventional iron ring wafer, and keeps the front side of the wafer 410 separated from the adsorption part 111 so as to inspect the back side of the wafer 410.

[0059] It should be noted that in some embodiments of this application, "front-side bearing" and "back-side bearing" are relative concepts. "Front-side bearing" refers to the conventional iron ring wafer or the expanded iron ring wafer being placed in the bearing device with the wafer 410 facing upwards and being supported and fixed. "Back-side bearing" refers to the conventional iron ring wafer or the expanded iron ring wafer being placed in the bearing device with the wafer 410 facing downwards and being supported and fixed.

[0060] In some embodiments, the inner diameter of the support portion 113 can be set to be smaller than the inner diameter of the expansion ring portion 400b (i.e., the inner ring 440 of the expansion ring). For example, the inner diameter of the support portion 113 (i.e., the outer diameter of the isolation portion 112) is 2-3 mm smaller than the inner diameter of the inner ring 440 of the expansion ring. The outer diameter of the support portion 113 can be set to be larger than the outer diameter of the frame portion 400a (specifically, the iron ring piece 430). For example, the outer diameter of the support portion 113 is 1-2 mm larger than the outer diameter of the iron ring piece 430. In this way, when supporting the expansion ring iron ring piece wafer, sufficient support space can be provided for the frame portion 400a and the expansion ring portion 400b, avoiding structural interference between the expansion ring portion 400b and the isolation portion 112. At the same time, it also enables the support device to meet the front and back support requirements of conventional iron ring piece wafers.

[0061] Furthermore, in some embodiments, the outer diameter of the adsorption portion 111 can be set to be larger than the outer diameter of the wafer portion 400d (specifically the wafer 410). For example, the outer diameter of the adsorption portion 111 is 1-2 mm larger than the outer diameter of the wafer 410. When the wafer is supported on the front side, the adsorption area of ​​the adsorption portion 111 on the test piece can be effectively increased, the adsorption and fixation effect on the test piece can be enhanced, and the flatness of the wafer 410 in the adsorption and fixation state can be improved.

[0062] In some embodiments where the carrier device is only suitable for carrying conventional iron ring wafers, the upper surface of the adsorption part 111 and the upper surface of the isolation part 112 can be set to be flush, and the height difference between the upper surface of the adsorption part 111 and the upper surface of the carrier part 113 can be set to be not less than the thickness of the frame part 400a of the conventional iron ring wafer (exemplarily, the upper surface of the carrier part 113 can be 1-2 mm lower than the upper surface of the adsorption part 111); this makes the carrier device suitable for carrying and fixing conventional iron ring wafers so as to perform forward and back inspection operations on the conventional iron ring wafers.

[0063] In some embodiments, please refer to Figures 6 to 8 The locking edge component 120 includes a locking edge portion 121 and a support portion 122 that penetrates the bearing portion 113. The locking edge portion 121 is located at the first end of the support portion 122 and is used to receive and fix the test piece when bearing on the back side. The driving mechanism 140 acts on the second end of the support portion 122 to drive the support portion 122 to move the locking edge portion 121 up and down. Specifically, the locking edge portion 121 has an adsorption structure, which can be a vacuum adsorption structure, or other adsorption structures such as an electromagnet structure or a magnet structure. For example, please refer to... Figure 6 and Figure 7 The adsorption structure includes a vacuum suction cup, which is fixed to the first end of the support part 122 by means of bonding, locking, snapping, etc. The support part 122 is provided with an air pipe connector 123 for connecting the vacuum suction cup to an external control source (such as a negative pressure air source).

[0064] Thus, when the drive mechanism 140 drives the support part 122 to raise the adsorption structure (such as a vacuum suction cup) to the preset position, the adsorption structure can be used to support the frame part 400a of the test piece, and then the negative pressure of the adsorption structure adsorbs the frame part 400a, thereby achieving the bearing and fixation of the back side of the test piece.

[0065] In other embodiments, the locking member 120 may also employ a clamping structure to support and fix the test piece. For example, the locking part 121 includes a third driving member and a pressure block. The body of the third driving member is connected to the support part 122, and the power end of the third driving member is coupled to the pressure block. When the transfer member 130 releases the test piece onto the locking member 120 (e.g., the support part 122 receives the frame part 400a), the pressure block is driven by the third driving member to flip relative to the bearing plate 110 or the support part 122. The pressure block is used to press and fix the frame part 400a of the test piece to the first end of the support part 122, thereby achieving the support and fixation of the back side of the test piece.

[0066] In some embodiments, please refer to Figure 6 and Figure 7 The power end of the drive mechanism 140 is fixedly connected to the locking edge member 120 to directly drive the locking edge member 120 to rise and fall relative to the carrier plate 110.

[0067] For example, the drive mechanism 140 includes a cylinder assembly, the body of which is connected to the support plate 110, and the power end of the cylinder assembly is connected to the second end of the support portion 122. By utilizing the characteristics of the cylinder, such as low and controllable pneumatic pressure and short stroke, the controllability of the lifting of the locking member 120 can be effectively improved, so that the locking member 120 provides stable structural support and fixation for the frame portion 400a of the test piece.

[0068] For example, the drive mechanism 140 includes an electric cylinder assembly. The body of the electric cylinder assembly is connected to the carrier plate 110, and the power end of the electric cylinder assembly is connected to the second end of the support part 122. By utilizing the controllable movement speed and acceleration of the electric cylinder and the ability to stop at any position within its stroke range, the rising height and speed of the locking edge member 120 can be effectively controlled to adapt to the test piece with expansion rings of different thicknesses.

[0069] Please see Figure 3 , Figure 4 and Figure 6In some embodiments where the power end of the drive mechanism 140 is fixedly connected to the locking member 120, the locking member 120 and the corresponding drive mechanism 140 can be set in multiple groups, such as two groups, three groups, or more. The functional components of the multiple groups of locking members 120 combined with the drive mechanism 140 are arranged at intervals around the center of the support portion 113. Before back inspection, by driving multiple locking members 120 to rise to the same height position, the frame portion 400a can be supported and fixed from different positions. This can achieve stable support for the test piece, avoid slippage of the test piece relative to the support plate 110, and ensure that the wafer portion 400d is horizontally suspended above the adsorption portion 111, which is conducive to the inspection of the back side of the wafer 410.

[0070] Further, please refer to Figure 3 and Figure 4 The outline edge of the carrier plate 110 (i.e. the carrier part 113) can be provided with a notch structure. The notch structure can accommodate the locking piece 120, which makes it easy to install and remove the drive structure 140 and the locking piece 120 as a relatively independent functional combination on the carrier plate 110, thereby reducing the difficulty of installing and removing the carrier device.

[0071] In some embodiments, please refer to Figure 8 The drive mechanism 140 and the locking edge member 120 adopt a split-type cooperation structure. Specifically, the drive mechanism 140 includes a first drive member 141 and a first lifting plate 142, and the locking edge member 120 also includes an elastic part 124. The first drive member 141 may include a power device such as a cylinder or electric cylinder that can output linear motion. The body of the first drive member 141 is connected to the support plate 110, and the power end of the first drive member 141 is connected to the first lifting plate 142 to drive the first lifting plate 142 to rise and fall relative to the support plate 110. The support part 122 is disposed through the support part 113. One end of the elastic part 124 is connected to the support plate 110, and the other end is connected to the second end of the support part 122. For example, the elastic part 124 may be a spring sleeved on the support part 122. The first lifting plate 142 corresponds to the second end of the support part 122.

[0072] When the first driving member 141 drives the first lifting plate 142 to rise, the first lifting plate 142 can abut against the second end of the support part 122, thereby driving the support part 122 to drive the locking edge part 121 to rise (at this time, the elastic part 124 is compressed by the support part 122 and stores elastic potential energy), so that the locking edge part 121 can support and fix the frame part 400a of the test piece; conversely, when the first driving member 141 drives the first lifting plate 142 to fall, the elastic part 124 will release elastic potential energy to provide an elastic force that causes the support part 122 to drive the locking edge part 121 to fall synchronously, so that the locking edge part 121 falls to a position where the upper surface of the locking edge part 121 is lower than the upper surface of the bearing part 113.

[0073] Thus, by setting the drive mechanism 140 as a split-type mating structure, the lifting and lowering of the locking edge member 120 can be made more stable with the cooperation of the first drive member 141 (together with the first lifting plate 142) and the elastic part 124; at the same time, it also helps to reduce the difficulty of disassembling and assembling the bearing component 100.

[0074] In some embodiments where the drive mechanism 140 and the locking element 120 adopt a separate mating structure, the number of locking elements 140 can be set to multiple, such as two, three, four, or more. Multiple locking elements 140 are arranged at intervals around the center of the support portion 113, and the second ends of the support portions 122 of the multiple locking elements 140 correspond to the same first lifting plate 142. Thus, by driving multiple locking elements 140 to rise and fall synchronously relative to the support plate 110 based on the same drive mechanism 140, the receiving and fixing of the expansion ring iron ring wafer can be achieved more evenly and smoothly.

[0075] In some embodiments, please refer to Figures 3 to 6 The drive assembly 200 and the transmission component 130 adopt a split-type cooperative structure. Specifically, the transmission component 130 includes a lifting column 131 and an elastic element 132. The lifting column 131 is disposed through the bearing portion 113. The first end of the lifting column 131 is used to contact the frame portion 400a. One end of the elastic element 132 is connected to the bearing plate 110, and the other end is connected to the second end of the lifting column 131. For example, the elastic element 132 can be a spring sleeved on the lifting column 131. Correspondingly, the drive assembly 200 includes a second drive component 210 and a second lifting plate 220. The second lifting plate 220 corresponds to the second end of the lifting column 131. The second drive component 210 can include a power device such as a cylinder or electric cylinder that can output linear motion and is disposed on the motion platform 300. The power end of the second drive component 210 is coupled to the second lifting plate 220.

[0076] Thus, by driving the second lifting plate 220 to rise and fall relative to the support plate 110 via the second driving member 210, the second lifting plate 220 can abut against the second end of the lifting column 131 when it rises, thereby driving the lifting column 131 to rise synchronously (at this time, the elastic member 132 will be compressed by the lifting column 131 and store elastic potential energy), thereby supporting the frame portion 400a of the test piece through the lifting column 131 and realizing the support of the test piece; conversely, when the second lifting plate 220 falls, the elastic member 132 will release elastic potential energy to provide an elastic force that causes the lifting column 131 to drive the frame portion 400a to fall synchronously until the frame portion 400a falls on the locking member 120 or the wafer portion 400d falls on the adsorption portion 111, thereby realizing the release of the test piece.

[0077] In some embodiments, please refer to Figure 3 , Figure 4 and Figure 6 The number of conveying components 130 is set to multiple, and the multiple conveying components 130 are arranged at intervals around the center of the bearing part 113, and the multiple conveying components 130 correspond to the same second lifting plate 220; in this way, the multiple conveying components 130 can be driven to rise synchronously by means of the second lifting plate 220, so as to support the frame part 400a of the test piece from different positions through the multiple conveying components 130, thereby realizing the smooth acceptance and release of the test piece; moreover, the multiple conveying components 130 share a single drive assembly 200, which helps to reduce the overall structural complexity of the bearing device; in addition, the drive assembly 200 and the conveying components 130 adopt a relatively independent structural system and cooperate with each other, which also helps to reduce the difficulty of disassembling and assembling the bearing device.

[0078] Considering that the test pieces typically have different external dimensions, such as the common wafer 410 which comes in 8-inch and 12-inch sizes, the corresponding wafer portion 400d and frame portion 400a of the expander ring iron ring wafer and the conventional iron ring wafer are also different. Since the size difference between 8-inch and 12-inch expander ring iron ring wafers and the size difference between 8-inch and 12-inch conventional iron ring wafers is relatively large, it is not easy to set up locking components 120, conveying components 130 and related functional structures adapted to 8-inch and 12-inch test pieces on the same carrier tray 110. However, if a separate carrier device is set up for each size of test piece, it will inevitably increase the configuration cost of the carrier device or testing equipment, as well as the testing cost.

[0079] Therefore, in some embodiments, the number of carrier components 100 is set to multiple, and different carrier components 100 are configured to carry test pieces of different sizes; for example, one of the multiple carrier components 100 is configured to carry a fixed 8-inch expanded ring iron ring wafer and a conventional iron ring wafer, and another of the multiple carrier components 100 is configured to carry a fixed 12-inch expanded ring iron ring wafer and a conventional iron ring wafer. See also... Figure 3 , Figure 4 , Figure 5 , Figure 11 and Figure 12 The support device also includes a motion platform 300, on which a first positioning seat 310 is provided. Each support component 100 includes a second positioning seat 150 that supports its respective support plate 110 (for example, the second positioning seat 150 is centrally located at the bottom of the support plate 110). The first positioning seat 310 and the second positioning seat 150 are matched with each other and detachably connected.

[0080] Thus, by utilizing the detachable connection between the first positioning seat 310 and the second positioning seat 150, a quick-change structure can be formed between the bearing component 100 and the motion platform 300. This allows multiple bearing components 100 to be detachably and interchangeably connected to the motion platform 300. Based on the different dimensions of the workpiece being tested, corresponding bearing components 100 and motion platforms 300 can be selectively combined to form a bearing device. This not only meets the requirements for front and back inspection of workpieces of different sizes but also effectively saves time in modifying the bearing device structure and improves testing efficiency. Furthermore, the shared use of the same motion platform 300 by multiple bearing components 100 effectively improves the utilization rate of the motion platform 300 and related functional components, and reduces the configuration and operating costs of the bearing device.

[0081] In some embodiments, please refer to Figure 5 , Figure 11 and Figure 12 The first positioning seat 310 is provided with at least three first positioning elements 311, and the second positioning seat 150 is provided with at least three second positioning elements 151 arranged at intervals along the center of the bearing disk 110. The first positioning elements 311 and the second positioning elements 151 correspond one to one and are inserted and connected. For example, one of the corresponding first positioning elements 311 and the second positioning elements 151 has a groove structure extending in the radial direction of the bearing disk 110, and the other has a protrusion structure that can be inserted into the corresponding groove structure.

[0082] When the support component 100 is connected to the motion platform 300 through the cooperation of the second positioning seat 150 and the first positioning seat 310, the insertion connection between the first positioning member 311 and the second positioning member 151, as well as their quantity and arrangement, can prevent the support component 100 from rotating and translating relative to the first positioning seat 310, thereby stably restricting the support component 100 on the motion platform 300. Conversely, if it is necessary to replace the support component 100, it is only necessary to apply an upward force along the thickness direction of the support plate 110 to the support component 100 to remove the support component 100 from the motion platform 300, thereby realizing the quick disassembly and switching of different support components 100 based on the same motion platform 300.

[0083] In some embodiments, please refer to Figure 5 , Figure 11 and Figure 12The first positioning seat 310 is also provided with a first magnetic attractor 312, and the second positioning seat 150 is also provided with a second magnetic attractor 152 for one-to-one engagement with the first magnetic attractor 312; wherein, one of the first magnetic attractor 312 and the second magnetic attractor 152 can be a magnet, and the other can be made of a ferromagnetic material; the number of the first magnetic attractor 312 and the second magnetic attractor 152 can be set to multiple, for example, the second magnetic attractor 152 and the second positioning member 151 are arranged alternately around the center of the bearing plate 110.

[0084] Thus, relying on the alignment and attraction between the first magnetic 312 and the second magnetic 152, the first positioning seat 310 and the second positioning seat 150 can be prevented from moving along the thickness direction of the bearing plate 110. Furthermore, under the gravity of the bearing assembly 100 and with the cooperation of the first positioning member 311 and the second positioning member 151, the bearing assembly 100 is effectively prevented from rotating, translating, and moving up and down relative to the first positioning seat 310, thereby more securely binding the bearing assembly 100 to the motion platform 300.

[0085] Please see Figure 5 As described in some of the embodiments above, the drive assembly 200 can be mounted on the motion platform 300. In this case, multiple sets of support structures 230 can be mounted on the second lifting plate 220, with different sets of support structures 230 corresponding to the positions of the transmission components 130 in different load-bearing assemblies 100. Thus, when the second drive assembly 210 drives the second lifting plate 220 to rise and fall, the positional correspondence between the support structures 230 and the transmission components 130 can be used to drive the corresponding transmission components 130 to rise and fall. At the same time, by sharing the drive assembly 200, it is also beneficial to simplify the structural complexity of the load-bearing assembly 100 and improve the utilization rate of the motion platform 300, the drive assembly 200, and related functional components.

[0086] In some embodiments, in order to save the structural space occupied by components such as the support plate 110, and to provide support for the installation of components such as the locking piece 120 on the support plate 110, the pipelines (such as air ducts) and lines (such as connecting cables) in the support assembly 100 can be externally routed. In this case, the corresponding pipelines can be connected to an external control source (such as a negative pressure air source, control device, etc.) using a quick-connect structure, so that the support assembly 100 can be disassembled and assembled as a whole when switching the support assembly 100.

[0087] Specifically, the carrier component 100 also includes one or more first pipeline connectors (not shown in the figure). The first pipeline connector may include a connector that is connected to the carrier plate 110 (specifically, the adsorption part 111), the drive mechanism 140 (e.g., the first drive member 141 using a cylinder), the vacuum adsorption mechanism of the locking member 120, etc. through a corresponding air passage, or a connector that is connected to the drive mechanism 140 (e.g., the first drive member 141 using an electric cylinder), the electromagnet adsorption structure of the locking member 120, etc. through a corresponding power supply or signal cable.

[0088] The first pipeline connector allows for a detachable connection (e.g., a plug-in connection) between the first pipeline connector and the second pipeline connector of the external control source. This enables both pneumatic and electrical connections between the carrier assembly 100 and the external control source, and facilitates the assembly and disassembly of the carrier assembly 100 as a whole with the motion platform 300, the external control source, and the drive assembly 200, allowing for rapid switching between different carrier assemblies 100. This further reduces the time required for modifying the structural system of the carrier device to meet the need for rapid switching between different carrier assemblies 100.

[0089] In some embodiments, the motion platform 300 is configured to drive the carrier assembly 100 to rotate, thereby synchronously rotating the test piece (e.g., a conventional iron ring wafer, an expanded iron ring wafer, etc.) through the carrier assembly 100, adjusting the test piece's inspection position to meet the requirements of front or back inspection. For details, please refer to... Figure 5 The motion platform 300 includes a platform section 320 and a rotating section 330 that can be controlled to rotate relative to the platform section 320; wherein, the first positioning seat 310 is connected to the rotating section 330 and rotates synchronously, so that the bearing component 100 can rotate synchronously with the first positioning seat 310; and the drive component 200, etc. can be disposed on the platform section 320.

[0090] At the same time, please combine Figure 3 , Figure 4 and Figure 5 The platform section 320 is provided with a first limiting member 340, and the bearing assembly 100 also includes a second limiting member 160 connected to the bearing plate 110. Through the cooperation of the first limiting member 340 and the second limiting member 160, the rotation stroke of the bearing assembly 100 can be limited so that the rotating part 330 drives the bearing assembly 100 to rotate within a preset angle range, thereby avoiding the tearing of pipelines (such as airway pipelines, signal / power supply cables, etc.) in the bearing assembly 100 due to excessive rotation angle.

[0091] For example, please refer to Figure 3The first limiting member 340 and the second limiting member 160 cooperate to form a mechanical limiting structure. When the rotating part 330 drives the bearing assembly 100 to rotate to a preset angle position, the second limiting member 160 will resist the first limiting member 340 to prevent the bearing assembly 100 from continuing to rotate, thereby limiting the rotation stroke or angle position of the bearing assembly 100.

[0092] For example, please refer to Figure 2 The first limiting member 340 and the second limiting member 160 cooperate to form a photoelectric limiting structure. Specifically, the first limiting member 340 can be a stroke sensor, pressure sensor, infrared sensor, etc. When the rotating part 330 drives the bearing assembly 100 to rotate to a preset angle position, the second limiting member 160 will trigger the first limiting member 340. The motion platform 300 or related control device can stop the rotating part 330 from driving the bearing assembly 100 to rotate according to the trigger information of the first limiting member 340, thereby limiting the rotation stroke of the bearing assembly 100.

[0093] In some embodiments, the first limiting member 340 and the second limiting member 160 can be configured as two sets, one set being a mechanical limiting structure and the other set being a photoelectric limiting structure, so that the rotational stroke of the bearing component 100 can be reliably limited within a preset stroke range.

[0094] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A supporting device, characterized in that, It includes a support component and a drive component, wherein the support component includes a support disk, a locking edge component, a conveying component, and a drive mechanism; wherein: The carrier plate includes an adsorption part and a support part surrounding the adsorption part, the upper surface of the adsorption part is higher than the upper surface of the support part, and the locking member and the conveying member are respectively disposed on the support part; The driving mechanism is configured to drive the locking member to move up and down relative to the carrier plate, so as to support and fix the frame part of the test piece through the locking member, thereby spacing the test piece from the adsorption part. The drive component is configured to drive the conveyor to move up and down relative to the carrier plate, so as to receive or release the test object through the conveyor.

2. The bearing device as described in claim 1, characterized in that, The locking edge component includes a locking edge portion and a support portion. The locking edge portion is used to receive and fix the frame portion. The support portion passes through the load-bearing portion and is disposed at the first end of the support portion. The driving mechanism acts on the second end of the support portion to drive the support portion to move the locking edge portion up and down.

3. The bearing device as described in claim 2, characterized in that, The locking edge portion has an adsorption structure for adsorbing and fixing the frame portion, and the adsorption structure includes at least one of a vacuum adsorption structure, an electromagnet structure, and a magnet structure.

4. The bearing device as described in claim 2, characterized in that, The driving mechanism includes a first driving member and a first lifting plate, and the locking member further includes an elastic part; wherein: One end of the elastic part is connected to the bearing plate, and the other end is connected to the second end of the support part. The elastic part is used to provide an elastic force that causes the support part to drive the locking edge part to descend. The body of the first driving member is connected to the bearing plate, and the power end of the first driving member is connected to the first lifting plate. The first driving member drives the first lifting plate to rise and fall. The first lifting plate acts on the second end of the support part, driving the support part to drive the locking edge part to rise.

5. The bearing device as described in claim 1, characterized in that, The conveying component includes a lifting column and an elastic element. The lifting column is disposed through the bearing portion. A first end of the lifting column is used to contact the frame portion. One end of the elastic element is connected to the bearing plate, and the other end is connected to the second end of the lifting column. The driving component acts on the second end of the lifting column to drive the lifting column to rise. The elastic element is used to provide an elastic force to cause the lifting column to descend.

6. The bearing device as described in claim 1, characterized in that, Each of the carrier components further includes one or more first line connectors; the first line connectors are configured to be detachably connected to a second line connector of an external control source to achieve a pneumatic or electrical connection between the carrier component and the external control source.

7. The bearing device as described in any one of claims 1-6, characterized in that, The test piece includes a die-expanding ring iron ring wafer, which includes a wafer, a die-expanding ring surrounding the wafer, and an iron ring surrounding the die-expanding ring, wherein the iron ring is the frame portion; wherein the height difference between the upper surface of the adsorption portion and the upper surface of the support portion is not less than the thickness of the die-expanding ring.

8. The bearing device as described in any one of claims 1-6, characterized in that, The support device further includes a first positioning seat for mounting on the motion platform, and the support assembly further includes a second positioning seat for supporting the support plate; the first positioning seat and the second positioning seat are detachably connected to each other to detachably connect the support assembly to the motion platform.

9. The bearing device as described in claim 8, characterized in that, The first positioning seat is provided with at least three first positioning elements, and the second positioning seat is provided with at least three second positioning elements arranged around the center of the bearing plate; the first positioning elements and the second positioning elements correspond one-to-one and are inserted and connected to prevent the bearing assembly from rotating and translating relative to the first positioning seat.

10. The bearing device as described in claim 9, characterized in that, The first positioning seat is further provided with a first magnetic attraction element, and the second positioning seat is provided with a second magnetic attraction element; the first magnetic attraction element and the second magnetic attraction element are aligned and attracted to prevent the first positioning seat and the second positioning seat from moving along the thickness direction of the bearing plate.

11. The bearing device as claimed in claim 8, characterized in that, The support device further includes the motion platform, and the number of the support components is set to multiple, with different support components used to support test pieces of different dimensions; each support component includes a second positioning seat that matches the first positioning seat, so that multiple support components can be interchangeably connected to the motion platform.

12. The bearing device as described in claim 8, characterized in that, The drive assembly includes a second drive member and a second lifting plate. The second drive member is disposed on the motion platform and is used to drive the second lifting plate to rise and fall. The second lifting plate has a support structure corresponding to the transmission member in different load-bearing assemblies. The second lifting plate drives the corresponding transmission member to rise and fall through the support structure.

13. The bearing device as described in claim 8, characterized in that, The motion platform includes a platform and a rotating part that can be controlled to rotate relative to the platform; the first positioning seat is connected to the rotating part and rotates synchronously, and the bearing component rotates synchronously with the first positioning seat; The platform portion is provided with a first limiting member, and the bearing assembly further includes a second limiting member connected to the bearing disk; the first limiting member and the second limiting member cooperate to limit the rotational stroke of the bearing assembly.

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