Air-cooled array surface structure adopting vapor chamber frame

Abstract

The invention provides an air-cooled array surface structure adopting a vapor chamber frame, which comprises a vapor chamber array surface frame, an antenna cover, a receiving and transmitting assembly, an antenna, a shell, a connector, a temperature monitoring unit, an array surface distribution plate, a high-power-consumption functional module, a low-power-consumption functional module, a temperature control module, a large-air-volume axial flow fan, an internal turbulent flow fan and a semiconductor refrigerator, a semiconductor refrigerator cold end, a semiconductor refrigerator hot end, a loop heat pipe, a loop heat pipe cold end, a loop heat pipe hot end, an air duct cover plate, a rear cover plate, a rear cover plate external groove, a rear cover plate internal groove, a sealing rope, a fan protective cover, captive screws and trunnions are included. According to the design of the invention, the array surface heat dissipation mode is changed from liquid cooling to air cooling, the design requirements of light weight and low cost of the array surface structure are realized, and the effect of the heat dissipation system and the redundancy design is verified step by step in the high-temperature environment test process to meet the requirements.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to an air-cooled array structure using a vapor chamber frame. Background Technology

[0002] With the development of heat dissipation technology, there are increasingly more heat dissipation methods available for weapon arrays. Generally, considering the need to improve the heat dissipation capacity and temperature uniformity of the array, liquid cooling is preferred. The cold source for liquid cooling can be a system-supplied coolant or a gas-liquid heat exchanger built into the array itself to provide coolant to the front of the array. However, with the design requirements of modern warfare for lightweight and low-cost weapon assembly, air cooling is now the preferred option for weapon arrays while meeting performance specifications. But air cooling is less efficient than liquid cooling. How to adopt various enhanced heat dissipation measures to improve the efficiency of air cooling and reduce equipment weight and cost has become an urgent problem to be solved. Summary of the Invention

[0003] The purpose of this invention is to address the aforementioned technical problems by employing various enhanced heat dissipation measures to improve the efficiency of air-cooled heat dissipation and reduce equipment weight and cost. Therefore, this invention provides an air-cooled array structure using a vapor chamber frame.

[0004] The present invention proposes an air-cooled array structure using a heat spreader frame, comprising: Temperature distribution plate array frame (1), radome (2), receiver and transmitter assembly (3), antenna (3a), housing (3b), connector (3c), temperature monitoring unit (4), array distribution plate (5), high power consumption functional module (6), low power consumption functional module (7), temperature control module (8), high air volume axial flow fan (9), internal turbulence fan (10), semiconductor cooler (11), semiconductor cooler cold end (11a), semiconductor cooler hot end (11b), loop heat pipe (12), loop heat pipe cold end (12a), loop heat pipe hot end (12b), air duct cover (13), rear cover (14), rear cover external groove (14a), rear cover internal groove (14b), sealing rope (15), fan protective cover (16), non-removable screw (17), trunnion; The heat exchange plate array frame (1) includes: a frame base plate (101), a base plate clearance hole (102), an outer frame (103), an inner frame (104), a heat dissipation boss on the outer side of the inner frame (105), an inner frame sealing groove (106), an inner cross reinforcing rib plate (107), an outer toothed heat dissipation fin (108), an inner toothed heat dissipation fin (109), an interface between the array and the transmission mechanism (110), an internal fan mounting hole (111), an external fan mounting hole (112), and a rib plate wiring hole (113). On the heat spreader array frame (1), the array distribution plates (5) located in the four quadrants are installed from the rear. The receiver and transmitter assembly (3) with positioning pin connector (3c) is blindly inserted into the array distribution plate (5) from the front. Then, the fastening screw passes through the antenna (3a) and housing (3b) of the receiver and transmitter assembly (3) and fixes it on the frame base plate (101) of the heat spreader array frame (1). The connector (3c) of the receiver and transmitter assembly (3) passes through the base plate clearance hole (102) on the frame base plate (101) and is inserted into the corresponding connector on the array distribution plate (5). The high-power functional module (6) and temperature control module (8) are installed inside the inner frame (104) of the heat spreader array frame (1), and the low-power functional module (7) and internal turbulence fan (10) are installed on the internal cross reinforcing rib plate (107); the hot end (12b) of the semiconductor cooler (11) and the loop heat pipe (12) are installed at a set position on the frame substrate (101), and the cold end (12b) of the loop heat pipe (12) is installed inside the inner frame (104); wherein the high-power functional module (6) and the cold end (12b) of the loop heat pipe (12) are evenly and symmetrically distributed inside the inner frame (104) according to the heat dissipation. The internal turbulence fan (10) is installed at the internal fan mounting hole (111) on the internal cross reinforcing rib plate (107). One end of the fan is embedded in the internal fan mounting hole (111). The air outlet direction is the right side of the fan mounting surface, and the air inlet direction is the left side of the fan mounting surface. The four fans make the internal air flow in a clockwise closed loop, and the airflow of the four fans can also flow in a counterclockwise closed loop. Four heat dissipation areas are formed between the outer frame (103) and inner frame (104) of the heat exchange plate array frame (1). Two large-volume axial flow fans (9) are arranged in each area and installed in the external fan mounting holes (112) at the chamfer of the outer frame (103) of the heat exchange plate array frame (1). A fan protective cover (16) is added to the outside of the large-volume axial flow fans (9). A circular external toothed heat dissipation fin (108) is designed on the frame substrate (101) between the outer frame (103) and the inner frame (104). The duct cover (13) is installed on the outer frame (103) and the external toothed heat dissipation fins (108), and there is a certain gap between it and the inner frame (104). It serves as one of the environmental air inlets for the heat dissipation area. The environmental air here flows through the heat dissipation protrusions (105) on the outer side of the inner frame and the external toothed heat dissipation fins (108) before flowing out to the large-volume axial fan (9). The second entrance is the porous structure on the duct cover (13). Due to the irregular shape between the outer frame (103) and inner frame (104) of the heat exchange plate array frame (1), the circular external toothed heat dissipation fins (108) are irregularly densely distributed under the duct cover (13). The porous structure on the duct cover (13) and the circular external toothed heat dissipation fins (108) are arranged in an alternating manner, which facilitates the ambient wind entering the heat dissipation area to directly convect and exchange heat with the external toothed heat dissipation fins (108). The arrangement is irregular, and the four heat dissipation areas are symmetrically arranged.

[0005] In one embodiment, a rear cover plate (14) is installed on the inner frame (104) and the inner cross reinforcing rib plate (107) of the heat exchange plate array frame (1). Before installation, the sealing rope (15) is fixed in the inner frame sealing groove (106), and then the rear cover plate (14) is fastened to the heat dissipation boss (105) on the outer side of the inner frame using the non-detachable screws (17) on the rear cover plate (14), so that the rear cover plate (14) and the inner frame (104) are sealed together, thereby improving the internal protection performance of the array.

[0006] In one embodiment, the rear cover plate (14) is provided with regularly stamped strip grooves at the front and rear, namely the outer groove (14a) and the inner groove (14b) of the rear cover plate, which are used to increase the heat exchange area of ​​the rear cover plate to the inside and the outside and reduce the weight of the rear cover plate; the rear cover plate (14) is equipped with a non-detachable screw as the force point for moving the rear cover plate.

[0007] In one embodiment, the frame substrate (101) of the heat exchanger array frame (1) is an aluminum-based heat exchanger, which is used to quickly conduct the heat dissipation of the receiving and transmitting components (3) mounted on its surface to the four heat dissipation areas, thereby reducing the temperature rise caused by heat conduction; the frame substrate (101) and the outer frame (103) are integrally processed with the inner frame (104); the outer heat dissipation boss (105), the outer toothed heat dissipation fins (108) and the inner toothed heat dissipation fins (109) of the inner frame are directly processed on the frame substrate (101) to improve the heat conduction efficiency and avoid the thermal resistance that exists when different components are installed and in contact.

[0008] In one embodiment, the radome (2) is sealed to the frame substrate (101) of the heat spreader array frame (1) at the front, and the radome (2) is designed to be heat-insulated.

[0009] In one embodiment, the interface (110) between the surface of the heat exchange plate array frame (1) and the transmission mechanism is connected to the transmission mechanism through the trunnions (18) on both sides, thereby achieving dynamic sealing between the interface and the transmission mechanism. This allows cables in different quadrants inside the array to pass through the cable routing holes (113) and trunnions (18) along the internal cross reinforcing ribs (107) and connect to the inside of the transmission mechanism.

[0010] In one implementation, the system is divided into two levels based on the distance from the outer frame (103): a central level and a middle level. The central layer consists of four semiconductor coolers (11) arranged at the center of the rear of the array. The cold end (11a) of the semiconductor cooler (11) is attached to the frame substrate (101) at this location to cool the central area of ​​the array. The hot end (11b) of the semiconductor cooler (11) is conducted to the inner frame (104) through the loop heat pipe (12) and then dissipates heat through the heat dissipation area, thus cooling the center and simultaneously heating the periphery. The middle layer is located around the rear center layer of the array, near the internal turbulence fan (10), where several internal toothed heat dissipation fins (109) are arranged to enhance local heat exchange through the internal turbulence fan (10).

[0011] In one embodiment, the temperature monitoring unit (4) is integrated into the receiving and transmitting component (3) to monitor the temperature of all receiving and transmitting components (3) and to perform step-by-step enhanced control of the heat dissipation system of the entire array based on the monitoring results, so as to ensure that the array heat dissipation and temperature uniformity requirements are met with the lowest energy consumption.

[0012] In one implementation, the step-by-step enhanced control of the entire array's heat dissipation system based on monitoring results includes four levels of control, specifically: The first stage has a heat loss of about half of the theoretical maximum heat loss, requiring two large-volume axial flow fans (9) installed at the four corners of the array to work alternately; The second stage has a heat loss of about three-quarters of the theoretical maximum heat loss, requiring the two large-volume axial flow fans (9) installed at the four corners of the array to be fully operational. At the third stage, the heat loss of the array surface is about seven-eighths of the theoretical maximum heat loss, and the large-volume axial flow fan (9) and the internal turbulence fan (10) are all working. At the fourth stage, the heat loss of the array surface is approximately the theoretical maximum heat loss, and the large-volume axial flow fan (9), the internal turbulence fan (10), and the semiconductor cooler (11) are all in operation.

[0013] By adopting the above technical solution, the present invention has at least the following advantages: This invention relates to a vapor chamber cooling array structure employing a vapor chamber frame and a graded temperature control method. Without increasing the array structure size, it employs multiple measures to enhance the heat dissipation system, including: using a vapor chamber frame to reduce conductive temperature rise; improving the forced air cooling heat exchange effect in each heat dissipation area; enhancing heat dissipation within the array's internal space; and using a semiconductor cooler for active cooling in the central area. This achieves a change from liquid cooling to air cooling for the array, thus meeting the requirements for lightweight and low-cost array structure design. The effectiveness of the heat dissipation system and redundancy design was verified step-by-step during high-temperature environment testing. Attached Figure Description

[0014] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 This is a front three-dimensional view of an air-cooled array structure employing a heat spreader frame according to an embodiment of the present invention; Figure 2 This is a three-dimensional view of the rear of the array surface according to an embodiment of the present invention; Figure 3 This is a three-dimensional view of the rear part of the array surface after removing the air duct cover and the rear cover in an embodiment of the present invention. Figure 4 This is a three-dimensional view of the rear of the heat exchanger frame according to an embodiment of the present invention; Figure 5 This is a three-dimensional view of the front of the heat exchanger frame according to an embodiment of the present invention; Figure 6 This is a three-dimensional view of the receiving and transmitting component according to an embodiment of the present invention; Figure 7 This is an integrated view of the semiconductor cooler and loop heat pipe according to an embodiment of the present invention; Figure 8 This is an internal view of the rear cover plate according to an embodiment of the present invention. Detailed Implementation

[0015] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the present invention will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0016] While exemplary embodiments of the invention are shown in the accompanying drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the invention and to fully convey its scope to those skilled in the art. The invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0017] According to an embodiment of the present invention, a wind-cooled array structure employing a heat spreader frame is provided, such as... Figures 1 to 8 Shown, including: 1. Heat spreader array frame; 2. Antenna cover; 3. Receiver / transmitter assembly; 3a. Antenna; 3b. Housing; 3c. Connector; 4. Temperature monitoring unit; 5. Array distribution board; 6. High-power function module; 7. Low-power function module; 8. Temperature control module; 9. High-volume axial flow fan; 10. Internal turbulence fan; 11. Semiconductor cooler; 11a. Cold end of semiconductor cooler; 11b. Hot end of semiconductor cooler; 12. Loop heat pipe; 12a. Hot end of loop heat pipe; 12b. Air duct cover; 13. Rear cover; 14. External groove of rear cover; 14a. Internal groove of rear cover; 14b. Sealing rope; 15. Fan protective cover; 16. Locking screw; 17. Trunnion; 18.

[0018] The heat spreader array frame 1 further includes: a frame base plate 101, a base plate clearance hole 102, an outer frame 103, an inner frame 104, a heat dissipation boss on the outer side of the inner frame 105, an inner frame sealing groove 106, an internal cross reinforcing rib 107, an external toothed heat dissipation fin 108, an internal toothed heat dissipation fin 109, an interface 110 between the array and the transmission mechanism, an internal fan mounting hole 111, an external fan mounting hole 112, and a rib wiring hole 113.

[0019] The vapor chamber array frame 1 is the main structure of the array, responsible for installing other units, connecting the array to the transmission mechanism, and conducting heat for all modules. On the vapor chamber array frame 1, the passive array distribution plates 5 located in the four quadrants are first installed from the rear. Then, the receiver / transmitter assembly 3 with a positioning pin connector 3c is blindly inserted into the passive array distribution plate 5 from the front. Fastening screws are then passed through the antenna 3a and assembly 3b of the receiver / transmitter assembly 3 and fixed to the frame base plate 101 of the vapor chamber array frame 1. The connector 3c of the receiver / transmitter assembly 3 passes through the base plate clearance hole 102 on the frame base plate 101 and engages with the corresponding connector on the passive array distribution plate 5.

[0020] A high-power functional module 6 and a temperature control module 8 are installed inside the inner frame 104 of the heat spreader array frame 1. A low-power functional module 7 and an internal turbulence fan 10 are installed on the internal cross-shaped reinforcing rib plate 107. A semiconductor cooler 11 and the hot end 12b of the loop heat pipe 12 are installed at designated positions on the frame substrate 101, and the cold end 12b of the loop heat pipe 12 is installed inside the inner frame 104. The high-power functional module 6 and the cold end 12b of the loop heat pipe 12 are evenly and symmetrically distributed inside the inner frame 104 according to the amount of heat dissipation to avoid excessive impact on the surface temperature uniformity.

[0021] The internal turbulence fan 10 is installed at the internal fan mounting hole 111 on the internal cross-shaped reinforcing rib plate 107. One end of the fan is embedded in the internal fan mounting hole 111. The air outlet direction is the right side of the fan mounting surface, and the air inlet direction is the left side of the fan mounting surface. The four fans make the internal air flow in a clockwise closed loop, which is equivalent to four fans connected in series. However, the airflow direction of adjacent fans is perpendicular, which makes the internal circulating airflow range and air velocity larger, which is more conducive to transferring the heat on the internal toothed heat dissipation fins 109 to the inner frame 104 and the rear cover plate 14 of the heat spreader array frame 1. The airflow direction of the four fans can also be a counterclockwise closed loop.

[0022] Four heat dissipation areas are formed between the outer frame 103 and the inner frame 104 of the heat exchange plate array frame 1. Each area is equipped with two large-volume axial flow fans 9, which are installed in the external fan mounting holes 112 at the chamfer of the outer frame 103 of the heat exchange plate array frame 1. A fan protective cover 16 is installed on the outside of the large-volume axial flow fans 9 to protect the fans.

[0023] A circular external toothed heat dissipation fin 108 is designed on the frame base plate 101 between the outer frame 103 and the inner frame 104. The air duct cover 13 is installed on the outer frame 103 and the external toothed heat dissipation fin 108, and leaves a certain distance gap with the inner frame 104. It serves as one of the ambient air inlets for the heat dissipation area. The ambient air here flows through the heat dissipation protrusion 105 on the outer side of the inner frame and the external toothed heat dissipation fin 108, and then flows out of the high-volume axial fan 9. The second entrance is the porous structure on the air duct cover plate 13. Due to the irregular shape between the outer frame 103 and the inner frame 104 of the heat exchange plate array frame 1, the circular external toothed heat dissipation fins 108 are irregularly and densely distributed under the air duct cover plate 13. The porous structure on the air duct cover plate 13 and the circular external toothed heat dissipation fins 108 are arranged alternately, which facilitates the ambient wind entering the heat dissipation area to directly convect and exchange heat with the external toothed heat dissipation fins 108. Their arrangement is also irregular, but the four heat dissipation areas are symmetrically arranged.

[0024] The rear cover plate 14 is installed on the inner frame 104 and the internal cross reinforcing rib plate 107 of the heat exchange plate array frame 1. Before installation, the sealing rope 15 is fixed in the sealing groove 106 of the inner frame. Then, the rear cover plate 14 is fastened to the heat dissipation protrusion 105 on the outer side of the inner frame using the non-detachable screws 17 on the rear cover plate 14, so that the rear cover plate 14 and the inner frame 104 are sealed together, thereby improving the internal protection performance of the array.

[0025] The rear cover plate 14 has regularly stamped strip-shaped grooves on its front and back, namely the outer groove 14a and the inner groove 14b. This not only increases the heat exchange area of ​​the rear cover plate to the inside and outside, but also reduces its weight. The use of captive screws on the rear cover plate 14 can prevent ordinary screws from being easily lost, and can also serve as leverage points for moving the rear cover plate.

[0026] The frame substrate 101 of the vapor chamber array frame 1 is an aluminum-based vapor chamber, which can quickly conduct the heat dissipation of the receiving and transmitting components 3 mounted on its surface to the four heat dissipation areas, reducing the temperature rise caused by heat conduction. This reduces the maximum temperature of the array and improves the temperature uniformity of the array. The aluminum-based vapor chamber has a lower density than aluminum alloy, and the frame substrate 101 has a larger volume, thus significantly reducing the weight of the array structure. Integrating the frame substrate 101, outer frame 103, and inner frame 104 into a single unit not only increases the rigidity of the entire vapor chamber array frame 1 and reduces the space required for assembly, which is beneficial for lightweight array structure design, but also enhances the thermal conductivity of the modules mounted on the outer frame 103 and inner frame 104, which is beneficial for heat dissipation. Directly machining the heat dissipation protrusions 105 on the outer side of the inner frame, the external toothed heat dissipation fins 108, and the internal toothed heat dissipation fins 109 on the frame substrate 101 is also to improve heat conduction efficiency and avoid thermal resistance when different components are installed and in contact.

[0027] The radome 2 is sealed to the frame base plate 101 of the heat spreader array frame 1 at the front, improving the protection performance of the receiving and transmitting components 3. Due to the wave transmission characteristics of the radome 2, its thermal conductivity is poor. Therefore, no heat dissipation capacity improvement design is made here. However, heat insulation design to reduce the influence of solar radiation must be done. First, reduce the solar radiation absorption coefficient of the radome 2. Second, further reduce the thermal conductivity of the radome 2.

[0028] The interface 110 between the surface of the heat exchange plate array frame 1 and the transmission mechanism is connected to the transmission mechanism through the trunnions 18 on both sides. First, it is necessary to ensure good connection strength. Second, it is necessary to ensure dynamic sealing near the interface and the transmission mechanism. Third, the cables of different quadrants inside the array pass through the cable routing holes 113 and trunnions 18 along the internal cross reinforcing rib plate 107 and are connected to the inside of the transmission mechanism.

[0029] Even with simultaneous heat dissipation from all four heat dissipation areas, the vapor chamber array frame 1 still suffers from overheating at the center. Therefore, enhanced heat dissipation in the central area is necessary, and the array is divided into two levels based on its distance from the outer frame 103: a central level and a middle level. The central level consists of four thermoelectric coolers 11 positioned at the center of the rear of the array. The cold ends 11a of the thermoelectric coolers 11 are attached to the frame substrate 101 at this location, cooling the central area of ​​the array. The hot ends 11b of the thermoelectric coolers 11 are conducted to the inner frame 104 via a loop heat pipe 12, and then dissipated through the heat dissipation area. This effectively cools the center and heats the periphery, significantly reducing the maximum array temperature and improving array uniformity. The middle level consists of several internal toothed heat dissipation fins 109 arranged around the central level at the rear of the array, near the internal turbulence fan 10, for locally enhanced heat exchange via the internal turbulence fan 10.

[0030] The temperature monitoring unit 4 is integrated within the receiver / transmitter assembly 3. It monitors the temperature of all receiver / transmitter assemblies 3 and, based on the monitoring results, progressively strengthens the control of the entire array's heat dissipation system to ensure that the array's heat dissipation and temperature uniformity requirements are met with minimal energy consumption. In the first stage, the array's heat loss is approximately half of the theoretical maximum heat loss, requiring only the two high-volume axial flow fans 9 installed at the four corners of the array to operate alternately. In the second stage, the array's heat loss is approximately three-quarters of the theoretical maximum heat loss, requiring both high-volume axial flow fans 9 installed at the four corners of the array to operate. In the third stage, the array's heat loss is approximately seven-eighths of the theoretical maximum heat loss, requiring both high-volume axial flow fans 9 and internal turbulence fans 10 to operate. In the fourth stage, the array's heat loss is approximately the theoretical maximum heat loss, requiring all high-volume axial flow fans 9, internal turbulence fans 10, and semiconductor coolers 11 to operate.

[0031] To further improve the reliability of the array air-cooled heat dissipation system, a redundancy design of approximately 25% was implemented. This means that in the aforementioned hierarchical control, as long as the first and second stages, or the first, third, and fourth stages, can function normally, the array's most stringent requirements for the heat dissipation system will be met.

[0032] During high-temperature environment testing, the heat dissipation system was subjected to stage-by-stage thermal tests to observe whether it matched the design estimates. Based on the test results, the control parameters of the temperature control module 8 were corrected to ensure that the array surface temperature met the design requirements. Simultaneously, the effectiveness of the redundancy design was verified: whether the array surface temperature met the design requirements when the first and second stage heat dissipation systems were operating normally; and whether the array surface temperature met the design requirements when the first, third, and fourth stage heat dissipation systems were operating normally.

[0033] The advantages of the structure and application method proposed in the embodiments of the present invention include at least the following: The base plate of the array frame, which mounts the receiving and transmitting components, is a vapor chamber. This allows for rapid heat transfer from all components to the heat dissipation area for centralized forced air cooling. This eliminates the need for other heat dissipation structures in the central area of ​​the array, significantly simplifying electrical design. The outer frame, inner frame, and internal cross-shaped reinforcing ribs of the array frame are integrally machined with the vapor chamber, further enhancing heat conduction. The array frame and inner frame form four heat dissipation areas, and the heat dissipation fins within these areas are also integrally machined with the vapor chamber. Furthermore, the density of the vapor chamber is generally only three-quarters that of aluminum, while the volume of the array frame base plate is the largest within the array frame. Designing the base plate as a vapor chamber reduces the weight of the array frame by at least one-eighth.

[0034] The outer frame dimensions of the array are determined by the electrical dimensions of the array, with an additional 30mm space added around the perimeter for mounting the radome. The inner frame dimensions are determined by the arrangement of the connectors at the rear of the receiver / transmitter components; that is, the inner frame dimensions are the envelope dimensions of the connectors at the rear of the receiver / transmitter components. The thickness of the array frame is determined by the dimensions of the internal functional modules and other mounting interfaces; the thickness should be minimized to facilitate weight reduction.

[0035] The left and right sides of the outer frame of the array are mainly used to connect with the external two-dimensional turntable. The four chamfered corners are mainly used to install large-volume axial flow fans. The inner sidewall of the inner frame of the array is mainly used to install functional modules with large heat generation. The cross-shaped reinforcing ribs inside the array frame are mainly used to install functional modules with small heat generation.

[0036] A perforated plate is installed between the outer and inner frames of the array. The air inlet for the heat dissipation area is formed by the openings in the perforated plate and the gap between the perforated plate and the inner frame. A back cover plate is installed on the inner frame and the internal cross-shaped reinforcing ribs of the array frame. The back cover plate and the inner frame are sealed together to improve the internal protection performance of the array.

[0037] 5. To further increase the heat exchange area, heat dissipation protrusions are designed on the outer side of the inner frame of the array. Sealing grooves are designed on the inner frame, and the mounting screws of the rear cover plate are fastened to the heat dissipation protrusions, which can reduce the thickness of the inner frame and thus reduce the weight.

[0038] 6. In order to further increase the heat exchange area and heat exchange path, the rear cover is designed with regular strip grooves, which can increase the heat exchange area of ​​the rear cover to the inside and outside, and also reduce the weight of the rear cover.

[0039] The outer and inner frames of the 7-array array have irregular shapes. The heat dissipation fins are designed with a toothed shape and are densely distributed below the perforated plate, intersecting with the openings of the perforated plate. This increases the heat dissipation area and facilitates direct convection heat exchange between the ambient air entering the heat dissipation area and the heat dissipation fins. At the same time, in order to reduce wind resistance and increase airflow, the toothed heat dissipation fins are designed to be circular.

[0040] 8. Due to the limited space in the heat dissipation area, the overall drag coefficient is relatively low. Considering the spatial relationship between the air inlets and fan installation locations, high-volume axial fans were selected. To further improve heat dissipation capacity and reliability, a near-type tiered temperature control system was implemented, with two fans installed in each heat dissipation area, for a total of eight fans across the entire array. Because the heat dissipation fins are close to the fans and the air inlets are relatively dispersed, the fan direction is chosen to draw air inwards and blow it outwards, resulting in better heat dissipation. The air inlets for the entire array run from back to front, and the air outlets are perpendicular to the air inlets, minimizing the risk of hot air recirculation.

[0041] 9 Even with the application of a vapor chamber frame and simultaneous heat dissipation in the four quadrants of the array, the problem of overheating in the center of the array still exists. In this case, it is necessary to enhance the heat dissipation of the middle area and divide it into two levels according to the distance from the outer frame of the array: the central level and the middle level.

[0042] The 10-center layer consists of four semiconductor coolers arranged at the center of the rear of the array. The cold end of the cooler is attached to the heat spreader plate to cool the center of the array, while the hot end is conducted to the inner frame of the array through a loop heat pipe and then dissipated through the heat dissipation area. This cools the center and heats the periphery, which can significantly reduce the maximum temperature of the array and improve the temperature uniformity of the array.

[0043] The 11-level middle layer consists of several toothed heat dissipation fins arranged in the middle area of ​​the rear of the array. Then, the heat is locally enhanced by an internal turbulence fan arranged on a cross-shaped reinforcing rib plate, transferring part of the heat in the middle area to the inner frame of the array and part to the rear cover plate.

[0044] The 12 receiver and transmitter components are equipped with temperature sensing devices. A temperature control module monitors the temperature of all receiver and transmitter components and, based on the monitoring results, progressively strengthens the heat dissipation system of the entire array to ensure that the array achieves heat dissipation and temperature uniformity requirements with minimal energy consumption. The first stage consumes approximately half of the theoretical maximum heat dissipation, requiring only the two high-volume axial fans installed at the four corners of the array to operate alternately. The second stage consumes approximately three-quarters of the theoretical maximum heat dissipation, requiring both high-volume axial fans at the four corners to operate. The third stage consumes approximately seven-eighths of the theoretical maximum heat dissipation, requiring all high-volume axial fans and internal turbulence fans to operate. The fourth stage consumes approximately the theoretical maximum heat dissipation, requiring all high-volume axial fans, internal turbulence fans, and semiconductor coolers to operate.

[0045] 13 To further improve the mission reliability of the array air-cooled heat dissipation system, a redundancy design of about 25% was implemented. That is, in the above-mentioned hierarchical control, as long as the first and second stages, or the first, third and fourth stages can work normally, the array's most stringent requirements for the heat dissipation system will be met.

[0046] The cost of the 14-array cooling system is significantly reduced, eliminating the costs associated with cold sources and fluid connectors in liquid cooling systems. The processing and welding costs of the vapor chamber frame and liquid cooling plate are comparable, and the simplified cooling system also significantly reduces the design cost of the temperature control module. Simultaneously, the air-cooled system directly transfers heat to the environment, eliminating most components of the liquid cooling source, resulting in a significant reduction in the weight and size of the array structure. This reduces the design requirements for the array's transmission mechanism, further reducing the weight, size, and cost of radar equipment.

[0047] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims. All of these forms are within the protection scope of this application.

Claims

1. A wind-cooled array structure employing a heat spreader frame, characterized in that, include: Temperature distribution plate array frame (1), radome (2), receiver and transmitter assembly (3), antenna (3a), housing (3b), connector (3c), temperature monitoring unit (4), array distribution plate (5), high power consumption functional module (6), low power consumption functional module (7), temperature control module (8), high air volume axial flow fan (9), internal turbulence fan (10), semiconductor cooler (11), semiconductor cooler cold end (11a), semiconductor cooler hot end (11b), loop heat pipe (12), loop heat pipe cold end (12a), loop heat pipe hot end (12b), air duct cover (13), rear cover (14), rear cover external groove (14a), rear cover internal groove (14b), sealing rope (15), fan protective cover (16), non-removable screw (17), trunnion; The heat exchange plate array frame (1) includes: a frame base plate (101), a base plate clearance hole (102), an outer frame (103), an inner frame (104), a heat dissipation boss on the outer side of the inner frame (105), an inner frame sealing groove (106), an inner cross reinforcing rib plate (107), an outer toothed heat dissipation fin (108), an inner toothed heat dissipation fin (109), an interface between the array and the transmission mechanism (110), an internal fan mounting hole (111), an external fan mounting hole (112), and a rib plate wiring hole (113). On the heat spreader array frame (1), the array distribution plates (5) located in the four quadrants are installed from the rear. The receiver and transmitter assembly (3) with positioning pin connector (3c) is blindly inserted into the array distribution plate (5) from the front. Then, the fastening screw passes through the antenna (3a) and housing (3b) of the receiver and transmitter assembly (3) and fixes it on the frame base plate (101) of the heat spreader array frame (1). The connector (3c) of the receiver and transmitter assembly (3) passes through the base plate clearance hole (102) on the frame base plate (101) and is inserted into the corresponding connector on the array distribution plate (5). The high-power functional module (6) and temperature control module (8) are installed inside the inner frame (104) of the heat spreader array frame (1), and the low-power functional module (7) and internal turbulence fan (10) are installed on the internal cross reinforcing rib plate (107); the hot end (12b) of the semiconductor cooler (11) and the loop heat pipe (12) are installed at a set position on the frame substrate (101), and the cold end (12b) of the loop heat pipe (12) is installed inside the inner frame (104); wherein the high-power functional module (6) and the cold end (12b) of the loop heat pipe (12) are evenly and symmetrically distributed inside the inner frame (104) according to the heat dissipation. The internal turbulence fan (10) is installed at the internal fan mounting hole (111) on the internal cross reinforcing rib plate (107). One end of the fan is embedded in the internal fan mounting hole (111). The air outlet direction is the right side of the fan mounting surface, and the air inlet direction is the left side of the fan mounting surface. The four fans make the internal air flow in a clockwise closed loop, and the airflow of the four fans can also flow in a counterclockwise closed loop. Four heat dissipation areas are formed between the outer frame (103) and inner frame (104) of the heat exchange plate array frame (1). Two large-volume axial flow fans (9) are arranged in each area and installed in the external fan mounting holes (112) at the chamfer of the outer frame (103) of the heat exchange plate array frame (1). A fan protective cover (16) is added to the outside of the large-volume axial flow fans (9). A circular external toothed heat dissipation fin (108) is designed on the frame substrate (101) between the outer frame (103) and the inner frame (104). The duct cover (13) is installed on the outer frame (103) and the external toothed heat dissipation fins (108), and there is a certain gap between it and the inner frame (104). It serves as one of the environmental air inlets for the heat dissipation area. The environmental air here flows through the heat dissipation protrusions (105) on the outer side of the inner frame and the external toothed heat dissipation fins (108) before flowing out to the large-volume axial fan (9). The second entrance is the porous structure on the duct cover (13). Due to the irregular shape between the outer frame (103) and inner frame (104) of the heat exchange plate array frame (1), the circular external toothed heat dissipation fins (108) are irregularly densely distributed under the duct cover (13). The porous structure on the duct cover (13) and the circular external toothed heat dissipation fins (108) are arranged in an alternating manner, which facilitates the ambient wind entering the heat dissipation area to directly convect and exchange heat with the external toothed heat dissipation fins (108). The arrangement is irregular, and the four heat dissipation areas are symmetrically arranged.

2. The air-cooled array structure with a heat spreader frame according to claim 1, characterized in that, The back cover plate (14) is installed on the inner frame (104) and the inner cross reinforcing rib plate (107) of the heat exchange plate array frame (1). Before installation, the sealing rope (15) is fixed in the inner frame sealing groove (106). Then, the back cover plate (14) is fastened to the heat dissipation boss (105) on the outer side of the inner frame using the non-detachable screw (17) on the back cover plate (14), so that the back cover plate (14) and the inner frame (104) are sealed and connected, thereby improving the internal protection performance of the array.

3. The air-cooled array structure using a heat spreader frame according to claim 2, characterized in that, The rear cover plate (14) is provided with regularly stamped strip grooves at the front and rear, namely the outer groove (14a) and the inner groove (14b) of the rear cover plate, which are used to increase the heat exchange area of ​​the rear cover plate to the inside and outside and reduce the weight of the rear cover plate; the non-detachable screws are used on the rear cover plate (14) as the force points for moving the rear cover plate.

4. The air-cooled array structure using a heat spreader frame according to claim 3, characterized in that, The frame substrate (101) of the heat exchange plate array frame (1) is an aluminum-based heat exchange plate, which is used to quickly conduct the heat dissipation of the receiving and transmitting components (3) attached to its surface to the four heat dissipation areas, thereby reducing the temperature rise caused by heat conduction; the frame substrate (101) and the outer frame (103) are integrated with the inner frame (104); the outer heat dissipation boss (105), the outer toothed heat dissipation fins (108) and the inner toothed heat dissipation fins (109) of the inner frame are directly processed on the frame substrate (101) to improve the heat conduction efficiency and avoid the thermal resistance that exists when different components are installed and in contact.

5. The air-cooled array structure with a heat spreader frame according to claim 4, characterized in that, The radome (2) is sealed to the frame base plate (101) of the heat spreader array frame (1) at the front, and the radome (2) is designed to be heat-insulated.

6. The air-cooled array structure using a heat spreader frame according to claim 5, characterized in that, The interface (110) between the array surface and the transmission mechanism of the heat exchange plate array frame (1) is connected to the transmission mechanism through the trunnions (18) on both sides, so as to achieve dynamic sealing between the interface and the transmission mechanism. This allows the cables in different quadrants inside the array surface to pass through the cable routing holes (113) and trunnions (18) along the internal cross reinforcing ribs (107) and connect to the inside of the transmission mechanism.

7. The air-cooled array structure using a heat spreader frame according to claim 6, characterized in that, Based on the distance from the outer frame (103), it is divided into two levels: the center level and the middle level. The central layer consists of four semiconductor coolers (11) arranged at the center of the rear of the array. The cold end (11a) of the semiconductor cooler (11) is attached to the frame substrate (101) at this location to cool the central area of ​​the array. The hot end (11b) of the semiconductor cooler (11) is conducted to the inner frame (104) through the loop heat pipe (12) and then dissipates heat through the heat dissipation area, thus cooling the center and simultaneously heating the periphery. The middle layer is located around the rear center layer of the array, near the internal turbulence fan (10), where several internal toothed heat dissipation fins (109) are arranged to enhance local heat exchange through the internal turbulence fan (10).

8. The air-cooled array structure using a heat spreader frame according to claim 7, characterized in that, The temperature monitoring unit (4) is integrated in the receiving and transmitting component (3) to monitor the temperature of all receiving and transmitting components (3) and to strengthen the control of the heat dissipation system of the entire array according to the monitoring results, so as to ensure that the heat dissipation and temperature uniformity requirements of the array are achieved with the lowest energy consumption.

9. The air-cooled array structure using a heat spreader frame according to claim 8, characterized in that, The cooling system of the entire array is subject to progressively enhanced control based on monitoring results, including four levels of control, specifically: The first stage has a heat loss of about half of the theoretical maximum heat loss, requiring two large-volume axial flow fans (9) installed at the four corners of the array to work alternately; The second stage has a heat loss of about three-quarters of the theoretical maximum heat loss, requiring the two large-volume axial flow fans (9) installed at the four corners of the array to be fully operational. At the third stage, the heat loss of the array surface is about seven-eighths of the theoretical maximum heat loss, and the large-volume axial flow fan (9) and the internal turbulence fan (10) are all working. At the fourth stage, the heat loss of the array surface is approximately the theoretical maximum heat loss, and the large-volume axial flow fan (9), the internal turbulence fan (10), and the semiconductor cooler (11) are all in operation.

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