LED chip packaging automatic film pressing equipment integrating hot pressing and accurate alignment

Abstract

The invention discloses an LED chip packaging automatic film pressing device integrating hot pressing and accurate alignment, and relates to the technical field of LED chip packaging, the device specifically comprises a film pressing frame and a transmission table, the transmission table is installed on one side of the film pressing frame, a driving rotary disc is movably connected to one side of the film pressing frame, and a rotary arm is movably connected to the side of the driving rotary disc through a bearing sleeve; when the lower die frame upwards pushes the base plate to make contact with the adhesive film, the side tightening blocks on the two sides of the upper die frame make contact with the edge of the base plate firstly, the pressing table continuously presses downwards to make the side tightening blocks buckled inwards, the film face is transversely stretched to eliminate middle wrinkles, it is ensured that the adhesive film is evenly attached, and film layer wrinkles are eliminated through the two-way synchronous pressing mechanism; clutch type transmission driving is combined to realize seamless connection of press fit and feeding, hot pressing, alignment, feeding, film stretching and correction are integrated into a single automatic process, three major pain points of substrate dislocation, film surface wrinkling and loose process connection in traditional LED packaging are solved, and high precision and high efficiency are achieved.

Description

Technical Field

[0001] This invention relates to the field of LED chip packaging technology, specifically to an automated lamination equipment for LED chip packaging that integrates hot pressing and precise alignment. Background Technology

[0002] LED chip packaging is a core link in the semiconductor lighting industry chain, directly affecting the optoelectronic performance, reliability and production cost of the device. With the rapid development of technologies such as Mini / Micro LED and high-power lighting, the global LED market continues to expand.

[0003] The packaging equipment market has a compound annual growth rate of over 12%, and the market is placing higher demands on packaging technology: on the one hand, it needs to meet micron-level alignment accuracy, and on the other hand, it needs to improve mass production efficiency to reduce costs. The current mainstream packaging processes include die bonding, wire bonding, and encapsulation, while thermocompression packaging has become a key link in COB packaging due to its advantages of no need for solder and high connection strength, and is especially suitable for high-density integration scenarios.

[0004] However, traditional hot-press encapsulation processes have significant drawbacks in the film bonding stage, mainly in three aspects: film material processing, substrate alignment, and efficiency bottlenecks. They mostly adopt a unidirectional pressing mode, and the positioning of the substrate on the conveyor belt relies on mechanical stops, which can lead to slight deviations. For example, the alignment device involved in patent CN114188250B improves the accuracy to ±15μm, but requires an additional CCD vision system, increasing costs. Another example is patent CN119300578A, where film pressing and substrate transfer are mostly independent modules. The pressure supply module can suppress lens floating, but the substrate needs to undergo three positioning transfers, increasing the time consumed per cycle and reducing the overall pressing efficiency. Therefore, a solution is proposed. Summary of the Invention

[0005] The purpose of this invention is to provide an automated lamination equipment for LED chip packaging that integrates hot pressing and precise alignment, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an automated film pressing equipment for LED chip packaging that integrates hot pressing and precise alignment, including a film pressing frame and a transfer table. The transfer table is installed on one side of the film pressing frame, and a drive rotary table is movably connected to one side of the film pressing frame. A rotary arm is movably connected to the drive rotary table side through a bearing sleeve. The membrane pressing frame sidewall is slidably connected from top to bottom with a transfer mechanism and a linkage pressing mechanism. The linkage pressing mechanism includes a slide plate two that slides on the track of the membrane pressing table sidewall. The sidewall of the slide plate two is fixed with a pressing table by bolts. The pressing table is slidably connected to an upper mold frame. Side tension blocks are symmetrically and rotatably connected to both sides of the upper mold frame and located on the sidewall of the pressing table. Springs are installed between the side tension blocks and the sidewall of the upper mold frame. A power shaft is symmetrically and movably connected to the transmission platform. A transmission belt is sleeved on the outer wall of the guide wheel installed on the power shaft. A lifting platform is fixed on the side of the transmission platform and at the bottom of the membrane pressing frame. A lower mold frame is slidably connected in the groove on the side wall of the lifting platform.

[0007] Furthermore, a feeding wheel is movably connected to the side wall of the membrane pressing frame, and a waste collection wheel is installed on one side of the top of the conveyor table. The membrane roll on the feeding wheel is wound around the waste collection wheel through the guide wheels set on the membrane pressing frame and the conveyor table, and the height of the membrane surface on the conveyor table is greater than the height of the top of the conveyor belt.

[0008] Furthermore, the transfer mechanism provided on the membrane press frame includes a sliding plate that slides on its surface. A block is fixed to the back of the sliding plate by bolts, and notches are provided on both sides of the block. Sliding sleeves are symmetrically installed on the back of the sliding plate.

[0009] Furthermore, an elastic pawl is rotatably connected to the inner wall of the sliding sleeve. The spring side of the inner wall of the sliding sleeve abuts against the side wall of the elastic pawl, pushing the elastic pawl out of the notch on the side wall of the sliding sleeve. A ratchet is sleeved and installed on one side of the power shaft, and the elastic pawl abuts against the ratchet.

[0010] Furthermore, the linkage pressing mechanism also includes a rotating arm 1 and a rotating arm 2 installed on the back side of the second slide plate. The rotating arm 1 and the rotating arm 2 are rotatably connected on the back side of the second slide plate and are connected by a connecting rod. A drive cam is movably connected on the back side of the second slide plate and at the top of the rotating arm 2. A sliding sleeve 2 is slidably connected on the back side of the second slide plate and on the sliding sleeve 1.

[0011] Furthermore, the bottom of the pressing platform is provided with an actuating gear shaft, and the inner wall of the lifting platform is movably connected with a transmission gear. One end of the actuating gear shaft passes through the lifting platform and meshes with the transmission gear. The inner wall of the lifting platform and located on the other side of the transmission gear is provided with a lower mold frame, and the bottom of the lower mold frame is placed with a plate meshing with the transmission gear.

[0012] Furthermore, the width of the lower mold frame is smaller than the spacing of the transmission belt sleeved on the power shaft, and the spring on the membrane pressing frame abuts against the bottom of the sliding sleeve.

[0013] The integrated hot pressing and precise alignment method for automated LED chip packaging is as follows: With the combined drive, when the first slide moves, the motor on the second slide drives the drive cam to rotate, squeezing the second single-sided rotating arm while simultaneously rotating the first rotating arm. The ends of both slides simultaneously enter the groove on one side wall of the sliding sleeve, achieving synchronous drive of the first and second slides. The bidirectional displacement mechanism involves the bottom of the pressure table contacting the gear shaft and transmission gear while simultaneously pushing the entire lower mold frame upwards. At the same time, the upper mold frame at the bottom of the pressure table moves synchronously, and the lower mold frame contacts the substrate placed on the conveyor belt. The substrate is lifted and first contacts the bottom of the adhesive film. While pushing and squeezing the film surface, the upper side tension block of the upper mold frame contacts the edge of the substrate. When subjected to continuous downward pressure from the pressure table, it pushes the side tension block to move inwards, stretching the film surface tension marks to both sides while correcting the substrate position. Subsequently, the upper mold frame contacts the top film surface of the substrate, achieving film surface cutting while hot pressing. The subsequent reset process sends the film-pressed substrate back onto the conveyor belt. Automatic feeding occurs as slide plate two resets. Simultaneously, rotating arm one disengages from rotating arm two, driving the rotating disc to rotate and causing slide plate one to move independently. This causes the elastic pawl on slide sleeve one to contact the driving ratchet, which in turn drives the power shaft to rotate intermittently. This moves the newly placed substrate on the conveyor belt to the pressing and positioning point between the lower mold frame and the upper mold frame. The substrate on the conveyor belt is then intercepted by the set interception block.

[0014] Compared with the prior art, the beneficial effects of the present invention are: In this invention, a dual-mechanism linkage is used to achieve a seamless connection between precise pressing and efficient feeding. Slide 1 and Slide 2 are pressed down synchronously through the engagement of Rotary Arm 1 and Rotary Arm 2 with the assembly block, ensuring bidirectional displacement of the pressing table and the lower mold frame to press the substrate. At this time, the conveyor belt is locked due to the abutment of the elastic pawl by the sliding sleeve 2, completely eliminating the risk of substrate displacement during the pressing process and improving the packaging alignment accuracy. When Slide 2 is reset, the rotating arm disengages from the assembly block, and Slide 1 moves independently to drive the elastic pawl to push the ratchet, driving the conveyor belt to feed the substrate precisely and intermittently. The substrate movement distance is controlled by the stroke of Slide 1. With the positioning of the intercepting block, automatic feeding of the pressing station is realized, avoiding multiple substrate blockages and ensuring tight connection, thereby improving the equipment cycle efficiency. In this invention, dynamic film stretching and substrate alignment are performed to solve the problem of film wrinkles. When the lower mold frame pushes the substrate to contact the adhesive film, the side stretching blocks on both sides of the upper mold frame first contact the edge of the substrate. The pressure table continuously presses down to make the side stretching blocks buckle inward, and the film surface is stretched laterally to eliminate wrinkles in the middle, ensuring uniform adhesion of the adhesive film. During the buckling process of the side stretching blocks, the edge of the substrate is squeezed simultaneously to correct the slight positional deviation of the substrate on the conveyor belt in real time. Combined with the hot pressing of the upper mold frame to cut the adhesive film, this design integrates positioning alignment, film stretching, and pressing into one step, which significantly reduces packaging bubbles and wrinkles, and improves yield. This equipment integrates hot pressing, alignment, feeding, film stretching, and alignment into a single automated process through mechanical innovation, solving the three major pain points in traditional LED packaging: substrate misalignment, film wrinkles, and loose process connections, and has both high precision and high efficiency. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the automated LED chip packaging lamination equipment integrating hot pressing and precise alignment according to the present invention. Figure 2 This is a schematic diagram of the conveyor belt installation at the bottom of the membrane press frame of the present invention; Figure 3 This is a schematic diagram of the main structure of the automated LED chip packaging lamination equipment integrating hot pressing and precise alignment according to the present invention. Figure 4 This is a schematic diagram of the contact structure between the upper block of the first sliding plate and the upper rotating arm of the second sliding plate according to the present invention; Figure 5 This is a schematic diagram of the mold frame mounting structure on the pressure table surface of the present invention; Figure 6 This is a schematic diagram of the contact structure between the inner elastic pawl of the sliding sleeve and the driving ratchet of the present invention; Figure 7 This is a schematic diagram of the present invention, showing how the trigger gear shaft drives the lower mold frame to push the LED.

[0016] In the diagram: 1. Membrane pressing frame; 2. Transfer table; 3. Drive rotary table; 4. Rotary arm; 5. Transfer mechanism; 501. Slide plate one; 502. Assembly block; 503. Sliding sleeve one; 6. Linkage pressing mechanism; 601. Slide plate two; 602. Rotary arm one; 603. Rotary arm two; 604. Drive cam; 605. Sliding sleeve two; 7. Pressing table; 8. Upper mold frame; 9. Side tension block; 10. Actuating gear shaft; 11. Power shaft; 12. Drive ratchet; 13. Elastic pawl; 14. Lifting table; 15. Lower mold frame; 16. Transmission gear; 17. Feeding wheel; 18. Waste collection wheel; 19. Conveyor belt. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] See also Figure 1-7 The present invention provides a technical solution: Example 1: COB packaging, short for Chip on Board, is a technology to solve the heat dissipation problem of LEDs. It involves attaching bare chips to an interconnect substrate with conductive or non-conductive adhesive, and then performing wire bonding to achieve electrical connection. Exposed to the air, it is susceptible to contamination or human damage. Solid film technology is used to seal the substrate. like Figure 1 As shown, a transfer station 2 is set at the front end of the membrane press 1. The substrate is transported by the transfer belt 19 set in the transfer station 2. The two sides of the transfer belt 19 are dimensionally constrained according to the length of the substrate. The two sides are constrained during the substrate positioning process. The left and right sides of the substrate are then constrained to achieve complete substrate positioning. Unlike traditional substrate loading, a transfer mechanism 5 and a linkage pressing mechanism 6 are set on the side wall of the membrane pressing frame 1. The main body consists of slide plate 1 501 and slide plate 2 601. Slide plate 1 501 is driven by the top rotating arm 4. A drive disc 3 is movably connected to the side wall of the membrane pressing frame 1. Through motor and belt transmission, the rotating arm 4 is sleeved with the drive disc 3. The rotation of the drive disc 3 drives the slide plate 1 501 connected to the rotating arm 4 to move up and down. Skateboard 2 601 is located at the bottom of skateboard 1 501 and is also slidably connected to it. The two are connected by the back structure of skateboard 2 601. The back structure of skateboard 1 501 and skateboard 2 601 is as follows: Figure 4 As shown, a block 502 is provided on the slide plate 1 501, and notches are provided on both sides of the block 502. The back side of the slide plate 2 601 is rotatably connected to the rotating arm 1 602 and the rotating arm 2 603. The rod provided in the middle of the rotating arm 2 603 is connected to the end of the rotating arm. As the second rotating arm 603 rotates inward, the first rotating arm 602 is rotated synchronously through the rod body, so that the first rotating arm 602 and the second rotating arm 603 move inward at the same time and abut against the notch on the block 502, so that the first sliding plate 501 moves and drives the second sliding plate 601 to move downward at the same time. Since the pressure table 7 is installed on the second sliding plate 601, the mold frame 8 on the surface of the pressure table 7 contacts the substrate. If the first rotating arm 602 and the second rotating arm 603 are not engaged with the assembly block 502, only the first sliding plate 501 moves up and down. The movement of the first sliding plate 501 drives the conveyor belt 19 to move the substrate to the pressing area. Compared with using unrelated substrate conveying components, this can easily cause multiple substrates to clog and poor pressing connection, resulting in a decrease in substrate molding accuracy. In actual operation, a sliding sleeve 503 is also installed on the back side of the skateboard 501, such as... Figure 6 As shown, the left side is where the sliding sleeve 503 moves independently. The back of the sliding plate 601 is provided with the sliding sleeve 605. The sliding sleeve 503 is located inside the sliding sleeve 605. When the sliding plate 501 moves down independently, the sliding sleeve 503 moves synchronously. During the downward movement, the elastic pawl 13 installed in the sliding sleeve 503 is not abutted by the sliding sleeve 605 and is pushed out of the notch by the spring. In the subsequent downward movement, it contacts the drive ratchet 12 installed on the power shaft 11 on the side of the transmission table 2. like Figure 2 As shown, the power shaft 11 rotates while the conveyor belt 19 rotates, gradually moving the substrate placed on the conveyor belt 19 to the pressing area. The slide plate 501 drives the conveyor belt 19 to rotate a fixed distance. A baffle is set for the pressing area, and after the conveyor belt 19 moves the substrate to contact the baffle, the substrate is restricted from moving continuously. When slide plate 1 501 drives slide plate 2 601 to move downward, the elastic pawl 13 is blocked by slide sleeve 2 605 and retracts into slide sleeve 1 503 during the upward movement of slide plate 1 501. When it descends again, slide sleeve 1 503 and slide sleeve 2 605 move simultaneously. At this time, there is no elastic pawl 13 to block, so the rotation of the ratchet 12 cannot be achieved. That is, when slide plate 2 601 moves, the entire conveyor belt 19 remains stationary, which avoids the substrate from moving and misaligning during the lifting and pressing process and improves the pressing accuracy.

[0019] Example 2: For membrane pressing operation, a feeding roller 17 is provided on the membrane pressing frame 1 on the side of the transfer table 2. The feeding roller 17 is used to set the adhesive film. The adhesive film is coated with anti-warping resin and phenyl silicone oil, etc. After curing, the adhesive film is peeled off and wound on the waste collection roller 18 through the guide roller. Since the adhesive film area is larger than the substrate area, the cut waste is rotated and wound on the waste collection roller 18. The overall molding process adopts a synchronous pressing method, that is, the upper mold frame 8 and the lower mold frame 15 move and press together synchronously. In order to drive the lower mold frame 15, an upper lifting platform 14 is set on the side of the transfer table 2, such as... Figure 5 As shown, an actuating gear shaft 10 is fixed to the back side of the pressure table 7 and extends into the lifting table 14, as shown in the figure. Figure 7 As shown, the actuating gear 10 contacts the transmission gear 16 that is movably arranged inside the lifting platform 14. When it moves down, it drives the transmission gear 16 to rotate counterclockwise, thereby pushing the placement plate that is meshed and abutting on the other side upward. The placement plate is provided with a lower mold frame 15, and the lower mold frame 15 is pushed upward simultaneously. The upper mold frame 8 and the lower mold frame 15 move towards each other on both sides. The width of the lower mold frame 15 is smaller than the gap of the conveyor belt 19. During the upward movement, the lower mold frame 15 pushes the positioning substrate of the conveyor belt 19 to move upward and begin to contact the bottom of the adhesive film. Since the substrate is pushed by the lower mold frame 15 to contact the bottom of the adhesive film first and pushes the entire adhesive film upward, the upper mold frame 8 then completes the pressing work. During the process of stretching the adhesive film, stripes are easily formed in the middle area, which involves the buckling instability of the adhesive film. This is usually caused by tension imbalance, depending on the length-to-width ratio of the substrate. For example, when the width of the substrate is greater than its length, when the adhesive film on the surface is squeezed and stretched, a wavy adhesive film stack will be formed in the middle of the substrate along the vertical length side. If the pressing is performed directly, wrinkles will be formed on the surface of the substrate. To solve such problems, such as Figure 5 and Figure 7 As shown, upper side tension blocks 9 are installed on both sides of the entire upper mold frame 8, and they contact the adhesive film first during the downward movement. At this time, the side tension blocks 9 contact the adhesive film side substrate and realize the position correction of the substrate with respect to the conveyor belt 19. The continuously moving pressure table 7 squeezes the side tension blocks 9, causing the side tension blocks 9 to rotate inward and press down. While correcting the position of the substrate, the adhesive film is tightened with respect to the lateral angle side, and the wrinkles of the adhesive film in the middle of the substrate are removed. As the side tension block 9 is pressed inward, the upper mold frame 8 begins to contact the adhesive film pushed up by the lower mold frame 15, and hot-presses it together. At the same time, the adhesive film is cut off. During the reset process of the pressure table 7, the substrate after the film pressing is completed is put back onto the conveyor belt 19. At this time, a new substrate is waiting to move to the pressing area. The subsequent working process involves the motor on slide plate 2 601 driving the drive cam 604 to rotate, causing the first rotating arm 602 and the second rotating arm 603 to disengage from the mating block 502. The drive disc 3 drives slide plate 1 501 to move independently, realizing the rotation of the conveyor belt 19 and moving the new substrate to the pressing area. Finally, by driving slide plate 2 601 to move synchronously, the film pressing operation is completed. The independent drive unit realizes the close connection between fixed-point feeding and film pressing, improving the efficiency of automated film pressing for LED chip packaging.

[0020] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to specific implementations. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. An automated lamination equipment for LED chip packaging integrating hot pressing and precise alignment, comprising a lamination frame (1) and a transfer table (2), wherein the transfer table (2) is mounted on one side of the lamination frame (1), and a drive rotary table (3) is movably connected to one side of the lamination frame (1), and a rotary arm (4) is movably connected to the drive rotary table (3) via a bearing sleeve, characterized in that: The membrane pressing frame (1) has a moving mechanism (5) and a linkage pressing mechanism (6) slidably connected from top to bottom on its side wall. The linkage pressing mechanism (6) includes a sliding plate (601) that slides on the track of the side wall of the membrane pressing table (7). The side wall of the sliding plate (601) is fixed with a pressing table (7) by bolts. The pressing table (7) is slidably connected to an upper mold frame (8). Side tension blocks (9) are symmetrically rotatably connected on both sides of the upper mold frame (8) and on the side wall of the pressing table (7). A spring is installed between the side tension blocks (9) and the side wall of the upper mold frame (8). A power shaft (11) is symmetrically and movably connected to the transmission platform (2). A transmission belt (19) is sleeved on the outer wall of the guide wheel installed on the power shaft (11). A lifting platform (14) is fixed on the side of the transmission platform (2) and at the bottom of the membrane press frame (1). A lower mold frame (15) is slidably connected in the groove on the side wall of the lifting platform (14).

2. The automated lamination equipment for LED chip packaging integrating hot pressing and precise alignment according to claim 1, characterized in that, The membrane pressing frame (1) is movably connected to the side wall of the feeding wheel (17), and the waste collection wheel (18) is installed on one side of the top of the conveyor (2). The membrane roll on the feeding wheel (17) is wound around the waste collection wheel (18) through the guide wheels set by the membrane pressing frame (1) and the conveyor (2), and the height of the membrane surface on the conveyor (2) is greater than the height of the top of the conveyor belt (19).

3. The automated LED chip packaging lamination equipment integrating hot pressing and precise alignment according to claim 2, characterized in that, The transfer mechanism (5) provided on the membrane press frame (1) includes a sliding plate (501) that slides on its surface. A block (502) is fixed to the back of the sliding plate (501) by bolts, and notches are provided on both sides of the block (502). A sliding sleeve (503) is symmetrically installed on the back of the sliding plate (501).

4. The automated LED chip packaging lamination equipment integrating hot pressing and precise alignment according to claim 3, characterized in that, The inner wall of the first sliding sleeve (503) is rotatably connected to an elastic pawl (13). One side of the spring on the inner wall of the first sliding sleeve (503) abuts against the side wall of the elastic pawl (13), pushing the elastic pawl (13) out of the notch on the side wall of the first sliding sleeve (503). A ratchet is mounted on one side of the power shaft (11), and one side of the elastic pawl (13) abuts against the ratchet.

5. The automated LED chip packaging lamination equipment integrating hot pressing and precise alignment according to claim 4, characterized in that, The linkage pressing mechanism (6) further includes a rotating arm (602) and a rotating arm (603) installed on the back side of the sliding plate (601). The rotating arm (602) and the rotating arm (603) are rotatably connected on the back side of the sliding plate (601) and connected by a connecting rod. A drive cam (604) is movably connected on the back side of the sliding plate (601) and at the top of the rotating arm (603). A sliding sleeve (605) is slidably connected on the back side of the sliding plate (601) and on the sliding sleeve (503).

6. The automated lamination equipment for LED chip packaging integrating hot pressing and precise alignment according to claim 1, characterized in that, The bottom of the pressing platform (7) is provided with an actuating gear shaft (10), and the inner wall of the lifting platform (14) is movably connected with a transmission gear (16). One end of the actuating gear shaft (10) passes through the lifting platform (14) and meshes with the transmission gear (16). The inner wall of the lifting platform (14) and the other side of the transmission gear (16) is provided with a lower mold frame (15), and the bottom plate of the lower mold frame (15) meshes with the transmission gear (16).

7. The automated LED chip packaging lamination equipment integrating hot pressing and precise alignment according to claim 6, characterized in that, The width of the lower mold frame (15) is smaller than the spacing of the transmission belt (19) sleeved on the power shaft (11), and the spring on the membrane press frame (1) abuts against the bottom of the sliding sleeve (503).

8. The automated LED chip packaging lamination equipment integrating hot pressing and precise alignment according to claim 7, characterized in that, The integrated hot pressing and precise alignment LED chip packaging automated pressing method is as follows: joint drive, when slide plate one (501) moves, the motor on slide plate two (601) drives the drive cam (604) to rotate, while squeezing the single-sided rotating arm two (603) to realize the synchronous rotation of rotating arm one (602), and the ends of both enter the side wall groove of slide sleeve one (503) at the same time, realizing the synchronous drive of slide plate one (501) and slide plate two (601); Bidirectional displacement, the bottom of the pressure table (7) touches the gear shaft (10) and contacts the transmission gear (16) while pushing the entire lower mold frame (15) upward. At the same time, the upper mold frame (8) at the bottom of the pressure table (7) moves synchronously. The lower mold frame (15) contacts the substrate placed on the conveyor belt (19). The substrate is lifted and contacts the bottom of the adhesive film first. While pushing and squeezing the film surface, the upper side tension block (9) of the upper mold frame (8) contacts the edge of the substrate. When it is continuously pressed down by the pressure table (7), it pushes the side tension block (9) to buckle inward. While stretching the film surface tension marks to both sides, it corrects the position of the substrate. Then the upper mold frame (8) contacts the top film surface of the substrate. While hot pressing, the film surface is cut. Then the reset process sends the film-pressed substrate back to the conveyor belt (19). Automatic feeding, while the slide plate 2 (601) is reset, the rotating arm 1 (602) and the rotating arm 2 (603) disengage from the block (502), the drive disc (3) rotates and drives the slide plate 1 (501) to move independently, causing the elastic pawl (13) on the sliding sleeve 1 (503) to contact the drive ratchet (12), which drives the power shaft (11) to rotate intermittently, moving the newly placed substrate on the conveyor belt (19) to the pressing and positioning point of the lower mold frame (15) and the upper mold frame (8), and intercepting the substrate on the conveyor belt (19) through the set interception block.

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