Circuit board module deformation test system and method for SMT automatic patch forming

Abstract

The invention discloses a circuit board module deformation testing system and method for SMT automatic patch forming, and belongs to the technical field of circuit board deformation testing, and the system comprises a warping judgment execution demand analysis module, a first execution strategy determination module, a second execution strategy determination module and a support sinking adjustment module. The circuit board warping and supporting structure deformation risk can be accurately quantified, the Z-axis compensation value, the mounting speed, the pressure and other parameters are dynamically adjusted, mounting deviation caused by circuit board deformation is compensated in real time, the element mounting precision is controlled within the preset range, meanwhile, through hot spot area tracking and supporting sinking graded adjustment, the element mounting precision is improved, and the element mounting precision is improved. The stress concentration risk is reduced, the problems of poor welding, element breakage and the like caused by aggravation of deformation are avoided, the stability of the SMT mounting process is improved, the deformation-related reject ratio is reduced, and the consistency and reliability of the mounting quality of the circuit board are improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board deformation testing technology, and in particular to a circuit board module deformation testing system and method for SMT automatic placement and forming. Background Technology

[0002] Surface Mount Technology (SMT) has become the mainstream method for circuit board assembly in modern electronics manufacturing. In the SMT automated placement process, electronic components are precisely placed onto the surface of a printed circuit board (PCB) by a high-speed pick-and-place machine, significantly improving production efficiency.

[0003] To address the deformation control issue during SMT placement, the following solutions are commonly used:

[0004] (1) Passive adjustment methods: such as optimizing support fixtures, reinforcing circuit boards, and low-temperature welding to alleviate deformation, but these methods are mostly based on experience and lack real-time judgment and adjustment capabilities.

[0005] (2) Manual post-inspection methods: such as using 3D AOI and X-ray to inspect the appearance and solder joint quality of the mounted product. Although problems can be found, they cannot be controlled at the source of the problem, resulting in a delay.

[0006] (3) Local press adjustment mechanism: Some high-end placement equipment supports adaptive adjustment of placement height, but it is still controlled by a fixed threshold and lacks personalized adjustment for specific module structure and risk evolution trend.

[0007] For example, the circuit board testing device and testing method announced in the invention patent announcement CN118465492B includes a testing body; support rods are fixedly welded to the four corners of the top surface of the testing body; a movable test plate is fixedly connected to the bottom surface of the push rod of the electric drive movable tube; a test connecting plate is installed on the bottom surface of the movable test plate; a movable tube is sleeved on the outside of the support rod; a limiting tube is sleeved on the outside of the movable tube; a first sliding groove and a second sliding groove are opened on the limiting tube; a first clamping component is slidably engaged inside the first sliding groove; a second clamping component is slidably engaged inside the second sliding groove. When the first push plate pushes the movable clamping block to move left and right, and the second push plate pushes the movable clamping block to move back and forth, the circuit board to be tested can be clamped, and the clamping is automatically achieved during the downward movement of the electric drive movable tube.

[0008] However, in the process of implementing the inventive technical solution in the embodiments of this application, it was found that the above-mentioned technology has at least the following technical problems:

[0009] Current circuit board testing methods mostly focus on electrical performance testing or static structural testing, but neglect the dynamic deformation of circuit board modules during SMT automated placement. Furthermore, in actual placement, due to the complex coupling effects of factors such as circuit board structure, pad arrangement, placement pressure, support structure, and temperature stress, circuit board modules often undergo Z-axis deformation, especially when mounting large or densely packed components at the module edges. These deformations can cause component placement misalignment, particularly for micro-components or packaged components, potentially leading to solder bridging or open circuits, component breakage, or pad peeling, thus affecting soldering quality and reliability. Summary of the Invention

[0010] The first aspect of this invention provides a deformation testing system for SMT automated surface mount technology (SMT) circuit board modules, comprising:

[0011] The warpage determination execution requirement analysis module is used to analyze the warpage sensitivity index of the circuit board module and combine it with the historical data of the circuit board module to analyze the warpage determination execution requirement label of the circuit board module in the SMT placement process.

[0012] The first execution strategy determination module is used to determine the first execution strategy of the SMT placement process based on the warpage sensitivity index of the circuit board module when the warpage determination execution requirement label of the circuit board module is "demand execution warpage determination".

[0013] The second execution strategy determination module is used to perform a first warpage adjustment based on the warpage sensitivity index of the circuit board module when the first execution strategy is to perform warpage adaptive adjustment, and to determine the second execution strategy of the SMT placement process based on the first warpage adjustment effect information.

[0014] The support depression adjustment module is used to analyze the support depression evaluation characterization factor of the circuit board module when the first execution strategy or the second execution strategy is to determine support depression, analyze the abnormal aggravation of local hot spot areas in combination with the warp sensitivity index of the circuit board module, and adjust the support depression of the SMT placement process in combination with the determination result of the abnormal aggravation of local hot spot areas when the determination result of the abnormal aggravation of local hot spot areas is determined.

[0015] A second aspect of the present invention provides a method for testing the deformation of a circuit board module in an automated surface mount technology (SMT) assembly process, comprising the following steps:

[0016] S1, analyze the warpage sensitivity index of the circuit board module, and combine the historical data of the circuit board module to analyze the warpage judgment execution requirement label of the circuit board module of SMT assembly process.

[0017] S2, when the requirement label for the warpage determination of the circuit board module is "requirement to perform warpage determination", the first execution strategy of the SMT placement process is determined based on the warpage sensitivity index of the circuit board module.

[0018] S3, when the first execution strategy is to perform warp adaptive adjustment, the first warp adjustment is performed based on the warp sensitivity index of the circuit board module, and the second execution strategy of the SMT placement process is determined based on the first warp adjustment effect information.

[0019] S4, when the first execution strategy or the second execution strategy is to determine support sinking, analyze the support sinking evaluation characterization factor of the circuit board module, combine the warpage sensitivity index of the circuit board module to analyze the demand information for the abnormal aggravation of local hot spots, and when the demand information for the abnormal aggravation of local hot spots is determined, adjust the support sinking of the SMT placement process in combination with the determination result of the abnormal aggravation of local hot spots.

[0020] One or more technical solutions provided in this invention have at least the following technical effects or advantages:

[0021] 1. The present invention provides a SMT automatic placement forming circuit board module deformation testing system and method, which can accurately quantify the deformation risk of circuit board warpage and support structure. By dynamically adjusting parameters such as Z-axis compensation value, placement speed and pressure, it can compensate for placement deviation caused by circuit board deformation in real time, control the component placement accuracy within a preset range, and reduce the risk of stress concentration through hot spot area tracking and support sinking graded adjustment. This avoids problems such as poor soldering and component breakage caused by aggravated deformation, improves the stability of SMT placement process, reduces deformation-related defect rate, and improves the consistency and reliability of circuit board placement quality.

[0022] 2. This invention, by determining the first execution strategy of the SMT placement process, enables risk-level management based on the warpage sensitivity index of the circuit board module. When the warpage risk exceeds a threshold, it precisely triggers warpage adaptive adjustment to avoid excessive relative height deviation between the placement head and the circuit board due to significant warpage, ensuring that the component placement position accuracy remains within a preset range. When the warpage risk is low, it switches to support sagging judgment, focusing on support structure stability analysis to avoid local deformation problems caused by insufficient support. Thus, it achieves dynamic identification and targeted control of deformation risk during the SMT placement process, improving the reliability of the placement process, reducing problems such as component placement misalignment and poor soldering caused by deformation, and improving the overall yield and quality consistency of circuit board placement.

[0023] 3. This invention performs a first warp adjustment based on the warp sensitivity index of the circuit board module, and determines a second execution strategy for the SMT placement process based on the first warp adjustment effect information. This enables dynamic compensation and strategy optimization for circuit board warp deformation, avoiding component placement misalignment caused by warp. The second execution strategy is dynamically switched based on the adjusted warp sensitivity characterization coefficient, which can accurately identify the adjustment effect and match subsequent measures. This avoids the waste of resources from ineffective adjustments and continuously reduces warp risk through a graded strategy, ultimately improving the stability of the SMT placement process, significantly reducing the deformation-related placement defect rate, and ensuring the reliability of circuit board placement quality.

[0024] 4. This invention, by combining the judgment results of abnormal aggravation in local hot spots with the adjustment of support depression in SMT placement process, can achieve dynamic and precise control of the risk of circuit board support structure. When the local hot spot area is abnormally aggravated, the reduction force of the placement head's pressing speed and pressure is strengthened based on an adjustment ratio greater than 1, which can effectively suppress the local deformation expansion caused by support depression. When the hot spot area is stable, the parameter reduction range is optimized by adjusting the ratio between 0 and 1, controlling the risk while ensuring placement efficiency and avoiding production losses caused by over-adjustment. Through real-time matching of hot spot area status and adjustment force, the placement defect rate related to support depression is reduced, and the stability and reliability of circuit board placement process are improved. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of a deformation testing system for an SMT (Surface Mount Technology) circuit board module, provided in an embodiment of this application.

[0026] Figure 2 A flowchart illustrating a deformation testing method for an SMT (Surface Mount Technology) automated placement circuit board module, as provided in this application embodiment.

[0027] Figure 3 This is a flowchart illustrating the warp adjustment strategy branch involved in the embodiments of this application.

[0028] Figure 4 This is a flowchart illustrating the support sinkhole response branch in an embodiment of this application. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0030] Reference Figure 1As shown, the first aspect of the present invention provides a deformation testing system for SMT automated surface mount technology (SMT) circuit board modules, comprising:

[0031] The warpage determination execution requirement analysis module is used to analyze the warpage sensitivity index of the circuit board module and combine it with the historical data of the circuit board module to analyze the warpage determination execution requirement label of the circuit board module in the SMT placement process.

[0032] Extract the reference warp characterization parameters and reference support characterization parameters stored in the database.

[0033] The reference warpage characterization parameters include the reference Z-axis displacement difference, the reference maximum strain gradient, and the reference mounting pressure distribution dispersion.

[0034] The reference support characterization parameters include the maximum force difference of the reference support points, the maximum spacing between the reference support points, and the maximum height deviation of the reference support points.

[0035] Extract the pre-defined warp characterization weighted metric factor and the supporting characterization parameter weighted metric factor from the database.

[0036] The warpage characterization weighted metrics include the Z-axis displacement difference weighted metric, the maximum strain gradient weighted metric, and the mounting pressure distribution dispersion weighted metric.

[0037] The weighted measurement factors for the support characterization parameters include the weighted measurement factor for the maximum force difference at the support points, the weighted measurement factor for the maximum spacing between support points, and the weighted measurement factor for the maximum height deviation at the support points.

[0038] It should be noted that the values ​​of the warp characterization weighted metric and the support characterization parameter weighted metric are both between 0 and 1, and the sum of the warp characterization weighted metric and the support characterization parameter weighted metric is 1. When using them, the pre-set values ​​can be directly extracted from the database.

[0039] It should also be noted that the database stores a mapping set of warp characterization parameters and warp characterization weighted metric factors, as well as a mapping set of support characterization parameters and support characterization parameter weighted metric factors. When it is necessary to extract a weighted metric factor, you only need to input the parameter corresponding to the weighted metric factor to be extracted into the corresponding mapping set to extract the corresponding weighted metric factor.

[0040] Furthermore, the warpage sensitivity index of the circuit board module was analyzed, and the specific analysis method is as follows:

[0041] Collect warpage characterization parameters, including the Z-axis displacement difference of the circuit board module, the maximum strain gradient, and the dispersion of the mounting pressure distribution.

[0042] It should be noted that the Z-axis displacement difference refers to the Z-direction difference between the highest and lowest points of the circuit board module, which can be collected by a displacement sensor array. The maximum strain gradient can be collected by a strain gauge array at the edge of the mounting area. The mounting pressure distribution dispersion is the numerical result of the pressure variation coefficient, and the pressure data can be collected in real time by a mounting head pressure sensor array.

[0043] It should be added that the pressure coefficient of variation is the numerical result of the ratio of the pressure standard deviation to the pressure mean.

[0044] In a specific embodiment, the Z-axis displacement difference, maximum strain gradient, and mounting pressure distribution dispersion of the circuit board module are interrelated and mutually influential, jointly reflecting the warpage sensitivity of the circuit board: a larger Z-axis displacement difference indicates more severe circuit board warpage, which inevitably increases the deformation gradient on the circuit board surface, leading to an increase in the maximum strain gradient; the two are positively correlated. Circuit board warpage (Z-axis displacement difference) causes uneven contact pressure in different areas when the mounting head presses down, thereby increasing the mounting pressure distribution dispersion (pressure variation coefficient). Uneven mounting pressure distribution exacerbates local strain concentration, further increasing the maximum strain gradient. These three factors are coupled together through the "warpage-stress-pressure" transmission path, serving as the core parameters of the warpage sensitivity index.

[0045] Warp sensitivity index of circuit board module based on warp characterization parameters.

[0046] The warpage sensitivity index of the circuit board module is a quantitative characterization of the influence of the Z-axis displacement difference, maximum strain gradient, and mounting pressure distribution dispersion of the circuit board module on the warpage sensitivity of the circuit board module. The specific analysis process is as follows: the comparison results of the Z-axis displacement difference, maximum strain gradient, and mounting pressure distribution dispersion of the circuit board module with their reference values ​​are weighted based on the corresponding weighting metric factors, thereby obtaining the warpage sensitivity index of the circuit board module.

[0047] In a specific embodiment, the warpage sensitivity index of the circuit board module is specifically expressed as follows:

[0048]

[0049] Where A is the warpage sensitivity index of the circuit board module, a is the Z-axis displacement difference of the circuit board module, b is the maximum strain gradient of the circuit board module, c is the mounting pressure distribution dispersion of the circuit board module, and a vef For reference Z-axis displacement difference, b vef For reference to the maximum strain gradient, c vef For reference, the dispersion of mounting pressure distribution is α1, which is the weighting factor for Z-axis displacement difference; α2 is the weighting factor for maximum strain gradient; and α3 is the weighting factor for dispersion of mounting pressure distribution.

[0050] Furthermore, by combining historical data analysis of the circuit board module, the warpage determination of the SMT assembly process circuit board module is implemented using the required tags. The specific analysis process is as follows:

[0051] The number of historical data traced for circuit board modules is extracted based on the warp sensitivity index of the circuit board module.

[0052] It should be noted that the database stores a mapping set between the warp sensitivity index of the circuit board module and the number of historical data traceable of the circuit board module. When using it, the warp sensitivity index of the circuit board module obtained in real time is input into the mapping set, and the number of historical data traceable of the circuit board module can be extracted.

[0053] In this embodiment, a higher warpage sensitivity index for the circuit board module indicates a higher risk of warpage and potentially more severe deformation. To more comprehensively analyze the current warpage status of the circuit board module, accurately determine its warpage trend, and formulate reasonable adjustment strategies, it is necessary to refer to more historical data for comparison. Therefore, the more historical data of the extracted circuit board module, the more accurate and reliable the determination of current circuit board module warpage can be achieved by increasing the sample size of historical data.

[0054] Based on the historical data of the circuit board module, the number of historical warp sensitivity indicators were extracted from the system program log, and the coefficient of variation of the warp sensitivity indicators was analyzed in combination with the warp sensitivity indicators of the circuit board module.

[0055] It is important to understand that the coefficient of variation of the warp sensitivity index is the ratio of the standard deviation of the warp sensitivity index to the mean of the warp sensitivity index.

[0056] Extract the preset warp sensitivity index variation coefficient threshold from the database.

[0057] If the coefficient of variation of the warp sensitivity index is less than or equal to the threshold of the coefficient of variation of the warp sensitivity index, then the warp determination execution requirement label of the circuit board module is recorded as the requirement to execute warp determination.

[0058] If the coefficient of variation of the warp sensitivity index is less than or equal to the threshold of the warp sensitivity index, it indicates that the warp sensitivity index of the current circuit board module has a smaller dispersion compared with historical data, high data stability, and the fluctuation of warp risk is within a controllable range. At this time, a warp determination needs to be performed to further confirm whether there is a warp problem in the current circuit board module, ensuring that potential warp risks can still be detected in a timely manner within the normal fluctuation range.

[0059] If the coefficient of variation of the warp sensitivity index is greater than the threshold of the coefficient of variation of the warp sensitivity index, the warp determination execution requirement tag of the circuit board module is marked as no warp determination is required, and an early warning message is generated directly.

[0060] If the coefficient of variation of the warp sensitivity index is greater than the threshold, it indicates that the warp sensitivity index of the current circuit board module has a large degree of dispersion and poor data stability compared with historical data, and the warp risk may fluctuate abnormally. In this case, there is no need to perform the conventional warp determination process; instead, an early warning message is generated directly to remind relevant personnel that the circuit board module may have a significant warp risk and that appropriate measures should be taken in a timely manner.

[0061] See Figure 3 The diagram shows a branch flowchart of the warp adjustment strategy involved in this application embodiment. When the warp sensitivity index is higher than the warp sensitivity verification index, the system performs the first warp adjustment. First, the first Z-axis compensation value is extracted based on the sensitivity index, and the placement head height is adjusted accordingly to achieve deformation compensation. After the adjustment is completed, the sensitivity index is re-acquired to determine whether the compensation effect is effective: if the sensitivity does not decrease after adjustment, it is considered an invalid adjustment, and a warning message is generated; if the sensitivity decreases after adjustment and is lower than the warp sensitivity verification index, it is considered a successful adjustment, and the process proceeds to the support sinking judgment; if it decreases but is still higher than the warp sensitivity verification index, the second warp adjustment is performed to further optimize Z-axis compensation and placement speed.

[0062] The first execution strategy determination module is used to determine the first execution strategy of the SMT placement process based on the warpage sensitivity index of the circuit board module when the warpage determination execution requirement label of the circuit board module is "demand execution warpage determination".

[0063] Furthermore, the first execution strategy for the SMT placement process is determined based on the warp sensitivity index of the circuit board module. The specific process is as follows:

[0064] Extract the pre-defined warp sensitivity verification indicators from the database.

[0065] When the warpage sensitivity index of the circuit board module is greater than or equal to the warpage sensitivity verification index, the first execution strategy is recorded as executing warpage adaptive adjustment.

[0066] In this embodiment, when the warpage sensitivity index of the circuit board module is greater than or equal to the warpage sensitivity verification index, it indicates that the warpage sensitivity of the circuit board module has reached or exceeded the preset risk threshold, and there is a significant risk of warpage. It is necessary to perform warpage adaptive adjustment to compensate for and control the warpage of the circuit board module in order to maintain its bonding accuracy and avoid the warpage problem affecting the subsequent mounting process.

[0067] When the warpage sensitivity index of the circuit board module is less than the warpage sensitivity verification index, the first execution strategy is recorded as performing support sinking judgment.

[0068] In this embodiment, when the warpage sensitivity index of the circuit board module is less than the warpage sensitivity verification index, it indicates that the warpage sensitivity of the circuit board module has not reached the risk threshold that requires direct warpage adaptive adjustment. At this time, the warpage risk is relatively low, and the focus should be shifted to the stability of the support structure. By performing support sagging judgment, it can be analyzed whether there is a risk of support sagging in the circuit board module, so as to discover and deal with potential support-related problems in a timely manner.

[0069] The second execution strategy determination module is used to perform a first warpage adjustment based on the warpage sensitivity index of the circuit board module when the first execution strategy is to perform warpage adaptive adjustment, and to determine the second execution strategy of the SMT placement process based on the first warpage adjustment effect information.

[0070] Furthermore, a first warp adjustment is performed based on the warp sensitivity index of the circuit board module, and a second execution strategy for the SMT placement process is determined based on the information on the effect of the first warp adjustment. The specific analysis process is as follows:

[0071] The first Z-axis compensation value is extracted using the warp sensitivity index of the circuit board module.

[0072] It should be noted that the database stores a mapping set of warp sensitivity index of circuit board module and first Z-axis compensation value. When using it, the warp sensitivity index of circuit board module acquired in real time is input into the mapping set, and the first Z-axis compensation value can be extracted.

[0073] It should also be noted that a higher warpage sensitivity index for the circuit board module indicates a more severe degree of warpage or a higher risk of warpage, as surface deformation leads to a greater relative height deviation between the mounting head and the circuit board module. To compensate for this deformation and maintain the preset bonding accuracy, the height of the mounting head needs to be adjusted by increasing the compensation amount in the Z-axis direction, thereby ensuring the positional accuracy during component placement. Therefore, the larger the extracted first Z-axis compensation value, the better it is to accommodate more severe warpage conditions and achieve effective deformation compensation.

[0074] The Z-axis compensation value is used to adjust the relative height between the placement head of the SMT automatic placement machine and the circuit board module to maintain the preset bonding accuracy and achieve deformation compensation.

[0075] The first warping adjustment is performed based on the first Z-axis compensation value, and a first completion signal is generated after the adjustment is completed.

[0076] In a specific embodiment, the specific process of performing the first warp adjustment is as follows: extract the current execution height of the SMT automatic placement machine from the system program log, and use the sum of the current execution height of the SMT automatic placement machine and the Z-axis compensation value as the execution height between the placement head of the SMT automatic placement machine and the circuit board module.

[0077] It should be noted that if the execution height between the SMT automatic placement machine's placement head and the circuit board module obtained from the analysis exceeds the maximum allowed relative height preset in the database, then the maximum allowed relative height will be used for execution.

[0078] After receiving the first completion signal, the warp sensitivity index of the circuit board module is reacquired and denoted as the first characteristic coefficient of warp sensitivity.

[0079] When the first characteristic coefficient of warp sensitivity is greater than or equal to the warp sensitivity index of the circuit board module, the first warp adjustment effect information is recorded as invalid adjustment, and the second execution strategy is recorded as directly generating early warning information.

[0080] In this embodiment, when the first characteristic coefficient of warp sensitivity is greater than or equal to the warp sensitivity index of the circuit board module, it indicates that after performing the first warp adjustment, the warp sensitivity of the circuit board module has not decreased or has even increased, and the adjustment measures have failed to effectively improve the warp situation, which is an ineffective adjustment. At this time, a warning message needs to be generated directly to indicate that the current adjustment strategy has failed, and a warning message needs to be generated in a timely manner to remind the operator.

[0081] When the first characteristic coefficient of warp sensitivity is less than the warp sensitivity index of the circuit board module, if the first characteristic coefficient of warp sensitivity is also less than the warp sensitivity verification index, the first warp adjustment effect information is recorded as successful adjustment, and the second execution strategy is recorded as performing support sinking judgment. If the first characteristic coefficient of warp sensitivity is greater than or equal to the warp sensitivity verification index, the first warp adjustment effect information is recorded as effective adjustment, and the second execution strategy is recorded as performing the second warp adjustment.

[0082] In this embodiment, when the first characteristic coefficient of warp sensitivity is less than the warp sensitivity index of the circuit board module, it indicates that the first warp adjustment has had a positive impact on the warp condition of the circuit board module, and the warp sensitivity has decreased compared to before the adjustment. At this time, if the first characteristic coefficient of warp sensitivity is also less than the warp sensitivity verification index, it indicates that the first warp adjustment is successful, and the second execution strategy can be shifted to support sagging judgment to investigate potential risks in the support structure; if the first characteristic coefficient of warp sensitivity is greater than or equal to the warp sensitivity verification index, it indicates that although the warp sensitivity has decreased compared to before the adjustment, the problem has not been completely solved, and the second warp adjustment needs to be performed to further optimize the compensation parameters until the warp risk is reduced to a safe range.

[0083] Further, a second warpage adjustment is performed, the specific process of which is as follows:

[0084] The difference between the first characterization coefficient of warpage sensitivity and the verification index of warpage sensitivity is processed to obtain the first deviation characterization coefficient of warpage sensitivity.

[0085] It should be noted that the difference processing refers to subtracting the warp sensitivity verification index from the first characteristic coefficient of warp sensitivity.

[0086] The second warp adjustment set is extracted based on the first deviation characterization coefficient of warp sensitivity.

[0087] It should be noted that the database stores a mapping set of the first deviation characterization coefficient of warp sensitivity and the second warp adjustment set. When using it, the first deviation characterization coefficient of warp sensitivity obtained in real time is input into the mapping set, and the second warp adjustment set can be extracted.

[0088] The second warp adjustment set includes the Z-axis compensation value supplementation ratio and the placement speed reduction value.

[0089] It's important to understand that a larger first deviation coefficient for warp sensitivity indicates that after the first warp adjustment, the gap between the warp sensitivity of the circuit board module and the warp sensitivity verification index remains significant, meaning the current warp risk remains high. To more fully compensate for the deformation of the circuit board module and effectively reduce warp risk, the mounting process parameters need to be adjusted more significantly. Therefore, the extracted Z-axis compensation value supplementation ratio and the mounting speed reduction value should be larger. By increasing the Z-axis compensation value to further adjust the mounting head height to match the deformation, and simultaneously reducing the mounting speed more significantly to reduce impact force, the accuracy of deformation compensation is improved synergistically, effectively reducing warp sensitivity.

[0090] The placement speed reduction value is used to adjust the placement execution speed of the SMT automatic placement machine. Specifically, by reducing the placement speed, the impact force on the edge of the circuit board when the placement head presses down is reduced, avoiding the aggravation of deformation caused by high-speed placement. In conjunction with the Z-axis compensation value, it allows the placement head more time to complete the bonding according to the real-time compensation height, thereby improving the accuracy of deformation compensation.

[0091] The second Z-axis compensation value is obtained based on the first Z-axis compensation value and the Z-axis compensation value supplementation ratio. That is, the product of the first Z-axis compensation value and the Z-axis compensation value supplementation ratio is used as the numerical result of the second Z-axis compensation value.

[0092] The second warpage adjustment is performed based on the second Z-axis compensation value and the placement speed reduction value.

[0093] In a specific embodiment, the specific process of performing the second warpage adjustment is as follows: extract the current placement head execution height and the current placement head execution speed from the system program log, take the sum of the current placement head execution height and the second Z-axis compensation value as the execution height between the SMT automatic placement machine placement head and the circuit board module, and take the sum of the current placement head execution speed and the placement speed reduction value as the SMT automatic placement machine placement head pressing execution speed.

[0094] It should be noted that if the calculated downward pressing speed of the SMT automatic placement machine head exceeds the minimum allowable downward pressing speed preset in the database, then the machine will be executed at the minimum allowable downward pressing speed.

[0095] See Figure 4 The diagram shown is a flowchart of the support sinking response branch involved in an embodiment of this application. When the system executes the support sinking judgment process, it first collects the support characterization parameters of the circuit board module, including the maximum force difference of the support points, the maximum spacing of the support points, and the maximum height deviation of the support points, and calculates the support sinking evaluation factor accordingly. If the support sinking evaluation characterization factor does not exceed the support sinking evaluation threshold, it is determined that the support structure is stable, and no further hot spot area analysis is required, maintaining the current mounting strategy; if the support sinking evaluation characterization factor exceeds the support sinking evaluation threshold, it is necessary to further determine whether there is an abnormal aggravation trend in the local hot spot area, and extract the corresponding mounting head execution parameter adjustment set based on this, and adjust the pressing speed and pressure parameters of the mounting head according to the judgment result, thereby reducing the impact intensity and realizing active intervention and control of local sinking risk.

[0096] The support depression adjustment module is used to analyze the support depression evaluation characterization factor of the circuit board module when the first execution strategy or the second execution strategy is to determine support depression, analyze the abnormal aggravation of local hot spot areas in combination with the warp sensitivity index of the circuit board module, and adjust the support depression of the SMT placement process in combination with the determination result of the abnormal aggravation of local hot spot areas when the determination result of the abnormal aggravation of local hot spot areas is determined.

[0097] Furthermore, the analysis of the abnormally heightened activity in local hotspot areas reveals a need for information to determine the extent of the problem. The specific analysis process is as follows:

[0098] The support characteristics of the circuit board module are collected, including the maximum force difference between the support points, the maximum spacing between the support points, and the maximum height deviation of the support points.

[0099] It should be noted that the maximum force difference of the support points of the circuit board module refers to the difference between the maximum and minimum vertical pressure borne by a single support point among all the support points of the circuit board module. This difference reflects the degree of unevenness of the force on the support points. The larger the difference, the more uneven the force on the support structure, and the easier it is to cause local sinking of the circuit board module. This is collected by a pressure sensor array.

[0100] The maximum spacing between support points of a circuit board module refers to the maximum horizontal distance between adjacent support points on the circuit board module. It reflects the sparseness of the support points in the horizontal direction. The larger the maximum spacing, the sparser the support points are. During the mounting process, the middle area of ​​the circuit board module is more likely to sink due to insufficient support. This is measured by a laser rangefinder.

[0101] The maximum height deviation of the support points of the circuit board module refers to the difference between the maximum and minimum height of the support points among all the support points of the circuit board module. This deviation reflects the vertical height consistency of the support points. The larger the maximum height deviation, the more inconsistent the height of the support points, the more unbalanced the force on the circuit board module, and the easier it is to cause the support to sink. This is collected by a 3D laser contour scanner.

[0102] In a specific embodiment, the maximum stress difference, maximum spacing between support points, and maximum height deviation of support points are interrelated and jointly affect the stability of the support structure. A larger maximum spacing between support points means a sparser distribution of support points, resulting in insufficient support in the central area of ​​the circuit board. This makes the board more susceptible to concave deformation due to gravity or mounting pressure, leading to uneven stress distribution and further increasing the maximum stress difference. A maximum height deviation of support points causes uneven stress distribution on the circuit board, with higher support points bearing greater pressure, directly exacerbating the maximum stress difference. Furthermore, uneven stress distribution may further cause changes in the spacing between support points due to deformation. An excessive maximum stress difference can overload some support points, potentially triggering plastic deformation of the support structure, leading to increased height deviation or changes in spacing. These three factors interact through the "spacing-height-stress" transmission path, collectively serving as core parameters for evaluating support sagging.

[0103] Analysis of support characterization parameters based on circuit board modules to evaluate the characterization factors of support depression in circuit board modules.

[0104] The evaluation characterization factor for the support sinking of the circuit board module is a quantitative representation of the impact of the maximum force difference of the support points, the maximum spacing between the support points, and the maximum height deviation of the support points on the risk of support sinking of the circuit board module. The specific analysis process is as follows: the differential processing results of the maximum force difference of the support points, the maximum spacing between the support points, and the maximum height deviation of the support points with the reference values ​​are weighted based on the corresponding weighted measurement factors to obtain the evaluation characterization factor for the support sinking of the circuit board module.

[0105] In a specific embodiment, the evaluation characteristic factor for the support depression of the circuit board module is specifically expressed as follows:

[0106]

[0107] Where B is the evaluation characteristic factor of the support sinking of the circuit board module, d is the maximum force difference of the support points of the circuit board module, f is the maximum spacing of the support points of the circuit board module, g is the maximum height deviation of the support points of the circuit board module, and d vef f is the maximum force difference at the reference support point. vef As a reference for the maximum spacing between support points, g vef For reference, the maximum height deviation of the support point is used as the weighting factor for the maximum force difference of the support point, β1 is the weighting factor for the maximum spacing of the support points, and β3 is the weighting factor for the maximum height deviation of the support point.

[0108] When the support sinking assessment characterization factor of the circuit board module is greater than or equal to the preset support sinking assessment threshold in the database, the abnormal aggravation of the local hot spot area is recorded as the demand existence determination.

[0109] When the support sinking assessment characterization factor of the circuit board module is greater than or equal to the preset support sinking assessment threshold in the database, it indicates that the comprehensive risk level of the support characterization parameters such as the maximum force difference of the support points, the maximum spacing of the support points, and the maximum height deviation of the support points of the circuit board module has reached or exceeded the preset critical value. The stability of the support structure is insufficient, and there is a high risk of support sinking. It is necessary to determine whether the local hot spot area is abnormally aggravated in order to further clarify the subsequent analysis strategy.

[0110] When the support sinking assessment characterization factor of the circuit board module is less than the preset support sinking assessment threshold in the database, the information on the abnormal aggravation of local hot spot areas is recorded as not requiring assessment.

[0111] When the support sinking assessment characterization factor of the circuit board module is less than the preset support sinking assessment threshold in the database, it indicates that the overall risk level of the support characterization parameters of the circuit board module is low, the support structure is relatively stable, and the risk of support sinking is within a controllable range. There is no need to determine whether the local hot spot area is abnormally aggravated, thus avoiding unnecessary waste of resources.

[0112] Furthermore, the abnormal exacerbation of local hotspots has been identified, and the specific analysis steps are as follows:

[0113] The Z-axis deformation spatial distribution matrix of the circuit board module surface is acquired in real time, and the deformation gradient is analyzed.

[0114] Hotspot regions are segmented based on deformation gradient threshold, and dynamic contour tracking is performed on the binary map of hotspot regions with continuous time steps to obtain the hotspot area expansion rate.

[0115] In a specific embodiment, the system first uses a high-speed displacement sensor array to collect the Z-axis height values ​​of the circuit board module surface in real time with a preset accuracy in the database, forming a spatial distribution matrix. Next, for each grid cell, the deformation gradient field is extracted through differential operations. Regions with deformation gradients greater than a set deformation gradient threshold in the database are marked as hotspot regions, and corresponding binary maps are constructed. Then, using a boundary tracking algorithm, the contours and areas of the hotspot regions are extracted and calculated over five consecutive time steps, forming a time series curve. Based on this, it is determined whether there is a significant expansion trend, and further, whether there is an abnormal aggravation of local hotspot regions.

[0116] In a specific embodiment, the hotspot area expansion rate is obtained through the following process: After converting the hotspot region into a binary image, a dynamic contour extraction algorithm is used for region tracking. The area change rate of the hotspot region is calculated within multiple consecutive time frames (pre-set in the database), and the hotspot expansion trend is determined accordingly. If the area expansion rate is greater than a threshold set in the database, it is recorded as abnormal aggravation.

[0117] If the hotspot area expansion rate is greater than the preset hotspot area expansion rate threshold in the database, the result of the judgment that the local hotspot area has abnormally intensified will be recorded as the existence of local hotspot area abnormal intensification.

[0118] In this embodiment, if the hot spot area expansion rate is greater than the preset hot spot area expansion rate threshold, it indicates that the local deformation area on the surface of the circuit board module is expanding at a relatively fast speed, the abnormal condition of the hot spot area is continuously aggravated, and the stability of the support structure faces the risk of rapid deterioration.

[0119] If the hotspot area expansion rate is less than or equal to the preset hotspot area expansion rate threshold, the result of the determination that the local hotspot area abnormally intensifies is recorded as no local hotspot area abnormally intensifies.

[0120] In this embodiment, if the hot spot area expansion rate is less than or equal to the preset hot spot area expansion rate threshold, it indicates that the local deformation area on the surface of the circuit board module expands slowly or is in a stable state, the abnormal condition of the hot spot area does not show an aggravating trend, and the risk of the support structure is within a controllable range.

[0121] Furthermore, the support depression in the SMT placement process is adjusted. The specific analysis steps are as follows:

[0122] The first set of adjustment parameters for the mounting head is extracted by evaluating the characterization factors of the support depression of the circuit board module.

[0123] It should be noted that the database stores a mapping set of the support depression evaluation characterization factor of the circuit board module and the first adjustment set of the mounting head execution parameters. When using it, the support depression evaluation characterization factor of the circuit board module obtained in real time is input into the mapping set, and the first adjustment set of the mounting head execution parameters can be extracted.

[0124] The first set of adjustment parameters for the placement head includes the placement head depress speed reduction value and the placement head depress pressure reduction value.

[0125] In a specific embodiment, a larger support sagging assessment factor for the circuit board module indicates a higher overall risk of uneven force distribution at the support points, greater spacing between support points, and height deviations. This results in poorer support structure stability and a greater likelihood of circuit board sagging during mounting. To reduce the impact force on the circuit board when the mounting head presses down and to prevent support sagging from being exacerbated by high-speed, high-pressure mounting, it is necessary to significantly reduce the pressing speed and pressure of the mounting head. Therefore, the larger the corresponding extracted values ​​for mounting head pressing speed reduction and mounting head pressing pressure reduction, the greater the impact on the support structure can be by slowing down the pressing speed and reducing the pressing pressure. This reduces deformation of the circuit board module caused by support sagging and ensures mounting accuracy.

[0126] Based on the judgment result of the abnormal increase in local hot spots, the mounting head execution parameter adjustment ratio value is extracted.

[0127] It should be noted that the database stores a mapping set of judgment results for the abnormal aggravation of local hot spots and the adjustment ratio values ​​of the mounting head execution parameters. When using it, the judgment results for the abnormal aggravation of local hot spots obtained in real time are input into the mapping set, and the adjustment ratio values ​​of the mounting head execution parameters can be extracted.

[0128] It should also be noted that when the determination result of the abnormal aggravation of local hot spots is that there is an abnormal aggravation of local hot spots, the extracted adjustment ratio of the mounting head execution parameters is greater than 1. When the determination result of the abnormal aggravation of local hot spots is that there is no abnormal aggravation of local hot spots, the extracted adjustment ratio of the mounting head execution parameters is between 0 and 1.

[0129] It's important to explain that when a localized hotspot area is abnormally aggravated and the determination result is "existent," it indicates that the support structure of the circuit board module has experienced rapid expansion of localized deformation and intensified stress concentration. At this point, the risk of support sagging increases significantly. Extracting an adjustment ratio greater than 1 means further increasing the parameter reduction magnitude based on the first set of adjustment parameters for the placement head (reduction values ​​for pressing speed and pressing pressure). This uses stronger impact force suppression measures to prevent the placement process from exacerbating localized deformation and thus preventing further support sagging.

[0130] When the judgment result is "not found", it indicates that the local hotspot area is in a stable state and the risk of support sinking is within a controllable range. Extracting an adjustment ratio between 0 and 1 at this time is to avoid excessively reducing mounting parameters and affecting production efficiency while ensuring the stability of the support structure, thus achieving a balance between risk control and mounting efficiency.

[0131] The support depression of the SMT placement process is adjusted based on the first set of adjustment parameters for the placement head and the adjustment ratio of the placement head execution parameters.

[0132] The specific process for adjusting the support depression in the SMT placement process is as follows: extract the current placement head pressing speed and the current placement head pressing pressure from the system program log, take the sum of the current placement head pressing speed and the reduction value of the placement head pressing speed as the placement head pressing execution speed, and take the sum of the current placement head pressing pressure and the reduction value of the placement head pressing pressure as the placement head pressing execution pressure.

[0133] It should be noted that if the analyzed placement head pressing speed exceeds the preset minimum allowable pressing speed in the database, the minimum allowable pressing speed will be used. If the analyzed placement head pressing pressure exceeds the preset minimum allowable pressing pressure in the database, the minimum allowable pressing pressure will be used.

[0134] See Figure 2 As shown, the second aspect of the present invention provides a method for testing the deformation of a circuit board module in an automated SMT (Surface Mount Technology) assembly process, comprising the following steps:

[0135] S1, analyze the warpage sensitivity index of the circuit board module, and combine the historical data of the circuit board module to analyze the warpage judgment execution requirement label of the circuit board module of SMT assembly process.

[0136] S2, when the requirement label for the warpage determination of the circuit board module is "requirement to perform warpage determination", the first execution strategy of the SMT placement process is determined based on the warpage sensitivity index of the circuit board module.

[0137] S3, when the first execution strategy is to perform warp adaptive adjustment, the first warp adjustment is performed based on the warp sensitivity index of the circuit board module, and the second execution strategy of the SMT placement process is determined based on the first warp adjustment effect information.

[0138] S4, when the first execution strategy or the second execution strategy is to determine support sinking, analyze the support sinking evaluation characterization factor of the circuit board module, combine the warpage sensitivity index of the circuit board module to analyze the demand information for the abnormal aggravation of local hot spots, and when the demand information for the abnormal aggravation of local hot spots is determined, adjust the support sinking of the SMT placement process in combination with the determination result of the abnormal aggravation of local hot spots.

[0139] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0140] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0141] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0142] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0143] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0144] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A deformation testing system for SMT automated placement and forming circuit board modules, characterized in that, include: The warpage determination execution requirement analysis module is used to analyze the warpage sensitivity index of the circuit board module and combine the historical data of the circuit board module to analyze the warpage determination execution requirement label of the circuit board module in the SMT placement process. The first execution strategy determination module is used to determine the first execution strategy of the SMT placement process based on the warpage sensitivity index of the circuit board module when the warpage determination execution requirement label of the circuit board module is the requirement to execute warpage determination. The second execution strategy determination module is used to perform a first warp adjustment based on the warp sensitivity index of the circuit board module when the first execution strategy is to perform warp adaptive adjustment, and to determine the second execution strategy of the SMT placement process based on the first warp adjustment effect information. The support depression adjustment module is used to analyze the support depression evaluation characterization factor of the circuit board module when the first execution strategy or the second execution strategy is to determine support depression, analyze the abnormal aggravation of local hot spot areas in combination with the warp sensitivity index of the circuit board module, and adjust the support depression of the SMT placement process in combination with the determination result of the abnormal aggravation of local hot spot areas when the determination result of the abnormal aggravation of local hot spot areas is determined.

2. The SMT automated placement and forming circuit board module deformation testing system as described in claim 1, characterized in that: The specific analysis method for the warpage sensitivity index of the analytical circuit board module is as follows: Collect warpage characterization parameters, including the Z-axis displacement difference of the circuit board module, the maximum strain gradient, and the dispersion of the mounting pressure distribution; Analysis of warpage sensitivity index of circuit board module based on warpage characterization parameters; The warpage sensitivity index of the circuit board module is a quantitative characterization of the influence of the Z-axis displacement difference, maximum strain gradient, and mounting pressure distribution dispersion of the circuit board module on the warpage sensitivity of the circuit board module. The specific analysis process is as follows: the comparison results of the Z-axis displacement difference, maximum strain gradient, and mounting pressure distribution dispersion of the circuit board module with their reference values ​​are weighted based on the corresponding weighting metric factors, thereby obtaining the warpage sensitivity index of the circuit board module.

3. The SMT automated placement and forming circuit board module deformation testing system as described in claim 2, characterized in that: The analysis of historical data from the circuit board module to determine the warpage of the SMT (Surface Mount Technology) process requires the execution of a tag-based requirement. The specific analysis process is as follows: The number of historical data traced for circuit board modules is extracted based on the warp sensitivity index of the circuit board modules. Based on the number of historical data traced from the circuit board module, the historical warp sensitivity indexes were extracted, and the coefficient of variation of the warp sensitivity indexes was analyzed in combination with the warp sensitivity indexes of the circuit board module. Extract the preset warp sensitivity index variation coefficient threshold from the database; If the coefficient of variation of the warp sensitivity index is less than or equal to the threshold of the coefficient of variation of the warp sensitivity index, then the warp determination execution requirement label of the circuit board module is recorded as the requirement to execute warp determination. If the coefficient of variation of the warp sensitivity index is greater than the threshold of the coefficient of variation of the warp sensitivity index, the warp determination execution requirement tag of the circuit board module is marked as no warp determination is required, and an early warning message is generated directly.

4. The SMT automated placement and forming circuit board module deformation testing system as described in claim 1, characterized in that: The first execution strategy for the SMT placement process is determined based on the warp sensitivity index of the circuit board module, and the specific process is as follows: Extract the preset warp sensitivity verification index from the database; When the warpage sensitivity index of the circuit board module is greater than or equal to the warpage sensitivity verification index, the first execution strategy is recorded as executing warpage adaptive adjustment. When the warpage sensitivity index of the circuit board module is less than the warpage sensitivity verification index, the first execution strategy is recorded as performing support sinking judgment.

5. The SMT automated placement and forming circuit board module deformation testing system as described in claim 1, characterized in that: The first warp adjustment is performed based on the warp sensitivity index of the circuit board module, and the second execution strategy of the SMT placement process is determined based on the information of the first warp adjustment effect. The specific analysis process is as follows: The first Z-axis compensation value is extracted using the warp sensitivity index of the circuit board module. The Z-axis compensation value is used to adjust the relative height between the placement head of the SMT automatic placement machine and the circuit board module in order to maintain the preset bonding accuracy and achieve deformation compensation. A first warping adjustment is performed based on the first Z-axis compensation value, and a first completion signal is generated after the adjustment is completed. After receiving the first completion signal, the warp sensitivity index of the circuit board module is reacquired and recorded as the first characterization coefficient of warp sensitivity. When the first characteristic coefficient of warp sensitivity is greater than or equal to the warp sensitivity index of the circuit board module, the first warp adjustment effect information is recorded as invalid adjustment, and the second execution strategy is recorded as directly generating early warning information. When the first characteristic coefficient of warp sensitivity is less than the warp sensitivity index of the circuit board module, if the first characteristic coefficient of warp sensitivity is also less than the warp sensitivity verification index, the first warp adjustment effect information is recorded as successful adjustment, and the second execution strategy is recorded as performing support sinking judgment. If the first characteristic coefficient of warp sensitivity is greater than or equal to the warp sensitivity verification index, the first warp adjustment effect information is recorded as effective adjustment, and the second execution strategy is recorded as performing the second warp adjustment.

6. The SMT automated placement and forming circuit board module deformation testing system as described in claim 5, characterized in that: The second warp adjustment is performed as follows: The difference between the first characterization coefficient of warpage sensitivity and the verification index of warpage sensitivity is processed to obtain the first deviation characterization coefficient of warpage sensitivity. The second warp adjustment set is extracted based on the first deviation characterization coefficient of warp sensitivity; The second warpage adjustment set includes a Z-axis compensation value supplementation ratio and a placement speed reduction value; The placement speed reduction value is used to adjust the placement execution speed of the SMT automatic placement machine. Specifically, by reducing the placement speed, the impact force on the edge of the circuit board when the placement head presses down is reduced, avoiding the aggravation of deformation caused by high-speed placement. In conjunction with the Z-axis compensation value, the placement head has more time to complete the bonding according to the real-time compensation height, thereby improving the accuracy of deformation compensation. The second Z-axis compensation value is obtained based on the first Z-axis compensation value and the Z-axis compensation value supplemented by a ratio. The second warpage adjustment is performed based on the second Z-axis compensation value and the placement speed reduction value.

7. The SMT automated placement and forming circuit board module deformation testing system as described in claim 1, characterized in that: The analysis of the abnormal aggravation of local hotspot areas requires information for determination. The specific analysis process is as follows: Collect the support characteristics parameters of the circuit board module, including the maximum force difference of the support points, the maximum spacing between support points, and the maximum height deviation of the support points; Analysis of support characterization parameters of circuit board modules to evaluate the characterization factor of support depression of circuit board modules. The support sinking assessment characterization factor of the circuit board module is a quantitative characterization of the impact of the maximum force difference of the support points, the maximum spacing of the support points, and the maximum height deviation of the support points on the support sinking risk of the circuit board module. The specific analysis process is as follows: the differential processing results of the maximum force difference of the support points, the maximum spacing of the support points, and the maximum height deviation of the support points with the reference values ​​are weighted based on the corresponding weighted measurement factors to obtain the support sinking assessment characterization factor of the circuit board module. When the support sinking evaluation characterization factor of the circuit board module is greater than or equal to the preset support sinking evaluation threshold in the database, the abnormal aggravation of the local hot spot area is recorded as the demand existence determination. When the support sinking assessment characterization factor of the circuit board module is less than the preset support sinking assessment threshold in the database, the information on the abnormal aggravation of local hot spot areas is recorded as not requiring assessment.

8. The SMT automated placement and forming circuit board module deformation testing system as described in claim 7, characterized in that: The determination result of the abnormal aggravation of the local hotspot area is as follows: Real-time acquisition of the Z-axis deformation spatial distribution matrix on the surface of the circuit board module, and analysis of the deformation gradient; Hotspot regions are segmented based on deformation gradient threshold, and dynamic contour tracking is performed on the binary map of hotspot regions with continuous time steps to obtain the hotspot area expansion rate. If the hotspot area expansion rate is greater than the preset hotspot area expansion rate threshold, the determination result of the abnormal aggravation of the local hotspot area is recorded as the existence of abnormal aggravation of the local hotspot area. If the hotspot area expansion rate is less than or equal to the preset hotspot area expansion rate threshold, the result of the determination that the local hotspot area abnormally intensifies is recorded as no local hotspot area abnormally intensifies.

9. The SMT automated placement and forming circuit board module deformation testing system as described in claim 1, characterized in that: The specific analysis steps for adjusting the support depression in the SMT placement process are as follows: The first set of adjustment parameters for the mounting head is extracted by evaluating the characterization factors of the support depression of the circuit board module. The first set of adjustment parameters for the placement head includes a reduction value for the placement head pressing speed and a reduction value for the placement head pressing pressure. Based on the judgment result of abnormal aggravation in local hot spots, the adjustment ratio value of the mounting head execution parameters is extracted; The support depression of the SMT placement process is adjusted based on the first set of adjustment parameters for the placement head and the adjustment ratio of the placement head execution parameters.

10. A method for testing the deformation of a circuit board module in an SMT automated placement and forming system according to any one of claims 1-9, characterized in that, include: S1, analyze the warpage sensitivity index of the circuit board module, and combine the historical data of the circuit board module to analyze the warpage judgment execution requirement label of the SMT placement process circuit board module. S2, when the requirement label for the warpage determination of the circuit board module is "requirement to perform warpage determination", the first execution strategy of the SMT placement process is determined based on the warpage sensitivity index of the circuit board module. S3, when the first execution strategy is to perform warp adaptive adjustment, the first warp adjustment is performed based on the warp sensitivity index of the circuit board module, and the second execution strategy of the SMT placement process is determined based on the first warp adjustment effect information. S4, when the first execution strategy or the second execution strategy is to determine support sinking, analyze the support sinking evaluation characterization factor of the circuit board module, combine the warpage sensitivity index of the circuit board module to analyze the demand information for the abnormal aggravation of local hot spots, and when the demand information for the abnormal aggravation of local hot spots is determined, adjust the support sinking of the SMT placement process in combination with the determination result of the abnormal aggravation of local hot spots.

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