Method and device for predicting reliability of backup power supply containing super capacitor under extreme environmental conditions

Abstract

The invention discloses a method and a device for predicting the reliability of a standby power supply with a super capacitor under an extreme environmental condition. The method comprises the following steps: placing a stand-by power supply in a non-discharge state in a preset extreme environment, starting timing and recording test temperature state parameters and test voltage state parameters after a preset time after the stand-by power supply reaches thermal stability and voltage stability; calculating the temperature coefficient of each component of the standby power supply in the extreme environment according to the test temperature state parameter and the reference temperature of each component of the standby power supply; calculating a voltage coefficient of each component of the standby power supply in an extreme environment according to the test voltage state parameter and the reference voltage of each component of the standby power supply; according to the temperature coefficient and the voltage coefficient of each component of the standby power supply and the reference failure rate of each component of the standby power supply, calculating the working failure rate of each component of the standby power supply in the extreme environment; and superposing the working failure rates of the components of the standby power supply in the extreme environment to obtain a reliability prediction result of the standby power supply.

Description

Technical Field

[0001] This invention relates to the field of power system technology, and more specifically, to a method and apparatus for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions. Background Technology

[0002] Existing smart meters and their pluggable communication unit modules face occasional power outages during operation. These outages may be caused by unpaid electricity bills, circuit faults, or circuit maintenance. To ensure that smart meters can promptly retain data in their volatile memory and that communication unit modules can promptly report outages to the main information station, both standards and specifications explicitly stipulate that supercapacitors should be used as backup power supply components in the circuits. This allows them to temporarily power the memory or communication circuits in place of the main power supply during a power outage. A conceptual diagram of the backup power supply is shown below. Figure 1 As shown, the decomposed structural diagram is as follows: Figure 2 As shown.

[0003] Regarding the selection of supercapacitors, in most current embodiments, the internal materials of supercapacitors are aluminum electrodes and liquid electrolytes; the supercapacitors selected in smart energy meters are either 3V-3.3F or 5.5V-1.5F; the supercapacitors selected in communication unit modules are 2.7V-10F. Regarding the backup power supply scheme, in most current embodiments, the backup power supply for the communication unit module is a DC 3.3V and 12V input. The scheme uses a series connection of a DC-DC type power chip, a voltage regulating resistor, a supercapacitor, and a back-end circuit with boost function to output a backup power supply voltage, such as... Figure 3 As shown; the backup power supply for the smart energy meter is the mains frequency voltage input. The scheme uses a series connection of a rectifier bridge, a three-terminal voltage regulator type power chip, a step-down diode, and a supercapacitor to output a backup power supply voltage, such as... Figure 4 As shown.

[0004] Supercapacitors and power supply chips are key components of backup power supplies. Reliability prediction can be achieved using stress methods, empirical methods combined with field data, or simulation methods to obtain the failure rates of supercapacitors and power supply chips. However, in this embodiment, empirical methods and field data cannot provide sufficient reference data, and simulation modeling cannot account for all situations, making them unsuitable. In this embodiment, through long-term operation testing of the backup power supply in a 70°C high-temperature environment, the state parameters show that the output voltage of the power supply chip exhibits a trend of gradual increase over time. This trend is due to the error between the actual value and the design value of the power supply chip's reference voltage. This error gradually increases with the continuous extreme ambient temperature, leading to a corresponding increase in the operating voltage of the supercapacitor. This error is not significant within a few hours, so conventional voltage state parameter measurement methods cannot capture this factor, resulting in a significant deviation when using stress methods to predict reliability under extreme conditions. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a method and apparatus for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions.

[0006] According to one aspect of the present invention, a method for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions is provided, comprising:

[0007] Place the standby power supply in a preset extreme environment when it is not in a discharged state. After the standby power supply reaches thermal and voltage stability, start timing and record the test temperature and voltage parameters after the preset time.

[0008] The temperature coefficients of each component of the backup power supply under extreme environments are calculated based on the test temperature parameters and the reference temperatures of each component.

[0009] Calculate the voltage coefficients of each component of the backup power supply under extreme conditions based on the test voltage state parameters and the reference voltages of each component.

[0010] Based on the temperature coefficient, voltage coefficient, and reference failure rate of each component of the backup power supply, calculate the operating failure rate of each component of the backup power supply under extreme environments.

[0011] The failure rates of each component in the backup power supply under extreme conditions are superimposed to obtain the expected reliability of the backup power supply.

[0012] Optionally, the backup power supply in its non-discharged state is placed in a preset extreme environment, including:

[0013] Connect the power frequency / DC voltage input of the backup power supply to keep the backup power supply in a non-discharge state;

[0014] The backup power supply in its non-discharged state is placed in a preset extreme environment.

[0015] Optionally, the test temperature parameters include the surface temperature of the test supercapacitor and the test air temperature.

[0016] Optionally, after the backup power supply reaches thermal and voltage stability, timing begins, and the test temperature and voltage status parameters are recorded after a preset time, including:

[0017] The real-time surface temperature of the supercapacitor and the real-time air temperature are obtained by thermocouples installed on the supercapacitor of the backup power supply and at preset locations in the environment where the backup power supply is located.

[0018] The real-time voltage status parameters of the backup power supply are obtained in real time through the leads brought out from the voltage pins of the power chip in the backup power supply.

[0019] Observe the real-time supercapacitor surface temperature, real-time air temperature, and real-time voltage status parameters of the backup power supply under extreme conditions, and start timing after stabilization;

[0020] Record the surface temperature of the supercapacitor, the temperature of the test air, and the state parameters of the test voltage after the preset time test ends.

[0021] Optionally, the temperature coefficients of each component of the backup power supply under extreme environments are calculated based on the test temperature condition parameters and the reference temperatures of each component, including:

[0022] The temperature coefficients of each component of the backup power supply under extreme environments are calculated based on the surface temperature of the supercapacitor, the test air temperature, and the reference temperatures of each component.

[0023] According to another aspect of the present invention, a device for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions is provided, comprising:

[0024] The recording module is used to place the backup power supply in a preset extreme environment when it is not in a discharged state. After the backup power supply reaches thermal stability and voltage stability, the timing starts and the test temperature and voltage status parameters are recorded after the preset time.

[0025] The first calculation module is used to calculate the temperature coefficient of each component of the backup power supply under extreme environments based on the test temperature state parameters and the reference temperature of each component of the backup power supply.

[0026] The second calculation module is used to calculate the voltage coefficient of each component of the backup power supply under extreme conditions based on the test voltage state parameters and the reference voltage of each component of the backup power supply.

[0027] The third calculation module is used to calculate the operating failure rate of each component of the backup power supply under extreme environments based on the temperature coefficient, voltage coefficient, and reference failure rate of each component of the backup power supply.

[0028] The module is used to superimpose the failure rates of various components of the backup power supply under extreme environments to obtain the expected reliability results of the backup power supply.

[0029] According to another aspect of the present invention, a computer-readable storage medium is provided, the storage medium storing a computer program for performing the methods described in any of the above aspects of the present invention.

[0030] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising: a processor; a memory for storing executable instructions of the processor; the processor being configured to read the executable instructions from the memory and execute the instructions to implement the method described in any of the preceding aspects of the present invention.

[0031] Therefore, this invention provides a method for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions by designing an extreme environment test. This method takes into account the factor that the state parameters will gradually deviate over time, thereby enabling a more accurate prediction of the backup power supply's reliability. Attached Figure Description

[0032] Exemplary embodiments of the present invention can be more fully understood by referring to the following figures:

[0033] Figure 1 This is an overall conceptual diagram of a backup power supply provided in an exemplary embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram of the disassembled structure of the backup power supply provided in an exemplary embodiment of the present invention;

[0035] Figure 3 This is a schematic diagram of a backup power communication unit module provided in an exemplary embodiment of the present invention;

[0036] Figure 4 This is an embodiment of the present invention providing a schematic diagram of intelligent power representation for backup power supply;

[0037] Figure 5 This is a flowchart illustrating a method for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions, provided in an exemplary embodiment of the present invention.

[0038] Figure 6 This is a circuit diagram of a scheme for improving the reliability of backup power supply provided by an exemplary embodiment of the present invention;

[0039] Figure 7 This is a schematic diagram of the structure of a backup power supply containing a supercapacitor for predicting reliability under extreme environmental conditions, provided in an exemplary embodiment of the present invention.

[0040] Figure 8 This is the structure of an electronic device provided in an exemplary embodiment of the present invention. Detailed Implementation

[0041] Hereinafter, exemplary embodiments according to the present invention will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments of the present invention. It should be understood that the present invention is not limited to the exemplary embodiments described herein.

[0042] It should be noted that, unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of the invention.

[0043] Those skilled in the art will understand that the terms "first," "second," etc., in the embodiments of the present invention are only used to distinguish different steps, devices, or modules, and do not represent any specific technical meaning, nor do they indicate a necessary logical order between them.

[0044] It should also be understood that in the embodiments of the present invention, "multiple" can refer to two or more, and "at least one" can refer to one, two or more.

[0045] It should also be understood that any component, data or structure mentioned in the embodiments of the present invention can generally be understood as one or more unless explicitly defined or given contrary instructions in the context.

[0046] Furthermore, the term "and / or" in this invention is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this invention generally indicates that the preceding and following related objects have an "or" relationship.

[0047] It should also be understood that the description of the various embodiments in this invention emphasizes the differences between the various embodiments, and the similarities or similarities can be referred to each other. For the sake of brevity, they will not be described in detail.

[0048] At the same time, it should be understood that, for ease of description, the dimensions of the various parts shown in the accompanying drawings are not drawn according to actual scale.

[0049] The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the invention or its application or use.

[0050] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, they should be considered part of the specification.

[0051] It should be noted that similar labels and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be discussed further in subsequent figures.

[0052] The embodiments of this invention can be applied to electronic devices such as terminal devices, computer systems, and servers, and can operate together with a wide range of other general-purpose or special-purpose computing system environments or configurations. Well-known examples of terminal devices, computing systems, environments, and / or configurations suitable for use with electronic devices such as terminal devices, computer systems, and servers include, but are not limited to: personal computer systems, server computer systems, thin clients, thick clients, handheld or laptop devices, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputer systems, mainframe computer systems, and distributed cloud computing environments including any of the above systems, etc.

[0053] Electronic devices such as terminal devices, computer systems, and servers can be described in the general context of computer system executable instructions (such as program modules) executed by a computer system. Typically, program modules can include routines, programs, object programs, components, logic, data structures, etc., which perform specific tasks or implement specific abstract data types. Computer systems / servers can be implemented in distributed cloud computing environments, where tasks are executed by remote processing devices linked through communication networks. In distributed cloud computing environments, program modules can reside on local or remote computing system storage media, including storage devices.

[0054] Exemplary methods

[0055] Figure 5 This is a flowchart illustrating a method for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions, provided by an exemplary embodiment of the present invention. This embodiment can be applied to electronic devices, such as… Figure 5 As shown, the reliability prediction method 500 for a backup power supply containing supercapacitors under extreme environmental conditions includes the following steps:

[0056] Step 501: Place the standby power supply in a preset extreme environment in a non-discharged state. After the standby power supply reaches thermal stability and voltage stability, start timing and record the test temperature state parameters and test voltage state parameters after the preset time.

[0057] Step 502: Calculate the temperature coefficient of each component of the backup power supply under extreme conditions based on the test temperature status parameters and the reference temperature of each component of the backup power supply.

[0058] Step 503: Calculate the voltage coefficient of each component of the backup power supply under extreme conditions based on the test voltage state parameters and the reference voltage of each component of the backup power supply.

[0059] Step 504: Calculate the operating failure rate of each component of the backup power supply under extreme environments based on the temperature coefficient, voltage coefficient, and reference failure rate of each component of the backup power supply.

[0060] Step 505: The failure rates of each component of the backup power supply under extreme conditions are superimposed to obtain the expected reliability results of the backup power supply.

[0061] Specifically, this invention proposes a method for predicting the reliability of backup power supplies containing supercapacitors under extreme environmental conditions by designing an extreme environment test, which can more accurately predict the reliability of backup power supplies under extreme environmental conditions. Furthermore, this invention proposes a scheme to improve the reliability of backup power supplies, which can avoid the situation where the reliability of backup power supplies is significantly reduced due to the aforementioned extreme environments.

[0062] The main purpose of the supercapacitor backup power supply reliability prediction method based on extreme environment testing disclosed in this invention application is to provide a method for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions by designing an extreme environment test.

[0063] Another objective of the supercapacitor backup power reliability prediction method based on extreme environment testing disclosed in this invention application is to propose a solution to improve the reliability of backup power supplies.

[0064] This invention provides a method for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions by designing an extreme environment test. The steps of the method are as follows:

[0065] (1) Collect relevant information on backup power sources to be anticipated.

[0066] The schematic diagram of the backup power supply is as follows: Figure 1 As shown, the input of the backup power supply can be either power frequency voltage or DC voltage, depending on the specific application scenario. Simply adjust the internal circuit to adapt to the corresponding input.

[0067] Furthermore, Figure 2 The supercapacitor in it is C1. Figure 3U1 is a DC-DC type power supply chip. R1, R2, R3, and R4 are resistors, and C2 is a supercapacitor. R1 and R2 are connected in parallel, and the two are connected in series with the EN pin of U2. The FB pin of U2 is connected in series with R3, and R3 and R4 are connected in parallel. R3 is connected in series with the back-end circuit, which implements the boost function. Figure 4 In the circuit, M1 is a rectifier bridge, U2 is a three-terminal voltage regulator type power chip, D1 is a diode, and C3 is a supercapacitor. The VIN pins of M1 and U2 are connected in series, the VOUT pin of U2 is connected in series with D1, and D1 is connected in series with C3. There is no back-end circuit.

[0068] (2) Using clips or soldering, connect a lead to the voltage output pin VOUT and the ground pin GND of the power chip. When the backup power supply is in a non-discharge state, the voltage state parameter U between the voltage output pin VOUT and the ground pin GND can be measured through the lead. out ,like Figure 2 As shown.

[0069] (3) Install thermocouples on the outer surface of the supercapacitor C1 and in the air near the circuit to read temperature status parameters at any time, including: the outer surface temperature T of the supercapacitor. cap and the air temperature T near the circuit amb .

[0070] (4) Connect the backup power supply to the mains frequency / DC voltage input normally to put the backup power supply in a non-discharged state. Then place the backup power supply in an extreme environment where the ambient temperature is equal to the upper limit of the backup power supply's extreme operating temperature range.

[0071] (5) Observe the above voltage state parameters and the above temperature state parameters. Start timing after thermal stability and voltage stability are reached respectively. Record this as 0 hours.

[0072] (6) If the timing exceeds 24 hours, it is recommended to stop timing between 48 and 96 hours. Record the above-mentioned test temperature state parameter T when timing is stopped. cap T amb Simultaneously record the above-mentioned test voltage state parameter U. out .

[0073] (7) Based on the relevant information mentioned above in (1), find the reference failure rate λ of each component such as supercapacitor and power chip in the backup power supply. ref Reference temperature T ref and reference voltage U ref Temperature coefficient formula π T (T)=f T (T,T ref Voltage coefficient formula π U (U)=f U (U,Uref ).

[0074] (8) The test temperature state parameter T at the time of stopping the timing. cap or T amb (Specific temperature parameters should be used for specific component analysis) and the above reference temperature T ref Substituting into the above temperature coefficient formula, we can obtain the temperature coefficient π for the above extreme environment. T The voltage state parameter U mentioned above out and the aforementioned reference voltage U ref Substituting into the voltage coefficient formula above, the voltage coefficient π for the aforementioned extreme environment can be obtained. U The aforementioned reference failure rate λ ref The above temperature coefficient π T The voltage coefficient π mentioned above U Substitute into the failure rate formula λ op =λ ref π T π U The failure rate λ of the components under the above extreme environment can be obtained. op .

[0075] (9) Since the backup power supply does not have redundant components, all the above-mentioned related components are in series. The expected reliability calculation result of the backup power supply is λ. 备用 =∑λ op .

[0076] On the other hand, this invention proposes a solution to improve the reliability of backup power supplies; a simplified circuit diagram is shown below. Figure 6 C3 is a supercapacitor, and D3 is a Zener diode. C3 and D2 are connected in parallel. This design incorporates a Zener diode connected in parallel after the supercapacitor. The Zener voltage parameter of this diode should be higher than the operating voltage of the supercapacitor. When the actual operating voltage of the supercapacitor rises to the Zener voltage of the diode, the Zener diode will break down, releasing energy and ensuring that the actual operating voltage of the supercapacitor does not exceed the Zener voltage of the diode.

[0077] Furthermore, the present invention is described in terms of the reliability prediction of the backup power supply of the communication unit module, but is not limited to the backup power supply of metering devices such as the communication unit module and smart energy meters.

[0078] 1. The main objective of this invention is to provide a method for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions by designing an extreme environment test. The backup power supply circuit of the embodiment is as follows: Figure 2 As shown.

[0079] In this embodiment, the output voltage of the DC-DC power supply chip is designed to be 2.67V, and the rated voltage of the supercapacitor is 2.7V. Since the upper limit of the extreme operating temperature range of the communication unit module is 70℃, the communication unit module is placed in an extreme environment of 70℃ for normal operation, and the temperature and voltage status parameters are measured and recorded from 0 hours to 96 hours.

[0080] Tests revealed that as the extreme environment testing time accumulated, the operating voltage of the supercapacitor gradually increased and stabilized after 72 hours. At this point, the reliability prediction based on the 72-hour state parameters was closer to the actual value of the backup power supply under extreme conditions compared to the 0-hour state parameters. Comparing the reliability predictions of related components at 0 and 72 hours, the failure rate of the supercapacitor showed the largest change. This is because the reliability of the supercapacitor is most sensitive to changes in operating voltage; therefore, this embodiment only shows the failure rate of the supercapacitor. Table 1 shows the records of the supercapacitor's temperature and operating voltage (i.e., the output voltage of the DC-DC type power chip) between 0 and 96 hours. The calculation process is as follows:

[0081] Table 1 Record of supercapacitor state parameters

[0082]

[0083] (1) Find the reference failure rate λ of the supercapacitor by searching SN-29500. ref =5 FIT, reference temperature 40℃, reference voltage 2.16V (0.8 times rated voltage), refer to IEC 61709 for the temperature coefficient formula, voltage coefficient formula, and the supercapacitor operating failure rate calculation formula λ. op =λ ref π T π U .

[0084] (2) When the working voltage of the supercapacitor is not considered to gradually increase with the accumulation of deviation over time, the state parameter at 0 hours is taken as π at 78℃. T =12.4, 2.7V when π U =1.3. The failure rate λ of a supercapacitor is... op (0h) = 80.6 FIT, corresponding to reliable lifetime t 0.95 ≈73 years.

[0085] (3) Taking into account the deviation of the supercapacitor's operating voltage, the state parameters for 72 hours are taken as follows: at 79℃, π T =13.2, 3.1V when π U =1.6. The failure rate λ of a supercapacitor is... op(72h) = 105.6 FIT, corresponding to reliable lifetime t 0.95 ≈55 years. The expected reliability results differ by 18 years between using and not using extreme environment testing.

[0086] 2. Another objective of this invention is to propose a solution for improving the reliability of backup power supplies. The circuit diagram of an embodiment is shown below. Figure 6 As shown.

[0087] After installing the Zener diode, the temperature status parameters were taken over 72 hours: at 78℃, π T =12.4, because the voltage is controlled at 2.7V, therefore π U =1.3. The failure rate λ of a supercapacitor is... op =85.8 FIT, the calculated failure rate λ of the additional Zener diode at an ambient temperature of 70°C is... opZ =3.7 FIT. The sum of failure rates λ = 89.5 FIT, corresponding to a reliable lifetime t. 0.95 ≈65 years. The reliability forecast has improved by nearly 10 years.

[0088] Therefore, this invention provides a method for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions by designing an extreme environment test. This method takes into account the factor that the state parameters will gradually deviate over time, thereby enabling a more accurate prediction of the backup power supply's reliability.

[0089] Exemplary device

[0090] Figure 7 This is a schematic diagram of a device for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions, provided in an exemplary embodiment of the present invention. Figure 7 As shown, the device 700 includes:

[0091] The recording module 710 is used to place the backup power supply in a preset extreme environment in a non-discharged state. After the backup power supply reaches thermal stability and voltage stability, the timing starts and the test temperature state parameters and test voltage state parameters are recorded after the preset time.

[0092] The first calculation module 720 is used to calculate the temperature coefficient of each component of the backup power supply under extreme environments based on the test temperature state parameters and the reference temperature of each component of the backup power supply.

[0093] The second calculation module 730 is used to calculate the voltage coefficient of each component of the backup power supply under extreme conditions based on the test voltage state parameters and the reference voltage of each component of the backup power supply.

[0094] The third calculation module 740 is used to calculate the operating failure rate of each component of the backup power supply under extreme environments based on the temperature coefficient, voltage coefficient and reference failure rate of each component of the backup power supply.

[0095] Module 750 is obtained, which is used to superimpose the failure rates of various components of the backup power supply under extreme environments to obtain the expected reliability results of the backup power supply.

[0096] Exemplary electronic devices

[0097] Figure 8 This is the structure of an electronic device provided in an exemplary embodiment of the present invention. For example... Figure 8 As shown, the electronic device 80 includes one or more processors 81 and memory 82.

[0098] The processor 81 may be a central processing unit (CPU) or other form of processing unit with data processing capabilities and / or instruction execution capabilities, and may control other components in the electronic device to perform desired functions.

[0099] The memory 82 may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program instructions may be stored on the computer-readable storage medium, and the processor 81 may execute the program instructions to implement the methods of the software programs of the various embodiments of the present invention described above, and / or other desired functions. In one example, the electronic device may also include an input device 83 and an output device 84, these components being interconnected via a bus system and / or other forms of connection mechanisms (not shown).

[0100] In addition, the input device 83 may also include, for example, a keyboard, a mouse, etc.

[0101] The output device 84 can output various information to the outside. The output device 84 may include, for example, a display, a speaker, a printer, and a communication network and its connected remote output devices, etc.

[0102] Of course, for the sake of simplicity, Figure 8 Only some of the components of this electronic device relevant to the present invention are shown, omitting components such as buses, input / output interfaces, etc. In addition, the electronic device may include any other suitable components depending on the specific application.

[0103] Exemplary computer program products and computer-readable storage media

[0104] In addition to the methods and apparatus described above, embodiments of the present invention may also be computer program products, which include computer program instructions that, when executed by a processor, cause the processor to perform the steps in the methods according to various embodiments of the present invention described in the "Exemplary Methods" section above.

[0105] The computer program product can be written in any combination of one or more programming languages ​​to perform the operations of the embodiments of the present invention. The programming languages ​​include object-oriented programming languages ​​such as Java and C++, as well as conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0106] Furthermore, embodiments of the present invention may also be computer-readable storage media storing computer program instructions thereon, which, when executed by a processor, cause the processor to perform the steps of the methods according to various embodiments of the present invention described in the "Exemplary Methods" section above.

[0107] The computer-readable storage medium may be any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may be, for example, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or any combination thereof. More specific examples (a non-exhaustive list) of readable storage media include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof.

[0108] The basic principles of the present invention have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in the present invention are merely examples and not limitations, and should not be considered as essential features of each embodiment of the present invention. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the present invention to the necessity of employing the aforementioned specific details.

[0109] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For system embodiments, since they largely correspond to method embodiments, the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0110] The block diagrams of devices, systems, devices, and systems involved in this invention are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, systems, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0111] The methods and systems of the present invention may be implemented in many ways. For example, they may be implemented by software, hardware, firmware, or any combination of software, hardware, and firmware. The above-described order of steps for the methods is for illustrative purposes only, and the steps of the methods of the present invention are not limited to the order specifically described above unless otherwise specifically stated. Furthermore, in some embodiments, the present invention may also be implemented as a program recorded on a recording medium, the program comprising machine-readable instructions for implementing the methods according to the present invention. Thus, the present invention also covers recording media storing programs for performing the methods according to the present invention.

[0112] It should also be noted that in the systems, apparatus, and methods of the present invention, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered equivalents of the present invention. The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the invention. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of the invention. Therefore, the invention is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0113] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the invention to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A method for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions, characterized in that, include: The backup power supply in a non-discharged state is placed in a preset extreme environment. After the backup power supply reaches thermal and voltage stability, timing is started, and the test temperature and test voltage parameters are recorded after a preset time. The temperature coefficients of each component of the backup power supply under extreme environments are calculated based on the test temperature parameters and the reference temperatures of each component. Calculate the voltage coefficient of each component of the backup power supply under extreme conditions based on the test voltage state parameters and the reference voltage of each component of the backup power supply; Based on the temperature coefficient, voltage coefficient, and reference failure rate of each component of the backup power supply, calculate the operating failure rate of each component of the backup power supply under extreme environments. The failure rates of each component of the backup power supply under extreme conditions are superimposed to obtain the expected reliability result of the backup power supply.

2. The method according to claim 1, characterized in that, The backup power supply in its non-discharged state is placed in a preset extreme environment, including: Connect the power frequency / DC voltage input of the backup power supply to put the backup power supply in a non-discharge state; The backup power supply in the non-discharged state is placed in a preset extreme environment.

3. The method according to claim 1, characterized in that, The test temperature parameters include the surface temperature of the test supercapacitor and the test air temperature.

4. The method according to claim 3, characterized in that, Once the backup power supply reaches thermal and voltage stability, timing begins, and the test temperature and voltage parameters are recorded after a preset time, including: The real-time surface temperature of the supercapacitor and the real-time air temperature are obtained by thermocouples installed on the supercapacitor surface of the backup power supply and at preset locations in the environment where the backup power supply is located. The real-time voltage status parameters of the backup power supply are obtained in real time through the leads brought out from the voltage pins of the power chip in the backup power supply. Observe the real-time surface temperature of the supercapacitor, the real-time air temperature, and the real-time voltage status parameters of the backup power supply under extreme conditions, and start timing after stabilization; Record the surface temperature of the supercapacitor, the temperature of the test air, and the state parameters of the test voltage after the preset time test ends.

5. The method according to claim 4, characterized in that, Based on the test temperature parameters and the reference temperatures of each component of the backup power supply, the temperature coefficients of each component under extreme environments are calculated, including: The temperature coefficients of each component of the backup power supply under extreme environments are calculated based on the surface temperature of the supercapacitor under test, the test air temperature, and the reference temperatures of each component of the backup power supply.

6. A device for predicting the reliability of a backup power supply containing a supercapacitor under extreme environmental conditions, characterized in that, include: The recording module is used to place the backup power supply in a preset extreme environment when it is not in a discharged state. After the backup power supply reaches thermal stability and voltage stability, the timing starts and the test temperature state parameters and test voltage state parameters are recorded after a preset time. The first calculation module is used to calculate the temperature coefficient of each component of the backup power supply under extreme environment based on the test temperature state parameters and the reference temperature of each component of the backup power supply. The second calculation module is used to calculate the voltage coefficient of each component of the backup power supply under extreme conditions based on the test voltage state parameters and the reference voltage of each component of the backup power supply. The third calculation module is used to calculate the operating failure rate of each component of the backup power supply under extreme environments based on the temperature coefficient, the voltage coefficient, and the reference failure rate of each component of the backup power supply. The module is used to superimpose the failure rates of each component of the backup power supply under extreme environments to obtain the expected reliability result of the backup power supply.

7. The apparatus according to claim 6, characterized in that, The recording module places the backup power supply in a preset extreme environment when it is not discharging, including: The connection submodule is used to connect to the power frequency / DC voltage input of the backup power supply, so that the backup power supply is in a non-discharge state; A placement submodule is used to place the backup power supply in the non-discharged state within a preset extreme environment.

8. The apparatus according to claim 6, characterized in that, The test temperature parameters include the surface temperature of the test supercapacitor and the test air temperature.

9. A computer-readable storage medium, characterized in that, The storage medium stores a computer program for performing the method described in any one of claims 1-5.

10. An electronic device, characterized in that, The electronic device includes: processor; Memory used to store the processor's executable instructions; The processor is configured to read the executable instructions from the memory and execute the instructions to implement the method described in any one of claims 1-5.

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