Electronic device

Abstract

The invention provides an electronic device, the electronic device comprises a conductive shell, a conductive part and a non-conductive support, the conductive part is embedded in the non-conductive support, the conductive part is electrically connected with the conductive shell, the conductive part and the conductive shell are enclosed to form a cavity antenna with a gap structure, and the cavity antenna carries out signal radiation through the gap structure. According to the invention, in the cavity antenna structure formed by the electronic equipment, the conductive part is embedded in the non-conductive support, the non-conductive support is reused, the stacking space is utilized to the maximum extent, and the cost of the antenna is reduced. In addition, the conductive part is embedded in the non-conductive support, so that the structure reliability is good, and the antenna grounding device can be suitable for grounding schemes of various cavity antennas.

Description

Technical Field

[0001] This application relates to the field of wireless communication, and more particularly to an electronic device. Background Technology

[0002] Electronic devices can achieve communication functions through antennas. To pursue a premium look and a slim, lightweight experience, tablets and other electronic devices have increasingly adopted unibody metal designs. For all-metal tablets, a cavity antenna solution is typically used to achieve communication, radiating signals through the black border area of ​​the screen, thus resolving the conflict between the all-metal aesthetic and antenna radiation performance. However, existing cavity antenna solutions are relatively expensive to manufacture, and the structural stability and reliability of cavity antennas cannot be guaranteed. Summary of the Invention

[0003] This application provides an electronic device that can reduce the manufacturing cost of cavity antennas in electronic devices and improve the structural stability and reliability of cavity antennas.

[0004] In a first aspect, an electronic device is provided, comprising a conductive housing, a conductive component, and a non-conductive support, wherein the conductive component is embedded in the non-conductive support, the conductive component is electrically connected to the conductive housing, and the conductive component and the conductive housing enclose a cavity antenna with a slot structure, the cavity antenna radiating signals through the slot structure.

[0005] For example, the conductive shell can be made of metal (such as magnesium alloy, titanium alloy, aluminum-magnesium alloy, etc.) or other non-metallic conductive materials (such as carbon fiber); the conductive component can be made of metal (such as steel sheet, aluminum sheet, copper sheet, etc.) or other non-metallic conductive materials (such as carbon fiber); the non-conductive support can be made of non-metallic materials, such as plastic.

[0006] For example, conductive components can be embedded in non-conductive supports through processes such as hot-melt or injection molding.

[0007] It should be understood that the conductive housing can be the outer shell of an electronic device or the middle frame of an electronic device, and this application does not limit it in this regard.

[0008] It should be understood that conductive components can function as antennas. Cavity antennas can radiate various signals outward through slot structures. Specifically, cavity antennas (also known as cavity slot antennas) can radiate signals through slot structures and the black border area of ​​the screen.

[0009] For example, the electronic device also includes a screen assembly, which includes a display layer, and the conductive housing includes a bezel and a back cover. A black border area is formed between the outer edge of the display layer and the inner wall of the bezel, and the projection of the slit structure onto the plane of the display layer is located within the black border area.

[0010] In this embodiment, the conductive component is electrically connected to the conductive housing, forming a cavity antenna with a slotted structure. The electronic device can radiate signals outward through the slotted structure of the cavity antenna. Furthermore, by embedding the conductive component within a non-conductive support, a conformal cavity antenna structure is formed, maximizing the use of stacking space, improving the overall stacking space utilization, and resolving the conflict between the cavity antenna and the plastic retaining strip. In addition, by reusing existing non-conductive support structural components, the manufacturing cost of the cavity antenna can be reduced. Moreover, by embedding the conductive component within the non-conductive support, the non-conductive support can serve as a support structure for the conductive component, while the conductive component can also enhance the strength of the non-conductive support. This results in good structural stability and reliability for the cavity antenna, making it suitable for various cavity antenna grounding schemes.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the electronic device further includes a motherboard, a first connector, and a second connector, wherein the conductive component is electrically connected to the motherboard via the first connector, and the motherboard is electrically connected to the conductive housing via the second connector.

[0012] The first and second connectors can be electrical connectors such as springs or foam.

[0013] In this embodiment, the cavity antenna can be formed in the PCB area of ​​the electronic device, that is, the conductive component and the projection of the motherboard along the first direction (i.e., the thickness direction of the electronic device) at least partially overlap. In this case, the conductive component can be electrically connected to the motherboard through a first connector, and the motherboard can be connected to the conductive housing through a second connector, so that the conductive component, the motherboard, and the conductive housing can form a cavity antenna with a slotted structure.

[0014] In conjunction with the first aspect, in some implementations of the first aspect, the first connector includes a power feed spring and a ground spring, the power feed spring being used to feed in radio frequency signals, and the ground spring being used to achieve an electrical connection between the conductive element and the motherboard.

[0015] For example, a cavity antenna can be fed with radio frequency signals via a feeding spring and electrically connected to the motherboard via a grounding spring, thereby achieving a grounding effect. For instance, the grounding spring can be positioned along the long side of the conductive component (the side furthest from the frame), thus grounding one side of the cavity antenna. Alternatively, the grounding spring can be positioned along the long side and two short sides of the conductive component, thus grounding all three sides of the cavity antenna.

[0016] In conjunction with the first aspect, in some implementations of the first aspect, the metal casing further includes a frame, the power supply spring is disposed close to the frame, and the grounding spring is disposed away from the frame.

[0017] For example, the frame of the conductive housing (such as the four sides) can serve as the antenna radiating edges. When the cavity antenna is formed on the long or short side of the electronic device, the feed spring can be positioned close to the long side of the electronic device, and the grounding spring can be positioned away from the long side of the electronic device. When the cavity antenna is formed at the four corners of the electronic device, the feed spring can be positioned close to the two antenna radiating edges, and the grounding spring can be positioned away from the antenna radiating edges (i.e., close to the non-radiating edges), for example, it can be positioned on the side of the motherboard away from the two antenna radiating edges. Here, the antenna radiating edge refers to the edge where the antenna can radiate outwards; the non-radiating edge is the edge that does not radiate electromagnetic waves. Therefore, the non-radiating edge needs to be grounded through the grounding spring to achieve a complete electrical connection and form an electrical barrier as much as possible to prevent electromagnetic radiation and leakage.

[0018] It should be understood that placing the feed spring close to the antenna radiation edge is not necessary. From a practical evaluation perspective, placing the feed spring on the antenna radiation edge results in a better antenna impedance (close to 50 ohms), thus reducing return loss and minimizing input power reflection.

[0019] In conjunction with the first aspect, in some implementations of the first aspect, a metal groove is provided on the conductive element, and the metal groove is located between the power feeding spring and the grounding spring.

[0020] In this embodiment, by setting a metal groove on the conductive component, and the metal groove being located between the feed spring and the ground spring, the length of the current path between the feed spring and the ground spring can be controlled by the length of the metal groove, thereby achieving the effect of adjusting the antenna impedance.

[0021] In conjunction with the first aspect, in some implementations of the first aspect, the electronic device further includes a motherboard and a signal transmission line, wherein the conductive component is electrically connected to the motherboard via the signal transmission line. For example, the signal transmission line may be a coaxial cable, i.e., a cable wire.

[0022] It should be understood that signal transmission lines are used to transmit radio frequency (RF) signals between the cavity antenna and the chips on the motherboard. In other words, the cavity antenna can be fed using a cable. The signal transmission line can transmit RF signals from the chips on the motherboard to the cavity antenna, or vice versa.

[0023] In this embodiment, the cavity antenna can be formed in a non-PCB area of ​​the electronic device, i.e., the projection of the conductive component onto the motherboard along a first direction (i.e., the thickness direction of the electronic device) does not overlap. In this case, the conductive component can be electrically connected to the motherboard via a signal transmission line, and simultaneously electrically connected to the conductive housing, thereby forming a cavity antenna with a slotted structure between the conductive component and the conductive housing.

[0024] In conjunction with the first aspect, in some implementations of the first aspect, the electronic device further includes a third connector connected between the conductive element and the conductive housing.

[0025] In the embodiments of this application, the conductive component and the conductive housing can be electrically connected by a third connector (such as foam or spring), thereby enabling the conductive component and the conductive housing to form a cavity antenna structure.

[0026] In conjunction with the first aspect, in some implementations of the first aspect, a metal groove is formed on the conductive element. The metal groove can be used to adjust the impedance of the cavity antenna.

[0027] In this embodiment, when the cavity antenna is formed in a non-PCB area of ​​the electronic device, a metal groove can also be formed on the conductive component. The length of the metal groove can control the length of the current path between the power supply and the conductive shell, thereby achieving the effect of adjusting the antenna impedance.

[0028] In conjunction with the first aspect, in some implementations of the first aspect, the metal groove divides the conductive element into a first part and a second part; the signal transmission line includes a core, an outer conductor, and a transmission line, the core being connected to the first part, the outer conductor being connected to the second part, one end of the transmission line being connected to the core and the outer conductor, and the other end of the transmission line being connected to the motherboard.

[0029] In this embodiment of the application, when connecting a signal transmission line (such as a cable) to a conductive component, the outer conductor of the cable can be soldered to the bottom of the metal groove, and the core of the cable can be soldered to the top of the metal groove, thereby simplifying the installation process of the signal transmission line.

[0030] In conjunction with the first aspect, in some implementations of the first aspect, the electronic device further includes an isolator embedded in the non-conductive support and located on one or both sides of the conductive element.

[0031] For example, the insulating element can be embedded in a non-conductive support through a hot-melt process or injection molding process.

[0032] Considering that side-open cavity antennas are prone to clutter issues in the overall system environment, this application addresses this by incorporating an isolator and positioning it on one or both sides of the cavity antenna. This suppresses electromagnetic radiation from the side of the cavity antenna, preventing antenna clutter and improving antenna efficiency. Furthermore, embedding the isolator within a non-conductive support also enhances the structural strength of the non-conductive support.

[0033] In conjunction with the first aspect, in some implementations of the first aspect, one end of the isolator is electrically connected to the screen assembly, and the other end of the isolator is electrically connected to the conductive housing.

[0034] In the embodiments of this application, for cases where the cavity antenna is formed in a non-PCB area of ​​an electronic device, one end of the isolation component provided in this application can be electrically connected to the screen assembly, and the other end can be electrically connected to the conductive housing, forming a metal barrier structure from the screen assembly to the conductive housing, constructing an electric wall on the side. The electromagnetic field strength of the electric wall is zero, thereby blocking the electromagnetic field from radiating to the side, and can play the role of an electromagnetic isolation barrier.

[0035] In conjunction with the first aspect, in some implementations of the first aspect, one end of the isolator is electrically connected to the screen assembly, the other end of the isolator is electrically connected to the motherboard, and the motherboard is electrically connected to the conductive housing.

[0036] In the embodiments of this application, for cases where the cavity antenna is formed in the PCB area of ​​an electronic device, one end of the isolation component provided in this application can be electrically connected to the screen assembly, and the other end can be electrically connected to the motherboard. The motherboard is then electrically connected to the conductive shell, which can also form a metal barrier structure from the screen assembly to the conductive shell, constructing an electric wall on the side. The electromagnetic field strength of the electric wall is zero, thereby blocking the electromagnetic field from radiating to the side, and can play the role of an electromagnetic isolation barrier.

[0037] Secondly, an electronic device is provided, comprising a conductive housing, a conductive component, and a non-conductive support. The conductive component is embedded in the non-conductive support, and the distance between the conductive component and the conductive housing is less than a first threshold. The conductive component and a portion of the conductive housing form a cavity antenna with a slot structure, and the cavity antenna radiates signals through the slot structure. For example, the first threshold can be 0.5 mm.

[0038] For example, the conductive shell can be made of metal (such as magnesium alloy, titanium alloy, aluminum-magnesium alloy, etc.) or other non-metallic conductive materials (such as carbon fiber); the conductive component can be made of metal (such as steel sheet, aluminum sheet, copper sheet, etc.) or other non-metallic conductive materials (such as carbon fiber); the non-conductive support can be made of non-metallic materials, such as plastic.

[0039] For example, conductive components can be embedded in non-conductive supports through processes such as hot-melt or injection molding.

[0040] It should be understood that the conductive housing can be the outer shell of an electronic device or the middle frame of an electronic device, and this application does not limit it in this regard.

[0041] It should be understood that conductive components can function as antennas. Cavity antennas can radiate various signals outward through slot structures. Specifically, cavity antennas (also known as cavity slot antennas) can radiate signals through slot structures and the black border area of ​​the screen.

[0042] For example, the electronic device also includes a screen assembly, which includes a display layer, and the conductive housing includes a bezel and a back cover. A black border area is formed between the outer edge of the display layer and the inner wall of the bezel, and the projection of the slit structure onto the plane of the display layer is located within the black border area.

[0043] In this embodiment, the conductive component and the conductive housing do not need to be electrically connected. Instead, by limiting the distance between the conductive component and the conductive housing, an approximate grounding effect is achieved, thereby reducing the use of electrical connectors and saving costs. The two can form a cavity antenna with a slotted structure, allowing electronic devices to radiate signals outward through the slotted structure of the cavity antenna. By embedding the conductive component within a non-conductive support, a conformal cavity antenna structure is formed, maximizing the use of stacking space, improving the overall stacking space utilization rate, and resolving the problem of stacking conflicts between the cavity antenna and the plastic retaining strip. Furthermore, by reusing existing non-conductive support structural components, the manufacturing cost of the cavity antenna can also be reduced. Additionally, by embedding the conductive component within the non-conductive support, the non-conductive support can serve as a support structure for the conductive component, while the conductive component can also enhance the strength of the non-conductive support. The cavity antenna exhibits good structural stability and reliability, making it suitable for various cavity antenna grounding schemes.

[0044] In conjunction with the second aspect, in some implementations of the second aspect, the length of the projection of the conductive element onto the first plane is greater than a second threshold, and / or the width of the projection of the conductive element onto the first plane is greater than a third threshold, and the first plane is perpendicular to the thickness direction of the electronic device.

[0045] It should be understood that the coupling capacitance C between the conductive component and the conductive shell is related to the length L, width D of the conductive component, and distance d between the conductive component and the conductive shell. Furthermore, the coupling capacitance C is directly proportional to L and D, and inversely proportional to d. Therefore, increasing L and D and decreasing d can increase the coupling capacitance C. When C is sufficiently large, a current path can be formed, allowing an equivalent cavity structure to be formed between the conductive component and the conductive shell, creating a cavity antenna (or cavity slot antenna). This also simplifies the electrical connections, saves costs, and simplifies the structure.

[0046] In conjunction with the second aspect, in some implementations of the second aspect, the electronic device further includes a motherboard and a signal transmission line, wherein the conductive component is electrically connected to the motherboard via the signal transmission line.

[0047] For example, the signal transmission line can be a coaxial cable, i.e., a cable line.

[0048] It should be understood that signal transmission lines are used to transmit radio frequency (RF) signals between the cavity antenna and the chips on the motherboard. In other words, the cavity antenna can be fed using a cable. The signal transmission line can transmit RF signals from the chips on the motherboard to the cavity antenna, or vice versa.

[0049] In this embodiment, the conductive component can be electrically connected to the motherboard via a signal transmission line, and simultaneously electrically connected to the conductive housing, thereby enabling the conductive component and the conductive housing to form a cavity antenna with a slotted structure.

[0050] In conjunction with the second aspect, in some implementations of the second aspect, a metal groove is formed on the conductive element. The metal groove is used to adjust the impedance of the cavity antenna.

[0051] In this embodiment, when the cavity antenna is formed in a non-PCB area of ​​the electronic device, a metal groove can also be formed on the conductive component. The length of the metal groove can control the length of the current path between the power supply and the conductive shell, thereby achieving the effect of adjusting the antenna impedance.

[0052] In conjunction with the second aspect, in some implementations of the second aspect, the metal groove divides the conductive element into a first part and a second part; the signal transmission line includes a core, an outer conductor, and a transmission line, the core is connected to the first part, the outer conductor is connected to the second part, one end of the transmission line is connected to the core and the outer conductor, and the other end of the transmission line is connected to the motherboard.

[0053] In this embodiment of the application, when connecting a signal transmission line (such as a cable) to a conductive component, the outer conductor of the cable can be soldered to the bottom of the metal groove, and the core of the cable can be soldered to the top of the metal groove, thereby simplifying the installation process of the signal transmission line.

[0054] In conjunction with the second aspect, in some implementations of the second aspect, the electronic device further includes an isolator embedded in the non-conductive support and located on one or both sides of the conductive element.

[0055] For example, the insulating element can be embedded in a non-conductive support through a hot-melt process or injection molding process.

[0056] Considering that side-open cavity antennas are prone to clutter issues in the overall system environment, this application addresses this by incorporating an isolator and positioning it on one or both sides of the cavity antenna. This suppresses electromagnetic radiation from the side of the cavity antenna, preventing antenna clutter and improving antenna efficiency. Furthermore, embedding the isolator within a non-conductive support also enhances the structural strength of the non-conductive support.

[0057] In conjunction with the second aspect, in some implementations of the second aspect, one end of the isolator is electrically connected to the screen assembly, and the other end of the isolator is electrically connected to the conductive housing.

[0058] In this embodiment of the application, for cases where the cavity antenna is formed in a non-PCB area of ​​an electronic device, one end of the isolation component provided in this application can be electrically connected to the screen assembly, and the other end can be electrically connected to the conductive housing, forming a current path metal barrier structure from the screen assembly to the conductive housing, constructing an electric wall on the side. The electromagnetic field strength of the electric wall is zero, thereby blocking the electromagnetic field from radiating to the side, and can play the role of an electromagnetic isolation barrier.

[0059] In conjunction with the second aspect, in some implementations of the second aspect, one end of the isolator is electrically connected to the screen assembly, the other end of the isolator is electrically connected to the motherboard, and the motherboard is electrically connected to the conductive housing.

[0060] In the embodiments of this application, for cases where the cavity antenna is formed in the PCB area of ​​an electronic device, one end of the isolation component provided in this application can be electrically connected to the screen assembly, and the other end can be electrically connected to the motherboard. The motherboard is then electrically connected to the conductive shell, which can also form a metal barrier structure from the screen assembly to the conductive shell, constructing an electric wall on the side. The electromagnetic field strength of the electric wall is zero, thereby blocking the electromagnetic field from radiating to the side, and can play the role of an electromagnetic isolation barrier. Attached Figure Description

[0061] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application.

[0062] Figure 2 This is a cross-sectional view of the structure of a cavity antenna shown in an embodiment of this application.

[0063] Figure 3 This is a layout of a cavity antenna and a cross-sectional view of the cavity antenna structure shown in an embodiment of this application.

[0064] Figure 4 These are two antenna grounding schemes provided in the embodiments of this application.

[0065] Figure 5 This is a schematic diagram of the installation position of an antenna structure provided in an embodiment of this application.

[0066] Figure 6 This is a schematic diagram of the overall structure of an antenna structure provided in an embodiment of this application.

[0067] Figure 7 yes Figure 6 The antenna structure shown is a cross-sectional view along the yz plane.

[0068] Figure 8 yes Figure 6 The antenna structure shown is a cross-sectional view along the xz plane.

[0069] Figures 9 to 12 It shows Figure 6 The antenna structure shown is a partial structure.

[0070] Figure 13 This is a schematic diagram showing the installation position of another antenna structure provided in an embodiment of this application.

[0071] Figure 14 yes Figure 13 A schematic diagram showing the placement of the first connector in the layout shown.

[0072] Figure 15 This is a schematic diagram showing the installation position of another antenna structure provided in an embodiment of this application.

[0073] Figure 16 This is a schematic diagram of the overall structure of another antenna structure provided in the embodiments of this application.

[0074] Figure 17 yes Figure 16 The antenna structure shown is a cross-sectional view along the CC' plane.

[0075] Figures 18 to 21 It shows Figure 16 The antenna structure shown is a partial structure.

[0076] Figure 22 These are schematic diagrams of two antenna structures provided in the embodiments of this application.

[0077] Figure 23 yes Figure 16 The antenna structure 400 shown is a cross-sectional view along the DD' plane.

[0078] Figure 24 and Figure 25 These are two cross-sectional views of the isolation component in the yz plane.

[0079] Figure 26 and Figure 27 These are two cross-sectional views of the separator in the xy plane.

[0080] Figure 28 and Figure 29This is a comparison image showing the effect before and after setting up the isolation element. Detailed Implementation

[0081] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0082] It should be noted that, in the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in this article is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0083] In the embodiments of this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more, and "at least one" and "one or more" refer to one, two, or more than two. The singular expressions "a," "an," "the," "the," "this," and "this" are intended to also include expressions such as "one or more," unless the context explicitly indicates otherwise.

[0084] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0085] In the description of the embodiments of this application, the terms "upper," "lower," "inner," "outer," "vertical," and "horizontal," etc., indicate orientations or positional relationships relative to the indicated placement of components in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and not to indicate or imply a specific orientation that the device or component must have, or its construction and operation in a specific orientation. They can change accordingly depending on the orientation of the components in the accompanying drawings, and therefore should not be construed as limiting this application. Furthermore, "vertical" in this application is not strictly vertical, but within the allowable error range. "Parallel" is not strictly parallel, but within the allowable error range.

[0086] In the embodiments of this application, the same reference numerals are used to denote the same component or part. For the same part in the embodiments of this application, only one part or component may be labeled with reference numerals in the figures. It should be understood that the reference numerals also apply to other identical parts or components. In addition, the various parts in the figures are not drawn to actual scale, and the dimensions and sizes of the parts shown in the figures are only exemplary and should not be construed as limiting this application.

[0087] This application defines a coordinate system for the accompanying drawings. The x, y, and z directions are mutually perpendicular. The z direction can be understood as the thickness direction of the electronic device, the y direction as the width direction of the electronic device, and the x direction as the length direction of the electronic device; alternatively, the y direction can be understood as the length direction of the electronic device, and the x direction as the width direction of the electronic device. For example, in this application embodiment, the structure of the electronic device is described using the x direction as the length direction, the y direction as the width direction, and the z direction as the thickness direction.

[0088] Figure 1 A schematic structural diagram of an electronic device to which embodiments of this application are applicable is shown.

[0089] In this embodiment, the electronic device 100 is an electronic device with communication capabilities. The communication technologies employed by the electronic device 100 include, but are not limited to, Bluetooth (BT) communication technology, Global Positioning System (GPS) communication technology, Wireless Fidelity (Wi-Fi) communication technology, Global System for Mobile Communications (GSM) communication technology, Wideband Code Division Multiple Access (WCDMA) communication technology, Long Term Evolution (LTE) communication technology, 5th Generation (5G) communication technology, SUB-6G communication technology (also known as low-to-mid-band spectrum communication technology or centimeter-wave communication technology, where SUB-6G refers to the frequency band below 6 GHz in 5G), millimeter-wave (mmW) communication technology, 6th Generation (6G) communication technology, and other future communication technologies.

[0090] The electronic device 100 in this application embodiment can be a mobile phone, a personal digital assistant (PDA) computer, a tablet computer, a laptop computer, a laptop computer, an ultra-mobile personal computer (UMPC), a netbook, a smartwatch, a smart wristband, an in-vehicle computer, a television (or smart screen), an augmented reality (AR) / virtual reality (VR) device, a wearable device, a wireless headset, etc., or other handheld devices, computing devices, or processing devices connected to a wireless modem, in-vehicle devices, etc. This application embodiment does not impose special limitations on the specific form of the electronic device 100. For ease of explanation and understanding, the following description uses a tablet as an example for the electronic device 100.

[0091] like Figure 1 As shown, the electronic device 100 may include a display screen 11 and a housing 12. The cavity formed by the display screen 11 and the housing 12 can accommodate electronic components such as speakers, cameras, microphones, sensors, memory, processors, and batteries.

[0092] For example, electronic device 100 may also include a cover, a printed circuit board (PCB), a middle frame, a rear cover, and an antenna, etc.

[0093] The cover plate can cover the surface of the display screen 11 and is set in close contact with the display screen 11, mainly for protecting the display screen 11 and preventing dust. In some embodiments, the cover plate can be a glass cover plate, or it can be replaced with a cover plate made of other materials, such as a cover plate made of polyethylene terephthalate (PET).

[0094] The display screen 11 is used to display images. In one embodiment, the display screen 11 may include a liquid crystal display (LCD), a light emitting diode (LED) display panel, an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, a flexible light-emitting diode (FLED) display panel, a quantum dot light-emitting diode (QLED) display panel, etc., and this application embodiment does not limit this.

[0095] The mid-frame is a supporting frame located inside the electronic device, primarily serving to support the entire device. For example, the mid-frame can be used to support and secure the display screen 11. Exemplarily, the mid-frame can be formed from metallic materials such as copper, magnesium alloy, stainless steel, etc.

[0096] A printed circuit board (also known as a motherboard) is the support structure for electronic components and serves as the carrier for their electrical connections. These electronic components can include, but are not limited to, capacitors, inductors, resistors, processors, radio frequency chips, cameras, flashlights, microphones, and batteries. Printed circuit boards can be made of flame-retardant (FR-4) dielectric substrates, Rogers dielectric substrates (a type of high-frequency board), or hybrid dielectric substrates of Rogers and FR-4, etc.

[0097] In one embodiment, a metal layer may be disposed on the printed circuit board. This metal layer can be used to ground electronic components carried on the printed circuit board, or to ground other components such as bracket antennas, frame antennas, etc. This metal layer may be referred to as a ground plane, grounding plate, or grounding layer. In one embodiment, the metal layer can be formed by etching metal onto the surface of any dielectric layer in the printed circuit board. In one embodiment, the grounding metal layer may be disposed on the side of the printed circuit board near the middle frame. In one embodiment, the edge of the printed circuit board can be considered as the edge of its grounding layer. In one embodiment, the metal middle frame can also be used to ground the aforementioned components. The electronic device 100 may also have other ground planes / grounding plates, as previously described, and will not be repeated here.

[0098] In some embodiments, the electronic device 100 may further include a battery (not shown in the figures). The battery may be disposed between the middle frame and the back cover, or between the middle frame and the display screen 11, and this embodiment of the application does not limit this. In some embodiments, the printed circuit board may be divided into a motherboard and a daughterboard, and the battery may be disposed between the motherboard and the daughterboard, wherein the motherboard may be disposed between the upper edge of the middle frame and the battery, and the daughterboard may be disposed between the lower edge of the middle frame and the battery.

[0099] The electronic device 100 may also include a frame, which may be formed of a conductive material such as metal. The frame may be disposed between the display screen 11 and the back cover and extend circumferentially around the periphery of the electronic device 100. The frame may have four sides surrounding the display screen 11 to help secure the display screen 11.

[0100] In one implementation, the frame made of conductive material can be directly used as the conductive frame of the electronic device 100, for example, forming the appearance of a metal frame, suitable for industrial design (ID). In one embodiment, the outer surface of the frame can be a conductive material. In one embodiment, the conductive portion of the frame can be used as an antenna radiator of the electronic device 100.

[0101] In one embodiment, the inner surface of the frame may include a conductive material, such as a metallic material. In this implementation, the conductive portion of the frame can be used as an antenna radiator of the electronic device 100. It should be understood that the radiator (or the conductive material of the inner surface) disposed on the inner surface of the frame is disposed in conjunction with the non-conductive material of the frame to facilitate antenna radiation, and both the conductive material and the non-conductive material should be considered as part of the frame.

[0102] In one embodiment, the mid-frame may include a border. Here, the mid-frame, including the border, serves as a single unit and can support the electronic components in the device. The cover and rear cover are respectively fitted along the upper and lower edges of the border to form the housing 12 of the electronic device 100. In one embodiment, the cover, rear cover, border, and / or mid-frame may be collectively referred to as the housing 12 of the electronic device 100. It should be understood that "housing 12" may be used to refer to any part or all of the cover, rear cover, border, or mid-frame, or to any combination of the cover, rear cover, border, or mid-frame.

[0103] In some embodiments, the border edge on the mid-frame can at least partially serve as an antenna radiator for transmitting / receiving radio frequency signals. This portion of the border edge serving as the radiator may have gaps between it and the rest of the mid-frame, thereby ensuring a good radiation environment for the antenna radiator. In one embodiment, the mid-frame may have an aperture at this portion of the border edge serving as the radiator to facilitate antenna radiation.

[0104] In another embodiment, the frame may not be considered part of the mid-frame. For example, the frame may be connected to and integrally formed with the mid-frame. Alternatively, the frame may include inwardly extending protrusions to connect to the mid-frame, for example, the protrusions are connected to the mid-frame by means of spring clips, screws, welding, etc. Exemplarily, the protrusions of the frame can also be used to receive feed signals, so that at least a portion of the frame acts as a radiator for transmitting / receiving radio frequency signals. A gap may exist between this portion of the frame acting as the radiator and the mid-frame, thereby ensuring a good radiation environment for the antenna radiator and enabling the antenna to have good signal transmission capabilities.

[0105] The back cover is typically located on the back of the electronic device 100, for example, on the side of the mid-frame away from the display screen 11. The back cover is mainly used to protect the internal components of the electronic device 100, such as preventing external impurities like dust and water from entering the electronic device 100. The back cover can be made of metal.

[0106] The antenna is used to realize the communication function of electronic device 100. When transmitting signals, electronic device 100 mainly outputs radio frequency signal power through a radio transmitter, which is then transmitted to the antenna through a feed line and radiated by the antenna in the form of electromagnetic waves. When receiving signals, the antenna receives electromagnetic waves in space and sends them to the radio receiver through the feed line.

[0107] In some embodiments, the antenna can be disposed within the frame. When the frame of the electronic device 100 is made of a non-conductive material, the antenna radiator can be located within the electronic device 100 and disposed along the frame. For example, the antenna radiator can be disposed close to the frame to minimize the volume occupied by the antenna radiator and to be closer to the outside of the electronic device 100, thereby achieving better signal transmission performance. It should be noted that "disposing the antenna radiator close to the frame" means that the antenna radiator can be disposed tightly against the frame or close to the frame; for example, there can be a small gap between the antenna radiator and the frame.

[0108] For example, such as Figure 1 As shown, the antenna can be positioned in the edge region of the electronic device 100. That is, the antenna can be... Figure 1 The shadow area 101 is arranged in the middle and radiates through the black border area of ​​the screen.

[0109] It should be understood that Figure 1 The electronic device 100 is shown only schematically, and the actual shape, size, and construction of these components are not subject to change. Figure 1 Limitations. In some other embodiments, the electronic device 100 may include more or fewer components than those shown in the figures, and this application embodiment is not limited thereto. In other embodiments, the type of electronic device 100 is different, and the components it includes are different; the electronic device structure provided in this application embodiment is only illustrative.

[0110] It should be understood that in the embodiments of this application, the side where the display screen 11 of the electronic device 100 is located can be considered as the front, the side where the back cover is located as the back, and the side where the frame is located as the side.

[0111] As mentioned above, electronic devices can achieve communication functions through antennas. To pursue a premium look and a slim, lightweight experience, tablets and other electronic devices have increasingly adopted unibody all-metal designs. For all-metal tablets, a cavity antenna solution is typically used to achieve communication functions, radiating signals through the black border area of ​​the screen, thus resolving the conflict between the all-metal aesthetic and antenna radiation performance.

[0112] There are various implementation schemes for cavity antennas. Currently, the commonly used schemes in the industry include the bracket FPC / LDS scheme and the PCB soldered steel sheet scheme.

[0113] Figure 2 A cross-sectional view of the structure of a cavity antenna is shown. It should be understood that... Figure 2 This pertains to the FPC / LDS support system solution. It should be understood that... Figure 2 It can be from Figure 1 The structure of the cavity antenna was obtained by observing it along the AA' direction.

[0114] like Figure 2 As shown, the cavity antenna 200 may include a conductive element 210, a non-conductive support 220, and a conductive housing 120. The conductive element 210 may be a flexible metal material, such as FPC or LDS. The non-conductive support 220 serves as a support member to support the conductive element 210, and the conductive element 210 may be attached to the surface of the non-conductive support 220. The conductive element 210 may be electrically connected to the conductive housing 120 via an electrical connector 201 (such as foam). The conductive housing 120 may be... Figure 1 The housing 12 of the electronic device 100 shown.

[0115] The conductive element 210 can serve as the upper surface and part of the sidewall of the cavity antenna 200; the conductive housing 120 can serve as the lower surface and part of the sidewall of the cavity antenna 200; the conductive element 210 and the conductive housing 120 together can form a cavity with a slot structure 10. It should be understood that the slot structure 10 is located in the black border area of ​​the screen (e.g., ...). Figure 1 The shaded area 101 is used for signal radiation.

[0116] exist Figure 2 In the antenna design shown, considering that the conductive component 210 is a flexible metal material, it needs to be supported by a non-conductive bracket 220. However, in this design, forming the cavity antenna 200 requires materials such as a non-conductive bracket, FPC, and LDS, resulting in a relatively high total cost for the antenna. In addition, the conductive component 210 (such as FPC or LDS) requires multiple foams to be electrically connected to the conductive housing 120, and the cavity antenna has a large number of grounding points, which also increases the antenna cost and complicates assembly.

[0117] Figure 3 The diagram shows a layout of a cavity antenna and a cross-sectional view of its structure. Among other things, Figure 3 Image (a) shows a layout of a cavity antenna. Figure 3 (b) shows a cross-sectional view of the structure of a cavity antenna. It should be understood that... Figure 3 The cross-sectional view of the cavity antenna shown in (b) can be obtained from... Figure 3 (a) is obtained by observation along the BB' direction. Figure 3 (b) in the text refers to the PCB welding steel sheet solution.

[0118] Combination Figure 3 As shown in (b), the cavity antenna 200 may include a conductive component 210, a conductive housing 120, and a main board 230. The conductive component 210 may be a rigid metal material, such as a steel sheet, aluminum sheet, or copper sheet. The conductive component 210 can be connected to the main board 230 by welding or other methods. The main board 230 is then electrically connected to the conductive housing 120 via an electrical connector 201 (such as a spring). The conductive housing 120 may be... Figure 1 The housing 12 of the electronic device 100 shown.

[0119] The conductive element 210 can serve as the upper surface and part of the sidewall of the cavity antenna 200; the conductive housing 120 can serve as the lower surface and part of the sidewall of the cavity antenna 200; the conductive element 210 and the conductive housing 120 together can form a cavity with a slot structure 10. It should be understood that the slot structure 10 is located in the black border area of ​​the screen (e.g., ...). Figure 1 The shaded area 101 is used for signal radiation.

[0120] Compared to Figure 2 The proposed scheme Figure 3 The antenna design shown eliminates the need for the non-conductive support 220, thus reducing manufacturing costs. However, because the central non-conductive support 220 is removed, the conductive component 210 requires multiple bends and welding to the main board 230 to ensure structural strength. This means the cavity antenna structure is not suitable for all cavity antenna designs. For example, when the cavity antenna 200 has only one grounded edge, the conductive component 210, located on the upper surface of the cavity, has only one edge welded to the main board 230, compromising the structural stability and reliability of the cavity antenna 200.

[0121] In addition, combined Figure 3 As shown in (a) above, in the overall layout, the cavity antenna 200 passes through the black border area of ​​the screen (such as...). Figure 1 The cavity antenna 200 radiates from the shaded area 101, so it is positioned close to the edge of the conductive housing 120. The plastic retaining strip 300 used to press the motherboard 230 also needs to be placed along the edge of the entire device. Therefore, the conductive component 210 and the plastic retaining strip 300 will overlap and conflict, creating a structural interference zone. Consequently, the plastic retaining strip 300 in the structural interference zone needs to be positioned to avoid this interference. In other words, the plastic retaining strip 300 at the location where the cavity antenna 200 is placed needs to be avoided. This may lead to an increase in the number of plastic retaining strips 300 and a decrease in structural strength.

[0122] Figure 4 These are two antenna grounding schemes provided in the embodiments of this application. For example... Figure 4 As shown in (a), the conductive element 210 can be connected to the motherboard 230 on only one side; that is, the cavity antenna can be grounded on one side, and the left and right sides of the cavity antenna are open boundaries. For example, as shown in [example image]... Figure 3 As shown in (b), the conductive component 210 is soldered to the motherboard 230 on only one side. Figure 4 As shown in (b), the conductive element 210 can be connected to the motherboard 230 on only three sides, that is, the cavity antenna can be grounded on three sides.

[0123] Combination Figure 4 (a) and Figure 4 As shown in (b), for an antenna resonant frequency f of 2.4 GHz, the scheme of grounding one side of the cavity antenna has the advantage of miniaturization. However, since the left and right sides of the cavity antenna are open, electromagnetic field radiation exists on the sides, which can easily excite antenna clutter in the overall environment. The scheme of grounding three sides of the cavity antenna, although it occupies more space, can suppress the propagation of electromagnetic fields to the left and right sides.

[0124] Therefore, in practical applications, a suitable antenna grounding scheme can be selected based on the specific stacking space of the antennas. When stacking space is limited, one can choose... Figure 4 The grounding scheme shown in (a) is the one that minimizes the space occupied by the cavity antenna, i.e., grounding only one side of the cavity antenna; if there is sufficient stacking space, it can be selected... Figure 4 The grounding scheme shown in (b) is a scheme that uses three sides of the cavity antenna to be grounded to prevent the electromagnetic field from propagating laterally. It should be noted that, as... Figure 4 Both grounding schemes shown are applicable to the schemes of this application. That is to say, the schemes in the following embodiments of this application can adopt a single-side grounding scheme or a three-side grounding scheme, and there is no limitation on this.

[0125] To address the aforementioned problems, embodiments of this application provide an electronic device that may include the antenna structure 400 described in the following embodiments. It should be understood that the antenna structure 400 may form a cavity antenna (or cavity slot antenna), meaning that a cavity antenna (or cavity slot antenna) can be implemented using the antenna structure 400. The following will be combined with... Figures 5 to 29 Please describe in detail the solution provided in this application.

[0126] It should be noted that, considering the different internal layouts of various electronic devices, the position of the cavity antenna can be adjusted according to the specific layout of the internal components. For example, when the motherboard 230 of an electronic device is large, a cavity antenna can be formed in the area where the motherboard 230 is located. This will be discussed in the following section. Figures 5 to 14 Detailed Explanation. For example, when the motherboard 230 of an electronic device is small, it is impossible to form a cavity antenna in the area where the motherboard 230 is located. Therefore, a cavity antenna can be formed in another location, and then an electrical connection to the motherboard 230 can be achieved through a signal transmission line. The following will refer to the attached diagram. Figures 15 to 22 Detailed explanation.

[0127] Figure 5 This is a schematic diagram of the installation position of an antenna structure provided in an embodiment of this application. Figure 6 This is a schematic diagram of the overall structure of an antenna structure provided in an embodiment of this application. Figure 7 yes Figure 6The antenna structure shown is a cross-sectional view along the yz plane. Figure 8 yes Figure 6 The antenna structure shown is a cross-sectional view along the xz plane. Figures 9 to 12 It shows Figure 6 The antenna structure shown is a partial structure.

[0128] like Figure 5 As shown, the cavity antenna can be located on the straight edge of the device, and the non-conductive bracket 220 can be located above the motherboard 230, meaning that the projection of the non-conductive bracket 220 on the xy plane at least partially overlaps with the projection of the motherboard 230 on the xy plane. In other words, the non-conductive bracket 220 can be positioned on the long side (i.e., along the x-direction) or the short side (i.e., along the y-direction) of the electronic device, thereby forming a cavity antenna on either the long or short side of the electronic device. It should be understood that the non-conductive bracket 220 can reuse the structure of the plastic strip 300, meaning the non-conductive bracket 220 can be a part of the plastic strip 300.

[0129] like Figures 6 to 8 As shown, the electronic device includes an antenna structure 400, which may include a conductive component 210, a non-conductive support 220, a motherboard 230, a conductive housing 120, a first connector 202, and a second connector 203. The conductive housing may be made of a metal (such as magnesium alloy, titanium alloy, aluminum-magnesium alloy, etc.) or other non-metallic conductive materials (such as carbon fiber); the conductive component may be made of a metal (such as steel sheet, aluminum sheet, copper sheet, etc.) or other non-metallic conductive materials (such as carbon fiber); the non-conductive support may be made of a non-metallic material, such as plastic. It should be understood that the conductive housing 120 may be... Figure 1 The housing 12 of the electronic device 100 shown can also be the mid-frame of the electronic device, and this application does not limit it in this way.

[0130] like Figure 7 As shown, the conductive component 210 and part of the conductive housing 120 can be configured to form a cavity antenna (or cavity slot antenna) with a slot structure 10. Specifically, the conductive component 210, the first connector 202, the motherboard 230, the second connector 203, and the conductive housing 120 can form a cavity, on which the slot structure 10 is provided. The cavity and the slot structure 10 can constitute a cavity antenna (or a cavity slot antenna). It should be understood that the slot structure 10 is used to radiate signals to the outside of the electronic device, and the slot structure 10 can be located in the black border area of ​​the electronic device (e.g., Figure 1 Within the shaded area 101, the black border area can be the area between the inner wall of the electronic device's frame and the outer edge of the display screen. That is, the projection of the slit structure 10 onto the xy plane (or the plane where the display screen is located) lies within the black border area of ​​the electronic device.

[0131] like Figure 6 , Figure 7 and Figure 9 As shown, the conductive element 210 can be embedded inside the non-conductive support 220. For example, the conductive element 210 can be embedded in the non-conductive support 220 through processes such as hot melting or injection molding, thereby forming a conformal cavity antenna. The non-conductive support 220 can serve as both a plastic pressure strip 300 for pressing the PCB board and a support structure for the conductive element 210; the conductive element 210 serves as both the upper surface of the cavity antenna and a reinforcing structure for the non-conductive support 220. Therefore, this application does not have the aforementioned problem of stacking conflict between the conductive element 210 and the plastic pressure strip 300.

[0132] It should be understood that this application does not limit the shape of the conductive element 210 and the non-conductive support 220. The conductive element 210 can be configured as an "L" shape, a "Z" shape, or other shapes.

[0133] It should also be understood that the non-conductive support 220 can be part of the plastic strip 300, meaning that a conductive element 210 (such as a steel sheet) can be embedded in a portion of the plastic strip 300. The dimensions of the local structure of the plastic strip 300 (i.e., the non-conductive support 220) can be adjusted according to the conductive element 210 (or the dimensions of the formed cavity antenna). The portion of the plastic strip 300 in which the conductive element 210 is embedded can be locally enlarged to meet the design requirements of the antenna.

[0134] The first connector 202 connects the conductive component 210 and the motherboard 230, meaning the conductive component 210 can be electrically connected to the motherboard 230 via the first connector 202. In some embodiments, such as… Figure 8 , Figure 11 and Figure 12 As shown, the first connector 202 may include a feeding spring 2021 and a grounding spring 2022. The feeding spring 2021 is disposed near the antenna radiation edge (or, in other words, the feeding spring 2021 is disposed near the frame of the electronic device), and the grounding spring 2022 is disposed away from the antenna radiation edge (or, in other words, the feeding spring 2021 is disposed away from the frame of the electronic device). Here, the antenna radiation edge can be one of the four sides of the electronic device (such as a tablet). One cavity antenna corresponds to one feeding spring 2021 and multiple grounding springs 2022. The multiple grounding springs 2022 may include, for example, a first grounding spring 2022A, a second grounding spring 2022B, a third grounding spring 2022C, and a fourth grounding spring 2022D.

[0135] It should be understood that the feed spring 2021 is the antenna feed terminal, used to feed in radio frequency signals; the ground spring 2022 is mainly used to realize the electrical connection between the conductive component 210 (such as a steel sheet) and the main board 230.

[0136] It should also be understood that, in the embodiments of this application, such as Figure 6 and Figure 7 As shown, a cavity antenna can be grounded on one side; a cavity antenna can also be grounded on all three sides. For example, the grounding spring 2022 can be set along the three sides (including one long side and two short sides) of the conductive member 210, thereby enabling the antenna to be grounded on all three sides.

[0137] The second connector 203 connects the motherboard 230 and the conductive housing 120, meaning the motherboard 230 can be electrically connected to the conductive housing 120 via the second connector 203. In some embodiments, such as… Figure 8 and Figure 12 As shown, the second connector 203 may include multiple metal springs (or multiple conductive springs). For example, the second connector 203 may include a first metal spring 2031, a second metal spring 2032, a third metal spring 2033, a fourth metal spring 2034, a fifth metal spring 2035, and a sixth metal spring 2036. This application does not limit the number of the second connector 203.

[0138] It should be noted that the embodiments of this application use metal springs as examples to illustrate the first connector 202 and the second connector 203. It should be understood that the first connector 202 and the second connector 203 can also be electrical connectors made of other materials, such as foam.

[0139] In some embodiments, such as Figure 10 and Figure 11 As shown, a metal groove 211 can be formed on the conductive component 210 (such as a steel sheet), and this metal groove 211 can be located between the feed spring 2021 and the ground spring 2022. It should be understood that the feed spring 2021 corresponds to the feed point, and the ground spring 2022 corresponds to the ground point. The grounding path of the antenna can be adjusted by adjusting the length and / or width of the metal groove 211. Therefore, the length of the current path between the feed spring and the ground spring 2022 can be controlled by the length and / or width of the metal groove 211, thereby achieving the effect of adjusting the antenna impedance.

[0140] For example, the number of metal slots 211 can be one or more. In one example, the metal slot 211 may be located on one side of the feed spring 2021 and between the feed spring 2021 and the grounding spring 2022. In another example, as... Figure 10 As shown, the metal groove 211 can be located on both sides of the power feeding spring 2021, and is located between the power feeding spring 2021 and the grounding spring 2022.

[0141] For example, the length of the projection of the conductive element 210 onto the xy plane is denoted as L, and the width of the projection of the conductive element 210 onto the xy plane is denoted as D. Figure 6In the structure shown, L can be 21 mm and D can be 6.5 mm. Figure 6 The cavity antenna shown has a resonant frequency of 5 GHz.

[0142] In other embodiments, the metal groove 211 may not be provided on the conductive element 210 (such as a steel sheet), but the antenna impedance may be optimized by providing a corresponding matching circuit on the main board 230.

[0143] exist Figures 6 to 12 In the antenna structure 400 shown, by embedding the conductive component 210 (such as a steel sheet) within the non-conductive support 220, existing structural components are reused, maximizing the use of stacking space and reducing antenna costs. Furthermore, compared to existing low-cost cavity antenna structures (such as...),... Figure 3 The structure shown in (b) can accommodate more cavity antenna schemes and also solves the problem of stacking conflict between cavity antennas and plastic retaining strips 300. Furthermore, by embedding the conductive component 210 within the non-conductive support 220, the structure has good reliability and can be applied to… Figure 4 The two grounding schemes for cavity antennas are described.

[0144] Figure 13 This is a schematic diagram showing the installation position of another antenna structure provided in an embodiment of this application.

[0145] like Figure 13 As shown, the cavity antenna can be located at the four corners of the device, and the non-conductive bracket 220 can be located above the motherboard 230, meaning that the projection of the non-conductive bracket 220 on the xy plane at least partially overlaps with the projection of the motherboard 230 on the xy plane. In other words, the non-conductive bracket 220 can be placed at the corners of the electronic device (i.e., the four corners of the frame), and the conductive component 210 embedded in the non-conductive bracket 220 can be electrically connected to the motherboard 230.

[0146] Figure 13 The antenna layout shown is in the same position as Figure 5 The different antenna layout positions shown will cause the corresponding changes in the layout positions of the feed spring 2021 and the grounding spring 2022. It should be understood that... Figure 6 The antenna structure shown can be set as follows: Figure 13 The corner positions of the electronic device shown.

[0147] For example, the four sides of the conductive housing 120 can serve as antenna radiating edges, such as... Figure 13 In the antenna layout shown, i.e., when the antenna is placed at the corner of the electronic device, the specific layout of the first connector 202 can be referenced. Figure 14 .like Figure 14As shown, the antenna radiating edge positioned in the corner comprises two parts: one along the long side of the electronic device and the other along the short side. The feed spring 2021 can be positioned close to the two antenna radiating edges, while the grounding spring 2022 can be positioned away from the antenna radiating edges (i.e., close to the non-radiating edge). For example, it can be positioned on the side of the motherboard 230 away from the two antenna radiating edges. Here, the antenna radiating edge refers to the edge where the antenna can radiate outwards; the non-radiating edge is the edge that does not radiate electromagnetic waves. Therefore, the non-radiating edge needs to be grounded through the grounding spring 2022 to achieve a complete electrical connection and form an electrical barrier, preventing electromagnetic radiation and leakage.

[0148] It should be understood that placing the feed spring 2021 close to the antenna radiation side is not necessary. From a practical evaluation perspective, placing the feed spring 2021 on the antenna radiation side results in a better antenna impedance (close to 50 ohms), thus reducing return loss and minimizing input power reflection.

[0149] It should be understood that one cavity antenna corresponds to one feed spring 2021 and multiple ground springs 2022. For example, as Figure 14 As shown, the plurality of grounding springs 2022 may include a first grounding spring 2022A, a second grounding spring 2022B, a third grounding spring 2022C, a fourth grounding spring 2022D, and a fifth grounding spring 2022E, etc., which are not limited in this application.

[0150] For example, in Figure 13 In the layout shown, the width D of the projection of the conductive element 210 onto the xy plane can be 38 mm, and the length L of the projection of the conductive element 210 onto the xy plane can be 35 mm. It should be understood that the cavity antenna... Figure 13 In the layout shown, its resonant frequency is 2.4 GHz.

[0151] It should be noted that the mainboard 230 in the antenna structure is not necessary. In some embodiments, the conductive component 210 can also be directly electrically connected to the conductive housing 120 through metal connectors such as foam or springs, which can also form a cavity antenna structure.

[0152] The above combination Figures 5 to 14 The solution for forming a cavity antenna in the PCB area (i.e., the projections of the conductive component 210 / non-conductive support 220 on the xy plane at least partially overlap with the projection of the motherboard 230 on the xy plane) is described in detail below. Figures 15 to 22 This document details a scheme for forming a cavity antenna in a non-PCB area (i.e., the projections of the conductive component 210 / non-conductive support 220 on the xy plane do not overlap with the projection of the motherboard 230 on the xy plane).

[0153] Figure 15This is a schematic diagram showing the installation position of another antenna structure provided in an embodiment of this application. Figure 16 This is a schematic diagram of the overall structure of another antenna structure provided in the embodiments of this application. Figure 17 yes Figure 16 The antenna structure shown is a cross-sectional view along the CC' plane. Figures 18 to 21 It shows Figure 16 The antenna structure shown is a partial structure. Figure 22 These are schematic diagrams of two antenna structures provided in the embodiments of this application.

[0154] like Figure 15 As shown, the cavity antenna can be located outside the PCB area, meaning the projection of the conductive component 210 / non-conductive support 220 onto the xy plane does not overlap with the projection of the motherboard 230 onto the xy plane. In this case, the conductive component 210 can be electrically connected to the motherboard 230 via the signal transmission line 500.

[0155] For example, the signal transmission line 500 can be a coaxial cable, which is generally made of four layers of material: the innermost layer is a conductive copper wire (also called the core), the conductive copper wire is surrounded by a layer of plastic (used as an insulator and dielectric), the insulator is surrounded by a thin mesh conductive material (usually copper or alloy, also called the outer conductor), and then the outermost insulating material is the outer sheath.

[0156] like Figures 16 to 18 As shown, the electronic device includes an antenna structure 400, which may include a conductive component 210, a non-conductive support 220, and a conductive housing 120. The conductive housing 120 may be made of a metal (such as magnesium alloy, titanium alloy, aluminum-magnesium alloy, etc.) or other non-metallic conductive materials (such as carbon fiber); the conductive component 210 may be made of a metal (such as steel sheet, aluminum sheet, copper sheet, etc.) or other non-metallic conductive materials (such as carbon fiber); and the non-conductive support 220 may be made of a non-metallic material, such as plastic.

[0157] It should be understood that the conductive housing 120 can be Figure 1 The housing 12 of the electronic device 100 shown can also be the mid-frame of the electronic device, and this application does not limit it in this way.

[0158] like Figure 17As shown, the conductive element 210 and part of the conductive housing 120 can be configured to form a cavity antenna (or cavity slot antenna) with a slot structure 10. Specifically, the conductive element 210 and part of the conductive housing 120 can form a cavity, on which the slot structure 10 is provided. The cavity and the slot structure 10 can constitute a cavity antenna (or cavity slot antenna). It should be understood that the slot structure 10 is used to radiate signals to the outside of the electronic device, and the slot structure 10 can be located in the black border area of ​​the electronic device (e.g., Figure 1 Within the shaded area 101, the black border area can be the area between the inner wall of the electronic device's frame and the outer edge of the display screen. That is, the projection of the slit structure 10 onto the xy plane (or the plane where the display screen is located) lies within the black border area of ​​the electronic device.

[0159] like Figures 16 to 18 As shown, the conductive element 210 can be embedded inside the non-conductive support 220. For example, the conductive element 210 can be embedded in the non-conductive support 220 through processes such as hot melting or injection molding, thereby forming a conformal cavity antenna. The non-conductive support 220 can serve as both a plastic pressure strip 300 for pressing the PCB board and a support structure for the conductive element 210; the conductive element 210 serves as both the upper surface of the cavity antenna and a reinforcing structure for the non-conductive support 220. Therefore, this application does not have the aforementioned problem of stacking conflict between the conductive element 210 and the plastic pressure strip 300.

[0160] It should be understood that this application does not limit the shape of the conductive element 210 and the non-conductive support 220. The conductive element 210 can be configured as an "L" shape, a "Z" shape, or other shapes.

[0161] For example, such as Figure 19 As shown, the conductive element 210 can be configured as a "Z"-shaped structure. The conductive element 210 may include an antenna segment 212, a connecting segment 214, and a feed segment 213. The antenna segment 212 and the feed segment 213 are arranged parallel to the xy plane. The connecting segment 214 connects the antenna segment 212 and the feed segment 213. The feed segment 213 is located near the back cover of the electronic device, and the antenna segment 212 is located near the display screen of the electronic device. The antenna segment 212 of the conductive element 210 forms the upper surface of the cavity antenna, the connecting segment 214 forms part of the side surface of the cavity antenna, and the feed segment 213 of the conductive element 210 is electrically connected to the conductive housing 120.

[0162] For example, such as Figure 20 As shown, the length of the projection of the conductive element 210 onto the xy plane is L, the width of the projection of the conductive element 210 onto the xy plane is D, and the width of the projection of the feed segment 213 of the conductive element 210 onto the xy plane is W. Figure 16In the structure shown, L can be 21 mm, D can be 10 mm, and W can be 5 mm. Figure 16 The cavity antenna shown has a resonant frequency of 5 GHz.

[0163] It should be understood that the longer the projected length of the conductive element 210 along the z-direction, that is, the higher the height of the conductive element 210, the better the antenna performance. However, due to the limitations of the thickness of the electronic device, the height of the conductive element 210 is generally between 2.5 mm and 3 mm.

[0164] In some embodiments, such as Figure 20 and Figure 21 As shown, a metal groove 211 can be formed on the conductive component 210 (such as a steel sheet), which is used to adjust the antenna impedance. It should be understood that the length and / or width of the metal groove 211 can control the length of the current path between the power supply and the conductive housing 120, thereby achieving the effect of adjusting the antenna impedance.

[0165] In some embodiments, such as Figure 16 and Figure 21 As shown, the antenna structure 400 also includes a signal transmission line 500, through which the conductive component 210 can be electrically connected to the motherboard 230. The signal transmission line 500 is used to realize the transmission of radio frequency signals between the cavity antenna and the chips on the motherboard 230. The signal transmission line 500 can transmit the radio frequency signals from the chips on the motherboard 230 to the cavity antenna, and vice versa.

[0166] It should be noted that if both the chip and the antenna are mounted on the motherboard 230, they can be connected via microstrip lines. If the antenna is not mounted on the motherboard 230, then other methods are needed for radio frequency signal transmission. For example, in this embodiment, radio frequency signal transmission is achieved through signal transmission line 500.

[0167] For example, such as Figure 21 As shown, the metal groove 211 on the conductive component 210 can divide the conductive component 210 into two parts, namely the first part 210A and the second part 210B. The signal transmission line 500 may include a wire core 510, an outer conductor 520 and a transmission line 530. The wire core 510 can be connected to the first part 210A of the conductive component 210, the outer conductor 520 can be connected to the second part 210B of the conductive component 210, one end of the transmission line 530 is connected to the wire core 510 and the outer conductor 520, and the other end of the transmission line 530 is connected to the motherboard 230.

[0168] For example, the conductor 510 is soldered above the metal slot 211, and the outer conductor 520 is soldered below the metal slot 211. That is, the conductor 510 can be soldered to the side of the metal slot 211 of the conductive element 210 near the conductive housing 120, and the outer conductor 520 can be soldered to the side of the metal slot 211 of the conductive element 210 away from the conductive housing 120. By adjusting the length and / or width of the metal slot 211 (i.e., adjusting the length and / or width of the projection of the metal slot 211 onto the xy plane), the current path from the antenna feed point to the lower point can be adjusted, thereby adjusting the antenna impedance.

[0169] For example, such as Figure 19 and Figure 21 As shown, when the conductive component 210 adopts the aforementioned "Z"-shaped structure, the metal groove 211 can be disposed on the feed section 213 of the conductive component 210. The metal groove 211 can divide the feed section 213 into a third part 213A and a fourth part 213B. The third part 213A of the feed section 213 is located on the side of the metal groove 211 relatively closer to the connecting section 214, and the fourth part 213B of the feed section 213 is located on the side of the metal groove 211 relatively farther from the connecting section 214. In this case, the core 510 of the signal transmission line 500 can be connected to the third part 213A of the feed section 213, and the outer conductor 520 of the signal transmission line 500 can be connected to the fourth part 213B of the feed section 213, thereby realizing the radio frequency signal transmission between the conductive component 210 and the motherboard 230.

[0170] In some embodiments, such as Figure 16 and Figure 17 As shown, the antenna structure 400 may further include a plastic structural component 420, which is located between the non-conductive support 220 and the conductive housing 120. The plastic structural component 420 is used to lock and fix components such as the main board 230 and the sound cavity.

[0171] It should be understood that the conductive housings of mid-to-low-end tablets are made using a stamping process, resulting in a flat inner surface after stamping. However, the mainboard 230, the sound chamber, and many other components inside the device require screws for secure fastening. Therefore, a plastic structural component 420 is typically attached to the conductive housing 120, with a thermosetting nut on it. The mainboard 230, the sound chamber, and other components are then fastened to the plastic structural component 420 using screws.

[0172] In some embodiments, such as Figure 17 and Figure 22 As shown in (a), no connecting parts may be provided between the conductive element 210 (such as a steel sheet) and the conductive housing 120, and the distance (denoted as d) between the conductive element 210 and the conductive housing 120 is less than a first threshold. The distance d between the conductive element 210 and the conductive housing 120 is less than or equal to 0.5 mm.

[0173] For example, the length L of the projection of the conductive element 210 on the xy plane is greater than a second threshold, and / or the width D of the projection of the conductive element 210 on the xy plane is greater than a third threshold, and / or the width W of the projection of the feed segment 213 of the conductive element 210 on the xy plane is greater than a fourth threshold.

[0174] It should be understood that the coupling capacitance C between the conductive component 210 and the conductive housing 120 satisfies the following formula:

[0175] Where L is the length of the conductive element 210 (i.e., the coupling grounding length), W is the width of the feed section 213 of the conductive element 210 (i.e., the coupling grounding width), d is the distance between the conductive element 210 and the conductive housing 120, ε0 is the vacuum permittivity, and ε r It is the relative permeability (i.e., the ratio of the permeability of the filling material inside the cavity to the permeability of the vacuum).

[0176] As shown in the above formula, the coupling capacitance C between the conductive component 210 and the conductive housing 120 is related to the coupling grounding length L, the coupling grounding width W, and the distance d between the conductive component 210 and the conductive housing 120. Furthermore, the coupling capacitance C is directly proportional to L and W, and inversely proportional to d. Therefore, increasing the length L and / or the width D and / or the width W of the feed section 213 of the conductive component 210 (i.e., the coupling grounding width W) and / or decreasing the distance d between the conductive component 210 and the metal back cover can increase the coupling capacitance between the conductive component 210 and the conductive housing 120. When the coupling capacitance is sufficiently large, a current path can be formed, thereby simplifying the use of grounding accessories such as springs / foam.

[0177] In other words, when the length L of the conductive element 210, the width D of the conductive element 210 (or the width W of the feed section 213 of the conductive element 210), and the distance d between the conductive element 210 and the conductive housing 120 meet certain requirements, a large capacitor can be formed between the conductive element 210 and the conductive housing 120. Capacitors have the characteristic of passing high frequencies and blocking low frequencies. Therefore, under high-frequency electromagnetic fields (such as 2.4G and 5G in this application), current can still be conducted between the conductive element 210 and the conductive housing 120. Even if no electrical connectors such as springs / foams are provided between the conductive element 210 and the conductive housing 120, a current path can still be formed, thereby enabling an equivalent cavity structure to be formed between the conductive element 210 and the conductive housing 120, forming a cavity antenna (or a cavity slot antenna).

[0178] In other embodiments, such as Figure 22As shown in (b), the conductive element 210 (such as a steel sheet) and the conductive housing 120 can be electrically connected by a third connector 204 (such as foam or spring).

[0179] It should be understood that the conductive element 210 can be grounded on one side or all three sides. For example, multiple third connectors 204 can be provided along one long side of the feed section 213 of the conductive element 210 away from the frame 121, thereby enabling the antenna to be grounded on one side. As another example, multiple third connectors 204 can be provided along the two short sides of the feed section 213 of the conductive element 210 and one long side away from the frame 121, thereby enabling the antenna to be grounded on all three sides.

[0180] For example, such as Figure 22 As shown, the electronic device includes a screen assembly 600, which may include a metal layer 610, a display layer 620, and a cover plate 630. The metal layer 610 and the display layer 620 can form the aforementioned display screen 11. The metal layer 610, display layer 620, and cover plate 630 are stacked, with the display layer 620 located between the metal layer 610 and the cover plate 630. The metal layer 610 serves to support the display layer 620. The conductive housing 120 includes a frame 121 and a back cover 122. A black border area 20 (i.e., a black border region 20) is formed between the outer edge of the display layer 620 and the inner wall of the frame 121. Figure 1 The conductive element 210 and part of the conductive housing 120 surround a cavity antenna with a slot structure 10. The projection of the slot structure 10 on the display layer 620 is located within the black border region 20, that is, the projection of the slot structure 10 on the xy plane is within the projection range of the black border region 20 on the xy plane. The projection length of the black border region 20 on the xy plane is X, and the projection length of the slot structure 10 of the cavity antenna formed in this application on the xy plane is Y, where Y is less than or equal to X. This allows the cavity antenna (or cavity slot antenna) to radiate or receive signals outwards via the black border region 20 of the screen assembly 600.

[0181] For example, such as Figure 22 As shown, in order to enable the cavity antenna formed in this application to radiate or receive signals, an avoidance structure can be made in the metal layer 610 and display layer 620 of the screen assembly 600 near the border 121. The avoidance structure can be the black border area 20 mentioned above.

[0182] In this embodiment, the cavity antenna can be formed in a non-PCB area, and does not occupy layout space on the motherboard 230, but it needs to be fed by a signal transmission line 500 (such as a cable). The core and outer conductor of the signal transmission line 500 are respectively soldered above and below the slotted structure of the conductive component 210 (such as a steel sheet). The impedance of the antenna can be adjusted by adjusting the length and width of the metal slot 211 on the conductive component 210 (such as a steel sheet). In addition, the length L and / or the width D and / or the width W of the feed section 213 of the conductive component 210 (i.e., the coupling ground width W) can be increased and / or the distance d between the conductive component 210 and the metal back cover can be decreased to form a large capacitive coupling ground to replace the conventional grounding scheme, thereby reducing the number of grounding points such as foam or springs, thus solving the problems of a large number of grounding points, increased cost, and complex production line assembly of cavity antennas.

[0183] Figure 23 yes Figure 16 The antenna structure 400 shown is a cross-sectional view along the DD' plane. Figure 24 and Figure 25 These are cross-sectional views of two different structures of the isolation element in electronic devices. Figure 26 and Figure 27 These are two cross-sectional views of the separator in the xy plane. Figure 28 and Figure 29 This is a comparison image showing the effect before and after setting up the isolation element.

[0184] like Figure 16 and Figure 23 As shown, the electronic device may also include an isolator 410 (or the antenna structure 400 may also include an isolator 410), which may be embedded in the non-conductive support 220. The isolator 410 may be made of a metal (such as steel, aluminum, or copper) or other non-metallic conductive materials (such as carbon fiber). Figure 16 As can be seen, two independent steel sheet structures can be embedded inside the non-conductive bracket 220, where a conformal cavity antenna can be formed on the left and a conformal isolation barrier structure can be formed on the right.

[0185] like Figure 24 and 25 As shown, the electronic device may also include a screen assembly 600, which may include a metal layer 610, a display layer 620, and a cover plate 630. The metal layer 610 and the display layer 620 can form the aforementioned display screen 11. The metal layer 610, the display layer 620, and the cover plate 630 are stacked, with the display layer 620 connected between the metal layer 610 and the cover plate 630. The metal layer 610 serves to support the display layer 620.

[0186] The conductive housing 120 can be the outer casing of an electronic device or the mid-frame of an electronic device. In one example, when the conductive housing 120 is the outer casing of an electronic device, it may include a bezel 121 and a back cover 122. One end of the isolator 410 is electrically connected to the screen assembly 600 (the metal layer 610 of the screen assembly 600), and the other end is electrically connected to the back cover 122 of the conductive housing 120. In another example, when the conductive housing 120 is the mid-frame of an electronic device, it may include a bezel and a mid-frame plate, with one end of the isolator 410 electrically connected to the screen assembly 600 (the metal layer 610 of the screen assembly 600) and the other end electrically connected to the mid-frame plate of the conductive housing 120. This application mainly uses the conductive housing 120 as an example of an electronic device's outer casing for illustration.

[0187] In one example, such as Figure 24 As shown, one end of the isolator 410 can be electrically connected to the metal layer 610 via the metal connector 206, and the other end of the isolator 410 can be electrically connected to the rear cover 122 of the conductive housing 120 via the metal connector 205. This forms a complete metal barrier structure from the metal layer 610 to the rear cover 122, constructing an electric wall on the side. The electromagnetic field strength of the electric wall is zero, blocking the electromagnetic field from radiating to the side, thus serving as an electromagnetic isolation barrier.

[0188] In another example, such as Figure 25 As shown, one end of the isolator 410 can be electrically connected to the metal layer 610 via the metal connector 206, and the other end of the isolator 410 can be electrically connected to the main board 230 via the metal connector 205. The main board 230 can be electrically connected to the conductive housing 120 via the metal connector 207. The metal connectors 205, 206, and 207 can be foam or spring clips, etc., and this application is not limited to these. This forms a complete metal barrier structure from the metal layer 610 to the main board 230 and then to the back cover 122, constructing a side electric barrier. The electromagnetic field strength of the electric barrier is zero, blocking the electromagnetic field from radiating to the side, thus serving as an electromagnetic isolation barrier.

[0189] It should be noted that, in combination Figure 22 and Figure 25It is understood that the main difference between the isolator 410 and the conductive element 210 is that the conductive element 210 is not electrically connected to the screen assembly 600, while the isolator 410 needs to be electrically connected to the metal layer 610 of the screen assembly 600. Considering that in the overall environment, the electromagnetic field generated by the cavity antenna will radiate to both sides, it is easy to excite antenna clutter in the overall environment, which will affect the antenna efficiency. In this embodiment, the isolator 410 can be provided on the side (one side or both sides) of the conductive element 210, and the isolator 410 can be electrically connected to the screen assembly 600 and the back cover 122, forming a metal barrier structure from the metal layer 610 to the back cover 122, thereby confining the electromagnetic field generated by the cavity antenna within a certain area, suppressing the propagation of the lateral electromagnetic field, reducing antenna clutter, and improving antenna efficiency.

[0190] In one example, such as Figure 16 and Figure 26 As shown, the isolator 410 can be disposed on one side of the conductive member 210, for example, on the left side of the conductive member 210. By disposing of the isolator 410 on one side of the conductive member 210, the propagation of lateral electromagnetic fields can be blocked, thereby reducing antenna clutter and improving antenna efficiency.

[0191] In another example, such as Figure 27 As shown, the isolator 410 can be disposed on both sides of the conductive element 210, for example, on the left and right sides of the conductive element 210. By disposing of the isolator 410 on both sides of the conductive element 210, the electromagnetic field can propagate to both sides, thereby further reducing antenna clutter and improving antenna efficiency.

[0192] It should be understood that whether the isolation element 410 is set on one side of the conductive element 210 or on both sides of the conductive element 210, it can suppress the propagation of the side electromagnetic field to a certain extent, reduce antenna clutter, and improve antenna efficiency.

[0193] It should be understood that this application does not limit the shape of the isolation member 410. The isolation member 410 can be configured with a structure similar to that of the conductive member 210, for example, a "Z" shaped structure. For example, Figure 19 As shown, the isolator 410 may include a first bent segment 411, a second bent segment 412, and a third bent segment 413. The first bent segment 411 and the third bent segment 413 are arranged parallel to the xy plane. The second bent segment 412 is connected between the first bent segment 411 and the third bent segment 413. The first bent segment 411 is located near the screen assembly 600 of the electronic device, and the third bent segment 413 is located near the back cover 122 of the conductive housing 120.

[0194] It should be noted that the isolation element 410 provided in this application can be applied to Figure 4In the two antenna grounding schemes shown, the effect of placing the isolation element 410 on one or both sides of the conductive element 210 is more obvious and the antenna efficiency is improved significantly in the scheme where one side of the antenna is grounded (i.e., one side of the conductive element 210 is grounded). In the scheme where three sides of the antenna are grounded (i.e., all three sides of the conductive element 210 are grounded), placing the isolation element 410 on one or both sides of the conductive element 210 can also improve the antenna efficiency to a certain extent.

[0195] For example, in combination Figure 28 It can be seen that, Figure 28 The two curves shown by the black dashed lines are the radiation efficiency curves before the addition of the isolator 410. ① represents the antenna radiation efficiency without the isolators 410 on both sides (radiation efficiency represents the limit performance level that the antenna can reach, without considering the actual impedance matching of the antenna); ② represents the total antenna efficiency without the isolators 410 on both sides (actual efficiency level after considering the antenna impedance matching). Figure 28 The two curves shown by the solid black line are the radiation efficiency curves before adding the isolator 410. Among them, ③ represents the antenna radiation efficiency after adding the isolators 410 on both sides (radiation efficiency represents the limit performance level that the antenna can reach, without considering the actual impedance matching of the antenna); ④ represents the total antenna efficiency after adding the isolators 410 on both sides (the actual efficiency level after considering the antenna impedance matching).

[0196] from Figure 28 As can be seen, before adding isolator 410 (shown by the dashed line in the figure), the antenna's radiation efficiency at 5.5 GHz exhibited a dip (indicated by the dashed arrow in the figure), resulting in reduced antenna efficiency. After adding isolator 410 (shown by the solid line in the figure), the radiation efficiency dip within the 5 GHz band (5.15–5.85 GHz) disappeared, and the antenna efficiency improved by nearly 1 dB.

[0197] For example, in combination Figure 29 It can be seen that, in Figure 29 In (a) of the diagram, when there are no isolation elements 410 on both sides of the antenna structure 400, it will propagate electromagnetic fields to the sides, which may increase antenna clutter and reduce antenna efficiency. Figure 29 In (b) of the above, after adding isolation members 410 on both sides of the antenna structure 400, the isolation members 410 on both sides can limit the electromagnetic field to a certain area, thereby suppressing the propagation of the side electromagnetic field, reducing antenna clutter, and improving antenna efficiency.

[0198] It should be noted that the isolation component 410 provided in this application can be applied not only to applications such as Figure 16 The antenna structure shown can also be applied to Figure 6In the antenna structure shown, an isolator 410 can be provided on one or both sides of the antenna structure 400. By providing the isolator 410, the propagation of lateral electromagnetic fields can be suppressed to a certain extent, antenna clutter can be reduced, and thus antenna efficiency can be improved.

[0199] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, include: A conductive housing (120), a conductive component (210), and a non-conductive support (220) The conductive element (210) is embedded in the non-conductive bracket (220). The conductive element (210) is electrically connected to the conductive shell (120). The conductive element (210) and the conductive shell (120) surround and form a cavity antenna with a slot structure (10). The cavity antenna radiates signals through the slot structure (10).

2. The electronic device according to claim 1, characterized in that, The electronic device further includes a motherboard (230), a first connector (202), and a second connector (203). The conductive component (210) is electrically connected to the motherboard (230) through the first connector (202), and the motherboard (230) is electrically connected to the conductive housing (120) through the second connector (203).

3. The electronic device according to claim 2, characterized in that, The first connector (202) includes a power feed spring (2021) and a ground spring (2022). The power feed spring (2021) is used to feed in radio frequency signals, and the ground spring (2022) is used to realize the electrical connection between the conductive element (210) and the motherboard (230).

4. The electronic device according to claim 3, characterized in that, The conductive housing (120) includes a frame (121), the power feeding spring (2021) is disposed close to the frame (121), and the grounding spring (2022) is disposed away from the frame (121).

5. The electronic device according to claim 3 or 4, characterized in that, The conductive element (210) has a metal groove (211) located between the power feeding spring (2021) and the grounding spring (2022).

6. The electronic device according to claim 1, characterized in that, The electronic device also includes a motherboard (230) and a signal transmission line (500), and the conductive component (210) is connected to the motherboard (230) through the signal transmission line (500).

7. The electronic device according to claim 6, characterized in that, The electronic device further includes a third connector (204) connected between the conductive element (210) and the conductive housing (120).

8. The electronic device according to claim 6 or 7, characterized in that, The conductive component (210) has a metal groove (211).

9. The electronic device according to claim 8, characterized in that, The metal groove (211) divides the conductive element (210) into a first part (210A) and a second part (210B); The signal transmission line (500) includes a wire core (510), an outer conductor (520), and a transmission line (530). The wire core (510) is connected to the first part (210A), the outer conductor (520) is connected to the second part (210B), one end of the transmission line (530) is connected to the wire core (510) and the outer conductor (520), and the other end of the transmission line (530) is connected to the motherboard (230).

10. The electronic device according to any one of claims 1 to 9, characterized in that, The electronic device further includes an isolator (410) embedded in the non-conductive bracket (220) and located on the side of the conductive component (210).

11. The electronic device according to claim 10, characterized in that, The electronic device further includes a screen assembly (600), one end of the isolator (410) is electrically connected to the screen assembly (600), and the other end of the isolator (410) is electrically connected to the conductive housing (120).

12. The electronic device according to claim 10, characterized in that, The electronic device further includes a screen assembly (600) and a motherboard (230). One end of the isolator (410) is electrically connected to the screen assembly (600), and the other end of the isolator (410) is electrically connected to the motherboard (230). The motherboard (230) is electrically connected to the conductive housing (120).

13. The electronic device according to any one of claims 1 to 12, characterized in that, The conductive component (210) is embedded in the non-conductive bracket (220) by a hot-melt process or an injection molding process.

14. An electronic device, characterized in that, include: A conductive housing (120), a conductive component (210), and a non-conductive support (220) The conductive element (210) is embedded in the non-conductive bracket (220). The distance between the conductive element (210) and the conductive shell (120) is less than a first threshold. The conductive element (210) and the conductive shell (120) surround and form a cavity antenna with a slot structure (10). The cavity antenna radiates signals through the slot structure (10).

15. The electronic device according to claim 14, characterized in that, The length of the projection of the conductive element (210) on the first plane is greater than a second threshold, and / or the width of the projection of the conductive element (210) on the first plane is greater than a third threshold, wherein the first plane is perpendicular to the thickness direction of the electronic device.

16. The electronic device according to claim 14 or 15, characterized in that, The electronic device also includes a motherboard (230) and a signal transmission line (500), and the conductive component (210) is electrically connected to the motherboard (230) through the signal transmission line (500).

17. The electronic device according to any one of claims 14 to 16, characterized in that, The conductive component (210) has a metal groove (211).

18. The electronic device according to claim 17, characterized in that, The metal groove (211) divides the conductive element (210) into a first part (210A) and a second part (210B); The signal transmission line (500) includes a wire core (510), an outer conductor (520), and a transmission line (530). The wire core (510) is connected to the first part (210A), the outer conductor (520) is connected to the second part (210B), one end of the transmission line (530) is connected to the wire core (510) and the outer conductor (520), and the other end of the transmission line is connected to the motherboard (230).

19. The electronic device according to any one of claims 14 to 18, characterized in that, The electronic device further includes an isolator (410) embedded in the non-conductive bracket (220) and located on the side of the conductive component (210).

20. The electronic device according to claim 19, characterized in that, The electronic device further includes a screen assembly (600), one end of the isolator (410) is electrically connected to the screen assembly (600), and the other end of the isolator (410) is electrically connected to the conductive housing (120).

21. The electronic device according to claim 19, characterized in that, The electronic device further includes a screen assembly (600) and a motherboard (230). One end of the isolator (410) is electrically connected to the screen assembly (600), and the other end of the isolator (410) is electrically connected to the motherboard (230). The motherboard (230) is electrically connected to the conductive housing (120).

22. The electronic device according to any one of claims 14 to 21, characterized in that, The conductive component (210) is embedded in the non-conductive bracket (220) by a hot-melt process or an injection molding process.

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