Satellite-borne high-integration receiving phased-array antenna

Abstract

The invention discloses a satellite-borne highly-integrated receiving phased-array antenna, which adopts a highly-integrated R component, is internally integrated with multiple paths of independent phase shift and attenuation channels, and is integrated with a first-stage feed network corresponding to each wave beam at the same time; the PCB sub-array compactly stacks an antenna radiation unit, a secondary feed network and an R assembly power supply and control circuit; a basic sub-array module is formed by one PCB sub-array and an R assembly array installed on the PCB sub-array, interconnection and signal convergence of the sub-array modules are achieved through the radio frequency expansion mother board, and therefore the requirements of different task indexes for antenna gain and beam performance are met. The wave-controlled power supply module and the down-conversion amplification module both employ an integrated design, and are efficiently connected with each sub-array of the phased-array antenna through a high-integration-level cable assembly. According to the design, the longitudinal profile height, the overall size and the system weight of a traditional brick type phased-array antenna are remarkably reduced, and the antenna can better meet the application requirements of a future low earth orbit flat plate type satellite platform.

Description

Technical Field

[0001] This invention relates to the field of active phased array antenna technology, and in particular to a spaceborne highly integrated receiving phased array antenna. Background Technology

[0002] Low Earth Orbit (LEO) small satellite technology is entering a phase of explosive growth. Driven by commercial spaceflight, flat-panel satellites, with their standardized and modular design advantages, are reshaping the LEO satellite industry. This transformation places demands on spaceborne phased array antennas—they must break through traditional design constraints to achieve high-performance radiation within millimeter-level vertical space, while simultaneously meeting stringent weight budgets and integration requirements.

[0003] The current mainstream brick-and-tile phased array architectures are facing severe challenges. These traditional solutions are limited by the physical characteristics of discrete receiver components, and have reached their technological ceiling in terms of profile height, weight control, and system integration. Especially in multi-satellite launch scenarios, every additional millimeter of thickness and every additional gram of weight significantly impacts the economics and competitiveness of the entire satellite system. This contradiction is forcing phased array technology to develop towards higher integration and thinner, lighter designs. Summary of the Invention

[0004] The technical problem solved by this invention is to overcome the shortcomings of the prior art and provide a spaceborne highly integrated receiving phased array antenna that can be applied to a flat-panel satellite platform. It can meet the requirements of large-angle beam scanning coverage, and has high integration, extremely low profile, independent beam control capability. Moreover, the antenna array size can be flexibly adjusted according to specific mission requirements.

[0005] The technical solution of the present invention is: a spaceborne highly integrated receiving phased array antenna, comprising several PCB subarrays, an R component array, an RF extension motherboard, a thermal control board, a wave-controlled power supply module, and a down-conversion amplifier module;

[0006] The PCB subarray integrates the power supply and control lines for the antenna radiating element array, the secondary feed network, and the R component array, with electrical connections between layers achieved through a vertical interconnection structure; the surface is provided with a pad array for mounting the R component array;

[0007] In the R component array, each R component integrates a primary feed network and N×N independent phase shift and attenuation control channels; N is the number of beams of the receiving phased array antenna;

[0008] A PCB subarray and the R component array mounted on it together constitute the smallest functional unit of a phased array antenna; the RF signal transmission between the antenna radiating element array and the RF input port of the R component, as well as between the RF output port of the R component and the secondary feed network, is achieved through the vertical interconnection structure inside the PCB subarray.

[0009] The minimum functional units are combined and modularly connected by an RF expansion motherboard to meet different receiving requirements. In the internal circuit of the RF expansion motherboard, the signal transmission path of each antenna beam is independent, and the RF signals from the same beam from each PCB subarray are converged.

[0010] The N independent RF input ports of the downconversion amplifier module are directly connected to the corresponding N independent beam output ports on the RF expansion motherboard. The RF signals of the N independent beams converged by the RF expansion motherboard are amplified, filtered and downconverted to intermediate frequency signals with low noise.

[0011] The beam control power module is used to power the R component array and also for beam control command transmission;

[0012] The thermal control board is used to provide heat dissipation for the receiving phased array antenna.

[0013] Furthermore, each PCB subarray has N independent secondary feed network RF output ports; each secondary feed network RF output port is connected to the RF input port on the RF expansion motherboard, which is used to converge and beam combine RF signals from different PCB subarrays.

[0014] Furthermore, SMP RF connectors are used to connect the RF output ports of each secondary power supply network to the RF input ports of the RF expansion motherboard.

[0015] Furthermore, the beam control power module is electrically connected to each PCB subarray via independent low-frequency signal transmission cables, providing parallel and synchronous power supply and beam control command transmission to the R component arrays on each PCB subarray.

[0016] Furthermore, the R component achieves electrical interconnection and mechanical fixation with the corresponding pad array of the PCB subarray 1 through BGA ball-mounting technology.

[0017] Furthermore, the RF expansion motherboard uses a power-of-2 combining method to converge RF signals in order to achieve the desired antenna gain and directivity.

[0018] Furthermore, the minimum functional unit, RF expansion motherboard, and thermal control board are vertically stacked to form a vertically stacked module group; the wave control power module and downconversion amplifier module are both horizontally arranged on the same plane as the vertically stacked module group.

[0019] Furthermore, the specific composition of the vertically stacked module group is as follows: an R component array is installed on the bottom surface of each PCB subarray, all PCB subarrays are located on the same plane, and the RF expansion motherboard is installed around all the PCB subarrays, leaving the installation area for all R component arrays empty; the inner surface edge area of ​​the thermal control board adopts a conformal design, consistent with the shape of the RF expansion motherboard, and the middle area is tightly attached to the R component array through thermal pads; the outer surface of the thermal control board is installed on the unified heat dissipation interface of the satellite platform; the heat generated by the R component array is directly conducted to the unified heat dissipation interface of the satellite platform through the thermal pads and the thermal control board;

[0020] The wave-controlled power supply module and the down-conversion amplifier module are located on both sides of the vertically stacked module group, with the bottom surfaces of all three being flush.

[0021] Furthermore, the specific composition of the PCB subarray is as follows:

[0022] The first and second layers are the antenna radiating element array layers. The third layer is the antenna and RF ground. The fourth layer is the RF ground for the first receiving beam. The fifth layer is the power divider network routing layer for the first receiving beam. The sixth layer is another RF ground for the first receiving beam. The seventh layer is the RF ground for the second receiving beam. The eighth layer is the power divider network routing layer for the second receiving beam. The ninth layer is another RF ground for the second receiving beam, and so on. The next layers are the RF ground, power divider network routing layer, and another RF ground for beam i, up to beam N. Finally, the 3×N+4 layer is the control line shielding ground layer. The 3×N+5 layer is the control routing layer. The 3×N+6 layer is the shielding layer shared by control and power supply. The 3×N+7 layer is the power supply routing layer. The 3×N+8 layer is the power supply shielding layer. The 3×N+9 layer is the BGA pad layer. N is the number of beams of the receiving phased array antenna.

[0023] Furthermore, the thickness of the PCB subarray is less than 5mm.

[0024] The advantages of this invention compared to the prior art are:

[0025] (1) The present invention designs and implements parallel reception and independent control of multiple independent radio frequency beams, which can meet the application requirements of modern satellite communication systems for concurrent coverage of multiple regions, multiple users and multiple tasks, and significantly improve the utilization efficiency of satellite resources and the flexibility of system services.

[0026] (2) The present invention uses an RF expansion motherboard to achieve standardized interconnection between the basic subarray modules of the phased array antenna, effectively avoiding the complex and error-prone cable network in traditional solutions. This modular design allows the antenna array size to be flexibly and quickly expanded or reduced according to the needs of different mission scenarios (such as different orbital altitudes, communication capacities, coverage areas, etc.), while maintaining the core advantage of the antenna system's low longitudinal profile, making it suitable for flat-panel small satellite platforms with strict space and weight requirements.

[0027] (3) Through highly integrated design, this invention greatly reduces the overall physical size and system weight of the phased array antenna, especially significantly reducing the longitudinal profile height of the antenna, so that it can perfectly adapt to the stringent requirements of current and future flat-panel small satellite platforms in terms of payload size, weight and power consumption.

[0028] (4) In view of the high heat generation characteristics of R components, the present invention greatly shortens the heat conduction path by optimizing the layout, simplifies the thermal control design, and ensures thermal design compatibility when scaling up. Attached Figure Description

[0029] Figure 1 This is a three-dimensional perspective view of the overall structure of the phased array antenna described in this invention;

[0030] Figure 2 This is a schematic diagram of the antenna of the present invention;

[0031] Figures 3(a) to (w) are schematic diagrams of the design of each layer of the PCB subarray;

[0032] Figure 4 This is a three-dimensional perspective view of the integrated assembly of the PCB subarray and the R component array of the present invention.

[0033] Figure 5 This is a three-dimensional perspective view of the radio frequency extension motherboard of the present invention;

[0034] Figure 6 This is a three-dimensional perspective view of the thermal control plate of the present invention;

[0035] Figure 7 This is a three-dimensional structural perspective view of the wave-controlled power module of the present invention;

[0036] Figure 8 This is a three-dimensional structural perspective view of the downconversion amplifier module of the present invention. Detailed Implementation

[0037] To better understand the technical solution of the present invention, specific embodiments are described below. Elements not shown in the figures or not described in writing are forms known to those skilled in the art. Any references to directions and orientations in the description of the embodiments herein are for ease of description only and should not be construed as limiting the scope of protection of the present invention. The following description of preferred embodiments involves combinations of features, which may exist independently or in combination; the present invention is not particularly limited to the preferred embodiments.

[0038] The following embodiment uses a four-beam receiving phased array antenna as an example for description.

[0039] like Figure 1 As shown, the four-beam receiving phased array antenna includes several PCB subarrays 1, R component array 4, RF extension motherboard 2, thermal control board 3, wave-controlled power supply module 5, and down-conversion amplifier module 6, as well as a lightweight integrated structural frame.

[0040] like Figure 2 The diagram shown is a schematic of the antenna of this invention. The specific composition and design of each part are as follows:

[0041] PCB subarray 1 is the key core component for achieving high integration in this invention. Within a single PCB subarray, 128 dual-layer broadband microstrip antenna radiating elements are integrated, along with power distribution networks and control signal traces for powering 32 R-component chips, a secondary feed network for four independent beams, vertical transition structures (such as vias) for electrical connections between circuit layers, and a BGA pad array for mounting the 32 R-component chips. Through precise multi-layer circuit design and manufacturing processes, the total thickness of the PCB subarray is strictly controlled to within 5 millimeters (mm), significantly saving valuable installation space and system weight compared to traditional phased array antenna implementations.

[0042] Specifically, as shown in Figure 3(w), it is a layered schematic diagram of the PCB subarray. Figures 3(a) to (v) show the PCB fabrication diagrams and BGA pad distribution diagrams for each layer. The first and second layers are antenna radiation element arrays, specifically in the form of a double-layer microstrip patch antenna. The third layer is the RF ground of the antenna radiator; the fourth layer is the RF ground of beam 1; the fifth layer is the power divider network routing layer of beam 1; the sixth layer is another RF ground of beam 1; the seventh layer is the RF ground of beam 2; the eighth layer is the power divider network routing layer of beam 2; the ninth layer is another RF ground of beam 2; the tenth layer is the RF ground of beam 3; the eleventh layer is the power divider network routing layer of beam 3; the twelfth layer is another RF ground of beam 3; the thirteenth layer is the RF ground of beam 4; the fourteenth layer is the power divider network routing layer of beam 4; the fifteenth layer is another RF ground of beam 4; the sixteenth layer is the control line shielding ground layer; the seventeenth layer is the control routing layer; the eighteenth layer is the shielding layer shared by control and power supply; the nineteenth layer is the power supply routing layer; the twentieth layer is the power supply shielding layer; and the twenty-first layer is the BGA pad layer.

[0043] This highly integrated design not only greatly reduces the space occupied by a large number of discrete R components in traditional brick-type and tile-type phased array antennas, but also significantly simplifies the interconnection design between the complex power distribution / combining network and R components in traditional multi-beam phased array antennas, reducing system complexity and potential failure points.

[0044] The R-module array 4, each R-module has a four-beam, four-channel parallel processing capability, that is, it precisely integrates 16 independent phase shift and attenuation control channels, and simultaneously integrates the first-level feed network corresponding to each beam. The complete R-module chip, including BGA ball-mounted components, has a physical size of only 9.5mm × 9.5mm × 2.5mm.

[0045] A PCB subarray and 32 R components mounted on it together constitute the smallest independently operable functional unit of a phased array antenna. Through the RF expansion motherboard 2, several such smallest functional units can be conveniently and flexibly combined to construct a phased array antenna array that meets any preset functional requirements (such as antenna gain, effective isotropic radiated power EIRP, G / T value, etc.). In the PCB subarray, direct RF signal transmission is achieved between the antenna radiating element and the RF input port of the R component chip, as well as between the secondary feed network and the RF output port of the R component chip, through vertical interconnect structures within the PCB (such as buried / blind vias, back-drilled vias, etc.). This connectorless interconnection method not only eliminates the use of traditional RF connectors (such as coaxial connectors) between RF ports and the additional insertion loss and phase inconsistency they may introduce, but also effectively reduces the overall link loss of the system and improves signal integrity while greatly compressing physical space.

[0046] The thermal control board 3, through careful optimization of the overall antenna structure, enables the PCB subarray and R component array to be tightly mounted with the thermal control board, and the other side of the thermal control board is the standard heat dissipation interface of the satellite platform.

[0047] The beam control power module 4 integrates the beam controller and power module into a compact and efficient integrated beam control power module, which is used to power the R component array and transmit beam control commands.

[0048] The downconversion amplifier module 5 is directly connected to the four independent beam output ports on the RF expansion motherboard via four high-quality RF cables. It performs low-noise amplification, filtering, and downconversion processing on the RF signals of the four independent beams converged by the RF expansion motherboard, so that they can be processed by subsequent signal processing units (such as digital receivers or demodulators).

[0049] Preferably, such as Figure 4As shown, in this embodiment, each R component is responsible for the four-beam phase shifting, attenuation control, and signal processing functions of a 2×2 antenna element subarray. Therefore, 32 R component chips are installed on the other side or in a designated area of ​​a PCB subarray 1, arranged in a 4x8 array. Correspondingly, each PCB subarray 1 receiving the phased array antenna integrates 128 antenna radiating elements. These radiating elements are preferably arranged in a regular 8x16 array. The bottom of each R component chip is designed with, for example, 260 ball grid array (BGA) pads, which are precisely aligned with the BGA pad patterns on the back of the PCB subarray 1. Through standard reflow soldering processes, multiple PCB subarrays and multiple R component chips can be batch soldered and assembled in one go with high efficiency, thereby significantly improving manufacturing efficiency and product consistency. The RF input / output ports, power supply ports, and beam control signal input ports of the R component chip are all reliably electrically connected and firmly mechanically fixed to the corresponding circuits on the PCB subarray through these BGA ball pads. The 16-channel phase shifting and attenuation function control chip inside the R component is preferably implemented using mature silicon-based CMOS or SiGeBiCMOS technology to achieve high integration and low cost advantages. As for the overall packaging of the R component chip, a ceramic package with good high-frequency characteristics and thermal stability can be selected, or a more economical plastic encapsulation process can be selected according to the specific cost control requirements of the application scenario.

[0050] Preferably, refer to Figure 5 As shown, in this embodiment, each PCB subarray 1 has four independent secondary feed network RF output ports. Each of these four RF output ports is connected to a preset input port on the RF expansion motherboard 2 for the corresponding beam via a suitable RF connection method (e.g., via the SMP connector shown in the figure). In the internal circuit design of the RF expansion motherboard 2, the signal transmission path of each beam is independent and is responsible for converging the RF signals from the same beam from different PCB subarrays 1. Finally, for a phased array antenna array of arbitrary size composed of several PCB subarrays 1, the RF expansion motherboard 2 completes the topology connection and efficient signal convergence of the entire phased array antenna system signal link through a preset, usually power-of-two combining method (e.g., two-stage, four-stage, eight-stage Wilkinson power divider / combiner network), so as to achieve the desired antenna gain and directivity.

[0051] Preferably, refer to Figure 6 As shown, in this embodiment, the thermal control board 3 is tightly mechanically pressed and has good thermal interface contact with each PCB subarray 1 and the R component array 4 mounted on it. Combined with... Figure 13 and 4, the PCB subarrays, R-component arrays, RF expansion motherboard, and thermal control board are vertically stacked to form a vertically stacked module group. The wave control power supply module and down-conversion amplifier module are horizontally arranged on the same plane as the vertically stacked module group. Specifically, the R-component array is mounted on the bottom surface of each PCB subarray, and all PCB subarrays are located on the same plane. The RF expansion motherboard is installed around all the PCB subarrays, leaving the mounting area for all R-component arrays empty. The inner surface edge area of ​​the thermal control board adopts a conformal design, consistent with the shape of the RF expansion motherboard. The middle area is tightly attached to the R-component array through a thermally conductive pad (TIM) with a high thermal conductivity of approximately 0.5 mm. The outer surface of the thermal control board is mounted on the unified heat dissipation interface of the satellite platform. The heat generated by the R-component array is directly conducted to the unified heat dissipation interface of the satellite platform through the thermally conductive pad and the thermal control board. The wave control power supply module and down-conversion amplifier module are located on both sides of the vertically stacked module group, and the bottom surfaces of all three are flush. This layout design greatly shortens the heat conduction path from the active devices to the final heat dissipation interface, making the thermal control design unprecedentedly simplified. Therefore, it is no longer necessary to rely on complex heat-conducting media or phase-change energy storage materials such as heat pipes and vapor chambers. Ordinary metallic materials with good thermal conductivity (such as aluminum alloys) can meet the system's heat dissipation requirements under high-power operation. Importantly, when the phased array antenna size is expanded according to different mission requirements (i.e., the number of subarrays is increased), since the vertical heat conduction path length of each subarray remains essentially unchanged, no major modifications to the original thermal control design are required, demonstrating excellent heat dissipation design compatibility and system scalability.

[0052] Preferably, refer to Figure 7 As shown, in this embodiment, the beam control power module 5 is electrically connected to each PCB subarray 1 through multiple independent low-frequency signal transmission cables. Considering that phased array antenna systems typically have high performance requirements for rapid switching and response time of parameters such as beam pointing and gain adjustment (e.g., when rapidly tracking moving targets or responding to dynamic communication environments), the beam control signal and the power supply to each R component array 4 in this invention preferentially adopt a parallel signal transmission and power distribution method to ensure that commands can be received and executed by each subarray almost synchronously, thereby ensuring the overall rapid response capability of the antenna system. However, in some applications where the requirements for beam switching response time are not very stringent, a serial (daisy-chain) signal transmission or power distribution method can be selected according to the actual system design trade-offs (such as simplifying wiring complexity and reducing costs).

[0053] Preferably, refer to Figure 8As shown, in this embodiment, four independent analog radio frequency beam signals derived from the radio frequency extension motherboard 2 are directly connected to the corresponding four independent radio frequency input ports on the downconversion amplifier module 6 via four high-quality coaxial radio frequency cables. The core function of the downconversion amplifier module 6 is to first perform low-noise amplification on the four radio frequency signals (which are usually located in higher operating frequency bands, such as S-band, C-band, X-band, Ku-band, or Ka-band) from the antenna array after preliminary convergence, in order to improve the system's receiving sensitivity; then, it mixes the high-frequency radio frequency signal with the local oscillator signal through a mixer to downconvert the high-frequency radio frequency signal to one or more lower intermediate frequency signals that are easier to process subsequently; at the same time, the module may also contain filters to perform in-band selection and out-of-band rejection of the signal, as well as further amplification. The processed intermediate frequency signal is then output to a subsequent digital signal processing unit (such as an ADC, FPGA, or dedicated demodulation chip) for further digitization, demodulation, and information extraction. Meanwhile, the downconversion amplifier module 6 is connected to the integrated wave control power supply module 5 through one or more dedicated low-frequency cable assemblies to obtain a stable and clean DC power supply, as well as necessary module enable, mode control or status monitoring signals.

[0054] It is understood that this invention has been described through embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this invention. Furthermore, under the teachings of this invention, these features and embodiments can be modified to adapt to specific circumstances without departing from the spirit and scope of this invention. Therefore, this invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are protected by this invention.

[0055] The contents not described in detail in this specification are common knowledge to those skilled in the art.

Claims

1. A spaceborne highly integrated phased array receiving antenna, characterized in that: It includes several PCB subarrays, R component arrays, RF expansion motherboards, thermal control boards, wave-controlled power modules, and down-conversion amplifier modules; The PCB subarray integrates the power supply and control lines for the antenna radiating element array, the secondary feed network, and the R component array, with electrical connections between layers achieved through a vertical interconnection structure; the surface is provided with a pad array for mounting the R component array; In the R component array, each R component integrates a primary power supply network and N×N independent phase shift and attenuation control channels for receiving. N is the number of beams received by the phased array antenna; A PCB subarray and the R component array mounted on it together constitute the smallest functional unit of a phased array antenna; the RF signal transmission between the antenna radiating element array and the RF input port of the R component, as well as between the RF output port of the R component and the secondary feed network, is achieved through the vertical interconnection structure inside the PCB subarray. The minimum functional units are combined and modularly connected by an RF expansion motherboard to meet different receiving requirements. In the internal circuit of the RF expansion motherboard, the signal transmission path of each antenna beam is independent, and the RF signals from the same beam from each PCB subarray are converged. The N independent RF input ports of the downconversion amplifier module are directly connected to the corresponding N independent beam output ports on the RF expansion motherboard. The RF signals of the N independent beams converged by the RF expansion motherboard are amplified, filtered and downconverted to intermediate frequency signals with low noise. The beam control power module is used to power the R component array and also for beam control command transmission; The thermal control board is used to provide heat dissipation for the receiving phased array antenna.

2. The spaceborne highly integrated receiving phased array antenna according to claim 1, characterized in that: Each PCB subarray has N independent secondary feed network RF output ports; each secondary feed network RF output port is connected to the RF input port on the RF expansion motherboard, which is used to converge and beam combine RF signals from different PCB subarrays.

3. The spaceborne highly integrated receiving phased array antenna according to claim 2, characterized in that: Each secondary power supply network RF output port is connected to the RF input port of the RF expansion motherboard using an SMP RF connector.

4. The spaceborne highly integrated receiving phased array antenna according to claim 1, characterized in that: The beam control power module is electrically connected to each PCB subarray via independent low-frequency signal transmission cables, providing parallel and synchronous power supply and beam control command transmission to the R component arrays on each PCB subarray.

5. The spaceborne highly integrated receiving phased array antenna according to claim 1, characterized in that: The R component achieves electrical interconnection and mechanical fixation with the corresponding pad array of the PCB subarray 1 through BGA ball-mounting technology.

6. The spaceborne highly integrated receiving phased array antenna according to claim 1, characterized in that: The RF expansion motherboard uses a power-of-two combining method to converge RF signals in order to achieve the desired antenna gain and directivity.

7. The spaceborne highly integrated receiving phased array antenna according to claim 1, characterized in that: The minimum functional unit, RF expansion motherboard, and thermal control board are vertically stacked to form a vertical stacked module group; the wave control power module and downconversion amplifier module are both horizontally arranged on the same plane as the vertical stacked module group.

8. The spaceborne highly integrated receiving phased array antenna according to claim 7, characterized in that: The specific composition of the vertical stacked module group is as follows: the bottom surface of each PCB subarray is equipped with an R component array, each PCB subarray is located on the same plane, and the RF expansion motherboard is installed around all the PCB subarrays, leaving the installation area of ​​all R component arrays empty. The inner surface edge area of ​​the thermal control board adopts a conformal design, which is consistent with the shape of the RF expansion motherboard, and the middle area is tightly attached to the R component array through thermal pads. The outer surface of the thermal control plate is mounted on the unified heat dissipation interface of the satellite platform; the heat generated by the R component array is directly conducted to the unified heat dissipation interface of the satellite platform through the thermal pads and the thermal control plate. The wave-controlled power supply module and the down-conversion amplifier module are located on both sides of the vertically stacked module group, with the bottom surfaces of all three being flush.

9. The spaceborne highly integrated receiving phased array antenna according to claim 1, characterized in that: The specific composition of the PCB subarray is as follows: The first and second layers are the antenna radiating element array layers. The third layer is the antenna and RF ground. The fourth layer is the RF ground for the first receiving beam. The fifth layer is the power divider network routing layer for the first receiving beam. The sixth layer is another RF ground for the first receiving beam. The seventh layer is the RF ground for the second receiving beam. The eighth layer is the power divider network routing layer for the second receiving beam. The ninth layer is another RF ground for the second receiving beam, and so on. The next layers are the RF ground, power divider network routing layer, and another RF ground for beam i, up to beam N. Finally, the 3×N+4 layer is the control line shielding ground layer. The 3×N+5 layer is the control routing layer. The 3×N+6 layer is the shielding layer shared by control and power supply. The 3×N+7 layer is the power supply routing layer. The 3×N+8 layer is the power supply shielding layer. The 3×N+9 layer is the BGA pad layer. N is the number of beams of the receiving phased array antenna.

10. The spaceborne highly integrated receiving phased array antenna according to claim 9, characterized in that: The thickness of the PCB subarray is less than 5mm.

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