Temperature adjusting box

By combining a heat exchanger and a cooling mechanism in the temperature control chamber, the problem of temperature regulation during long-term storage or transportation of objects in the warehouse is solved, achieving stable temperature maintenance and efficient management of the objects.

CN120883017APending Publication Date: 2025-10-31KOBE STEEL LTD
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Patent Information

Application Number
CN202480021634.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-03-28
Filing Date
2024-01-17
Publication Date
2025-10-31

AI Technical Summary

Technical Problem

Existing technologies make it difficult to maintain the temperature regulation of objects during long-term storage in warehouses or during transportation.

Method used

A temperature regulating chamber was designed, comprising a chamber body, a heat exchanger, a cooling mechanism, and a connecting part. The heat exchanger exchanges heat with the object through a heat carrier, and the cooling mechanism cools the heated heat carrier and then recirculates it to maintain the temperature of the object.

Benefits of technology

It effectively maintains the temperature regulation state of the object, facilitates long-term storage and transportation, and improves the efficiency and stability of the object's temperature management.

✦ Generated by Eureka AI based on patent content.

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Abstract

A temperature control box (10) is provided with: a box body (1) that forms an object accommodation space (1A) for accommodating an object (A); a heat exchanger (4) that constitutes a wall (31) that forms the object housing space (1A) in the housing (1), and that forms a heat medium flow path (40) through which a heat medium that exchanges heat with the object (A) flows; a cooling mechanism (6) that cools the heat medium flowing out from the heat medium flow path (40) and returns the cooled heat medium to the heat medium flow path (40); and a connection part (8) provided in the case (1) and connecting the cooling mechanism (6) and the heat exchanger (4).
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Description

Technical Field

[0001] This disclosure relates to a temperature control box. Background Technology

[0002] Patent Document 1 discloses a heat exchanger constructed by enclosing a tray component with internal fins using a cover component. An inlet and an outlet are provided on the surface of the cover component, allowing a heat carrier to flow in and out relative to the enclosed space. The object to be heat-exchanged or temperature-regulated is on the surface of the tray component. The heat carrier flows within the enclosed space, exchanging heat with the object via solid-state heat transfer.

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2021-103060. Summary of the Invention

[0004] The problem that the invention aims to solve When goods are stored in a warehouse for a long period of time, or when goods are moved by vehicles or loading and unloading machinery, it is difficult to use the heat exchangers mentioned above to maintain the goods in a temperature-regulated state.

[0005] The subject of this disclosure is to maintain an object in a state after temperature regulation.

[0006] Methods used to solve problems One aspect of this disclosure provides a temperature control box comprising: a box body having a wall forming an object receiving space; a heat exchanger forming part of the wall and forming a heat carrier flow path through which a heat carrier exchanges heat with the object; a cooling mechanism for cooling the heat carrier flowing out of the heat carrier flow path and returning the cooled heat carrier to the heat carrier flow path; and a connecting portion provided in the box body for connecting the cooling mechanism to the heat exchanger.

[0007] According to the above structure, an object can be housed in the object housing space of the enclosure, and the heat exchanger partially constitutes the wall of the enclosure forming the object housing space. Therefore, during the flow of the heat carrier within the heat exchanger (i.e., within the wall of the enclosure), efficient heat exchange can occur between the heat carrier and the object. The heat carrier may heat up through heat exchange with the object. A cooling mechanism is provided in the enclosure to connect the heat exchanger to a cooling mechanism, which cools the heated heat carrier and returns it to the heat carrier flow path. Since the mechanism for circulating and cooling the heat carrier is connected to the enclosure housing the object, it is easy to maintain the object in a temperature-regulated state. As an example, the object can be easily transferred while maintaining it in a temperature-regulated state.

[0008] Alternatively, the aforementioned housing may form a cooling unit housing space that is isolated from the aforementioned object housing space; the aforementioned cooling mechanism may be housed in the aforementioned cooling unit housing space in a state of being connected to the aforementioned connecting part.

[0009] According to the above structure, the cooling mechanism is integrated with the housing. Therefore, it is easy to maintain the state of the object after temperature regulation.

[0010] Alternatively, the aforementioned cooling mechanism may be housed in a separate cooling unit housing other than the aforementioned housing; the aforementioned cooling mechanism may be detachably connected to the aforementioned connecting part, and the aforementioned cooling unit housing may be detachably assembled into the aforementioned housing.

[0011] According to the above structure, the cooling mechanism is housed within a cooling unit housing and thus modularized. Since this cooling unit housing can be detachably assembled into the housing, it is easy to maintain the object's temperature after adjustment. Maintenance of the cooling mechanism is easy, and furthermore, the housing is easier to handle when temperature adjustment of the object is not required.

[0012] Alternatively, the aforementioned heat exchanger may form the bottom wall of the aforementioned housing, and the aforementioned cooling mechanism may be disposed below the aforementioned bottom wall.

[0013] According to the above structure, the heat carrier can efficiently exchange heat with the object housed in the object receiving space and placed on the bottom wall. With the cooling mechanism installed below the enclosure, the center of gravity of the temperature control box is lowered, making it easier to move the object stably.

[0014] Alternatively, the aforementioned cooling mechanism may include a compressor that compresses the aforementioned heat carrier flowing out of the aforementioned heat carrier flow path, a condenser that condenses the aforementioned heat carrier compressed by the aforementioned compressor, and an expansion valve that expands the aforementioned heat carrier condensed by the aforementioned condenser; the aforementioned object is cooled by the evaporation of the aforementioned heat carrier expanded by the aforementioned expansion valve as it flows through the aforementioned heat carrier flow path in the aforementioned heat exchanger.

[0015] Based on the above structure and the principle of vapor compression refrigeration cycle, the heat exchanger functions as an evaporator, and can cool the object.

[0016] Alternatively, the aforementioned cooling mechanism may have a Peltier element that cools the aforementioned heat carrier, which has been heated during the flow of the aforementioned heat carrier.

[0017] Based on the above structure, an object can be cooled by a heat exchanger using a simple structure that utilizes Peltier elements.

[0018] Alternatively, the aforementioned heat exchanger may include: a flow path forming plate having a flow path and a groove recessed in the flow path; and a temperature regulating plate having a cover overlapping the flow path and a heat exchange surface close to the object on the opposite side of the cover; the aforementioned heat carrier flow path is formed by covering the groove with the aforementioned cover.

[0019] Based on the above structure, since the heat exchanger is formed by stacking two plates, it is easy to manufacture the heat exchanger. In addition, the thermal resistance of the heat exchanger is reduced, which improves the heat exchange performance.

[0020] Alternatively, it may also have a cover made of heat-insulating material that can openly close the opening on the upper side of the aforementioned object-containing space.

[0021] Based on the above structure, with the object containing space closed by the lid, the temperature of the object can be easily managed to reach the target temperature by utilizing the insulation effect of the lid. Since the object containing space can be opened by operating the lid, it is easier to retrieve and place the object relative to the object containing space.

[0022] Invention Effects According to this disclosure, it is possible to maintain the object in a state of temperature regulation. Attached Figure Description

[0023] Figure 1 This is an exploded perspective view of the temperature control box according to the first embodiment.

[0024] Figure 2 This is an unfolded diagram of the outer box.

[0025] Figure 3 This is an unfolded diagram of the inner box.

[0026] Figure 4 It is a three-dimensional view showing the temperature control box in its assembled state, except for the lid.

[0027] Figure 5 This is a cross-sectional view of the temperature control box.

[0028] Figure 6A This is a cross-sectional view of the connection section, showing the connection with the cooling mechanism removed.

[0029] Figure 6B This is a cross-sectional view of the connection section, showing the connection with the cooling mechanism installed.

[0030] Figure 7 This is a cross-sectional view of the temperature control box according to the second embodiment.

[0031] Figure 8A This is a cross-sectional view of the temperature control box of the third embodiment, with the cooling unit box and cover removed.

[0032] Figure 8B This is a cross-sectional view of a temperature control box, showing the box with the cooling unit housing and cover installed. Detailed Implementation

[0033] Hereinafter, the embodiments will be described with reference to the accompanying drawings. The same or corresponding elements are given the same reference numerals throughout the drawings, and repetition of detailed descriptions is omitted.

[0034] (First Embodiment) Reference Figure 1 The temperature control box 10 according to the first embodiment includes a box body 1, a heat exchanger 4, a heat insulation component 5, a cooling mechanism 6, a cover 7, and connecting parts 8A and 8B. The box body 1 has a double-layer structure consisting of an outer box 2 and an inner box 3. Both the outer box 2 and the inner box 3 are cuboids with openings to the upward side.

[0035] The outer casing 2 has a rectangular bottom wall 21 in top view, a pair of first peripheral walls 22 erected on a pair of short edges of the bottom wall 21, and a pair of second peripheral walls 23 erected on a pair of long edges of the bottom wall 21. Each peripheral wall 22, 23 is rectangular in side view.

[0036] The inner casing 3 has a rectangular bottom wall 31 in top view, a pair of first peripheral walls 32 erected on a pair of short edges of the bottom wall 31, and second peripheral walls 33 erected on a pair of long edges of the bottom wall 31. Each peripheral wall 32, 33 is rectangular in side view. The inner casing 3 has a pair of first flanges 34 extending from the upper edges of the pair of first peripheral walls 32 in opposite directions (the length direction of the bottom wall 31) of the first peripheral walls 32, and a pair of second flanges 35 extending from the upper edges of the pair of second peripheral walls 33 in opposite directions (the width direction of the bottom wall 31) of the second peripheral walls 33. The four flanges 34, 35 are rectangular in shape with the amount of protrusion from the peripheral walls 32, 33 as the shorter side length. The longer side length of the first flange 34 is equal to the length of the upper edge of the corresponding first peripheral wall 32. The second flange 35 protrudes from the peripheral wall 32 by the amount by which the first flange 34 protrudes from the peripheral wall 32, relative to the upper edge of the corresponding second peripheral wall 33. Therefore, the long side of the first flange 34 and the short side of the second flange 35 are connected in a straight line in top view, and the four flanges 34 and 35 as a whole form a rectangular window frame shape in top view.

[0037] Reference Figure 2 The outer casing 2 is constructed by bending a single sheet of aluminum alloy. The peripheral walls 22, 23 are seamlessly connected to the bottom wall 21. Adjacent peripheral walls 22, 23 are joined together by welding.

[0038] Reference Figure 3The inner casing 3 is also constructed by bending a single sheet of aluminum alloy. The peripheral walls 32 and 33 are seamlessly connected to the bottom wall 31, and the flanges 34 and 35 are seamlessly connected to their corresponding peripheral walls 32 and 33. Adjacent peripheral walls 32 and 33 are joined by welding. Adjacent flanges 34 and 35 are joined by welding.

[0039] Reference Figure 1 , Figure 4 and Figure 5 The inner box 3 is housed within the outer box 2, thus forming the box body 1. In top view, the flanges 34 and 35 have approximately the same shape as the opening of the outer box 2, with the outer periphery of the flanges 34 and 35 approaching the edge of the opening of the outer box 2. A cooling mechanism 6 and a heat insulation member 5 are mounted on the bottom wall 21 of the outer box 2, and the inner box 3 is then mounted on it. The bottom wall 31 of the inner box 3 is located above the bottom wall 21 of the outer box 2. The inner box 3 is shorter than the outer box 2, while the upper surfaces of the flanges 34 and 35 are at approximately the same height as the upper end of the outer box 2.

[0040] The enclosure 1 forms an object receiving space 1A, a cooling unit receiving space 1B, and an insulation filling space 1C. The object receiving space 1A is isolated from the cooling unit receiving space 1B and the insulation filling space 1C. The cooling unit receiving space 1B and the insulation filling space 1C are defined by the inner surface of the outer enclosure 2 and are continuous in the vertical direction.

[0041] Object A is contained in object containing space 1A. Object containing space 1A is formed inside inner box 3. In other words, object containing space 1A is defined by the inner surfaces of bottom wall 31 and peripheral walls 32 and 33 of inner box 3.

[0042] Insulation component 5 is filled into insulation component filling space 1C. Insulation component 5 has a bottom wall portion 51 and a peripheral wall portion 52, and is box-shaped with an opening on the upper side. The peripheral wall portion 52 of insulation component 5 is filled in the portion of insulation component filling space 1C defined by the inner surfaces of the peripheral walls 22 and 23 of outer box 2 and the outer surfaces of the peripheral walls 32 and 33 of inner box 3. This portion is closed by four flanges 34 and 35. The bottom wall portion 51 of insulation component 5 is filled in the portion below the outer surface of the bottom wall 31 of inner box 3 in insulation component filling space 1C.

[0043] The cooling unit housing space 1B houses the cooling mechanism 6. The cooling unit housing space 1B is located below the insulation filling space 1C and is defined by the inner surface of the bottom wall 21 of the outer casing 2, the inner surfaces of the lower ends of the peripheral walls 22 and 23 of the outer casing 2, and the bottom surface of the bottom wall portion 51 of the insulation component 5. The cooling mechanism 6 is covered by an insulating cover 59. The cover 59 has a cuboid shape.

[0044] The cooling mechanism 6 is housed inside the outer casing 2, covered by the cover 59. A box-shaped heat-insulating member 5 is housed inside the outer casing 2 and placed on the cover 59. Thus, the cooling unit housing space 1B is filled by the cover 59. The inner casing 3 is housed inside the outer casing 2 (in other words, inside the box-shaped heat-insulating member 5) and placed on the bottom wall 51 of the heat-insulating member 5. A heat-insulating member filling space 1C is formed on the outer surface of the inner casing 3 and filled by the heat-insulating member 5. On the other hand, an object housing space 1A is formed on the inner surface of the inner casing 3 and is open upwards.

[0045] The cover 7 can openably close the opening of the housing 1 (in other words, the opening of the inner housing 3 or the opening of the object receiving space 1A). The cover 7 has a fitting portion 71 that fits tightly against the upper end of the inner surface of the peripheral walls 32 and 33 of the inner housing 3, and a mounting portion 72 that is provided above the fitting portion 71 and fits tightly against the upper surface of the flanges 34 and 35 of the inner housing 3. The cover 7 is constructed by covering the surface of the heat insulation member 73 with a sheet of aluminum alloy 74. Through the fitting portion 71 and the mounting portion 72 fitting tightly against the inner housing 3, the object receiving space 1A is insulated from external air.

[0046] Reference Figure 1 and Figure 5 The heat exchanger 4 is installed on the wall of the housing 1, which forms the object receiving space 1A. The object receiving space 1A is defined by the bottom wall 31 of the inner housing 3 and the four peripheral walls 32 and 33. In this embodiment, the heat exchanger 4 is partially formed by the bottom wall 31 of the inner housing 3.

[0047] The heat exchanger 4 is constructed by bonding two plates together. The bottom wall 31 of the inner casing 3 functions as one of the plates (i.e., the temperature regulating plate). The other plate is a flow path forming plate 41. The flow path forming plate 41 is a separate part from the outer casing 2 and the inner casing 3. The flow path forming plate 41 has a flow surface 41a and a groove 42 recessed in the flow surface 41a. The outer surface of the bottom wall 31, which serves as the temperature regulating plate, is a cover 31a that overlaps with the flow surface 41a to close the groove 42. The inner surface of the bottom wall 31 is a heat exchange surface 31b that holds and contacts the object A housed in the object housing space 1A. By closing the groove 42 with the cover 31a, a heat carrier flow path 40 is formed for the flow of the heat carrier. During the flow of the heat carrier in the heat carrier flow path 40, the heat carrier exchanges heat with the object A on the heat exchange surface 31b through the solid heat transfer of the bottom wall 31.

[0048] Furthermore, the bottom wall portion 51 of the heat insulation member 5 contacts the lower surface of the flow path forming plate 41 (the surface opposite to the flow path 41a). A protrusion is provided on the lower surface side of the flow path forming plate 41 due to the presence of the groove 42. To facilitate contact with this lower surface side, a recess 51a is formed on the upper surface of the bottom wall portion 51 to engage the protrusion.

[0049] The channel 42 extends meanderingly, encompassing the flow path 41a of the flow path forming plate 41. The channel 42 does not branch or merge along its length. The heat transfer fluid flow path 40 is formed by the closure of this channel 42, creating a single, unidirectional flow path within the heat exchanger 4 (i.e., between the temperature regulating plate and the flow path forming plate). The heat exchanger 4 has an inlet 43A for the heat transfer fluid to flow into the heat transfer fluid flow path 40 and an outlet 43B for the heat transfer fluid to flow out of the heat transfer fluid flow path 40. The inlet 43A opens at one end of the heat transfer fluid flow path 40, and the outlet 43B opens at the other end of the heat transfer fluid flow path 40.

[0050] The cooling mechanism 6 cools the heat carrier flowing out of the heat carrier flow path 40, allowing the cooled heat carrier to return to the heat carrier flow path 40. Therefore, the cooling mechanism 6 has a circulation path 60 that connects to the outlet 44 and the inlet 43A, circulating the heat carrier. The cooling mechanism 6 is located below the bottom wall 31 of the inner casing 3. The inlet 43A and outlet 43B open at their respective bottom surfaces at both ends of the groove 42, extending downwards from the flow path forming plate 41 toward the cooling mechanism 6.

[0051] The cooling mechanism 6 also includes a compressor 61, a condenser 62, and an expansion valve 63. The compressor 61, condenser 62, and expansion valve 63 are arranged in this order on the circulation path 60 in the direction of heat carrier flow (from the outlet 43B side towards the inlet 43A side). The compressor 61 compresses the heat carrier of the gas flowing out of the heat carrier flow path 40. The condenser 62 cools the heat carrier compressed by the compressor 61, causing it to condense. The expansion valve 63 causes the heat carrier cooled by the condenser 62 to expand under reduced pressure. A low-temperature, low-pressure liquid heat carrier is supplied to the heat carrier flow path 40. During its flow through the heat carrier flow path 40, the heat carrier absorbs heat from the object A and changes into vapor, and the object A is cooled by the heat of vaporization. According to the principle of the vapor compression refrigeration cycle, the heat exchanger 4 functions as an evaporator. Thus, cold can be applied to the object A, and the object A is refrigerated within the object containing space 1A.

[0052] The cooling mechanism 6 also includes a battery 68, a controller 69, and a property sensor (not shown). The battery 68 powers the compressor 61 and the controller 69. A plug (not shown) electrically connected to the battery 68 is provided on the outer surface of the peripheral walls 22 and 23 of the outer casing. The battery 68 can be charged by supplying power to the plug from outside the temperature control box 10 using a commercial power supply or similar source. The property sensor detects the properties of the heat carrier flowing through the circulation path 60, such as temperature, pressure, and / or flow rate. The controller 69 controls the operation of the cooling mechanism 6 (specifically, the compressor speed, etc.) based on the detection results of the property sensor, thereby maintaining the object A at the target temperature.

[0053] The compressor 61 is driven by an electric motor (not shown). The expansion valve 63 only needs to have a throttling function, including the concept of a capillary tube. The battery 68 can take any form as long as it can be charged and discharged. The controller 69 is a computer with a CPU, memory, and input / output interfaces. The CPU processes information in the order instructed by the program stored in memory, thereby executing the required control. Thus, the temperature regulation of the object A using the cooling mechanism 6 is automated.

[0054] Connecting portions 8A and 8B are provided in the housing 1, connecting the cooling mechanism 6 to the heat exchanger 4. In this embodiment, the housing 1 forms an object receiving space 1A and a cooling unit receiving space 1B isolated from the object receiving space 1A. The cooling mechanism 6 is received in the cooling unit receiving space 1B in a state of being connected to the heat exchanger 4 via connecting portions 8A and 8B. Connecting portion 8B connects the outlet 43B of the heat exchanger 4 to the inlet 60B of the circulation path 60. Connecting portion 8A connects the outlet 60A of the circulation path 60 to the inlet 43A of the heat exchanger 4.

[0055] Reference Figure 6A and Figure 6B As a simple example, the connecting part 8A has a guide tube 84A that is inserted into the inlet 43A, extends downward from the flow path forming plate 41, and passes through the bottom wall portion 51 of the insulation member 5, and a connector 80A that connects the guide tube 84A to the outlet 60A of the circulation path 60. The guide tube 84A is open at both ends. The connector 80A has a first connector 85A provided on the bottom surface side of the bottom wall portion 51, and a second connector 86A provided on the upper surface side of the cover member 59. As a simple example, the first connector 85A is female and the second connector 86A is male. The first connector 85A is formed by a hole recessed in the bottom surface of the bottom wall portion 51 of the insulation member 5. The front end of the guide tube 84A is located at the center of the first connector 85A. The second connector 86A is cylindrical and protrudes upward from the upper surface of the cover member 59. The outer diameter of the second connector 86A is equal to the inner diameter of the first connector 85A, and the inner diameter of the second connector 86A is equal to the outer diameter of the conductive tube 84A. Furthermore, the connecting part 8B is constructed in the same manner.

[0056] Therefore, if the upper surface of the cover 59 is overlapped with the lower surface of the bottom wall 51 with the insulation 5 installed on the lower surface of the heat exchanger 4, the second connectors 86A and 86B are connected to the first connectors 85A and 85B and fitted into the conductive pipes 84A and 84B. Thus, the cooling mechanism 6 is mechanically connected to the heat exchanger 4. Furthermore, the heat transfer fluid flow path 40 is fluidly connected to the circulation path 60 via the hollow spaces of the conductive pipes 84A and 84B and the second connectors 86A and 86B, forming a closed loop for circulating the heat transfer fluid.

[0057] According to the above structure, the temperature control box 10 includes: a box body 1 having walls 31 to 33 forming an object receiving space 1A for containing object A; a heat exchanger 4 forming part of the walls 31 to 33 (for example, the bottom wall 31) forming a heat carrier flow path 40 through which heat carriers exchange heat with object A; a cooling mechanism 6 cooling the heat carrier flowing out of the heat carrier flow path 40 and returning the cooled heat carrier to the heat carrier flow path 40; and connecting parts 8A and 8B provided in the box body 1 to connect the cooling mechanism 6 to the heat exchanger 4.

[0058] Therefore, as the heat carrier flows through the heat carrier flow path 40 within the heat exchanger 4 (i.e., within the wall of the housing 1), efficient heat exchange can occur between the heat carrier and the object A. The heat carrier heats up through heat exchange with the object A. The housing 1 is equipped with a cooling mechanism 6 that connects the heat exchanger 4 to the cooling mechanism 6. The cooling mechanism 6 cools the heated heat carrier and returns it to the heat carrier flow path 40. Since the mechanism for circulating and cooling the heat carrier is connected to the housing 1 containing the object A, it is easy to maintain the object A in a temperature-regulated state. As an example, the object A can be easily transferred while maintaining it in a temperature-regulated state.

[0059] The housing 1 forms a cooling unit housing space 1B that is isolated from the object housing space 1A. The cooling mechanism 6 is housed in the cooling unit housing space 1B in a state connected to the connecting parts 8A and 8B. Since the cooling mechanism 6 is integrated with the housing 1, it is easy to maintain the state after the object A has been conditioned.

[0060] The heat exchanger 4 forms the bottom wall 31 of the housing 1 (particularly the inner housing 3), and the cooling mechanism 6 is disposed below this bottom wall 31. The heat carrier can efficiently exchange heat with the object A, which is housed in the object housing space 1A and placed on the bottom wall 31, via solid-state heat transfer through the bottom wall 31. The installation of the cooling mechanism 6 below the housing 1 lowers the center of gravity of the temperature control box 10. This facilitates the stable transfer of the object A when using loading and unloading machinery.

[0061] The cooling mechanism 6 includes a compressor 61 that compresses the heat carrier flowing out of the heat carrier flow path 40, a condenser 62 that condenses the heat carrier compressed by the compressor 61, and an expansion valve 63 that expands the heat carrier condensed by the condenser 62. The heat carrier, expanded by the expansion valve 63, evaporates as it flows through the heat carrier flow path 40 within the heat exchanger 4, thus cooling the object A. Based on the principle of the vapor compression refrigeration cycle, the heat exchanger 4 functions as an evaporator, cooling the object A and refrigerating it within the object storage space 1A.

[0062] The temperature control box 10 also includes a cover 7, which is made of heat-insulating material and can be opened and closed to the opening on the upper side of the object receiving space 1A. When the object receiving space 1A is closed with the cover 7, the temperature of the object A can be easily controlled to the set target temperature by means of the heat insulation effect of the cover 7. Since the object receiving space 1A can be opened by operating the cover 7, it is easier to take the object A out of the object receiving space 1A.

[0063] The heat exchanger 4 includes: a flow path forming plate 41 having a flow path 41a and a groove 42 recessed in the flow path 41a; and a temperature regulating plate (e.g., a bottom wall 31) having a cover surface 31a overlapping the flow path 41a and a heat exchange surface 31b close to the object A on the opposite side of the cover surface 31a; the heat carrier flow path 40 is formed by covering the groove 42 with the cover surface 31a. Since the heat exchanger 4 is formed by bonding two plates, it is easy to manufacture the heat exchanger 4. In addition, the thermal resistance of the heat exchanger 4 is reduced, and the heat exchange performance is improved.

[0064] Reference Figure 6A or Figure 6B The bottom wall 31a of the temperature regulating plate and the flow path 41a of the flow path forming plate 41 are both covered with a non-polar resin film 49. The film 49 is formed by chemically converting the surface of the aluminum alloy plate raw material, applying an adhesive with non-polar resin as the main component to the chemically converted surface, and drying the applied adhesive. The film 49 consists of a chemically converted layer 49a formed on the surface of the plate raw material and a resin layer 49b laminated on the chemically converted layer 49a. The film 49 has hot melt adhesive properties. The bottom wall 31 of the temperature regulating plate and the flow path forming plate 41 are bonded together by hot melt adhesive. Compared with brazing, the heat exchanger 4 and the housing 1 can be enlarged, and the volume of the object receiving space 1A can be enlarged. The part other than the surface that defines the heat carrier flow path 40 contributes to the bonding. Conversely, the film 49 remains on the surface that defines the heat carrier flow path 40. Because the coating 49 is made of non-polar resin, it can prevent corrosion of the aluminum alloy temperature control plate and flow path forming plate 41 even if the heat carrier is alkaline. In addition, since the thickness of the coating 49 is a few μm to tens of μm, the thermal resistance of the heat exchanger 4 is not increased, and the heat exchange performance is maintained at a high level.

[0065] (Second Implementation) Next, refer to Figure 7 The temperature control chamber 210 of the second embodiment will be described, focusing on its differences from the first embodiment. In this embodiment, the structure of the cooling mechanism 206 differs from that of the first embodiment.

[0066] The cooling mechanism 206 includes a circulation path 60, a battery 68, a controller 69, a cooling chamber 261 containing a Peltier element, and a pump 262. The cooling chamber 261 and the pump 262 are disposed on the circulation path 60. In the example shown, the cooling chamber 261 is configured on the inlet 60B side relative to the pump 262, but the configuration can also be reversed.

[0067] The Peltier element itself is well-known, so an explanation of its operating principle is omitted. The Peltier element is a thermoelectric element that utilizes the Peltier effect, possessing the function of consuming electricity to move heat. Battery 68 functions as the power source for both the Peltier element and pump 262. Controller 69 controls the operation of the Peltier element and pump 262, controlling the temperature of the heat carrier and object A to the set target temperature.

[0068] The heat transfer medium is pressurized by pump 262 and supplied to heat exchanger 4 via outlet 60A and connection 8A of circulation path 60, and flows into heat transfer medium flow path 40 via inlet 43A. During its flow through heat transfer medium flow path 40, the heat transfer medium exchanges heat with object A through solid heat transfer via the bottom wall 31, which serves as a temperature regulating plate. The heat transfer medium flows out of heat transfer medium flow path 40 via outlet 43B and flows into circulation path 60 via connection 8B and inlet 60B. During its flow through circulation path 60, the heat transfer medium is cooled in cooling chamber 261. Additionally, a device (not shown) is provided in temperature regulating chamber 210 to discharge heat removed from the heat transfer medium by the Peltier element to the outside of temperature regulating chamber 210. The heat transfer medium can cool the object A within heat exchanger 4, maintaining object A at a low temperature. Even if the heat transfer medium heats up through heat exchange with object A, it is cooled down in cooling chamber 261.

[0069] According to this embodiment, the object can be cooled by the heat exchanger 4 using a simple structure employing a Peltier element. This simplifies the lower structure of the temperature control chamber 210.

[0070] (Third implementation) Next, refer to Figure 8A and Figure 8B The temperature control chamber 310 of the third embodiment will be described, focusing on its differences from the embodiments described above. The cooling mechanism 206 itself is the same as that of the second embodiment, but this embodiment differs from all the embodiments described above in that the cooling mechanism 206 can be detached from the chamber 1.

[0071] The outer casing 2 forms an object receiving space 1A and an insulation filling space 1C. The insulation 5 is mounted on the bottom wall 21 of the outer casing 2. The cooling mechanism 6 is housed in a separate cooling unit housing 9, other than the casing 1. The cooling unit housing 9 is detachably assembled relative to the casing 1. The connecting parts 308A and 308B have a structure substantially the same as in the embodiment described above, but differ from the embodiment in that they are separately provided in the casing 1 and the separate cooling unit housing 9. Thus, the cooling mechanism 6 can be separated from the heat exchanger 4 depending on the situation.

[0072] The cooling unit housing 9 is rectangular, forming a sealed cooling unit housing space 9B. The cooling unit housing 9 has a rectangular bottom wall 91 in top view, an upper wall 92 located above the bottom wall 91, and peripheral walls 93 connecting the edges of the bottom wall 91 and the edges of the upper wall 92 vertically. The cooling unit housing space 9B is defined by the inner surfaces of these walls 91 to 93.

[0073] The cooling mechanism 206 is covered by a heat-insulating cover 59, which is rectangular in shape with the same shape as the cooling unit housing space 9B. The cooling mechanism 206 is housed in the cooling unit housing space 9B while covered by the cover 59, and the cover 59 fills the cooling unit housing space 9B.

[0074] The conductive pipes 384A and 384B are arranged in the same manner as in the embodiment described above. In this embodiment, the front ends of the conductive pipes 384A and 384B penetrate the bottom wall 51 of the insulation member 5 and the bottom wall 21 of the outer casing 2, protruding downward relative to the casing 1. The connectors 380A and 380B are formed by the first connectors 381A and 381B on the side of the casing 1 and the second connectors 389A and 389B on the side of the cooling unit casing 9. The first connectors 381A and 381B are formed by the front ends of the conductive pipes 384A and 384B and are male. The second connectors 389A and 389B are formed by the recesses formed on the upper wall of the cooling unit casing 9 and are female.

[0075] If the upper surface of the upper wall 92 of the cooling unit housing 9 is overlapped with the bottom surface of the housing 1 (the outer surface of the bottom wall 21 of the outer housing 2), then the second connectors 389A and 389B are connected to the first connectors 381A and 381B. Thus, the cooling mechanism 6 is mechanically connected to the heat exchanger 4. Furthermore, the heat transfer fluid flow path 40 is fluidly connected to the circulation path 60 via the conductive pipes 384A and 384B, forming a closed loop for circulating the heat transfer fluid.

[0076] According to this embodiment, the cooling mechanism 206 is housed in the cooling unit housing 9 and thus modularized. Since the cooling unit housing 9 can be detachably assembled to the housing 1, it is easy to maintain the state after the object A has been conditioned. Maintenance of the cooling mechanism 206 is easy, and the housing 1 is easier to handle when temperature conditioning of the object A is not required. Furthermore, if the cooling unit housing 9 can be separated from the housing 1, it can also replace the cooling mechanism 206 and house the cooling mechanism 6 operating in the same vapor compression refrigeration cycle as in the first embodiment.

[0077] (Variation example) The above-described implementation is an example, and the above structure can be appropriately added to, modified, or removed within the scope of this disclosure.

[0078] In the above embodiment, the heat exchanger 4 partially constitutes the bottom wall 31 of the inner casing 3. The heat exchanger 4 may also constitute other walls forming the object receiving space 1A, such as one of the peripheral walls 32 or 33 of the inner casing 3. Multiple heat exchangers 4 may also each constitute two or more walls.

[0079] This disclosure may include the following methods.

[0080] (Method 1) A temperature control box includes: a box body having a wall forming an object receiving space; a heat exchanger forming part of the wall and forming a heat carrier flow path through which a heat carrier exchanges heat with the object; a cooling mechanism that cools the heat carrier flowing out of the heat carrier flow path and returns the cooled heat carrier to the heat carrier flow path; and a connecting part provided in the box body to connect the cooling mechanism to the heat exchanger.

[0081] (Method 2) As described in Method 1, the temperature control box forms a cooling unit receiving space that is isolated from the object receiving space; the cooling mechanism is received in the cooling unit receiving space in a state of being connected to the connecting part.

[0082] (Method 3) As described in Method 1, the aforementioned cooling mechanism is housed in a separate cooling unit housing other than the aforementioned housing; the aforementioned cooling mechanism is detachably connected to the aforementioned connecting part, and the aforementioned cooling unit housing is detachably assembled into the aforementioned housing.

[0083] (Method 4) As in any one of the temperature control boxes of methods 1 to 3, the aforementioned heat exchanger forms the bottom wall of the aforementioned box body, and the aforementioned cooling mechanism is disposed below the aforementioned bottom wall.

[0084] (Method 5) The temperature control box according to any one of methods 1 to 4, the aforementioned cooling mechanism has a compressor that compresses the aforementioned heat carrier flowing out of the aforementioned heat carrier flow path, a condenser that condenses the aforementioned heat carrier compressed by the aforementioned compressor, and an expansion valve that expands the aforementioned heat carrier condensed by the aforementioned condenser; the aforementioned object is cooled by evaporating the aforementioned heat carrier expanded by the aforementioned expansion valve in the process of flowing through the aforementioned heat carrier flow path in the aforementioned heat exchanger.

[0085] (Method 6) The temperature control box as described in any one of embodiments 1 to 4, wherein the cooling mechanism has a Peltier element that cools the heat carrier that has been heated during the flow of the heat carrier in the flow path.

[0086] (Method 7) The temperature regulating box according to any one of embodiments 1 to 6, wherein the heat exchanger comprises: a flow path forming plate having a flow path and a groove recessed in the flow path; and a temperature regulating plate having a cover surface overlapping the flow path and a heat exchange surface close to the object on the opposite side of the cover surface; wherein the heat carrier flow path is formed by covering the groove with the cover surface.

[0087] (Method 8) The temperature control box according to any one of methods 1 to 7 further includes a cover made of an insulating member that can open and close the opening on the upper side of the object receiving space.

[0088] This application is accompanied by a priority claim based on Japanese Patent Application No. 2023-051510, filed on March 28, 2023. No. 2023-051510 is incorporated herein by reference.

[0089] Explanation of reference numerals in the attached figures 1. Box 1A Object containment space 1B Cooling unit containment space 1C Insulation component filling space 2 outer box 21 bottom wall 22nd and 23rd Zhou Bi 3. Inner Box 31 bottom wall 31a Cover 31b Heat exchange surface 32, 33 Zhou Bi Flanges 34 and 35 4. Heat exchanger 40 Heating medium flow path 41 Flow path forming plate 41a Flowing surface 42 slots 43A Inlet 43B Outlet 49. Membrane 49a Chemical conversion treatment layer 49b Resin Layer 5 Insulation components 51 bottom wall 52. Perimeter of the wall 59, 359 Cover Parts 6. 206 Cooling Mechanism 60 loop 60A Outlet 60B Inlet 61 Compressor 62 Condenser 63 Expansion Valve 68 batteries 69 Controller 261 Cooling Chamber 262 pump 7. Cover 71 Chimeric part 72. Loading section 73 Insulation components 74 Metal Sheets 8A and 8B connecting parts 80A and 80B connectors 84A and 84B conductive tubes 85A, 85B Connector 1 86A, 86B Connector 2 308A and 308B connection parts 380A and 380B connectors 381A, 381B Connector 1 384A and 384B conductive tubes 389A, 389B Connector 2 9. Cooling Unit Housing 9B Cooling unit containment space 91 bottom wall 92 upper wall 93 Zhou Bi 10, 210, 310 Temperature Control Boxes A. Object.

Claims

1. A temperature regulating box, characterized in that, have: A box, having walls that form a containment space for the contained object; A heat exchanger, which forms part of the aforementioned wall, forms a heat carrier flow path through which heat carriers exchange heat with the aforementioned object. The cooling mechanism cools the heat carrier flowing out of the aforementioned heat carrier flow path, and returns the cooled heat carrier to the aforementioned heat carrier flow path. as well as A connecting part is provided in the aforementioned housing to connect the aforementioned cooling mechanism to the aforementioned heat exchanger.

2. The temperature regulating box as described in claim 1, characterized in that, The aforementioned enclosure forms a cooling unit containment space that is isolated from the aforementioned object containment space; The aforementioned cooling mechanism is housed in the aforementioned cooling unit housing space in a state of connection with the aforementioned connecting part.

3. The temperature regulating box as described in claim 1, characterized in that, The aforementioned cooling mechanism is housed in a separate cooling unit housing, other than the aforementioned housing. The aforementioned cooling mechanism can be detachably connected to the aforementioned connecting part, and the aforementioned cooling unit housing can be detachably assembled into the aforementioned housing.

4. The temperature regulating box as described in any one of claims 1 to 3, characterized in that, The aforementioned heat exchanger forms the bottom wall of the aforementioned housing, and the aforementioned cooling mechanism is located below the aforementioned bottom wall.

5. The temperature regulating box as described in any one of claims 1 to 3, characterized in that, The aforementioned cooling mechanism includes a compressor that compresses the aforementioned heat carrier flowing out of the aforementioned heat carrier flow path, a condenser that condenses the aforementioned heat carrier after it has been compressed by the aforementioned compressor, and an expansion valve that expands the aforementioned heat carrier after it has been condensed by the aforementioned condenser. The object is cooled as the heat carrier, after being expanded by the expansion valve, evaporates in the heat carrier flow path within the heat exchanger.

6. The temperature control box as described in any one of claims 1 to 3, characterized in that, The aforementioned cooling mechanism has a Peltier element that cools the aforementioned heat carrier, which has been heated during the flow of the aforementioned heat carrier.

7. The temperature regulating box as described in any one of claims 1 to 3, characterized in that, The aforementioned heat exchanger has: A flow path forming plate has a flow path and a groove recessed in the aforementioned flow path; and The temperature regulating plate has a cover surface that overlaps with the aforementioned flow surface and a heat exchange surface that is close to the object on the opposite side of the aforementioned cover surface; The aforementioned heat transfer fluid flow path is constructed by covering the aforementioned groove with the aforementioned cover.

8. The temperature regulating box as described in any one of claims 1 to 3, characterized in that, It also has a cover made of heat-insulating material that can openly close the opening on the upper side of the aforementioned object-containing space.

Citation Information

Patent Citations

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