Electrode plate coated by lead spray and method for manufacturing same

Abstract

The present invention relates to an electrode plate using a lead spray coating and a method for manufacturing the same, and more particularly, to an electrode plate using an improved lead spray coating and a method for manufacturing the same, which enable a copper foil to be manufactured in a copper foil manufacturing process related to a secondary battery technology, a circuit board manufacturing technology, and the like. As a result, it is possible to provide an electrode plate for a secondary battery or the like, which is economical and excellent in corrosion resistance due to the use of lead (Pb), to improve the state of the copper foil surface. The present invention provides a method for manufacturing an electrode plate by means of lead spray coating, comprising: (a) a step for preparing a metal substrate; (b) a step for melting lead (Pb) at a high temperature; (c) forming a lead coating layer by applying the molten lead to the surface of the metal substrate at a predetermined thickness by a meltallizing method; and (d) cooling and solidifying the lead coating layer.

Description

TECHNICAL FIELD

[0001] The present application relates to an electrode plate and a manufacturing method thereof for secondary battery technology, circuit board technology, and the like, and more particularly, to an electrode plate and a manufacturing method thereof using improved lead sputtering coating, which makes it possible to provide an electrode plate for a secondary battery or the like having economic efficiency and excellent corrosion resistance using lead (Pb) to improve the state of a copper foil surface in a copper foil manufacturing process related to secondary battery technology, circuit board manufacturing technology, and the like. BACKGROUND

[0002] Generally, a copper foil is used to manufacture a cathode for a secondary battery, a flexible printed circuit board (FPCB), and various other products.

[0003] Such a copper foil is manufactured by an electroplating method in which an electrolyte is supplied between an anode and a cathode and an electric current is caused to flow.

[0004] Figure 6 FIG. 1 illustrates a configuration of an electrolytic copper foil device for forming the above-described copper foil by an electrolysis method. Referring to FIG. 1, an electrolytic copper foil device 30 includes a drum roll 31 as a cathode electrode and an electrolytic cell 35 rotatably supporting the drum roll 31 to constitute. Figure 6

[0005] In addition, the electrolytic cell 35 has a frame 36, a pair of anode bases 46, 51, a power supply bus 60, and an electrolyte supply nozzle 70. Also, the pair of anode bases 46, 51 are formed to be curved into a curved surface in a manner of being spaced apart from a lower portion of an outer circumferential surface of the drum roll 31.

[0006] On the other hand, a plurality of thin electrode plates are attached to inner side surfaces of the pair of anode bases 46, 51 facing the outer circumferential surface of the drum roll 31. In addition, a gap is formed between the plurality of electrode plates and the outer circumferential surface of the drum roll 31.

[0007] In addition, the power supply bus 60 is intended to supply an electric current to the anode bases 46 and the plurality of electrode plates attached thereto.

[0008] Further, the electrolyte supply nozzle 70 supplies an electrolyte into the electrolytic cell 35 and is disposed between the left and right anode bases 46, 51.

[0009] In addition, in the conventional copper foil manufacturing process, a DSA electrode based on iridium oxide (IrO2) is mainly used.

[0010] ​However, the above iridium, although providing high performance, is extremely rare and expensive, and there is a risk of long-term supply shortage. Therefore, the demand for low-cost, high-corrosion-resistant alternative electrodes is increasing.

[0011] In addition, lead (Pb) is inexpensive, has excellent corrosion resistance in a sulfuric acid-based electrolyte, and has the characteristic of spontaneously forming a protective oxide film (PbO).

[0012] However, there are limitations in applying lead only through the above plating method in the past, and there are problems in that uniform thickness and attachment force cannot be ensured.

[0013] Prior Art Documents

[0014] Patent Documents

[0015] Patent Document 1: Korean Patent Laid-Open Publication No. 10-2017-0085425 (Published on July 24, 2017)

[0016] Patent Document 2: Korean Patent Laid-Open Publication No. 10-2023-0062060 (Published on May 09, 2023)

[0017] Patent Document 3: Korean Registered Patent Publication No. 10-1479251 (Published on January 05, 2015)

[0018] Patent Document 4: Korean Patent Laid-Open Publication No. 10-2025-0071156 (Published on May 21, 2025) SUMMARY

[0019] PROBLEMS TO BE SOLVED BY THE INVENTION

[0020] The present invention was made to solve the above problems, and the object thereof is to provide an electrode plate using lead sputter coating and a manufacturing method thereof, so that an electrode that can both replace an expensive iridium electrode and be stably used in a copper foil manufacturing process can be provided.

[0021] METHOD FOR SOLVING THE PROBLEMS

[0022] To achieve the above object, the present invention provides an electrode plate using lead sputter coating, which is characterized in that, as an electrode plate spaced apart from a lower portion of a metal foil manufacturing drum for manufacturing a metal foil, the electrode plate is composed of a metal substrate, and a lead coating layer formed by sputtering a high-temperature molten lead (Pb) at a predetermined thickness is formed on the surface of the metal substrate.

[0023] In the present invention, the molten lead uses a lead wire or a lead powder.

[0024] In the present invention, the thickness of the lead coating layer is preferably 20 μm to 1.0 mm.

[0025] In the present invention, the metal substrate is made of any one of titanium, stainless steel, and high corrosion-resistant alloy.

[0026] To achieve the above object, the present invention provides a method for manufacturing an electrode plate using a lead sputtering coating, characterized by comprising: (a) a metal substrate preparation step of preparing a metal substrate; (b) a lead melting preparation step of melting lead (Pb) at a high temperature; (c) a lead sputtering coating formation step of forming a lead coating layer by sputtering the molten lead onto the surface of the metal substrate at a predetermined thickness; and (d) a lead coating layer cooling and solidification step of cooling and solidifying the lead coating layer.

[0027] In the present invention, in the step (b), the molten lead is made of a lead wire or lead powder.

[0028] In the present invention, the thickness of the lead coating layer is preferably 20 μm to 1.0 mm.

[0029] In the present invention, in the step (b), the melting point of the lead is preferably 350°C or higher.

[0030] In the present invention, it further comprises a step of washing the metal substrate with a predetermined acid solution or polishing to remove oxides, and then cleaning with demi-water and drying, before performing the step (c).

[0031] In the present invention, in the step (d), the cooling is performed by natural cooling for 10 to 20 seconds (sec).

[0032] In the present invention, it further comprises a lead coating layer inspection step of inspecting the state of the lead coating layer, in a state where the lead coating layer is formed on the metal substrate by lead (Pb) sputtering based on the sputtering method and is solidified by cooling.

[0033] Effects of the Invention

[0034] According to the embodiment of the present invention, in manufacturing an anode electrode plate used in a copper foil manufacturing process, by applying a lead (Pb) based sputtering coating technique, a high-cost iridium electrode can be replaced, and a durable electrode plate having excellent durability can be manufactured due to the acid resistance of lead and PbO2.

[0035] In addition, the sputtering and manufacturing speed can be improved, and the electroplating process can be omitted.

[0036] Further, an electrode that can be stably used in a copper foil manufacturing process can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0037] Figure 1FIG. 1 is a sectional view showing a partial configuration of an electrode plate according to the present application using a lead spray coating.

[0038] Figure 2 FIG. 4 is a flow chart sequentially showing a manufacturing method of an electrode plate according to the present application using a lead spray coating.

[0039] Figure 3 FIG. 5 is an explanatory view sequentially illustrating a manufacturing process of an electrode plate according to the present application using a lead spray coating.

[0040] Figure 4 and Figure 5 FIG. 6 is a product photograph and data after testing an electrode plate according to the present application using a lead spray coating.

[0041] Figure 6 FIG. 7 is a configuration view of an electrolytic copper foil device for forming a copper foil by an electrolytic method.

[0042] Symbol explanation

[0043] 100: electrode plate,

[0044] 110: metal substrate,

[0045] 120: lead coating layer. DETAILED DESCRIPTION

[0046] Hereinafter, a preferred embodiment of the present application will be explained in detail with reference to the accompanying drawings.

[0047] Figure 1 FIG. 1 is a sectional view showing a partial configuration of an electrode plate according to the present application using a lead spray coating.

[0048] Referring to Figure 1 the electrode plate 100 according to the present application using a lead spray coating is formed by a lead coating layer coated on a surface of a metal substrate 110 in a predetermined thickness t using a high-temperature molten lead (Pb) by a spray process.

[0049] In addition, the lead is used in a lead wire (Pb wire) or a lead powder (Pb powder).

[0050] Further, the thickness t of the lead coating layer is preferably 20 μm to 1.0 mm.

[0051] That is, when the thickness t of the lead coating layer is less than 20 μm, it can be difficult to exert a function (or performance) of the lead coating layer, and thus it is difficult to expect characteristics such as corrosion resistance to an electrolyte. In addition, when the thickness t of the lead coating layer is greater than 1.0 mm, although it is good in terms of function exertion, it is poor in economy and workability.

[0052] In addition, the metal substrate 110 can be made of any one of titanium (Ti), stainless steel, and a high corrosion-resistant alloy such as a galvanized aluminum steel sheet.

[0053] Further, the electrode plate 100 can be applied to an electroplating process using a sulfuric acid-based electrolyte.

[0054] Hereinafter, a manufacturing method of the electrode plate using lead sputter coating according to the present application having the above-described configuration will be described.

[0055] Figure 2 FIG. 1 illustrates a flowchart sequentially showing a manufacturing method of the electrode plate using lead sputter coating according to the present application.

[0056] Referring to Figure 1 and Figure 2 First, a metal substrate 110 is prepared (metal substrate preparation step, S210).

[0057] The metal substrate 110 can be made of any one of titanium, stainless steel, and a high corrosion-resistant alloy such as a galvanized aluminum steel sheet.

[0058] Further, the metal substrate 110 is washed or sand blasted using an acid solution (e.g., HCl 5-10%) to remove oxides on the metal substrate 110, and is cleaned with demi-water and dried (metal substrate cleaning and drying step, S220).

[0059] Next, lead (Pb) is melted at a high temperature (lead melting preparation step, S230).

[0060] In the lead melting preparation step (S230), the lead is used in the form of a lead wire or a lead powder.

[0061] At this time, the melting point of the lead is preferably 350°C or more.

[0062] This is because the melting point of lead is about 327°C, but the temperature is maintained higher than the normal melting point of lead in order to smoothly flow the molten lead.

[0063] In addition, the molten lead is sputtered onto the surface of the metal substrate 110 to a predetermined thickness by a sputtering method to form a lead coating layer 120 (lead sputter coating layer formation step, S240).

[0064] Further, the lead coating layer 120 is cooled and solidified (lead coating layer cooling and solidification step, S250).

[0065] The thickness of the lead coating layer 120 thus formed is preferably 20 μm to 1.0 mm.

[0066] In addition, the cooling of the lead coating 120 in the cooling and solidification step (S250) can be performed by natural cooling for 10 to 20 seconds (sec).

[0067] Further, in the state in which the lead coating 120 is formed on the metal substrate 110 by the lead spraying based on the melting method and is solidified by cooling, a lead coating inspection step (S260) of inspecting the formation state of the lead coating 120 is performed. The inspection is performed with respect to the uniformity of the surface and the thickness uniformity using ultrasonic waves, etc. The uniformity of the surface is photographed using a dedicated camera, and can be determined by whether the irregular surface in the photographed image is so much that the reflectance is lower than a predetermined ratio. The technology of inspecting the surface uniformity by the photographed image can be known, and thus a detailed technical explanation thereof is omitted.

[0068] The electrode plate 100 manufactured as such can be applied to an electroplating process using an electrolyte based on sulfuric acid.

[0069] As described above, in order to replace the conventional expensive iridium electrode or electrode plate and to provide an electrode or electrode plate that can be stably used in a copper foil manufacturing process, the electrode plate coated with lead spraying and a manufacturing method thereof according to the present application forms the lead coating 120 on the metal substrate 110 by spraying the relatively inexpensive lead (Pb) melt compared to iridium by the spraying method.

[0070] That is, the lead coating 120 formed by spraying and coating lead is formed on the metal substrate 110, and in particular, the lead coating 120 is formed on the metal substrate 110 by directly spraying or layering the lead wire or lead powder after melting at a high temperature.

[0071] Further, after the coating process, a firm lead coating 120 can be formed by natural cooling.

[0072] The electrode plate coated with lead spraying and a manufacturing method thereof according to the present application as such are simple in process, can reduce material costs, and exhibit excellent performance even under the condition of an electrolyte based on sulfuric acid.

[0073] The electrode plate 100 coated with lead spraying as such can replace the conventional high-cost iridium electrode, and is excellent in durability due to the acid resistance of lead and PbO2 lead dioxide.

[0074] In addition, by using the spraying process, the manufacturing cost can be reduced, the manufacturing speed or productivity can be improved, and the conventional electroplating process can be omitted.

[0075] The electrode plate and its manufacturing method using lead spray coating of this invention can be applied to electrodes for copper foil manufacturing, anode electrodes for electrolytic refining and electroplating industries, and low-cost electrodes for battery and electrolytic capacitor industries, thereby greatly promoting the development of related industries.

[0076] (Experimental Example)

[0077] like Figure 4 As shown in the photos, the upper left photo is a picture of a titanium (Ti) plate product before lead (Pb) spray coating, and the upper right photo is a picture of a titanium (Ti) plate product after lead spray coating using the present invention.

[0078] Furthermore, the lower image of the aforementioned product photo shows data from X-ray fluorescence (XRF) testing, while the data on the left shows the results of measurements on the titanium (Ti) plate before coating, confirming a high titanium (Ti) content. In other words, it can be determined that the metal substrate is composed of a titanium plate.

[0079] On the other hand, for the metal plate for electrode plates manufactured by lead spray coating according to the present invention, Figure 4 The data on the right shows the situation after lead coating. During XRF testing, the lead content was found to be as high as 97.31%.

[0080] If the coating is not applied properly, the titanium (Ti) content may be higher than the lead content.

[0081] Therefore, the electrode plate using lead spray coating and its manufacturing method of the present invention can be easily realized.

[0082] in addition, Figure 5 The product photos show the surface confirmation and adhesion test results of the lead coating 120. The coating was checked for peeling by attaching and removing adhesive tape on the surface of the lead coating 120, and the results showed that the coating was good.

[0083] As described above, the invention has been illustrated with reference to one embodiment shown in the accompanying drawings, but this is merely exemplary, and those skilled in the art should understand that various modifications and equivalent embodiments can be made therefrom.

[0084] Therefore, the true scope of protection of this invention should be defined only by the appended claims.

Claims

1. An electrode plate using lead spray coating, characterized in that, It is an electrode plate separated from the lower part of the metal foil manufacturing roller used to manufacture metal foil. The electrode plate is made of a metal substrate. A lead coating is formed on the surface of the metal substrate by applying molten lead (Pb) at a predetermined thickness using a spraying method.

2. The electrode plate using lead spray coating according to claim 1, characterized in that, The molten lead is obtained using lead wire or lead powder.

3. The electrode plate using lead spray coating according to claim 1, characterized in that, The thickness of the lead coating is 20 μm to 1.0 mm.

4. The electrode plate using lead spray coating according to claim 1, characterized in that, The metal substrate is made of any one of titanium, stainless steel, and a highly corrosion-resistant alloy.

5. A method for manufacturing an electrode plate using lead spray coating, characterized in that, include: (a) Metal substrate preparation steps for preparing a metal substrate; (b) Lead melting preparation steps, which involve melting lead (Pb) at high temperature; (c) A lead spray coating forming step, wherein molten lead is applied to the surface of the metal substrate to form a lead coating by spraying to a predetermined thickness; and (d) The lead coating cooling and solidification step.

6. The method for manufacturing an electrode plate using lead spray coating according to claim 5, characterized in that, In the lead melting preparation step, the molten lead is prepared using lead wire or lead powder.

7. The method for manufacturing an electrode plate using lead spray coating according to claim 5, characterized in that, The thickness of the lead coating is 20 μm to 1.0 mm.

8. The method for manufacturing an electrode plate using lead spray coating according to claim 5, characterized in that, The metal substrate is made of any one of titanium, stainless steel, and a highly corrosion-resistant alloy.

9. The method for manufacturing an electrode plate using lead spray coating according to claim 5, characterized in that, In the lead melting preparation step, the melting point of the lead is above 350°C.

10. The method for manufacturing an electrode plate using lead spray coating according to claim 5, characterized in that, Also includes: Before performing the lead melting preparation step, the metal substrate is washed or sandblasted with a predetermined acid solution to remove oxides, and then dried after being cleaned with demineralized water.

11. The method for manufacturing an electrode plate using lead spray coating according to claim 5, characterized in that, In the lead coating cooling and solidification step, the cooling is carried out by natural cooling for 10 to 20 seconds.

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