AIP module of phased array antenna and preparation method thereof

Abstract

The application discloses a phased array antenna AIP module and a preparation method thereof, and belongs to the technical field of phased array antennas. The module comprises a PCB board, a radio frequency chip is welded and installed on the PCB board, and a grounding shielding network is further arranged on the PCB board. Epoxy bottom filling glue is filled in the gap between the radio frequency chip and the PCB board, mechanical support is provided, internal air medium is excluded, the bottom of the radio frequency chip is sealed, vibration resistance and temperature change resistance are improved, and small reflection during signal transmission is reduced. A metal layer with a preset thickness is continuously sputtered on the surface of the epoxy bottom filling glue after solidification along the top surface of the radio frequency chip and the four peripheries of the radio frequency chip, the metal layer extends to the solder pad of the grounding shielding network along the radio frequency chip, and the metal layer and the grounding shielding network jointly form an electromagnetic shielding structure. The application adopts a metal layer to replace a heavy metal shielding cover, weight is greatly reduced while excellent electromagnetic shielding effect is ensured, and the application is particularly suitable for large-scale arrays and aerospace applications.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of phased array antennas, in particular to a phased array antenna AIP module and a preparation method thereof. BACKGROUND

[0002] At present, the phased array antenna AIP (Antenna in Package) module in the field of satellite communication and 5G millimeter wave can reduce the difficulty of secondary development, complete two-dimensional large-scale expansion, and has superior performance, and its structure form develops faster and faster, and the industry demand is more and more vigorous. The phased array antenna AIP module is mainly composed of a PCB board and a radio frequency chip by welding.

[0003] At present, the shielding problem of the phased array antenna AIP module has not been well solved in the industry, and a metal shielding cover is welded around the radio frequency chip or no shielding is performed. As shown in FIG. 1, because the weight of the metal shielding cover itself will greatly increase the weight of the module and even the weight of the entire array, it is extremely unfavorable for weight-sensitive applications such as aerospace; secondly, a closed air cavity will be formed between the shielding cover and the PCB board, which has the risk of falling off due to vibration or thermal stress; thirdly, the shielding cover is difficult to completely and tightly contact the radio frequency chip, so that the heat generated by the radio frequency chip cannot be efficiently dissipated, causing poor heat dissipation of the chip, affecting the performance and reliability; finally, in the secondary welding process, due to the temperature gradient problem, the shielding cover is prone to falling off and mispositioning and other process risks. The unshielded solution will cause serious electromagnetic interference (EMI) and electromagnetic compatibility (EMC) problems. Figure 1 At present, due to poor grounding, the microwave millimeter wave product has the unstable phenomena of signal jitter, gain or receiving sensitivity high and low, which has been a long-term problem in the industry; the shielding environment consistency of each module of the phased array antenna array composed of multiple phased array antenna AIP modules in the prior art is not high, there are individual differences, and unified control is performed, lacking a reasonable regulation and control mechanism and an abnormal coping strategy, and unable to cope with complex working conditions.

[0004] SUMMARY The present application relates to the technical field of phased array antennas, in particular to a phased array antenna AIP module and a preparation method thereof.

[0005] The present application relates to the technical field of phased array antennas, in particular to a phased array antenna AIP module and a preparation method thereof.

[0006] The application aims at realizing the following technical scheme: the first aspect of the application provides a phased array antenna AIP module, comprising a PCB board, a radio frequency chip is welded and installed on the PCB board, and a grounding shielding network is further arranged on the PCB board; epoxy underfill glue is filled in the gap between the radio frequency chip and the PCB board, mechanical support is provided, internal air medium is excluded, the bottom of the radio frequency chip is sealed, vibration resistance and temperature change resistance are improved, and micro reflection during signal transmission is reduced; a metal layer with a preset thickness is continuously sputtered on the surface of the epoxy underfill glue after solidification along the top surface of the radio frequency chip and the four sides of the radio frequency chip, the metal layer extends to the pads of the grounding shielding network along the radio frequency chip, and the metal layer and the grounding shielding network jointly form an electromagnetic shielding structure.

[0007] When a plurality of phased array antenna AIP modules are arranged to form a phased array antenna array, the working state parameters of each module are monitored in real time through an array real-time intelligent control method, the working state of each module is dynamically coordinated according to the working state parameters, and the phased array antenna array is always in the current optimal cooperative working state based on the current working state of each module.

[0008] Preferably, the metal layer extends to the pads closest to the radio frequency chip on the two sides of the radio frequency chip along the shortest path, so as to reduce the gap space; the metal layer on the top surface of the radio frequency chip is directly sputtered on the radio frequency chip, the epoxy underfill glue is coated on the two sides and the bottom surface of the radio frequency chip, penetrates the bottom and the edge of the radio frequency chip, and covers the pads closest to the radio frequency chip on the two sides of the radio frequency chip by a preset proportion, so as to shorten the heat dissipation path.

[0009] Preferably, the metal layer extends to the pads closest to the radio frequency chip on the two sides of the radio frequency chip from the two intersection points of the left and right sides and the bottom surface of the radio frequency chip.

[0010] Preferably, the preset thickness is 2-5 mu m.

[0011] Preferably, the preset proportion is 1 / 2.

[0012] Preferably, the side of the PCB board away from the radio frequency chip is provided with an antenna radiation sheet.

[0013] Preferably, the metal layer uses titanium copper, nickel chromium iron or nickel iron.

[0014] Preferably, the array real-time intelligent control method comprises the following steps:

[0015] The initialization stage: starting the phased array antenna AIP module, and initializing the working parameters of the radio frequency front end based on the electromagnetic shielding structure;

[0016] Real-time monitoring phase: when the signal transceiver is in operation, the working state parameters of the phased array antenna AIP module are monitored in real time, and the working state parameters at least include working temperature, transmitting power and receiving signal strength;

[0017] Dynamic adjustment phase: according to the working state parameters monitored in real time, the transmitting power and / or receiving gain of the phased array antenna AIP module are dynamically adjusted;

[0018] Beam forming phase: control each phased array antenna AIP module to perform two-dimensional beam scanning and forming, through the consistent and stable electromagnetic shielding environment provided by the electromagnetic shielding structure, reduce the beam pointing error and side lobe level rise caused by the difference of electromagnetic coupling between modules, improve the accuracy and stability of array beam forming, and predict the unit performance of the phased array antenna AIP module based on the electromagnetic shielding structure, and use pre-distortion or calibration algorithm to compensate the phase and amplitude of the transmitting / receiving signal, further optimize the beam quality.

[0019] Preferably, the dynamic adjustment phase further comprises the following steps:

[0020] When the temperature of the target phased array antenna AIP module is monitored to be lower than the first temperature threshold, the target phased array antenna AIP module is controlled to transmit at the rated maximum power or the power higher than the conventional level;

[0021] When the temperature of the target phased array antenna AIP module is monitored to rise and reach the first temperature threshold, the active heat dissipation mechanism is started or the power reduction slope is set according to the heat dissipation efficiency of the target phased array antenna AIP module to gradually and smoothly reduce the transmitting power;

[0022] If the temperature of the target phased array antenna AIP module continues to rise to the second temperature threshold and maintains the first preset time, the target phased array antenna AIP module is shielded, which is marked as an abnormal module to continuously monitor the module state, and the transmitting power of other phased array antenna AIP modules with temperature lower than the first temperature threshold is increased, then the working parameters of the entire phased array antenna array are updated and consistency adjustment is performed.

[0023] Preferably, when the phased array antenna array has an abnormal module, the following steps are further included:

[0024] State recovery monitoring step: for the abnormal module, the working temperature is continuously monitored, and when the temperature is monitored to drop below the third temperature threshold and maintain the second preset time, the module is determined as a recoverable module;

[0025] Gradual recovery step: control the recoverable module to re-enter the phased array antenna array at the lowest power level, and maintain the power level for the third preset time while monitoring the stability of the working state parameters;

[0026] Performance verification and calibration steps: If the module's working state is stable within the third preset time, its transmission power is gradually increased, and calibration is performed at each power level, collecting amplitude and phase error data when it is used as a transmitting unit and a receiving unit;

[0027] Array reconstruction steps: Using amplitude and phase error data, update the calibration coefficients of the recoverable module and re-incorporate them into the beamforming calculation of the phased array antenna array; at the same time, correspondingly reduce the transmit power of other modules that were increased to improve the overall output power when the module was marked as abnormal, so that the entire array can be restored to the optimal cooperative working state.

[0028] A second aspect of the present invention provides: a method for fabricating a phased array antenna AIP module, used to fabricate any of the above-mentioned phased array antenna AIP modules, comprising the following steps:

[0029] The radio frequency chip is soldered and fixed onto the PCB board using the surface mount technology (SMT).

[0030] Using a highly fluid epoxy underfill adhesive, apply it along both sides and the bottom surface of the RF chip, allowing the epoxy underfill adhesive to fully penetrate and fill the gap between the RF chip and the PCB board until the epoxy underfill adhesive covers the pads closest to the RF chip on both sides of the RF chip at a predetermined ratio.

[0031] The coated phased array antenna AIP module is subjected to low-temperature curing treatment to solidify the epoxy bottom filler.

[0032] A metal layer of a predetermined thickness is continuously sputtered along the top surface of the RF chip and the surface of the solidified epoxy bottom filler around the RF chip using a sputtering process, and the metal layer extends to the pads of the grounding shielding network on the PCB board.

[0033] The beneficial effects of this invention are:

[0034] 1) Effective shielding and weight reduction: The use of an ultra-thin metal layer (2-5μm) formed by sputtering replaces the bulky metal shielding cover, which greatly reduces the weight of the module while ensuring excellent electromagnetic shielding effect, making it particularly suitable for large-scale arrays and aerospace applications.

[0035] 2) Excellent heat dissipation performance: The sputtered metal layer is in direct and close contact with the top surface of the RF chip, forming an efficient heat conduction path that can quickly dissipate the heat generated by the chip, improve the heat dissipation conditions of the chip, enhance its working stability and lifespan, and facilitate secondary thermal design.

[0036] 3) High reliability: epoxy underfill not only fixes the chip, but also eliminates air, provides protection against vibration and temperature changes, and provides a smooth substrate for sputtered metal layers. Without the use of a metal shield design, the secondary soldering process of the module is eliminated, reducing the risk of secondary soldering, and the entire structure has no risk of falling off due to secondary soldering, greatly improving reliability.

[0037] 4) Good signal stability: the underfill eliminates air gaps and reduces signal reflection; the continuous sputtered shielding layer and the ground network form a stable, low-impedance reference ground, effectively suppressing signal jitter and interference caused by poor grounding, making the module's transmit gain and receive sensitivity more stable.

[0038] 5) Array performance optimization: when multiple modules form an array, the consistency of the shielding environment of each unit is extremely high, reducing unit differences, and combining intelligent temperature control and beam calibration algorithms, the beam forming precision and overall stability of large-scale phased arrays can be significantly improved. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 AIP module structure schematic diagram in the prior art;

[0040] Figure 2 AIP module structure schematic diagram of the application;

[0041] Figure 3 Phased array antenna array workflow diagram;

[0042] Figure 4 Flowchart for recovering abnormal modules;

[0043] Figure 5 Preparation method flowchart;

[0044] In the figure, 1, radio frequency chip; 2, chip solder ball; 3, PCB board; 4, antenna radiation sheet; 5, ground shielding network of PCB board; 6, land of ground shielding network; 7, metal layer sputtered and continuously connected to the land of ground shielding network; 8, epoxy resin glue filled in the bottom gap of radio frequency chip and the edge of chip; 11, metal shield; 12, secondary soldering point. DETAILED DESCRIPTION

[0045] The technical solutions of the application will be described below in conjunction with embodiments. Obviously, the described embodiments are only some of the embodiments of the application, not all. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the application.

[0046] Reference Figures 1-5The first aspect of the present application provides: a phased array antenna AIP module, comprising a PCB board, a radio frequency chip is welded and mounted on the PCB board, and a grounding shielding network is further arranged on the PCB board; epoxy underfill glue is filled in the gap between the radio frequency chip and the PCB board, mechanical support is provided, internal air medium is excluded, the bottom of the radio frequency chip is sealed, vibration resistance and temperature change resistance are improved, and micro reflection during signal transmission is reduced; a metal layer with a preset thickness is continuously sputtered on the surface of the epoxy underfill glue after solidification along the top surface of the radio frequency chip and the four sides of the radio frequency chip, the metal layer extends along the radio frequency chip to the pad of the grounding shielding network, and the metal layer and the grounding shielding network jointly form an electromagnetic shielding structure.

[0047] When a plurality of phased array antenna AIP modules are arranged to form a phased array antenna array, the working state parameters of each module are monitored in real time through an array real-time intelligent control method, the working states of the modules are dynamically coordinated according to the working state parameters, and the phased array antenna array is always in the current optimal cooperative working state based on the current working states of the modules.

[0048] In the embodiment, the PCB board is made of high-frequency board material (for example, Rogers 4350B), one side of the PCB board is formed with a grounding shielding network and a pad through an etching process, and the other side of the PCB board is provided with an antenna radiation sheet (which can be in the form of a patch antenna). The radio frequency chip is welded on the side of the PCB board away from the antenna radiation sheet through an SMT surface mounting process.

[0049] After welding, epoxy underfill glue with extremely high fluidity (for example, the LOCTITEABLESTIK series of Henkel Company) is used to perform L-shaped path coating along the two sides and the bottom of the chip. The glue rapidly penetrates and completely fills all gaps between the bottom of the chip and the PCB board under the action of capillary force, spreads to the surrounding, and precisely covers half of the area of the pad of the grounding network closest to the radio frequency chip on the two sides of the chip. Subsequently, curing is performed at low temperature, so that the glue solidifies into a solid whole.

[0050] After curing, a composite metal layer (titanium copper, nickel chromium iron or other metal materials such as nickel iron) with a thickness of 2-5 μm is continuously deposited on the top surface of the radio frequency chip and the surface of the epoxy underfill glue around the radio frequency chip by using a magnetron sputtering process in a vacuum environment. The metal layer spreads from the top surface of the chip to the surface of the glue around the chip, and finally realizes reliable metallic connection with the exposed pad of the grounding shielding network on the PCB board, thereby forming a complete Faraday cage shielding structure from the top of the chip to the grounding network of the PCB.

[0051] Comparison Figure 1 and Figure 2It can be known that, due to the fact that the metal shielding cover is not adopted, the secondary welding risk of the module is reduced, the falling risk caused by the secondary welding is eliminated, and the reliability is greatly improved.

[0052] In some embodiments, the metal layer extends to the pads closest to the radio frequency chip on both sides of the radio frequency chip along the shortest path, reducing the gap space; the metal layer on the top surface of the radio frequency chip is directly sputtered on the radio frequency chip, the epoxy underfill adhesive is coated on both sides and the bottom surface of the radio frequency chip, penetrates the bottom and edges of the radio frequency chip, and covers the pads closest to the radio frequency chip on both sides of the radio frequency chip in a preset proportion, shortening the heat dissipation path.

[0053] In some embodiments, the metal layer extends to the pads closest to the radio frequency chip on both sides of the radio frequency chip from the two intersection points of the left and right sides and the bottom surface of the radio frequency chip.

[0054] In some embodiments, the preset thickness is 2-5 mu m.

[0055] In some embodiments, the preset proportion is 1 / 2.

[0056] In some embodiments, the PCB board is provided with an antenna radiation sheet away from the radio frequency chip.

[0057] In some embodiments, the metal layer uses titanium copper, nickel chromium iron or nickel iron.

[0058] In some embodiments, the array real-time intelligent control method comprises the following steps:

[0059] Initialization stage: start the phased array antenna AIP module, and initialize the working parameters of the radio frequency front end based on the electromagnetic shielding structure;

[0060] Real-time monitoring stage: when signal transmission and reception is performed, the working state parameters of the phased array antenna AIP module are monitored in real time, and the working state parameters at least include working temperature, transmission power and received signal strength;

[0061] Dynamic adjustment stage, according to the working state parameters monitored in real time, the transmission power and / or reception gain of the phased array antenna AIP module are dynamically adjusted;

[0062] Beam forming stage, control each phased array antenna AIP module to perform two-dimensional beam scanning and shaping, through the consistent and stable electromagnetic shielding environment provided by the electromagnetic shielding structure, the beam pointing error and side lobe level rise caused by the difference of electromagnetic coupling between modules are reduced, the accuracy and stability of array beam forming are improved, and the performance of the phased array antenna AIP module is predicted based on the electromagnetic shielding structure, the phase and amplitude of the transmitted / received signal are compensated by using pre-distortion or calibration algorithm, and the beam quality is further optimized.

[0063] In the present embodiment, as shown in Figure 3 the working process of the phased array antenna array is first initialized, and each module sets initial working parameters based on its stable shielding structure. During the signal transceiving process, the system monitors the working state parameters of each module in real time, including working temperature, transmission power, and received signal strength.

[0064] In the dynamic adjustment stage, the system intelligently adjusts the working state of each module according to the monitoring data. For example, when the temperature of a certain module is lower than the first temperature threshold, it is allowed to transmit at a higher power; when the temperature rises to the first temperature threshold, an active cooling mechanism (such as increasing the power of the cooling fan or increasing the water circulation speed of the water cooling system) is started or the power reduction slope is set according to the heat dissipation efficiency of the target phased array antenna AIP module to gradually and smoothly reduce the transmission power; if the temperature of a certain module continues to rise to the second temperature threshold and maintains for a first preset time, the system determines that the module is abnormal, shields it, and automatically increases the power of the surrounding normal modules for compensation, then recalculates and adjusts the beam weight of the entire array to ensure stable beam performance.

[0065] In the beamforming stage, due to the highly consistent electromagnetic shielding environment of all modules, the electromagnetic coupling difference between units is minimized, the beam directivity is more accurate, and the sidelobe level is effectively suppressed. The system can further use pre-distortion or other calibration algorithms to fine-tune the phase and amplitude of the signal, thereby further optimizing the beam quality.

[0066] In some embodiments, the dynamic adjustment stage further includes the following steps:

[0067] When it is monitored that the temperature of the target phased array antenna AIP module is lower than the first temperature threshold, the target phased array antenna AIP module is controlled to transmit at the rated maximum power or a power higher than the regular level;

[0068] When it is monitored that the temperature of the target phased array antenna AIP module rises and reaches the first temperature threshold, an active cooling mechanism is started or the power reduction slope is set according to the heat dissipation efficiency of the target phased array antenna AIP module to gradually and smoothly reduce the transmission power;

[0069] If the temperature of the target phased array antenna AIP module continues to rise to the second temperature threshold and maintains for a first preset time, the target phased array antenna AIP module is shielded and marked as an abnormal module for continuous monitoring of the module state, and the transmission power of other phased array antenna AIP modules with a temperature lower than the first temperature threshold is increased, then the working parameters of the entire phased array antenna array are updated and consistency adjustment is performed.

[0070] In the present embodiment, as shown in Figure 4When abnormal modules exist in the phased array antenna array, the method further comprises the following steps:

[0071] A state recovery monitoring step: for abnormal modules, continuously monitor their working temperatures, and when the temperature of a module is monitored to drop below a third temperature threshold and maintain for a second preset time, determine that the module is a recoverable module;

[0072] A gradual recovery step: control the recoverable module to re-enter the phased array antenna array at the lowest power level and maintain for a third preset time, while monitoring the stability of its working state parameters;

[0073] A performance verification and calibration step: if the module's working state is stable within the third preset time, gradually increase its transmission power and calibrate at each power step to collect its amplitude and phase error data as a transmitting unit and a receiving unit;

[0074] An array reconstruction step: use the amplitude and phase error data to update the calibration coefficients of the recoverable module and re-integrate it into the beamforming calculation of the phased array antenna array; at the same time, reduce the transmission power of other modules that were raised to improve overall output power when the module was marked as abnormal, so that the entire array returns to an optimal cooperative working state.

[0075] In the performance verification and calibration step, the power step increase amplitude and maintenance time are dynamically adjusted according to the real-time temperature change rate of the recoverable module. After the array reconstruction step, if the module appears abnormal again, it will be marked as abnormal again and perform a shielding operation, and the threshold condition required for its next recovery will be raised. After being marked as abnormal multiple times, the module is determined to be a scrap module and is no longer enabled and recorded as a maintenance replacement state.

[0076] The threshold condition includes extending the second preset time and / or requiring a lower third temperature threshold.

[0077] In this embodiment, the first temperature threshold, the second temperature threshold, the third temperature threshold, the first preset time, the second preset time, and the third preset time are temperature thresholds or times set in advance according to actual working environment and working state, and are not limited to a specific temperature value or time value. The third temperature threshold < the first temperature threshold < the second temperature threshold.

[0078] The "monitor-recover-verify-reconstruct" closed-loop process in the embodiment. By setting the "third temperature threshold" and the "second preset time", the stability and reliability of module cooling are ensured, and frequent switching oscillation is prevented. The "gradual recovery" and "performance verification and calibration" steps avoid the risk of directly putting a module that may not have fully stabilized into full power operation, and compensate for possible minor drifts in module performance through recalibration, ensuring the consistency of array performance after reintegration.

[0079] The "self-healing" mechanism ensures that the phased array antenna array can automatically and smoothly isolate and recover individual units that fail due to transient overheating or other reasons during long-term operation, thereby maintaining the continuity and stability of the entire system output signal, avoiding the problem of direct performance drop or interruption of the system due to unit failure in traditional systems, and improving system stability.

[0080] Through the "array reconstruction step", the system not only rebalances in power, but more importantly, updates the calibration coefficients of the unit in the beamforming algorithm. This ensures that the accuracy of beam pointing and shape can quickly recover to the optimal state after unit recovery, maintains the long-term stability of beam performance, and improves beam stability.

[0081] For modules that have appeared abnormally multiple times, the recovery threshold condition is increased until it is no longer enabled, avoiding unnecessary waste of system resources.

[0082] As shown in Figure 5 The second aspect of the present application provides: a phased array antenna AIP module preparation method for preparing any of the above phased array antenna AIP modules, comprising the following steps:

[0083] The radio frequency chip is welded and fixed on the PCB by SMT surface mounting process;

[0084] An epoxy underfill adhesive with high fluidity is used to coat along the two sides and bottom surface of the radio frequency chip, so that the epoxy underfill adhesive fully penetrates and fills the gap between the radio frequency chip and the PCB, until the epoxy underfill adhesive covers the two sides of the radio frequency chip closest to the pad of the radio frequency chip by a preset proportion;

[0085] The coated phased array antenna AIP module is subjected to low-temperature curing treatment to solidify the epoxy underfill adhesive;

[0086] By sputtering process, a layer of metal with a predetermined thickness is continuously sputtered on the top surface of the radio frequency chip and the surface of the solidified epoxy underfill adhesive around the radio frequency chip, and the metal layer is extended to the pads of the grounding shielding network on the PCB.

[0087] The foregoing is considered as illustrative only of the principles of the application. Further, since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the application to the exact construction and operation described. Accordingly, all such variations are intended to be included within the scope of the present application as defined in the claims below and their equivalents.

Claims

1. An arrayed antenna panel (AIP) module, characterized by: The PCB board is provided with a radio frequency chip welded and mounted thereon and a grounding shielding network; a gap between the radio frequency chip and the PCB board is filled with epoxy underfill glue to provide mechanical support, exclude internal air medium, realize bottom sealing of the radio frequency chip, improve vibration resistance and temperature change resistance, and reduce micro reflection during signal transmission; A metal layer with a preset thickness is continuously sputtered on the surface of the epoxy underfill glue after solidification along the top surface of the radio frequency chip and the periphery of the radio frequency chip, the metal layer extends to the pads of the grounding shielding network along the radio frequency chip, and the metal layer and the grounding shielding network jointly form an electromagnetic shielding structure; When a plurality of phased array antenna AIP modules are arranged to form a phased array antenna array, the working state parameters of each module are monitored in real time through an array real-time intelligent control method, and the working state of each module is dynamically coordinated according to the working state parameters, so that the phased array antenna array is always in the current optimal cooperative working state based on the current working state of each module; The array real-time intelligent control method comprises the following steps: An initialization stage: starting the phased array antenna AIP module and initializing the working parameters of the radio frequency front end based on the electromagnetic shielding structure; A real-time monitoring stage: when signal transmission and reception is performed, the working state parameters of the phased array antenna AIP module are monitored in real time, and the working state parameters at least include working temperature, transmission power and received signal strength; A dynamic adjustment stage: dynamically adjusting the transmission power and / or reception gain of the phased array antenna AIP module according to the working state parameters monitored in real time; A beam forming stage: controlling each phased array antenna AIP module to perform two-dimensional beam scanning and forming, reducing the beam pointing error and side lobe level rise caused by the difference in electromagnetic coupling between modules through the consistent and stable electromagnetic shielding environment provided by the electromagnetic shielding structure, improving the accuracy and stability of array beam forming, and predicting the unit performance of the phased array antenna AIP module based on the electromagnetic shielding structure, and using a pre-distortion or calibration algorithm to compensate the phase and amplitude of the transmitted / received signal, further optimizing the beam quality.

2. The phased array antenna AIP module of claim 1, wherein: The metal layer extends to the pads closest to the radio frequency chip on both sides of the radio frequency chip along the shortest path, reducing the gap space; the metal layer on the top surface of the radio frequency chip is directly sputtered onto the radio frequency chip, the epoxy underfill glue is coated on both sides and the bottom surface of the radio frequency chip, penetrates the bottom and edge of the radio frequency chip, and covers the pads closest to the radio frequency chip on both sides of the radio frequency chip by a preset proportion, shortening the heat dissipation path.

3. The phased array antenna AIP module of claim 2, wherein: The metal layer extends to the pads closest to the radio frequency chip on both sides of the radio frequency chip from the two intersection points of the left and right sides and the bottom surface of the radio frequency chip.

4. The phased array antenna AIP module of claim 1, wherein: The preset thickness is 2-5 μm.

5. The phased array antenna AIP module of claim 2, wherein: The preset proportion is 1 / 2.

6. The phased array antenna AIP module of claim 1, wherein: The side of the PCB board away from the radio frequency chip is provided with an antenna radiation sheet.

7. The phased array antenna AIP module of claim 1, wherein: The dynamic adjustment stage further comprises the following steps: When it is monitored that the temperature of a target phased array antenna AIP module is lower than a first temperature threshold, the target phased array antenna AIP module is controlled to transmit at a rated maximum power or a power higher than a regular level. When the temperature of the target phased array antenna AIP module is monitored to rise and reach a first temperature threshold, a forced cooling mechanism is started or the transmit power is gradually and smoothly reduced according to a power reduction slope set according to the cooling efficiency of the target phased array antenna AIP module; If the temperature of the target phased array antenna AIP module continues to rise to a second temperature threshold and is maintained for a first preset time, the target phased array antenna AIP module is shielded, marked as an abnormal module, the module state is continuously monitored, the transmit power of other phased array antenna AIP modules with a temperature lower than the first temperature threshold is increased, then the beam weight update working parameters of the entire phased array antenna array are recalculated, and consistency adjustment is performed.

8. The phased array antenna AIP module of claim 7, wherein: When there is an abnormal module in the phased array antenna array, the following steps are further included: A state recovery monitoring step: for the abnormal module, the working temperature is continuously monitored, and when the temperature is monitored to drop below a third temperature threshold and is maintained for a second preset time, the module is determined to be a recoverable module; A gradual recovery step: the recoverable module is controlled to re-enter the phased array antenna array at a minimum power level, and the stability of the working state parameters is monitored while maintaining the power level for a third preset time; A performance verification and calibration step: if the module working state is stable within the third preset time, the transmit power is gradually increased, and calibration is performed at each power step to collect amplitude and phase error data when the module is used as a transmitting unit and a receiving unit; An array reconstruction step: using the amplitude and phase error data, the calibration coefficients of the recoverable module are updated, and the recoverable module is re-included in the beam forming calculation of the phased array antenna array; at the same time, the transmit power of other modules that were increased to improve the overall output power when the module was marked as abnormal is correspondingly reduced, so that the entire array returns to an optimal cooperative working state.

9. A method of manufacturing an arrayed antenna in package (AIP) module, the method comprising: A method for preparing a phased array antenna AIP module as claimed in any one of claims 1-8, comprising the following steps: ​ Soldering and fixing the radio frequency chip on the PCB board by SMT surface mounting process; Using an epoxy underfill adhesive with high fluidity to coat along the two sides and bottom of the radio frequency chip, so that the epoxy underfill adhesive fully penetrates and fills the gap between the radio frequency chip and the PCB board, until the epoxy underfill adhesive covers the two sides of the radio frequency chip closest to the pad at a preset proportion; Performing low-temperature curing treatment on the coated phased array antenna AIP module to solidify the epoxy underfill adhesive; By sputtering process, a layer of metal with a predetermined thickness is continuously sputtered on the top surface of the radio frequency chip and the surface of the solidified epoxy underfill adhesive around the radio frequency chip, and the metal layer is extended to the pads of the grounding shielding network on the PCB board.

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