Liquid cooling floating heat dissipation assembly and electric connector

Abstract

A liquid cooling floating heat dissipation assembly and an electric connector, the liquid cooling floating heat dissipation assembly comprising: a liquid cooling plate module, in which a flow guide channel is formed, the flow guide channel being provided with an inflow port and an outflow port; the bracket piece is fixed on the surface of one side of the liquid cooling plate module; the at least one through hole is formed in the bracket piece in a penetrating manner; the floating module is provided with a limiting part, and the limiting part is movably limited between the support part and the liquid cooling plate module in the thickness direction; the first thermal contact part is integrally formed on the floating module, the first thermal contact part penetrates through the through hole and forms a first thermal contact surface exposed out of the support part, and the first thermal contact surface is used for being in contact with a heat source; the second thermal contact surface is formed on the floating module and is used for directly or indirectly contacting with the surface of one side, combined with the bracket piece, of the liquid cooling plate module; and the elastic piece is pressed and limited between the floating module and the liquid cooling plate module along the thickness direction of the liquid cooling plate module.

Description

Technical Field

[0001] This application relates to a liquid-cooled floating heat dissipation component and an electrical connector. Background Technology

[0002] A common challenge faced by electrical system developers is thermal management. Heat generated by electronic components within a system can degrade their performance and even damage system components, such as electrical connectors. Electrical connectors are used to transmit data and / or power between different systems or devices. Data signals can be transmitted via (multiple) communication cables in the form of optical and / or electrical signals. Examples include IC connectors (PGA, etc.), I / O connectors (DisplayPort, VGA, DVI, HDMI, USB, etc.), fiber optic connectors (FC, SC, ST, LC, D4, DIN, MU, MT, etc.), optical communication connectors (SFP, QSFP, OSFP, etc.), filter connectors, CATV connectors, backplane connectors, memory module / memory connectors (DDR, SIMM, DIMM, PCI, SIM, etc.), high-definition television connectors (RF coaxial connectors, etc.), flexible circuit board connectors (FPC, FFC, etc.), network cable connectors (RJ45, etc.), audio / video (AV) connectors, battery connectors, and so on. Electrical connectors generate significant amounts of heat due to the increasing power requirements.

[0003] To dissipate heat, a system typically includes thermal components, such as a thermal bridge, which connects to a heat source, absorbs heat from the source, and transfers it away. However, existing thermal bridges have low heat transfer efficiency. For example, the solution disclosed in Chinese utility model patent CN213959261U involves assembling a heat sink on a shielding cage, with heat transfer achieved through contact between the heat sink and an inserted connector. However, the heat sink alone has limited cooling efficiency, and the contact between the heat sink and the connector is unstable due to various factors (such as assembly tolerances), further reducing heat transfer between them and ultimately impacting the overall cooling effect. Summary of the Invention

[0004] The purpose of this application is to provide a liquid-cooled floating heat dissipation component and an electrical connector, which can reduce the contact thermal resistance with the heat pipe, improve the heat transfer efficiency, and thus enhance the heat dissipation capacity.

[0005] To achieve the aforementioned objective, this application provides the following technical solution:

[0006] A liquid-cooled floating heat dissipation component includes:

[0007] The liquid cooling plate module has a meandering flow channel inside, and the flow channel has an inlet and an outlet that are connected to the outside.

[0008] A bracket is fixed to one side surface of the liquid cooling plate module;

[0009] At least one through hole is formed through the support member;

[0010] The floating module forms a limiting part, which is movably restricted between the support member and the liquid cooling plate module along the thickness direction of the liquid cooling plate module.

[0011] A first thermal contact portion is integrally formed on the floating module. The first thermal contact portion passes through the through hole and forms a first thermal contact surface exposed to the outside of the support member. The first thermal contact surface is used to contact a heat source.

[0012] The second thermal contact surface is formed on the floating module and is used to directly or indirectly contact the side surface of the liquid cooling plate module and the support component.

[0013] An elastic element is applied and restricted between the floating module and the liquid cooling plate module along the thickness direction of the liquid cooling plate module. Along the thickness direction of the liquid cooling plate module, the floating module always maintains a tendency to move away from the liquid cooling plate module.

[0014] The floating module can float within a specific range along the thickness direction of the liquid cooling plate module.

[0015] Furthermore, the limiting portion extends from the edge of the floating module, and along the thickness direction of the floating module, the thickness of the limiting portion is less than the thickness of the floating module;

[0016] The bracket extends to form a limiting skirt at the position of the inner side wall of the through hole;

[0017] Along the thickness direction of the liquid cooling plate module, a limiting gap is formed between the limiting skirt and the liquid cooling plate module, and the limiting part is floating and limited within the limiting gap along the thickness direction of the liquid cooling plate module.

[0018] Furthermore, the floating module has a plurality of implanted feet integrally formed thereon, and the implanted feet protrude from the surface of the floating module on the side that is in contact with the liquid cooling plate module;

[0019] An implantation groove is formed on the side surface of the liquid cooling plate module that is in contact with the floating module, corresponding to the position of the implantation foot. One end of the implantation foot is inserted into the implantation groove, and the elastic element is disposed between the end of the implantation foot and the bottom surface of the implantation groove.

[0020] Furthermore, the elastic element is a helical compression spring, or the elastic element is a plate-shaped leaf spring with a central depression.

[0021] Furthermore, the side surface of the floating module that is in contact with the liquid cooling plate module is recessed inward to form a receiving groove, and a thermally conductive pad is disposed in the receiving groove. The depth of the recess in the receiving groove is less than the thickness of the thermally conductive pad.

[0022] Furthermore, the thermal pad is a flexible structure, and the thermal pad can deform along the thickness direction of the liquid cooling plate module.

[0023] Furthermore, it also includes a connector portion, which is connected to the inlet. The liquid cooling plate module has an installation notch at the corresponding inlet position. The inner surfaces on both sides of the installation notch are recessed inward to form guide limiting grooves. The outer surfaces on both sides of the connector portion are protruding to form guide protrusions. The connector portion is inserted into the installation notch in a transverse direction perpendicular to the thickness direction of the cooling plate module. The guide protrusions are correspondingly slidably implanted into the guide limiting grooves.

[0024] Furthermore, the liquid cooling plate module includes a substrate and a cover plate stacked together along the thickness direction, the flow channel is recessed on the surface of the substrate, the mounting notch includes a first portion formed on the substrate, the guide limiting groove is formed on the substrate, and the first portion penetrates the substrate along the thickness direction and opens outward from one edge.

[0025] Furthermore, the mounting notch also includes a second portion formed on the cover plate, the second portion penetrating the cover plate along its thickness direction and opening outward from one side edge.

[0026] Furthermore, the mounting notch includes a third portion formed on the bracket, the third portion penetrating the bracket along the thickness direction and opening outward from one side edge.

[0027] To achieve the aforementioned objective, this application provides the following technical solution:

[0028] An electrical connector includes a liquid-cooled floating heat dissipation assembly as described in any of the above claims, and further includes: a terminal module and a shielding cage covering the periphery of the terminal module, the shielding cage forming a mating cavity with one end open, the terminal module being coupled to the other end of the shielding cage, an opening being formed through the top plate of the shielding cage, the liquid-cooled floating heat dissipation assembly being assembled above the top plate of the shielding cage, and a first thermal contact portion of the floating module protruding downward into the mating cavity through the opening in the top plate.

[0029] Compared with the prior art, the beneficial effects of this application are: it can reduce the contact thermal resistance with the heat pipe, improve the heat transfer efficiency, and thus enhance the heat dissipation capacity. Attached Figure Description

[0030] Figure 1This is a three-dimensional schematic diagram of the liquid-cooled floating heat dissipation component of this application.

[0031] Figure 2 yes Figure 1 The diagram shows a three-dimensional view of the liquid-cooled floating heat dissipation component from another angle.

[0032] Figure 3 yes Figure 1 The exploded three-dimensional view of the liquid-cooled floating heat dissipation component shown here is a three-dimensional schematic diagram of the liquid-cooled plate module with the connector after it has been separated from the support component.

[0033] Figure 4 yes Figure 1 The exploded three-dimensional view of the liquid-cooled floating heat dissipation assembly shown specifically illustrates the three-dimensional schematic diagram of the liquid-cooled plate module after separation from the support component. Furthermore, it illustrates the three-dimensional schematic diagram of the liquid-cooled plate module after separation of the base plate and the cover plate.

[0034] Figure 5 yes Figure 4 A three-dimensional diagram viewed from another angle.

[0035] Figure 6 yes Figure 4 A further exploded perspective view of the liquid-cooled floating heat dissipation assembly shown.

[0036] Figure 7 yes Figure 6 A three-dimensional diagram viewed from another angle.

[0037] Figure 8 This is a top view of the liquid-cooled floating heat dissipation assembly of this application.

[0038] Figure 9 It is self Figure 8 A cross-sectional view along line AA in the middle.

[0039] Figure 10 yes Figure 9 Enlarged view of the structure within the dashed box.

[0040] Figure 11 It is self Figure 8 A cross-sectional view along the BB line.

[0041] Figure 12 yes Figure 11 Enlarged view of the structure within the dashed box. Detailed Implementation

[0042] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0043] Please refer to the reference. Figures 1 to 12 The diagram shows a liquid-cooled floating heat dissipation assembly disclosed in this application, comprising a liquid-cooled plate module 1, a support member 2, a floating module 3, a thermal pad 4, and an elastic member 5, all assembled together. The liquid-cooled plate module 1 includes a substrate 102 and a cover plate 101 stacked together along their thickness direction. The surface of the substrate 102 that is in contact with the cover plate 101 (the upper surface of the substrate 102) is recessed inward to form a meandering flow channel 11. The cover plate 101 covers the substrate 102 and closes the flow channel 11, which has an inlet 1101 and an outlet 1102 communicating with the outside. Preferably, the substrate 102 and the cover plate 101 are welded together, such that the flow channel 11 forms a closed tube communicating with the outside through the inlet 1101 and the outlet 1102.

[0044] Furthermore, the support member 2 is fixed to one side surface of the liquid cooling plate module 1. Specifically, the support member 2 is fixed to the lower surface of the substrate 102. In this embodiment, four through holes 20 are formed along the thickness direction on the support member 2. A limiting skirt portion 201 extends from the inner wall of each through hole 20. A limiting gap 103 is formed between the limiting skirt portion 201 and the liquid cooling plate module 1 along the thickness direction. In this embodiment, the cross-section of each through hole 20 is rectangular, and the limiting skirt portion 201 is preferably formed on the inner wall of the two long sides and one short side of the through hole 20.

[0045] Please refer to the reference. Figures 1 to 12As shown, each of the floating modules 3 includes a generally cuboid-shaped main body (not labeled) and a limiting portion 31 extending further from the periphery of the main body. Along the thickness direction of the floating module 3, the thickness of the limiting portion 31 is less than the thickness of the floating module 3. The limiting portion 31 of each of the four floating modules 3 is movably limited between the support member 2 and the liquid cooling plate module 1 (specifically, the substrate 102) along the thickness direction of the liquid cooling plate module 1. Specifically, the limiting portion 31 is floatingly limited within the limiting gap 103 along the thickness direction of the liquid cooling plate module 1, so that each of the floating modules 3 is correspondingly limited and accommodated within the through hole 20. Each of the floating modules 3 integrally forms a first thermal contact portion 32, which passes through the through hole 20 and forms a first thermal contact surface 321 protruding downwards to the support member 2. The first thermal contact surface 321 is used for contact with a heat source. Each of the floating modules 3 also forms a second thermal contact surface 33 that directly or indirectly contacts the side surface of the liquid cooling plate module 1 that is combined with the support member 2. In this embodiment, specifically, the second thermal contact surface 33 contacts the lower surface of the substrate 102. In this embodiment, the floating module 3 is capable of floating within a specific range along the thickness direction of the liquid cooling plate module 1.

[0046] In a preferred embodiment, the thermal pad 4 is disposed between the second thermal contact surface 33 and the liquid cooling plate module 1 (specifically, between the second thermal contact surface 33 and the lower surface of the substrate 102). In a preferred embodiment, the side surface of the floating module 3 that is in contact with the liquid cooling plate module 1 is recessed inward to form a receiving groove 331. The thermal pad 4 is disposed within the receiving groove 331. In a more preferred embodiment, the depth of the inward recess of the receiving groove 331 is less than the thickness of the thermal pad 4. In a more preferred embodiment, the thermal pad 4 is a flexible structure, and the thermal pad 4 can deform along the thickness direction of the liquid cooling plate module 1; for example, the thermal pad 4 can be thermally conductive adhesive, etc.

[0047] Furthermore, each of the floating modules 3 has a plurality of implanted feet 34 integrally formed thereon. The implanted feet 34 protrude from the surface of the floating module 3 on the side that abuts against the liquid cooling plate module 1. Specifically, the implanted feet 34 protrude from the second thermal contact surface 33. In a preferred embodiment, each of the four corners of the floating module 3 has one implanted foot 34. The surface of the liquid cooling plate module 1 that abuts against the floating module 3 has an implantation groove 104 recessed corresponding to the position of the implanted foot 34. One end of the implanted foot 34 is inserted into the implantation groove 104, and the elastic member 5 is disposed between the end of the implanted foot 34 and the bottom surface of the implantation groove 104. Along the thickness direction of the liquid cooling plate module 1, the elastic member 5 ensures that the floating module 3 always maintains a tendency to move away from the liquid cooling plate module 1. In a preferred embodiment, the elastic element 5 can be a helical compression spring, or the elastic element 5 can be a plate-shaped leaf spring with a central depression. In the illustrated embodiment of this application, the elastic element 5 is a plate-shaped leaf spring with a central depression.

[0048] Please refer to the reference. Figures 1 to 12 As shown in the embodiment of this application, two connector portions 6 are also included, which are respectively connected to the inlet 1101 and the outlet 1102. The two connector portions 6 have the same structure. Here, the connector portion 6 connected to the inlet 1101 is described: the liquid cooling plate module 1 has an installation notch 105 formed at the position corresponding to the inlet 1101. The inner surfaces on both sides of the installation notch 105 are recessed inward to form guide limiting grooves 1051. The outer surfaces on both sides of the connector portion 6 are protruding to form guide protrusions 61. The connector portion 6 is inserted into the installation notch 105 in a transverse direction perpendicular to the thickness direction of the cooling plate module 1. The guide protrusions 61 are correspondingly slidably implanted into the guide limiting grooves 1051.

[0049] Furthermore, the mounting notch 105 includes a first portion formed on the substrate 102, and the guide limiting groove 1051 is formed on the substrate 102. The first portion penetrates the substrate 102 along its thickness direction and opens outward from one edge. The mounting notch 105 also includes a second portion formed on the cover plate 101. The second portion penetrates the cover plate 101 along its thickness direction and opens outward from one edge. The mounting notch 105 includes a third portion formed on the support member 2. The third portion penetrates the support member 2 along its thickness direction and opens outward from one edge. In some embodiments, for example, when the thickness of the substrate 102 is sufficient, the mounting notch 105 may be formed only on the substrate 102 (i.e., only the first portion). Of course, when the thickness of the substrate 102 is insufficient, the mounting notch 105 may be formed on both the substrate 102 and the cover plate 101 (i.e., including both the first and second portions). Of course, when the thickness of the liquid cooling plate module is still insufficient, the mounting notch 105 can be formed simultaneously on the substrate 102, the cover plate 101 and the bracket 2 (that is, including the first part, the second part and the third part, which is the embodiment shown in the accompanying drawings of this application).

[0050] The liquid-cooled floating heat dissipation assembly of this application can be directly used in contact with heat sources, such as chips in electronic devices, or it can be assembled onto the shielding cage (not shown) of an electrical connector (not shown), such as optical communication connectors (SFP, QSFP, OSFP, etc.). Such electrical connectors include terminal modules (not shown) and a shielding cage (not shown) surrounding the terminal modules. The shielding cage includes at least a top plate (not shown) and two side plates (not shown) extending downwards from both sides of the top plate. The shielding cage encloses a mating cavity (not shown) with one open end. The terminal module is attached to the other end of the shielding cage. An opening (not shown) is formed through the top plate. The liquid-cooled floating heat dissipation assembly is assembled above the top plate of the shielding cage. The first thermal contact portion 32 of the floating module 3 protrudes downwards into the mating cavity through the opening in the top plate. When the mating connector is inserted into the mating cavity, the first thermal contact surface 321 of the floating module 3 can make contact with the mating connector to achieve heat transfer.

[0051] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A liquid-cooled floating heat dissipation component, characterized in that, include: The liquid cooling plate module (1) has a meandering flow channel (11) inside, and the flow channel (11) has a flow inlet (1101) and a flow outlet (1102) that are connected to the outside. The bracket (2) is fixed to one side surface of the liquid cooling plate module (1); At least one through hole (20) is formed through the support member (2); The floating module (3) forms a limiting part (31), which is movably limited between the support member (2) and the liquid cooling plate module (1) along the thickness direction of the liquid cooling plate module (1); The first thermal contact portion (32) is integrally formed on the floating module (3). The first thermal contact portion (32) passes through the through hole (20) and forms a first thermal contact surface (321) exposed to the bracket (2). The first thermal contact surface (321) is used to contact the heat source. The second thermal contact surface (33) is formed on the floating module (3) and is used to directly or indirectly contact the side surface of the liquid cooling plate module (1) and the support member (2); The elastic element (5) is pressed and restricted between the floating module (3) and the liquid cooling plate module (1) along the thickness direction of the liquid cooling plate module (1). Along the thickness direction of the liquid cooling plate module (1), the floating module (3) always maintains a tendency to move away from the liquid cooling plate module (1). The floating module (3) can float within a specific range along the thickness direction of the liquid cooling plate module (1).

2. The liquid-cooled floating heat dissipation assembly as described in claim 1, characterized in that: The limiting part (31) extends from the edge of the floating module (3), and the thickness of the limiting part (31) is less than the thickness of the floating module (3) along the thickness direction of the floating module (3); the bracket (2) extends to the inner wall of the through hole (20) to form a limiting skirt (201); a limiting gap (103) is formed between the limiting skirt (201) and the liquid cooling plate module (1) along the thickness direction of the liquid cooling plate module (1), and the limiting part (31) is floating and limited within the limiting gap (103) along the thickness direction of the liquid cooling plate module (1).

3. The liquid-cooled floating heat dissipation assembly as described in claim 1, characterized in that: The floating module (3) has a plurality of implant feet (34) integrally formed on it. The implant feet (34) protrude from the surface of the floating module (3) on one side of the liquid cooling plate module (1). The liquid cooling plate module (1) has an implant groove (104) recessed on the side surface of the floating module (3) corresponding to the position of the implant feet (34). One end of the implant foot (34) is inserted into the implant groove (104). The elastic member (5) is disposed between the end of the implant foot (34) and the bottom surface of the implant groove (104).

4. The liquid-cooled floating heat dissipation assembly as described in claim 1, characterized in that: The elastic element (5) is a helical compression spring, or the elastic element (5) is a plate-shaped leaf spring with a concave center.

5. The liquid-cooled floating heat dissipation assembly as described in claim 1, characterized in that: The floating module (3) has an inwardly recessed groove (331) on one side surface that is in contact with the liquid cooling plate module (1). A thermal pad (4) is provided in the groove (331). The depth of the inward recess of the groove (331) is less than the thickness of the thermal pad (4).

6. The liquid-cooled floating heat dissipation assembly as described in any one of claims 1 to 5, characterized in that: It also includes a connector (6), which is connected to the inlet (1101). The liquid cooling plate module (1) has an installation notch (105) at the corresponding inlet (1101). The inner surfaces on both sides of the installation notch (105) are recessed to form an inlet limiting groove (1051). The outer surfaces on both sides of the connector (6) are protruding to form a guide protrusion (61). The connector (6) is inserted into the installation notch (105) in a transverse direction perpendicular to the thickness direction of the cold plate module (1). The guide protrusion (61) is correspondingly slidably implanted into the inlet limiting groove (1051).

7. The liquid-cooled floating heat dissipation assembly as described in claim 6, characterized in that: The liquid cooling plate module (1) includes a substrate (102) and a cover plate (101) stacked together along the thickness direction. The flow channel (11) is recessed on the surface of the substrate (102). The mounting notch (105) includes a first portion formed on the substrate (102). The guide limiting groove (1051) is formed on the substrate (102). The first portion penetrates the substrate (102) along the thickness direction and opens outward from one edge.

8. The liquid-cooled floating heat dissipation assembly as described in claim 7, characterized in that: The mounting notch (105) also includes a second portion formed on the cover plate (101), the second portion penetrating the cover plate (101) along the thickness direction and opening outward from one side edge.

9. The liquid-cooled floating heat dissipation assembly as described in claim 7, characterized in that: The mounting notch (105) includes a third portion formed on the bracket (2), the third portion penetrating the bracket (2) along the thickness direction and opening outward from one side edge.

10. An electrical connector comprising the liquid-cooled floating heat dissipation assembly as described in any one of claims 1 to 9, characterized in that, Also includes: The terminal module and the shielding cage surrounding the terminal module are provided. The shielding cage forms a docking cavity with one end open. The terminal module is connected to the other end of the shielding cage. An opening is formed through the top plate of the shielding cage. The liquid-cooled floating heat dissipation assembly is assembled above the top plate of the shielding cage. The first thermal contact part of the floating module protrudes downward into the docking cavity through the opening of the top plate.

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