Cooling structure of high-temperature superconducting coil assembly and superconducting magnet

Abstract

The utility model provides a cooling structure of a high-temperature superconducting coil assembly and a superconducting magnet. A cooling assembly of the cooling structure is attached to the outer surface of at least one side of the high-temperature superconducting coil assembly. The cooling assembly comprises a cold guide plate component and a plurality of cooling pipes, the surface of one side of the cold guide plate component in the thickness direction is attached to the outer surface of the corresponding side of the high-temperature superconducting coil assembly, and a plurality of mounting grooves extending in the thickness direction are further formed in the surface of the other side of the cold guide plate component. The multiple cooling pipes are arranged in the corresponding installation grooves in a matched mode, and the outer wall of each cooling pipe makes thermal contact with the inner wall of the corresponding installation groove. The cooling pipe is used for forced flow cooling, the cold guide plate component achieves conduction cooling, the heat exchange efficiency of the combination of the cooling pipe and the cold guide plate component is higher than that of a single heat exchange mode, and the mode that the cooling pipe is installed in the installation groove of the cold guide plate component enables the structure of the cooling assembly to be compact, and space is saved.

Description

Technical Field

[0001] This utility model relates to the field of superconducting technology, and in particular to a cooling structure and a superconducting magnet for a high-temperature superconducting coil assembly. Background Technology

[0002] Superconducting magnet technology is widely used in fields such as nuclear fusion, medical imaging (magnetic resonance imaging), and high-end manufacturing, leveraging the strong magnetic field and zero resistance characteristics of superconducting magnets in their superconducting state to drive development in various industries. The realization and maintenance of the superconducting state of a superconducting magnet depends on an extremely low-temperature environment; therefore, efficient, reliable, and economical cooling technology has always been a key constraint and research direction in this field. A commonly used cooling technology for superconducting magnets is immersion cooling, which involves directly immersing the entire magnet in cryogenic liquids such as liquid helium (4.2 K) or liquid nitrogen (77 K). However, immersion cooling consumes a large amount of cryogenic liquid, resulting in resource waste; when the magnet loses quench, the instantaneous surge of heat causes the cryogenic liquid to vaporize violently, leading to a sharp increase in pressure within the Dewar container, posing significant safety risks; and the cryogenic immersion container also occupies a considerable amount of space. Utility Model Content

[0003] The purpose of this invention is to solve the problems of resource waste, safety issues caused by violent vaporization of low-temperature liquids, and large space occupation of low-temperature immersion containers in the existing technology.

[0004] To solve the above-mentioned technical problems, the present invention provides a cooling structure for a high-temperature superconducting coil assembly, including a cooling assembly attached to at least one outer surface of the high-temperature superconducting coil assembly. The cooling assembly includes a cold-conducting plate component and multiple cooling pipes. One surface of the cold-conducting plate component in the thickness direction is attached to the corresponding outer surface of the high-temperature superconducting coil assembly. The cold-conducting plate component is connected to the cold head of an external cryogenic refrigerator. Multiple mounting grooves extending in the thickness direction are also formed on the other surface of the cold-conducting plate component. These mounting grooves are evenly spaced and arranged side-by-side on the other surface. Multiple cooling pipes are respectively fitted into a corresponding mounting groove, and the outer wall of each cooling pipe is in thermal contact with the inner wall of the corresponding mounting groove. Each mounting groove opening is also provided with a clamping member. The side surface of the clamping member facing the cooling pipe is fitted with the outer wall surface of the cooling pipe, and the other side surface away from the cooling pipe is flush with the other side surface of the cold-conducting plate component. Furthermore, in the thickness direction of the cold-conducting plate component, each cooling pipe is located in the middle of the cold-conducting plate component.

[0005] Using the above technical solution, the cooling pipe is used to introduce the cooling medium for forced-flow cooling of the high-temperature superconducting coil assembly. The cold-conducting plate component is connected to the cold head of an external cryogenic refrigerator. Utilizing the thermal conductivity of solids, the heat from the high-temperature superconducting coil assembly is transferred to the cold head for conductive cooling. The combination of the cooling pipe and the cold-conducting plate component together cools the high-temperature superconducting coil assembly, resulting in higher heat exchange efficiency compared to a single heat exchange method. Installing the cooling pipe within the mounting groove of the cold-conducting plate component also allows for a more compact structure of the cooling assembly, saving space. The surface of the clamping member facing the cooling pipe is fitted to the outer wall of the cooling pipe, pressing the cooling pipe firmly into the mounting groove and improving the heat transfer efficiency between the cooling pipe and the cold-conducting plate component. Furthermore, the surface of the clamping member away from the cooling pipe is flush with the other side of the cold-conducting plate component, ensuring uniform contact between the other side of the cold-conducting plate component and the surface of the corresponding high-temperature superconducting coil assembly, achieving uniform heat conduction. Positioning the cooling pipe in the middle of the cold-conducting plate component ensures that the distance from the cooling pipe to both sides of the cold-conducting plate component is the same, further ensuring uniform cooling.

[0006] According to another specific embodiment of the present invention, the cooling structure of the high-temperature superconducting coil assembly disclosed in the embodiment of the present invention includes a plurality of stacked disc-shaped superconducting coil groups; and cooling components are respectively provided on both end surfaces of the high-temperature superconducting coil assembly in the stacking direction, and corresponding cooling components are sandwiched between two adjacent disc-shaped superconducting coil groups.

[0007] By adopting the above technical solution, the stacked arrangement of multiple disk-shaped superconducting coil groups results in a large contact area between adjacent disk-shaped superconducting coils, and the surface area of ​​both ends of the high-temperature superconducting coil assembly in the stacking direction is also large. Therefore, the heat is concentrated at the contact points between adjacent disk-shaped superconducting coils and on the surface of both ends, which are the main areas that need to be cooled. The ends of the high-temperature superconducting coil assembly are cooled by cooling components set on the surface of both ends of the high-temperature superconducting coil assembly, and the middle part of the high-temperature superconducting coil assembly is cooled by cooling components sandwiched between two adjacent disk-shaped superconducting coil groups, so as to prevent the internal temperature of the high-temperature superconducting coil assembly from becoming too high.

[0008] According to another specific embodiment of the present invention, the cooling structure of the high-temperature superconducting coil assembly disclosed in the embodiment of the present invention has a cooling plate component of each cooling component that is adapted to the shape of the corresponding high-temperature superconducting coil assembly. Multiple mounting slots are opened on the corresponding side surface of the cooling plate component and are evenly spaced in the radial direction of the high-temperature superconducting coil assembly. Each mounting slot extends along the circumference of the high-temperature superconducting coil assembly.

[0009] By adopting the above technical solution, the shape adaptation between the cold-conducting plate component and the corresponding high-temperature superconducting coil assembly enables the cold-conducting plate component to make full contact with the high-temperature superconducting coil assembly, thereby improving the cooling efficiency. The mounting slots are arranged evenly at intervals in the radial direction of the high-temperature superconducting coil assembly, and each mounting slot extends circumferentially along the high-temperature superconducting coil assembly, so that the mounting slots are evenly distributed on the cold-conducting plate component. The cooling pipe adapted to the mounting slots conducts heat evenly during cooling, preventing the local temperature of the high-temperature superconducting coil assembly from becoming too high.

[0010] According to another specific embodiment of the present invention, the cooling structure of the high-temperature superconducting coil assembly disclosed in the embodiment of the present invention includes a plurality of cylindrical superconducting coil groups nested in layers; and cooling components are respectively provided on both sides of the high-temperature superconducting coil assembly in the radial direction, and corresponding cooling components are sandwiched between two adjacent cylindrical superconducting coil groups.

[0011] By adopting the above technical solution, the layered arrangement of multiple cylindrical superconducting coil groups results in a large contact area between adjacent cylindrical superconducting coils, leading to a more concentrated heat distribution. This area is the main area requiring cooling. Cooling components sandwiched between two adjacent cylindrical superconducting coil groups are used to cool the middle part of the high-temperature superconducting coil assembly, preventing excessive internal temperature. Cooling components located on the radial surfaces of the high-temperature superconducting coil assembly are used to cool the radial sides of the assembly.

[0012] According to another specific embodiment of the present invention, the cooling structure of the high-temperature superconducting coil assembly disclosed in the embodiment of the present invention has multiple mounting slots opened on the corresponding side surface of the cold conductive plate component, evenly spaced in the circumferential direction of the high-temperature superconducting coil assembly, and each mounting slot extending along the axial direction of the high-temperature superconducting coil assembly.

[0013] Using the above technical solution, the mounting slot and cooling pipe are fitted together to uniformly cool the high-temperature superconducting coil assembly.

[0014] According to another specific embodiment of the present invention, in the cooling structure of the high-temperature superconducting coil assembly disclosed in the embodiment of the present invention, a heat-conducting layer is filled between the outer wall of each cooling tube and the inner wall of the corresponding mounting groove and the surface of the corresponding clamping member facing the cooling tube.

[0015] By adopting the above technical solution, the heat-conducting layer ensures full contact between the cooling pipe, the inner wall of the mounting groove, and the clamping components, thereby improving cooling efficiency.

[0016] According to another specific embodiment of the present invention, the cooling structure of the high-temperature superconducting coil assembly disclosed in the embodiment of the present invention has a circular cross-section for each cooling tube, and the bottom of each mounting groove is an arc-shaped surface adapted to the outer wall surface of the corresponding cooling tube. The side surface of the pressing member facing the corresponding cooling tube is an arc-shaped surface adapted to the outer wall surface of the cooling tube.

[0017] By adopting the above technical solution, when the cross-section of the cooling pipe is circular, the bottom of the mounting groove and the side surface of the clamping member facing the corresponding cooling pipe are both set as arc-shaped surfaces that fit the outer periphery of the cooling pipe to ensure full contact and improve heat exchange efficiency.

[0018] According to another specific embodiment of the present invention, the cooling structure of the high-temperature superconducting coil assembly disclosed in the embodiment of the present invention is made of metal material for both the cold-conducting plate component and the cooling pipe; and liquid helium flows inside the cooling pipe.

[0019] This invention also provides a superconducting magnet, including a high-temperature superconducting coil assembly and a cooling structure for the high-temperature superconducting coil assembly.

[0020] The beneficial technical effects of this utility model are as follows: the high-temperature superconducting coil assembly is cooled by forced flow using a cooling pipe, and the heat of the high-temperature superconducting coil assembly is transferred to the cold head by the solid thermal conductivity of the cold plate component to achieve conductive cooling. The high-temperature superconducting coil assembly is cooled by the combination of the cooling pipe and the cold plate component. The heat exchange efficiency is higher than that of a single heat exchange method. The method of installing the cooling pipe in the mounting groove of the cold plate component can also make the structure of the cooling assembly more compact, thereby saving space. The cooling pipe is pressed by the clamping component to improve the heat transfer efficiency between the cooling pipe and the cold plate component. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the cooling structure of the high-temperature superconducting coil assembly provided in Embodiment 1 of this utility model and a partial structural diagram of a high-temperature superconducting coil assembly (the high-temperature superconducting coil assembly includes multiple stacked disk-shaped superconducting coil groups).

[0022] Figure 2 This is a partial structural diagram of the cooling structure of the high-temperature superconducting coil assembly provided in Embodiment 1 of the present invention (including mounting groove, cooling pipe and clamping component).

[0023] Figure 3 This is a schematic diagram of the cooling structure of the high-temperature superconducting coil assembly provided in Embodiment 1 of this utility model and another high-temperature superconducting coil assembly (the high-temperature superconducting coil assembly includes multiple cylindrical superconducting coil groups nested in layers).

[0024] Explanation of reference numerals in the attached figures:

[0025] 1. High-temperature superconducting coil assembly;

[0026] 10. Disc-shaped superconducting coil assembly; 11. Cylindrical superconducting coil assembly;

[0027] 2. Cooling components;

[0028] 20. Cooling plate component; 200. Mounting groove; 21. Cooling pipe; 22. Clamping component. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be described in further detail below with reference to the accompanying drawings.

[0030] Example 1

[0031] This embodiment provides a cooling structure for a high-temperature superconducting coil assembly, such as... Figure 1 As shown, a cooling component 2 is attached to at least one outer surface of the high-temperature superconducting coil assembly 1. The cooling component 2 is used to cool the high-temperature superconducting coil assembly 1. It should be noted that the high-temperature superconducting coil assembly 1 has the characteristics of zero resistance, high current carrying capacity, and low weight, and can maintain a large current carrying capacity even under a strong magnetic field. The high-temperature superconducting coil assembly 1 is a structure composed of multiple ring-shaped superconducting coils, and its overall structure is a hollow cylinder. The outer surface of the high-temperature superconducting coil assembly 1 refers to the two end faces along the axial direction of the hollow cylindrical structure, the outer circumferential surface surrounding it, and the inner circumferential surface surrounding it. Furthermore, the high-temperature superconducting coil assembly 1 may include surfaces along the axial direction of the cylindrical structure (e.g., along the outer end faces of the hollow cylindrical structure, the outer circumferential surface surrounding it, and the inner circumferential surface surrounding it). Figure 1 Multiple disk-shaped superconducting coil groups 10 stacked in the Y direction (as shown in the image), or including radial (e.g., along the cylindrical structure) Figure 3 Multiple cylindrical superconducting coil groups 11 are nested layer by layer in the X direction of the structure.

[0032] In one specific embodiment of this utility model, such as Figure 1 As shown, the high-temperature superconducting coil assembly 1 includes components along its height direction, i.e., its axial direction ( Figure 1 Multiple disk-shaped superconducting coil groups 10 are stacked in the Y direction (as described in the invention). Specifically, in this invention, "disc-shaped" refers to the overall shape of the disk-shaped superconducting coil group 10 along its extension direction. It can be a circular disk structure or an elliptical disk structure, and each disk structure is annular. Taking a circular annular disk structure as an example, the disk-shaped superconducting coil group 10 is... Figure 1 The high-temperature superconducting coil assembly 1 shown is a portion cut along its circumference, therefore Figure 1The high-temperature superconducting coil assembly 1 and each disk-shaped superconducting coil group 10 shown are arc-shaped. Each disk-shaped superconducting coil group 10 may further include two stacked superconducting coil subgroups, the stacking method of these two superconducting coil subgroups being the same as the stacking direction of the multiple disk-shaped superconducting coil groups 10. Figure 1 (as shown in the Y direction) are consistent, and each superconducting coil group can consist of multiple annular superconducting coils along the radial direction of the disk-shaped superconducting coil group 10 ( Figure 1 The superconducting coils are arranged sequentially in the X direction, with multiple annular superconducting coils nested together. Each superconducting coil can be composed of superconducting tape (such as REBCO tape) or spirally wound superconducting cable.

[0033] Specifically, the stacking of multiple disk-shaped superconducting coil groups 10 results in a larger contact area between adjacent disk-shaped superconducting coil groups 10, and the high-temperature superconducting coil assembly 1 is in the stacking direction ( Figure 1 The surface area at both ends of the high-temperature superconducting coil assembly 10 (in the Y direction) is also relatively large. Therefore, the heat is concentrated at the contact points between adjacent disk-shaped superconducting coil groups 10 and at both ends, which are the main areas that need to be cooled. Cooling components 2 are respectively set on the two ends of the high-temperature superconducting coil assembly 1 in the stacking direction to cool the axial ends of the high-temperature superconducting coil assembly 1. Cooling components 2 are sandwiched between two adjacent disk-shaped superconducting coil groups 10 to cool the middle part of the high-temperature superconducting coil assembly 1 to prevent the internal temperature of the high-temperature superconducting coil assembly 1 from being too high. These areas are cooled by a combination of conduction cooling and forced flow cooling, which ensures high cooling efficiency while occupying as little space as possible.

[0034] It should be noted that the number of stacked disk-shaped superconducting coil groups 10 can be two, three, four or more, and the number of cooling components 2 is determined according to the number of disk-shaped superconducting coil groups 10. If the high-temperature superconducting coil assembly 1 includes a disk-shaped superconducting coil group 10, a cooling component 2 can be correspondingly provided on one end face of the disk-shaped superconducting coil group 10 along its axial direction.

[0035] like Figure 1 As shown, the cooling assembly 2 includes a cold-conducting plate component 20 and a plurality of cooling pipes 21. The cold-conducting plate component 20 is located in the thickness direction ( Figure 1 One side surface (e.g., in the Y direction) Figure 1 The lower surface of the uppermost cooling plate component 20 is attached to the corresponding outer surface of the high-temperature superconducting coil assembly 1 (e.g., Figure 1The upper end face of the high-temperature superconducting coil assembly 1 along its axial direction ( ) allows for sufficient contact between the cooling plate component 20 and the corresponding outer surface of the high-temperature superconducting coil assembly 1. The cooling plate component 20 is connected to the cold head (not shown in the figure) of an external cryogenic refrigerator. Utilizing the thermal conductivity of solids, the heat of the high-temperature superconducting coil assembly 1 is transferred to the cold head via the cooling plate component 20 to achieve conductive cooling, thereby ensuring that the high-temperature superconducting coil assembly 1 is sufficiently cooled through this outer surface. It should be noted that the high-temperature superconducting coil assembly 1 includes a surface along its axial direction ( ) Figure 1 When multiple disk-shaped superconducting coil groups 10 are stacked in the Y direction (as shown in the image), the thickness direction of the cooling plate component 20 is the same as the axial direction of the high-temperature superconducting coil assembly 1, and a cooling component 2 can be sandwiched between adjacent disk-shaped superconducting coil groups 10. Compared to immersion cooling, the conduction cooling method using the cooling plate component 20 eliminates the need for a complex fluid circulation system and a large cryogenic liquid container, greatly simplifying the system structure, making operation and maintenance more convenient, and avoiding the waste caused by using large amounts of cryogenic liquid. It should be noted that the thickness direction of the cooling plate component 20 is the same as the axial direction of the high-temperature superconducting coil assembly 1, i.e. Figure 1 in the Y direction.

[0036] It should also be noted that the specific shape of the cold-conducting plate component 20 is determined according to the shape of the outer surface of the high-temperature superconducting coil assembly 1 to which it is attached, such as... Figure 1 As shown, when the outer surface of the high-temperature superconducting coil assembly 1 to be cooled is a plane and has an annular surface, the cooling plate component 20 is a flat plate structure with an annular surface. When the outer surface of the high-temperature superconducting coil assembly 1 to be cooled is an arc-shaped surface, the cooling plate component 20 is a curved arc-shaped plate structure with an arc-shaped surface.

[0037] To improve cooling efficiency, from the other side surface of the cooling plate component 20 (e.g.) Figure 1Multiple mounting slots 200 are formed on the upper surface of the uppermost cold-conducting plate component 20, such that the direction of the slot opening towards the bottom of the slot is consistent with the thickness direction of the cold-conducting plate component 20. Multiple cooling pipes 21 are respectively fitted into a corresponding mounting slot 200. Coolant (such as cold helium, liquid helium or supercritical helium) can be introduced into the cooling pipes 21. The outer wall of each cooling pipe 21 is in thermal contact with the inner wall of the corresponding mounting slot 200, that is, the outer wall of the cooling pipe 21 is in contact with the inner wall of the mounting slot 200 and can transfer heat. Thus, the heat of the high-temperature superconducting coil assembly 1 can be transferred to the cold-conducting plate component 20. Part of the heat is dissipated through the cold-conducting plate component 20, and the other part is transferred through the cold-conducting plate component 20 to the cooling pipes 21 and carried away by the cooling medium. The cooling medium in the cooling pipes 21 performs forced flow cooling on the high-temperature superconducting coil assembly 1. The forced flow cooling method is used to control the cooling effect. When multiple mounting slots 200 are provided, these mounting slots 200 can be arranged side by side along the extension direction of the surface where the mounting slots 200 are located, so that the cooling pipes 21 arranged in the mounting slots 200 are arranged side by side along the extension direction of the surface, so as to uniformly cool the high-temperature superconducting coil assembly 1. The forced flow cooling technology used to cool the high-temperature superconducting coil assembly 1 by means of the cooling medium in the cooling pipes 21 is a relatively conventional cooling method in the field, especially applied to the in-tube cable conductor (CICC) structure of large fusion magnets. This technology uses an external pumping system to force the coolant (such as supercritical helium) to flow through a pre-set channel inside the conductor or an independent pipe in close contact with the conductor, so as to achieve active and forced convection heat transfer to the magnet. Forced flow cooling brings a significant improvement in cooling efficiency and enhanced operational stability because it can more effectively remove heat and can precisely control the flow rate, temperature and pressure of the coolant.

[0038] This application utilizes a combination of cooling pipe 21 and cold-conducting plate component 20 to cool the high-temperature superconducting coil assembly 1. Compared to using only cooling pipe forced flow cooling, this method solves the problems of low current density, high flow resistance, the need for a high-power pumping system to maintain the circulation of the cooling medium, and increased system energy consumption and complexity. Compared to using only conduction cooling, it solves the problems of low thermal conductivity of solid materials, easy formation of large temperature gradients, slow cooling rate, and thermal resistance between contact surfaces affecting heat transfer efficiency. Compared to immersion cooling, it solves the problems of resource waste, safety issues caused by violent vaporization of cryogenic liquids, and the large space occupied by cryogenic immersion containers. Therefore, this solution combines high heat exchange efficiency, compact cooling component structure, and space saving.

[0039] It should be noted that the specific number of mounting slots 200 can be two, three, five or more, depending on the actual cooling requirements. The bottom of each mounting slot 200 can be arc-shaped or flat, and the cross-section of the cooling pipe 21 can be circular or rectangular, as long as the cooling pipe 21 can be placed inside the mounting slot 200. The gap between the two can be filled with thermally conductive resin materials such as epoxy resin.

[0040] In one specific embodiment of this utility model, such as Figure 1 As shown, the shape of the cold-conducting plate component 20 of each cooling assembly 2 is adapted to the shape of the corresponding high-temperature superconducting coil assembly 1. That is, when the high-temperature superconducting coil assembly 1 includes multiple stacked disc-shaped superconducting coil groups 10, the cold-conducting plate component 20 of each cooling assembly 2 is also a disc-shaped structure. The shape adaptation of the cold-conducting plate component 20 to the corresponding high-temperature superconducting coil assembly 1 enables the cold-conducting plate component 20 to fully contact the high-temperature superconducting coil assembly 1, thereby improving the cooling efficiency. Multiple mounting slots 200 are formed on the corresponding side surface of the cold-conducting plate component 20 (e.g., ...). Figure 1 On the upper surface of the intermediate cooling plate component 20), each mounting groove 200 extends circumferentially along the high-temperature superconducting coil assembly 1, that is, each mounting groove 200 has a ring-shaped structure extending circumferentially around the cooling plate component 20, and multiple mounting grooves 200 are radially ( Figure 1 The cooling tubes 21 are evenly spaced along the X direction (as shown in the diagram), and the number of cooling tubes 21 matches the number of mounting slots 200. Each mounting slot 200 corresponds to one cooling tube 21. In other words, the cooling tubes 21 are also evenly spaced along the radial direction of the high-temperature superconducting coil assembly 1. This arrangement can distribute the heat of the high-temperature superconducting coil assembly 1 to the multiple cooling tubes 21 to improve the heat dissipation efficiency of the cooling tubes 21. It can also make the cooling tubes 21 that are adapted to the mounting slots 200 conduct heat evenly during cooling, preventing the local temperature of the high-temperature superconducting coil assembly 1 from becoming too high.

[0041] Furthermore, such as Figure 1 and Figure 2As shown, each mounting slot 200 is also provided with a clamping member 22. The side surface of the clamping member 22 facing the cooling pipe 21 is adapted to the outer wall surface of the cooling pipe 21. The clamping member 22 is used to press the cooling pipe 21 into the mounting slot 200 to ensure tight contact between the cooling pipe 21 and the mounting slot 200, thereby improving the heat transfer efficiency between the cooling pipe 21 and the cold-conducting plate component 20. When the cold-conducting plate component 20 is a flat plate structure, the other side surface of the clamping member 22 away from the cooling pipe 21 is flush with the side surface of the cold-conducting plate component 20 where the mounting slot 200 is opened, so that the side surface of the cold-conducting plate component 20 where the mounting slot 200 is opened can fit and make uniform contact with the surface of the adjacent disc-shaped superconducting coil group 10, thereby achieving uniform heat conduction. In the thickness direction of the cooling plate component 20, the mounting groove 200 extends from one side surface of the cooling plate component 20 to the other side surface but does not penetrate the cooling plate component 20. The depth of the groove ensures that the cooling pipe 21 is located in the middle of the cooling plate component 20. This arrangement ensures that the heat conduction distance from the cooling pipe 21 to both sides of the cooling plate component 20 is the same, with the aim of ensuring uniform cooling.

[0042] Furthermore, such as Figure 1 and Figure 2 As shown, when the cross-section of the cooling pipe 21 is circular, the bottom of the mounting groove 200 and the side surface of the clamping member 22 facing the corresponding cooling pipe 21 are both set as arc-shaped surfaces that fit the outer periphery of the cooling pipe 21 to ensure full contact and improve heat exchange efficiency.

[0043] In one specific embodiment of this utility model, a heat-conducting layer is filled between the outer wall of each cooling pipe 21, the inner wall of the corresponding mounting groove 200, and the surface of the corresponding clamping member 22 facing the cooling pipe 21. Figure 1 and Figure 2 (Not shown in the image) The thermally conductive layer can fill the gaps between the cooling pipe 21 and the mounting groove 200, as well as between the cooling pipe 21 and the clamping member 22, so that the inner wall of the cooling pipe 21 and the mounting groove 200 and the clamping member 22 are in full contact and have good thermal conductivity, thereby improving cooling efficiency. It should be noted that, in order to reserve space for the thermally conductive layer, the size of the mounting groove 200 can be slightly larger than the size of the cooling pipe 21. For example, the width of the mounting groove 200 is 0.5 to 1 mm larger than the outer diameter of the cooling pipe 21. The gaps are filled with epoxy resin doped with high thermal conductivity powder (such as aluminum nitride, alumina, or silicon nitride) as a thermally conductive layer. These materials can significantly improve the thermal conductivity of the thermally conductive layer.

[0044] In one specific embodiment of this utility model, both the cold-conducting plate component 20 and the cooling pipe 21 are made of metallic materials. The cold-conducting plate component 20 can be made of aluminum alloy or pure copper, which have good thermal conductivity. The cooling pipe 21 can be made of oxygen-free copper or stainless steel, which also have good thermal conductivity. Liquid helium flows inside the cooling pipe 21 to exchange heat with the cold-conducting plate component 20 and the high-temperature superconducting coil assembly 1 to achieve cooling.

[0045] In another specific embodiment of this utility model, such as Figure 3 As shown, the overall structure of the high-temperature superconducting coil assembly 1 is a hollow cylinder, and the high-temperature superconducting coil assembly 1 includes radially ( Figure 3 Multiple cylindrical superconducting coil groups 11 are nested layer by layer in the X direction (in the high-temperature superconducting coil assembly 1). Each superconducting coil group is a hollow cylinder, and the diameter of the multiple cylindrical superconducting coil groups 11 increases sequentially from the inside to the outside along the radial direction of the high-temperature superconducting coil assembly 1, thus nesting together with each other. For example Figure 3 The system includes two cylindrical superconducting coil groups 11. The radial dimension of the inner cylindrical superconducting coil group 11 is smaller than that of the outer cylindrical superconducting coil group 11, meaning that the outer cylindrical superconducting coil group 11 is nested around the outer periphery of the inner cylindrical superconducting coil group 11. The layered nesting of multiple cylindrical superconducting coil groups 11 results in a larger contact area between adjacent cylindrical superconducting coil groups 11, leading to a more concentrated heat. Therefore, the contact area between adjacent cylindrical superconducting coil groups 11 is the main area requiring cooling. Corresponding cooling components 2 are sandwiched between two adjacent cylindrical superconducting coil groups 11 to cool the middle part of the high-temperature superconducting coil assembly 1, preventing the internal temperature of the high-temperature superconducting coil assembly 1 from becoming too high. Cooling components 2 are also provided on the inner and outer circumferential surfaces of the high-temperature superconducting coil assembly 1 to cool the radial sides (inner and outer circumferences) of the high-temperature superconducting coil assembly 1. It should be noted that when each superconducting coil assembly has a cylindrical structure, the cooling component 2 also has a cylindrical structure and is adapted to the adjacent cylindrical superconducting coil assembly 11. In the radial direction of the high-temperature superconducting coil assembly 1, the cooling component 2 and the cylindrical superconducting coil assembly 11 are nested layer by layer, as shown below. Figure 3Cooling components 2 are disposed between two cylindrical superconducting coil groups 11 and on opposite sides of the two cylindrical superconducting coil groups 11. Each cooling component 2 has a cooling plate component 20 that is also cylindrical. Multiple mounting slots 200 are formed on one side surface of the cooling plate component 20 along its thickness direction (in the same direction as the radial direction of the high-temperature superconducting coil assembly 1) (e.g., the outer or inner circumferential surface of the cooling plate component 20). When there are multiple mounting slots 200, they are evenly spaced along the circumference of the high-temperature superconducting coil assembly 1 (which is also the circumferential direction of the cylindrical cooling plate component 20), i.e., multiple mounting slots 200 are spaced around the circumference of the high-temperature superconducting coil assembly 1, and each mounting slot 200 is along the axial direction of the high-temperature superconducting coil assembly 1. Figure 3 Extending in the Y direction, the cooling tube 21 is disposed within the mounting groove 200 to uniformly cool each cylindrical superconducting coil assembly 11. It should be noted that if the high-temperature superconducting coil assembly 1 includes a cylindrical superconducting coil assembly 11, a cooling assembly 2 can be correspondingly disposed on the outer or inner circumferential surface of the cylindrical superconducting coil assembly 11.

[0046] Example 2

[0047] This embodiment also provides a superconducting magnet, including a high-temperature superconducting coil assembly and a cooling structure for the high-temperature superconducting coil assembly provided in Embodiment 1. The high-temperature superconducting coil assembly may include a disk-shaped superconducting coil group or multiple disk-shaped superconducting coil groups stacked together; it may also include a cylindrical superconducting coil group or multiple cylindrical superconducting coil groups nested layer by layer, etc. The specific structure of the high-temperature superconducting coil assembly is not limited, as long as the cooling component is attached to at least one outer surface of the high-temperature superconducting coil assembly for cooling. The superconducting magnet provided in this embodiment may specifically be a magnet in a nuclear fusion device, a semiconductor crystal pulling magnet, a magnet in a magnetic resonance imaging (MRI) device, or a high-field superconducting magnet.

[0048] The superconducting magnet provided in this embodiment can be manufactured by vacuum pressure impregnation. The following describes the manufacturing method of the superconducting magnet, taking the case of a high-temperature superconducting coil assembly including multiple stacked disk-shaped superconducting coil groups as an example.

[0049] Step 1: Processing of the cooling plate components.

[0050] First, the core cold-conducting plate component needs to be fabricated, using high thermal conductivity aluminum alloy or pure copper as the base material. Mounting grooves to accommodate the cooling pipes are then machined into the cold-conducting plate component. To achieve optimal symmetrical heat transfer, the depth of the mounting grooves must ensure that the thermal distance from both surfaces of the cold-conducting plate component to the cooling pipes is equal. The width of the mounting grooves is 0.5 to 1 mm larger than the outer diameter of the cooling pipes; this gap is reserved for the subsequent thermally conductive layer (epoxy resin filler layer).

[0051] Next, oxygen-free copper or stainless steel cooling tubes with uniform wall thickness are bent into annular tubes that match the disc-shaped superconducting coil assembly. The bent cooling tubes are placed into the mounting groove, and then epoxy resin mixed with high thermal conductivity powders (such as aluminum nitride, alumina, or silicon nitride) is filled into the gap between the cooling tubes and the mounting groove. These powders can significantly improve the thermal conductivity of the resin after curing.

[0052] Next, the clamping component is applied and then sealed to the cold-conducting plate component using laser welding. During this process, parameters such as laser power, speed, and pulse frequency must be precisely controlled to prevent excessive welding heat input from causing thermal damage to the filled epoxy resin. After welding, the contact surfaces between the cold-conducting plate component and the superconducting coil assembly require secondary finishing to ensure flatness and smoothness, laying the foundation for low thermal resistance contact with the subsequent high-temperature superconducting coil assembly.

[0053] Step 2: Winding of the disc-shaped superconducting coil assembly.

[0054] High-performance superconducting cables with a specific cross-sectional area are formed by stacking or spirally winding multiple second-generation high-temperature superconducting tapes (such as REBCO tapes). During the winding process, relevant process standards must be followed to ensure the connection quality between the tapes. Using the prepared superconducting cable, a single disc-shaped superconducting coil assembly (disc coil) is wound on a dedicated winding machine using a disc-like winding method. A constant and appropriate tension must be applied during winding, and the number of turns and geometric dimensions of the coil must be precisely controlled to ensure its assembly relationship with the cold-conducting plate components.

[0055] Step 3: Superconducting magnet assembly and vacuum pressure impregnation for overall curing.

[0056] The wound disc-shaped superconducting coil assemblies are alternately stacked with the fabricated cold-conducting plate components, ensuring that both end faces of each disc-shaped superconducting coil assembly are in close contact with the cold-conducting plate component to maximize the area of ​​contact. The entire structure is then placed in a vacuum pressure impregnation tank. First, a vacuum process is performed to completely remove air and moisture from the inside of the windings, the surface of the cold-conducting plate component, and all gaps. Next, under vacuum or pressure conditions, low-viscosity, high-thermal-conductivity epoxy resin is injected into the tank, allowing it to fully impregnate the spaces between each superconducting coil turn and between the superconducting coil assembly and the cold-conducting plate component. Finally, the structure is heated according to the resin's specified curing process curve, allowing the entire structure (including the high-temperature superconducting coil assembly, cooling pipes, cold-conducting plate component, and the filled thermally conductive resin) to cure into a rigid, dense whole with excellent thermal conductivity. This step is crucial for forming a highly efficient "forced flow conduction" cooling structure.

[0057] Step 4: System assembly and performance verification.

[0058] The cured superconducting magnet is removed from the impregnation tank. The inlet and outlet of the cooling pipe are reliably connected to the external high-efficiency cryogenic refrigerator circulation system to form a closed forced-flow cooling loop. High-strength, low-thermal-leakage-current leads for the high-temperature superconducting coil assembly are welded, and sensors for temperature, strain, and quench detection are installed. Finally, the entire superconducting magnet undergoes rigorous electrical strength testing, insulation resistance testing, and helium mass spectrometry leak detection to ensure its operational safety and reliability at cryogenic temperatures.

[0059] It should be noted that, in addition to the specific embodiments described above, those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. Although the description of this utility model will be presented in conjunction with preferred embodiments, this does not mean that the features of this utility model are limited to that embodiment. On the contrary, the purpose of describing the utility model in conjunction with the embodiments is to cover other options or modifications that may be derived from the claims of this utility model. To provide a deep understanding of this utility model, many specific details will be included in the following description. This utility model may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this utility model, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0060] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0061] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0062] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0063] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0064] Although the present invention has been illustrated and described with reference to certain preferred embodiments, those skilled in the art should understand that the above description is a further detailed explanation of the present invention in conjunction with specific embodiments, and should not be construed as limiting the specific implementation of the present invention to these descriptions. Those skilled in the art can make various changes in form and detail, including some simple deductions or substitutions, without departing from the spirit and scope of the present invention.

Claims

1. A cooling structure for a high-temperature superconducting coil assembly, characterized in that, Includes: a cooling assembly, the cooling assembly being attached to at least one outer surface of the high-temperature superconducting coil assembly; wherein The cooling assembly includes a cold-conducting plate component and multiple cooling pipes. One side surface of the cold-conducting plate component in the thickness direction is attached to the corresponding outer surface of the high-temperature superconducting coil assembly. The cold-conducting plate component is connected to the cold head of an external cryogenic refrigerator. Multiple mounting slots extending along the thickness direction are also formed on the other side surface of the cold-conducting plate component. The multiple mounting slots are evenly spaced and arranged side by side along the surface extension direction. The multiple cooling pipes are respectively adapted to a corresponding mounting slot, and the outer wall of each cooling pipe is in thermal contact with the inner wall of the corresponding mounting slot. Each of the mounting slots is further provided with a clamping member, the side surface of which faces the cooling pipe is adapted to the outer wall surface of the cooling pipe, and the other side surface away from the cooling pipe is flush with the other side surface of the cold-conducting plate component; and In the thickness direction of the cold-conducting plate component, each of the cooling pipes is located in the middle of the cold-conducting plate component.

2. The cooling structure of the high-temperature superconducting coil assembly as described in claim 1, characterized in that, The high-temperature superconducting coil assembly includes multiple stacked disk-shaped superconducting coil groups; and The high-temperature superconducting coil assembly has cooling components disposed on both end surfaces in the stacking direction, and a corresponding cooling component is sandwiched between two adjacent disc-shaped superconducting coil assemblies.

3. The cooling structure of the high-temperature superconducting coil assembly as described in claim 2, characterized in that, The shape of the cooling plate component of each cooling assembly is adapted to the shape of the corresponding high-temperature superconducting coil assembly. The plurality of mounting slots are formed on the respective side surface of the cooling plate component and are evenly spaced in the radial direction of the high-temperature superconducting coil assembly, and each mounting slot extends circumferentially along the high-temperature superconducting coil assembly.

4. The cooling structure of the high-temperature superconducting coil assembly as described in claim 1, characterized in that, The high-temperature superconducting coil assembly comprises multiple cylindrical superconducting coil groups nested in layers; and The high-temperature superconducting coil assembly has cooling components disposed on both sides of its radial direction, and a corresponding cooling component is sandwiched between two adjacent cylindrical superconducting coil assemblies.

5. The cooling structure of the high-temperature superconducting coil assembly as described in claim 4, characterized in that, The plurality of mounting slots are formed on a corresponding side surface of the cooling plate component, are evenly spaced in the circumferential direction of the high-temperature superconducting coil assembly, and each mounting slot extends along the axial direction of the high-temperature superconducting coil assembly.

6. The cooling structure of the high-temperature superconducting coil assembly as described in claim 1, characterized in that, A thermally conductive layer is filled between the outer wall of each cooling pipe and the inner wall of the corresponding mounting groove, and between the surface of the corresponding clamping member facing the cooling pipe.

7. The cooling structure of the high-temperature superconducting coil assembly as described in claim 6, characterized in that, Each of the cooling pipes has a circular cross-section, and the bottom of each mounting groove is an arc-shaped surface adapted to the outer wall surface of the corresponding cooling pipe. The side surface of the clamping member facing the corresponding cooling pipe is an arc-shaped surface adapted to the outer wall surface of the cooling pipe.

8. A superconducting magnet, characterized in that, It includes a high-temperature superconducting coil assembly and a cooling structure for the high-temperature superconducting coil assembly as described in any one of claims 1-7.

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