Anti-skew circuit board welding equipment for integrated circuit board processing and control method

Abstract

The invention discloses anti-deflection circuit board welding equipment for integrated circuit board processing and a control method, and relates to the technical field of integrated circuit board processing. The multi-point dynamic supporting subsystem is arranged on the bearing base and comprises a plurality of supporting units which are arranged in an array mode; the multi-modal sensing subsystem is arranged on the bearing base and corresponds to the multi-point dynamic supporting subsystem; the intelligent prediction control subsystem is electrically connected with the multi-point dynamic support subsystem and the multi-modal sensing subsystem; and the control subsystem is used for predicting the deformation trend of the circuit board and controlling each supporting unit of the multi-point dynamic supporting subsystem to independently move so as to form a supporting curved surface for compensating the buckling deformation of the circuit board. Through cooperative work of real-time monitoring, advanced prediction and dynamic compensation, passive correction is changed into active intelligent correction. Dynamic deformation caused by welding thermal stress can be actively counteracted, a welding area is kept at extremely high flatness, and the welding yield and the equipment reliability are fundamentally improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuit board processing, and particularly relates to a kind of integrated circuit board processing anti-inclination circuit board welding equipment and control method. BACKGROUND

[0002] In modern electronic manufacturing industry, integrated circuit board as the core carrier of various electronic products, its production quality is directly related to the performance and reliability of the final product, and in the production process of high density, high precision integrated circuit board, welding is a crucial link.Circuit board in the welding process, will be subjected to from the welding head or laser rapid, local and uneven heating, and then in the environment natural or forced cooling.This sharp temperature gradient changes, will produce complex thermal stress in the board, when thermal stress exceeds the rigidity of the material itself can withstand the scope, will be in the form of macroscopic geometric deformation release, cause circuit board warping, distortion and other three-dimensional deformation, this dynamic deformation, is the root cause of the problem of welding quality.Therefore, how to keep the circuit board, especially the key welding area, is always flat during welding, is one of the core goals pursued by the technical field for a long time.

[0003] At present, the traditional technical scheme for dealing with circuit board welding deformation in the industry has obvious limitations.The mainstream production line generally uses rigid clamps or mechanical pressing to position and fix the circuit board.However, the initial positioning of the circuit board during fixation may have some errors, more importantly, it cannot adapt to the real-time and dynamic deformation caused by thermal stress during welding.The pressing force of rigid clamps is constant and global, and cannot respond and compensate for local and instantaneous warping.This leads to the fact that the circuit board will still be inclined under the action of welding heat, and further cause a series of serious quality defects, such as the position deviation of components due to uneven board surface, poor connection of solder joints due to height changes, virtual welding, and even short circuit or open circuit caused by excessive deformation.The existing other solutions, such as adding a quality detection and screening process after welding, can eliminate defective products, but it is essentially a lagging remedial measure that cannot recover the already produced defective products, causing great waste of materials and seriously affecting the overall production efficiency.Therefore, the existing technology cannot fundamentally eliminate the dynamic inclination during welding, and the industry urgently needs a technical solution that can actively and real-time intervene and correct during welding to meet the increasingly stringent production requirements. SUMMARY

[0004] The present application aims to provide a kind of integrated circuit board processing anti-inclination circuit board welding equipment and control method, solve the problems in the background art.

[0005] To solve the above technical problems, the present application provides a kind of integrated circuit board processing anti-inclination circuit board welding equipment, comprising:

[0006] Bearing base;

[0007] Multi-point dynamic support subsystem, set in the bearing base, the multi-point dynamic support subsystem includes a plurality of support units arranged in array;Each of the support unit includes a piezoelectric ceramic actuator, a support top rod connected to the piezoelectric ceramic actuator and a force sensor integrated into the support unit base;

[0008] Multi-modal sensing subsystem, set in the bearing base, and corresponding the multi-point dynamic support subsystem setting, the multi-modal sensing subsystem includes a global vision positioning camera arranged above the circuit board and a laser sensor array arranged below the circuit board;

[0009] Intelligent predictive control subsystem, electrically connected to the multi-point dynamic support subsystem and the multi-modal sensing subsystem;The intelligent predictive control subsystem is used to predict the deformation trend of the circuit board based on the sensing data of the multi-modal sensing subsystem, and control the independent motion of each of the support unit of the multi-point dynamic support subsystem, to form a support surface to compensate the warping deformation of the circuit board.

[0010] Preferably, the top end of the support top rod is provided with a micro contact head made of low thermal conductivity material.

[0011] Preferably, the lens of the laser sensor array is provided with a protective cover with positive pressure blowing function.

[0012] Preferably, the intelligent predictive control subsystem is built-in with a thermal-force coupling prediction model;The model is used to predict the future deformation displacement of the circuit board based on the stress growth rate monitored by the force sensor and the geometric deformation rate monitored by the laser sensor.

[0013] Preferably, it further comprises a standard plane reference block fixed to the bearing base;The intelligent predictive control subsystem is connected to control the laser sensor array to scan the standard plane reference block and each of the support top rod regularly, to realize self-calibration.

[0014] Also provided is a kind of integrated circuit board processing anti-inclination circuit board welding control method, comprising:

[0015] S1, control the multi-point dynamic support subsystem to lift the circuit board, and control the multi-modal sensing subsystem to scan the circuit board to establish the datum model of three-dimensional posture;

[0016] S2, after welding starts, control the multi-modal sensing subsystem to collect the deformation and stress data of the circuit board at high frequency;

[0017] S3, inputting the deformation and stress data into the intelligent predictive control subsystem to predict the deformation trend of the circuit board;

[0018] S4, the intelligent predictive control subsystem generates compensation instructions according to the deformation trend, and controls each support unit of the multi-point dynamic support subsystem to perform micron-level lifting adjustment to actively maintain the soldering area of the circuit board in a horizontal posture;

[0019] S5, steps S2 to S4 are cyclically executed until the soldering work is completed.

[0020] Preferably, before the S1 step, further comprising:

[0021] controlling the global visual positioning camera to identify the model of the circuit board, and the intelligent predictive control subsystem loading corresponding material property parameters according to the model.

[0022] Preferably, after the soldering work is completed, further comprising:

[0023] During the cooling stage of the circuit board, the multi-point dynamic support subsystem continues to be controlled for dynamic compensation to reduce residual deformation during the cooling process.

[0024] Compared with the prior art, the present application has the following beneficial effects:

[0025] 1. The present application innovates the traditional passive fixing mode to an intelligent active correction mode by organically integrating high-precision sensing, intelligent prediction and dynamic compensation mechanism, and uses a distributed multi-point support system to form a dynamically changing and accurately adjustable support surface below according to the real-time state of the circuit board, actively adapts to and offsets any complex warping deformation caused by thermal stress, ensures that the key soldering area of the circuit board is always maintained in an ideal horizontal posture during the entire processing process, and significantly improves the precision and consistency of soldering.

[0026] 2. The present application has a feedforward predictive control capability, and is not a lag compensation after detecting deformation error, but through the built-in physical model, the stress and displacement data collected in real time are fused to calculate and predict the deformation trend of the circuit board in the future very short time, so that the compensation action can lead the actual occurrence of physical deformation, fundamentally solves the precision bottleneck caused by signal and execution delay in the traditional control mode, and realizes micron-level accurate inhibition of high-speed dynamic deformation.

[0027] 3、The application effectively isolates the interference of the support mechanism on the thermal field of the soldering area of the circuit board by adopting a support contact head made of low-thermal-conductivity material, in order to cope with the challenge of soldering fume to optical sensing, a specially designed positive pressure air purge protection cover ensures the continuous accuracy of the detection system, in addition, the self-calibration function of the system can automatically correct the accuracy drift that may be generated due to long-term operation, ensuring the stability and reliability of the equipment throughout its life cycle, and greatly reducing the maintenance difficulty.

[0028] 4、The control method covers the whole process from feeding to cooling, showing high systematicness and adaptability, and can automatically load the characteristic parameters of the corresponding model circuit board before processing through visual identification, realize personalized and accurate control, and continue to provide dynamic support during the cooling stage after welding to reduce the residual stress and deformation generated during the cooling process, and comprehensively guarantee the whole process quality of the circuit board from welding to forming, and finally obtain a finished product with higher flatness and stronger reliability. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the drawings in the following description only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings;

[0030] Figure 1 is the structure diagram of the whole device outside;

[0031] Figure 2 is the structure diagram of the global visual positioning camera;

[0032] Figure 3 is the structure diagram of the bearing base;

[0033] Figure 4 is the structure diagram of the support top rod;

[0034] Figure 5 is the structure diagram of the laser sensor;

[0035] 100, multi-point dynamic support subsystem; 101, bearing base; 102, piezoelectric ceramic actuator; 103, support top rod; 104, force sensor; 105, micro contact head; 200, multi-modal sensing subsystem; 201, global visual positioning camera; 202, laser sensor array; 203, protection cover; 300, intelligent predictive control subsystem; 4, standard plane reference block. DETAILED DESCRIPTION

[0036] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative work are within the protection scope of the present application.

[0037] Embodiment 1

[0038] Please refer to Figures 1-5 The present application provides a kind of integrated circuit board processing prevents skewing circuit board welding equipment, comprising: bearing pedestal 101;

[0039] Multi-point dynamic support subsystem 100 is arranged in the bearing pedestal 101, and the multi-point dynamic support subsystem 100 includes a plurality of support units arranged in array;Each of the support unit includes piezoelectric ceramic actuator 102, support top rod 103 connected to the piezoelectric ceramic actuator 102 and force sensor 104 integrated in the support unit base;

[0040] Multi-modal sensing subsystem 200 is arranged in the bearing pedestal 101, and is arranged corresponding to the multi-point dynamic support subsystem 100, and the multi-modal sensing subsystem 200 includes global visual positioning camera 201 arranged above the circuit board and laser sensor array 202 arranged below the circuit board;

[0041] Intelligent predictive control subsystem 300 is electrically connected to the multi-point dynamic support subsystem 100 and the multi-modal sensing subsystem 200;The intelligent predictive control subsystem 300 is used to predict the deformation trend of the circuit board based on the sensing data of the multi-modal sensing subsystem 200, and control the independent movement of each of the support unit of the multi-point dynamic support subsystem 100, to form the support curved surface that compensates the warping deformation of the circuit board;

[0042] To solve the technical problem of dynamic distortion of the circuit board caused by welding thermal stress and further causing welding defects in the prior art, the embodiment provides a kind of anti-inclination circuit board welding equipment for integrated circuit board processing;The equipment includes a bearing base 101 as a mounting base;A multi-point dynamic support subsystem 100 is arranged on the bearing base 101, which is composed of a plurality of arrayed support units, for supporting and adjusting the circuit board from below during welding;Each independent support unit is provided with a core drive component piezoelectric ceramic actuator 102 and a force sensor 104 for monitoring the support point pressure, and the piezoelectric ceramic actuator 102 is connected with a support top rod 103 extending upward;At the same time, the equipment also includes a multi-modal sensing subsystem 200, which is specifically composed of a global visual positioning camera 201 arranged above the processing station for identifying the model and initial position of the circuit board, and a laser sensor array 202 arranged below the circuit board for precise measurement of the three-dimensional morphology of the board;The core of the equipment is an intelligent predictive control subsystem 300, which is electrically connected to the multi-point dynamic support subsystem 100 and the multi-modal sensing subsystem 200 through data cables;In work, the intelligent predictive control subsystem 300 receives and processes the real-time posture and stress data of the circuit board collected by the multi-modal sensing subsystem 200, predicts the deformation trend of the circuit board under the influence of welding heat based on these data, and generates control instructions accordingly;The instructions are sent to the multi-point dynamic support subsystem 100 to control the piezoelectric ceramic actuator 102 of each support unit to perform independent, micron-level lifting motion;It is worth noting that the piezoelectric ceramic actuator 102 itself has micron-level or even higher motion resolution, thereby ensuring the accurate execution of micron-level compensation control instructions;All support units act in concert to form a dynamic support surface under the circuit board, which is opposite to the predicted warping deformation trend, actively offsets thermal stress deformation, and continuously maintains the welding area of the circuit board at a preset horizontal posture, thereby improving the welding quality;

[0043] The top end of the support top rod 103 is provided with a micro contact head 105 made of a low thermal conductivity material;

[0044] To solve the secondary technical problem that the support system may interfere with the temperature field of the soldering area due to heat conduction when physically contacting and compensating the circuit board, a micro contact head 105 is specially arranged at the part of the support top rod 103 in contact with the circuit board in each support unit of the multi-point dynamic support subsystem 100, and the top end of the support top rod 103 is connected to the piezoelectric ceramic actuator 102; the contact head is made of a material with low thermal conductivity, such as zirconia ceramic; the zirconia ceramic material has low heat conduction efficiency and high wear resistance; the point contact between the micro contact head 105 made of the low thermal conductivity material and the circuit board can reduce the heat conduction between the support system and the circuit board to a very low level; the technical effect is that while achieving active deviation correction support, the support action does not affect the temperature distribution of the key soldering area of the circuit board, eliminates the interference with the heat field of the soldering process, and ensures the stability of the soldering quality.

[0045] A protective cover 203 with positive pressure air blowing function is arranged in front of the lens of the laser sensor array 202;

[0046] To solve the technical problem that the smoke and dust particles generated during the soldering process may adhere to the surface of the optical sensor, thereby affecting the measurement accuracy and the long-term stability of the equipment; in the multi-modal sensing subsystem 200, a protective cover 203 is additionally arranged in front of the optical lens of each sensor of the laser sensor array 202 located below the circuit board; the protective cover 203 has a special structure, clean compressed air can be introduced into the cover, and a continuous and stable positive pressure air flow is formed outward from the opening at the front end of the cover body; this design forms an invisible air barrier in front of the lens, which can effectively blow away and isolate the dispersed smoke and dust in the soldering station, preventing contaminants from adhering to the lens surface; the technical effect is that the laser sensor can still perform long-term, stable and high-precision measurement in harsh conditions such as smoke, ensuring the reliability of the system in obtaining circuit board deformation data, and improving the anti-interference ability and environmental adaptability of the equipment.

[0047] The intelligent predictive control subsystem 300 is built-in with a thermal-mechanical coupling prediction model; the model is used to predict the future deformation displacement of the circuit board based on the stress growth rate monitored by the force sensor 104 and the geometric deformation rate monitored by the laser sensor;

[0048] To solve the technical problem that the traditional control method cannot accurately compensate for the high-speed change of the circuit board deformation due to the delay of signal acquisition and mechanical execution, a thermal-mechanical coupling prediction model based on physical mechanism is built-in at the software core of the intelligent predictive control subsystem 300; instead of lagging compensation after detecting the deformation displacement, the model performs feedforward prediction by fusing multi-modal sensing data;

[0049] The specific calculation process is as follows: after the welding starts, the system collects real-time geometric displacement data from the laser sensor array 202 below and real-time support force data from the force sensor 104 array of the support unit base; by fusing the two heterogeneous sensing data, the model can accurately predict the deformation displacement of the circuit board in the future very short time; to realize this prediction, the model adopts a feedforward prediction algorithm based on a state space equation; specifically, at time k, the future deformation displacement D pred (k+1) of a point on the circuit board can be predicted by the following classical kinematics formula:

[0050]

[0051] D actual (k) is the actual absolute displacement of the point measured by the laser sensor array (202) at the current time k;

[0052] v(k) is the deformation rate at the current time k, which can be approximately calculated by the change amount of displacement of the laser sensor array (202) in the last several sampling periods through numerical methods such as backward difference in a discrete time system, for example: Where Δt sample is the sampling time interval of the sensor;

[0053] Δt is the prediction time step, which can be set according to the system response requirement (for example, 10 milliseconds);

[0054] a pred (k) is the core prediction part of the model, which is the estimated value of the deformation acceleration in the future one small time step at the current time k; the prediction of the acceleration is based on a physical model that simplifies the local area of the circuit board as an elastic body, whose behavior follows the dynamic form of Hooke's law;

[0055] In this model, the support force F(k) monitored in real time by the force sensor 104 is proportional to the local elastic deformation displacement D local (k) of the circuit board at the support point, and the proportional coefficient is the equivalent local stiffness k eff of the point; it should be noted that D local (k) refers to the local compression or warping deformation caused by the support force, which is different from the absolute displacement D actual (k) measured by the sensor, but the time variation trend (i.e., speed, acceleration) of the two is coupled in dynamic response; the relationship is:

[0056] F(k)≈k eff ·D local (k)

[0057] F(k) represents the real-time monitored support force;

[0058] D local (k) represents the local elastic deformation displacement at the support point;

[0059] k eff represents the equivalent local stiffness of the point, with the dimension of force / displacement (e.g. N / m); the coefficient is related to the material properties (such as elastic modulus) and geometry (such as thickness) of the circuit board, as well as the position of the support point on the board; before welding, the system loads the corresponding k eff value from the parameter library when identifying the model of the circuit board by vision;

[0060] In order to predict the difficult-to-directly-measure acceleration a(k) from the directly-measurable force signal F(k), we take the second-order derivative of the above relationship with respect to time; assuming that k eff is constant within a small deformation range, we can get:

[0061]

[0062] Since the definition of acceleration is the second-order time derivative of displacement, i.e. This acceleration is also the acceleration that causes the change of the overall displacement D actual (k); by substitution, we can get the calculation formula of the estimated acceleration a pred (k):

[0063]

[0064] In a discrete digital control system, the second-order time derivative of the support force cannot be directly obtained, but is approximated by numerical differentiation on a series of discrete force signals F(k), F(k-1), F(k-2), … collected by the force sensor (104); for example, the central difference method or other digital filtering algorithms can be used to estimate the value; it represents the acceleration trend of the change of the support force, and thus indirectly reflects the severity of the change of thermal stress caused by the change of thermal gradient;

[0065] By this method, the system can not rely on direct modeling of the complex thermal field, but innovatively use the dynamic form of Hooke's law to accurately and quickly predict the future deformation acceleration from the second-order change rate of force by fusing two heterogeneous sensing data of displacement (from the laser sensor) and force (from the force sensor); this physical model-based feedforward prediction control method enables the compensation action to be performed in advance before the error actually occurs, thus solving the control delay problem from the mechanism and achieving micron-level dynamic correction accuracy.

[0066] Also included is a standard plane reference block 4 fixed to the bearing base 101; the intelligent predictive control subsystem 300 is connected to control the laser sensor array 202 to periodically scan the standard plane reference block 4 and each support top rod 103 to achieve self-calibration;

[0067] To solve the technical problem that the positioning accuracy may drift due to mechanical wear or thermal expansion and contraction after long-term high-frequency reciprocating motion of the precision equipment, thereby affecting the compensation effect; a standard plane reference block 4 is added to the hardware of the equipment, the reference block is made of high-stability material, has extremely high flatness on the surface, and is firmly installed at a fixed position on the bearing base 101; on the software level, a self-calibration program is integrated into the intelligent predictive control subsystem 300; the program can be set to start periodically (such as at the beginning of each production shift) or on demand; after starting, the control system controls the laser sensor array 202 to first scan the standard plane reference block 4 to obtain an absolute reference plane data, and then scans the top end position of the support top rod 103 of each support unit one by one; by comparing the difference between the measured value and the initial calibration value, the system can automatically calculate the precision drift of each support point, and generate correction parameters to compensate the control system; the design ensures the precision consistency and reliability of the equipment throughout its life cycle through the automated calibration process, and reduces the complexity and cost of manual maintenance.

[0068] Embodiment 2:

[0069] The application also provides a control method for preventing the inclination of a circuit board during welding of an integrated circuit board processing device, comprising:

[0070] S1, control the multi-point dynamic support subsystem 100 to lift the circuit board, and control the multi-modal sensing subsystem 200 to scan the circuit board to establish a three-dimensional attitude reference data model;

[0071] S2, after the start of welding, control the multi-modal sensing subsystem 200 to collect deformation and stress data of the circuit board at a high frequency;

[0072] S3, input the deformation and stress data into the intelligent predictive control subsystem 300 to predict the deformation trend of the circuit board;

[0073] S4, the intelligent predictive control subsystem 300 generates compensation instructions according to the deformation trend, and controls each support unit of the multi-point dynamic support subsystem 100 to perform micron-level lifting adjustment to actively maintain the welding area of the circuit board in a horizontal attitude;

[0074] S5, steps S2 to S4 are repeatedly executed until the welding work is completed;

[0075] The embodiment discloses a kind of integrated circuit board processing anti-inclination circuit board welding equipment control method, the method is changed into intelligent active correction mode from traditional passive fixed mode, specific execution steps are as follows: first, execute step S1, after the circuit board to be welded enters processing station, control system instructs all support units of multipoint dynamic support subsystem 100 to rise, with a preset tiny initial force gently holds up circuit board;Immediately, control the bottom laser sensor array 202 to the bottom surface of circuit board is scanned quickly, measures its initial three-dimensional topography, and this data is used as subsequent compensation datum model;Then, welding operation starts, method enters a high-speed closed-loop control stage;In step S2, once welding heat source acts on circuit board, multi-modal sensing subsystem 200 starts to work, in which force sensor 104 array and laser sensor array 202 continuously collect internal stress change and geometric deformation data of circuit board with kilohertz level frequency;Then, in step S3, all collected real-time data are uninterruptedly transmitted to intelligent predictive control subsystem 300, and are handled by the prediction model in it to calculate the deformation trend of circuit board in next time;Then, in step S4, intelligent predictive control subsystem 300 generates a set of multi-point collaborative compensation instructions based on the predicted deformation trend, and issues the instruction to each support unit of multipoint dynamic support subsystem 100;Each unit carries out independent, micron-precision lifting adjustment according to instruction, and jointly forms a dynamic support surface opposite to the warping deformation trend of circuit board, to actively maintain the welding plane of circuit board in the preset horizontal tolerance range;Finally, execute step S5, in the whole welding process, from data acquisition S2 to prediction decision S3 again to the step of executing compensation S4 will be as a whole cycle high-speed operation, until all welding tasks are completed.

[0076] The S1 step further includes before:

[0077] Control the global vision positioning camera 201 to identify circuit board model, and the intelligent predictive control subsystem 300 loads corresponding material characteristic parameters according to the model;

[0078] In order to improve the adaptability of the equipment to different specifications of the circuit board and the accuracy of the control, a preprocessing step is added before step S1; in this step, when a circuit board to be welded enters the processing station through the conveying system, the image of the circuit board is first captured by the global vision positioning camera 201 arranged above the station; the image processing system analyzes the image, identifies the specific model information of the current circuit board to be processed through edge contour recognition or reading of bar codes, two-dimensional codes and other marks on the board; the model information is sent to the intelligent predictive control subsystem 300; the control system internally pre-stores a parameter library containing various key material characteristic parameters of different models of circuit boards, such as thermal expansion coefficient, elastic modulus, thickness, size, etc.; after receiving the model information, the control system automatically calls and loads the parameter file corresponding to the model from the parameter library; these accurate parameters will be used as the basis for input for the subsequent heat-force coupling prediction model, which significantly improves the accuracy of the prediction model and realizes individualized and optimized control of different circuit boards, achieving a balance between generalization and high-precision control.

[0079] After the welding work is completed, it also includes:

[0080] During the cooling stage of the circuit board, the multi-point dynamic support subsystem 100 continues to be controlled to perform dynamic compensation to reduce residual deformation during the cooling process;

[0081] To solve the technical problem that the circuit board will also generate thermal stress and may cause permanent residual deformation due to rapid and uneven cooling after welding is completed and the heat source is removed, a post-processing step is added; specifically, after the welding work is completed and the welding heat source is removed, the control system does not immediately remove the support, but enters a compensation program for the cooling stage; in this stage, the multi-modal sensing subsystem 200 continues to monitor the shrinkage deformation trend of the circuit board due to temperature drop; the intelligent predictive control subsystem 300 also continues to operate to control the multi-point dynamic support subsystem 100 to provide dynamic and adaptive support; this active intervention during the cooling process can effectively reduce the stress concentration caused by uneven cooling inside the circuit board, thereby significantly reducing the residual warping or distortion of the final product board; the technical effect is that not only the flatness during the welding process is ensured, but also the final flatness after the product is cooled and formed is improved, further improving the overall quality and reliability of the product.

[0082] Compared with the prior art, the technical scheme introduces an active and predictive control strategy, which presents significant beneficial effects and technical progress;

[0083] The prior art mainly relies on rigid clamps to passively mechanically press and fix the circuit board; the limitation of this method is that it cannot adapt to the dynamic warping deformation caused by local, rapid and uneven heating during the welding process, resulting in poor solder joint connection, component deviation and other quality defects; the present scheme fundamentally changes this situation; the core difference is that the cooperative work of the multi-point dynamic support subsystem 100, the multi-modal sensing subsystem 200 and the intelligent predictive control subsystem 300 upgrades passive fixing to intelligent active correction;

[0084] The significant progress of the present technical scheme lies in that, by virtue of the built-in thermal-force coupling prediction model, it realizes a fundamental change from lag compensation to feedforward prediction; instead of reacting after detecting deformation errors, the model combines the stress growth rate monitored by the force sensor 104 and the geometric deformation rate monitored by the laser sensor to calculate the future deformation displacement of the circuit board in advance; accordingly, the intelligent predictive control subsystem 300 can instruct each piezoelectric ceramic actuator 102 of the multi-point dynamic support subsystem 100 to act in advance to generate a compensation surface opposite to the predicted deformation trend; this mechanism enables the compensation action to precede the actual occurrence of physical deformation, fundamentally solving the precision problem of traditional control methods due to data and execution delays, and maintaining the dynamic flatness of the welding area within a micron-level tolerance range;

[0085] To ensure the accuracy and reliability of the above core functions, the present scheme also includes several key improvements; to avoid the interference of heat conduction between the support mechanism and the circuit board, the top end of the support top rod 103 is specially provided with a micro contact head 105 made of low thermal conductivity material; this design not only realizes precise physical support, but also ensures that the welding area thermal field is not affected; to ensure the long-term working stability of the sensing system in the welding smoke environment, a protective cover 203 with positive pressure blowing function is installed in front of the lens of the laser sensor array 202; this structure forms a continuous air curtain barrier, effectively preventing the attachment of pollutants to the optical lens, ensuring the continuous accuracy and reliability of the measurement data; in addition, the system also includes a standard plane reference block 4 fixed to the bearing base 101, and the intelligent predictive control subsystem 300 can control the laser sensor array 202 to regularly scan it to realize system self-calibration, thereby correcting the mechanical wear or thermal drift that may be caused by long-term operation, ensuring the precision consistency of the equipment throughout its life cycle;

[0086] At the level of the control method, the scheme also shows systematic progress; before the welding task begins, the global visual positioning camera 201 first identifies the circuit board model, and the intelligent predictive control subsystem 300 then loads the corresponding material characteristic parameters, realizing personalized and accurate control for different products; during the cooling stage after welding, the device continues to perform dynamic compensation to reduce the residual deformation of the circuit board due to temperature drop; this closed-loop control strategy covering the whole process from loading identification to welding process to cooling forming can more comprehensively improve the final quality of the circuit board product compared with the existing technology which only focuses on the welding moment.

[0087] The above is only a preferred embodiment of the present application, and does not limit the present application in other forms. Any skilled person in the art can use the disclosed technical content to make changes or modifications to equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification made to the above embodiments without departing from the technical solution content of the present application, in accordance with the technical essence of the present application, still belongs to the protection scope of the technical solution of the present application.

Claims

1. A skew-resistant circuit board welding device for integrated circuit board processing, characterized in that, The application relates to a circuit board welding device, which comprises the following parts: a bearing base (101); a multi-point dynamic support subsystem (100) arranged on the bearing base (101), wherein the multi-point dynamic support subsystem (100) comprises a plurality of support units arranged in an array, each of the support units comprises a piezoelectric ceramic actuator (102), a support top rod (103) connected to the piezoelectric ceramic actuator (102), and a force sensor (104) integrated in a base of the support unit; a multi-modal sensing subsystem (200) arranged on the bearing base (101) and corresponding to the multi-point dynamic support subsystem (100), wherein the multi-modal sensing subsystem (200) comprises a global visual positioning camera (201) arranged above a circuit board and a laser sensor array (202) arranged below the circuit board; an intelligent predictive control subsystem (300) electrically connected to the multi-point dynamic support subsystem (100) and the multi-modal sensing subsystem (200), wherein the intelligent predictive control subsystem (300) is used for predicting a deformation trend of the circuit board based on sensing data of the multi-modal sensing subsystem (200) and controlling independent movements of each of the support units of the multi-point dynamic support subsystem (100) to form a support curved surface for compensating for warping deformation of the circuit board.

2. The integrated circuit board processing skew prevention circuit board soldering apparatus of claim 1 wherein, A micro contact head (105) made of a low-thermal-conductivity material is arranged at a top end of the support top rod (103).

3. The integrated circuit board processing skew prevention circuit board soldering apparatus of claim 1 wherein, A protective cover (203) with a positive pressure air blowing function is arranged in front of a lens of the laser sensor array (202).

4. The integrated circuit board processing skew prevention circuit board soldering apparatus of claim 1 wherein, The intelligent predictive control subsystem (300) is internally provided with a thermal-force coupling prediction model, wherein the model is used for predicting future deformation displacement of the circuit board based on a stress growth rate monitored by the force sensor (104) and a geometric deformation rate monitored by the laser sensor.

5. The integrated circuit board processing skew prevention circuit board soldering apparatus of claim 1 wherein, The application further comprises a standard plane reference block (4) fixed to the bearing base (101), and the intelligent predictive control subsystem (300) is connected to control the laser sensor array (202) to periodically scan the standard plane reference block (4) and each of the support top rods (103) to realize self-calibration.

6. A method for preventing misalignment of a circuit board during soldering of an integrated circuit board processing apparatus according to any one of claims 1 to 5, wherein The application further comprises the following steps: S1. Controlling the multi-point dynamic support subsystem (100) to hold up the circuit board and controlling the multi-modal sensing subsystem (200) to scan the circuit board to establish a three-dimensional attitude reference data model; S2. After welding starts, controlling the multi-modal sensing subsystem (200) to high-frequency collect deformation and stress data of the circuit board; S3. Inputting the deformation and stress data into the intelligent predictive control subsystem (300) to predict a deformation trend of the circuit board; S4. The intelligent predictive control subsystem (300) generates compensation instructions according to the deformation trend and controls each of the support units of the multi-point dynamic support subsystem (100) to perform micron-level lifting adjustment to actively maintain a welding area of the circuit board in a horizontal attitude; S5. Repeating steps S2 to S4 until the welding work is completed.

7. The integrated circuit board processing skew prevention circuit board soldering control method of claim 6, wherein, Before the step S1, the application further comprises the following steps: The global visual positioning camera (201) is controlled to identify a circuit board model, and the intelligent prediction control subsystem (300) loads corresponding material characteristic parameters according to the model.

8. The method of claim 6, wherein the method further comprises: determining whether the integrated circuit board is tilted; and if the integrated circuit board is tilted, tilting the integrated circuit board to a predetermined angle. After the welding work is completed, further comprising: During the cooling stage of the circuit board, the dynamic compensation of the multi-point dynamic support subsystem (100) is continuously controlled to reduce residual deformation in the cooling process.

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