Vehicle-mounted power supply device, power assembly and electric vehicle

Abstract

The embodiment of the invention provides a vehicle-mounted power supply device, a power assembly and an electric vehicle, relates to the technical field of vehicles, and is used for solving the problem that the space utilization rate of the vehicle-mounted power supply device is low. A circuit board and a radiator in an electrical assembly of the vehicle-mounted power supply device are adjacently arranged in a shell in the first direction, and one or more first magnetic devices are arranged on the other side, away from the circuit board, of the radiator. One side, facing one radiator, of one circuit board is used for fixing two rows of power devices which are arranged at intervals along a third direction, and at least three power devices in each row of power devices are arranged at intervals along a second direction. One side, facing one circuit board, of one radiator is used for being connected with two rows of power devices in a heat conduction mode, the other side, deviating from the circuit board, of one radiator is used for being connected with one or more first magnetic devices in a heat conduction mode, and the power devices and the first magnetic devices are arranged more compactly while the radiators cool the power devices and the first magnetic devices. And the space utilization rate of the vehicle-mounted power supply device is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vehicles, in particular to a vehicle-mounted power supply device, a power assembly and an electric vehicle. BACKGROUND

[0002] The electrical components of the vehicle-mounted power supply device include a circuit board, power devices, magnetic devices and a plurality of electronic devices. In the working process, the circuit board, power devices, magnetic devices and a plurality of electronic devices generate a large amount of heat. Therefore, the electronic devices need to be cooled to ensure the normal operation of the vehicle-mounted power supply device.

[0003] In the related art, the power devices, magnetic devices and a plurality of electronic devices are cooled by the way of single-sidedly attaching a water-cooled plate. This cooling method makes the power devices, magnetic devices and a plurality of electronic devices arranged dispersedly, thereby resulting in a larger occupied space of the electrical components, and further resulting in a lower space utilization rate of the vehicle-mounted power supply device. SUMMARY

[0004] The present application provides a vehicle-mounted power supply device, a power assembly and an electric vehicle to improve the space utilization rate of the vehicle-mounted power supply device.

[0005] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0006] In a first aspect, the present application provides a vehicle-mounted power supply device. The vehicle-mounted power supply device includes at least one of a motor controller or a vehicle-mounted charger. The motor controller is used to control a drive motor of an electric vehicle. The vehicle-mounted charger is used to charge a power battery of the electric vehicle or used to supply power to a load of the electric vehicle. The electrical components of the vehicle-mounted power supply device include one circuit board, one heat sink and one or more first magnetic devices. The one circuit board and the one heat sink are arranged adjacent to each other in a first direction in a housing of the vehicle-mounted power supply device. The one or more first magnetic devices are arranged on the other side of the one heat sink away from the circuit board. One side of the one circuit board facing the one heat sink is used to fix two rows of power devices. Each row of power devices includes at least three power devices. The at least three power devices in each row of power devices are arranged spaced apart in a second direction. The two rows of power devices are arranged spaced apart in a third direction. The first direction, the second direction and the third direction are perpendicular to each other. One side of the one heat sink facing the one circuit board is used to thermally connect the two rows of power devices. The other side of the one heat sink away from the circuit board is used to thermally connect the one or more first magnetic devices.

[0007] In the vehicle-mounted power supply device provided in the present application, one side of a heat sink facing a circuit board is used to thermally connect two rows of power devices, and the heat generated by the two rows of power devices is transferred to the heat sink to reduce the temperature rise of the two rows of power devices, thereby achieving the purpose of cooling the two rows of power devices. The other side of the heat sink away from the circuit board is used to thermally connect one or more first magnetic devices, and the heat generated by the one or more first magnetic devices is transferred to the heat sink to reduce the temperature rise of the one or more first magnetic devices, thereby achieving the purpose of cooling the one or more first magnetic devices.

[0008] By sharing one heat sink for the two rows of power devices and the one or more first magnetic devices, the two rows of power devices and the one or more first magnetic devices are cooled by one heat sink, while the arrangement of the two rows of power devices and the one or more first magnetic devices is more compact, thereby reducing the occupied space of the electrical assembly, and further improving the space utilization of the vehicle-mounted power supply device. Compared with the existing heat dissipation mode of single-sided water-cooled plate for multiple electronic devices, the present application cools multiple electronic devices by one heat sink from both sides, which reduces the space size and also reduces the cost.

[0009] In one embodiment, the spacing between the two rows of power devices along the third direction is greater than the spacing between two adjacent power devices in each row of power devices along the second direction. The size of the heat sink along the third direction is greater than the spacing between the two rows of power devices along the third direction, and the size of the heat sink along the third direction is less than the size of the circuit board along the third direction.

[0010] In the vehicle-mounted power supply device provided in the present application, the spacing between the two rows of power devices along the third direction is greater than the spacing between two adjacent power devices in each row of power devices along the second direction, so that the heat dissipation paths between the two rows of power devices are separated, the thermal interference between the two rows of power devices is reduced, and the heat dissipation efficiency of the power devices is improved.

[0011] The size of the heat sink along the third direction is greater than the spacing between the two rows of power devices along the third direction, which is beneficial to thermally connect each power device in the two rows of power devices with the heat sink, and ensures the heat dissipation effect of the power devices.

[0012] The size of the heat sink along the third direction is less than the size of the circuit board along the third direction, which is beneficial to the heat generated by the power devices being transferred to the heat sink along the shortest path, preventing the heat from being diffused to the circuit board or other components of the circuit board along the third direction, and improving the heat dissipation efficiency of the power devices. On the other hand, it is used to release the area of the edge of the circuit board in the third direction for arranging capacitors, connectors and other devices, which is beneficial to making the device layout of the electrical assembly more compact, thereby improving the space utilization of the vehicle-mounted power supply device. In addition, it is also beneficial to reduce the cost and weight of the vehicle-mounted power supply device.

[0013] In one embodiment, the heat sink includes a first heat sink plate and a second heat sink plate, and the first heat sink plate and the second heat sink plate are used to surround and form a liquid cooling cavity. The first heat sink plate and the second heat sink plate are arranged adjacent to each other along a first direction, and the first heat sink plate has a side facing away from the circuit board and is used to fix a plurality of heat dissipation fins, and the second heat sink plate has a side facing the circuit board and includes a liquid cooling groove used to accommodate the plurality of heat dissipation fins.

[0014] In the vehicle-mounted power supply device provided in the present application, the liquid cooling cavity is used to accommodate the cooling liquid. The cooling liquid in the liquid cooling cavity is in contact with the first heat sink plate and exchanges heat with the first heat sink plate, so as to take away the heat transferred from the power device to the first heat sink plate, so that a temperature gradient is formed between the first heat sink plate and the power device, and then the heat of the power device is continuously transferred to the first heat sink plate.

[0015] The cooling liquid in the liquid cooling cavity is in contact with the second heat sink plate and exchanges heat with the second heat sink plate, so as to take away the heat transferred from the first magnetic device to the second heat sink plate, so that a temperature gradient is formed between the second heat sink plate and the first magnetic device, and then the heat of the first magnetic device is continuously transferred to the second heat sink plate.

[0016] The plurality of heat dissipation fins on the side of the first heat sink plate facing away from the circuit board increases the contact area between the inner wall surface of the first heat sink plate and the cooling liquid in the liquid cooling groove, increases the heat exchange area between the first heat sink plate and the cooling liquid, and thus is conducive to achieving high-efficiency heat dissipation. In addition, the plurality of heat dissipation fins is also conducive to forming turbulent flow and strengthening convective heat transfer.

[0017] In one embodiment, the heat sink includes an inlet and an outlet, and the second heat sink plate includes a separation protrusion facing the circuit board along the first direction, and the separation protrusion is used to separate the liquid cooling groove to form two liquid cooling flow channels, the inlet is used to communicate one of the two liquid cooling flow channels, and the outlet is used to communicate the other of the two liquid cooling flow channels.

[0018] In the vehicle-mounted power supply device provided in the present application, the separation protrusion is used to separate the liquid cooling groove to form two liquid cooling flow channels, which on the one hand realizes the directional flow of the cooling liquid, lengthens the flow path of the cooling liquid, and prevents the cooling liquid from directly flowing from the inlet to the outlet, and on the other hand is conducive to adapting to the layout of the two rows of power devices to cool the two rows of power devices respectively, so as to improve the heat dissipation efficiency of the power devices.

[0019] In one embodiment, the size of the heat sink along a third direction is smaller than the size of the heat sink along a second direction. Along the second direction, the size of the separation protrusion is smaller than the size of each liquid cooling flow channel, and the size of each liquid cooling flow channel is greater than the size of each row of power devices. Along the third direction, the size of the separation protrusion is smaller than the interval between the two adjacent rows of power devices, and the size of each liquid cooling flow channel is greater than the size of the power device.

[0020] Since the two rows of power devices are arranged at intervals along the third direction, and at least three power devices in each row of power devices are arranged at intervals along the second direction, by the size of the heat sink along the second direction being greater than the size of the heat sink along the third direction, the size of the liquid cooling flow channel in the second direction is greater than the size of the liquid cooling flow channel in the third direction, which not only increases the heat exchange area and heat exchange time of the cooling liquid and the power device, but also balances the temperature difference of the cooling liquid, thereby improving the overall heat dissipation efficiency of the heat sink.

[0021] The size of the partition protrusion along the second direction is less than the size of each liquid cooling flow channel along the second direction, and the size of the partition protrusion along the third direction is less than the interval between the two adjacent rows of power devices along the third direction, which not only ensures the communication of the two liquid cooling flow channels, but also increases the cross-sectional area of the liquid cooling flow channel to allow more cooling liquid to pass through the liquid cooling flow channel, thereby improving the heat exchange efficiency. And it is also beneficial to reduce the weight of the vehicle-mounted power supply device and reduce the cost of the vehicle-mounted power supply device.

[0022] The size of each liquid cooling flow channel along the second direction is greater than the size of each row of power devices along the second direction, and the size of each liquid cooling flow channel along the third direction is greater than the size of the power device along the third direction, which is beneficial to make each liquid cooling flow channel completely cover the projection area of the corresponding row of power devices in the first direction, prevent the occurrence of heat dissipation blind area, and improve the heat exchange efficiency.

[0023] In an embodiment, the liquid inlet and the liquid outlet are distributed on the tank bottom of the liquid cooling tank. Wherein, along the third direction, the liquid inlet and the liquid outlet are arranged on both sides of the partition protrusion, and the size of the liquid inlet and the size of the liquid outlet are less than the size of each liquid cooling flow channel.

[0024] In the vehicle-mounted power supply device provided in the present application, by distributing the liquid inlet and the liquid outlet on the tank bottom of the liquid cooling tank, the pipeline connection and later maintenance of the liquid inlet and the liquid outlet are facilitated, so that the maintenance work such as adding and replacing the cooling liquid can be carried out without interrupting the operation of the circuit board.

[0025] The liquid inlet and the liquid outlet are arranged on both sides of the partition protrusion along the third direction to prolong the flow path of the cooling liquid, prevent the cooling liquid entering from the liquid inlet from flowing out of the heat sink directly from the liquid outlet, and improve the heat exchange efficiency of the heat sink. The size of the liquid inlet along the third direction and the size of the liquid outlet along the third direction are both less than the size of each liquid cooling flow channel along the third direction, which is beneficial to improve the local flow rate of the liquid inlet and the liquid outlet, improve the degree of turbulence, strengthen convective heat transfer, and thereby improve the heat exchange efficiency, and on the other hand, it is beneficial to accurately control the cooling liquid flow and reduce the risk of leakage.

[0026] In an embodiment, the shell comprises a first accommodating groove for accommodating the heat sink and one or more first magnetic devices arranged between the heat sink and a groove bottom of the first accommodating groove. The first accommodating groove has a dimension along a second direction greater than a dimension along a third direction of the first accommodating groove, and the heat sink has a dimension along the second direction greater than a dimension along the third direction of the heat sink and the first accommodating groove along the third direction.

[0027] Since the first and second rows of power devices are arranged apart along the third direction, and at least three power devices in each row of power devices are arranged apart along the B direction, the dimension of the heat sink along the second direction is greater than the dimension of the heat sink along the third direction to match the layout of the first and second rows of power devices, increase the heat dissipation area, and thus facilitate improving the heat dissipation efficiency of the power devices. Also, the invalid space occupation is reduced, the space utilization in the shell is improved while achieving efficient heat dissipation, and the space occupation rate of the vehicle-mounted power supply device is improved.

[0028] The dimension of the heat sink along the second direction is greater than the dimension of the first accommodating groove along the third direction, which facilitates fully utilizing the space of the first accommodating groove to increase the flow path of the cooling liquid in the heat sink and improve the heat exchange efficiency of the heat sink. The dimension of the first accommodating groove along the second direction is greater than the dimension of the first accommodating groove along the third direction to match the size of the heat sink, ensure the heat sink to arrange the flow path of the cooling liquid along the long side, shorten the heat transfer path, improve the heat dissipation capacity of the heat sink, and also reduce the invalid space occupation, which facilitates improving the space utilization of the shell.

[0029] In an embodiment, the shell comprises two waterway interfaces distributed in at least one of the groove wall or the groove bottom of the first accommodating groove. One of the two waterway interfaces is used to deliver the cooling liquid to the heat sink, and the other of the two waterway interfaces is used to receive the cooling liquid discharged from the heat sink.

[0030] In the vehicle-mounted power supply device provided in the present application, the water inlet interface and the water outlet interface are distributed in at least one of the groove wall or the groove bottom of the first accommodating groove, which facilitates the pipeline connection and later maintenance between the water inlet interface and the liquid inlet, and the pipeline connection and later maintenance between the water outlet interface and the liquid outlet, so that the maintenance work such as adding and replacing the cooling liquid can be performed without interrupting the operation of the circuit board.

[0031] In one embodiment, the electrical components of the vehicle power supply device further include at least one capacitor and at least one second magnetic component, and the housing further includes a second accommodating groove and a third accommodating groove, the first accommodating groove is arranged between the second accommodating groove and the third accommodating groove along the third direction, and the second accommodating groove and the third accommodating groove are used to accommodate the at least one capacitor and the at least one second magnetic component respectively, so as to make full use of the internal space of the housing, make the electrical components arranged more compact, and facilitate to reduce the occupied space of the vehicle power supply device, thereby improving the space utilization of the vehicle power supply device.

[0032] In one embodiment, the housing further includes a first baffle plate and a second baffle plate, the first baffle plate is used to separate the first accommodating groove and the second accommodating groove, and the second baffle plate is used to separate the first accommodating groove and the third accommodating groove. The first baffle plate includes a first bending portion facing the second accommodating groove along the third direction, and the second baffle plate includes a second bending portion facing the third accommodating groove along the third direction, and the first bending portion and the second bending portion are used to support the side of the circuit board facing the second accommodating groove and the third accommodating groove respectively, so as to support the circuit board, and facilitate to improve the operation reliability of the vehicle power supply device.

[0033] In one embodiment, the housing further includes a first side wall and a second side wall, the first side wall is arranged opposite to the first baffle plate along the third direction, and the second side wall is arranged opposite to the second baffle plate along the third direction. The first side wall includes a third bending portion facing the first baffle plate along the third direction, and the second side wall includes a fourth bending portion facing the second baffle plate along the third direction, and the third bending portion and the fourth bending portion are used to support the side of the circuit board facing the second accommodating groove and the third accommodating groove respectively, so as to support the circuit board, and facilitate to improve the operation reliability of the vehicle power supply device.

[0034] In one embodiment, the size of the circuit board along the third direction is greater than the size of the first accommodating groove along the third direction, and the side of the circuit board facing the second accommodating groove and the third accommodating groove is used to fix and electrically connect at least one of the capacitor or the second magnetic component.

[0035] Since the second accommodating groove and the third accommodating groove are located on both sides of the first accommodating groove along the third direction, by the size of the circuit board along the third direction being greater than the size of the first accommodating groove along the third direction, the part of the circuit board along the third direction extending out of the first accommodating groove is used to fix and electrically connect at least one of the capacitor and the second magnetic component, and at least one of the capacitor and the second magnetic component on this side is accommodated in the second accommodating groove. The part of the circuit board along the third direction extending out of the first accommodating groove is used to fix and electrically connect at least one of the capacitor and the second magnetic component, and at least one of the capacitor and the second magnetic component on this side is accommodated in the third accommodating groove, so as to make full use of the internal space of the housing, make the layout of the electrical components more compact, and facilitate to improve the space utilization of the vehicle power supply device.

[0036] In one embodiment, the electrical components of the on-board power supply device include two first magnetic devices, the size of the first accommodating groove along the third direction is greater than the size of the second accommodating groove along the third direction, and the size of the third accommodating groove along the third direction. Wherein, the two first magnetic devices are arranged adjacent to each other between the groove bottom of the first accommodating groove and the heat sink along the third direction, which is conducive to adapting the layout of the flow channel in the heat sink, improves the structural compactness of the electrical components while ensuring the heat dissipation efficiency, and is conducive to improving the space utilization of the on-board power supply device.

[0037] In a second aspect of the present application, a power assembly is provided. The power assembly includes a drive motor and the on-board power supply device described above, and the on-board power supply device includes a motor controller configured to control the drive motor.

[0038] In the power assembly provided in the present application, the motor controller is configured to control the drive motor to rotate, so as to drive the wheels of the electric vehicle to rotate, thereby enabling the electric vehicle to travel. In addition, the power assembly provided in the present application includes the on-board power supply device described above, so the power assembly provided in the present application solves the same technical problem as the on-board power supply device described above and has the same technical effect, which will not be described here.

[0039] In a third aspect of the present application, an electric vehicle is provided. The electric vehicle includes a power battery and the on-board power supply device described above. Wherein, the on-board power supply device includes an on-board charger configured to receive power supply from an external power source and charge the power battery or supply power to a load of the electric vehicle, or the on-board power supply device includes a motor controller configured to receive power supply from the power battery and control the drive motor to drive the wheels of the electric vehicle.

[0040] When the on-board power supply device includes the on-board charger, the on-board charger is configured to receive power supply from an external power source such as a power grid or a portable energy storage power source, so as to charge the power battery or supply power to a load. Wherein, the load includes an in-vehicle air conditioner, an on-board player, etc.

[0041] When the on-board power supply device includes the motor controller, the motor controller is configured to receive power supply from the power battery and control the drive motor to operate, so as to drive the wheels of the electric vehicle to rotate through the drive motor, thereby enabling the electric vehicle to travel.

[0042] In addition, the electric vehicle provided in the present application includes the on-board power supply device described above, so the electric vehicle provided in the present application solves the same technical problem as the on-board power supply device described above and has the same technical effect, which will not be described here. BRIEF DESCRIPTION OF DRAWINGS

[0043] Figure 1 A structural schematic diagram of an electric vehicle provided in an embodiment of the present application is shown in the figure;

[0044] Figure 2 A structural schematic diagram of a power assembly provided for an embodiment of the present application;

[0045] Figure 3 A structural schematic diagram of a vehicle-mounted power supply device provided for an embodiment of the present application;

[0046] Figure 4 A partial structural schematic diagram of a vehicle-mounted power supply device provided for an embodiment of the present application;

[0047] Figure 5 A partial exploded view of a vehicle-mounted power supply device; Figure 4

[0048] A partial exploded view of a vehicle-mounted power supply device; Figure 6A Figure 4 A structural schematic diagram of a vehicle-mounted power supply device with a circuit board removed;

[0049] Figure 6B Figure 6A A partial enlarged view of a Q position;

[0050] Figure 7 A partial structural schematic diagram of a vehicle-mounted power supply device provided for an embodiment of the present application;

[0051] Figure 8 A partial exploded view of a vehicle-mounted power supply device; Figure 7

[0052] A partial sectional view of a vehicle-mounted power supply device provided for an embodiment of the present application; Figure 9

[0053] A structural schematic diagram of a housing and a heat sink; Figure 10 Figure 9 A structural schematic diagram of a housing;

[0054] Figure 11 Figure 9 A structural schematic diagram of a housing;

[0055] Figure 12 A structural schematic diagram of an electrical component; Figure 9

[0056] A partial structural schematic diagram of a housing provided for an embodiment of the present application; Figure 13

[0057] A partial sectional view of another vehicle-mounted power supply device provided for an embodiment of the present application. Figure 14 Reference signs:

[0058]

[0059] ​​​​​1000 - electric vehicle; 100 - on-board power supply device; 101 - on-board charger; 102 - motor controller; 103 - vehicle controller; 200 - power assembly; 01 - drive motor; 02 - speed reducer; 300 - power battery; 400 - load; 500 - wheel; 600 - transmission mechanism;

[0060] 10 - electrical assembly; 20 - housing; 201 - first accommodating groove; 202 - second accommodating groove; 203 - third accommodating groove; 204 - fourth accommodating groove; 205 - waterway interface; 2051 - water inlet interface; 2052 - water outlet interface;

[0061] 1 - circuit board;

[0062] 2 - heat sink; 21 - first heat sink plate; 22 - second heat sink plate; 221 - liquid cooling groove; 222 - partition protrusion; 223 - liquid cooling flow channel; 2231 - first liquid cooling flow channel; 2232 - second liquid cooling flow channel; 23 - liquid cooling cavity; 24 - heat dissipation tooth; 25 - liquid inlet; 26 - liquid outlet;

[0063] 3 - power device; 31 - first row of power devices; 32 - second row of power devices; 4 - first magnetic device; 5 - second magnetic device; 6 - capacitor;

[0064] 71 - first baffle; 711 - first bending part; 72 - second baffle; 721 - second bending part; 73 - support;

[0065] 81 - first side wall; 811 - third bending part; 82 - second side wall; 821 - fourth bending part. DETAILED DESCRIPTION

[0066] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application.

[0067] In the drawings of the embodiments of the present application, the entity structures of components, assemblies, etc. are represented by guide lines; the hollow structures of openings, holes, spaces, cavities, etc. are represented by guide lines with arrows.

[0068] In the on-board power supply device, multiple electronic devices such as power devices and magnetic devices are usually cooled by the way of single-sided pasting of water-cooled plates. This cooling method makes the arrangement of multiple electronic devices such as power devices and magnetic devices dispersed, thereby resulting in a larger occupied space of the electrical assembly, and further resulting in a reduced space utilization of the on-board power supply device.

[0069] Based on this, the embodiment of the present application provides a vehicle-mounted power supply device, a power assembly and an electric vehicle. The power device and the magnetic device are connected by the double-sided heat conduction of the radiator. The power device and the magnetic device are cooled by the radiator, and the power device and the magnetic device are arranged more compactly, thereby reducing the occupied space of the electrical assembly, and further improving the space utilization of the vehicle-mounted power supply device.

[0070] The embodiment of the present application provides an electric vehicle. The electric vehicle is a wheeled device driven or towed by a power device. In some embodiments, the electric vehicle includes a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), a range-extended electric vehicle (REEV) or a plug-in hybrid electric vehicle (PHEV).

[0071] Figure 1 The embodiment of the present application provides a structural schematic diagram of an electric vehicle. Referring to Figure 1 , the electric vehicle 1000 includes a power assembly 200, a power battery 300 and a wheel 500. The power battery 300 is used to supply power to the power assembly 200. The power assembly 200 is used to convert the electric energy provided by the power battery 300 into mechanical energy, and is used to drive the wheel 500 to rotate, thereby making the electric vehicle 1000 travel.

[0072] Referring to Figure 1 , the electric vehicle 1000 includes a vehicle-mounted power supply device 100, and the vehicle-mounted power supply device 100 is electrically connected with the power battery 300.

[0073] In the embodiment of the present application, the vehicle-mounted power supply device 100 includes at least one of an on-board charger (OBC) 101 or a motor control unit (MCU) 102.

[0074] In some embodiments, referring to Figure 1 , the vehicle-mounted power supply device 100 includes the on-board charger 101. The on-board charger 101 is used to receive the power supply of an external power supply and charge the power battery 300 or supply power to the load 400 of the electric vehicle 1000.

[0075] The external power source can be in various forms. In some embodiments, the external power source comprises a power grid. In some embodiments, the external power source comprises a portable energy storage power source. The on-board charger 101 receives alternating current from the external power source such as the power grid or the portable energy storage power source, and converts the alternating current into direct current, which is provided to the power battery 300 or the load 400 to charge the power battery 300 or power the load 400. The load 400 includes electrical devices such as air conditioners and on-board players.

[0076] In some embodiments, referring to Figure 1 , the on-board power supply device 100 comprises a motor controller 102, which is configured to receive power from the power battery 300 and control the driving motor 01 of the power assembly 200 to drive the wheels 500 of the electric vehicle 1000 to move the electric vehicle 1000.

[0077] In some embodiments, the motor controller 102 is configured to receive direct current from the power battery 300 and convert the direct current into alternating current, which is provided to the driving motor 01 to drive the wheels 500 to move the electric vehicle 1000.

[0078] Figure 2 A structural schematic diagram of a power assembly is provided in an embodiment of the present application. Referring to Figure 2 , the structure shown in the dashed box is a power assembly 200, which comprises a driving motor 01 and an on-board power supply device 100. The on-board power supply device 100 comprises a motor controller 102, which is configured to control the driving motor 01.

[0079] Referring to Figure 2 , the power assembly 200 further comprises a speed reducer 02, and the driving motor 01 is in transmission connection with the speed reducer 02. The motor controller 102 is configured to receive direct current from the power battery 300 in Figure 1 and convert the direct current into alternating current, which is provided to the driving motor 01. The driving motor 01 is configured to receive the alternating current converted by the motor controller 102 and convert the alternating current into rotational mechanical energy, and output torque to the speed reducer 02. The speed reducer 02 comprises a gear set, which is not shown in the drawings of the present application. The speed reducer 02 reduces the rotational speed and increases the torque through the gear set, and transmits power to the transmission mechanism 600, and then to the wheels 500, to drive the wheels 500 to rotate.

[0080] The transmission mechanism 600 can have various forms. In some embodiments, the transmission mechanism 600 includes a gear set, and the power of the reducer 02 is transmitted to the wheel 500 through the gear set of the transmission mechanism 600. In some embodiments, the transmission mechanism 600 includes a transmission shaft, and the power of the reducer 02 is transmitted to the wheel 500 through the transmission shaft. A person skilled in the art can selectively design the structure of the transmission mechanism 600 according to actual needs.

[0081] Figure 3 A structural schematic diagram of a vehicle-mounted power supply device is provided for embodiments of the present application. Referring to Figure 3 , the vehicle-mounted power supply device 100 includes a housing 20, a motor controller 102, and a vehicle-mounted charger 101, and the motor controller 102 and the vehicle-mounted charger 101 are accommodated in the housing 20. By integrating the motor controller 102 and the vehicle-mounted charger 101 in the same housing 20, the miniaturization of the vehicle-mounted power supply device 100 is facilitated, thereby facilitating the overall vehicle layout.

[0082] Referring to Figure 3 , the vehicle-mounted power supply device 100 further includes an electrical assembly 10, and the electrical assembly 10 is accommodated in the housing 20. The electrical assembly 10 is used to be responsible for the functions of safe connection, power distribution, protection, and monitoring of components such as the motor controller 102 and the vehicle-mounted charger 101, to ensure the safe and cooperative operation of the vehicle-mounted power supply device 100.

[0083] In other embodiments of the present application, the vehicle-mounted power supply device 100 further includes components such as a vehicle control unit (VCU) 103 or a DC-DC converter to form a multi-in-one power supply device. Among them, the vehicle control unit 103 is responsible for the functions of normal driving, braking energy feedback, vehicle driving system and energy pipeline of the power battery 300, network pipeline, fault diagnosis and processing, vehicle state monitoring, etc. of the vehicle. The DC-DC converter is used to convert high-voltage direct current into low-voltage direct current to supply power to low-voltage loads. Among them, the low-voltage loads include components such as vehicle lights and instrument panels. A person skilled in the art can selectively design the constituent components of the vehicle-mounted power supply device according to actual needs.

[0084] Figure 4 A partial structural schematic diagram of a vehicle-mounted power supply device is provided for embodiments of the present application. Figure 5 A partial exploded view of the vehicle-mounted power supply device is provided in Figure 4 . Referring to Figure 4 and Figure 5 , the electrical assembly 10 includes one circuit board 1, a plurality of power devices 3, and one or more first magnetic devices 4.

[0085] The first magnetic device 4 is an electronic device that uses the magnetic properties of a material to achieve a specific function. The first magnetic device 4 can have various forms. In some embodiments, the first magnetic device 4 includes a power factor correction inductor (PFC inductor), a direct current-direct current converter inductor (DC-DC inductor), and an inductor-inductor-capacitor resonant transformer (LLC transformer). The PFC inductor is a magnetic component used to achieve efficient power conversion, suppress harmonic pollution, and improve power factor. The PFC inductor is shown in Fig. 1a. The DC-DC inductor is a magnetic component used to achieve voltage conversion, energy transfer, and noise suppression. The DC-DC inductor is shown in Fig. 1b. The LLC transformer is a magnetic energy conversion device used to achieve efficient isolated DC-DC conversion. The LLC transformer is shown in Fig. 1c. Figure 5 Figure 5 Figure 5

[0086] During the operation of the vehicle power supply device 100, the circuit board 1, the plurality of power devices 3, and the one or more first magnetic devices 4 of the electrical assembly 10 generate a large amount of heat. In order to dissipate the heat from these electronic devices and ensure the normal operation of the vehicle power supply device 100, the existing vehicle power supply device 100 uses a single-sided water-cooled board to dissipate heat from the plurality of power devices 3 and the one or more first magnetic devices 4. This heat dissipation method causes the plurality of power devices 3 and the one or more first magnetic devices 4 to be arranged in a dispersed manner, resulting in a larger occupied space of the electrical assembly 10, and further reducing the space utilization of the vehicle power supply device 100.

[0087] In the vehicle power supply device 100 provided in the present application, reference is made to Figs. 1a-1c and Figs. 2a-2c. Figure 4 Figure 5 ​​​​The electrical component 10 also includes a heat sink 2. A circuit board 1 and a heat sink 2 are arranged adjacent to each other along a first direction in the housing 20 of the vehicle power supply device 100, and one or more first magnetic devices 4 are arranged on the side of a heat sink 2 opposite to the circuit board 1. A plurality of power devices 3 include two rows of power devices 3, with one side of the circuit board 1 facing the heat sink 2 for fixing the two rows of power devices 3. Each row of power devices 3 includes at least three power devices 3, and at least three power devices 3 in each row are spaced apart along a second direction. The two rows of power devices 3 are spaced apart along a third direction. One side of the heat sink 2 facing the circuit board 1 is used for thermally conductive connection of the two rows of power devices 3, and the other side of the heat sink 2 opposite to the circuit board 1 is used for thermally conductive connection of one or more first magnetic devices 4.

[0088] Two rows of power devices 3 are thermally connected to a heat sink 2 on the side facing a circuit board 1. The heat generated by the two rows of power devices 3 is transferred to the heat sink 2 to reduce the temperature rise of the two rows of power devices 3, thereby achieving the purpose of cooling the two rows of power devices 3. One or more first magnetic devices 4 are thermally connected to a heat sink 2 on the side away from a circuit board 1. The heat generated by the one or more first magnetic devices 4 is transferred to the heat sink 2 to reduce the temperature rise of the one or more first magnetic devices 4, thereby achieving the purpose of cooling the one or more first magnetic devices 4.

[0089] By sharing a single heat sink 2 with two rows of power devices 3 and one or more first magnetic devices 4, the two rows of power devices 3 and one or more first magnetic devices 4 can be cooled by a single heat sink 2, allowing for a more compact arrangement of the two rows of power devices 3 and one or more first magnetic devices 4. This reduces the space occupied by the electrical components 10 and improves the space utilization of the vehicle power supply device 100. Furthermore, compared to the existing method of using a single-sided water-cooled plate to cool multiple electronic devices, this application uses a single heat sink 2 to cool multiple electronic devices on both sides, reducing both the size of the space and the cost.

[0090] In the embodiments of this application, the first direction is as follows: Figure 4 As shown in direction A, the second direction is as follows Figure 4 As shown in the B direction, the third direction is as follows Figure 4 As shown in the C-direction. The first direction, the second direction, and the third direction are perpendicular to each other. The perpendicularity defined in this application embodiment includes perpendicular intersection. The included angle of perpendicular intersection is 90 degrees. Meanwhile, the perpendicularity defined in this application embodiment also allows for small-angle errors due to factors such as assembly tolerances, design tolerances, and structural flatness. In some embodiments, the error range is 80 degrees to 100 degrees.

[0091] In some embodiments, the first direction is the thickness direction of the circuit board 1, the second direction is the width direction of the circuit board 1, and the third direction is the length direction of the circuit board 1.

[0092] There are multiple ways for the heat conduction connection between the heat sink 2 and the two rows of power devices 3, and the heat conduction connection between the heat sink 2 and the one or more first magnetic devices 4. Taking the heat conduction connection between the heat sink 2 and the two rows of power devices 3 as an example, in some embodiments, the heat sink 2 is connected to the two rows of power devices 3 through a heat conduction interface material, which includes heat conduction gel, heat conduction silicone grease, heat conduction glue, heat conduction pad, and other heat conduction materials, to fill the gap between the contact surface of the heat sink 2 and the two rows of power devices 3, increase the contact area of the heat sink 2 and the two rows of power devices 3, reduce the contact thermal resistance, and ensure that the heat of the two rows of power devices 3 is efficiently transferred to the heat sink 2, which is conducive to improving the heat dissipation efficiency of the two rows of power devices 3. In some embodiments, the heat sink 2 is connected to the two rows of power devices 3 through mechanical pressure connection. The mechanical pressure connection includes screw fastening, buckle fixing, and other ways, which makes the two rows of power devices 3 and the heat sink 2 tightly contact through external pressure, so as to increase the contact area of the heat sink 2 and the two rows of power devices 3, and is conducive to improving the heat dissipation efficiency of the two rows of power devices 3.

[0093] The principle of the heat conduction connection between the heat sink 2 and the one or more first magnetic devices 4 is the same as that of the heat conduction connection between the heat sink 2 and the two rows of power devices 3, which will not be repeated here.

[0094] In other embodiments of the present application, referring to Figure 5 , the side of the heat sink 2 facing the circuit board 1 includes a plurality of support pieces 73, each of which is from the heat sink 2 to the circuit board 1, and the support piece 73 is used to support the circuit board 1. In some embodiments, the support piece 73 is made of heat-conducting material, and the side of the support piece 73 facing the circuit board 1 is in heat-conducting connection with the circuit board 1 or other devices on the circuit board 1. The heat generated by the circuit board 1 or other devices on the circuit board 1 is transferred to the heat sink 2 through the support piece 73, so as to achieve the purpose of cooling the circuit board 1 and other devices on the circuit board 1.

[0095] Figure 6A For Figure 4 , the structure diagram of the circuit board is removed from the vehicle power supply device. Figure 6B For Figure 6A , the local enlarged view of the Q position. Referring to Figure 6A and Figure 6B , the interval between the two rows of power devices 3 along the third direction is greater than the interval between the two adjacent power devices 3 in each row of power devices 3 along the second direction, so that the heat dissipation path between the two rows of power devices 3 is separated, the thermal interference between the two rows of power devices 3 is reduced, and the heat dissipation efficiency of the power device 3 is improved.

[0096] In Figure 6Aand Figure 6B In the embodiment shown, the spacing between the first row of power devices 31 and the second row of power devices 32 along the third direction is d1, the spacing between two adjacent power devices 3 in the first row of power devices 31 along the second direction is d2, the spacing between two adjacent power devices 3 in the second row of power devices 32 along the second direction is d3, d1 is greater than d2, and d1 is greater than d3.

[0097] In some embodiments, referring to Figure 6A and Figure 6B , the spacing between two adjacent power devices 3 in each row of power devices 3 along the second direction is the same, so that the heat dissipation paths between two adjacent power devices 3 in each row of power devices 3 are the same, which is conducive to the uniform diffusion of heat onto the heat sink 2 and improves the heat dissipation efficiency of the power devices 3. In some embodiments, d2 is equal to d3 to further improve the uniformity of heat diffusion and thus further improve the heat dissipation efficiency of the power devices 3.

[0098] In some embodiments, referring to Figure 6A and Figure 6B , the size of the heat sink 2 along the third direction is greater than the spacing between the two rows of power devices 3 along the third direction, which is conducive to the heat conduction connection between each power device in the two rows of power devices 3 and the heat sink 2 and ensures the heat dissipation effect of the power devices 3.

[0099] In the embodiment shown in Figure 6A and Figure 6B , the size of the heat sink 2 along the third direction is d4, and d4 is greater than d1.

[0100] In some embodiments, referring to Figure 4 and Figure 6B , the size of the heat sink 2 along the third direction is less than the size of the circuit board 1 along the third direction, which on the one hand is conducive to the heat of the power devices 3 being transferred to the heat sink 2 along the shortest path and preventing the heat from being diffused along the third direction to the circuit board 1 or other components of the circuit board 1, thereby improving the heat dissipation efficiency of the power devices 3, and on the other hand is used to release the area of the edge of the circuit board 1 in the third direction for arranging capacitors, connectors and other devices, which is conducive to making the device layout of the electrical assembly 10 more compact and thus improving the space utilization of the vehicle-mounted power supply device 100. In addition, it is also conducive to reducing the cost and weight of the vehicle-mounted power supply device 100.

[0101] In the embodiment shown in Figure 4 and Figure 6B , the size of the circuit board 1 along the third direction is D, and d4 is less than D.

[0102] Figure 7 A partial structure schematic view of a vehicle-mounted power supply device according to an embodiment of the present application. Figure 8For Figure 7 A partial exploded view of the vehicle-mounted power supply device. Referring to Figure 7 and Figure 8 , the heat sink 2 includes a first heat sink plate 21 and a second heat sink plate 22, the first heat sink plate 21 and the second heat sink plate 22 are arranged adjacent to each other along a first direction, and the first heat sink plate 21 and the second heat sink plate 22 are used to form a liquid cooling cavity 23 by surrounding. The liquid cooling cavity 23 is used to accommodate cooling liquid.

[0103] The cooling liquid in the liquid cooling cavity 23 is in contact with the first heat sink plate 21 and exchanges heat with the first heat sink plate 21 to take away Figure 5 the heat transferred by the power device 3 to the first heat sink plate 21, so that a temperature gradient is formed between the first heat sink plate 21 and the power device 3, and in turn the heat of the power device 3 is continuously transferred to the first heat sink plate 21.

[0104] The cooling liquid in the liquid cooling cavity 23 is in contact with the second heat sink plate 22 and exchanges heat with the second heat sink plate 22 to take away Figure 5 the heat transferred by the first magnetic device 4 to the second heat sink plate 22, so that a temperature gradient is formed between the second heat sink plate 22 and the first magnetic device 4, and in turn the heat of the first magnetic device 4 is continuously transferred to the second heat sink plate 22.

[0105] In some embodiments, referring to Figure 7 and Figure 8 , the side of the first heat sink plate 21 away from the circuit board 1 is used to fix a plurality of heat dissipation fins 24, and the side of the second heat sink plate 22 facing the circuit board 1 includes a liquid cooling groove 221, and the liquid cooling groove 221 is used to accommodate the plurality of heat dissipation fins 24.

[0106] The plurality of heat dissipation fins 24 on the side of the first heat sink plate 21 away from the circuit board 1 increases the contact area of the inner wall surface of the first heat sink plate 21 and the cooling liquid in the liquid cooling groove 221, increases the heat exchange area of the first heat sink plate 21 and the cooling liquid, thereby facilitating efficient heat dissipation. And the plurality of heat dissipation fins 24 also facilitate the formation of turbulent flow and enhance convective heat transfer.

[0107] In some embodiments, referring to Figure 7 and Figure 8The heat sink 2 comprises an inlet 25 and an outlet 26, the second heat sink plate 22 comprises a partition protrusion 222, the partition protrusion 222 is arranged along the first direction and faces the circuit board 1, the partition protrusion 222 is used to partition the liquid cooling groove 221 to form two liquid cooling flow channels 223, the inlet 25 is used to communicate one of the two liquid cooling flow channels 223, and the outlet 26 is used to communicate the other of the two liquid cooling flow channels 223. By partitioning the liquid cooling groove 221 to form two liquid cooling flow channels 223, on the one hand, the directional flow of the cooling liquid is realized, the flow path of the cooling liquid is increased, and the cooling liquid is prevented from directly flowing from the inlet 25 to the outlet 26, and on the other hand, it is beneficial to adapt to the layout of the two rows of power devices 3 to cool the two rows of power devices 3 respectively, thereby improving the heat dissipation efficiency of the power devices 3.

[0108] In Figure 7 and Figure 8 the embodiment shown, the two liquid cooling flow channels 223 comprise a first liquid cooling flow channel 2231 and a second liquid cooling flow channel 2232, the first liquid cooling flow channel 2231 and the second liquid cooling flow channel 2232 are in communication, the inlet 25 is used to communicate the first liquid cooling flow channel 2231, and the outlet 26 is used to communicate the second liquid cooling flow channel 2232.

[0109] The cooling liquid flows into the first liquid cooling flow channel 2231 from the inlet 25, flows into the second liquid cooling flow channel 2232 along the first liquid cooling flow channel 2231, and flows out of the heat sink 2 from the outlet 26 along the second liquid cooling flow channel 2232. During the flow of the cooling liquid along the first liquid cooling flow channel 2231, the cooling liquid is used to cool the row of power devices 3 corresponding to the first liquid cooling flow channel 2231. During the flow of the cooling liquid along the second liquid cooling flow channel 2232, the cooling liquid is used to cool the row of power devices 3 corresponding to the second liquid cooling flow channel 2232.

[0110] In some embodiments, referring to Figure 8 , the size of the heat sink 2 along the third direction is smaller than the size of the heat sink 2 along the second direction. The size of the heat sink 2 along the third direction is the size of the heat sink 2 along the C direction, and the size of the heat sink 2 along the second direction is the size of the heat sink 2 along the B direction.

[0111] Referring to Figure 6A and Figure 8 , since the first row of power devices 31 and the second row of power devices 32 are arranged in the third direction, and at least three power devices 3 in each row of power devices 3 are arranged in the second direction, by the size of the heat sink 2 along the B direction being greater than the size of the heat sink 2 along the C direction, it is beneficial to make the size of the liquid cooling flow channel 223 in the B direction greater than the size of the liquid cooling flow channel in the C direction, not only increasing the heat exchange area and heat exchange time of the cooling liquid and the power devices 3, but also being beneficial to balance the temperature difference of the cooling liquid, thereby being beneficial to improve the overall heat dissipation efficiency of the heat sink 2.

[0112] In addition, the size of the heat sink 2 along the C direction is small, which is also conducive to arranging the capacitor 6, the connector and other devices, so that the device layout of the electrical assembly 10 is more compact, thereby improving the space utilization of the vehicle-mounted power supply device.

[0113] In some embodiments, referring to Figure 8 , the size of the partition protrusion 222 along the second direction is smaller than the size of each liquid cooling flow channel 223 along the second direction, so as to ensure the communication of the two liquid cooling flow channels 223.

[0114] The size of the partition protrusion 222 along the second direction is the size of the partition protrusion 222 along the B direction, and is also the length dimension of the partition protrusion 222. The size of the liquid cooling flow channel 223 along the second direction is the slot inner dimension of the liquid cooling flow channel 223 along the B direction, and is also the length dimension of the liquid cooling flow channel 223.

[0115] In some embodiments, referring to Figure 8 , the size of the partition protrusion 222 along the third direction is smaller than the interval of the two adjacent rows of power devices 3 along the third direction, which is conducive to increasing the cross-sectional area of the liquid cooling flow channel 223 on the one hand, so as to allow more cooling liquid to pass through the liquid cooling flow channel 223, and improve the heat exchange efficiency on the other hand, and is conducive to reducing the weight of the vehicle-mounted power supply device and reducing the cost of the vehicle-mounted power supply device.

[0116] The size of the partition protrusion 222 along the third direction is the size of the partition protrusion 222 along the C direction, and is also the width dimension of the partition protrusion 222.

[0117] In some embodiments, referring to Figure 6A and Figure 8 , the size of each liquid cooling flow channel 223 along the second direction is greater than the size of each row of power devices 3 along the second direction, and the size of each liquid cooling flow channel 223 along the third direction is greater than the size of the power device 3 along the third direction, which is conducive to making each liquid cooling flow channel 223 completely cover the projection area of a row of power devices 3 in the first direction, and preventing the occurrence of heat dissipation blind area.

[0118] The size of the liquid cooling flow channel 223 along the second direction is the slot inner dimension of the liquid cooling flow channel 223 along the B direction, and is also the length dimension of the liquid cooling flow channel 223. The size of the liquid cooling flow channel 223 along the third direction is the slot inner dimension of the liquid cooling flow channel 223 along the C direction, and is also the width dimension of the liquid cooling flow channel 223.

[0119] In some embodiments, referring to Figure 8 , the liquid inlet 25 and the liquid outlet 26 are distributed on the groove bottom of the liquid cooling groove 221.

[0120] As the size of the circuit board 1 along the C direction is greater than the size of the heat sink 2 along the C direction, by distributing the liquid inlet 25 and the liquid outlet 26 on the groove bottom of the liquid cooling groove 221, the pipeline connection and the later maintenance of the liquid inlet 25 and the liquid outlet 26 are facilitated, so that the maintenance work such as adding and replacing the cooling liquid can be carried out without interrupting the operation of the circuit board 1.

[0121] In some embodiments, referring to Figure 8 , the liquid inlet 25 and the liquid outlet 26 are arranged on both sides of the partition protrusion 222 along the third direction, so as to prolong the flow path of the cooling liquid and prevent the cooling liquid entering from the liquid inlet 25 from directly flowing out of the heat sink 2 from the liquid outlet 26, thereby improving the heat exchange efficiency of the heat sink 2.

[0122] In some embodiments, referring to Figure 8 , the size of the liquid inlet 25 along the third direction and the size of the liquid outlet 26 along the third direction are both smaller than the size of each liquid cooling flow channel 223 along the third direction, which is beneficial to improve the local flow rate of the liquid inlet 25 and the liquid outlet 26, increase the degree of turbulence, strengthen convective heat transfer, thereby improve the heat exchange efficiency, and is also beneficial to accurately control the cooling liquid flow and reduce the risk of leakage.

[0123] In the embodiments of the present application, the heat dissipation teeth 24 have various forms. In some embodiments, the heat dissipation teeth 24 are straight teeth, and in some embodiments, the heat dissipation teeth 24 are spiral teeth, which are beneficial to form turbulence, strengthen convective heat dissipation, and improve the heat dissipation efficiency. In some embodiments, the heat dissipation teeth 24 are corrugated teeth, and a person skilled in the art can selectively design the form of the heat dissipation teeth 24 according to actual needs.

[0124] Figure 9 A partial cross-sectional view of a vehicle-mounted power supply device provided in the embodiments of the present application. Figure 10 A partial cross-sectional view of a vehicle-mounted power supply device provided in the embodiments of the present application. Figure 9 A structural schematic view of a middle shell and a heat sink. Referring to Figure 9 and Figure 10 , the shell 20 comprises a first containing groove 201, and the first containing groove 201 is used for containing the heat sink 2 and one or more first magnetic devices 4. The one or more first magnetic devices 4 are arranged between the heat sink 2 and the groove bottom of the first containing groove 201, so that the heat sink 2 and the first magnetic devices 4 are distributed more compactly, thereby facilitating the reduction of the occupied space of the vehicle-mounted power supply device, and thereby improving the space occupancy rate of the vehicle-mounted power supply device.

[0125] In some embodiments, referring to Figure 9 and Figure 10 , the size of the heat sink 2 along the second direction is greater than the size of the heat sink 2 along the third direction.

[0126] Referring to Figure 6A , Figure 9 and Figure 10Since the first row of power devices 31 and the second row of power devices 32 are arranged along the C direction with intervals, and at least three power devices 3 in each row of power devices 3 are arranged along the B direction with intervals, the size of the heat sink 2 along the B direction is greater than the size of the heat sink 2 along the C direction, so as to match the layout of the first row of power devices 31 and the second row of power devices 32, increase the heat dissipation area, and thus facilitate to improve the heat dissipation efficiency of the power devices 3. Moreover, the invalid space occupation is reduced, the space utilization in the shell 20 is improved while realizing high-efficiency heat dissipation, and the space occupation rate of the vehicle-mounted power supply device is improved.

[0127] With reference to Figure 9 and Figure 10 , the size of the heat sink 2 along the second direction is greater than the size of the first containing groove 201 along the third direction, which facilitates to fully utilize the space of the first containing groove 201, so as to increase the flow path of the cooling liquid in the heat sink 2 and improve the heat exchange efficiency of the heat sink 2.

[0128] Figure 11 For Figure 9 , a structural schematic view of the shell is shown. With reference to Figure 11 , the size of the first containing groove 201 along the second direction is greater than the size of the first containing groove 201 along the third direction, so as to match the size of the heat sink 2, ensure the flow path of the cooling liquid along the long side of the heat sink 2, shorten the heat transfer path, improve the heat dissipation capacity of the heat sink 2, and also reduce the invalid space occupation, which facilitates to improve the space utilization of the shell 20.

[0129] In some embodiments, with reference to Figure 10 and Figure 11 , the shell 20 includes two waterway interfaces 205, which are distributed in at least one of the groove wall or the groove bottom of the first containing groove 201. One of the two waterway interfaces 205 is used to deliver the cooling liquid to the heat sink 2, and the other of the two waterway interfaces 205 is used to receive the cooling liquid discharged from the heat sink 2.

[0130] In Figure 10 and Figure 11 given embodiments, the two waterway interfaces 205 include a water inlet interface 2051 and a water outlet interface 2052. The water inlet interface 2051 is used to communicate with the liquid inlet 25 in Figure 8 , so as to deliver the cooling liquid to the first liquid cooling channel 2231 of the heat sink 2. The water outlet interface 2052 is used to communicate with the liquid outlet 26 in Figure 8The liquid outlet 26 in the first containing groove 201 is communicated with the liquid outlet 26 in the second containing groove 202 and the liquid outlet 26 in the third containing groove 203, so as to receive the cooling liquid discharged by the heat sink 2. The water inlet interface 2051 and the water outlet interface 2052 are arranged on the groove bottom of the first containing groove 201, facilitating the pipeline connection and later maintenance between the water inlet interface 2051 and the liquid inlet 25 and the pipeline connection and later maintenance between the water outlet interface 2052 and the liquid outlet 26, so that the maintenance work such as adding and replacing the cooling liquid can be carried out without interrupting the operation of the circuit board 1.

[0131] In some embodiments, the water inlet interface 2051 and the water outlet interface 2052 are arranged on the groove wall of the first containing groove 201. The advantages of arranging the water inlet interface 2051 and the water outlet interface 2052 on the groove wall of the first containing groove 201 are the same as those of arranging the water inlet interface 2051 and the water outlet interface 2052 on the groove bottom of the first containing groove 201, which will not be repeated here.

[0132] In the above embodiments of the present application, the plurality of power devices 3 includes two rows of power devices 3, and each row of power devices 3 corresponds to one liquid cooling flow channel 223. In other embodiments of the present application, the plurality of power devices 3 includes three or more rows of power devices, and the number and arrangement of power devices in each row of power devices are the same as those of one row of power devices in the above embodiments of the present application, and each row of power devices corresponds to one liquid cooling flow channel 223. Those skilled in the art can selectively design the arrangement of power devices according to actual needs. Figure 6A In the above embodiments of the present application, the plurality of power devices 3 includes two rows of power devices 3, and each row of power devices 3 corresponds to one liquid cooling flow channel 223. In other embodiments of the present application, the plurality of power devices 3 includes three or more rows of power devices, and the number and arrangement of power devices in each row of power devices are the same as those of one row of power devices in the above embodiments of the present application, and each row of power devices corresponds to one liquid cooling flow channel 223. Those skilled in the art can selectively design the arrangement of power devices according to actual needs.

[0133] Referring to Figure 11 , the shell 20 further includes a second containing groove 202 and a third containing groove 203, and the first containing groove 201 is arranged between the second containing groove 202 and the third containing groove 203 along the third direction. The shell 20 includes a first baffle 71, a second baffle 72, a first side wall 81 and a second side wall 82, the first baffle 71 is used to separate the first containing groove 201 and the second containing groove 202, the second baffle is used to separate the first containing groove 201 and the third containing groove 203, the first side wall 81 is arranged opposite to the first baffle 71 along the third direction, and the second side wall 82 is arranged opposite to the second baffle 72 along the third direction.

[0134] Figure 12 For Figure 9 , the structural schematic diagram of the electrical assembly, referring to Figure 9 and Figure 12 , the electrical assembly 10 includes two first magnetic devices 4, referring to Figure 9 and Figure 12 , the two first magnetic devices 4 are arranged as Figure 9Q1 and Q2, the first magnetic device 4 shown by Q1 and the first magnetic device 4 shown by Q2 are adjacently arranged between the groove bottom of the first accommodating groove 201 and the heat sink 2 along the C direction to adapt to the layout of the two liquid cooling channels 223, so as to improve the heat dissipation efficiency of the first magnetic device 4 and the space utilization of the electrical assembly 10.

[0135] In some embodiments, referring to Figure 9 and Figure 12 , the size of the first accommodating groove 201 along the third direction is greater than the size of the second accommodating groove 202 along the third direction, which ensures the heat dissipation efficiency while improving the structural compactness of the electrical assembly 10, and is conducive to improving the space utilization of the vehicle-mounted power supply device.

[0136] In some embodiments, referring to Figure 9 and Figure 12 , the size of the first accommodating groove 201 along the third direction is greater than the size of the third accommodating groove 203 along the third direction, which ensures the heat dissipation efficiency while improving the structural compactness of the electrical assembly 10, and is conducive to improving the space utilization of the vehicle-mounted power supply device.

[0137] In order to improve the heat dissipation efficiency of the first magnetic device 4 in the first accommodating groove 201, in some embodiments, the first magnetic device 4 in the first accommodating groove 201 is in thermal conductive connection with the groove bottom of the first accommodating groove 201 to increase the heat dissipation area of the first magnetic device 4 and improve the heat dissipation efficiency. In some embodiments, the first magnetic device 4 in the first accommodating groove 201 is in thermal conductive connection with the first baffle 71 to increase the heat dissipation area of the first magnetic device 4 and improve the heat dissipation efficiency. In some embodiments, the first magnetic device 4 in the first accommodating groove 201 is in thermal conductive connection with the second baffle 72 to increase the heat dissipation area of the first magnetic device 4 and improve the heat dissipation efficiency. Those skilled in the art can selectively design according to actual needs.

[0138] In some embodiments, referring to Figure 9 and Figure 12 , the electrical assembly 10 further comprises at least one capacitor 6 and at least one second magnetic device 5, and the second accommodating groove 202 and the third accommodating groove 203 are respectively used to accommodate the at least one capacitor 6 and the at least one second magnetic device 5, so as to make full use of the internal space of the shell 20, so that the electrical assembly 10 is arranged more compactly, which is conducive to reducing the occupied space of the vehicle-mounted power supply device, thereby improving the space utilization of the vehicle-mounted power supply device.

[0139] In some embodiments, referring to Figure 9 and Figure 11 , the size of the circuit board 1 along the third direction is greater than the size of the first accommodating groove 201 along the third direction, and the side of the circuit board 1 facing the second accommodating groove 202 and the third accommodating groove 203 is used to fix and electrically connect at least one of the capacitor 6 or the second magnetic device 5.

[0140] Since the second accommodating groove 202 and the third accommodating groove 203 are located on both sides of the first accommodating groove 201 in the third direction, the size of the circuit board 1 along the third direction is greater than the size of the first accommodating groove 201 along the third direction, the part of the circuit board 1 extending out of the first accommodating groove 201 on the left side in the third direction is fixed and electrically connected with the at least one capacitor 6 and the at least one second magnetic device 5, and the at least one capacitor 6 and the at least one second magnetic device 5 on the left side in the third direction are accommodated in the second accommodating groove 202. Figure 9 The part of the circuit board 1 extending out of the first accommodating groove 201 on the right side in the third direction is fixed and electrically connected with the at least one capacitor 6 and the at least one second magnetic device 5, and the at least one capacitor 6 and the at least one second magnetic device 5 on the right side in the third direction are accommodated in the third accommodating groove 203. Figure 9 Figure 9 Figure 9

[0141] In the installation, the capacitor 6 and the second magnetic device 5 are fixed and electrically connected to the circuit board 1 first, and then the capacitor 6 and the second magnetic device 5 are embedded in the corresponding accommodating groove, which is convenient and fast.

[0142] In the embodiments given in the present application, the second magnetic device 5 is an electronic device that uses the magnetism of a material to achieve a specific function. In some embodiments, the second magnetic device 5 includes a high-voltage DC bus choke inductance (High Voltage DC-Link Choke, HV inductance), which is a filter and energy storage element on the high-voltage DC bus, used to suppress high-frequency noise, smooth current ripple, and improve system stability.

[0143] Referring to Figure 9 and Figure 12 Since the first accommodating groove 201 accommodates the heat sink 2, the first accommodating groove 201 and the second accommodating groove 202 are separated by the first baffle 71, and the first accommodating groove 201 and the third accommodating groove 203 are separated by the second baffle 72, therefore, the at least one capacitor 6 and the at least one second magnetic device 5 in the second accommodating groove 202 are arranged close to the heat sink 2, and the at least one capacitor 6 and the at least one second magnetic device 5 in the third accommodating groove 203 are also arranged close to the heat sink 2.

[0144] In some embodiments, referring to Figure 9 and Figure 12 ​​​, the capacitor 6 or the second magnetic device 5 in the second accommodating groove 202 is in heat conduction connection with the first baffle 71, so that the heat of the capacitor 6 or the second magnetic device 5 in the second accommodating groove 202 is transmitted to the heat sink 2 through the first baffle 71, thereby realizing cooling of the capacitor 6 and the second magnetic device 5 in the second accommodating groove 202.

[0145] In order to improve the heat dissipation efficiency of the capacitor 6 or the second magnetic device 5 in the second accommodating groove 202, in some embodiments, the capacitor 6 or the second magnetic device 5 in the second accommodating groove 202 is in heat conduction connection with the first side wall 81, so as to increase the heat dissipation area and improve the heat dissipation efficiency. In some embodiments, the capacitor 6 or the second magnetic device 5 in the second accommodating groove 202 is in heat conduction connection with the groove bottom of the second accommodating groove 202, so as to increase the heat dissipation area and improve the heat dissipation efficiency.

[0146] In some embodiments, referring to Figure 9 and Figure 12 , the capacitor 6 or the second magnetic device 5 in the third accommodating groove 203 is in heat conduction connection with the second baffle 72, so that the heat of the capacitor 6 or the second magnetic device 5 in the third accommodating groove 203 is transmitted to the heat sink 2 through the second baffle 72, thereby realizing cooling of the capacitor 6 and the second magnetic device 5 in the third accommodating groove 203.

[0147] In order to improve the heat dissipation efficiency of the capacitor 6 or the second magnetic device 5 in the third accommodating groove 203, in some embodiments, the capacitor 6 or the second magnetic device 5 in the third accommodating groove 203 is in heat conduction connection with the second side wall 82, so as to increase the heat dissipation area and improve the heat dissipation efficiency. In some embodiments, the capacitor 6 or the second magnetic device 5 in the third accommodating groove 203 is in heat conduction connection with the groove bottom of the third accommodating groove 203, so as to increase the heat dissipation area and improve the heat dissipation efficiency.

[0148] In other embodiments of the present application, other components can also be included in the second accommodating groove 202 and the third accommodating groove 203. In some embodiments, the second accommodating groove 202 and the third accommodating groove 203 further include components such as connection rows, which can be selectively designed by those skilled in the art according to actual needs.

[0149] In some embodiments, referring to Figure 11 , the first baffle includes a first bending part 711 facing the second accommodating groove 202 in the third direction, and the second baffle includes a second bending part 721 facing the third accommodating groove 203 in the third direction. The first bending part 711 and the second bending part 721 are respectively used to support one side of the circuit board 1 facing the second accommodating groove 202 and the third accommodating groove 203. Through the support of the first bending part 711 and the second bending part 721 to the circuit board 1, the running reliability of the vehicle-mounted power supply device is improved.

[0150] In Figure 11In the embodiment shown, the first bent portion 711 is spaced apart from the side of the first baffle plate 71 facing the circuit board 1. To better support the circuit board 1, the first bent portion 711 has a support member 73 on the side facing the circuit board 1, and the side of the support member 73 facing away from the first bent portion 711 is flush with the side of the first baffle plate 71 facing the circuit board 1.

[0151] The number of first bent portions 711 can be various. In some embodiments, the first bent portion 711 includes one. In some embodiments, referring to Figure 11 , the first bent portion 711 includes two, and the two first bent portions 711 are respectively located on the two sides of the first baffle plate 71 in the second direction. In some embodiments, the first bent portion 711 includes three or more, and the three or more first bent portions 711 are spaced apart along the second direction. Those skilled in the art can selectively design the number of first bent portions 711 according to actual needs.

[0152] Similarly, in Figure 11 the embodiment shown, the second bent portion 721 is spaced apart from the side of the second baffle plate 72 facing the circuit board 1. To better support the circuit board 1, the second bent portion 721 has a support member 73 on the side facing the circuit board 1, and the side of the support member 73 facing away from the second bent portion 721 is flush with the side of the second baffle plate 72 facing the circuit board 1.

[0153] The number of second bent portions 721 can be various. In some embodiments, the second bent portion 721 includes one. In some embodiments, referring to Figure 11 , the second bent portion 721 includes two, and the two second bent portions 721 are respectively located on the two sides of the second baffle plate 72 in the second direction. In some embodiments, the second bent portion 721 includes three or more, and the three or more second bent portions 721 are spaced apart along the second direction. Those skilled in the art can selectively design the number of second bent portions 721 according to actual needs.

[0154] In some embodiments, the first bent portion 711 extends from the first baffle plate 71 in the second direction to be connected with the first side wall 81, so as to improve the support strength of the first bent portion 711 on the circuit board 1. The second bent portion 721 extends from the second baffle plate 72 in the second direction to be connected with the second side wall 82, so as to improve the support strength of the second bent portion 721 on the circuit board 1.

[0155] Figure 13 A partial structure schematic diagram of a shell is provided for the embodiments of the present application. Referring to Figure 9 and Figure 13The first bending part 711 is flush with the side of the first baffle plate 71 facing the circuit board 1, and the second bending part 721 is flush with the side of the second baffle plate 72 facing the circuit board 1, so as to directly support the circuit board 1 through the first bending part 711 and the second bending part 721, thereby improving the support strength of the second bending part 721 on the circuit board 1.

[0156] In some embodiments, referring to Figure 13 The first side wall 81 comprises a third bending part 811 facing the first baffle plate in the third direction, and the second side wall 82 comprises a fourth bending part 821 facing the second baffle plate in the third direction, and the third bending part 811 and the fourth bending part 821 are respectively used to support the side of the circuit board 1 facing the second accommodating groove 202 and the third accommodating groove 203, thereby further supporting the circuit board 1 through the third bending part 811 and the fourth bending part 821, and facilitating the improvement of the operation reliability of the vehicle power supply device.

[0157] In some embodiments, referring to Figure 13 The third bending part 811 is flush with the side of the first side wall 81 facing the circuit board 1, and the fourth bending part 821 is flush with the side of the second side wall 82 facing the circuit board 1, so as to directly support the circuit board 1 through the third bending part 811 and the fourth bending part 821, thereby improving the support strength of the third bending part 811 and the fourth bending part 821 on the circuit board 1.

[0158] The number of the third bending part 811 and the number of the fourth bending part 821 are respectively various. Taking the third bending part 811 as an example, in some embodiments, the third bending part 811 comprises one. In some embodiments, referring to Figure 13 The third bending part 811 comprises two, and the two third bending parts 811 are respectively located on both sides of the first side wall 81 in the second direction. In some embodiments, the third bending part 811 comprises three and more than three, and the three and more than three third bending parts 811 are arranged at intervals in the second direction. Those skilled in the art can selectively design the number of the third bending part 811 according to actual needs.

[0159] In other embodiments of the present application, the third bending part 811 has a spacing from the side of the first side wall 81 facing the circuit board 1. In order to better support the circuit board 1, the side of the third bending part 811 facing the circuit board 1 has a support piece 73, and the side of the support piece 73 away from the third bending part 811 is flush with the side of the first side wall 81 facing the circuit board 1. The fourth bending part 821 has a spacing from the side of the second side wall 82 facing the circuit board 1. In order to better support the circuit board 1, the side of the fourth bending part 821 facing the circuit board 1 has a support piece 73, and the side of the support piece 73 away from the fourth bending part 821 is flush with the side of the second side wall 82 facing the circuit board 1.

[0160] The third bending part 811 extends from the first side wall 81 to the first baffle 71 in the second direction to improve the support strength of the third bending part 811 to the circuit board 1. The fourth bending part 821 extends from the second side wall 82 to the second baffle 72 in the second direction to improve the support strength of the fourth bending part 821 to the circuit board 1.

[0161] Figure 14 Another partial sectional view of the vehicle-mounted power supply device provided by the embodiment of the present application is provided. Figure 9 In the vehicle-mounted power supply device provided by the embodiment of the present application, after the vehicle-mounted power supply device is installed, the circuit board 1 is located above the radiator 2, the first magnetic device 4 is located below the radiator 2, and the shell 20 supports the circuit board 1 and the first magnetic device 4. Figure 14 In the vehicle-mounted power supply device provided by the embodiment of the present application, after the vehicle-mounted power supply device is installed, the first magnetic device 4 is located above the radiator 2, the radiator 2 is located above the circuit board 1, the shell 20 fixes the circuit board 1 and the first magnetic device 4, and the radiator 2 supports the first magnetic device 4.

[0162] In addition, Figure 14 The other structures of the vehicle-mounted power supply device provided by the embodiment of the present application are the same as Figure 9 The structure of the vehicle-mounted power supply device provided by the embodiment of the present application is the same as the vehicle-mounted power supply device provided by the embodiment of the present application, and the present application will not be described here.

[0163] In the embodiment provided by the present application, the form of the radiator 2 is various, and in some embodiments, the radiator 2 is a profile brazed radiator. The profile brazed radiator has high heat dissipation efficiency, compact structure, light weight and low cost, which is beneficial to the miniaturization and light weight of the vehicle-mounted power supply device 100. The form of the radiator 2 can be selectively designed by the person skilled in the art according to the actual needs.

[0164] The vehicle-mounted power supply device 100 provided by the present application realizes double-sided cooling of the power device and the first magnetic device 4 through one radiator 2, fully utilizes the heat dissipation area of the radiator 2 and improves the space utilization of the vehicle-mounted power supply device 100, so as to realize the purpose of small size and low cost heat dissipation.

[0165] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any change or replacement within the technical scope disclosed by the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A power supply device for a vehicle, characterized by comprising: The vehicle-mounted power supply device comprises at least one of a motor controller for controlling a drive motor of an electric vehicle and a vehicle-mounted charger for charging a power battery of the electric vehicle or for supplying power to a load of the electric vehicle, and an electrical assembly of the vehicle-mounted power supply device comprises a circuit board, a heat sink and one or more first magnetic devices, wherein: The circuit board and the heat sink are arranged adjacent to each other in a first direction in a housing of the vehicle-mounted power supply device, and the one or more first magnetic devices are arranged on the other side of the heat sink away from the circuit board; A side of the circuit board facing the heat sink is used for fixing two rows of power devices, each row of the power devices comprises at least three power devices, and at least three power devices in each row of the power devices are arranged at intervals in a second direction, and the two rows of power devices are arranged at intervals in a third direction, and the first direction, the second direction and the third direction are perpendicular to each other; A side of the heat sink facing the circuit board is used for thermally connecting the two rows of power devices, and the other side of the heat sink away from the circuit board is used for thermally connecting the one or more first magnetic devices.

2. The on-board power supply device according to claim 1, characterized in that The interval between the two rows of power devices in the third direction is greater than the interval between two adjacent power devices in each row of the power devices in the second direction, and wherein: The size of the heat sink in the third direction is greater than the interval between the two rows of power devices in the third direction and less than the size of the circuit board in the third direction.

3. The on-board power supply device according to claim 1 or 2, characterized in that The heat sink comprises a first heat sink plate and a second heat sink plate, and the first heat sink plate and the second heat sink plate are used to surround and form a liquid cooling cavity, wherein: The first heat sink plate and the second heat sink plate are arranged adjacent to each other in the first direction, a side of the first heat sink plate away from the circuit board is used for fixing a plurality of heat dissipation teeth, and a side of the second heat sink plate facing the circuit board comprises a liquid cooling groove for accommodating the plurality of heat dissipation teeth.

4. The on-board power supply device according to claim 3, characterized in that The heat sink comprises an inlet and an outlet, the second heat sink plate comprises a separation protrusion facing the circuit board in the first direction, and the separation protrusion is used to separate the liquid cooling groove to form two liquid cooling flow channels, the inlet is used to communicate one of the two liquid cooling flow channels, and the outlet is used to communicate the other of the two liquid cooling flow channels.

5. The on-board power supply device according to claim 4, characterized in that The size of the heat sink in the third direction is less than the size of the heat sink in the second direction, and wherein: In the second direction, the size of the separation protrusion is less than the size of each liquid cooling flow channel, and the size of each liquid cooling flow channel is greater than the size of each row of power devices; In the third direction, the size of the separation protrusion is less than the interval between two adjacent rows of power devices, and the size of each liquid cooling flow channel is greater than the size of the power devices.

6. The on-board power supply device according to claim 4 or 5, characterized in that The inlet and the outlet are distributed on the groove bottom of the liquid cooling groove, and wherein: In the third direction, the liquid inlet and the liquid outlet are arranged on two sides of the partitioned protrusion respectively, and the size of the liquid inlet and the size of the liquid outlet are smaller than the size of each liquid cooling flow channel.

7. The on-board power supply device according to any one of claims 1 to 6, characterized in that, The shell comprises a first accommodating groove for accommodating the heat sink and the one or more first magnetic devices, the one or more first magnetic devices being arranged between the heat sink and the groove bottom of the first accommodating groove, wherein: The size of the first accommodating groove in the second direction is greater than the size of the first accommodating groove in the third direction, and the size of the heat sink in the second direction is greater than the size of the heat sink in the third direction and the size of the first accommodating groove in the third direction.

8. The on-board power supply device according to claim 7, characterized in that The shell comprises two water channel interfaces distributed in at least one of the groove wall or the groove bottom of the first accommodating groove, one of the two water channel interfaces being used to deliver cooling liquid to the heat sink, and the other of the two water channel interfaces being used to receive cooling liquid discharged by the heat sink.

9. The on-board power supply device according to claim 8, characterized in that The electrical components of the vehicle-mounted power supply device further comprise at least one capacitor and at least one second magnetic device, and the shell further comprises a second accommodating groove and a third accommodating groove, the first accommodating groove being arranged between the second accommodating groove and the third accommodating groove in the third direction, and the second accommodating groove and the third accommodating groove being used to accommodate at least one capacitor and at least one second magnetic device respectively.

10. The in-vehicle power supply device according to claim 9, characterized by The shell further comprises a first baffle plate for separating the first accommodating groove and the second accommodating groove, and a second baffle plate for separating the first accommodating groove and the third accommodating groove, wherein: The first baffle plate comprises a first bending portion towards the second accommodating groove in the third direction, and the second baffle plate comprises a second bending portion towards the third accommodating groove in the third direction, the first bending portion and the second bending portion being used to support one side of the circuit board towards the second accommodating groove and the third accommodating groove respectively.

11. The on-board power supply device according to claim 10, characterized in that The shell further comprises a first side wall and a second side wall, the first side wall being arranged opposite to the first baffle plate in the third direction, and the second side wall being arranged opposite to the second baffle plate in the third direction, wherein: The first side wall comprises a third bending portion towards the first baffle plate in the third direction, and the second side wall comprises a fourth bending portion towards the second baffle plate in the third direction, the third bending portion and the fourth bending portion being used to support one side of the circuit board towards the second accommodating groove and the third accommodating groove respectively.

12. The on-board power supply device according to any one of claims 9-11, characterized in that, The size of the circuit board in the third direction is greater than the size of the first accommodating groove in the third direction, and one side of the circuit board towards the second accommodating groove and the third accommodating groove is used to fix and electrically connect at least one of the capacitor or the second magnetic device.

13. The on-board power supply device according to any one of claims 9 to 12, characterized in that, The electrical components of the vehicle-mounted power supply device comprise two first magnetic devices, and the size of the first accommodating groove in the third direction is greater than the size of the second accommodating groove in the third direction and the size of the third accommodating groove in the third direction, wherein: The two first magnetic devices are arranged adjacent to each other along the third direction between the bottom of the first accommodating groove and the heat sink.

14. A powertrain, characterized by, The power assembly comprises a drive motor and the on-vehicle power supply device according to any one of claims 1-13, wherein the on-vehicle power supply device comprises the motor controller configured to control the drive motor.

15. An electric vehicle characterized by comprising: The electric vehicle comprises a power battery and the on-vehicle power supply device according to any one of claims 1-13, wherein: The on-vehicle power supply device comprises an on-vehicle charging machine configured to receive power supply from an external power source and charge the power battery or supply power to a load of the electric vehicle, or, The on-vehicle power supply device comprises a motor controller configured to receive power supply from the power battery and control a drive motor to drive wheels of the electric vehicle.

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