A gold plating apparatus

Abstract

The application provides a gold electroplating device. The gold electroplating device is connected with the conductive panel and the conductive column through the turnover assembly, so that the short circuit and poor contact caused by the collision between different plates and the conductive tile due to the multiple blocks of the conductive plate and the rotary electrical connection are avoided. When the turnover mechanism turns the body out of the electroplating tank, the ratchet wheel is clamped on the ratchet teeth to fix the body and the turnover assembly, so as to turn the metal to be electroplated in the body. During the process that the turnover mechanism immerses the body into the electroplating liquid, the ratchet wheel and the ratchet teeth rotate freely, so that at least two conductive columns are located in the lower half of the body. Therefore, the short circuit is prevented, the electroplating effect of the bottom metal is ensured, the residual electroplating liquid on the surface of other metals is minimized when the other metals are taken out, and the cleaning cost is reduced.

Description

Technical Field

[0001] This application relates to the field of precious metal processing technology, and in particular to a gold electroplating device. Background Technology

[0002] In the field of precious metal processing, such as the processing and manufacturing of gold, electroplating gold on the outer layer of other metals has a significant price advantage compared to solid gold. It can achieve large-scale mass production and can be applied to the surface of metals of different materials, improving the decorative and functional properties of items.

[0003] Existing gold electroplating principles generally involve placing other metals in an electroplating solution containing gold cyanide or gold thiocyanate. Gold ions are then reduced to the surface of the other metals through the action of electrodes, thus completing the gold plating. However, in the electroplating process of other metals, a drum containing the other metals is typically placed in the electroplating solution. Due to the weight of the other metals, they usually sink to the bottom of the drum. Electrolyzing the entire drum would cause gold ions to remain free throughout the drum space, thus affecting the gold plating effect. To address this issue, patent application CN119307999B proposes a drum conductive device for NdFeB electroplating. This device uses a multi-plate structure with spaced conductive plates and conductive tiles at the bottom. By energizing the conductive tiles and rotating the conductive plates, the conductive tiles are kept in continuous contact with the bottom conductive plate, thereby electroplating the metal located at the bottom of the drum.

[0004] Existing technology involves rotating a conductive plate until it reaches the bottom, causing it to contact the conductive tile and thus achieving electroplating. However, since the connection and disconnection of the conductive plate during rotation are achieved through collisions between the plate and the tile, prolonged impacts can lead to poor contact and suboptimal electroplating results. Furthermore, because the drum cannot be rotated, a large amount of other metals sinks to the bottom and carries away a significant amount of electroplating solution during retrieval, increasing the cleaning costs for subsequent electroplating processes. Summary of the Invention

[0005] In view of this, it is necessary to provide a gold plating device that can prevent short circuits and ensure the electroplating effect of the bottomed metal while reducing cleaning costs when other metals are retrieved, in order to solve the above problems.

[0006] Embodiments of this application provide a gold electroplating apparatus, comprising:

[0007] The machine platform, the electroplating tank mounted on the machine platform, and the flipping mechanism;

[0008] The roller includes a body, a flipping assembly, a locking assembly, and a conductive assembly. One end of the flipping assembly is disposed on the flipping mechanism, and the other end is disposed at opposite ends of the body and connected to an external power source. The locking assembly includes a ratchet and a ratchet tooth, which are embedded in the flipping assembly. The conductive assembly includes a conductive panel electrically connected to the flipping assembly and at least two conductive posts, with one end of each conductive post disposed on the conductive panel and the other end disposed on the body.

[0009] The ratchet is fixed to the flipping assembly to rotate with the flipping assembly, and the ratchet tooth is fixed to the conductive panel. The ratchet has a locking groove on its peripheral wall that extends from the electroplating tank to the flipping mechanism. When the flipping mechanism flips the body out of the electroplating tank, the ratchet engages with the ratchet tooth to fix the body and the flipping assembly, thereby flipping the metal to be electroplated inside the body. It also allows the ratchet and ratchet tooth to rotate freely during the process of the flipping mechanism immersing the body in the electroplating solution, so that at least two of the conductive posts are located in the lower half of the body.

[0010] In at least one embodiment of this application, the roller further includes an energizing element;

[0011] The energizing component is embedded in the flip assembly and electrically connected to the conductive panel. The energizing component has an energizing port for connecting an external power supply. The current from the external power supply is introduced into the conductive panel through the energizing port.

[0012] In at least one embodiment of this application, the energizing element is connected to the housing of the locking assembly, and both the energizing element and the housing of the locking assembly are made of conductive material.

[0013] In at least one embodiment of this application, the energizing element surrounds the locking assembly and is connected to the conductive panel, and there is a gap between the energizing element and the locking assembly for interrupting current.

[0014] In at least one embodiment of this application, the body is a hexagonal cage structure, and the body has a top surface and a bottom surface facing each other.

[0015] The top surface has an opening that communicates with the internal cavity of the main body, and other metals are placed inside the internal cavity of the main body through the opening;

[0016] The roller also includes a load-bearing component disposed on the bottom surface, and when the body is immersed in the electroplating solution, at least two of the conductive posts are located on both sides of the load-bearing component along its vertical central axis.

[0017] In at least one embodiment of this application, the roller further includes a rotating shaft, which passes through the body along the central axis of the body and has its two ends respectively disposed on the flipping mechanism, and the roller is fitted onto the rotating shaft with a clearance fit.

[0018] In at least one embodiment of this application, when viewed from the side of the roller, the line connecting the center of the two conductive pillars and the center of the rotation axis forms an isosceles triangle. In at least one embodiment of this application, the flipping assembly includes a flipping rod and two clamping members disposed on the flipping rod. The flipping rod is disposed on the flipping mechanism, and one end of each of the two clamping members is disposed on the flipping rod, while the other end is fixed to both ends of the body. The ratchet is embedded in the clamping members.

[0019] In at least one embodiment of this application, the roller further includes a first cover plate and a second cover plate;

[0020] The first cover plate and the second cover plate are fixed to the two ends of the body respectively to seal the inner cavity of the body.

[0021] In at least one embodiment of this application, the first cover plate is provided with a plurality of conductive holes, and each conductive post extends into the inner cavity of the roller through one of the conductive holes.

[0022] The gold electroplating equipment described above avoids the problems of short circuits and poor contact caused by collisions between different conductive plates and conductive tiles due to the direct connection of the conductive panel to the flipping assembly and conductive posts. Furthermore, by fixing a ratchet inside the flipping assembly and rotating it with the assembly, and fixing the ratchet teeth to the conductive panel, a locking groove is formed on the peripheral wall in the direction circumferential from the flipping mechanism towards the electroplating tank. Thus, when the flipping mechanism flips the body out of the electroplating tank, the ratchet engages with the ratchet teeth to fix the body and the flipping assembly, thereby flipping the metal to be electroplated inside the body. During the process of immersing the body in the electroplating solution, the ratchet and ratchet teeth rotate freely, ensuring that at least two of the conductive posts are located in the lower half of the body. This not only prevents short circuits and ensures the electroplating effect of the bottom-plated metal, but also minimizes the amount of electroplating solution residue on the surface of other metals when they are retrieved, reducing cleaning costs. Attached Figure Description

[0023] Figure 1 This is a three-dimensional structural diagram of a gold electroplating device according to an embodiment of this application.

[0024] Figure 2 for Figure 1 The diagram shows a three-dimensional structure of the roller.

[0025] Figure 3 for Figure 2The image shown is an exploded view from the first perspective after the roller has been hidden from view.

[0026] Figure 4 for Figure 2 The diagram shown is an exploded view from a second perspective after the roller has been hidden from view.

[0027] Figure 5 for Figure 1 The diagram shows a cross-sectional view of the locking assembly.

[0028] Explanation of main component symbols

[0029] 100. Gold electroplating equipment; 10. Machine platform; 20. Electroplating tank; 30. Tilting mechanism; 40. Roller; 41. Body; 41a. Top surface; 41b. Opening; 41c. Bottom surface; 42. Tilting assembly; 421. Tilting rod; 422. Clamping component; 43. Locking assembly; 431. Ratchet; 431a. Locking groove; 432. Ratchet tooth; 433. Housing; 44. Conductive component; 441. Conductive panel; 442. Conductive post; 45. Electrical component; 45a. Electrical port; 46. Load-bearing component; 47. Rotating shaft; 48. First cover plate; 481. Conductive hole; 49. Second cover plate; F1. First direction; F2. Second direction. Detailed Implementation

[0030] The embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0031] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or may also have an intervening component. When a component is considered to be "placed" on another component, it can be directly placed on the other component or may also have an intervening component. The terms "top," "bottom," "upper," "lower," "left," "right," "front," "back," and similar expressions used in this article are for illustrative purposes only.

[0032] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0033] Please see Figures 1-5 This application provides a gold electroplating apparatus 100, comprising:

[0034] Machine base 10, electroplating tank 20 and flipping mechanism 30 disposed on the machine base 10;

[0035] The roller 40 includes a body 41, a flipping assembly 42, a locking assembly 43, and a conductive assembly 44. One end of the flipping assembly 42 is disposed on the flipping mechanism 30, and the other end is disposed on opposite ends of the body 41 and connected to an external power source. The locking assembly 43 includes a ratchet 431 and a ratchet tooth 432, which are embedded in the flipping assembly 42. The conductive assembly 44 includes a conductive panel 441 electrically connected to the flipping assembly 42 and at least two conductive posts 442, with one end of the at least two conductive posts 442 disposed on the conductive panel 441 and the other end disposed on the body 41.

[0036] The ratchet 431 is fixed to the flipping assembly 42 to rotate with the flipping assembly 42, and the ratchet tooth 432 is fixed to the conductive panel 441. The ratchet 431 has a locking groove 431a on its peripheral wall, which is circumferential from the electroplating tank 20 to the flipping mechanism 30. When the flipping mechanism 30 flips the body 41 out of the electroplating tank 20, the ratchet 431 is engaged with the ratchet tooth 432 to fix the body 41 and the flipping assembly 42, thereby flipping the metal to be electroplated in the body 41. It is also used so that when the flipping mechanism 30 immerses the body 41 in the electroplating solution, the ratchet 431 and the ratchet tooth 432 can rotate freely so that at least two of the conductive posts 442 are located in the lower half of the body 41.

[0037] In one specific embodiment, the machine platform 10 is a benchtop machine platform 10, the electroplating tank 20 is a tank set on the machine platform 10 for holding the electroplating solution, and the flipping mechanism 30 is a device, such as a robotic arm, installed on the machine platform 10 for flipping. It should be noted that the shape of the machine platform 10 is not limited to this, nor is the flipping mechanism 30; any feasible device or equipment can be used. It is understood that the robotic arm is a computer-controlled robotic arm that can perform grasping, flipping, etc., according to a specified path; this is existing technology and will not be elaborated upon here.

[0038] Furthermore, in precious metal processing plants or jewelry stores, to achieve specific display effects or surface finishes, it is often necessary to electroplate a layer of gold onto the outer surface of parts made of other metals. Generally, during the electroplating process, the other metals are placed in an electroplating solution of gold cyanide or gold thiocyanate. An electric current is applied to reduce the gold ions in the electroplating solution to the surface of the other metals, forming a gold coating. In this process, the other metals are often placed in a drum 40, which is then placed in an electroplating bath 20 containing the electroplating solution for electroplating. Due to the weight of the other metals, when placed in the drum 40 for electroplating, they tend to accumulate and sink to the bottom. Therefore, when the current is applied to the drum 40, the electroplating solution on the parts not directly connected to the other metals is also reduced, causing the gold ions to disperse and affecting the electroplating effect on the other metals. Therefore, patent application CN119307999B proposes a technical means to solve the above-mentioned technical problems, namely, setting the conductive plate as a multi-plate structure with spaced intervals, and setting a conductive tile at the bottom of the outer side, so that the conductive plate at the bottom is always in contact with the conductive tile and thus charged by rotating the conductive plate. In the above-mentioned prior art, since the conductive plate needs to be continuously rotated, different conductive plates will continuously contact and impact with the conductive tile. Therefore, after a long period of contact and impact, wear will occur between the conductive plate and the conductive tile, resulting in a short circuit problem, which will affect the electroplating effect. Based on this problem, this application sets the conductive component 44 as a combination of conductive panel 441 and conductive post 442. Preferably, the conductive panel 441 is a complete plate structure that can conduct electricity, such as an iron plate. The conductive post 442 is a column structure set on the conductive surface for conducting electricity.

[0039] Furthermore, to ensure that at least two conductive posts 442 are located in the lower half of the body 41 during the electroplating process of other metals within the drum 40, for the electroplating of other metals at the bottom of the drum 40, please refer to [the relevant documentation / reference needed]. Figure 2 and Figure 5This application addresses this issue by configuring the locking component 43 as a ratchet 431 and a ratchet 432. Specifically, the ratchet 431 is fixed to the flipping component 42 to rotate with it, and the ratchet 432 is fixed to the conductive panel 441. Simultaneously, the ratchet 431 and ratchet 432 are embedded within the flipping component 42 and located in the same vertical space. This allows the flipping component 42 to simultaneously flip the roller 40 out of the electroplating solution while keeping it relatively stationary. This flips other metals located at the bottom of the roller 40, preventing cleaning problems caused by residual electroplating solution between other metals. Furthermore, during the process of the flipping component 42 immersing the roller 40 into the electroplating solution, the flipping component 42 flips without affecting the actual movement of the roller 40. The roller 40 remains in its original position, and due to the gravity of the roller 40 and other metals, the conductive post 442 remains located in the lower half of the body 41, achieving a better electroplating effect.

[0040] Furthermore, in one specific embodiment, the body 41 is a hexagonal cage structure, the body 41 having a top surface 41a and a bottom surface 41c facing each other; the top surface 41a has an opening 41b communicating with the inner cavity of the body 41, and other metals are placed in the inner cavity of the body 41 through the opening 41b; the roller 40 also includes a load-bearing member 46, the load-bearing member 46 is disposed on the bottom surface 41c, and when the body 41 is immersed in the electroplating solution, at least two of the conductive posts 442 are located on both sides of the load-bearing member 46 along its vertical central axis.

[0041] It is understandable that during the process of the rotating component 42 driving the roller 40 to rotate and immerse in the electroplating bath 20, since the ratchet 431 and ratchet 432 do not engage with each other, the rotation of the rotating component 42 will not affect the rotation of the roller 40, and the roller 40 will always maintain its original state. To prevent the resistance of the electroplating solution to the roller 40 during entry into the electroplating solution from causing the roller 40 to rotate and resulting in the conductive post 442 being located on the upper part of the body 41, leading to poor electroplating effect, this application provides a load-bearing member 46 on the bottom surface 41c to resist the resistance of the electroplating solution, thereby keeping the roller 40 in its original state. In a specific embodiment, the load-bearing member 46 is a high-density object that can generate a large gravity in a small volume, such as iron. Preferably, by placing at least two conductive posts 442 on both sides of the vertical central axis of the load-bearing member 46, the conductive posts 442 can simultaneously conduct electricity to the electroplating solution on both sides of the bottom of the roller 40 during the electroplating process, thereby avoiding electroplating problems caused by unilateral conductivity.

[0042] Furthermore, to ensure that the roller 40 and the flipping mechanism 30 can maintain their running trajectory and shape relatively independently during the process of the flipping assembly 42 driving the roller 40 to be immersed in the electroplating solution, in a specific embodiment, the roller 40 further includes a rotating shaft 47. The rotating shaft 47 passes through the body 41 along the central axis of the body 41, and its two ends are respectively disposed on the flipping mechanism 30. The roller 40 is fitted onto the rotating shaft 47 with a clearance fit. Please refer to the following for details. Figure 5 It is understandable that when the flipping assembly 42 drives the drum 40 to be immersed in the electroplating solution, that is, when the flipping assembly 42 drives the ratchet 431 to flip along the second direction F2, since there is no mutual stop or force between the ratchet 431 and the ratchet 432, the flipping assembly 42 flips while the drum 40 remains in its original position during the flipping process. Furthermore, the energizer is continuously applied during the immersion in the electroplating solution, thereby ensuring that electroplating operations can be continuously performed on the other metals at the bottom of the drum 40.

[0043] Furthermore, to ensure the electroplating effect within the roller 40, in one specific embodiment, when viewed from the side of the roller 40, the line connecting the centers of the two conductive pillars 442 and the center of the rotation axis 47 forms an isosceles triangle. That is, along the vertical central axis of the rotation axis 47, the two conductive pillars 442 are symmetrically arranged so that the electroplating solution located on both sides can be electroplated simultaneously.

[0044] To facilitate understanding of the process of uncovering and immersing in this application, the specific steps are as follows:

[0045] Please see details. Figure 2 and Figure 5 When other metals need electroplating, they are placed into the inner cavity of the drum 40 through the opening 41b, and then the flipping mechanism 30 flips them. At this time, the flipping mechanism 30 drives the ratchet 431 to rotate in the second direction F2. At this time, the ratchet 432 does not stop the ratchet 431, so the drum 40 maintains its original state under the gravity of the load-bearing component 46 during the process of the flipping mechanism 30 immersing the drum 40 into the electroplating solution. During the entry process, the conductive panel 441 is energized by the external power supply. The conductive panel 441 transmits the current to the conductive post 442, and the conductive post 442 performs conductive electroplating on the parts in contact with the conductive post 442. Since the conductive post 442 is located in the lower half of the body 41, when the conductive post 442 is energized, the conductive post 442 electrolyzes the electroplating solution at the bottom of the drum 40, thereby reducing gold ions at the bottom of the drum 40 to the surface of other metals.

[0046] After electroplating for a certain period of time, the flipping mechanism 30 flips along the first direction F1, thereby driving the ratchet 431 to rotate along the first direction F1. Figure 5It can be seen that when the ratchet 431 rotates along the first direction F1, the ratchet 431 abuts against the ratchet 432 and pushes the ratchet 432 to flip. The ratchet 432 is fixed to the conductive panel 441, and the conductive panel 441 is fixed to the conductive post 442 and the roller 40. That is, when the ratchet 431 flips along the first direction F1, the flipping mechanism 30 drives the roller 40 to flip out of the electroplating solution relatively stationary. When the roller 40 flips out of the electroplating solution along the first direction F1 with the flipping mechanism 30, the roller 40 tilts. At this time, the other metals at the bottom of the roller 40 roll under the action of gravity. Thus, when the flipping mechanism 30 flips the roller 40 out as a whole, the other metals will move relative to each other, and the residual electroplating solution between the other metals will be discharged, avoiding the tedious cleaning work after electroplating.

[0047] Please see Figures 2-4 To ensure proper power supply to the bottom of the roller 40, the roller 40 also includes a power supply component 45. The power supply component 45 is embedded in the flipping assembly 42 and electrically connected to the conductive panel 441. The power supply component 45 has a power supply port 45a for connecting an external power source, and the current from the external power source is introduced into the conductive panel 441 through the power supply port 45a.

[0048] It should be noted that by separately configuring a power supply component 45 embedded in the flipping assembly 42, an external power source is connected to the power supply component 45 to ensure continuous power supply inside the drum 40. Furthermore, the power supply component 45 is partially embedded in the flipping assembly 42 and partially extends outside the flipping assembly 42. The external power supply cable is connected to the power port 45a outside the power supply component 45, thereby preventing the external power supply cable from extending into the drum 40 and causing damage to the cable during the flipping of the drum 40.

[0049] In the first embodiment, the energizing element 45 is connected to the housing 433 of the locking assembly 43, and both the energizing element 45 and the housing 433 of the locking assembly 43 are made of conductive material. Please refer to [link / reference] for details. Figure 5 ,exist Figure 5 In this embodiment, the housing 433 of the locking assembly 43 surrounds the ratchet 431 and the ratchet tooth 432. In this embodiment, the energizing component 45 is embedded in the flipping assembly 42 and connected to the housing 433 of the locking assembly 43, so that the current on the energizing component 45 is transmitted to the conductive panel 441 through the housing 433 of the locking assembly 43. Since the housing 433 of the locking component does not contact the ratchet 431 and the ratchet tooth 432, it will not affect the normal operation of the ratchet 431 and the ratchet tooth 432 when energized. In one specific embodiment, the energizing component 45 is a block structure made of copper.

[0050] In the second embodiment, the energizing element 45 surrounds the locking assembly 43 and is connected to the conductive panel 441, and a gap for interrupting current exists between the energizing element 45 and the locking assembly 43. It is understood that, unlike the first embodiment, in the second embodiment, the energizing element 45 has a hat-like structure, which enables current conduction by surrounding the locking assembly 43 and connecting to the conductive panel 441. Preferably, by providing a gap between the energizing element 45 and the locking assembly 43, contact between the current and the ratchet 431 and ratchet teeth 432 within the locking assembly 43 is avoided, thus preventing wear and tear caused by prolonged energization of the ratchet 431 and ratchet teeth 432.

[0051] Please see Figures 2-4 In order to facilitate the rotation of the roller 40, the rotation assembly 42 includes a rotation rod 421 and two clamping members 422 disposed on the rotation rod 421. The rotation rod 421 is disposed on the rotation mechanism 30. One end of each of the two clamping members 422 is disposed on the rotation rod 421, and the other end is respectively fixed to both ends of the body 41. The ratchet 431 is embedded in the clamping member 422.

[0052] Specifically, the flipping rod 421 is mounted on the flipping mechanism 30. This can be understood as the flipping rod 421 being mounted on the external robotic arm, which can drive the flipping rod 421 to flip. The flipping method can be either up and down along the lateral direction of the electroplating tank 20 or up and down along the length direction of the electroplating tank 20, as long as it can achieve the flipping of the roller 40 entering and exiting the electroplating tank 20.

[0053] In one specific embodiment, the clamping member 422 is an elongated block structure integrally formed with the flipping rod 421. Furthermore, in this embodiment, there are two clamping members 422, each fixed to the flipping rod 421, with its other end connected to the rotation shaft 47 of the main body 41. Further, a ratchet 431 is fixedly mounted on the clamping member 422. When it flips along the first direction F1, the ratchet 431 and the ratchet teeth 432 abut against each other, allowing the flipping mechanism 30 to drive the roller 40 to flip together. When it flips along the second direction F2, the ratchet teeth 432 do not affect the rotation of the ratchet 431, thus keeping the roller 40 stationary.

[0054] To facilitate the connection between the roller 40 and the two clamping members 422, in one specific embodiment, the roller 40 further includes a first cover plate 48 and a second cover plate 49. The first cover plate 48 and the second cover plate 49 are fixed to the two ends of the body 41 respectively to seal the inner cavity of the body 41.

[0055] It is understood that the first cover plate 48 and the second cover plate 49 are part of the roller 40. The body 41 of the roller 40 is a mesh-like regular hexahedral structure. The first cover plate 48 and the second cover plate 49 are plate-like structures of the roller 40 along its length and fixed to opposite ends of the body 41. Specifically, one end of the conductive post 442 is fixed to the conductive panel 441, and the other end is fixed to the first cover plate 48, so as to transmit the current of the external power supply to the first cover plate 48, and then transmit the current to the inner cavity of the roller 40 through the first cover plate 48, so that when the roller 40 is immersed in the electroplating solution, the conductive post 442 can transmit the current to the inner cavity of the roller 40 to electroplat the electroplating solution in the inner cavity of the roller 40.

[0056] Furthermore, the first cover plate 48 has multiple conductive holes 481, and each conductive post 442 extends into the inner cavity of the drum 40 through one of the conductive holes 481. It is understood that by opening multiple conductive holes 481 on the first cover plate 48, each conductive post 442 is positioned within the inner cavity of the drum 40 through each conductive hole 481. When the drum 40 is immersed in the electroplating solution and the external power supply is activated, the current from the external power supply flows through the energizing component 45, the conductive panel 441, the conductive post 442, and the inner cavity of the drum 40 to directly electrolyze the electroplating solution within the drum 40. Preferably, by extending the conductive post 442 directly into the inner cavity of the drum 40 instead of transmitting current through the first cover plate 48, damage to the first cover plate 48 due to prolonged current flow is avoided, as is excessive conductive area that could affect the electroplating effect if current is transmitted through the first cover plate 48 into the inner cavity of the drum 40.

[0057] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. A gold electroplating device, characterized in that, include: The machine platform, the electroplating tank mounted on the machine platform, and the flipping mechanism; The roller includes a body, a flipping assembly, a locking assembly, and a conductive assembly. One end of the flipping assembly is disposed on the flipping mechanism, and the other end is disposed at opposite ends of the body and connected to an external power source. The locking assembly includes a ratchet and a ratchet tooth, which are embedded in the flipping assembly. The conductive assembly includes a conductive panel electrically connected to the flipping assembly and at least two conductive posts, with one end of each conductive post disposed on the conductive panel and the other end disposed on the body. The main body is a cage structure with a regular hexagonal shape, and the main body has a top surface and a bottom surface facing each other. The top surface has an opening that communicates with the inner cavity of the main body, and other metals to be electroplated are placed inside the inner cavity of the main body through the opening; The roller also includes a load-bearing component, which is disposed on the bottom surface, and when the body is immersed in the electroplating solution, at least two of the conductive posts are located on both sides of the load-bearing component along its vertical central axis. The roller also includes a rotating shaft, which passes through the body along the central axis of the body and has its two ends respectively disposed on the flipping mechanism. The roller is fitted onto the rotating shaft with a clearance fit. When viewed from the side of the roller, the line connecting the center of the two conductive posts and the center of the rotating shaft is an isosceles triangle. The ratchet is fixed to the flipping assembly to rotate with the flipping assembly, and the ratchet tooth is fixed to the conductive panel. The ratchet has a locking groove on its peripheral wall that extends from the electroplating tank to the flipping mechanism. When the flipping mechanism flips the body out of the electroplating tank, the ratchet engages with the ratchet tooth to fix the body and the flipping assembly, thereby flipping the metal to be electroplated inside the body. It also allows the ratchet and ratchet tooth to rotate freely during the process of the flipping mechanism immersing the body in the electroplating solution, so that at least two of the conductive posts are located in the lower half of the body.

2. The gold electroplating equipment according to claim 1, characterized in that, The drum also includes an electrical component; The energizing component is embedded in the flip assembly and electrically connected to the conductive panel. The energizing component has an energizing port for connecting an external power supply. The current from the external power supply is introduced into the conductive panel through the energizing port.

3. The gold electroplating equipment according to claim 2, characterized in that, The energizing element is connected to the housing of the locking assembly, and both the energizing element and the housing of the locking assembly are made of conductive material.

4. The gold electroplating equipment according to claim 2, characterized in that, The energizing element surrounds the locking assembly and is connected to the conductive panel, and there is a gap between the energizing element and the locking assembly for interrupting current.

5. The gold electroplating equipment according to claim 1, characterized in that, The flipping assembly includes a flipping rod and two clamping members disposed on the flipping rod. The flipping rod is disposed on the flipping mechanism. One end of each of the two clamping members is disposed on the flipping rod, and the other end is respectively fixed to both ends of the body. The ratchet is embedded in the clamping members.

6. The gold electroplating equipment according to claim 1, characterized in that, The roller also includes a first cover plate and a second cover plate; The first cover plate and the second cover plate are fixed to the two ends of the body respectively to seal the inner cavity of the body.

7. The gold electroplating equipment according to claim 6, characterized in that, The first cover plate has multiple conductive holes, and each conductive post extends into the inner cavity of the roller through one of the conductive holes.

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