Lithography machine substrate rigidity evaluation method and related equipment

Abstract

The invention discloses a photoetching machine substrate rigidity evaluation method and related equipment, and relates to the technical field of semiconductors, and the method comprises the following steps: applying a vibration excitation signal of a preset frequency band to a photoetching machine substrate through a preset excitation device; obtaining vibration response data of the photoetching machine substrate through a preset sensor array; based on the vibration excitation signal and the vibration response data, determining frequency response function data of the photoetching machine substrate; determining modal frequency and vibration mode data of the photoetching machine substrate based on the frequency response function data; and determining a rigidity evaluation result of the photoetching machine substrate based on the modal frequency and the vibration mode data. According to the method, the rigidity of the substrate of the photoetching machine can be quantitatively evaluated through modal testing, weak links are accurately positioned, targeted optimization is achieved, testing is efficient and high in applicability, preventive improvement in the design stage and full-life-cycle performance monitoring are supported, and therefore the long-term precision and stability of equipment are guaranteed.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, and more particularly, to a lithography machine substrate rigidity evaluation method and related equipment. BACKGROUND

[0002] With the continuous development of semiconductor manufacturing technology, as a core equipment, the lithography machine substrate plays a crucial role in supporting, positioning and maintaining the stability of the optical system. During exposure, alignment and high-speed movement, the lithography machine substrate needs to have extremely high rigidity to prevent the optical path from deviating, the silicon wafer from tilting or the mask from shaking due to slight vibration or structural deformation, thereby affecting the precision and yield of chip pattern transfer. Therefore, accurate evaluation of the rigidity of the lithography machine substrate is a key link to ensure the performance and stability of the equipment.

[0003] In related technologies, substrate rigidity evaluation usually relies on theoretical analysis of material selection and structural design, or is verified by limited static testing at the finished product stage. Although this method is simple to implement, it has obvious limitations: on the one hand, relying solely on qualitative judgment of materials and structures makes it difficult to fully quantify the dynamic stiffness characteristics of the substrate under actual operating conditions; on the other hand, static testing often fails to reflect the real response of the substrate under different frequency band vibration excitations, and tends to overlook dynamic characteristics such as changes in natural frequency and mode shape of the structure. That is, the related art has the technical problems of lack of dynamic quantitative analysis, insufficient precision and lag in risk identification in the evaluation of lithography machine substrate rigidity. SUMMARY

[0004] A series of simplified concepts are introduced in the summary part of the present application, which will be further described in detail in the specific embodiment part. The summary part of the present application does not mean to try to limit the key features and necessary technical features of the claimed technical solution, nor does it mean to try to determine the protection scope of the claimed technical solution.

[0005] The lithography machine substrate rigidity evaluation method and related equipment provided by the present application can quantitatively evaluate the rigidity of the lithography machine substrate through modal testing, accurately locate weak links and target optimization, and is efficient and highly applicable in testing, supporting preventive improvement at the design stage and performance monitoring throughout the life cycle, thereby ensuring long-term precision and stability of the equipment.

[0006] In a first aspect, the present application provides a lithography machine substrate rigidity evaluation method, comprising: applying a preset frequency band vibration excitation signal to a lithography machine substrate through a preset excitation device; acquiring vibration response data of the lithography machine substrate through a preset sensor array; determining frequency response function data of the lithography machine substrate based on the vibration excitation signal and the vibration response data; determining modal frequency and mode shape data of the lithography machine substrate based on the frequency response function data; and determining a rigidity evaluation result of the lithography machine substrate based on the modal frequency and the mode shape data.

[0007] In some embodiments, the acquiring vibration response data of the lithography machine substrate through a preset sensor array comprises: acquiring structural topology information of the lithography machine substrate; determining preset node positions covering support column connection points and beam intersection points based on the structural topology information; and acquiring the vibration response data through the preset sensor array arranged at the preset node positions.

[0008] In some embodiments, the applying a preset frequency band vibration excitation signal to a lithography machine substrate through a preset excitation device comprises: determining excitation parameters of the vibration excitation signal based on mass parameters and geometric parameters of the lithography machine substrate; wherein the excitation parameters include a preset excitation amplitude, a preset excitation frequency range, and a preset excitation duration; and applying steady-state vibration excitation to the lithography machine substrate according to the excitation parameters through the preset excitation device.

[0009] In some embodiments, the determining frequency response function data of the lithography machine substrate based on the vibration excitation signal and the vibration response data comprises: performing time-domain synchronization processing on the vibration response data and the vibration excitation signal to obtain a synchronization signal; and performing frequency-domain transformation on the synchronization signal to obtain the frequency response function data.

[0010] In some embodiments, the determining modal frequency and mode shape data of the lithography machine substrate based on the frequency response function data comprises: performing peak frequency identification on the frequency response function data to obtain a target peak frequency set; determining the modal frequency based on the target peak frequency set; and generating mode shape data of the lithography machine substrate based on sensor output data corresponding to the modal frequency.

[0011] In some embodiments, the determining a rigidity evaluation result of the lithography machine substrate based on the modal frequency and the mode shape data comprises: comparing the modal frequency with a preset frequency threshold to obtain a first comparison result; comparing preset node displacement amplitudes corresponding to the mode shape data with a preset displacement threshold to obtain a second comparison result; and generating the rigidity evaluation result based on the first comparison result and the second comparison result.

[0012] In some embodiments, the method further comprises: in a case where the rigidity evaluation result indicates insufficient rigidity, determining a weak area of the lithography machine substrate based on the mode shape data; and generating a structure optimization scheme for the weak area based on the modal frequency, wherein the structure optimization scheme comprises at least one of a material replacement scheme, a cross-section reinforcement scheme, and a support layout adjustment scheme.

[0013] In a second aspect, the present application further provides a lithography machine substrate rigidity evaluation device, comprising: a vibration excitation unit configured to apply a vibration excitation signal of a preset frequency band to a lithography machine substrate through a preset excitation device; a vibration response unit configured to acquire vibration response data of the lithography machine substrate through a preset sensor array; a function determination unit configured to determine frequency response function data of the lithography machine substrate based on the vibration excitation signal and the vibration response data; a modal analysis unit configured to determine modal frequency and mode shape data of the lithography machine substrate based on the frequency response function data; and a rigidity evaluation unit configured to determine a rigidity evaluation result of the lithography machine substrate based on the modal frequency and the mode shape data.

[0014] In a third aspect, the present application further provides an electronic device, comprising: a memory and a processor, wherein the processor is configured to execute a computer program stored in the memory to implement the steps of the lithography machine substrate rigidity evaluation method of the first aspect.

[0015] In a fourth aspect, the present application further provides a computer readable storage medium, which stores a computer program, wherein the computer program is executed by a processor to implement the steps of the lithography machine substrate rigidity evaluation method of the first aspect.

[0016] In a fifth aspect, the present application further provides a computer program product, comprising a computer program or computer executable instructions, wherein the computer program or computer executable instructions are executed by a processor to implement the lithography machine substrate rigidity evaluation method provided in the embodiments of the present application.

[0017] In summary, the application can directly obtain the key parameters such as modal frequency and vibration mode by applying the vibration excitation signal of the preset frequency band to the lithography machine substrate and collecting vibration response data by using the sensor array combined with frequency response function analysis, thereby quantifying the rigidity characteristics of the substrate. Compared with the theoretical calculation method depending on material and structure design, the application can output clear numerical indicators to realize the change from qualitative judgment to quantitative verification of rigidity evaluation. Through visual analysis of the vibration mode data, the deformation mode of the lithography machine substrate under different modes can be intuitively displayed, thereby accurately positioning the area with insufficient rigidity, which is helpful for targeted optimization and avoids unnecessary reinforcement measures in a large range, thereby reducing the improvement cost. The preset excitation device and the sensor array can cover the test requirements in the target frequency range in a short time, and are also suitable for large-size and high-quality lithography machine substrates without destructive treatment of the substrate. The test conditions can simulate the actual installation boundary to ensure the reliability and applicability of the results. The rigidity risk can be identified in advance by the method before the lithography machine substrate is put into production and installed, and the structure is optimized according to the modal analysis results, which can effectively reduce the risk of rework, downtime and other risks in the later stage, shorten the research and development cycle and reduce the overall cost. The substrate rigidity change can be detected periodically during the service period of the equipment to timely find the performance decline problem caused by fatigue, loosening and deformation, thereby ensuring the precision and stability requirements of the lithography machine in the whole life cycle. In summary, the lithography machine substrate rigidity evaluation method provided by the application can quantitatively evaluate the rigidity of the lithography machine substrate through modal testing, accurately locate the weak links and target optimization, and is efficient and highly applicable in testing, which supports preventive improvement in the design stage and performance monitoring in the whole life cycle, thereby ensuring the long-term precision and stability of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0018] Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are for purposes of illustration only and are not to be construed as limiting the specification. Throughout the drawings, like reference numerals refer to like structures or elements. In the drawings: Figure 1 A flowchart of a lithography machine substrate rigidity evaluation method provided by an embodiment of the application is shown in FIG. 1. Figure 2 A structural schematic diagram of a lithography machine substrate provided by an embodiment of the application is shown in FIG. 2. Figure 3 A component structure schematic diagram of a lithography machine substrate rigidity evaluation device provided by an embodiment of the application is shown in FIG. 3. Figure 4 A component structure schematic diagram of an electronic device provided by an embodiment of the application is shown in FIG. 4.

[0019] In the drawings, 401 is a lithography machine substrate, 402 is a preset node position, and 403 is an acceleration sensor. DETAILED DESCRIPTION

[0020] The terms “first”, “second”, “third”, “fourth” etc. (if any) in the description, claims, and drawings of the present application are used for distinguishing between similar objects, not necessarily described in the specific order or sequence. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the description are, for example, capable of use in the different sequences or arrangements, unless otherwise specifically provided herein. Moreover, the term “is” and “has”, and any variations thereof used herein are intended to cover a non-exclusive inclusion, such that a process, method, system, product or apparatus that comprises a list of elements is not necessarily limited to the elements explicitly mentioned. For example, a process, method, system, product or apparatus that includes several elements or steps does not have to only include the elements or steps explicitly mentioned and can include other elements or steps not explicitly mentioned or inherent to such process, method, system, product or apparatus.

[0021] In the present application, “module” or “unit” refers to a computer program or a part of a computer program with a specific function, and works in cooperation with other related parts to achieve a predetermined target. These modules or units can be implemented by software, hardware (such as processing circuitry or memory), or a combination of both. One or more processors or memories can implement one or more modules or units. Meanwhile, each module or unit can also be part of a larger module or unit.

[0022] The technical solutions in the present application will be described in detail below in conjunction with the accompanying drawings in the embodiments. It should be noted that the described embodiments are only a part of the present application, not all embodiments. In the following description, “some embodiments” mentioned is only a subset of all possible embodiments, which can be the same or different subset, and different embodiments can be combined with each other without conflict.

[0023] Figure 1 is a flowchart of a substrate rigidity evaluation method of a lithography machine provided by an embodiment of the present application. For example, referring to Figure 1 The substrate rigidity evaluation method of the lithography machine provided by the embodiment of the present application can include the following steps 101 to 105: Step 101, applying a vibration excitation signal of a preset frequency band to the substrate of the lithography machine through a preset excitation device; In some examples, the preset excitation device is a driving device for applying controllable, frequency-spectrum configurable force or displacement excitation to the lithography machine substrate, capable of providing stable and repeatable excitation energy within the required frequency band; the preset excitation device can be an electromagnetic / electrodynamic shaker, a hydraulic shaker, a piezoelectric actuator modal exciter, or a single-point multi-axis shaker, etc.; in actual selection, the corresponding model can be selected according to the mass of the lithography machine substrate, the target frequency band, and the test environment, and a flexible stinger or a rigid connecting piece is used with a force sensor (force sensor / force meter) to ensure accurate measurement and transmission of the excitation force. The lithography machine substrate is the main structural component of the lithography equipment that undertakes mechanical support, optical positioning, and motion reference functions, including but not limited to the main bearing plate, the cross beam, the support column, and the connecting flange, etc.; the lithography machine substrate can be made of cast iron, aluminum alloy, steel, carbon fiber composite material, etc., and has the characteristics of large size and large mass. The preset frequency band is a frequency range determined in advance for modal identification and rigidity evaluation, the upper and lower limits of which should cover the key modal frequencies that may exist in the lithography machine substrate and the frequency bands that have an impact on precision within the working period, which can be determined based on modal prediction of finite element (FEA) or empirical model, can also refer to historical test data or known modal range of similar equipment, and can also be determined in combination with the working bandwidth and vibration sensitivity of the lithography machine (for example, low-frequency stiffness usually has a greater impact on the device posture); for example, the preset frequency band can be 0 Hz to 1000 Hz to cover the identification needs of the low-order overall stiffness modal to several high-order local modals; in some high-precision occasions, the upper limit can also be extended to several kHz. The vibration excitation signal is a specific time-frequency domain signal applied to the lithography machine substrate by the preset excitation device, with controllable waveform, amplitude, frequency distribution, and time length, etc.; the types of vibration excitation signal can include: linear or logarithmic sweep (sine sweep / chirp), stepped-sine, steady-state sine, random / white noise (broadband random), multi-sine, maximum length sequence (MLS), etc.; the generation method is usually generated by a signal generator or a controller, and driven by a power amplifier to drive the shaker.

[0024] For example, first, the target frequency band (such as 0-1000 Hz) and the positions of several key measuring points to be covered can be determined based on finite element pre-analysis; then, an electromagnetic exciter is selected and a force sensor is connected in series at the output end of the exciter, the force is transmitted to the predetermined excitation point of the substrate through a flexible stinger; an IEPE type acceleration sensor is arranged at the intersection of the support column connecting point and the cross beam and connected to a synchronous data acquisition system, and the sampling rate is set to 5-10 kHz; a logarithmic sweep or wideband random steady-state excitation is applied according to the preset excitation parameters, the input / output coherence is monitored in real time, and the data is recorded after the steady state to be used for frequency response function and modal identification analysis.

[0025] By implementing step 101, the vibration excitation signal of the preset frequency band is applied to the lithography machine substrate by using the preset excitation device, which can ensure that the input energy covers the full frequency range required for target analysis, thereby providing sufficient, uniform and controllable excitation conditions for subsequent modal analysis, and avoiding distortion of test results due to insufficient excitation or missing frequency bands.

[0026] Step 102, acquiring vibration response data of the lithography machine substrate by the preset sensor array; In some examples, the preset sensor array is a set of sensors arranged at a plurality of predetermined measuring point positions, which is used to synchronously acquire dynamic response signals of different positions of the lithography machine substrate during the test; the node positions of the preset sensor array can be determined in advance according to the structural topology of the lithography machine substrate, the finite element modal prediction results and the empirical rules, such as the support column connecting point, the intersection of the cross beam, the flange connecting point and the thin-walled area, etc., so as to ensure that the key vibration areas can still be covered under the condition that the number of sensors is limited; the types of the preset sensors can include contact type acceleration sensors, non-contact type laser Doppler vibrometers, proximity sensors / eddy current displacement sensors (eddy-current), displacement sensors (LVDT), optical displacement meters and strain gauges / strain meters or fiber Bragg grating (FBG) sensors, etc.; the fixing methods of the sensors can include screws, high-strength adhesives, magnetic supports or special clamps, etc., and good point contact stiffness and frequency band transmission performance should be ensured when selecting. The vibration response data refers to the original time domain or preprocessed dynamic signal data output by the preset sensor under the excitation, including but not limited to acceleration time history, velocity / displacement time history, strain time history and phase information, etc.

[0027] By implementing step 102, the vibration response data of the lithography machine substrate is acquired by using the preset sensor array, which can cover the key structural positions without increasing the number of sensors too much, and obtain complete and representative response signals, thereby improving the data acquisition efficiency and reducing the complexity and cost of test arrangement.

[0028] Step 103, determining the frequency response function data of the lithography machine substrate based on the vibration excitation signal and the vibration response data; In some examples, the frequency response function data is a transfer characteristic parameter between an output vibration response and an input vibration excitation of a lithography machine substrate under vibration excitation at different frequencies, and the mathematical expression is FRF(f)=X(f) / F(f), where X(f) is a frequency domain amplitude of the vibration response signal, F(f) is a frequency domain amplitude of the vibration excitation signal, and f is the frequency; the frequency response function data can intuitively reflect the dynamic stiffness of the substrate at a specific frequency, and the smaller the frequency response function amplitude, the stronger the ability of the substrate to resist vibration deformation at the frequency (the higher the rigidity). The vibration excitation signal output by the preset excitation device and the vibration response signal (such as an acceleration signal) fed back by the preset sensor array can be recorded synchronously by a data acquisition system to ensure alignment of the two on the time axis and eliminate phase deviation caused by time delay; the excitation signal and the response signal after synchronization are subjected to fast Fourier transform (FFT) respectively, the time domain signal is converted into a frequency domain spectrum, and the excitation amplitude F(f) and the response amplitude X(f) corresponding to each frequency point are obtained; the ratio of X(f) to F(f) is calculated point by point in a target frequency range (such as 0-1000 Hz), and a frequency response function curve FRF(f) is generated, which is the frequency response function data.

[0029] For example, to improve the accuracy of the frequency response function data, multiple average method can be used to process multiple groups of synchronously collected signals to reduce the influence of environmental noise and random interference; at the same time, by setting a suitable FFT window function, the spectral leakage caused by signal truncation is reduced, and the parameter accuracy at the resonance frequency point (at the peak value of the frequency response function) is ensured, laying a foundation for subsequent accurate identification of modal frequency and mode shape.

[0030] Through the implementation of step 103, the frequency response function data is calculated based on the vibration excitation signal and the vibration response data, which can effectively reflect the dynamic characteristic relationship between the input and the output, so as to convert the original signal into a frequency domain feature that can be directly used for modal identification, facilitating subsequent high-precision extraction of natural frequency and mode shape.

[0031] Step 104, based on the frequency response function data, determining the modal frequency and mode shape data of the lithography machine substrate; In some examples, the modal frequency is the natural frequency of the lithography machine substrate when freely vibrating under no external force, which is one of the core parameters representing the rigidity of the lithography machine substrate; each modal frequency corresponds to a specific vibration mode of the substrate, and the higher the value, the stronger the rigidity of the substrate in that vibration mode; the frequency response function curve obtained in step 103 can be subjected to peak value identification, and the frequency corresponding to the peak value of the frequency response function amplitude significantly higher than the surrounding frequency is the modal frequency, which can be automatically extracted by the peak picking algorithm of the modal analysis software, or the accurate frequency value corresponding to the peak value can be determined by combining the half-power bandwidth method. The mode shape data is the vibration shape distribution of the lithography machine substrate at a certain modal frequency, which can be represented by the relative displacement amplitude and phase relationship of each preset node, and can intuitively reflect the deformation trend of the substrate vibration. The area with larger displacement amplitude in the mode shape data is the weak part of rigidity; at the peak value of the frequency response function corresponding to the identified modal frequency, the vibration response amplitude (such as acceleration, displacement) and phase information of each sensor node are extracted; the vibration state between nodes is supplemented by an interpolation algorithm (such as polynomial fitting), and then a three-dimensional modeling tool is used to generate a vibration shape animation or a cloud chart of the substrate, which is the mode shape data.

[0032] Through the implementation of step 104, the modal frequency and mode shape data of the lithography machine substrate are extracted based on the frequency response function data, which can intuitively reveal the dynamic behavior characteristics of the substrate under different modes. It can not only provide quantitative indicators (modal frequency) to judge the overall rigidity level, but also locate the weak part of the structure through the mode shape form.

[0033] Step 105, based on the modal frequency and mode shape data, determining the rigidity evaluation result of the lithography machine substrate; In some examples, the rigidity evaluation result is a comprehensive determination conclusion based on the modal frequency and the mode shape data whether the rigidity of the lithography machine substrate meets the design requirements, which can include “rigidity meets the standard” and “rigidity is insufficient”, and specific weak areas and risk levels (such as slight, moderate, and severe) when the rigidity is insufficient; the rigidity evaluation result can directly reflect the ability of the lithography machine substrate to resist vibration deformation under dynamic working conditions, and is the core basis for verifying whether the substrate meets the exposure accuracy requirements of the lithography machine. The modal frequency identified in step 104 can be compared with a preset frequency threshold (such as 100 Hz), if the modal frequency ≥ the preset frequency threshold, it indicates that the overall rigidity of the lithography machine substrate meets the basic requirements, if the modal frequency < the preset frequency threshold, it is determined that the overall rigidity is insufficient; the displacement amplitudes of the key nodes (such as the top of the support column and the midpoint of the beam) in the mode shape data can be extracted and compared with a preset displacement threshold (such as ±1 μm), if the displacement amplitudes of all key nodes ≤ the preset displacement threshold, it indicates that the local rigidity meets the standard; if there is a node displacement amplitude > the preset displacement threshold, the area can be marked as a weak rigidity area. The final conclusion is generated in combination with the above two determination results, when the fundamental frequency meets the standard and there is no displacement exceeding the standard area, it is determined that “the rigidity meets the standard”; when the fundamental frequency does not meet the standard or there is an area exceeding the standard displacement, it is determined that “the rigidity is insufficient”, and the position of the weak area and the corresponding displacement exceeding the standard value are output simultaneously.

[0034] For example, to improve evaluation accuracy, a weighted algorithm can be used to assign different weights to the modal frequency and the mode shape data, such as a modal frequency weight of 60% and a mode shape displacement weight of 40%, and the rigidity level is determined by comprehensive score; at the same time, joint evaluation is carried out for multiple orders of modal, avoiding the limitations of single order analysis; the evaluation result can form a standardized report, including modal frequency curve, mode shape cloud chart and exceeding standard area marking, providing intuitive basis for subsequent structure optimization.

[0035] Through the implementation of step 105, the rigidity evaluation result of the lithography machine substrate is determined based on the modal frequency and the mode shape data, which can convert the complex dynamic characteristic analysis into a directly determinable rigidity qualified or not conclusion, providing a scientific basis for design optimization, production detection and state monitoring in the use process, and ensuring that the substrate meets the accuracy and stability requirements of the lithography machine for a long time.

[0036] In summary, the embodiment of the present application can directly obtain the key parameters such as modal frequency and vibration mode by applying the vibration excitation signal of the preset frequency band to the substrate of the lithography machine and collecting the vibration response data by using the sensor array combined with the frequency response function analysis, thereby quantitatively reflecting the rigidity characteristics of the substrate. Compared with the theoretical calculation method depending on the material and structure design, the embodiment can output clear numerical indicators, realize the change from qualitative judgment to quantitative verification of the rigidity evaluation, and intuitively display the deformation mode of the lithography machine substrate under different modes through the visual analysis of the vibration mode data, thereby accurately positioning the area with insufficient rigidity and helping to perform targeted optimization and avoid unnecessary reinforcement measures in a large range, thereby reducing the improvement cost. The preset excitation device and the sensor array are used, the test requirements in the target frequency range can be covered in a short time, and the method is also applicable to large-size and high-quality lithography machine substrates without destructive treatment of the substrate. The test conditions can simulate the actual installation boundary, ensure the reliability and applicability of the results, and the like. The rigidity risk can be identified in advance by the method before the lithography machine substrate is put into production and installed, the structure is optimized according to the modal analysis result, the risks such as rework and downtime in the later stage can be effectively reduced, the research and development cycle can be shortened, and the overall cost can be reduced. The rigidity change of the substrate can be periodically detected during the service period of the equipment, and the performance decline problem caused by fatigue, loosening and deformation can be found in time, thereby guaranteeing the precision and stability requirements of the lithography machine in the whole life cycle. In summary, the rigidity evaluation method of the lithography machine substrate provided by the embodiment of the present application can quantitatively evaluate the rigidity of the lithography machine substrate through modal testing, accurately locate the weak links and perform targeted optimization, the test is efficient and has strong applicability, supports preventive improvement in the design stage and performance monitoring in the whole life cycle, thereby guaranteeing the long-term precision and stability of the equipment.

[0037] In some embodiments, the foregoing step 102 can include: acquiring structure topology information of the lithography machine substrate; determining preset node positions covering support column connection points and beam intersection points based on the structure topology information; and acquiring vibration response data by a preset sensor array arranged at the preset node positions.

[0038] In some examples, structural topology information refers to the overall structural layout data of the lithography machine substrate, including the substrate's geometry, the spatial distribution, connection relationships, and dimensional parameters of its components (such as support columns, beams, and reinforcing ribs), which forms the basis for determining the sensor placement. Support column connection points are the connection points between the support columns and the main structure of the substrate or its foundation. These are critical nodes for the substrate's load-bearing capacity and force transmission, and their vibration characteristics directly reflect the substrate's support stability. For example, a lithography machine substrate has four cylindrical support columns at its bottom; the welding interface or bolt connection point between each support column and the substrate panel is the support column connection point. Beam intersection points are the cross-connection points (such as cross intersections or T-shaped connections) between beams and longitudinal beams on the lithography machine substrate. These are weak points in the overall rigidity of the substrate (easily amplified due to stress concentration), and their vibration response reflects the structure's resistance to deformation. For example, in the "well"-shaped frame in the middle of the substrate, the welding intersection point of the horizontal and vertical beams is the beam intersection point. The preset node locations are a set of key points where sensors need to be installed, selected based on structural topology information. These locations must simultaneously cover support column connection points and beam intersections to capture the core dynamic characteristics of the substrate with the fewest possible sensors. The preset sensor array is a combination of sensors arranged according to the preset node locations for synchronously acquiring vibration response data. Piezoelectric accelerometers can be used, and signal synchronization is achieved through a data acquisition device. Installation can be done magnetically or with bolts to ensure a rigid connection between the sensors and the substrate. Figure 2 As shown in the figure, a preset node position 402 is shown on the lithography machine substrate 401 covering the connection point of the support column and the intersection point of the crossbeam, and an acceleration sensor 403 in a preset sensor array is provided on the lithography machine substrate 401.

[0039] For example, structural topology information can be extracted from the 3D CAD model (such as a SolidWorks model) of the lithography machine substrate, or analyzed after generating a point cloud model by laser scanning of the physical prototype; the connection points of the support columns and the intersection points of the beams can be located in the 3D model (such as marking the center coordinates of the connection surface), or the actual positions can be determined by the dimension annotations of the engineering drawings; finally, modal simulation can be performed on the lithography machine substrate to screen the support column connection points and beam intersection points with the top 20% of vibration displacement amplitude, and finally determine 8-12 preset nodes, such as 4 support column connection points + 6 beam intersection points.

[0040] To ensure the representativeness of the preset nodes, pre-tests can be conducted at the initially selected node locations to collect vibration signals under no-load conditions. Correlation analysis can then be used to eliminate redundant nodes with similar vibration responses. Meanwhile, when installing the sensor, magnetic adsorption or bolt fixing (depending on the node material) should be used to ensure a rigid connection between the sensor and the substrate, avoiding measurement errors caused by loose installation.

[0041] Through implementation of the foregoing embodiments, based on the structure topology information of the lithography machine substrate, sensors are arranged at key nodes such as the covering support column connection points and the beam intersection points, so that the key stress areas can be covered in the case of optimal number of sensors, the real dynamic response of the weak structure position can be effectively captured, the evaluation accuracy caused by missing measurement points can be avoided, and the time and cost waste caused by invalid measurement can be reduced.

[0042] In some embodiments, the foregoing step 101 can include determining excitation parameters of the vibration excitation signal based on the quality parameters and the geometric parameters of the foregoing lithography machine substrate; wherein the excitation parameters can include a preset excitation amplitude, a preset excitation frequency range, and a preset excitation duration; and applying a steady-state vibration excitation to the lithography machine substrate according to the excitation parameters through a preset excitation device.

[0043] In some examples, the quality parameter is a parameter representing the quality characteristics of the lithography machine substrate, including the total mass of the substrate, the mass distribution and the center of gravity position of each key component (such as the support column, the crossbeam), etc., which directly affects the demand for excitation energy. The greater the mass, the higher the excitation energy required to ensure that the vibration response can be measured; for example, the total mass of a certain lithography machine substrate is 800 kg, in which the mass of a single support column is 50 kg, the total mass of the crossbeam is 300 kg, and the center of gravity is located at the left of the geometric center of the substrate by 5 cm. The geometric parameter is a parameter describing the size of the lithography machine substrate structure, including the overall length, width, and thickness of the substrate, the diameter, height, and spacing of the support column, and the cross-sectional size (such as width, thickness) and span of the crossbeam. It determines the vibration characteristic distribution (such as the resonance frequency range) of the substrate; for example, the overall size of the substrate is 3m x 2m x 0.3m, the diameter of the support column is 0.2m, the height is 0.5m, the spacing between adjacent support columns is 1.5m, and the crossbeam cross-section is 0.3m x 0.2m, with a span of 2.5m. The excitation parameter is a characteristic parameter of the excitation signal set for exciting the substrate vibration, which is an adaptive parameter calculated based on the quality parameter and the geometric parameter, and is used to ensure that the excitation signal can effectively cover the dynamic characteristic range of the substrate. The preset excitation amplitude is the force value of the vibration excitation signal, which needs to match the mass of the substrate to avoid insufficient excitation or overload; it can be estimated according to the total mass of the lithography machine substrate and the material allowable stress, or the response intensity under different amplitudes can be simulated by finite element simulation software to determine it. The preset excitation frequency range is the frequency coverage interval (unit: Hz) of the excitation signal, which needs to include the possible resonance frequencies of the lithography machine substrate; the low-frequency vibration (such as 0~500Hz) of the lithography machine substrate has a greater impact on exposure accuracy, so the target range is usually 0~1000Hz; for example, combined with the crossbeam span of 2.5m and the material characteristics, the first-order resonance frequency is estimated to be about 80~120Hz, so the preset excitation frequency range is set to 5~1000Hz. The preset excitation duration is the duration (unit: s) of applying excitation at each frequency point, which needs to ensure that the substrate vibration reaches a steady state (the response signal is stable), and the lower the frequency, the longer the duration required; for example, the stable time of the response signal can be observed by pre-testing, and the low-frequency band (such as 5~100Hz) is set to 5~10s, and the high-frequency band (such as 100~1000Hz) is set to 2~5s. The steady-state vibration excitation is an excitation mode in which the amplitude and frequency of the excitation signal remain constant within the preset duration, so that the substrate vibration state reaches a steady state (the amplitude and phase of the response signal no longer change significantly with time). Compared with transient excitation (such as force hammer knocking), it can more accurately capture the dynamic characteristics at a specific frequency.

[0044] Through the implementation of the foregoing embodiments, the excitation amplitude, frequency range and duration are optimized in combination with the quality and geometric parameters of the substrate, so as to ensure that the vibration excitation can fully cover the target modal frequency band and meet the energy input requirement, avoid test distortion caused by insufficient or excessive excitation, and make the measured dynamic response data more consistent with the real characteristics under the actual working conditions of the lithography machine, thereby improving the effectiveness of the rigidity evaluation result.

[0045] In some embodiments, the foregoing step 103 can include: performing time-domain synchronization processing on the vibration response data and the vibration excitation signal to obtain a synchronization signal; and performing frequency-domain transformation on the synchronization signal to obtain the frequency response function data.

[0046] In some examples, the time-domain synchronization processing is a processing procedure for time axis calibration of the vibration response data and the vibration excitation signal, and the purpose is to eliminate the time offset of the two signals caused by collection delay and device response time difference, so as to ensure that the excitation and the response data at the same time correspond to each other; the time-domain synchronization processing can be realized by a data collection system with a synchronization trigger function, and the excitation device and the sensor array share the same trigger source, so that the sampling start point and the sampling frequency of the two signals are completely consistent. The synchronization signal is a vibration excitation signal and a vibration response signal combined after time-domain synchronization processing, and is characterized by two groups of discrete data sequences corresponding to each other in the time dimension; for example, the excitation signal outputs a force of 3N at t=0.1s, and the response signal in the synchronization signal corresponds to an output acceleration of 0.005m / s² at t=0.1s. The frequency-domain transformation is a mathematical processing method for converting the time-domain synchronization signal into a frequency-domain signal, and the core is to reveal the amplitude and phase characteristics of the signal at different frequencies through Fourier transformation, which can be realized by fast Fourier transform (FFT) to improve the calculation efficiency. The excitation signal and the response signal in the synchronization signal can be respectively subjected to frequency-domain transformation to obtain the frequency-domain amplitudes (F(f) and X(f)) of the two signals, and then the ratio (including amplitude ratio and phase difference) of X(f) / F(f) is calculated at each frequency point to generate a frequency response function curve (FRF curve); for example, after performing FFT on the synchronization signal, the frequency-domain amplitude of the excitation signal at 50Hz is 2N, and the frequency-domain amplitude of the response signal at 50Hz is 0.004m / s², so the frequency response function amplitude at this frequency point is 0.002(m / s²) / N, and the phase difference is-30°, which reflects the dynamic transmission characteristics of the substrate under 50Hz excitation.

[0047] Through the implementation of the foregoing embodiments, the excitation signal and the response signal are subjected to time-domain synchronization, and then frequency-domain transformation is performed to obtain the frequency response function data, which can effectively eliminate interference factors such as signal delay and phase error, ensure the accuracy of the frequency-domain analysis result, and provide a high-quality data basis for subsequent modal frequency extraction and mode shape calculation, thereby fundamentally improving the evaluation accuracy.

[0048] In some embodiments, the foregoing step 104 can include: performing peak frequency identification on the frequency response function data to obtain a target peak frequency set; determining a modal frequency based on the target peak frequency set; and generating mode shape data of the lithography machine substrate based on sensor output data corresponding to the modal frequency.

[0049] In some examples, the peak frequency identification is a process of screening out characteristic frequency points with amplitude significantly higher than that of the surrounding frequencies from the frequency spectrum curve of the frequency response function data. These peak frequencies correspond to the resonance frequencies of the lithography machine substrate under vibration excitation and are the core basis for identifying modal characteristics. The target peak frequency set is an ordered set of all characteristic frequencies obtained after peak frequency identification, which can be sorted in ascending order of frequency. This set reflects the main resonance characteristics of the lithography machine substrate within the test frequency range, and each element in the set corresponds to a potential vibration mode; for example, after frequency response function analysis of a certain lithography machine substrate, the target peak frequency set is {95Hz, 180Hz, 320Hz, 450Hz}, which respectively correspond to the first four order resonance frequencies of the substrate. The modal frequency refers to the characteristic frequency corresponding to the natural vibration mode of the substrate, wherein the first order modal frequency is the minimum value in the target peak frequency set, as it directly reflects the lowest threshold of the overall rigidity of the substrate and is a key indicator for rigidity evaluation; for example, 95Hz in the above set is the first order modal frequency, 180Hz is the second order modal frequency, and so on; if there are multiple low-frequency peaks close to each other in the set (such as 94Hz and 96Hz), the frequency with the highest mode shape consistency is selected as the first order modal frequency through modal assurance criterion (MAC) verification. The sensor output data corresponding to the modal frequency is the amplitude and phase information of the vibration response signal collected by the preset sensor array at a specific modal frequency. These sensor output data reflect the vibration intensity and synchronicity of each key node of the substrate at that mode; for example, at the first order modal frequency of 95Hz, the acceleration amplitude of the support column node is 0.5g (g is the acceleration of gravity), and the phase difference is ≤5°, while the acceleration amplitude of the middle node of the crossbeam is 1.2g, and the phase difference is 15°, indicating that the vibration in this area is more significant. The mode shape data is a visual representation of the vibration pattern of the substrate at a specific modal frequency. It is generated by the following steps: first, extract the vibration amplitude (such as displacement) and phase of each sensor node at the target modal frequency; then, use the triangular interpolation method or the finite element interpolation method to supplement the vibration state of non-sensor nodes; finally, generate a vibration cloud chart or a dynamic animation through a three-dimensional modeling tool to visually display the deformation trend of the substrate, such as bending, twisting, etc.; for example, the mode shape diagram generated based on the sensor data corresponding to 95Hz shows that there is obvious up-down bending vibration in the middle crossbeam of the substrate, and the vibration of the support column at both ends is smaller, indicating that the middle crossbeam is a weak area of rigidity.

[0050] Through the implementation of the above embodiments, the target modal frequency is obtained by peak frequency identification, and the mode shape is generated in combination with the corresponding sensor data, so that the rigidity quantitative index (modal frequency) and the spatial deformation distribution (mode shape) can be obtained at the same time, the overall rigidity level can be determined, and the local weak link can be directly identified, thereby providing accurate positioning basis for subsequent optimization and improvement.

[0051] In some embodiments, the foregoing step 105 can include: comparing the modal frequency with a preset frequency threshold to obtain a first comparison result; comparing the preset node displacement amplitude corresponding to the mode shape data with a preset displacement threshold to obtain a second comparison result; and generating a rigidity evaluation result based on the first comparison result and the second comparison result.

[0052] In some examples, the preset frequency threshold is a rigid minimum natural frequency standard preset based on the design accuracy requirement of the lithography machine substrate and the vibration characteristics of the working environment, which can be a critical value (such as 100 Hz) of the first-order modal frequency; the preset frequency threshold needs to meet the requirement of avoiding resonance of the lithography machine substrate in core processes such as exposure and alignment, and can be determined by the whole machine dynamics simulation of the lithography machine, inversely deduced by referring to the rigid index of the same type of high-end substrate, or set in combination with industry standards (such as Semiconductor Equipment Vibration Control Specification). The first comparison result is a determination result obtained by numerically comparing the modal frequency identified in step 104 with the preset frequency threshold, including “modal frequency ≥ preset frequency threshold” (qualified) or “modal frequency < preset frequency threshold” (unqualified); for example, if the first-order modal frequency of the substrate is 95 Hz and the preset frequency threshold is 100 Hz, the first comparison result is “unqualified”. The preset node displacement amplitude is the maximum vibration displacement (including positive and negative directions, reflecting the vibration amplitude) of the preset sensor node (such as the support column connection point or the beam intersection point) at the corresponding modal frequency in the mode shape data, which can be extracted from the displacement peak value of each preset node in the mode shape data, directly read from the three-dimensional mode shape cloud diagram or the sensor output curve; for example, the displacement amplitude of the middle node of the beam at 100 Hz is ±1.2 μm. The preset displacement threshold is the maximum allowable vibration displacement (such as ±1 μm) of the node preset to ensure the stability of the light path of the lithography machine and the alignment accuracy of the silicon wafer, which needs to be derived in combination with the exposure accuracy requirement of the lithography machine, such as calculating the critical value based on the mapping relationship between the light path offset and the displacement, or determining the critical point of the failure displacement by long-term process data statistics. The second comparison result is a determination result obtained by comparing the preset node displacement amplitude with the preset displacement threshold, including “displacement amplitude ≤ preset displacement threshold” (qualified) or “displacement amplitude > preset displacement threshold” (unqualified); for example, if the displacement amplitude of a support column node is ±1.5 μm and the preset displacement threshold is ±1 μm, the second comparison result is “unqualified”. The rigidity evaluation result is represented by “qualified” or “unqualified”, and the determination logic is: if the first comparison result is “unqualified” (the modal frequency does not meet the standard), or the second comparison result is “unqualified” (the displacement amplitude exceeds the standard), the overall evaluation is “insufficient rigidity”; only when both are “qualified”, the evaluation is “rigidity meets the standard”; for example, the first-order modal frequency of a certain substrate is 105 Hz (the first comparison result is qualified), but the displacement amplitude of the beam node is ±1.1 μm (the second comparison result is unqualified), and the final evaluation result is “insufficient rigidity”.

[0053] Through implementation of the foregoing embodiments, the modal frequency is compared with the preset threshold value to obtain a frequency determination result, the displacement amplitude of the key node is compared with the threshold value to obtain a displacement determination result, and the two are comprehensively combined to generate a rigidity evaluation conclusion. The overall rigidity level and the local deformation control requirement can be simultaneously considered, the one-sidedness of single-index evaluation can be avoided, and more comprehensive and reliable rigidity determination can be achieved.

[0054] In some embodiments, the foregoing method can further include: in the case where the rigidity evaluation result indicates insufficient rigidity, determining a weak area of the lithography machine substrate based on the modal data; and generating a structure optimization scheme for the weak area based on the modal frequency; wherein the structure optimization scheme can include at least one of a material replacement scheme, a cross-section enhancement scheme, and a support layout adjustment scheme.

[0055] In some examples, insufficient rigidity refers to the rigidity evaluation result of the lithography machine substrate not meeting the preset performance standard. The specific judgment basis can be that the first-order modal frequency is lower than the preset frequency threshold (e.g., < 100 Hz), or the displacement amplitude of the key node exceeds the preset displacement threshold (e.g., > ± 1 μm); for example, the first-order modal frequency of a certain substrate is 92 Hz, and the displacement of the middle node of the beam is ± 1.5 μm, that is, it is judged to be insufficient in rigidity, which may cause the light path to deviate during the exposure process. The weak area is a part of the vibration amplitude in the vibration mode data which is significantly higher than that of other areas, which can be a red / warm color concentrated area in the vibration mode cloud diagram, reflecting the deformation sensitive point of the substrate under a certain modal; for example, the first-order vibration mode data shows that the displacement of the connecting part between the beam and the support column is ± 2.0 μm, and the bending deformation trend is shown, and the area is identified as a weak area. The optimization intensity can be determined according to the difference between the modal frequency and the target threshold, and a scheme can be developed in combination with the structural characteristics of the weak area; for example, if the modal frequency is close to the threshold (e.g., 95 Hz, target 100 Hz), a local reinforcement scheme can be used; if the gap is large (e.g., 80 Hz), the overall optimization needs to be combined, such as for the first-order frequency of 92 Hz and the weak area of the beam, the overall modal frequency is broken through the threshold by improving the rigidity of the area. The material replacement scheme is a scheme for replacing the original material with a high-rigidity material to improve the rigidity of the weak area, which can select a material (such as carbon fiber composite material, elastic modulus about 200 GPa, higher than 110 GPa of cast iron) with better specific strength and elastic modulus according to the stress characteristics (such as bending load) of the weak area; for example, the material of the beam is replaced from gray cast iron (HT300) to carbon fiber reinforced resin matrix composite material, and the first-order modal frequency is increased from 92 Hz to 105 Hz through modal test verification, meeting the design requirements. The cross-section reinforcement scheme is a scheme for improving the structural moment of inertia by increasing the cross-sectional size (such as width, thickness) of the weak area, thereby enhancing the rigidity; the rigidity improvement amplitude under different cross-sectional parameters can be calculated based on finite element simulation, and the optimal size meeting the weight constraint can be selected; for example, the cross-section of the weak area of the beam is optimized, the original thickness is increased from 80 mm to 100 mm, and the width remains unchanged at 300 mm. The test shows that the displacement amplitude of the area is reduced from ± 1.5 μm to ± 0.8 μm, and the modal frequency is increased to 98 Hz. The support layout adjustment scheme is a scheme for reducing the vibration of the weak area by increasing the number of support points, optimizing the support position, or adjusting the support stiffness; according to the deformation direction (such as downward bending) of the weak area in the vibration mode data, a support column can be added or the existing support spacing can be adjusted within the projection range of the area; for example, one support column is added below the middle of the beam, and the original support spacing is 2 m, which is adjusted to 1 m. The test shows that the first-order modal frequency is increased from 92 Hz to 102 Hz, and the displacement amplitude of the area in the vibration mode is reduced to ± 0.7 μm.

[0056] Through the implementation of the above embodiments, when the evaluation results show insufficient rigidity, the weak area can be accurately located based on the mode shape data, and a structural optimization scheme (including material replacement, cross-section reinforcement, support layout adjustment, etc.) can be generated in combination with the modal frequency. The rigidity of the weak parts can be improved in a targeted manner to achieve targeted improvement. At the same time, the optimization effect can be verified through subsequent repeated tests, which can improve the efficiency and reliability of the rigidity design of the lithography machine substrate.

[0057] Furthermore, as an implementation of the aforementioned method embodiments, this application also provides a photolithography substrate rigidity evaluation device for implementing the aforementioned method embodiments. This device embodiment corresponds to the aforementioned method embodiments. For ease of reading, this photolithography substrate rigidity evaluation device embodiment will not repeat the details of the aforementioned method embodiments one by one, but it should be understood that the device in this application embodiment can correspondingly implement all the contents of the aforementioned method embodiments. For example... Figure 3 As shown, the lithography substrate rigidity evaluation device 20 includes: a vibration excitation unit 201, a vibration response unit 202, a function determination unit 203, a modal analysis unit 204, and a rigidity evaluation unit 205. The vibration excitation unit 201 is used to apply a vibration excitation signal of a preset frequency band to the lithography substrate through a preset excitation device; the vibration response unit 202 is used to acquire vibration response data of the lithography substrate through a preset sensor array; the function determination unit 203 is used to determine the frequency response function data of the lithography substrate based on the vibration excitation signal and the vibration response data; the modal analysis unit 204 is used to determine the modal frequencies and mode shapes of the lithography substrate based on the frequency response function data; and the rigidity evaluation unit 205 is used to determine the rigidity evaluation result of the lithography substrate based on the modal frequencies and mode shapes.

[0058] In some embodiments, the vibration response unit 202 is further configured to acquire structural topology information of the lithography machine substrate; determine the preset node positions covering the connection points of the support columns and the intersection points of the beams based on the structural topology information; and acquire vibration response data through a preset sensor array set at the preset node positions.

[0059] In some embodiments, the vibration excitation unit 201 is further configured to determine the excitation parameters of the vibration excitation signal based on the mass parameters and geometric parameters of the lithography machine substrate; wherein the excitation parameters include a preset excitation amplitude, a preset excitation frequency range, and a preset excitation duration; and apply steady-state vibration excitation to the lithography machine substrate according to the excitation parameters through a preset excitation device.

[0060] In some embodiments, the function determination unit 203 is further configured to perform time-domain synchronization processing on the vibration response data and the vibration excitation signal to obtain a synchronization signal; and to perform frequency-domain transformation on the synchronization signal to obtain frequency response function data.

[0061] In some embodiments, the modal analysis unit 204 is further configured to perform peak frequency identification on the frequency response function data to obtain a target peak frequency set, determine a modal frequency based on the target peak frequency set, and generate mode shape data of the lithography substrate based on sensor output data corresponding to the modal frequency.

[0062] In some embodiments, the rigidity evaluation unit 205 is further configured to compare the modal frequency with a preset frequency threshold to obtain a first comparison result, compare a preset node displacement amplitude corresponding to the mode shape data with a preset displacement threshold to obtain a second comparison result, and generate a rigidity evaluation result based on the first comparison result and the second comparison result.

[0063] In some embodiments, the lithography substrate rigidity evaluation apparatus 20 further includes a rigidity optimization unit configured to, in a case where the rigidity evaluation result indicates insufficient rigidity, determine a weak area of the lithography substrate based on the mode shape data, and generate a structure optimization scheme for the weak area based on the modal frequency, wherein the structure optimization scheme includes at least one of a material replacement scheme, a cross-section enhancement scheme, and a support layout adjustment scheme.

[0064] The present application also provides a computer-readable storage medium having computer-executable instructions or computer programs stored therein, which, when executed by a processor, cause the processor to perform any step of the lithography substrate rigidity evaluation method provided by the present application.

[0065] In some embodiments, the computer-readable storage medium can be a random access memory (RAM), a read-only memory (ROM), a flash memory, a magnetic surface memory, an optical disc, or a compact disc read-only memory (CD-ROM), etc. The computer-readable storage medium can also be various devices including one or any combination of the above storage devices.

[0066] In some embodiments, the computer-executable instructions can be in the form of programs, software, software modules, scripts, or codes, written in any form of programming language (including compiled or interpreted languages, or declarative or procedural languages), and can be deployed in any form, including being deployed as standalone programs or being deployed as modules, components, subroutines, or other units suitable for use in a computing environment.

[0067] In some embodiments, the computer-executable instructions can, but need not, reside in a file system; can, but need not, be part of only the file(s) that are comprised in the computer programs, can, but need not, be stored in a single file dedicated to the program in question, or can, but need not, be stored in multiple files, such as files that store one or more modules, subprograms, or code portions.

[0068] In some embodiments, the computer-executable instructions can be deployed to execute on one electronic device, or on multiple electronic devices located at one site, or on multiple electronic devices distributed across multiple sites and interconnected through a communication network.

[0069] As shown in Figure 4 The present application also provides an electronic device 30, which comprises a memory 310, a processor 320, and a computer program 311 stored in the memory 310 and executable on the processor 320, wherein the processor 320 implements any step of the lithography machine substrate rigidity evaluation method when executing the computer program 311.

[0070] The present application also provides a computer program product, which comprises a computer program or computer-executable instructions stored in a computer-readable storage medium. A processor of an electronic device reads the computer program or computer-executable instructions from the computer-readable storage medium, and the processor executes the computer program or computer-executable instructions, so that the electronic device performs any step of the lithography machine substrate rigidity evaluation method described above.

[0071] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit the technical solutions; even though the above technical solutions are described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements to some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A lithography substrate rigidity evaluation method characterized by, The method comprises: applying a vibration excitation signal of a preset frequency band to the lithography machine substrate through a preset excitation device; obtaining vibration response data of the lithography machine substrate through a preset sensor array; determining frequency response function data of the lithography machine substrate based on the vibration excitation signal and the vibration response data; determining modal frequency and mode shape data of the lithography machine substrate based on the frequency response function data; determining a rigidity evaluation result of the lithography machine substrate based on the modal frequency and the mode shape data; wherein applying a vibration excitation signal of a preset frequency band to the lithography machine substrate through a preset excitation device comprises: determining excitation parameters of the vibration excitation signal based on mass parameters and geometric parameters of the lithography machine substrate; wherein the excitation parameters include a preset excitation amplitude, a preset excitation frequency range, and a preset excitation duration; applying steady-state vibration excitation to the lithography machine substrate according to the excitation parameters through the preset excitation device.

2. The method of claim 1, wherein, obtaining vibration response data of the lithography machine substrate through a preset sensor array comprises: obtaining structure topology information of the lithography machine substrate; determining preset node positions covering support column connection points and beam intersection points based on the structure topology information; obtaining the vibration response data through the preset sensor array arranged at the preset node positions.

3. The method of claim 1, wherein, determining frequency response function data of the lithography machine substrate based on the vibration excitation signal and the vibration response data comprises: synchronously processing the vibration response data and the vibration excitation signal in the time domain to obtain a synchronization signal; performing frequency domain transformation on the synchronization signal to obtain the frequency response function data.

4. The method of claim 1, wherein, determining modal frequency and mode shape data of the lithography machine substrate based on the frequency response function data comprises: performing peak frequency identification on the frequency response function data to obtain a target peak frequency set; determining the modal frequency based on the target peak frequency set; generating mode shape data of the lithography machine substrate based on sensor output data corresponding to the modal frequency.

5. The method of claim 1, wherein, determining a rigidity evaluation result of the lithography machine substrate based on the modal frequency and the mode shape data comprises: comparing the modal frequency with a preset frequency threshold to obtain a first comparison result; comparing preset node displacement amplitudes corresponding to the mode shape data with a preset displacement threshold to obtain a second comparison result; generating the rigidity evaluation result based on the first comparison result and the second comparison result.

6. The method according to any one of claims 1 to 5, characterized in that, The method further comprises: in the case that the rigidity evaluation result indicates insufficient rigidity, determining a weak area of the lithography machine substrate based on the mode shape data; generating a structure optimization scheme for the weak area based on the modal frequency; wherein the structure optimization scheme includes at least one of a material replacement scheme, a cross-section reinforcement scheme, and a support layout adjustment scheme.

7. A lithography substrate rigidity evaluation apparatus characterized by comprising: The device comprises: a vibration excitation unit for applying a vibration excitation signal of a preset frequency band to the lithography machine substrate through a preset excitation device; a vibration response unit for obtaining vibration response data of the lithography machine substrate through a preset sensor array; a function determining unit, configured to determine frequency response function data of the lithography machine substrate based on the vibration excitation signal and the vibration response data; a modal analysis unit, configured to determine modal frequency and mode shape data of the lithography machine substrate based on the frequency response function data; a rigidity evaluation unit, configured to determine a rigidity evaluation result of the lithography machine substrate based on the modal frequency and the mode shape data.

8. An electronic device comprising: A memory and a processor, wherein the processor is configured to implement the steps of the lithography machine substrate rigidity evaluation method according to any one of claims 1 to 6 when executing a computer program stored in the memory.

9. A computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the steps of the lithography machine substrate rigidity evaluation method according to any one of claims 1 to 6.

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