Adhesive testing system, method and device

Abstract

The invention discloses an adhesive testing system, method and device, and relates to the technical field of adhesion testing, and the method comprises the following steps: obtaining a substrate surface image after an adhesive is stripped; a flexible isolation plate is arranged between the adhesive and the base material, and the flexible isolation plate is a hollowed-out isolation plate so that the adhesive and the base material can be bonded in a point-shaped mode. Performing color analysis on the surface image of the base material to determine a damage mode corresponding to each bonding point; the destruction mode comprises an adhesive body destruction mode, a base material body destruction mode and a bonding interface separation mode. And determining a test result of the adhesive based on the proportion of the bonding interface separation mode in the damage mode corresponding to all the bonding points. By arranging the hollowed-out isolation plate between the adhesive and the base material, even if the base material is an elastic base material with low modulus, stripping of the adhesive and the base material can be smoothly achieved. Based on the visual identification part, automatic evaluation of the adhesion effect of the adhesive can be realized, so that the adhesion effect of the adhesive can be evaluated more accurately.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of bonding test, in particular to a kind of adhesive testing system, method and device. BACKGROUND

[0002] Adhesive has the advantages of connecting different materials, making up dimensional tolerance, and is widely used. Adhesive is generally in the form of adhesive tape. For the use of adhesive, strict verification in advance and effective supervision in the application process are needed to ensure the bonding quality.

[0003] A commonly used adhesive testing method currently includes the following steps: first, apply adhesive on the substrate as required, and obtain a peel sample by curing the adhesive. Then tear the adhesive, and cut the adhesive multiple times using a blade, each time the blade cuts the adhesive, the peeling of the adhesive starts from the surface of the substrate, and finally the peeling condition of the adhesive at the cutting position is counted to evaluate the adhesion effect of the adhesive and the bonding interface of the substrate.

[0004] However, for substrates with low body strength, the cutting of the blade during testing will cut the substrate body, and after cutting, the substrate body is peeled and layered, which prevents the adhesive from being peeled from the surface of the substrate, and the adhesion effect of the adhesive and the bonding interface of the substrate cannot be evaluated.

[0005] It can be seen that how to accurately evaluate the adhesion effect of the adhesive is a problem to be solved by those skilled in the art. SUMMARY

[0006] The purpose of the embodiments of the present application is to provide an adhesive testing system, method and device, which can solve the problem that the adhesion effect of the adhesive and the bonding interface of the substrate cannot be evaluated for substrates with low body strength.

[0007] To solve the above technical problems, the embodiments of the present application provide an adhesive testing system, which comprises a flexible isolation plate, a peeling component and a visual recognition component; the flexible isolation plate is arranged between the adhesive and the substrate, and the flexible isolation plate is a hollow isolation plate to form point bonding between the adhesive and the substrate;

[0008] The peeling component is used to peel the adhesive from the substrate;

[0009] The visual recognition component is used to acquire the surface image of the substrate after peeling the adhesive; color analysis is performed on the surface image of the substrate to determine the damage mode corresponding to each bonding point; wherein the damage mode includes adhesive body damage mode, substrate body damage mode and bonding interface separation mode; based on the proportion of the bonding interface separation mode in all damage modes corresponding to each bonding point, the test result of the adhesive is determined.

[0010] In one aspect, the flexible isolation plate is an integrated flexible isolation plate, the length of the flexible isolation plate is greater than the coating length of the adhesive, the width of the flexible isolation plate is greater than the coating width of the adhesive, and the flexible isolation plate is provided with uniformly distributed holes in a set area; the distance between the set area and the starting end of the adhesive coating is greater than or equal to a set distance threshold.

[0011] In one aspect, the flexible isolation plate is composed of a plurality of release papers fixed at intervals; the interval distance between two adjacent release papers is greater than or equal to the width of the release paper; the length of the flexible isolation plate is less than the coating length of the adhesive, and the width of the flexible isolation plate is greater than the coating width of the adhesive.

[0012] In one aspect, it further comprises a pressing component;

[0013] The pressing component is used to press the adhesive after the adhesive is laid on the surface of the substrate, so that the coating thickness of the adhesive is less than a set thickness threshold, and the coating length of the adhesive is greater than or equal to a set length threshold.

[0014] In one aspect, the visual recognition component is used to compare the appearance color corresponding to each bonding point on the substrate surface image with a pre-established sample color library to determine the damage mode corresponding to each bonding point; wherein the sample color library contains substrate surface color maps corresponding to different damage modes respectively.

[0015] In one aspect, the visual recognition component is used to count the total number of bonding points and the number of bonding points belonging to the bonding interface separation mode in all damage modes corresponding to the bonding points; and the ratio of the number of bonding points to the total number of bonding points is taken as the proportion of the bonding interface separation mode.

[0016] In one aspect, the visual recognition component is used to determine that the adhesive is qualified when the proportion of the bonding interface separation mode is less than a set threshold, and determine that the adhesive is unqualified when the proportion of the bonding interface separation mode is greater than or equal to the set threshold.

[0017] In one aspect, the peeling component comprises a peeling test fixture and a tensile testing machine;

[0018] The peeling test fixture is used to fix the starting end of the adhesive to the tensile testing machine to drive the substrate to slide transversely during the peeling of the adhesive;

[0019] The tensile testing machine is used to vertically peel the adhesive from the surface of the substrate at a set peeling speed.

[0020] The embodiments of the present application also provide an adhesive testing method, comprising:

[0021] obtaining a substrate surface image after the adhesive is peeled; wherein the flexible isolation plate is provided between the adhesive and the substrate, and the flexible isolation plate is a hollow isolation plate to form point-like bonding between the adhesive and the substrate;

[0022] color analysis is performed on the substrate surface image to determine a corresponding failure mode of each bonding point; wherein the failure mode includes an adhesive body failure mode, a substrate body failure mode, and an adhesive interface separation mode;

[0023] Based on the proportion of the adhesive interface separation mode in all the failure modes corresponding to the bonding points, the test result of the adhesive is determined.

[0024] The embodiments of the present application also provide an adhesive testing device, which comprises an acquisition unit, an analysis unit, and a determination unit.

[0025] The acquisition unit is configured to acquire a substrate surface image after the adhesive is peeled off; wherein a flexible isolation plate is arranged between the adhesive and the substrate, and the flexible isolation plate is a hollow isolation plate to form point-like bonding between the adhesive and the substrate.

[0026] The analysis unit is configured to perform color analysis on the substrate surface image to determine a corresponding failure mode of each bonding point; wherein the failure mode includes an adhesive body failure mode, a substrate body failure mode, and an adhesive interface separation mode.

[0027] The determination unit is configured to determine a test result of the adhesive based on the proportion of the adhesive interface separation mode in all the failure modes corresponding to the bonding points.

[0028] As can be seen from the above technical solution, the adhesive testing system comprises a flexible isolation plate, a peeling component, and a visual recognition component. The flexible isolation plate is arranged between the adhesive and the substrate, and the flexible isolation plate is a hollow isolation plate to form point-like bonding between the adhesive and the substrate. The peeling component is configured to peel the adhesive from the substrate. The visual recognition component is configured to acquire a substrate surface image after the adhesive is peeled off; perform color analysis on the substrate surface image to determine a corresponding failure mode of each bonding point; wherein the failure mode includes an adhesive body failure mode, a substrate body failure mode, and an adhesive interface separation mode; and determine a test result of the adhesive based on the proportion of the adhesive interface separation mode in all the failure modes corresponding to the bonding points. In this technical solution, the hollow isolation plate is arranged between the adhesive and the substrate, which reduces the difficulty of peeling the adhesive from the substrate, and even if the substrate is a low-modulus elastic substrate, the adhesive can be successfully peeled off from the substrate. Compared with the traditional way of manually evaluating the adhesive performance, the present solution can realize automatic evaluation of the adhesive adhesion effect based on the visual recognition component, so that the adhesive adhesion effect can be more accurately evaluated. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort on the basis of these drawings.

[0030] Figure 1 A structural schematic diagram of an adhesive testing system provided by an embodiment of the present application is shown in FIG. 1.

[0031] Figure 2 A schematic diagram of a flexible isolation plate provided by an embodiment of the present application is shown in FIG. 2.

[0032] Figure 3 A schematic diagram of another flexible isolation plate provided by an embodiment of the present application is shown in FIG. 3.

[0033] Figure 4 A structural schematic diagram of a peel testing fixture provided by an embodiment of the present application is shown in FIG. 4.

[0034] Figure 5 A flowchart of an adhesive testing method provided by an embodiment of the present application is shown in FIG. 5. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative effort fall within the protection scope of the present application.

[0036] The terms "include" and "have" and any variations of the terms "include" and "have" in the specification and the above drawings of the present application are intended to cover the non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but can include steps or units not listed.

[0037] In order to make the person skilled in the art better understand the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0038] Next, a kind of adhesive testing system provided by an embodiment of the present application will be described in detail. Figure 1A structural schematic diagram of an adhesive testing system provided by an embodiment of the present application, comprising a flexible isolation plate 1, a peeling component 2 and a visual identification component 3; the flexible isolation plate 1 is arranged between the adhesive and the substrate, and the flexible isolation plate 1 is a hollow isolation plate so that the adhesive and the substrate form point-like bonding. Because of the effect of the flexible isolation plate 1, the adhesive is bonded with the substrate only at the hollow positions, and each hollow position is a test point.

[0039] The peeling component 2 can be composed of a peeling test fixture and a tensile testing machine, so that the peeling test fixture and the tensile testing machine are contained in the Figure 1 visual identification component 3. The visual identification component 3 can include a camera and a processor. The camera can be used to shoot the substrate surface image after the adhesive is peeled off, and the processor is used to analyze the substrate surface image so as to determine the adhesive effect of the adhesive. Figure 1 The dashed line between the camera and the substrate in the

[0040] By laying the hollow isolation plate between the adhesive and the substrate, the adhesive and the substrate form point-like bonding, so that the peeling of the adhesive and the substrate can be successfully realized even if the substrate is a low modulus elastic substrate. The adhesive is directly peeled off from the substrate by the peeling component 2, so that the peeling test process does not need to use a blade to cut, and at the same time, it can be ensured that each test point can peel off the adhesive tape from the surface of the substrate. The flexible isolation plate can strengthen the adhesive during the peeling process, effectively solving the problem of breaking of the adhesive with low body strength or low breaking elongation during the peeling process. At the same time, the strengthening effect of the flexible isolation plate can avoid the overall tensile deformation of the adhesive, eliminate the influence of the size difference of the adhesive on the test result, and the consistency of the test result is higher.

[0041] In actual application, before performing the adhesive test, a layer of hollow isolation plate needs to be laid on the surface of the substrate, the adhesive is coated on the surface of the substrate through the flexible isolation plate, and is cured in a suitable environment. In order to facilitate description, the substrate coated with the adhesive through the flexible isolation plate can be referred to as a sample. In order to better reflect the adhesive effect of the adhesive in actual application, after obtaining the sample, a suitable aging condition and aging period are selected to perform aging treatment on the sample.

[0042] For the aging treatment of the sample, the aging condition of cycling once every 12 hours at -40°C and 70°C can be selected according to the target of 5 years of service life of the adhesive under the application condition of temperature range of (-10 to 45) °C and maximum temperature difference of 15°C between day and night, and the aging multiple is expected to be 3, and the aging period is 5 years / (3*10) = 2 months. According to the selected aging condition, the sample is placed in the aging environment box for aging, and the aging condition is: the preset environment is cycled at a temperature of (70 ± 2) °C and (-40 ± 3) °C, each time the preset environment is reached for 5h ± 20min, the switching of the environment is completed within (60 ± 20) min, the aging period is 2 months, and finally the environment is changed to (23 ± 2) °C and (50 ± 5)% relative humidity within 60 min, and maintained for 4 hours.

[0043] After the aging treatment of the sample is completed, the adhesive can be peeled off by using the peeling component 2.

[0044] In the embodiments of the present application, in order not to affect the adhesion effect of the adhesive, the thickness of the flexible isolation plate is as thin as possible, for example, the thickness of the flexible isolation plate can be less than 0.1mm.

[0045] The flexible isolation plate 1 can be an integrated flexible isolation plate, or can be composed of a plurality of release papers fixed at an interval.

[0046] For the integrated flexible isolation plate, the length of the flexible isolation plate 1 can be greater than the coating length of the adhesive, the width of the flexible isolation plate 1 can be greater than the coating width of the adhesive, and the flexible isolation plate 1 is provided with uniformly distributed holes in the set region; the distance between the set region and the starting end of the adhesive coating is greater than or equal to the set distance threshold. The distance threshold can be flexibly set based on actual needs, for example, it can be set to 30 millimeters (mm).

[0047] Figure 2 A schematic diagram of a flexible isolation plate provided in the embodiments of the present application is shown in FIG. 1. The flexible isolation plate is laid between the substrate and the adhesive, and the flexible isolation plate is provided with uniformly distributed holes. Figure 2 The right-to-left direction is the test direction, which refers to the direction of peeling the adhesive from the substrate. Figure 2 As can be seen from FIG. 1, no holes are provided on the flexible isolation plate in the region starting from the adhesive coating starting end, which is to enable the peeling component to more conveniently clamp the adhesive starting end, so as to smoothly peel the adhesive from the substrate.

[0048] In actual application, the size of the holes provided on the flexible isolation plate can be 2mm*2mm, and the hole spacing can be set to be more than twice the size of the hole.

[0049] For the flexible isolation plate 1 composed of multiple spaced apart release papers, the spacing distance between two adjacent release papers is greater than or equal to the width of the release paper; the length of the flexible isolation plate 1 is less than the coating length of the adhesive, and the width of the isolation plate is greater than the coating width of the adhesive.

[0050] Figure 3 Another schematic diagram of a flexible isolation plate provided in the embodiments of the present application is provided, the starting end of the adhesive coating is not pasted with the release paper within a range of not less than 30 mm, the end is not pasted with the release paper within a range of not less than 20 mm, the middle region is pasted with the release paper in sections, the length and width of the release paper are both 3 mm, and the spacing between the adjacent release papers is 3 mm. The number of the release papers can be determined according to the coating length of the adhesive.

[0051] Because there is sufficient spacing between the holes of the flexible isolation plate, after peeling off one test point, the next test point can be smoothly extended through the isolation region to realize uninterrupted testing. When the body strength or the breaking elongation of the adhesive is low, the direct peeling method of the adhesive is easy to cause the adhesive to break during the peeling process. By peeling off the flexible isolation plate together with the adhesive, the flexible isolation plate plays a strengthening role on the adhesive, which can avoid the breaking of the adhesive during the peeling process. The strengthening effect of the flexible isolation plate during the peeling process avoids the overall tensile deformation of the adhesive, and eliminates the influence of the size difference of the adhesive on the test results.

[0052] In the embodiments of the present application, the peeling component 2 can include a peeling test clamp and a tensile testing machine. The peeling test clamp is used to fix the starting end of the adhesive to the tensile testing machine to drive the substrate to slide horizontally during the peeling process of the adhesive. The tensile testing machine is used to vertically peel off the adhesive from the substrate surface at a set peeling speed.

[0053] Figure 4 A structural schematic diagram of a peeling test clamp provided in the embodiments of the present application is provided. The peeling starting end of the adhesive is fixed to the tensile testing machine through the peeling test clamp, and the peeling test of the adhesive is performed by the tensile testing machine at a set peeling speed, Figure 4 The upward force (F) represents the force applied by the tensile testing machine on the adhesive and the flexible isolation plate, so as to peel off the adhesive and the flexible isolation plate from the substrate together. The substrate slides horizontally on the peeling test clamp. The peeled adhesive and the substrate always maintain a 90° peeling angle during the peeling process, and the included angle can ensure that the peeling circular arc radius remains consistent, and the test consistency is high.

[0054] Each bonding point has its corresponding failure mode when the adhesive is peeled off from the substrate. Among them, the failure mode can include the adhesive body failure mode, the substrate body failure mode and the bonding interface separation mode.

[0055] The failure interface presents a matt color in the adhesive body failure mode and the substrate body failure mode. The failure interface presents a bright color in the adhesive interface separation mode. The three failure modes differ in appearance color, so in the embodiments of the present application, the feature can be used to accurately count the failure mode corresponding to each bonding point by the visual recognition component 3.

[0056] The visual recognition component 3 is configured to acquire a substrate surface image after the adhesive is peeled off, and perform color analysis on the substrate surface image to determine the failure mode corresponding to each bonding point. Based on the proportion of the adhesive interface separation mode in all failure modes corresponding to the bonding points, the test result of the adhesive is determined.

[0057] In actual application, the sample colors corresponding to the three failure modes can be pre-sampled and stored in the visual recognition component 3. The visual recognition component 3 is configured to compare the appearance color of each bonding point on the substrate surface image with the pre-established sample color library to determine the failure mode corresponding to each bonding point. The sample color library contains substrate surface color images corresponding to different failure modes.

[0058] The visual recognition component 3 can count the total number of bonding points and the number of bonding points belonging to the adhesive interface separation mode in all failure modes corresponding to the bonding points, and take the ratio of the number of bonding points to the total number of bonding points as the proportion of the adhesive interface separation mode.

[0059] When the proportion of the adhesive interface separation mode is less than a set threshold, it indicates that the adhesive adhesion effect is good, and the adhesive can be determined to be qualified at this time. When the proportion of the adhesive interface separation mode is greater than or equal to the set threshold, it indicates that the adhesive adhesion effect is poor, and the adhesive can be determined to be unqualified at this time.

[0060] The value of the set threshold can be flexibly set according to actual needs, for example, it can be set to 30%.

[0061] When the proportion of the adhesive interface separation mode is less than 30%, it indicates that the adhesive and the substrate are firmly bonded, and the adhesive is qualified. At this time, the proportion of the adhesive body failure mode is greater than the proportion of the substrate body failure mode, indicating that the strength of the selected adhesive is less than the substrate body, and attention needs to be paid to whether the strength of the adhesive meets the use requirements when the adhesive is applied.

[0062] When the proportion of the adhesive interface separation mode is greater than or equal to 30%, it indicates that the adhesive and the substrate are not firmly bonded, and the adhesive is unqualified.

[0063] It can be seen from the above technical solution that the adhesive testing system comprises a flexible isolation plate, a peeling component and a visual recognition component. The flexible isolation plate is arranged between the adhesive and the substrate, and the flexible isolation plate is a hollow isolation plate so that the adhesive and the substrate form point-like bonding. The peeling component is used to peel the adhesive from the substrate. The visual recognition component is used to acquire a substrate surface image after the adhesive is peeled off; color analysis is performed on the substrate surface image to determine a corresponding damage mode of each bonding point; wherein the damage mode comprises an adhesive body damage mode, a substrate body damage mode and an adhesive interface separation mode; based on the proportion of the adhesive interface separation mode in all damage modes corresponding to the bonding points, the test result of the adhesive can be determined. In this technical solution, by arranging a hollow isolation plate between the adhesive and the substrate, the difficulty of peeling the adhesive from the substrate is reduced, and even if the substrate is a low modulus elastic substrate, the peeling of the adhesive from the substrate can be successfully realized. Compared with the traditional way of manually evaluating the adhesive performance, the present solution can realize the automatic evaluation of the adhesive adhesion effect based on the visual recognition component, so that the adhesive adhesion effect can be more accurately evaluated.

[0064] In actual application, the pressing component can be used to press the adhesive, so as to control the length and thickness of the adhesive.

[0065] The pressing component can be used to press the adhesive after the adhesive is laid on the substrate surface, so that the coating thickness of the adhesive is less than the set thickness threshold, and the coating length of the adhesive is greater than or equal to the set length threshold. The thickness threshold can be set to 5mm, and the length threshold can be set to 150mm.

[0066] By pressing the adhesive with the pressing component, the length and thickness of the adhesive can be accurately controlled, and the evaluation of the adhesive adhesion effect is avoided due to the excessive thickness, thinness or shortness of the adhesive, thereby providing effective guarantee for accurately evaluating the adhesive adhesion effect.

[0067] Figure 5 A flowchart of an adhesive testing method provided by the embodiment of the present application comprises:

[0068] S501: acquiring a substrate surface image after the adhesive is peeled off.

[0069] The flexible isolation plate is arranged between the adhesive and the substrate, and the flexible isolation plate is a hollow isolation plate so that the adhesive and the substrate form point-like bonding.

[0070] S502: performing color analysis on the substrate surface image to determine a corresponding damage mode of each bonding point.

[0071] The damage mode comprises an adhesive body damage mode, a substrate body damage mode and an adhesive interface separation mode.

[0072] S503: determining the test result of the adhesive based on the proportion of the adhesive interface separation mode in the failure modes corresponding to all the bonding points.

[0073] In some embodiments, color analysis is performed on the substrate surface image to determine the failure mode corresponding to each bonding point, including:

[0074] The appearance color of each bonding point on the substrate surface image is compared with a pre-established sample color library to determine the failure mode corresponding to each bonding point; wherein the sample color library contains substrate surface color maps corresponding to different failure modes.

[0075] In some embodiments, the method further includes, for determining the proportion of the adhesive interface separation mode:

[0076] counting the total number of bonding points and the number of bonding points belonging to the adhesive interface separation mode in the failure modes corresponding to all the bonding points;

[0077] taking the ratio of the number of bonding points to the total number of bonding points as the proportion of the adhesive interface separation mode.

[0078] In some embodiments, determining the test result of the adhesive based on the proportion of the adhesive interface separation mode in the failure modes corresponding to all the bonding points includes:

[0079] in the case where the proportion of the adhesive interface separation mode is less than a set threshold, determining that the adhesive is qualified;

[0080] in the case where the proportion of the adhesive interface separation mode is greater than or equal to the set threshold, determining that the adhesive is unqualified.

[0081] Figure 5 The description of the features of the corresponding embodiments can be referred to Figure 1 the related description of the corresponding embodiments, which will not be repeated here.

[0082] It can be seen from the above technical solution that the surface image of the substrate after the adhesive is stripped is obtained; wherein, the flexible isolation plate is arranged between the adhesive and the substrate, and the flexible isolation plate is a hollow isolation plate to form point bonding between the adhesive and the substrate. Color analysis is performed on the surface image of the substrate to determine the corresponding damage mode of each bonding point; wherein, the damage mode includes adhesive body damage mode, substrate body damage mode and bonding interface separation mode. Based on the proportion of the bonding interface separation mode in the damage mode corresponding to all bonding points, the test result of the adhesive is determined. In this technical solution, by arranging the hollow isolation plate between the adhesive and the substrate, the difficulty of stripping the adhesive from the substrate is reduced, and even if the substrate is a low modulus elastic substrate, the adhesive and the substrate can be successfully stripped. Compared with the traditional way of artificially evaluating the adhesive performance, the present scheme can realize the automatic evaluation of the adhesive adhesion effect based on the visual recognition component, so as to more accurately evaluate the adhesive adhesion effect.

[0083] The embodiment of the present application also provides a kind of adhesive testing device, including acquisition unit, analysis unit and determination unit;

[0084] Acquisition unit, for obtaining the surface image of the substrate after stripping adhesive;Wherein, flexible isolation plate is arranged between the adhesive and the substrate, and the flexible isolation plate is a hollow isolation plate to form point bonding between the adhesive and the substrate;

[0085] Analysis unit, for color analysis is carried out on the surface image of the substrate to determine the corresponding damage mode of each bonding point;Wherein, the damage mode includes adhesive body damage mode, substrate body damage mode and bonding interface separation mode;

[0086] Determination unit, for determining the test result of the adhesive based on the proportion of the bonding interface separation mode in the damage mode corresponding to all bonding points.

[0087] It can be seen from the above technical solution that the surface image of the substrate after the release adhesive is obtained; wherein the flexible isolation plate is arranged between the adhesive and the substrate, and the flexible isolation plate is a hollow isolation plate to form point-like bonding between the adhesive and the substrate. Color analysis is performed on the surface image of the substrate to determine the corresponding damage mode of each bonding point; wherein the damage mode includes adhesive body damage mode, substrate body damage mode and bonding interface separation mode. Based on the proportion of the bonding interface separation mode in all the damage modes corresponding to the bonding points, the test result of the adhesive is determined. In this technical solution, by arranging the hollow isolation plate between the adhesive and the substrate, the difficulty of peeling the adhesive from the substrate is reduced, and even if the substrate is a low modulus elastic substrate, the peeling of the adhesive from the substrate can be successfully realized. Compared with the traditional way of artificially evaluating the adhesive performance, the present scheme can realize the automatic evaluation of the adhesive adhesion effect based on the visual recognition component, so as to more accurately evaluate the adhesive adhesion effect.

[0088] The description of the features of the embodiments corresponding to the adhesive testing device can be referred to the related description of the embodiments corresponding to the adhesive testing method, which will not be repeated here.

[0089] The above provides a detailed introduction to the adhesive testing system, method and device provided by the embodiments of the present application. The embodiments in the specification are described in a progressive manner, and each embodiment mainly explains the differences from other embodiments. The same or similar parts of each embodiment can be referred to. For the device disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple, and the related parts can be referred to the method part.

[0090] The skilled person can further realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized in electronic hardware, computer software or a combination of both. In order to clearly illustrate the interchangeability of hardware and software, the components and steps of each example have been described in the above description. Whether the functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. The skilled person can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0091] The above describes in detail the adhesive testing system, method and device provided by the present application. The principles and implementation manners of the present application are described by applying specific examples, and the above description of the examples is only used to help understand the method of the present application and the core idea thereof. It should be pointed out that, for those skilled in the art, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the present application.

Claims

1. An adhesive testing system, characterized by, The flexible isolation plate, the peeling component and the visual identification component; the flexible isolation plate is arranged between the adhesive and the substrate, the flexible isolation plate is a hollow isolation plate to make the adhesive and the substrate form point-like bonding; The peeling component is used to peel the adhesive from the substrate; The visual identification component is used to obtain the substrate surface image after the adhesive is peeled off; color analysis is performed on the substrate surface image to determine the damage mode corresponding to each bonding point; wherein the damage mode includes adhesive body damage mode, substrate body damage mode and bonding interface separation mode; based on the proportion of the bonding interface separation mode in all damage modes corresponding to the bonding points, the test result of the adhesive is determined.

2. The adhesive testing system of claim 1, wherein, The flexible isolation plate is an integrated flexible isolation plate, the length of the flexible isolation plate is greater than the coating length of the adhesive, the width of the flexible isolation plate is greater than the coating width of the adhesive, and the flexible isolation plate is provided with uniformly distributed holes in the set area; the distance between the set area and the starting end of the adhesive coating is greater than or equal to the set distance threshold.

3. The adhesive testing system of claim 1, wherein, The flexible isolation plate is composed of a plurality of release papers with a fixed interval distance; the interval distance between adjacent two release papers is greater than or equal to the width of the release paper; the length of the flexible isolation plate is less than the coating length of the adhesive, and the width of the isolation plate is greater than the coating width of the adhesive.

4. The adhesive testing system of claim 1, wherein, It also includes a pressing component; The pressing component is used to press the adhesive after the adhesive is laid on the substrate surface, so that the coating thickness of the adhesive is less than the set thickness threshold, and the coating length of the adhesive is greater than or equal to the set length threshold.

5. The adhesive testing system of claim 1, wherein, The visual identification component is used to compare the appearance color of each bonding point on the substrate surface image with the pre-established sample color library to determine the damage mode corresponding to each bonding point; wherein the sample color library contains substrate surface color graphs corresponding to different damage modes respectively.

6. The adhesive testing system of claim 5, wherein, The visual identification component is used to count the total number of bonding points and the number of bonding points belonging to the bonding interface separation mode in all damage modes corresponding to the bonding points; The ratio of the number of bonding points to the total number of bonding points is taken as the proportion of the bonding interface separation mode.

7. The adhesive testing system of claim 6, wherein The visual identification component is used to determine that the adhesive is qualified when the proportion of the bonding interface separation mode is less than the set threshold, and to determine that the adhesive is unqualified when the proportion of the bonding interface separation mode is greater than or equal to the set threshold.

8. The adhesive testing system of any one of claims 1 to 7, wherein, The peeling component includes a peeling test fixture and a tension machine; The peeling test fixture is used to fix the starting end of the adhesive to the tension machine, and to drive the substrate to slide transversely during the peeling process of the adhesive; The tension machine is used to vertically peel the adhesive from the substrate surface at a set peeling speed.

9. An adhesive test method characterized by, It includes: Obtain the substrate surface image after the adhesive is peeled off; wherein a flexible isolation plate is arranged between the adhesive and the substrate, the flexible isolation plate is a hollow isolation plate to make the adhesive and the substrate form point-like bonding; The substrate surface image is subjected to color analysis to determine a corresponding failure mode of each bonding point; wherein the failure mode comprises an adhesive bulk failure mode, a substrate bulk failure mode, and an adhesive-substrate interface separation mode; Based on the proportion of the adhesive-substrate interface separation mode in all corresponding failure modes of the bonding points, a test result of the adhesive is determined.

10. An adhesive testing device characterized by, comprise an acquisition unit, an analysis unit, and a determination unit; The acquisition unit is configured to acquire a substrate surface image after the adhesive is peeled off; wherein a flexible isolation plate is arranged between the adhesive and the substrate, and the flexible isolation plate is a hollow isolation plate so that the adhesive and the substrate form point bonding; The analysis unit is configured to subject the substrate surface image to color analysis to determine a corresponding failure mode of each bonding point; wherein the failure mode comprises an adhesive bulk failure mode, a substrate bulk failure mode, and an adhesive-substrate interface separation mode; The determination unit is configured to determine a test result of the adhesive based on the proportion of the adhesive-substrate interface separation mode in all corresponding failure modes of the bonding points.

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