Current sensor and system

Abstract

The invention discloses a current sensor and a system. A magnetic field sensor for sensing a current flowing in a first direction, the current being divided in at least two conductor portions separated in a second direction, the sensor comprising at least two sensing elements for sensing a magnetic field at two locations in a region between the two conductor portions, the at least two sensing elements are adapted to sense the field at respective positions with highest sensitivity in a direction between 20 degrees and 160 degrees from a third direction perpendicular to both the first and second directions, where the two positions are separated by a predetermined distance in the third direction.

Description

TECHNICAL FIELD

[0001] The present invention relates to the field of magnetic field sensors for current measurement, and more specifically, to a sensor configuration for detecting a magnetic field associated with a current in a conductor. BACKGROUND

[0002] The field of current sensing is an important component of modern electrical systems, particularly in the context of increasing electrification and the proliferation of electronic devices and electric vehicles. Current sensors are vital for monitoring and controlling the current in electrical circuits, thereby ensuring safety, efficiency, and reliability across a variety of applications, from industrial automation to consumer electronics.

[0003] Integration of current sensors into electrical systems often requires consideration of factors such as the sensor’s footprint, mechanical robustness, and response to magnetic noise. Magnetic shields are often included at the sensing region to reduce the impact of magnetic noise in the sensor. However, this requires the introduction of additional parts that are fixed to the assembly, which increases the footprint of the device.

[0004] Additionally, one of the widespread problems faced in the field of current sensing is the accurate measurement of time-varying currents. As electrical systems become more complex, and the demand for precise current measurements grows, the ability to accurately sense rapidly changing currents, characterized by high rates of change over time (high di / dt), becomes increasingly important. High-frequency currents generate rapidly changing magnetic flux, which can induce unwanted voltages in nearby conductive elements. This phenomenon can lead to measurement errors and disturbances in the operation of current sensors. Induced voltages can interfere with the sensor’s ability to accurately detect the actual current flowing through the conductor, resulting in inaccurate readings and potential malfunctions in electrical systems.

[0005] Despite advancements in current sensing technology, there remains a need for further improvements to address the challenges associated with measuring rapidly changing currents and ensuring robust and accurate current sensing across a variety of applications. SUMMARY

[0006] It is an object of embodiments of the present invention to provide a current sensor package with enhanced immunity to electromagnetic noise. This object is achieved by a magnetic field sensor according to the invention.

[0007] In a first aspect, the invention relates to a magnetic field sensor for sensing a current flowing in a first direction, the current being divided among at least two conductor portions separated along a second direction, the sensor comprising at least two sensing elements for sensing a magnetic field at two locations in a region between the two conductor portions. In some embodiments, the at least two sensing elements can be adapted to sense the field at the respective locations with a highest sensitivity in a direction between 20 degrees and 160 degrees from a third direction perpendicular to both the first direction and the second direction. In some embodiments, the two locations can be separated by a predetermined distance in the third direction.

[0008] An advantage of embodiments of the invention is that external or stray magnetic fields can be compensated for without the use of large elements such as shields, or with shields having a reduced size.

[0009] In embodiments, the sensor can comprise a substrate on which the at least two sensing elements are arranged, wherein the substrate lies in a plane comprising the second direction and the third direction, wherein the sensing elements provide signals each derived from a component of the field in the plane of the substrate, the sensor further comprising processing circuitry arranged for obtaining a sensor signal, the sensor signal being computed as a difference or gradient of the signals from the sensing elements.

[0010] An advantage is that the signal of the sensor can be provided by a simple computation without requiring strong processing power.

[0011] In embodiments, the sensor can further comprise electrically conductive leads for interchanging signals between the outside and the sensor, the electrically conductive leads being elongated and extending away from the substrate in the third direction.

[0012] An advantage of embodiments of the invention is that coupling of magnetic fields to the signals from the sensor is reduced, thereby improving electromagnetic compatibility even in the presence of high frequency currents or signals in the conductors.

[0013] In embodiments, the elongated leads can comprise a set of leads aligned with the second direction.

[0014] An advantage of embodiments is that coupling of the current to be measured is further reduced. An advantage is that the leads do not form a parasitic loop.

[0015] In embodiments, each of the elongated leads can carry an analog signal or a digital signal, wherein the elongated leads extending away from the substrate comprise an end opposite to the substrate, wherein the leads carrying the analog signals are configured for redirecting the signals and connecting to a first row of connections, and wherein the leads carrying the digital signals are configured for redirecting the signals and connecting to a second row of connections of another device.

[0016] An advantage of embodiments is that the coupling of the current to be measured is further reduced.

[0017] In embodiments, all leads of the sensor can extend from the same side of the sensor.

[0018] An advantage is that all leads extend away from the conductor carrying the current to be measured on the same side for connection to a single board for further processing of the signal and / or signal output.

[0019] In embodiments, the sensor can comprise at least two integrated magnetic concentrators and at least two horizontal Hall elements for sensing the magnetic field at two locations. An advantage is that the sensing elements can be easily implemented.

[0020] In embodiments, the two integrated magnetic concentrators can be separated in a third direction and arranged such that each horizontal Hall element provides a signal representing the magnetic field in the second direction at two locations.

[0021] In embodiments, the sensor can further comprise two pairs of horizontal Hall elements, each pair of Hall elements further comprising one integrated magnetic concentrator, wherein the concentrators are separated in the third direction. An advantage is that two sensing elements are used to provide a measurement in each location, thereby improving the differential signal.

[0022] In embodiments, the sensor can further comprise two additional sensing elements adapted to sense the field in two additional locations in the area between the two conductor sections in a direction of 20 degrees and 160 degrees to the second direction perpendicular to both the first and third directions with highest sensitivity, the two additional locations being separated in the second direction by a predetermined distance.

[0023] An advantage of embodiments of the invention is that redundant signals can be used to e.g. check for errors or faults. A further advantage is that errors due to positioning can be compensated for, thereby increasing the mechanical tolerance. An advantage is that the SNR can be improved.

[0024] In embodiments, the sensor can comprise two pairs of additional horizontal Hall elements, the two pairs of horizontal Hall elements being separated from each other in the second direction, and further comprising an integrated magnetic concentrator for each pair of Hall elements separated in the second direction.

[0025] In embodiments, the sensor can further comprise two pairs of additional horizontal Hall elements separated in the second direction, thereby providing a pair of Hall elements at the top of the sensor and a pair of Hall elements at the bottom of the sensor, a pair of Hall elements at the right side and a pair of Hall elements at the left side, and further comprising four integrated magnetic concentrators, wherein each integrated magnetic concentrator is positioned for redirecting the magnetic field to two sensing elements of a different pair.

[0026] When additional sensors are used, the signals from the additional pairs of positions can be combined to obtain an improved SNR, or improved resistance to mechanical misalignment. Additionally or alternatively, these additional signals can be compared to obtain improved safety.

[0027] In some embodiments, the sensor is configured to provide at least one gradient of one component in a direction different from the component direction, the direction of the gradient and the direction of the component being in a plane perpendicular to the direction of the current generating the field.

[0028] In some embodiments, the sensing element provides a signal corresponding to the magnetic field component or direction, wherein the contribution from other components in different directions is negligible.

[0029] In some embodiments, the sensing position and / or the sensing element is located at a position close to the edge of the substrate. For example, the sensing element is located at a distance of less than or equal to 10%, or 15%, or 20% of the width of the substrate, the distance being measured from the edge of the substrate.

[0030] The sensing position is located at a position where the field generated by the conductor is less than 90% of the maximum field generated by the conductor; in other words, the sensing element is located away from the position of the maximum field. The advantage is that the differential signal is more robust to mechanical tolerances.

[0031] In a second aspect, the invention relates to the use of a sensor according to any embodiment of the first aspect for detecting a high frequency current through a conductor, the conductor comprising a hole through the conductor, the sensor being placed in the hole.

[0032] The advantage is that, for example for unshielded conductors, accurate sensing can be obtained with good SNR and good rejection of stray or external fields.

[0033] In a third aspect, the invention relates to a sensing system, the sensing system comprising a conductor, the conductor comprising a through hole surrounded by an electrically conductive material, the sensing system further comprising a sensor according to any embodiment of the first aspect, wherein the sensor is introduced inside the through hole such that the sensing element is arranged for sensing the field in at least two positions in a region between two electrically conductive parts of the conductor, wherein the at least two sensing positions follow the axis of the through hole.

[0034] In some embodiments, the area of the main surface of the SC substrate is smaller than the cross section of the conductor, and the encapsulation area is larger than the cross section of the conductor.

[0035] In some embodiments, the current from the conductor is redirected in a direction different from the longitudinal axis of the conductor. The first direction is the direction of the current through the conductor part delineating the hole. The third direction is the direction of the hole axis, and the second direction is perpendicular to the first and third directions.

[0036] In some embodiments, the sensors of the sensing system can be arranged for connection to a board (e.g. a PCB) which can be provided with its main surface parallel to the main surface of the current conductor (e.g. busbar), e.g. parallel to the conductor in a plane perpendicular to the third direction (Z).

[0037] In some embodiments, the board to which the sensors are connected can also be part of the system.

[0038] Particular and preferred aspects of the present application are set out in the appended independent claims and dependent claims. Features from dependent claims can be combined with features of the independent claims and with features of other dependent claims, as appropriate and expedient, and not only as explicitly claimed in the claims.

[0039] These and other aspects of the present application will be apparent from the (one or more) embodiments described hereinafter and will be elucidated with reference to the (one or more) embodiments described hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0040] Figure 1 is a top view of a magnetic field sensor placed within a through-hole of a conductor according to an embodiment of the present application.

[0041] Figure 2 is a side view of a magnetic field sensor and a conductor according to an embodiment of the present application, showing the sensing elements on the substrate and their spacing in the third direction (Z).

[0042] Figure 3 is a cross-sectional view of a conductor and a magnetic field sensor according to an embodiment of the present application, illustrating the connection of the sensor to a board via leads, and the orientation of the sensing elements.

[0043] Figure 4 is a detailed view of the sensor, in which the highest sensitivity axis of the sensing elements is not exactly parallel to the second direction (X).

[0044] Figure 5 is a side view of an alternative embodiment of a magnetic field sensor, whose leads are adapted to provide connection to a PCB on different rows of pads.

[0045] Figure 6 is a schematic illustration of a magnetic field sensor substrate according to an embodiment of the present application, having sensing elements in two locations separated along the third direction (Z).

[0046] Figure 7is a schematic illustration of a magnetic field sensor substrate with two pairs of sensing elements for sensing a field in two locations separated along a third direction (Z), each pair linked to an integrated magnetic concentrator (IMC), and each sensing element in a pair separated in a second direction (X), according to embodiments of the application.

[0047] Figure 8 is a schematic illustration of a magnetic field sensor substrate with two pairs of sensing elements, each element in a pair separated in a second direction (X) and linked to a respective IMC, the pairs separated in a third direction (Z), according to embodiments of the application.

[0048] Figure 9 is a similar view to Figure 3 and Figure 4 of a magnetic field sensor with four sensing locations, two sensing locations separated in a third direction (Z) and the other two sensing locations separated in a second direction (X), according to embodiments of the application.

[0049] Figure 10 is a detailed view of a magnetic field sensor substrate showing pairs of Hall elements combined with IMCs in a gradient measurement configuration for each sensing location, according to embodiments of the application.

[0050] Figure 11 is a schematic illustration of a magnetic field sensor substrate with four pairs of horizontal Hall elements, two pairs separated in a third direction (Z) and the other two pairs separated in a second direction (X), according to embodiments of the application.

[0051] Figure 12 is a schematic illustration of a magnetic field sensor substrate similar to Figure 10 where four IMCs are functionally linked to different pairs of Hall elements, according to embodiments of the application.

[0052] Figure 13 is a top view of a magnetic field sensor placed inside a via with a conductor with redirection of current, according to embodiments of the application.

[0053] In the different drawings, like reference numerals refer to like or similar elements. DETAILED DESCRIPTION

[0054] The application will be described with respect to the particular embodiments and with reference to certain drawings but the application is not limited thereto but only by the claims. The drawings described are only schematic and are non-limiting. In the drawings, the size of some of the elements can be exaggerated and not drawn on scale for illustrative purposes. The dimensions and the relative dimensions do not correspond exactly to the practical reduction of the application.

[0055] The terms first, second, third, etc. that are used in the specification and in the claims, are used for distinguishing between similar elements and not necessarily for describing the temporal or spatial order. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the application described herein are capable of operating in other sequences than described or illustrated herein.

[0056] In addition, the terms top, upper, etc. and the like in the description and in the claims are used for descriptive purposes and not necessarily for describing relative positions. It is to be understood that the terms so used are interchangeable under appropriate circumstances and that the embodiments of the application described herein are capable of operation in other orientations than described or illustrated herein.

[0057] It is to be noted that the term "comprising", used in the claims, should not be interpreted as being restricted to the means listed thereafter; it does not exclude other elements or steps. It is thus to be construed as specifying the presence of the stated features, integers, steps or components as referred to, but does not preclude the presence or addition of one or more other features, integers, steps or components, or groups thereof. Thus, the scope of the expression "a device comprising means A and B" should not be limited to devices consisting only of components A and B. It means that with respect to the present application, the only relevant components of the device are A and B. In other words, as the term is used within the application, the phrase "comprising A and B" stands for the presence of A and B, and not for the exclusion of other parts, integers, steps or components. Thus, the term "comprising" as used herein means the presence of the stated features, integers, steps or components as referred to, but the application does not exclude the presence or addition of one or more other features, integers, steps or components, or groups thereof. As used herein, the term "and / or", comprises any and all combinations of one or more of the associated listed items.

[0058] Similarly, it is to be noted that the term "coupled" is not intended to limit the component to which it is used in the description and / or claims to direct connection only. The terms "coupled" and "connected", along with their derivatives, can be used. It should be understood that these terms are not intended as synonyms for each other. Thus, the statement "device A is coupled to device B" does not exclude the possibility of intervening devices or intervening components between device A and device B. "Coupled" can mean that two or more elements are either in direct physical or electrical contact, or that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other.

[0059] References throughout this specification to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment, however. Furthermore, the particular features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0060] Similarly, it is to be appreciated that, wherever the description herein refers to a process, method, article, manufacturing, or compositions being "comprised of", "comprising", "including", "containing", "having" or "consisting of" or the like, it is understood that the alternative "consisting essentially of" or "consisting of" can be employed. Where appropriate, aspects of the present application encompassed within the scope of the claims can be further defined by additional limitations and / or exceptions in conjunction with the

[0061] Furthermore, although some embodiments described herein include some features of other embodiments that are described herein, yet other embodiments of the application do not include those features. Thus, those of ordinary skill in the art will recognize that many modifications and other embodiments are possible within the scope of the application, and the embodiments described herein have been chosen for purposes of illustration only and not for purposes of limitation, and that this application is not limited to the particular embodiments described in the above detailed description or illustrated in the accompanying drawings.

[0062] In addition, some of the embodiments described herein are described as methods or combinations of elements of methods that can be implemented by a processor of a computer system or by other means of carrying out the function(s) described in the elements of the methods. Thus, a processor with stored logic of a computer system that is used to implement some or all of the described elements of the method(s) forms means for implementing some or all of the elements of the methods, and each differentiated element of the method(s) is an example of a corresponding means for implementing the function(s) performed by that element of the method(s). In addition, combinations of means for performing the functions described in the elements of the methods are intended to be within the scope of the application.

[0063] In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application can be practiced without these specific details. In other instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

[0064] The following terms are provided solely to aid in the understanding of the present application.

[0065] As used herein, and unless otherwise specified, the term "magnetic field sensor for sensing current flowing in a first direction (Y)" refers to a device or component designed to detect the presence and characteristics of a magnetic field generated by current flowing primarily in a specified direction that is parallel to an axis labeled as the Y-axis. Such sensors can be Hall-effect based sensors, magnetoresistive based sensors (TMR, AMR, etc.), and fluxgate based sensors, without limitation. Such sensors can detect magnetic fields produced by direct current (DC), alternating current (AC), or pulsed current.

[0066] As used herein, and unless otherwise specified, the term "at least two conductor portions separated in a second direction (X)" refers to segments or portions of an electrical conductor that are physically distinct and spaced apart along an axis or line labeled as the X-axis, which is orthogonal to the Y-axis. For example, this can include two separate wires, traces on a printed circuit board, or portions of a conductive path designed to carry current.

[0067] As used herein, and unless otherwise specified, the term "at least two sensing elements for sensing magnetic fields at two locations in an area between two conductor portions" refers to components within a magnetic field sensor that are capable of detecting magnetic fields and are positioned at two different locations within an area defined by the boundary between two separate conductor portions. For example, the sensing elements can be confined to the projection of the aperture in the XY plane (e.g., top view), although one or both sensing locations can be outside the aperture on each side of the conductor. In some embodiments, the sensing elements can be confined within the aperture, thereby being confined in the projection of the aperture in the XY plane and in the XZ plane.

[0068] These sensing elements can be, for example, Hall-effect sensing elements, magnetoresistive sensing elements, or any other type of magnetic field sensing component. The term "horizontal Hall elements" refers to Hall-effect sensors that are oriented such that their active sensing area lies in a horizontal plane when the sensor is positioned in its intended operating orientation. These elements can detect magnetic field components that are perpendicular to their active sensing area.

[0069] As used herein, and unless otherwise specified, the term "substrate" refers to a base material or layer on which the sensing elements and possibly other components of the sensor are mounted or fabricated. The substrate can be made of a material such as a semiconductor (SC) such as silicon, ceramic, glass, polymer, or any suitable insulating or semiconducting material that provides mechanical support and possibly electrical isolation for the components. The substrate can be a leadframe. The sensing elements can be disposed on the leadframe, adjacent to the SC die, and electrically connected to the SC die.

[0070] As used herein, and unless otherwise specified, the term "processing circuitry" refers to electronic circuitry or systems capable of receiving signals from a sensing element, performing calculations or operations on those signals, and outputting resulting sensor signals. The processing circuitry can include analog or digital components, such as amplifiers, filters, analog-to-digital converters, microprocessors, or any combination thereof. The processing circuitry can be disposed in a substrate. For example, the substrate can be implemented as a CMOS integrated circuit. The processing circuitry can be programmed for providing readable signals to an output based on signals generated by the sensing element.

[0071] As used herein, and unless otherwise specified, the term "magnetic concentrator" refers to a material or structure incorporated into a sensor for the purpose of enhancing the magnetic field in the vicinity of the sensing element. These concentrators can be made of high magnetic permeability materials such as ferrites or permalloys, and are designed to focus or direct magnetic field lines in order to improve the sensitivity and accuracy of the sensor. They can be integrated with the sensing element in a substrate, for example in a semiconductor (SC) substrate, hence in the present disclosure they are referred to as integrated magnetic concentrators (IMC), the present invention is not limited to concentrators integrated in SC chips.

[0072] As used herein, and unless otherwise specified, the term "electrically conductive lead" or simply "lead" refers to an elongated electrically conductive path or wire used to transmit electrical signals provided by the sensor to external devices or systems. These leads can be made of metals such as copper, aluminum, gold, or any other electrically conductive material suitable for carrying electrical signals.

[0073] As used herein, and unless otherwise specified, the term "packaged sensor" refers to a magnetic field sensor that has been enclosed or sealed in a protective housing or package, which can provide mechanical protection, environmental isolation, and possibly electrical connections to external circuitry. Such a package can be made of materials such as plastic, ceramic, or metal, and can be designed to meet specific standards for durability, thermal management, and electrical performance.

[0074] As used herein, and unless otherwise specified, the term "use of sensors for detecting high frequency currents" refers to the application or employment of magnetic field sensors in a manner that enables the detection and measurement of high frequency alternating or changing direction currents, the high frequency range can be in the range of thousands to millions of cycles per second (kilohertz to megahertz). This includes the use of sensors in various industrial, commercial, or research settings that require monitoring of high speed electrical signals or power distribution.

[0075] The application will now be described by way of detailed description of several embodiments of the application. Obviously, other embodiments of the application can be configured according to the knowledge of the person skilled in the art, without departing from the technical teaching of the application, the application being limited only by the terms of the appended claims.

[0076] The present application relates to current sensors and sensing systems based on magnetic field detection and monitoring. A magnetic sensor picks up the magnetic field in the vicinity of a conductor, and the value of the field is used to measure the current through the conductor, which is the intended field source. Since there can be other sources of magnetic fields (e.g. nearby electrical equipment, noise and other electromagnetic interferences, etc.), existing sensing systems typically include a shield around the sensor to block these parasitic contributions. The shield typically comprises one or more ferromagnetic plates. The present application does not require such a shield, or if present, allows to reduce the size of such a shield, thus reducing the material and allowing a more compact implementation. This is provided by the specific layout and signal processing enabled by the sensor.

[0077] The sensor is adapted to be introduced in a through hole in the conductor. The current through the conductor (e.g. through a portion of the conductor at the side of the sensor) follows a first direction Y, a second direction X being perpendicular to the first direction Y and to the direction of the hole, which follows a third direction Z. Overall, the second direction X is the direction of the spacing between two portions of the conductor.

[0078] The sensor comprises sensing elements forming at least one pair spaced apart in a given direction in a plane perpendicular to the current generating the field, the sensed component being perpendicular to the spacing direction. The sensed component at the sensing location has a direction perpendicular to the spacing direction. When there are additional sensing elements, each pair senses a field component perpendicular to the respective direction in which the pair of elements is spaced apart from each other.

[0079] The sensor is configured (e.g. by appropriate connections, by processing, etc.) to provide a gradient of the field component, the direction of the gradient being perpendicular to the direction of the component, both the component and the spacing direction being in the same plane, which is perpendicular to the current generating the field.

[0080] In embodiments, only the field component having a direction perpendicular to the spacing direction is actually sensed. When there are additional sensing elements, each pair of sensing elements can only sense the field in a direction perpendicular to the respective spacing direction. In other words, the sensing elements are adjusted so that the contribution of other components from the field to the signal is negligible.

[0081] In some embodiments, the sensor comprises sensing elements adapted to sense the field with highest sensitivity in the second direction X in the plane comprising the sensing elements. In other words, the highest sensitivity of the sensing elements is achieved in the same direction X in the same plane XZ in which the sensing elements are provided. This direction need not be exactly perpendicular to the direction of the hole and to the direction of the current i to be measured, but it can have a directional tolerance. The highest sensitivity can be between 20 and 160 degrees from the third direction (Z). The sensing elements are configured or designed such that their maximum sensitivity to the magnetic field is oriented at an angle between 20 and 160 degrees with respect to an axis or line denoted as the third direction Z. This orientation allows the sensing elements to detect magnetic field components that are not strictly aligned along the Z axis. Preferably, the highest sensitivity follows the second direction X (thus, at 90 degrees from the Z direction), as the symmetry is higher and the signal does not need to be processed as much to enhance the noise cancellation. In embodiments of the invention, the directions are defined in the XZ plane, so the component of the highest sensitivity of the sensor in the first direction Y can be negligible.

[0082] Due to the configuration of the sensing elements, the parasitic contribution to the magnetic field generated by the current conductor from external stray fields is cancelled. For example, the sensor measures dBx / dz. This can be obtained by measuring the field Bx1 at a first position and the field Bx2 at a second position. Then, the difference is obtained from the analog signal or from the digital signal, for example Bx1 - Bx2. Thereby, for example a constant external stray field contributes at both positions cancel each other out.

[0083] Figure 1 A top view of a sensor 100 surrounded by two conductor portions 201, 202 is shown, for example within a through hole 210 provided on a conductor 200, which in this example is a flat conductor such as a busbar. It has a width Wc and extends in a longitudinal direction, which in this example is the direction of the current. The longitudinal direction and the width correspond to the first and second directions of the plane XY (the first direction is the direction Y in the figure). In some embodiments, the hole is centered, so the conductor portions surrounding the sensor have the same width, so the system has symmetry. However, the hole can not be exactly centered; for example, a correction factor can be applied in these cases.

[0084] Figure 2A side view of the previous conductor and sensor is shown. The thickness Tc of the busbar is shown. The figure shows at least two sensing elements 101, 102 on a substrate 300, which can be a planar substrate, for example a SC substrate. They are separated by a distance e in a third direction Z perpendicular to the first Y and second X directions. The sensing elements sense the field in two locations within the aperture, which means that both locations are at a predetermined distance a, b from the respective surfaces A, B of the conductor, the distance e between the elements being less than the thickness Tc of the conductor. In some embodiments, the locations are at the same distance from the surfaces, so a = b. The sensor can be a packaged sensor, so the substrate, and optionally the sensing elements, can be covered by a package 103. The sensor package can be longer than the aperture, so it can protrude outside the aperture through one or both sides of the aperture (as shown), or the package can be entirely inside the aperture.

[0085] In some embodiments, one or both sensing elements can also be outside the aperture, so for example, the top sensing element can be above surface A, as long as the sensing elements can detect the field in two different locations separated by the third direction Z, and within the area between the two conductive parts 201, 202. However, if the relative sizes of the parts allow, it is preferred that both sensing elements are at a predetermined distance a, b from the conductor surfaces and inside the aperture, in order to improve the signal to noise ratio (SNR).

[0086] The sensor can include pins or leads 301 for connecting to a board 400, for example a PCB, to interchange signals with the outside. The PCB 400 can be separated from the conductor 200 by a predetermined distance Ti, for example between 0.5 mm and 4 mm; in the embodiment of the figures, the conductor and the PCB are parallel. For example, the PCB can be set so that its main surface is parallel to the main surface of the current conductor (for example, the busbar). The leads 301 extend towards the PCB (for example, in the third direction Z). They can extend from the same side of the sensor. For example, the leads can be provided on only one side of the package. The leads are connected to certain rows of connections 410 provided on the PCB, however, the invention is not limited to this, as shown below. Figure 5 Some of the leads are adapted to be connected to different areas of the board, including contacts separated in the Y direction, etc. In some embodiments, the leads provide flexibility in the choice of height with respect to the PCB (and with respect to the height of the sensing locations in the aperture of the conductor). These heights can be controlled using protrusions (for example, stamped pins).

[0087] The elongated leads 301 can comprise a set of leads forming a single row aligned with the second direction (X), thereby forming a configuration in which the conductive leads are arranged in a linear array or sequence extending along the X axis, thereby facilitating organized connection and possibly simplifying the layout of the sensors within the system. As they extend perpendicularly with respect to the current and to the second direction X, the leads are arranged for preventing the formation of parasitic loops, thereby eliminating the induced voltage due to the varying magnetic flux, in particular induced by fast current variations in the conductor. This allows the use of the sensor to detect high frequency currents with high accuracy, as the parasitic loops of the magnetic field on the leads are reduced or avoided. In some embodiments, the leads 301 form a row in the second direction X, as shown in Figure 3

[0088] Due to the arrangement of the leads in the mechanical coupling between the sensor and the PCB (for example with respect to the current), the performance of the sensor and its immunity to fast current transients are improved. As the leads do not form parasitic loops, the magnetic flux is reduced or zero; (dphi / dt) = 0.

[0089] In more detail, Figure 3 is a cross-sectional view of the conductor, the hole of the conductor and the sensor 100, which shows the front of the sensor facing the sensing elements. The sensor 100 is connected to the board 400 via the leads 301. This perspective view clearly shows that the sensing elements 101, 102 sense the magnetic field at two locations in the Z direction and on the XZ plane, the two locations being separated by a distance e. The arrows at the sensing elements indicate the direction of the detected magnetic field; due to symmetry, the magnetic field has opposite directions at the two locations. The detected axes, corresponding to the highest sensitivity direction of the respective sensing element, can point in the same direction. They are defined on the same second direction X. The gradient measurement (or differential) configuration of the sensor allows to provide an output signal by combining the signals of the sensing elements. In any case, the output signal provided by the sensor is the gradient or difference of the signals measured by the sensing elements (for example, dBx / dz = Bx1 - Bx2) resulting from the analog or digital processing of the sensing elements signals. In Figure 3 the direction of the highest sensitivity follows the second direction X. However, the present invention is not limited to this.

[0090] Figure 4 An example of a sensor 110 with sensing elements 111, 112 is shown, such that the direction of the highest sensitivity does not exactly match the second direction X, thereby forming an angle v between 20 degrees and 160 degrees (for example about 45 degrees) with the third direction Z. In this configuration, which is also a gradient measurement configuration, the field can be detected at 45 degrees with respect to the second direction X. Due to the higher symmetry, an advantageous embodiment is Figure 3 ​In some embodiments, the angle is 90 degrees. In some embodiments, each element has a highest sensitivity direction with a different orientation (e.g., opposite orientations as shown) so the signals can be easily processed to obtain a final reading. However, as before, they can also have the same orientation.

[0091] In some embodiments, the sensing locations and / or sensing elements are located away from the center of the substrate. For example, these can be near or adjacent to an edge of the substrate, such as a semiconductor substrate. For example, the sensing elements can be located at a distance that is less than or equal to 10%, or 15%, or 20% of the width "ws" of the substrate, the distance being measured from an edge (e.g., the nearest edge) of the substrate.

[0092] In some embodiments, the sensing locations are adapted to detect magnetic fields that are below the maximum field provided by the conductor. For example, at the sensing locations, the field generated by the conductor for a predetermined current is less than 90% of the maximum field generated by the conductor for the same current. For example, the sensing elements can be located away from the location of the maximum generated magnetic field. In this way, the differential signal is more robust to mechanical tolerances.

[0093] In some embodiments, as shown in Figure 3 or Figure 4 The area of the major surface of the SC substrate 300 is less than the area of the cross-section of at least one (or both) of the conductor portions 201, 202. Additionally, for the same cross-section, the area of the package 103 can be greater than the area of the cross-section of the conductor portions.

[0094] Figure 5 Side views of two alternative sensors 120, 130 are shown, in which the leads 311, 312, 313, 314 are adapted to be connected to multiple rows of pads in the board. In the example embodiment on the left, the leads 311, 312 of the sensor 120 extend from a single row. The ends of some of the leads opposite the substrate are adapted to be connected to a first row of pads, while the ends of the other leads can be adapted to be connected to pads of a different row. For example, the ends can be bent, or can extend with feet, as shown. In some embodiments, in the example embodiment on the right, the leads 313, 314 of the sensor 130 form two rows. The ends can also be bent, the application not being limited in this regard. For example, the contacts can be made by press-fit connectors. In some embodiments, the pads of one row exchange digital signals, while the pads of the different row exchange analog signals. Thereby, the leads adapted to contact the same row carry the same type of signal (e.g., digital or analog). Since the signals are separated, there is no loop between the analog pads, and no loop between the digital pads. The contribution of dI / dt is reduced or even cancelled in each domain. The only remaining parasitic loop is formed between the two domains, which has a relatively low impact on the sensor operation. Thereby, the signal-to-noise ratio is increased.

[0095] Figures 6 to 8 Three different distributions of sensing elements in the sensor of the application are shown. The signals from the sensing elements are processed to provide a measure from the current through the conductor while cancelling noise contributions. The sensor output is proportional to dBx / dz, for example, the output of the sensor is equal to k.dBx / dz, where k is a predetermined calibration factor. The magnetic field is sensed in two locations spaced along the Z direction, which are disposed on the major surface of the substrate in the XZ plane. For example, dBx / dz can be obtained from the difference of the field at the two sensing locations, i.e. Bx1-Bx2. Hall elements can be used, in particular horizontal Hall elements with their maximum sensitivity axis perpendicular to the substrate, in other words horizontal Hall elements following the first direction Y, as they are perpendicular to the substrate extending in the plane XZ. The elements are denoted by H1, H2... They are combined with IMCs in different configurations for sensing the field at these locations in the desired direction. However, as mentioned earlier, other types of sensing elements can be used, whether combined with IMCs or not.

[0096] Figure 6 The sensing locations in each of the 2 locations spaced in the third direction Z in the gradient meter configuration are shown. The disposition of the IMCs 113, 114 relative to the respective sensing elements H1, H3 is such that the axis of the magnetic field detected by the sensing elements is rotated around the Z direction. In other words, when the IMC is combined with a horizontal Hall element, the IMC reorients the field, so the element detects both Bx and By (as the maximum sensitivity axis of the plate and the IMC are at 45 degrees). When taking the difference, only the differential field remains. From this, the difference of the response of each element H1-H3 is proportional to dBx / dz (both common mode Bx and By are cancelled).

[0097] Figure 7 Two pairs of sensing elements are shown, the first pair H1, H2 linked to a first IMC 113 and the second pair H3, H4 linked to a second IMC 114. Each pair of elements is spaced in the second direction X on opposite sides of their respective IMC. The pairs (and corresponding IMCs) are spaced in the third direction Z following the axis of the via. The top pair of sensing elements H1, H2 around their IMC 113 can be used to provide a sensing signal Bx1 at this first location (e.g. as H1-H2). The bottom pair H3, H4 provides a second sensing signal Bx2 at the second location (e.g. as H3-H4). Both signals represent a component of the field in the second direction X. As shown in the previous figures, the signal dBx / dz can be obtained (e.g. the difference of the outputs of the top and bottom pairs, e.g. (H1-H2)-(H3-H4)).

[0098] Figure 8 The sensing locations in each of the 2 locations spaced in the third direction Z in the gradient meter configuration are shown. The disposition of the IMCs 113, 114 relative to the respective sensing elements H1, H3 is such that the axis of the magnetic field detected by the sensing elements is rotated around the Z direction. In other words, when the IMC is combined with a horizontal Hall element, the IMC reorients the field, so the element detects both Bx and By (as the maximum sensitivity axis of the plate and the IMC are at 45 degrees). When taking the difference, only the differential field remains. From this, the difference of the response of each element H1-H3 is proportional to dBx / dz (both common mode Bx and By are cancelled). Figure 7Similar distribution, however each sensing element is associated with an IMC, instead of each pair of sensing elements being associated with one IMC. In detail, two pairs of sensing elements are provided, the elements H1, H2 of the top pair being spaced apart from each other in the second direction X, each element H1, H2 being linked to a respective IMC 115, 117, the IMCs 115, 117 being arranged so that the component of the magnetic field in the second direction X is measured, and elements H3, H4 are also arranged next to respective IMCs 116, 118 in the same way. Thereby, the two pairs are arranged for measuring said component (Bx) of the field at each of the two positions separated along the Z direction. In this example, each pair of sensing elements (i.e. H1 and H2, and H3 and H4) can be arranged next to each other, e.g. directly next to each other.

[0099] The following is an exemplary signal processing for the embodiment of Figure 6 :

[0100] H1 = gx.Bxext+ gy.Byext+ gx.Bx_i

[0101] H2 = -gx.Bxext+ gy.Byext- gx.Bx_i

[0102] H3 = gx.Bxext+ gy.Byext- gx.Bx_i

[0103] The following is an exemplary signal processing for the embodiment of Figure 7 and the embodiment of Figure 8 :

[0104] H1 = gx.Bxext+ gy.Byext+ gx.Bx_i

[0105] H2 = -gx.Bxext+ gy.Byext- gx.Bx_i

[0106] H3 = gx.Bxext+ gy.Byext- gx.Bx_i

[0107] H4 = -gx.Bxext+ gy.Byext+ gx.Bx_i

[0108] S = (H1 - H2) - (H3 - H4) = (2.gx.Bxext+ 2gx.Bx_i) - (2.gx.Bxext- 2.gx.Bx_i)

[0109] = 4.gx.Bx_i (dBx / dz)

[0110] Factors gx and gy are proportionality or signal conversion factors (e.g., including magnetic gain provided by the IMC, if these exist). Bxext and Byext are noise contributions. Notably, the noise contribution Bzext (Bzext outside) to the magnetic field in the third direction (Z) is negligible because the structure is assumed to be well aligned, so the field components in the third direction (Z) are unaffected at the sensing position. For example, in the case of a horizontal Hall element, the components in the third direction (Z) may be perpendicular to the sensitivity axis of the sensing element itself, so such components are not detected. However, even if there is a residual contribution to the signal, this combination will cause the noise contribution of the magnetic components in the third direction (Z) to be canceled out. Bx_i is the contribution from the current. The sign of the contribution from the current stems from the fact that the sensing element senses the field from the current at each section 201, 202 of the conductor, because the magnetic field contribution generated by each conductor section at each sensor position has the opposite sign.

[0111] The inventors have discovered that, despite the use of an IMC that introduces magnetic non-ideals (such as hysteresis and saturation), the configuration of the present invention provides reliable readings even at high-frequency currents.

[0112] Sensor configurations can vary from a single pair of sensing elements to multiple pairs in a gradient measurement arrangement. Additional signals can be used for redundancy, SNR improvement, or reduction of errors due to mechanical tolerances. Different configurations are shown in the figure below.

[0113] Figure 9 and Figure 10 An example with four sensing positions is shown, two of which are separated in the third direction Z, while the other two are separated in the second direction X.

[0114] Figure 9 The schematic cross-sectional view shows, for example Figure 3 The conductors and sensors connected to the board. Figure 9 The sensor in the diagram shows four measurement positions. The sensing element closest to the orifice provides signal S1 from two sensing positions, as shown in, for example... Figure 3 As shown in the diagram. Another set of sensing elements 104, 105 is positioned closest to the conductor portion, preferably within the aperture, and spaced apart in the second direction (X). The direction of maximum sensitivity is... Figure 3 The same arrow indicates the direction.

[0115] However, similar to the vertical pair, the sensing elements 104 and 105 of the horizontal pair have the highest sensitivity in directions forming 20 degrees and 160 degrees with respect to the second direction (X) perpendicular to both the first direction and the third direction (Z). Preferably, the angle is 90 degrees, so the direction of maximum sensitivity of the additional sensing element will be the third direction (Z).

[0116] The top and bottom sensing positions are used to obtain a first signal S2, and the right and left sensing positions provide a second signal S1, whereby:

[0117] S1 = Bz1 - Bz2

[0118] S2 = Bx1 - Bx2

[0119] The signals S1 and S2 can also be seen as the gradients dBz / dx, dBx / dz, respectively.

[0120] Figure 10 The sensing elements on the substrate are shown in detail, wherein a pair of Hall elements is combined with one IMC for each sensing position. As explained earlier, the difference of the signals obtained by the opposing pairs of sensing elements (corresponding to opposing IMCs) provides the first signal S1 and the second signal S2. In particular, the top sensing element pair HH5, HH6 and the corresponding bottom pair HH7, HH8 are separated by a top IMC 123 and a bottom IMC 124, each pair providing the sensing element signals Bz1 and Bz2 from which the first signal S1 is obtained, respectively. The same applies to the left and right pairs, whose IMCs 121, 122 are separated in the second direction X. The sensing elements and IMCs can be configured relative to each other, thus providing the direction of highest sensitivity in the direction as specified in Figure 9 For example, for the top and bottom pairs, the horizontal Hall elements HH5, HH6, HH7, HH8 can be arranged opposite to each other in the second direction X in each pair, and the additional Hall elements HH1, HH2, HH3, HH4 of each pair can be separated in the third direction Z, with the respective IMC 123, 124 in between.

[0121] Figure 11 and Figure 12 Two further substrates using four pairs of horizontal Hall elements are shown for use in embodiments of the application. Two pairs of horizontal Hall elements are positioned on a top position and a bottom position (the pairs are separated in the third direction Z), the Hall elements are configured such that the sensitivity follows the second direction X. The other two pairs are separated in the second direction X, centered with respect to the distance between the top and bottom elements.

[0122] Figure 11 An embodiment is shown in which each Hall element HH1, HH2,..., HH8 is linked to an IMC 131, 132,..., 138. This embodiment is similar to the one shown in Figure 10

[0123] For Figure 11 ​of the embodiments, the components are obtained from the signals of the sensing elements (also applicable to Figure 10 of the embodiments).

[0124] Bz1 = HH1 - HH2

[0125] Bz2 = HH3 - HH4

[0126] Bx1 = HH5 - HH6

[0127] Bx2 = HH7 - HH8

[0128] Alternatively, one IMC can be used in more than one position to provide high sensitivity in different directions, e.g. in the vertical directions X, Z. For example, Figure 12 embodiments similar to the embodiments in Figure 11 , where the gradient measurement configuration and signal processing are similar to Figure 11 to obtain each of the two signals. However, as shown in Figure 12 , four IMCs are provided and each IMC is functionally linked with the Hall elements in a different pair. In a particular example of Figure 12 , one of the Hall elements of the top pair or the bottom pair shares an IMC with a Hall element of the right element pair or the left element pair.

[0129] For embodiments of Figure 12 , the components are obtained from the signals of the sensing elements, as for the embodiments of Figure 11 .

[0130] Embodiments showing two pairs of sensing positions separated in the second direction (X) in the third direction (Z) respectively provide a signal S1 and S2 for each pair of sensing positions. As mentioned earlier, the signals can be used for improved SNR or improved resilience to mechanical misalignment, e.g. by combining the two signals S1, S2. Additionally or alternatively, the signals can be used for improved safety, e.g. by comparing the signals, for detecting e.g. irregularities or an increase in noise. In some embodiments, the signals can additionally or alternatively be output separately.

[0131] With regard to Figures 9-12 , it is noted that the spacing between the elements in one pair can be equal to the spacing between the elements in the other pair. Alternatively, the spacing for the different pairs can be different. For example, the spacing between the elements separated in the third direction Z can be lower than the spacing between the elements separated in the second direction X, or the spacing between the elements separated in the second direction X can be lower than the spacing between the elements separated in the third direction Z. An advantage is that the sensed signal is optimized according to the via size.

[0132] In the drawings, a circular IMC is shown, however different shapes (e.g. an elongated shape) can be used for the IMC. In other embodiments, no IMC is used. Furthermore, the invention is not limited to Hall elements, and other sensing elements can be used.

[0133] The sensor in embodiments of the invention can comprise a packaged integrated circuit IC (e.g. a CMOS IC) comprising sensing elements sensitive to components in both directions perpendicular to the axis of the via (third direction Z) and the current (first direction Y). The sensing elements are arranged to sense the field in different positions, which are spaced apart across the axis of the via. The signal is obtained as a gradient or difference of the signals provided by each sensing element. The sensing elements are arranged on an XZ plane along a substrate, which can be a SC substrate. It can be an IC with sensing elements comprising e.g. a processor for processing the signals provided by the sensing elements. Optionally, one or more IMCs can be provided on the substrate. The IC can be molded, thereby forming a current sensor package capable of accurately measuring time-varying currents with high di / dt, while minimizing the influence of spurious induced voltages due to varying magnetic flux. Such a sensor improves the reliability and accuracy of current sensing in applications driven by electrification, such as electric vehicles and renewable energy systems.

[0134] The sensing in the XZ plane allows the influence of parasitic loops to become negligible, and if an IMC is provided, the sensing is improved due to the magnetic gain in the plane provided by the IMC in its elongated direction. The IMC can be a circular plate with a diameter d and a thickness w, where the thickness is much smaller than the diameter. For example, the aspect ratio is higher than 5, e.g. or 10. Other shapes can be used. The aspect ratio of the IMC (thin and elongated in the XZ plane) provides the magnetic gain in the XZ plane. The IMC can be provided on the substrate by known techniques, such as deposition techniques (including electroplating or sputtering).

[0135] In some embodiments, the sensor is designed to sense two in-plane magnetic field components and to calculate a gradient or difference, where a processing circuit outputs a signal indicative of the current based on the magnetic field gradient or difference. Leads (e.g. arranged to minimize current loops) are used to interchange signals between the sensor and the outside. Press-fit connections can be used to attach the sensor to a board for output of the sensor signals.

[0136] The sensor package measures the magnetic field gradient inside the via of a conductor, converting it into a current measurement with improved immunity to fast transients (di / dt). The use of elongated leads and the specific arrangement of the sensing elements minimizes the induction of spurious voltages. The redundancy provided by multiple gradient meters improves the signal-to-noise ratio and reduces errors due to mechanical tolerances.

[0137] The current sensor package provides enhanced immunity to fast current transients, is able to accurately measure high currents with high frequencies, and reduces induced voltage errors. The sensor can be advantageously used in applications requiring precise current measurement in environments with strong magnetic interference.

[0138] The sensor in embodiments of the invention measures the change in the components in the plane (the plane of the substrate that provides the sensing elements) by providing a measurement of the components of the field at a location and calculating their difference or gradient, thereby producing a signal indicative of the current flowing in the conductor. The sensor package performs reliably in real-world applications where fast transient detection is critical, such as in electric vehicles or renewable energy systems. The elongated leads are configured to reduce or prevent parasitic induction. The redundancy provided by the multiple gradient meters enhances the signal-to-noise ratio and reduces measurement errors due to mechanical tolerances.

[0139] In a second aspect, the invention provides a sensing system comprising a sensor according to embodiments of the first aspect of the invention. The sensing system comprises: an assembly or arrangement comprising a conductor having a specific feature, such as a via; and a magnetic field sensor as described in the first aspect of the invention. Preferably, the via is centered such that the same thickness of the conductor is left on each side of the hole, the invention is not limited to this.

[0140] The system is designed to measure or monitor the magnetic field generated by the current flowing through the conductor, with the sensor positioned in a strategic location relative to the conductor to achieve the desired sensing performance. The sensor can be an integrated circuit (IC) with a package of at least two magnetic sensing elements, and a processing circuit. The IC is positioned between two conductor sections, inside the via, while the magnetic sensing elements are spaced apart in the thickness or Z direction. In some embodiments, one or both sensing elements are inside the hole. However, one or both sensing elements can be on opposite sides of the conductor outside the hole, with the IC remaining with the sensing elements disposed inside the hole.

[0141] The elements have a sensitivity axis perpendicular to the direction of the current and the direction of the axis of the hole. The IC surface is perpendicular to the current in the XZ plane. Notably, the direction of the current refers to the direction of the current through the section that delineates the hole. As shown in Figure 1 the direction can be parallel to the longitudinal axis of the conductor. However, in some embodiments, the current from the conductor can be "redirected" in a direction different from the longitudinal axis of the conductor. Figure 13The embodiment in FIG. 2 shows a conductor 220 and a hole 221 in which the sensor 140 is included. Two grooves 222, 223 open on opposite sides of the conductor, to the left and right of the hole in the conductor. The direction of the conductor portions 224, 225 is in this embodiment defined by the grooves and the hole. Thereby, the current "i" passes through the grooves and is redirected. In this case, the first direction (Y) is defined by the current in the portions, which is a direction perpendicular to the longitudinal axis of the conductor (and as mentioned before, perpendicular to the hole). Similarly, the second direction X is defined by the spacing between the conductor portions 224, 225, as mentioned before.

[0142] The orientation of the sensor 140 is made as mentioned before, with the sensing locations spaced in the second direction (X), thereby in the direction between the conductor portions, and preferably in a plane perpendicular to the first direction (Y). Said first direction (Y) is the direction of the current through the conductor portions, in the embodiment of FIG. 2 perpendicular to the longitudinal axis of the conductor. For embodiments of the sensor comprising Hall elements and IMC, the previous explanation regarding the direction of highest sensitivity still applies, however taking into account the definition of the first direction (Y) as shown in FIG. 2. Figure 13 Figure 13

[0143] The sensing elements comprise Hall plates (e.g. horizontal Hall plates with integrated magnetic concentrators and / or other elements such as vertical Hall elements), magnetoresistive (such as TMR, GMR), fluxgate,...

[0144] A printed circuit board (PCB) can be used to extract the signals from the sensor, with its main surface parallel to the axis of the current conductor. In embodiments in which the conductor comprises a flat surface (e.g. in the case of a busbar), the PCB main surface can be parallel to the main surface of the current conductor. In some embodiments, an isolation region (such as air or plastic) can be maintained in the space Ti left between the PCB 400 and the conductor 200 (see e.g. FIG. 4). Figure 2 The molded part of the current sensor (including the IC) is at least partially inside the hole, and electrically and mechanically coupled to the PCB through a plurality of elongated leads.

[0145] In general, the invention provides a magnetic field sensor for sensing a current passing through a conductor. The current is divided in two conductor portions separated by a gap in which the sensor is placed. The invention allows to reduce noise by appropriately orienting different parts of the sensor with respect to each other (e.g. by orienting the sensing locations), so that the sensor has a gradiometric measurement configuration.

[0146] ​​For example, the sensor comprises at least two sensing elements for sensing the magnetic field at two locations in the area between the two conductor sections. They are laid out in a plane perpendicular to the direction of the current. Their highest sensitivity points approximately in the direction of the separation of the conductors, although they can be in any direction within + / - 70 degrees of the direction of the separation. The sensing locations are both coplanar and separated in a direction perpendicular to the direction of the separation of the conductors (notably, the directional range of the highest sensitivity is within 20 and 160 degrees of the third direction, which is the direction of separation between the sensing locations).

[0147] The sensor is provided as a packaged chip, with its leads extending from one side of the package away from the sensing locations, for connection to a board that can extend parallel to the conductors. The package can be known from the art, however the leads can extend coplanar to each other, forming one or two rows. As explained with reference to Figure 5 In particular, in the embodiment on the right, the leads can extend in two rows towards the substrate, or they can extend as a single row. Advantageously, such a configuration provides for leads carrying signals. Due to the relative orientation of the leads that prevents the formation of parasitic loops, these are hardly or not at all affected by currents through the target conductors, even if carrying high frequency currents. Leads carrying analog signals and leads carrying digital signals (the analog and digital signals are exchanged between the sensor and the substrate (sent to or from the sensor)) can be connected to two different rows in the substrate, one row of connectors (e.g. pads) for each type of signal. The leads can be adapted to be connected to these pads, for example, by forming two rows, or with one row but with extensions or feet or bent portions, etc., such that some leads are connected to a row of pads, while other leads are connected to another row of pads.

[0148] This configuration of leads provides advantageous immunity to external noise and to high frequencies, as such. Such a configuration can also be combined with the differential configuration described with reference to Figures 6 to 8 The signal output of a sensor that combines both the layout of the leads and the layout of the sensing locations has high immunity to external noise and allows accurate measurement of the current at high frequencies.

[0149] It should be understood that while preferred embodiments, specific configurations, and materials are discussed herein for apparatuses according to the present application, various changes or modifications can be made in form and detail without departing from the scope of the application. For example, any formulas given above are merely representative of procedures that can be used. Functionality can be added or deleted from the block diagrams or processes, and operations can be interchanged among functional blocks or processes. Steps can be added or deleted to methods described within the scope of the application.

Claims

1. A magnetic field sensor (100) for sensing an electric current (i) flowing in a first direction (Y), the electric current (i) being divided among at least two conductor portions (201, 202) separated along a second direction (X), the sensor comprising at least two sensing elements (101, 102) for sensing a magnetic field at two locations in a region between the two conductor portions, wherein, The at least two sensing elements are adapted to sense a field at a highest sensitivity at respective positions in a direction between 20 and 160 degrees from a third direction (Z) perpendicular to both the first direction and the second direction, wherein the two positions are separated by a predetermined distance in the third direction (Z).

2. Sensor according to the preceding claim, comprising a substrate (300), the at least two sensing elements being arranged on the substrate (300), wherein, The substrate lies in a plane comprising the second direction (X) and the third direction (Z), wherein sensing elements provide signals each derived from a component of a field in the plane of the substrate, the sensor further comprising processing circuitry arranged for obtaining a sensor signal computed as a difference or gradient of the signals from the sensing elements.

3. The sensor of claim 1, further comprising electrically conductive leads (301) for interchanging signals between the outside and the sensor, the electrically conductive leads being elongated and extending away from the substrate in the third direction (Z).

4. The sensor according to the preceding claim, wherein, The elongated leads comprise a set of leads (301) aligned with the second direction (X).

5. The sensor according to the preceding claim, wherein, Each of the elongated leads carries an analog or digital signal, wherein the elongated leads extending away from the substrate comprise an end opposite the substrate, wherein the leads carrying analog signals are configured for redirecting the signals and connecting to a first row of connections (401), and wherein the leads carrying digital signals are configured for redirecting the signals and connecting to a second row of connections (402) of a further device (400).

6. The sensor of any one of claims 3 to 5, wherein, All leads of the sensor extend from the same side of the sensor.

7. The sensor of claim 1, wherein, The sensor comprises at least two integrated magnetic concentrators (113, 114, 115, 116, 117, 118) and at least two horizontal Hall elements (H1, H3) for sensing the magnetic field at the two positions.

8. The sensor according to the preceding claim, wherein, The two integrated magnetic concentrators (113, 114) are separated in the third direction (Z) and arranged such that each horizontal Hall element (H1, H3) provides a signal representing the magnetic field in the second direction (X) at the two positions.

9. The sensor according to claim 8, further comprising two pairs of horizontal Hall elements (Hi, H2; H3, H4), further comprising one integrated magnetic concentrator (113, 114) for each pair of Hall elements, wherein, The concentrators are separated in the third direction (Z).

10. The sensor of claim 1, further comprising two additional sensing elements (104, 105) adapted to sense a field at a highest sensitivity in two additional positions in a region between the two conductor portions in a direction between 20 and 160 degrees from a second direction (X) perpendicular to both the first direction (Y) and the third direction (Z), the two additional positions being separated by a predetermined distance in the second direction (X).

11. The sensor of claim 9, comprising two pairs of additional horizontal Hall elements (HH1, HH2, HH3, HH4) separated from each other in the second direction (X), and further comprising integrated magnetic concentrators (121, 122) for each pair of Hall elements separated in the second direction (X).

12. The sensor of claim 9, further comprising two additional pairs of horizontal Hall elements separated in the second direction, such that a pair of Hall elements is provided at the top of the sensor and a pair of Hall elements is provided at the bottom of the sensor, and a pair of Hall elements is provided at the right side and a pair of Hall elements is provided at the left side, and further comprising four integrated magnetic concentrators (125, 126, 127, 128), wherein, Each integrated magnetic concentrator is positioned for redirecting the magnetic field to a different pair of two sensing elements.

13. Use of the sensor according to claim 1 for detecting high frequency currents through a conductor (200) comprising a hole (203) through the conductor, the sensor being placed in the hole.

14. A sensing system comprising a conductor (200) comprising a through hole (203) surrounded by an electrically conductive material, the sensing system further comprising a sensor according to claim 1, wherein, The sensor is introduced inside the through hole such that the sensing elements are arranged for sensing the field in at least two positions in the area between two electrically conductive parts of the conductor, wherein the at least two sensing positions follow the axis of the through hole.

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