A vcse1 chip cleaning device and cleaning process

Abstract

The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The application discloses a VCSEL chip cleaning device and a cleaning process, and relates to the technical field of chip cleaning. The

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip cleaning, in particular to a VCSEL chip cleaning device and cleaning process. BACKGROUND

[0002] Before the chip is manufactured, the wafer needs to be handled accordingly, the wafer refers to the silicon wafer used for the production of silicon semiconductor integrated circuits, since its shape is circular, it is called wafer, the integrated circuit manufacturing of wafer is to reduce the device thermal resistance, improve the working heat dissipation and cooling capacity, facilitate packaging, after the integrated circuit is manufactured on the front surface of the silicon wafer, the back surface needs to be thinned;

[0003] In the process of grinding and thinning of the existing chip wafer, the chip wafer surface is usually cleaned by spraying between cleaning liquids, so that some debris generated during grinding remains on the surface of the chip wafer during cleaning, which may scratch the surface of the chip wafer. SUMMARY

[0004] The purpose of the present application is to provide a VCSEL chip cleaning device and cleaning process to solve the problems in the prior art.

[0005] To achieve the above purpose, the present application provides the following technical scheme:

[0006] A VCSEL chip cleaning device, comprising a body, a plurality of cleaning assemblies are arranged in the body, the cleaning assemblies are equidistantly arranged along the side of the body, the cleaning assembly is composed of a placing groove and a moving body, the placing groove is located on one side of the body close to the bottom, the moving body is located on one side of the body close to the top, the moving body is slidingly connected with the body, and the moving body is rotationally connected with the placing groove.

[0007] Preferably, the bottom of the placing groove is provided with a driving motor, the driving shaft of the driving motor is connected with the placing groove, the placing groove is rotationally connected with the body, the placing groove is used for placing the wafer, a water pump is arranged in the body, the water pump is communicated with the placing groove through a pipeline, and the water pump delivers the cleaning liquid to the placing groove through the pipeline.

[0008] When the wafer is placed in the placing groove, the controller controls the driving motor and the water pump to start respectively, the driving shaft of the driving motor drives the placing groove to rotate, the placing groove drives the wafer to rotate in the process of rotating, and the water pump delivers the cleaning liquid to the placing groove through the pipeline, so that the cleaning liquid immerses the whole wafer.

[0009] Preferably, the top of the moving body is provided with a hydraulic cylinder, the push rod of the hydraulic cylinder is connected with the moving body, a rotating motor is arranged on the side of the push rod of the hydraulic cylinder close to the moving body, and the driving shaft of the rotating motor is connected with the moving body.

[0010] In the process of immersing the wafer in the cleaning liquid and driving the wafer to rotate by the placing groove, the controller controls the hydraulic cylinder to start, the push rod of the hydraulic cylinder drives the moving body to move, the moving body then moves to the side close to the placing groove, the moving body drives the grinding disc to move in the process of moving, so that the grinding disc encounters the wafer in the process of moving, and then the bottom of the grinding disc is in contact with the upper surface of the wafer, and then the controller controls the driving of the rotating motor, the driving shaft of the rotating motor drives the moving body to rotate, the moving body drives the several grinding discs to revolve around the axis of the moving body in the process of rotating, and the grinding discs are in contact with the surface of the wafer in the process of revolving, so that the surface of the wafer is ground, and at the same time, the wafer is immersed in the cleaning liquid, so that the wafer is cleaned on the surface while being ground.

[0011] Preferably, the side of the moving body close to the placing groove is provided with a first sliding groove and a second sliding groove, the first sliding groove and the second sliding groove are in the shape of an eight-character, and the distance between the first sliding groove and the placing groove is greater than the distance between the second sliding groove and the placing groove.

[0012] Preferably, each of the first sliding groove and the second sliding groove is provided with a sliding group, the sliding group is composed of a hinged body and a rotating body, the side of the hinged body away from the rotating body is provided with a sliding wheel, the sliding wheel is in sliding connection with the first sliding groove and the second sliding groove respectively, the sliding wheel is provided with a magnet, the inner wall of the first sliding groove and the second sliding groove is provided with an electromagnet, the hinged body is composed of several fixed wheels, and the adjacent two fixed wheels are hinged to each other.

[0013] In the process of revolving of the grinding disc around the moving body, the controller controls the electromagnets in the first sliding groove and the second sliding groove to be sequentially electrified, the sliding wheel moves under the action of the magnetic force of the electromagnet due to the magnet in the sliding wheel, the sliding wheel moves in the first sliding groove and the second sliding groove in a circulating manner, the hinged body moves in the process of moving of the sliding wheel, the rotating body moves in the process of moving of the hinged body, the grinding disc moves in the process of moving of the rotating body, the two grinding discs move in the side edges of the first sliding groove and the second sliding groove in a circulating manner due to the fact that the sliding group drives the grinding disc to move, and the grinding discs revolve around the eight-character in a circulating manner due to the fact that the first sliding groove and the second sliding groove are in the shape of an eight-character, and the two grinding discs do not interfere with each other.

[0014] Preferably, the bottom of the rotating body is provided with a grinding disc, the rotating body is provided with a micro motor, the driving shaft of the micro motor is connected with the grinding disc, and the grinding disc is in rotary connection with the rotating body.

[0015] The controller controls the micro motor in the rotating body to start, and the driving shaft of the micro motor drives the grinding disc to rotate, so that the grinding disc rotates around the eight-shaped structure, and the wafer surface is ground.

[0016] Preferably, the bottom of the grinding disc is provided with a plurality of grinding strips, and an output groove is arranged between two adjacent grinding strips.

[0017] In the process of self-rotation of the grinding disc, the grinding disc drives the grinding strips to rotate, and the plurality of grinding strips grind the wafer surface, and the debris generated by grinding enters the output groove. When the cleaning liquid enters the output groove, the cleaning liquid is transported from the outside of the grinding disc to the side close to the conveying pipe, and the debris generated by grinding is carried by the cleaning liquid during the movement of the cleaning liquid, so that the debris is transported along the output groove to the conveying pipe. When the cleaning liquid carrying the debris enters the conveying pipe, the cleaning liquid is transported from the conveying pipe to the side close to the spiral pipe, so that the cleaning liquid enters the spiral pipe through the conveying pipe. Since a plurality of spiral pipes are arranged, the cleaning liquid is transported into the spiral pipe in batches, and the cleaning liquid is transported from the spiral pipe to the side close to the filter disc. At this time, since the cleaning liquid flows along the spiral pipe, the cleaning liquid is output in a spiral motion state when it is output from the spiral pipe, so that the cleaning liquid moves spirally around the filter disc, increasing the contact area between the cleaning liquid and the filter disc. When the cleaning liquid flows spirally, a centrifugal force is generated, so that the debris mixed with the cleaning liquid is thrown out under the action of the centrifugal force, and then filtered by the filter disc, avoiding the debris remaining in the filter disc and causing scratches on the wafer surface, thereby improving the quality of wafer surface grinding and cleaning. At the same time, the spiral conveying of the cleaning liquid and the filter disc cooperate with each other, further improving the quality of debris filtering.

[0018] Preferably, the bottom of the filter disc is provided with an output cavity, and the outer part of the grinding disc is provided with a plurality of baffles.

[0019] The filtered cleaning liquid is transported from the filter disc to the output cavity. Since the grinding disc is in a state of self-rotation, the cleaning liquid in the output cavity flows to the edge of the grinding disc, so that the cleaning liquid is transported from the output cavity to the side close to the baffle. The cleaning liquid is transported again to the wafer surface through the gap between two adjacent baffles, so that the cleaning liquid flows from the edge of the grinding disc to the center of the grinding disc, thereby forming a circulating flow state.

[0020] Preferably, the rotation direction of the placing groove is opposite to the rotation direction of the grinding disc.

[0021] Since the rotation direction of the placing groove is opposite to the rotation direction of the grinding disc, the revolution direction of the grinding disc is the same as the rotation direction, and thus the grinding rotation speed of the grinding disc is improved without increasing the rotation power, so that the wafer grinding efficiency is further improved.

[0022] A VCSEL chip cleaning process, the cleaning process comprises the following specific steps:

[0023] S1, the chip wafer is placed in the placing groove;

[0024] S2, the water pump is started to transport the cleaning liquid to the placing groove, so that the cleaning liquid immerses the chip wafer;

[0025] S3, the placing groove drives the chip wafer to rotate;

[0026] S4, the moving body drives the grinding disc to move to the side close to the chip wafer;

[0027] S5, the grinding disc contacts the chip wafer in the moving process and performs grinding and cleaning treatment on it;

[0028] S6, after the grinding and cleaning are completed, the moving body is reset;

[0029] S7, the placing groove stops rotating, and the chip wafer is taken out.

[0030] Compared with the prior art, the beneficial effects of the present application are:

[0031] 1, in the process of the grinding disc revolving around the eight characters and revolving around the axis of the moving body, the controller controls the micro motor in the rotating body to start, the driving shaft of the micro motor drives the grinding disc to rotate immediately, the grinding disc rotates immediately, so that the grinding disc revolves around the eight characters in the state of combination of rotation and revolution, and the wafer surface is ground and treated.

[0032] 2. Due to the presence of several spiral tubes, the cleaning solution enters the spiral tubes in batches and is transported to the side near the filter plate. As the cleaning solution flows along the spiral tubes, it exits in a spiral motion, moving around the filter plate. This increases the contact area between the cleaning solution and the filter plate. Furthermore, the spiral flow generates centrifugal force, causing debris mixed in the cleaning solution to be thrown out and filtered by the filter plate. This prevents debris from remaining in the filter plate and scratching the wafer surface, thus improving the quality of wafer surface grinding and cleaning. Simultaneously, the spiral-conveyed cleaning solution and the filter plate work together to further enhance the quality of debris filtration. Attached Figure Description

[0033] Figure 1 This is a perspective view of the present invention;

[0034] Figure 2 This is a front view of the present invention;

[0035] Figure 3 This is a structural diagram showing the placement of the slot and the moving body;

[0036] Figure 4 A schematic diagram of the structure of the first sliding groove and the second sliding groove;

[0037] Figure 5 The image shows a bottom view of the first and second sliding grooves.

[0038] Figure 6 This is a schematic diagram of the top structure of the grinding disc;

[0039] Figure 7 This is a schematic diagram of the bottom structure of the grinding disc;

[0040] Figure 8 This is a schematic diagram of the internal structure of the grinding disc;

[0041] In the diagram: 1. Machine body; 2. Cleaning assembly; 21. Placement slot; 22. Moving body; 23. First sliding slot; 24. Second sliding slot; 25. Sliding assembly; 251. Hinge; 252. Rotating body; 253. Sliding wheel; 26. Grinding disc; 27. Grinding strip; 28. Output slot; 29. ​​Conveying pipe; 30. Spiral tube; 31. Filter disc; 32. Output chamber; 33. Baffle. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Example: Figures 1-8 As shown, the present invention provides a technical solution for a VCSEL chip cleaning device, including a body 1. A plurality of cleaning components 2 are arranged inside the body 1. The cleaning components 2 are arranged at equal intervals along the side of the body 1. Each cleaning component 2 consists of a placement slot 21 and a moving body 22. The placement slot 21 is located on the side of the body 1 near the bottom, and the moving body 22 is located on the side of the body 1 near the top. The moving body 22 is slidably connected to the body 1 and rotatably connected to the placement slot 21.

[0044] In one specific embodiment of the present invention, a drive motor is provided at the bottom of the placement slot 21, the drive shaft of the drive motor is connected to the placement slot 21, the placement slot 21 is rotatably connected to the machine body 1, the placement slot 21 is used to place wafers, a water pump is provided in the machine body 1, the water pump is connected to the placement slot 21 through a pipe, and the water pump delivers cleaning fluid to the placement slot 21 through the pipe.

[0045] In one specific embodiment of the present invention, a hydraulic cylinder is provided on the top of the movable body 22, the push rod of the hydraulic cylinder is connected to the movable body 22, and a rotary motor is provided on the side of the push rod of the hydraulic cylinder near the movable body 22, and the drive shaft of the rotary motor is connected to the movable body 22.

[0046] In one specific embodiment of the present invention, the movable body 22 is provided with a first sliding groove 23 and a second sliding groove 24 on the side near the placement groove 21. The first sliding groove 23 and the second sliding groove 24 are in the shape of an octagon. The distance between the first sliding groove 23 and the placement groove 21 is greater than the distance between the second sliding groove 24 and the placement groove 21.

[0047] In one specific embodiment of the present invention, a sliding assembly 25 is provided in both the first sliding groove 23 and the second sliding groove 24. The sliding assembly 25 is composed of a hinge body 251 and a rotating body 252. A sliding wheel 253 is provided on the side of the hinge body 251 away from the rotating body 252. The sliding wheel 253 is slidably connected to the first sliding groove 23 and the second sliding groove 24 respectively. A magnet is provided in the sliding wheel 253. An electromagnet is provided on the inner wall of the first sliding groove 23 and the second sliding groove 24. The hinge body 251 is composed of a plurality of fixed wheels, and two adjacent fixed wheels are hinged to each other.

[0048] As a specific embodiment of the present application, the bottom of the rotating body 252 is provided with a grinding disc 26, a micro motor is arranged in the rotating body 252, the driving shaft of the micro motor is connected with the grinding disc 26, and the grinding disc 26 is rotationally connected with the rotating body 252.

[0049] As a specific embodiment of the present application, the rotating direction of the placing groove 21 is opposite to the rotating direction of the grinding disc 26.

[0050] As a specific embodiment of the present application, the bottom of the grinding disc 26 is provided with a plurality of grinding strips 27, an output groove 28 is arranged between two adjacent grinding strips 27, a conveying pipe 29 is arranged in the grinding disc 26, the output groove 28 is communicated with the conveying pipe 29, a plurality of spiral pipes 30 are arranged on the side of the conveying pipe 29 away from the output groove 28, a filter disc 31 is arranged outside the conveying pipe 29, one end of the spiral pipe 30 is communicated with the conveying pipe 29, and the other end of the spiral pipe 30 is communicated with the filter disc 31.

[0051] As a specific embodiment of the present application, the bottom of the filter disc 31 is provided with an output cavity 32, and the outside of the grinding disc 26 is provided with a plurality of baffles 33.

[0052] A VCSEL chip cleaning process, the cleaning process comprises the following specific steps:

[0053] S1, the chip wafer is placed in the placing groove 21;

[0054] S2, the water pump is started to convey the cleaning liquid to the placing groove 21, so that the cleaning liquid immerses the chip wafer;

[0055] S3, the placing groove 21 drives the chip wafer to rotate;

[0056] S4, the moving body 22 drives the grinding disc 26 to move to the side close to the chip wafer;

[0057] S5, the grinding disc 26 contacts the chip wafer in the moving process and performs grinding and cleaning treatment on the chip wafer;

[0058] S6, after the grinding and cleaning are completed, the moving body 22 is reset;

[0059] S7, the placing groove 21 stops rotating, and the chip wafer is taken out.

[0060] The working principle of the present application is as follows:

[0061] When the wafer is placed in the placing groove 21, the controller controls the driving motor and the water pump to start respectively, the driving shaft of the driving motor drives the placing groove 21 to rotate, the placing groove 21 drives the wafer to rotate in the process of rotating, and the water pump delivers the cleaning liquid to the placing groove 21 through the pipeline, so that the cleaning liquid immerses the whole wafer;

[0062] In the process that the cleaning liquid immerses the wafer and the placing groove 21 drives the wafer to rotate, the controller controls the hydraulic cylinder to start, the push rod of the hydraulic cylinder drives the moving body 22 to move, the moving body 22 moves to the side close to the placing groove 21, the moving body 22 drives the grinding disc 26 to move in the process of moving, so that the grinding disc 26 meets the wafer in the process of moving, and then the bottom of the grinding disc 26 contacts the upper surface of the wafer, and the controller controls the driving of the rotating motor, the driving shaft of the rotating motor drives the moving body 22 to rotate, the moving body 22 drives the several grinding discs 26 to revolve around the axis of the moving body 22 in the process of rotating, and the grinding disc 26 contacts the surface of the wafer in the process of revolving, so as to grind the surface of the wafer, and at the same time, the wafer is immersed in the cleaning liquid, so that the wafer is cleaned on the surface while being grinded;

[0063] In the process that the grinding disc 26 revolves around the moving body 22, the controller controls the electromagnets in the first sliding groove 23 and the second sliding groove 24 to be electrified in turn, the sliding wheel 253 is provided with a magnet, and the sliding wheel 253 moves under the action of the magnetic force of the electromagnet, and then the sliding wheel 253 moves in the first sliding groove 23 and the second sliding groove 24 in a cycle, the sliding wheel 253 drives the hinged body 251 to move in the process of moving, the hinged body 251 drives the rotating body 252 to move in the process of moving, the rotating body 252 drives the grinding disc 26 to move in the process of moving, the first sliding groove 23 and the second sliding groove 24 are provided with the sliding group 25, and the sliding group 25 drives the grinding disc 26 to move, so that the two grinding discs 26 move along the side edges of the first sliding groove 23 and the second sliding groove 24 in a cycle, and the first sliding groove 23 and the second sliding groove 24 are in the shape of an eight character, so that the grinding disc 26 moves around the eight character in a cycle, and the two grinding discs 26 do not interfere with each other;

[0064] In the process that the grinding disc 26 rotates around the eight character and revolves around the axis of the moving body 22, the controller controls the micro motor in the rotating body 252 to start, the driving shaft of the micro motor drives the grinding disc 26 to rotate, the grinding disc 26 rotates immediately, so that the grinding disc 26 moves around the eight character in the state of combination of rotation and revolution, and grinds the surface of the wafer;

[0065] The grinding disc 26 drives the grinding strip 27 to rotate in the process of rotation, and the grinding strip 27 then performs grinding treatment on the wafer surface. The debris generated in the grinding process enters the output groove 28. The output groove 28 is driven to rotate by the rotation of the grinding disc 26. The output groove 28 drives the cleaning liquid to move, so that the cleaning liquid moves from the outside of the grinding disc 26 to the side close to the conveying pipe 29. The debris is carried by the cleaning liquid and moves along the output groove 28 to the conveying pipe 29. When the cleaning liquid carrying the debris enters the conveying pipe 29, the cleaning liquid is conveyed from the conveying pipe 29 to the side close to the spiral pipe 30. The cleaning liquid enters the spiral pipe 30 through the conveying pipe 29. Since the spiral pipe 30 is provided, the cleaning liquid enters the spiral pipe 30 in batches, and is conveyed from the spiral pipe 30 to the side close to the filter disc 31. At this time, since the cleaning liquid flows along the spiral pipe 30, the cleaning liquid is output in a spiral motion state when it is output from the spiral pipe 30. The cleaning liquid spirally moves around the filter disc 31, increases the contact area between the cleaning liquid and the filter disc 31, and generates a certain centrifugal force when the cleaning liquid flows in a spiral manner. The debris mixed in the cleaning liquid is thrown out under the action of the centrifugal force, and is filtered by the filter disc 31, so that the debris is prevented from remaining in the filter disc 31.

[0066] The filtered cleaning liquid is conveyed from the filter disc 31 to the output cavity 32. Since the grinding disc 26 is in the rotation state, the cleaning liquid in the output cavity 32 flows to the edge of the grinding disc 26, so that the cleaning liquid is conveyed from the output cavity 32 to the side close to the baffle 33. The cleaning liquid is conveyed again to the wafer surface through the gap between adjacent two baffles 33, so that the cleaning liquid constantly flows from the edge of the grinding disc 26 to the center of the grinding disc 26, and forms a circulating flow state.

[0067] It is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be regarded as exemplary and non-limiting, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present application. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A VCSEL chip cleaning apparatus, characterized by: The utility model provides a kind of wafer cleaning device, including body (1), several cleaning assemblies (2) are arranged in the body (1), the cleaning assembly (2) is equidistantly arranged along the side of body (1), the cleaning assembly (2) is composed of placing groove (21) and moving body (22), the placing groove (21) is located in the side of body (1) close to bottom, the moving body (22) is located in the side of body (1) close to top, the moving body (22) is slidably connected with body (1), the moving body (22) is rotatably connected with placing groove (21);The placing groove (21) is rotatably connected with body (1), and the placing groove (21) is used to place wafer, water pump is arranged in the body (1), and the water pump is communicated with placing groove (21) by pipeline, and the water pump transports cleaning fluid to placing groove (21) by pipeline; The side of the moving body (22) close to the placing groove (21) is provided with a first sliding groove (23) and a second sliding groove (24), the first sliding groove (23) and the second sliding groove (24) are in the shape of an 8, the first sliding groove (23) and the second sliding groove (24) are provided with a sliding group (25), the sliding group (25) is composed of a hinged body (251) and a rotating body (252), the hinged body (251) is provided with a sliding wheel (253) on the side away from the rotating body (252). The bottom of the rotating body (252) is provided with a grinding disc (26), the rotating body (252) is provided with a micro motor, the driving shaft of the micro motor is connected with the grinding disc (26), and the grinding disc (26) is rotatably connected with the rotating body (252). The bottom of the grinding disc (26) is provided with a plurality of grinding strips (27), an output groove (28) is arranged between adjacent two grinding strips (27), the grinding disc (26) is provided with a conveying pipe (29), the output groove (28) is communicated with the conveying pipe (29), the conveying pipe (29) is provided with a plurality of spiral pipes (30) on the side away from the output groove (28), the outer part of the conveying pipe (29) is provided with a filter disc (31), one end of the spiral pipe (30) is communicated with the conveying pipe (29), and the other end of the spiral pipe (30) is communicated with the filter disc (31).

2. The VCSEL chip cleaning apparatus of claim 1, wherein: The bottom of the placing groove (21) is provided with a driving motor, and the driving shaft of the driving motor is connected with the placing groove (21).

3. The VCSEL chip cleaning apparatus of claim 1, wherein: The top of the moving body (22) is provided with a hydraulic cylinder, the push rod of the hydraulic cylinder is connected with the moving body (22), the push rod of the hydraulic cylinder is provided with a rotating motor on the side close to the moving body (22), and the driving shaft of the rotating motor is connected with the moving body (22).

4. The VCSEL chip cleaning apparatus of claim 1, wherein: The distance between the first sliding groove (23) and the placing groove (21) is greater than the distance between the second sliding groove (24) and the placing groove (21).

5. The VCSEL chip cleaning apparatus of claim 1, wherein: The sliding wheels (253) are respectively connected with the first sliding groove (23) and the second sliding groove (24) in a sliding mode, a magnet is arranged in the sliding wheel (253), electromagnets are arranged in the inner walls of the first sliding groove (23) and the second sliding groove (24), the articulated body (251) is composed of a plurality of fixed wheels, and adjacent two fixed wheels are articulated with each other.

6. The VCSEL chip cleaning apparatus of claim 1, wherein: The bottom of the filter disc (31) is provided with an output cavity (32), the outside of the grinding disc (26) is provided with a plurality of baffles (33), and the output cavity (32) is communicated with the outside of the grinding disc (26).

7. The VCSEL chip cleaning apparatus of claim 1, wherein: The rotating direction of the placing groove (21) is opposite to the rotating direction of the grinding disc (26).

8. A cleaning process applied to a VCSEL chip cleaning apparatus as claimed in any one of claims 1 to 7, characterized in that: The cleaning process comprises the following specific steps: S1, placing a chip wafer in the placing groove (21); S2, starting a water pump to transport cleaning liquid to the placing groove (21), so that the cleaning liquid immerses the chip wafer; S3, the placing groove (21) drives the chip wafer to rotate; S4, the moving body (22) drives the grinding disc (26) to move to the side close to the chip wafer; S5, the grinding disc (26) contacts the chip wafer in the moving process and performs grinding and cleaning treatment on the chip wafer; S6, after the grinding and cleaning are completed, the moving body (22) is reset; S7, the placing groove (21) stops rotating, and the chip wafer is taken out.

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