Corrosion-resistant composition for wafer clamping piece and preparation method of corrosion-resistant composition

By using a composite material of PTFE resin, sulfonated PEEK resin, and modified carbon nanotubes in the wafer clamping component material, the balance between corrosion resistance and antistatic properties was solved. In particular, the corrosion resistance of the material was improved at high temperatures, meeting the requirements of wafer processing.

CN120923948APending Publication Date: 2025-11-11QINGDAO BESLAN SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202511177533.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-08-21
Publication Date
2025-11-11

AI Technical Summary

Technical Problem

Existing wafer clamping materials struggle to balance corrosion resistance and antistatic properties, especially with insufficient corrosion resistance at high temperatures, which affects wafer processing quality.

Method used

Using PTFE resin and sulfonated PEEK resin as the base material, and adding modified carbon nanotubes, a dense structure is formed by controlling the proportion and degree of sulfonation of sulfonated PEEK resin and introducing 5-amino-2-(trifluoromethyl)benzimidazole modified carbon nanotubes to improve the corrosion resistance and antistatic properties of the material.

Benefits of technology

It achieves excellent corrosion resistance and antistatic properties at high temperatures, significantly improving the service life and processing accuracy of wafer clamping components.

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Abstract

The invention provides a corrosion-resistant composition for a wafer clamping piece and a preparation method of the corrosion-resistant composition, and relates to the technical field of semiconductors and corrosion-resistant materials. The corrosion-resistant composition comprises PTFE (Polytetrafluoroethylene) resin, sulfonated PEEK (Polyetheretherketone) resin and modified carbon nanotubes, the weight ratio of the PTFE resin to the sulfonated PEEK resin in the base material is (88-93): (7-12); the modified carbon nanotubes are 8-15 parts by weight in every 100 parts by weight of the base material. According to the composite material, PTFE resin and sulfonated PEEK resin are used as base materials, and modified carbon nanotubes are added, so that the composite material has excellent corrosion resistance and antistatic performance.
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Description

Technical Field

[0001] This application relates to the fields of semiconductor and corrosion-resistant materials technology, and in particular to a corrosion-resistant composition for wafer clamping components and its preparation method. Background Technology

[0002] During wafer etching and cleaning processes, wafers are typically secured to wafer chucks using clamping components to prevent displacement or movement, thus ensuring processing accuracy. However, these processes involve the use of various acids, alkalis, and chemical reagents such as sodium chloride and potassium chloride. The clamping components inevitably come into contact with these chemicals, necessitating materials with excellent corrosion resistance to guarantee proper wafer processing and production quality.

[0003] Polytetrafluoroethylene (PTFE), as a special engineering plastic, possesses excellent high-temperature resistance and corrosion resistance, with a long-term operating temperature reaching 260℃. PTFE exhibits extremely strong chemical stability, reacting almost entirely with no chemicals, thus making it widely used in the semiconductor field. However, pure PTFE material has excellent insulation properties and a high surface resistivity, making it prone to static electricity buildup during friction, which can damage wafers. Currently, the main method is to add conductive fillers such as carbon nanotubes to PTFE material. However, conductive fillers are difficult to disperse uniformly in the polymer matrix, preventing a simultaneous improvement in antistatic properties, mechanical properties, and corrosion resistance. Achieving high antistatic effects generally requires sacrificing corrosion resistance, especially at high temperatures. Therefore, it is necessary to provide a material with excellent corrosion resistance and antistatic properties for wafer clamping components. Summary of the Invention

[0004] The purpose of this application is to address the shortcomings of the prior art by providing a corrosion-resistant composition for wafer clamping components and a method for preparing the same, thereby solving at least some of the problems existing in the prior art.

[0005] To achieve the above objectives, the technical solution adopted in this application is as follows: According to one aspect of this application, a corrosion-resistant composition for a wafer clamping component is provided, comprising a substrate: PTFE resin and sulfonated PEEK resin, and modified carbon nanotubes; wherein, The weight ratio of PTFE resin to sulfonated PEEK resin in the substrate is (88-93):(7-12); By weight, 8-15 parts of modified carbon nanotubes are present in every 100 parts of the substrate.

[0006] In this application, PTFE resin and sulfonated PEEK resin are mixed in a certain proportion as the base material, and modified carbon nanotubes are added to prepare a composite material for wafer clamping parts. The addition of sulfonated PEEK resin can increase the interfacial bonding between the resin matrix and other materials, and help to form a denser structure, increase the interaction force between molecular chains, thereby improving the corrosion resistance and antistatic properties of the material to a certain extent.

[0007] This application specifies the ratio of PTFE resin to sulfonated PEEK resin, requiring that the amount of sulfonated PEEK resin not be excessive. Excessive sulfonated PEEK resin can easily damage the molecular chain structure of the resin, leading to a decrease in corrosion resistance, especially alkali resistance. When the weight ratio of PTFE resin to sulfonated PEEK resin is in the range of (88-93):(7-12), the composite material can simultaneously possess better corrosion resistance and antistatic properties.

[0008] Furthermore, the degree of sulfonation of the sulfonated PEEK resin is 18-25%.

[0009] Specifically, the applicant selects sulfonated PEEK resin with a sulfonation degree of 18-25% to avoid excessive sulfonation, which would severely damage the main chain structure and intermolecular forces of the PEEK resin, thereby affecting the material's strength and corrosion resistance at high temperatures.

[0010] The aforementioned sulfonated PEEK resin can be purchased directly or prepared in a laboratory without special limitations, as long as the required degree of sulfonation is met. For example, PEEK resin can be sulfonated with concentrated sulfuric acid, as detailed below: PEEK resin was added to concentrated sulfuric acid at a weight-volume ratio of 1:(60-80) and reacted at 60-70℃ for 5-6 hours. After the reaction was completed, the mixture was washed with ice water and dried to obtain sulfonated PEEK.

[0011] Furthermore, the modified carbon nanotubes are polyetheramide-modified carbon nanotubes, prepared by first acidifying and acyl-chlorinating carbon nanotubes to obtain acyl-chlorinated carbon nanotubes, and then reacting them with an aminosilane coupling agent and a terminal amine polyether; wherein, The carbon nanotubes are multi-walled carbon nanotubes with an average outer diameter of 5-20 nm, an average inner diameter of 1-8 nm, and an average length of 1-80 μm. The aminosilane-containing coupling agents include, but are not limited to, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-β-(aminoethyl)-γ-aminopropyltrimethoxysilane, 3-allylaminopropyltrimethoxysilane, N-vinylbenzyl-N-aminoethyl-γ-aminopropyltrimethoxysilane, and N-allyl-3-aminopropyltrimethoxysilane. The terminal amine polyether is terminal amine polyethylene glycol or terminal amine polypropylene glycol; The weight ratio of the carbon nanotubes, the aminosilane coupling agent, and the terminal amine polyether is 10:(0.6-0.8):(0.3-0.5).

[0012] Furthermore, the modified carbon nanotubes described above are specifically prepared via the following method: (1) Place carbon nanotubes in a solution of concentrated nitric acid or concentrated sulfuric acid or a mixture of both, treat at 60-80℃ for 1-3 hours, filter, wash with water and dry to obtain acidified carbon nanotubes; (2) Place the acidified carbon nanotubes in SOCl2, add DMF as a catalyst, react at 70-80℃ for 1-2 h, filter and dry to obtain acyl chloride carbon nanotubes; (3) Add acyl chloride carbon nanotubes to DMF, add amino silane coupling agent and terminal amine polyether, react at 70-80℃ for at least 8h, filter, wash with DMF and dry to obtain polyether amide modified carbon nanotubes.

[0013] Specifically, in step (1), the mass fraction of both concentrated sulfuric acid and concentrated nitric acid is 20-68%; when using a mixed solution, concentrated sulfuric acid and concentrated nitric acid can be added in any proportion to the mixed solution, as long as the total mass fraction of concentrated sulfuric acid and concentrated nitric acid in the mixed solution is in the range of 20-68%.

[0014] While surface modification of carbon nanotubes can increase their compatibility and dispersibility with the substrate, thereby improving the material's corrosion resistance and antistatic properties, silane coupling agents and polyether amides have poor corrosion resistance at high temperatures. Therefore, although the addition of polyether amide-modified carbon nanotubes improves the material's corrosion resistance and antistatic properties, its corrosion resistance at high temperatures is reduced.

[0015] In a further embodiment, the modified carbon nanotubes are further modified with 5-amino-2-(trifluoromethyl)benzimidazole; the amount of 5-amino-2-(trifluoromethyl)benzimidazole is 2-3.5% of the weight of the carbon nanotubes.

[0016] Introducing 5-amino-2-(trifluoromethyl)benzimidazole into modified carbon nanotubes not only introduces carbon-fluorine bonds, which helps enhance the material's corrosion resistance at high temperatures, but also allows 5-amino-2-(trifluoromethyl)benzimidazole to react with the sulfonic acid groups in sulfonated PEEK, thereby further improving the material's corrosion resistance at high temperatures and also helping to further enhance the material's antistatic properties.

[0017] Specifically, the further modification steps of 5-amino-2-(trifluoromethyl)benzimidazole are as follows: Polyether amide-modified carbon nanotubes are added to DFM, followed by the addition of 5-amino-2-(trifluoromethyl)benzimidazole and a catalyst. The mixture is reacted at 70-80°C for 3-4 hours, filtered, and dried to obtain 5-amino-2-(trifluoromethyl)benzimidazole-modified carbon nanotubes. The catalyst can be an organotin catalyst, such as dibutyltin dilaurate or dibutyltin diacetate, etc., and the amount of the organotin catalyst is 0.5-2% of the weight of 5-amino-2-(trifluoromethyl)benzimidazole.

[0018] When the modified carbon nanotubes are 5-amino-2-(trifluoromethyl)benzimidazole modified carbon nanotubes, the sulfonated PEEK resin is activated before use. The steps are as follows: the sulfonated PEEK resin, N,N'-carbonyldiimidazole, and methyl sulfoxide are mixed evenly and activated at 50-60℃ for 1-2 hours. The weight ratio of sulfonated polyether ether ketone, N,N'-carbonyldiimidazole, and methyl sulfoxide is 10:(2-4):(100-200).

[0019] Furthermore, the corrosion-resistant composition for the wafer clamping component may also contain one or both of a dispersant and an antioxidant; the amount of the dispersant and the antioxidant is 0.5-3% of the substrate.

[0020] Specifically, the dispersant includes, but is not limited to, stearamide and pentaerythritol stearate; the antioxidant includes, but is not limited to, at least one of hindered phenols, phosphites, thiodipropionates and other sulfur-containing compounds.

[0021] According to another aspect of this application, a method for preparing the corrosion-resistant composition for the wafer clamping component includes the following steps: After uniformly mixing PTFE resin, sulfonated PEEK resin and modified carbon nanotubes, the mixture is placed in a mold and pressurized once at room temperature. Then, the temperature is raised to 370-380℃ and pressurized a second time. Finally, it is cooled to room temperature to obtain the final product.

[0022] Furthermore, the pressure of the first pressurization is 10-15 MPa, and the time is 5-10 min; the pressure of the second pressurization is 30-35 MPa, and the time is 20-30 min.

[0023] Furthermore, the heating rate is 5-10℃ / min.

[0024] This application employs a two-stage pressurization process. By controlling the conditions of the two pressurization stages, a more uniform and dense structure can be formed, reducing internal defects and thus improving the corrosion resistance of the material.

[0025] Furthermore, when the modified carbon nanotubes are polyetheramide modified carbon nanotubes, the mixing method of PTFE resin, sulfonated PEEK resin and modified carbon nanotubes is stirring or ultrasonic mixing, or other conventional mixing methods in the art. When the modified carbon nanotubes are 5-amino-2-(trifluoromethyl)benzimidazole modified carbon nanotubes, the sulfonated PEEK resin is first activated and then mixed with the modified carbon nanotubes and PTFE resin, kept at a temperature for 2-3 hours, washed with water, and dried.

[0026] Specifically, the activation step of sulfonated PEEK resin includes: mixing sulfonated PEEK resin, N,N'-carbonyldiimidazole, and methyl sulfoxide evenly, and activating at a temperature of 50-60℃ for 1-2 hours; the weight ratio of sulfonated polyether ether ketone, N,N'-carbonyldiimidazole, methyl sulfoxide, and 1-(3-aminopropyl)imidazole is 10:(2-4):(100-200).

[0027] This application utilizes N,N'-carbonyldiimidazole to activate the sulfonic acid groups on sulfonated PEEK, and then mixes it with modified carbon nanotubes and PTFE resin. The amino groups in the modified carbon nanotubes react with the sulfonic acid groups on the sulfonated PEEK, which helps to further improve the corrosion resistance and antistatic properties of the material at high temperatures.

[0028] Compared with the prior art, this application has the following beneficial effects: 1. This application provides a corrosion-resistant composition for wafer clamping components. The composite material uses PTFE resin and sulfonated PEEK resin as base materials and adds modified carbon nanotubes, exhibiting excellent corrosion resistance and antistatic properties.

[0029] 2. In this application, PTFE resin and sulfonated PEEK resin are mixed in a certain proportion as the base material. By controlling the amount of sulfonated PEEK resin and the degree of sulfonation, the corrosion resistance and antistatic properties of the material can be improved.

[0030] 3. In this application, modified carbon nanotubes are added to the corrosion-resistant composition for wafer clamping components. The introduction of polyether amide can increase the compatibility between carbon nanotubes and substrates, and improve the corrosion resistance and antistatic properties of the material. Furthermore, the introduction of 5-amino-2-(trifluoromethyl)benzimidazole can not only further enhance the corrosion resistance and antistatic properties of the material, but also improve the corrosion resistance at high temperatures. Detailed Implementation

[0031] The following non-limiting embodiments are intended to enable those skilled in the art to gain a more comprehensive understanding of this application, but do not limit this application in any way. The following content is merely an exemplary description of the scope of protection claimed in this application, and those skilled in the art can make various changes and modifications to the invention based on the disclosed content, which should also fall within the scope of protection claimed in this application.

[0032] Unless otherwise specified, all chemical reagents used in this application were obtained through conventional commercial channels. In the specific embodiments described below, PTFE resin (density 2.15 g / mL) was purchased from Shandong Yihong Chemical Co., Ltd., 5-amino-2-(trifluoromethyl)benzimidazole (CAS No. 3671-66-7) was purchased from Shanghai Yiji Industrial Co., Ltd., the aminosilane coupling agent was γ-aminopropyltriethoxysilane (CAS No. 11519-85-6), purchased from Shandong Yifei Science and Trade Co., Ltd., and m-aminotrifluorotoluene (CAS No. 98-16-8) was purchased from Hubei Dongcao Chemical Technology Co., Ltd. Sulfonated PEEK resin can be purchased directly or prepared in the laboratory without special limitations, as long as the degree of sulfonation is met. In the specific embodiments below, sulfonated PEEK resin is prepared by sulfonating PEEK resin with concentrated sulfuric acid. The specific steps are as follows: PEEK resin is added to concentrated sulfuric acid at a weight-to-volume ratio of 1:(60-80), and reacted at 60-70°C for 5-6 hours; after the reaction is completed, it is washed with ice water and dried to obtain sulfonated PEEK. The amount of concentrated sulfuric acid and the specific conditions are adjusted according to the required degree of sulfonation. Multi-walled carbon nanotubes with an outer diameter of 20 nm, an inner diameter of 5 nm, and a length of 10 μm are selected. These can be replaced with multi-walled carbon nanotubes of other specifications, which does not constitute a limitation of this application.

[0033] The present application will be further described below by way of specific embodiments.

[0034] Example 1 A corrosion-resistant composition for a wafer clamping component comprises, by weight: 100 parts of PTFE resin and sulfonated PEEK resin, and 8 parts of modified carbon nanotubes. The weight ratio of PTFE resin to sulfonated PEEK resin is 88:12; The degree of sulfonation of the sulfonated PEEK resin is 18%; Modified carbon nanotubes were prepared by the following method: (1) Place carbon nanotubes in a sufficient amount of concentrated nitric acid or concentrated sulfuric acid or a mixture of both, treat at 60°C for 3 hours, filter, wash with water and dry to obtain acidified carbon nanotubes; (2) Place the acidified carbon nanotubes in sufficient SOCl2, add DMF (0.5% of the weight of the acidified carbon nanotubes), react at 70°C for 2 h, filter and dry to obtain acyl chloride carbon nanotubes; (3) Add acyl chloride carbon nanotubes to sufficient DMF, add amino silane coupling agent and terminal amine polypropylene glycol in a weight ratio of 10:0.5:0.3, react at 80°C for 8 hours, filter, wash with DMF and dry to obtain polyether amide modified carbon nanotubes.

[0035] The method for preparing the corrosion-resistant composition for the above-mentioned wafer clamping component includes the following steps: After uniformly mixing PTFE resin, sulfonated PEEK resin and modified carbon nanotubes, the mixture is placed in a mold and subjected to a first pressurization at room temperature for 10 MPa and 10 min. Then, the temperature is increased to 370°C at a rate of 5°C / min for a second pressurization at 30 MPa and 30 min. Finally, the mixture is cooled to room temperature to obtain the product.

[0036] Example 2 A corrosion-resistant composition for a wafer clamping component comprises, by weight: 100 parts of PTFE resin and sulfonated PEEK resin, and 15 parts of modified carbon nanotubes. The weight ratio of PTFE resin to sulfonated PEEK resin is 93:7; The degree of sulfonation of the sulfonated PEEK resin is 25%; (1) Place carbon nanotubes in a sufficient amount of concentrated nitric acid or concentrated sulfuric acid or a mixture of both, treat at 80°C for 1 hour, filter, wash with water and dry to obtain acidified carbon nanotubes; (2) Place the acidified carbon nanotubes in sufficient SOCl2, add DMF (0.5% of the weight of the acidified carbon nanotubes), react at 80°C for 1 h, filter and dry to obtain acyl chloride carbon nanotubes; (3) Add acyl chloride carbon nanotubes to sufficient DMF, add amino silane coupling agent and terminal amine polyethylene glycol in a weight ratio of 10:0.8:0.5, react at 80°C for 8 hours, filter, wash with DMF and dry to obtain polyether amide modified carbon nanotubes.

[0037] The method for preparing the corrosion-resistant composition for the above-mentioned wafer clamping component includes the following steps: After uniformly mixing PTFE resin, sulfonated PEEK resin and modified carbon nanotubes, the mixture is placed in a mold and subjected to a first pressurization at room temperature for 5 minutes at a pressure of 15 MPa. Then, the temperature is increased to 380°C at a rate of 10°C / min for a second pressurization at a pressure of 35 MPa for 20 minutes. Finally, the mixture is cooled to room temperature to obtain the product.

[0038] Example 3 The difference from Example 1 is that the weight ratio of PTFE resin to sulfonated PEEK resin in this example is 85:15.

[0039] Example 4 The difference from Example 1 is that the degree of sulfonation of PEEK resin in this example is 30%.

[0040] Example 5 The difference from Example 1 is that in this example, the weight ratio of carbon nanotubes to silane coupling agent is 10:1.2 during the preparation of the modified silane coupling agent.

[0041] Example 6 The difference from Example 1 is that the modified carbon nanotubes in this example are further modified with 5-amino-2-(trifluoromethyl)benzimidazole. The amount of 5-amino-2-(trifluoromethyl)benzimidazole is 2% of the weight of the carbon nanotubes. The specific preparation steps are as follows: the polyether amide modified carbon nanotubes obtained in Example 1 are added to sufficient DFM, 5-amino-2-(trifluoromethyl)benzimidazole is added, and 0.5% of the weight of 5-amino-2-(trifluoromethyl)benzimidazole is added to dibutyltin laurylate. The mixture is reacted at 80°C for 3 hours, filtered, and dried to obtain the final product.

[0042] At this point, the method for preparing the corrosion-resistant composition for the wafer clamping component includes the following steps: Sulfonated PEEK resin, N,N'-carbonyldiimidazole, and methyl sulfoxide were mixed evenly in a weight ratio of 10:2:100 and activated at 60°C for 1 hour. Then, modified carbon nanotubes and PTFE resin were added, mixed, and kept at the same temperature for 2 hours. The mixture was then washed with water and dried. The mixture was then placed in a mold and subjected to a first pressurization at room temperature for 5 minutes at a pressure of 15 MPa. The temperature was then increased to 380°C at a rate of 10°C / min for a second pressurization at a pressure of 35 MPa for 20 minutes. Finally, the mixture was cooled to room temperature to obtain the product.

[0043] Example 7 The difference from Example 6 is that in this example, the amount of 5-amino-2-(trifluoromethyl)benzimidazole used is 3.5% of the weight of the carbon nanotubes.

[0044] Example 8 The difference from Example 6 is that in this example, the amount of 5-amino-2-(trifluoromethyl)benzimidazole used is 5% of the weight of the carbon nanotubes.

[0045] Example 9 The difference from Example 6 is that in this example, 5-amino-2-(trifluoromethyl)benzimidazole is replaced with an equal amount of m-aminotrifluorotoluene.

[0046] Example 10 The difference from Example 6 is that the sulfonated PEEK resin in this example was not activated, that is, the preparation method of the corrosion-resistant composition for the wafer clamp is the same as that in Example 1.

[0047] Example 11 The difference from Example 1 is that the preparation method of the corrosion-resistant composition for the wafer clamping component in this example is the same as that in Example 6, that is, the sulfonated PEEK resin is first activated.

[0048] Comparative Example 1 The difference from Example 1 is that the carbon nanotubes in this comparative example are replaced with an equal amount of unmodified carbon nanotubes.

[0049] Comparative Example 2 The difference from Example 1 is that the sulfonated PEEK resin in this comparative example is replaced with an equal amount of PEEK resin.

[0050] Comparative Example 3 The difference from Example 1 is that no sulfonated PEEK resin was added in this comparative example, that is, the substrate is only PTFE resin.

[0051] Comparative Example 4 The difference from Example 1 is that, in the preparation process of the corrosion-resistant composition for the wafer clamping component in this comparative example, the conditions for the two pressurization processes are as follows: The first pressurization was performed at a pressure of 20 MPa for 5 minutes; the second pressurization was performed at a pressure of 40 MPa for 20 minutes.

[0052] Comparative Example 5 The difference from Example 1 is that, in the preparation process of the corrosion-resistant composition for the wafer clamping component in this comparative example, the conditions for the two pressurization processes are as follows: The first pressurization was performed at a pressure of 5 MPa for 10 minutes; the second pressurization was performed at a pressure of 20 MPa for 30 minutes.

[0053] Test case The products obtained in the above examples and comparative examples were made into 10cm×5cm×10mm sample blocks for acid resistance, alkali resistance, high-temperature corrosion resistance, and surface resistivity tests. For acid and alkali resistance tests, the sample blocks were immersed in 20% sulfuric acid solution and 20% sodium hydroxide solution, respectively, at 70°C for 7 days, and their tensile strength was tested. The tensile strength reduction rate was calculated based on the tensile strength before treatment to evaluate corrosion resistance. High-temperature corrosion resistance was tested using the same methods as the acid and alkali resistance tests, at 170°C for 7 days. Surface resistivity was tested using the high-resistivity meter method in GB / T 1410-2006.

[0054] The test results are shown in Table 1 below.

[0055] Table 1

[0056] As shown in Table 1, the composite material provided in this application exhibits excellent corrosion resistance. After immersion in a 5% sulfuric acid and sodium hydroxide solution for 10 days, the tensile strength decreases by less than 5%, and the surface resistivity decreases to 7 × 10⁻⁶. 6 The following (the surface resistivity of pure PTFE material is 1×10⁻⁶) 11 The above-mentioned materials have good antistatic properties, which makes up for the defect that pure PTFE materials are prone to static electricity accumulation after friction, thus damaging the wafer.

[0057] According to Examples 1-4 and Comparative Examples 2 and 3, compared with using only PTFE or PTFE / PEEK as the base material, the corrosion resistance of the composite material using PTFE / sulfonated PEEK as the base material in Examples 1-4 is improved. In particular, when PTFE / sulfonated PEEK is used in combination with a ratio of (88-93):(7-12), the tensile strength decrease rate after immersion in 5% sulfuric acid and sodium hydroxide solution for 10 days is less than 5%, resulting in better corrosion resistance. In addition, the degree of sulfonation of sulfonated PEEK also affects the corrosion resistance of the composite material. Excessive sulfonation of sulfonated PEEK damages the structure of PEEK resin, leading to a decrease in corrosion resistance. Therefore, the tensile strength decrease rate in Example 4 is significantly lower than that in Example 1.

[0058] Although the composite material obtained using PTFE / sulfonated PEEK as the base material and adding a certain amount of modified carbon nanotubes exhibits good corrosion resistance, its corrosion resistance at high temperatures still needs improvement. Therefore, compared to Example 1, the modified carbon nanotubes in Examples 6-8 were further modified with 5-amino-2-(trifluoromethyl)benzimidazole, resulting in improved corrosion resistance at high temperatures and a certain degree of improvement in antistatic properties. Furthermore, compared to Examples 6-8, the amount of 5-amino-2-(trifluoromethyl)benzimidazole in Example 8 was higher than in Examples 6 and 7, but its corrosion resistance and antistatic properties at high temperatures did not improve further; in fact, they decreased somewhat. Therefore, the preferred amount of 5-amino-2-(trifluoromethyl)benzimidazole is 5% of the mass of the carbon nanotubes.

[0059] According to Examples 6 and 10, in Example 6, carbon nanotubes further modified with 5-amino-2-(trifluoromethyl)benzimidazole were used, and sulfonated PEEK resin was activated during the preparation of the composite material. However, in Example 10, the sulfonated PEEK resin was not activated. The corrosion resistance of the composite material obtained in Example 10 at high temperature was significantly lower than that in Example 6. It can be seen that when using carbon nanotubes further modified with 5-amino-2-(trifluoromethyl)benzimidazole, it is necessary to combine them with the activation treatment of sulfonated PEEK resin in order to significantly improve the corrosion resistance of the composite material at high temperature.

[0060] The above description of the embodiments is provided to enable those skilled in the art to understand and use the invention. It will be apparent to those skilled in the art that various modifications can be made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, this application is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of this application without departing from the scope of this application should be within the protection scope of this application.

Claims

1. A corrosion-resistant composition for a wafer clamping component, characterized in that, The substrates include PTFE resin and sulfonated PEEK resin, as well as modified carbon nanotubes; among which, The weight ratio of PTFE resin to sulfonated PEEK resin in the substrate is (88-93):(7-12); By weight, 8-15 parts of modified carbon nanotubes are present in every 100 parts of the substrate.

2. The corrosion-resistant composition for wafer clamping components according to claim 1, characterized in that, The degree of sulfonation of the sulfonated PEEK resin is 18-25%.

3. The corrosion-resistant composition for wafer clamping components according to claim 1, characterized in that, The modified carbon nanotubes are polyether amide modified carbon nanotubes, which are prepared by first acidifying and acyl chlorinating carbon nanotubes to obtain acyl chloride carbon nanotubes, and then reacting them with an amino silane coupling agent and an amino-terminated polyether. The weight ratio of the carbon nanotubes, the aminosilane coupling agent, and the terminal amine polyether is 10:(0.6-0.8):(0.3-0.5).

4. The corrosion-resistant composition for wafer clamping components according to claim 3, characterized in that, The terminal amine polyether is terminal amine polyethylene glycol or terminal amine polypropylene glycol.

5. The corrosion-resistant composition for wafer clamping components according to claim 1, characterized in that, The modified carbon nanotubes are further modified by 5-amino-2-(trifluoromethyl)benzimidazole, with the amount of 5-amino-2-(trifluoromethyl)benzimidazole being 2-3.5% of the weight of the carbon nanotubes.

6. The corrosion-resistant composition for wafer clamping components according to claim 5, characterized in that, The steps for further modification of 5-amino-2-(trifluoromethyl)benzimidazole are as follows: add polyether amide-modified carbon nanotubes to DFM, add 5-amino-2-(trifluoromethyl)benzimidazole, add catalyst, react at 70-80℃ for 3-4h, filter, dry, and obtain 5-amino-2-(trifluoromethyl)benzimidazole-modified carbon nanotubes.

7. The corrosion-resistant composition for wafer clamping components according to claim 5 or 6, characterized in that, When the modified carbon nanotubes are 5-amino-2-(trifluoromethyl)benzimidazole modified carbon nanotubes, the sulfonated PEEK resin is activated before use. The steps are as follows: the sulfonated PEEK resin, N,N'-carbonyldiimidazole and methyl sulfoxide are mixed evenly and activated at 50-60℃ for 1-2 hours.

8. A method for preparing the corrosion-resistant composition for a wafer clamping component according to any one of claims 1-7, characterized in that, Includes the following steps: After uniformly mixing PTFE resin, sulfonated PEEK resin and modified carbon nanotubes, the mixture is placed in a mold and pressurized once at room temperature. Then, the temperature is raised to 370-380℃ and pressurized a second time. Finally, it is cooled to room temperature to obtain the final product.

9. The preparation method according to claim 8, characterized in that, The pressure of the first pressurization is 10-15 MPa, and the time is 5-10 min; the pressure of the second pressurization is 30-35 MPa, and the time is 20-30 min.

10. The preparation method according to claim 8, characterized in that, When modifying carbon nanotubes to 5-amino-2-(trifluoromethyl)benzimidazole-modified carbon nanotubes, the sulfonated PEEK resin is first activated, then mixed with the modified carbon nanotubes and PTFE resin and kept at a constant temperature for 2-3 hours, washed with water, and dried.

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