Resin composition

Abstract

The invention provides a resin composition which comprises matrix resin and hardened resin. The matrix resin comprises polyphenyl ether resin and alkylene resin. The weight ratio of the matrix resin in the resin composition is between 10 wt% and 20 wt%. The hardened resin is prepared from cyclopentadiene-styrene copolymer resin, triallyl isocyanurate and maleimide resin. The weight ratio of the hardened resin in the resin composition is between 10 wt% and 20 wt%.

Description

Technical Field

[0001] This invention relates to a resin composition. Background Technology

[0002] In recent years, with the rapid development of integrated circuit (IC) technology, the requirements for wiring density (L / S) and transmission rate of chips (such as high-speed computing chips) have increased. In order to be more suitable for high-frequency and high-speed transmission applications, the requirements for the low dielectric properties of resin components have also been increasing. Summary of the Invention

[0003] The present invention provides a resin composition that can maintain low dielectric properties while having better roughness and peel strength.

[0004] A resin composition of the present invention includes a matrix resin and a curing resin. The matrix resin includes polyphenylene ether resin and an olefinic resin. The weight percentage of the matrix resin in the resin composition is between 10 wt% and 20 wt%. The curing resin includes cyclopentadiene-styrene copolymer resin, triallyl isocyanurate, and maleimide resin. The weight percentage of the curing resin in the resin composition is between 10 wt% and 20 wt%.

[0005] In one embodiment of the present invention, the molecular weight of the maleimide resin is between 300 and 1800.

[0006] In one embodiment of the present invention, the weight percentage of the cyclopentadiene-styrene copolymer resin in the cured resin is between 30 wt% and 50 wt%, the weight percentage of triallyl isocyanurate in the cured resin is between 25 wt% and 35 wt%, and the weight percentage of maleimide resin in the cured resin is between 25 wt% and 35 wt%.

[0007] In one embodiment of the present invention, the polyphenylene ether resin mentioned above includes methacrylate polyphenylene ether resin, oligophenylene ether or a combination thereof, and the olefinic resin includes allylated phenolic resin.

[0008] In one embodiment of the present invention, the resin composition further includes an initiator. The initiator is present in the resin composition at a weight percentage between 0.1 wt% and 0.2 wt%.

[0009] In one embodiment of the present invention, the resin composition further includes an inorganic filler. The inorganic filler accounts for between 60 wt% and 80 wt% of the weight of the resin composition.

[0010] In one embodiment of the present invention, the content of the above-mentioned cyclopentadiene-styrene copolymer resin in the cured resin is greater than the content of triallyl isocyanurate in the cured resin and the content of maleimide resin in the cured resin.

[0011] In one embodiment of the present invention, the content of the matrix resin in the resin composition is greater than the content of the hardened resin in the resin composition.

[0012] In one embodiment of the present invention, the weight proportion of the polyphenylene ether resin in the matrix resin is between 75 wt% and 85 wt%, and the weight proportion of the olefinic resin in the matrix resin is between 15 wt% and 25 wt%.

[0013] In one embodiment of the present invention, the content of the polyphenylene ether resin in the matrix resin is greater than the content of the olefinic resin in the matrix resin.

[0014] Based on the above, the present invention introduces the improved curing resin into the resin system of polyphenylene ether resin and olefin resin. By combining cyclopentadiene-styrene copolymer resin, triallyl isocyanurate and maleimide resin, the resin composition can maintain low dielectric properties while having better roughness and peel strength.

[0015] To make the above features and advantages of the present invention more apparent and understandable, specific embodiments are described in detail below. Detailed Implementation

[0016] In the following detailed description, exemplary embodiments disclosing specific details are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the various principles of the invention. However, it will be apparent to those skilled in the art that, thanks to this disclosure, the invention can be practiced in other embodiments that depart from the specific details disclosed herein.

[0017] Unless otherwise stated, the term "between" used in this specification to define numerical ranges is intended to cover the range equal to and between the endpoint values. For example, a size range between a first value and a second value means that the size range can cover the first value, the second value, and any value between the first value and the second value.

[0018] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains.

[0019] In this embodiment, the resin composition includes a matrix resin and a curing resin (which can be considered a curing agent), wherein the weight percentage of the matrix resin in the resin composition is between 10 wt% and 20 wt%, and the weight percentage of the curing resin in the resin composition is between 10 wt% and 20 wt%. Further, the matrix resin includes polyphenylene ether resin and an olefinic resin, and the curing resin includes cyclopentadiene-styrene copolymer resin, triallyl isocyanurate, and maleimide resin (e.g., bismaleimide resin (BMI)). Accordingly, this embodiment introduces a modified curing resin into the resin system of polyphenylene ether resin and olefinic resin. Through the combination of cyclopentadiene-styrene copolymer resin, triallyl isocyanurate, and maleimide resin, the resin composition can maintain low dielectric properties while exhibiting better roughness and peel strength.

[0020] In some embodiments, the molecular weight of the maleimide resin is between 300 and 1800 to have better electrical properties, but the invention is not limited thereto.

[0021] In some embodiments, commercially available maleimide resins may be used, such as "NE-X-9470S" manufactured by DIC Corporation, "NE-X-9500" manufactured by DIC Corporation, "MIR-3000" manufactured by Nippon Kayaku Co., Ltd., "MIR-5000" manufactured by Nippon Kayaku Co., Ltd., and "SE-55" manufactured by KI Chemical Co., Ltd. In particular, since the main chain structure of "NE-X-9470S" manufactured by DIC Corporation is longer, it can achieve lower dielectric loss, but the present invention is not limited thereto.

[0022] In some embodiments, the cyclopentadiene-styrene copolymer resin accounts for 30 wt% to 50 wt% of the cured resin, the triallyl isocyanurate accounts for 25 wt% to 35 wt% of the cured resin, and the maleimide resin accounts for 25 wt% to 35 wt% of the cured resin, but the invention is not limited thereto.

[0023] In some embodiments, the content of cyclopentadiene-styrene copolymer resin in the cured resin is greater than the content of triallyl isocyanurate in the cured resin and the content of maleimide resin in the cured resin, but the present invention is not limited thereto.

[0024] In some embodiments, the content of the matrix resin in the resin composition is greater than the content of the cured resin in the resin composition, but the present invention is not limited thereto.

[0025] In some embodiments, the polyphenylene ether resin includes methacrylate polyphenylene ether resin, oligophenylene ether, or a combination thereof, and the olefinic resin includes allylated phenolic resin, but the invention is not limited thereto.

[0026] In some embodiments, the polyphenylene ether resin accounts for 75 wt% to 85 wt% of the weight of the matrix resin, and the olefinic resin accounts for 15 wt% to 25 wt% of the weight of the matrix resin, but the present invention is not limited thereto.

[0027] In some embodiments, the content of polyphenylene ether resin in the matrix resin is greater than the content of olefinic resin in the matrix resin, but the present invention is not limited thereto.

[0028] In some embodiments, the resin composition further includes an initiator, wherein the initiator is present in a weight percentage of 0.1 wt% to 0.2 wt% in the resin composition. For example, the initiator includes 1,3-bis(butylperoxyisopropyl)benzene, but the invention is not limited thereto and other suitable peroxides may also be used.

[0029] In some embodiments, the resin composition further includes an inorganic filler material, wherein the inorganic filler material is present in a weight proportion between 60 wt% and 80 wt% of the resin composition. For example, the inorganic filler material includes silicon oxide, but the invention is not limited thereto and other suitable fillers may also be used.

[0030] It should be noted that the above-mentioned resin composition can be considered as the non-volatile component of the resin composition (varnish-like) dissolved in the solvent. When the non-volatile component is 100 wt%, the content of the inorganic filler material is greater than or equal to 70 wt%, but the present invention is not limited thereto. In addition, the resin composition of the present invention can be processed into prepreg and copper foil substrate (CCL) according to the actual design requirements, and the specific embodiments listed above are not limitations of the present invention.

[0031] The following embodiments and comparative examples are provided to illustrate the effects of the present invention, but the scope of the present invention is not limited to the scope of the embodiments.

[0032] The products of each embodiment and comparative example were evaluated according to the following method.

[0033] Dielectric constant Dk and dielectric loss Df: The above-mentioned resin film was heated to 200°C for 90 minutes to form a cured film. The cured film was cut into pieces with a length of 10 mm and a width of 7 mm. The dielectric constant (Dk, εr) and dielectric loss (Df, Tanδ) of the material under a 10 GHz signal were determined according to the standard test method of IPC-TM-650 (Method 2.5.5.3).

[0034] Coefficient of thermal expansion (CTE) (xy plane): The coefficient of thermal expansion of the material in the XY plane, i.e., XY CTE (ppm / ℃), was determined using a thermomechanical analyzer (TMA) according to the standard test method of IPC-TM-650 2.4.24. The test temperature range was 40℃~120℃.

[0035] Coefficient of thermal expansion (CTE) (z-plane direction): The coefficient of thermal expansion in the z-plane of the material, i.e., Z CTE (ppm / ℃), was determined using a thermomechanical analyzer (TMA) according to the standard test method of IPC-TM-650 2.4.24. The test temperature range was 50℃~260℃.

[0036] Glass transition temperature (Tg) (°C): The glass transition temperature Tg (°C) of the material was determined using a thermomechanical analyzer (TMA) according to the standard test method of ASTM E1545.

[0037] Resin sheet lamination and curing: A glass cloth epoxy resin substrate with copper foil was prepared as the inner layer substrate, and copper lamination was applied to both sides (Nanya Corporation's "NPG-180INBK"). The surface copper foil of this inner layer substrate was roughened. Using a vacuum laminator (Nikko-Material Corporation's "V-130"), the resin composition was bonded to the inner layer substrate under the following conditions: pressure reduction to below 1 hPa for 30 seconds, followed by pressing for 60 seconds at 100°C and 100 N. Subsequently, it was heated in an oven at 130°C for 30 minutes, and then transferred to an oven at 165°C for 30 minutes. Through the above heating, the resin composition was cured to obtain "Evaluation Substrate A".

[0038] Descaling treatment: To roughen the cured resin substrate, evaluation substrate A was immersed in a DuPont Sweller 7810 at 70°C for 10 minutes. Next, it was immersed in a DuPont Promoter 7820 at 85°C for 10 minutes. Finally, it was immersed in a DuPont Neutralizer 7831 at 40°C for 5 minutes to obtain the descaling treated "evaluation substrate B".

[0039] Formation of the plated conductor layer: To form a copper-plated layer (second conductor layer) on the surface of evaluation substrate B, evaluation substrate B was immersed in an electroless plating solution containing PdCl2 at 40°C for 5 minutes, followed by immersion in an electroless copper plating solution at 25°C for 20 minutes. The resulting evaluation substrate B was annealed at 150°C for 30 minutes, and then subjected to copper sulfate electrolytic plating to form a copper-plated layer with a thickness of 30 μm. The evaluation substrate B with the formed copper-plated layer was annealed at 190°C for 60 minutes. The resulting substrate is referred to as "evaluation substrate C".

[0040] Roughness Ra (nm): The arithmetic mean roughness Ra of the evaluation substrate B was measured using a laser conjugate focal microscope (Keyence VK-X3000) under a 50x lens. Ten points were randomly selected to measure the roughness Ra.

[0041] Peel strength (lbf / in): A 10 mm wide and 100 mm long cut is made in the copper plating layer of the evaluation substrate C. One end of the cut is peeled off and clamped with a jig. The load when peeling 35 mm vertically at a speed of 50 mm / min is measured using a tensile testing machine (TSE "AC-50C-SL") at room temperature (25°C).

[0042] <Examples 1-5, Comparative Example 1>

[0043] The resin composition shown in Table 1 was dissolved in a solvent (toluene) to form a liquid (varnish-like) resin composition, which was then coated onto a support (PET release film) using a die coater. After drying to form a film layer, its properties such as dielectric constant, dielectric loss, coefficient of thermal expansion, glass transition temperature, peel strength, and chemical resistance were evaluated, and the results are detailed in Table 1. Comparing the results of Examples 1 to 5 and Comparative Example 1 in Table 1, the following conclusions can be drawn: In the resin compositions of Examples 1 to 5, the modified curing resin was introduced into the resin system of polyphenylene ether resin and olefinic resin. Through the combination of cyclopentadiene-styrene copolymer resin, triallyl isocyanurate, and maleimide resin, it can maintain low dielectric properties while having better roughness and peel strength. For example, the preferred Example 1 has a dielectric loss (Df) of 0.0019 and a coefficient of thermal expansion of 17.8 ppm / ℃.

[0044] Table 1

[0045]

[0046]

[0047] In summary, this invention introduces the improved curing resin into a resin system of polyphenylene ether resin and olefinic resin. By combining cyclopentadiene-styrene copolymer resin, triallyl isocyanurate and maleimide resin, the resin composition can maintain low dielectric properties while having better roughness and peel strength.

[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A resin composition, characterized in that, include: The matrix resin includes polyphenylene ether resin and olefinic resin, wherein the weight percentage of the matrix resin in the resin composition is between 10 wt% and 20 wt%. as well as The curing resin includes cyclopentadiene-styrene copolymer resin, triallyl isocyanurate and maleimide resin, wherein the curing resin accounts for between 10 wt% and 20 wt% of the weight of the resin composition.

2. The resin composition according to claim 1, characterized in that, The molecular weight of the maleimide resin is between 300 and 1800.

3. The resin composition according to claim 1, characterized in that, The cyclopentadiene-styrene copolymer resin is present in a weight ratio of 30 wt% to 50 wt% in the cured resin, the triallyl isocyanurate is present in a weight ratio of 25 wt% to 35 wt% in the cured resin, and the maleimide resin is present in a weight ratio of 25 wt% to 35 wt% in the cured resin.

4. The resin composition according to claim 1, characterized in that, The polyphenylene ether resin includes methacrylate polyphenylene ether resin, oligophenylene ether or a combination thereof, and the olefinic resin includes allylated phenolic resin.

5. The resin composition according to claim 1, characterized in that, It further includes an initiator, wherein the initiator is present in the resin composition at a weight percentage between 0.1 wt% and 0.2 wt%.

6. The resin composition according to claim 1, characterized in that, It further includes inorganic filler materials, wherein the inorganic filler materials are present in the resin composition at a weight ratio between 60 wt% and 80 wt%.

7. The resin composition according to claim 1, characterized in that, The content of the cyclopentadiene-styrene copolymer resin in the cured resin is greater than the content of the triallyl isocyanurate in the cured resin and the content of the maleimide resin in the cured resin.

8. The resin composition according to claim 1, characterized in that, The content of the matrix resin in the resin composition is greater than the content of the hardened resin in the resin composition.

9. The resin composition according to claim 1, characterized in that, The polyphenylene ether resin is present in a weight ratio of 75 wt% to 85 wt% of the matrix resin, and the olefinic resin is present in a weight ratio of 15 wt% to 25 wt% of the matrix resin.

10. The resin composition according to claim 1, characterized in that, The content of the polyphenylene ether resin in the matrix resin is greater than the content of the olefinic resin in the matrix resin.

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