Defect marking method, system, medium and equipment based on piezoelectric ceramic driving

Abstract

The invention provides a defect marking method and system based on piezoelectric ceramic driving, a medium and equipment, and relates to the technical field of precise micro-nano machining, and the method comprises the steps: obtaining the coordinate of each defect point of a to-be-treated plate; the XY moving platform is controlled to move the current defect point to the position under a pressing head of a defect marking device according to the coordinates of the current defect point; acquiring the distance between the current defect point and the tip of the pressure head; a z-axis driver of the defect marking device is controlled to drive a pressing head to press downwards, so that the pressing head makes contact with the surface of the to-be-treated plate and does not damage the surface of the to-be-treated plate; and according to the hardness of the to-be-treated plate and the preset defect marking duration, the pressing head is controlled to imprint the to-be-treated plate according to the first defect marking mode or the second defect marking mode. According to the method, nanoscale impressing precision and controllable impressing morphology are achieved, the problem that the effect is difficult to achieve through traditional mechanical impressing is solved, and the method further has high repetition precision and can be compatible with various film materials with different hardness.

Description

Technical Field

[0001] This application relates to the field of precision micro-nano fabrication technology, and in particular to a defect marking method, system, medium, and device based on piezoelectric ceramics. Background Technology

[0002] In the manufacturing process of high-end optical glass, photomasks, semiconductor wafers, and other materials, surface defects at the micron or even nanometer scale often occur. Although traditional optical inspection systems can identify these defects, they lack a high-precision, non-destructive, and repeatable micro-marking method near the defects for subsequent location, review, or repair.

[0003] While existing technologies such as laser marking and ion beam etching can achieve micron-level marking, they suffer from problems such as large heat-affected zones, complex equipment, high costs, and susceptibility to contamination. Mechanical imprinting, although structurally simple, struggles to achieve nanometer-level precision and controllable indentation morphology.

[0004] Therefore, there is an urgent need for a nanoimprint marking system that can be integrated into a precision platform, has high repeatability, low pollution, and is compatible with a variety of film materials. Summary of the Invention

[0005] To address the aforementioned technical problems, this application provides a defect marking method, system, medium, and device based on piezoelectric ceramics, which at least partially solves the problems existing in the prior art.

[0006] In a first aspect of this application, a defect marking method based on piezoelectric ceramics is provided, the method comprising: Obtain the coordinates of each defect point on the board material to be processed; In response to processing the current defect point, the XY moving platform is controlled to move the current defect point directly below the pressure head of the defect marking device according to the coordinates of the current defect point; The distance between the current defect point and the tip of the indenter is obtained based on the optical sensor; Based on the distance between the current defect point and the tip of the indenter, the z-axis driver of the defect marking device is controlled to drive the indenter downwards, so that the indenter contacts the surface of the material to be treated without damaging the surface of the material; wherein, the z-axis driver includes a non-piezoelectric ceramic driver and a piezoelectric ceramic driver; the pressing distances corresponding to the non-piezoelectric ceramic driver and the piezoelectric ceramic driver are different. Based on the hardness of the material to be treated and the preset defect marking duration, the pressure head is controlled to imprint the material to be treated according to either the first defect marking method or the second defect marking method; wherein, the first defect marking method is controlled by pressure; and the second defect marking method is controlled by distance.

[0007] In a second aspect of this application, a defect marking system based on piezoelectric ceramic driven imprinting is provided, the system comprising: The coordinate acquisition unit is used to acquire the coordinates of each defect point in the board material to be processed; The moving unit, in response to processing the current defect point, controls the XY moving platform to move the current defect point directly below the pressure head of the defect marking device according to the coordinates of the current defect point; The distance acquisition unit is used to acquire the distance between the current defect point and the tip of the indenter based on the optical sensor. The pressing unit is used to control the z-axis driver of the defect marking device to press down the pressing head according to the distance between the current defect point and the tip of the pressing head, so that the pressing head contacts the surface of the material to be treated without damaging the surface of the material to be treated; wherein, the z-axis driver includes a non-piezoelectric ceramic driver and a piezoelectric ceramic driver; the pressing distance corresponding to the non-piezoelectric ceramic driver and the pressing distance corresponding to the piezoelectric ceramic driver are different; The imprinting unit is used to control the pressure head to imprint the material to be processed according to the hardness of the material and the preset defect marking duration, either according to a first defect marking method or a second defect marking method; wherein, the first defect marking method is controlled by pressure; and the second defect marking method is controlled by distance.

[0008] In a third aspect of this application, a non-transitory computer-readable storage medium is provided, wherein at least one instruction or at least one program is stored in the storage medium, and the at least one instruction or at least one program is loaded and executed by a processor to implement the aforementioned defect marking method based on piezoelectric ceramic drive.

[0009] In a fourth aspect of this application, an electronic device is provided, including a processor and the aforementioned non-transitory computer-readable storage medium.

[0010] This application has at least the following beneficial effects: The defect marking method based on piezoelectric ceramic drive provided in this application first acquires the coordinates of each defect point on the material to be processed through a coordinate acquisition unit. Then, a moving unit controls an XY moving platform to precisely move the current defect point to directly below the indenter of the defect marking device according to the coordinates, ensuring accurate correspondence between the marking position and the defect point, laying the foundation for subsequent high-precision marking. Next, a distance acquisition unit acquires the distance between the current defect point and the tip of the indenter using an optical sensor. The pressing unit controls the z-axis driver of the defect marking device to drive the indenter downward based on this distance. The z-axis driver includes both non-piezoelectric ceramic drivers and piezoelectric ceramic drivers, each corresponding to different pressing distances. This design allows for flexible selection of appropriate drivers according to actual needs, ensuring contact between the indenter and the surface of the material to be processed while avoiding excessive pressing that could damage the surface. This achieves non-destructive marking, overcoming the shortcomings of laser marking and ion beam etching, which easily damage the material surface, and traditional mechanical imprinting, which is difficult to control the imprinting force and can lead to material damage. At the same time, it eliminates the need for complex equipment structures, reducing equipment costs and preventing pollution, thus meeting the requirements of high-end material manufacturing for low-pollution and non-destructive marking processes. Finally, the imprinting unit flexibly selects either the first defect marking method (pressure control) or the second defect marking method (displacement control) to imprint the material based on the hardness of the material to be processed and the preset defect marking duration. When the preset defect marking duration is short and the hardness of the material is low, distance control (displacement control) is used. This is because, under these conditions, if pressure control is used, the continuous force will cause the material to deform continuously, and the deformation of the material during imprinting may sometimes exceed the resistance caused by the deformation of the mechanical structure itself, leading to unstable force and thus unstable imprinting cycles. Displacement control can precisely control the movement distance of the indenter, avoiding the impact of force instability on imprinting accuracy. When the preset defect marking duration is long and the hardness of the material to be processed is high, pressure control is used. Because materials with high hardness deform less during imprinting, i.e., the displacement is smaller, and the pressure sensor can monitor pressure at the micro-Newton level (below millinewtons), its accuracy feedback frequency can meet the requirements, enabling high-precision imprinting. Control based on the preset total pressure is more accurate than displacement control. Furthermore, as the imprinting speed increases, the force rapidly rises to the millinewtons or even newtons, rendering the high precision of the pressure sensor ineffective. Therefore, when the preset defect marking time is long and the material to be processed has high hardness, pressure control is employed. This application's design, which flexibly selects the imprinting control method based on the characteristics of the material to be processed and the imprinting time, not only achieves nanometer-level imprinting accuracy and controllable indentation morphology, solving the problem that traditional mechanical imprinting cannot achieve this effect, but also possesses high repeatability, is compatible with various film materials of different hardness, and can be integrated into precision platforms. It fully meets the urgent needs of high-end material manufacturing processes for micro-marking systems, providing reliable marking assurance for subsequent defect location, review, and repair work. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 A flowchart illustrating a defect marking method based on piezoelectric ceramics driven by an embodiment of this application; Figure 2 This is a structural block diagram of a defect marking system based on piezoelectric ceramic driven imprinting provided in an embodiment of this application. Detailed Implementation

[0013] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0014] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.

[0015] It should be noted that the following description covers various aspects of embodiments within the scope of the appended claims. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0016] Please refer to Figure 1 As shown, embodiments of this application provide a defect marking method based on piezoelectric ceramics, the method comprising: S100: Obtain the coordinates of each defect point on the board to be processed.

[0017] Specifically, step S100 also includes: S110: Obtain an image of the surface of the material to be processed using a microscope.

[0018] Here, high-resolution microscopy is used to capture the details of the plate surface, ensuring micron / nanoscale defects.

[0019] S120: Based on the image of the surface of the board to be processed, obtain the coordinates of each defect point.

[0020] Here, the location of the defect in the image is extracted by the image recognition algorithm, and then combined with the mapping relationship of the previous "microscope-imprint device joint calibration", the image coordinates are converted into mechanical coordinates, providing a precise target position for the subsequent platform movement.

[0021] Specifically, a defect identification algorithm (such as the YOLOv8 model based on deep learning, which is trained in advance with 10,000 images of board material containing defects) is used to analyze the collected images and mark the center pixel coordinates of each defect (e.g., the center coordinates of a certain scratch defect are (2500, 1800) pixels). Based on the pre-established mapping relationship between pixel coordinates and machine coordinates, for example: 1 pixel = 0.01 mm, the pixel coordinates are converted into machine coordinates (2500 × 0.01 mm = 25.000 mm, 1800 × 0.01 mm = 18.000 mm), that is, the machine coordinates of the defect are (X = 25.000 mm, Y = 18.000 mm), and stored in the system defect coordinate library.

[0022] S200, in response to processing the current defect point, controls the XY moving platform to move the current defect point directly below the pressure head of the defect marking device according to the coordinates of the current defect point.

[0023] Specifically, the coordinates of the defect to be processed are retrieved from the defect coordinate library (e.g., (X=25.000mm, Y=18.000mm)); the XY moving platform is controlled to move according to these coordinates. During the movement, the position is fed back in real time through the grating ruler (resolution 0.1μm) built into the platform, ensuring that the deviation between the center of the defect point and the tip of the pressure head is ≤0.2μm when the final stop is reached (e.g., if the grating ruler detects the stop coordinates as (25.0002mm, 17.9999mm), the deviation is within the allowable range and no secondary adjustment is required).

[0024] S300 uses an optical sensor to obtain the distance between the current defect point and the tip of the indenter.

[0025] Specifically, a fiber optic displacement sensor (such as Keyence IL-100) is installed next to the pressure head. The sensor's transmitter is aligned with the surface of the defect point, and the receiver detects the reflected light signal. According to the sensor's built-in calibration curve (e.g., when the signal strength is 80%, the corresponding distance is 100μm), the current signal strength is read in real time and converted into distance (if the signal strength is 60%, the distance is 150μm). This distance (150μm) is used as the initial reference value for the z-axis downward pressure.

[0026] S400, based on the distance between the current defect point and the tip of the indenter, controls the z-axis driver of the defect marking device to drive the indenter to press down, so that the indenter contacts the surface of the material to be treated without damaging the surface of the material to be treated; wherein, the z-axis driver includes a non-piezoelectric ceramic driver and a piezoelectric ceramic driver; the pressing distance corresponding to the non-piezoelectric ceramic driver and the pressing distance corresponding to the piezoelectric ceramic driver are different.

[0027] Specifically, step S400 also includes: S410, based on the current distance between the defect point and the tip of the indenter, controls the non-piezoelectric ceramic actuator of the z-axis driver of the defect marking device to press down a first distance.

[0028] S420, the piezoelectric ceramic actuator of the z-axis driver of the defect marking device continues to press down a second distance until the indenter contacts the surface of the plate to be treated without damaging the surface of the plate; wherein, the second distance is a fixed distance; the distance between the current defect point and the tip of the indenter is the sum of the first distance and the second distance.

[0029] Specifically, step S420 also includes: S421, based on the material of the indenter and the imprint distance mapping table corresponding to the indenter, obtain the number of pressing stages of the piezoelectric ceramic actuator of the z-axis driver of the current defect marking device, as well as the start position, end position and pressing step distance corresponding to each pressing stage; wherein, the distance between the end position corresponding to the pressing stage and the surface of the plate to be processed is inversely proportional to the pressing step distance corresponding to the pressing stage.

[0030] In this application, a non-piezoelectric ceramic actuator is responsible for long-distance rapid approach, while a piezoelectric ceramic actuator is responsible for short-distance precise contact. This is because the overshoot effect of the indenter may damage the surface of the substrate. For example, taking the surface of the substrate (set as an absolute coordinate of 10μm, initial zero position set to 0μm) as the target contact position, when controlling the indenter to move from 0μm to the target position, a segmented step planning and dynamic overshoot suppression strategy is adopted: First, in the 0~5μm displacement range, a constant step size of 1μm / step is set to drive the indenter to move. Although the inherent dynamic overshoot effect of the piezoelectric ceramic actuator exists in this stage, a preset displacement threshold constraint (overshoot ≤ 10% of the current step size) ensures that the actual displacement of the indenter never exceeds the 5μm coordinate upper limit; after the indenter reaches a steady state at 5μm (steady-state establishment time ≤ 50ms), ... The process then enters the second stage of displacement control (5~8μm range), reducing the step size to 0.1μm / step (i.e., 100nm / step). At this stage, each step displacement of the indenter is accompanied by dynamic process effects (such as step response overshoot), but by reducing the step size, the single overshoot can be controlled within 10nm. Finally, in the 8~10μm range (i.e., the first 2μm of the target surface), the step size is further reduced to 50nm / step. Through micro-step creeping feed (feed speed ≤0.5μm / s), the indenter approaches the target surface with an almost static displacement trend, ultimately achieving non-overshoot contact between the indenter and the plate surface (displacement overshoot ≤5nm at contact), avoiding mechanical damage to the plate surface. In other words, the closer to the surface of the plate to be treated, the slower the pressing speed and the smaller the pressing step size.

[0031] The specific segment distances and the corresponding step distances for each segment can be determined based on human experience.

[0032] S500 controls the pressure head to imprint on the material to be treated according to either the first defect marking method or the second defect marking method, based on the hardness of the material to be treated and the preset defect marking duration; wherein, the first defect marking method is controlled by pressure; and the second defect marking method is controlled by distance.

[0033] Specifically, step S500 also includes: S510, if the hardness of the material to be processed is greater than the preset hardness threshold, and the preset defect marking duration of the material to be processed is greater than the preset defect marking duration threshold, then control the pressure head to perform imprinting according to the first defect marking method.

[0034] S520, if the hardness of the board to be processed is less than or equal to the preset hardness threshold, and the preset defect marking duration of the board to be processed is less than or equal to the preset defect marking duration threshold, then the pressure head is controlled to imprint according to the second defect marking method.

[0035] Specifically, when the preset defect marking duration is short and the hardness of the material to be processed is low, distance control (displacement control) is used. This is because, under these conditions, if pressure control is used, the force, as a continuous acting force, will cause continuous deformation of the material. Furthermore, during the imprinting process, the material deformation may sometimes exceed the resistance from the deformation of the mechanical structure itself, leading to instability in the force and consequently, instability in the imprinting cycle. Displacement control can precisely control the movement distance of the indenter, avoiding the impact of force instability on imprinting accuracy. When the preset defect marking duration is long and the hardness of the material to be processed is high, pressure control is used. Because hard materials deform less during imprinting, i.e., the displacement is smaller, and the pressure sensor can monitor pressure at the micro-Newton level (below millinewtons), its accuracy feedback frequency can meet the requirements, enabling high-precision imprinting. Control based on the preset total pressure is more accurate than displacement control. Moreover, when the imprinting speed increases, the force will rapidly rise to the millinewton or even Newton level, causing the high precision of the pressure sensor to be ineffective. Therefore, when the preset defect marking duration is long and the hardness of the material to be processed is high, pressure control is used. This application's design, which flexibly selects the imprinting control method based on the characteristics of the substrate and the imprinting time, not only achieves nanoscale imprinting accuracy and controllable indentation morphology, solving the problem that traditional mechanical imprinting cannot achieve this effect, but also has high repeatability, is compatible with various film materials of different hardness, and can be integrated into a precision platform. It fully meets the urgent needs of high-end material manufacturing processes for micro-marking systems, and provides reliable marking assurance for subsequent defect location, review, and repair work.

[0036] Furthermore, when pressure control is adopted, for a fixed material material to be processed, under the premise that the imprinting time and imprinting morphology (including imprinting depth and indentation shape) have been preset, the total pressure value required for this imprinting can be determined by using historical experience databases or previous test data.

[0037] In one embodiment, taking into account the exponential material response characteristics of the shear-type pressure sensor (the sensor output signal changes exponentially with pressure, with high sensitivity in the low-pressure range and stable sensitivity in the high-pressure range), the total pressure of 15mN is divided into multiple stages of loading: Initial loading phase (0~10mN): A coarse segmentation strategy is adopted, with a large single loading step size (e.g., 5mN per step) to quickly approach the target pressure range. This phase utilizes the high sensitivity of the sensor in the low pressure range to ensure pressure loading accuracy. Intermediate transition stage (10~13mN): Based on the inflection point characteristics of the sensor material response curve (where the slope of the exponential change changes abruptly), the loading step size is adjusted to the pressure increment corresponding to 0.3μm (the specific pressure increment needs to be calculated in conjunction with the plate stiffness) to avoid pressure overshoot due to sensor response lag. Fine loading stage (13~14.5mN): Further reduce the loading step size to the pressure increment corresponding to 0.1μm, adapt to the stable sensitivity of the sensor in the high pressure range, and realize the micro-adjustment of pressure; Final stabilization phase (14.5~15mN): Using the smallest loading step size (pressure increment corresponding to 0.01μm), the total pressure value is slowly approximated to ensure the final accuracy of pressure loading.

[0038] Regarding time allocation, although the pressure increment is smallest in the final stage, it requires minute pressure adjustments through extremely small step sizes. Reducing the step size directly increases the number of loading steps required per unit pressure increment, thus necessitating the allocation of the longest time to ensure the stability of each loading step. The final stage employs a 0.01μm micro-step loading, essentially reducing the impact between the indenter and the plate surface by decreasing the single displacement increment. Simultaneously, the high sensitivity of the shear-type pressure sensor in the low pressure increment range (achieving micro-Newton-level pressure feedback) ensures pressure deviation for each loading step, ultimately achieving high repeatability (coefficient of variation ≤1%) of the indentation morphology (such as the side length and depth of triangular indentations). If the previous large step sizes of 0.1μm or 0.5μm were used in this stage, the single pressure increment would exceed the sensor's accurate feedback range (pressure deviation increases to over ±0.1mN), and the indenter displacement impact would increase, causing the indentation depth fluctuation range to expand to ±0.5μm, resulting in uneven indentation sizes (such as triangle side length differences exceeding 20%), failing to meet the requirements of high-end materials for consistent marking morphology.

[0039] In summary, there is a negative correlation between force and step size; the smaller the pressure increment, the smaller the step size. There is also a negative correlation between step size and time; the smaller the step size, the higher the proportion of time.

[0040] In one exemplary embodiment of this application, prior to step S200, the method further includes: S001, three test imprint areas are obtained at equal intervals along the preset X and preset Y directions on the material to be processed.

[0041] Specifically, after long-term use, the XY moving platform may experience "non-linear motion errors" due to guide rail wear, lead screw backlash, etc. (e.g., moving 10mm in the X direction but actually moving only 9.998mm). If it moves directly according to the defect coordinates, the defect point will not be able to reach directly under the pressure head. Here, by selecting a test area on the plate and performing pre-imprinting, the actual motion accuracy of the platform is detected, providing a basis for subsequent compensation.

[0042] S002, Obtain images of each test imprint area using a microscope.

[0043] Specifically, by taking images of the test indentation area with a microscope, the actual location of the test indentation can be obtained intuitively, providing a visual basis for calculating the motion error of the platform.

[0044] S003, based on the image of each test imprint area, obtain the distance between any two adjacent test imprint areas.

[0045] S004, if the difference between the distance between any two adjacent test imprint areas and the preset distance is greater than the preset distance difference threshold, then the XY moving platform is positionally compensated based on the difference between the distance between the two adjacent test imprint areas and the preset distance.

[0046] Specifically, a preset distance difference threshold (e.g., ±0.002mm) is used to determine whether platform errors affect marking accuracy. If the error exceeds this value, the defect point will deviate from directly below the indenter, causing the marking to fail. Real-time compensation ensures that the platform's motion accuracy meets the requirements for nanometer-level marking.

[0047] In one exemplary embodiment of this application, after step S002, the method further includes: S005, based on the image of each test imprint area, obtain the dimensional deviation of the test imprint area.

[0048] S006, convert the dimensional deviation of the test imprint area into the z-axis error of the z-axis driver; S007, Based on the z-axis error of the z-axis driver, perform embossing action compensation on the z-axis driver.

[0049] Specifically, if there is an error in the downward pressure of the z-axis driver (e.g., the commanded downward pressure is 5μm, but the actual downward pressure is 5.003μm), the indentation size (e.g., diameter, depth) will exceed expectations.

[0050] Here, the specific implementation can be as follows: for the image of each test imprint area, measure the actual diameter of the indentation (e.g., the preset indentation diameter is 8μm, the actual measurement is 8.006μm, and the size deviation is +0.006μm). Based on the calibration data of the indenter contact area (the relationship between contact area and indentation depth is known: for every 0.001 μm increase in depth, the diameter increases by 0.002 μm), it can be deduced that the actual indentation depth is 0.003 μm greater than the commanded depth (because a 0.006 μm diameter deviation corresponds to a 0.003 μm depth deviation). Therefore, the z-axis driver's z-axis error is determined to be +0.003 μm (i.e., the actual output displacement of the driver is 0.003 μm greater than the commanded displacement).

[0051] Finally, the z-axis error amount +0.003μm is written into the compensation program of the z-axis driver. When controlling the z-axis to press down later, the system will automatically subtract the error amount from the command depth (for example, when the command presses down by 5μm, the actual output pressing amount is 5μm-0.003μm=4.997μm, ensuring that the final indentation depth meets the preset value).

[0052] In one exemplary embodiment of this application, before obtaining the coordinates of each defect point on the board to be processed, the method further includes: S010, calibrate the z-value, calibrate the imprint contact area, and calibrate the motion error of the indenter of the defect marking device.

[0053] Specifically, in one embodiment, a laser displacement sensor can be used to slowly move the pressure head down from its initial position, record the position data of the pressure head tip detected by the laser sensor, compare it with the preset z-axis zero point of the system, and correct the zero point deviation (e.g., if the actual position of the pressure head tip detected by the laser is 2μm lower than the preset zero point, then the system z-axis zero point is lowered by 2μm).

[0054] In one embodiment, the imprint contact area is calibrated as follows: Select a standard indenter (surface flatness < 0.1 μm), control the indenter to press lightly with a pressure of 50 μN, scan the imprinted trace with an atomic force microscope (AFM, such as Bruker Dimension Icon), and measure the actual contact area (e.g., if the indenter is designed with a diameter of 10 μm and the actual contact area is 78.3 μm², the contact area parameter in the system needs to be updated to this value to avoid pressure calculation errors due to area deviation).

[0055] In one embodiment, motion error calibration can be performed using a laser interferometer to control the pressure head to perform multiple reciprocating movements along the z-axis (e.g., from 0 μm to 50 μm and then back), and record the difference between the actual displacement of the pressure head detected by the interferometer and the system command displacement (e.g., when the command displacement is 50 μm, the actual displacement is 49.995 μm, and the error value of 0.005 μm is written into the system compensation table, and the compensation is automatically added during subsequent movements).

[0056] S020, the microscope and defect marking device are calibrated together based on the image of the surface of the plate to be processed.

[0057] Specifically, in one embodiment, the joint calibration method can be as follows: Three calibration targets with known coordinates (e.g., cross-shaped metal targets, with a preset spacing of 10mm) are attached to the surface of the material to be processed (e.g., optical glass). Images of the targets are captured using a microscope, and the pixel coordinates of each target in the microscope image are obtained (e.g., target A has coordinates of (1200, 800) pixels). The XY moving platform is controlled to move the material, aligning the tip of the pressure head with each target, and the mechanical coordinates of the XY moving platform at this time are recorded (e.g., the mechanical coordinates corresponding to target A are (X=50.000mm, Y=30.000mm)). A mapping relationship between pixel coordinates and mechanical coordinates is established (e.g., 1 pixel corresponds to 0.01mm mechanical distance). When the microscope identifies the pixel coordinates of defect points later, they can be automatically converted into precise mechanical coordinates.

[0058] Specifically, the entire imprinting process of piezoelectric ceramics is achieved by using closed-loop control of the piezoelectric ceramics to achieve constant force or constant displacement imprinting.

[0059] After step S500, the pressure head of the defect marking device is raised to obtain the imprint area corresponding to the current defect point, and the particles around the imprint area corresponding to the current defect point are removed.

[0060] After performing joint calibration using a microscope and a defect marking device based on the image of the surface of the material to be treated, the method further includes: Four test imprint areas are obtained along the four corners of the test board surface; images of each test imprint area are obtained using a microscope; the orientation of the test board is obtained based on the images of each test imprint area; if the orientation of the test board is tilted, the tilt amount of the test board is obtained; and the tilt amount of the test board is adjusted accordingly.

[0061] Please refer to Figure 2 As shown, an embodiment of this application provides a defect marking system 100 based on piezoelectric ceramic driven imprinting, the system comprising: The coordinate acquisition unit 110 is used to acquire the coordinates of each defect point of the plate to be processed. The moving unit 120 is used to control the XY moving platform to move the current defect point directly below the pressure head of the defect marking device according to the coordinates of the current defect point in response to processing the current defect point. The distance acquisition unit 130 is used to acquire the distance between the current defect point and the tip of the indenter based on the optical sensor. The pressing unit 140 is used to control the z-axis driver of the defect marking device to drive the pressing head to press down according to the distance between the current defect point and the tip of the pressing head, so that the pressing head contacts the surface of the material to be treated without damaging the surface of the material to be treated; wherein, the z-axis driver includes a non-piezoelectric ceramic driver and a piezoelectric ceramic driver; the pressing distance corresponding to the non-piezoelectric ceramic driver and the pressing distance corresponding to the piezoelectric ceramic driver are different; The imprinting unit 150 is used to control the pressure head to imprint the material to be treated according to the hardness of the material to be treated and the preset defect marking time, according to either the first defect marking method or the second defect marking method; wherein, the first defect marking method is controlled by pressure; and the second defect marking method is controlled by distance.

[0062] Those skilled in the art will understand that various aspects of this application can be implemented as apparatus, method, or program product. Therefore, various aspects of this application can be specifically implemented in the following forms: a completely hardware implementation, a completely software implementation (including firmware, microcode, etc.), or a combination of hardware and software aspects, collectively referred to herein as a "circuit," "module," or "apparatus."

[0063] An electronic device according to this embodiment of the present application. The electronic device is merely an example and should not be construed as limiting the functionality and scope of use of the embodiments of this application.

[0064] Electronic devices are manifested in the form of general-purpose computing devices. The components of an electronic device may include, but are not limited to: at least one processor, at least one memory, and a bus connecting different device components (including memory and processor).

[0065] The memory stores program code that can be executed by a processor, causing the processor to perform the steps described in the "Exemplary Methods" section above, according to various exemplary embodiments of this application.

[0066] The storage may include readable media in the form of volatile storage, such as random access memory (RAM) and / or cache memory, and may further include read-only memory (ROM).

[0067] The storage device may also include a program / utility having a set (at least one) of program modules, including but not limited to: operating device, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0068] A bus can represent one or more of several bus architectures, including a memory bus or memory controller, a peripheral bus, a graphics acceleration port, a processor, or a local bus that uses any of the various bus architectures.

[0069] The electronic device can also communicate with one or more external devices (such as keyboards, pointing devices, Bluetooth devices, etc.), one or more devices that enable a user to interact with the electronic device, and / or any device that enables the electronic device to communicate with one or more other computing devices (such as routers, modems, etc.). This communication can be performed via input / output (I / O) interfaces. Furthermore, the electronic device can communicate with one or more networks (such as local area networks (LANs), wide area networks (WANs), and / or public networks, such as the Internet) via a network adapter. As shown in the figure, the network adapter communicates with other modules of the electronic device via a bus. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with the electronic device, including but not limited to: microcode, device drivers, redundant processors, external disk drive arrays, RAID devices, tape drives, and data backup storage devices.

[0070] Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of this application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, external hard drive, etc.) or on a network, including several instructions to cause a computing device (such as a personal computer, server, terminal device, or network device, etc.) to execute the methods according to the embodiments of this application.

[0071] In exemplary embodiments of this application, a computer-readable storage medium is also provided, on which a program product capable of implementing the methods described above is stored. In some possible implementations, various aspects of this application may also be implemented as a program product including program code, which, when the program product is run on a terminal device, causes the terminal device to perform the steps of the various exemplary embodiments of this application described in the "Exemplary Methods" section above.

[0072] The program product may employ any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor device, apparatus, or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0073] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A readable signal medium may also be any readable medium other than a readable storage medium, capable of sending, propagating, or transmitting a program for use by or in connection with an instruction execution device, apparatus, or apparatus.

[0074] The program code contained on the readable medium may be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber, RF, etc., or any suitable combination thereof.

[0075] Program code for performing the operations of this application can be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as Java and C++, and conventional procedural programming languages ​​such as C or similar languages. The program code can execute entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0076] Furthermore, the above figures are merely illustrative of the processes included in the method according to exemplary embodiments of this application, and are not intended to be limiting. It is readily understood that the processes shown in the above figures do not indicate or limit the temporal order of these processes. Additionally, it is readily understood that these processes may be executed synchronously or asynchronously, for example, in multiple modules.

[0077] It should be noted that although several modules or units for the device used to perform actions have been mentioned in the detailed description above, this division is not mandatory. In fact, according to the embodiments of this application, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0078] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A defect marking method based on piezoelectric ceramic actuation, characterized in that, The method includes: Obtain the coordinates of each defect point on the board material to be processed; In response to processing the current defect point, the XY moving platform is controlled to move the current defect point directly below the pressure head of the defect marking device according to the coordinates of the current defect point; The distance between the current defect point and the tip of the indenter is obtained based on the optical sensor; Based on the distance between the current defect point and the tip of the indenter, the z-axis driver of the defect marking device is controlled to drive the indenter downwards, so that the indenter contacts the surface of the material to be treated without damaging the surface of the material; wherein, the z-axis driver includes a non-piezoelectric ceramic driver and a piezoelectric ceramic driver; the pressing distances corresponding to the non-piezoelectric ceramic driver and the piezoelectric ceramic driver are different. Based on the hardness of the material to be treated and the preset defect marking duration, the pressure head is controlled to imprint the material to be treated according to either the first defect marking method or the second defect marking method; wherein, the first defect marking method is controlled by pressure; and the second defect marking method is controlled by distance.

2. The defect marking method based on piezoelectric ceramic actuation according to claim 1, characterized in that, Before controlling the XY moving platform to move the current defect point directly below the pressure head of the defect marking device according to the coordinates of the current defect point in response to processing the current defect point, the method further includes: Three test imprint areas are obtained at equal intervals along the preset X and preset Y directions on the material to be processed; Images of each test imprint area were obtained using a microscope. Based on the image of each test imprint area, the distance between any two adjacent test imprint areas is obtained; If the difference between the distance between any two adjacent test imprint areas and the preset distance is greater than the preset distance difference threshold, then the XY moving platform is positionally compensated based on the difference between the distance between the two adjacent test imprint areas and the preset distance.

3. The defect marking method based on piezoelectric ceramic actuation according to claim 1, characterized in that, After acquiring images of each test imprint area using a microscope, the method further includes: Based on the image of each test imprint area, the dimensional deviation of the test imprint area is obtained. The dimensional deviation of the test imprint area is converted into the z-axis error of the z-axis driver; Based on the z-axis error of the z-axis driver, the imprinting action is compensated.

4. The defect marking method based on piezoelectric ceramic actuation according to claim 1, characterized in that, The step of controlling the z-axis driver of the defect marking device to drive the pressure head downwards based on the distance between the current defect point and the tip of the pressure head, so that the pressure head contacts the surface of the material to be treated without damaging the surface of the material, includes: Based on the current distance between the defect point and the tip of the indenter, the non-piezoelectric ceramic actuator of the z-axis drive of the defect marking device is controlled to press down a first distance; The piezoelectric ceramic actuator of the z-axis driver of the defect marking device continues to press down a second distance until the indenter contacts the surface of the material to be treated without damaging the surface of the material; wherein, the second distance is a fixed distance; the distance between the current defect point and the tip of the indenter is the sum of the first distance and the second distance.

5. The defect marking method based on piezoelectric ceramic actuation according to claim 4, characterized in that, The piezoelectric ceramic actuator of the z-axis driver of the defect marking device continues to press down a second distance until the indenter contacts the surface of the plate to be treated without damaging the surface of the plate to be treated, including: Based on the material of the indenter and the corresponding imprint distance mapping table, the number of pressing stages of the piezoelectric ceramic actuator of the z-axis driver of the current defect marking device, as well as the start position, end position and pressing step distance corresponding to each pressing stage are obtained; wherein, the distance between the end position of the pressing stage and the surface of the plate to be processed is inversely proportional to the pressing step distance corresponding to the pressing stage.

6. The defect marking method based on piezoelectric ceramic actuation according to claim 1, characterized in that, The step of controlling the indenter to imprint the material to be processed according to the hardness of the material and the preset defect marking duration, based on either the first defect marking method or the second defect marking method, includes: If the hardness of the board to be processed is greater than the preset hardness threshold, and the preset defect marking duration of the board to be processed is greater than the preset defect marking duration threshold, then the pressure head is controlled to imprint according to the first defect marking method. If the hardness of the material to be processed is less than or equal to the preset hardness threshold, and the preset defect marking duration of the material to be processed is less than or equal to the preset defect marking duration threshold, then the pressure head is controlled to imprint according to the second defect marking method.

7. The defect marking method based on piezoelectric ceramic actuation according to claim 1, characterized in that, Before obtaining the coordinates of each defect point on the board to be treated (step 7), the method further includes: The z-value, imprint contact area, and motion error of the indenter of the defect marking device are calibrated. The microscope and defect marking device are calibrated together based on the surface image of the plate to be processed.

8. A defect marking system based on piezoelectric ceramic driven imprinting, characterized in that, The system includes: The coordinate acquisition unit is used to acquire the coordinates of each defect point in the board material to be processed; The moving unit, in response to processing the current defect point, controls the XY moving platform to move the current defect point directly below the pressure head of the defect marking device according to the coordinates of the current defect point; The distance acquisition unit is used to acquire the distance between the current defect point and the tip of the indenter based on the optical sensor. The pressing unit is used to control the z-axis driver of the defect marking device to press down the pressing head according to the distance between the current defect point and the tip of the pressing head, so that the pressing head contacts the surface of the material to be treated without damaging the surface of the material to be treated; wherein, the z-axis driver includes a non-piezoelectric ceramic driver and a piezoelectric ceramic driver; the pressing distance corresponding to the non-piezoelectric ceramic driver and the pressing distance corresponding to the piezoelectric ceramic driver are different; The imprinting unit is used to control the pressure head to imprint the material to be processed according to the hardness of the material and the preset defect marking duration, either according to a first defect marking method or a second defect marking method; wherein, the first defect marking method is controlled by pressure; and the second defect marking method is controlled by distance.

9. A non-transitory computer-readable storage medium, characterized in that, The storage medium stores at least one instruction or at least one program segment, which is loaded and executed by a processor to implement the method as described in any one of claims 1-7.

10. An electronic device, characterized in that, Includes a processor and the non-transitory computer-readable storage medium as described in claim 9.

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