Defect marking method, system, medium, and apparatus based on piezoelectric ceramic drive

Abstract

The application provides a defect marking method, system, medium and equipment based on piezoelectric ceramic driving, relates to the field of precise micro-nano processing technology, and comprises the following steps: acquiring the coordinates of each defect point of a to-be-processed plate; controlling an XY moving platform to move a current defect point to the bottom of a pressure head of a defect marking device according to the coordinates of the current defect point; acquiring the distance between the current defect point and the tip of the pressure head; controlling a z-axis driver of the defect marking device to drive the pressure head to press down, so that the pressure head is in contact with the surface of the to-be-processed plate without damaging the surface of the to-be-processed plate; and according to the hardness of the to-be-processed plate and a preset defect marking duration, controlling the pressure head to perform pressure imprinting on the to-be-processed plate according to a first defect marking mode or a second defect marking mode. The application realizes nanoscale pressure imprinting precision and controllable indentation morphology, solves the problem that the traditional mechanical pressure imprinting is difficult to realize the effect, and is also provided with high repeat precision and can be compatible with various film layer materials with different hardness.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of precision micro-nano processing, and in particular to a defect marking method, system, medium and equipment based on piezoelectric ceramic driving. BACKGROUND

[0002] In the manufacturing process of high-end optical glass, photomask, semiconductor wafer and other materials, micron or even nanometer level surface defects often occur. Although the traditional optical detection system can identify these defects, it lacks a high-precision, non-destructive and repeatable microscopic marking method near the defects, so as to facilitate subsequent positioning, rechecking or repairing.

[0003] In the prior art, laser marking and ion beam etching can achieve micron-level marking, but have problems such as large heat affected zone, complex equipment, high cost, and easy introduction of pollution. Although the mechanical imprinting method has a simple structure, it is difficult to achieve nanometer-level precision and controllable indentation morphology.

[0004] Therefore, there is an urgent need for a nano-imprint marking system that can be integrated into a precision platform, has high repeatable precision, low pollution, and is compatible with various film layer materials. SUMMARY

[0005] To solve the above technical problems, the present application provides a defect marking method, system, medium and equipment based on piezoelectric ceramic driving.

[0006] In the first aspect of the present application, a defect marking method based on piezoelectric ceramic driving is provided, which comprises:

[0007] Obtaining the coordinates of each defect point of the plate to be processed;

[0008] In response to processing the current defect point, controlling the XY moving platform to move the current defect point to the directly below the indenter of the defect marking device according to the coordinates of the current defect point;

[0009] Obtaining the distance between the current defect point and the tip of the indenter according to the optical sensor;

[0010] According to the distance between the current defect point and the tip of the indenter, controlling the z-axis driver of the defect marking device to drive the indenter to press down, so that the indenter contacts the surface of the plate to be processed without damaging the surface of the plate to be processed; wherein the z-axis driver comprises a non-piezoelectric ceramic driver and a piezoelectric ceramic driver; the corresponding pressing distance of the non-piezoelectric ceramic driver and the corresponding pressing distance of the piezoelectric ceramic driver are different;

[0011] According to the hardness of the plate to be processed and a preset defect marking duration, the pressing head is controlled to perform imprinting on the plate to be processed according to a first defect marking mode or a second defect marking mode; wherein the first defect marking mode is controlled according to pressure; and the second defect marking mode is controlled according to distance.

[0012] In a second aspect of the present application, a defect marking system based on piezoelectric ceramic driving imprinting is provided, and the system comprises:

[0013] A coordinate acquisition unit is configured to acquire coordinates of each defect point of the plate to be processed;

[0014] A moving unit is configured to, in response to processing a current defect point, control the XY moving platform to move the current defect point to be directly below the pressing head of the defect marking device according to the coordinates of the current defect point;

[0015] A distance acquisition unit is configured to acquire a distance between the current defect point and the tip of the pressing head according to the optical sensor;

[0016] A pressing unit is configured to, according to the distance between the current defect point and the tip of the pressing head, control the z-axis driver of the defect marking device to drive the pressing head to press down, so that the pressing head is in contact with the surface of the plate to be processed without damaging the surface of the plate to be processed; wherein the z-axis driver comprises a non-piezoelectric ceramic driver and a piezoelectric ceramic driver; the corresponding pressing distance of the non-piezoelectric ceramic driver and the corresponding pressing distance of the piezoelectric ceramic driver are different;

[0017] An imprinting unit is configured to, according to the hardness of the plate to be processed and a preset defect marking duration, control the pressing head to perform imprinting on the plate to be processed according to a first defect marking mode or a second defect marking mode; wherein the first defect marking mode is controlled according to pressure; and the second defect marking mode is controlled according to distance.

[0018] In a third aspect of the present application, a non-transitory computer readable storage medium is provided, and the storage medium stores at least one instruction or at least one program, and the at least one instruction or at least one program is loaded and executed by a processor to implement the foregoing defect marking method based on piezoelectric ceramic driving.

[0019] In a fourth aspect of the present application, an electronic device is provided, comprising a processor and the foregoing non-transitory computer readable storage medium.

[0020] The present application has at least the following beneficial effects:

[0021] The defect marking method based on piezoelectric ceramic driving provided by the application first acquires the coordinates of each defect point of the plate to be processed through a coordinate acquisition unit, and then a moving unit controls an XY moving platform to accurately move the current defect point to the exact position below the pressure head of the defect marking device according to the coordinates, so as to ensure the accurate correspondence between the marking position and the defect point and lay a foundation for subsequent high-precision marking. Next, a distance acquisition unit acquires the distance between the current defect point and the tip of the pressure head with the help of an optical sensor, and a pressing unit controls the z-axis driver of the defect marking device to drive the pressure head to press down according to the distance. The z-axis driver includes a non-piezoelectric ceramic driver and a piezoelectric ceramic driver, and the two correspond to different pressing distances. This design can flexibly select the appropriate driver according to actual needs, ensure the contact between the pressure head and the surface of the plate to be processed, avoid excessive pressing of the pressure head to damage the surface of the plate to be processed, realize non-destructive marking, overcome the defects that laser marking and ion beam etching are easy to cause damage to the material surface and traditional mechanical imprinting is difficult to control the imprinting strength, and at the same time, without complex equipment structure, the equipment cost is reduced, and pollution is not introduced, which meets the requirements of low pollution and non-destructive marking in the process of high-end material manufacturing. Finally, the imprinting unit flexibly selects a first defect marking mode (pressure control) or a second defect marking mode (displacement control) to perform imprinting on the plate to be processed according to the hardness of the plate to be processed and the preset defect marking time. When the preset defect marking time is short and the hardness of the plate to be processed is small, distance control (displacement control) is adopted. This is because in this case, if pressure control is adopted, force as a continuous force will cause the material to deform continuously, and sometimes the material deformation during imprinting will be greater than the resistance caused by the deformation of the mechanical structure itself, resulting in unstable force, which in turn causes unstable imprinting cycle. Displacement control can accurately control the movement distance of the pressure head to avoid the influence of unstable force on imprinting precision. When the preset defect marking time is long and the hardness of the plate to be processed is large, pressure control is adopted. Since the material with large hardness deforms less during imprinting, i.e. the displacement is small, and the pressure sensor can monitor the pressure of the micro-newton level (below the millinewton level), the accuracy feedback frequency can meet the demand, and high-precision imprinting can be realized. According to the preset total pressure, the control is more accurate than displacement control. Moreover, when the imprinting speed increases, the force will quickly rise to the level of millinewton or even newton, which makes the high precision of the pressure sensor cannot be reflected. Therefore, when the preset defect marking time is long and the hardness of the plate to be processed is large, pressure control is adopted. The design of the application flexibly selects the imprinting control mode according to the characteristics of the plate to be processed and the imprinting time, not only realizes the imprinting precision of nanometer level and the controllable indentation morphology, solves the problem that traditional mechanical imprinting is difficult to realize this effect, but also has high repeatable precision, can be compatible with various film layer materials with different hardness, can be integrated into a precision platform, and completely meets the urgent needs of the micro marking system in the process of high-end material manufacturing, providing reliable marking guarantee for the subsequent positioning, review and repair work of the defect point. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort based on these drawings.

[0023] Figure 1 The flow chart of the defect marking method based on piezoelectric ceramic driving provided by the embodiments of the present application is shown in the figure.

[0024] Figure 2 The structural block diagram of the defect marking system based on piezoelectric ceramic driving embossing provided by the embodiments of the present application is shown in the figure. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort belong to the scope of protection of the present application.

[0026] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or server including a series of steps or units does not necessarily limit to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0027] It should be noted that the following description covers various aspects of embodiments within the scope of the appended claims. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0028] Please refer to Figure 1 As shown, embodiments of this application provide a defect marking method based on piezoelectric ceramics, the method comprising:

[0029] S100: Obtain the coordinates of each defect point on the board to be processed.

[0030] Specifically, step S100 also includes:

[0031] S110: Obtain an image of the surface of the material to be treated using a microscope.

[0032] Here, high-resolution microscopy is used to capture the details of the plate surface, ensuring micron / nanoscale defects.

[0033] S120: Based on the image of the surface of the board to be processed, obtain the coordinates of each defect point.

[0034] Here, the location of the defect in the image is extracted by the image recognition algorithm, and then combined with the mapping relationship of the previous "microscope-imprint device joint calibration", the image coordinates are converted into mechanical coordinates, providing a precise target position for the subsequent platform movement.

[0035] Specifically, a defect identification algorithm (such as the YOLOv8 model based on deep learning, which is trained in advance with 10,000 images of board material containing defects) is used to analyze the collected images and mark the center pixel coordinates of each defect (e.g., the center coordinates of a certain scratch defect are (2500, 1800) pixels).

[0036] Based on the pre-established mapping relationship between pixel coordinates and machine coordinates, for example: 1 pixel = 0.01 mm, the pixel coordinates are converted into machine coordinates (2500 × 0.01 mm = 25.000 mm, 1800 × 0.01 mm = 18.000 mm), that is, the machine coordinates of the defect are (X = 25.000 mm, Y = 18.000 mm), and stored in the system defect coordinate library.

[0037] S200, in response to processing the current defect point, controlling the XY moving platform to move the current defect point to be directly below the pressure head of the defect marking device according to the coordinates of the current defect point.

[0038] Specifically, the defect coordinates of the current defect to be processed are retrieved from the defect coordinate library (such as (X=25.000mm, Y=18.000mm)); the XY moving platform is controlled to move according to the coordinates, and the position is fed back in real time during the movement through the grating ruler (resolution 0.1μm) of the platform to ensure that the deviation between the center of the defect point and the tip of the pressure head is ≤0.2μm (for example: if the grating ruler detects the stop position coordinates as (25.0002mm, 17.9999mm), the deviation is within the allowable range, and there is no need for secondary adjustment).

[0039] S300, acquiring the distance between the current defect point and the tip of the pressure head according to the optical sensor.

[0040] Specifically, a fiber displacement sensor (such as Keyence IL-100) is installed beside the pressure head, the transmitting end of the sensor is aligned with the surface of the defect point, and the receiving end detects the reflected light signal; according to the calibration curve (for example: when the signal strength is 80%, the corresponding distance is 100μm) provided by the sensor, the current signal strength is read in real time and converted into distance (if the signal strength is 60%, the distance is 150μm), and the distance (150μm) is taken as the initial reference value of the z-axis pressing.

[0041] S400, according to the distance between the current defect point and the tip of the pressure head, controlling the z-axis driver of the defect marking device to drive the pressure head to press down, so that the pressure head contacts the surface of the plate to be processed without damaging the surface of the plate to be processed; wherein the z-axis driver includes a non-piezoelectric ceramic driver and a piezoelectric ceramic driver; the corresponding pressing distance of the non-piezoelectric ceramic driver is different from the corresponding pressing distance of the piezoelectric ceramic driver.

[0042] Specifically, step S400 further comprises:

[0043] S410, according to the distance between the current defect point and the tip of the pressure head, controlling the non-piezoelectric ceramic driver of the z-axis driver of the defect marking device to press down by a first distance.

[0044] S420, controlling the piezoelectric ceramic driver of the z-axis driver of the defect marking device to continue to press down by a second distance until the pressure head contacts the surface of the plate to be processed without damaging the surface of the plate to be processed; wherein the second distance is a fixed distance; the distance between the current defect point and the tip of the pressure head is the sum of the first distance and the second distance.

[0045] Specifically, step S420 further comprises:

[0046] S421, according to the material of the pressure head and the pressure head corresponding to the imprint distance mapping table, the number of times of the piezoelectric ceramic driver of the z-axis driver of the current defect marking device is obtained, and the starting position, the ending position and the down pressure step distance corresponding to each down pressure stage; wherein the closer to the surface of the to-be-processed plate, the slower the down pressure speed, and the smaller the down pressure step distance.

[0047] In this application, the non-piezoelectric ceramic driver is responsible for long-distance fast approach, and the piezoelectric ceramic driver is responsible for short-distance accurate contact. Because the overshoot effect of the pressure head may cause damage to the surface of the to-be-processed plate, as an example: taking the surface of the to-be-processed plate (set as the target contact position at the absolute coordinate of 10 μm, and the initial zero position is set as 0 μm) as the target contact position, when the pressure head needs to be controlled to move from 0 μm to the target position, a segmented step distance planning and dynamic overshoot suppression strategy is adopted: first, in the 0~5 μm displacement interval, set the constant step distance of 1 μm / step to drive the pressure head to move, although there is an inherent dynamic overshoot effect of the piezoelectric ceramic driver, but through the pre-set displacement threshold constraint (overshoot amount≤10% of the current step distance), it is ensured that the actual displacement of the pressure head is always within the upper limit of 5 μm coordinate; after the pressure head reaches the steady state at 5 μm (steady state establishment time≤50 ms), the second stage displacement control (5~8 μm interval) is entered, and the step distance is reduced to 0.1 μm / step (i.e. 100 nm / step), at this time, the displacement of the pressure head at each step is accompanied by a dynamic process effect (such as step response overshoot), but by reducing the step distance, the single overshoot amount can be controlled within 10 nm; finally, in the 8~10 μm interval (i.e. 2 μm range in front of the target surface), the step distance is further reduced to 50 nm / step, and through the micro-step distance peristalsis feeding (feeding speed≤0.5 μm / s), the pressure head approaches the target surface with an approximate static displacement trend, and finally realizes the non-overshoot contact (contact instantaneous displacement overshoot amount≤5 nm) between the pressure head and the plate surface, avoiding mechanical damage to the plate surface. That is, the closer to the surface of the to-be-processed plate, the slower the down pressure speed, and the smaller the down pressure step distance.

[0048] And the specific segmented distance and the step distance corresponding to each segment can be determined according to artificial experience.

[0049] S500, according to the hardness of the to-be-processed plate and the preset defect marking time, controlling the pressure head to perform imprint on the to-be-processed plate according to the first defect marking mode or the second defect marking mode; wherein the first defect marking mode is controlled according to pressure; and the second defect marking mode is controlled according to distance.

[0050] Specifically, step S500 further comprises:

[0051] S510, if the hardness of the to-be-processed plate is greater than the preset hardness threshold, and the preset defect marking time of the to-be-processed plate is greater than the preset defect marking time threshold, then controlling the pressure head to perform imprint according to the first defect marking mode.

[0052] S520, if the hardness of the to-be-processed plate material is less than or equal to the preset hardness threshold value, and the preset defect marking duration of the to-be-processed plate material is less than or equal to the preset defect marking duration threshold value, the pressing head is controlled to perform the pressure imprinting according to the second defect marking mode.

[0053] Specifically, when the preset defect marking duration is short and the hardness of the to-be-processed plate material is low, distance control (displacement control) is adopted. This is because, in this case, if pressure control is adopted, the force as a continuous force will cause the material to continuously deform, and sometimes the material deformation during the pressure imprinting process will be greater than the resistance caused by the deformation of the mechanical structure body, resulting in unstable force, and further causing unstable pressure imprinting cycle. However, displacement control can accurately control the moving distance of the pressing head, avoiding the influence of unstable force on the pressure imprinting precision. When the preset defect marking duration is long and the hardness of the to-be-processed plate material is high, pressure control is adopted. Since the material with high hardness deforms less during the pressure imprinting process, i.e., the displacement is small, and the pressure sensor can monitor the pressure in the order of micro-newtons (below millinewtons), the precision feedback frequency can meet the demand, and high-precision pressure imprinting can be achieved. According to the preset total pressure, the control is more accurate than displacement control. Moreover, when the pressure imprinting speed increases, the force will quickly rise to the order of millinewtons or even newtons, which makes it impossible for the high precision of the pressure sensor to be reflected. Therefore, when the preset defect marking duration is long and the hardness of the to-be-processed plate material is high, pressure control is adopted. The design of the present application flexibly selects the pressure imprinting control mode according to the characteristics of the to-be-processed plate material and the pressure imprinting time. Not only does it achieve nanoscale pressure imprinting precision and controllable indentation morphology, but it also solves the problem that traditional mechanical pressure imprinting is difficult to achieve this effect. In addition, it has high repeatability and can be compatible with various film layer materials of different hardness. It can be integrated into a precision platform and fully meets the urgent needs of micro-marking systems in high-end material manufacturing processes, providing reliable marking protection for subsequent positioning, review and repair of defect points.

[0054] Further, when pressure control is adopted, for to-be-processed plate materials of a fixed material, under the premise that the pressure imprinting time and the pressure imprinting morphology (including pressure imprinting depth and indentation shape) are preset, the total pressure value required for this pressure imprinting can be determined through historical experience database or previous pressure test data.

[0055] In one embodiment, in combination with the exponential material response characteristic of the shear type pressure sensor (the sensor output signal changes exponentially with the pressure, the sensitivity is high in the low pressure segment, and the sensitivity tends to be stable in the high pressure segment), the 15 mN total pressure is divided into multiple stages of loading:

[0056] Initial loading stage (0~10 mN): coarse segmentation strategy is adopted, and the single loading step is large (such as 5 mN per step), which quickly approaches the target pressure interval. In this stage, the high sensitivity characteristic of the low pressure segment of the sensor is utilized to ensure the pressure loading precision.

[0057] Intermediate transition stage (10~13 mN): Based on the inflection point characteristics of the sensor material response curve (abrupt change in exponential slope), the loading step is adjusted to the pressure increment corresponding to 0.3 μm (the specific pressure increment needs to be calculated in combination with the plate stiffness), to avoid pressure overshoot due to sensor response lag;

[0058] Fine loading stage (13~14.5 mN): Further reduce the loading step to the pressure increment corresponding to 0.1 μm, adapt to the characteristics of stable sensitivity of the sensor in the high pressure segment, and realize the micro adjustment of pressure;

[0059] Final stable stage (14.5~15 mN): The smallest loading step (0.01 μm corresponding to the pressure increment) is used to slowly approach the total pressure value, to ensure the final accuracy of the pressure loading.

[0060] As for the allocation of time, although the pressure increment in the final stage is the smallest, it needs to realize the micro adjustment of pressure through the smallest step, and the reduction of step directly leads to a significant increase in the number of loading steps required for unit pressure increment, so the longest time needs to be allocated to ensure the stability of each loading step. The final stage uses a 0.01 μm micro-step loading, which essentially reduces the single displacement increment and reduces the contact impact of the pressure head and the plate surface, while cooperating with the high sensitivity of the shear type pressure sensor in the low pressure increment interval (micro-newton level pressure feedback can be realized), to ensure the pressure deviation of each loading step, and finally realize the high repeatability (coefficient of variation ≤1%) of the indentation morphology (such as the side length and depth of the triangular indentation). If the large step of 0.1 μm or 0.5 μm is used in this stage, it will cause the single pressure increment to exceed the accurate feedback range of the sensor (the pressure deviation increases to ±0.1 mN or more), and the pressure head displacement impact increases, causing the indentation depth fluctuation interval to expand to ±0.5 μm, resulting in uneven indentation size (such as the triangular side length difference exceeding 20%), which cannot meet the needs of high-end materials for the consistency of the mark morphology.

[0061] In summary, there is a negative correlation between force and step, the smaller the pressure increment, the smaller the step, and there is a negative correlation between step and time, the smaller the step, the higher the time proportion.

[0062] In an exemplary embodiment of the present application, before step S200, the method further comprises:

[0063] S001, respectively acquiring three test imprint areas equidistantly along the preset X and Y directions on the plate to be processed.

[0064] Specifically, after long-term use of the XY moving platform, "motion nonlinear error" (e.g., moving 10 mm along the X direction, actually moving 9.998 mm) may occur due to guide rail wear, screw gap, etc. If the defect coordinates are directly moved, the defect point cannot reach the position directly below the pressure head. Here, the actual motion accuracy of the platform is detected by selecting a test area on the plate for pre-embossing, providing a basis for subsequent compensation.

[0065] S002, acquiring an image of each test embossing area according to the microscope.

[0066] Specifically, by shooting the test embossing area image through the microscope, the actual position of the test indentation can be directly obtained, providing a visual basis for calculating the motion error of the platform.

[0067] S003, obtaining the distance between any two adjacent test embossing areas according to the image of each test embossing area.

[0068] S004, if the difference between the distance between any two adjacent test embossing areas and the preset distance is greater than the preset distance difference threshold, compensating the position of the XY moving platform according to the difference between the distance between the two adjacent test embossing areas and the preset distance.

[0069] Specifically, the preset distance difference threshold (e.g., ±0.002 mm) is a standard for judging whether the platform error affects the marking accuracy. If the error exceeds this value, the defect point will deviate from the position directly below the pressure head, resulting in failed marking. Here, real-time compensation is used to ensure that the motion accuracy of the platform meets the nanoscale marking requirements.

[0070] In an exemplary embodiment of the present application, after step S002, the method further comprises:

[0071] S005, obtaining the size deviation of the test embossing area according to the image of each test embossing area.

[0072] S006, converting the size deviation of the test embossing area into the z-axis error amount of the z-axis driver;

[0073] S007, compensating the embossing action of the z-axis driver according to the z-axis error amount of the z-axis driver.

[0074] Specifically, if there is an error when the z-axis driver is pressed (e.g., the command is to press 5 μm, but the actual pressing is 5.003 μm), the size of the indentation (e.g., diameter, depth) will exceed the expected value.

[0075] Here, the specific implementation can be: for the image of each test embossing area, the actual diameter of the indentation is measured (e.g., the preset indentation diameter is 8 μm, the actual measurement is 8.006 μm, and the size deviation is +0.006 μm);

[0076] Combined with the indenter contact area calibration data (the relationship between the known contact area and the depth of indentation: such as the diameter increases 0.002 μm for every 0.001 μm increase in depth), it can be deduced that the actual depth of indentation is 0.003 μm more than the command depth (because a 0.006 μm diameter deviation corresponds to a 0.003 μm depth deviation). Further, the z-axis driver's z-direction error amount is determined to be +0.003 μm (i.e., the driver's actual output displacement is 0.003 μm more than the command displacement).

[0077] Finally, the z-direction error amount +0.003 μm is written into the compensation program of the z-axis driver, and in subsequent control of the z-axis indentation, the system automatically subtracts the error amount from the command depth (for example: when the command indentation depth is 5 μm, the actual output indentation depth is 5 μm-0.003 μm=4.997 μm, ensuring that the final indentation depth meets the preset value).

[0078] In an exemplary embodiment of the present application, before obtaining the coordinates of each defect point of the plate to be processed, the method further comprises:

[0079] S010, z value calibration, impression contact area calibration and motion error calibration of the indenter of the defect marking device.

[0080] Specifically, in an embodiment, a laser displacement sensor can be used to slowly lower the indenter from the initial position, and record the position data of the laser sensor detecting the tip of the indenter. Compared with the system preset z-axis zero point, the zero point deviation is corrected (for example: if the laser detects that the actual position of the tip of the indenter is 2 μm lower than the preset zero point, the system z-axis zero point is lowered by 2 μm).

[0081] In an embodiment, the impression contact area calibration is as follows: a standard indenter (surface flatness <0.1 μm) is selected, the indenter is controlled to lightly press the indenter with a pressure of 50 μN, and an atomic force microscope (AFM, such as Bruker DimensionIcon) is used to scan the trace after impression, and the actual contact area is measured (for example: if the actual contact area of the indenter designed with a diameter of 10 μm is 78.3 μm², the contact area parameter in the system needs to be updated to this value to avoid errors in pressure calculation due to area deviation).

[0082] In an embodiment, the motion error calibration can use a laser interferometer to control the indenter to make multiple reciprocating motions along the z-axis (such as from 0 μm to 50 μm and back), and record the difference between the actual displacement of the indenter detected by the interferometer and the system command displacement (for example: when the command displacement is 50 μm, the actual displacement is 49.995 μm, and the error value of 0.005 μm is written into the system compensation table, which is automatically added to the compensation in subsequent motion).

[0083] S020, combined calibration of the microscope and the defect marking device according to the surface image of the plate to be processed.

[0084] Specifically, in one embodiment, the specific joint calibration method can be as follows: paste 3 calibration targets (such as cross-shaped metal targets, the interval is preset to 10 mm) with known coordinates on the surface of the plate (such as optical glass) to be processed, capture the target image by the microscope, and obtain the pixel coordinates of each target in the microscope image (for example, the coordinates of target A in the image are (1200, 800) pixels); control the XY moving platform to move the plate, so that the tip of the pressure head is aligned with each target respectively, and record the mechanical coordinates of the XY moving platform at this time (for example, the mechanical coordinates corresponding to target A are (X=50.000 mm, Y=30.000 mm)); establish the mapping relationship between the pixel coordinates and the mechanical coordinates (for example, 1 pixel corresponds to 0.01 mm mechanical distance), and when the pixel coordinates of the defect point are recognized by the microscope later, the pixel coordinates can be automatically converted into accurate mechanical coordinates.

[0085] Specifically, the entire piezoelectric ceramic stamping process is realized according to the closed-loop control of the piezoelectric ceramic to realize constant force or constant displacement stamping.

[0086] After step S500, the tip of the defect marking device is lifted to obtain the stamping area corresponding to the current defect point, and the particles around the stamping area corresponding to the current defect point are sucked away.

[0087] After the microscope and the defect marking device are jointly calibrated according to the surface image of the plate to be processed, the method further comprises:

[0088] Four test stamping areas are obtained on the test plate along the four corners of the surface of the test plate; the image of each test stamping area is obtained by the microscope; the posture of the test plate is obtained according to the image of each test stamping area; if the posture of the test plate is inclined, the inclination of the test plate is obtained; and the test plate is adjusted according to the inclination of the test plate.

[0089] Please refer to Figure 2 As shown in the figure, the embodiment of the present application provides a defect marking system 100 based on piezoelectric ceramic driving stamping, which comprises:

[0090] The coordinate acquisition unit 110 is configured to acquire the coordinates of each defect point of the plate to be processed;

[0091] The moving unit 120 is configured to, in response to processing the current defect point, control the XY moving platform to move the current defect point to the directly below the tip of the pressure head of the defect marking device according to the coordinates of the current defect point;

[0092] The distance acquisition unit 130 is configured to acquire the distance between the current defect point and the tip of the pressure head according to the optical sensor;

[0093] The pressing unit 140 is configured to control the Z-axis driver of the defect marking device to drive the indenter to press down according to the distance between the current defect point and the tip of the indenter, so that the indenter is in contact with the surface of the plate to be processed without damaging the surface of the plate to be processed. The Z-axis driver includes a non-piezoelectric ceramic driver and a piezoelectric ceramic driver. The corresponding pressing distance of the non-piezoelectric ceramic driver is different from the corresponding pressing distance of the piezoelectric ceramic driver.

[0094] The stamping unit 150 is configured to control the indenter to stamp the plate to be processed according to the first defect marking mode or the second defect marking mode according to the hardness of the plate to be processed and the preset defect marking time. The first defect marking mode is controlled according to the pressure. The second defect marking mode is controlled according to the distance.

[0095] Those skilled in the art can understand that various aspects of the present application can be implemented as devices, methods or program products. Therefore, various aspects of the present application can be embodied in the form of a complete hardware implementation, a complete software implementation (including firmware, microcode, etc.), or a combination of hardware and software aspects, which can be collectively referred to as "circuitry", "module" or "device" here.

[0096] The electronic device according to this embodiment of the present application. The electronic device is only an example and should not limit the function and use range of the embodiments of the present application.

[0097] The electronic device is in the form of a general computing device. The components of the electronic device can include but are not limited to the above-mentioned at least one processor, the above-mentioned at least one storage, and a bus connecting different device components (including storage and processor).

[0098] The storage stores program code that can be executed by the processor to cause the processor to perform the steps described in the "example method" section of the present specification according to various example embodiments of the present application.

[0099] The storage can include a readable medium in the form of a volatile storage, such as a random access memory (RAM) and / or a cache memory, and can further include a read-only memory (ROM).

[0100] The storage can also include programs / utilities with a set of (at least one) program modules, such as operation devices, one or more application programs, other program modules, and program data, each of which or some combination of which can include the implementation of a network environment.

[0101] The bus can be one or more of several types of bus structures including a memory bus or memory controller, a peripheral bus, a graphics bus, a processor or local bus using any of a variety of bus architectures.

[0102] The electronic device can also communicate with one or more external devices such as a keyboard or a pointing device, through an I / O interface. The I / O interface can also include devices such as a Bluetooth device, a universal serial bus (USB) device, a serial device, a parallel device, or a game port. The electronic device can communicate with one or more devices that enable a user to interact with the electronic device through the I / O interface. The electronic device can also include a communication interface that can enable the electronic device to communicate with one or more other electronic devices. The communication interface can include a modem, a network interface card, a communication port, or a wireless communication device, just to mention a few. The communication interface can enable the electronic device to communicate with one or more other electronic devices using electrical, electromagnetic, or optical packets, streams, or signals.

[0103] From the above description of the embodiments, it is easy for those skilled in the art to understand that the example embodiments described herein can be implemented by software, or by software in combination with necessary hardware. Therefore, the technical solution according to the embodiments of the present application can be embodied in the form of a software product. The software product can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash disk, a mobile hard disk, or the like) or a network, and includes a number of instructions to enable a computing device (which can be a personal computer, a server, a terminal device, or a network device, etc.) to perform the method according to the embodiments of the present application.

[0104] In the example embodiments of the present application, a computer readable storage medium is also provided, which stores a program product capable of implementing the method described above. In some possible embodiments, various aspects of the present application can also be implemented in the form of a program product, which includes program codes for causing a terminal device to perform the steps described in the “example method” section above according to various example embodiments of the present application when the program product is run on the terminal device.

[0105] A program product can take any combination of one or more computer-readable media. The computer-readable media can be a computer-readable storage medium or a computer-readable signal medium. The computer-readable storage medium can be, for example, but not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the above. More specific examples (a non-exhaustive list) of the computer-readable storage medium include an electrical connection having one or more wires, a portable disc, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above.

[0106] The computer-readable signal medium can include a computer-readable storage medium that is propagated as a carrier wave in a baseband or propagated as part of a propagated data signal in a carrier, such as a propagated signal. The propagated signal can take any of a variety of forms, including, but not limited to, electro-magnetic, optical, or any suitable combination thereof. A computer-readable signal medium can be any computer-readable medium that is not a computer-readable storage medium and that can communicate, propagate, or transport programming for use by or in connection with an instruction execution system, apparatus, or device.

[0107] The program code embodied on the computer-readable media can be transmitted using any appropriate medium, including but not limited to wireless, wired, optical, RF, etc., or any suitable combination of the above.

[0108] Program code for carrying out operations of the present application can be written in any combination of one or more programming languages, including an object-oriented programming language such as Java, C++, etc., and conventional procedural programming languages, such as the "C" programming language or similar programming languages. The program code can execute entirely on the user's computing device, partly on the user's computing device, as a stand-alone software package, partly on the user's computing device and partly on a remote computing device or entirely on the remote computing device or server. In the latter scenario, the remote computing device can be connected to the user's computing device through any type of network, including a local area network (LAN) or a wide area network (WAN), or the connection can be made to an external computing device, such as through the Internet using an Internet Service Provider. The computer program product described above can be implemented in any combination of hardware and / or software. The computer program product can be implemented in one or more computer programs or one or more programs development tools.

[0109] In addition, the above-described flowcharts are merely illustrative of the processes involved in the method according to the exemplary embodiments of the present application, and are not intended to limit the present application. It is readily understood that the processes shown in the above-described flowcharts do not indicate or limit the time sequence of the processes. In addition, it is readily understood that the processes can be executed synchronously or asynchronously, for example, in a plurality of modules.

[0110] It should be noted that, although several modules or units of the devices for action execution are mentioned in the above detailed description, the division into these modules or units is not mandatory. Indeed, according to an embodiment of the application, the features and functionalities of two or more of the above-described modules or units can be embodied in one module or unit. Conversely, the features and functionalities of one of the above-described modules or units can be further divided into several modules or units.

[0111] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A defect marking method based on piezoelectric ceramic drive, characterized by, The method comprises: acquiring coordinates of each defect point of the to-be-processed board; in response to processing the current defect point, controlling the XY moving platform to move the current defect point to the directly below the pressure head of the defect marking device according to the coordinates of the current defect point; acquiring the distance between the current defect point and the tip of the pressure head according to the optical sensor; controlling the z-axis driver of the defect marking device to drive the pressure head to press down according to the distance between the current defect point and the tip of the pressure head, so that the pressure head is in contact with the surface of the to-be-processed board without damaging the surface of the to-be-processed board; wherein the z-axis driver comprises a non-piezoelectric ceramic driver and a piezoelectric ceramic driver; the corresponding pressing distance of the non-piezoelectric ceramic driver is different from the corresponding pressing distance of the piezoelectric ceramic driver; controlling the pressure head to perform pressure printing on the to-be-processed board according to the first defect marking mode or the second defect marking mode according to the hardness of the to-be-processed board and the preset defect marking duration; wherein the first defect marking mode is controlled according to the pressure; the second defect marking mode is controlled according to the distance; the method further comprises: if the hardness of the to-be-processed board is greater than the preset hardness threshold, and the preset defect marking duration of the to-be-processed board is greater than the preset defect marking duration threshold, controlling the pressure head to perform pressure printing according to the first defect marking mode; if the hardness of the to-be-processed board is less than or equal to the preset hardness threshold, and the preset defect marking duration of the to-be-processed board is less than or equal to the preset defect marking duration threshold, controlling the pressure head to perform pressure printing according to the second defect marking mode.

2. The defect marking method based on piezoelectric ceramic driving according to claim 1, characterized by, Before the step of in response to processing the current defect point, controlling the XY moving platform to move the current defect point to the directly below the pressure head of the defect marking device according to the coordinates of the current defect point, the method further comprises: acquiring three test pressure printing areas equidistantly along the preset X and Y directions on the to-be-processed board respectively; acquiring the image of each test pressure printing area according to the microscope respectively; obtaining the distance between any two adjacent test pressure printing areas according to the image of each test pressure printing area; if the difference between the distance between any two adjacent test pressure printing areas and the preset distance is greater than the preset distance difference threshold, performing position compensation on the XY moving platform according to the difference between the distance between the two adjacent test pressure printing areas and the preset distance.

3. The defect marking method based on piezoceramic drive according to claim 2, characterized in that, After the step of acquiring the image of each test pressure printing area according to the microscope respectively, the method further comprises: obtaining the size deviation of the test pressure printing area according to the image of each test pressure printing area; converting the size deviation of the test pressure printing area into the z-direction error amount of the z-axis driver; performing pressure printing action compensation on the z-axis driver according to the z-direction error amount of the z-axis driver.

4. The defect marking method based on piezoelectric ceramic driving according to claim 1, characterized by, The method further comprises: controlling the non-piezoelectric ceramic driver of the z-axis driver of the defect marking device to press down by a first distance according to the distance between the current defect point and the tip of the pressure head; The piezoelectric ceramic driver of the z-axis driver of the defect marking device continues to press down by a second distance until the indenter contacts the surface of the plate to be processed without damaging the surface of the plate to be processed; wherein the second distance is a fixed distance; the distance between the current defect point and the tip of the indenter is the sum of the first distance and the second distance.

5. The defect marking method based on piezoelectric ceramic driving according to claim 4, characterized by, The piezoelectric ceramic driver of the z-axis driver of the defect marking device continues to press down by a second distance until the indenter contacts the surface of the plate to be processed without damaging the surface of the plate to be processed includes: According to the material of the indenter and the corresponding imprint distance mapping table of the indenter, the number of pressing stages of the piezoelectric ceramic driver of the z-axis driver of the current defect marking device is obtained, as well as the starting position, ending position and pressing step distance corresponding to each pressing stage; the closer to the surface of the plate to be processed, the slower the pressing speed and the smaller the pressing step distance.

6. The piezoelectric ceramic drive-based defect marking method according to claim 1, wherein Before obtaining the coordinates of each defect point of the plate to be processed, the method further includes: z value calibration, imprint contact area calibration and motion error calibration are performed on the indenter of the defect marking device; microscope and defect marking device joint calibration is performed according to the surface image of the plate to be processed.

7. A defect marking system based on piezoceramic drive imprinting, characterized by The system includes: a coordinate acquisition unit for obtaining the coordinates of each defect point of the plate to be processed; a moving unit for controlling the XY moving platform to move the current defect point to the directly below the indenter of the defect marking device according to the coordinates of the current defect point in response to processing the current defect point; a distance acquisition unit for obtaining the distance between the current defect point and the tip of the indenter according to the optical sensor; a pressing unit for controlling the z-axis driver of the defect marking device to drive the indenter to press down so that the indenter contacts the surface of the plate to be processed without damaging the surface of the plate to be processed according to the distance between the current defect point and the tip of the indenter; wherein the z-axis driver includes a non-piezoelectric ceramic driver and a piezoelectric ceramic driver; the corresponding pressing distance of the non-piezoelectric ceramic driver and the corresponding pressing distance of the piezoelectric ceramic driver are different; an imprint unit for controlling the indenter to perform imprint on the plate to be processed according to the first defect marking mode or the second defect marking mode according to the hardness of the plate to be processed and the preset defect marking duration; wherein the first defect marking mode is controlled according to the pressure; the second defect marking mode is controlled according to the distance; The imprint unit is used to perform the following steps: if the hardness of the plate to be processed is greater than the preset hardness threshold, and the preset defect marking duration of the plate to be processed is greater than the preset defect marking duration threshold, the indenter is controlled to perform imprint according to the first defect marking mode; if the hardness of the plate to be processed is less than or equal to the preset hardness threshold, and the preset defect marking duration of the plate to be processed is less than or equal to the preset defect marking duration threshold, the indenter is controlled to perform imprint according to the second defect marking mode.

8. A non-transitory computer-readable storage medium, comprising: The storage medium stores at least one instruction or at least one program, which is loaded and executed by the processor to realize the method of any one of claims 1-6.

9. An electronic device, comprising: It includes a processor and the non-transitory computer readable storage medium described in claim 8. The storage medium stores at least one instruction or at least one program, which is loaded and executed by the processor to realize the method of any one of claims 1-6.

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