Server air slot with heat sink bionic device and server

Abstract

The application discloses a server air slot radiator bionic device and a server, relates to the technical field of servers, and comprises a first baffle, the first baffle has a first opening area and a second opening area, wherein the second opening area is arranged around the first opening area, the first opening area is provided with a plurality of first flow holes, the second opening area is provided with a plurality of second flow holes, and the flow passage cross-sectional area of the second flow hole is greater than that of the first flow hole; a second baffle is arranged at the rear of the first baffle along the through direction of the air slot, the second baffle is provided with a plurality of third flow holes, and the opening rate of the second baffle is greater than that of the first baffle. By arranging the first flow holes and the second flow holes with different flow passage cross-sectional areas and the second baffle with a higher opening rate, the air flow can be more reasonably distributed, the air volume flowing out of the radiator is increased, and therefore the heat dissipation effect inside the server case is improved, and the temperature of the central processing unit is reduced.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a biomimetic device for a heat sink in a server slot and a server. Background Technology

[0002] Server motherboards are typically configured with dual CPUs (Central Processing Units) and equipped with heatsinks for cooling. When a server is configured with only a single CPU, in order to reduce costs, heatsinks are not installed in the empty CPU slots. In this configuration, the airflow resistance in the empty CPU slot area is low, causing hot air inside the server chassis to mainly flow out through the slow airflow area of ​​the empty CPU slot, rather than through the fast airflow of the heatsink. This reduces the cooling effect inside the server chassis and causes the CPU temperature to rise.

[0003] In related technologies, using enclosed or perforated baffles installed in the CPU slot can solve the air leakage problem. However, due to the mismatch between the flow resistance of the enclosed or perforated baffles and the actual heatsink, insufficient airflow occurs at the CPU or for components located behind the perforated baffle. Furthermore, because the perforations in the perforated baffles are mostly circular, they easily generate lateral vortices, increasing turbulence intensity and air pressure loss, thus preventing a single CPU from achieving the cooling effect of a dual-CPU system. Summary of the Invention

[0004] This application provides a biomimetic device for a heat sink in a server slot and a server, to at least solve the problem of mismatch between the flow resistance of the baffle and the actual heat sink in the related art.

[0005] This application provides a heat sink device for server slots. The server has multiple slots extending along the airflow direction. At least one of the slots is equipped with a central processing unit (CPU) and a heat sink for cooling the CPU. The remaining slots are configured to house a biomimetic device for the heat sink. The biomimetic device includes:

[0006] The first baffle is configured to be perpendicular to the through direction of the vacancy slot, and the first baffle has a first opening area and a second opening area, wherein the second opening area is arranged around the first opening area, the first opening area has a plurality of uniformly distributed first flow holes, the second opening area has a plurality of uniformly distributed second flow holes, and the flow cross-sectional area of ​​the second flow holes is larger than the flow cross-sectional area of ​​the first flow holes.

[0007] The second baffle is spaced behind the first baffle along the through direction of the vacancy slot, and the second baffle is provided with a plurality of third flow holes, and the opening ratio of the second baffle is greater than that of the first baffle.

[0008] This application also provides a server including a plurality of empty slots, a central processing unit, a heat sink, and a heat sink bionic device as described above, wherein at least one of the empty slots is equipped with a central processing unit and a heat sink for cooling the central processing unit, and the remaining empty slots are configured to be equipped with the heat sink bionic device.

[0009] By setting first and second flow-through holes with different cross-sectional areas on the first baffle, and the higher opening ratio of the second baffle, airflow can be distributed more rationally. This reduces the direct flow of hot air through the CPU slot area, increases the airflow through the heatsink, thereby improving the heat dissipation effect inside the server chassis and reducing the temperature of the central processing unit (CPU). The biomimetic design of the heatsink can better match the flow resistance of a real heatsink, avoiding insufficient airflow at the CPU and components behind the baffle due to flow resistance mismatch. This allows a single CPU to achieve a heat dissipation effect closer to that of a dual CPU. Unlike the single circular hole shape of traditional perforated baffles, the perforation design of this biomimetic device is more rational, reducing the generation of lateral vortices, lowering turbulence intensity and wind pressure loss, improving airflow utilization efficiency, and further enhancing heat dissipation performance. Attached Figure Description

[0010] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the structure of a biomimetic radiator device provided in an embodiment of this application;

[0012] Figure 2 A front view of the first baffle provided in an embodiment of this application;

[0013] Figure 3 This is a schematic diagram of the internal structure of the server provided in an embodiment of this application.

[0014] The above figures include the following reference numerals:

[0015] 1. First baffle; 11. First opening area; 12. Second opening area; 101. First flow passage; 102. Second flow passage;

[0016] 2. Second baffle; 201. Third flow passage;

[0017] 3. Base plate; 301. Locking structure;

[0018] 10. Radiator. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0020] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0021] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] In related technologies, closed or perforated baffles are placed in the CPU slot to solve the air leakage problem. However, closed baffles block the slot, allowing air to pass only through the area where the CPU is installed, resulting in excessive airflow to the CPU. Perforated baffles, on the other hand, typically have uniform circular openings. Due to their perfect axisymmetric structure, the fluid passing through these openings generates strong streamline bending and centrifugal force along the perimeter of the opening. This interacts with the low-pressure fluid within the boundary layer, causing imbalance and triggering lateral vortices around the opening axis, increasing turbulence and pressure loss.

[0023] As can be seen from the above, neither closed baffles nor baffles with uniform openings can achieve the wind resistance effect of a real radiator.

[0024] Therefore, this application provides a biomimetic device for a heat sink in a server slot, such as... Figure 3 As shown, the server has multiple slots running along the airflow direction. At least one slot contains a central processing unit (CPU, not shown) and a heat sink 10 for cooling the CPU. The CPU is connected to the motherboard below, and the heat sink 10 is positioned above the CPU to exchange heat with it, thus cooling the CPU. The remaining slots contain heat sink bionic devices to simulate the air resistance of the heat sink 10.

[0025] like Figure 1 and Figure 2 As shown, the biomimetic radiator device includes a first baffle 1 and a second baffle 2. The first baffle 1 is perpendicular to the through direction of the vacancy slot. The shape of the first baffle 1 matches the cross-sectional shape of the vacancy slot. The first baffle 1 has a first opening area 11 and a second opening area 12. The second opening area 12 is arranged around the first opening area 11. The first opening area 11 has multiple evenly distributed first flow holes 101, and the second opening area 12 has multiple evenly distributed second flow holes 102. The flow cross-sectional area of ​​the second flow holes 102 is larger than that of the first flow holes 101. That is, when the uniform airflow passes perpendicularly through the first baffle 1, the airflow of the second flow holes 102 is greater than that of the first flow holes 101. However, since the first baffle 1 is installed in the empty slot, which faces a row of fans and is blocked on both sides, in reality, the airflow will be concentrated in the middle of the first baffle 1, while the airflow at the edge of the first baffle 1 is smaller. Thus, by setting the flow cross-section of the second flow hole 102 to be larger than the flow cross-sectional area of ​​the first flow hole 101, the flow difference of different sizes of flow holes is well balanced, thereby making the airflow through the first baffle 1 more uniform.

[0026] The second baffle 2 is spaced behind the first baffle 1 along the through direction of the vacancy groove, and the second baffle 2 is provided with a plurality of third flow holes 201. The opening ratio of the second baffle 2 is greater than that of the first baffle 1. That is to say, for the same area of ​​the first baffle 1 and the second baffle 2, the flow cross-sectional area of ​​the second baffle 2 that allows airflow is greater than that of the first baffle 1.

[0027] The opening layout of the first baffle 1 (the distribution of the first flow passage 101 and the second flow passage 102) will change the uniformity of the airflow velocity distribution exiting the first baffle 1. If the airflow is not uniform (e.g., the center velocity is high and the periphery velocity is low), then when this uneven airflow impacts the second baffle 2, it will change the flow velocity and effective opening ratio of the local orifices of the second baffle 2, thereby causing the actual pressure drop of the second baffle 2 to deviate from the pressure drop calculated separately (assuming the incoming flow is uniform).

[0028] The core objective of the biomimetic device for installing a heatsink in an empty slot is to make the airflow resistance and airflow path of the empty slot as close as possible to the state when the actual heatsink 10 is installed. Only when the airflow characteristics of the empty slot are consistent with those of the slots with CPUs and actual heatsinks 10 can the problem of hot air in the case favoring the empty slot (low flow resistance) and ignoring the heatsink (slightly higher flow resistance) be avoided, thus achieving overall airflow balance.

[0029] The airflow distribution of the real heatsink 10 has a key characteristic: the core area of ​​the real heatsink 10 (corresponding to the first opening area 11 of the bionic device) is usually the high-density fin area directly above the CPU. Here, the fins are dense and the flow resistance is relatively large, so the airflow needs to pass through slowly to fully remove the heat from the CPU; the edge area of ​​the real heatsink (corresponding to the second opening area 12 of the bionic device) is usually the sparse area around the fins or the gaps in the frame. Here, there are fewer fins and the flow resistance is relatively small, so the airflow can pass through quickly. Moreover, the airflow in the edge area can help remove the heatsink 10 as a whole and avoid local heat accumulation.

[0030] In short, the "slow airflow in the core area and fast airflow in the edge area" of the real radiator 10 is a natural airflow distribution pattern determined by its physical structure (dense core fins and sparse edge fins).

[0031] The first opening area 11 of the biomimetic heatsink device corresponds to the core area of ​​the real heatsink 10, and the second opening area 12 corresponds to the edge area of ​​the real heatsink 10. Since the flow cross-sectional area of ​​the second flow hole 102 is larger than that of the first flow hole 101, the difference in flow cross-sectional area is used to actively create an effect consistent with the real heatsink 10: "slightly higher flow resistance in the core area and slightly lower flow resistance in the edge area." This guides the airflow according to the rules of the real scenario, ultimately achieving "airflow resistance matching between empty slots and positions with CPUs," preventing the hot air path inside the chassis from deviating and ensuring overall heat dissipation efficiency.

[0032] The core function of the second baffle 2 is to ensure effective airflow based on the distribution of the first baffle 1. It needs to address the potential issues of localized airflow accumulation and insufficient rear-end airflow that may occur after the first baffle 1 controls the flow, while simultaneously preventing airflow turbulence between the first and second baffles 1. Ultimately, it aims to achieve a design that conforms to real-world heat dissipation scenarios without compromising the overall airflow efficiency of the chassis. The design of the second baffle 2 having a higher opening ratio than the first baffle 1 essentially creates a reasonable gradient with slightly higher resistance at the front and slightly lower resistance at the rear. The higher opening ratio (larger flow area per unit area) and lower resistance of the second baffle 2 allows it to quickly receive airflow from the first baffle 1, providing a smoother exhaust channel and preventing airflow stagnation and accumulation in the gap between the first and second baffles 1 and 2. The third flow hole 201 provides secondary airflow guidance, smoothing out small eddies and bringing the airflow closer to a laminar flow state (stable velocity, consistent direction), thereby reducing the generation of transverse eddies and lowering turbulence intensity and pressure loss.

[0033] In summary, the embodiments of this application, by setting first flow holes 101 and second flow holes 102 with different flow cross-sectional areas on the first baffle 1 and by the high opening ratio of the second baffle 2, enable a more reasonable distribution of airflow, reduce the direct flow of hot air through the CPU slot area, increase the airflow through the heatsink 10, thereby improving the heat dissipation effect inside the server chassis and reducing the temperature of the central processing unit. The structural design of the heatsink bionic device can better match the flow resistance of the real heatsink 10, avoiding insufficient airflow at the central processing unit and insufficient airflow to components located behind the second baffle 2 due to flow resistance mismatch, enabling a single-socket central processing unit to achieve a heat dissipation effect closer to that of a dual-socket central processing unit. Unlike the single circular hole shape of traditional perforated baffles, the opening design of this heatsink bionic device is more reasonable, which can reduce the generation of transverse vortices, reduce turbulence intensity and wind pressure loss, improve airflow utilization efficiency, and further enhance heat dissipation performance.

[0034] Furthermore, in some embodiments of this application, the third flow hole 201 is an elongated hole, and a plurality of the third flow holes 201 are spaced apart from top to bottom.

[0035] In addition to the main airflow in the front and back directions, there is also a vertical (up and down) airflow requirement inside the server chassis. If the third airflow hole 201 is not arranged properly (such as uneven spacing or poor shape adaptability), it is easy to cause airflow discontinuity in the vertical direction (too much airflow in some areas and too little airflow in some areas), which will affect the heat dissipation of vertically distributed components behind the baffle (such as multiple memory modules or vertically installed hard drives).

[0036] The length of the elongated holes can cover a certain area in the vertical direction. With the uniform spacing, a continuous and uniform flow channel can be formed in the vertical direction of the second baffle 2, avoiding local airflow gaps caused by sparse holes.

[0037] Furthermore, in some embodiments of this application, the ratio of the sum of the flow cross-sectional areas of the second flow holes 102 to the flow cross-sectional area of ​​the first flow hole 101 is greater than 4, that is, the flow cross-sectional area of ​​a single second flow hole 102 is more than 4 times the flow cross-sectional area of ​​a single first flow hole 101.

[0038] The larger ratio allows the second flow-through orifice 102 to have a significantly greater airflow capacity than the first flow-through orifice 101. During airflow within the server chassis, the first flow-through orifice 101 restricts airflow, preventing excessive concentration in any one area. The second flow-through orifice 102, however, allows more airflow to pass through, guiding it to a more even distribution across the empty slot area. This prevents airflow from concentrating at a specific location and improves overall heat dissipation efficiency. Furthermore, when the cross-sectional area of ​​the second flow-through orifice 102 is sufficiently larger than that of the first flow-through orifice 101, the velocity change of the airflow passing through it is relatively small, reducing the likelihood of strong eddies and turbulence. According to fluid mechanics principles, eddies and turbulence increase pressure loss, and a ratio greater than 4 helps reduce this pressure loss, allowing airflow to pass more smoothly through the empty slot and providing more effective cooling airflow for the server components.

[0039] The real heatsink 10 has certain flow resistance characteristics. By making the ratio of the flow cross-sectional area of ​​the second flow hole 102 to that of the first flow hole 101 greater than 4, the flow resistance of the real heatsink 10 can be better simulated. In this way, in a single-socket CPU configuration, even if no real heatsink 10 is installed in the empty slot, the airflow distribution and flow resistance characteristics can be made closer to those in a dual-socket CPU configuration through this biomimetic device, thereby improving the heat dissipation effect of the single-socket CPU and making it closer to the heat dissipation level of a dual-socket CPU.

[0040] In some embodiments of this application, the ratio of the sum of the flow cross-sectional areas of all second flow holes 102 to the sum of the flow cross-sectional areas of all first flow holes 101 is greater than or equal to 6 / 4 and less than or equal to 7 / 3.

[0041] The core function of the first baffle 1 is to simulate the characteristics of a real heat sink 10: high flow resistance in the core area (corresponding to the first opening area 11) and low flow resistance in the edge area (corresponding to the second opening area 12). The airflow distribution ratio between the core area and the edge area is directly determined by the ratio of the sum of the flow cross-sections of all the second flow holes 102 to the sum of the flow cross-sectional areas of all the first flow holes 101. When the real heat sink 10 is working normally, due to the dense core fins and sparse edge fins, the airflow ratio in the edge area (about 60%-70%) is much higher than that in the core area (about 30%-40%). The ratio of the flow area in the edge area to the flow area in the core area is usually between 1.5 and 2.3, which is highly consistent with the range of [6 / 4, 7 / 3] defined in this solution.

[0042] The specific manifestations of the effect of this ratio range:

[0043] If the ratio is less than 6 / 4 (e.g., 1.2): the sum of the flow cross-sectional areas of all the second flow holes 102 is relatively small, which means that the total flow capacity of the second opening area 12 is insufficient, resulting in high flow resistance in the edge area. At this time, the airflow distribution in the core area and the edge area of ​​the empty slot will deviate from the real heat sink 10 (the edge airflow accounts for less than 50%), and the airflow will be forced to concentrate in the core area (first opening area 11). This not only fails to simulate the real heat dissipation scenario, but may also generate local eddies due to the overload of airflow in the core area, thus reducing the heat dissipation efficiency.

[0044] If the ratio is higher than 7 / 3 (e.g., 2.5): the sum of the flow cross-sectional areas of all the second flow holes 102 is relatively too large, which means that the total flow capacity of the second opening area 12 is excessive, resulting in excessively low flow resistance in the edge area. At this time, the airflow will be excessively biased towards the edge area (accounting for more than 75%), and the airflow in the core area will account for less than 25%. This is out of sync with the requirement that the core area of ​​the real heatsink 10 needs to retain a certain amount of airflow to simulate fin heat dissipation. Moreover, the excessively concentrated edge airflow will cause the overall flow resistance of the empty slots to be too low, and the original problem of hot air favoring the empty slots and ignoring the real heatsink 10 will reappear.

[0045] When the ratio is between 6 / 4 and 7 / 3, it perfectly matches the distribution pattern of the actual heatsink 10, where the edge airflow accounts for 60%-70% and the core airflow accounts for 30%-40%. The flow resistance characteristics of the empty slot are highly consistent with those of the actual heatsink 10, thus avoiding heat dissipation deviations caused by the imbalance of airflow between the core and edge areas from the source.

[0046] In some embodiments of this application, the opening ratio of the second baffle 2 is greater than or equal to 40% and less than or equal to 70%.

[0047] In this application, it is required that the flow resistance of the airflow at the same velocity passing through the radiator bionic device and the flow resistance passing through the real radiator 10 deviates by less than 20%. Wherein the flow resistance deviation rate = (pressure drop of radiator bionic device - pressure drop of radiator) / pressure drop of radiator.

[0048] A simulation model was established based on the real radiator 10. The pressure drop of the radiator model under different target flow values ​​(30CFM-60CFM) is shown in Table 1. Table 1 shows the target values ​​of the pressure drop of the structural component under different flow values.

[0049] Table 1

[0050]

[0051] The pressure drop of the second baffle 2 accounts for 10% to 20% of the pressure drop of the heat sink 10 at different flow rates. The opening ratio of each elongated hole on the second baffle 2 accounts for 10% of the area of ​​the second baffle 2. The simulated pressure drop value of the second baffle 2 with an opening ratio of 40% to 80% is controlled within 10% to 20% of the corresponding pressure drop of the heat sink at different flow rates.

[0052] The opening ratio of the second baffle 2 was set to 40%, 50%, 60%, 70%, and 80% respectively. The pressure drop of the second baffle 2 under different opening ratios and different air volumes was simulated. The results showed that when the opening ratio was 60% and 70%, the pressure drop under different air volumes could be controlled within the range of 10%-20% of the radiator pressure drop. Moreover, when the opening ratio was 70%, the pressure drop under different air volumes was controlled within the range of 10%-15%, which is smaller and more stable. Therefore, the opening ratio of 70% was used for further evaluation, as shown in Table 2.

[0053] Table 2

[0054]

[0055] Based on the above, a comparison was made of different opening layouts of the second baffle 2 with an opening rate of 70%. The results show that the more uniform the openings on the second baffle 2, the smaller the pressure drop deviation under different flow rates, and the more uniform the airflow velocity at the outlet, as shown in Table 3.

[0056] Table 3

[0057]

[0058] Furthermore, in some embodiments of this application, the opening ratio of the second baffle 2 is greater than or equal to 60% and less than or equal to 70%, the opening ratio of the first baffle 1 is greater than or equal to 40%, and the difference between the opening ratio of the second baffle 2 and the first baffle 1 is greater than or equal to 15%. Different opening ratios result in different pressure drops when the airflow passes through the baffles. The relatively low opening ratio of the first baffle 1 causes a certain pressure drop when the airflow passes through, thereby initially slowing down and stabilizing the airflow. The higher opening ratio of the second baffle 2 results in a relatively smaller pressure drop when the airflow passes through. This allows for the smooth passage of airflow while reasonably controlling the pressure drop of the entire system, ensuring that the airflow within the system meets the design requirements.

[0059] Furthermore, in some embodiments of this application, the distance between the second baffle 2 and the first baffle 1 is greater than 20 mm. After the airflow passes through the first baffle 1, it can naturally diffuse and adjust its velocity within a gap of more than 20 mm, so that the airflow state of the first opening area 11 and the second opening area 12 tends to be stable, avoiding mutual interference of airflow due to limited space. For example, the fast-flowing airflow in the edge area of ​​the first baffle 1 can smoothly transition to a uniform velocity state within a 20 mm gap, and when it passes through the elongated hole of the second baffle 2, it can maintain a consistent direction and will not generate transverse vortices due to entering the second baffle 2 before stabilization.

[0060] After the airflow passes through the first baffle 1, a first pressure drop is formed, the pressure drop value of which is 80% to 90% of the preset pressure drop value. After the airflow passes through the second baffle 2, a second pressure drop is formed, the pressure drop value of which is 10% to 20% of the preset pressure drop value.

[0061] Specifically, the preset pressure drop value is determined by the pressure drop value of the airflow under a set flow rate. The radiator bionic device of this application aims to achieve a flow resistance deviation rate of less than 20% between the airflow velocity passing through the radiator bionic device and the flow resistance passing through a real radiator. The preset pressure drop value can be obtained based on the pressure drop of the radiator.

[0062] Furthermore, in some embodiments of this application, the cross-sectional shape of the first flow passage 101 is a square or a regular hexagon, and the cross-sectional shape of the second flow passage 102 is a square or a regular hexagon.

[0063] Taking a square shape for both the first flow orifice 101 and the second flow orifice 102 as an example, the side length of the first flow orifice 101 is between 2mm and 4mm, and the side length of the second flow orifice 102 is between 5mm and 8mm, with the difference between the side length of the second flow orifice 102 and the side length of the first flow orifice 101 being greater than or equal to 2mm. In this case, the biomimetic radiator device meets the requirement that the deviation rate of the flow resistance from the actual radiator 10 is less than 20%.

[0064] Specifically, the dimensions of the first flow passage 101 and the second flow passage 102 can be verified.

[0065] First, the flow cross-sectional area of ​​the first baffle 1 can be calculated as follows:

[0066] Starting from the pressure drop formula of the orifice plate:

[0067]

[0068] Where △ p The target pressure drop for the first baffle 1 (that is, 80% to 90% of the preset pressure drop value);

[0069] ρ is the air density, which can be taken as 1.2 kg / m³. 3 ;

[0070] Q is the volumetric flow rate (m³ / s). 3 / s);

[0071] C d For the flow coefficient, taking the first baffle 1 as an example of a thin plate with square holes, C is the flow coefficient. d Approximately 0.60-0.62;

[0072] A eff Total effective cross-sectional area (m²) 2 );

[0073] Based on the derivation, we can conclude that:

[0074]

[0075] As shown in Table 4, with the first baffle 1 accounting for 85% of the total pressure drop, C d Substituting 0.62 into the equation, we can calculate the corresponding flow cross-sectional area under different flow rates:

[0076] Table 4

[0077]

[0078] The arithmetic mean of the effective flow cross-sectional areas under different flow rates yields a total effective flow cross-sectional area of ​​2921 mm². 2 .

[0079] Next, the area and number of the second flow passage 102 and the first flow passage 101 on the first baffle 1 will be evaluated:

[0080] The area on the first baffle 1 is divided into a central first opening region 11 and a surrounding second opening region 12. Second opening region 12: This area allows airflow to enter more easily, and a small number of second flow passages 102 are formed here. First opening region 11 (central region): This is the core area of ​​the airflow path, and a large number of first flow passages 101 are formed here to simulate the dense fins and high flow resistance of the center fins of the radiator 10. Side length of the second flow passages 102: Generally, 5mm-8mm is required based on experience. Too large, and it resembles a grid, resulting in an overly flat flow resistance characteristic; too small, and it becomes meaningless. Side length of the first flow passages 101: 2mm-4mm is required. Too small, and processing becomes difficult and it is prone to clogging; too large, and the effect is not obvious. Furthermore, the difference between the side length of the second flow passage 102 and the side length of the first flow passage 101 must be ≥2mm; otherwise, the difference in performance between large and small first flow passages 101 will be insignificant. The first opening region 11 and the second opening region 12 of the first baffle 1 are connected in parallel. According to the principles of fluid mechanics, the pressure drop at both ends of a parallel path must be equal; otherwise, the airflow would all rush to the path with lower pressure, resulting in extremely uneven flow distribution. Therefore, the pressure drop of the second opening region 12 on the first baffle 1 is the same as the pressure drop of the first opening region 11. The pressure drop of the second flow passage 102 is ΔP2, and the pressure drop of the first flow passage 101 is ΔP2. p1 , that is, △ p2 =△ p1 .

[0081] For orifice plates, the pressure drop formula is: △ p =1 / 2*ρ*(Q / C d *A 开孔 ) 2 A 开孔 A represents the total cross-sectional area of ​​the circulation zone. 开孔 =N*α, where N is the number of openings and α is the area of ​​a single opening.

[0082] According to △ p1 =1 / 2*ρ*(Q2 / C d2 *A2) 2 , △ p1 =1 / 2*ρ*(Q1 / C d1 *A1) 2 Q2 is the flow rate of the second flow orifice 102, Q1 is the flow rate of the first flow orifice 101, and C d2 C is the volumetric flow rate of the second flow orifice 102. d1 Let A2 be the volumetric flow rate of the first flow orifice 101, A2 be the flow cross-sectional area of ​​all second flow orifices 102, and A1 be the flow cross-sectional area of ​​all first flow orifices 101; then (Q2 / C) can be calculated. d2 *A2) 2 =(Q1 / C d1 *A1) 2Substituting A2=N2*α2 and A1=N1*α1, we get Q2 / C d2 *N2*α2=Q1 / C d1 *N1*α1, Q2 / Q1=C d2 *N2*α2 / C d1 *N1*α1 means that the flow distribution ratio is equal to the ratio of the effective flow capacity of the two regions.

[0083] Simultaneously, it is necessary to ensure that the airflow through the second opening region 12 and the first opening region 11 is as uniform as possible, i.e., the flow rate per unit area is the same. The flow rate density of the first opening region 11 is Q1 / A1, where A1 is the total area of ​​the first opening region 11 (solid area, i.e., including the area of ​​the unopened portion), and the flow rate density of the surrounding region is Q2 / A2, where A2 is the total area of ​​the second opening region 12. To achieve uniform flow, Q2 / A2 = Q1 / A1, and therefore Q2 / Q1 = A2 / A1.

[0084] Based on Q2 / Q1=A2 / A1 and Q2 / Q1=C d2 *N2*α2 / C d1 *N1*α1, and generally the flow coefficients of the first flow passage 101 and the second flow passage 102 are not much different. Therefore, A2 / A1=N2*α2 / N1*α1. That is to say, in order to achieve equal pressure drop and uniform airflow, the ratio of the total flow cross-sectional area of ​​the first opening region 11 to the second opening region 12 must be equal to the ratio of their solid areas.

[0085] In this embodiment, the effective flow cross-sectional area of ​​the first baffle 1 is 2921 mm². 2 The first baffle 1 has a horizontal length of 92.4 mm, a vertical height of 64 mm, and a total area of ​​5913.6 mm². 2 The area of ​​the first opening region 11 is set to account for 40% of the total area of ​​the baffle, and the area of ​​the second opening region 12 is set to account for 60% of the total area of ​​the baffle. The first flow passage 101 is set to be square with a side length of 2.5 mm, and the second flow passage 102 is set to be square with a side length of 5 mm. The flow coefficient of the second flow passage 102 is 0.62, and the flow coefficient of the first flow passage 101 is 0.62.

[0086] Therefore, the total flow cross-sectional area of ​​the first flow passage 101 is 5913.6 * 40% = 1168.4 mm. 2 The total cross-sectional area of ​​the second flow passage 102 is 5913.6 * 60% = 1752.6 mm. 2The number of openings in the first flow passage 101 is approximately 184.9 (1168.4 / (2.5*2.5)), so we take 187. The number of openings in the second flow passage 102 is approximately 70.104 (1752.6 / (5*5)), so we take 70. The actual total area of ​​the first flow passage 101 is 187 × 6.25 = 1168.75 mm². 2 The actual total area of ​​the second flow passage 102 is: 70 × 25 = 1750 mm. 2 The actual total cross-sectional area is: 1168.75 + 1750 = 2918.75 mm² 2 This is consistent with the target value of 2921mm. 2 The error is only 0.08%, which is acceptable.

[0087] Furthermore, in some embodiments of this application, the heat sink bionic device further includes a base plate 3, which is connected between the lower end of the first baffle 1 and the lower end of the second baffle 2, and the base plate 3 is provided with a locking structure 301, which is configured to be fixedly connected to the corresponding motherboard in the empty slot.

[0088] The base plate 3, together with the first baffle 1 and the second baffle 2, forms a U-shaped frame structure (the first baffle 1 and the second baffle 2 form the vertical plates on both sides, and the base plate 3 forms the horizontal plate at the bottom), integrating the two originally independent baffles into a rigid whole, which greatly improves the vibration resistance and impact resistance.

[0089] The locking structure 301 precisely fixes the device to the preset mounting position on the motherboard (consistent with the mounting holes of a real heatsink), ensuring that the flow holes of the dual baffles are completely aligned with the airflow channels of the motherboard, allowing airflow to pass through the heatsink simulation device without deviation. The type (such as thread hole specifications and clip shape) and position (such as hole spacing) of the locking structure 301 are consistent with those of a real heatsink. Maintenance personnel can use the same tools as those used to install a real heatsink (such as torque wrenches and clip removal tools) to complete the installation and removal of the bionic device according to the same procedure, without the need for additional learning of operating methods.

[0090] Furthermore, such as Figure 3 As shown, this application embodiment also provides a server, including multiple empty slots, a central processing unit, a heat sink, and a heat sink bionic device as described in any of the above embodiments, wherein at least one empty slot is equipped with a central processing unit and a heat sink for cooling the central processing unit, and the remaining empty slots are configured to install heat sink bionic devices.

[0091] This server achieves excellent heat dissipation regardless of whether it uses dual-CPU or single-CPU configurations. The bionic heatsink device can simulate the pressure drop effect of a real heatsink, making the heat dissipation performance of a single-CPU configuration close to that of a dual-CPU configuration.

[0092] The above provides a detailed description of a biomimetic heat sink device for server slots and a server provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A biomimetic heat sink device for server slots, wherein a server has multiple slots extending along the airflow direction, at least one of the slots is equipped with a central processing unit and a heat sink (10) for cooling the central processing unit, and the remaining slots are configured to install the biomimetic heat sink device, characterized in that, The biomimetic radiator device includes: The first baffle (1) is configured to be perpendicular to the through direction of the vacancy slot, and the first baffle (1) has a first opening area (11) and a second opening area (12), wherein the second opening area (12) is arranged around the first opening area (11), the first opening area (11) has a plurality of uniformly distributed first flow holes (101), the second opening area (12) has a plurality of uniformly distributed second flow holes (102), and the flow cross-sectional area of ​​the second flow holes (102) is larger than the flow cross-sectional area of ​​the first flow holes (101); The second baffle (2) is arranged at intervals behind the first baffle (1) along the through direction of the vacancy groove, and the second baffle (2) is provided with a plurality of third flow holes (201), and the opening ratio of the second baffle (2) is greater than that of the first baffle (1). The flow resistance of the airflow passing through the second opening region (12) is less than the flow resistance passing through the first opening region (11).

2. The biomimetic heat sink device for server slots according to claim 1, characterized in that, The third flow passage (201) is an elongated hole, and multiple third flow passages (201) are spaced apart from top to bottom.

3. The biomimetic heat sink device for server slots according to claim 1, characterized in that, The ratio of the flow cross-sectional area of ​​the second flow orifice (102) to the flow cross-sectional area of ​​the first flow orifice (101) is greater than 4; And / or, the ratio of the sum of the flow cross-sectional areas of all the second flow holes (102) to the sum of the flow cross-sectional areas of all the first flow holes (101) is greater than or equal to 6 / 4 and less than or equal to 7 / 3.

4. The biomimetic heat sink device for server slots according to claim 1, characterized in that, The opening ratio of the second baffle (2) is greater than or equal to 40% and less than or equal to 70%.

5. The biomimetic heat sink device for server slots according to claim 4, characterized in that, The opening ratio of the second baffle (2) is greater than or equal to 60%, the opening ratio of the first baffle (1) is greater than or equal to 40%, and the difference between the opening ratio of the second baffle (2) and the opening ratio of the first baffle (1) is greater than or equal to 15%.

6. The biomimetic heat sink device for server slots according to claim 1, characterized in that, The distance between the second baffle (2) and the first baffle (1) is greater than 20 mm; Alternatively, after the airflow passes through the first baffle (1), a first pressure drop is formed, the pressure drop value of the first pressure drop is 80% to 90% of the preset pressure drop value, and after the airflow passes through the second baffle (2), a second pressure drop is formed, the pressure drop value of the second pressure drop is 10% to 20% of the preset pressure drop value.

7. The biomimetic heat sink device for server slots according to claim 1, characterized in that, The cross-sectional shape of the first flow passage (101) is square or regular hexagonal; And / or, the cross-sectional shape of the second flow passage (102) is square or regular hexagonal.

8. The biomimetic heat sink device for server slots according to claim 7, characterized in that, Both the first flow passage (101) and the second flow passage (102) are square, and the side length of the first flow passage (101) is between 2 mm and 4 mm, the side length of the second flow passage (102) is between 5 mm and 8 mm, and the difference between the side length of the second flow passage (102) and the side length of the first flow passage (101) is greater than or equal to 2 mm.

9. The biomimetic heat sink device for server slots according to claim 1, characterized in that, It also includes a base plate (3), which is connected between the lower end of the first baffle (1) and the lower end of the second baffle (2), and the base plate (3) is provided with a locking structure (301), which is configured to be fixedly connected to the corresponding main board in the empty slot.

10. A server, characterized in that, It includes multiple empty slots, a central processing unit, a heat sink (10), and a heat sink bionic device as described in any one of claims 1-9, wherein at least one of the empty slots is equipped with a central processing unit and a heat sink (10) for cooling the central processing unit, and the remaining empty slots are configured to be equipped with the heat sink bionic device.

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