Method of manufacturing rfid flexible label and stamping mechanism

Abstract

The application discloses a kind of RFID flexible label manufacturing method and hot stamping mechanism, it is related to label manufacturing technical field.Therein, RFID flexible label manufacturing method includes the flexible substrate of upper pressing plate is pre-tensioned straightening in two-way, flexible substrate is preheated simultaneously;Metal wire is transported to the wire slot in hot stamping mechanism;Using movable protruding structure in wire slot to exert lateral pushing force to metal wire, so that metal wire forms preset pattern;Using lifting mechanism in lower pressing plate to lift metal wire in wire slot, so that metal wire contacts flexible substrate;Using upper pressing plate to exert pressure on the contact area of metal wire and flexible substrate and heat, hot stamping metal wire into flexible substrate.The technical scheme provided by the application can eliminate the internal stress of flexible substrate, reduce the deformation rate of flexible substrate in subsequent hot pressing process with metal wire, to reduce the risk of metal wire falling off, and ensure the forming precision of metal wire, and the metal wire implantation precision is high.

Description

Technical Field

[0001] This invention relates to the field of tag manufacturing technology, and in particular to a method for manufacturing RFID flexible tags and a hot-pressing mechanism. Background Technology

[0002] RFID flexible tags, as a core component of the Internet of Things, are widely used in fields such as clothing, medical care, and logistics.

[0003] Existing methods for manufacturing RFID flexible tags employ ultrasonic wire bonding technology. This technology utilizes the principle of ultrasonic welding to transfer vibrational energy to the joints of the tag to be welded, converting it into heat energy through friction to melt and bond the tags together. However, the high-frequency vibrational energy is unevenly absorbed on the flexible substrate, resulting in a high rate of metal wire detachment. Another method involves weaving the metal wires into the flexible substrate, but this suffers from low wire embedding accuracy. Summary of the Invention

[0004] The main objective of this invention is to propose a method for manufacturing RFID flexible tags and a hot-pressing mechanism, which aims to solve the problems of high metal wire detachment rate and low metal wire implantation accuracy in existing methods for manufacturing RFID flexible tags.

[0005] To achieve the above objectives, the RFID flexible tag manufacturing method proposed in this invention includes the following steps:

[0006] The flexible substrate of the upper pressure plate is pre-tensioned and straightened in both directions, while the flexible substrate is preheated.

[0007] The metal wire is fed into the wire trough in the hot pressing mechanism;

[0008] The movable protrusions inside the groove apply a lateral pushing force to the metal wire, causing the metal wire to form a preset pattern.

[0009] The metal wire in the wire groove is lifted by the lifting mechanism inside the lower pressure plate, so that the metal wire comes into contact with the flexible substrate;

[0010] Pressure and heat are applied to the contact area between the metal wire and the flexible substrate using an upper pressure plate, thereby hot stamping the metal wire into the flexible substrate.

[0011] In one embodiment, the step of using a lifting mechanism within the lower pressure plate to lift the metal wire in the wire groove includes: using 0.2... Up to 1.0 The metal wire is lifted at a high speed, while applying 5 up to 8 The pressure;

[0012] The step of hot stamping the metal wire into the flexible substrate by applying pressure and heating the upper pressure plate to the contact area between the metal wire and the flexible substrate includes: using a pressure of 0.8... Up to 1.5 Press down the upper pressure plate at a speed of 10 Up to 25 The pressure is applied and the temperature is heated to 70°C to 90°C.

[0013] In one embodiment, the step of bidirectional pre-tensioning and straightening of the flexible substrate of the upper pressure plate, while simultaneously preheating the flexible substrate, includes: the pre-tensioning tension being 5... Up to 15 The preheating temperature is 50℃ to 100℃, and the preheating time is 3s to 5s.

[0014] In one embodiment, before the step of using the lifting mechanism within the lower pressure plate to lift the metal wire in the wire groove and bring the metal wire into contact with the flexible substrate, the method further includes:

[0015] The metal wire is heated and shaped using a wire groove. The heating and shaping temperature is 50°C to 80°C, and the shaping time is 2s to 5s.

[0016] In one embodiment, after the step of applying pressure and heating the contact area between the metal wire and the flexible substrate using the upper pressure plate to hot-print the metal wire into the flexible substrate, the method further includes:

[0017] In 10 Up to 25 Maintain pressure for 3 to 5 seconds;

[0018] Or, with 10 Hold pressure for 2 seconds, then apply 25... Hold pressure for 3 seconds.

[0019] In one embodiment, after the step of applying pressure and heating the contact area between the metal wire and the flexible substrate using the upper pressure plate to hot-print the metal wire into the flexible substrate, the method further includes:

[0020] Data from displacement, temperature, and pressure sensors are acquired, and the displacement difference is calculated using the compensation formula.

[0021] In one embodiment, the step of acquiring data from the displacement sensor, temperature sensor, and pressure sensor, and calculating the displacement difference according to the compensation formula includes:

[0022] Temperature difference for: ;

[0023] Pressure difference : Displacement difference

[0024] Based on feedback from displacement, temperature, and pressure sensors, the temperature difference between the preset temperature and the actual temperature, and the pressure difference between the preset pressure and the actual pressure are calculated. The temperature difference is then... and pressure difference Substitute into the compensation formula Calculate the displacement difference And then according to The static compensation value is obtained. Where k1 is the temperature coefficient, ranging from 0.2 N / ℃ to 0.3 N / ℃; and k2 is the deformation coefficient, ranging from 0.13 N / ℃. 0.23 .

[0025] The present invention also provides a hot pressing mechanism, which includes an upper pressure plate and a lower pressure plate. The lower pressure plate has a groove, and the groove has multiple movable protrusions arranged in a staggered and spaced manner. The lower pressure plate is also provided with a heating pipe, a displacement sensor and multiple temperature sensors.

[0026] In one embodiment, the plurality of protruding structures include a first protruding structure and a second protruding structure, the first protruding structure and the second protruding structure being disposed opposite to each other and offset from each other, the first protruding structure and the second protruding structure moving toward each other towards the center line of the lower pressure plate to push the metal wire.

[0027] In one embodiment, the number of the hot pressing mechanism is at least two, and each of the at least two hot pressing mechanisms is equipped with a temperature control system and a pressure control system.

[0028] The technical solution of this invention employs bidirectional pre-tensioning and straightening of the flexible substrate on the upper pressure plate, while simultaneously preheating the flexible substrate to eliminate internal stress and reduce the deformation rate of the flexible substrate during subsequent hot pressing with the metal wire, thereby reducing the risk of metal wire detachment. Subsequently, the metal wire is conveyed to the wire groove in the hot pressing mechanism; the movable protrusion structure within the wire groove applies lateral pushing force to the metal wire, causing it to form a preset pattern and ensuring the forming accuracy of the metal wire; the lifting mechanism within the lower pressure plate lifts the metal wire in the wire groove, bringing the metal wire into contact with the flexible substrate; the upper pressure plate applies pressure and heat to the contact area between the metal wire and the flexible substrate, hot-pressing and embedding the metal wire into the flexible substrate, resulting in high precision metal wire embedding. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0030] Figure 1 A flowchart illustrating the steps of an embodiment of the RFID flexible tag manufacturing method provided by the present invention;

[0031] Figure 2 This is a schematic diagram of a structure of an embodiment of the hot pressing mechanism provided by the present invention;

[0032] Figure 3 This is a schematic diagram of a structure of an embodiment of the pressure plate provided by the present invention.

[0033] Explanation of icon numbers:

[0034] 100. Hot pressing mechanism; 11. Flexible substrate; 12. Metal wire; 13. Upper pressure plate; 14. Lower pressure plate; 140. Raised structure; 141. First raised structure; 142. Second raised structure.

[0035] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0037] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0038] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0039] RFID flexible tags, as a core component of the Internet of Things, are widely used in fields such as clothing, medical care, and logistics.

[0040] Existing methods for manufacturing RFID flexible tags employ ultrasonic wire bonding technology. This technology utilizes the principle of ultrasonic welding to transfer vibrational energy to the joints of the tag to be welded, converting it into heat energy through friction to melt and bond the tags together. However, the high-frequency vibrational energy is unevenly absorbed on the flexible substrate, resulting in a high rate of metal wire detachment. Another method involves weaving the metal wires into the flexible substrate, but this suffers from low wire embedding accuracy.

[0041] This invention proposes a method for manufacturing flexible RFID tags. Please refer to [link / reference]. Figure 1 In one embodiment of the present invention, the RFID flexible tag manufacturing method includes the following steps:

[0042] Step S10: The flexible substrate of the upper pressure plate is pre-tensioned and straightened in both directions, while the flexible substrate 11 is preheated.

[0043] Step S20: Feed the metal wire into the wire trough in the hot pressing mechanism;

[0044] Step S30: Apply lateral pushing force to the metal wire using the movable protrusion structure inside the wire groove to form a preset pattern on the metal wire;

[0045] Step S50: Use the lifting mechanism inside the lower pressure plate to lift the metal wire in the wire groove so that the metal wire contacts the flexible substrate;

[0046] Step S60: Apply pressure and heat to the contact area between the metal wire and the flexible substrate using the upper pressure plate to heat-print the metal wire into the flexible substrate.

[0047] In one embodiment, the flexible substrate 11 with embedded metal wire 12 hot stamping is the intermediate material of the wash label, and the complete flexible wash label is formed by subsequent steps such as coating and lamination.

[0048] The upper pressure plate 13 applies pressure and heat to the contact area between the metal wire 12 and the flexible substrate 11. After the step of hot stamping the metal wire into the flexible substrate, the process further includes: cooling the material of the wash label by natural air cooling and moving it to the next station.

[0049] Step S20 includes:

[0050] The metal wire 12 is plasma cleaned and then transported to the wire trough through a guide wheel system.

[0051] The metal wire 12 enters the wire groove in a straight, stretched state. After the metal wire 12 is conveyed into the wire groove, the tension of the metal wire 12 can be reduced by a servo tension control system. Specifically, the tension of the metal wire 12 can be reduced from the original 20N to 5N to 10N. At the same time, multiple protruding structures 140 move slowly in sequence to push the metal wire 12 in sequence until the metal wire 12 forms a preset pattern.

[0052] The technical solution of this invention employs bidirectional pre-tensioning and straightening of the flexible substrate 11 on the upper pressure plate 13, while simultaneously preheating the flexible substrate 11, thereby eliminating the internal stress of the flexible substrate 11 and reducing its deformation rate during subsequent hot pressing, thus reducing the risk of the metal wire 12 detaching. Subsequently, the metal wire 12 is conveyed to the wire groove in the hot pressing mechanism 100; the movable protrusion structure 140 in the wire groove applies a lateral pushing force to the metal wire 12, causing the metal wire 12 to form a preset pattern, ensuring the forming accuracy of the metal wire 12; the lifting mechanism in the lower pressure plate 14 lifts the metal wire 12 in the wire groove, causing the metal wire 12 to contact the flexible substrate 11; the upper pressure plate 13 applies pressure and heats the contact area between the metal wire 12 and the flexible substrate, hot-pressing and embedding the metal wire 12 into the flexible substrate 11, resulting in high embedding accuracy of the metal wire 12.

[0053] In one embodiment, step S50 includes: using 0.2 Up to 1.0 The speed of lifting the metal wire 12, while applying 5 up to 8 The pressure;

[0054] The upper pressure plate 13 applies pressure and heat to the contact area between the metal wire 12 and the flexible substrate, and the step of hot stamping the metal wire 12 into the flexible substrate 11 includes: applying pressure and heating at 0.8... Up to 1.5 Press down the upper pressure plate 13 at a speed of 10. Up to 25 The pressure is applied and the temperature is heated to 70°C to 90°C.

[0055] In one embodiment, step S50 includes a two-stage pressure loading process: in the first stage, the lifting mechanism within the lower pressure plate 14 can operate at 0.2... The speed pushes the metal wire 12 out, while applying 5 to the metal wire 12. The low pressure ensures that the metal wire 12, shaped into a preset pattern, can be slowly pushed out into the wire groove, so that the metal wire 12 is laid flat on the surface of the lower pressure plate 14, and the metal wire 12 can be pushed to contact the flexible substrate 11 of the upper pressure plate 13; in the second stage, the upper pressure plate 13 is at 1 Speed ​​down pressure, working pressure 20 The upper pressure plate 13 is heated to 90°C, causing the adhesive layer of the flexible substrate 11 to melt. The upper pressure plate 13 and the lower pressure plate 14 together clamp the metal wire 12, embedding the metal wire 12 into the flexible substrate 11. The embedding depth of the metal wire 12 into the flexible substrate 11 is uniform, and the positional accuracy is high. The seamless transition time between the two stages is less than 0.05s, and the embedding of the metal wire 12 into the flexible substrate 11 is stable, reducing the possibility of the metal wire 12 breaking or detaching from the flexible substrate 11.

[0056] In one embodiment, step S60 includes: the pre-tensioning tension is 5. Up to 15 The preheating temperature is 50℃ to 100℃, and the preheating time is 3s to 5s.

[0057] Step S10 includes:

[0058] The flexible substrate 11 is pre-tensioned bidirectionally by an electric clamp. The tension of the electric clamp ranges from 5N to 15N. The preheating temperature of the electric clamp can be 80 degrees Celsius, and the preheating time is from 3 to 5 seconds.

[0059] In one embodiment, the flexible substrate 11 is a flexible fabric. The preheating unit in the upper pressure plate 13 can uniformly heat the flexible substrate 11 to the target temperature to reduce the moisture absorption rate of the flexible substrate 11, thereby improving the dimensional stability of the flexible substrate 11.

[0060] In one embodiment, while the flexible substrate 11 is being bidirectionally pre-tensioned and preheated, the metal wire 12 is also being fed into the wire groove in the hot pressing mechanism 100.

[0061] Please refer to Figure 1 Before step S50, the method further includes:

[0062] Step S40: Heat and shape the metal wire using a wire groove. The heating and shaping temperature is 50℃ to 80℃, and the shaping time is 2s to 5s.

[0063] The metal wire 12 forms a preset pattern. The metal wire 12 is kept heated in the wire groove for 3 to 5 seconds to ensure that the temperature of the lower pressure plate 14 can be stabilized within the temperature range required when the metal wire 12 is hot-stamped onto the flexible substrate 11. Afterward, the lifting mechanism of the lower pressure plate 14 pushes the metal wire 12 out of the wire groove, so that the metal wire 12 comes into contact with the flexible substrate 11 of the upper pressure plate 13.

[0064] In one embodiment, the preset pattern can be a meander pattern. The flexible substrate 11 can be fabric.

[0065] The sequence in which the multiple protruding structures 140 push the metal wire 12 is as follows: first, the protruding structure 140 in the middle moves, and then the protruding structures 140 on both sides move, so that the meander pattern of the metal wire 12 appears. After the entire metal wire 12 has completely formed the meander pattern, the tension of the metal wire 12 can be slowly increased to 15N using a servo tension control system to ensure the stability of the meander pattern formed by the metal wire 12.

[0066] To ensure the metal wire 12 is stably embedded within the flexible substrate 11, after step 60, the method further includes:

[0067] In 10 Up to 25 Maintain pressure for 3 to 5 seconds;

[0068] Or, with 10 Hold pressure for 2 seconds, then apply 25... Hold pressure for 3 seconds.

[0069] In one embodiment, the pressure of the upper pressure plate 13 can be maintained at 10. This allows the adhesive layer in the flexible substrate 11 to melt and flow fully to fill the substrate.

[0070] To meet the insulation needs of different fabric materials, a multi-stage pressure holding method can be used: first apply 10N of pressure and maintain it for 2 seconds, then increase the pressure to 25N and maintain it for 3 seconds. Alternatively, a single-stage pressure holding method can be used: apply 20N of pressure and maintain it for 5 seconds.

[0071] Furthermore, after the pressure holding is completed, the upper pressure plate 13 and the lower pressure plate 14 are separated. At this time, the metal wire 12 has been completely embedded in the adhesive layer of the flexible substrate 11 to be stably fixed in the flexible substrate 11.

[0072] After the upper pressure plate 13 and the lower pressure plate 14 separate by 10mm to 30mm, the flexible substrate 11 is then conveyed forward, and the metal wire 12 is slowly stretched forward by 800mm to 1000mm. The lower pressure plate 14 slowly moves upward by 5mm to 10mm, and a new section of metal wire 12 is conveyed into the wire trough to prepare for a new round of metal wire 12 shaping operation. At the same time, the flexible substrate 11 is preheated by contacting the upper pressure plate, and the new round of steps is repeated to form a cycle.

[0073] In one embodiment, after step S60, the method further includes:

[0074] Data from displacement, temperature, and pressure sensors are acquired, and the displacement difference is calculated using the compensation formula.

[0075] Both the upper pressure plate 13 and the lower pressure plate 14 are equipped with displacement sensors, temperature sensors and pressure sensors.

[0076] The step of acquiring data from the displacement sensor, temperature sensor, and pressure sensor, and calculating the displacement difference according to the compensation formula includes:

[0077] Temperature difference for: ;

[0078] Pressure difference for: ;

[0079] Based on feedback from displacement, temperature, and pressure sensors, the temperature difference between the preset temperature and the actual temperature, and the pressure difference between the preset pressure and the actual pressure are calculated. The temperature difference is then... and pressure difference Substitute into the compensation formula Calculate the displacement difference And then according to The static compensation value is obtained. Where k1 is the temperature coefficient, ranging from 0.2 N / ℃ to 0.3 N / ℃; and k2 is the deformation coefficient, ranging from 0.13 N / ℃. 0.23 .

[0080] In one embodiment, k1 = 0.25 N / ℃. k2 = 0.13 .

[0081] The present invention also provides a hot pressing mechanism 100, please refer to [link / reference]. Figure 2 The hot pressing mechanism 100 includes an upper pressure plate 13 and a lower pressure plate 14. The lower pressure plate 14 has a groove, and the groove has a plurality of movable protrusions 140. Please refer to [link to relevant documentation]. Figure 3The multiple protruding structures 140 are arranged at staggered intervals; the lower pressure plate 14 is also equipped with a heating pipe, a displacement sensor and multiple temperature sensors.

[0082] The lower pressure plate 14 is made of an aluminum alloy substrate. The lower pressure plate 14 integrates heating pipes and multiple temperature sensors, with a spacing of less than or equal to 15mm between them, to ensure uniform temperature distribution and facilitate temperature control. The lower pressure plate 14 is provided with grooves, the etching depth of which can be from 1mm to 3mm. Multiple micro-protrusions 140 are provided within the grooves to guide the metal wires 12 to form a meander pattern.

[0083] The upper pressure plate 13 includes a steel substrate and a silicone composite layer disposed at the bottom of the substrate. The upper pressure plate 13 is controlled by a pneumatic cylinder to achieve a downward pressure stroke ranging from 0 mm to 20 mm, and the pressure range of the upper pressure plate 13 is within 5 mm. By 20 The distance between them is adjustable. The surface of the silicone composite layer is designed with multiple micron-sized concave structures to enhance the friction between the upper pressure plate 13 and the flexible substrate 11.

[0084] The groove of the lower pressure plate 14 is machined by micro-milling. The groove is 2mm wide and 2mm deep. An asymmetrical micro-convex protrusion structure 140 is set inside the groove. The height of the protrusion structure 140 is 0.5mm and the inclination angle of the protrusion structure 140 is 45°. The groove integrates a piezoelectric ceramic displacement sensor to monitor the position of the metal wire 12 in real time.

[0085] In one implementation, please refer to Figure 3 The plurality of protrusions 140 include a first protrusion 141 and a second protrusion 142. The first protrusion 141 and the second protrusion 142 are disposed opposite to each other and are staggered. The first protrusion 141 and the second protrusion 142 move toward each other towards the center line of the lower pressure plate 14 to push the metal wire 12.

[0086] The groove can be changed according to the needs of different labels, and the groove type can be changed in 3 to 5 minutes, which improves the compatibility of the hot stamping mechanism 100.

[0087] Furthermore, the number of the hot pressing mechanism 100 is at least two, and each of the at least two hot pressing mechanisms 100 is equipped with a temperature control system and a pressure control system. The at least two hot pressing mechanisms 100 are produced in parallel.

[0088] In one embodiment, there are 2 to 16 independently controlled hot stamping mechanisms 100, each equipped with a complete tension control system, temperature control system and pressure control system to support the parallel production of different types of flexible substrates 11 or different antenna patterns on the hot stamping mechanism 100.

[0089] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of protection of the present invention. Any equivalent structural transformations made based on the technical concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. A method of manufacturing an RFID flexible label, characterized by, Includes the following steps: The flexible substrate of the upper pressure plate is pre-tensioned and straightened in both directions, while the flexible substrate is preheated. The metal wire is fed into the wire trough in the hot pressing mechanism; The movable protrusions inside the groove apply a lateral pushing force to the metal wire, causing the metal wire to form a preset pattern. The metal wire in the wire groove is lifted by the lifting mechanism inside the lower pressure plate, so that the metal wire comes into contact with the flexible substrate; The upper pressure plate applies pressure and heat to the contact area between the metal wire and the flexible substrate, and the metal wire is hot-stamped and embedded into the flexible substrate. wherein the step of jacking the wire in the wire slot using the lifting mechanism in the lower presser plate comprises jacking the wire at a speed of 0.2 to 1.0 while applying a pressure of 5 to 8 . The upper platen applies pressure to the contact area of the metal thread with the flexible substrate and heat to emboss the metal thread into the flexible substrate. The step of applying pressure and heat to emboss the metal thread into the flexible substrate includes pressing the upper platen at a speed of 0.8 to 1.5 , applying a pressure of 10 to 25 , and heating to 70°C to 90°C. The step of pre-tensioning and straightening the flexible substrate of the upper pressing plate in two directions and preheating the flexible substrate comprises that the pre-tensioning tension is 5 to 15 , the preheating temperature is 50-100 DEG C, and the preheating time is 3-5 s.

2. The method of claim 1, wherein the RFID flexible label is manufactured by the steps of: Before the step of using the lifting mechanism within the lower pressure plate to lift the metal wire in the wire groove and bring the metal wire into contact with the flexible substrate, the method further includes: The metal wire is heated and shaped using a wire groove. The heating and shaping temperature is 50°C to 80°C, and the shaping time is 2s to 5s.

3. The method of claim 1, wherein the RFID flexible label manufacturing method is characterized by, After the step of applying pressure and heating the contact area between the metal wire and the flexible substrate using an upper pressure plate to hot-print and embed the metal wire into the flexible substrate, the method further includes: In 10 To 25 Maintained under pressure for 3 to 5 s; or, at 10 Hold for 2 s, then at 25 Hold for 3 s.

4. The method of claim 1, wherein the RFID flexible label manufacturing method is characterized by, After the step of applying pressure and heating the contact area between the metal wire and the flexible substrate using the upper pressure plate to hot-print and embed the metal wire into the flexible substrate, the method further includes: Data from displacement, temperature, and pressure sensors are acquired, and the displacement difference is calculated using the compensation formula.

5. The method of manufacturing an RFID flexible label of claim 4, wherein, The step of acquiring data from the displacement sensor, temperature sensor, and pressure sensor, and calculating the displacement difference according to the compensation formula includes: Temperature difference To: ; pressure difference to be: ; Based on feedback from displacement sensors, temperature sensors, and pressure sensors, the temperature difference between the preset temperature and the actual temperature, and the pressure difference between the preset pressure and the actual pressure are obtained. Temperature difference and pressure difference Substitute into the compensation formula Calculate the displacement difference And then according to The static compensation value is obtained. Where k1 is the temperature coefficient, ranging from 0.2 N / ℃ to 0.3 N / ℃; and k2 is the deformation coefficient, ranging from 0.13 N / ℃. 0.23 .

6. A hot-pressing mechanism characterized by comprising: The hot pressing mechanism adopts the RFID flexible tag manufacturing method as described in any one of claims 1 to 5; the hot pressing mechanism includes an upper pressure plate and a lower pressure plate, the lower pressure plate has a groove, and the groove has a plurality of movable protrusions, the plurality of protrusions being arranged in a staggered and spaced manner; the lower pressure plate is also provided with a heating pipe, a displacement sensor and a plurality of temperature sensors.

7. The ironing press mechanism according to claim 6, wherein The plurality of protruding structures include a first protruding structure and a second protruding structure, the first protruding structure and the second protruding structure being disposed opposite to each other and offset from each other, the first protruding structure and the second protruding structure moving toward each other towards the center line of the lower pressure plate to push the metal wire.

8. The ironing press mechanism of claim 6 wherein, The number of the hot pressing mechanism is at least two, and each of the at least two hot pressing mechanisms is equipped with a temperature control system and a pressure control system.

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