Ultrasonic cleaning equipment for wafer cleaning

Abstract

The invention belongs to the technical field of ultrasonic cleaning, and particularly relates to ultrasonic cleaning equipment for wafer cleaning, which comprises a working table, corners of the bottom surface of the working table are isolated from the ground through supporting legs, a lifting sleeve is vertically fixed in the center of the top surface of the working table, and a lifting rod is movably embedded in a center hole of the lifting sleeve. A support disc is fixedly installed at the top end of the lifting rod, a plurality of insertion holes are formed in the side of the support disc at equal intervals, hook rods are connected into the insertion holes in an inserted mode, positioning grooves are formed in the outer ends of the hook rods, and wafer containing frames are connected into the positioning grooves in a hooked mode; the side of the top face of the working table is in supporting connection with an annular rotating disc. According to the wafer cleaning device, the wafer containing frame is driven by the lifting rod to ascend and descend, the multiple ultrasonic cleaning pools are driven by the annular rotary disc to rotate, wafers in the wafer containing frame can be gradually cleaned among the multiple cleaning pools till the needed cleaning effect is achieved, the cleaning effect is good, and the cleaning efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of ultrasonic cleaning technology, specifically to an ultrasonic cleaning device for wafer cleaning. Background Technology

[0002] Ultrasonic cleaners generate high-frequency oscillation signals through an ultrasonic generator, which are then converted into mechanical vibrations by a transducer and transmitted to the cleaning fluid. In the cleaning fluid, the ultrasonic waves propagate and generate countless tiny bubbles. These bubbles rapidly enlarge under the negative pressure of the sound waves and then suddenly collapse under positive pressure, creating a cavitation effect. The shock waves generated by this cavitation effect break the adhesion between dirt and the object's surface, causing the dirt to peel off. Simultaneously, the ultrasonic vibrations emulsify oil stains, making them easier to remove. Ultrasonic cleaners offer advantages such as excellent cleaning effect, gentle and non-damaging operation, suitability for various materials, and comprehensive cleaning.

[0003] Therefore, ultrasonic cleaning machines are now widely used in wafer cleaning. Wafer cleaning involves using various solutions to dissolve oil and impurities on the wafer surface. Furthermore, after each use of a solution, it is necessary to thoroughly rinse the wafer with pure water before using another solution. Current ultrasonic cleaning equipment for wafer cleaning has the following shortcomings: First, it can only clean one wafer at a time. When using the first cleaning solution to clean one wafer, it cannot clean other wafers, resulting in low cleaning efficiency. Second, it cannot progressively clean the wafers, leading to poor cleaning results. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides an ultrasonic cleaning device for wafer cleaning, which solves the problems mentioned in the background section.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, the present invention specifically adopts the following technical solution:

[0008] An ultrasonic cleaning device for wafer cleaning includes a worktable. The corners of the bottom surface of the worktable are isolated from the ground by support legs. A lifting sleeve is vertically fixed to the center of the top surface of the worktable. A lifting rod is movably fitted into the center hole of the lifting sleeve. A support plate is fixedly installed at the top of the lifting rod. A plurality of through holes are evenly spaced on the sides of the support plate. A hook rod is inserted into each of the through holes. A positioning groove is opened at the outer end of the hook rod. A wafer placement frame is hooked into the positioning groove. An annular turntable is supported and connected to the side of the top surface of the worktable. The center hole of the annular turntable is coaxial with the lifting sleeve. A plurality of ultrasonic cleaning tanks are evenly fixed on the side of the annular turntable. The wafer placement frame is positioned directly above the ultrasonic cleaning tank.

[0009] Furthermore, a lifting cylinder is fixedly installed in the center of the bottom surface of the worktable, and the lifting shaft at the top of the lifting cylinder is fixedly connected to the lifting rod.

[0010] Furthermore, a gear ring is fixedly provided on the side of the annular turntable, a shift motor is fixedly installed on one corner of the worktable, and a drive gear is fixed on the output shaft of the shift motor, the drive gear meshing with the gear ring.

[0011] Furthermore, a locking screw is screwed onto the side of the top surface of the support plate, and the bottom end of the locking screw abuts against the top surface of the connecting hook rod.

[0012] Furthermore, magnetic induction switches are fixed at both the upper and lower ends of the lifting cylinder.

[0013] Furthermore, an annular edge is fixedly installed on the side of the annular turntable.

[0014] (III) Beneficial Effects

[0015] Compared with the prior art, the present invention provides an ultrasonic cleaning device for wafer cleaning, which has the following advantages:

[0016] This invention uses a lifting rod to raise and lower the wafer placement frame, and a ring turntable to rotate several ultrasonic cleaning tanks, allowing the wafers in the wafer placement frame to be gradually cleaned between the several cleaning tanks until the desired cleaning effect is achieved. The cleaning effect is good and the cleaning efficiency is improved.

[0017] This invention, by simultaneously setting up several hook rods and several ultrasonic cleaning tanks, and with the wafer placement frame positioned directly above the ultrasonic cleaning tank, can simultaneously clean wafers in several wafer placement frames, thereby further improving cleaning efficiency. Attached Figure Description

[0018] Figure 1This is a schematic diagram of the main structure of the present invention;

[0019] Figure 2 This is a side sectional view of the main structure of the present invention;

[0020] Figure 3 This is a top view of the main structure of the present invention.

[0021] In the diagram: 1. Workbench; 2. Support leg; 3. Lifting sleeve; 4. Lifting rod; 5. Support plate; 6. Insertion hole; 7. Hook rod; 8. Positioning slot; 9. Wafer placement frame; 10. Circular turntable; 11. Ultrasonic cleaning tank; 12. Lifting cylinder; 13. Gear ring; 14. Shifting motor; 15. Drive gear; 16. Locking screw; 17. Magnetic induction switch; 18. Circular edge. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Example

[0024] like Figure 1 , 2 As shown in Figure 3, an ultrasonic cleaning device for wafer cleaning according to one embodiment of the present invention includes a worktable 1. The worktable 1 has its bottom corners isolated from the ground by support legs 2. A lifting sleeve 3 is vertically fixed to the center of the top surface of the worktable 1. A lifting rod 4 is movably fitted into the center hole of the lifting sleeve 3. A support plate 5 is fixedly installed at the top of the lifting rod 4. A plurality of through holes 6 are equally spaced on the sides of the support plate 5. A hook rod 7 is inserted into each of the through holes 6. A positioning groove 8 is opened at the outer end of the hook rod 7. A wafer placement frame 9 is hooked into the positioning groove 8. An annular turntable 10 is supported and connected to the side of the top surface of the worktable 1. The center hole of the annular turntable 10 is coaxially arranged with the lifting sleeve 3. A plurality of ultrasonic cleaning tanks 11 are equally spaced and fixed on the side of the annular turntable 10. The wafer placement frame 9 is positioned directly above the ultrasonic cleaning tank 11.

[0025] In this embodiment, several ultrasonic cleaning tanks 11 are filled with different types of cleaning solutions. Wafers are arranged and fixed in a wafer placement frame 9. The operator hangs the wafer placement frame 9 on the hook rod 7 through the positioning groove 8. The lifting rod 4 drives the wafer placement frame 9 to rise and fall through the support plate 5 and the hook rod 7. When the wafer placement frame 9 descends, it can be immersed in the first ultrasonic cleaning tank 11. At this time, the ultrasonic cleaning tank 11 performs ultrasonic cleaning on the wafers in the wafer placement frame 9. After the wafers in the wafer placement frame 9 are cleaned, the lifting rod 4 drives the wafer placement frame 9 to rise above the top opening of the ultrasonic cleaning tank 11 through the support plate 5 and the hook rod 7. At this time, the annular turntable 10 drives several ultrasonic cleaning tanks 11 to rotate at a set angle. Then the wafer placement frame 9 descends again and is immersed in the second ultrasonic cleaning tank 11 for cleaning. In this way, the wafer placement frame 9 can be gradually cleaned between several cleaning tanks until the required cleaning effect is achieved, and the cleaning efficiency is improved.

[0026] Furthermore, since several hook rods 7 and several ultrasonic cleaning tanks 11 are set up at the same time, and the wafer placement frame 9 is set directly above the ultrasonic cleaning tank 11, the wafers in several wafer placement frames 9 can be cleaned at the same time, thereby further improving the cleaning efficiency.

[0027] Furthermore, such as Figure 2 As shown, a lifting cylinder 12 is fixedly installed in the middle of the bottom surface of the worktable 1, and the lifting shaft at the top of the lifting cylinder 12 is fixedly connected to the lifting rod 4.

[0028] As described above, the lifting cylinder 12 drives the lifting rod 4 to rise and fall through the lifting shaft at the top, and then drives the wafer placement frame 9 to rise and fall through the bracket plate 5 and the hook rod 7, thereby realizing the above-mentioned cleaning process.

[0029] Furthermore, such as Figure 1 As shown, a gear ring 13 is fixedly installed on the side of the annular turntable 10, and a shift motor 14 is fixedly installed on one corner of the worktable 1. A drive gear 15 is fixedly installed on the output shaft of the shift motor 14, and the drive gear 15 meshes with the gear ring 13.

[0030] The shift motor 14 is a stepper motor or a servo motor, and its rotation angle can be precisely controlled. Therefore, the shift motor 14 drives the annular turntable 10 and several ultrasonic cleaning tanks 11 to rotate at a set angle through the drive gear 15 meshing with the gear ring 13, so that the wafer placement frame 9 can be gradually cleaned in the above-mentioned different types of cleaning solutions.

[0031] Furthermore, such as Figure 1As shown, a locking screw 16 is screwed onto the side of the top surface of the support plate 5. The bottom end of the locking screw 16 abuts against the top surface of the hook rod 7 so that the hook rod 7 can be locked after the hook rod 7 is adjusted to the correct position, so that the wafer placement frame 9 is always directly above the ultrasonic cleaning tank 11.

[0032] Furthermore, such as Figure 2 As shown, magnetic induction switches 17 are fixed at both the upper and lower ends of the lifting cylinder 12. The magnetic induction switches 17 are used to sense the position of the piston inside the lifting cylinder 12, and further sense the height position of the wafer placement frame 9, so that the ultrasonic cleaning tank 11 avoids interference and collision with the wafer placement frame 9 when it rotates.

[0033] Furthermore, such as Figure 2 As shown, an annular edge 18 is fixedly installed on the side of the annular turntable 10. The annular edge 18 is used to block the liquid splashed during cleaning.

[0034] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An ultrasonic cleaning device for wafer cleaning, comprising a worktable (1), characterized in that: The corners of the bottom surface of the workbench (1) are isolated from the ground by the support legs (2). A lifting sleeve (3) is vertically fixed at the center of the top surface of the workbench (1). A lifting rod (4) is movably fitted into the center hole of the lifting sleeve (3). A support plate (5) is fixedly installed at the top of the lifting rod (4). Several through holes (6) are equally spaced on the side of the support plate (5). A hook rod (7) is inserted into each of the several through holes (6). A positioning groove (8) is opened at the outer end of the hook rod (7). A wafer placement frame (9) is hooked into the positioning groove (8). A ring turntable (10) is supported and connected to the side of the top surface of the workbench (1). The center hole of the ring turntable (10) is coaxially set with the lifting sleeve (3). Several ultrasonic cleaning tanks (11) are equally spaced on the side of the ring turntable (10). The wafer placement frame (9) is located directly above the ultrasonic cleaning tank (11).

2. The ultrasonic cleaning equipment for wafer cleaning according to claim 1, characterized in that: A lifting cylinder (12) is fixedly installed in the middle of the bottom surface of the workbench (1), and the lifting shaft at the top of the lifting cylinder (12) is fixedly connected to the lifting rod (4).

3. The ultrasonic cleaning equipment for wafer cleaning according to claim 1, characterized in that: A gear ring (13) is fixedly provided on the side of the annular turntable (10), and a shift motor (14) is fixedly installed on one corner of the worktable (1). A drive gear (15) is fixed on the output shaft of the shift motor (14), and the drive gear (15) meshes with the gear ring (13).

4. The ultrasonic cleaning equipment for wafer cleaning according to claim 1, characterized in that: A locking screw (16) is screwed onto the side of the top surface of the support plate (5), and the bottom end of the locking screw (16) abuts against the top surface of the connecting hook rod (7).

5. The ultrasonic cleaning equipment for wafer cleaning according to claim 2, characterized in that: Magnetic induction switches (17) are fixed at both the upper and lower ends of the lifting cylinder (12).

6. The ultrasonic cleaning equipment for wafer cleaning according to claim 1, characterized in that: The annular turntable (10) has an annular edge (18) fixedly installed on its side.

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