Rapid calibration device and method for wafer probe station

Abstract

The invention discloses a wafer probe station rapid calibration device and method, and relates to the technical field of wafer probe stations, the wafer probe station rapid calibration device comprises a base frame, a base station and a support are fixedly installed on the surface of the base frame, a laser range finder is fixedly installed in the support, and a calibration mechanism is arranged in the base frame. After a to-be-tested wafer chip is placed on a support table, an electric push rod drives a stand column to move downwards, the support table drives the to-be-tested wafer chip to rotate, the stand column enables a rotating rod to rotate at the same time through a first gear and a transmission assembly, the to-be-tested wafer chip is limited through a support sleeve, and friction to the peripheral side of the wafer chip is avoided; the wafer chip is centered when moving downwards, then the supporting table is reset upwards, the correction work of the wafer chip can be completed through one-time longitudinal displacement, the correction efficiency of the wafer chip is effectively improved, and meanwhile the wafer chip correction device is simple in structure and low in manufacturing cost and use cost.

Description

Technical Field

[0001] This invention relates to the field of wafer probe station technology, specifically to a rapid calibration device and method for wafer probe stations. Background Technology

[0002] A wafer probe station is a high-precision device used to perform electrical performance testing on chips during the wafer manufacturing process. As a core device in semiconductor testing, the wafer probe station transmits and measures electrical signals by having probes contact the test points on the chip.

[0003] In existing technologies, when using a wafer prober, the chip needs to be placed on the wafer prober, and then the probes need to contact the chip test points to complete the test. Before testing the chip, it is usually necessary to calibrate the chip to ensure that the probes contact the chip. However, the calibration device of the existing wafer prober has a complex structure and high manufacturing and usage costs, which increases the chip testing cost.

[0004] Combining the above issues, we find that existing wafer prober rapid calibration devices on the market cannot simultaneously avoid the problems mentioned above. Even if they can solve these problems, they require external tools, thus failing to achieve the desired effect. Therefore, we propose a wafer prober rapid calibration device and method. Summary of the Invention

[0005] The purpose of this invention is to provide a rapid calibration device and method for a wafer probe station to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a wafer probe station rapid calibration device, comprising a base frame, a base plate and a support fixedly mounted on the surface of the base frame, a laser rangefinder fixedly mounted inside the support plate, and a calibration mechanism provided inside the base frame, the calibration mechanism being used in conjunction with the base plate;

[0007] The correction mechanism includes a support, a fixed frame, and a rotating rod. A rotating assembly is installed inside the base frame. The support is fixedly connected to the top of the rotating assembly. The fixed frame is fixedly installed at the bottom of the base. A transmission assembly is provided at one end of the fixed frame. The transmission assembly works in conjunction with the rotating assembly and the rotating rod. An adjustment assembly is provided on one side of the fixed frame. The rotating rod works in conjunction with the adjustment assembly. A support sleeve is fixedly fitted on the surface of the rotating rod. The rotating rod is inclined.

[0008] The rotating assembly includes an electric push rod, which is fixedly installed inside the base frame. The telescopic end of the electric push rod is rotatably connected to a column. One end of the column passes through the base frame and the base platform and is rotatably connected to the inner cavity of the base frame and the base platform. A support is fixedly connected to one end of the column. The surface of the support is provided with a spiral groove. A guide block is fixedly installed in the inner cavity of the base frame. The guide block cooperates with the spiral groove. A first gear is fixedly sleeved on the surface of the column. The first gear cooperates with a transmission assembly.

[0009] Preferably, the transmission assembly includes a rotating shaft rotatably connected to the bottom of the base. A second gear is fixedly sleeved on the surface of the rotating shaft, and the surface of the second gear meshes with the surface of the first gear. One end of the rotating shaft is rotatably connected to a connecting sleeve via a universal coupling. The connecting sleeve cooperates with a fixed frame. A connecting rod is slidably sleeved inside the connecting sleeve. One end of the connecting rod passes through the connecting sleeve and is connected to the rotating shaft via a universal coupling.

[0010] Preferably, a first positioning block is fixedly installed at the other end of the rotating shaft, the first positioning block is rotatably connected to the inside of the base, a first connecting block is fixedly installed on the surface of the connecting sleeve, a first connecting frame is fixedly installed at one end of the fixing frame, and the first connecting block is rotatably connected to the inside of the first connecting frame.

[0011] Preferably, a first limiting block is fixedly installed on the inner wall of the connecting sleeve, and a first limiting groove is formed on the surface of the connecting rod, with the inner cavity of the first limiting groove slidably connected to the surface of the first limiting block.

[0012] Preferably, the adjusting assembly includes a sleeve, which is fixedly connected to one side of the fixing frame. A screw is slidably fitted inside the sleeve, and a threaded sleeve is rotatably fitted at one end of the sleeve. The inner cavity of the threaded sleeve is threadedly connected to the surface of the screw. A second connecting frame is fixedly connected to one end of the screw, and the rotating rod is rotatably fitted inside the second connecting frame.

[0013] Preferably, a second connecting block is fixedly installed on the surface of the rotating rod, and the second connecting block is rotatably connected inside the second connecting frame.

[0014] Preferably, a second positioning block is fixedly installed on the surface of one end of the sleeve, and the threaded sleeve is rotatably sleeved on the surface of the second positioning block.

[0015] Preferably, a positioning frame is fixedly installed on one side of the fixing frame, and a positioning rod is fixedly connected to the bottom of the second connecting frame, with one end of the positioning rod slidably connected inside the positioning frame.

[0016] Preferably, a second limiting block is fixedly installed on the inner wall of the positioning frame, and a second limiting groove is formed on the surface of the positioning rod. The surface of the second limiting block is slidably connected to the inner cavity of the second limiting groove.

[0017] The method for using the wafer prober rapid calibration device includes the following steps:

[0018] S1. Debugging: Adjust the position of the rotating rod according to the specifications of the wafer chip, rotate the threaded sleeve to make the threaded sleeve drive the screw to slide inside the sleeve, and stabilize the position of the second connecting rod through the positioning frame and positioning rod to adjust the position of the rotating rod. At the same time, the connecting rod slides inside the connecting sleeve to make the transmission component adapt to the position of the rotating rod.

[0019] S2. Chip Placement: The robotic arm in the wafer prober places the wafer chip to be tested onto the support platform and positions the wafer chip between the three rotating rods.

[0020] S3. Correction: The electric push rod drives the column to move downwards, and the column rotates through the cooperation of the spiral groove and the guide block. The column drives the support to rotate, and the support drives the wafer chip to rotate. At the same time, the column drives the rotating rod to rotate through the first gear and the transmission assembly. The rotating rod drives the support sleeve to rotate. The support sleeve supports the outside of the wafer chip. By tilting the rotating rod, the wafer chip is centered during the downward movement to complete the correction of the wafer chip. Then the electric push rod drives the support to return to its original position by driving the column upwards.

[0021] S4. Unloading: The calibrated wafer chip is removed by the robotic arm in the wafer prober.

[0022] S5. Testing: The wafer chip to be tested is fed into the wafer probe station by a robotic arm for testing.

[0023] Compared with the prior art, the beneficial effects of the present invention are:

[0024] 1. This invention, through the setting of a calibration mechanism, after the wafer chip to be tested is placed on the support, the column is driven to move downward by an electric push rod, and at the same time the support causes the wafer chip to rotate. The column, through the first gear and transmission assembly, causes the rotating rod to rotate simultaneously, so that the rotating rod drives the support sleeve to rotate. The support sleeve limits the wafer chip to be tested and avoids friction on the periphery of the wafer chip, so that the wafer chip is centered when moving downward. Then the support returns to its original position. The calibration of the wafer chip can be completed in one longitudinal displacement, thereby effectively improving the calibration efficiency of the wafer chip. At the same time, the structure is simple and the manufacturing and usage costs are low.

[0025] 2. This invention, by setting an adjustment component, when used for wafer chips of different sizes, rotates the threaded sleeve, which drives the screw to slide inside the sleeve, so that the screw drives the second connecting frame to move simultaneously. The position of the second connecting frame is stabilized by the positioning rod and the positioning frame, so that the second connecting frame drives the rotating rod to move laterally. At the same time, the connecting rod slides inside the connecting sleeve, thereby achieving the function of adjusting the position of the rotating rod. By adjusting the position of the rotating rod, it is possible to adapt to the calibration work of wafer chips of different sizes. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0027] Figure 2 This is a schematic diagram of the correction mechanism structure of the present invention;

[0028] Figure 3 For the present invention Figure 2 A schematic diagram of the structure viewed from below;

[0029] Figure 4 This is a schematic diagram of the transmission component structure of the present invention;

[0030] Figure 5 This is a schematic diagram of the connecting sleeve structure of the present invention;

[0031] Figure 6 This is a schematic diagram of the adjustment component structure of the present invention;

[0032] Figure 7 For the present invention Figure 6 A magnified structural diagram of part A.

[0033] In the diagram: 1. Base frame; 101. Base platform; 102. Support; 103. Laser rangefinder; 2. Calibration mechanism; 21. Support; 22. Rotating assembly; 2201. Electric push rod; 2202. Column; 2203. Spiral groove; 2204. Guide block; 2205. First gear; 23. Fixing frame; 24. Transmission assembly; 2401. Rotating shaft; 2402. Second gear; 2403. Connecting sleeve; 2404. Connecting rod; 2405. First positioning block; 2406, First connecting block; 2407, First connecting frame; 2408, First limiting block; 2409, First limiting groove; 25, Rotating rod; 26, Support sleeve; 27, Adjusting assembly; 2701, Sleeve; 2702, Screw; 2703, Threaded sleeve; 2704, Second connecting frame; 2705, Second connecting block; 2706, Second positioning block; 2707, Positioning frame; 2708, Positioning rod; 2709, Second limiting block; 2710, Second limiting groove. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Example 1: Please refer to Figures 1-7 The present invention provides a technical solution: a wafer probe station rapid calibration device, including a base frame 1, a base 101 and a support 102 fixedly mounted on the surface of the base frame 1, a laser rangefinder 103 fixedly mounted inside the support 102, and a calibration mechanism 2 provided inside the base frame 1, which is used in conjunction with the base 101.

[0036] The calibration mechanism 2 includes a support 21, a fixed frame 23, and a rotating rod 25. The base frame 1 has a rotating component 22 inside. The support 21 is fixedly connected to the top of the rotating component 22. The fixed frame 23 is fixedly installed at the bottom of the base 101. One end of the fixed frame 23 is provided with a transmission component 24. The transmission component 24 works in conjunction with the rotating component 22 and the rotating rod 25. One side of the fixed frame 23 is provided with an adjustment component 27. The rotating rod 25 works in conjunction with the adjustment component 27. A support sleeve 26 is fixedly sleeved on the surface of the rotating rod 25. The rotating rod 25 is inclined.

[0037] The rotating assembly 22 includes an electric push rod 2201, which is fixedly installed inside the base frame 1. The telescopic end of the electric push rod 2201 is rotatably connected to a column 2202. One end of the column 2202 passes through the base frame 1 and the base platform 101 and is rotatably connected to the inner cavity of the base frame 1 and the base platform 101. A support 21 is fixedly connected to one end of the column 2202. A spiral groove 2203 is provided on the surface of the support 21. A guide block 2204 is fixedly installed in the inner cavity of the base frame 1. The guide block 2204 cooperates with the spiral groove 2203. A first gear 2205 is fixedly sleeved on the surface of the column 2202. The first gear 2205 cooperates with the transmission assembly 24.

[0038] When calibration of the wafer chip under test is required, the wafer chip is placed on the support 21. Then, the electric push rod 2201 drives the column 2202 downwards, and through the cooperation of the spiral groove 2203 and the guide block 2204, the column 2202 rotates. This causes the column 2202 to drive the support 21 and the first gear 2205 to rotate. The rotation of the support 21 causes the wafer chip under test to rotate, and through the first gear 2205 and the transmission assembly 24, the rotating rod 25 rotates, so that the support sleeve 26 is positioned within the wafer chip under test. While positioning, friction between the support 26 and the wafer chip under test is avoided. The tilting of the rotating rod 25 ensures that the wafer chip under test is centered during downward displacement. After the laser rangefinder 103 detects that the wafer chip under test is in the centered position, the electric push rod 2201 drives the column 2202 to reset upward, so that the support 21 drives the wafer chip under test to reset upward, thereby completing the calibration of the wafer chip under test. The calibration of the wafer chip under test is completed in one longitudinal displacement, which greatly improves the calibration efficiency of the wafer chip under test.

[0039] As a further definition of the correction mechanism 2 of the present invention, the transmission assembly 24 includes a rotating shaft 2401, which is rotatably connected to the bottom of the base 101. A second gear 2402 is fixedly sleeved on the surface of the rotating shaft 2401, and the surface of the second gear 2402 meshes with the surface of the first gear 2205. One end of the rotating shaft 2401 is rotatably connected to a connecting sleeve 2403 via a universal coupling. The connecting sleeve 2403 cooperates with the fixing frame 23. A connecting rod 2404 is slidably sleeved inside the connecting sleeve 2403, and one end of the connecting rod 2404 passes through the connecting sleeve 2403. One end of 04 is connected to the rotating rod 25 via a universal coupling. When the column 2202 rotates, the column 2202 drives the first gear 2205 to rotate, the first gear 2205 drives the second gear 2402 to rotate, the second gear 2402 drives the rotating shaft 2401 to rotate, the rotating shaft 2401 drives the connecting sleeve 2403 to rotate via the universal coupling, the connecting sleeve 2403 drives the connecting rod 2404 to rotate, and the connecting rod 2404 drives the rotating rod 25 to rotate via the universal coupling, so that the rotating rod 25 and the support 21 rotate synchronously, thereby avoiding friction between the wafer chip under test and the support 26.

[0040] A first positioning block 2405 is fixedly installed at the other end of the rotating shaft 2401. The first positioning block 2405 is rotatably connected to the inside of the base 101. A first connecting block 2406 is fixedly installed on the surface of the connecting sleeve 2403. A first connecting frame 2407 is fixedly installed at one end of the fixing frame 23. The first connecting block 2406 is rotatably connected to the inside of the first connecting frame 2407. The first positioning block 2405 is rotatably connected to the inside of the base 101 to effectively stabilize the position of the rotating shaft 2401 and prevent the rotating shaft 2401 from shifting or falling off, which would affect the transmission effect. The first connecting block 2406 is rotatably connected to the inside of the first connecting frame 2407 to effectively stabilize the position of the connecting sleeve 2403 and prevent the connecting sleeve 2403 from shifting, which would affect the transmission effect.

[0041] A first limiting block 2408 is fixedly installed on the inner wall of the connecting sleeve 2403, and a first limiting groove 2409 is formed on the surface of the connecting rod 2404. The inner cavity of the first limiting groove 2409 is slidably connected to the surface of the first limiting block 2408. By sliding the surface of the first limiting block 2408 to the inner cavity of the first limiting groove 2409, the connecting sleeve 2403 can drive the connecting rod 2404 to rotate through the first limiting block 2408 and the first limiting groove 2409, while avoiding affecting the sliding of the connecting rod 2404 inside the connecting sleeve 2403.

[0042] The specific implementation of this embodiment is as follows: When calibration of the wafer chip under test is required, the wafer chip under test is placed on the support 21. Then, the electric push rod 2201 drives the column 2202 to move downward, and the column 2202 rotates through the cooperation of the spiral groove 2203 and the guide block 2204. This causes the column 2202 to drive the support 21 and the first gear 2205 to rotate. The rotation of the support 21 causes the wafer chip under test to rotate, and the rotation of the column 2202 causes the column 2202 to drive the first gear 2205 to rotate. The first gear 2205 drives the second gear 2402 to rotate, and the second gear 2402 drives the rotating shaft 2401 to rotate. The first positioning block 2405 stabilizes the position of the rotating shaft 2401, so that the rotating shaft 2401 drives the connecting sleeve 2403 to rotate through the universal coupling, and the first connecting bracket 2407 and the first connecting... The connecting block 2406 stabilizes the position of the connecting sleeve 2403, causing the connecting sleeve 2403 to drive the connecting rod 2404 to rotate via the first limiting block 2408 and the first limiting groove 2409. The connecting rod 2404 causes the rotating rod 25 to rotate via the universal coupling, so that the rotating rod 25 rotates synchronously with the support 21. This allows the support 26 to limit the wafer chip under test while preventing friction between the wafer chip under test and the support 26. Furthermore, the tilting of the rotating rod 25 ensures that the wafer chip under test is centered during downward displacement. After the laser rangefinder 103 detects that the wafer chip under test is in the centered position, the electric push rod 2201 drives the column 2202 to reset upward, causing the support 21 to drive the wafer chip under test to reset upward, thereby completing the calibration of the wafer chip under test. The calibration of the wafer chip under test is completed in one longitudinal displacement, greatly improving the calibration efficiency of the wafer chip under test.

[0043] Example 2: Please refer to Figures 1-7 The present invention provides a technical solution: a wafer probe station rapid calibration device, which makes corresponding improvements to the technical problems mentioned in the background art.

[0044] As a further definition of the correction mechanism 2 of the present invention, the adjustment assembly 27 includes a sleeve 2701, which is fixedly connected to one side of the fixing frame 23. A screw 2702 is slidably sleeved inside the sleeve 2701, and a threaded sleeve 2703 is rotatably sleeved at one end of the sleeve 2701. The inner cavity of the threaded sleeve 2703 is threadedly connected to the surface of the screw 2702. A second connecting frame 2704 is fixedly connected to one end of the screw 2702, and a rotating rod 25 is rotatably sleeved inside the second connecting frame 2704. A second connecting block 2705 is fixedly installed on the surface of the rotating rod 25 and rotatably connected inside the second connecting frame 2704. A second positioning block 2706 is fixedly installed on the surface of one end of the sleeve 2701, and the threaded sleeve 2703 is rotatably sleeved on the surface of the second positioning block 2706. This adjustment assembly is suitable for applications with different sizes of large... When working with small wafer chips, the threaded sleeve 2703 is rotated, and the position of the threaded sleeve 2703 is stabilized by the second positioning block 2706 to prevent lateral displacement of the threaded sleeve 2703. This allows the threaded sleeve 2703 to drive the screw 2702 to slide inside the sleeve 2701, causing the screw 2702 to drive the second connecting frame 2704 to move simultaneously. The position of the second connecting frame 2704 is stabilized by the positioning rod 2708 and the positioning frame 2707. The second connecting block 2705 prevents the rotating rod 25 from longitudinally displacing inside the second connecting frame 2704, allowing the second connecting frame 2704 to drive the rotating rod 25 to move laterally. At the same time, the connecting rod 2404 slides inside the connecting sleeve 2403, thereby adjusting the position of the rotating rod 25. By adjusting the position of the rotating rod 25, the calibration work of wafer chips of different sizes can be adapted.

[0045] A positioning frame 2707 is fixedly installed on one side of the fixing frame 23. A positioning rod 2708 is fixedly connected to the bottom of the second connecting frame 2704. One end of the positioning rod 2708 is slidably connected to the inside of the positioning frame 2707. A second limiting block 2709 is fixedly installed on the inner wall of the positioning frame 2707. A second limiting groove 2710 is formed on the surface of the positioning rod 2708. The surface of the second limiting block 2709 is slidably connected to the inner cavity of the second limiting groove 2710. The positioning rod 2708 is slidably connected to the inner cavity of the second limiting groove 2710. The positioning rod 2708 is attached inside the positioning frame 2707 to stabilize the position of the second connecting frame 2704 through the positioning rod 2708 and the positioning frame 2707, so as to prevent the second connecting frame 2704 from shifting. At the same time, the positioning rod 2708 is stabilized inside the positioning frame 2707 through the second positioning block 2706 and the second limiting groove 2710, so as to prevent the positioning rod 2708 from separating from the positioning frame 2707, thus ensuring the limiting effect of the positioning frame 2707 and the positioning rod 2708 on the second connecting frame 2704.

[0046] The specific implementation of this embodiment is as follows: When it is necessary to perform calibration work on wafer chips of different sizes, the position of the rotating rod 25 is adjusted according to the size of the wafer chip, the threaded sleeve 2703 is rotated, and the position of the threaded sleeve 2703 is stabilized by the second positioning block 2706 to prevent the threaded sleeve 2703 from shifting laterally, so that the threaded sleeve 2703 drives the screw 2702 to slide inside the sleeve 2701, so that the screw 2702 drives the second connecting frame 2704 to move simultaneously, and the positioning rod 2708 is stabilized in the positioning frame 2704 by the second limiting block 2709 and the second limiting groove 2710. The positioning rod 2708 is positioned inside the positioning frame 2707 so that it can slide inside the positioning frame 2707. This stabilizes the position of the second connecting frame 2704 and prevents the rotating rod 25 from longitudinally displacing inside the second connecting frame 2704 through the second connecting block 2705. This allows the second connecting frame 2704 to drive the rotating rod 25 to laterally displace. At the same time, the connecting rod 2404 slides inside the connecting sleeve 2403, thereby adjusting the position of the rotating rod 25. By adjusting the position of the rotating rod 25, it can be adapted to the calibration work of wafer chips of different sizes.

[0047] Please see Figures 1-7 This invention provides a technical solution: a method for using a wafer prober rapid calibration device, comprising the following steps:

[0048] S1. Debugging: Adjust the position of the rotating rod 25 according to the specifications of the wafer chip, rotate the threaded sleeve 2703 so that the threaded sleeve 2703 drives the screw 2702 to slide inside the sleeve 2701, and stabilize the position of the second connecting rod 2404 through the positioning frame 2707 and the positioning rod 2708 to adjust the position of the rotating rod 25. At the same time, the connecting rod 2404 slides inside the connecting sleeve 2403 so that the transmission component 24 adapts to the position of the rotating rod 25.

[0049] S2. Chip Placement: The robotic arm in the wafer prober places the wafer chip to be tested onto the support 21 and positions the wafer chip between the three rotating rods 25.

[0050] S3. Correction: The electric push rod 2201 drives the column 2202 to move downward. The column 2202 rotates through the cooperation of the spiral groove 2203 and the guide block 2204. The column 2202 drives the support 21 to rotate. The support 21 drives the wafer chip to rotate. At the same time, the column 2202 drives the rotating rod 25 to rotate through the first gear 2205 and the transmission assembly 24. The rotating rod 25 drives the support sleeve 26 to rotate. The support sleeve 26 supports the outer side of the wafer chip. Through the tilt setting of the rotating rod 25, the wafer chip is centered during the downward movement to complete the correction of the wafer chip. Then the electric push rod 2201 drives the support 21 to return to the starting position through the column 2202.

[0051] S4. Unloading: The calibrated wafer chip is removed by the robotic arm in the wafer prober.

[0052] S5. Testing: The wafer chip to be tested is fed into the wafer probe station by a robotic arm for testing.

[0053] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0054] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer probe station rapid calibration device, comprising a base frame (1), characterized in that: The base (1) is fixedly mounted with a base (101) and a bracket (102). A laser rangefinder (103) is fixedly mounted inside the bracket (102). A calibration mechanism (2) is provided inside the base (1). The calibration mechanism (2) is used in conjunction with the base (101). The correction mechanism (2) includes a support (21), a fixed frame (23), and a rotating rod (25). The base frame (1) is equipped with a rotating component (22). The support (21) is fixedly connected to the top of the rotating component (22). The fixed frame (23) is fixedly installed at the bottom of the base frame (101). One end of the fixed frame (23) is equipped with a transmission component (24). The transmission component (24) works in conjunction with the rotating component (22) and the rotating rod (25). One side of the fixed frame (23) is equipped with an adjustment component (27). The rotating rod (25) works in conjunction with the adjustment component (27). The surface of the rotating rod (25) is fixedly fitted with a support sleeve (26). The rotating rod (25) is inclined. The rotating assembly (22) includes an electric push rod (2201), which is fixedly installed inside the base frame (1). The telescopic end of the electric push rod (2201) is rotatably connected to a column (2202). One end of the column (2202) passes through the base frame (1) and the base platform (101) and is rotatably connected to the inner cavity of the base frame (1) and the base platform (101). The support (21) is fixedly connected to one end of the column (2202). The surface of the support (21) is provided with a spiral groove (2203). The inner cavity of the base frame (1) is fixedly installed with a guide block (2204). The guide block (2204) cooperates with the spiral groove (2203). The surface of the column (2202) is fixedly sleeved with a first gear (2205). The first gear (2205) cooperates with the transmission assembly (24).

2. The wafer probe station rapid calibration device according to claim 1, characterized in that: The transmission assembly (24) includes a rotating shaft (2401), which is rotatably connected to the bottom of the base (101). A second gear (2402) is fixedly sleeved on the surface of the rotating shaft (2401). The surface of the second gear (2402) meshes with the surface of the first gear (2205). One end of the rotating shaft (2401) is rotatably connected to a connecting sleeve (2403) through a universal coupling. The connecting sleeve (2403) is used in conjunction with the fixing frame (23). A connecting rod (2404) is slidably sleeved inside the connecting sleeve (2403). One end of the connecting rod (2404) passes through the connecting sleeve (2403). One end of the connecting rod (2404) is connected to the rotating rod (25) through a universal coupling.

3. The wafer probe station rapid calibration device according to claim 2, characterized in that: The other end of the rotating shaft (2401) is fixedly installed with a first positioning block (2405), which is rotatably connected to the inside of the base (101). The surface of the connecting sleeve (2403) is fixedly installed with a first connecting block (2406). One end of the fixing frame (23) is fixedly installed with a first connecting frame (2407), and the first connecting block (2406) is rotatably connected to the inside of the first connecting frame (2407).

4. The wafer probe station rapid calibration device according to claim 2, characterized in that: The inner wall of the connecting sleeve (2403) is fixedly installed with a first limiting block (2408), and the surface of the connecting rod (2404) is provided with a first limiting groove (2409), and the inner cavity of the first limiting groove (2409) is slidably connected to the surface of the first limiting block (2408).

5. The wafer probe station rapid calibration device according to claim 1, characterized in that: The adjusting assembly (27) includes a sleeve (2701), which is fixedly connected to one side of the fixing frame (23). A screw (2702) is slidably sleeved inside the sleeve (2701). A threaded sleeve (2703) is rotatably sleeved at one end of the sleeve (2701). The inner cavity of the threaded sleeve (2703) is threadedly connected to the surface of the screw (2702). A second connecting frame (2704) is fixedly connected to one end of the screw (2702). The rotating rod (25) is rotatably sleeved inside the second connecting frame (2704).

6. The wafer probe station rapid calibration device according to claim 5, characterized in that: The surface of the rotating rod (25) is fixedly mounted with a second connecting block (2705), which is rotatably connected to the inside of the second connecting frame (2704).

7. The wafer probe station rapid calibration device according to claim 5, characterized in that: A second positioning block (2706) is fixedly installed on the surface of one end of the sleeve (2701), and the threaded sleeve (2703) is rotatably sleeved on the surface of the second positioning block (2706).

8. The wafer probe station rapid calibration device according to claim 5, characterized in that: A positioning frame (2707) is fixedly installed on one side of the fixed frame (23), and a positioning rod (2708) is fixedly connected to the bottom of the second connecting frame (2704). One end of the positioning rod (2708) is slidably connected to the inside of the positioning frame (2707).

9. The wafer probe station rapid calibration device according to claim 8, characterized in that: The inner wall of the positioning frame (2707) is fixedly installed with a second limiting block (2709), and the surface of the positioning rod (2708) is provided with a second limiting groove (2710). The surface of the second limiting block (2709) is slidably connected to the inner cavity of the second limiting groove (2710).

10. The method of using the wafer probe station rapid calibration device according to any one of claims 1-9, characterized in that: Includes the following steps: S1. Debugging: Adjust the position of the rotating rod (25) according to the specifications of the wafer chip, rotate the threaded sleeve (2703) so that the threaded sleeve (2703) drives the screw (2702) to slide inside the sleeve (2701), and stabilize the position of the second connecting rod (2404) through the positioning frame (2707) and the positioning rod (2708) to adjust the position of the rotating rod (25). At the same time, the connecting rod (2404) slides inside the connecting sleeve (2403) so that the transmission component (24) adapts to the position of the rotating rod (25). S2, chip placement: The wafer chip to be tested is placed on the support (21) by the robot in the wafer probe station and the wafer chip to be tested is positioned between the three rotating rods (25); S3, Correction: The electric push rod (2201) drives the column (2202) to move downward. The column (2202) rotates through the cooperation of the spiral groove (2203) and the guide block (2204). The column (2202) drives the support (21) to rotate. The support (21) drives the wafer chip to rotate. At the same time, the column (2202) drives the rotating rod (25) to rotate through the first gear (2205) and the transmission assembly (24). The rotating rod (25) drives the support sleeve (26) to rotate. The support sleeve (26) supports the outer side of the wafer chip. Through the tilt setting of the rotating rod (25), the wafer chip is centered during the downward movement to complete the correction of the wafer chip. Then the electric push rod (2201) drives the support (21) to reset upward through the column (2202). S4. Unloading: The calibrated wafer chip is removed by the robotic arm in the wafer prober. S5. Testing: The wafer chip to be tested is sent to the wafer probe station by a robotic arm for testing.

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