Chip on film and display device

Abstract

The invention relates to the field of display, and particularly discloses a chip on film and a display device.The chip on film comprises a base material layer, a first metal layer and a driving chip, the first metal layer is arranged above the base material layer, and the side, away from the base material layer, of the first metal layer is connected with the driving chip through a connecting line; the chip on film further comprises a second metal layer, the second metal layer is arranged on the side, away from the first metal layer, of the base material layer, openings are formed in the positions, corresponding to the driving chip, of the first metal layer and the base material layer, and the openings are used for partially exposing the second metal layer. The second metal layer abuts against the driving chip through the opening. In this way, the heat dissipation performance of the chip on film is effectively improved.

Description

Technical Field

[0001] This application relates to the field of displays, and more particularly to a flip-chip film and a display device. Background Technology

[0002] As the refresh rate and resolution of display panel products continue to increase, the temperature of the flip-chip film connected to the display panel is usually relatively high because its structure is very compact and it needs to process all data signals, timing signals, voltage signals, etc. that are output to the display panel within such a small structure.

[0003] While the chip film generates heat, the load on the display panel does not decrease. This means that the higher the temperature, the greater the load on the chip film, thus affecting its performance.

[0004] Therefore, how to improve the heat dissipation performance of flip-chip films has become an urgent problem to be solved in this field. Summary of the Invention

[0005] This application discloses a flip-chip thin film and a display device, with the aim of improving the heat dissipation performance of the flip-chip thin film.

[0006] This application discloses a flip-chip film, including a substrate layer, a first metal layer, and a driver chip. The first metal layer is disposed above the substrate layer, and the side of the first metal layer away from the substrate layer is connected to the driver chip via a connecting line. The flip-chip film also includes a second metal layer, which is disposed on the side of the substrate layer away from the first metal layer. The first metal layer and the substrate layer have openings at positions corresponding to the driver chip, and the openings are used to partially expose the second metal layer, which abuts against the driver chip through the openings.

[0007] Optionally, the second metal layer includes a substrate layer, a first extension, and a second extension. The substrate layer is located on the side of the substrate layer away from the first metal layer and is connected to the substrate layer. One end of the first extension is connected to the substrate layer, and the other end is connected to the second extension. The first extension is located within the opening between the first metal layer and the substrate layer, and the side of the second extension away from the first extension abuts against the driver chip.

[0008] Optionally, the opening includes a first opening disposed on the first metal layer, and a gap exists between the first extension and the first opening.

[0009] Optionally, the second extension has a plurality of channels on the side near the driver chip, and the plurality of channels are arranged at intervals along the extension direction of the horizontal plane of the second extension.

[0010] Optionally, the driver chip includes a chip body and a packaging layer. The packaging layer encapsulates the chip body and is made of an insulating material. A ground layer is provided between the packaging layer and the chip body. The ground layer is located on the side of the chip body near the second extension and is connected to the chip body. The ground layer corresponds to the position of the second extension.

[0011] Optionally, the gaps between the driver chip, the connecting line, the first extension, and the second extension are all filled with an insulating layer.

[0012] Optionally, the flip-chip film further includes a solder resist layer disposed above the first metal layer, and the solder resist layer has a third opening at the position corresponding to the driver chip. The third opening is used to partially expose the first metal layer so that the driver chip can be connected to the first metal layer through the connecting line. The thickness of the second extension is greater than half the thickness of the solder resist layer and less than the total thickness of the solder resist layer.

[0013] Optionally, the connecting line includes a first connecting line and a second connecting line, the first connecting line and the second connecting line being located on both sides of the first opening and close to the first opening; the first metal layer includes a first sub-metal layer and a second sub-metal layer, the first sub-metal layer and the second sub-metal layer being located on both sides of the first opening; the first connecting line is connected between the driver chip and the first sub-metal layer; the second connecting line is connected between the driver chip and the second sub-metal layer; the first connecting line and the second connecting line are respectively separated from the second extension.

[0014] Optionally, the first extension is perpendicular to the second extension, and the width of the second extension is greater than the width of the first extension, but less than the spacing between the first connecting line and the second connecting line.

[0015] This application also discloses a display device, including a display panel and a printed circuit board. The display device further includes the aforementioned flip-chip film, which is connected between the display panel and the printed circuit board.

[0016] This application improves upon traditional flip-chip films by additionally forming a second metal layer on the side of the substrate layer away from the driver chip. The second metal layer is partially exposed through openings in the first metal layer and the substrate layer, allowing it to contact the driver chip. When the driver chip generates heat during operation, the heat is directly conducted to the second metal layer due to the contact between the two layers, and then transferred to the external environment. This effectively reduces the temperature of the driver chip, thereby improving the heat dissipation performance of the flip-chip film and enhancing its signal transmission stability. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the embodiments of this application and form part of the specification. They serve to demonstrate implementation methods of this application and, together with the textual description, explain the principles of this application. Obviously, the drawings described below are merely some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort. In the drawings:

[0018] Figure 1 This is a schematic diagram of the first embodiment of the flip-chip film of this application;

[0019] Figure 2 This is a schematic diagram of a second embodiment of the flip-chip film of this application;

[0020] Figure 3 This is a schematic diagram of the third embodiment of the flip-chip film of this application;

[0021] Figure 4 This is a schematic diagram of the fourth embodiment of the flip-chip film of this application;

[0022] Figure 5 This is a schematic diagram of an embodiment of the display device of this application.

[0023] Among them, 10 is a display device; 100 is a flip-chip film; 200 is a display panel; 300 is a printed circuit board; 110 is a substrate layer; 120 is a first metal layer; 121 is a first sub-metal layer; 122 is a second sub-metal layer; 130 is a driver chip; 131 is a chip body; 132 is a packaging layer; 133 is a ground layer; 140 is a second metal layer; 141 is a substrate layer; 142 is a first extension; 143 is a second extension; 144 is a channel; 150 is an opening; 151 is a first opening; 160 is an insulating layer; 170 is a solder resist layer; 180 is a third opening; 190 is a connecting line; 191 is a first connecting line; and 192 is a second connecting line. Detailed Implementation

[0024] The present application will now be described in detail with reference to the accompanying drawings and optional embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0025] Figure 1 This is a schematic diagram of the first embodiment of the flip-chip film of this application, as shown. Figure 1 As shown in the figure, this application discloses a flip-chip film 100, including a substrate layer 110, a first metal layer 120, and a driver chip 130. The first metal layer 120 is disposed above the substrate layer 110, and the side of the first metal layer 120 away from the substrate layer 110 is connected to the driver chip 130 through a connecting line 190. The flip-chip film 100 also includes a second metal layer 140, which is disposed on the side of the substrate layer 110 away from the first metal layer 120. The first metal layer 120 and the substrate layer 110 have openings 150 at positions corresponding to the driver chip 130. The openings 150 are used to partially expose the second metal layer 140, and the second metal layer 140 abuts against the driver chip 130 through the openings 150.

[0026] This application improves upon the conventional flip-chip film 100 by additionally providing a second metal layer 140 on the side of the substrate layer 110 away from the driver chip 130. The second metal layer 140 is partially exposed through openings 150 on the first metal layer 120 and the substrate layer 110, allowing it to contact the driver chip 130. When the driver chip 130 generates heat during operation, the heat is directly conducted to the second metal layer 140 due to the contact between the second metal layer 140 and the driver chip 130, and then transferred to the external environment. This effectively reduces the temperature of the driver chip 130, thereby improving the heat dissipation performance of the flip-chip film 100 and enhancing its signal transmission stability.

[0027] It should be noted that the substrate layer 110 in this application can be made of polyimide material, the first metal layer 120 has at least conductive properties and can be a copper metal layer, and the second metal layer 140 is a metal layer with heat dissipation and thermal conductivity properties, such as a metal layer made of copper material, or a metal layer made of other metal materials with the same properties; this application is only used as an example to illustrate that both the first metal layer 120 and the second metal layer 140 are copper metal layers.

[0028] A first metal layer 120 is formed by depositing copper material on the substrate layer 110. The driver chip 130 is then bonded to the first metal layer 120 via a connecting line 190. Anisotropic conductive adhesive is used to bond the wiring on the driver chip 130 and the first metal layer 120. This allows each pin on the driver chip 130 to be connected to the wiring deposited on the first metal layer 120, forming a whole and achieving electrical connection and signal transmission.

[0029] In order to enable the second metal layer 140 to abut against the driver chip 130 from the side of the substrate layer 110 away from the driver chip 130 through the opening 150, this application has also made improvements to the structure of the second metal layer 140, as follows:

[0030] The second metal layer 140 includes a substrate layer 141, a first extension 142, and a second extension 143. The substrate layer 141 is located on the side of the base layer 110 away from the first metal layer 120 and is connected to the base layer 110. One end of the first extension 142 is connected to the substrate layer 141, and the other end is connected to the second extension 143. The first extension 142 is located in the opening 150 of the first metal layer 120 and the base layer 110, and the side of the second extension 143 away from the first extension 142 abuts against the driver chip 130.

[0031] In this embodiment, the substrate layer 141 is located outside the substrate layer 110. The second metal layer 140 is partially extended to a position close to the driver chip 130 by the first extension 142, and abuts against the driver chip 130 by the second extension 143.

[0032] When the driver chip 130 generates heat during operation, the heat is first transferred to the second extension 143 that is in contact with the driver chip 130, then transferred from the second extension 143 to the first extension 142, and finally transferred to the substrate layer 141 via the first extension 142, whereby the substrate layer 141 dissipates the heat to the external environment.

[0033] In this embodiment, the heat is transferred sequentially through the second extension 143 and the first extension 142, so that the heat is gradually carried away from the driver chip 130. On the one hand, the heat can be effectively dissipated from the driver chip 130, and on the other hand, the heat can be prevented from accumulating at the location of the driver chip 130, which is conducive to improving the heat dissipation effect of the driver chip 130, and thus improving the heat dissipation effect of the flip-chip film 100.

[0034] Of course, in this embodiment, the second extension 143 may not be provided. That is, the second metal layer 140 includes a substrate layer 141 and a first extension 142. One end of the first extension 142 is connected to the substrate layer 141, and the other end extends to the driver chip 130 through the opening 150 and abuts against the driver chip 130. In this solution, the first extension 142 directly abuts against the driver chip 130. The heat generated by the driver chip 130 is directly transferred to the first extension 142, and then transferred from the first extension 142 to the substrate layer 141. The substrate layer 141 then dissipates the heat to the external environment, which can also improve the heat dissipation performance of the flip-chip film 100.

[0035] This application only uses the second metal layer, which includes a substrate layer 141, a first extension 142, and a second extension 143, as an example.

[0036] Furthermore, the opening 150 includes a first opening 151, which is disposed on the first metal layer 120, and there is a gap between the first extension 142 and the first opening 151.

[0037] In this embodiment, since the first opening 151 is formed on the first metal layer 120, the first extension 142 needs to pass through the first opening 151 to extend to a position close to the driver chip 130. That is, the first extension 142 is actually partially located inside the first opening 151. Since the first extension 142 itself is conductive, in this embodiment, a gap is provided between the first extension 142 and the first opening 151 so that the first extension 142 will not contact the sidewall of the first opening 151, thus preventing it from contacting the first metal layer 120. This prevents the first extension 142 from contacting the first metal layer 120 and causing a short circuit, ensuring the normal use of the flip-chip film 100.

[0038] Furthermore, the flip-chip film 100 also includes a solder resist layer 170, which is disposed above the first metal layer 120. The solder resist layer 170 has a third opening 180 at the position corresponding to the driver chip 130. The third opening 180 is used to partially expose the first metal layer 120 so that the driver chip 130 can be connected to the first metal layer 120 through the connecting line 190. The thickness of the second extension 143 is greater than half the thickness of the solder resist layer 170 but less than the total thickness of the solder resist layer 170.

[0039] In this embodiment, the solder resist layer 170 is disposed above the first metal layer 120 mainly to avoid moisture, static electricity, etc. affecting the connection position between the driver chip 130 and the first metal layer 120, thereby helping to extend the service life of the flip-chip film 100.

[0040] By opening a third opening 180 on the solder mask layer 170, the third opening 180 can expose the position of the first metal layer 120 corresponding to the driver chip 130. In this way, the driver chip 130 can form a stable electrical connection with the first metal layer 120 through the connecting line 190, thereby ensuring normal signal transmission of the driver chip 130.

[0041] Furthermore, the space formed by the third opening 180 is also used to accommodate the second extension 143. That is, the second extension 143 can actually be regarded as being set in the same layer as the solder resist layer 170. When the thickness of the second extension 143 is greater than half the thickness of the solder resist layer 170 but less than the total thickness of the solder resist layer 170, on the one hand, the second extension 143 will not protrude from the solder resist layer 170 on the horizontal plane, which can effectively reduce the overall size of the flip-chip film 100; on the other hand, it can ensure that the second extension 143 has sufficient thickness to connect with the first extension 142, so that the second extension 143 is not easy to break with the first extension 142 while maintaining a certain support strength for the driver chip 130, thereby effectively improving the stability of the connection between the first extension 142 and the second extension 143, which helps to improve the heat dissipation stability of the flip-chip film 100.

[0042] It should be noted that the solder resist layer 170 in this application can be a substrate layer 141 that completely covers the first metal layer 120 and the second metal layer 140, or it can be a substrate layer 141 that partially covers the first metal layer 120 and completely exposes the second metal layer 140.

[0043] When the solder resist layer 170 completely covers the substrate layer 141 of the first metal layer 120 and the second metal layer 140, neither the first metal layer 120 nor the substrate layer 141 of the second metal layer 140 is exposed to the external environment. This effectively reduces the impact of external moisture corrosion on the first metal layer 120 and the second metal layer 140, which helps to extend the service life of the flip-chip film 100. When the solder resist layer 170 partially covers the first metal layer 120 and completely exposes the substrate layer 141 of the second metal layer 140, the substrate layer 141 of the second metal layer 140 can directly contact the metal backplate. In this way, when the heat generated by the driver chip 130 is transferred to the substrate layer 141 through the second extension 143 and the first extension 142, the substrate layer 141 can directly transfer the heat to the metal backplate because it is in direct contact with the metal backplate. Since the metal backplate itself has a large heat dissipation area, it helps to quickly dissipate the heat generated by the driver chip 130 to the external environment.

[0044] This application is illustrated by example only, where the solder mask layer 170 partially covers the first metal layer 120, while the substrate layer 141 of the second metal layer 140 is completely exposed.

[0045] Furthermore, the connecting line 190 includes a first connecting line 191 and a second connecting line 192, which are located on both sides of the first opening 151 and close to it; the first metal layer 120 includes a first sub-metal layer 121 and a second sub-metal layer 122, which are located on both sides of the first opening 151; the first connecting line 191 connects the driver chip 130 and the first sub-metal layer 121; the second connecting line 192 connects the driver chip 130 and the second sub-metal layer 122; the first connecting line 191 and the second connecting line 192 have gaps with the second extension 143.

[0046] It should be noted that the first sub-metal layer 121 and the second sub-metal layer 122 in this application do not mean that they are two completely disconnected copper layers, but rather that they are copper layer structures located on both sides of the first opening 151 of the first metal layer 120, and the two copper layers are only disconnected at the first opening 151, while the other parts are connected.

[0047] The driver chip 130 is generally bonded to the first metal layer 120 through multiple connecting lines 190. The first connecting line 191 and the second connecting line 192 can be understood as the connecting lines 190 closest to the two sides of the first opening 151 among the multiple connecting lines 190. Since the first extension 142 extends from the first opening 151 and connects to the second extension 143, and the second extension 142 generally needs to be appropriately wider than the first extension to ensure sufficient heat conduction area for contact with the driver chip 130, in order to avoid the second extension 143 from contacting the first connecting line 191 and the second connecting line 192, this application provides gaps between the first connecting line 191 and the second connecting line 192 and the second extension 143, so that the second extension 143 does not contact the first connecting line 191 and the second connecting line 192 respectively. This can avoid the situation where the second extension 143 contacts the first connecting line 191 and the second connecting line 192, which would cause a short circuit.

[0048] Specifically, in this embodiment, the first extension 142 is perpendicular to the second extension 143, and the width of the second extension 143 is greater than the width of the first extension 142, but less than the distance between the first connecting line 191 and the second connecting line 192.

[0049] Since the first extension 142 is perpendicular to the second extension 143, the first extension 142 can provide stable support for the second extension 143, improving structural stability and ensuring that the second extension 143 is on a horizontal plane. When the second extension 143 comes into contact with the driver chip 130, the driver chip 130 is also on a horizontal plane, which helps to improve the stability of the driver chip 130's operation.

[0050] Furthermore, since the second extension 143 abuts against the driver chip 130, the size of the contact area between the second extension 143 and the driver chip 130 determines the thermal conductivity of the second extension 143 to the driver chip 130. Therefore, when the width of the second extension 143 is greater than the width of the first extension 142, the contact area between the second extension 143 and the driver chip 130 is relatively large, resulting in better thermal conductivity. When the driver chip 130 generates heat during operation, the second extension 143 can quickly conduct the heat out and transfer it to the first extension 142 and the substrate layer 141, and the substrate layer 141 dissipates the heat to the external environment, effectively reducing the temperature of the driver chip 130.

[0051] In this embodiment, the width of the second extension 143 is smaller than the distance between the first connecting line 191 and the second connecting line 192, so that the second extension 143 does not come into contact with the connecting lines 190 on both sides. This avoids short circuits caused by the second extension 143 coming into contact with the connecting lines 190, and ensures the reliability and stability of the flip-chip film 100.

[0052] Figure 2 This is a schematic diagram of a second embodiment of the flip-chip film of this application, as shown below. Figure 2 As shown, Figure 2 The illustrated embodiment is based on Figure 1 As an improvement, the second extension 143 is provided with a plurality of channels 144 on the side near the driver chip 130, and the plurality of channels 144 are arranged at intervals along the extension direction of the horizontal plane of the second extension 143.

[0053] The difference between this embodiment and the previous embodiment is that in this embodiment, a plurality of channels 144 are provided on the side of the second extension 143 near the driver chip 130. When the second extension 143 contacts the outer surface of the driver chip 130, the plurality of channels 144 form a plurality of gaps between the driver chip 130 and the second extension 143, and air can circulate in the plurality of channels 144. When the driver chip 130 generates heat during operation, on the one hand, the heat can be transferred to the external environment in sequence through the second extension 143, the first extension 142 and the substrate layer 141. On the other hand, the heat can also be quickly carried away from below the driver chip 130 by the air circulating in the channels 144, so as to avoid the accumulation of heat below the driver chip 130 and the occurrence of the driver chip 130 overheating, thereby improving the heat dissipation performance of the flip-chip film 100.

[0054] Since the flip-chip film serves as the connection between the display panel driving system and the in-plane display system, it is subject to electrostatic discharge (ESD) from both the in-plane of the display panel and the two ends of the printed circuit board. Both ESD from the in-plane of the display panel and the printed circuit board can be transferred to the flip-chip film through various paths. Once this ESD is released on the driving chip, there is a high probability that the flip-chip film will fail, ultimately leading to abnormal or no display in the product. Therefore, based on the above problems, this application also makes improvements to the flip-chip film, as follows:

[0055] Figure 3 This is a schematic diagram of the third embodiment of the flip-chip film of this application. Figure 3 The illustrated embodiment is based on Figure 1 The improved driver chip 130 includes a chip body 131 and a package layer 132. The package layer 132 wraps around the chip body 131 and is made of an insulating material. A ground layer 133 is provided between the package layer 132 and the chip body 131. The ground layer 133 is located on the side of the chip body 131 near the second extension 143 and is connected to the chip body 131. The ground layer 133 corresponds to the position of the second extension 143.

[0056] In this embodiment, the encapsulation layer 132 is made of insulating material, the ground layer 133 can be a grounding metal trace, and a ground layer 133 is also provided between the driver chip 130 and the encapsulation layer 132 near the second extension 143.

[0057] Since the encapsulation layer 132 is a non-conductive material, the second extension 143 of the second metal layer 140 is a conductive material, and the grounding metal trace is also conductive, with an insulating medium between the two conductive media, when a voltage is applied to the conductive medium, the overall structure will form a parasitic capacitance and generate a coupling effect. Suppose that when static electricity is generated in the display panel 200 or the printed circuit board 300 and transmitted to the flip-chip film 100 through the trace, the second extension 143 of the flip-chip film 100 will generate a voltage due to static electricity. The driver chip 130 will also have a voltage inside because the flip-chip film 100 itself has a power supply. Therefore, the second extension 143, the encapsulation layer 132, and the grounding layer 133 will form a de facto parasitic capacitance. The parasitic capacitance can absorb static charge, thereby preventing damage to the flip-chip film 100 due to static discharge.

[0058] Similarly, due to the presence of parasitic capacitance, when the flip-chip film 100 transmits data, some of the energy generated will be absorbed by the parasitic capacitance, thereby reducing EMI radiation energy and allowing EMI certification to be passed smoothly.

[0059] Figure 4 This is a schematic diagram of the fourth embodiment of the flip-chip film of this application, as shown. Figure 4 As shown, Figure 4 The illustrated embodiment is based on Figure 1 As an improvement, the gaps between the driver chip 130, the connecting line 190, the first extension 142, and the second extension 143 are all filled with an insulating layer 160.

[0060] The difference between this embodiment and the previous embodiment is that, in this embodiment, insulating material, such as insulating glue, can be filled in the gap between the driver chip 130, the connecting line 190, the first extension 142, and the second extension 143, so that the insulating material cures to form an insulating layer 160.

[0061] The use of the insulating layer 160 can prevent the connecting wire 190 from contacting the first extension 142 and the second extension 143, effectively improving the risk of potential short circuits. On the other hand, it can reduce the electrostatic interference problem that may occur when the connecting wire 190 and the second extension 143 are close together.

[0062] Figure 5 This is a schematic diagram of an embodiment of the display device of this application, as shown below. Figure 5As shown in the illustration, this application also discloses a display device 10, including a display panel 200 and a printed circuit board 300. The display device 10 further includes the aforementioned flip-chip film 100, which is connected between the display panel 200 and the printed circuit board 300. The flip-chip film 100 is bonded between the display panel 200 and the printed circuit board 300 to achieve signal transmission and ensure the normal display of the display panel 200.

[0063] In traditional display devices, the high refresh rate and high resolution of the display panel result in a high temperature of the flip-chip film. Since the driver chip inside the flip-chip film is encapsulated within its structure, the heat generated cannot be effectively dissipated to the external environment. Therefore, the flip-chip film has poor heat dissipation capabilities and is prone to damage.

[0064] Based on the above problems, this application improves the flip-chip film 100 in the conventional display device 10 by additionally providing a second metal layer 140 on the side of the substrate layer 110 of the flip-chip film 100 away from the driver chip 130, and using the second metal layer 140 to abut against the driver chip 130. When the driver chip 130 generates heat during operation, the heat generated by the driver chip 130 is directly conducted to the second metal layer 140 due to the contact between the second metal layer 140 and the driver chip 130, and then transferred to the external environment through the second metal layer 140. This can effectively reduce the temperature of the driver chip 130, thereby improving the heat dissipation performance of the flip-chip film 100, improving the signal transmission stability of the flip-chip film 100, and thus improving the quality of the display device 10.

[0065] It should be noted that the inventive concept of this application can form many embodiments, but due to the limited space of the application documents, they cannot all be listed. Therefore, without conflict, the embodiments described above or the technical features can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effect will be enhanced.

[0066] The above description, in conjunction with specific optional embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications or substitutions should be considered within the scope of protection of this application.

Claims

1. A flip-chip thin film, comprising a substrate layer, a first metal layer, and a driver chip, wherein the first metal layer is disposed above the substrate layer, and the side of the first metal layer away from the substrate layer is connected to the driver chip via a connecting line; Its features are, The flip-chip film further includes a second metal layer, which is disposed on the side of the substrate layer away from the first metal layer. The first metal layer and the substrate layer have openings at positions corresponding to the driver chip. The openings are used to partially expose the second metal layer, and the second metal layer abuts against the driver chip through the openings.

2. The flip-chip thin film according to claim 1, characterized in that, The second metal layer includes a substrate layer, a first extension and a second extension, wherein the substrate layer is located on the side of the substrate layer away from the first metal layer and is connected to the substrate layer; One end of the first extension is connected to the substrate layer, and the other end is connected to the second extension; the first extension is located in the opening between the first metal layer and the substrate layer, and the side of the second extension away from the first extension abuts against the driver chip.

3. The flip-chip thin film according to claim 2, characterized in that, The opening includes a first opening disposed on the first metal layer, and a gap exists between the first extension and the first opening.

4. The flip-chip thin film according to claim 3, characterized in that, The second extension has multiple channels on the side near the driver chip, and the multiple channels are arranged at intervals along the extension direction of the horizontal plane of the second extension.

5. The flip-chip thin film according to claim 4, characterized in that, The driver chip includes a chip body and a packaging layer. The packaging layer encapsulates the chip body and is made of an insulating material. A ground layer is provided between the packaging layer and the chip body. The ground layer is located on the side of the chip body near the second extension and is connected to the chip body. The ground layer corresponds to the position of the second extension.

6. The flip-chip thin film according to claim 5, characterized in that, The gaps between the driver chip, the connecting line, the first extension, and the second extension are all filled with an insulating layer.

7. The flip-chip thin film according to claim 6, characterized in that, The flip-chip film further includes a solder resist layer, which is disposed above the first metal layer. The solder resist layer has a third opening at the position corresponding to the driver chip. The third opening is used to partially expose the first metal layer so that the driver chip can be connected to the first metal layer through the connecting line. The thickness of the second extension is greater than half the thickness of the solder resist layer, but less than the total thickness of the solder resist layer.

8. The flip-chip thin film according to claim 7, characterized in that, The connecting line includes a first connecting line and a second connecting line, the first connecting line and the second connecting line being located on both sides of the first opening and close to the first opening; The first metal layer includes a first sub-metal layer and a second sub-metal layer, which are located on opposite sides of the first opening. The first connecting line connects the driver chip and the first sub-metal layer; the second connecting line connects the driver chip and the second sub-metal layer. The first connecting line and the second connecting line each have a gap with the second extension.

9. The flip-chip thin film according to claim 8, characterized in that, The first extension is perpendicular to the second extension, and the width of the second extension is greater than the width of the first extension, but less than the spacing between the first connecting line and the second connecting line.

10. A display device, comprising a display panel and a printed circuit board, characterized in that, The display device further includes a flip-chip film according to any one of claims 1 to 9, the flip-chip film being connected between the display panel and the printed circuit board.

Images