Display device, method of manufacturing display device, and electronic device

Abstract

A display device, a method of manufacturing the same, and an electronic device are disclosed. The display device includes: a substrate including a display area in which a plurality of pixels are disposed and a pad area spaced apart from the display area; a first substrate pad disposed in the pad region and forming a first inclination angle with an edge of the substrate to have an inclined shape; a substrate alignment mark disposed in the pad region and adjacent to the first substrate pad; a first alignment pattern disposed in the pad region and disposed under the first substrate pad in a plan view; and a chip on film attached to one side of the substrate. The flip chip film includes: a first film pad overlapping with the first substrate pad in at least a portion of a pad region in a plan view, and forming a second inclination angle with an edge of the substrate to have an inclined shape; and a film alignment mark adjacent to the first film pad.

Description

TECHNICAL FIELD

[0001] Embodiments relate to a display device, a method of manufacturing a display device, and an electronic device including the display device. More particularly, embodiments relate to a display device including a flip chip film, a method of manufacturing a display device, and an electronic device including the display device. BACKGROUND

[0002] A display device is a device that displays an image to provide visual information to a user. Among display devices, an organic light emitting diode display device has recently attracted attention.

[0003] The display device can include a substrate on which a plurality of pixels are disposed, and a flip chip film attached to one side of the substrate. It is necessary to check whether the substrate and the flip chip film are properly aligned. For example, in the case where the flip chip film is attached to the substrate in an expanded or contracted state, it is necessary to check the flip chip film and adjust the position of the flip chip film. SUMMARY

[0004] Embodiments provide a display device having improved quality.

[0005] Embodiments provide a method of manufacturing a display device.

[0006] Embodiments provide an electronic device including a display device.

[0007] A display device according to an embodiment includes a substrate including a display area in which a plurality of pixels are disposed, and a pad area spaced apart from the display area; a first substrate pad disposed on the substrate in the pad area and forming a first tilt angle with respect to an edge of the substrate to have a tilted shape; a substrate alignment mark disposed on the substrate in the pad area and adjacent to the first substrate pad; a first alignment pattern disposed on the substrate in the pad area and disposed below the first substrate pad in a plan view; and a flip chip film attached to one side of the substrate.

[0008] In an embodiment, the flip chip film can include a first film pad overlapping the first substrate pad in at least a portion of the pad area in a plan view and forming a second tilt angle with respect to the edge of the substrate to have a tilted shape, and a film alignment mark adjacent to the first film pad.

[0009] In an embodiment, the first tilt angle and the second tilt angle can be substantially equal to each other.

[0010] In an embodiment, the first alignment pattern can form a third tilt angle with respect to the edge of the substrate to have a tilted shape.

[0011] In an embodiment, the third tilt angle and the first tilt angle can be substantially equal to each other.

[0012] In an embodiment, the substrate alignment mark can be disposed adjacent to the first substrate pad in the first direction.

[0013] In an embodiment, the film alignment mark can be disposed adjacent to the first film pad in the first direction.

[0014] In an embodiment, the first alignment pattern can be disposed adjacent to the first film pad in the first direction in a plan view.

[0015] In an embodiment, the display device can further include a second alignment pattern spaced apart from the first alignment pattern in a plan view and the first film pad is disposed between the second alignment pattern and the first alignment pattern.

[0016] In an embodiment, the first alignment pattern can form a third tilt angle with respect to an edge of the substrate to have a tilted shape.

[0017] In an embodiment, the second alignment pattern can form a fourth tilt angle with respect to the edge of the substrate to have a tilted shape.

[0018] In an embodiment, the third tilt angle and the fourth tilt angle can be substantially equal to each other.

[0019] In an embodiment, the display device can further include a second substrate pad disposed on the substrate in the pad area, disposed adjacent to the first substrate pad, and forming a third tilt angle with respect to an edge of the substrate to have a tilted shape.

[0020] In an embodiment, the flip chip film can further include a second film pad overlapping the second substrate pad in at least a portion of the pad area in a plan view and forming a fourth tilt angle with respect to the edge of the substrate to have a tilted shape.

[0021] In an embodiment, the third tilt angle and the fourth tilt angle can be substantially equal to each other.

[0022] In an embodiment, the display device can further include a second alignment pattern disposed on the substrate in the pad area and spaced apart from the first alignment pattern in a plan view and the first film pad is interposed between the second alignment pattern and the first alignment pattern, a third alignment pattern disposed between the second alignment pattern and the second film pad in a plan view, and a fourth alignment pattern disposed on the substrate in the pad area and spaced apart from the third alignment pattern in a plan view and the second film pad is interposed between the fourth alignment pattern and the third alignment pattern.

[0023] In an embodiment, the third alignment pattern can form a fifth tilt angle with respect to an edge of the substrate to have a tilted shape.

[0024] In an embodiment, the fourth alignment pattern can form a sixth tilt angle with respect to the edge of the substrate to have a tilted shape.

[0025] In an embodiment, the fifth inclination angle and the sixth inclination angle can be substantially equal to each other.

[0026] In an embodiment, the first alignment pattern can include metal.

[0027] In an embodiment, the first alignment pattern can be formed by removing at least a portion of an insulating layer disposed on the first substrate pad.

[0028] A method of manufacturing a display device according to an embodiment includes attaching a COF to one side of a substrate including a display area in which a plurality of pixels are disposed and a pad area spaced apart from the display area, inspecting a substrate alignment mark disposed in the pad area on the substrate and a film alignment mark included in the COF to inspect whether the COF is expanded and whether the COF is contracted, adjusting a position of the COF, and measuring a first separation distance between a first film pad and a first alignment pattern adjacent to the first film pad.

[0029] In an embodiment, the first film pad can be included in the COF and can form a first inclination angle with respect to an edge of the substrate in at least a portion of the pad area to have a slanted shape.

[0030] In an embodiment, the adjusting of the position of the COF can include moving the COF in a direction away from the substrate in a case where the COF is expanded.

[0031] In an embodiment, the adjusting of the position of the COF can include moving the COF such that an area in which the COF and the substrate overlap in a plan view increases in a case where the COF is contracted.

[0032] In an embodiment, the first alignment pattern can form a second inclination angle with respect to an edge of the substrate to have a slanted shape.

[0033] In an embodiment, the first inclination angle and the second inclination angle can be substantially equal to each other.

[0034] In an embodiment, the method can further include measuring a second separation distance between a second alignment pattern and the first film pad, the second alignment pattern being spaced apart from the first alignment pattern in a plan view and the first film pad being interposed between the second alignment pattern and the first alignment pattern.

[0035] In an embodiment, the second alignment pattern can form a third inclination angle with respect to an edge of the substrate to have a slanted shape.

[0036] In an embodiment, the third inclination angle and the second inclination angle can be substantially equal to each other.

[0037] In an embodiment, the method can further include additionally adjusting the position of the flip chip film after measuring the first separation distance between the first film pad and the first alignment pattern.

[0038] An electronic device according to an embodiment includes a substrate including a display area in which a plurality of pixels are disposed and a pad area spaced apart from the display area, a first substrate pad disposed on the substrate in the pad area and formed to have a first inclined angle with respect to an edge of the substrate to have an inclined shape, a substrate alignment mark disposed on the substrate in the pad area and adjacent to the first substrate pad, a first alignment pattern disposed on the substrate in the pad area and disposed below the first substrate pad in a plan view, a flip chip film attached to one side of the substrate, and a memory storing data information.

[0039] The first inclined angle and the second inclined angle can be substantially equal to each other.

[0040] The first alignment pattern can form a third inclined angle with respect to the edge of the substrate to have an inclined shape, and the third inclined angle and the first inclined angle can be substantially equal to each other.

[0041] The substrate alignment mark can be adjacent to the first substrate pad in a first direction, and the film alignment mark can be adjacent to the first film pad in the first direction.

[0042] The first alignment pattern can be adjacent to the first film pad in a first direction in a plan view.

[0043] The electronic device can further include a second alignment pattern spaced apart from the first alignment pattern in a plan view and the first film pad is disposed between the second alignment pattern and the first alignment pattern.

[0044] The first alignment pattern can form a third inclined angle with respect to the edge of the substrate to have an inclined shape, the second alignment pattern can form a fourth inclined angle with respect to the edge of the substrate to have an inclined shape, and the third inclined angle and the fourth inclined angle can be substantially equal to each other.

[0045] The electronic device can be at least one of a smart watch, a mobile phone, a smart phone, a portable computer, a tablet personal computer (PC), a watch phone, a car display, smart glasses, a portable multimedia player (PMP), a navigation system, an ultra-mobile computer (UMPC), a head-mounted display (HMD), a virtual reality (VR) device, a mixed reality (MR) device, and an augmented reality (AR) device.

[0046] In an embodiment, the flip chip film can include a first film pad overlapping the first substrate pad in at least a portion of the pad area in a plan view and formed to have a second inclined angle with respect to the edge of the substrate to have an inclined shape, and a film alignment mark adjacent to the first film pad.

[0047] The display device according to an embodiment may include: a substrate, including a display area in which a plurality of pixels are disposed and a pad area spaced apart from the display area; a first substrate pad disposed on the substrate in the pad area and having a first tilt angle relative to the edge of the substrate to have a tilted shape; a substrate alignment mark disposed on the substrate in the pad area and adjacent to the first substrate pad; a first alignment pattern disposed on the substrate in the pad area and disposed below the first substrate pad in a plan view; and a flip-chip film attached to one side of the substrate. The flip-chip film may include: a first film pad overlapping the first substrate pad in at least a portion of the pad area in a plan view and having a tilted shape relative to the edge of the substrate to have a second tilt angle; and a film alignment mark adjacent to the first film pad.

[0048] By measuring the separation distance between the first alignment pattern and the first film pad, it is possible to accurately determine whether the flip-chip film is properly attached to one side of the substrate. For example, since the display device includes the first alignment pattern, it is possible to accurately determine whether the flip-chip film is properly attached to one side of the substrate. Attached Figure Description

[0049] The illustrative, non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0050] Figure 1 This is a schematic plan view illustrating a display device according to an embodiment.

[0051] Figure 2 It is shown Figure 1 An enlarged schematic plan view of an example of the X1 region.

[0052] Figure 3 It is shown Figure 1 An enlarged schematic plan view of an example of the X2 region.

[0053] Figure 4 yes Figure 2 A magnified schematic plan view of the X3 region.

[0054] Figure 5 yes Figure 3 A magnified schematic plan view of the X4 region.

[0055] Figure 6 It is shown that it includes Figure 1 A schematic cross-sectional view of pixels in a display device.

[0056] Figure 7 and Figure 8 It is shown that this includes in Figure 1 A schematic plan view of the expansion of the flip-chip film in a display device.

[0057] Figure 9 and Figure 10 is a schematic plan view showing a die bonding film disposed at an adjusted position.

[0058] Figure 11 is a schematic plan view showing an X5 region of Figure 9

[0059] Figure 12 is a schematic plan view showing an X6 region of Figure 10

[0060] Figure 13 and Figure 14 are schematic plan views showing a case in which a die bonding film included in a display device of Figure 1

[0061] Figure 15 and Figure 16 are schematic plan views showing a die bonding film disposed at an adjusted position.

[0062] Figure 17 is a schematic plan view showing an X7 region of Figure 15

[0063] Figure 18 is a schematic plan view showing an X8 region of Figure 16

[0064] Figure 19 is a schematic plan view showing an example of an X1 region of Figure 1

[0065] Figure 20 is a schematic plan view showing an example of an X2 region of Figure 1

[0066] Figure 21 is a schematic block diagram of an electronic device according to an embodiment.

[0067] Figure 22 is a schematic diagram of an electronic device according to various embodiments. DETAILED DESCRIPTION

[0068] ​​​​​​​In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of various embodiments or implementations of the present application. As used herein, "embodiment" and "implementation" are interchangeable words that refer to non-limiting examples of apparatuses or methods disclosed herein. It will be apparent, however, that various embodiments can be practiced without these specific details, or with one or more equivalent arrangements. In other instances, well-known structures and functions have not been described in detail in order to avoid obscuring the concepts of the various embodiments. For example, specific shapes, configurations, and characteristics of embodiments can be used or implemented in another embodiment.

[0069] Unless otherwise indicated, embodiments shown should be understood to provide features of the present application. Thus, features, components, modules, layers, films, panels, regions, and / or aspects of various embodiments (hereinafter, individually or collectively referred to as "elements") can be additionally combined, separated, interchanged, and / or rearranged without departing from the present inventive concept, unless otherwise indicated.

[0070] The use of cross-hatching and / or shading in the drawings is generally used to illustrate the boundaries, or edges, of elements. As such, neither the presence nor the absence of cross-hatching or shading conveys or indicates any particular preference or requirement for any particular material, material property, size, proportion, commonality of illustrated elements, or any other characteristic, attribute, property, or the like of an element. Additionally, in the drawings, the size and relative sizes of elements can be exaggerated for clarity and / or descriptive purposes. Where an embodiment can be implemented differently, a specific order of processes can be performed differently than described. For example, two sequentially described processes can be executed substantially concurrently, or in the reverse order that described. Additionally, the same reference numbers and / or characters can refer to the same elements.

[0071] When an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, the element or layer may be directly on, directly connected to, or directly coupled to the other element or layer, or an intermediary element or layer may be present. However, when an element or layer is referred to as being "directly on," "directly connected to," or "directly coupled to" another element or layer, an intermediary element or layer is not present. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection with or without an intermediary element. Furthermore, the first direction DR1, the second direction DR2, and the third direction DR3 are not limited to the three axes of a Cartesian coordinate system (such as the x-axis, y-axis, and z-axis) and can be interpreted in a broader sense. For example, the first direction DR1, the second direction DR2, and the third direction DR3 may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of A and B" can be interpreted as only A, only B, or any combination of A and B. Furthermore, "at least one of X, Y, and Z" and "at least one of the groups consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0072] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0073] For descriptive purposes, spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side” (e.g., as in “sidewall”) may be used herein to describe the relationship of one element to another (or more elements) as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, the spatial relative terms are also intended to cover different orientations of the device during use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features will subsequently be oriented “above” said other elements or features. Thus, the term “below” can cover both above and below orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein shall be interpreted accordingly.

[0074] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, to the extent that the terms "including," "includes," "containing," "contains," or "containing," are used in this specification, the terms are intended to be inclusive (meaning that there are other items in the process, machine, manufacture, useful comparison, method, or article that are not specified), and to not exclude or require the presence of any

[0075] Various embodiments are described herein with reference to cross-sectional and / or exploded illustrations that are schematic illustrations of embodiments (and intermediate structures) described herein. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments disclosed herein should not necessarily be construed as limited to the particular shapes of regions illustrated in the drawings, but are to include deviations in shapes that result from, for example, manufacturing. In this manner, regions illustrated in the drawings can be schematic in nature and the shapes of the regions as illustrated in the figures can not reflect actual shapes of regions of a device and, as such, are not intended to limit the scope of the embodiments described herein.

[0076] As is conventional in the art, some embodiments are described and illustrated herein in terms of functional blocks, units, and / or modules. Those skilled in the art will appreciate that these blocks, units, and / or modules are nothing more than a conceptualization of the electronic (or optical) circuitry (such as logic circuitry, discrete components, microprocessors, hardwired circuitry, memory elements, and / or wiring connections) formed using semiconductor-based manufacturing techniques or other manufacturing techniques, and that the conceptualization is a convenient way of describing the circuitry that is formed by the manufacturing techniques. In instances where blocks, units, and / or modules are implemented by microprocessors or other similar hardware, they can be programmed and controlled using software (e.g., microcode) to perform various functions discussed herein, and can optionally be driven by firmware and / or software. It is also contemplated that each block, unit, and / or module can be implemented by dedicated hardware, or can be implemented as a combination of dedicated hardware and a processor (e.g., one or more programmed microprocessors and associated circuitry) for performing some functions. Furthermore, each block, unit, and / or module of some embodiments can be physically separated into two or more interacting and discrete blocks, units, and / or modules without departing from the scope of the inventive concept. Moreover, blocks, units, and / or modules of some embodiments can be physically combined into more complex blocks, units, and / or modules without departing from the scope of the inventive concept.

[0077] Hereinafter, a display device according to an embodiment will be described in greater detail with reference to the accompanying drawings. In the drawings, like reference numerals are used for the same components and redundant descriptions thereof will be omitted.

[0078] Figure 1 is a schematic plan view illustrating a display device according to an embodiment.

[0079] Referring to Figure 1 The display device DD according to an embodiment can include a substrate SUB, a chip on film COF, and a circuit board PCB.

[0080] The substrate SUB can include a display area DA and a non-display area NDA. The display area DA can be defined as an area in which light is emitted. The non-display area NDA can be defined as an area in which components that transmit signals to the display area DA are disposed.

[0081] A plurality of pixels can be disposed in the display area DA. For example, pixels PX can be disposed in the display area DA. Each of the plurality of pixels PX can emit light based on a signal applied from the non-display area NDA. For example, the plurality of pixels PX can be repeatedly arranged in a first direction DR1 and a second direction DR2 intersecting the first direction DR1. Accordingly, the display area DA can emit light and display an image throughout the entire area.

[0082] The non-display area NDA can contact (e.g., connect) the display area DA. For example, the non-display area NDA can be disposed around the display area DA. For example, the non-display area NDA can surround at least a portion of the display area DA.

[0083] The non-display area NDA can include a pad area PA. The pad area PA can be disposed at one side (e.g., a single side) of the non-display area NDA. For example, the pad area PA can be spaced apart from the display area DA in a plan view. For example, the pad area PA can be spaced apart from the display area DA in the second direction DR2. For example, the non-display area NDA can surround the display area DA.

[0084] The non-display area NDA can include a driver for driving the plurality of pixels PX. For example, the non-display area NDA can include a gate driver, a light emitting driver, and / or a power voltage generator, etc.

[0085] The chip on film COF can be attached to one side (e.g., a single side) of the substrate SUB. For example, the chip on film COF can be attached to the substrate SUB in at least a portion of the pad area PA. For example, the chip on film COF can be spaced apart from the display area DA in the second direction DR2.

[0086] The number of the chip-on-film COF can be one. However, the present disclosure is not limited thereto, and the number of the chip-on-film COF can vary. For example, the number of the chip-on-film COF can be two or more.

[0087] For example, the chip-on-film COF can include a soft material. For example, the chip-on-film COF can include polyethylene terephthalate ("PET") and / or polyimide ("PI"), etc. These materials can be used alone or in combination with each other. However, the present disclosure is not limited thereto, and the chip-on-film COF can include different kinds of materials.

[0088] The driving chip IC can be disposed on the chip-on-film COF. The driving chip IC can convert a digital data signal among the driving signals into an analog data signal. The driving chip IC can provide the analog data signal to the plurality of pixels PX.

[0089] The circuit board PCB can be attached to one side (e.g., a single side) of the chip-on-film COF. For example, the circuit board PCB can be spaced apart from the substrate SUB in the second direction DR2. The circuit board PCB can provide the driving signals and / or driving voltages, etc. to the driving chip IC and the plurality of pixels PX.

[0090] The number of the circuit board PCB can be one. However, the present disclosure is not limited thereto, and the number of the circuit board PCB can vary. For example, the number of the circuit board PCB can be two or more.

[0091] The signals provided from the chip-on-film COF and the circuit board PCB can be provided to the substrate SUB through a plurality of connection lines SL. For example, the signals provided from the chip-on-film COF and the circuit board PCB can be provided to the display area DA through the plurality of connection lines SL. However, the present disclosure is not limited thereto, and the signals provided from the chip-on-film COF and the circuit board PCB through the plurality of connection lines SL can also be provided to the non-display area NDA.

[0092] Figure 2 is an enlarged schematic plan view illustrating an example of an X1 area of Figure 1 . Figure 3 is an enlarged schematic plan view illustrating an example of an X2 area of Figure 1 .

[0093] Referring to Figure 1 , Figure 2 and Figure 3A plurality of base pads can be disposed on the substrate SUB. For example, a first base pad PNL-P1, a second base pad PNL-P2, a third base pad PNL-P3, a fourth base pad PNL-P4, a fifth base pad PNL-P5, a sixth base pad PNL-P6, a seventh base pad PNL-P7, and an eighth base pad PNL-P8 can be disposed on the substrate SUB.

[0094] For example, the first base pad PNL-P1, the second base pad PNL-P2, the third base pad PNL-P3, the fourth base pad PNL-P4, the fifth base pad PNL-P5, the sixth base pad PNL-P6, the seventh base pad PNL-P7, and the eighth base pad PNL-P8 can be disposed in the pad area PA.

[0095] For example, the first base pad PNL-P1, the second base pad PNL-P2, the third base pad PNL-P3, and the fourth base pad PNL-P4 can be disposed on one side (e.g., a single side) of the pad area PA. For example, the fifth base pad PNL-P5, the sixth base pad PNL-P6, the seventh base pad PNL-P7, and the eighth base pad PNL-P8 can be disposed on another side of the pad area PA. For example, the other side of the pad area PA can be spaced apart from the one side of the pad area PA in the first direction DR1.

[0096] The plurality of base pads can be repeatedly disposed in the first direction DR1. For example, the second base pad PNL-P2 can be disposed adjacent to the first base pad PNL-P1 in the first direction DR1. The third base pad PNL-P3 can be disposed adjacent to the second base pad PNL-P2 in the first direction DR1. The fourth base pad PNL-P4 can be disposed adjacent to the third base pad PNL-P3 in the first direction DR1.

[0097] For example, the sixth base pad PNL-P6 can be disposed adjacent to the fifth base pad PNL-P5 in a direction opposite to the first direction DR1. The seventh base pad PNL-P7 can be disposed adjacent to the sixth base pad PNL-P6 in the direction opposite to the first direction DR1. The eighth base pad PNL-P8 can be disposed adjacent to the seventh base pad PNL-P7 in the direction opposite to the first direction DR1.

[0098] The plurality of connection lines SL can include a first connection line SL1, a second connection line SL2, a third connection line SL3, a fourth connection line SL4, a fifth connection line SL5, a sixth connection line SL6, a seventh connection line SL7, and an eighth connection line SL8.

[0099] The first base pad PNL-P1 can be electrically connected to the first connection line SL1. The second base pad PNL-P2 can be electrically connected to the second connection line SL2. The third base pad PNL-P3 can be electrically connected to the third connection line SL3. The fourth base pad PNL-P4 can be electrically connected to the fourth connection line SL4. The fifth base pad PNL-P5 can be electrically connected to the fifth connection line SL5. The sixth base pad PNL-P6 can be electrically connected to the sixth connection line SL6. The seventh base pad PNL-P7 can be electrically connected to the seventh connection line SL7. The eighth base pad PNL-P8 can be electrically connected to the eighth connection line SL8.

[0100] The first base alignment mark PM1 can be disposed on the substrate SUB. The first base alignment mark PM1 can be disposed in the pad area PA. For example, the first base alignment mark PM1 can be disposed adjacent to the first base pad PNL-P1. For example, the first base alignment mark PM1 can be disposed adjacent to the first base pad PNL-P1 in a direction opposite to the first direction DR1.

[0101] For example, the first base alignment mark PM1 can include a first portion PM1-1 and a second portion PM1-2. The first portion PM1-1 can be attached to a central portion of the second portion PM1-2. For example, the first portion PM1-1 can contact (e.g., connect) the second portion PM1-2 in a direction opposite to the second direction DR2.

[0102] The first portion PM1-1 can have a rectangular shape in a plan view. However, the disclosure is not limited thereto, and the shape of the first portion PM1-1 can vary. The second portion PM1-2 can have a rectangular shape in a plan view. For example, the second portion PM1-2 can have a rectangular shape extending in the first direction DR1 in a plan view. However, the disclosure is not limited thereto, and the shape of the second portion PM1-2 can vary.

[0103] The second base alignment mark PM2 can be disposed on the substrate SUB. The second base alignment mark PM2 can be disposed in the pad area PA. For example, the second base alignment mark PM2 can be disposed adjacent to the fifth base pad PNL-P5. For example, the second base alignment mark PM2 can be disposed adjacent to the fifth base pad PNL-P5 in the first direction DR1.

[0104] For example, the second base alignment mark PM2 can include a first portion PM2-1 and a second portion PM2-2. The first portion PM2-1 can be attached to a central portion of the second portion PM2-2. For example, the first portion PM2-1 can contact the second portion PM2-2 in a direction opposite to the second direction DR2.

[0105] The first portion PM2-1 can have a rectangular shape in a plan view. However, the disclosure is not limited thereto, and the shape of the first portion PM2-1 can vary. The second portion PM2-2 can have a rectangular shape in a plan view. For example, the second portion PM2-2 can have a rectangular shape extending in the first direction DR1 in a plan view. However, the disclosure is not limited thereto, and the shape of the second portion PM2-2 can vary.

[0106] A plurality of alignment patterns can be disposed on the substrate SUB. For example, a first alignment pattern PNL-AM1, a second alignment pattern PNL-AM2, a third alignment pattern PNL-AM3, a fourth alignment pattern PNL-AM4, a fifth alignment pattern PNL-AM5, a sixth alignment pattern PNL-AM6, a seventh alignment pattern PNL-AM7, an eighth alignment pattern PNL-AM8, a ninth alignment pattern PNL-AM9, a tenth alignment pattern PNL-AM10, an eleventh alignment pattern PNL-AM11, a twelfth alignment pattern PNL-AM12, a thirteenth alignment pattern PNL-AM13, a fourteenth alignment pattern PNL-AM14, a fifteenth alignment pattern PNL-AM15, and a sixteenth alignment pattern PNL-AM16 can be disposed.

[0107] For example, the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be disposed in the pad area PA.

[0108] For example, the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, and the eighth alignment pattern PNL-AM8 can be disposed on one side (e.g., a single side) of the pad area PA. For example, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be disposed on another side of the pad area PA. The other side of the pad area PA can be spaced apart from the one side of the pad area PA in the first direction DR1.

[0109] For example, the first alignment pattern PNL-AM1 can be disposed below the first base pad PNL-P1 in a plan view. For example, the first alignment pattern PNL-AM1 can be disposed adjacent to the first base pad PNL-P1 in the second direction DR2.

[0110] For example, the second alignment pattern PNL-AM2 can be disposed below the first base pad PNL-P1 in a plan view. For example, the second alignment pattern PNL-AM2 can be disposed adjacent to the first base pad PNL-P1 in the second direction DR2. The second alignment pattern PNL-AM2 can be spaced apart from the first alignment pattern PNL-AM1 in the first direction DR1. For example, the second alignment pattern PNL-AM2 can be spaced apart from the first alignment pattern PNL-AM1 in a plan view with the first film pad COF-P1, which will be described later, interposed between the second alignment pattern PNL-AM2 and the first alignment pattern PNL-AM1.

[0111] For example, the third alignment pattern PNL-AM3 can be disposed below the second base pad PNL-P2 in a plan view. For example, the third alignment pattern PNL-AM3 can be disposed adjacent to the second base pad PNL-P2 in the second direction DR2. The third alignment pattern PNL-AM3 can be disposed between the second alignment pattern PNL-AM2 and the second film pad COF-P2, which will be described later, in a plan view.

[0112] For example, the fourth alignment pattern PNL-AM4 can be disposed below the second base pad PNL-P2 in plan view. For example, the fourth alignment pattern PNL-AM4 can be disposed adjacent to the second base pad PNL-P2 in the second direction DR2. The fourth alignment pattern PNL-AM4 can be spaced apart from the third alignment pattern PNL-AM3 in the first direction DR1. For example, the fourth alignment pattern PNL-AM4 can be spaced apart from the third alignment pattern PNL-AM3 in plan view with a second chip pad COF-P2 to be described later interposed between the fourth alignment pattern PNL-AM4 and the third alignment pattern PNL-AM3.

[0113] For example, the fifth alignment pattern PNL-AM5 can be disposed below the third base pad PNL-P3 in plan view. For example, the fifth alignment pattern PNL-AM5 can be disposed adjacent to the third base pad PNL-P3 in the second direction DR2.

[0114] For example, the sixth alignment pattern PNL-AM6 can be disposed below the third base pad PNL-P3 in plan view. For example, the sixth alignment pattern PNL-AM6 can be disposed adjacent to the third base pad PNL-P3 in the second direction DR2. The sixth alignment pattern PNL-AM6 can be spaced apart from the fifth alignment pattern PNL-AM5 in the first direction DR1. For example, the sixth alignment pattern PNL-AM6 can be spaced apart from the fifth alignment pattern PNL-AM5 in plan view with a third chip pad COF-P3 to be described later interposed between the sixth alignment pattern PNL-AM6 and the fifth alignment pattern PNL-AM5.

[0115] For example, the seventh alignment pattern PNL-AM7 can be disposed below the fourth base pad PNL-P4 in plan view. For example, the seventh alignment pattern PNL-AM7 can be disposed adjacent to the fourth base pad PNL-P4 in the second direction DR2.

[0116] For example, the eighth alignment pattern PNL-AM8 can be disposed below the fourth base pad PNL-P4 in plan view. For example, the eighth alignment pattern PNL-AM8 can be disposed adjacent to the fourth base pad PNL-P4 in the second direction DR2. The eighth alignment pattern PNL-AM8 can be spaced apart from the seventh alignment pattern PNL-AM7 in the first direction DR1. For example, the eighth alignment pattern PNL-AM8 can be spaced apart from the seventh alignment pattern PNL-AM7 in plan view with a fourth chip pad COF-P4 to be described later interposed between the eighth alignment pattern PNL-AM8 and the seventh alignment pattern PNL-AM7.

[0117] For example, the ninth alignment pattern PNL-AM9 can be disposed below the fifth base pad PNL-P5 in plan view. For example, the ninth alignment pattern PNL-AM9 can be disposed adjacent to the fifth base pad PNL-P5 in the second direction DR2.

[0118] For example, the tenth alignment pattern PNL-AM10 can be disposed below the fifth base pad PNL-P5 in plan view. For example, the tenth alignment pattern PNL-AM10 can be disposed adjacent to the fifth base pad PNL-P5 in the second direction DR2. The tenth alignment pattern PNL-AM10 can be spaced apart from the ninth alignment pattern PNL-AM9 in a direction opposite the first direction DR1. For example, the tenth alignment pattern PNL-AM10 can be spaced apart from the ninth alignment pattern PNL-AM9 in plan view with a fifth chip on film pad COF-P5, to be described later, interposed between the tenth alignment pattern PNL-AM10 and the ninth alignment pattern PNL-AM9.

[0119] For example, the eleventh alignment pattern PNL-AM11 can be disposed below the sixth base pad PNL-P6 in plan view. For example, the eleventh alignment pattern PNL-AM11 can be disposed adjacent to the sixth base pad PNL-P6 in the second direction DR2.

[0120] For example, the twelfth alignment pattern PNL-AM12 can be disposed below the sixth base pad PNL-P6 in plan view. For example, the twelfth alignment pattern PNL-AM12 can be disposed adjacent to the sixth base pad PNL-P6 in the second direction DR2. The twelfth alignment pattern PNL-AM12 can be spaced apart from the eleventh alignment pattern PNL-AM11 in a direction opposite the first direction DR1. For example, the twelfth alignment pattern PNL-AM12 can be spaced apart from the eleventh alignment pattern PNL-AM11 in plan view with a sixth chip on film pad COF-P6, to be described later, interposed between the twelfth alignment pattern PNL-AM12 and the eleventh alignment pattern PNL-AM11.

[0121] For example, the thirteenth alignment pattern PNL-AM13 can be disposed below the seventh base pad PNL-P7 in plan view. For example, the thirteenth alignment pattern PNL-AM13 can be disposed adjacent to the seventh base pad PNL-P7 in the second direction DR2.

[0122] For example, the fourteenth alignment pattern PNL-AM14 can be disposed below the seventh base pad PNL-P7 in a plan view. For example, the fourteenth alignment pattern PNL-AM14 can be disposed adjacent to the seventh base pad PNL-P7 in the second direction DR2. The fourteenth alignment pattern PNL-AM14 can be spaced apart from the thirteenth alignment pattern PNL-AM13 in a direction opposite the first direction DR1. For example, the fourteenth alignment pattern PNL-AM14 can be spaced apart from the thirteenth alignment pattern PNL-AM13 in a plan view with the seventh film pad COF-P7, to be described later, interposed between the fourteenth alignment pattern PNL-AM14 and the thirteenth alignment pattern PNL-AM13.

[0123] For example, the fifteenth alignment pattern PNL-AM15 can be disposed below the eighth base pad PNL-P8 in a plan view. For example, the fifteenth alignment pattern PNL-AM15 can be disposed adjacent to the eighth base pad PNL-P8 in the second direction DR2.

[0124] For example, the sixteenth alignment pattern PNL-AM16 can be disposed below the eighth base pad PNL-P8 in a plan view. For example, the sixteenth alignment pattern PNL-AM16 can be disposed adjacent to the eighth base pad PNL-P8 in the second direction DR2. The sixteenth alignment pattern PNL-AM16 can be spaced apart from the fifteenth alignment pattern PNL-AM15 in a direction opposite the first direction DR1. For example, the sixteenth alignment pattern PNL-AM16 can be spaced apart from the fifteenth alignment pattern PNL-AM15 in a plan view with the eighth film pad COF-P8, to be described later, interposed between the sixteenth alignment pattern PNL-AM16 and the fifteenth alignment pattern PNL-AM15.

[0125] The first base pad PNL-P1, the second base pad PNL-P2, the third base pad PNL-P3, the fourth base pad PNL-P4, the fifth base pad PNL-P5, the sixth base pad PNL-P6, the seventh base pad PNL-P7, and the eighth base pad PNL-P8 can be disposed on substantially the same layer as the source electrode SE and the drain electrode DE of the source / drain electrode pair Figure 6 The first base pad PNL-P1, the second base pad PNL-P2, the third base pad PNL-P3, the fourth base pad PNL-P4, the fifth base pad PNL-P5, the sixth base pad PNL-P6, the seventh base pad PNL-P7, and the eighth base pad PNL-P8 can be disposed on substantially the same layer as the source electrode SE and the drain electrode DE of the source / drain electrode pair Figure 6 The first base pad PNL-P1, the second base pad PNL-P2, the third base pad PNL-P3, the fourth base pad PNL-P4, the fifth base pad PNL-P5, the sixth base pad PNL-P6, the seventh base pad PNL-P7, and the eighth base pad PNL-P8 can be disposed on substantially the same layer as the source electrode SE and the drain electrode DE of the source / drain electrode pair

[0126] However, the disclosure is not limited thereto, and the first base pad PNL-P1, the second base pad PNL-P2, the third base pad PNL-P3, the fourth base pad PNL-P4, the fifth base pad PNL-P5, the sixth base pad PNL-P6, the seventh base pad PNL-P7, and the eighth base pad PNL-P8 can be disposed on substantially the same layer as the source electrode SE and the drain electrode DE of the source / drain electrode pair Figure 6the lower metal layer BML of the source electrode SE and the drain electrode DE are disposed on substantially the same layer, and can include substantially the same material. Figure 6 the lower metal layer BML of the source electrode SE and the drain electrode DE are disposed on substantially the same layer, and can include substantially the same material.

[0127] The first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be disposed on substantially the same layer as the first base pad PNL-P1, and can include substantially the same material as the first base pad PNL-P1.

[0128] However, the present disclosure is not limited thereto, and the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be disposed on different layers from the first base pad PNL-P1, and can include different materials from the first base pad PNL-P1.

[0129] For example, the first base pad PNL-P1 can be disposed on substantially the same layer as Figure 6 the source electrode SE and the drain electrode DE, and can include substantially the same material as Figure 6The source electrode SE and the drain electrode DE of the source / drain electrode pair S / D-EL include substantially the same material, and the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be disposed on substantially the same layer, and can be Figure 6 The lower metal layer BML of the source / drain electrode pair S / D-EL includes substantially the same material, but the present disclosure is not limited thereto. Figure 6 The lower metal layer BML of the source / drain electrode pair S / D-EL includes substantially the same material, but the present disclosure is not limited thereto.

[0130] Each of the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be a cutout portion.

[0131] For example, each of the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be a portion in which at least a portion of an insulating layer disposed on the substrate SUB is removed therefrom.

[0132] For example, each of the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be a portion from which at least a portion of an insulating layer disposed on the first base pad PNL-P1 is removed.

[0133] For example, each of the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be a portion from which at least a portion of a via insulating layer VIA is removed. Figure 6 For example, each of the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be a portion from which at least a portion of a via insulating layer VIA is removed.

[0134] However, the disclosure is not limited thereto, and in an embodiment, each of the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be a portion from which at least a portion of a via insulating layer VIA and Figure 6 For example, each of the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be a portion from which at least a portion of a via insulating layer VIA and Figure 6 For example, each of the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the fifth alignment pattern PNL-AM5, the sixth alignment pattern PNL-AM6, the seventh alignment pattern PNL-AM7, the eighth alignment pattern PNL-AM8, the ninth alignment pattern PNL-AM9, the tenth alignment pattern PNL-AM10, the eleventh alignment pattern PNL-AM11, the twelfth alignment pattern PNL-AM12, the thirteenth alignment pattern PNL-AM13, the fourteenth alignment pattern PNL-AM14, the fifteenth alignment pattern PNL-AM15, and the sixteenth alignment pattern PNL-AM16 can be a portion from which at least a portion of a via insulating layer VIA and

[0135] The first substrate alignment mark PM1 and the second substrate alignment mark PM2 can be disposed on substantially the same layer as the first substrate pad PNL-P1 and can include substantially the same material as the first substrate pad PNL-P1. However, the present disclosure is not limited thereto, and the first substrate alignment mark PM1 and the second substrate alignment mark PM2 can be disposed on different layers from the first substrate pad PNL-P1 and can include different materials from the first substrate pad PNL-P1.

[0136] The COF can include a plurality of film pads. For example, the COF can include a first film pad COF-P1, a second film pad COF-P2, a third film pad COF-P3, a fourth film pad COF-P4, a fifth film pad COF-P5, a sixth film pad COF-P6, a seventh film pad COF-P7, and an eighth film pad COF-P8.

[0137] The first film pad COF-P1, the second film pad COF-P2, the third film pad COF-P3, the fourth film pad COF-P4, the fifth film pad COF-P5, the sixth film pad COF-P6, the seventh film pad COF-P7, and the eighth film pad COF-P8 can be electrically connected to the driving chip IC.

[0138] The first film pad COF-P1 can overlap the first substrate pad PNL-P1 in at least a portion of the pad area PA in a plan view. For example, the first film pad COF-P1 can be bonded to the first substrate pad PNL-P1 in at least a portion of the pad area PA. For example, the first film pad COF-P1 can be bonded to the first substrate pad PNL-P1 by anisotropic conductive film (“ACF”). The first film pad COF-P1 can be disposed between the first alignment pattern PNL-AM1 and the second alignment pattern PNL-AM2 in a plan view.

[0139] The second film pad COF-P2 can overlap the second substrate pad PNL-P2 in at least a portion of the pad area PA in a plan view. For example, the second film pad COF-P2 can be bonded to the second substrate pad PNL-P2 in at least a portion of the pad area PA. For example, the second film pad COF-P2 can be bonded to the second substrate pad PNL-P2 by anisotropic conductive film. The second film pad COF-P2 can be disposed between the third alignment pattern PNL-AM3 and the fourth alignment pattern PNL-AM4 in a plan view.

[0140] The third film pad COF-P3 can overlap the third base pad PNL-P3 in at least a portion of the pad area PA in a plan view. For example, the third film pad COF-P3 can be bonded to the third base pad PNL-P3 in at least a portion of the pad area PA. For example, the third film pad COF-P3 can be bonded to the third base pad PNL-P3 by anisotropic conductive film. The third film pad COF-P3 can be disposed between the fifth alignment pattern PNL-AM5 and the sixth alignment pattern PNL-AM6 in a plan view.

[0141] The fourth film pad COF-P4 can overlap the fourth base pad PNL-P4 in at least a portion of the pad area PA in a plan view. For example, the fourth film pad COF-P4 can be bonded to the fourth base pad PNL-P4 in at least a portion of the pad area PA. For example, the fourth film pad COF-P4 can be bonded to the fourth base pad PNL-P4 by anisotropic conductive film. The fourth film pad COF-P4 can be disposed between the seventh alignment pattern PNL-AM7 and the eighth alignment pattern PNL-AM8 in a plan view.

[0142] The fifth film pad COF-P5 can overlap the fifth base pad PNL-P5 in at least a portion of the pad area PA in a plan view. For example, the fifth film pad COF-P5 can be bonded to the fifth base pad PNL-P5 in at least a portion of the pad area PA. For example, the fifth film pad COF-P5 can be bonded to the fifth base pad PNL-P5 by anisotropic conductive film. The fifth film pad COF-P5 can be disposed between the ninth alignment pattern PNL-AM9 and the tenth alignment pattern PNL-AM10 in a plan view.

[0143] The sixth film pad COF-P6 can overlap the sixth base pad PNL-P6 in at least a portion of the pad area PA in a plan view. For example, the sixth film pad COF-P6 can be bonded to the sixth base pad PNL-P6 in at least a portion of the pad area PA. For example, the sixth film pad COF-P6 can be bonded to the sixth base pad PNL-P6 by anisotropic conductive film. The sixth film pad COF-P6 can be disposed between the eleventh alignment pattern PNL-AM11 and the twelfth alignment pattern PNL-AM12 in a plan view.

[0144] The seventh film pad COF-P7 can overlap the seventh base pad PNL-P7 in at least a portion of the pad area PA in a plan view. For example, the seventh film pad COF-P7 can be bonded to the seventh base pad PNL-P7 in at least a portion of the pad area PA. For example, the seventh film pad COF-P7 can be bonded to the seventh base pad PNL-P7 by anisotropic conductive film. The seventh film pad COF-P7 can be disposed between the thirteenth alignment pattern PNL-AM13 and the fourteenth alignment pattern PNL-AM14 in a plan view.

[0145] The eighth film pad COF-P8 can overlap the eighth base pad PNL-P8 in at least a portion of the pad area PA in a plan view. For example, the eighth film pad COF-P8 can be bonded to the eighth base pad PNL-P8 in at least a portion of the pad area PA. For example, the eighth film pad COF-P8 can be bonded to the eighth base pad PNL-P8 by anisotropic conductive film. The eighth film pad COF-P8 can be disposed between the fifteenth alignment pattern PNL-AM15 and the sixteenth alignment pattern PNL-AM16 in a plan view.

[0146] For example, each of the first film pad COF-P1, the second film pad COF-P2, the third film pad COF-P3, the fourth film pad COF-P4, the fifth film pad COF-P5, the sixth film pad COF-P6, the seventh film pad COF-P7, and the eighth film pad COF-P8 can include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material, etc. Examples of the metal can include silver (“Ag”), molybdenum (“Mo”), aluminum (“Al”), tungsten (“W”), copper (“Cu”), nickel (“Ni”), chromium (“Cr”), titanium (“Ti”), tantalum (“Ta”), platinum (“Pt”), or scandium (“Sc”), etc. These materials can be used alone or in combination with each other. Examples of the conductive metal oxide can include indium tin oxide or indium zinc oxide, etc. These materials can be used alone or in combination with each other. Examples of the metal nitride can include aluminum nitride (“AlN x ”), tungsten nitride (“WN x ”), or chromium nitride (“CrN x ”), etc. These materials can be used alone or in combination with each other.

[0147] The COF can include a first film alignment mark CM1 and a second film alignment mark CM2. The first film alignment mark CM1 and the second film alignment mark CM2 can be disposed in the pad area PA. The first film alignment mark CM1 can be disposed adjacent to the first film pad COF-P1. For example, the first film alignment mark CM1 can be disposed adjacent to the first film pad COF-P1 in a direction opposite to the first direction DR1. The second film alignment mark CM2 can be disposed adjacent to the fifth film pad COF-P5. For example, the second film alignment mark CM2 can be disposed adjacent to the fifth film pad COF-P5 in the first direction DR1.

[0148] The first film alignment mark CM1 can define a first recess CM1-RSC in a plan view. The second film alignment mark CM2 can define a second recess CM2-RSC in a plan view.

[0149] A width W2 of the first recess CM1-RSC and a width W1 of the first portion PM1-1 of the first substrate alignment mark PM1 can be substantially the same. For example, the width W2 of the first recess CM1-RSC in the first direction DR1 and the width W1 of the first portion PM1-1 of the first substrate alignment mark PM1 in the first direction DR1 can be substantially the same.

[0150] A width W4 of the second recess CM2-RSC and a width W3 of the first portion PM2-1 of the second substrate alignment mark PM2 can be substantially the same as each other. For example, the width W4 of the second recess CM2-RSC in the first direction DR1 and the width W3 of the first portion PM2-1 of the second substrate alignment mark PM2 in the first direction DR1 can be substantially the same.

[0151] For example, each of the first film alignment mark CM1 and the second film alignment mark CM2 can include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material, etc. Examples of the metal can include silver (“Ag”), molybdenum (“Mo”), aluminum (“Al”), tungsten (“W”), copper (“Cu”), nickel (“Ni”), chromium (“Cr”), titanium (“Ti”), tantalum (“Ta”), platinum (“Pt”), or scandium (“Sc”), etc. These materials can be used alone or in combination with each other. Examples of the conductive metal oxide can include indium tin oxide or indium zinc oxide, etc. These materials can be used alone or in combination with each other. Examples of the metal nitride can include aluminum nitride (“AlN x ”), tungsten nitride (“WN x ”), or chromium nitride (“CrN x ”), etc. These materials can be used alone or in combination with each other.

[0152] The first film alignment mark CM1 and the second film alignment mark CM2 can include substantially the same material as the first film pad COF-P1. However, the present disclosure is not limited thereto, and in an embodiment, each of the first film alignment mark CM1 and the second film alignment mark CM2 can include a material different from that of the first film pad COF-P1.

[0153] Figure 4 is an enlarged schematic plan view of the X3 region of Figure 2 Figure 5 is an enlarged schematic plan view of the X4 region of Figure 3

[0154] Referring to Figure 2 and Figure 4 , the substrate SUB can include an edge SUB-ED. The edge SUB-ED of the substrate SUB can at least partially overlap the chip-on-film COF in a plan view. For example, the edge SUB-ED of the substrate SUB can extend in the first direction DR1. For example, the edge SUB-ED of the substrate SUB can be observed as a straight line extending in the first direction DR1 in a plan view.

[0155] The first alignment pattern PNL-AM1 can have an inclined shape. For example, the first alignment pattern PNL-AM1 can form a first inclined angle θ1 with respect to the edge SUB-ED of the substrate SUB. For example, an imaginary extension line (or a center line) of the first alignment pattern PNL-AM1 can form the first inclined angle θ1 with respect to the edge SUB-ED of the substrate SUB. For example, the first inclined angle θ1 can be less than about 90 degrees.

[0156] The first substrate pad PNL-P1 can have an inclined shape. For example, the first substrate pad PNL-P1 can form a second inclined angle θ2 with respect to the edge SUB-ED of the substrate SUB. For example, an imaginary extension line (or a center line) of the first substrate pad PNL-P1 can form the second inclined angle θ2 with respect to the edge SUB-ED of the substrate SUB. For example, the second inclined angle θ2 can be less than about 90 degrees.

[0157] The first film pad COF-P1 can have an inclined shape. For example, the first film pad COF-P1 can form a second inclined angle θ2 with respect to the edge SUB-ED of the substrate SUB. For example, an imaginary extension line (or a center line) of the first film pad COF-P1 can form the second inclined angle θ2 with respect to the edge SUB-ED of the substrate SUB. For example, the second inclined angle θ2 can be less than about 90 degrees.

[0158] For example, the imaginary extension line of the first substrate pad PNL-P1 and the imaginary extension line of the first film pad COF-P1 can be identical to each other. ​​

[0159] The second alignment pattern PNL-AM2 can have an inclined shape. For example, the second alignment pattern PNL-AM2 can form a third inclined angle θ3 with respect to the edge SUB-ED of the substrate SUB. For example, an imaginary extension line (or a center line) of the second alignment pattern PNL-AM2 can form the third inclined angle θ3 with respect to the edge SUB-ED of the substrate SUB. For example, the third inclined angle θ3 can be less than about 90 degrees.

[0160] The first inclined angle θ1 and the second inclined angle θ2 can be substantially equal to each other. For example, the inclination of the first alignment pattern PNL-AM1 and the inclination of the first substrate pad PNL-P1 can be substantially equal to each other. For example, the inclination of the first alignment pattern PNL-AM1 and the inclination of the first film pad COF-P1 can be substantially equal to each other. However, the present disclosure is not limited thereto, and the first inclined angle θ1 and the second inclined angle θ2 can be different from each other.

[0161] The second inclined angle θ2 and the third inclined angle θ3 can be substantially equal to each other. For example, the inclination of the first substrate pad PNL-P1 and the inclination of the second alignment pattern PNL-AM2 can be substantially equal to each other. For example, the inclination of the first film pad COF-P1 and the inclination of the second alignment pattern PNL-AM2 can be substantially equal to each other. However, the present disclosure is not limited thereto, and the second inclined angle θ2 and the third inclined angle θ3 can be different from each other.

[0162] Reference has been made to Figure 4 The first substrate pad PNL-P1, the first film pad COF-P1, the first alignment pattern PNL-AM1, and the second alignment pattern PNL-AM2 have been described, but the present disclosure is not limited thereto. For example, the second substrate pad PNL-P2, the third substrate pad PNL-P3, and the fourth substrate pad PNL-P4 can have substantially the same shape as the first substrate pad PNL-P1. For example, the second film pad COF-P2, the third film pad COF-P3, and the fourth film pad COF-P4 can have substantially the same shape as the first film pad COF-P1. For example, the third alignment pattern PNL-AM3, the fifth alignment pattern PNL-AM5, and the seventh alignment pattern PNL-AM7 can have substantially the same shape as the first alignment pattern PNL-AM1. For example, the fourth alignment pattern PNL-AM4, the sixth alignment pattern PNL-AM6, and the eighth alignment pattern PNL-AM8 can have substantially the same shape as the second alignment pattern PNL-AM2.

[0163] Reference has been made to Figure 3 The inclination direction of the fifth substrate pad PNL-P5 can be the same as that of the first substrate pad (for example, the first substrate pad PNL-P1), the second substrate pad PNL-P2, the third substrate pad PNL-P3, and the fourth substrate pad PNL-P4. For example, the inclination direction of the fifth film pad COF-P5 can be the same as that of the first film pad COF-P1, the second film pad COF-P2, the third film pad COF-P3, and the fourth film pad COF-P4. For example, the inclination direction of the fifth alignment pattern PNL-AM5 can be the same as that of the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the sixth alignment pattern PNL-AM6, and the eighth alignment pattern PNL-AM8. However, the present disclosure is not limited thereto, and the inclination direction of the fifth substrate pad PNL-P5 can be different from that of the first substrate pad (for example, the first substrate pad PNL-P1), the second substrate pad PNL-P2, the third substrate pad PNL-P3, and the fourth substrate pad PNL-P4. For example, the inclination direction of the fifth film pad COF-P5 can be different from that of the first film pad COF-P1, the second film pad COF-P2, the third film pad COF-P3, and the fourth film pad COF-P4. For example, the inclination direction of the fifth alignment pattern PNL-AM5 can be different from that of the first alignment pattern PNL-AM1, the second alignment pattern PNL-AM2, the third alignment pattern PNL-AM3, the fourth alignment pattern PNL-AM4, the sixth alignment pattern PNL-AM6, and the eighth alignment pattern PNL-AM8. Figure 2The tilt direction of the first die pad PNL-P1 can be opposite to the tilt direction of the first base pad PNL-P1. For example, the fifth base pad PNL-P5 can be mirror-symmetrical to the first base pad with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0164] The tilt direction of the sixth base pad PNL-P6 can be opposite to the tilt direction of the second base pad (e.g., Figure 2 PNL-P2). For example, the sixth base pad PNL-P6 can be mirror-symmetrical to the second base pad with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0165] The tilt direction of the seventh base pad PNL-P7 can be opposite to the tilt direction of the third base pad (e.g., Figure 2 PNL-P3). For example, the seventh base pad PNL-P7 can be mirror-symmetrical to the third base pad with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0166] The tilt direction of the eighth base pad PNL-P8 can be opposite to the tilt direction of the fourth base pad (e.g., Figure 2 PNL-P4). For example, the eighth base pad PNL-P8 can be mirror-symmetrical to the fourth base pad with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0167] The tilt direction of the fifth die pad COF-P5 can be opposite to the tilt direction of the first die pad (e.g., Figure 2 COF-P1). For example, the fifth die pad COF-P5 can be mirror-symmetrical to the first die pad with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0168] The tilt direction of the sixth die pad COF-P6 can be opposite to the tilt direction of the second die pad (e.g., Figure 2 COF-P2). For example, the sixth die pad COF-P6 can be mirror-symmetrical to the second die pad with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0169] The tilt direction of the seventh die pad COF-P7 can be opposite to the tilt direction of the third die pad (e.g., Figure 2 COF-P3). For example, the seventh die pad COF-P7 can be mirror-symmetrical to the third die pad with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0170] The tilt direction of the eighth film pad COF-P8 can be opposite to the tilt direction of the fourth film pad (e.g., COF-P4 of FIG. 8). Figure 2 For example, the eighth film pad COF-P8 can be mirror-symmetrical to the fourth film pad with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0171] The tilt direction of the ninth alignment pattern PNL-AM9 can be opposite to the tilt direction of the first alignment pattern (e.g., PNL-AM1 of FIG. 6). Figure 2 For example, the ninth alignment pattern PNL-AM9 can be mirror-symmetrical to the first alignment pattern with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0172] The tilt direction of the tenth alignment pattern PNL-AM10 can be opposite to the tilt direction of the second alignment pattern (e.g., PNL-AM2 of FIG. 7). Figure 2 For example, the tenth alignment pattern PNL-AM10 can be mirror-symmetrical to the second alignment pattern with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0173] The tilt direction of the eleventh alignment pattern PNL-AM11 can be opposite to the tilt direction of the third alignment pattern (e.g., PNL-AM3 of FIG. 8). Figure 2 For example, the eleventh alignment pattern PNL-AM11 can be mirror-symmetrical to the third alignment pattern with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0174] The tilt direction of the twelfth alignment pattern PNL-AM12 can be opposite to the tilt direction of the fourth alignment pattern (e.g., PNL-AM4 of FIG. 8). Figure 2 For example, the twelfth alignment pattern PNL-AM12 can be mirror-symmetrical to the fourth alignment pattern with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0175] The tilt direction of the thirteenth alignment pattern PNL-AM13 can be opposite to the tilt direction of the fifth alignment pattern (e.g., PNL-AM5 of FIG. 6). Figure 2 For example, the thirteenth alignment pattern PNL-AM13 can be mirror-symmetrical to the fifth alignment pattern with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0176] The tilt direction of the fourteenth alignment pattern PNL-AM14 can be opposite to the tilt direction of the sixth alignment pattern (e.g., PNL-AM6 of FIG. 7). Figure 2The tilt direction of the sixth alignment pattern PNL-AM6 can be opposite to that of the seventh alignment pattern (e.g., PNL-AM7) of the plurality of alignment patterns PNL-AM1-AM8. For example, the fourteenth alignment pattern PNL-AM14 can be mirror-symmetrical to the seventh alignment pattern with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0177] The tilt direction of the fifteenth alignment pattern PNL-AM15 can be opposite to that of the eighth alignment pattern (e.g., PNL-AM8) of the plurality of alignment patterns PNL-AM1-AM8. For example, the fifteenth alignment pattern PNL-AM15 can be mirror-symmetrical to the eighth alignment pattern with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2. Figure 2 The tilt direction of the sixteenth alignment pattern PNL-AM16 can be opposite to that of the ninth alignment pattern (e.g., PNL-AM9) of the plurality of alignment patterns PNL-AM1-AM8. For example, the sixteenth alignment pattern PNL-AM16 can be mirror-symmetrical to the ninth alignment pattern with respect to an imaginary line passing through the center of the substrate SUB and extending in the second direction DR2.

[0178] Figure 2 Further referring to , the ninth alignment pattern PNL-AM9 can have a tilted shape. For example, the ninth alignment pattern PNL-AM9 can form a fourth tilt angle Θ4 with respect to an edge SUB-ED of the substrate SUB. For example, an imaginary extension line (or a center line) of the ninth alignment pattern PNL-AM9 can form the fourth tilt angle Θ4 with respect to the edge SUB-ED of the substrate SUB. For example, the fourth tilt angle Θ4 can be less than about 90 degrees.

[0179] Figure 5 The fifth base pad PNL-P5 can have a tilted shape. For example, the fifth base pad PNL-P5 can form a fifth tilt angle Θ5 with respect to an edge SUB-ED of the substrate SUB. For example, an imaginary extension line (or a center line) of the fifth base pad PNL-P5 can form the fifth tilt angle Θ5 with respect to the edge SUB-ED of the substrate SUB. For example, the fifth tilt angle Θ5 can be less than about 90 degrees.

[0180] The fifth film pad COF-P5 can have a tilted shape. For example, the fifth film pad COF-P5 can form a fifth tilt angle Θ5 with respect to an edge SUB-ED of the substrate SUB. For example, an imaginary extension line (or a center line) of the fifth film pad COF-P5 can form the fifth tilt angle Θ5 with respect to the edge SUB-ED of the substrate SUB. For example, the fifth tilt angle Θ5 can be less than about 90 degrees.

[0181] For example, the imaginary extension line of the fifth base pad PNL-P5 and the imaginary extension line of the fifth film pad COF-P5 can be the same as each other.

[0182] For example, the imaginary extension line of the fifth base pad PNL-P5 and the imaginary extension line of the fifth film pad COF-P5 can be the same as each other. ​

[0183] The tenth alignment pattern PNL-AM10 can have an inclined shape. For example, the tenth alignment pattern PNL-AM10 can form a sixth inclined angle θ6 with respect to the edge SUB-ED of the substrate SUB. For example, an imaginary extension line (or a center line) of the tenth alignment pattern PNL-AM10 can form the sixth inclined angle θ6 with respect to the edge SUB-ED of the substrate SUB. For example, the sixth inclined angle θ6 can be less than about 90 degrees.

[0184] The fourth inclined angle θ4 and the fifth inclined angle θ5 can be substantially equal to each other. For example, the inclination of the ninth alignment pattern PNL-AM9 and the inclination of the fifth substrate pad PNL-P5 can be substantially equal to each other. For example, the inclination of the ninth alignment pattern PNL-AM9 and the inclination of the fifth film pad COF-P5 can be substantially equal to each other. However, the present disclosure is not limited thereto, and the fourth inclined angle θ4 and the fifth inclined angle θ5 can be different from each other.

[0185] The fifth inclined angle θ5 and the sixth inclined angle θ6 can be substantially equal to each other. For example, the inclination of the fifth substrate pad PNL-P5 and the inclination of the tenth alignment pattern PNL-AM10 can be substantially equal to each other. For example, the inclination of the fifth film pad COF-P5 and the inclination of the tenth alignment pattern PNL-AM10 can be substantially equal to each other. However, the present disclosure is not limited thereto, and the fifth inclined angle θ5 and the sixth inclined angle θ6 can be different from each other.

[0186] Referring to FIGS. 1 to 3, a first substrate pad PNL-P1, a second substrate pad PNL-P2, a third substrate pad PNL-P3, a fourth substrate pad PNL-P4, a fifth substrate pad PNL-P5, a sixth substrate pad PNL-P6, a seventh substrate pad PNL-P7, an eighth substrate pad PNL-P8, a ninth substrate pad PNL-P9, a tenth substrate pad PNL-P10, a first film pad COF-P1, a second film pad COF-P2, a third film pad COF-P3, a fourth film pad COF-P4, a fifth film pad COF-P5, a sixth film pad COF-P6, a seventh film pad COF-P7, an eighth film pad COF-P8, a ninth film pad COF-P9, a tenth film pad COF-P10, a first alignment pattern PNL-AM1, a second alignment pattern PNL-AM2, a third alignment pattern PNL-AM3, a fourth alignment pattern PNL-AM4, a ninth alignment pattern PNL-AM9, a tenth alignment pattern PNL-AM10, an eleventh alignment pattern PNL-AM11, a twelfth alignment pattern PNL-AM12, a thirteenth alignment pattern PNL-AM13, a fourteenth alignment pattern PNL-AM14, a fifteenth alignment pattern PNL-AM15, and a sixteenth alignment pattern PNL-AM16 have been described. Figure 5 The fifth substrate pad PNL-P5, the fifth film pad COF-P5, the ninth alignment pattern PNL-AM9, and the tenth alignment pattern PNL-AM10 have been described, but the present disclosure is not limited thereto.

[0187] For example, the sixth substrate pad PNL-P6, the seventh substrate pad PNL-P7, and the eighth substrate pad PNL-P8 can have substantially the same shape as the fifth substrate pad PNL-P5. For example, the sixth film pad COF-P6, the seventh film pad COF-P7, and the eighth film pad COF-P8 can have substantially the same shape as the fifth film pad COF-P5. For example, the eleventh alignment pattern PNL-AM11, the thirteenth alignment pattern PNL-AM13, and the fifteenth alignment pattern PNL-AM15 can have substantially the same shape as the ninth alignment pattern PNL-AM9. For example, the twelfth alignment pattern PNL-AM12, the fourteenth alignment pattern PNL-AM14, and the sixteenth alignment pattern PNL-AM16 can have substantially the same shape as the tenth alignment pattern PNL-AM10.

[0188] Figure 6 is a view showing a cross-sectional structure of a display device according to an embodiment of the present disclosure. Figure 1A schematic cross-sectional view of a pixel in a display device.

[0189] Referring to Figure 6 , the pixel PX can include a substrate SUB, a buffer layer BUF, a bottom metal layer BML, a gate insulating layer GI, an interlayer insulating layer ILD, a via insulating layer VIA, an active layer ACT, a source electrode SE, a gate electrode GE, a drain electrode DE, a pixel electrode PE, a pixel definition layer PDL, an emission layer EML, a common electrode CE, and a sealing layer TFE.

[0190] The transistor TR can include the active layer ACT, the source electrode SE, the gate electrode GE, and the drain electrode DE.

[0191] The substrate SUB can include a transparent material or an opaque material. The substrate SUB can be formed of a transparent resin substrate. Examples of the transparent resin substrate can include a polyimide substrate. For example, the polyimide substrate can include a first organic layer, a first barrier layer, and a second organic layer, etc.

[0192] In another example, the substrate SUB can include a quartz substrate (e.g., a synthetic quartz substrate, a fluorine-doped quartz substrate), a calcium fluoride substrate, a soda lime glass substrate, or a non-alkali glass substrate, etc. These materials can be used alone or in combination with each other.

[0193] The bottom metal layer BML can be disposed on the substrate SUB. The bottom metal layer BML can include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material, etc. Examples of the metal can include silver ("Ag"), molybdenum ("Mo"), aluminum ("Al"), tungsten ("W"), copper ("Cu"), nickel ("Ni"), chromium ("Cr"), titanium ("Ti"), tantalum ("Ta"), platinum ("Pt"), or scandium ("Sc"), etc. These materials can be used alone or in combination with each other. Examples of the conductive metal oxide can include indium tin oxide or indium zinc oxide, etc. These materials can be used alone or in combination with each other. Examples of the metal nitride can include aluminum nitride ("AlN x "), tungsten nitride ("WN x "), or chromium nitride ("CrN x "), etc. These materials can be used alone or in combination with each other.

[0194] The buffer layer BUF can be disposed on the substrate SUB. The buffer layer BUF can cover the bottom metal layer BML. The buffer layer BUF can prevent metal atoms or impurities from diffusing from the substrate SUB to the transistor TR. In the case where the surface of the substrate SUB is not uniform, the buffer layer BUF can improve the flatness of the surface of the substrate SUB.

[0195] For example, the buffer layer BUF can include an inorganic material such as silicon oxide, silicon nitride, or silicon oxynitride, etc. These materials can be used alone or in combination with each other.

[0196] The active layer ACT can be disposed on the buffer layer BUF. The active layer ACT can include an inorganic semiconductor (e.g., amorphous silicon semiconductor, polycrystalline silicon semiconductor, metal oxide semiconductor), or an organic semiconductor, etc. These materials can be used alone or in combination with each other. The active layer ACT can include a source region, a drain region, and a channel region disposed between the source region and the drain region.

[0197] The metal oxide semiconductor can include a binary compound ("AB x "), a ternary compound ("AB x C y "), or a quaternary compound ("AB x C y D z ", etc.) including indium ("In"), zinc ("Zn"), gallium ("Ga"), tin ("Sn"), titanium ("Ti"), aluminum ("Al"), hafnium ("Hf"), zirconium ("Zr"), or magnesium ("Mg"), etc. These materials can be used alone or in combination with each other. For example, the metal oxide semiconductor can include zinc oxide ("ZnO x "), gallium oxide ("GaO x "), tin oxide ("SnO x "), indium oxide ("InO x "), indium gallium oxide ("IGO"), indium zinc oxide ("IZO"), indium tin oxide ("ITO"), indium zinc tin oxide ("IZTO"), and indium gallium zinc oxide ("IGZO"). These materials can be used alone or in combination with each other.

[0198] The gate insulating layer GI can be disposed on the buffer layer BUF. The gate insulating layer GI can cover (e.g., substantially cover) the active layer ACT. For example, the gate insulating layer GI can cover the active layer ACT and can be disposed along the profile of the active layer ACT.

[0199] For example, the gate insulating layer GI can include an inorganic material such as silicon oxide ("SiO x "), silicon nitride ("SiN x "), silicon carbide ("SiC x "), silicon oxynitride ("SiO x N y "), or silicon oxycarbide ("SiO x C y ", etc. These materials can be used alone or in combination with each other.

[0200] The gate electrode GE can be disposed on the gate insulating layer GI. The gate electrode GE can overlap the channel region of the active layer ACT in the third direction DR3.

[0201] The gate electrode GE can include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material, etc. Examples of the metal can include silver (“Ag”), molybdenum (“Mo”), aluminum (“Al”), tungsten (“W”), copper (“Cu”), nickel (“Ni”), chromium (“Cr”), titanium (“Ti”), tantalum (“Ta”), platinum (“Pt”), or scandium (“Sc”), etc. These materials can be used alone or in combination with each other. Examples of the conductive metal oxide can include indium tin oxide or indium zinc oxide, etc. These materials can be used alone or in combination with each other. Examples of the metal nitride can include aluminum nitride (“AlN x ”), tungsten nitride (“WN x ”), or chromium nitride (“CrN x ”), etc. These materials can be used alone or in combination with each other.

[0202] The interlayer insulating layer ILD can be disposed on the gate insulating layer GI. The interlayer insulating layer ILD can cover (e.g., substantially cover) the gate electrode GE. For example, the interlayer insulating layer ILD can cover the gate electrode GE and can be disposed along the profile of the gate electrode GE.

[0203] For example, the interlayer insulating layer ILD can include an inorganic material, such as silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, or silicon oxycarbide, etc. These materials can be used alone or in combination with each other.

[0204] The source electrode SE can be disposed on the interlayer insulating layer ILD. The source electrode SE can be electrically connected to the source region of the active layer ACT through a first contact hole defined through the gate insulating layer GI and the interlayer insulating layer ILD.

[0205] The drain electrode DE can be disposed on the interlayer insulating layer ILD. The drain electrode DE can be electrically connected to the drain region of the active layer ACT through a second contact hole defined through the gate insulating layer GI and the interlayer insulating layer ILD.

[0206] For example, the source electrode SE can include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material, etc. These materials can be used alone or in combination with each other. The drain electrode DE and the source electrode SE can be formed through the same process and can include the same materials as each other.

[0207] A via insulating layer VIA can be disposed on the interlayer insulating layer ILD. The via insulating layer VIA can cover (e.g., substantially cover) the source electrode SE and the drain electrode DE. The via insulating layer VIA can include an organic material. For example, the via insulating layer VIA can include an organic material such as a phenol resin, an acrylic resin, a polyimide resin, a polyamide resin, a siloxane resin, or an epoxy resin, etc. These materials can be used alone or in combination with each other.

[0208] The pixel electrode PE can be disposed on the via insulating layer VIA. The pixel electrode PE can be electrically connected to the drain electrode DE through a contact hole that penetrates the via insulating layer VIA.

[0209] The pixel electrode PE can include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material, etc. These materials can be used alone or in combination with each other. The pixel electrode PE can have a stack structure including ITO / Ag / ITO. For example, the pixel electrode PE can operate as an anode.

[0210] The pixel defining layer PDL can be disposed on the via insulating layer VIA. The pixel defining layer PDL can cover a side portion of the pixel electrode PE. An opening that exposes a portion of an upper surface of the pixel electrode PE can be defined in the pixel defining layer PDL.

[0211] For example, the pixel defining layer PDL can include an inorganic material or an organic material. The pixel defining layer PDL can include an organic material such as an epoxy resin or a siloxane resin, etc. These materials can be used alone or in combination with each other. In another embodiment, the pixel defining layer PDL can further include a light-blocking material including a black pigment or a black dye, etc.

[0212] The emission layer EML can be disposed on the pixel electrode PE. The emission layer EML can include an organic material that emits light of a predetermined color. For example, the emission layer EML can include an organic material that emits red light. However, the present disclosure is not limited thereto, and the emission layer EML can emit light of a color different from red light.

[0213] The common electrode CE can be disposed on the emission layer EML and the pixel defining layer PDL. The common electrode CE can include a metal, an alloy, a metal nitride, a conductive metal oxide, or a transparent conductive material, etc. These materials can be used alone or in combination with each other. The common electrode CE can operate as a cathode.

[0214] The encapsulation layer TFE can be disposed on the common electrode CE. The encapsulation layer TFE can prevent impurities and moisture from penetrating into the pixel electrode PE, the emission layer EML, and the common electrode CE from the outside. The encapsulation layer TFE can include at least one inorganic layer and at least one organic layer.

[0215] For example, the inorganic layer may include silicon oxide, silicon nitride, or silicon oxynitride. These materials may be used alone or in combination with each other. The organic layer may include polymer-cured products, such as polyacrylates.

[0216] Although it has been referenced Figure 6 An embodiment of pixel PX has been described, but pixel PX is not limited to... Figure 6 The structure is shown in the diagram. For example, a pixel PX may include all the structures that receive electrical signals and emit light with a brightness corresponding to the intensity of the electrical signals.

[0217] Figure 7 and Figure 8 It is shown that this includes in Figure 1 A schematic plan view of the expansion of the flip-chip film in a display device. Figure 9 and Figure 10 This is a schematic plan view showing the flip-chip film positioned at the adjusted location. Figure 11 It is shown Figure 9 A magnified schematic plan view of the X5 region. Figure 12 It is shown Figure 10 A magnified schematic plan view of the X6 region.

[0218] Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 12 This illustrates how a display device can be manufactured by adjusting the position of the flip-chip COF when the COF is attached to the substrate SUB in an expanded state (e.g., Figure 1 A schematic plan view of the method of displaying a device (DD).

[0219] Reference Figure 7 and Figure 8 The flip-chip COF can be attached to one side (or the other side) of the substrate SUB in an expanded state. When the flip-chip COF expands, the width of each of the multiple film pads included in the flip-chip COF may increase. For example, the width of each of the first film pad COF-P1, the second film pad COF-P2, the third film pad COF-P3, the fourth film pad COF-P4, the fifth film pad COF-P5, the sixth film pad COF-P6, the seventh film pad COF-P7, and the eighth film pad COF-P8 may increase.

[0220] When the flip-chip COF expands, the separation distance between adjacent film pads may increase. For example, the separation distance between the first film pad COF-P1 and the second film pad COF-P2 may increase. Therefore, when the flip-chip COF is attached to one side (or the other side) of the substrate SUB in an expanded state, misalignment may occur between the multiple film pads and the multiple substrate pads disposed on the substrate SUB.

[0221] Whether the flip-chip COF has expanded can be checked by examining the first substrate alignment mark PM1, the second substrate alignment mark PM2, the first film alignment mark CM1, and the second film alignment mark CM2. For example, the expansion of the flip-chip COF can be checked by examining the relative positions of the first substrate alignment mark PM1 and the first film alignment mark CM1. Similarly, the expansion of the flip-chip COF can be checked by examining the relative positions of the second substrate alignment mark PM2 and the second film alignment mark CM2.

[0222] When the flip-chip COF is attached to one side (e.g., one side) of the substrate SUB in an expanded state, the first film alignment mark CM1 may be offset relative to the first substrate alignment mark PM1 in a direction opposite to the first direction DR1. For example, in the case of expansion of the flip-chip COF, as with Figure 2 Compared to the previous case, the first film alignment mark CM1 may be offset in a direction opposite to the first direction DR1. For example, in the case of expansion of the flip-chip COF, the first film alignment mark CM1 may be offset by a first distance ER1 relative to the first substrate alignment mark PM1 in a direction opposite to the first direction DR1. For example, in the case of expansion of the flip-chip COF, the centerline of the first film alignment mark CM1 may be offset by a first distance ER1 relative to the centerline of the first substrate alignment mark PM1 in a direction opposite to the first direction DR1. The centerline of the first substrate alignment mark PM1 may pass through the central portion of the first substrate alignment mark PM1 and extend in the second direction DR2. The centerline of the first film alignment mark CM1 may pass through the central portion of the first film alignment mark CM1 and extend in the second direction DR2.

[0223] When the flip-chip COF is attached to the other side of the substrate SUB in an expanded state, the second film alignment mark CM2 may be offset relative to the second substrate alignment mark PM2 in the first direction DR1. For example, in the case of expansion of the flip-chip COF, as with Figure 3In contrast to the case where the first film alignment mark CM1 is not shifted in the first direction DR1, the second film alignment mark CM2 can be shifted in the first direction DR1. For example, in the case where the chip-on-film COF is expanded, the second film alignment mark CM2 can be shifted in the first direction DR1 by a second distance ER2 with respect to the second substrate alignment mark PM2. For example, in the case where the chip-on-film COF is expanded, a center line of the second film alignment mark CM2 can be shifted in the first direction DR1 by the second distance ER2 with respect to a center line of the second substrate alignment mark PM2. The center line of the second substrate alignment mark PM2 can pass through a center portion of the second substrate alignment mark PM2 and extend in the second direction DR2. The center line of the second film alignment mark CM2 can pass through a center portion of the second film alignment mark CM2 and extend in the second direction DR2.

[0224] Referring to Figure 9 and Figure 10 In the case where the chip-on-film COF is attached to one side (or the other side) of the substrate SUB in the expanded state, a position of the chip-on-film COF can be adjusted. For example, in the case where the chip-on-film COF is attached to one side (or the other side) of the substrate SUB in the expanded state, the chip-on-film COF can be moved in a direction away from the substrate SUB to align the plurality of substrate pads and the plurality of film pads, respectively. For example, in the case where the chip-on-film COF is attached to one side (or the other side) of the substrate SUB in the expanded state, the chip-on-film COF can be moved in the second direction DR2.

[0225] In the case where the chip-on-film COF is moved in the second direction DR2, the first film pad COF-P1, the second film pad COF-P2, the third film pad COF-P3, the fourth film pad COF-P4, the fifth film pad COF-P5, the sixth film pad COF-P6, the seventh film pad COF-P7, the eighth film pad COF-P8, the first film alignment mark CM1, and the second film alignment mark CM2 can be moved in the second direction DR2.

[0226] After the chip-on-film COF is moved in the second direction DR2, it can be necessary to check whether the plurality of substrate pads and the plurality of film pads are aligned, respectively. For example, relative positions of the first substrate alignment mark PM1 and the first film alignment mark CM1 and relative positions of the second substrate alignment mark PM2 and the second film alignment mark CM2 can not provide information about whether the plurality of substrate pads and the plurality of film pads are aligned, respectively. This can be because the first film alignment mark CM1 and the second film alignment mark CM2 are moved only in the second direction DR2 such that a first distance (e.g., the first distance ER1 of Figure 7 and a second distance (e.g., the second distance ER2 of Figure 8 are not changed. Hereinafter, a method of checking whether the plurality of substrate pads and the plurality of film pads are aligned, respectively, by a plurality of alignment patterns disposed on the substrate SUB will be described.

[0227] Referring to Figure 9 and Figure 11 A separation distance between the first film pad COF-P1 and the first alignment pattern PNL-AM1 can be measured. A separation distance between the first film pad COF-P1 and the second alignment pattern PNL-AM2 can be measured.

[0228] For example, at the first position, a first separation distance L1 between the first film pad COF-P1 and the first alignment pattern PNL-AM1 can be measured. At the first position, a second separation distance L2 between the first film pad COF-P1 and the second alignment pattern PNL-AM2 can be measured.

[0229] In a case where the first separation distance L1 and the second separation distance L2 are substantially equal to each other, it can be determined that the plurality of substrate pads and the plurality of film pads are properly aligned, respectively. For example, in a case where the first separation distance L1 and the second separation distance L2 are substantially equal to each other, it can be determined that the substrate SUB and the COF are properly aligned. For example, in a case where the first separation distance L1 and the second separation distance L2 are substantially equal to each other, it can be determined that the COF is properly attached to one side (e.g., a single side) of the substrate SUB.

[0230] If the first separation distance L1 is greater than the second separation distance L2, the COF can be further moved upward in a direction opposite to the second direction DR2. In a case where the first separation distance L1 is less than the second separation distance L2, the COF can be moved downward in the second direction DR2.

[0231] A third separation distance L3 between the first film pad COF-P1 and the first alignment pattern PNL-AM1 can be measured at the second position. A fourth separation distance L4 between the first film pad COF-P1 and the second alignment pattern PNL-AM2 can be measured at the second position.

[0232] A fifth separation distance L5 between the first film pad COF-P1 and the first alignment pattern PNL-AM1 can be measured at the third position. A sixth separation distance L6 between the first film pad COF-P1 and the second alignment pattern PNL-AM2 can be measured at the third position.

[0233] This can be because, if the separation distance between the first film pad COF-P1 and the first alignment pattern PNL-AM1 and the separation distance between the first film pad COF-P1 and the second alignment pattern PNL-AM2 are measured multiple times, it can be more accurately determined whether the plurality of substrate pads and the plurality of film pads are properly aligned.

[0234] Referring to Figure 10 andFigure 12 A separation distance between the fifth film pad COF-P5 and the ninth alignment mark PNL-AM9 can be measured. A separation distance between the fifth film pad COF-P5 and the tenth alignment mark PNL-AM10 can be measured.

[0235] For example, at the fourth position, a seventh separation distance L7 between the fifth film pad COF-P5 and the ninth alignment mark PNL-AM9 can be measured. At the fourth position, an eighth separation distance L8 between the fifth film pad COF-P5 and the tenth alignment mark PNL-AM10 can be measured.

[0236] In a case where the seventh separation distance L7 and the eighth separation distance L8 are substantially equal to each other, it can be determined that the plurality of substrate pads and the plurality of film pads are respectively properly aligned. For example, in a case where the seventh separation distance L7 and the eighth separation distance L8 are substantially equal to each other, it can be determined that the substrate SUB and the COF are properly aligned. For example, in a case where the seventh separation distance L7 and the eighth separation distance L8 are substantially equal to each other, it can be determined that the COF is properly attached to the other side of the substrate SUB.

[0237] If the seventh separation distance L7 is greater than the eighth separation distance L8, the COF can be moved upward in a direction opposite to the second direction DR2. In a case where the seventh separation distance L7 is less than the eighth separation distance L8, the COF can be moved downward in the second direction DR2.

[0238] A ninth separation distance L9 between the fifth film pad COF-P5 and the ninth alignment mark PNL-AM9 can be measured at the fifth position. A tenth separation distance L10 between the fifth film pad COF-P5 and the tenth alignment mark PNL-AM10 can be measured at the fifth position.

[0239] An eleventh separation distance L11 between the fifth film pad COF-P5 and the ninth alignment mark PNL-AM9 can be measured at the sixth position. A twelfth separation distance L12 between the fifth film pad COF-P5 and the tenth alignment mark PNL-AM10 can be measured at the sixth position.

[0240] This can be because, if the separation distance between the fifth film pad COF-P5 and the ninth alignment mark PNL-AM9 and the separation distance between the fifth film pad COF-P5 and the tenth alignment mark PNL-AM10 are measured a plurality of times, it can be more accurately determined whether the plurality of substrate pads and the plurality of film pads are respectively properly aligned.

[0241] Figure 13 and Figure 14 is a diagram illustrating a case where the COF is attached to the substrate SUB in the first direction DR1. Figure 1a schematic plan view of a chip-on-film (COF) in a display device. Figure 15 and Figure 16 is a schematic plan view showing the chip-on-film (COF) disposed at an adjusted position. Figure 17 is a schematic plan view showing Figure 15 is a zoomed-in schematic plan view of an X7 region of Figure 18 is a zoomed-in schematic plan view of an X8 region of Figure 16

[0242] Figure 13 , Figure 14 , Figure 15 , Figure 16 , Figure 17 and Figure 18 are schematic plan views showing a method of manufacturing a display device (e.g., a display device DD of Figure 1 ) by adjusting a position of a chip-on-film (COF) attached to a substrate (SUB) in a shrunk state.

[0243] Referring to Figure 13 and Figure 14 , the chip-on-film (COF) can be attached to one side (or the other side) of the substrate (SUB) in the shrunk state. In the case where the chip-on-film (COF) is shrunk, a width of each of a plurality of film pads included in the chip-on-film (COF) can decrease. For example, a width of each of a first film pad COF-P1, a second film pad COF-P2, a third film pad COF-P3, a fourth film pad COF-P4, a fifth film pad COF-P5, a sixth film pad COF-P6, a seventh film pad COF-P7, and an eighth film pad COF-P8 can decrease. In the case where the chip-on-film (COF) is shrunk, a separation distance between adjacent film pads can decrease. For example, a separation distance between the first film pad COF-P1 and the second film pad COF-P2 can decrease. Accordingly, in the case where the chip-on-film (COF) is attached to one side (or the other side) of the substrate (SUB) in the shrunk state, misalignment can occur between the plurality of film pads disposed on the substrate (SUB) and the plurality of substrate pads.

[0244] Whether the chip-on-film (COF) is shrunk can be checked by checking the first substrate alignment mark PM1, the second substrate alignment mark PM2, the first film alignment mark CM1, and the second film alignment mark CM2. For example, whether the chip-on-film (COF) is shrunk can be checked by checking relative positions of the first substrate alignment mark PM1 and the first film alignment mark CM1. Whether the chip-on-film (COF) is shrunk can be checked by checking relative positions of the second substrate alignment mark PM2 and the second film alignment mark CM2.

[0245] ​In the case where the COF is attached to one side (e.g., a single side) of the substrate SUB in the shrunk state, the first film alignment mark CM1 can be offset in the first direction DR1 relative to the first substrate alignment mark PM1. For example, in the case where the COF is shrunk, the first film alignment mark CM1 can be offset in the first direction DR1 as compared to Figure 2 For example, in the case where the COF is shrunk, the first film alignment mark CM1 can be offset in the first direction DR1 relative to the first substrate alignment mark PM1 by a third distance ER3. For example, in the case where the COF is shrunk, a centerline of the first film alignment mark CM1 can be offset in the first direction DR1 relative to a centerline of the first substrate alignment mark PM1 by the third distance ER3.

[0246] In the case where the COF is attached to the other side of the substrate SUB in the shrunk state, the second film alignment mark CM2 can be offset in a direction opposite the first direction DR1 relative to the second substrate alignment mark PM2. For example, in the case where the COF is shrunk, the second film alignment mark CM2 can be offset in a direction opposite the first direction DR1 as compared to Figure 3 For example, in the case where the COF is shrunk, the second film alignment mark CM2 can be offset in a direction opposite the first direction DR1 relative to the second substrate alignment mark PM2 by a fourth distance ER4. For example, in the case where the COF is shrunk, a centerline of the second film alignment mark CM2 can be offset in a direction opposite the first direction DR1 relative to a centerline of the second substrate alignment mark PM2 by the fourth distance ER4.

[0247] Referring to Figure 15 and Figure 16 In the case where the COF is attached to one side (or the other side) of the substrate SUB in the shrunk state, the position of the COF can be adjusted. For example, in the case where the COF is attached to one side (or the other side) of the substrate SUB in the shrunk state, to align the plurality of substrate pads and the plurality of film pads, respectively, the COF can be moved such that an area / region where the substrate SUB and the COF overlap in plan view is increased. For example, in the case where the COF is attached to one side (or the other side) of the substrate SUB in the shrunk state, the COF can be moved in a direction opposite the second direction DR2.

[0248] In a case where the COF moves in a direction opposite to the second direction DR2, the first film pad COF-P1, the second film pad COF-P2, the third film pad COF-P3, the fourth film pad COF-P4, the fifth film pad COF-P5, the sixth film pad COF-P6, the seventh film pad COF-P7, the eighth film pad COF-P8, the first film alignment mark CM1, and the second film alignment mark CM2 can move in a direction opposite to the second direction DR2.

[0249] After the COF moves in a direction opposite to the second direction DR2, it can be required to check whether the plurality of substrate pads and the plurality of film pads are respectively aligned. For example, relative positions of the first substrate alignment mark PM1 and the first film alignment mark CM1 and relative positions of the second substrate alignment mark PM2 and the second film alignment mark CM2 can not provide information about whether the plurality of substrate pads and the plurality of film pads are respectively aligned. This can be because the first film alignment mark CM1 and the second film alignment mark CM2 are moved only in a direction opposite to the second direction DR2, such that a third distance (e.g., a third distance ER3) and a fourth distance (e.g., a fourth distance ER4) do not change. Hereinafter, a method of checking whether the plurality of substrate pads and the plurality of film pads are respectively aligned by a plurality of alignment patterns will be described. Figure 13 Figure 14 Hereinafter, a method of checking whether the plurality of substrate pads and the plurality of film pads are respectively aligned by a plurality of alignment patterns will be described.

[0250] Referring to Figure 15 and Figure 17 , a separation distance between the first film pad COF-P1 and the first alignment pattern PNL-AM1 can be measured. A separation distance between the first film pad COF-P1 and the second alignment pattern PNL-AM2 can be measured.

[0251] For example, at the first position, a first separation distance L1' between the first film pad COF-P1 and the first alignment pattern PNL-AM1 can be measured. At the first position, a second separation distance L2' between the first film pad COF-P1 and the second alignment pattern PNL-AM2 can be measured.

[0252] In a case where the first separation distance L1' and the second separation distance L2' are equal to each other, it can be determined that the plurality of substrate pads and the plurality of film pads are respectively properly aligned. For example, in a case where the first separation distance L1' and the second separation distance L2' are equal to each other, it can be determined that the substrate SUB and the COF are properly aligned. For example, in a case where the first separation distance L1' and the second separation distance L2' are equal to each other, it can be determined that the COF is properly attached to one side (e.g., a single side) of the substrate SUB.

[0253] ​If the first separation distance L1' is greater than the second separation distance L2', the COF can move upward in a direction opposite the second direction DR2. If the first separation distance L1' is less than the second separation distance L2', the COF can move downward in the second direction DR2.

[0254] A third separation distance L3' between the first film pad COF-P1 and the first alignment pattern PNL-AM1 can be measured at the second position. A fourth separation distance L4' between the first film pad COF-P1 and the second alignment pattern PNL-AM2 can be measured at the second position.

[0255] A fifth separation distance L5' between the first film pad COF-P1 and the first alignment pattern PNL-AM1 can be measured at the third position. A sixth separation distance L6' between the first film pad COF-P1 and the second alignment pattern PNL-AM2 can be measured at the third position.

[0256] This can be because if the separation distance between the first film pad COF-P1 and the first alignment pattern PNL-AM1 and the separation distance between the first film pad COF-P1 and the second alignment pattern PNL-AM2 are measured multiple times, it can be more accurate to determine whether the plurality of substrate pads and the plurality of film pads are properly aligned.

[0257] Referring to Figure 16 and Figure 18 A separation distance between the fifth film pad COF-P5 and the ninth alignment pattern PNL-AM9 can be measured. A separation distance between the fifth film pad COF-P5 and the tenth alignment pattern PNL-AM10 can be measured.

[0258] For example, at the fourth position, a seventh separation distance L7' between the fifth film pad COF-P5 and the ninth alignment pattern PNL-AM9 can be measured. At the fourth position, an eighth separation distance L8' between the fifth film pad COF-P5 and the tenth alignment pattern PNL-AM10 can be measured.

[0259] In the case where the seventh separation distance L7' and the eighth separation distance L8' are equal, it can be determined that the plurality of substrate pads and the plurality of film pads are properly aligned, respectively. For example, in the case where the seventh separation distance L7' and the eighth separation distance L8' are equal, it can be determined that the substrate SUB and the COF are properly aligned. For example, in the case where the seventh separation distance L7' and the eighth separation distance L8' are equal, it can be determined that the COF is properly attached to the other side of the substrate SUB.

[0260] If the seventh separation distance L7' is greater than the eighth separation distance L8', the chip-on-film COF can move upward in a direction opposite to the second direction DR2. If the seventh separation distance L7' is less than the eighth separation distance L8', the chip-on-film COF can move downward in the second direction DR2.

[0261] A ninth separation distance L9' between the fifth film pad COF-P5 and the ninth alignment pattern PNL-AM9 can be measured at the fifth position. A tenth separation distance L10' between the fifth film pad COF-P5 and the tenth alignment pattern PNL-AM10 can be measured at the fifth position.

[0262] An eleventh separation distance L11' between the fifth film pad COF-P5 and the ninth alignment pattern PNL-AM9 can be measured at the sixth position. A twelfth separation distance L12' between the fifth film pad COF-P5 and the tenth alignment pattern PNL-AM10 can be measured at the sixth position.

[0263] This can be because, if the separation distance between the fifth film pad COF-P5 and the ninth alignment pattern PNL-AM9 and the separation distance between the fifth film pad COF-P5 and the tenth alignment pattern PNL-AM10 are measured multiple times, whether the plurality of substrate pads and the plurality of film pads are respectively properly aligned can be more accurately determined.

[0264] For example, since the display device (e.g., the display device DD of FIG. 1) includes the plurality of alignment patterns on the substrate SUB, whether the chip-on-film COF is properly attached to one side (or the other side) of the substrate SUB can be accurately determined. Figure 1

[0265] Figure 19 is an enlarged schematic plan view illustrating an example of an X1 region of the display device DD of FIG. 1. Figure 1 Figure 20 is an enlarged schematic plan view illustrating an example of an X2 region of the display device DD of FIG. 1. Figure 1 In addition to the positions and the number of the plurality of alignment patterns, the display device according to the embodiments described with reference to

[0266] and Figure 19 may be substantially the same as or similar to the display device described with reference to Figure 20 and Figure 2 may be substantially the same as or similar to the display device (e.g., the display device DD of FIG. 1). Thus, redundant descriptions can be omitted or simplified. Figure 3 Figure 1 In addition to the positions and the number of the plurality of alignment patterns, the display device according to the embodiments described with reference to

[0267] In addition to the positions and the number of the plurality of alignment patterns, the display device according to the embodiments described with reference to Figure 19 Figure 20 ​​​​A plurality of alignment patterns can be disposed on the substrate SUB. For example, a first alignment pattern PNL-AM1’, a second alignment pattern PNL-AM2’, a third alignment pattern PNL-AM3’, a fourth alignment pattern PNL-AM4’, a fifth alignment pattern PNL-AM5’, a sixth alignment pattern PNL-AM6’, a seventh alignment pattern PNL-AM7’, an eighth alignment pattern PNL-AM8’, a ninth alignment pattern PNL-AM9’, and a tenth alignment pattern PNL-AM10’ can be disposed on the substrate SUB.

[0268] One alignment pattern can be disposed between adjacent film pads. For example, the second alignment pattern PNL-AM2’ can be disposed between the first film pad COF-P1 and the second film pad COF-P2. The third alignment pattern PNL-AM3’ can be disposed between the second film pad COF-P2 and the third film pad COF-P3. The fourth alignment pattern PNL-AM4’ can be disposed between the third film pad COF-P3 and the fourth film pad COF-P4. The first alignment pattern PNL-AM1’ can be spaced apart from the second alignment pattern PNL-AM2’ in a direction opposite to the first direction DR1. For example, the first alignment pattern PNL-AM1’ can be spaced apart from the second alignment pattern PNL-AM2’ in a plan view with respect to the first film pad COF-P1 interposed between the first alignment pattern PNL-AM1’ and the second alignment pattern PNL-AM2’. The fifth alignment pattern PNL-AM5’ can be spaced apart from the fourth alignment pattern PNL-AM4’ in the first direction DR1. For example, the fifth alignment pattern PNL-AM5’ can be spaced apart from the fourth alignment pattern PNL-AM4’ in a plan view with respect to the fourth film pad COF-P4 interposed between the fifth alignment pattern PNL-AM5’ and the fourth alignment pattern PNL-AM4’.

[0269] For example, the seventh alignment pattern PNL-AM7' can be disposed between the fifth film pad COF-P5 and the sixth film pad COF-P6. The eighth alignment pattern PNL-AM8' can be disposed between the sixth film pad COF-P6 and the seventh film pad COF-P7. The ninth alignment pattern PNL-AM9' can be disposed between the seventh film pad COF-P7 and the eighth film pad COF-P8. The sixth alignment pattern PNL-AM6' can be spaced apart from the seventh alignment pattern PNL-AM7' in the first direction DR1. For example, the sixth alignment pattern PNL-AM6' can be spaced apart from the seventh alignment pattern PNL-AM7' in a plan view with respect to the fifth film pad COF-P5 interposed between the sixth alignment pattern PNL-AM6' and the seventh alignment pattern PNL-AM7'. The tenth alignment pattern PNL-AM10' can be spaced apart from the ninth alignment pattern PNL-AM9' in a direction opposite to the first direction DR1. For example, the tenth alignment pattern PNL-AM10' can be spaced apart from the ninth alignment pattern PNL-AM9' in a plan view with respect to the eighth film pad COF-P8 interposed between the tenth alignment pattern PNL-AM10' and the ninth alignment pattern PNL-AM9'.

[0270] As described above, in the case where the COF is attached to the substrate SUB in a contracted or expanded state, the position of the COF can be adjusted. For example, in the case where the COF is expanded, the COF can be moved in the second direction DR2. Thereafter, it can be necessary to check whether the plurality of substrate pads and the plurality of film pads are respectively aligned. For example, it is necessary to check whether the position of the COF is adjusted.

[0271] By measuring the separation distance between the first alignment pattern PNL-AM1' and the first film pad COF-P1 and the separation distance between the second alignment pattern PNL-AM2' and the first film pad COF-P1, it can be checked whether the position of the COF is adjusted.

[0272] By measuring the separation distance between the second alignment pattern PNL-AM2' and the second film pad COF-P2 and the separation distance between the third alignment pattern PNL-AM3' and the second film pad COF-P2, it can be checked whether the position of the COF is adjusted.

[0273] By measuring the separation distance between the third alignment pattern PNL-AM3' and the third film pad COF-P3 and the separation distance between the fourth alignment pattern PNL-AM4' and the third film pad COF-P3, it can be checked whether the position of the COF is adjusted.

[0274] By measuring the separation distance between the fourth alignment pattern PNL-AM4' and the fourth film pad COF-P4 and the separation distance between the fifth alignment pattern PNL-AM5' and the fourth film pad COF-P4, it can be checked whether the position of the flip chip film COF is adjusted.

[0275] By measuring the separation distance between the sixth alignment pattern PNL-AM6' and the fifth film pad COF-P5 and the separation distance between the seventh alignment pattern PNL-AM7' and the fifth film pad COF-P5, it can be checked whether the position of the flip chip film COF is adjusted.

[0276] By measuring the separation distance between the seventh alignment pattern PNL-AM7' and the sixth film pad COF-P6 and the separation distance between the eighth alignment pattern PNL-AM8' and the sixth film pad COF-P6, it can be checked whether the position of the flip chip film COF is adjusted.

[0277] By measuring the separation distance between the eighth alignment pattern PNL-AM8' and the seventh film pad COF-P7 and the separation distance between the ninth alignment pattern PNL-AM9' and the seventh film pad COF-P7, it can be checked whether the position of the flip chip film COF is adjusted.

[0278] By measuring the separation distance between the ninth alignment pattern PNL-AM9' and the eighth film pad COF-P8 and the separation distance between the tenth alignment pattern PNL-AM10' and the eighth film pad COF-P8, it can be checked whether the position of the flip chip film COF is adjusted.

[0279] A display device (e.g., a display device DD) according to an embodiment can be applied to various electronic devices. An electronic device according to an embodiment can include the above-described display device, and in addition to the display device, can include a module or a device having other additional functions. Figure 1 A display device (e.g., a display device DD) according to an embodiment can be applied to various electronic devices. An electronic device according to an embodiment can include the above-described display device, and in addition to the display device, can include a module or a device having other additional functions.

[0280] Figure 21 FIG. 1 is a schematic block diagram illustrating an electronic device according to an embodiment.

[0281] Referring to FIG. 1, Figure 21 An electronic device 10 according to an embodiment can include a display module 11, a processor 12, a memory 13, and a power module 14.

[0282] The processor 12 can include at least one of a central processing unit ("CPU"), an application processor ("AP"), a graphics processing unit ("GPU"), a communication processor ("CP"), an image signal processor ("ISP"), and a controller.

[0283] Data information required for the operation of the processor 12 or the display module 11 can be stored in the storage 13. In the case where the processor 12 executes an application program stored in the storage 13, an image data signal and / or an input control signal are transmitted to the display module 11, and the display module 11 can process the received signal and output image information through a display screen.

[0284] The power module 14 can include a power supply module such as a power adapter or a battery device and a power conversion module that converts power supplied by the power supply module to generate power required for the operation of the electronic device 10.

[0285] At least one of the components of the above-described electronic device 10 can be included in a display device according to the above-described embodiments. Furthermore, some of the respective modules functionally included in one module can be included in the display device, and other modules can be provided separately from the display device. For example, the display device can include the display module 11, and the processor 12, the storage 13, and the power module 14 can be provided in the form of another device other than the display device in the electronic device 10.

[0286] Figure 22 is a schematic view of an electronic device according to various embodiments.

[0287] Referring to Figure 22 Various electronic devices to which the display device according to the embodiments is applied can not only include an electronic device for image display such as a smart phone 10_1a, a tablet PC 10_1b, a laptop computer 10_1c, a TV 10_1d, and / or a desktop monitor 10_1e, etc., but also include a wearable electronic device including a display module such as smart glasses 10_2a for virtual reality (VR), mixed reality (MR), and augmented reality (AR), a head-mounted display 10_2b, and / or a smart watch 10_2c, etc., and a vehicle electronic device 10_3 including a display module such as an instrument panel of a vehicle, a center instrument panel, a central information display ("CID") provided on the instrument panel, and / or a rearview mirror display in a vehicle, etc.

[0288] The present disclosure can be applied to various display devices. For example, the present disclosure is applicable to various display devices such as a display device for a vehicle, a ship, and an aircraft, a portable communication device, a display device for exhibition or information transmission, and a medical display device, etc.

[0289] The foregoing is a summary of embodiments and should not be construed as a limitation. Although several embodiments have been described, it will be understood by those skilled in the art that many modifications can be made to the embodiments without departing from the novel teachings and advantages of the present inventive concept. Accordingly, all such modifications are intended to be included within the scope of the present inventive concept as defined in the claims. It is therefore understood that the foregoing is a description of various embodiments and should not be construed to limit the disclosed embodiments, and that modifications to the disclosed embodiments, as well as other embodiments, are intended to be included within the scope of the appended claims.

Claims

1. A display device, wherein, The display device includes: a substrate including a display area and a pad area spaced apart from the display area, a plurality of pixels disposed in the display area; a first substrate pad disposed on the substrate in the pad area and forming a first tilt angle with respect to an edge of the substrate to have a tilted shape; a substrate alignment mark disposed on the substrate in the pad area and adjacent to the first substrate pad; a first alignment pattern disposed on the substrate in the pad area and disposed below the first substrate pad in a plan view; and a flip chip film attached to one side of the substrate, the flip chip film including: a first film pad overlapping the first substrate pad in at least a portion of the pad area in a plan view and forming a second tilt angle with respect to the edge of the substrate to have a tilted shape; and a film alignment mark adjacent to the first film pad.

2. The display device according to claim 1, wherein The first tilt angle and the second tilt angle are equal to each other.

3. The display device according to claim 1, wherein The first alignment pattern forms a third tilt angle with respect to the edge of the substrate to have a tilted shape, and The third tilt angle and the first tilt angle are equal to each other.

4. The display device according to claim 1, wherein The substrate alignment mark is adjacent to the first substrate pad in a first direction, and The film alignment mark is adjacent to the first film pad in the first direction.

5. The display device of claim 4, wherein, The first alignment pattern is adjacent to the first film pad in the first direction in a plan view.

6. The display device of claim 5, wherein, The display device further includes: a second alignment pattern spaced apart from the first alignment pattern in a plan view and the first film pad is disposed between the second alignment pattern and the first alignment pattern.

7. The display device of claim 6, wherein, The first alignment pattern forms a third tilt angle with respect to the edge of the substrate to have a tilted shape, The second alignment pattern forms a fourth tilt angle with respect to the edge of the substrate to have a tilted shape, and The third tilt angle and the fourth tilt angle are equal to each other.

8. The display device according to claim 1, wherein The display device further includes: a second substrate pad disposed on the substrate in the pad area, disposed adjacent to the first substrate pad, and forming a third tilt angle with respect to the edge of the substrate to have a tilted shape.

9. The display device of claim 8, wherein, The flip chip film further includes a second film pad overlapping the second substrate pad in at least a portion of the pad area in a plan view and forming a fourth tilt angle with respect to the edge of the substrate to have a tilted shape, and The third tilt angle and the fourth tilt angle are equal to each other.

10. The display device of claim 9, wherein, The display device further includes: a second alignment pattern disposed on the substrate in the pad area and spaced apart from the first alignment pattern with respect to the first film pad in a plan view; a third alignment pattern disposed between the second alignment pattern and the second film pad in a plan view; and a fourth alignment pattern disposed on the substrate in the pad area and spaced apart from the third alignment pattern with respect to the second film pad in a plan view.

11. The display device of claim 10, wherein, The third alignment pattern forms a fifth tilt angle with respect to the edge of the substrate to have a tilted shape, The fourth alignment pattern forms a sixth inclination angle with respect to the edge of the substrate to have a slanted shape, and The fifth inclination angle and the sixth inclination angle are equal to each other.

12. The display device of claim 1, wherein, The first alignment pattern includes metal.

13. The display device of claim 1, wherein, The first alignment pattern is formed by removing at least a portion of an insulating layer disposed on the first substrate pad.

14. A method of manufacturing a display device, wherein, The method includes: attaching a chip on film to one side of a substrate including a display area in which a plurality of pixels are disposed and a pad area spaced apart from the display area; inspecting a substrate alignment mark disposed in the pad area on the substrate and a film alignment mark included in the chip on film to inspect whether the chip on film is swollen and whether the chip on film is shrunk; adjusting a position of the chip on film; and measuring a first separation distance between a first film pad included in the chip on film and a first alignment pattern adjacent to the first film pad, the first film pad forming a first inclination angle with respect to an edge of the substrate to have a slanted shape in at least a portion of the pad area.

15. The method of claim 14, wherein, The adjusting of the position of the chip on film includes moving the chip on film in a direction away from the substrate in a case where the chip on film is swollen.

16. The method of claim 14, wherein, The adjusting of the position of the chip on film includes moving the chip on film such that an area in which the chip on film and the substrate overlap in a plan view increases in a case where the chip on film is shrunk.

17. The method of claim 14, wherein, The first alignment pattern forms a second inclination angle with respect to the edge of the substrate to have a slanted shape, and The first inclination angle and the second inclination angle are equal to each other.

18. The method of claim 17, wherein, The method further includes: measuring a second separation distance between a second alignment pattern and the first film pad, the second alignment pattern being spaced apart from the first alignment pattern in a plan view and the first film pad being interposed between the second alignment pattern and the first alignment pattern.

19. The method of claim 18, wherein, The second alignment pattern forms a third inclination angle with respect to the edge of the substrate to have a slanted shape, and The third inclination angle and the second inclination angle are equal to each other.

20. The method of claim 14, wherein, The method further includes: adjusting the position of the chip on film additionally after the measuring of the first separation distance between the first film pad and the first alignment pattern.

21. An electronic device, comprising: The electronic device includes: a substrate including a display area in which a plurality of pixels are disposed and a pad area spaced apart from the display area; a first substrate pad disposed in the pad area on the substrate and forming a first inclination angle with respect to an edge of the substrate to have a slanted shape; a substrate alignment mark disposed in the pad area on the substrate and adjacent to the first substrate pad; a first alignment pattern disposed in the pad area on the substrate and disposed below the first substrate pad in a plan view; a chip on film attached to one side of the substrate, the chip on film including: a first film pad overlapping the first substrate pad in at least a portion of the pad area in a plan view and forming a second inclination angle with respect to the edge of the substrate to have a slanted shape; and a second film pad disposed adjacent to the first film pad in the pad area on the substrate and forming a third inclination angle with respect to the edge of the substrate to have a slanted shape. a film alignment mark adjacent to the first film pad; and a memory storing data information. 22.The electronic device of claim 21, wherein, The first and second tilt angles are equal to each other. 23.The electronic device of claim 21, wherein, The first alignment pattern forms a third tilt angle with respect to the edge of the substrate to have a tilted shape, and The third and first tilt angles are equal to each other. 24.The electronic device of claim 21, wherein, The substrate alignment mark is adjacent to the first substrate pad in a first direction, and The film alignment mark is adjacent to the first film pad in the first direction.

25. The electronic device of claim 24, wherein, The first alignment pattern is adjacent to the first film pad in a plan view in the first direction.

26. The electronic device of claim 25, wherein, The electronic device further includes: a second alignment pattern spaced apart from the first alignment pattern in a plan view and the first film pad is disposed between the second alignment pattern and the first alignment pattern.

27. The electronic device of claim 26, wherein, The first alignment pattern forms a third tilt angle with respect to the edge of the substrate to have a tilted shape, The second alignment pattern forms a fourth tilt angle with respect to the edge of the substrate to have a tilted shape, and The third and fourth tilt angles are equal to each other. 28.The electronic device of claim 21, wherein, The electronic device is at least one of a smart watch, a mobile phone, a smart phone, a portable computer, a tablet personal computer, a watch phone, a car display, smart glasses, a portable multimedia player, a navigation system, an ultra-mobile computer, a head-mounted display, a virtual reality device, a mixed reality device, and an augmented reality device.

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