Electronic device

Abstract

The invention discloses an electronic device which comprises a frame body, a loudspeaker support, a loudspeaker single body and a display screen module, the frame body is provided with a frame part and a flat plate part, the frame part surrounds the flat plate part, a first hole is formed in the frame part, a second hole is formed in the flat plate part, a channel is formed in the flat plate part, and the first hole and the second hole are communicated through the channel. One end of the channel is communicated with the first hole, the second end of the channel is communicated with the second hole, and the frame part is also provided with an antenna module; the loudspeaker support is arranged at the second hole, the loudspeaker single body is arranged on the loudspeaker support, and the loudspeaker single body transmits sound through the channel; the display screen module is arranged on the side, away from the loudspeaker single body, of the flat plate part.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] Electronic devices typically include a frame, antenna, and speaker unit. The speaker unit itself is magnetic, and if it is too close to the antenna, it will interfere with the antenna and affect its performance. To reduce the impact, there needs to be an antenna clearance between the antenna and the speaker unit (i.e., maintaining a certain amount of space around the antenna to ensure that the antenna can work properly and effectively receive or transmit signals).

[0003] However, the longer the antenna clearance requirement, the longer the corresponding frame needs to be, and the larger the size of the hole on the frame. Since the size of the speaker unit is basically fixed, the speaker unit cannot be placed. In order to meet the antenna clearance requirement, gaps are likely to appear between the speaker unit and the frame, resulting in poor sealing of the electronic equipment. Summary of the Invention

[0004] This application aims to provide an electronic device that at least solves the problem of poor sealing in existing electronic devices.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application provide an electronic device, comprising:

[0007] The frame has a frame portion and a flat plate portion. The frame portion surrounds the flat plate portion. A first hole is provided on the frame portion. A second hole is provided on the flat plate portion. A channel is provided in the flat plate portion. One end of the channel is connected to the first hole. The second end of the channel is connected to the second hole. An antenna module is also provided on the frame portion.

[0008] A speaker bracket and a speaker unit, wherein the speaker bracket is disposed at the second hole, the speaker unit is disposed on the speaker bracket, and the speaker unit transmits sound through the channel;

[0009] A display module is disposed on the side of the flat panel away from the speaker unit.

[0010] In some embodiments, a third hole is provided between the frame portion and the flat portion, and both the first hole and the third hole are in communication with the channel.

[0011] In some embodiments, the speaker bracket includes a bracket unit with a first through hole, the side of the bracket unit facing away from the display module is provided with a receiving groove, the bottom of the receiving groove is provided with the first through hole, the speaker unit is at least partially disposed in the receiving groove, and the sound output side of the speaker unit faces the first through hole.

[0012] In some embodiments, the speaker bracket further includes a first connecting portion extending from the edge of the bracket unit in a direction away from the bracket unit, the first connecting portion connecting to the flat plate portion, and the distance of the first connecting portion relative to the display module being greater than the distance of the bracket unit relative to the display module.

[0013] In some embodiments, a plurality of first limiting ribs are provided on the first side of the first connecting portion facing away from the display module, and the plurality of first limiting ribs are located at the edge of the first side near the receiving groove.

[0014] In some embodiments, the bracket unit has at least one second limiting rib on the side facing away from the display module, and the at least one second limiting rib and the plurality of first limiting ribs are arranged around the speaker unit.

[0015] In some embodiments, the second side of the bracket unit facing the display module is provided with a third limiting rib and a fourth limiting rib, the third limiting rib and the fourth limiting rib are disposed opposite to each other, and the bracket unit is connected to the flat plate part through the third limiting rib and the fourth limiting rib.

[0016] In some embodiments, the antenna module, the speaker bracket, and the speaker unit are all located on the side of the channel opposite to the display module.

[0017] In some embodiments, the electronic device further includes:

[0018] A motherboard is stacked on the side of the flat plate facing the speaker unit, and the motherboard is also provided with a second through hole through which the speaker unit passes;

[0019] A motherboard bracket is disposed on the side of the motherboard away from the flat section, and the motherboard bracket and the motherboard form a first cavity, wherein the speaker unit is at least partially disposed in the first cavity.

[0020] In some embodiments, the electronic device further includes:

[0021] The first foam is disposed between the display module and the flat panel to form a first receiving space, and the first foam is at least partially located within the first receiving space.

[0022] This embodiment adds a speaker bracket, on which the speaker unit is mounted. The speaker bracket is located at the second hole of the flat plate of the frame. By setting the speaker bracket, gaps between the speaker unit and the flat plate of the frame can be avoided, thus improving the sealing of the electronic device.

[0023] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0024] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0025] Figure 1 This is a diagram illustrating waterproof ratings;

[0026] Figure 2 This is one of the cross-sectional views of an electronic device according to an embodiment of this application;

[0027] Figure 3 This is one of the structural diagrams of a speaker unit in an electronic device according to an embodiment of this application;

[0028] Figure 4 This is a second structural diagram of a speaker unit in an electronic device according to an embodiment of this application;

[0029] Figure 5 This is a second cross-sectional view of an electronic device according to an embodiment of this application.

[0030] Figures 1 to 5Reference numerals: 100, electronic device; 101, frame; 1011, side frame; 1012, flat panel; 10111, first hole; 10112, third hole; 10121, second hole; 10122, channel; 10123, first part; 10124, second part; 102, display module; 103, antenna module; 104, speaker bracket; 1041, first through hole; 1042, bracket unit; 1043, receiving groove; 1044, first connecting part; 1045, first limiting rib; 1046, second limiting rib; 1047, third limiting rib; 1048. Fourth limiting rib; 105. Speaker unit; 106. First foam; 107. Mainboard bracket; 108. Mainboard; 109. First receiving space; 110. Battery cover; 111. First foam adhesive; 112. Second foam adhesive; 113. Third foam adhesive; 201. First double-sided adhesive; 202. Second double-sided adhesive; 1081. Second through hole; 1071. First cavity; 1072. Support part; 1073. Steel sheet; 1074. Fourth foam adhesive; 1075. Fifth foam adhesive; 1021. Cover plate; 1022. Display assembly; 1023. Third seal. Detailed Implementation

[0031] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0032] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] First, the relevant technical specifications:

[0034] If the portion of the frame near the display module is intact, the speaker unit's sound outlet channel will be inverted. Under conditions that meet the requirements for waterproofing, processing, and clearance of the battery cover, motherboard, and speaker unit, the speaker unit cannot be glued on and cannot be sealed to achieve IP68 waterproofing. IPXX waterproofing levels are also not possible. Figure 1 As shown. In related technologies:

[0035] Antenna module clearance length L1: Antenna module 103 requires ≥3.5mm;

[0036] Speaker driver length L2: Determined based on speaker driver selection;

[0037] The inverted length L3 of the frame: ≥3.5mm is required to meet waterproofing and adhesive requirements; at this time, the antenna module clearance is only 2mm; if the antenna clearance is ≥3.5mm, then L3 ≥5mm;

[0038] The length L4 of the second hole set in the frame: including the slide mold exit + mold retraction space, must be ≥ L3 + 4.6mm (mold wall thickness 4.1 + retraction distance 0.5mm);

[0039] Adhesive width L5: Under IP68 waterproof rating, L5 must be ≥ 1.6mm; it can be narrowed in some areas as long as waterproofing is achieved.

[0040] Local thickness L6 of the antenna module: To prevent deformation, it is recommended to be ≥0.5mm;

[0041] If L1+L2+L6 < L3+L4+L5, then the speaker unit cannot be placed, and the larger the size, the longer the motherboard, and the thicker the corresponding whole machine.

[0042] For example: the antenna module clearance is 3.5mm, and all other values ​​are calculated using the minimum values; L1 = 3.5mm, L2 = 10mm, L3 = 5mm, L4 = 9.6mm, L5 = 1.6mm, L6 = 0.5mm. Therefore, L1 + L2 + L6 < L3 + L4 + L5, meaning the speaker unit cannot be placed, and there is a gap between the speaker unit and the frame 101, failing to meet the overall sealing requirements. Based on this, this application provides an electronic device that avoids gaps and improves the sealing performance of the electronic device.

[0043] The following is combined Figures 2 to 5 This application describes an electronic device 100 according to an embodiment of the present application.

[0044] like Figures 2-5 As shown, an electronic device 100 includes:

[0045] The frame 101 has a frame portion 1011 and a flat plate portion 1012. The frame portion 1011 surrounds the flat plate portion 1012. A first hole 10111 is provided on the frame portion 1011. A second hole 10121 is provided on the flat plate portion 1012. A channel 10122 is provided in the flat plate portion 1012. One end of the channel 10122 communicates with the first hole 10111, and the second end of the channel 10122 communicates with the second hole 10121. An antenna module 103 is also provided on the frame portion 1011.

[0046] The speaker bracket 104 and the speaker unit 105 are provided. The speaker bracket 104 is disposed at the second hole 10121, and the speaker unit 105 is disposed on the speaker bracket 104. The speaker unit 105 transmits sound through the channel 10122.

[0047] Display module 102 is disposed on the side of the flat panel 1012 away from the speaker unit 105.

[0048] The frame 101, also known as the mid-frame, is used in the electronic device 100, which may be a mobile device or similar device. A gap exists between the antenna module 103 and the speaker unit 105 of the electronic device 100, providing clearance between the antenna module 103 and the speaker unit 105 to facilitate communication between the antenna modules 103 and 105. The speaker unit 105 can be any single unit capable of sound emission, without specific limitations, such as a loudspeaker. As an example, the length of the clearance between the antenna module 103 and the speaker unit 105 can be greater than a preset length. This preset length can be the shortest length that does not cause signal interference to the antenna module 103. For example, to avoid interference with the antenna module 103, the clearance is generally greater than 3.5 mm. The preset length can be set to 3.5 mm or a value greater than 3.5 mm, without specific limitations.

[0049] The larger the size of the speaker bracket 104, the longer the distance between the speaker unit 105 and the antenna module 103, and the longer the clearance of the antenna module 103, resulting in higher antenna signal reliability. In this embodiment, the antenna clearance length can be adjusted by adjusting the size of the speaker bracket 104 to meet the requirements for antenna clearance.

[0050] In this embodiment, the speaker bracket 104 is disposed at the second hole 10121 of the flat plate portion 1012. As an example, the side of the speaker bracket 104 facing the display module 102 is provided with a first double-sided adhesive 201. The side of the speaker bracket 104 facing the display module 102 is sealed to the edge of the flat plate portion 1012 of the frame 101 near the second hole 10121 via the first double-sided adhesive 201. The side of the speaker bracket 104 facing away from the display module 102 is provided with a second double-sided adhesive 202. The side of the speaker bracket 104 facing away from the display module 102 is sealed to the speaker unit 105 via the second double-sided adhesive 202, thereby improving the sealing performance of the electronic device 100. As an example, the frame portion 1011 and the flat plate portion 1012 are integrally formed.

[0051] This embodiment adds a speaker bracket 104, on which a speaker unit 105 is mounted. The speaker bracket 104 is located at the second hole 10121 of the flat plate portion 1012 of the frame 101. Since the size of the speaker bracket 104 can be designed according to the size of the second hole 10121 and the size of the speaker unit 105, the speaker bracket 104 can prevent gaps between the speaker unit 105 and the flat plate portion 1012 of the frame 101, thus improving the sealing performance of the electronic device 100. Simultaneously, with the addition of the speaker bracket 104 and the speaker unit 105 mounted on it, the position of the speaker unit 105 can be adjusted according to changes in the size of the speaker bracket 104, allowing for greater flexibility and meeting various needs, such as molding requirements, waterproofing requirements, and clearance requirements for the antenna module 103.

[0052] In some embodiments, a third hole 10112 is further provided between the frame portion 1011 and the flat portion 1012, and both the first hole 10111 and the third hole 10112 are connected to the channel 10122. This allows the speaker unit 105 to transmit sound through the channel 10122, the first hole 10111, and the third hole 10112.

[0053] As an example, the flat panel 1012 has a first portion 10123 and a second portion 10124. A channel 10122 is formed between the first portion 10123 and the second portion 10124, and a second hole 10121 is also formed between the first portion 10123 and the second portion 10124. The display module 102 is disposed on the side of the second portion 10124 away from the speaker unit 105. A third hole 10112 is formed between the frame portion 1011 and the second portion 10124. As an example, the second portion 10124 is a complete structure, integrally formed. The second portion 10124 does not have any through holes. The projection of the second portion 10124 on the display module 102 is complete and there are no blanks. Therefore, the second portion 10124 can also be called a complete main body. The second portion 10124 is sealed to the display module 102 by a third seal 1023. As an example, the display module 102 includes a cover plate 1021 and a display component 1022. A second part 10124 is sealed to the cover plate 1021 via a third sealant 1023, and the second part 10124 and the cover plate 1021 form a first receiving space 109. The display component 1022 is at least partially located within the first receiving space 109. As an example, the third sealant 1023 can be a sealant, that is, the second part 10124 is bonded to the display module 102 via the third sealant 1023. It can be adhesive, surface adhesive, etc., without specific limitation. As an example, it can be bonded by adhesive dispensing.

[0054] In some embodiments, the speaker bracket 104 includes a bracket unit 1042 having a first through hole 1041. The bracket unit 1042 has a receiving groove 1043 on the side facing away from the display module 102. The bottom of the receiving groove 1043 has the first through hole 1041. The speaker unit 105 is at least partially disposed in the receiving groove 1043, and the sound output side of the speaker unit 105 faces the first through hole 1041.

[0055] By providing a receiving groove 1043 on the side of the bracket unit 1042 facing away from the display module 102, the bracket unit 1042 is assembled with the speaker unit 105 through the receiving groove 1043, which prevents the speaker unit 105 from sliding and improves the stability of the electronic device 100. In addition, the aforementioned first through hole 1041 is provided at the bottom of the groove. The first through hole 1041 communicates with the first channel 10122, and the sound output side of the speaker unit 105 faces the first through hole 1041, so that the speaker unit 105 can transmit sound through the first through hole 1041 and the first channel 10122.

[0056] As an example, the bottom of the receiving groove 1043 is sealed to the speaker unit 105. For example, a second double-sided adhesive 202 is disposed on the bottom of the receiving groove 1043, and the bottom of the receiving groove 1043 is sealed to the speaker unit 105 through the second double-sided adhesive 202, thereby achieving a sealed connection between the speaker bracket 104 and the speaker unit 105 and improving the sealing performance of the electronic device 100.

[0057] In some embodiments, the speaker bracket 104 further includes a first connecting portion 1044, which extends from the edge of the bracket unit 1042 in a direction away from the bracket unit 1042. The first connecting portion 1044 is connected to the flat plate portion 1012, and the distance between the first connecting portion 1044 and the display module 102 is greater than the distance between the bracket unit 1042 and the display module 102.

[0058] As an example, the first connecting portion 1044 is sealed to the flat plate portion 1012, for example, improving the sealing performance of the electronic device 100. As an example, the first connecting portion 1044 connects to the first portion 10123 of the flat plate portion 1012 to achieve the connection between the first connecting portion 1044 and the flat plate portion 1012. As an example, the first connecting portion 1044 is sealed to the first portion 10123 of the flat plate portion 1012, for example, the first connecting portion 1044 is sealed to the first portion 10123 via a first double-sided adhesive 201, and the bracket unit 1042 is also sealed to the second portion 10124 via the first double-sided adhesive 201.

[0059] In some embodiments, the first connecting portion 1044 is provided with a plurality of first limiting ribs 1045 on the first side facing away from the display module 102, and the plurality of first limiting ribs 1045 are located at the edge of the first side near the receiving groove 1043.

[0060] By providing a plurality of first limiting ribs 1045 at the edge position of the first surface of the first connecting portion 1044 near the receiving groove 1043, and with the speaker unit 105 at least partially disposed within the receiving groove 1043, the plurality of first limiting ribs 1045 can limit the speaker unit 105, preventing the speaker unit 105 from sliding and improving the reliability and stability of the electronic device 100. As an example, the first limiting ribs 1045 extend from the edge position in a first direction, the first direction being perpendicular to the first surface.

[0061] In some embodiments, at least one second limiting rib 1046 is provided on the side of the bracket unit 1042 facing away from the display module 102, and the at least one second limiting rib 1046 and the plurality of first limiting ribs 1045 are arranged around the speaker unit 105.

[0062] In addition to providing a first limiting rib 1045 on the side of the first connecting portion 1044 facing away from the display module 102, at least one second limiting rib 1046 can also be provided on the side of the bracket unit 1042 facing away from the display module 102. This increases the number of limiting ribs used to limit the speaker unit 105. At least one second limiting rib 1046 and the plurality of first limiting ribs 1045 are arranged around the speaker unit 105, which improves the limiting effect on the speaker unit 105, prevents the speaker unit 105 from sliding, and improves the reliability and stability of the electronic device 100.

[0063] In some embodiments, the second side of the bracket unit 1042 facing the display module 102 is provided with a third limiting rib 1047 and a fourth limiting rib 1048, the third limiting rib 1047 and the fourth limiting rib 1048 are disposed opposite to each other, and the bracket unit 1042 is connected to the flat plate portion 1012 through the third limiting rib 1047 and the fourth limiting rib 1048.

[0064] Specifically, a third limiting rib 1047 and a fourth limiting rib 1048 are provided on the second surface of the display module 102. The bracket unit 1042 is connected to the flat plate portion 1012 through the third limiting rib 1047 and the fourth limiting rib 1048, thereby limiting the bracket unit 1042. Furthermore, the third limiting rib 1047 and the fourth limiting rib 1048 are arranged opposite to each other to enhance the limiting effect. In this way, the bracket unit 1042 can be prevented from sliding, thereby improving the reliability and stability of the electronic device 100.

[0065] As an example, the bracket unit 1042 is engaged with the flat plate portion 1012 by the third limiting rib 1047 and the fourth limiting rib 1048, which improves the limiting effect of the bracket unit 1042, prevents the bracket unit 1042 from sliding, and improves the reliability and stability of the electronic device 100.

[0066] In some embodiments, the antenna module 103, the speaker bracket 104, and the speaker unit 105 are all located on the side of the channel 10122 opposite to the display module 102.

[0067] That is, the antenna module 103, the speaker bracket 104 and the speaker unit 105 are all located on the same side of the channel 10122. The position of the speaker unit 105 can be adjusted by the speaker bracket 104 to meet the clearance requirements of the antenna module 103 and the speaker unit 105.

[0068] In some embodiments, the electronic device 100 further includes:

[0069] The motherboard 108 is stacked on the side of the flat plate 1012 facing the speaker unit 105, and the motherboard 108 is also provided with a second through hole 1081 through which the speaker unit 105 passes.

[0070] A motherboard bracket 107 is disposed on the side of the motherboard 108 away from the flat plate portion 1012. The motherboard bracket 107 and the motherboard 108 form a first cavity 1071. The speaker unit 105 is at least partially disposed in the first cavity 1071.

[0071] That is, the motherboard bracket 107 and the motherboard 108 enclose a first cavity 1071 to provide a placement space for the speaker unit 105. The speaker unit 105 passes through a second through hole 1081 provided on the motherboard 108. The first cavity 1071 is connected to the second through hole 1081, and the second through hole 1081 is also connected to the first through hole 1041. In this way, the speaker unit 105 can pass through the second through hole 1081 and be located in the cavity formed by the first cavity 1071, the second through hole 1081 and the first through hole 1041, so that the speaker unit 105 can be placed.

[0072] As an example, the side of the motherboard 108 facing away from the display module 102 is sealed to the motherboard bracket 107, and the side of the motherboard 108 facing the display module 102 is sealed to the flat portion 1012 of the frame 101. The motherboard bracket 107, the motherboard 108, the frame 101, the speaker bracket 104, and the upward-facing unit form a first sealed space, improving the sealing performance of the electronic device 100. There are various ways to seal the motherboard 108 to the motherboard bracket 107 and to the flat portion 1012 of the frame 101. For example, sealing can be achieved by gluing, sealing can be achieved by a sealing ring, or sealing can be achieved by welding or hot-melt connection. This application does not make specific limitations. For example, as an example, sealing can be achieved by gluing. On the one hand, gluing is convenient for operation, and on the other hand, it can save sealing costs. As an example, there are various bonding methods, such as spot bonding, surface bonding, double-sided bonding, or foam adhesive, without specific limitations. For instance, in this embodiment, foam adhesive can be used to bond the side of the motherboard 108 facing away from the display module 102 to the motherboard bracket 107, and the side of the motherboard 108 facing the display module 102 to the flat portion 1012 of the frame 101. As an example, the side of the motherboard 108 facing away from the display module 102 is sealed to the motherboard bracket 107 using a first foam adhesive 111, and the side of the motherboard 108 facing the display is sealed to the flat portion 1012 of the frame 101 using a second foam adhesive 112.

[0073] In some embodiments, the electronic device 100 further includes:

[0074] The first foam 106 is disposed between the display module 102 and the flat plate portion 1012 to form a first receiving space 109, and the first foam 106 is at least partially located within the first receiving space 109.

[0075] In this embodiment, a first foam 106 is provided between the display module 102 and the flat panel 1012 to provide cushioning and shock absorption for the display module 102. Furthermore, the first foam 106 and the flat panel 1012 require pre-compression design, such as an interference fit, to prevent delamination of the frame adhesive. As an example, the display module 102 and the second portion 10124 of the flat panel 1012 form a first receiving space 109, and the first foam 106 and the second portion 10124 of the flat panel 1012 are interference-fitted.

[0076] In some embodiments, the electronic device 100 further includes:

[0077] The battery cover 110 is located on the side of the motherboard bracket 107 facing away from the speaker unit 105. The battery cover 110 is disposed on the frame portion 1011. The battery cover 110, the frame portion 1011, the motherboard 108, and the motherboard bracket 107 form a second cavity.

[0078] As an example, the battery cover 110 is sealed to the frame portion 1011, and the second cavity can be a sealed cavity. This further improves the sealing performance of the electronic device 100, preventing liquid from flowing into the electronic device 100 from between the battery cover 110 and the frame portion 1011, thus enhancing its waterproof function. There are various ways to seal the battery cover 110 and the frame portion 1011. For example, sealing can be achieved through gluing, sealing rings, welding, or hot-melt connection. This application does not impose specific limitations. For example, as an example, sealing can be achieved through gluing. As an example, there are various gluing methods, such as dot adhesive, surface adhesive, double-sided adhesive, or foam adhesive. No specific limitations are imposed. For example, as an example, in this embodiment, foam adhesive can be used to glue the battery cover 110 to the frame portion 1011. As an example, the battery cover 110 is sealed to the frame portion 1011 by a third foam adhesive 113.

[0079] In some embodiments, the motherboard bracket 107 has a support portion 1072 and a steel plate 1073. The steel plate 1073 is connected to the support portion 1072, and the steel plate 1073 is connected to the speaker unit 105 via a fourth foam adhesive 1074. The support portion 1072 is connected to the speaker unit 105 via a fifth foam adhesive 1075. The steel plate 1073, while ensuring the strength of the motherboard bracket 107, can reduce the thickness of the motherboard bracket 107, thus reserving more space for accommodating the speaker unit 105.

[0080] The above-described electronic device 100 will be described in detail below with some specific embodiments. Taking the first channel 10122 as the sound output channel 10122 and the speaker unit 105 as a speaker or unit as an example, the description will be carried out.

[0081] This application provides an electronic device 100. To enhance product competitiveness, the electronic device 100 is generally equipped with dual speakers and IP68 waterproofing. Figure 5 As shown, the complete frame of the upward-sloping section (101+), the upward-sloping section, the integrated plastic middle frame, and the IP68 waterproof design are as follows:

[0082] The design of the complete frame 101 at the upward position: The display module 102 (e.g., an organic light-emitting diode (GOLED) screen) needs to be waterproofed by applying adhesive around its perimeter. In order to prevent the adhesive from delaminating, the display module 102 has its own foam and the second part 10124 of the frame 101 need to be pre-pressed (interference fit). Therefore, the second part 10124 of the frame 101 at the upward position needs to be complete. If other screens are designed as a complete frame 101 at this position due to reliability issues, they may also be designed as complete frames 101.

[0083] Semi-sealed speaker unit 105 design: The groove of the frame 101 is connected to the first channel 10122 to form a second cavity (i.e., the front cavity sound outlet channel 10122). At least part of the speaker unit 105 is located in the groove. The speaker unit 105, the main board 108, the main board bracket 107, and the frame 101 are sealed to form an upward rear cavity.

[0084] Integrated plastic frame antenna module 103 design: The frame 101 is made of metal and serves as the body of the antenna module 103. The speaker unit 105 itself is magnetic. If it is too close, it will interfere with the antenna module 103 and affect the performance of the antenna module 103. The requirements for the antenna module 103 are increasing. The clearance of the antenna module 103 needs to be more than 3.5mm.

[0085] IP68 waterproof: No dust particles can enter. It can withstand prolonged immersion in water under certain pressure. It requires high sealing performance of the whole machine. The adhesive width is greater than IP68 / IP65. The battery cover 110 side is waterproofed by bonding it to the frame 101 with the first foam adhesive 111. The display module 102 is waterproofed by bonding it to the frame 101 with glue. The front cavity channel 10122 is waterproofed by double-sided adhesive, thus achieving waterproofing of the whole machine.

[0086] In addition, this application adds a speaker bracket 104. By adding the speaker bracket 104, the frame 101 and the unit are glued to both sides of the speaker bracket 104 respectively. Compared with the conventional solution of gluing the unit to the frame 101, the position of the unit is more flexible and can be adjusted according to the size of the bracket to meet different needs (such as demolding requirements, waterproofing, and clearance of the antenna module 103). According to the above example, by introducing the speaker bracket 104, a clearance of 3.5mm antenna module 103 can be achieved, while meeting IP68 waterproofing and demolding requirements. The speaker bracket 104 adds limiting ribs to ensure the reliability of unit bonding and assembly.

[0087] This application provides a method to meet the requirements of clearance, IP68 waterproofing, and row-position molding of the upward-facing antenna module 103 by adding a speaker bracket 104. Specifically, when the conventional solution L1+L2+L6 < L3+L4+L5, the conventional solution cannot bond the frame 101 to the unit and achieve waterproofing. By adding the speaker bracket 104, the space of L1 increases while L3 and L4 remain unchanged, achieving L1+L2+L6 > L3+L4+L5. The overall cross-sectional view is shown below. Figure 5 As shown, the specific implementation method is as follows:

[0088] The speaker unit 105 is attached to the speaker bracket 104 with double-sided adhesive, and the speaker bracket 104 is attached to the frame 101 with double-sided adhesive, thereby achieving waterproofing at the location of the speaker unit 105. The electronic device 100 is also waterproofed through the third foam adhesive 113 of the battery cover 110 and the first foam adhesive 111 on both sides of the motherboard 108. Compared with the related technology where the speaker unit is waterproofed through the frame 101, it is waterproofed through the speaker bracket 104. Since the waterproof width requirement remains unchanged, the undercut space of the frame 101 remains unchanged, and thus the requirements for the mold release and demolding space remain unchanged, and can be designed to the minimum value. Taking the net clearance of the antenna module 103 as an example of 3.5mm, L1=3.5mm, L2=10mm, L3=3.5mm, L4=8.1mm, L5=1.6mm, L6=0.5mm, L1+L2+L6>L3+L4+L5. There will be no problem that the speaker unit cannot be sealed and waterproofed after the conventional solution of sticking the speaker unit to the frame 101, in order to meet the net clearance of the antenna module 103 of 3.5mm, the undercut space and demolding space are increased. Furthermore, to save space in the Z-direction (direction perpendicular to the display module 102), the side of the first connecting part 1044 of the speaker bracket 104 facing away from the display module 102 is not glued. Since the motherboard bracket 107-motherboard 108-frame 101 has been sealed, this position already meets the waterproof requirements. The side of the first connecting part 1044 of the speaker bracket 104 facing the display module 102 is glued to prevent water from entering the whole machine from the front cavity channel 10122.

[0089] Additionally, the design diagram of speaker bracket 104 is as follows: Figure 3-4 As shown, limiting ribs are added to both the side facing away from the display module 102 and the side facing the display module 102 to improve the bonding reliability and stability of the speaker bracket 104 with the frame 101 and the speaker unit 105, prevent the speaker bracket 104 from being misaligned and causing poor sealing, thereby improving waterproof performance while ensuring upward performance.

[0090] This application provides a design that adds a speaker bracket 104 to the frame 101 with a complete integrated plastic frame corresponding to the upward position. The bracket position is locked by adding a limiting rib, and the frame 101 and the speaker unit 104 are bonded together by the speaker bracket 104, which meets the requirements of IP68, antenna module 103 clearance, and upward position processing.

[0091] Other configurations and operations of the mobile terminal according to the embodiments of this application are known to those skilled in the art and will not be described in detail here.

[0092] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0093] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, include: The frame has a frame portion and a flat plate portion. The frame portion surrounds the flat plate portion. A first hole is provided on the frame portion. A second hole is provided on the flat plate portion. A channel is provided in the flat plate portion. One end of the channel is connected to the first hole. The second end of the channel is connected to the second hole. An antenna module is also provided on the frame portion. A speaker bracket and a speaker unit, wherein the speaker bracket is disposed at the second hole, the speaker unit is disposed on the speaker bracket, and the speaker unit transmits sound through the channel; A display module is disposed on the side of the flat panel away from the speaker unit.

2. The electronic device according to claim 1, characterized in that, A third hole is provided between the frame portion and the flat plate portion, and both the first hole and the third hole are connected to the channel.

3. The electronic device according to claim 1, characterized in that, The speaker bracket includes a bracket unit with a first through hole. The side of the bracket unit facing away from the display module is provided with a receiving groove. The bottom of the receiving groove is provided with the first through hole. The speaker unit is at least partially disposed in the receiving groove, and the sound output side of the speaker unit faces the first through hole.

4. The electronic device according to claim 3, characterized in that, The speaker bracket further includes a first connecting portion, which extends from the edge of the bracket unit in a direction away from the bracket unit. The first connecting portion connects to the flat panel, and the distance between the first connecting portion and the display module is greater than the distance between the bracket unit and the display module.

5. The electronic device according to claim 4, characterized in that, The first connecting part has a plurality of first limiting ribs on its first side facing away from the display module. The plurality of first limiting ribs are located on the first side near the edge of the receiving groove.

6. The electronic device according to claim 5, characterized in that, The bracket unit has at least one second limiting rib on the side facing away from the display module, and the at least one second limiting rib and the plurality of first limiting ribs are arranged around the speaker unit.

7. The electronic device according to claim 3, characterized in that, The bracket unit has a third limiting rib and a fourth limiting rib on its second side facing the display module. The third limiting rib and the fourth limiting rib are arranged opposite to each other. The bracket unit is connected to the flat plate part through the third limiting rib and the fourth limiting rib.

8. The electronic device according to claim 1, characterized in that, The antenna module, the speaker bracket, and the speaker unit are all located on the side of the channel opposite to the display module.

9. The electronic device according to any one of claims 1-8, characterized in that, The electronic device also includes: A motherboard is stacked on the side of the flat plate facing the speaker unit, and the motherboard is also provided with a second through hole through which the speaker unit passes; A motherboard bracket is disposed on the side of the motherboard away from the flat section, and the motherboard bracket and the motherboard form a first cavity, wherein the speaker unit is at least partially disposed in the first cavity.

10. The electronic device according to claim 1, characterized in that, The electronic device also includes: The first foam is disposed between the display module and the flat panel to form a first receiving space, and the first foam is at least partially located within the first receiving space.

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