High-strength printed circuit board

Abstract

The invention relates to the technical field of circuit boards, and discloses a high-strength printed circuit board, through the synergistic effect of an adjusting mechanism and a buffer mechanism, the vibration resistance and impact resistance are effectively improved, in the adjusting mechanism, a soft column is bent to drive hydraulic oil in an adjusting bag to drive an arc-shaped telescopic rod to stretch, and the vibration resistance and impact resistance are improved. An adjusting gear ring rotates through transmission of an adjusting rod, an adjusting ring and the like, then a first rifle sleeve drives a first rifle ring to stretch and compress an adjusting spring, the bending strength of the soft column is dynamically improved, the vibration difference caused by uneven weights of components is balanced, a damping ring can prevent the adjusting gear ring from rotating, and a preset structure can adjust the initial anti-vibration state. The buffer mechanism is linked with the adjusting gear ring through the clamping shell, during impact, a buffer rack is driven to enable a second rifle sleeve to rotate, a second rifle ring and an air ring are driven to move to enable a buffer air bag to expand to abut against the periphery of the circuit board, flexible protection is formed, meanwhile, the modular design is convenient to install and maintain, and multiple scenes are adapted.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, specifically to a high-strength printed circuit board. Background Technology

[0002] Circuit boards are the core connection and support carriers of electronic devices, playing a crucial role in the electrical interconnection, physical fixation, and signal transmission of components. Through conductive lines on the substrate, they connect electronic components such as resistors, capacitors, and chips in an orderly manner to form a complete circuit system, realizing functions such as current distribution, signal processing, and energy conversion. Whether in consumer electronics, industrial equipment, or high-end fields such as automobiles and aerospace, all rely on circuit boards to build a stable electronic architecture. Their design must take into account the rationality of the circuit layout, reduce signal interference and energy loss, and ensure circuit safety isolation through the insulating substrate. Standardized dimensions and interfaces also simplify equipment assembly and maintenance processes, promoting the miniaturization and integration of electronic devices. They are the basic platform for modern electronic technology to achieve functional integration and efficient operation.

[0003] However, existing printed circuit boards are subject to vibration and impact when used in high-intensity environments, which can easily lead to a series of chain damages: continuous vibration causes the solder joints between components and the substrate to be subjected to alternating stress. In particular, heavy components are prone to fatigue cracking and pad detachment due to their large inertial forces, resulting in circuit breakage. Specifically, different component weights can lead to different impact forces on both sides of the printed circuit board. Uneven weight distribution can lead to differences in stress distribution, which indirectly leads to localized impact concentration on the printed circuit board, which can easily cause the substrate to bend, delaminate, or even deform as a whole.

[0004] Meanwhile, severe impacts may directly tear the substrate or break metallized vias, damaging interlayer connections. Vibration can also increase the relative friction between components and the printed circuit board, wear down the pin plating, and cause poor contact. Furthermore, existing printed circuit board protection devices installed on the circuit board will further aggravate the vibration and impact of the circuit board. Therefore, we propose a high-strength printed circuit board. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the present invention provides a high-strength printed circuit board with advantages such as self-adjustment, and solves a series of problems such as the circuit board being easily damaged in high-strength environments.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a high-strength printed circuit board, comprising,

[0007] A high-strength device, comprising a mounting housing, wherein a circuit board is fixedly connected to the top of the mounting housing;

[0008] An adjustment mechanism is threadedly connected to the top of the mounting housing, and the circuit board is threadedly connected to the top of the adjustment mechanism. The adjustment mechanism includes an adjustment base shell threadedly connected to the top of the mounting housing. A first flange is slidably connected inside the adjustment base shell. A flexible column is fixedly connected to the top of the adjustment base shell. An adjustment bladder is fixedly connected inside the flexible column. The adjustment bladder is filled with hydraulic oil. The adjustment bladder can drive the first flange to slide inside the adjustment base shell. The top of the first flange extends into the interior of the flexible column. An adjustment spring is fixedly connected to the top of the first flange. The top of the adjustment spring is fixedly connected to the top of the inner wall of the flexible column.

[0009] A buffer mechanism includes a buffer shell threaded onto the top of a mounting housing, a buffer airbag connected to the top of the buffer shell, the outer side of the buffer airbag being adapted to the outer periphery of a circuit board, and an adjustable bladder capable of driving the buffer airbag to expand and abut against the outer side of the circuit board.

[0010] Preferably, the adjustment mechanism further includes an arc-shaped telescopic rod fixedly connected to the inner wall of the adjustment base, the top of the arc-shaped telescopic rod being connected to the bottom of the adjustment chamber, the telescopic end of the arc-shaped telescopic rod being rotatably connected to an adjustment rod, the bottom of the adjustment rod being rotatably connected to an adjustment ring, the adjustment ring being rotatably connected to the inner wall of the adjustment base, and the outer side of the adjustment base being rotatably connected to a first riveting ring.

[0011] Preferably, the outer side of the adjusting ring is provided with a plurality of first adjusting grooves, a retaining spring is fixedly connected inside the first adjusting groove, a retaining block is fixedly connected to one end of the retaining spring, the retaining block is slidably connected inside the first adjusting groove, an adjusting gear ring is rotatably connected inside the adjusting base shell, a plurality of second adjusting grooves are provided inside the adjusting gear ring, and one end of the plurality of retaining blocks is adapted to the plurality of second adjusting grooves.

[0012] Preferably, a damping ring is fixedly connected to the inner wall of the adjusting base, the outer side of the damping ring is fixedly connected to the inner side of the adjusting gear ring, and a first rifle sleeve is rotatably connected to the inner side of the adjusting gear ring. The inner side of the first rifle sleeve meshes with the outer side of the adjusting gear ring, and the first rifle ring is threaded into the inner side of the first rifle sleeve.

[0013] Preferably, a preset pad is slidably connected inside the adjusting base shell, a preset positioning groove is provided on the outside of the adjusting base shell, a preset ring is threaded onto the outside of the adjusting base shell, a preset groove is provided inside the preset ring, the preset pad passes through the preset positioning groove and is slidably connected inside the preset ring through the preset groove, and the top of the preset pad abuts against the bottom of the first rifle sleeve.

[0014] Preferably, a first fixing bolt is threaded onto the bottom of the inner wall of the adjusting base, the first fixing bolt is threaded onto the top of the circuit board, an adjusting top shell is fixedly connected to the top of the flexible column, an mounting bolt is threaded onto the top of the adjusting top shell, the mounting bolt is threaded onto the inside of the circuit board, a protective gasket is fixedly connected to the top of the adjusting top shell, and the top of the protective gasket abuts against the bottom of the circuit board.

[0015] Preferably, the buffer mechanism further includes a retaining case snapped onto one side of the adjusting base shell, a buffer rack slidably connected to the top of the retaining case, the buffer rack engaging with the outside of the adjusting gear ring, a second rifle sleeve rotatably connected inside the buffer shell, the buffer rack engaging with the buffer rack, a second rifle ring threadedly connected to the inside of the second rifle sleeve, the second rifle ring slidably connected inside the buffer shell, and an air ring fixedly connected to the top of the second rifle ring, the air ring being airtightly slidably connected inside the buffer shell.

[0016] Preferably, a buffer block is fixedly connected to the inner wall of the buffer shell, a buffer groove is provided inside the second riveting ring, the buffer block is slidably connected inside the buffer groove, and a second fixing bolt is threaded to the bottom of the buffer shell, and the second fixing bolt is threaded to the top of the mounting shell.

[0017] Compared with the prior art, the present invention provides a high-strength printed circuit board with the following advantages:

[0018] 1. This invention, through the hydraulic drive of the adjusting bladder in the adjusting mechanism and the elastic cooperation of the adjusting spring, can change the bending strength of the soft column in real time according to the vibration state of the circuit board. It can dynamically balance the stress distribution to address the difference in vibration frequency on both sides caused by uneven component weight, avoid local resonance and stress concentration, reduce problems such as solder joint fatigue cracking and substrate delamination, and improve the structural stability under vibration environment.

[0019] 2. This invention uses the buffer rack and adjusting gear ring of the buffer mechanism to drive the buffer airbag to expand rapidly and abut against the outer periphery when the circuit board is impacted. This absorbs the impact energy through the deformation of the airbag and avoids the drawback of traditional protective devices that aggravate vibration. It forms a flexible protection from the outer periphery and reduces the risk of tearing of the substrate and metallized vias by instantaneous impact.

[0020] 3. This invention can adjust the initial vibration resistance state through the cooperation of preset pads and preset rings. The buffer mechanism can be flexibly assembled through the clamp, which can adapt to different component distributions and vibration and impact intensity scenarios. At the same time, the modular structure is easy to install and maintain, taking into account both stability and versatility, and is applicable to multiple fields such as consumer electronics and industrial equipment. Attached Figure Description

[0021] Figure 1This is a three-dimensional structural diagram of the present invention;

[0022] Figure 2 for Figure 1 Enlarged 3D structural diagram of part A;

[0023] Figure 3 This is a three-dimensional structural diagram of the internal structure of the flexible column of the present invention;

[0024] Figure 4 This is a schematic diagram of the three-dimensional structure inside the adjustable bottom shell of the present invention;

[0025] Figure 5 for Figure 4 Enlarged 3D structural diagram of part B;

[0026] Figure 6 This is a three-dimensional structural diagram of the clamping block portion of the present invention;

[0027] Figure 7 for Figure 4 Enlarged 3D structural diagram of section C;

[0028] Figure 8 This is a three-dimensional structural diagram of the internal structure of the buffer mechanism of the present invention.

[0029] In the diagram: 1. High-strength equipment; 2. Mounting shell; 3. Circuit board; 4. Adjustment mechanism; 5. Buffer mechanism; 6. Flexible column; 7. Mounting bolt; 8. Buffer shell; 9. Buffer airbag; 10. Adjustable bottom shell; 11. First rifle sleeve; 12. First rifle ring; 13. Adjusting spring; 14. Adjusting top shell; 15. Protective pad; 16. Adjusting bladder; 17. Arc-shaped telescopic rod; 18. Adjusting rod; 19. Adjusting ring; 20. Adjusting gear ring; 21. Preset pad; 22. Preset positioning groove; 23. Preset ring; 24. Buffer rack; 25. Clamping case; 26. Damping ring; 27. First fixing bolt; 28. First adjustment groove; 29. ​​Clamping spring; 30. Clamping block; 31. Second adjustment groove; 32. Preset groove; 33. Second fixing bolt; 34. Second rifle sleeve; 35. Second rifle ring; 36. Buffer block; 37. Buffer groove; 38. Air ring. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] As described in the background section, there are shortcomings in the existing technology. In order to solve the above-mentioned technical problems, this application proposes a high-strength printed circuit board.

[0032] Example 1, a typical implementation of this application, such as Figure 1-7 As shown, a high-strength printed circuit board includes,

[0033] A high-strength printed circuit board, comprising,

[0034] High-strength equipment 1, which includes a mounting shell 2, with a circuit board 3 fixedly connected to the top of the mounting shell 2;

[0035] Adjustment mechanism 4 is threadedly connected to the top of mounting housing 2. Circuit board 3 is threadedly connected to the top of adjustment mechanism 4. Adjustment mechanism 4 includes adjustment base 10 threadedly connected to the top of mounting housing 2. A first flange 12 is slidably connected inside adjustment base 10. A flexible column 6 is fixedly connected to the top of adjustment base 10. An adjustment bladder 16 is fixedly connected inside flexible column 6. The adjustment bladder 16 is filled with hydraulic oil. The adjustment bladder 16 can drive the first flange 12 to slide inside adjustment base 10. The top of the first flange 12 extends into the interior of flexible column 6. An adjustment spring 13 is fixedly connected to the top of the first flange 12. The top of the adjustment spring 13 is fixedly connected to the top of the inner wall of flexible column 6.

[0036] The adjustment mechanism 4 also includes an arc-shaped telescopic rod 17 fixedly connected to the inner wall of the adjustment base 10. The top of the arc-shaped telescopic rod 17 is connected to the bottom of the adjustment bladder 16. The telescopic end of the arc-shaped telescopic rod 17 is rotatably connected to an adjustment rod 18. The bottom of the adjustment rod 18 is rotatably connected to an adjustment ring 19. The adjustment ring 19 is rotatably connected to the inner wall of the adjustment base 10. The outer side of the adjustment base 10 is rotatably connected to a first riveting ring 12.

[0037] The outer side of the adjusting ring 19 is provided with several first adjusting grooves 28. A retaining spring 29 is fixedly connected inside the first adjusting groove 28. A retaining block 30 is fixedly connected to one end of the retaining spring 29. The retaining block 30 is slidably connected inside the first adjusting groove 28. An adjusting gear ring 20 is rotatably connected inside the adjusting base shell 10. Several second adjusting grooves 31 are provided inside the adjusting gear ring 20. One end of several retaining blocks 30 is adapted to several second adjusting grooves 31.

[0038] A damping ring 26 is fixedly connected to the inner wall of the adjusting base 10. The outer side of the damping ring 26 is fixedly connected to the inner side of the adjusting gear ring 20. A first rifle sleeve 11 is rotatably connected to the inner side of the adjusting gear ring 20. The inner side of the first rifle sleeve 11 meshes with the outer side of the adjusting gear ring 20. A first rifle ring 12 is threaded into the inner side of the first rifle sleeve 11.

[0039] Specifically, in mobile scenarios such as automobiles and rail transportation, as well as in the mechanical vibrations of industrial machinery, these external forces are transmitted to the circuit board 3, causing relative movement and stress accumulation between the circuit board 3 and the components, which can damage the circuit board 3.

[0040] More specifically, in a vibration scenario, the vibration frequency of circuit board 3 needs to be distinguished between its natural frequency and the forced vibration response frequency. Uneven weight distribution of components will affect both. Increased mass changes the natural frequency and can easily cause resonance. Every object has its natural vibration frequency. At the same time, high-power components are relatively heavy, which will increase the overall mass of circuit board 3. This change in mass will cause the natural frequency of circuit board 3 to decrease or shift. If it is close to the frequency of the external vibration source during equipment operation, it may cause resonance. At this time, the vibration amplitude of circuit board 3 will be significantly amplified, far exceeding the normal vibration intensity.

[0041] The natural frequency of any object is determined by its mass and stiffness. The formula for natural frequency is: Where k is stiffness and m is mass;

[0042] When the weights of the components on both sides of circuit board 3 are different, the shift in the center of gravity will exacerbate local vibration. If multiple high-power components are unevenly distributed on circuit board 3, such as being concentrated on one side, it will cause the overall center of gravity of circuit board 3 to shift. In a vibrating environment, the shift in the center of gravity will cause the oscillation of circuit board 3 to exhibit eccentric motion. The vibration amplitude and acceleration in local areas, such as near the center of gravity, will increase significantly, becoming stress concentration points. This exacerbation of local vibration may cause the component solder joints and substrate materials in that area to bear greater alternating stress, which can easily lead to fatigue damage to circuit board 3 in the long run.

[0043] If one side of circuit board 3 is heavier than the other, then the mass m1 > m2, and the stiffness of both sides is similar. If the structure of circuit board 3 is symmetrical, then the local natural frequency of the side with greater weight will be lower because the larger m is, the smaller f is.

[0044] At the same time, the natural frequency of the entire circuit board 3 will also decrease due to the shift of the center of gravity, the overall mass will increase and the distribution will be uneven, which is equivalent to the increase of the effective mass of the system, and the vibration mode will change from symmetrical vibration to eccentric oscillation, that is, the vibration modes on both sides will be different, resulting in a situation where one side has a large amplitude and the other side has a small amplitude. Essentially, the vibration response frequency on both sides changes with the external excitation, resulting in a difference in the vibration characteristics. During vibration: the different weight changes the mass distribution and stiffness distribution of the circuit board 3, resulting in different natural frequencies on both sides. The amplitude and frequency matching degree of the vibration response under external excitation will be different, and even one side will resonate while the other side will not resonate, affecting the stability and service life of the circuit board 3.

[0045] Therefore, when the circuit board 3 vibrates, the flexible column 6 bends and vibrates, causing the regulating bladder 16 to bend and vibrate. The rubber wall on the inner side of the bend is squeezed, and the hydraulic oil is forced into the arc-shaped telescopic rod 17. According to the principle of fluid mechanics, this causes the pressure inside the arc-shaped telescopic rod 17 to increase, and causes the telescopic end of the arc-shaped telescopic rod 17 to extend. The liquid space is relatively expanded, and the local volume increases. The extension of the arc-shaped telescopic rod 17 causes the regulating rod 18 to move. The movement of the regulating rod 18 causes the regulating ring 19 to rotate inside the regulating base shell 10. The rotation of the regulating base shell 10, through the engagement of the clamping block 30 and the second regulating groove 31, causes the regulating gear ring 20 to rotate. The rotation of the regulating gear ring 20 causes the first bolt sleeve 11, which meshes with it, to rotate inside the regulating base shell 10. The rotation of the first bolt sleeve 11 causes the first bolt ring 12 to extend. The extension of the first bolt ring 12 causes the regulating spring 13 to compress, thereby improving the bending strength of the flexible column 6 and indirectly adjusting the vibration amplitude of the circuit board 3.

[0046] It should be noted that within the elastic deformation range of the adjusting spring 13, as the degree of contraction increases, the gap between the coils decreases, the overall structure becomes more compact, and the rigidity increases, thus enhancing the ability to resist lateral bending. At the same time, the contraction increases the lateral natural frequency of the adjusting spring 13, making it less likely to resonate with the external impact frequency, reducing deformation or damage amplified by resonance. Therefore, the resistance to lateral impact gradually increases. This is because moderate contraction allows the adjusting spring 13 to more stably disperse stress when subjected to lateral force, suppressing excessive bending through its own rigidity while retaining its elastic deformation capacity to buffer impact energy, thereby enhancing the resistance to lateral impact and adjusting the vibration amplitude of the circuit board 3, thus providing the circuit board 3 with a high-intensity working environment.

[0047] When the circuit board 3 stops working and no longer vibrates, the adjusting spring 13 extends and drives the first bolt ring 12 to return to its original position. The return of the first bolt ring 12 drives the first bolt sleeve 11 to rotate. The rotation of the first bolt sleeve 11 drives the adjusting gear ring 20 to rotate. At this time, since the extension end of the arc-shaped telescopic rod 17 no longer moves, the force on the left side of the abutment block 30 is less than the force on the right side of the abutment block 30. The abutment block 30 retracts inside the first adjusting groove 28, restoring the vibration resistance of the adjusting mechanism 4 to its original state. The damping ring 26 can effectively prevent the adjusting gear ring 20 from rotating with the movement of the extension end of the arc-shaped telescopic rod 17 when the extension end of the arc-shaped telescopic rod 17 retracts.

[0048] It is worth mentioning that, in the same vibration environment of circuit board 3, the vibration of components is mainly affected by their own mass and the connection stiffness with circuit board 3. According to the principle of vibration dynamics, when the connection stiffness is similar, the smaller the mass, such as light components, the higher their natural vibration frequency, and the larger the mass, such as heavy components, the lower their natural vibration frequency.

[0049] For example, under the same vibration excitation, the lightweight chip resistor on circuit board 3 is more likely to respond to high-frequency vibration due to its small mass, while the transformer has a lower vibration frequency due to its large mass.

[0050] By changing the elastic strength of each adjustment mechanism 4 in real time, the difference in vibration frequency between the two sides caused by the different weights of the components on the top of the circuit board 3 can be comprehensively adjusted, so that the vibration of the circuit board 3 tends to be balanced. When the vibration frequency of the lighter component side is detected to be too high, the stiffness can be reduced by adjusting the adjustment mechanism 4 to reduce the vibration frequency of that side by increasing the elastic deformation to buffer the high-frequency vibration energy.

[0051] If the vibration frequency of the heavy component side is too low, the stiffness of the component can be improved by adjusting the adjustment mechanism 4 to enhance the support force and increase the vibration frequency of that side. The advantage of doing so is that it can accurately balance the vibration characteristics of both sides, reduce the risk of resonance and internal stress concentration caused by frequency differences, solve the problems of local structural fatigue and solder joint cracking caused by uneven weight distribution of the circuit board 3, and significantly improve its structural stability and service life under vibration or impact environment. At the same time, the continuous heat generated by the high-power component during operation will cause thermal stress between the circuit board 3 and the component due to the difference in thermal expansion coefficient. When the instantaneous stress generated by the impact is superimposed, the two stresses will interact, making the actual force on the circuit board 3 close to or even exceed its tolerance limit. The above structure can more effectively prevent damage to the circuit board 3.

[0052] The adjustable base 10 has a preset pad 21 slidably connected inside, a preset positioning groove 22 is opened on the outside of the adjustable base 10, a preset ring 23 is threaded on the outside of the adjustable base 10, a preset groove 32 is opened inside the preset ring 23, the preset pad 21 passes through the preset positioning groove 22 and is slidably connected inside the preset ring 23 through the preset groove 32, and the top of the preset pad 21 abuts against the bottom of the first rifle sleeve 11.

[0053] The initial vibration resistance of the circuit board 3 can be adjusted by the above-mentioned structure. Specifically, when it is necessary to adjust the initial vibration resistance of the circuit board 3, the preset ring 23 is rotated. The rotation of the preset ring 23 causes the preset pad 21 to move. The movement of the preset pad 21 causes the first bolt sleeve 11 to move. The movement of the first bolt sleeve 11 causes the first bolt ring 12 to move. The movement of the first bolt ring 12 causes the adjusting spring 13 to extend and retract, thereby adjusting the initial vibration resistance of the circuit board 3.

[0054] The bottom of the inner wall of the adjusting base 10 is threaded with a first fixing bolt 27, which is threaded onto the top of the circuit board 3. The top of the flexible column 6 is fixedly connected to the adjusting top shell 14, and the top of the adjusting top shell 14 is threaded with a mounting bolt 7, which is threaded onto the inside of the circuit board 3. The top of the adjusting top shell 14 is fixedly connected to a protective gasket 15, and the top of the protective gasket 15 abuts against the bottom of the circuit board 3.

[0055] With the above-described structure, the circuit board 3 can be fixed to the top of the mounting shell 2. Specifically, when it is necessary to fix the circuit board 3 to the top of the mounting shell 2, the adjusting mechanism 4 is first screwed onto the top of the mounting shell 2 using the first fixing bolt 27, and then the circuit board 3 is screwed onto the top of the adjusting mechanism 4 using the mounting bolt 7, thus completing the installation and fixing of the circuit board 3.

[0056] Example 2, as Figure 4 and Figure 8 As shown, based on Embodiment 1, the buffer mechanism 5 includes a buffer shell 8 threadedly connected to the top of the mounting shell 2. The top of the buffer shell 8 is connected to a buffer airbag 9. The outside of the buffer airbag 9 is adapted to the outer periphery of the circuit board 3. The adjusting bladder 16 can drive the buffer airbag 9 to expand and abut against the outside of the circuit board 3.

[0057] The buffer mechanism 5 also includes a retainer 25 that is snapped onto one side of the adjusting base 10. A buffer rack 24 is slidably connected to the top of the retainer 25. The buffer rack 24 meshes with the outside of the adjusting gear ring 20. A second rifle sleeve 34 is rotatably connected inside the buffer housing 8. The buffer rack 24 meshes with the buffer rack 24. A second rifle ring 35 is threaded into the inside of the second rifle sleeve 34. The second rifle ring 35 is slidably connected inside the buffer housing 8. An air ring 38 is fixedly connected to the top of the second rifle ring 35. The air ring 38 is airtightly slidably connected inside the buffer housing 8.

[0058] A buffer block 36 is fixedly connected to the inner wall of the buffer shell 8. A buffer groove 37 is opened inside the second riveting ring 35. The buffer block 36 is slidably connected inside the buffer groove 37. A second fixing bolt 33 is threadedly screwed to the bottom of the buffer shell 8. The second fixing bolt 33 is threadedly screwed to the top of the mounting shell 2.

[0059] The different weights of the components will result in different impact forces on both sides of the circuit board 3:

[0060] In an impact scenario, the impact force on circuit board 3 is mainly determined by the inertial force F = ma, where m is the mass and a is the impact acceleration, and the stress distribution. Different weights directly lead to differences in the impact forces on both sides; the greater the weight, the greater the impact force.

[0061] Impact is an instantaneous high acceleration, such as a 1000G process. The weight of the component, i.e., its mass, directly determines the magnitude of the inertial force. If the weights of the components on both sides of circuit board 3 are different:

[0062] On the side of circuit board 3 with greater weight, the inertial force F1 = m1 × a generated by mass m1 is much greater than that on the side with less weight, F2 = m2 × a. Since m1 > m2, then F1 > F2.

[0063] For example, when the impact acceleration is 1000G and a≈10000m / s2, the inertial force of the 100g component on the left is F1=0.1kg×10000=1000N, about 100kg force, and the inertial force of the 10g component on the right is F20.01kg×10000=100N. The impact forces on the two sides differ by a factor of 10.

[0064] When the circuit board 3 is manually impacted, the difference in weight directly leads to the difference in inertial force, and the shift in the center of gravity will exacerbate the local stress concentration, resulting in a significant difference in the impact force on both sides, especially the local impact force, which affects the stability and service life of the circuit board 3.

[0065] By setting the buffer mechanism 5 to adaptively and moderately abut, the excessive displacement of the circuit board 3 is limited, and the impact energy is absorbed and the vibration stress is dispersed by the deformation of the buffer airbag 9. This method can reduce the instantaneous load caused by rigid impact, alleviate the stress on the solder joint and the circuit board 3, and thus reduce the risk of damage. Specifically, when it is necessary to protect the side of the circuit board 3, the retaining clip 25 around the circuit board 3 is pried open, and the buffer rack 24 with the buffer mechanism 5 is placed on the top of the retaining clip 25. The retaining clip 25 is then locked on one side of the adjusting base shell 10. At this time, the buffer rack 24 meshes with the adjacent adjusting gear ring 20, and its buffer mechanism 5 is threaded onto the top of the mounting shell 2 by the second fixing bolt 33. At this time, the periphery of the circuit board 3 can be protected.

[0066] When the circuit board 3 is impacted, the adjusting gear ring 20 rotates, which drives the buffer rack 24 to move. The movement of the buffer rack 24 drives the second bolt sleeve 34 to rotate, which drives the second bolt ring 35 to slide inside the buffer shell 8. The movement of the second bolt ring 35 drives the air ring 38 to move, which causes the buffer airbag 9 to expand and come into contact with the outer periphery of the circuit board 3, thereby protecting the edge of the circuit board 3.

[0067] When the impact or vibration of the circuit board 3 disappears, the gear ring 20 is adjusted back to its original position and drives the second rifle sleeve 34 to rotate in the opposite direction, the buffer airbag 9 contracts, and the next protection can be carried out.

[0068] It is worth mentioning that the traditional protective mechanism placed on the circuit board 3 will further aggravate the vibration of the circuit board 3. By placing the protective mechanism on the outside of the circuit board 3, it is possible to avoid reverse protection of the circuit board 3 from vibration while providing frontal protection for the circuit board 3.

[0069] The working principle of this invention is as follows: When it is necessary to fix the circuit board 3 to the top of the mounting shell 2, the adjusting mechanism 4 is first screwed onto the top of the mounting shell 2 by the first fixing bolt 27, and then the circuit board 3 is screwed onto the top of the adjusting mechanism 4 by the mounting bolt 7, thus completing the installation and fixing of the circuit board 3.

[0070] When it is necessary to adjust the initial vibration resistance of the circuit board 3, the preset ring 23 is rotated. The rotation of the preset ring 23 causes the preset pad 21 to move. The movement of the preset pad 21 causes the first bolt sleeve 11 to move. The movement of the first bolt sleeve 11 causes the first bolt ring 12 to move. The movement of the first bolt ring 12 causes the adjusting spring 13 to extend and retract, thereby adjusting the initial vibration resistance of the circuit board 3.

[0071] When the circuit board 3 vibrates, the flexible column 6 bends and vibrates, causing the regulating bladder 16 to bend and vibrate. The rubber wall on the inner side of the bend is squeezed, and hydraulic oil is forced into the arc-shaped telescopic rod 17. According to the principle of fluid mechanics, this causes the pressure inside the arc-shaped telescopic rod 17 to increase, and causes the telescopic end of the arc-shaped telescopic rod 17 to extend. The liquid space is relatively expanded, and the local volume increases. The extension of the arc-shaped telescopic rod 17 causes the regulating rod 18 to move. The movement of the regulating rod 18 causes the regulating ring 19 to rotate inside the regulating base shell 10. The rotation of the regulating base shell 10, through the engagement of the clamping block 30 and the second regulating groove 31, causes the regulating gear ring 20 to rotate. The rotation of the regulating gear ring 20 causes the first bolt sleeve 11, which meshes with it, to rotate inside the regulating base shell 10. The rotation of the first bolt sleeve 11 causes the first bolt ring 12 to extend. The extension of the first bolt ring 12 causes the regulating spring 13 to compress, thereby improving the bending strength of the flexible column 6 and indirectly adjusting the vibration amplitude of the circuit board 3.

[0072] When the circuit board 3 stops working and no longer vibrates, the adjusting spring 13 extends and drives the first bolt ring 12 to return to its original position. The return of the first bolt ring 12 drives the first bolt sleeve 11 to rotate. The rotation of the first bolt sleeve 11 drives the adjusting gear ring 20 to rotate. At this time, since the extension end of the arc-shaped telescopic rod 17 no longer moves, the force on the left side of the abutment block 30 is less than the force on the right side of the abutment block 30. The abutment block 30 retracts inside the first adjusting groove 28, restoring the vibration resistance of the adjusting mechanism 4 to its original state. The damping ring 26 can effectively prevent the adjusting gear ring 20 from rotating with the movement of the extension end of the arc-shaped telescopic rod 17 when the extension end of the arc-shaped telescopic rod 17 retracts.

[0073] When it is necessary to protect the side of the circuit board 3, the retaining clip 25 around the circuit board 3 is pried open, and the buffer rack 24 with the buffer mechanism 5 is placed on the top of the retaining clip 25. The retaining clip 25 is then locked on one side of the adjusting base shell 10. At this time, the buffer rack 24 engages with the adjacent adjusting gear ring 20, and its buffer mechanism 5 is threaded onto the top of the mounting shell 2 by the second fixing bolt 33. At this time, the periphery of the circuit board 3 can be protected.

[0074] When the circuit board 3 is impacted, the adjusting gear ring 20 rotates, which drives the buffer rack 24 to move. The movement of the buffer rack 24 drives the second bolt sleeve 34 to rotate, which drives the second bolt ring 35 to slide inside the buffer shell 8. The movement of the second bolt ring 35 drives the air ring 38 to move, which causes the buffer airbag 9 to expand and come into contact with the outer periphery of the circuit board 3, thereby protecting the edge of the circuit board 3.

[0075] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-strength printed circuit board, characterized in that: include, A high-strength device, comprising a mounting housing, wherein a circuit board is fixedly connected to the top of the mounting housing; An adjustment mechanism is provided, comprising several adjustment mechanisms. Each adjustment mechanism is threadedly connected to the top of the mounting housing, and the circuit board is threadedly connected to the top of the adjustment mechanism. The adjustment mechanism includes an adjustment base shell threadedly connected to the top of the mounting housing. A first flange is slidably connected inside the adjustment base shell. A flexible column is fixedly connected to the top of the adjustment base shell. An adjustment bladder is fixedly connected inside the flexible column. The adjustment bladder is filled with hydraulic oil and can drive the first flange to slide inside the adjustment base shell. The top of the first flange extends into the interior of the flexible column. An adjustment spring is fixedly connected to the top of the first flange. The top of the adjustment spring is fixedly connected to the top of the inner wall of the flexible column. A buffer mechanism includes a buffer shell threaded onto the top of a mounting housing, a buffer airbag connected to the top of the buffer shell, the outer side of the buffer airbag being adapted to the outer periphery of a circuit board, and an adjustable bladder capable of driving the buffer airbag to expand and abut against the outer side of the circuit board.

2. The high-strength printed circuit board according to claim 1, characterized in that: The adjustment mechanism further includes an arc-shaped telescopic rod fixedly connected to the inner wall of the adjustment base. The top of the arc-shaped telescopic rod is connected to the bottom of the adjustment chamber. An adjustment rod is rotatably connected to the telescopic end of the arc-shaped telescopic rod. An adjustment ring is rotatably connected to the bottom of the adjustment rod. The adjustment ring is rotatably connected to the inner wall of the adjustment base. A first riveting ring is rotatably connected to the outside of the adjustment base.

3. A high-strength printed circuit board according to claim 2, characterized in that: The outer side of the adjusting ring is provided with several first adjusting grooves. A retaining spring is fixedly connected inside the first adjusting groove. One end of the retaining spring is fixedly connected with a retaining block. The retaining block is slidably connected inside the first adjusting groove. An adjusting gear ring is rotatably connected inside the adjusting base shell. Several second adjusting grooves are provided inside the adjusting gear ring. One end of several retaining blocks is adapted to several second adjusting grooves.

4. A high-strength printed circuit board according to claim 3, characterized in that: A damping ring is fixedly connected to the inner wall of the adjusting base. The outer side of the damping ring is fixedly connected to the inner side of the adjusting gear ring. A first rifle sleeve is rotatably connected to the inner side of the adjusting gear ring. The inner side of the first rifle sleeve meshes with the outer side of the adjusting gear ring. The first rifle ring is threadedly screwed into the inner side of the first rifle sleeve.

5. A high-strength printed circuit board according to claim 4, characterized in that: The adjustable base shell has a preset pad slidably connected inside, and a preset positioning groove is provided on the outside of the adjustable base shell. A preset ring is threaded onto the outside of the adjustable base shell, and a preset groove is provided inside the preset ring. The preset pad passes through the preset positioning groove and is slidably connected inside the preset ring through the preset groove. The top of the preset pad abuts against the bottom of the first rifle sleeve.

6. A high-strength printed circuit board according to claim 1, characterized in that: The bottom of the inner wall of the adjusting base is threaded with a first fixing bolt, which is threaded onto the top of the circuit board. The top of the flexible column is fixedly connected to an adjusting top shell, and the top of the adjusting top shell is threaded with a mounting bolt, which is threaded onto the inside of the circuit board. The top of the adjusting top shell is fixedly connected to a protective gasket, and the top of the protective gasket abuts against the bottom of the circuit board.

7. A high-strength printed circuit board according to claim 6, characterized in that: The buffer mechanism further includes a retaining case that is snapped onto one side of the adjusting base. A buffer rack is slidably connected to the top of the retaining case. The buffer rack meshes with the outside of the adjusting gear ring. A second rifle sleeve is rotatably connected inside the buffer housing. The buffer rack meshes with the buffer rack. A second rifle ring is threaded into the inside of the second rifle sleeve. The second rifle ring is slidably connected inside the buffer housing. An air ring is fixedly connected to the top of the second rifle ring. The air ring is slidably connected inside the buffer housing in an airtight manner.

8. A high-strength printed circuit board according to claim 7, characterized in that: A buffer block is fixedly connected to the inner wall of the buffer shell. A buffer groove is opened inside the second riveting ring. The buffer block is slidably connected inside the buffer groove. A second fixing bolt is threaded to the bottom of the buffer shell. The second fixing bolt is threaded to the top of the mounting shell.

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