Data center three-dimensional bionic liquid cooling plate

Abstract

The invention discloses a data center three-dimensional bionic liquid cooling plate which comprises a liquid inlet arranged in the center, multiple stages of branch flow channels, flow channel connecting channels, multiple stages of annular branches, optional fins and a liquid outlet, and the multiple stages of branch flow channels comprise the first branch flow channel, the second branch flow channel and the third branch flow channel which are sequentially communicated. The multi-stage annular branches comprise the first annular branch, the second annular branch and the third annular branch which are sequentially arranged in a sleeved mode, cooling liquid flows into the first branch flow channel from the liquid inlet, is divided into the first annular branch and the second branch flow channel through the flow channel connecting channel and is communicated with the next stage of branch flow channel step by step through the annular branches, and cooling liquid flows into the third annular branch flow channel. And finally, the liquid is collected to the liquid outlet through the third annular branch. The number of the first branch flow channels is adjusted, and the length ratio, the width ratio, the bifurcation angle, the depth difference and other structural parameters of the branch flow channels are optimized. Fin structures can be selectively arranged in the branch flow channels, so that fluid disturbance is enhanced, the heat exchange area is enlarged, and the overall heat dissipation performance and the system stability are improved.

Description

Technical Field

[0001] This application relates to the field of data cooling technology, and more specifically, to a three-dimensional biomimetic liquid cooling plate for data centers. Background Technology

[0002] In recent years, with the widespread application of high-performance processors, electronic chips such as CPUs and GPUs used in data centers have been continuously developing towards higher integration and miniaturization, leading to a continuous increase in chip power density and heat flux density, making heat dissipation an increasingly prominent issue. To ensure the stable operation of equipment, existing heat dissipation technologies mainly include natural cooling, mechanical refrigeration, and liquid cooling. Among them, natural cooling relies on airflow for heat dissipation, but is limited by the low specific heat capacity of air and its limited heat dissipation efficiency, making it difficult to meet the cooling requirements of high heat flux density chips. Mechanical refrigeration uses compressors for cooling, which can provide lower temperatures, but the system is complex, energy-intensive, and has high maintenance costs, making it unsuitable for large-scale deployment. In contrast, liquid cooling technology uses liquid as a cooling medium, which has the advantages of high specific heat capacity and high thermal conductivity, enabling efficient heat transfer in a smaller volume, and has become an important heat dissipation method for high heat flux density electronic devices. In liquid cooling systems, the liquid cooling plate, as a key component that directly contacts the heat-generating chip, has a significant impact on heat dissipation efficiency, temperature uniformity, and system stability due to its internal structural design. Existing liquid cooling plate technology still suffers from problems such as high flow resistance, uneven temperature distribution, localized hot spots, and insufficient heat exchange efficiency, limiting further improvements in the overall performance of liquid cooling systems. However, the heat dissipation performance of liquid cooling plates is affected by various factors, among which the flow channel shape and turbulence shape are key. Therefore, optimizing the flow channel shape can improve the heat dissipation efficiency of liquid cooling plates.

[0003] In the prior art, a data center liquid cooling plate (CN118973233B) utilizes fluid channels formed between adjacent partition ribs to guide coolant flow. However, due to the relatively simple channel structure, the overall disturbance capability is limited, making it difficult to significantly improve heat exchange efficiency. A novel biomimetic fin-like liquid cooling plate (CN119297475A) designs multiple tortuous flow channels to create disturbances in the coolant flow within the internal channels, enhancing heat exchange efficiency. While this approach helps strengthen heat exchange, excessive bends can lead to localized flow dead zones and high pressure drops, affecting system performance. A data center liquid cooling plate (CN119922888A) designs branching channels, converging channels, and biomimetic flow channels within the liquid cooling plate, with multiple channels connected in parallel. The biomimetic flow channels mimic the texture of dolphin skin. While this approach focuses more on reducing flow resistance, it struggles to achieve efficient heat exchange, and the parallel structure is prone to uneven flow velocity.

[0004] Current liquid cooling plate technology still faces several challenges in application: First, it's difficult to balance flow resistance and heat transfer performance. Some liquid cooling plates have poorly designed internal flow channels, leading to poor coolant flow, increased system energy consumption, and limited overall heat transfer efficiency. Second, uneven temperature distribution and the formation of localized hotspots not only affect the stable operation of electronic devices but also limit the application and promotion of liquid cooling technology in high heat flux density scenarios. To improve liquid cooling plate performance, some research has introduced biomimetic design concepts, simulating natural structures to enhance flow and heat transfer characteristics. However, most existing biomimetic structures remain two-dimensional, with limited design dimensions and functional integration. While they address performance indicators such as temperature difference control, temperature difference uniformity, and flow resistance to some extent, they lack systematic and coordinated optimization of key parameters closely related to heat transfer capacity, such as flow rate, resulting in significant room for improvement in overall performance evaluation indicators. Therefore, how to comprehensively improve the heat transfer efficiency and flow performance of liquid cooling plates through more coordinated and multi-dimensional biomimetic structural designs has become a key technical challenge for the development of liquid cooling technology. Summary of the Invention

[0005] The purpose of this application is to overcome the shortcomings of existing technologies by selecting Victoria amazonica as a biomimetic model based on the radial venation structure on the back of its leaves. Compared with other plants, Victoria amazonica has the following significant advantages: First, its layered venation structure can effectively increase the specific surface area of ​​the flow channels and reduce fluid dead zones, thereby significantly improving heat dissipation uniformity; Second, its branch channel cross-section has a gradient change, which can maintain high transmission efficiency while reducing flow pressure drop; Third, the mesh support structure formed by its radial main veins and annular secondary veins balances high strength and lightweight. In summary, this biomimetic venation structure can effectively improve the performance of liquid cooling plates in terms of fluid transmission, heat dissipation, and structural reliability. Based on this, a three-dimensional biomimetic liquid cooling plate for data centers is proposed. By optimizing the number of the first branch channels and optimizing structural parameters such as the length ratio, width ratio, bifurcation angle, and depth difference of the branch channels, the problems of uneven fluid distribution, low local heat exchange efficiency, and large pressure drop can be improved.

[0006] The objective of this application is achieved through the following technical solution: In the first aspect, this application proposes a three-dimensional biomimetic liquid cooling plate for a data center, including a centrally located liquid inlet (1), a multi-level branched flow channel (2), a flow channel connecting channel (3), a multi-level annular branch (4), optional fins (5), and a liquid outlet (6). The multi-level branch flow channel (2) includes a first branch flow channel (21), a second branch flow channel (22) and a third branch flow channel (23) connected in sequence. The multi-level ring branch (4) includes a first ring branch (41), a second ring branch (42) and a third ring branch (43) nested in sequence. Coolant flows into the first branch channel (21) from the inlet (1), and is divided into the first annular branch (41) and the second branch channel (22) through the channel connection channel (3). It then connects with the next level branch channel through the annular branch (4) and finally converges to the outlet (6) through the third annular branch (43).

[0007] In one possible implementation, the number of first branch channels (21) is ≥4, and the first branch channels (21), the second branch channels (22) and the third branch channels (23) are connected to the corresponding first annular branches (41), the second annular branches (42) and the third annular branches (43) through the channel connection channel (3).

[0008] In one possible implementation, the length ratio of the first branch channel (21), the second branch channel (22), and the third branch channel (23) is 0.4-1.

[0009] In one possible implementation, the width ratio of the first branch channel (21), the second branch channel (22), and the third branch channel (23) is 0.3-1.

[0010] In one possible implementation, the number of the ring branches (4) is ≥3, and they are continuous closed rings or partially interrupted structures.

[0011] In one possible implementation, the bifurcation angle of the flow channel connecting channel (3) is 30°-90°.

[0012] In one possible implementation, there is a depth difference between the first branch channel (21), the second branch channel (22), and the third branch channel (23), and the depth difference is 0-0.7 mm.

[0013] In one possible implementation, fins (5) are provided inside the branch channel. The shape of the fins (5) is selected from at least one of rectangle, triangle, derived geometry, or a composite structure composed of main fins and auxiliary fins.

[0014] In one possible implementation, the lateral spacing between the fins (5) is 0-0.7 mm and the longitudinal spacing is 0-0.8 mm.

[0015] In one possible implementation, the fin (5) has a height of 0.6-1.6 mm.

[0016] The main solution and its various further alternatives described above can be freely combined to form multiple solutions, all of which are solutions that can be adopted and are claimed in this application; furthermore, the (non-conflicting alternatives) can also be freely combined with each other and with other alternatives. Those skilled in the art, after understanding the solution of this application, will realize from the prior art and common general knowledge that there are many combinations, all of which are technical solutions to be protected in this application, and will not be exhaustively listed here.

[0017] This application discloses a three-dimensional biomimetic liquid cooling plate for data centers, including a centrally located liquid inlet, multi-level branched channels, channel connecting channels, multi-level annular branches, optional fins, and a liquid outlet. The multi-level branched channels include a first branched channel, a second branched channel, and a third branched channel connected in sequence. The multi-level annular branches include a first annular branch, a second annular branch, and a third annular branch nested in sequence. Coolant flows into the first branched channel from the liquid inlet, is distributed to the first and second annular branches via the channel connecting channels, and connects to the next level of branched channels through the annular branches, finally converging at the liquid outlet through the third annular branch. The number of first branched channels is adjusted, and structural parameters such as the length ratio, width ratio, bifurcation angle, and depth difference of the branched channels are optimized. Optional fin structures are installed inside the branched channels to enhance fluid turbulence, expand the heat exchange area, and improve overall heat dissipation performance and system stability. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of a three-dimensional biomimetic liquid cooling plate for a data center, as proposed in an embodiment of this application.

[0020] Figure 2 This is a schematic diagram illustrating the effect of the number of flow channels in the first branch on the chip temperature.

[0021] Figure 3 The cross-sectional temperature contour plots of the biomimetic liquid cooling plate under different branch numbers are shown.

[0022] Figure 4 This is a schematic diagram illustrating the effect of different numbers of first branch channels on the pressure drop and pump power of the biomimetic liquid cooling plate.

[0023] Figure 5 This is a schematic diagram illustrating the effect of the length ratio of each branch channel on the chip temperature distribution.

[0024] Figure 6This is a schematic diagram showing the cross-sectional temperature distribution of a biomimetic liquid cooling plate under different length ratios.

[0025] Figure 7 This is a schematic diagram showing the effect of changes in the length ratio on the pressure drop and pump power of the biomimetic liquid cooling plate.

[0026] Figure 8 This is a schematic diagram illustrating the effect of different aspect ratios on chip temperature distribution.

[0027] Figure 9 A schematic diagram showing the cross-sectional temperature distribution of a biomimetic liquid cooling plate under different width ratios is presented.

[0028] Figure 10 This is a schematic diagram showing the effect of changes in the width ratio on the pressure drop and pump power of the biomimetic liquid cooling plate.

[0029] Figure 11 This is a schematic diagram illustrating the effect of different bifurcation angles on chip temperature.

[0030] Figure 12 The cross-sectional temperature distribution cloud map of the biomimetic liquid cooling plate under different bifurcation angles is shown.

[0031] Figure 13 This is a schematic diagram showing the effect of different bifurcation angles on the pressure drop and pump power of the biomimetic liquid cooling plate.

[0032] Figure 14 This embodiment illustrates the effect of a biomimetic liquid cooling plate on chip temperature under different depth differences.

[0033] Figure 15 The cross-sectional temperature contour plots of the biomimetic liquid cooling plate under different depth differences are shown.

[0034] Figure 16 A schematic diagram illustrates the effect of different depth differences on the pressure drop and pump power of the biomimetic liquid cooling plate.

[0035] Figure 17 This embodiment illustrates the effect of different lateral spacing between fins on chip temperature.

[0036] Figure 18 A schematic diagram showing the pressure drop and pump power changes of the biomimetic liquid cooling plate under different lateral spacing conditions is presented.

[0037] Figure 19 This embodiment illustrates the effect of different longitudinal spacing between fins on chip temperature.

[0038] Figure 20 This is a schematic diagram showing the pressure drop and pump power changes of the biomimetic liquid cooling plate under different longitudinal spacing conditions.

[0039] Figure 21This embodiment provides a schematic diagram illustrating the effect of different fin heights on chip temperature.

[0040] Figure 22 A schematic diagram of the pressure drop under different fin height conditions is shown.

[0041] Figure 23 This diagram illustrates the effect of inlet flow rate on chip temperature under three cooling structures: traditional liquid cooling plate, bionic liquid cooling plate, and improved bionic liquid cooling plate.

[0042] Figure 24 This is a schematic diagram illustrating the influence of inlet flow rate on the pressure drop and pump power of three types of liquid cooling plates.

[0043] Figure 25 This is a schematic diagram showing the effect of chip power on chip temperature.

[0044] Reference numerals: 1-Inlet; 2-Multi-stage branched flow channel; 3-Flow channel connection channel; 4-Multi-stage annular branch; 5-Fin; 6-Outlet; 21-First branched flow channel; 22-Second branched flow channel; 23-Third branched flow channel; 41-First annular branch; 42-Second annular branch; 43-Third annular branch. Detailed Implementation

[0045] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. This application can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, unless otherwise specified, the following embodiments and features in the embodiments can be combined with each other.

[0046] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0047] Current liquid cooling plate technology still has many shortcomings in application, such as high flow resistance, uneven coolant temperature distribution, easy formation of hot spots, and limited overall heat exchange efficiency, making it difficult to further improve the overall heat dissipation performance of the liquid cooling system. These problems not only affect the stable operation of electronic devices, but also restrict the promotion and application of liquid cooling technology in high heat flux density application scenarios.

[0048] Therefore, in order to solve the above-mentioned technical problems, this application proposes a three-dimensional biomimetic liquid cooling plate for data centers. By adopting a biomimetic liquid cooling plate structure design, the heat exchange efficiency of the liquid cooling plate is effectively improved and the flow resistance is reduced, thereby significantly improving the overall heat dissipation performance of the liquid cooling plate and meeting the higher requirements of high heat flux density electronic devices for heat dissipation systems. The following is a detailed explanation.

[0049] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a three-dimensional biomimetic liquid cooling plate for a data center according to an embodiment of this application, including a centrally located liquid inlet 1, a multi-level branched flow channel 2, a flow channel connecting channel 3, a multi-level annular branch 4, optional fins 5, and a liquid outlet 6; The multi-level branch flow channel 2 includes a first branch flow channel 21, a second branch flow channel 22, and a third branch flow channel 23 connected in sequence; The multi-level ring branch 4 includes a first ring branch 41, a second ring branch 42 and a third ring branch 43 nested in sequence; Coolant flows from inlet 1 into first branch channel 21, then through channel connecting channel 3 to first annular branch 41 and second branch channel 22, and then through annular branch 4 to connect with the next level branch channel, finally converging at outlet 6 via third annular branch 43.

[0050] The biomimetic liquid cooling plate uses a centrally located inlet 1 as the coolant inlet, through which the coolant flows into the internal flow channel system. Multi-level branch channels 2 form the main coolant transport path, sequentially connecting the first branch channel 21, the second branch channel 22, and the third branch channel 23, achieving step-by-step distribution and delivery of coolant between different levels. Simultaneously, flow channel connecting channels 3 intersect the branch channels at each level with annular branches, ensuring smooth coolant flow within the complex flow channel network. Multi-level annular branches 4 consist of sequentially nested first annular branches 41, second annular branches 42, and third annular branches 43, forming a surrounding layout that provides multi-dimensional flow paths for the coolant and enhances heat dissipation coverage. Furthermore, the outlet 6, located at a specific position on the liquid cooling plate, collects and discharges the coolant after it has been cooled by each level of flow channel, completing the entire heat dissipation cycle. Optional fins 5 further enhance the heat dissipation effect and can be flexibly configured according to actual heat dissipation requirements.

[0051] After the coolant flows in from the central inlet 1, it first enters the first branch channel 21. During its flow through the first branch channel 21, some coolant is diverted through the channel connecting channel 3 to the first annular branch 41, flowing along its annular path to dissipate heat in the corresponding area. Simultaneously, another portion of the coolant continues flowing in the first branch channel 21 and enters the second branch channel 22 via the next channel connecting channel 3. In the second branch channel 22, the coolant is again diverted through the channel connecting channel 3 to the second annular branch 42, flowing along it to dissipate heat. This process continues, with the coolant being distributed and dissipating heat step-by-step between the various branch channels and annular branches, finally converging at the third annular branch 43 and exiting the liquid cooling plate through the outlet 6.

[0052] The number of branch channels, the length ratio, width ratio, depth difference, and bifurcation angle of the channel connection channels in the data center biomimetic liquid cooling plate can be comprehensively considered to select different parameter settings for chip temperature, heat transfer coefficient, and flow resistance.

[0053] The number of first branch channels 21 is ≥4, and the first branch channels 21, the second branch channels 22 and the third branch channels 23 are connected to the corresponding first annular branches 41, the second annular branches 42 and the third annular branches 43 through the channel connection channel 3.

[0054] Figure 2 This diagram illustrates the effect of the number of first branch channels on chip temperature. As the number of first branch channels increases, the chip surface temperature decreases significantly, the temperature distribution becomes more uniform, and the temperature gradient decreases accordingly. Figure 3 The cross-sectional temperature contour plots of the biomimetic liquid-cooled plate under different branch numbers show that the temperature distribution gradually decreases with increasing branch number. Increasing the number of branches reduces the average fluid velocity to some extent, leading to a decrease in the local Reynolds number, enhanced laminar flow characteristics, and a slight decrease in the local heat transfer coefficient, thus limiting the overall improvement in the average heat transfer coefficient. Nevertheless, because increasing the number of branches helps improve the flow distribution between the branch paths, significantly reduces the temperature gradient, and effectively suppresses the formation of local hot spots, the overall heat transfer performance still shows an improving trend. Figure 4 This diagram illustrates the impact of varying numbers of first-branch channels on the pressure drop and pump power of the biomimetic liquid-cooled plate. As the number of branches increases, the flow rate within the liquid-cooled plate redistributes, alleviating the localized high-pressure issue at the inlet. Simultaneously, the optimized branch structure enhances the parallel effect of the flow channels, reducing flow resistance between branches and consequently decreasing overall flow resistance, leading to a decrease in both system pressure drop and required pump power. However, it's important to note that increasing the number of branches has a diminishing marginal effect on performance improvement; once the number of branches exceeds a certain threshold, the improvement in pressure drop and pump power tends to decrease.

[0055] The length ratio of the first branch channel 21, the second branch channel 22, and the third branch channel 23 is 0.4-1.

[0056] In the data center biomimetic liquid cooling plate, the length ratio of each branch channel 21-23 is 0.4-1. This length ratio is the ratio of the length of the second branch channel to the length of the first branch channel, and also the ratio of the length of the (n+1)th branch channel to the length of the nth branch channel.

[0057] Figure 5 This diagram illustrates the impact of the length ratio of each branch channel on the chip's temperature distribution. As the length ratio increases, both the chip's maximum and average temperatures decrease, the temperature distribution becomes more uniform, and the chip's thermal uniformity is significantly improved. This is mainly due to the fact that a larger length ratio increases the proportion of the core heat exchange area corresponding to the high-temperature region within the overall heat exchange area, increasing the residence time of the cooling fluid in high-heat-flux regions and thus improving local heat exchange efficiency. Simultaneously, a larger length ratio brings the secondary and tertiary branch channels closer to the chip's heat source region, shortening the heat conduction path and further enhancing the heat exchange effect. Figure 6 This diagram illustrates the cross-sectional temperature distribution of the biomimetic liquid-cooled plate under different length ratios. As the length ratio increases, the overall temperature level inside the liquid-cooled plate gradually decreases, resulting in a more uniform temperature distribution and effectively preventing the formation of localized hot spots. Furthermore... Figure 7 This diagram illustrates the effect of changes in the length ratio on the pressure drop and pump power of the biomimetic liquid cooling plate. Although the shortening of the primary branch channel as the length ratio increases may slightly increase its friction resistance, the corresponding lengthening of the secondary and tertiary branch channels results in a relative decrease in their friction resistance. These two factors offset each other to some extent, resulting in a minimal change in the overall system's flow resistance. Therefore, while the pressure drop and pump power of the liquid cooling plate decrease slightly, the changes are relatively limited.

[0058] The width ratio of the first branch channel 21, the second branch channel 22, and the third branch channel 23 is 0.3-1.

[0059] In the data center biomimetic liquid cooling plate, the width ratio of each branch channel 21-23 is 0.3-1. This width ratio is the ratio of the width of the second branch channel to the width of the first branch channel, and also the ratio of the width of the (n+1)th branch channel to the width of the nth branch channel.

[0060] Figure 8This diagram illustrates the impact of different aspect ratios on chip temperature distribution. The results show that as the aspect ratio increases, the overall chip temperature rises significantly, especially in the high-heat-flux region at the chip's center, where the high-temperature phenomenon is more pronounced and the temperature gradient is also enhanced. However, although the chip's maximum and average temperatures increase with the aspect ratio, the change in temperature distribution uniformity is relatively small, indicating that the aspect ratio has a limited impact on the chip's thermal uniformity. Further analysis shows that increasing the aspect ratio leads to an increase in chip thermal resistance. This is mainly due to two reasons: firstly, a larger aspect ratio reduces the flow velocity in each branch flow path within the liquid cooler, thickens the thermal boundary layer of the cooling fluid, and consequently decreases the heat transfer coefficient, especially noticeable in the core high-temperature region; secondly, some secondary and tertiary branch flow paths are moved further away from local heat sources due to the increased aspect ratio, resulting in a longer heat conduction path and reduced heat transfer efficiency, thus causing an increase in chip temperature and thermal resistance. Figure 9 A schematic diagram showing the cross-sectional temperature distribution of the biomimetic liquid-cooled plate under different width ratios is presented. It can be observed from the figure that the overall cross-sectional temperature of the liquid-cooled plate increases with the increase of the width ratio, further verifying the suppressive effect of increasing the width ratio on heat transfer performance. Furthermore, Figure 10 This diagram illustrates the effect of width ratio variation on the pressure drop and pump power of the biomimetic liquid cooling plate. As the width ratio increases, the friction loss along the branch channels decreases, while flow separation and eddy current losses at the bifurcation angles also decrease, resulting in a decrease in both system pressure drop and pump power. However, it is worth noting that when the width ratio approaches a certain value, the flow resistance of each branch channel tends to be uniform, the room for improvement in flow distribution shrinks, and the rate of decrease in pressure drop and pump power gradually slows down, exhibiting the diminishing marginal returns of width ratio optimization.

[0061] The number of ring branches 4 is ≥3, and they are either continuous closed rings or partially interrupted structures.

[0062] The bifurcation angle of the flow channel connecting channel 3 is 30°-90°.

[0063] The bifurcation angle is the angle at which the flow from the previous branch flow channel splits into the next branch flow channel 2 through the flow channel 3. Figure 11 This diagram illustrates the impact of different bifurcation angles on chip temperature. As the bifurcation angle increases, the chip's highest and average temperatures decrease slightly, but the temperature difference widens slightly, indicating that the bifurcation angle has a relatively small impact on the chip's overall heat dissipation performance and temperature distribution. From a thermal design perspective, increasing the bifurcation angle does not significantly increase the heat transfer area of ​​the core high-heat-flux region, but it effectively shortens the distance between the branch flow paths, thereby shortening the heat conduction path and improving heat transfer efficiency to some extent, leading to a decrease in chip temperature. However, since the impact of this structural parameter change on the flow field distribution is relatively limited, its improvement effect has certain limitations. Figure 12The results show the cross-sectional temperature distribution cloud maps of the biomimetic liquid cooling plate under different bifurcation angles. The results show that as the bifurcation angle increases, the cross-sectional temperature change of the liquid cooling plate is not significant, further verifying that the bifurcation angle has a limited effect on regulating the temperature distribution. Figure 13 This diagram illustrates the impact of different bifurcation angles on the pressure drop and pump power of the biomimetic liquid cooling plate. As the bifurcation angle increases, both the overall system pressure drop and pump power decrease, but the rate of decrease gradually diminishes, with some adjacent angles showing no significant difference. This phenomenon is mainly attributed to the fact that increasing the bifurcation angle significantly weakens flow separation and eddy currents at the bifurcation point, thereby reducing local flow resistance and prompting a redistribution of flow among the branches, leading to a decrease in velocity and consequently, a decrease in pressure drop. However, once the bifurcation angle reaches a certain threshold, the sensitivity of resistance to velocity weakens, resulting in a slower rate of decrease in both pressure drop and pump power.

[0064] There is a depth difference between the first branch channel 21, the second branch channel 22 and the third branch channel 23, and the depth difference is 0-0.7 mm.

[0065] In the data center biomimetic liquid cooling plate, there is a depth difference between the various branch channels 21-23, which ranges from 0 to 0.7. This depth difference is the difference between the depth of the second branch channel and the first branch channel, and also the difference between the depth of the (n+1)th branch channel and the depth of the nth branch channel.

[0066] Figure 14 This embodiment illustrates the effect of a biomimetic liquid cooling plate on chip temperature under different depth differences. The results show that, compared to a structure with equal depth, the chip's maximum and average temperatures are slightly higher when a depth difference exists, but the temperature difference between them is small, and the overall thermal performance remains relatively stable. This is mainly because the introduction of a depth difference does not significantly alter the overall heat conduction path on the chip surface, thus having a limited impact on temperature distribution. Simultaneously, although the flow velocity in the second and third-level branch channels increases due to the depth change, which helps enhance local heat transfer, the corresponding reduction in heat transfer area causes these two effects to offset each other to some extent, thereby maintaining the overall chip temperature at a stable level. Figure 15 The figures show the cross-sectional temperature contours of the biomimetic liquid-cooled plate under different depth differences. It can be observed that the cross-sectional temperature change of the liquid-cooled plate is not significant as the depth difference increases, further verifying the conclusion that the depth difference has little impact on the temperature field. Figure 16A schematic diagram illustrates the impact of different depth differences on the pressure drop and pump power of the biomimetic liquid cooling plate. As the depth difference increases, both the system pressure drop and pump power show an upward trend, with the rate of increase gradually increasing. This is because, on the one hand, the depth difference guides more flow into the first-stage branch channel, significantly increasing the flow velocity and easily forming pressure disturbances and eddies at the bifurcation node, leading to local energy loss; on the other hand, the three-dimensional flow structure with alternating depths causes complex turns in the channels, lengthening the actual flow path and further increasing frictional resistance, thus increasing the overall pressure drop and pump power requirements.

[0067] The branch flow channel is provided with fins 5. The shape of the fins 5 is selected from at least one of the following: rectangle, triangle, derived geometry, or a composite structure composed of main fins and auxiliary fins.

[0068] In data center biomimetic liquid cooling plates, to address the significant heat transfer and flow imbalance caused by high flow velocities in branch channels near the outlet and slow velocities in adjacent branches farther from the outlet, fin structures can be incorporated within the branch channels. The fins can be rectangular, triangular, or other derived shapes, or they can be formed by adding auxiliary fins to the main fins, with the auxiliary fins referencing the main fins. The internal fin structure parameters can be selected and set by comprehensively considering chip temperature, heat transfer coefficient, and flow resistance.

[0069] The lateral spacing between the fins is 0-0.7 mm, and the longitudinal spacing is 0-0.8 mm.

[0070] Taking rectangular fins as an example, the lateral spacing between fins in a data center biomimetic liquid cooling plate is 0-0.7 mm. Figure 17 This embodiment illustrates the effect of different lateral fin spacings on chip temperature. As the lateral spacing increases, the chip's maximum temperature, average temperature, temperature difference, and thermal resistance generally show a trend of first decreasing and then slightly increasing, with relatively small fluctuations. Appropriately increasing the fin spacing is beneficial for improving local flow conditions and temperature distribution; however, when the spacing is too large, the heat transfer area decreases, and the thermal resistance slightly increases. Figure 18 A schematic diagram illustrating the pressure drop and pump power variations of the biomimetic liquid cooling plate under different lateral spacing conditions is presented. As the lateral spacing increases, both pressure drop and pump power increase overall, and the growth trend gradually slows down. When the lateral spacing reaches a certain range, the changes between adjacent data points tend to stabilize, indicating that its influence on the flow resistance of the liquid cooling system tends to saturate.

[0071] The longitudinal spacing between the fins in the biomimetic liquid cooling plate for data centers is 0-0.8.

[0072] Figure 19This embodiment illustrates the effect of different longitudinal spacing between fins on chip temperature. As the longitudinal spacing increases, the chip's maximum temperature, average temperature, and thermal resistance all rise, while the temperature difference remains relatively unchanged. Analysis suggests that increasing the longitudinal spacing between fins reduces the number of fins, decreases the heat exchange area, and weakens fluid turbulence, resulting in lower overall heat exchange efficiency and consequently higher chip temperature. Figure 20 This diagram illustrates the pressure drop and pump power variations of the biomimetic liquid cooling plate under different longitudinal spacing conditions. The results show that as the longitudinal spacing increases, both pressure drop and pump power gradually decrease, but the rate of decrease slows down. This phenomenon indicates that fin sparsity can reduce flow resistance, but its effect on improving pump power consumption gradually weakens under high spacing conditions.

[0073] The height of fin 5 is 0.6-1.6 mm.

[0074] Figure 21 This embodiment provides a schematic diagram illustrating the effect of different fin heights on chip temperature. As the fin height increases, the chip's maximum temperature, average temperature, temperature difference, and thermal resistance all show a decreasing trend. Increasing the fin height helps to enhance fluid turbulence, interrupt the temperature boundary layer, and improve the heat transfer efficiency in the bottom region of the chip, thereby enhancing overall cooling performance. Figure 22 The diagram illustrates the pressure drop under different fin heights. Both the pressure drop and pump power of the biomimetic liquid-cooled plate increase with increasing fin height. As the fin height increases, the flow disturbance within the channel intensifies, leading to more local eddies and increased flow resistance, which in turn increases the pressure drop and pump power. However, when the fin height approaches the channel height, the fluid space becomes limited, further restricting the increase in disturbance and causing the growth trend of pressure drop and pump power to level off.

[0075] This biomimetic liquid cooling plate structure can not only effectively improve heat exchange efficiency and reduce system pressure drop and pump power consumption, but also meet the heat dissipation requirements of higher power chips. Figure 23The diagram illustrates the effect of inlet flow rate on chip temperature under three cooling structures: traditional liquid cooling plate, biomimetic liquid cooling plate, and improved biomimetic liquid cooling plate. The influence of inlet flow rate on chip temperature under these three structures follows this pattern: As the inlet flow rate increases from 450 mL / min to 600 mL / min, both the maximum and average chip temperatures decrease under all three liquid cooling plate conditions. Specifically, within this flow rate range, with the traditional liquid cooling plate, the maximum chip temperature is 74.18℃~80.21℃, and the average temperature is 66.25℃~72.51℃; with the biomimetic liquid cooling plate, the maximum chip temperature decreases by 18.61℃~19.69℃, and the average temperature decreases by 12.74℃~13.71℃; further, with the improved biomimetic liquid cooling plate, the maximum chip temperature decreases by 2.89℃~4.08℃, and the average temperature decreases by 2.85℃~3.99℃. The above results demonstrate that the biomimetic liquid cooling plate exhibits a significant improvement in heat transfer performance compared to the traditional liquid cooling plate. The improved biomimetic liquid cooling plate, further optimized, possesses even better heat transfer capabilities. Furthermore, regarding temperature uniformity, within the same inlet flow range, the difference between the highest and average chip temperature under the traditional liquid cooling plate can reach a maximum of 7.93℃, while the difference is only 1.90℃ and 1.83℃ for the biomimetic and improved biomimetic liquid cooling plates, respectively. This indicates that the latter two significantly improve the temperature uniformity of the chip's working surface. Figure 24 The diagram illustrates the influence of inlet flow rate on the pressure drop and pump power of three types of liquid cooling plates. As the flow rate increases, both the pressure drop and pump power of the three liquid cooling plate systems increase accordingly. Specifically, within the inlet flow rate range of 450 ml / min to 600 ml / min, the pressure drop and pump power of the traditional liquid cooling plate are 289.39 Pa to 535.05 Pa and 0.130 W to 0.348 W, respectively. In contrast, the pressure drop and pump power of the biomimetic liquid cooling plate are reduced by 25.58% to 26.22%, respectively. While the improved biomimetic liquid cooling plate, by introducing a finned turbulence structure, further enhances heat transfer performance, its pressure drop and pump power increase by 25.45% to 25.58% compared to the biomimetic liquid cooling plate, approaching the levels of the traditional liquid cooling plate. Figure 25 The diagram illustrates the impact of chip power on chip temperature, showing that as chip power increases, both the maximum and average chip temperatures under the three liquid cooling plates rise accordingly. When the chip power is below 600W, all three liquid cooling plates can meet the chip's thermal management requirements. When the power is in the range of 600W to 800W, only the bionic liquid cooling plate and the improved bionic liquid cooling plate can keep the chip temperature within a safe range, while the traditional liquid cooling plate cannot meet the heat dissipation requirements. When the chip power reaches 900W, only the improved bionic liquid cooling plate can still ensure heat dissipation, and the chip temperature does not exceed the safe threshold.

[0076] In summary, under the design conditions, the traditional liquid cooling plate, the bionic liquid cooling plate, and the improved bionic liquid cooling plate can respectively meet the maximum heat dissipation power of the chip of 500W, 800W, and 900W, demonstrating the application potential and superior performance of the improved bionic structure under high heat flux density conditions.

[0077] Compared with the prior art, the embodiments of this application have the following beneficial effects: First, by simulating the configuration of radial main veins and annular branch veins in Victoria amazonica leaves, the coolant achieves multi-path, uniform and continuous turbulent flow in the internal channels of the liquid cooling plate.

[0078] Secondly, by adjusting the number of first branch channels and optimizing structural parameters such as the length ratio, width ratio, bifurcation angle, and depth difference of the branch channels, the problems of uneven fluid distribution, low local heat exchange efficiency, and large pressure drop in traditional liquid cooling channels were solved.

[0079] Third, finned structures can be optionally arranged inside the branch flow channels to further increase the intensity of fluid turbulence and expand the heat exchange area. The arrangement of fins can significantly improve the overall heat dissipation performance and system stability, ensuring the stable operation of electronic devices in demanding application scenarios such as data centers.

[0080] Fourth, it is particularly suitable for applications with high requirements for thermal management, such as data centers. Through the above innovative design, the liquid cooling plate can effectively cope with the heat generated by high-power chips in data centers, avoid equipment performance degradation or failure due to insufficient heat dissipation, and ensure the reliable operation of data centers.

[0081] Fifth, through the combination of biomimetic design and structural optimization, not only is the heat transfer efficiency of the liquid cooling plate improved, but pressure drop and pump power consumption are also reduced, temperature distribution is optimized, and the formation of local hot spots is avoided. This comprehensive performance improvement enables the liquid cooling plate to have superior heat dissipation performance under high heat flux density conditions, meeting the ever-increasing heat dissipation needs of future data centers.

[0082] In summary, this application discloses a three-dimensional biomimetic liquid cooling plate for data centers, comprising a centrally located liquid inlet, multi-level branch channels, channel connecting channels, multi-level annular branches, optional fins, and a liquid outlet. The multi-level branch channels include a first branch channel, a second branch channel, and a third branch channel connected in sequence. The multi-level annular branches include a first annular branch, a second annular branch, and a third annular branch nested in sequence. Coolant flows into the first branch channel from the liquid inlet, is distributed to the first and second annular branches via the channel connecting channels, and connects to the next level of branch channels through the annular branches, finally converging at the liquid outlet through the third annular branch. The number of first branch channels is adjusted, and structural parameters such as the length ratio, width ratio, bifurcation angle, and depth difference of the branch channels are optimized. Optional fin structures are provided inside the branch channels to enhance fluid turbulence, expand the heat exchange area, and improve overall heat dissipation performance and system stability.

[0083] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A three-dimensional biomimetic liquid cooling plate for a data center, characterized in that, It includes a centrally located liquid inlet (1), a multi-level branch flow channel (2), a flow channel connection channel (3), a multi-level annular branch (4), optional fins (5), and a liquid outlet (6). The multi-level branch flow channel (2) includes a first branch flow channel (21), a second branch flow channel (22) and a third branch flow channel (23) connected in sequence. The multi-level ring branch (4) includes a first ring branch (41), a second ring branch (42) and a third ring branch (43) nested in sequence. Coolant flows into the first branch channel (21) from the inlet (1), and is divided into the first annular branch (41) and the second branch channel (22) through the channel connection channel (3). It then connects with the next level branch channel through the annular branch (4) and finally converges to the outlet (6) through the third annular branch (43).

2. The data center three-dimensional biomimetic liquid cooling plate as described in claim 1, characterized in that, The number of first branch channels (21) is ≥4, and the first branch channels (21), second branch channels (22) and third branch channels (23) are connected to the corresponding first annular branches (41), second annular branches (42) and third annular branches (43) through the channel connection channel (3).

3. The data center three-dimensional biomimetic liquid cooling plate as described in claim 1, characterized in that, The length ratio of the first branch channel (21), the second branch channel (22), and the third branch channel (23) is 0.4-1.

4. The data center three-dimensional bionic liquid cooling plate as described in claim 1, characterized in that, The width ratio of the first branch channel (21), the second branch channel (22), and the third branch channel (23) is 0.3-1.

5. The data center three-dimensional biomimetic liquid cooling plate as described in claim 1, characterized in that, The number of the ring branches (4) is ≥3, and they are either continuous closed rings or partially interrupted structures.

6. The data center three-dimensional biomimetic liquid cooling plate as described in claim 1, characterized in that, The bifurcation angle of the flow channel connecting channel (3) is 30°-90°.

7. The data center three-dimensional biomimetic liquid cooling plate as described in claim 1, characterized in that, There is a depth difference between the first branch channel (21), the second branch channel (22) and the third branch channel (23), and the depth difference is 0-0.7 mm.

8. The data center three-dimensional biomimetic liquid cooling plate as described in claim 1, characterized in that, The branch channel is provided with fins (5), the shape of which is selected from at least one of rectangle, triangle, derived geometry, or a composite structure composed of main fins and auxiliary fins.

9. The data center three-dimensional biomimetic liquid cooling plate as described in claim 1, characterized in that, The transverse spacing between the fins (5) is 0-0.7 mm, and the longitudinal spacing is 0-0.8 mm.

10. The data center three-dimensional biomimetic liquid cooling plate as described in claim 1, characterized in that, The height of the fin (5) is 0.6-1.6 mm.

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