Wafer expanding equipment and method of electronic component

Abstract

The invention discloses wafer expanding equipment and method for an electronic element, and belongs to the technical field of automation. The wafer expanding equipment comprises a fixed table, a movable table and a lifting mechanism. And the wafer expanding equipment can acquire second images of the plurality of electronic components on the fixed table through the second camera. And the wafer expansion equipment controls the mobile station to move to start wafer expansion only after determining that the distance between the central point of the orthographic projection of the area where the plurality of electronic elements are located on the bearing surface of the fixed station and the central point of the bearing surface of the fixed station is smaller than a first preset threshold value through the second image. And in the wafer expansion process, the wafer expansion equipment can acquire the position information of the plurality of electronic elements in real time through the second camera, and when the wafer expansion equipment monitors that the position information of the plurality of electronic elements meets or approaches a target condition, the mobile station is controlled to stop moving so as to stop wafer expansion. Therefore, a plurality of electronic elements in the first substrate obtained after wafer expansion treatment of the wafer expansion equipment can meet or approach the target condition, and the wafer expansion precision is improved.

Description

[0001] This application claims priority to Chinese Patent Application No. 202410585494.8, filed on May 11, 2024, entitled "Transfer apparatus and method, system, die expansion apparatus and sorting apparatus for electronic components", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of automation technology, and in particular to a die expansion device and method for electronic components. Background Technology

[0003] With the development of display technology, LED (Light-Emitting Diode) light-emitting elements have advantages such as pure color, wide dynamic range, high brightness, high definition, low operating voltage, low power consumption, long life, impact resistance, wide viewing angle, and stable and reliable operation. Therefore, display substrates integrating LED light-emitting elements have become the most advantageous new generation of display media and have been widely used.

[0004] LED light-emitting elements are typically mounted on a driver backplane, and these elements emit light under the drive of the backplane. Usually, a transfer device is needed to mount the LED light-emitting elements onto the driver backplane. Furthermore, before mounting the LED light-emitting elements onto the driver backplane, they need to be expanded using a die-expanding device.

[0005] However, the arrangement accuracy of LED light-emitting elements after crystal expansion processing using current crystal expansion equipment is relatively low. Summary of the Invention

[0006] This application provides a die expansion device and method for electronic components. It can solve the problem of low arrangement accuracy of LED light-emitting elements after die expansion in the prior art. The technical solution is as follows:

[0007] Firstly, an improved device for transferring electronic components includes:

[0008] abutment;

[0009] A first platform movably connected to the base, the first platform being used to support a first substrate, the first substrate being a flexible substrate, and the first substrate including multiple electronic components;

[0010] A second platform is located on the base, the second platform is used to support the second substrate, and the second substrate has multiple connecting portions;

[0011] And a transfer head movably connected to the base, the transfer head including a first ejector pin, the first ejector pin being configured to: after the first substrate and the second substrate are aligned under the driving action of the first stage, apply a force to the side of the first substrate away from the second substrate, so as to transfer the electronic components disposed on the side of the first substrate facing the second substrate to the connecting portion of the second substrate.

[0012] Wherein, after the first substrate and the second substrate are aligned, the plurality of electronic components include a plurality of target electronic components, the plurality of target electronic components include a first electronic component and a second electronic component, the second substrate includes a plurality of target connection portions, the target connection portions include a first connection portion and a second connection portion;

[0013] The transfer device is configured such that, in a first transfer mode, after the first electronic component is transferred to the first connecting portion, while controlling the first ejector pin to move toward the second electronic component, the first stage is controlled to perform a regional displacement, so that after the first ejector pin reaches the side of the second electronic component away from the first substrate, the second electronic component and the second connecting portion are positioned opposite each other.

[0014] The regional displacement is controlled by either keeping the first platform stationary relative to the base or by having the first platform move the first substrate within a first preset region, where the first preset region is the region formed around the second connecting portion.

[0015] Optionally, the plurality of electronic components include multiple rows of electronic components, each electronic component in a row of electronic components is arranged along a first direction, and the plurality of target electronic components are located in the same row of electronic components;

[0016] The second substrate includes multiple rows of connecting portions, each of the connecting portions in one row is arranged along a first direction, and the multiple target connecting portions are located in the same row of connecting portions.

[0017] Optionally, the plurality of electronic components are arranged in an array of N columns along the first direction and in an array of M rows along the second direction, the second direction intersecting the first direction; M and N are both positive integers;

[0018] The transfer device is configured to: during the current alignment process of the first substrate and the second substrate, after the plurality of target connection portions are connected to the corresponding electronic components, control the first stage to move the first substrate relative to the base, so that at least one connection portion on the second substrate that is not aligned with the target connection portion is aligned with at least one electronic component, thereby realizing another alignment of the first substrate and the second substrate.

[0019] Optionally, during the J-th alignment process between the first substrate and the second substrate, at least two of the electronic components transferred to the second substrate come from the K-th row of electronic components; J is a positive integer, and K is an integer less than or equal to M;

[0020] When other electronic components are also distributed in the Kth row of electronic components, the first stage is configured to move the first substrate relative to the base along the first direction and the second direction, such that during the J+1th alignment process between the first substrate and the second substrate, at least two of the electronic components transferred to the second substrate also come from the Kth row of electronic components.

[0021] Optionally, when all the electronic components in the Kth row have been transferred to the second substrate, the first stage is configured to move the first substrate relative to the stage along the first direction and the second direction, such that during the J+1th alignment of the first substrate and the second substrate, at least two of the electronic components transferred to the second substrate come from another row of electronic components that are different from the electronic components in the Kth row.

[0022] Optionally, during the J-th alignment process between the first substrate and the second substrate, at least two of the electronic components transferred to the second substrate come from the K-th row of electronic components; J is a positive integer, and K is an integer less than or equal to M;

[0023] When K is less than or equal to Mn, the first stage is configured to: move the first substrate relative to the base along the second direction, such that during the J+1th alignment of the first substrate and the second substrate, at least two of the electronic components transferred to the second substrate come from the K+nth row of electronic components.

[0024] Where n is a positive integer.

[0025] Optionally, during the Jth alignment process between the first substrate and the second substrate, the number of electronic elements that can be distributed between two adjacent electronic elements transferred to the second substrate in the Kth row of electronic elements is n-1.

[0026] Optionally, when K is greater than Mn, the first stage is configured to: move the first substrate relative to the base along the first direction by a first distance or along the second direction by a second distance;

[0027] Wherein, the first distance is greater than or equal to the distribution width of the N columns of electronic components distributed in the first direction on the first substrate; the second distance is greater than or equal to the distribution width of the M rows of electronic components distributed in the second direction on the first substrate.

[0028] Optionally, the transfer device is configured to: sequentially transfer at least two of the electronic components to at least two connecting portions in the Lth row of the connecting portion in a first transfer direction, and then sequentially transfer at least two of the electronic components to at least two connecting portions in the L+1th row of the connecting portion in a second transfer direction;

[0029] Where L is a positive integer; the first transfer direction is opposite to the second transfer direction, and both are parallel to the first direction.

[0030] Optionally, in the first direction, the center distance between two adjacent connecting portions on the second substrate is an integer multiple of the center distance between two adjacent electronic components on the first substrate.

[0031] Optionally, in a second direction intersecting the first direction, the center distance between two adjacent connecting portions on the second substrate is an integer multiple of the center distance between two adjacent electronic components on the first substrate.

[0032] Optionally, the transfer device is configured to control the first stage to remain stationary relative to the base when the orthographic projection of the second electronic component on the second substrate is located within a second preset area;

[0033] The second preset region is located inside the first preset region.

[0034] Optionally, the transfer device is configured to: when the orthographic projection of the second electronic component on the second substrate is located within a first preset area but outside the second preset area, control the first stage to move the first substrate within the first preset area, so that the second electronic component is located within the second preset area, and then after the first ejector pin reaches the side of the second electronic component away from the first substrate, the second electronic component and the second connecting portion are positioned opposite each other.

[0035] Optionally, the plurality of target electronic components further include a third electronic component located between the first electronic component and the second electronic component; the plurality of target connecting portions include a third connecting portion located between the first connecting portion and the second connecting portion;

[0036] The transfer device is configured such that, in the first transfer mode, after the first electronic component is transferred to the first connecting portion, while moving the first ejector pin toward the second electronic component, the first stage is controlled to perform a regional displacement, so that after the first ejector pin reaches the side of the second electronic component away from the first substrate, the second electronic component and the second connecting portion are positioned opposite each other.

[0037] The transfer device is configured to: in a second transfer mode, control the first stage to move the first substrate relative to the base, so that the first substrate and the second substrate are aligned, and transfer the third electronic component to the third connecting part through the first ejector pin;

[0038] The transfer device is configured to perform either the first transfer mode first and then the second transfer mode, or the second transfer mode first and then the first transfer mode.

[0039] Optionally, in the first transfer mode, the condition under which the first ejector pin does not transfer the third electronic component is: after the action of transferring the first electronic component to the first connecting part is completed, the orthographic projection of the third electronic component on the second substrate is or should be outside the third preset area.

[0040] The third preset region is the region formed around the third connecting part.

[0041] Optionally, the size and shape of the third preset region are the same as the size and shape of the first preset region;

[0042] The position of the boundary of the third preset region relative to the third connecting part is the same as the position of the first preset region relative to the first connecting part.

[0043] Optionally, in the first direction, the width of the first preset region is less than K1 times the distance between two adjacent connecting portions;

[0044] In the second direction, the width of the first preset region is less than K2 times the distance between two adjacent connecting parts, where both K1 and K2 are less than 2.

[0045] Optionally, the shape of the first preset area is a rectangle or an ellipse.

[0046] Optionally, the center of the first preset region coincides with the center of the connecting portion.

[0047] Optionally, the transfer device further includes: a first support frame, which is movably connected to the base and the first platform;

[0048] The first support frame can move together with the first platform relative to the base along the fourth direction, and the first platform can move relative to the first support frame along the fifth direction; the fourth direction and the fifth direction intersect.

[0049] Optionally, the transfer device further includes: a second support frame, which is movably connected to the base and the second platform;

[0050] The second support frame can drive the transfer head to move together with the base along the fourth direction, and the first platform can move relative to the second support frame along the fifth direction.

[0051] Optionally, the transfer head further includes a first camera disposed adjacent to the first ejector pin, the first camera being used to simultaneously capture a first image containing the first substrate and the second substrate after the first substrate and the second substrate are aligned.

[0052] Optionally, the electronic component is a light-emitting diode (LED).

[0053] Secondly, a method for transferring electronic components is also provided, applied to an electronic component transfer device. The transfer device includes: a base, a first stage movably connected to the base, a second stage located on the base, and a transfer head movably connected to the base; the first stage is used to support a first substrate, the first substrate being a flexible substrate, and the first substrate including multiple electronic components; the second stage is used to support a second substrate, and the second substrate having multiple connecting portions; the transfer head includes a first ejector pin; the method includes:

[0054] The first stage is controlled to move relative to the base to align the first substrate and the second substrate; the plurality of electronic components include a plurality of target electronic components, the plurality of target electronic components include a first electronic component and a second electronic component, the second substrate includes a plurality of target connection portions, the target connection portions include a first connection portion and a second connection portion;

[0055] In the first transfer mode, after applying a force to the side of the first substrate away from the second substrate through the first ejector pin to transfer the first electronic component disposed on the side of the first substrate facing the second substrate to the first connecting portion of the second substrate, while controlling the first ejector pin to move toward the second electronic component, the first stage is controlled to perform regional displacement so that after the first ejector pin reaches the side of the second electronic component away from the first substrate, the second electronic component is disposed opposite to the second connecting portion.

[0056] The regional displacement refers to controlling the first platform to remain stationary relative to the base or the first platform to move the first substrate within a first preset region, where the first preset region is the region formed around the second connecting portion.

[0057] Thirdly, a die expansion device is also provided, including:

[0058] A fixed platform is used to support a first flexible carrier film and a crystal expander ring disposed in contact with the first flexible carrier film. The first flexible carrier film includes multiple electronic components, and the orthographic projections of the multiple electronic components on the carrier surface of the fixed platform are all located within the area enclosed by the orthographic projections of the crystal expander ring on the carrier surface of the fixed platform.

[0059] A movable platform is distributed around the fixed platform, and the movable platform is connected to the edge portion of the first flexible support membrane.

[0060] A lifting mechanism is provided in a third-party upward orientation relative to the fixed platform, and the lifting mechanism is connected to the expansion ring;

[0061] The crystal expansion device is configured to: move the edge portion of the first flexible carrier film upward in a third direction via the moving stage, perform crystal expansion processing on the portion of the first flexible carrier film located on the fixed stage, then control the moving stage to stop moving, and simultaneously control the lifting mechanism to move upward toward the fixed stage in a third direction until the crystal expansion mother ring and the crystal expansion daughter ring are engaged and connected to obtain the first substrate.

[0062] Optionally, the die expansion device is configured to: before expanding the portion of the first flexible carrier film located on the fixed platform, obtain the positional relationship between the center point of the orthographic projection of the region where the plurality of electronic components are located on the carrier surface of the fixed platform and the center point of the carrier surface of the fixed platform; and after determining that the distance between the center point of the orthographic projection of the region where the plurality of electronic components are located on the carrier surface of the fixed platform and the center point of the carrier surface of the fixed platform is less than a first preset threshold, control the moving stage to drive the edge portion of the first flexible carrier film to move upward in a third direction.

[0063] Optionally, the first flexible support film further includes a marking portion;

[0064] The die expansion device is configured to: obtain the distance between the center point of the orthographic projection of the region where the plurality of electronic components are located on the bearing surface of the fixed stage and the center point of the bearing surface of the fixed stage, based on the positional relationship between the marking portion and the center point of the bearing surface of the fixed stage.

[0065] Optionally, the marking portion may be a scratch mark, ink mark, or coating mark disposed on the first flexible carrier film or the electronic component.

[0066] Optionally, the marking portion is located at the center point of the area where the plurality of electronic components are located.

[0067] Optionally, the die expansion device is configured to: during the die expansion process of the portion of the first flexible carrier film located on the fixed stage, obtain the size of the outer boundary of the region where the plurality of electronic components are located, and after determining that the outer boundary size of the region where the plurality of electronic components are located has been expanded to a preset size, control the moving stage to stop moving.

[0068] Optionally, the die expansion device is further configured to: after the die expansion sub-ring and the die expansion mother ring are fastened together to obtain the first substrate, if the area where the plurality of electronic components are located is located within the area enclosed by the inner boundary of the die expansion sub-ring, and in the direction parallel to the bearing surface of the fixed stage, the minimum distance between the outer boundary of the area where the plurality of electronic components are located and the inner boundary of the die expansion sub-ring is less than a second preset threshold, then the first substrate is subjected to inward shrinkage processing.

[0069] Optionally, the fixed stage is also used to support the third flexible carrier film, and the movable stage is also used to connect with the edge portion of the third flexible carrier film; the crystal expansion device is configured to: drive the edge portion of the third flexible carrier film to move upward on the third third party through the movable stage, so as to stretch the portion of the third flexible carrier film located on the fixed stage, and then control the movable stage to stop moving; and after the portion of the third flexible carrier film located on the fixed stage is connected to the first flexible carrier film in the first substrate, drive the edge portion of the third flexible carrier film to move upward on the third third party through the movable stage, so that the portion of the connected third flexible carrier film located on the fixed stage and the first flexible carrier film in the first substrate retract synchronously, and then fasten the new crystal expansion mother ring and the new crystal expansion daughter ring to obtain the first substrate after shrinkage.

[0070] Optionally, the third flexible carrier film has an auxiliary sub-ring and an auxiliary mother ring that are fastened together, and the first substrate is located in the area enclosed by the auxiliary sub-ring.

[0071] Optionally, the die expansion device further includes: a second camera disposed opposite to the fixed stage in a third-party direction, wherein the orthographic projection of the second camera on the bearing surface of the fixed stage is located within the area enclosed by the orthographic projection of the die expansion ring on the bearing surface of the fixed stage, and the second camera is used to acquire a second image.

[0072] Optionally, the die expansion device further includes: a support base, which is fixedly connected to the fixed stage and movably connected to the movable stage, the movable stage being movable relative to the support base in the third direction.

[0073] Optionally, the movable platform includes: an annular support plate, and a plurality of connecting columns connected to the support plate, wherein the ends of the plurality of connecting columns opposite to the support plate are movably connected to the support base;

[0074] The fixed platforms are distributed within the area enclosed by the support plate.

[0075] Optionally, the movable platform further includes: an elastic element sleeved on the connecting column, the two ends of the elastic element being distributed to abut against the bearing plate and the support base.

[0076] Optionally, the die expansion device further includes: multiple track components distributed around the periphery of the moving stage, and multiple drive motors connected to each of the multiple track components in a one-to-one correspondence;

[0077] The track component extends along the third direction, and the drive motor is configured to move relative to the track component in the third direction, and after contacting the side of the support plate away from the connecting column, drive the support plate to move toward the support base.

[0078] Optionally, each of the drive motors is a servo motor.

[0079] Fourthly, a die expansion method for electronic components is also provided, applied to a die expansion device for electronic components. The die expansion device includes: a fixed stage, a movable stage distributed around the fixed stage, and a lifting mechanism disposed opposite to the fixed stage in a third direction. The fixed stage is used to support a first flexible carrier film and a die expansion sub-ring disposed in contact with the first flexible carrier film. The first flexible carrier film includes multiple electronic components, and the orthographic projections of the multiple electronic components on the carrier surface of the fixed stage are all located within the area enclosed by the orthographic projections of the die expansion sub-rings on the carrier surface of the fixed stage. The movable stage is connected to the edge portion of the first flexible carrier film. The lifting mechanism is connected to the die expansion mother ring, and the third direction is perpendicular to the carrier surface of the fixed stage.

[0080] The method includes: moving the edge portion of the first flexible carrier film upward in a third direction via the moving stage to expand the crystal in the portion of the first flexible carrier film located on the fixed stage; then controlling the moving stage to stop moving; and simultaneously controlling the lifting mechanism to move upward toward the fixed stage in a third direction until the crystal expansion mother ring and the crystal expansion daughter ring are engaged and connected to obtain the first substrate.

[0081] Fifthly, a sorting device for electronic components is also provided, comprising:

[0082] A third stage is used to support a second flexible support film, on which a plurality of initial electronic components are disposed, and at least two of the plurality of initial electronic components are of different types.

[0083] The fourth platform is used to support the first flexible support film, and the first flexible support film and the second flexible support film are arranged opposite each other in a third direction;

[0084] A second ejector pin located on the side of the second flexible support membrane opposite to the first flexible support membrane;

[0085] And, a support top platform located on the side of the first flexible carrier film away from the second flexible carrier film, the support top platform and the second pin are disposed opposite each other in the third direction, and the side of the support top platform facing the first flexible carrier film layer is in contact with a portion of the first flexible carrier film;

[0086] Wherein, after at least one of the initial electronic components is distributed in the third direction between the second ejector pin and the support top platform, the second ejector pin is used to apply pressure to at least one of the initial electronic components to transfer at least one of the initial electronic components to the portion of the first flexible carrier film that contacts the support top platform, and the types of each electronic component transferred to the first flexible carrier film are the same.

[0087] Optionally, the supporting top platform protrudes from the side of the first flexible bearing membrane facing the fourth platform facing the third platform.

[0088] Optionally, in the third direction, the distance between the side of the supporting top platform facing the first flexible carrier film and the side of the fourth platform facing the third platform is greater than or equal to the thickness of the electronic component.

[0089] Optionally, the side of the support top platform facing the first flexible bearing membrane is a first plane, and after the support top platform and one of the initial electronic components are arranged opposite each other in the third direction, the orthographic projection of the initial electronic component on the first plane is located in the first plane.

[0090] Optionally, the first plane is circular in shape, and the diameter of the circle is greater than the width of the initial electronic element in the first direction and greater than the width of the initial electronic element in the second direction.

[0091] Optionally, the support top platform also has a transition surface located between the first plane and the side surface of the support top platform.

[0092] Optionally, the transition surface is an arc-shaped convex surface, and the radius of the transition surface is greater than or equal to 15 micrometers.

[0093] Optionally, the plurality of initial electronic components are distributed on the side of the second flexible carrier film facing the first flexible carrier film.

[0094] Optionally, the side of the second ejector pin facing the first flexible bearing film layer is the second plane.

[0095] Optionally, the sorting device further includes: a first moving mechanism connected to the third platform, a second moving mechanism connected to the fourth platform, and a third moving mechanism connected to the second ejector pin;

[0096] The first moving mechanism is used to drive the third platform to move in the first direction and the second direction;

[0097] The second moving mechanism is used to move the fourth platform in the first direction and the second direction;

[0098] The third moving mechanism is used to drive the second ejector pin to move upward on the third party;

[0099] Wherein, the first direction intersects with the second direction, and both intersect with the third direction.

[0100] Optionally, the sorting device further includes a third camera fixedly connected to the support platform, the third camera being used to acquire a third image of the electronic components transferred onto the second carrier film.

[0101] Sixthly, an electronic component transfer system is also provided, comprising: the transfer device described above, and at least one of the die expansion device and the sorting device described above.

[0102] The beneficial effects of the technical solutions provided in this application include at least the following:

[0103] Using the second camera in the die expansion equipment, the equipment only controls the moving stage to begin die expansion after determining that the distance between the center point of the orthographic projection of the area containing multiple electronic components on the first flexible carrier film onto the bearing surface of the fixed stage and the center point of the bearing surface of the fixed stage is less than a first preset threshold. This ensures that the multiple electronic components in the first substrate obtained after die expansion are located in the central region of the first substrate. Furthermore, the second camera allows the die expansion equipment to acquire the positional information of the multiple electronic components in the first flexible carrier film in real time. During the die expansion process on the first flexible carrier film, when the equipment detects that the positional information of the multiple electronic components in the first flexible carrier film meets or is close to the target conditions, the equipment can control the moving stage to stop moving and control the lifting mechanism to engage the die expansion mother ring and die expansion daughter ring to obtain the first substrate. Thus, through the second camera, the multiple electronic components in the first substrate obtained after die expansion by the equipment can meet or be close to the target conditions, improving the die expansion accuracy. Attached Figure Description

[0104] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0105] Figure 1 This is a schematic diagram of the structure of an electronic component sorting device provided in an embodiment of this application;

[0106] Figure 2 This is a schematic diagram of the structure of a die expansion device for electronic components provided in an embodiment of this application;

[0107] Figure 3 This is a top view of a first substrate provided in an embodiment of this application;

[0108] Figure 4 This is a schematic diagram of the structure of an electronic component transfer device provided in an embodiment of this application;

[0109] Figure 5 This is a side view of an electronic component transfer device provided in an embodiment of this application;

[0110] Figure 6 This is a top view of an electronic component transfer device provided in an embodiment of this application;

[0111] Figure 7 This is a partial top view of a first substrate and a second substrate after alignment, provided in an embodiment of this application.

[0112] Figure 8This is a partial top view of another first substrate and second substrate after alignment, provided in an embodiment of this application;

[0113] Figure 9 This is a partial top view of the first substrate and the second substrate after alignment, as provided in another embodiment of this application;

[0114] Figure 10 This is a top view of a first substrate provided in an embodiment of this application;

[0115] Figure 11 This is a top view of a second substrate provided in an embodiment of this application;

[0116] Figure 12 This is a top view of a first substrate and a second substrate after the Jth alignment, as provided in an embodiment of this application.

[0117] Figure 13 This is a top view of a first substrate and a second substrate after the (J+1)th alignment, as provided in an embodiment of this application.

[0118] Figure 14 This is a top view of another first substrate and second substrate after the Jth alignment provided in an embodiment of this application;

[0119] Figure 15 This is a top view of another first substrate and second substrate after the (J+1)th alignment provided in the embodiments of this application;

[0120] Figure 16 This is a top view of the first substrate and the second substrate after the Jth alignment, as provided in another embodiment of this application.

[0121] Figure 17 This is a top view of another embodiment of the present application after the first substrate and the second substrate have been aligned for the (J+1)th time.

[0122] Figure 18 This is a top view of a second substrate mating with a first substrate, provided in an embodiment of this application;

[0123] Figure 19 This is a schematic diagram showing the distribution of remaining electronic components after electronic components in a first substrate are transferred to a die-bonding partition of a second substrate, according to an embodiment of this application.

[0124] Figure 20 This is a partial top view of another embodiment of the present application after the first substrate and the second substrate are aligned;

[0125] Figure 21 This is a schematic diagram of the structure of another electronic component sorting device provided in an embodiment of this application;

[0126] Figure 22 This is a schematic diagram of the structure of another sorting device provided in the embodiments of this application;

[0127] Figure 23 This is a simplified diagram of a sorting device.

[0128] Figure 24 This is a top view of another sorting device provided in the embodiments of this application;

[0129] Figure 25 This is a schematic diagram of a crystal expansion device carrying a first flexible carrier film, provided in an embodiment of this application;

[0130] Figure 26 This is a schematic diagram illustrating the connection between the die expansion sub-ring and the die expansion mother ring after die expansion is completed, provided in an embodiment of this application.

[0131] Figure 27 This is a top view of a first flexible bearing membrane located on a fixed platform, as provided in an embodiment of this application;

[0132] Figure 28 This is a top view of another first substrate provided in an embodiment of this application;

[0133] Figure 29 This is a top view of another first flexible bearing membrane located on a fixed platform according to an embodiment of this application;

[0134] Figure 30 This is a schematic diagram of a die expansion device controlling a second camera to reach the focal length position, provided in an embodiment of this application.

[0135] Figure 31 This is a top view of another type of first flexible bearing membrane located on a fixed platform, provided in an embodiment of this application;

[0136] Figure 32 This is a top view of yet another first substrate provided in an embodiment of this application;

[0137] Figure 33 This is a schematic diagram of a fixed platform for an expansion device supporting a third flexible support membrane, provided in an embodiment of this application.

[0138] Figure 34 This is a schematic diagram of a third flexible bearing membrane provided in this application embodiment, which has an auxiliary sub-ring and an auxiliary mother ring after stretching;

[0139] Figure 35 This is a schematic diagram of a first flexible bearing membrane and a third flexible bearing membrane connected according to an embodiment of this application;

[0140] Figure 36This is a schematic diagram showing the snap-fit ​​connection between the expansion ring and the expansion mother ring after the first flexible carrier film and the third flexible carrier film have shrunk inward, according to an embodiment of this application.

[0141] Figure 37 This is a schematic diagram illustrating the position of a second camera at focal length, as provided in an embodiment of this application.

[0142] Figure 38 This is a schematic diagram of a die expansion device provided in an embodiment of this application performing a die expansion process;

[0143] Figure 39 This is a schematic diagram of the snap-fit ​​connection between the expansion ring and the expansion ring after the expansion is completed, provided in an embodiment of this application. Detailed Implementation

[0144] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0145] This application provides a system for transferring electronic components. This system may include at least one of an electronic component sorting device, a die-expanding device, and an electronic component transfer device. For example, the electronic component sorting device, the die-expanding device, and the electronic component transfer device can all be devices within this system.

[0146] Please refer to this. Figure 1 , Figure 1 This is a schematic diagram of an electronic component sorting device provided in an embodiment of this application. The electronic component sorting device 100 can be used to sort a plurality of initial electronic components 011 carried on a second flexible carrier film 010 to form a plurality of electronic components 021 on at least one first flexible carrier film 020. The plurality of electronic components 021 in the first flexible carrier film 020 are electronic components of the same type among the plurality of initial electronic components 011 in the second flexible carrier film 010.

[0147] It should be noted that although the multiple initial electronic components 011 in a second flexible carrier film 010 are manufactured through the same process, some of these initial electronic components 011 have different emission wavelengths, and / or luminous efficiency, and / or forward voltage. Here, initial electronic components 011 whose emission wavelengths, luminous efficiency, and forward voltage are within the same range are considered to be of the same type. Therefore, the electronic component sorting device 100 can transfer these same-type electronic components from the multiple initial electronic components 011 in the second flexible carrier film 010 to at least one first flexible carrier film 020, thereby forming multiple electronic components 021 on the first flexible carrier film 020. That is, all electronic components 021 carried by a first flexible carrier film 020 are of the same type. In this way, after the various electronic components 021 in the first flexible carrier film 020 are subsequently die-bonded, the differences between the various electronic components in the resulting display panel are small, which in turn makes the display panel of the subsequent obtained display panel have a better display effect.

[0148] Please refer to Figure 2 , Figure 2 This is a schematic diagram of a die-expansion apparatus for an electronic component provided in an embodiment of this application. The die-expansion apparatus 200 can be used to expand the first flexible carrier film 020 to obtain a first substrate 030. For example, please refer to... Figure 3 , Figure 3 This is a top view of a first substrate provided in an embodiment of this application. After the first flexible carrier film 020 undergoes a die expansion process, the die expansion device 200 for electronic components can also be used to connect the mother-daughter ring 031 to the edge portion of the first flexible carrier film 020 after the die expansion process. After the mother-daughter ring 031 is connected to the edge portion of the first flexible carrier film 020 after the die expansion process, the first substrate 030 can be obtained. That is, the first substrate 030 may include: the first flexible carrier film 020, a plurality of electronic components 021 located on the first flexible carrier film 020, and the mother-daughter ring 031 connected to the edge portion of the first flexible carrier film 020.

[0149] It should be noted that, as Figure 3As shown, a setting area Q can be provided in the central portion of the first flexible carrier film 020 of the first substrate 030, and multiple electronic components 021 in the first flexible carrier film 020 of the first substrate 030 can be arranged in the setting area Q. It should also be noted that each position of the edge portion of the first flexible carrier film 020 can be connected to the mother-daughter ring 031, so that the mother-daughter ring 031 can tighten the first flexible carrier film 020, so as to facilitate better die bonding of the electronic components 021 carried by the first substrate 030.

[0150] Please refer to Figure 4 , Figure 4 This is a schematic diagram of an electronic component transfer device provided in an embodiment of this application. The electronic component transfer device 300 can be used to fix each electronic component 021 in the first substrate 030 onto a corresponding connecting portion 041 in the second substrate 040, so that the electronic component 021 transferred to the second substrate 040 can be electrically connected to the corresponding connecting portion 041. That is, the electronic component transfer device 300 can complete the die bonding of each electronic component 021 in the first substrate 030. It should be noted that the electronic component 021 and the connecting portion 041 are not on the first substrate 030. Figure 4 The markings will be performed in subsequent embodiments.

[0151] It should be noted that the electronic component 021 in this embodiment can be an LED light-emitting element, and the second substrate 040 can be a driving backplate for driving the LED light-emitting element to emit light. In this way, after the transferred LED light-emitting elements are connected to each of the connecting portions 041 in the second substrate 040, a display panel capable of displaying images can be obtained, or a light-emitting substrate capable of providing a light source for a liquid crystal display panel can be obtained.

[0152] The following embodiments illustrate the electronic component transfer equipment, die expansion equipment, and electronic component sorting equipment in the electronic component transfer system.

[0153] like Figure 4 ,like Figure 5 and Figure 6 As shown, Figure 5 This is a side view of an electronic component transfer device provided in an embodiment of this application. Figure 6 This is a top view of an electronic component transfer device provided in an embodiment of this application. The electronic component transfer device 300 may include: a base 301, a first stage 302, a second stage 303, and a transfer head 304.

[0154] The first stage 302 in the electronic component transfer device 300 can be movably connected to the base 301, and the first stage 302 can be used to support the first substrate 030. Here, as... Figure 3As shown, since the first substrate 030 includes a first flexible carrier film 020, the first substrate 030 can be a flexible substrate. Furthermore, the first substrate 030 can include multiple electronic components 021, which can be distributed within the setting area Q of the first flexible carrier film 020.

[0155] The second stage 303 in the electronic component transfer device 300 can be located on the base 301. The second stage 303 in the electronic component transfer device 300 can be used to support a second substrate 040, which has a plurality of connecting portions 041.

[0156] The transfer head 304 in the electronic component transfer device 300 can be movably connected to the base 301. The transfer head 304 in the electronic component transfer device 300 may include a first ejector pin 3041. The first ejector pin 3041 in the transfer head 304 can be configured to: after the first substrate 030 and the second substrate 040 are aligned by the drive of the first base 302, apply a force to the side of the first substrate 030 away from the second substrate 040, so as to transfer the electronic component 021 disposed on the side of the first substrate 030 facing the second substrate 040 onto the connection portion 041 of the second substrate 040.

[0157] Specifically, the transfer head 304 also includes a pin drive member, which can provide a driving force to the first pin 3041 to move the first pin 3041 so as to apply a force to the side of the first substrate 030 away from the second substrate 040.

[0158] Among them, such as Figure 7 As shown, Figure 7 This is a partial top view of a first substrate and a second substrate after alignment, according to an embodiment of this application. After the first substrate 030 and the second substrate 040 are aligned, the plurality of electronic components 021 in the first substrate 030 may include a plurality of target electronic components. The plurality of target electronic components in the first substrate 030 may include a first electronic component 0211 and a second electronic component 0212. The second substrate 040 may include a plurality of target connection portions, and the plurality of target connection portions in the second substrate 040 may include a first connection portion 0411 and a second connection portion 0412. It should be noted that the plurality of target electronic components here refers to electronic components 021 that may need to be transferred during one alignment process of the first substrate 030 and the second substrate 040; the plurality of target connection portions here refers to connection portions 041 that may need to connect electronic components during one alignment process of the first substrate 030 and the second substrate 040.

[0159] The electronic component transfer device 300 can be configured such that, in a first transfer mode, after the first electronic component 0211 in the first substrate 030 is transferred to the first connecting portion 0411 in the second substrate 040, while controlling the first ejector pin 3041 in the transfer head 304 to move toward the second electronic component 0212, the first stage 302 is controlled to perform regional displacement, so that after the first ejector pin 3041 reaches the side of the second electronic component 0212 away from the first substrate 030, the second electronic component 0212 can be arranged opposite to the second connecting portion 0412.

[0160] Here, the regional displacement can be either controlling the first platform 302 to remain stationary relative to the base 301, or controlling the first platform 302 to move the first substrate 030 within a first preset region F1. The first preset region F1 can be the region formed around the second connecting portion 0412.

[0161] Specifically, the regional displacement can be understood as a slight adjustment to the position of the first stage 302 during the movement of the first ejector pin 3041 in the transfer head 304 towards the second electronic component 0212, so that after the first ejector pin 3041 reaches the side of the second electronic component 0212 away from the first substrate 030, the second electronic component 0212 can be positioned opposite to the second connecting portion 0412. In some embodiments, by design, the displacement of the first electronic component 0211 to the second electronic component 0212 can be in the same row, and the distance between the first electronic component 0211 and the second electronic component 0212 is the same as the distance between the first connecting portion 0411 and the second connecting portion 0412. Ideally, after the first electronic component 0211 is aligned with the first connecting part 0411, the second electronic component 0212 should be aligned with the second connecting part 0412. However, due to limitations such as manufacturing precision, there may be alignment deviations between the second connecting part 0412 and the second electronic component 0212. Therefore, it is necessary to perform the aforementioned regional displacement on the position of the first stage 302 to ensure accurate alignment between the second connecting part 0412 and the second electronic component 0212, thereby achieving a successful connection.

[0162] Specifically, the first preset region F1 is the region formed around the second connecting portion 0412. For example, the first preset region F1 surrounds the entire second connecting portion 0412 and covers the second connecting portion 0412. For example, the first preset region F1 surrounds a portion of the second connecting portion 0412 and covers that portion. For example, the first preset region F1 surrounds the center of the second connecting portion 0412 and covers the center. For example, the second connecting portion 0412 includes a first conductive pad, a second conductive pad, and a second substrate region between the two conductive pads. The first preset region F1 surrounds the center of the entire second connecting portion 0412 and covers the center. Alternatively, the first preset region F1 surrounds a designated feature point on the second connecting portion 0412 and covers the feature point. The designated feature point is, for example, the center or corner position of one of the conductive pads.

[0163] For example, such as Figure 7 As shown, after the first substrate 030 and the second substrate 040 are aligned, the first electronic component 0211 in the first substrate 030 can be any one of a plurality of target electronic components, and the second electronic component 0212 can be an electronic component distributed after the first electronic component 0211 among the plurality of target electronic components. In the first transfer mode, after the transfer device 300 transfers the first electronic component 0211 to the first connecting portion 0411 in the second substrate 040 by controlling the first ejector pin 3041, the transfer device 300 needs to control the first ejector pin 3041 to move toward the second electronic component 0212, while controlling the first stage 302 to remain stationary relative to the base 301 or the first stage 302 to drive the first substrate 030 to move within the first preset area F1.

[0164] Specifically, since the movement time of the first ejector pin 3041 from the first electronic component 0211 to the second electronic component 0212 is short, the position movement of the first stage 302 is limited during this period. Therefore, the setting of the first preset area F1 needs to satisfy that it is within the range limited by the position movement limit distance of the first stage 302 during the movement time of the first ejector pin 3041 from the first electronic component 0211 to the second electronic component 0212.

[0165] In one specific embodiment, the first ejector pin 3041 moves from the first electronic component 0211 to the second electronic component 0212 in a uniform linear motion. While applying force to both the first and second electronic components (i.e., momentarily moving towards the first substrate and then retracting), the first ejector pin 3041 maintains a uniform linear motion speed along the direction from the first electronic component 0211 to the second electronic component 0212. Furthermore, for example, when the first electronic component 0211 and the second electronic component 0212 are located in the same row, and this row also includes other electronic components to be transferred, the first ejector pin 3041 maintains a uniform linear motion speed along the direction from the first electronic component 0211 to the second electronic component 0212 while transferring the first electronic component 0211, the second electronic component 0212, and other electronic components. This improves the transfer efficiency of the electronic component transfer device 300.

[0166] In one possible case, such as Figure 7 As shown, after the first substrate 030 and the second substrate 040 are aligned, the orthographic projection of the second electronic component 0212 on the second substrate 040 can be located within the second preset region F2. This allows the second electronic component 0212 to be directly positioned opposite the second connecting portion 0412 without moving the first substrate 030 relative to the base 201. Here, the second preset region F2 can be located within the first preset region F1. For example, the second preset region F2 can be located within the region where the second connecting portion 0412 is located, and the area of ​​the second preset region F2 can be slightly smaller than the area of ​​the region where the second connecting portion 0412 is located.

[0167] The second preset area F2 can be an area where the second electronic component 0212 can be effectively connected to the second connecting portion 0412 by the action of the first ejector pin 3041 without the first substrate 030 needing to move. In this case, the transfer device 300 can control the first stage 302 to remain stationary relative to the base 301, so that the transfer device 300 does not need to control the first substrate 030 to move relative to the base 301. The transfer device 300 only needs to control the first ejector pin 3041 in the transfer head 304 to move towards the second electronic component 0212. In this way, after the first ejector pin 3041 reaches the side of the second electronic component 0212 away from the first substrate 030, the second electronic component 0212 can be transferred to the second connecting portion 0412 by the first ejector pin 3041.

[0168] In another possible case, such as Figure 8 As shown, Figure 8This is a partial top view of another embodiment of the present application after the first substrate 030 and the second substrate 040 are aligned. After the first substrate 030 and the second substrate 040 are aligned, the orthographic projection of the second electronic component 0212 on the second substrate 040 can be located outside the second preset region F2 but within the first preset region F1. The second electronic component 0212 cannot be directly positioned relative to the second connecting portion 0412. That is, there is a deviation between the second electronic component 0212 and the second connecting portion 0412.

[0169] In this configuration, while controlling the first ejector pin 3041 in the transfer head 304 to move towards the second electronic component 0212, the transfer device 300 also needs to control the first stage 302 to move the first substrate 030 within the first preset region F1, ensuring that the second electronic component 0212 in the first substrate 030 is located within the second preset region F2. This guarantees that the second electronic component 0212 can be positioned opposite the second connecting portion 0412. Thus, after the first ejector pin 3041 reaches the side of the second electronic component 0212 away from the first substrate 030, the second electronic component 0212 can be transferred to the second connecting portion 0412 via the first ejector pin 3041.

[0170] It should be noted that after the first substrate 030 and the second substrate 040 are aligned, the first electronic component 0211 in the first substrate 030 can be either positioned opposite to the first connecting portion 0411 or misaligned with it. When the first electronic component 0211 is positioned opposite to the first connecting portion 0411, it can be directly transferred to the first connecting portion 0411 using the first ejector pin 3041. When there is a misalignment between the first electronic component 0211 and the first connecting portion 0411, the electronic component transfer device 300 can control the first stage 302 to move the first substrate 030 so that after the first electronic component 0211 is positioned opposite to the first connecting portion 0411, it can be transferred to the first connecting portion 0411 using the first ejector pin 3041.

[0171] Optionally, the multiple electronic components 021 in the first substrate 030 may include multiple rows, and the electronic components 021 in a row may be arranged along a first direction. The multiple target electronic components in the first substrate 030 may be located in the same row of electronic components 021. The second substrate 040 may include multiple rows of connecting portions 041, and the connecting portions 041 in a row may all be arranged along the first direction. The multiple target connecting portions in the second substrate 040 may be located in the same row of target connecting portions 041.

[0172] Here, as Figure 9 As shown, Figure 9This is a partial top view of the first substrate and the second substrate after alignment, according to another embodiment of this application. When the multiple target electronic components in the first substrate 030 include the first electronic component 0211 and the second electronic component 0212, the first electronic component 0211 and the second electronic component 0212 can be arranged in a row in the first direction X. Similarly, when the multiple target connecting portions in the second substrate 040 include the first connecting portion 0411 and the second connecting portion 0412, the first connecting portion 0411 and the second connecting portion 0412 can be arranged in a row in the first direction X. Thus, in the first transfer mode, after the first electronic component 0211 is transferred to the first connecting portion 0411, the first pin 3041 moves along the first direction X toward the second connecting portion 0412 until it moves to a position opposite to the second connecting portion 0412. During this process, the transfer device 300 can control the first stage 302 to perform regional displacement, so that the second electronic component 0212 in the first substrate 030 carried by the first stage 302 after regional displacement can be positioned opposite to the second connecting part 0412, that is, the second electronic component 0212 can be distributed between the second connecting part 0412 and the first ejector pin 3041.

[0173] Optional, such as Figure 10 As shown, Figure 10 This is a top view of a first substrate provided in an embodiment of this application. A plurality of electronic components 021 in the first substrate 030 can be arranged in N columns along a first direction X and in M ​​columns along a second direction Y. The first direction X can intersect the second direction Y; for example, the first direction X can intersect the second direction Y perpendicularly. Here, M and N are both positive integers. Therefore, the first substrate 030 can include M × N electronic components 021.

[0174] In this application, the first stage 302 in the electronic component transfer device 300 can be configured such that, during the current alignment of the first substrate 030 and the second substrate 040, after multiple target connection portions in the second substrate 040 are connected to corresponding electronic components 021, the first stage 302 is controlled to move the first substrate 030 relative to the base 301, so that at least one connection portion 041 on the second substrate 040 that is not aligned with the target connection portion can be aligned with at least one electronic component 021, thereby realizing another alignment of the first substrate 030 and the second substrate 040.

[0175] For example, during the current alignment process between the first substrate 030 and the second substrate 040, multiple target electronic components in the first substrate 030 may be located in the same row of electronic components 021 in the first substrate 030. At least a portion of the multiple target electronic components located in the same row of electronic components 021 may be connected to a corresponding target connection portion in the second substrate 040 in a first transfer mode. Next, the first substrate 030 may be moved relative to the base 301 so that after the next alignment between the first substrate 030 and the second substrate 040, at least one electronic component 021 in the first substrate 030 may be aligned with at least one connection portion 041, and this at least one connection portion 041 and the target connection portion from the previous alignment process are respectively located in two different rows of connection portions 041. Here, after the next alignment between the first substrate 030 and the second substrate 040, the at least one connection portion 041 and the at least one electronic component 021 that are aligned are: the target connection portion and the target electronic component.

[0176] It should be noted that, as Figure 11 As shown, Figure 11 This is a top view of a second substrate provided in an embodiment of this application. The second substrate 040 may have multiple die-bonding partitions R. The number of die-bonding partitions R distributed along the first direction X is multiple, and the number distributed along the second direction Y is at least one. Within any die-bonding partition R, multiple columns of connecting portions 401 arranged along the first direction X and multiple rows of connecting portions 401 arranged along the second direction Y are distributed.

[0177] Here, in the first direction X, the center distance between two adjacent connecting portions 041 on the second substrate 040 is an integer multiple of the center distance between two adjacent electronic components 021 on the first substrate 030.

[0178] In this case, during any alignment process between the first substrate 030 and the second substrate 040, the first substrate 030 can be positioned opposite to a die-bonding partition R, and each of the connecting portions 041 in any row of connecting portions 041 in this die-bonding partition R can serve as a target connecting portion in the second substrate 040 during a certain alignment process between the first substrate 030 and the second substrate 040.

[0179] Correspondingly, during a certain alignment process between the first substrate 030 and the second substrate 040, the target electronic component in the first substrate 030 is a part of the electronic components in a row of electronic components that are disposed opposite to the target connection portion of this row.

[0180] In this embodiment, electronic components 021 in the first substrate 030 can be fixed to corresponding connection portions 041 in the second substrate 040 via certain die-bonding paths. In this application, the electronic component transfer device 300 can perform die bonding on the electronic components 021 in the first substrate 030 via two different die-bonding paths. This embodiment will be illustrated by example using the following two optional implementation methods.

[0181] In a first optional implementation, during the J-th alignment process between the first substrate 030 and the second substrate 040, at least two electronic components 021 transferred from the first substrate 030 to the second substrate 040 can originate from the K-th row of electronic components 021 in the first substrate 030. Here, J is a positive integer, and K is an integer less than or equal to M. That is, after the J-th alignment process between the first substrate 030 and the second substrate 040, at least two electronic components 021 in the K-th row can be transferred to the corresponding connecting portion 041 in the first transfer mode.

[0182] Here, after the first substrate 030 and the second substrate 040 are aligned for the Jth time and at least two electronic components 021 in the Kth row of electronic components 021 are transferred, the first substrate 030 may have the following two movement situations depending on whether there are other electronic components 021 distributed in the Kth row of electronic components 021.

[0183] In the first moving scenario, when other electronic components 021 are also distributed in the Kth row of electronic components 021 in the first substrate 030, the first stage 302 in the electronic component transfer device 300 can be configured to: drive the first substrate 030 to move relative to the base 301 along the first direction X and the second direction Y, so that during the J+1th alignment process between the first substrate 030 and the second substrate 040, at least two electronic components 021 transferred from the first substrate 030 to the second substrate 040 can also come from the Kth row of electronic components 021.

[0184] For example, such as Figure 12 As shown, Figure 12 This is a top view of a first substrate and a second substrate after the Jth alignment, as provided in an embodiment of this application. During the Jth alignment process between the first substrate 030 and the second substrate 040, electronic component 1 can be transferred to connection part 1, electronic component 4 can be transferred to connection part 2, and electronic component 7 can be transferred to connection part 3. After the electronic component transfer is completed during the Jth alignment process between the first substrate 030 and the second substrate 040, other electronic components are still distributed in the row of electronic components where electronic components 1, 4, and 7 are located in the first substrate 030.

[0185] like Figure 13 As shown, Figure 13 This is a top view of a first substrate and a second substrate after the (J+1)th alignment, as provided in an embodiment of this application. After the transfer of electronic components during the Jth alignment process between the first substrate 030 and the second substrate 040, the transfer device 300 can control the first stage 302 to move the first substrate 030 in the first direction X and the second direction Y, so that during the (J+1)th alignment process between the first substrate 030 and the second substrate 040, electronic component 8 can be transferred to connection part 6, electronic component 5 can be transferred to connection part 5, and electronic component 2 021 can be transferred to connection part 4.

[0186] Here, the electronic component 021 transferred to the second substrate 040 during the Jth alignment process and the electronic component 021 transferred to the second substrate 040 during the J+1th alignment process can both come from the same row of electronic components in the first substrate 030.

[0187] In the second movement scenario, when all the electronic components 021 in the Kth row have been transferred to the corresponding connecting portions 041 in the second substrate 040, the first stage 302 is configured to move the first substrate 030 relative to the base 301 along the first direction X and the second direction Y, so that during the J+1th alignment of the first substrate 030 and the second substrate 040, at least two electronic components 021 transferred from the first substrate 030 to the second substrate 040 can come from a different row of electronic components 021 than the electronic components 021 in the Kth row.

[0188] For example, during the (J+1)th alignment process between the first substrate 030 and the second substrate 040, at least two electronic components 021 transferred from the first substrate 030 to the second substrate 040 can originate from electronic components 021 in row (K+1), row (K+2), or row (K+3), etc. Preferably, at least two electronic components 021 transferred from the first substrate 030 to the second substrate 040 can originate from electronic components 021 in row (K+1). This ensures that the electronic components 021 in the first substrate 030 are transferred to the second substrate 040 row by row.

[0189] For example, such as Figure 14 As shown, Figure 14This is a top view of the first substrate and the second substrate after the Jth alignment, according to another embodiment of this application. During the Jth alignment process between the first substrate 030 and the second substrate 040, electronic component No. 3 can be transferred to connection part No. 7, electronic component No. 6 can be transferred to connection part No. 8, and electronic component No. 9 can be transferred to connection part No. 9. After the transfer of electronic components during the Jth alignment process between the first substrate 030 and the second substrate 040 is completed, there are no other electronic components in the row of electronic components containing electronic components No. 3, No. 6, and No. 9 in the first substrate 030.

[0190] like Figure 15 As shown, Figure 15 This is a top view of another first substrate and second substrate after the (J+1)th alignment provided in this application embodiment. After the transfer of electronic components during the Jth alignment process of the first substrate 030 and the second substrate 040, the transfer device 300 can control the first stage 302 to move the first substrate 030 in the first direction X and the second direction Y, so that during the J+1th alignment process of the first substrate 030 and the second substrate 040, electronic component 10 can be transferred to connection part 10, electronic component 13 can be transferred to connection part 11, and electronic component 021 16 can be transferred to connection part 12.

[0191] Here, the electronic component 021 transferred to the second substrate 040 during the Jth alignment process and the electronic component 021 transferred to the second substrate 040 during the J+1th alignment process respectively come from two different rows of electronic components in the first substrate 030. Preferably, these two different rows of electronic components can be two adjacent rows of electronic components.

[0192] It should be noted that in the first optional implementation, regardless of whether the first substrate moves in the first or second movement mode, during the alignment and switching process of the first substrate 030 and the second substrate 040, the first substrate 030 needs to move simultaneously in the first direction X and the second direction Y.

[0193] In the second optional implementation, during the J-th alignment process between the first substrate 030 and the second substrate 040, at least two electronic components 021 transferred from the first substrate 030 to the second substrate 040 can originate from the K-th row of electronic components 021 in the first substrate 030. Here, J is a positive integer, and K is an integer less than or equal to M. That is, after the J-th alignment between the first substrate 030 and the second substrate 040, at least two electronic components 021 in the K-th row can be transferred to the corresponding connecting portion 041 in the first transfer mode. Here, after the J-th alignment between the first substrate 030 and the second substrate 040, and after at least two electronic components 021 in the K-th row are transferred, the following two movement scenarios are possible depending on the value of K.

[0194] In the first movement scenario, where K is less than or equal to Mn, the first stage 302 in the electronic component transfer device 300 can be configured to move the first substrate 030 relative to the base 301 along the second direction Y, such that during the (J+1)th alignment of the first substrate 030 and the second substrate 040, at least two electronic components 0211 transferred from the first substrate 030 to the second substrate 040 can originate from the (K+n)th row of electronic components 201. Here, n can be a positive integer greater than 1. For example, n can be equal to 1. For example, n can be equal to 2. For example, n can be equal to 3. For example, n can be equal to 4. For example, n can be equal to 5. Here, the value of n is preferably an integer greater than or equal to 2.

[0195] For example, such as Figure 16 As shown, Figure 16 This is a top view of the first substrate and the second substrate after the Jth alignment provided in this application embodiment. During the Jth alignment process of the first substrate 030 and the second substrate 040, electronic component 1 can be transferred to connection part 1, electronic component 4 can be transferred to connection part 2, and electronic component 7 can be transferred to connection part 3.

[0196] like Figure 17 As shown, Figure 17 This is a top view of the first substrate and the second substrate after the (J+1)th alignment provided in this application embodiment. After the transfer of electronic components during the Jth alignment process of the first substrate 030 and the second substrate 040, the transfer device 300 can control the first stage 302 to move the first substrate 030 along the second direction Y, so that during the J+1th alignment process of the first substrate 030 and the second substrate 040, electronic component 34 can be transferred to connection part 6, electronic component 31 can be transferred to connection part 5, and electronic component 28 021 can be transferred to connection part 4.

[0197] It should be noted that, in this case, during the alignment and switching process of the first substrate 030 and the second substrate 040, the first substrate 030 only needs to move in the second direction Y, and the vibration amplitude generated during the movement of the first substrate 030 in the second direction Y is relatively small. Therefore, in this case, it can be ensured that the electronic component transfer device can transfer the electronic component 021 to the second substrate with faster efficiency and higher accuracy. It should also be noted that the reason for the small vibration amplitude generated during the movement of the first substrate 030 in the second direction Y will be described in subsequent embodiments.

[0198] In the second movement scenario, when K is greater than Mn, the first stage 302 in the electronic component transfer device 300 can be configured to move the first substrate 030 relative to the base 301 by a first distance along the first direction X or a second distance along the second direction Y.

[0199] For example, such as Figure 18 As shown, Figure 18 This is a top view of a second substrate and a first substrate cooperating, provided in an embodiment of this application. After some electronic components 021 in the first substrate 030 are transferred to the connection portions 041 of a certain die-bonding partition R1 in the second substrate 040, the transfer device 300 needs to transfer the electronic components 021 to the connection portions 041 of the next die-bonding partition R2 in the second substrate 040. In this case, the first stage 302 can move the first substrate 030 relative to the base 301 along the first direction X by a first distance D1, and can also move the first substrate 030 relative to the base 301 along the second direction Y by a second distance D2.

[0200] Here, the first distance D1 can be greater than or equal to the distribution width of the N columns of electronic components distributed in the first direction X in the first substrate 030; the second distance D2 is greater than or equal to the distribution width of the M rows of electronic components distributed in the second direction Y in the first substrate 030. In this way, the first substrate 030 can be moved to the position corresponding to the next die-bonding partition R.

[0201] Optionally, in the second optional implementation described above, during the Jth alignment process between the first substrate 030 and the second substrate 040, the number of electronic components that can be distributed between two adjacent electronic components 021 transferred to the second substrate 040 in the Kth row of electronic components 021 is n-1.

[0202] For example, such as Figure 19 As shown, Figure 19This is a schematic diagram illustrating the distribution of remaining electronic components after an electronic component in the first substrate is transferred to a die-bonding partition of the second substrate, according to an embodiment of this application. When the number of electronic components that can be distributed between two adjacent electronic components 021 transferred to the second substrate 040 is n-1, it can be ensured that the electronic components transferred from the first substrate 030 to the second substrate 040 are uniformly distributed. That is, after the electronic component 021 in the first substrate 030 is transferred to a die-bonding partition R of the second substrate 040, the missing electronic components in the first substrate 030 can be uniformly arranged in the distribution area Q of the first flexible support film 020. This prevents the first flexible support film 020 from deforming due to a lack of too many electronic components in a local area of ​​the distribution area Q. Consequently, it can be ensured that the position coordinates of the remaining electronic components 021 in the first substrate 030 do not easily change, thus ensuring high accuracy in the subsequent transfer of electronic components.

[0203] It should be noted that the above embodiments are illustrated by taking as an example that the center distance between two adjacent connecting portions 041 on the second substrate 040 in the first direction X is an integer multiple of the center distance between two adjacent electronic components 021 on the first substrate 030.

[0204] In other possible implementations, in the second direction Y, the center distance between two adjacent connection portions 041 on the second substrate 040 is an integer multiple of the center distance between two adjacent electronic components 021 on the first substrate 030. In this case, during one alignment process between the first substrate 030 and the second substrate 040, the region in the second substrate 040 opposite to the first substrate 030 is a die-bonding partition R. During the transfer of electronic components 021, and in the first transfer mode, the first substrate 030 only needs to undergo localized regional displacement to transfer the corresponding electronic components 021 from each connection portion 041 within this die-bonding partition R.

[0205] Optionally, regardless of whether it is the first or the second optional implementation described above, the transfer device 300 can be configured to: sequentially transfer at least two electronic components to at least two connecting portions in the Lth row of connecting portions according to a first transfer direction, and then sequentially transfer at least two said electronic components to at least two connecting portions in the L+1th row of connecting portions according to a second transfer direction. Here, L is a positive integer; the first transfer direction and the second transfer direction are opposite and both are parallel to the first direction X.

[0206] For example, such as Figure 16 and Figure 17As shown, assuming that connection parts 1, 2, and 3 are located in the Lth row of connections, and connection parts 4, 5, and 6 are located in the (L+1)th row of connections, when transferring electronic components to the Lth row of connections, the transfer device 300 can sequentially transfer electronic components 1, 4, and 7 to connection parts 1, 2, and 3 in a first transfer direction (from left to right). Then, when transferring electronic components to the (L+1)th row of connections, the transfer device 300 can sequentially transfer electronic components 34, 31, and 28 to connection parts 6, 5, and 4 in a second transfer direction (from right to left).

[0207] That is, the transfer device 300 can sequentially transfer electronic components on each row of the bonding portion of a certain die-bonding partition R of the second substrate 040 in a serpentine direction. In this way, the displacement of the first substrate 040 and the first ejector pin 3041 can be reduced to the greatest extent, thereby further improving the transfer efficiency.

[0208] Optional, such as Figure 20 As shown, Figure 20 This is a partial top view of another embodiment of the present application after the first substrate 030 and the second substrate 040 are aligned. After the first substrate 030 and the second substrate 040 are aligned, the plurality of target electronic components in the first substrate 030 further include a third electronic component 0213 located between the first electronic component 0211 and the second electronic component 0212; the plurality of target connecting portions in the second substrate 040 further include a third connecting portion 0413 located between the first connecting portion 0411 and the second connecting portion 0412.

[0209] It should be noted that after the first substrate 030 and the second substrate 040 are aligned, the third electronic component 0213 can be a target electronic component among multiple target electronic components that has a large deviation from the corresponding third connecting portion 0413. In the first transfer mode, during the process of controlling the first stage 302 to perform regional displacement, the first stage 302 needs to move the first substrate 030 a large distance relative to the base 301 before the third electronic component 0213 can be positioned relative to the third connecting portion 0413. This would severely reduce the efficiency of transferring electronic components in the first transfer mode.

[0210] Therefore, in the first transfer mode, the first ejector pin 3041 may not transfer the third electronic component 0213, but in the second transfer mode, the first ejector pin 3041 transfers the third electronic component 0213 separately.

[0211] For example, the transfer device 300 can be configured such that, in a first transfer mode, after the first electronic component 0211 is transferred to the first connecting portion 0411, while moving the first ejector pin 3041 toward the second electronic component 0212, the first stage 302 is controlled to perform a regional displacement, so that after the first ejector pin 3041 reaches the side of the second electronic component away from the first substrate 030, the second electronic component 0212 can be positioned opposite to the second connecting portion 0412. In this case, in the first transfer mode, the transfer device 300 can skip the third electronic component 0213; that is, the transfer device 300 will not transfer the third electronic component 0213 to the third connecting portion 0413 in the first transfer mode.

[0212] The transfer device 300 can also be configured such that, in a second transfer mode, the first stage 302 moves the first substrate 030 relative to the base 301, aligning the first substrate 030 with the second substrate 040, and the third electronic component 0213 is transferred to the third connecting portion 0413 via the first ejector pin 3041. In this case, by using the second transfer mode alone to align the first substrate 030 with the second substrate 040, the third electronic component 0213 can be positioned opposite the third connecting portion 0413.

[0213] The transfer device 300 is configured to either perform a first transfer mode followed by a second transfer mode, or perform a second transfer mode followed by a first transfer mode.

[0214] It should be noted that before transferring each electronic component, the transfer device 300 can perform position calculations based on the position information of each electronic component on the first substrate 030 and the position of each connecting portion 041 on the second substrate 040. This allows it to determine which electronic components on the first substrate 030 need to be transferred using the first transfer mode and which need to be transferred using the second transfer mode. Therefore, the transfer device 300 can perform the first transfer mode first and then the second transfer mode, or vice versa. This embodiment does not limit this approach.

[0215] It should also be noted that, Figure 20 The illustration is based on the example of the third connecting portion 0413 corresponding to the third electronic element 0213 being located at the middle position of a row of target connecting portions. In other possible implementations, the third connecting portion 0413 corresponding to the third electronic element 0213 may also be located at the first or last position of a row of target connecting portions. This application does not limit this.

[0216] For example, in the first transfer mode, the condition under which the first ejector pin 3041 does not transfer the third electronic component 0213 is that, after the first electronic component 0211 has been transferred to the first connecting portion 0411 in the first transfer mode, the orthographic projection of the third electronic component 0213 on the second substrate 040 is or should be outside the third preset region F3. For example, if the transfer device 300 performs the first transfer mode first and then the second transfer mode, the third electronic component 0213 has not yet been transferred during the first transfer mode, therefore, the orthographic projection of the third electronic component 0213 on the second substrate 040 can be outside the third preset region F3; if the transfer device 300 performs the second transfer mode first and then the first transfer mode, the third electronic component 0213 has already been transferred during the first transfer mode, therefore, the orthographic projection of the third electronic component 0213 on the second substrate 040 should be outside the third preset region F3.

[0217] Here, the third preset region F3 can be a region formed around the third connecting portion 0413. For example, the size and shape of the third preset region F3 can be the same as the size and shape of the first preset region F1, and the position of the boundary of the third preset region F3 relative to the third connecting portion 0413 is the same as the position of the first preset region F1 relative to the first connecting portion 0411.

[0218] Specifically, the third preset region F3 can be a region surrounding the third connecting portion 0413. For example, the third preset region F3 can surround the entire third connecting portion 0413 and cover it. For example, the third preset region F3 can surround a portion of the third connecting portion 0413 and cover that portion. For example, the third preset region F3 can surround the center of the third connecting portion 0413 and cover that center. For example, the third connecting portion 0413 can include a first conductive pad, a second conductive pad, and a second substrate region between the two conductive pads. The third preset region F3 can surround the center of the entire third connecting portion 0413 and cover that center. Alternatively, the third preset region F3 can surround a designated feature point on the third connecting portion 0413 and cover that feature point. This designated feature point is, for example, the center or corner position of one of the conductive pads.

[0219] Optionally, in the first direction X, the width of the first preset region F1 is less than K1 times the distance between two adjacent connecting parts 041 in the first direction X; in the second direction Y, the width of the first preset region F1 is less than K2 times the distance between two adjacent connecting parts 041 in the second direction Y, wherein both K1 and K2 are less than 2.

[0220] For example, in the first direction X, the width of the first preset region F1 is less than 0.01 times the distance between two adjacent connecting parts 041 in the first direction X; in the second direction Y, the width of the first preset region F1 is less than 0.01 times the distance between two adjacent connecting parts 041 in the second direction Y.

[0221] For example, in the first direction X, the width of the first preset region F1 is less than 0.02 times the distance between two adjacent connecting parts 041 in the first direction X; in the second direction Y, the width of the first preset region F1 is less than 0.02 times the distance between two adjacent connecting parts 041 in the second direction Y.

[0222] For example, in the first direction X, the width of the first preset region F1 is less than 0.05 times the distance between two adjacent connecting parts 041 in the first direction X; in the second direction Y, the width of the first preset region F1 is less than 0.05 times the distance between two adjacent connecting parts 041 in the second direction Y.

[0223] For example, in the first direction X, the width of the first preset region F1 is less than 0.1 times the distance between two adjacent connecting parts 041 in the first direction X; in the second direction Y, the width of the first preset region F1 is less than 0.1 times the distance between two adjacent connecting parts 041 in the second direction Y.

[0224] For example, in the first direction X, the width of the first preset region F1 is less than 0.5 times the distance between two adjacent connecting parts 041 in the first direction X; in the second direction Y, the width of the first preset region F1 is less than 0.5 times the distance between two adjacent connecting parts 041 in the second direction Y.

[0225] For example, in the first direction X, the width of the first preset region F1 is less than 0.8 times the distance between two adjacent connecting parts 041 in the first direction X; in the second direction Y, the width of the first preset region F1 is less than 0.8 times the distance between two adjacent connecting parts 041 in the second direction Y.

[0226] For example, in the first direction X, the width of the first preset region F1 is less than 1.0 times the distance between two adjacent connecting parts 041 in the first direction X; in the second direction Y, the width of the first preset region F1 is less than 1.0 times the distance between two adjacent connecting parts 041 in the second direction Y.

[0227] For example, in the first direction X, the width of the first preset region F1 is less than 1.5 times the distance between two adjacent connecting parts 041 in the first direction X; in the second direction Y, the width of the first preset region F1 is less than 1.5 times the distance between two adjacent connecting parts 041 in the second direction Y.

[0228] Optionally, in the first direction X, the width of the first preset region F1 is smaller than the distance between two adjacent electronic components in the first direction X; in the second direction Y, the width of the first preset region F1 is smaller than the distance between two adjacent electronic components in the second direction Y.

[0229] Optionally, the shape of the first preset region F1 can be a rectangle or an ellipse. Here, when the shape of the first preset region F1 is a rectangle, the first preset region F1 can be a square with equal width in the first direction X and the second direction Y, or the first preset region F1 can be a rectangle with unequal width in the first direction X and the second direction Y; when the shape of the first preset region F1 is an ellipse, the first preset region F1 can be a circle with equal width in the first direction X and the second direction Y, or the first preset region F1 can be a flat ellipse with unequal width in the first direction X and the second direction Y.

[0230] Optionally, the center of the first preset region F1 may coincide with the center of the connecting part 041.

[0231] In the embodiments of this application, such as Figure 4 As shown, the electronic component transfer device 300 may further include a first support frame 305. The first support frame 305 may be movably connected to the base 301 and to the first platform 302. The first support frame 305 can move the first platform 302 relative to the base 301 along a fourth direction, and the first platform 302 can move relative to the first support frame 305 along a fifth direction.

[0232] That is, during the process of the first stage 302 driving the first substrate 030 to move relative to the base 301 along the fourth direction, the first support frame 305 drives the first stage 302 to move together relative to the base 301. During the process of the first stage 302 driving the first substrate 030 to move relative to the base 301 along the fifth direction, the first stage 302 itself moves relative to the first support frame 305 along the fifth direction.

[0233] In one possible implementation, the fourth direction may be parallel to the first direction X in the above embodiment, and the fifth direction may be parallel to the second direction Y in the above embodiment; in another possible implementation, the fourth direction may be parallel to the second direction Y in the above embodiment, and the fifth direction may be parallel to the first direction X in the above embodiment.

[0234] In some embodiments, where the fourth direction can be parallel to the first direction X in the above embodiments and the fifth direction can be parallel to the second direction Y in the above embodiments, since the first platform 302 can move directly relative to the first support frame 305 along the second direction Y, the first support frame 305 does not need to move (or only makes a small movement during regional displacement) to ensure that the transfer device 300 controls the movement of the first platform 302 along the second direction Y with a small weight, so that the inertia of the first platform 302 when moving along the second direction Y is small, and thus the first platform 302 is not easy to swing when moving along the second direction Y.

[0235] Optional, such as Figure 4 As shown, the electronic component transfer device 300 may further include a second support frame 306. The second support frame 306 may be movably connected to the base 301 and to the transfer head 304. The second support frame 306 can drive the transfer head 304 to move relative to the base 301 along a fourth direction, and the transfer head 304 can move relative to the second support frame 306 along a fifth direction.

[0236] That is, during the process of the transfer head 304 driving the first ejector pin 3041 to move relative to the base 301 along the fourth direction, the second support frame 306 drives the transfer head 304 to move together relative to the base 301. During the process of the transfer head 304 driving the first ejector pin 3041 to move relative to the base 301 along the fifth direction, the transfer head 304 itself moves relative to the second support frame 306 along the fifth direction. Here, during the movement of the transfer head 304 relative to the base 301 in the fourth or fifth direction, the transfer head 304 can drive the first ejector pin 3041 to move synchronously along the fourth or fifth direction.

[0237] In this application, both the first support frame 305 and the second support frame 306 can be beam structures, and the extension direction of the first support frame 305 can be basically parallel to the extension direction of the second support frame 306, and both are parallel to the second direction Y. Here, both ends of the first support frame 305 and both ends of the second support frame 306 can be slidably connected to the track structure extending along the first direction in the transfer device 300.

[0238] Optionally, the width of the first preset region F1 in the first direction X is greater than the width of the first preset region F1 in the second direction Y. Specifically, when the first platform can move relative to the first support frame in the first direction, and the first support frame can drive the first platform to move together relative to the base in the second direction Y, the movement of the first platform in the first direction X is faster than its movement in the second direction. Therefore, when planning the first preset region F1, it is advisable to consider that the width of the first preset region F1 in the first direction X is greater than the width of the first preset region F1 in the second direction Y.

[0239] Optionally, the transfer head 304 may further include a first camera 3042 disposed adjacent to the first ejector pin 3041. The first camera 3042 is used to simultaneously capture a first image containing the first substrate 030 and the second substrate 040 after the first substrate 030 and the second substrate 040 are aligned. In this way, the transfer device 300 can further confirm, based on the first image, whether the target electronic component in the first substrate 030 is disposed opposite to the target connection portion in the second substrate 040.

[0240] Optional, such as Figure 4 As shown, the transfer device 300 may further include a loading mechanism 307 and a unloading mechanism 308. Both the loading mechanism 307 and the unloading mechanism 308 are movable in a third direction Z perpendicular to the first direction X and the second direction Y. The loading mechanism 307 can carry a first substrate for which electronic components have not been transferred, and the unloading mechanism 308 can carry a first substrate for which electronic components have been transferred. Here, the transfer device 300 can control the loading mechanism 307 to move towards the first stage 302 in the third direction Z, so that the first stage 302 can grasp the first substrate for which electronic components have not been transferred, thereby allowing the transfer device 300 to transfer all electronic components from the first substrate to the second substrate. After all electronic components in the first substrate carried by the first stage 302 have been transferred, the transfer device 300 can control the unloading mechanism 308 to move towards the first stage 302 in the third direction Z, so that the first stage 302 can place the first substrate, after all electronic components have been transferred, onto the unloading mechanism 308.

[0241] Optionally, electronic component 021 is a light-emitting diode, such as a Mini-LED, but not limited thereto.

[0242] Optionally, the connecting part 041 is a conductive pad, for example, including a first conductive pad and a second conductive pad, which are electrically connected to the anode and cathode of the electronic component 021, respectively; correspondingly, the electronic component transfer device provided in the embodiments of this application is a die bonder.

[0243] Optionally, the conductive pad is a solder pad, and the electronic component 021 is fixedly connected to the conductive pad by solder.

[0244] Optionally, the second substrate 040 is a driving backplate for the display substrate. After the light-emitting diodes are transferred to the second substrate 040, they are fabricated as an LED display substrate.

[0245] Optionally, the second substrate 040 is a direct-lit light-emitting substrate, which can be used as the backlight of an LCD display module. After the light-emitting diode is transferred to the second substrate 040, it is fabricated as a direct-lit light-emitting substrate.

[0246] In summary, the electronic component transfer device provided in this application, after one alignment of the first substrate and the second substrate, allows the first pin in the transfer device to transfer at least two electronic components from the first substrate to the second substrate, thereby effectively improving the efficiency of transferring electronic components to the second substrate. Furthermore, by setting a first transfer mode and a second transfer mode, it can be ensured that electronic components with small or no deviation after one alignment can be directly transferred to the second substrate via the first transfer mode, while electronic components with larger deviations after one alignment can be transferred to the second substrate via a separate second transfer mode. This not only ensures that electronic components on the first substrate can be transferred to the second substrate with higher efficiency, but also ensures that all electronic components on the first substrate can be transferred to the second substrate, thereby improving the utilization rate of the electronic components on the first substrate.

[0247] This application also provides a method for transferring electronic components. This method can be applied to the aforementioned electronic component transfer equipment. The transfer equipment includes: a base, a first stage movably connected to the base, a second stage located on the base, and a transfer head movably connected to the base. The first stage carries a first substrate, which is a flexible substrate and includes multiple electronic components. The second stage carries a second substrate, which has multiple connecting portions. The transfer head includes a first ejector pin. The method may include:

[0248] Step S1: Control the first stage to move relative to the base to align the first substrate and the second substrate.

[0249] Step S2: In the first transfer mode, after applying a force to the side of the first substrate away from the second substrate by the first ejector pin to transfer the first electronic component disposed on the side of the first substrate facing the second substrate to the first connecting portion of the second substrate, while controlling the first ejector pin to move towards the second electronic component, the first stage is controlled to perform regional displacement so that after the first ejector pin reaches the side of the second electronic component away from the first substrate, the second electronic component is disposed opposite to the second connecting portion.

[0250] The regional displacement refers to controlling the first platform to remain stationary relative to the base or the first platform to move the first substrate within a first preset region, where the first preset region is the region formed around the second connecting portion.

[0251] Optionally, the multiple electronic components include multiple rows of electronic components, each electronic component in a row of electronic components is arranged along a first direction, and multiple target electronic components are located in the same row of electronic components; the second substrate includes multiple rows of connecting portions, each connecting portion in a row of connecting portions is arranged along a first direction, and multiple target connecting portions are located in the same row of connecting portions.

[0252] Optionally, the method for transferring electronic components may further include: during the current alignment process of the first substrate and the second substrate, after multiple target connection portions are connected to corresponding electronic components, controlling the first stage to move the first substrate relative to the base, so that at least one connection portion on the second substrate that is not aligned with the target connection portion is aligned with at least one electronic component, thereby achieving another alignment of the first substrate and the second substrate.

[0253] Optionally, during the Jth alignment process between the first substrate and the second substrate, at least two electronic components transferred to the second substrate originate from the Kth row of electronic components; J is a positive integer, and K is an integer less than or equal to M; the method for transferring electronic components may further include: if other electronic components are also distributed in the Kth row of electronic components, controlling the first stage to move the first substrate relative to the stage along the first direction and the second direction, so that during the J+1th alignment process between the first substrate and the second substrate, at least two electronic components transferred to the second substrate also originate from the Kth row of electronic components.

[0254] Optionally, the method for transferring electronic components may further include: when all electronic components in the Kth row have been transferred to the second substrate, controlling the first stage to move the first substrate relative to the stage along the first direction and the second direction, so that during the J+1th alignment process between the first substrate and the second substrate, at least two electronic components transferred to the second substrate come from another row of electronic components that are different from the electronic components in the Kth row.

[0255] Optionally, during the J-th alignment process between the first substrate and the second substrate, at least two electronic components transferred to the second substrate originate from the K-th row of electronic components; J is a positive integer, and K is an integer less than or equal to M; the method for transferring electronic components may further include: when K is less than or equal to Mn, controlling the first stage to move the first substrate relative to the base along a second direction, so that during the J+1-th alignment process between the first substrate and the second substrate, at least two electronic components transferred to the second substrate originate from the K+n-th row of electronic components; where n is a positive integer.

[0256] Optionally, during the Jth alignment process between the first substrate and the second substrate, the number of electronic components that can be distributed between two adjacent electronic components transferred to the second substrate in the Kth row of electronic components is n-1.

[0257] Optionally, when K is greater than Mn, the method for transferring electronic components may further include: controlling a first stage to move a first substrate relative to the stage by a first distance in a first direction or by a second distance in a second direction; wherein the first distance is greater than or equal to the distribution width of N columns of electronic components distributed in the first direction on the first substrate; and the second distance is greater than or equal to the distribution width of M rows of electronic components distributed in the second direction on the first substrate.

[0258] Optionally, the method for transferring electronic components may further include: sequentially transferring at least two electronic components to at least two connecting portions in the Lth row of connecting portions according to a first transfer direction, and then sequentially transferring at least two electronic components to at least two connecting portions in the L+1th row of connecting portions according to a second transfer direction; wherein, L is a positive integer; the first transfer direction and the second transfer direction are opposite and both are parallel to the first direction.

[0259] Optionally, in the first direction, the center distance between two adjacent connecting portions on the second substrate is an integer multiple of the center distance between two adjacent electronic components on the first substrate.

[0260] Optionally, in a second direction intersecting the first direction, the center distance between two adjacent connecting portions on the second substrate is an integer multiple of the center distance between two adjacent electronic components on the first substrate.

[0261] Optionally, the method for transferring electronic components may further include: when the orthographic projection of the second electronic component on the second substrate is located within a second preset region, controlling the first stage to remain stationary relative to the base; wherein the second preset region is located inside the first preset region.

[0262] Optionally, the method for transferring electronic components may further include: when the orthographic projection of the second electronic component on the second substrate is located within a first preset area but outside a second preset area, controlling the first stage to move the first substrate within the first preset area, so that the second electronic component is located within the second preset area, and then the first ejector pin reaches the side of the second electronic component away from the first substrate, and the second electronic component is positioned opposite to the second connecting portion.

[0263] Optionally, the plurality of target electronic components further includes a third electronic component, which is located between the first and second electronic components; the plurality of target connecting portions include a third connecting portion, which is located between the first and second connecting portions; the method for transferring electronic components may further include: in a first transfer mode, after the first electronic component is transferred to the first connecting portion, while moving the first ejector pin toward the second electronic component, controlling the first stage to perform regional displacement, so that after the first ejector pin reaches the side of the second electronic component away from the first substrate, the second electronic component and the second connecting portion are positioned opposite each other; in a second transfer mode, controlling the first stage to drive the first substrate to move relative to the base, so that the first substrate and the second substrate are aligned, and the third electronic component is transferred to the third connecting portion by the first ejector pin.

[0264] The transfer device is configured to either perform a first transfer mode followed by a second transfer mode, or perform a second transfer mode followed by a first transfer mode.

[0265] Optionally, in the first transfer mode, the condition under which the first ejector pin does not transfer the third electronic component is: after the action of transferring the first electronic component to the first connecting part is completed, the orthographic projection of the third electronic component on the second substrate is or should be outside the third preset area; wherein, the third preset area is the area formed around the third connecting part.

[0266] Optionally, the size and shape of the third preset region are the same as those of the first preset region; the position of the boundary of the third preset region relative to the third connecting part is the same as the position of the first preset region relative to the first connecting part.

[0267] Optionally, in the first direction, the width of the first preset region is less than K1 times the distance between two adjacent connecting parts; in the second direction, the width of the first preset region is less than K2 times the distance between two adjacent connecting parts, wherein both K1 and K2 are less than 2.

[0268] Optionally, the shape of the first preset area is a rectangle or an ellipse.

[0269] Optionally, the center of the first preset area coincides with the center of the connecting part.

[0270] It should be noted that the specific principle of the electronic component transfer method provided in the above embodiments can be found in the relevant content of the aforementioned electronic component transfer device. It will not be repeated here.

[0271] Please refer to Figure 21 , Figure 21 This is a schematic diagram of another electronic component sorting device provided in an embodiment of this application. The electronic component sorting device 100 may include: a third platform 101, a fourth platform 102, a second ejector pin 103, and a support platform 104.

[0272] The third stage 101 in the electronic component sorting device 100 can be used to carry the second flexible support film 010. At least two of the plurality of initial electronic components 011 in the second flexible support film 010 are of different types.

[0273] The fourth stage 102 in the electronic component sorting device 100 can be used to carry the first flexible support film 020. The first flexible support film 020 located on the fourth stage 102 can be arranged opposite to the second flexible support film 010 located on the third stage 101 in the third direction Z.

[0274] The second pin 103 in the electronic component sorting device 100 can be located on the side of the second flexible support film 010 away from the first flexible support film 020. The support platform 104 in the electronic component sorting device 100 can be located on the side of the first flexible support film 020 away from the second flexible support film 010. The support platform 104 in the electronic component sorting device 100 can be arranged opposite to the second pin 103 in the third direction Z, and the side of the support platform 104 facing the first flexible support film 020 can be in contact with a portion of the first flexible support film 020.

[0275] In this embodiment, after at least one initial electronic component 011 in the second flexible carrier film 010 is distributed in the third direction Z between the second ejector pin 103 and the support platform 104, the second ejector pin 103 can be used to apply pressure to at least one initial electronic component 011 in the second flexible carrier film 010 to transfer at least one initial electronic component 011 in the second flexible carrier film 010 to the portion of the first flexible carrier film 020 that contacts the support platform 102, and all electronic components 021 transferred to the first flexible carrier film 020 are of the same type. It should be noted that after multiple electronic components 021 of the same type are carried on the first flexible carrier film 020, the first flexible carrier film 020 can be subjected to a die expansion process using the die expansion equipment in a subsequent embodiment.

[0276] It should be noted that before the multiple initial electronic components 011 in the second flexible carrier film 010 are sorted by the electronic component sorting device 100, each initial electronic component 011 in the second flexible carrier film 010 needs to be electrically measured to obtain parameters such as the emission wavelength, luminous efficiency and forward voltage of each initial electronic component 011 in the second flexible carrier film 010. In this way, the initial electronic components 011 of the same type in the multiple initial electronic components 011 in the second flexible carrier film 010 can be obtained, and the relative positions between these initial electronic components 011 of the same type can be obtained.

[0277] It should also be noted that, such as Figure 21 As shown, the electronic component sorting device 100 may further include a visual recognition camera 105 disposed parallel to the second pin 103 in the third direction Z. The visual recognition camera 105 in the electronic component sorting device 100 can identify each initial electronic component 011 in the second flexible carrier film 010 located on the third stage 101 to obtain the relative position between each initial electronic component 011 in the second flexible carrier film 010 and the second pin 103. Therefore, the electronic component sorting device 100 can determine the initial electronic components 011 of the same type among the multiple initial electronic components 011 in the second flexible carrier film 010 obtained by electrical measurement, as well as the relative positions between these initial electronic components 011, and the relative positions between each initial electronic component 011 in the second flexible carrier film 010 and the second pin 103 obtained by the vision camera 105, by combining these initial electronic components 011 of the same type among the multiple initial electronic components 011 in the second flexible carrier film 010 located on the third stage 101, and the relative positions between these initial electronic components 011 and the second pin 103.

[0278] In this application, the third stage 101 of the electronic component sorting device 100 can move the second flexible carrier film 010, so that initial electronic components 011 of the same type among the plurality of initial electronic components 011 in the second flexible carrier film 010 can be moved sequentially between the second ejector pin 103 and the support top stage 104. The fourth stage 102 of the electronic component sorting device 100 can move the first flexible carrier film 020, so that the respective bearing positions of the first flexible carrier film 020 for bearing the plurality of electronic components 021 can be moved sequentially onto the support top stage 104 and contact the side of the support top stage 104 facing the first flexible carrier film 020. Therefore, by applying pressure to the initial electronic components 011 located between the second pin 103 and the support top 104 through the second pin 103 in the electronic component sorting device 100, the initial electronic components 011 of the same type in the second flexible carrier film 010 can be transferred sequentially to the portion of the first flexible carrier film 020 that is in contact with the support top 104.

[0279] For example, an initial electronic component 011 in the second flexible support film 010 can be moved between the second ejector pin 103 and the support platform 104, and a corresponding support position in the first flexible support film 020 can be moved onto the support platform 104. Then, the second ejector pin 103 can apply pressure to the initial electronic component 011 so that the initial electronic component 011 can be transferred to the corresponding support position in the first flexible support film 020.

[0280] It should be noted that the pin 103 in the electronic component sorting device 100 can reciprocate in the third direction Z, moving either towards the support platform 104 or away from the support platform 104. For example, after an initial electronic component 011 in the second flexible carrier film 010 is located between the second pin 103 and the support platform 104, the second pin 103 can move towards the support platform 104 to move the initial electronic component 011 towards the first flexible carrier film 020 until the initial electronic component 011 can be transferred to the portion of the first flexible carrier film 020 that contacts the support platform 104. Then, the second pin 103 can move away from the support platform 104 to return to its initial position, thereby allowing the next initial electronic component 011 of the same type as the initial electronic component 011 in the second flexible carrier film 010 to move between the second pin 103 and the support platform 104.

[0281] In this application, as Figure 22 and Figure 23 As shown, Figure 22 This is a schematic diagram of the structure of another electronic component sorting device provided in the embodiments of this application. Figure 23 This is a simplified diagram of a sorting device. In the electronic component sorting device 100, the support platform 104, facing the first flexible carrier film 020, can protrude beyond the fourth platform 102 facing the third platform 101. Thus, after the initial electronic component 011 located between the second pin 103 and the support platform 104 comes into contact with the first flexible carrier film 020 located on the support platform 104, no interference occurs between the initial electronic component 011 adjacent to it in the second flexible carrier film 010 and the electronic component 021 adjacent to it in the first flexible carrier film 020, avoiding the possibility of damage to the electronic component 021 in the first flexible carrier film 020.

[0282] Optionally, in the three directions Z, the distance between the side of the support platform 104 facing the first flexible carrier film 020 and the side of the fourth platform 102 facing the third platform 101 in the electronic component sorting device 100 can be greater than the thickness of the electronic component 021. For example, the thickness of the electronic component 021 can be between 50 micrometers and 200 micrometers, and the distance between the side of the support platform 104 facing the first flexible carrier film 020 and the side of the fourth platform 102 facing the third platform 101 can be between 50 micrometers and 300 micrometers. This ensures that after the initial electronic component 011 located between the second pin 103 and the support platform 104 contacts the first flexible carrier film 020, no interference will occur between other initial electronic components 011 in the second flexible carrier film 010 and the electronic components 021 in the first flexible carrier film 020.

[0283] Please refer to the following in this application: Figure 24 , Figure 24 This is a top view of another electronic component sorting device provided in this application embodiment. The side of the support platform 104 in the electronic component sorting device 100 facing the first flexible carrier film 020 can be a first plane P1. After the support platform 104 and an initial electronic component 011 are positioned relative to each other in the third direction Z, that is, after the electronic component 011 is located between the second ejector pin 103 and the support platform 104, the orthogonal projection of the initial electronic component 011 on the first plane P1 can be located within the first plane P1. Thus, driven by the second ejector pin 103, after the initial electronic component 011 contacts the first flexible carrier film 020 located on the support platform 104, the second ejector pin 103 can apply a pressing force towards the support platform 104 to the initial electronic component 011, ensuring that the initial electronic component 011 can be transferred to the first flexible carrier film 020 and can be stably positioned on the first flexible carrier film 020. This avoids the phenomenon of electronic components 021 on the first flexible carrier film 020 falling off the first flexible carrier film 020.

[0284] Optional, such as Figure 24 As shown, the shape of the first plane P1 of the supporting top platform 104 can be circular. The diameter of this circle can be greater than the width of the initial electronic component 011 in the second flexible support film 010 in the first direction X, and can also be greater than the width of the initial electronic component 011 in the second flexible support film 010 in the second direction Y. For example, the width of the electronic component 021 in both the first direction X and the second direction Y can be between 150 micrometers and 3000 micrometers, and the diameter of the first plane P1 of the supporting top platform 104 can be between 200 micrometers and 3500 micrometers. Therefore, it can be ensured that the orthographic projection of the initial electronic component 011, which is positioned opposite the supporting top platform 104 in the third direction Z, on the first plane P1 can be completely located within the first plane P1.

[0285] Optionally, the first plane P1 of the supporting top platform 104 can be circular. In this way, during the movement of the first flexible bearing membrane 020 relative to the supporting top platform 104 driven by the fourth platform 102, compared with the case where the first plane P1 of the supporting top platform 104 is other polygonal, the circular first plane P1 can reduce the possibility of the supporting top platform 104 tearing the first flexible bearing membrane 020.

[0286] In this application, as Figure 21As shown, the support platform 104 in the electronic component sorting device 100 may also have a transition surface P2 located between the first plane P1 and the side surface of the support platform 104. Here, the transition surface P1 of the support platform 104 can be an arc-shaped convex surface, and the radius of the transition surface P1 can be greater than 15 micrometers. In this way, during the movement of the first flexible carrier film 020 relative to the support platform 104 by the fourth stage 102, the first flexible carrier film 020 can slide on the transition surface P1 of the support platform 104. This further reduces the possibility that the support platform 104 may tear the first flexible carrier film 020 during its movement.

[0287] In this application, as Figure 21 and Figure 22 As shown, a plurality of initial electronic components 011 in the second flexible carrier film 010 can be evenly distributed on the side of the second flexible carrier film 010 facing the first flexible carrier film 020. Thus, after one initial electronic component 011 in the second flexible carrier film 010 is located between the second ejector pin 103 and the support platform 104, the second ejector pin 103 can move in the direction towards the support platform 104 to abut against the portion of the second flexible carrier film 010 that contacts the initial electronic component 011. This portion of the second flexible carrier film 010 then drives the initial electronic component 011 to move towards the first flexible carrier film 020 until the initial electronic component 011 abuts against the portion of the first flexible carrier film 020 that contacts the support platform 104, allowing the initial electronic component 011 to be transferred onto the first flexible carrier film 020. Therefore, a plurality of electronic components 021 in the first flexible carrier film 020 can be evenly distributed on the side of the first flexible carrier film 020 facing the second flexible carrier film 010.

[0288] Optional, such as Figure 21 and Figure 22 As shown, the side of the second pin 103 in the electronic component sorting device 100 facing the first flexible support film 020 can be a second plane P3. Thus, during the process of the first pin abutting against the second flexible support film 010 to move the initial electronic component 011 located between the second pin 103 and the support platform 104 towards the first flexible support film 020, it is the second plane P3 of the second pin 103 that abuts against the second flexible support film 010. Therefore, during this process, the second pin 103 will not puncture the second flexible support film 010 that abuts against the second plane P3, preventing direct contact between the second pin 103 and the initial electronic component 011, and thus preventing damage to the initial electronic component 011.

[0289] In this application, the electronic component sorting device 100 may further include: a first moving mechanism connected to a third stage 101, a second moving mechanism connected to a fourth stage 102, and a third moving mechanism connected to a second ejector pin 103.

[0290] The first moving mechanism in the electronic component sorting device 100 can be used to drive the third platform 101 to move in the first direction X and the second direction Y, thereby the third platform 101 can drive the second flexible carrier film 010 to move in the first direction X and the second direction Y, so that the initial electronic component 011 in the second flexible carrier film 010 can be moved between the second ejector pin 103 and the support platform 104.

[0291] The second moving mechanism 103 in the electronic component sorting equipment 100 can be used to drive the second carrier 102 to move in the first direction X and the second direction Y, so that the fourth platform 102 can drive the first flexible carrier film 020 to move in the first direction X and the second direction Y, so that the corresponding carrier position in the first flexible carrier film 020 can be moved to the support top platform 104.

[0292] The third moving mechanism in the electronic component sorting device 100 can be used to move the second ejector pin 103 in the third direction Z, so that the second ejector pin 103 can move in the direction toward the support top 104 to apply pressure to the initial electronic component 011 located between the second ejector pin 103 and the support top 104, or it can move in the direction away from the support top 104 to cancel the contact between the second ejector pin 103 and the second flexible carrier film 010.

[0293] Optional, such as Figure 21 and Figure 22 As shown, the electronic component sorting device 100 may further include a third camera 106 fixedly connected to the support platform 104. The third camera 106 in the electronic component sorting device 100 may be located on the side of the support platform 104 facing the electronic component 021 in the first flexible carrier film 020. The third camera 106 can be used to acquire a third image of the electronic component 021 transferred onto the first flexible carrier film 020. Based on this third image, the electronic component sorting device 100 can monitor in real time a portion of the multiple electronic components 021 transferred onto the first flexible carrier film 020 that are closest to the support platform 104.

[0294] It should be noted that the electronic component sorting device 300 can set the relative distance between multiple carrying positions in the first flexible carrier film 020 for carrying multiple target electronic components 021, so that the distance between any two adjacent target electronic components 021 in the first flexible carrier film 020 can meet the preset value.

[0295] For example, during the process of transferring initial electronic components of the same type from the first flexible carrier film 010 to the first flexible carrier film 020 by the electronic component sorting device 100, the electronic component sorting device 100 can monitor in real time the distance between the last electronic component 021 transferred to the first flexible carrier film 020 and the previous electronic component 021 transferred to the first flexible carrier film 020, based on the first image acquired by the third camera 106. If the deviation between the distance between these two electronic components 021 and the distance set by the electronic component sorting device 300 exceeds a certain error range, then during the transfer of the next initial electronic component 011, the fourth stage 102 can drive the first flexible carrier film 020 to perform position compensation. That is, the fourth stage 102 can drive the first flexible carrier film 020 to move along the first direction X and the second direction Y, so that the distance between the next electronic component 021 transferred to the first flexible carrier film 020 and the aforementioned last electronic component 021 transferred to the first flexible carrier film 020 can meet the preset value set by the electronic component sorting device.

[0296] In summary, the electronic component sorting device provided in this application embodiment allows the second ejector pin to transfer multiple initial electronic components of the same type from the second flexible carrier film onto the first flexible carrier film, ensuring that all electronic components on the first flexible carrier film are of the same type. This results in smaller differences between the electronic components in the obtained display panel after subsequent die bonding using the electronic component transfer device, leading to a better display effect.

[0297] Please refer to Figure 25 and Figure 26 , Figure 25 This is a schematic diagram of a crystal expansion device supporting a first flexible support film, provided in an embodiment of this application. Figure 26 This is a schematic diagram illustrating the connection between the die expansion sub-ring and the die expansion mother ring after die expansion is completed, according to an embodiment of this application. The die expansion equipment 200 for electronic components may include: a fixed stage 201, a moving stage 202, and a lifting mechanism 203.

[0298] The fixed stage 201 in the electronic component expansion device 200 can be used to support a first flexible support film 020 and an expansion sub-ring 0311 that is in contact with the first flexible support film 020. The first flexible support film 020 includes multiple electronic components 021, and the orthographic projections of the electronic components 021 on the support surface of the fixed stage 201 can all be located within the area enclosed by the orthographic projections of the expansion sub-rings 0311 on the support surface of the fixed stage 201. It should be noted that the orthographic projections of the electronic components 021 on the support surface of the fixed stage 201 can all be located in the central region of the support surface of the fixed stage 201, while the orthographic projections of the expansion sub-rings 0311 on the support surface of the fixed stage 201 can be located in the edge region of the support surface of the fixed stage 201, and the outer boundary of the orthographic projection of the expansion sub-rings 0311 on the support surface of the fixed stage 201 can coincide with the outer boundary of the support surface of the fixed stage 201. Therefore, the orthographic projections of the electronic components 021 in the first flexible carrier film 020 onto the carrier surface of the fixed stage 201 can all be located within the area enclosed by the orthographic projections of the expansion ring 0311 onto the carrier surface of the fixed stage 201.

[0299] The movable stage 202 in the die expansion equipment 200 for electronic components can be connected to the edge portion of the first flexible support film 020. The lifting mechanism 203 in the die expansion equipment 200 can be positioned opposite the fixed stage 201 in the third direction Z, and the lifting mechanism 203 is connected to the die expansion mother ring 0312. For example, the side of the lifting mechanism 203 facing the fixed stage 201 can be connected to the die expansion mother ring 0312. The third direction Z can be perpendicular to the support surface of the fixed stage 201.

[0300] The die expansion device 200 for electronic components can be configured as follows: A moving stage 202 moves the edge portion of the first flexible carrier film 020 along the Z-direction to perform die expansion processing on the portion of the first flexible carrier film 020 located on the fixed stage 201. Then, the moving stage 202 stops moving, and simultaneously, the lifting mechanism 203 moves towards the fixed stage 201 along the Z-direction until the die expansion mother ring 0312 can be engaged with the die expansion daughter ring 0311 to obtain the first substrate 030. It should be noted that the first substrate 030 here can be used for transferring electronic components on the aforementioned transfer device 300. However, this application embodiment is not limited to this transfer scenario and can use this first substrate 030 in other scenarios. This application embodiment does not limit this application.

[0301] Here, as Figure 25As shown, after the electronic component die expansion equipment 200 is in the initial state, the bearing surface of the fixed stage 201 and the bearing surface of the moving stage 202 in the electronic component die expansion equipment 200 can be located on the same plane. That is, the part of the first flexible bearing film 020 carried by the bearing surface of the fixed stage 201 for carrying the electronic component 021 and the edge part of the first flexible bearing film 020 carried by the bearing surface of the moving stage 202 can be on the same plane.

[0302] Optionally, the die expansion device 200 can also be configured to: before expanding the portion of the first flexible carrier film 020 located on the fixed stage 201, obtain the positional relationship between the center point of the orthographic projection of the region where the multiple electronic components 021 are located on the carrier surface of the fixed stage 201 and the center point of the carrier surface of the fixed stage 201; and after determining that the distance between the center point of the orthographic projection of the region where the multiple electronic components 021 are located on the carrier surface of the fixed stage 201 and the center point of the carrier surface of the fixed stage 201 is less than a first preset threshold, control the moving stage 202 to move the edge portion of the first flexible carrier film 020 in the third direction Z. That is, the die expansion device 200 will only control the moving stage 202 to move to expand the multiple electronic components 021 after determining that the distance between the center point of the orthographic projection of the region where the multiple electronic components 021 are located on the carrier surface of the fixed stage 201 and the center point of the carrier surface of the fixed stage 201 is less than the first preset threshold.

[0303] It should be noted that the first preset threshold can be less than 5 millimeters. For example, the first preset threshold can be zero. When the first preset threshold is zero, the center point of the orthographic projection of the area where the multiple electronic components 021 are located on the bearing surface of the fixed stage 201 can coincide with the center point of the bearing surface of the fixed stage 201. In this way, the orthographic projection of the area where the multiple electronic components 021 are located on the bearing surface of the fixed stage 201 can be located in the central region of the bearing surface of the fixed stage 201.

[0304] It should also be noted that the bearing surface of the fixed stage 201 in the die expansion equipment 200 for electronic components can be circular, and the bearing surface of the moving stage 202 can be annular. Thus, the moving stage 202 can be distributed around the periphery of the fixed stage 201, and the edge region of the first flexible bearing film 020 can all be located on the moving stage 202. That is, after the die expansion equipment 200 controls the moving stage 202 to move, the entire edge region of the first flexible bearing film 020 can move in the Z direction, allowing the portion of the first flexible bearing film 020 located on the bearing surface of the fixed stage 201 to be stretched at various angles, thereby enabling the area where multiple electronic components 201 are located to undergo die expansion uniformly from various angles.

[0305] Therefore, on the one hand, since the orthographic projection of the area where the multiple electronic components 021 are located on the bearing surface of the fixed stage 201 before the die expansion can be located in the central region of the bearing surface of the fixed stage 201, and on the other hand, since the area where the multiple electronic components 021 are located is expanded uniformly from various angles during the die expansion process, in the first substrate 030 obtained after die expansion by the die expansion equipment 200, the area where the multiple electronic components 021 are located in the first substrate 030 can be located in the central region of the first substrate 030, that is, the area where the multiple electronic components 021 are located can be located in the central region of the mother and daughter rings 031.

[0306] For example, please refer to Figure 27 and Figure 28 , Figure 27 This is a top view of a first flexible support membrane located on a fixed platform, as provided in an embodiment of this application. Figure 28 This is a top view of another first substrate provided in an embodiment of this application. Before die expansion, as... Figure 27 As shown, the area Q in which multiple electronic components 021 are disposed in the first flexible carrier film 020 can be rectangular, and the orthographic projection of the area Q onto the carrier surface of the fixed stage 201 is also rectangular. Thus, the die expansion device 200 can control the moving stage 202 to move to expand the die in the area Q of the multiple electronic components 021 after determining that the distance between the center point of the rectangular orthographic projection of the area Q onto the carrier surface of the fixed stage 201 and the center point of the carrier surface of the fixed stage 201 is less than a first preset threshold.

[0307] Furthermore, because the setting area Q of multiple electronic components 021 is uniformly expanded from various angles during the die expansion process, the rectangular setting area Q can be continuously enlarged proportionally during the die expansion process, so that after the die expansion is completed, as shown in the figure... Figure 28 As shown, the setting area Q remains rectangular, and the distance between the center point of the orthographic projection of the setting area Q onto the bearing surface of the fixed stage 201 and the center point of the bearing surface of the fixed stage 201 can still be less than the first preset threshold. That is, the orthographic projection of the setting area Q onto the bearing surface of the fixed stage 201 can be located in the central region of the bearing surface of the fixed stage 201. Thus, after the expansion sub-ring 0311 and the expansion mother ring 0312 are engaged, the setting area Q of the multiple electronic components 021 can be located in the central region of the mother and daughter rings 031.

[0308] It should be noted that when the die expansion device 200 detects that the distance between the center point of the orthographic projection of the area where multiple electronic components 021 are located on the bearing surface of the fixed stage 201 and the center point of the bearing surface of the fixed stage 201 is greater than a first preset threshold, the die expansion device 200 can generate an alarm to remind the operator to move the first flexible bearing film 020. Alternatively, the die expansion device 200 can have a linkage shaft for moving the first flexible bearing film 020. When the die expansion device 200 detects that the distance between the center point of the orthographic projection of the area where multiple electronic components 021 are located on the bearing surface of the fixed stage 201 and the center point of the bearing surface of the fixed stage 201 is greater than the first preset threshold, the die expansion device 200 can control the linkage shaft to move the first flexible bearing film 020 to adjust the position of the area where multiple electronic components 021 are located until the distance between the center point of the orthographic projection of the area where multiple electronic components 021 are located on the bearing surface of the fixed stage 201 and the center point of the bearing surface of the fixed stage 201 is less than the first preset threshold.

[0309] Optional, such as Figure 27 As shown, the first flexible carrier film 020 may also have a marking portion 023. The die expansion device 200 can be configured to: obtain the distance between the center point of the orthographic projection of the area where multiple electronic components 021 are located on the carrier surface of the fixed stage 201 and the center point of the carrier surface of the fixed stage 201, based on the positional relationship between the marking portion 023 and the center point of the carrier surface of the fixed stage 201. That is, after the fixed stage 201 carries the first flexible carrier film 020, the die expansion device 300 can identify the marking portion 023 on the first flexible carrier film 020 and the center point of the carrier surface of the fixed stage 201, so as to determine whether the distance between the center point of the orthographic projection of the area where multiple electronic components 021 are located on the carrier surface of the fixed stage 201 and the center point of the carrier surface of the fixed stage 201 is less than a first preset threshold, based on the positional relationship between the marking portion 023 and the center point of the carrier surface of the fixed stage 201.

[0310] It should be noted that after the fixed stage 201 carries the first flexible carrier film 020, the crystal expansion equipment 200 can identify the mark part 023 on the first flexible carrier film 020 and the edge of the carrier surface of the fixed stage 201, so as to determine the position of the center point of the carrier surface of the fixed stage 201 through the edge of the carrier surface of the fixed stage 201, and then determine the positional relationship between the mark part 023 and the center point of the carrier surface of the fixed stage 201.

[0311] Optionally, the marking part 023 may be located at the center point of the area where the multiple electronic components 021 are located. After the die expansion device 200 identifies that the distance between the center point of the marking part 023 and the center point of the bearing surface of the fixed stage 201 is less than the first preset threshold, it determines that the distance between the center point of the orthographic projection of the area where the multiple electronic components 021 are located on the fixed stage 201 and the center point of the bearing surface of the fixed stage 201 is less than the first preset threshold.

[0312] It should be noted that the marking portion 023 can be distributed on one side of the first flexible support film 020 where multiple electronic components 021 are disposed, or the marking portion 023 can be distributed on the side of any one of the multiple electronic components 021 that is away from the first flexible support film 020. When the marking portion 023 needs to be located at the center point of the area where the multiple electronic components 021 are located, such as... Figure 27 As shown, if no electronic component 021 is distributed at the center point of the area where multiple electronic components 021 are located on the first flexible support film 020, the marking part 023 can be distributed on one side of the first flexible support film 020 where multiple electronic components 021 are disposed. Figure 29 As shown, Figure 29 This is a top view of another first flexible carrier film located on a fixed platform provided in this application embodiment. If electronic components 021 are distributed at the center point of the area where multiple electronic components 021 are located on the first flexible carrier film 020, the marking part 023 can be distributed on the side of the electronic component 021 located at the center point that is away from the first flexible carrier film 020.

[0313] Optional, such as Figure 30 As shown, Figure 30 This is a schematic diagram of a die expansion device 200 after controlling the second camera to reach the focal length position, according to an embodiment of this application. The die expansion device 200 may further include a second camera 204 disposed opposite to the fixed stage 201 in the third direction Z. The orthographic projection of the second camera 204 onto the bearing surface of the fixed stage 201 may be located within the area enclosed by the orthographic projection of the die expansion ring 0312 onto the bearing surface of the fixed stage 201. The second camera 204 may be used to acquire second images of multiple electronic components 021 located on the first flexible bearing film 020.

[0314] For example, the second camera 204 can be configured to include a light receiver (e.g., a camera lens) whose orthographic projection onto the support surface of the fixed stage 201 is located within the area enclosed by the orthographic projection of the expansion ring 0312 onto the support surface of the fixed stage 201. This ensures that the light receiver of the second camera 204 can normally acquire the second image of the multiple electronic components 021 located on the first flexible support film 020. Furthermore, this design ensures that the light receiver of the second camera 204 will not obstruct the movement of the expansion ring 0312 driven by the lifting mechanism 203.

[0315] Thus, after the fixed stage 201 carries the first flexible carrier film 020 and the die expansion device 200 starts working, the lifting mechanism 203 in the die expansion device 200 can move the second camera 204 toward the fixed stage 201 until the second camera 204 reaches the focal length position, at which point the lifting mechanism can stop moving the second camera 204. After the second camera 204 reaches the focal length position, it can focus on multiple electronic components 021 located on the fixed stage 201 to obtain a second image of the multiple electronic components 021. In this way, the die expansion device 200 can obtain the positional relationship between the center point of the orthographic projection of the area where the multiple electronic components 021 are located on the carrier surface of the fixed stage 201 and the center point of the carrier surface of the fixed stage 201 through the second image of the multiple electronic components 021. Here, the die expansion device 200 can determine whether the distance between the center point of the orthographic projection of the area where the multiple electronic components 021 are located on the carrier surface of the fixed stage and the center point of the carrier surface of the fixed stage is less than a first preset threshold by using the positional relationship between the second image recognition marker and the center point of the carrier surface of the fixed stage.

[0316] Optionally, the second camera 204 in the die expansion device 200 and the first camera 3042 in the transfer device 300 in the above embodiment can be the same camera or different cameras. Similarly, the second camera 204 in the die expansion device 200 and the third camera 106 in the sorting device 100 in the above embodiment can be the same camera or different cameras. Likewise, the first camera 3042 in the transfer device 300 and the third camera 106 in the sorting device 100 in the above embodiment can be the same camera or different cameras.

[0317] Optionally, the marking portion 023 can be a scratch mark, an ink mark, or a coating mark disposed on the first flexible carrier film 020 or the electronic component 021. It should be noted that, compared to etching scratch marks onto the first flexible carrier film 020 or the electronic component 021, or compared to forming coating marks onto the first flexible carrier film 020 or the electronic component 021, directly forming ink marks on the first flexible carrier film 020 or the electronic component 021 is more cost-effective.

[0318] In this application, before the die expansion equipment 200 performs die expansion processing on the first flexible carrier film 020, the die expansion equipment 200 may preset target conditions, which may be the conditions that multiple electronic components 021 should have after the die expansion processing. After the fixed stage 201 carries the first flexible carrier film 020 and the crystal expansion device 200 presets the target conditions, the crystal expansion device 200 can control the second camera 204 to reach the focal length position. After determining that the distance between the center point of the orthographic projection of the area where the multiple electronic components 021 are located on the carrier surface of the fixed stage 201 and the center point of the carrier surface of the fixed stage 201 is less than the first preset threshold, during the crystal expansion process of the portion of the first flexible carrier film 020 located on the fixed stage 201, since the fixed stage 201 is fixed, the second camera 204 can continuously focus on the multiple electronic components 021 to acquire the second image of the multiple electronic components 021 in real time, and monitor the area where the multiple electronic components 021 are located in real time through the real-time second image until the multiple electronic components 021 meet the target conditions, and then control the moving stage 202 to stop moving to stop the crystal expansion.

[0319] It should be noted that, in the first possible scenario, if the multiple electronic components 021 on the first flexible carrier film 020 are sorted, such as... Figure 27 As shown, the setting area Q in the first flexible carrier film 020 for setting multiple electronic components 021 can be a regular rectangle, and the electronic components 021 in the first substrate 030 obtained after the multiple electronic components 021 in the first flexible carrier film 020 are expanded can be transferred in the transfer device 300 in the above embodiment.

[0320] In this case, the target condition can be a target distance or a target position. In the first substrate 030 obtained after the first flexible carrier film 020 undergoes crystal expansion processing by the crystal expansion device 200, the distance between any two adjacent electronic components 021 can be the target distance. At this time, multiple electronic components 021 can be arranged according to the target position. For example, during the process of transferring the electronic components 021 in the first substrate 030 to the corresponding connecting portions 041 in the second substrate 040 via the electronic component transfer device 300, the electronic components 021 in the first substrate 030 arranged according to the target distance can satisfy the condition that, in the first direction X, the center distance between two adjacent connecting portions 041 on the second substrate 040 is an integer multiple of the center distance between two adjacent electronic components 021 on the first substrate 030. And / or, the electronic components 021 arranged according to the target distance in the first substrate 030 can satisfy the condition that the center distance between two adjacent connecting portions 041 on the second substrate 040 in the second direction Y is an integer multiple of the center distance between two adjacent electronic components 021 on the first substrate 030.

[0321] Thus, the die expansion device 200 can be configured to: during the die expansion process of the portion of the first flexible carrier film 020 located on the fixed stage 201, obtain the distance between any two adjacent electronic components 021, and after determining that the center distance between two adjacent connecting portions 041 located on the second substrate 040 in the first direction X is an integer multiple of the center distance between two adjacent electronic components 021 located on the first substrate 030, and / or that the center distance between two adjacent connecting portions 041 located on the second substrate 040 in the second direction Y is an integer multiple of the center distance between two adjacent electronic components 021 located on the first substrate 030, control the moving stage 202 to stop moving.

[0322] In a second possible scenario, if the multiple electronic components 021 on the first flexible carrier film 020 are not sorted, that is, the multiple electronic components on the first flexible carrier film 020 can be the multiple initial electronic components 011 on the second flexible carrier film 010 that have not been sorted in the above embodiment. And after the multiple electronic components 021 on the first flexible carrier film 020 that have not been sorted are subjected to the die expansion process of the die expansion equipment 200, the multiple electronic components in the resulting first substrate 030 can be transferred on the swing arm die bonding equipment.

[0323] In this case, the target condition can be a preset size. In the first substrate 030 obtained after the first flexible carrier film 020 has undergone the die expansion process of the die expansion equipment 200, the outer boundary size of the region where multiple electronic components are located can be a preset size. Thus, the die expansion equipment can be configured to: during the die expansion process of the portion of the first flexible carrier film 020 located on the fixed stage 201, obtain the outer boundary size of the region where multiple electronic components 021 are located, and after determining that the outer boundary size of the region where multiple electronic components 021 are located has been expanded to the preset size, control the moving stage 201 to stop moving.

[0324] And in the second case, such as Figure 31 and Figure 32 As shown, Figure 31 This is a top view of another type of flexible bearing membrane located on a fixed platform, provided in an embodiment of this application. Figure 32 This is a top view of another first substrate provided in this application embodiment. Since the electronic components 021 on the first flexible carrier film 020 are not sorted, the multiple electronic components 021 on the first flexible carrier film 020 are irregularly arranged. Thus, in one possible implementation, the outer boundary of the area where the multiple electronic components 021 are located can be the line connecting the boundary endpoints of the orthographic projections of the outermost ring of electronic components 021 on the first flexible carrier film 020. In another possible implementation, the multiple electronic components 021 can be arranged in an irregular circle, and the outer boundary of the area where the multiple electronic components 021 are located is a circular boundary with the center point of the area where the multiple electronic components are located as the center and the distance between the outermost electronic component and the center point of the area where the multiple electronic components are located as the radius.

[0325] It should be noted that in the first substrate 030 obtained after the die expansion process of the die expansion equipment 200, the distance between the outer boundary of the region where the multiple electronic components 021 are located and the inner boundary of the die expansion sub-ring 0311 in the mother-daughter ring 031 needs to be greater than the second preset threshold in subsequent embodiments. The second preset threshold can be the size of the structure used in the electronic component transfer equipment for transferring the electronic components 021 in the first substrate 030.

[0326] For example, if the electronic component 021 in the first substrate 030 is transferred in the transfer device 300 of the above embodiment, the structure in the transfer device 300 used to transfer the electronic component 021 is the first ejector pin 3041, and the second preset threshold is the diameter of the entire structure in the transfer device used to drive the first ejector pin 3041 to move. For example, the range of the second preset threshold can be 40 mm to 65 mm. If the electronic component in the first substrate 030 is transferred in a swing-arm die bonder, the structure in the swing-arm die bonder used to transfer the electronic component is a chuck, and the second preset threshold is the diameter of the chuck. For example, the range of the second preset threshold can be 6 mm to 8 mm.

[0327] If the distance between the outer boundary of the region containing the multiple electronic components 021 in the first substrate 030 and the inner boundary of the expansion sub-ring 0311 in the mother-daughter ring 031 is less than a second preset threshold, the structure used to transfer the outermost electronic component among the multiple electronic components 021 will interfere with the expansion sub-ring 0311 during the transfer process, causing the outermost electronic component among the multiple electronic components 021 to be unable to be transferred normally. Therefore, in the first substrate 030 obtained after the expansion process of the expansion equipment 200, the distance between the outer boundary of the region containing the multiple electronic components 021 in the first substrate 030 and the inner boundary of the expansion sub-ring 0311 in the mother-daughter ring 031 needs to be greater than the second preset threshold to ensure that all electronic components 021 in the first substrate 030 can be transferred normally.

[0328] It should be noted that, in the first case, among the multiple electronic components 021 in the first flexible carrier film 020 that have not undergone crystal expansion, the distance between any two adjacent electronic components 021 and the outer boundary size of the multiple electronic components 021, i.e., the size of the setting area Q, can be determined in the design stage. This ensures that, in the first substrate 030 obtained after crystal expansion, while the distance between any two adjacent electronic components 021 is the target distance, the distance between the outer boundary of the setting area Q of the multiple electronic components 021 and the inner boundary of the crystal expansion sub-ring 0311 can be greater than the second preset threshold.

[0329] In the second scenario, since the electronic components on the first flexible carrier film are directly expanded without sorting, during the expansion process of the portion of the first flexible carrier film 020 located on the fixed stage 201, the expansion equipment 200 cannot identify all the electronic components through the second image acquired by the second camera 204. Thus, after the expansion equipment 200 determines that the outer boundary size of the area containing multiple electronic components 021 has reached a preset size and stops expansion, the resulting first substrate 030 may contain at least one electronic component whose distance to the inner boundary of the expansion sub-ring 0311 is less than a second preset threshold.

[0330] Therefore, for the second scenario, the die expansion equipment can also be configured as follows: after the die expansion sub-ring 0311 and die expansion mother ring 0312 are fastened together to form the first substrate 030, if the area where the multiple electronic components 021 are located is within the area enclosed by the inner boundary of the die expansion sub-ring 0311, and the minimum distance between the outer boundary of the area where the multiple electronic components 021 are located and the inner boundary of the die expansion sub-ring 0311 is less than a second preset threshold in the direction parallel to the bearing surface of the fixed stage 021, then the first substrate 030 is subjected to an inward shrinkage process. In this way, after the inward shrinkage process, the minimum distance between the outer boundary of the area where the multiple electronic components 021 are located and the inner boundary of the die expansion sub-ring 0311 in the first substrate 030 can be greater than the second preset threshold, so that all electronic components 021 in the first substrate 030 can be transferred normally on the subsequent transfer equipment.

[0331] It should be noted that during the die expansion process, the die expansion equipment 200 can use the second image acquired by the second camera 204 to ensure that the area where multiple electronic components 021 are located is within the region enclosed by the inner boundary of the die expansion sub-ring 0311. This ensures that after the die expansion sub-ring 0311 and the die expansion mother ring 0312 are fastened together, none of the multiple electronic components 021 will extend beyond the inner boundary of the die expansion sub-ring 0311. If any electronic component is located outside the region enclosed by the inner boundary of the die expansion sub-ring 0311, it will be unusable for subsequent die bonding after the die expansion sub-ring 0311 and the die expansion mother ring 0312 are fastened together, resulting in waste of electronic components. Therefore, in the first substrate 030 obtained after the die expansion process by the die expansion equipment 200, the area where the electronic components 021 are located is within the region enclosed by the inner boundary of the die expansion sub-ring 0311.

[0332] It should also be noted that, in the first case, the area where the multiple electronic components 021 are located is a rectangular setting area Q. The minimum distance between the outer boundary of the area where the multiple electronic components 021 are located and the inner boundary of the expansion ring 0311 can be the distance between the electronic components 021 located at the four corners of the rectangular setting area Q and the expansion ring 0311.

[0333] In the second case, in one possible implementation, if the outer boundary of the region containing the multiple electronic components 021 is the line connecting the endpoints of the orthographic projections of the outermost ring of electronic components 021 onto the first flexible support film 020, then the minimum distance between the outer boundary of the region containing the multiple electronic components 021 and the inner boundary of the expansion ring 0311 is the distance between the electronic component 021 closest to the inner boundary of the expansion ring 0311 and the inner boundary of the expansion ring 0311. In another possible implementation, if the outer boundary of the multiple electronic components 021 is a circular boundary with the center point of the region containing the multiple electronic components 021 as the center and the distance from the outermost electronic component 021 to the center point of the region containing the multiple electronic components 021 as the radius, then the minimum distance between the outer boundary of the region containing the multiple electronic components 021 and the inner boundary of the expansion ring 0311 is the distance between this circle and the inner boundary of the expansion ring 0311.

[0334] Optional, please refer to Figure 33 , Figure 33 This is a schematic diagram of a fixed stage of a die expansion device supporting a third flexible support film, provided in an embodiment of this application. During the shrinking process of the first substrate 030 by the die expansion device 200, the fixed stage 201 of the die expansion device 200 can also be used to support the third flexible support film 050, and the movable stage 202 of the die expansion device 200 can also be used to connect and be configured with the edge portion of the third flexible support film 050. Here, the third flexible support film 050 does not have electronic components.

[0335] like Figure 34 As shown, Figure 34 This is a schematic diagram of a third flexible carrier film with auxiliary sub-rings and auxiliary mother rings after stretching, provided in an embodiment of this application. After the crystal expansion equipment 200 carries the third flexible carrier film 050, the crystal expansion equipment 200 can move the edge portion of the third flexible carrier film 050 in the Z direction via the moving stage 202 to stretch the portion of the third flexible carrier film 050 located on the fixed stage 201, and then control the moving stage 202 to stop moving. That is, the crystal expansion equipment 200 can pre-stretch the portion of the third flexible carrier film 050 located on the fixed stage 201.

[0336] Optional, such as Figure 34 As shown, after the crystal expansion equipment 200 pre-stretches the portion of the third flexible carrier film 050 located on the fixed stage 201, the portion of the third flexible carrier film 050 located between the moving stage 202 and the fixed stage 201 can have an auxiliary sub-ring 0313 and an auxiliary mother ring 0314 that are interlocked. The first substrate 030 connected to the portion of the third flexible carrier film 050 located on the fixed stage 201 can be located within the area enclosed by the auxiliary sub-ring 0313. Thus, after the portion of the third flexible carrier film 050 located on the fixed stage 201 is pre-stretched, the interlocked auxiliary sub-ring 0313 and auxiliary mother ring 0314 on the third flexible carrier film 050 can further maintain the stretch level of the portion of the third flexible carrier film 050 located on the fixed stage 201.

[0337] Next, as Figure 35 As shown, Figure 35 This is a schematic diagram illustrating the connection of a first flexible carrier film and a third flexible carrier film according to an embodiment of this application. After the crystal expansion equipment 200 pre-stretches the portion of the third flexible carrier film 050 located on the fixed stage 201, the operator can connect the portion of the third flexible carrier film 050 located on the fixed stage 201 to the first flexible carrier film 020 in the first substrate 030. Furthermore, after the portion of the third flexible carrier film 050 located on the fixed stage 201 is connected to the first flexible carrier film 020 in the first substrate 030, the auxiliary sub-ring 0313 and auxiliary mother ring on the third flexible carrier film 050 can be removed, and the crystal expansion sub-ring 0311 and crystal expansion mother ring 0312 in the first substrate 030 used to connect the edge portion of the first flexible carrier film 020 can also be removed.

[0338] It should be noted that the first flexible carrier film 020 in the first substrate 030 can be bonded to the third flexible carrier film 050 using adhesive. Furthermore, the portion of the first flexible carrier film 020 of the first substrate 030 that is connected to the portion of the third flexible carrier film 050 located on the fixing stage 201 is the portion of the first flexible carrier film 020 located within the area enclosed by the inner boundary of the expansion sub-ring 0311. After removing the snap-fit ​​expansion sub-ring 0311 and expansion mother ring 0312 from the first substrate 030, the portion of the first flexible carrier film 020 outside the area enclosed by the inner boundary of the expansion sub-ring 0311 no longer needs to be connected to the third flexible carrier film 050.

[0339] It should also be noted that the die expansion equipment 200 can generally perform inward shrinkage processing on the first substrate 030 where the minimum distance between the outer boundary of the region where multiple electronic components 021 are located and the inner boundary of the die expansion sub-ring 0311 is slightly less than the second preset threshold. Therefore, even if the distance between the outer boundary of the region where multiple electronic components 021 are located in the first substrate 030 and the inner boundary of the die expansion sub-ring 0311 is greater than the second preset threshold, the first flexible carrier film 020 in the first substrate 030 still has a certain tension.

[0340] It should also be noted that during the process of connecting a portion of the first flexible carrier film 020 to the portion of the third flexible carrier film 050 located on the fixing stage 201, the side of the expander ring 0311 in the first substrate 030 facing the third flexible carrier film 050 can contact the third flexible carrier film 050. That is, there is a height difference between the first flexible carrier film 020 and the third flexible carrier film 050. Since the thickness of the expander ring 0311 in the first substrate 030 is small, and since the first flexible carrier film 020 has a certain tension, the operator can directly eliminate the height difference between the first flexible carrier film 020 and the third flexible carrier film 050 through the tension of the first flexible carrier film 020, so as to bond the portion of the first flexible carrier film 020 to the portion of the third flexible carrier film 050 located on the fixing stage 201.

[0341] Thus, as Figure 36 As shown, Figure 36 This is a schematic diagram illustrating the connection between the expansion sub-ring and the expansion mother ring after the first flexible carrier film and the third flexible carrier film have shrunk in an embodiment of this application. After the portion of the third flexible carrier film 050 located on the fixed stage 201 is connected to the first flexible carrier film 020 in the first substrate 030, the expansion device 200 can move the edge portion of the third flexible carrier film 020 in the Z direction via the moving stage 202. This allows the portion of the connected third flexible carrier film 050 located on the fixed stage 021 and the first flexible carrier film 030 in the first substrate 030 to retract synchronously, thereby engaging the new expansion mother ring 0312 and the new sub-ring 0311 to obtain the shrunk first substrate 030. The minimum distance between the outer boundary of the region where the multiple electronic components 021 are located in the new first substrate 030 and the inner boundary of the expansion sub-ring 0311 in the first substrate 030 can be greater than a second preset threshold.

[0342] It should be noted that after the crystal expansion equipment 200 pre-stretches the third flexible carrier film 050, the stretching degree of the third flexible carrier film 050 can be the same as the stretching degree of the first flexible carrier film 020 in the first substrate 010, so that the part of the third flexible carrier film 050 located on the fixed stage 201 can retract synchronously with the first flexible carrier film 020 in the first substrate 030.

[0343] Alternatively, since the die expansion equipment 200 can generally perform inward shrinkage processing on the first substrate 030 where the minimum distance between the outer boundary of the region where multiple electronic components 021 are located and the inner boundary of the die expansion sub-ring 0311 is slightly less than the second preset threshold, only a small shrinkage is needed to make the minimum distance between the outer boundary of the region where multiple electronic components 021 are located and the inner boundary of the die expansion sub-ring 0311 in the first substrate 030 greater than the second preset threshold. Therefore, even if the stretching degree of the third flexible support 050 is different from the stretching degree of the first flexible support film 020 in the first substrate 010, the portion of the connected third flexible support film 050 located on the fixed stage 021 and the first flexible support film 030 in the first substrate 030 will not separate due to different shrinkage forces, thus ensuring that both shrink synchronously.

[0344] It should also be noted that after the expansion sub-ring 0311 and expansion mother ring 0312 are fastened together to obtain the first substrate 030, the operator can determine whether the minimum distance between the outer boundary of the area where the multiple electronic components 021 in the first substrate 030 are located and the inner boundary of the expansion sub-ring 0311 is less than the second preset threshold. If it is determined that the minimum distance between the outer boundary of the area where the multiple electronic components 021 in the first substrate 030 are located and the inner boundary of the expansion sub-ring 0311 is less than the second preset threshold, the first substrate 030 can be shrinked by the expansion equipment 200.

[0345] Alternatively, after the die expansion device 200 has connected the die expansion sub-ring 0311 and the die expansion mother ring 0312 to obtain the first substrate 030, it can determine, based on the second image obtained by the second camera 204, whether the minimum distance between the outer boundary of the area where the multiple electronic components 021 are located and the inner boundary of the die expansion sub-ring 0311 in the direction parallel to the bearing surface of the fixed stage 201 is less than a second preset threshold.

[0346] Optional, such as Figure 37 and Figure 38 As shown, Figure 37 This is a schematic diagram illustrating the second camera reaching the focal length position according to an embodiment of this application. Figure 38This is a schematic diagram illustrating the die expansion process of a die expansion device provided in this application embodiment. After the second camera 204 reaches the focal length position and focuses on multiple electronic components 021 located on the fixed stage 201, the moving stage 202 can drive the edge portion of the first flexible carrier film 020 to move in the Z direction away from the lifting mechanism 203, so as to expand the portion of the first flexible carrier film 020 located on the fixed stage 201. During this process, the die expansion device 200 monitors the multiple electronic components 021 in the first flexible carrier film 020 in real time according to the preset target distance and the second image acquired in real time by the second camera 204. After monitoring that the electronic components 021 in the first flexible carrier film 020 meet the target conditions, the die expansion device 200 can control the moving stage 202 to stop moving the edge portion of the first flexible carrier film 020, thereby stopping the die expansion.

[0347] Optional, such as Figure 39 As shown, Figure 39 This is a schematic diagram illustrating the engagement of the expansion sub-ring and expansion mother ring after expansion is completed, according to an embodiment of this application. Simultaneously or after the moving stage 202 stops moving in the direction away from the lifting mechanism 203 in the third direction Z, the lifting mechanism 203 can move towards the fixed stage 201 in the third direction Z until the expansion mother ring 0312 can be engaged with the expansion sub-ring 0311 to obtain the first substrate 030. It should be noted that after the expansion mother ring 0312 and the expansion sub-ring 0311 are engaged, a portion of the edge of the first flexible carrier film 020 can be located between the expansion mother ring 0312 and the expansion sub-ring 0311. That is, the expansion mother ring 0312 and the expansion sub-ring 0311 can be engaged to form a mother-daughter ring 031, and the mother-daughter ring 031 can be connected to the first flexible carrier film 021, keeping the first flexible carrier film 021 under a certain degree of tension, thus obtaining the first substrate 030. Among them, the first substrate 030 is the first flexible carrier film 021 after being stretched.

[0348] Therefore, through the second camera 204 in the die expansion equipment 200, the die expansion equipment 200 can acquire the position information of multiple electronic components 021 in the first flexible carrier film 020 in real time. During the die expansion process of the die expansion equipment 020 on the first flexible carrier film 020, when the die expansion equipment 020 detects that the position information of multiple electronic components 021 in the first flexible carrier film 020 meets or approaches the target conditions, the die expansion equipment 020 can control the moving stage 202 to stop moving and can control the lifting mechanism 203 to drive the die expansion mother ring 0312 and the die expansion daughter ring 0311 to engage and connect, so as to obtain the first substrate 030. In this way, through the second camera 204, the multiple electronic components 021 in the first substrate 030 obtained after die expansion processing by the die expansion equipment 200 can meet or approach the target conditions, thus improving the die expansion accuracy.

[0349] Preferably, the second camera 204 is stationary relative to the fixed stage 201 during the crystal expansion process. For example, the second camera 204 can be fixedly set at a certain height above the fixed stage 201.

[0350] In this application, as Figure 37 , Figure 38 and Figure 39 As shown, the die expansion device 200 for electronic components may further include a support base 205. The support base 205 may be fixedly connected to the fixed stage 201 and movably connected to the movable stage 202. The movable stage 202 is movable relative to the support base 205 in the third direction Z. After the movable stage 202 moves the edge portion of the first flexible carrier film 020 toward the support base 205 in the third direction Z, the die expansion device 200 for electronic components can expand the portion of the first flexible carrier film 020 located on the fixed stage 201.

[0351] It should be noted that during the process of shrinking the first substrate 030 by the die expansion equipment 200, after the part of the third flexible carrier film 050 located on the fixed stage 201 is connected to the first flexible carrier film 020 in the first substrate 030, the die expansion equipment 200 can control the moving stage 202 to drive the edge part of the third flexible carrier film 020 to move away from the support seat 205 in the third direction Z, so that the part of the third flexible carrier film 050 located on the fixed stage 021 and the first flexible carrier film 030 in the first substrate 030 can be shrunk back synchronously, and then the new die expansion mother ring 0312 and the new daughter ring 0311 are engaged to obtain the shrunk first substrate 030.

[0352] In this application, as Figure 37 , Figure 38 and Figure 39 As shown, the moving stage 202 of the electronic component die expansion equipment 200 may include: an annular support plate 2021, and a plurality of connecting posts 2022 connected to the support plate 2021. The ends of the plurality of connecting posts 2022 in the moving stage 202 that face away from the support plate 2021 can all be movably connected to the support base 205. The fixed stage 201 can be distributed within the area enclosed by the support plate 2021. It should be noted that the edge portion of the first flexible support film 020 contacts the side of the support plate 2021 facing away from the connecting posts 2022. Thus, the support plate 2021 drives the first flexible support film 020 to move relative to the support base 205 in the third direction Z through the connecting posts 2022.

[0353] Optional, such as Figure 37 , Figure 38 and Figure 39As shown, the moving stage 202 in the die expansion device 200 for electronic components may further include an elastic element 2023 sleeved on the connecting post 2022. The two ends of the elastic element 2023 in the moving stage 202 can be connected to the carrier plate 2021 and the support base 205, respectively. Thus, during the process where the carrier plate 2021 drives the first flexible carrier film 020 to move towards the support base 205 in the third direction Z via the connecting post 2022, the elastic element 2023 sleeved on the connecting post 2022 can be compressed and store elastic force. After die expansion is completed and the die expansion mother ring 0312 and die expansion daughter ring 0311 are fastened together, the compressed elastic element 2023 can release the stored elastic force, thereby driving the carrier plate 2021 to move in the direction away from the support base 205 via the connecting post 2022 until the moving stage 202 returns to its initial position.

[0354] In this application, as Figure 37 , Figure 38 and Figure 39 As shown, the die expansion device 200 for electronic components may further include: multiple track components 207 distributed around the periphery of the moving stage 202, and multiple drive motors 206 connected one-to-one with the multiple track components 207. The track components 207 may extend along a third direction Z, and the drive motors 206 may be configured to move relative to the track components 207 in the third direction Z, and after contacting the side of the support plate 2021 away from the connecting column 2022, drive the support plate 2021 to move towards the support base 205.

[0355] In this way, the drive motor 206 can drive itself to move relative to the track component 207 in the third direction. When the moving stage 202 needs to move in the third direction Z towards the support 205, the drive motor 206 can move on the track component 207 in the direction towards the support 205. After the drive motor 206 contacts the support plate 2021, the drive motor 206 can abut against the support plate 2021 and move in the direction towards the support 205 through the corresponding connecting post 2022, and can compress the elastic element 2023 sleeved on the connecting post 2022. Thus, after the crystal expansion is completed and the crystal expansion mother ring 0312 and the crystal expansion daughter ring 0311 are fastened together, the drive motor 206 will no longer continue to move on the track component 207 in the direction toward the support seat 205, and the compressed elastic element 2023 can release its elastic force to drive the bearing plate 2021 to move in the direction away from the support seat 205. At the same time, the fourth moving mechanism 205 moves on the track component 207 in the direction away from the support seat 205 until the moving stage 202 and the fourth moving mechanism 205 can both return to their initial state.

[0356] Optionally, the drive motor 206 in the die expansion device 200 for electronic components can be a servo motor. In this way, as the drive motor 206 moves towards the support base 205 from the support plate 2021, it can ensure that the support plate 2021 moves towards the support base 205 at the same speed and uniformly. This ensures that, after die expansion, the electronic components 021 in the first substrate 030 can be arranged according to the target position and / or target distance, improving die expansion accuracy.

[0357] In summary, the die expansion equipment provided in this application embodiment, through the second camera in the die expansion equipment, only controls the moving stage to move to start die expansion after determining that the distance between the center point of the orthographic projection of the area where multiple electronic components on the first flexible carrier film are located on the carrier surface of the fixed stage and the center point of the carrier surface of the fixed stage is less than a first preset threshold. This ensures that the multiple electronic components in the first substrate obtained after die expansion can be located in the central region of the first substrate. Furthermore, the die expansion equipment can acquire the position information of the multiple electronic components in the first flexible carrier film in real time through the second camera. During the die expansion process of the first flexible carrier film, when the die expansion equipment detects that the position information of the multiple electronic components in the first flexible carrier film meets or is close to the target condition, the die expansion equipment can control the moving stage to stop moving and can control the lifting mechanism to drive the die expansion mother ring and die expansion daughter ring to engage and connect, thereby obtaining the first substrate. Thus, through the second camera, the multiple electronic components in the first substrate obtained after die expansion by the die expansion equipment can meet or be close to the target condition, improving the die expansion accuracy.

[0358] This application also provides a die expansion method for electronic components. This die expansion method can be applied to the die expansion equipment for the aforementioned electronic components. The die expansion equipment includes: a fixed stage, a movable stage distributed around the fixed stage, and a lifting mechanism disposed opposite to the fixed stage in a third direction. The fixed stage is used to support a first flexible carrier film and a die expansion sub-ring disposed in contact with the first flexible carrier film. The first flexible carrier film includes multiple electronic components, and the orthographic projections of the multiple electronic components on the carrier surface of the fixed stage are all located within the area enclosed by the orthographic projections of the die expansion sub-rings on the carrier surface of the fixed stage. The movable stage is connected to the edge portion of the first flexible carrier film. The lifting mechanism is connected to the die expansion mother ring and is perpendicular to the carrier surface of the fixed stage in a third direction.

[0359] The method may include: moving the edge portion of the first flexible carrier film upwards via a moving stage to expand the crystal on the portion of the first flexible carrier film located on the fixed stage, then controlling the moving stage to stop moving, and simultaneously controlling the lifting mechanism to move upwards toward the fixed stage until the crystal expansion mother ring and the crystal expansion daughter ring are engaged and connected to obtain the first substrate.

[0360] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0361] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0362] Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by hardware or by a program instructing related hardware. The program can be stored in a computer-readable storage medium, such as a read-only memory, a disk, or an optical disk.

[0363] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A crystal expansion device, characterized in that, include: A fixed platform is used to support a first flexible carrier film and a crystal expander ring disposed in contact with the first flexible carrier film. The first flexible carrier film includes multiple electronic components, and the orthographic projections of the multiple electronic components on the carrier surface of the fixed platform are all located within the area enclosed by the orthographic projections of the crystal expander ring on the carrier surface of the fixed platform. A movable platform is distributed around the fixed platform, and the movable platform is connected to the edge portion of the first flexible support membrane. A lifting mechanism is provided in a third direction opposite to the fixed platform. The lifting mechanism is connected to the expansion ring. The third direction is perpendicular to the bearing surface of the fixed platform. The crystal expansion device is configured to: move the edge portion of the first flexible carrier film upward in a third direction via the moving stage, expand the portion of the first flexible carrier film located on the fixed stage, then control the moving stage to stop moving, and simultaneously control the lifting mechanism to move towards the fixed stage in a third direction until the crystal expansion mother ring and the crystal expansion daughter ring are engaged and connected to obtain the first substrate.

2. The crystal expansion equipment according to claim 1, characterized in that, The crystal expansion device is configured to: before expanding the portion of the first flexible carrier film located on the fixed platform, obtain the positional relationship between the center point of the orthographic projection of the region where the plurality of electronic components are located on the carrier surface of the fixed platform and the center point of the carrier surface of the fixed platform; and after determining that the distance between the center point of the orthographic projection of the region where the plurality of electronic components are located on the carrier surface of the fixed platform and the center point of the carrier surface of the fixed platform is less than a first preset threshold, control the moving stage to drive the edge portion of the first flexible carrier film to move upward in a third direction.

3. The crystal expansion equipment according to claim 2, characterized in that, The first flexible support film also includes a marking portion; The die expansion device is configured to: obtain the distance between the center point of the orthographic projection of the region where the plurality of electronic components are located on the bearing surface of the fixed stage and the center point of the bearing surface of the fixed stage, based on the positional relationship between the marking portion and the center point of the bearing surface of the fixed stage.

4. The crystal expansion equipment according to claim 3, characterized in that, The marking portion is a scratch mark, ink mark, or coating mark disposed on the first flexible carrier film or the electronic component.

5. The crystal expansion equipment according to claim 3, characterized in that, The marking part is located at the center point of the area where the plurality of electronic components are located.

6. The crystal expansion apparatus according to any one of claims 1 to 5, characterized in that, The die expansion device is configured to: during the die expansion process of the portion of the first flexible carrier film located on the fixed platform, obtain the size of the outer boundary of the region where the plurality of electronic components are located, and after determining that the outer boundary size of the region where the plurality of electronic components are located has been expanded to a preset size, control the moving platform to stop moving.

7. The crystal expansion apparatus according to any one of claims 1 to 5, characterized in that, The die expansion device is further configured to: after the die expansion sub-ring and the die expansion mother ring are fastened together to obtain the first substrate, if the area where the plurality of electronic components are located is located within the area enclosed by the inner boundary of the die expansion sub-ring, and in the direction parallel to the bearing surface of the fixed stage, the minimum distance between the outer boundary of the area where the plurality of electronic components are located and the inner boundary of the die expansion sub-ring is less than a second preset threshold, then the first substrate is subjected to inward shrinkage processing.

8. The crystal expansion equipment according to claim 7, characterized in that, The fixed stage is also used to support the third flexible carrier film, and the movable stage is also used to be connected to the edge portion of the third flexible carrier film; the crystal expansion device is configured to: drive the edge portion of the third flexible carrier film to move upward on the third stage via the movable stage, so as to stretch the portion of the third flexible carrier film located on the fixed stage, and then control the movable stage to stop moving; After the portion of the third flexible carrier film located on the fixed platform is connected to the first flexible carrier film in the first substrate, the edge portion of the third flexible carrier film is moved upward by the moving stage, so that the portion of the third flexible carrier film located on the fixed platform and the first flexible carrier film in the first substrate retract synchronously, and then the new expansion mother ring and the new expansion daughter ring are fastened to obtain the first substrate after shrinkage.

9. The crystal expansion equipment according to claim 8, characterized in that, The third flexible carrier film has an auxiliary sub-ring and an auxiliary mother ring that are fastened together, and the first substrate is located in the area enclosed by the auxiliary sub-ring.

10. The crystal expansion apparatus according to any one of claims 1 to 5, 8 or 9, characterized in that, The crystal expansion device further includes a second camera disposed opposite to the fixed stage in a third direction, wherein the orthographic projection of the second camera on the bearing surface of the fixed stage is located within the area enclosed by the orthographic projection of the crystal expansion ring on the bearing surface of the fixed stage, and the second camera is used to acquire a second image.

11. The crystal expansion apparatus according to any one of claims 1 to 5, 8 or 9, characterized in that, The die expansion equipment further includes a support base, which is fixedly connected to the fixed stage and movably connected to the movable stage, the movable stage being able to move relative to the support base in the third direction.

12. The crystal expansion equipment according to claim 11, characterized in that, The mobile platform includes: an annular support plate, and a plurality of connecting columns connected to the support plate, wherein the ends of the plurality of connecting columns opposite to the support plate are movably connected to the support base; The fixed platforms are distributed within the area enclosed by the support plate.

13. The crystal expansion equipment according to claim 12, characterized in that, The moving platform further includes an elastic element sleeved on the connecting column, with both ends of the elastic element abutting against the bearing plate and the support base.

14. The crystal expansion equipment according to claim 13, characterized in that, The crystal expansion equipment also includes: multiple track components distributed around the periphery of the moving stage, and multiple drive motors connected to each of the multiple track components in a one-to-one correspondence; The track component extends along the third direction, and the drive motor is configured to move relative to the track component in the third direction, and after contacting the side of the support plate away from the connecting column, drive the support plate to move toward the support base.

15. The crystal expansion equipment according to claim 14, characterized in that, Each of the aforementioned drive motors is a servo motor.

16. A die expansion method for an electronic component, characterized in that, A die-expanding device for electronic components includes: a fixed stage, a movable stage distributed around the fixed stage, and a lifting mechanism disposed opposite to the fixed stage in a third direction; the fixed stage is used to support a first flexible carrier film and a die-expanding sub-ring disposed in contact with the first flexible carrier film, the first flexible carrier film including multiple electronic components, and the orthographic projections of the multiple electronic components on the carrier surface of the fixed stage are all located within the area enclosed by the orthographic projections of the die-expanding sub-rings on the carrier surface of the fixed stage; the movable stage is connected to the edge portion of the first flexible carrier film; the lifting mechanism is connected to the die-expanding mother ring, and the third direction is perpendicular to the carrier surface of the fixed stage; The method includes: moving the edge portion of the first flexible carrier film upward in a third direction via the moving stage to expand the crystal in the portion of the first flexible carrier film located on the fixed stage; then controlling the moving stage to stop moving; and simultaneously controlling the lifting mechanism to move upward toward the fixed stage in a third direction until the crystal expansion mother ring and the crystal expansion daughter ring are engaged and connected to obtain the first substrate.

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