Vacuum coating system

Abstract

The present disclosure relates to a vacuum coating system for coating a tape-type substrate (5), said vacuum coating system (10) comprising:-a first module (20) comprising a first module housing (21) comprising at least one of a first substrate inlet (22) and a first substrate outlet (23); the present invention relates to a substrate processing apparatus (1) comprising:-a first module (21) comprising at least one of a first substrate inlet (42) and a first substrate outlet (43),-a second module (40) comprising a second module housing (41) comprising at least one of a second substrate inlet (42) and a second substrate outlet (43),-a substrate transfer unit (50) arranged in one of the first module housing (21) and the second module housing (41), and-a substrate processing unit (60) arranged in one of the first module housing (21) and the second module housing (41), the substrate handling unit (70) is arranged in the other of the first module housing (21) and the second module housing (41),-wherein at least one of the substrate transfer unit (50) and the substrate handling unit (70) is interchangeably arranged in one of the first module housing (21) and the second module housing (41), or-wherein at least one of the substrate transfer unit (50) and the substrate handling unit (70) is interchangeably arranged in one of the first module housing (21) and the second module housing (41). The first module (20) and the second module (40) are interchangeably connectable via at least one of the first and second substrate inlets (22, 42) and at least one of the first and second substrate outlets (23, 43), respectively.

Description

[0001] This invention relates to the field of coating substrates, and more particularly to the field of coating metal substrates with a metal coating or an anti-corrosion coating. An aspect of the invention relates to a vacuum coating system and a method for configuring a vacuum coating system. Background Technology

[0002] Various methods exist for plating or coating the surface of corrosive materials (such as steel bars or strips) with anti-corrosion materials (such as zinc, aluminum, etc.). It is generally known, for example, to coat the surface of corrosive metallic materials with anti-corrosion coatings by electroplating zinc, hot-dip galvanizing, or by physical vapor deposition (PVD).

[0003] For example, document US 2021 / 0238726 A1 discloses a vacuum coating system for coating strip materials, particularly metal sheets or strips.

[0004] Typically, such vacuum coating systems are designed for only one specific coating or surface treatment process. The overall design and operation of a vacuum coating system may be limited to supporting only a single, well-defined vacuum deposition or vacuum processing procedure using strip materials. Modifications to the substrate processing procedure or the coating or processing procedure require a fairly meticulous reconfiguration or retrofit of the entire coating system. Moreover, the total footprint or space required to install such a vacuum coating system is relatively large and difficult to modify. Changes or modifications to the coating or processing procedure may require a meticulous reinstallation of the coating system. Such modifications to the coating or substrate processing procedure may therefore often mean a complete redesign or reconstruction of the equipment or the entire vacuum coating system.

[0005] Therefore, it is expected that improvements to vacuum coating systems can be provided that allow for fairly flexible and easy configuration and reconfiguration to adapt the vacuum coating system to different or varying needs for substrate coating or substrate processing. Summary of the Invention

[0006] According to the definition of the independent claim, the aforementioned problems and deficiencies are addressed by a vacuum coating system for coating strip substrates and by a method for configuring or reconfiguring the vacuum coating system. Numerous examples and embodiments are the subject of the corresponding dependent claims.

[0007] In one aspect, a vacuum coating system for coating a strip substrate is provided. The vacuum coating system includes a first module. The first module includes a first module housing. The first module housing includes at least one of a first substrate inlet and a first substrate outlet. The vacuum coating system further includes a second module. The second module includes a second module housing. The second module housing includes at least one of a second substrate inlet and a second substrate outlet.

[0008] The vacuum coating system further includes a substrate transfer unit disposed in one of the first module housing and the second module housing. The vacuum coating system further includes a substrate processing unit disposed in the other of the first module housing and the second module housing. Through the substrate transfer unit, a strip or bar substrate can be transferred through at least one of the first and second modules or through components of the first and second modules. Through the substrate processing unit, at least the surface of the substrate can be processed according to a process performed by the vacuum coating system. For example, the substrate processing unit can be used to prepare, coat, or otherwise process (e.g., anneal) the substrate.

[0009] At least one of the substrate transfer unit and the substrate processing unit is interchangeably or detachably arranged in one of the first module housing and the second module housing. Alternatively or additionally, the first module and the second module can be interchangeably connected via at least one of the first substrate inlet and the second substrate inlet and at least one of the first substrate outlet and the second substrate outlet, respectively.

[0010] By providing a first module housing and a second module housing respectively for the first module and the second module, and by providing at least one of the substrate transfer units and at least one of the substrate processing units, an interchangeable and therefore reconfigurable arrangement of the substrate transfer unit and substrate processing unit utilizing different modules or module housings is provided. The module housing may include a well-defined and fixed geometric structure. By interchangeably arranging or securing the transfer unit and / or processing unit to one of the first module housing and the second module housing, the overall design of the vacuum coating system can be changed and reconfigured accordingly.

[0011] Moreover, by interchangeably arranging at least one of the substrate transfer unit and the substrate processing unit in one of the first and second modules, the corresponding module housings and therefore the corresponding modules can be modified and reconfigured between the substrate transfer module and the substrate processing module, the substrate transfer module being used to provide transfer of the substrate through the corresponding or adjacently positioned module, the substrate processing module being primarily operable to process (i.e., to prepare and / or to coat) the surface of the substrate.

[0012] In some examples, the first module housing and the second module housing can be fixed relative to each other. Here, and by interchangeably arranging or securing the substrate transfer unit and / or substrate processing unit to one of the first module housing and / or inside one of the second module housings, the functions of the corresponding first and second module housings can be changed, for example, by removing the substrate transfer unit from the first module housing and arranging it in the second module housing. Conversely, the substrate processing unit initially disposed in the first module housing can be removed from the first module housing and can be arranged inside the second module housing. In this way, the function and functionality of the first and second modules can be easily interchanged or modified by respectively interchange or reconfiguring the arrangement of the substrate transfer unit and / or substrate processing unit in the first and second module housings.

[0013] In another example, it is conceivable to provide a plurality of processing units distinguished by the type of substrate processing, or a plurality of transfer units distinguished by the type of transfer. Here, and when starting from an initial configuration, wherein the first processing unit is arranged in the first module housing, the corresponding module can be reconfigured toward a modified configuration, for example by interchange of the first processing unit with the second processing unit and / or by interchange of the first transfer unit with the second transfer unit. In this way, the module housing can be individually and variably equipped with one of a variety of processing units or transfer units to establish or configure a vacuum coating system.

[0014] By way of example, and when a first module having its first module housing is equipped with a substrate processing unit, the corresponding module forms or constitutes a substrate processing module. Arranging a substrate transfer unit within the first module housing transforms the corresponding module into a transfer module. Accordingly, the same housing (e.g., one of the first and second module housings) can be arbitrarily used to form or constitute one of the transfer module and the substrate processing module by receiving and accommodating the corresponding substrate processing unit or substrate transfer unit. In this way, the total number of module housings with different configurations or different sizes can be reduced to a minimum, thereby allowing for a reduction in the cost and expenditure of designing and redesigning such vacuum coating systems.

[0015] Furthermore, based on a further example, it is conceivable that the substrate transfer unit is disposed in the first module housing, and the substrate processing unit is disposed in the second module housing. Here, by interchangeably connecting the first and second module housings, the positions of the respective module housings equipped with the transfer unit and the processing unit can be interchanged or reconfigured, thereby allowing for a fairly easy and flexible reconfiguration of the entire vacuum coating system.

[0016] Of course, a vacuum coating system may include not only the first and second modules, but also a number of modules, which are typically arranged in rows or columns to define a path along which the substrate can be transported and processed on its surface.

[0017] A vacuum coating system can be divided into multiple modules, some of which are dedicated to transferring substrates through the module arrangement, and some of which are dedicated to processing the substrates. In some examples, modules are specifically equipped with substrate transfer units, and some modules are specifically equipped with substrate processing units for substrate processing.

[0018] In some examples, one of the first and second modules may include both a substrate processing unit and a substrate transfer unit. Here, the module satisfies or includes dual functionality, namely, providing a surface for transferring the corresponding module housing through the substrate and providing a surface for processing the substrate.

[0019] In some examples, the module housing includes standardized connectors or fasteners for detachably receiving or detachably connecting at least one of the substrate processing unit and the substrate transfer unit. The fastening structure of the module housing for securing the substrate transfer unit can be equal to, and vice versa, the fastening structure configured for securing the substrate processing unit. Therefore, the substrate transfer unit and the substrate processing unit can include equal or at least mutually corresponding fastening structures by which they can be interchangeably fastened to the first module housing and the second module housing, or to the interior of the first module housing and the second module housing. Furthermore, the first module housing and the second module housing can include the same mechanical fasteners for securing the substrate transfer unit to and / or for securing the substrate processing unit inside the module housing.

[0020] Standardized connectors and fastening structures located on or inside the first and second module housings allow for interchangeable arrangement and / or interchangeable fastening of the substrate transfer unit and substrate processing unit in either the first or second module housing.

[0021] Furthermore, according to a further example, the first module and the second module can be interchangeably connected via at least one of the first substrate inlet and the second substrate inlet, and / or via at least one of the first substrate outlet and the second substrate outlet, respectively. Thus, in one configuration, the first substrate outlet of the first module can be connected to the second substrate inlet of the second module. In another configuration, for example, the order of the first module and the second module, equipped with different substrate transfer units and / or different substrate processing units, can be changed or interchanged. Then, the second substrate outlet of the second module can be connected to or interconnected with the first substrate inlet of the first module. This interchangeable connectivity between the first module and the second module (i.e., between the first module housing and the second module housing) is particularly advantageous for rearranging existing and, for example, pre-configured modules of the vacuum coating system.

[0022] In some examples, the first module housing includes a first fastener configured to engage with a reverse fastener of at least one of the substrate transfer unit and the substrate processing unit. Correspondingly, the second module housing includes a second fastener similarly configured to engage with a reverse fastener of at least one of the substrate transfer unit and the substrate processing unit. Likewise, the substrate transfer unit and / or the substrate processing unit are provided with reverse fasteners that can engage with at least one of the first fastener of the first module housing and the second fastener of the second module housing.

[0023] In a further example, the first substrate inlet is provided with a first connector, and the first substrate outlet is provided with a first reverse connector that is complementary to the first connector. Here, the second substrate inlet of the second module housing can also be provided with a first connector, and the second substrate outlet of the second module housing can also be provided with a first reverse connector. In this way, the first module and the second module can be interchangeably connected via their respective substrate inlets and substrate outlets.

[0024] According to some examples, vacuum coating systems are specifically configured for coating or processing strip substrates. Here, the strip substrate can extend through a first module, i.e., from the first substrate inlet toward and through the first substrate outlet through the interior of the first module housing. The strip substrate can further extend into a second module, specifically, through the second substrate inlet into the second module housing, and, for example, by extending through the second substrate outlet, further through and beyond the second module.

[0025] In some examples, the first substrate outlet can be aligned with the second substrate inlet. The first substrate outlet can be completely flush with the second substrate inlet. This provides a fairly direct transfer of the strip substrate from the first module toward and into the second module.

[0026] In some examples, the substrate transfer unit can be configured to provide or perform continuous transfer of the strip substrate through a first module, through a second module, and from the first module to the second module.

[0027] In some examples, and in the case of a closed-loop strip substrate, for example, a first portion of the strip substrate may be located inside a first module housing, and a second portion of the same strip substrate may be located inside a second module housing, wherein the first and second portions of the strip substrate will be processed or coated simultaneously in the first and second modules in a time-overlapping manner.

[0028] In some examples, the vacuum coating system is configured to process and / or coat a strip substrate in either the first module or the second module, while the substrate is subjected to transfer or movement relative to the respective module or module housing.

[0029] According to a further example, the vacuum coating system is transferable between a first operating configuration and at least one of a second and a third operating configuration. In some examples, the vacuum coating system is transferable between the first, second, and third operating configurations. In the first operating configuration, the first substrate outlet is directly or indirectly connected to the second substrate inlet. In the second operating configuration, the second substrate outlet is directly or indirectly connected to the first substrate inlet. In the third operating configuration, the first substrate outlet is directly connected to the third substrate inlet of the third substrate housing of the third module. In the first operating configuration, the third substrate inlet is directly or indirectly connected to the second substrate outlet.

[0030] When starting from the first operating configuration, the first substrate outlet is directly or indirectly connected to the second substrate inlet. As seen along a series of process steps, the first module, and therefore the first module housing, precedes the second module or the second module housing. When the strip substrate is processed, it is transported toward the second module through the first module and through the second module. In the second operating configuration, the roles of the first module and the second module can be interchanged. Here, the second module may precede the first module. Accordingly, the second substrate outlet of the second module is directly or indirectly connected to the first substrate inlet. Here, the substrate is transported along the transport direction that passes through the second module, exits the second module through the second substrate outlet, and enters the first module through the first substrate inlet.

[0031] The shift of the vacuum coating system from the first operating configuration to the second operating configuration means that the first module housing and the second module housing are respectively provided with corresponding and / or complementary mechanical connection structures and mechanical reverse connection structures.

[0032] In some examples, the first and second substrate inlets are provided with standardized mechanical connection structures, which are complementary to the reverse connection structures provided at the corresponding substrate outlets of the first and second modules. This allows for interchangeable arrangements of the first and second modules (i.e., the first module housing and the second module housing, respectively).

[0033] In the third operating configuration, the vacuum coating system includes at least a first module, a second module, and a third module. In the first operating configuration, the second module is located between the first module and the third module. Accordingly, the second substrate inlet of the second module is directly connected to the first substrate outlet of the first module. The second substrate outlet of the second module is directly connected to the third substrate inlet, as provided by the third module. In the first operating configuration, the first module precedes the second module, and the second module precedes the third module.

[0034] By transferring the vacuum coating system from the first configuration to the third configuration, it may only be necessary to remove the second module. The first substrate outlet of the first module is then directly connected to the third substrate inlet of the third module. In other words, by transferring the vacuum coating system between the first and third configurations, the total number of modules constituting the vacuum coating system changes. Nevertheless, and because the mechanical connection structures and mechanical reverse connection structures in the respective substrate inlet and substrate outlet regions of the modules have substantially equal or complementary shapes or structures, such reconfiguration can be achieved in a fairly straightforward and uncomplicated manner.

[0035] This allows the vacuum coating system to be reconfigured not only for the functionality and / or order of individual vacuum coating modules, but also to vary the total number of vacuum coating modules to accommodate changes or reconfigurations in the coating or processing technology for strip substrates.

[0036] In some examples, a module of a vacuum coating system may include only one of a substrate inlet and a substrate outlet. This is particularly applicable to so-called end or end modules. Such end or end modules can define the beginning and end of a vacuum coating system as seen along the substrate transport direction. An end module may be provided with a first coil on which a strip substrate is wound, and the substrate is unwound from the first coil for surface treatment in any of the next or subsequent modules. A second end or end module located at the opposite end of the vacuum coating system may also be provided with a winder for winding a treated, for example, coated, strip substrate.

[0037] According to another example, the first module housing includes a first substrate inlet and a first substrate outlet. The same applies to the second module housing, for example, which includes a second substrate inlet and a second substrate outlet. Such a first module housing and / or second module housing can be transformed into an end or end module housing, for example, by closing one of the substrate inlet and the substrate outlet. In this way, a fairly general module housing, for example, having a first substrate inlet and a first substrate outlet, can be transformed into an end or end module housing by closing and / or sealing one of the substrate inlet and the substrate outlet.

[0038] Specifically, and when the substrate inlet is closed, the corresponding module can be transferred to a first end module, which is provided, for example, with a winder to unwind the strip substrate and to supply the strip substrate through the first substrate outlet toward the next or subsequent module of the vacuum coating system. A second end or end module equipped only with the corresponding substrate inlet can be provided by closing the substrate outlet of a standardized or generic module housing. This second end or end module can typically be provided with a winder operable to wind or wrap the treated or coated strip substrate.

[0039] In a further example, and when the first module housing includes a first substrate inlet and a first substrate outlet, the first effective distance between the first substrate inlet and the first substrate outlet may be the same as or equal to one of the following: i) a second effective distance between the second substrate inlet and the second substrate outlet of the second module housing, and ii) an integer multiple n of the fraction f of the second effective distance, where f is one of the following: 1 / 2, 1 / 3, 1 / 4, 1 / 5, 1 / 6, 1 / 7 or 1 / 8, and where n is one of the following: 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 or 16.

[0040] Accordingly, by providing first and second module housings with first and second effective distances that are equal to or have a clearly defined size ratio, it is possible to change the order and / or position of the first and second modules in an existing vacuum coating system. Furthermore, by defining the first effective distance as an integer multiple of the second effective distance or as a fraction n / f, it is possible to redesign or reconfigure the vacuum coating system, for example, by replacing two or more modules of the first configuration of the vacuum coating system with one or a different number of modules of the vacuum coating system in a second configuration.

[0041] The vacuum coating system can be configured with a predefined or explicitly defined grid dimension or module dimension, which allows individual modules to be interchanged or replaced by any other module and / or by replacing the number of modules n with the number of modules f, where n is not equal to f. Then, when transferring the vacuum coating system from a first configuration to a second configuration, the remaining modules that do not need to be modified can remain unchanged with respect to their relative and / or absolute position or configuration with respect to the vacuum coating system.

[0042] Providing a first module housing with a first effective distance and a second module housing with a second effective distance between the respective substrate outlet and substrate inlet is particularly advantageous for reconfiguring the vacuum coating system and for replacing a module with another module, thereby keeping the remaining modules, which are not directly involved in the reconfiguration, substantially unchanged in both their position and orientation in the first and second configurations of the vacuum coating system.

[0043] According to a further example, at least one of the first module housing and the second module housing includes a first sidewall having a first through recess extending through the first sidewall and configured to receive a first substrate processing unit therethrough. By providing the first through recess to the first sidewall, the substrate processing unit can be detachably and reconfigurably connected to or disposed at or inside the first module housing or the second module housing. This allows different substrate processing units to be interchangeably disposed in one of the first module housing and the second module housing and / or disposed inside one of the first module housing and the second module housing.

[0044] In some examples, the substrate processing unit, or various other substrate processing units in different configurations, can be fastened to the first sidewall and / or adjacent through recess. This allows the substrate processing unit to be mounted and fastened to the sidewall quite easily, and thus to or within the corresponding module housing.

[0045] According to a further example, at least one of the first module housing and the second module housing includes a second sidewall having a second through recess extending through the second sidewall. The second through recess and / or the second sidewall is configured to receive a second substrate processing unit therethrough. Here, the respective module housing can be configured to simultaneously process strip-shaped substrates extending through the respective module housing (e.g., from the respective substrate inlet to and / or through the respective substrate outlet) on both sides or both sides.

[0046] In some examples, and when the first module housing or the second module housing includes a first sidewall with a first through recess and a second sidewall with a second through recess, the two sidewalls or through recesses can typically be equipped with the same or identical substrate processing unit or with different substrate processing units. In the case of identical configurations of the first sidewall or through recess and the second sidewall or through recess with the same substrate processing unit, substantially equal surface treatments on both sides of the strip substrate can be provided within the respective first module or second module.

[0047] In the case of a first through recess and a second sidewall equipped with different first substrate processing units and second substrate processing units, different surface treatment processes can be provided on opposite sides of the strip substrate. Here, the substrate treatment provided by the first processing unit can support or improve the process or substrate treatment provided or implemented by the second substrate unit.

[0048] According to a further example, one of the first module housing and the second module housing includes a first sidewall having a first through recess and a second sidewall having a second through recess. The first sidewall may be opposite to the second sidewall, and / or the first through recess may be opposite to the second through recess.

[0049] In some examples, the first through recess and the second through recess can be directly opposite each other. They can be completely flush in a direction that extends substantially perpendicular to the surface or plane of the strip substrate, which is transported through the respective module housing from, for example, a first substrate inlet toward a first substrate outlet or from a second substrate inlet toward a second substrate outlet.

[0050] The direct and opposite arrangement and configuration of the first through recess and the second through recess and / or the first sidewall and the second sidewall facilitates providing equal or at least substantially equal process conditions on opposite sides of the substrate.

[0051] According to a further example, the substrate processing unit includes a cover configured to close and / or seal at least one of a first through-recess and a second through-recess. The cover may include a fairly flat and rigid structure. Its size may be designed to completely cover the opening or through-recess in at least one of the first and second sidewalls of the corresponding module housing. In this way, and when the processing unit is arranged inside the corresponding module housing, the cover can cover and / or close the through-recess in the sidewall of the corresponding module housing.

[0052] In some examples, the cover can be fastened, for example, detachably fastened to a sidewall or sidewall portion including a through recess. The substrate processing unit can be rigidly attached or rigidly connected to the cover. In this way, the substrate processing unit can be simply arranged and / or detachably fastened and secured to the first or second module housing by attaching and fastening the corresponding cover of the substrate processing unit to and fastening it to the sidewall of the module housing.

[0053] Here, a fastening structure may be provided in the boundary region of the through recess of the first or second sidewall, and the fastening structure is complementary to the reverse fastening structure of the corresponding substrate processing unit.

[0054] According to a further example, the substrate processing unit includes one of the following: an evaporator, a magnetron, a plasma source, a heating unit, and a cooling unit. Therefore, the substrate processing unit can be operable to modify the temperature of the substrate. In a further example, the substrate processing unit can be configured to generate plasma within a corresponding module housing, through which a coating or layer of material can be deposited on the surface of the strip substrate, for example, by physical vapor deposition (PVD).

[0055] In some examples of vacuum coating systems, a plurality of substrate processing units as described above are provided. One or more evaporators and / or one or more plasma sources, as well as one or more heating units or one or more cooling units, may be provided. Here, each module may be provided with a single substrate processing unit, or a plurality of the aforementioned substrate processing units may be provided. In this way, the vacuum coating system can be easily and reconfigurably adapted to varying requirements of the processing technology for strip substrates.

[0056] According to a further example, a first substrate processing unit is interchangeably provided in one of the first module and the second module, and the first substrate processing unit can be replaced by a second substrate processing unit. Therefore, the corresponding modules can be variably and reconfigurably provided with different substrate processing units.

[0057] In other examples, the same module (e.g., one of the first and second modules) may have more than one substrate processing unit. Here, at least one of the first and second modules may have a first substrate processing unit and a second substrate processing unit, or even a third substrate processing unit. In this way, and by providing modules with multiple identical or multiple different substrate processing units, the operability and functionality of the respective modules can be modified in principle.

[0058] According to a further example, the substrate transfer unit includes one of the following: a transfer roller, a deflection roller, a tension roller, and a winder. The winder and the aforementioned rollers can be driven, for example, passively or actively, by a driver.

[0059] Using transfer rollers, the strip substrate can be linearly transferred through the respective module or module housing, for example, in a fairly straight and / or undeflected configuration. Using deflection rollers, the strip substrate can change its transfer direction within the respective module equipped with the deflection rollers. The deflection rollers can provide reorientation or redirection, and thus bend or deflect the transfer direction of the strip substrate, for example, by about 90º, about 60º, about 45º, or about 30º.

[0060] Specifically, when the module is equipped or configured as a transfer module and is provided with deflection rollers, the substrate inlet may not be positioned opposite the substrate outlet. Instead, and for example, when the deflection rollers provide a deflection of the substrate transfer direction by, for example, 90°, the substrate inlet may be located in a third sidewall, and the substrate outlet may be located in a fourth sidewall, wherein the third and fourth sidewalls are not opposite but adjacent to each other. This can be particularly suitable for rectangular module housings or for cuboid module housings.

[0061] According to a further example, at least one of the first module housing and the second module housing includes a third sidewall and a fourth sidewall. The third sidewall is provided with one of the first substrate inlet and the second substrate inlet, and the fourth sidewall is provided with one of the first substrate outlet and the second substrate outlet. In some examples, the module housings of the first module and the second module have a cuboid or rectangular shape. Here, and as seen in the direction transverse to the transport direction of the substrate, the first sidewall and the second sidewall can be arranged opposite to each other. Furthermore, the third sidewall and the fourth sidewall can be arranged opposite to each other. In some examples, the third sidewall is located between the first sidewall and the second sidewall, and the fourth sidewall can be disposed between the opposite ends of the first sidewall and the second sidewall.

[0062] However, specifically in the case where the substrate transfer unit includes deflection rollers, the third and fourth sidewalls do not necessarily need to be positioned opposite each other. They can be arranged adjacent to each other and each can include a surface normal extending at an angle between 30º and 60º relative to each other.

[0063] According to a further example, the third sidewall is opposite to the fourth sidewall and / or the third substrate inlet is opposite to the first substrate outlet and / or the second substrate inlet is opposite to the second substrate outlet. In either case, and when the third sidewall is opposite to the fourth sidewall, and when the third sidewall is provided with a substrate inlet and when the fourth sidewall is provided with a substrate outlet, the corresponding module provides and / or supports a fairly straight and therefore undeflected substrate transfer from the substrate inlet toward and through the substrate outlet.

[0064] The first and second sidewalls may include surface normals that are substantially parallel to the surface normals of the strip substrate being transported through the respective module or module housing. Therefore, the first and / or second through recesses provided in the first and second sidewalls of the respective housings face the surface of the strip substrate to be treated (e.g., coated) using a vacuum coating system.

[0065] In a further example, the third sidewall is adjacent to or adjacent to the fourth sidewall. At least one of the first substrate inlet and the second substrate inlet extends at a predefined angle relative to the first substrate outlet and the second substrate outlet of the same module housing. Such examples are particularly applicable to cases where the corresponding module or module housing is equipped with a transfer unit that provides deflection or redirection of the strip substrate inside the corresponding module housing.

[0066] Using, for example, a deflection roller that redirects the substrate transport direction by 90°, the substrate inlet can extend at an angle of approximately 90° to the substrate outlet of the same module housing. In other examples, where the deflection roller is defined to redirect or deflect the substrate transport direction by, for example, approximately 30° or approximately 45°, the substrate inlet and associated substrate outlet of the same module housing can extend relative to each other at corresponding angles to provide corresponding transport of the substrate through the module housing.

[0067] In a further example, the first module housing includes a first mechanical connection structure at the inlet of the first substrate and further includes a first mechanical reverse connection structure at the outlet of the first substrate. The second module housing includes a second mechanical connection structure at the inlet of the second substrate and further includes a second mechanical reverse connection structure at the outlet of the second substrate. Here, the first mechanical connection structure is complementary to at least one of the first mechanical reverse connection structure, the second mechanical connection structure, and the second reverse connection structure. In this way, well-defined and reconfigurable mechanical fastenings can be provided via the corresponding mechanical connection structures and mechanical reverse connection structures of the first and second module housings.

[0068] In some examples, the second mechanical connection structure can be substantially the same as the first mechanical connection structure. Similarly, the second mechanical reverse connection structure can be the same as the first mechanical reverse connection structure. In this way, the first substrate outlet of the first module housing equipped with the first mechanical reverse connection structure can be connected to the second connection structure at the second substrate inlet of the second module housing. Similarly, the second substrate outlet of the second module housing, which is also equipped with the second mechanical reverse connection structure, can be detachably connected to the first mechanical connection structure provided at the first substrate inlet of the first module housing. In this way, the order or sequence of the first and second module housings can be interchanged as needed.

[0069] In another example, at least one of the first module housing and the second module housing may be aligned in one of a horizontal orientation and a vertical orientation. In the horizontal orientation, the substrate inlet is separated from the substrate outlet along the horizontal direction. In the vertical orientation, the substrate inlet is separated from the substrate outlet along the vertical direction.

[0070] In some examples, various modules can be provided for arrangement in different orientations (e.g., in or along a horizontal orientation and / or along a vertical orientation or direction).

[0071] In other examples, the first module and / or the second module may be arrangable in either orientation. Here, the first module or the first module housing may be configured for use in a horizontal orientation as well as in a vertical orientation. It may be universally available in different orientations and may be reconfigurable and / or connectable or attachable to adjacently positioned modules to establish or facilitate a reconfigurable vacuum coating system.

[0072] According to a further example, the vacuum coating system is configured to coat a strip-shaped metal substrate, such as steel, with a metallic material or metal alloy, for example by physical vapor deposition (PVD), said metallic material or metal alloy including at least one or a combination of at least one or more of the following materials: zinc, aluminum, nickel, chromium, magnesium, or titanium.

[0073] According to another aspect, this disclosure also relates to a method for configuring or reconfiguring a vacuum coating system as described above. Here, the method includes the steps of providing a first module housing and a second module housing, and providing a substrate transfer unit and a substrate processing unit. The method for configuring or reconfiguring the vacuum coating system includes interchangeably arranging the substrate transfer unit in one of the first module housing and the second module housing, and interchangeably arranging the substrate processing unit in the other of the first module housing and the second module housing. Alternatively, the method includes the step of interchangeably connecting the first module and the second module through at least one of the first substrate inlet and the second substrate inlet, and at least one of the first substrate outlet and the second substrate outlet, respectively. Here, the first module may be equipped with one of the substrate transfer unit and the substrate processing unit, and the second module may be equipped with the other of the substrate transfer unit and the substrate processing unit.

[0074] It should be noted that the method of configuring or reconfiguring the vacuum coating system can be specifically implemented using the vacuum coating system described above. In this regard, all the effects, features, and benefits described above in conjunction with the vacuum coating system also apply to the method of configuring the vacuum coating system; and vice versa. Attached Figure Description

[0075] In the following, numerous examples of vacuum coating systems and their components, such as individual modules, are described in more detail with reference to the accompanying drawings, as well as methods for configuring or reconfiguring said vacuum coating systems, wherein:

[0076] Figure 1 schematically illustrates an example of a vacuum coating system for coating strip substrates.

[0077] Figure 2 shows another example of a vacuum coating system.

[0078] Figure 3 shows an example of a module of a vacuum coating system.

[0079] Figure 4 schematically illustrates another configuration of the module used in a vacuum coating system.

[0080] Figure 5 schematically illustrates the processing unit implemented as an evaporator.

[0081] Figure 6 shows another example of an evaporator.

[0082] Figure 7 shows a further example of an evaporator.

[0083] Figure 8 shows an example of another processing unit implemented as a magnetron.

[0084] Figure 9 shows another example of a processing unit implemented as a plasma source.

[0085] Figure 10 schematically illustrates another example of a processing unit arranged inside a module of a vacuum coating system.

[0086] Figure 11 shows another example of a processing unit implemented as a cooling unit.

[0087] Figure 12 shows an example of a transfer unit that includes multiple transfer rollers.

[0088] Figure 13 shows another example of a transfer unit including tension rollers.

[0089] Figure 14 shows another example of a transfer unit including a deflection roller, and

[0090] Figure 15 shows another example of a transfer unit including a winder.

[0091] Figure 16 shows an example of a module housing.

[0092] Figure 17 shows another example of a module housing.

[0093] Figure 18 shows another example of a module housing.

[0094] Figure 19 shows another example of a module housing.

[0095] Figure 20 shows another example of a module housing.

[0096] Figure 21 shows another example of a module housing.

[0097] Figure 22 shows another example of a module housing.

[0098] Figure 23 shows another example of a module housing.

[0099] Figure 24 shows another example of a module housing.

[0100] Figure 25 shows another example of a module housing.

[0101] Figure 26 shows another example of a module housing.

[0102] Figure 27 shows another example of a module housing.

[0103] Figure 28 shows examples of the connection structure and reverse connection structure between the first module and the second module.

[0104] Figure 29 shows further details of the corresponding connection structures and reverse connection structures of the adjacently positioned module housings.

[0105] Figure 30 shows a first configuration of the vacuum coating system.

[0106] Figure 31 shows a second configuration of the vacuum coating system.

[0107] Figure 32 shows a third configuration of the vacuum coating system, and

[0108] Figure 33 shows a flowchart of the method for configuring a vacuum coating system. Detailed Implementation

[0109] Figures 1 and 2 illustrate two different configurations or examples of a vacuum coating system 10 according to the present invention. The vacuum coating system includes a plurality of modules 20, 40, which define a substrate transfer path extending through the arrangement of the modules. The vacuum coating system 10 according to Figure 1 includes a plurality of modules A, B, C, D, E, F, G, H, I, J, K arranged in series. The entire vacuum coating system 10 is constituted by the arrangement of these individual modules, each of which is equipped with at least one of a substrate transfer unit 50 and a substrate processing unit 60.

[0110] In the example according to Figure 1, module A is provided, which is implemented as a second module 40 and equipped with a substrate transfer unit 50 in the form of a winder 55. Module A is connected to a further module B, which in turn is implemented as a second module 40'. Here, the substrate outlet of module A is connected to the substrate inlet of module B. Module B is provided with another substrate transfer unit 50 including a deflection roller 53. Further module C is connected to module B and is implemented, for example, as a substrate processing module. The substrate outlet of module B is connected to the substrate inlet of module C. Module C can be implemented as a first module 20, which includes a first module housing 21 and is equipped with a substrate processing unit 60, which can be implemented as a plasma source 64 or may include a plasma source 64.

[0111] Module C is further connected to another module D. Module D is also implemented as a type of the first module 20' and does not have a transfer unit 50. It may include, for example, another substrate processing unit 60 implemented as a magnetron 63. The substrate outlet of module C is connected to the substrate inlet of module D.

[0112] The substrate outlet of module D can be directly connected to the substrate inlet of another module E. Module E can be implemented as another substrate transfer module and thus as a second module 40''. It can be provided with another transfer unit 50, for example, including a further deflection roller 53. The substrate outlet of module E is connected to the substrate inlet of another module F. Module F can be implemented as a substrate transfer module or a substrate transport module. It may not have a substrate processing unit. Alternatively, module F may be equipped with a substrate processing unit 60 and / or a substrate transport unit 50.

[0113] The substrate outlet of module F is connected to the substrate inlet of another module G, which is also implemented as a substrate transfer module. Module G includes, for example, a transfer unit 50 characterized by a deflection roller 53. The substrate outlet of module G is connected to the substrate inlet of another module H, which is implemented as another first module 20''. Module H includes, for example, a substrate processing unit 60 including an evaporator 62. The substrate outlet of module H is connected to the substrate inlet of a further module I, which is also implemented as a first module 20'''. Module I is equipped with another substrate processing unit 60, for example, implemented as another evaporator 62'.

[0114] The substrate outlet of module I is connected to the substrate inlet of another module J, which is implemented as a substrate transfer module and includes another deflection roller 53. The substrate outlet of module J is finally connected to the substrate inlet of a further module K, which is provided with a transfer unit 50 and includes another winder 55.

[0115] Modules B, E, G, and J include deflection rollers 53, which can modify the substrate feed direction or substrate transport direction. The strip substrate 5 is initially positioned on a coil and can be unwound by the winder 55 of module A. Here, the initial substrate transport direction toward the adjacently positioned module B is substantially horizontal.

[0116] In adjacent module B, the strip substrate 5 is deflected upwards by deflection roller 53. Accordingly, the next module C is located on top of module B. Module D is located on top of module C. Module E is located on top of module D. In this manner, a module arrangement 11 including modules B, C, D, and E is provided, through which the substrate 5 is transported in an upward or vertical direction. The module arrangement 11 forms or constitutes a column of individual modules for transporting and / or processing the substrate 5.

[0117] In module E, substrate 5 is again deflected in the horizontal direction. Substrate 5 is transported or fed through module F and then deflected downward in module G. Before substrate 5 enters the transport module J below module I, module H is arranged below module G and module I is further arranged, in which substrate 5 is again deflected in the horizontal direction. The module arrangement 12 including modules G, H, I, and J defines the vertical downward direction of the modules, while the module arrangement 11 defines the vertical upright arrangement or assembly of modules B, C, D, and E.

[0118] Once the substrate 5 is deflected in module J, it is further provided and transferred to end module K, where the strip substrate 5 is wound by a further winder 55.

[0119] The surface treatment of substrate 5 occurs in a plurality of processing modules C, D, H, and I, wherein, for example, the surface of substrate 5 is heated, pretreated, and / or coated by physical vapor deposition. The vertical arrangement of the plurality of processing modules C, D, H, and I facilitates simultaneous processing or coating of the surface of substrate 5 on both sides. Here, the effect of gravity is equal on both sides of substrate 5.

[0120] Furthermore, by using vertically extending columns of individual modules B, C, D, E or G, H, I, J, and thus corresponding module arrangements 11, 12, the total footprint and installation space of the vacuum coating system 10 can be minimized.

[0121] Figure 2 illustrates another configuration of the vacuum coating system 10. Here, the vacuum coating system 10 comprises a single, continuous horizontal arrangement of modules A, B, C, D, and F. Modules A and F represent end modules or end units, each of which is equipped with a winder 55, 55. Corresponding transfer units 50 located within or provided by these modules A and F may be further provided by tension rollers 54. The coating system 10 may include transfer units 50 of the free span type. It may include a roll-to-roll arrangement in which the substrate 5 is suspended across the deposition area, for example, in any of modules B, C, D, or E, without any physical or mechanical contact with, for example, rollers.

[0122] Rows of modules B, C, D, and E are arranged between modules A and F. Modules B, C, D, and E are all implemented as so-called processing modules. They are all equipped with a processing unit 60 of a certain type, through which surface treatment of the substrate 5 can be provided in principle. The substrate outlet of module A is connected to the substrate inlet of module B. The substrate outlet of module B is connected to the substrate inlet of module C. The substrate outlet of module C is connected to the substrate inlet of module D. The substrate outlet of module D is connected to the substrate inlet of module E. The substrate outlet of module E is connected to the substrate inlet of module F.

[0123] As shown in Figure 2, modules B, C, D, and E are used, with the substrate inlet and substrate outlet facing each other, thereby providing a fairly straight and unbiased substrate transfer from module A to module F.

[0124] Module B of Figure 2 is provided with a plasma source 64, for example, for pre-treating the substrate 5. Module C is provided with a magnetron 63, for example, for performing a spray-based treatment on the surface of the substrate 5. Module D is provided with a first evaporator 62, for example, for depositing a first evaporation material, and the subsequent module E may be provided with another evaporator 62', for example, for depositing another evaporation material onto the surface of the substrate 5.

[0125] The configuration of the vacuum coating system 10 shown in Figure 2 can be specifically configured for single-sided processing. However, the configuration of the vacuum coating system 10 according to Figure 2 can also be applied to double-sided processing of the substrate 5. The configuration shown in Figure 1 is specifically designed for double-sided processing of the substrate 5. There, modules C, D, H, and I, which are implemented as substrate processing modules and thus have processing units 60, each include a dual arrangement of the corresponding processing units. Thus, module C includes two separate plasma sources 64 disposed on opposite sides of the substrate 5. Module D includes two magnetrons 63, each of which is disposed on opposite sides of the substrate 5. Similarly, modules H and I each include two evaporators 62, 62' on opposite sides of the substrate 5.

[0126] Individual modules, such as the first module 20 and the second module 40, as will be explained below, are specifically configured for the reconfiguration of the entire vacuum coating system 10 in order to facilitate changes in the vacuum coating system to suit the specific coating or surface treatment processes of the substrate 5.

[0127] The end or terminal modules A and K of Figure 1 can be closed and / or sealed by a vacuum-sealed closure 51. This can also be applied to modules A and F configured according to Figure 2. Accordingly, the interiors of individual modules A to K and A to F can withstand relatively low pressures (e.g., vacuum pressure), which are obtained by corresponding connection or coupling with a vacuum pump or several vacuum pumps. In some examples, the interiors of all modules A to K or A to F shown in Figures 1 and 2 are fluid-connected, provided a constant level of pressure reduction in all chambers formed by individual modules or module housings.

[0128] Alternatively, the winder 55 can be replaced by an airlock through which the closed-loop strip substrate can be transferred from the atmospheric pressure outside modules A to K and A to F to the vacuum pressure inside the interconnected modules A to K or A to F.

[0129] In the following text, terms such as first module and second module simply refer to different modules of the vacuum coating system. Although the first module is primarily described as including a substrate processing unit and the second module is primarily described as including a substrate transfer unit, such allocation regarding the availability of module housings for the first and second modules is quite arbitrary and non-limiting.

[0130] Typically, and as is evident from the configurations shown in Figures 1 and 2, each module is provided with one of the substrate transport units 5 and / or one of the substrate processing units 60. By way of example, module H of Figure 1 can be regarded as a first module 20''. The first module 20'' includes a first module housing 21 having a first substrate inlet 22 and a first substrate outlet 23.

[0131] As shown in more detail in Figure 16, the first module housing 21 may have a slightly rectangular or cuboid shape. The first module housing 21 includes a first sidewall 24 having a first through recess 25 and further includes a second sidewall 26 having a second through recess 27. The first module housing 21 further includes a third sidewall 28 having a first substrate inlet 22 and further includes a fourth sidewall 29 having a first substrate outlet 23. In operation, the first module 20 receives a substrate 5 through the first substrate inlet 22. The substrate 5 extends through the first module housing 21 and exits through the first substrate outlet 23. The first module housing 21 may be specifically equipped with, or may be specifically equipped with, one or two processing units 60. In the example of module H, the first module 20'' may have two evaporators 62 disposed in the through recesses 25, 27.

[0132] (For example, as shown in more detail in Figures 5 through 7) Each evaporator 62 may include a cover 61, the size and configuration of which are designed to close and / or seal the opening 25 in the first sidewall 24 and the opening 27 in the second sidewall 26. In the example of Figure 6, the evaporator 62, or at least a portion thereof, is configured to be arranged outside the module housings 21, 41. Here, only the nozzle 68 extends through the cover 61 and into the interior of the respective module housings 21, 41. The two evaporators 62 shown in Figures 5 and 6 are specifically configured for such module housings 21 through which the substrate 5 is transported in the vertical direction.

[0133] As shown in Figure 7, the evaporator 62 is configured for use with module housings 21 and 41, and the substrate 5 is horizontally transported through the module housings.

[0134] As shown in Figure 11, the cooling unit 66 can be provided with multiple rollers, which are actively or passively cooled, thereby causing a corresponding cooling effect on the substrate 5.

[0135] As further shown in Figure 16, the first substrate inlet 22 is provided with a first connection structure 32, for example, implemented as a flange 34. The relatively positioned first substrate outlet 23 may be provided with a reverse connection structure 33, for example, implemented as a corresponding reverse flange 34'.

[0136] In some examples, the first mechanical connection structure 32 can be complementary to the first mechanical reverse connection structure 33. In this way, equally formed module housings 21, 21' or module housings 21, 21' of the same or common type can be arranged and connected adjacent to each other, such that the first mechanical connection structure 32 of another first module housing 21' can be connected to the first mechanical reverse connection structure 33 of the first module housing 21.

[0137] In this manner, and as shown in the configuration of Figure 1, the substrate inlet of module 20''', and therefore the substrate inlet of module I, can be connected to the substrate outlet of module H, and therefore the substrate outlet of module 20''. In the example shown, modules 20'', 20''' include equally formed first module housings 21. Therefore, a first mechanical connection structure 32, such as that provided at the substrate inlet 22 of module 20''', can be connected to a first mechanical reverse connection structure 33, such as that provided at the substrate outlet 23 of module 20''.

[0138] In the same or similar manner, for example, the second module 40 equipped with the second module housing 41 also includes a first sidewall 44, a second sidewall 46, a third sidewall 45, and a fourth sidewall 47. The third sidewall 45 is provided with a second substrate inlet 42. The fourth sidewall 47 is provided with a second substrate outlet 43. The second substrate inlet 42 is provided with a second mechanical connection structure 48, and the second substrate outlet 43 is provided with a second mechanical reverse connection structure 49. Again, here, the second mechanical connection structure 48 can be complementaryly formed with the second mechanical reverse connection structure 49. The second mechanical reverse connection structure 49 can also be complementaryly formed with the first mechanical connection structure 32 of the first module housing 21. Similarly, the second mechanical connection structure 48 can be complementaryly formed with and correspond to the first mechanical reverse connection structure 33 of the first module housing 21.

[0139] Several examples of the first module housing 21 shown in Figures 16 to 21 each include a first substrate inlet 22 and a first substrate outlet 23. In the examples of Figures 16 and 17, the substrate inlet 22 and the substrate outlet 23 are located on opposite sides of the first module housing 21. In the examples of Figures 18 to 21, the substrate inlet 22 and the substrate outlet 23 are located on or within sidewalls arranged adjacent to each other. Here, the first module housing 21 can be configured not only to receive or provide a housing for the substrate processing unit 60, but also to provide mounting space for the substrate transfer unit 50, particularly for the deflection roller 53, by which the orientation or direction of feeding or transferring the substrate 5 through the respective first module housing 21 can be modified accordingly.

[0140] In all the examples shown in Figures 16 to 21, the module housing 21 includes at least one through recess 25, 27 configured to receive a substrate processing unit 60, for example, one of the substrate processing units shown in any of Figures 5 to 11. Most (if not all) of the substrate processing units 60 shown in Figures 5 to 10 are provided with a cover 61, the size and shape of which are designed to close and / or seal the through recesses 25, 27 of the respective first module housing 21. The through recess 25 may be provided with a flange structure, thereby facilitating the removable and thus reconfigurable fastening and / or arrangement of the various substrate processing units 60 in or to the respective through recesses 25, 27.

[0141] The substrate processing unit 60, for example in the form of an evaporator 62, a magnetron 63, a plasma source 64, a heating unit 65, or a cooling unit 66, can be detachably and securely attached to the module housing 21 via the cover 61. In this regard, the cover 61 can provide support and / or fastening structures for detachably fastening the substrate processing unit 60 and / or for arranging the substrate processing unit inside the module housing 21.

[0142] Figures 22 through 27 illustrate several examples of a second module 40, which includes a second module housing 41, which, like the first module housing 21, is provided with a second substrate inlet 42 and a second substrate outlet 43. In the configurations shown in the examples of Figures 22 and 23, the substrate inlet 42 is opposite to the substrate outlet 43. In other configurations or examples shown in Figures 24 through 27, the sidewall of the second module housing 41 equipped with the substrate inlet 42 and the sidewall equipped with the substrate outlet 43 are arranged adjacent to each other and thus positioned close together.

[0143] In the examples of Figures 24 to 27, the corresponding second module 40 and therefore the second module housing 41 are typically equipped with a substrate transfer unit 50, for example, including a deflection roller 53, by which the substrate feed direction or substrate transfer direction can be modified inside the corresponding module housing 41.

[0144] Figures 12 through 15 illustrate numerous examples of transfer units 50 configured to be arranged within a first module housing 21 and / or a second module housing 41. The transfer unit 50 according to Figure 12 includes a plurality of transfer rollers 52 by which the substrate 5 can be transferred in or along a predefined transfer or feed direction.

[0145] Figure 13 shows a transfer unit 50 including at least one or more tension rollers 54. Here, a plurality of transfer rollers 52 are arranged in positions that are staggered or slightly offset relative to the surface normals of the substrate 5. In this way, longitudinal or transverse tension can be induced across the planar shape of the strip substrate 5.

[0146] Figure 14 shows an example of a transfer unit 50 including a deflection roller 53. The deflection roller 53 can be used to modify the transfer direction of the substrate 5 through the corresponding first module housing 21 or second module housing 41.

[0147] Figure 15 shows another example of a transfer unit 50 including a winder 55, which is implemented to unwind or wind the strip substrate 5 from or onto a coil, as shown, for example, with the final modules A and K of Figure 1.

[0148] In some instances, and for the sake of relatively easy and straightforward forward reconfiguration of the entire vacuum coating system 10, it is particularly intended that the size (e.g., effective distance) between the substrate inlets 22, 42 and substrate outlets 23, 43 of the individual modules 20, 40 follows a well-defined grid dimension or module dimension.

[0149] In the illustration of Figure 16, a first effective distance D1 is indicated between the first substrate inlet 22 and the first substrate outlet 23 of the first module 20. A corresponding second effective distance D2 between the second substrate inlet 42 and the second substrate outlet 43 is shown using the example of the second module housing 41 in Figure 22. For the general and fairly flexible reconfiguration of the vacuum coating system 10, it is intended that the second effective distance D2 is the same as or equal to the first effective distance D1. Alternatively, the first effective distance D1 is the same as or equal to an integer multiple n of the fraction f of the second effective distance D. Here, f is one of the following: 1 / 2, 1 / 3, 1 / 4, 1 / 5, 1 / 6, 1 / 7, or 1 / 8, and n is one of the following: 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, or 16.

[0150] In this way, and to obtain different configurations of the vacuum coating system 10 as shown in, for example, FIG. 1 (e.g., toward the configuration according to FIG. 2), it may only be necessary to interchange one or more of the modules equipped with one of the transfer unit and the substrate processing unit with one or more other modules equipped with another substrate transfer unit and another substrate processing unit. Alternatively, it is conceivable to maintain a structure of first and second module housings interconnected with each other and further optional module housings, and to replace at least one of the substrate processing unit and substrate transfer unit in the modules with another substrate processing unit or transfer unit.

[0151] In the example of Figure 16, the first effective distance D1 is substantially the same as the second effective distance D2 of the second module housing 41, as shown, for example, in Figure 22. However, in the example of Figure 3, the second effective distance D2 of the second module housing 41 can be three times larger than the first effective distance D1. In the example of Figure 4, the second effective distance D2 can be twice larger than the first effective distance D1.

[0152] Since the first effective distance D1 and the second effective distance D2 have the same or equal n / f, n modules or module housings with the second effective distance D2 can be replaced by f first module housings, each of which includes the first effective distance D1.

[0153] Figure 3 shows an example of a modular arrangement 13, for example, composed of three separate modular housings 21, 21', 21''. The modular arrangement 13 includes a row of substantially equal first modular housings 21, 21', 21''. The individual modular housings 21, 21', 21'' are implemented in a manner shown in Figure 16, but rotated approximately 90°. They include a first sidewall 24 and a second sidewall 26, each of which is provided with a through recess 25, 27 closed by a cover 61. As shown, a processing unit 60 is provided only in the lower through recess 25, which is located in the first sidewall 24. A plasma source 64 is provided in the first modular housing 21. An evaporator 62 is provided in the second modular housing 21'', and another plasma source 64 is provided in the third modular housing 21''.

[0154] In the example of Figure 3, the third sidewall 28 of the module housing 21 includes a substrate inlet 42. Positioned relative to the sidewall 29 is the third sidewall 28' directly connected to the next or subsequent and adjacent module housing 21'. The second module housing 21' includes a fourth sidewall 29' opposite the third sidewall 28', which is similarly connected to the third sidewall 28'' of the third module housing 21''. The second module housing 21'' includes a fourth sidewall 2'' opposite the third sidewall 28'', which is provided with a substrate outlet 43.

[0155] The arrangement of three separate first module housings 21, 21', 21'' forms or constitutes module arrangement 13, which may represent a second module 40, and the second module may constitute a second module housing 41.

[0156] The effective distance D2 between the substrate inlet 42 and the substrate outlet 43 can be, for example, three times the effective distance D1.

[0157] Figure 4 shows another example of a second module 40 with another second module housing 41. Here, module 40 may be equipped with substrate processing units 60, 60', 60'' as described above in conjunction with Figure 3, with slight similarities. However, in Figure 4, module housing 41 comprises an integral body having a first sidewall 24 and a second sidewall 26 positioned opposite each other. The first sidewall is provided with a plurality of through recesses 25, 25', and 25'', while the second sidewall has no recesses or openings. A third sidewall 45 extending between one end of the oppositely positioned sidewalls 24 and 26 is provided with a substrate inlet 42. A fourth sidewall 47, provided with a substrate outlet 43, is positioned opposite the third sidewall 45. Again, here, the substrate inlet 42 and the substrate outlet 43 are separated by a second effective distance D2, which is equal to a first effective distance D1, and wherein the first effective distance D1 is equal to one of an integer multiple n / f, where n and f are integers as described above.

[0158] Figures 30 to 32 illustrate three different operating configurations of the vacuum coating system. In the first operating configuration shown in Figure 30, the first module 20 is connected to the second module 40. Specifically, the first substrate outlet 23 is connected to the second substrate inlet 42. Optionally, and when a third module 80 is required, the second substrate outlet 43 of the second module 40 can be connected to the third substrate inlet 82 of the third module housing 81. As will be explained in more detail with reference to Figures 28 and 29, the substrate inlets 22, 42, 82 and the substrate outlets 23, 43, 83 are provided with corresponding or complementary mechanical connection structures 32, 48 and mechanical reverse connection structures 33, 49, which support and allow for the variable connection of individual modules 20, 40, 80.

[0159] Accordingly, in the second operating configuration shown in FIG31, the positions of the first module 20 and the second module 40 have been interchanged. The second substrate outlet 43 of the second module 40 or module housing 41 is connected to the first substrate inlet 22 of the first module housing 21. Optionally, and when the third module 80 should be present in the second operating configuration, the first substrate outlet 23 of the first module housing 21 is connected to the third substrate inlet 82 of the third module 80 or module housing 81.

[0160] Since the first substrate inlet 22 and the second substrate inlet 42, as well as the first substrate outlet 23 and the second substrate outlet 43 are provided with common mechanical connection structures 32, 48 and common mechanical reverse connection structures 33, 49, this reconfiguration is possible.

[0161] In the third operating configuration shown in Figure 32, the arrangement shown in Figure 30 includes three separate modules 20, 40, and 80. Here, and in the first configuration, module 80, having a third module housing 81, is connected to the second module 40. The second module 40 is positioned and arranged between the first module 20 and the third module 80. In order to transfer the vacuum coating system 10, and thus the arrangement of the separate modules, from the first operating configuration shown in Figure 30 to the third operating configuration shown in Figure 32, the interconnection between the first module 20, the second module 40, and the third module 80 is temporarily deactivated or released, and the second module 40 is removed.

[0162] To transfer the module arrangement to the third operating configuration shown in FIG32, the first substrate outlet 23 of the first module housing 21 is connected to the third substrate inlet 82 of the third module housing 81 of the third module 80. In the example currently shown, the third module 80 includes a third substrate outlet 83 in a sidewall adjacent to the sidewall where the third substrate inlet 82 is located. Here, the third module 80 may be equipped with a transfer unit 50 such as a deflection roller 53.

[0163] The variable interconnectivity of individual modules 20, 40, 80 and module housings 22, 41, 81 is provided by standardized mechanical connection structures and mechanical reverse connection structures, respectively.

[0164] Figure 28 illustrates an example of the interconnection between, for example, the first housing 20 and the second housing 40 according to the second operational configuration of Figure 31. The first module housing 21 is arranged below the second module housing 41. Accordingly, the first substrate inlet 22 is connected to the second substrate outlet 43. The first substrate inlet 22 is provided with a first mechanical connection structure 32. The second substrate outlet 43 is provided with a second mechanical reverse connection structure 49 at the second substrate outlet 43.

[0165] The first mechanical connection structure 32 and the second mechanical reverse connection structure 49 include radially extending flanges 34 that extend substantially perpendicular to the substrate transport direction. Specifically, the first mechanical connection structure 32 includes flange 34, and the second mechanical reverse connection structure 49 includes complementary reverse flanges 34', as shown in FIG29.

[0166] Flange 34 is provided with a planar sealing or flange surface 75. A complementary reverse flange 34' is provided with a sealing or flange surface 74. One of the sealing or flange surfaces 74, 75 is provided with a groove 70, in which a seal 72, such as an O-ring, is located. The groove 70 and the entire flange may include a closed structure in the circumferential direction. The seal 72 may slightly protrude from the corresponding sealing surface 74 and can withstand elastic deformation when the sealing surfaces 74, 75 are pressed together.

[0167] To connect flange 34 and reverse flange 34' to each other, flange 34 and reverse flange 34' are each provided with a port 35, 35', which are aligned longitudinally when the sealing or flange surfaces 74, 75, and thus the substrate inlet 22 and substrate outlet 43 are aligned. The channel formed by the aligned ports 35, 35' is sized to receive a fastening element 36, by which flange 34 and reverse flange 34' can be pressed together to provide a sealing engagement between connection structure 32 and reverse connection structure 49. In the currently shown example, fastening element 36 includes a longitudinally extending bolt 38 with a radially widened head at one longitudinal end, and the bolt is threadedly engaged with a nut 37 at the opposite longitudinal end. The head 39 and nut 37 are located on opposite, opposite sides of flange 34 and reverse flange 34'.

[0168] In some examples, flange 34 and reverse flange 34' extend outward from the sidewall or sidewall section of the respective module housing 21, 41. Here, fastening element 36 can be accessed from the outside of module 20, 40. In other examples, connection structures 32, 42 and reverse connection structures 33, 49 are located inside the respective module housing 21, 41.

[0169] In such examples, the fastening elements 36 may not be accessible from the outside of the respective module housings 21, 41. Here, they may be accessible only and exclusively from the inside of the respective modules 20, 40.

[0170] It should be noted that the currently shown examples of connection structures 32, 48 and reverse connection structures 33, 49 are by no means limited to interconnecting the first module housing 21, the second module housing 41, and the third module housing 81. Many different ways may exist to detachably interconnect the various module housings in the respective substrate inlet or substrate outlet regions.

[0171] The flowchart in Figure 33 illustrates a method for reconfiguring the vacuum coating system 10 as described herein. In step 100, at least a first module housing 21 and a second module housing 41 are provided. In step 102, at least one substrate transfer unit 50 and a substrate processing unit 60 are provided. In step 104, the substrate transfer unit 50 is interchangeably or detachably arranged in one of the first module housing 21 and the second module housing 41, and the substrate processing unit 60 is interchangeably or detachably arranged in the other of the first module housing 21 and the second module housing 41. Furthermore, the first module housing 21 and the second module housing 41 can be interconnected. By way of example, the first substrate outlet 23 of the first module housing 21 can be connected to the second substrate inlet 42 of the second module housing 41, thereby interconnecting the first module housing 21 and the second module housing 41.

[0172] In the subsequent step 106, and if it is necessary or desired to reconfigure the vacuum coating system 10, for example, the substrate processing unit 60 located in the second module housing 41 may be replaced by another substrate processing unit 60'.

[0173] Alternatively, the arrangement order of modules 20, 40 can be modified. The reconfiguration then performed as in step 106 includes a rearrangement of module housings 21, 41. Accordingly, the arrangement order of the first module housing 21 and the second module housing 41 can be swapped or interchanged, such that, for example, the first module housing 21 precedes the second module housing in the substrate transport direction. Then, contrary to the initial configuration obtained in step 104, the second substrate outlet 43 of the second module housing 41 can be connected to the first substrate inlet 22 of the first module housing 21.

[0174] Figure Labels

[0175] 5 substrates

[0176] 10 Vacuum Coating System

[0177] 11-module layout

[0178] 12-module layout

[0179] 13-module layout

[0180] 20 modules

[0181] 21 Module Housing

[0182] 22 substrate entrance

[0183] 23 substrate export

[0184] 24 sidewalls

[0185] 25 through the concave part

[0186] 26 sidewalls

[0187] 27 Through the concave part

[0188] 28 sidewalls

[0189] 29 sidewalls

[0190] 32 connection structure

[0191] 33 Reverse Connection Structure

[0192] 34 flanges

[0193] 35 ports

[0194] 36 fastening components

[0195] 37 nuts

[0196] 38 bolts

[0197] 39 heads

[0198] 40 modules

[0199] 41 Module Housing

[0200] 42 substrate entrance

[0201] 43 substrate outlet

[0202] 44 sidewalls

[0203] 45 sidewalls

[0204] 46 sidewalls

[0205] 47 sidewalls

[0206] 48 connection structure

[0207] 49 Reverse Connection Structure

[0208] 50 transfer units

[0209] 51 Enclosure

[0210] 52 transfer rollers

[0211] 53 deflection roller

[0212] 54 tension rollers

[0213] 55 winding machine

[0214] 60 processing units

[0215] 61 covers

[0216] 62 Evaporator

[0217] 63 magnetron

[0218] 64 plasma sources

[0219] 65 heating units

[0220] 66 cooling units

[0221] 67 rolls

[0222] 68 nozzles

[0223] 70 grooves

[0224] 72 seals

[0225] 74 Sealing Surface

[0226] 75 sealing surface

[0227] 80 modules

[0228] 81 Module Housing

[0229] 82 substrate entrance

[0230] 83 substrate export

Claims

1. A vacuum coating system (10) for coating a strip substrate (5), the vacuum coating system (10) comprising: - A first module (20), the first module including a first module housing (21), the first module housing (21) including at least one of a first substrate inlet (22) and a first substrate outlet (23), The second module (40) includes a second module housing (41), which includes at least one of a second substrate inlet (42) and a second substrate outlet (43). - A substrate transfer unit (50), wherein the substrate transfer unit is disposed in one of the first module housing (21) and the second module housing (41), and - A substrate processing unit (60), which is disposed in another of the first module housing (21) and the second module housing (41). -In this configuration, at least one of the substrate transfer unit (50) and the substrate processing unit (60) is interchangeably arranged in one of the first module housing (21) and the second module housing (41), or - wherein the first module (20) and the second module (40) are interchangeably connected via at least one of the first substrate inlet and the second substrate inlet (22, 42) and at least one of the first substrate outlet and the second substrate outlet (23, 43).

2. The vacuum coating system (10) according to claim 1, wherein, The vacuum coating system (10) is transferable between a first operating configuration and at least one of a second and a third operating configuration. -In the first operating configuration, the first substrate outlet (23) is directly or indirectly connected to the second substrate inlet (42). -In the second operating configuration, the second substrate outlet (43) is directly or indirectly connected to the first substrate inlet (22), and -In the third operating configuration, the first substrate outlet (23) is directly connected to the third substrate inlet (82) of the third substrate housing (81) of the third module (80), and in the first operating configuration, the third substrate inlet (82) is directly or indirectly connected to the second substrate outlet (43).

3. The vacuum coating system (10) according to claim 1 or 2, wherein, The first module housing (21) includes a first substrate inlet (22) and a first substrate outlet (23), wherein a first effective distance (D1) between the first substrate inlet (22) and the first substrate outlet (23) is the same as or equal to one of the following: - The second effective distance (D2) between the second substrate inlet (42) and the second substrate outlet (43) of the second module housing (41). - and an integer multiple n of the fraction f of the second effective distance (D2), where f is one of the following: 1 / 2, 1 / 3, 1 / 4, 1 / 5, 1 / 6, 1 / 7 or 1 / 8, and where n is one of the following: 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 or 16.

4. The vacuum coating system (10) according to any one of the preceding claims, wherein, At least one of the first module housing (21) and the second module housing (41) includes a first sidewall (24) having a first through recess (25) extending through the first sidewall (24) and configured to receive a first substrate processing unit (60) passing therethrough.

5. The vacuum coating system (10) according to any one of the preceding claims, wherein, At least one of the first module housing (21) and the second module housing (41) includes a second sidewall (26) having a second through recess (27) extending through the second sidewall (26) and configured to receive a second substrate processing unit (60') passing therethrough.

6. The vacuum coating system (10) according to claims 4 and 5, wherein, One of the first module housing (21) and the second module housing (41) includes a first sidewall (24) having a first through recess (25) and a second sidewall (26) having a second through recess (27), wherein the first sidewall (24) is opposite to the second sidewall (26) and / or wherein the first through recess (25) is opposite to the second through recess (27).

7. The vacuum coating system (10) according to any one of claims 4 to 6, wherein, The substrate processing unit (60) includes a cover (61) configured to close and / or seal at least one of the first through recess (25) and the second through recess (27).

8. The vacuum coating system (10) according to any one of the preceding claims, wherein, The substrate processing unit (60) includes one of the following: an evaporator (62), a magnetron (63), a plasma source (64), a heating unit (65), and a cooling unit (66).

9. The vacuum coating system (10) according to any one of the preceding claims, wherein, One of the first module (20) and the second module (40) is interchangeably provided with a first substrate processing unit (60), wherein the first substrate processing unit (60) can be replaced by a second substrate processing unit (60').

10. The vacuum coating system (10) according to any one of the preceding claims, wherein, The substrate transfer unit (50) includes one of the following: transfer roller (52), deflection roller (53), tension roller (54), and winder (55).

11. The vacuum coating system (10) according to any one of the preceding claims, wherein, At least one of the first module housing (21) and the second module housing (41) includes a third sidewall (28, 45) and a fourth sidewall (29, 47), wherein the third sidewall (28, 45) is provided with one of the first substrate inlet (22) and the second substrate inlet (42), and wherein the fourth sidewall (29, 47) is provided with one of the first substrate outlet (23) and the second substrate outlet (43).

12. The vacuum coating system (10) according to claim 11, wherein, The third sidewall (28, 45) is opposite to the fourth sidewall (29, 47), and / or wherein the first substrate inlet (22) is opposite to the first substrate outlet (23), and / or wherein the second substrate inlet (42) is opposite to the second substrate outlet (43).

13. The vacuum coating system (10) according to claim 11, wherein, The third sidewall (28, 45) is adjacent to or adjacent to the fourth sidewall (29, 47), and wherein at least one of the first substrate inlet (22) and the second substrate inlet (42) extends at a predefined angle relative to the first substrate outlet (23) and the second substrate outlet (43) of the same module housing (21, 41).

14. The vacuum coating system (10) according to any one of the preceding claims, wherein, The first module housing (21) includes a first mechanical connection structure (32) at the first substrate inlet (22) and a first mechanical reverse connection structure (33) at the first substrate outlet (23), and wherein the second module housing (41) includes a second mechanical connection structure (48) at the second substrate inlet (42) and a second mechanical reverse connection structure (49) at the second substrate outlet (43), and wherein the first mechanical connection structure (32) is complementary to at least one of the first mechanical reverse connection structure (33), the second mechanical connection structure (48) and the second mechanical reverse connection structure (49).

15. A method for configuring a vacuum coating system (10) according to any one of the preceding claims, the method comprising the steps of: - Provide the first module housing (21) and the second module housing (41). - Provides a substrate transfer unit (50) and a substrate processing unit (70), and includes at least one of the following steps: i) The substrate transfer unit (50) is interchangeably arranged in one of the first module housing (21) and the second module housing (41), and the substrate processing unit (60) is interchangeably arranged in the other of the first module housing (21) and the second module housing (41), or ii) The first module (20) and the second module (40) are interchangeably connected via at least one of the first substrate inlet and the second substrate inlet (22, 42) and at least one of the first substrate outlet and the second substrate outlet (23, 43).

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