Electrical wire coating system with wide glue solution viscosity range and coating method thereof

Abstract

The invention discloses an electrical wire coating system with a wide glue solution viscosity range and a coating method thereof, and relates to the technical field of microsystems. A glue injection system; a glue injection system and a glue injection control module; and the scribbling motion system comprises a scribbling motion control module, an injection head motion displacement mechanism and a component motion displacement mechanism. According to the invention, the working modes are flexibly switched through the positive and inverted switching mechanism, the device adapts to the range from low viscosity to high viscosity, the positive mode assists conveying and coating of high-viscosity glue liquid by using pressure, and the inverted mode avoids dripping and line broadening of the low-viscosity glue liquid due to gravity; the defect that low-viscosity glue solution is infiltrated and widened due to the influence of gravity in a traditional forward mode is effectively overcome, meanwhile, the forward and reverse dual-system switching scheme can meet the requirements of different application scenes, and the problems that a traditional dual-independent system is long in switching time, single in application environment, repeated in system positioning and the like are solved.

Description

Technical Field

[0001] This invention relates to the fields of microsystems, flexible electronics, microelectronics, and sensors, and particularly to the coating of micron-level leads, specifically to an electrical wire coating system and method with a wide range of adhesive viscosity. Background Technology

[0002] Micro-nano electromechanical systems (MEMS / NEMS) are integrated systems composed of nano- and micro-scale components. They often include multiple functions such as sensors, actuators, signal processing, and communication. Their applications are very wide, including many fields such as medical, environmental protection, transportation, and military. Usually, after the key structures of the components are fabricated through semiconductor processing technology, they need to be powered on for testing.

[0003] Before power-on testing, multiple probe electrodes are typically placed on the edge of the chip of the component for contact with the probes of the probe station. The key structures of the component are connected by conductive leads formed through semiconductor processes or bonding. The formation of these conductive leads generally adopts the following methods: One method requires large-scale semiconductor process fabrication (involving mask fabrication, photolithography, evaporation coating, stripping, etc.), which is costly, lengthy, and has a high failure risk; the second method is to fabricate a hard mask as a patterned mask for evaporation coating, which requires pre-design and fabrication of the hard mask, which is lengthy, time-consuming, and cannot be adjusted in time as the device and process change, requiring re-fabrication; the third method is to manually apply silver paste and conductive adhesive for connection, which results in poor electrical connection quality, uncontrollable quality, and high implementation difficulty.

[0004] Each of the above methods has its own problems. Therefore, finding a fast, online detection, and low-cost electrical coating system and method is an indispensable key technology in the development of microsystem applications. To this end, an electrical wire coating system and method with a wide adhesive viscosity range are proposed. Summary of the Invention

[0005] The purpose of this invention is to provide an electrical wire coating system and method with a wide range of adhesive viscosity to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0007] In a first aspect, an electrical wire coating system with a wide range of adhesive viscosity includes: an external support frame that provides stable physical support for the entire coating system;

[0008] A dispensing system is used to control the delivery and extrusion of adhesive liquid to extrude conductive raw materials for components to be processed. It includes an adhesive liquid dispensing system and a dispensing control module. The viscosity range of the adhesive liquid is from low viscosity to high viscosity.

[0009] The writing motion system is used to control the relative movement between the components to be processed and the adhesive injection system, including a writing motion control module, an injection head motion displacement mechanism, and a component motion displacement mechanism;

[0010] The forward / inverted switching mechanism is used to switch the coating system between two working modes: forward and inverted. The forward mode is suitable for high-viscosity adhesives, using pressure to assist in adhesive delivery and coating, while the inverted mode is suitable for low-viscosity adhesives, avoiding adhesive dripping and line widening caused by gravity.

[0011] An optical system is used for coating positioning, observing the coating of the adhesive, and monitoring the coating progress of the conductive leads in real time.

[0012] The central control system is used to control the optical imaging module, the glue dispensing control module, and the coating motion control module to perform data transmission and interaction, thereby realizing the automation and collaborative operation of the entire coating system.

[0013] The inverted switching mechanism is located inside the external support frame, and the glue injection system and the writing motion system are installed inside the inverted switching mechanism. The glue injection system and the writing motion system switch between inverted and upright positions through the inverted switching mechanism.

[0014] A further improvement of the technical solution of the present invention is that: the inverted conversion mechanism includes an embedded slide rail support platform, the bottom of which is fixed to the bottom surface of the inner cavity of the outer support frame, and the embedded slide rail support platform is symmetrically arranged about the axis of the outer support frame. A slide rail drive motor is fixedly installed on the inner surface of the embedded slide rail support platform, and a support plate is rotatably installed on the inner side of the embedded slide rail support platform. The surface of the support plate has multiple threaded holes, and annular wheels are fixedly installed at both ends of the support plate. Annular grooves are formed on the inner edge surface of the embedded slide rail support platform, forming an inward annular track. The outer edge surfaces of the annular wheels at both ends of the support plate slide and adapt to the inner wall of the annular groove. The annular wheels at both ends of the support plate are embedded in the annular track to achieve 360-degree rotation, and are driven by the annular track drive motor, which is a digitally controlled motor.

[0015] A further improvement of the technical solution of the present invention is that: the adhesive injection system is used to deliver and extrude adhesive according to set parameters;

[0016] The glue injection control module is used to control the glue injection system to spray out the glue to form conductive leads, and the glue injection system is installed on top of the injection head movement displacement mechanism.

[0017] A further improvement of the technical solution of the present invention is that: the adhesive injection system includes a pusher motor, a fixed frame, an injection pump, an injection pipe, and an injection head. The injection pump and the pusher motor form an injector. The injection pump includes a pump outlet, an inner cavity, and a piston that reciprocates within the inner cavity. The pump outlet communicates with the inner cavity. The pump outlet is connected to the injection head via a connecting pipe. The adhesive is placed in the adhesive space formed by the cavity and one end of the piston. The other end of the piston is fixedly connected to the pusher motor. A moving block is fixedly installed on the pusher motor, and the bottom of the fixed frame is connected to the moving block of the pusher motor. The output end of the pusher motor is connected to the input end of the injection pump. An injection pipe is fixedly installed at the output end of the injection pump, and an injection head is installed at the output end of the injection pipe.

[0018] A further improvement of the technical solution of the present invention is that: the writing motion control module is used to control the injection head motion displacement mechanism and / or the component motion displacement mechanism to perform compound motion;

[0019] The injection head motion displacement mechanism is used to control the composite motion of the adhesive injection system, and the component motion displacement mechanism is used to control the composite motion of the components to be processed.

[0020] The composite motion includes motion along at least two coordinate axes.

[0021] A further improvement of the technical solution of the present invention is that: the injection head motion displacement mechanism includes an injection head clamp, an injection head worktable, and an injection head motor that drives the injection head worktable to perform compound motion. The injection pump is fixed on the injection head worktable by the injection head clamp. The injection head worktable is a three-axis motion platform, namely an XYZ displacement platform. The bottom of the injection head worktable is fixed to the support plate by screws. The injection head clamp is installed on the top of the injection head worktable. The injection head motor is installed on the side of the injection head worktable near the embedded slide rail support table.

[0022] The component motion displacement mechanism includes a component fixture, a component worktable, and a component motor. The component motor is a digitally controlled motor used to drive the component worktable to perform compound motion. The component to be processed is fixed on the component worktable by the component fixture. The component worktable is an XY displacement stage, which is composed of two digitally controlled motors. The digitally controlled motors are fixed to the support plate by screws.

[0023] A further improvement of the technical solution of the present invention is that: the optical system includes an electron microscope and / or other optical path lenses, a fixed bracket and an optical support rod are installed on the outside of the optical system, and the optical system is fixed to the support plate by the fixed bracket and the optical support rod, and the angle can be freely adjusted;

[0024] The objective lens of the electron microscope is mounted above and directly facing the nozzle of the injection head to monitor the coating progress and / or quality of the conductive leads of the component to be processed in real time. The other optical path lenses are obliquely incident, and the optical path can be used to introduce light of a specific wavelength for photoaccelerated curing or optical micromachining. The lenses are used for focusing.

[0025] Secondly, a method for coating electrical wires with a wide range of adhesive viscosity, based on the aforementioned coating system for electrical wires with a wide range of adhesive viscosity, includes the following steps:

[0026] Step 1: Draw the lead structure of the conductive lead of the component to be processed using vector image editing software. Before painting, import the pre-designed conductive lead pattern and the type of adhesive for the corresponding section through the central control system, i.e., low viscosity or high viscosity, and automatically identify the required upright or inverted working mode for each section.

[0027] Step 2: Convert the drawn lead wire structure into painting motion path information, generate the corresponding painting path and switching instructions, and integrate the painting parameters including glue dispensing speed and motion speed with the mode switching points into a unified execution sequence;

[0028] Step 3: Determine the coating parameters based on the linewidth of the component to be processed. The coating parameters include adhesive parameters and coating motion parameters. The adhesive parameters include adhesive concentration and dispensing speed, and the coating motion parameters are coating speed.

[0029] Step 4: Prepare the adhesive solution according to the required concentration or select the required adhesive solution, and select the upright or inverted writing mode according to the concentration of the adhesive solution. Use upright high pressure writing for high viscosity adhesive solution and inverted low pressure writing for low concentration adhesive solution.

[0030] Step 5: Convert the writing motion parameters and writing mode into parameter commands and transmit them to the writing motion system; convert the glue dispensing speed into parameter commands and transmit them to the glue dispensing system.

[0031] Step 6: Begin coating. Perform adhesive injection and compounding movements according to the coating parameters to coat the conductive leads of the components to be processed until coating is complete. During the coating process, the coating system moves and injects adhesive according to a preset program. When the need to switch adhesive types is detected, the central control system commands the inverted switching mechanism to start, driving the support plate and the adhesive injection and motion system to rotate 180° to automatically switch between upright and inverted modes. The entire switching process is completed at preset pause points in the coating path. During the coating and switching process, the optical system continuously monitors the adhesive coating status and lead forming quality. If coating abnormalities or coating parameter mismatches are detected, the system will pause in real time and prompt manual intervention, or automatically adjust the coating parameters and switching strategy according to preset rules.

[0032] Step 7: Use a microscopic imaging system to monitor the writing progress of the conductive leads in real time, and automatically analyze the writing quality. Combined with the preset quality threshold, determine the status of the writing quality to provide warning / status prompts, and then select manual intervention to interrupt and / or adjust the writing parameters.

[0033] A further improvement of the technical solution of the present invention is that: a step 0 is added before step 1. Step 0 is to perform parameter calibration. For each specific electrical wire coating system, under the condition that the inner diameter of the injection head is not determined, the linear relationship between the adhesive concentration and coating parameters and the width of the component to be processed is optimized and determined by experimental methods and least squares method.

[0034] Due to the adoption of the above technical solution, the technical progress achieved by this invention compared to the prior art is as follows:

[0035] 1. This invention provides an electrical wire coating system and method with a wide range of adhesive viscosity. Through a forward and reverse switching mechanism, the working mode can be flexibly switched to adapt to a wide range of adhesives from low viscosity to high viscosity. In the forward mode, the adhesive pushing motor is used to squeeze and form a relatively high pressure at the dispensing nozzle to squeeze out the high viscosity adhesive, ensuring the delivery and coating of the high viscosity adhesive. In the reverse mode, the dripping of low viscosity adhesive due to gravity and the widening of lines are avoided, which significantly improves the applicability of the coating system, improves the accuracy of the coated lines, and meets the needs of different application scenarios.

[0036] 2. This invention provides an electrical wire coating system and method with a wide range of adhesive viscosity. The optical system monitors the coating process in real time, enabling precise observation of the coating progress and quality of the conductive leads. Combined with the automated adjustment of the central control system, the system can promptly detect and correct coating defects, ensuring the uniformity and accuracy of the coating lines, thereby significantly improving the product yield and performance.

[0037] 3. This invention provides an electrical wire coating system and method with a wide range of adhesive viscosity. By combining high-pressure injection and forward / inverted switching of the adhesive injection system, the coating system can dynamically adapt to a wider range of adhesive viscosity and component structural requirements. By adjusting the pressure and geometric conditions, it can achieve rapid response to different coating environments. By combining high-pressure injection and forward / inverted switching, the coating system can optimize the coating process in multiple dimensions, including viscosity adaptability, geometric adaptability, and motion adaptability.

[0038] 4. This invention provides an electrical wire coating system and method with a wide range of adhesive viscosity. The overall coating time for a single electrode lead is short, completed within tens of seconds. The coating process can be directly observed through an electron microscope, enabling automatic system judgment and / or human intervention and control. Manual lead coating can be completed through a real-time controlled electromechanical system. The software can realize graphical design of the leads, enabling automatic completion of lead coating according to the graphical design, and preset coating parameters, such as speed, line width, and coating path. Through electromechanical automation control and silver paste coating, this invention replaces the requirements of traditional semiconductor processing technology for large equipment and cumbersome process steps in specific environments (small-scale samples, single samples, appropriate wire widths), while comprehensively reducing costs in terms of time, personnel configuration, and technical requirements. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0040] Figure 1 This is a schematic diagram of the upright appearance of the present invention;

[0041] Figure 2 This is a partial structural schematic diagram of the present invention;

[0042] Figure 3 This is a schematic diagram of the upright appearance of the present invention;

[0043] Figure 4 This is a schematic diagram of the forward / inverted conversion mechanism of the present invention;

[0044] Figure 5 This is a schematic diagram of the support plate of the present invention;

[0045] Figure 6 This is a three-dimensional structural diagram of the adhesive injection system of the present invention;

[0046] Figure 7 This is a three-dimensional structural schematic diagram of the injection head motion displacement mechanism of the present invention;

[0047] Figure 8 This is a three-dimensional structural schematic diagram of the motion displacement mechanism of the components of the present invention;

[0048] Figure 9 This is a three-dimensional structural diagram of the optical system of the present invention;

[0049] Figure 10 This is a graph showing the relationship between the moving speed of the prototype displacement stage and the adhesive coating line width, as determined in the laboratory of this invention.

[0050] Figure 11 This is a graph showing the relationship between the injection speed and the line width of the prototype as determined in the laboratory of this invention.

[0051] Figure 12 This is a schematic diagram of the writing line of the prototype of this invention at a dispensing speed of 0.05P and a movement speed of -16P, as measured in the laboratory.

[0052] Figure 13 This is a schematic diagram of the writing line of the prototype measured in the laboratory of this invention at a dispensing speed of 0.02P and a movement speed of -16P.

[0053] In the diagram: 1. External support frame; 2. Inverted conversion mechanism; 21. Embedded slide rail support table; 22. Slide rail drive motor; 23. Support plate; 24. Annular groove; 3. Injection head motion displacement mechanism; 31. Injection head clamp; 32. Injection head worktable; 33. Injection head motor; 4. Adhesive injection system; 41. Adhesive push motor; 42. Fixture; 43. Injection pump; 44. Injection pipeline; 45. Injection head; 5. Component motion displacement mechanism; 51. Component clamp; 52. Component worktable; 53. Component motor; 6. Optical system. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0055] Example 1, such as Figures 1 to 13 As shown, the present invention provides an electrical wire coating system with a wide range of adhesive viscosity, including: an external support frame 1, which provides stable physical support for the entire coating system, ensuring that each component maintains a precise relative position and stability during operation, ensuring the accuracy and reliability of the coating process, and avoiding a decrease in coating quality due to equipment shaking or instability.

[0056] The dispensing system controls the delivery and extrusion of adhesive liquid to extrude conductive raw materials for the components to be processed. It includes an adhesive dispensing system 4 and a dispensing control module. The viscosity range of the adhesive liquid is from low to high. The dispensing system delivers and extrudes the adhesive liquid according to set parameters. The dispensing control module controls the dispensing system 4 to spray the adhesive liquid to form conductive leads. The dispensing system 4 is mounted on top of the injection head movement displacement mechanism 3. The dispensing system 4 includes a dispensing motor 41, a fixing frame 42, an injection pump 43, an injection pipe 44, and an injection head 45. The injection pump 43 and the dispensing motor 41 form a... The syringe and the injection pump 43 include a pump outlet, an inner cavity, and a piston that reciprocates in the inner cavity. The pump outlet is connected to the inner cavity and is connected to the injection head 45 through a connecting tube. The glue is placed in the glue space formed by the cavity and one end of the piston. The other end of the piston is fixedly connected to the glue pushing motor 41. A moving block is fixedly installed on the glue pushing motor 41, and the bottom of the fixing frame 42 is connected to the moving block of the glue pushing motor 41. The output end of the glue pushing motor 41 is connected to the input end of the injection pump 43. An injection tube 44 is fixedly installed at the output end of the injection pump 43, and an injection head 45 is installed at the output end of the injection tube 44.

[0057] The writing motion system controls the relative motion between the component to be processed and the adhesive injection system 4. It includes a writing motion control module, an injection head motion displacement mechanism 3, and a component motion displacement mechanism 5. The writing motion control module controls the injection head motion displacement mechanism 3 and / or the component motion displacement mechanism 5 to perform compound motion. The injection head motion displacement mechanism 3 controls the compound motion of the adhesive injection system 4, and the component motion displacement mechanism 5 controls the compound motion of the component to be processed. The compound motion includes at least two coordinate axes. The injection head motion displacement mechanism 3 includes an injection head clamp 31, an injection head worktable 32, and an injection head motor 33 that drives the injection head worktable 32 to perform compound motion. The injection pump 43 is fixed to the injection head worktable 32 via the injection head clamp 31. The injection head worktable 32 is a three-axis motion platform. The injection head worktable 32 is an XYZ displacement stage. The bottom of the injection head worktable 32 is fixed to the support plate 23 by screws. The injection head clamp 31 is installed on the top of the injection head worktable 32. The injection head motor 33 is installed on the side of the injection head worktable 32 near the embedded slide rail bracket 21. The component motion displacement mechanism 5 includes a component clamp 51, a component worktable 52 and a component motor 53. The component motor 53 is a digitally controlled motor, which is used to drive the component worktable 52 to perform compound motion. The component to be processed is fixed on the component worktable 52 by the component clamp 51. The component worktable 52 is an XY displacement stage, which is composed of two digitally controlled motors. The digitally controlled motors are fixed to the support plate 23 by screws. The painting motion control module controls the component motor 53 and / or the injection head motor 33 to perform compound motion.

[0058] The inverting conversion mechanism 2 is used to switch the coating system between two working modes: upright and inverted. The upright mode is suitable for high-viscosity adhesives, using pressure to assist in adhesive delivery and coating. The inverted mode is suitable for low-viscosity adhesives, avoiding adhesive dripping and line widening caused by gravity. By flexibly switching working modes, it adapts to adhesives of different viscosities, improving the applicability and flexibility of coating and ensuring high-quality coating results under different conditions. The inverting conversion mechanism 2 includes an embedded slide rail support platform 21. The bottom of the embedded slide rail support platform 21 is fixed to the bottom surface of the inner cavity of the outer support frame 1, and the embedded slide rail support platform 21 is symmetrically arranged about the axis of the outer support frame 1. A [missing information - likely a device or component] is fixedly installed on the inner surface of the embedded slide rail support platform 21. The slide rail drive motor 22 and the embedded slide rail support platform 21 have a support plate 23 rotatably mounted on their inner side. The support plate 23 has multiple threaded holes pre-drilled on its surface, and annular wheels are fixedly mounted at both ends. Annular grooves 24 are formed on the inner edge surface of the embedded slide rail support platform 21, creating an inward-facing annular track. The outer edges of the annular wheels at both ends of the support plate 23 slide and adapt to the inner wall of the annular groove 24. The annular wheels at both ends of the support plate 23 are embedded in the annular track, allowing for 360-degree rotation. The slide rail drive motor 22 is a digitally controlled motor. The embedded slide rail support platform 21 is the basic structure of the entire forward / inverted conversion mechanism, supporting the glue dispensing system and the writing motion system, and ensuring smooth operation during the switching process. Maintaining a stable positional relationship and providing a circular track, the support plate 23 can rotate smoothly, thereby achieving the switching between upright and inverted positions. The embedded structure allows the slide rail support platform 21 to be tightly integrated with the external support frame 1, reducing space occupation and improving the compactness and stability of the overall structure. The slide rail drive motor 22 is the power source for the upright-inverted conversion mechanism, used to drive the support plate 23 to move along the circular track, thereby achieving the switching between upright and inverted positions. Through the precise control of the slide rail drive motor 22, a fast and accurate switching action is achieved, ensuring the reliability and repeatability of the switching process. It can quickly complete the switching between upright and inverted positions, improving the production efficiency of the coating system. In conjunction with the central control system, it realizes automated upright-inverted switching. Among them, the support... Plate 23 is used to fix the dispensing system and the coating motion system, ensuring stability during switching. The annular groove 24 limits the movement range of the support plate 23, ensuring accurate movement of the support plate on the slide rail. During switching, the annular groove 24 provides additional support, reducing the swaying of the support plate 23 and improving the stability of the switching process. The upright mode is mainly used for handling high-viscosity adhesives. In upright mode, the coating system is in a normal vertical direction, with the adhesive container above and the injection head 45 below. The high-torque operation mode of the push-dispensing motor creates a relatively high pressure at the dispensing nozzle, extruding the high-viscosity adhesive. The high-viscosity adhesive can be more smoothly extruded from the container and sprayed out through the injection head 45. The pressure value of the relatively high pressure is controlled.It can adapt well to high-viscosity adhesives of varying viscosities and / or particle sizes. Gravity also assists in the adsorption of the adhesive on the substrate, improving coating adhesion and uniformity, especially in applications requiring thicker coatings or high-precision coating. During the delivery of high-viscosity adhesives, the upright mode reduces air bubbles generated by adhesive flow, thereby improving coating quality. The inverted mode is mainly used for handling low-viscosity adhesives. In this mode, the coating system is rotated 180 degrees, with the adhesive container below and the injection head 45° above. Due to their high fluidity, low-viscosity adhesives are prone to dripping under gravity in the upright mode. This can lead to uneven coating lines or substrate contamination. The inverted mode effectively avoids this phenomenon, ensuring that the adhesive is sprayed only under the precise control of the injection head 45. In the upright mode, low-viscosity adhesive tends to flow continuously outward along the injection head 45 due to gravity, resulting in wider coating lines and affecting coating accuracy. The inverted mode eliminates this gravitational effect, enabling finer and more uniform coating lines. In the inverted mode, the extrusion of the adhesive relies entirely on the precise control of the dispensing system and the surface tension between the adhesive and the sample being coated, rather than gravity, thus achieving higher coating accuracy and repeatability.

[0059] Optical system 6 is used to observe the coating of adhesive and monitor the coating progress of conductive leads in real time. Optical system 6 includes an electron microscope and / or other optical path lenses, necessary components for microscopic imaging optical path such as beam splitting elements, optical lenses, illumination elements, and multi-beam introduction interfaces. The external mounting bracket and optical support rod of optical system 6 are fixed to support plate 23 through the mounting bracket and optical support rod, and the angle can be freely adjusted. The eyepiece of electron microscope is mounted above the nozzle of injection head 45 and directly facing the nozzle of injection head 45 to monitor the coating progress and / or quality of conductive leads of the component to be processed in real time. Other optical path lenses are obliquely incident, and the optical path can be used to introduce light of specific wavelengths for photoaccelerated curing or optical micromachining. The lenses are used for focusing.

[0060] The central control system is used to control the optical imaging module, the glue dispensing control module, and the coating motion control module for data transmission and interaction, realizing the automation and collaborative work of the entire coating system. Through the unified scheduling of the central control system, the overall efficiency and accuracy of the coating system are improved, the coordination error between components is reduced, and high-quality conductive lead coating is achieved.

[0061] The forward / inverted conversion mechanism 2 is located inside the external support frame 1. The glue injection system and the writing motion system are installed inside the forward / inverted conversion mechanism 2, and the glue injection system and the writing motion system switch between forward and inverted positions through the forward / inverted conversion mechanism 2.

[0062] In this embodiment, the combined action of the injection motion and the composite motion forms the conductive leads of the component.

[0063] In this embodiment, the connecting pipe is made of a flexible material resistant to organic solvents.

[0064] In this embodiment, the number of component motors 53 is increased from 2 to 3, each driving the component worktable 52 to move along the X, Y, and Z axes. The movement of the X and Y axes achieves composite motion, and the movement of the Z axis adjusts the gap between the component to be processed and the injection head 45 in the Z axis direction. Alternatively, the number of injection head motors 33 can be increased from 2 to 3, each driving the injection head worktable 32 to move along the X, Y, and Z axes. The movement of the X and Y axes achieves composite motion, and the movement of the Z axis adjusts the distance between the component to be processed and the injection head 45 in the Z axis direction, thereby achieving automated operation and reducing debugging time.

[0065] Example 2, as Figures 1 to 13 As shown, based on Example 1, the present invention also provides a method for coating electrical wires with a wide range of adhesive viscosity, implemented based on the electrical wire coating system with a wide range of adhesive viscosity according to any one of claims 1-7, comprising the following steps:

[0066] Step 0: Perform parameter calibration. For each specific electrical wire coating system, under the condition that the inner diameter of the injection head is 45, optimize and determine the linear relationship between the adhesive concentration and coating parameters and the width of the component to be processed through experimental methods and least squares method.

[0067] Step 1: Draw the lead structure of the conductive lead of the component to be processed using vector image editing software. Before painting, import the pre-designed conductive lead pattern and the type of adhesive for the corresponding section through the central control system, i.e., low viscosity or high viscosity, and automatically identify the required upright or inverted working mode for each section.

[0068] Step 2: Convert the drawn lead wire structure into painting motion path information, generate the corresponding painting path and switching instructions, and integrate the painting parameters including glue dispensing speed and motion speed with the mode switching points into a unified execution sequence to ensure that glue switching and attitude conversion are carried out synchronously during the painting process;

[0069] Step 3: Determine the coating parameters based on the linewidth of the component to be processed. The coating parameters include adhesive parameters and coating motion parameters. The adhesive parameters include adhesive concentration and dispensing speed, and the coating motion parameter is the coating speed.

[0070] Step 4: Prepare the adhesive solution according to the required concentration or select the required adhesive solution, and select the upright or inverted writing mode according to the concentration of the adhesive solution. Use upright high pressure writing for high viscosity adhesive solution and inverted low pressure writing for low concentration adhesive solution.

[0071] Step 5: Convert the writing motion parameters and writing mode into parameter commands and transmit them to the writing motion system; convert the dispensing speed into parameter commands and transmit them to the dispensing system.

[0072] Step 6: Begin coating. Following the coating parameters, perform injection and composite movements to coat the conductive leads of the components to be processed until coating is complete. During the coating process, the coating system moves and injects adhesive according to a preset program. When a switch in adhesive type is detected, the central control system instructs the inverted switching mechanism 2 to start, driving the support plate 23 to rotate 180° along with the injection and motion system, automatically switching between inverted and upright modes. The entire switching process is completed at preset pause points in the coating path, ensuring no loss of positional accuracy and achieving seamless connection between coating processes of different viscosity adhesives. During coating and switching, the optical system 6 continuously monitors the adhesive coating status and lead forming quality. If coating abnormalities or mismatched coating parameters are detected, it pauses in real time and prompts for manual intervention, or automatically adjusts the coating parameters and switching strategy according to preset rules, ensuring that the coating process of wide-viscosity adhesives on the same substrate combines flexibility, consistency, and high precision.

[0073] Step 7: Use a microscopic imaging system to monitor the writing progress of the conductive leads in real time, and automatically analyze the writing quality. Combined with the preset quality threshold, determine the status of the writing quality to provide warning / status prompts, and then select manual intervention to interrupt and / or adjust the writing parameters.

[0074] In this embodiment, the formula for calculating the line width X of the component to be processed and the glue dispensing speed V is: V=a1+b1X, where a1=170, b1=6393, and X ranges from 0.01P to 0.09P, where P=0.15625μm / s.

[0075] In this embodiment, in step 4, the relationship between the linewidth X of the component and the writing speed S is: S = a² + b²X, where a² = 729, b² = -8.5, and X ranges from 10P to 50P (P = 0.15625 μm / s). It is affected by the concentration of the adhesive. In addition, the parameters are different depending on whether the device is upright or inverted, or under high pressure or normal pressure. Consider them separately. For upright and normal pressure, the basic adhesive concentration is based on the concentration information of the silver paste obtained from the current values ​​of a and b: solid content 68%, viscosity > 20000 CPS. For inverted normal pressure / pressurized conditions, the viscosity and solid content can be higher.

[0076] It should be noted that the adhesive of the present invention includes liquids prepared from one or a mixture of gold powder, silver powder, and copper powder, but is not limited to these. It can be any other adhesive with conductive properties, such as graphite adhesive, ion-conductive gel, or other materials. It can also be an adhesive without conductive properties, applied to a specific scenario, and meeting the requirements of patterning or coating.

[0077] Furthermore, it should be noted that the above-mentioned method for coating electrical wires with a wide range of adhesive viscosity is a high-precision, digital additive manufacturing process that fabricates customized micro-nano scale conductive circuits on rigid and / or flexible substrates by directly depositing functional inks (such as metal nanoparticles, conductive polymers, etc.).

[0078] Furthermore, this method is also applicable to the field of flexible electronics and sensors. Traditional subtractive processes such as photolithography are costly, time-consuming, and difficult to adapt to flexible and irregular surfaces. However, the direct writing technology for electrical wire coating has broken through the manufacturing bottleneck with its advantages such as no need for masks, high material utilization, and conformal integration with non-planar substrates. It can directly integrate and manufacture high-performance strain sensors, bioelectrodes, radio frequency antennas and other core components on flexible / stretchable substrates such as polyimide (PI) and polydimethylsiloxane (PDMS), realizing the lightweight, miniaturization and comfort of device structures.

[0079] Therefore, direct writing of electrical wire coatings is not only a key enabling technology for achieving high integration and multifunctionality of microsystems, but it can also drive cutting-edge innovative applications such as wearable devices, electronic skin, and implantable medical devices from the laboratory to industrialization.

[0080] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electrical conductor coating system with a wide range of sizing solution viscosities, characterized in that, The application relates to a conductive lead coating system, which comprises the following parts: an external support frame (1); a glue injection system for controlling the delivery and extrusion of glue liquid to extrude conductive raw materials of a component to be processed, wherein the viscosity of the glue liquid ranges from low viscosity to high viscosity, the glue injection system comprises a glue injection system (4) and a glue injection control module; a coating and writing movement system for controlling the relative movement of the component to be processed and the glue injection system (4), wherein the coating and writing movement system comprises a coating and writing movement control module, a nozzle movement displacement mechanism (3) and a component movement displacement mechanism (5); a positive and negative conversion mechanism (2) for switching the coating system between a positive mode and a negative mode, wherein the positive mode is suitable for high-viscosity glue liquid, and the negative mode is suitable for low-viscosity glue liquid; an optical system (6) for observing the coating of the glue liquid and monitoring the coating progress of the conductive lead in real time; a central control system for controlling the optical imaging module, the glue injection control module and the coating and writing movement control module to realize data transmission and interaction; wherein the positive and negative conversion mechanism (2) is arranged in the internal cavity of the external support frame (1), the glue injection system and the coating and writing movement system are arranged on the inner side of the positive and negative conversion mechanism (2), and the glue injection system and the coating and writing movement system are switched between the positive mode and the negative mode through the positive and negative conversion mechanism (2).

2. A wide gum solution viscosity range electrical wire coating system according to claim 1, characterized in that: The positive and negative conversion mechanism (2) comprises an embedded slide rail support table (21), the bottom of the embedded slide rail support table (21) is fixed to the bottom surface of the internal cavity of the external support frame (1), the embedded slide rail support table (21) is symmetrically arranged about the axis of the external support frame (1), a slide rail driving motor (22) is fixedly arranged on the inner side surface of the embedded slide rail support table (21), a support plate (23) is rotatably arranged on the inner side of the embedded slide rail support table (21), a plurality of threaded holes are reserved on the surface of the support plate (23), annular wheels are fixedly arranged at the two ends of the support plate (23), an annular groove (24) is arranged on the inner edge surface of the embedded slide rail support table (21) to form an inward annular track, the outer edge surface of the annular wheels at the two ends of the support plate (23) is slidably matched with the inner wall of the annular groove (24), the annular wheels at the two ends of the support plate (23) are embedded in the annular track to realize 360-degree direction rotation, and the annular track is driven by the slide rail driving motor (22), and the slide rail driving motor (22) is a digital control motor.

3. A wide gum solution viscosity range electrical wire coating system according to claim 2, characterized in that: The glue injection system is used for delivering and extruding glue liquid according to set parameters; the glue injection control module is used for controlling the glue injection system (4) to spray glue liquid to form a conductive lead, and the glue injection system (4) is arranged on the top of the nozzle movement displacement mechanism (3).

4. A wide gum solution viscosity range electrical wire coating system according to any one of claim 3, characterized in that: The glue injection system (4) comprises a glue pushing motor (41), a fixing frame (42), an injection pump (43), an injection pipeline (44) and an injection head (45). The injection pump (43) and the glue pushing motor (41) constitute an injector. The injection pump (43) comprises a pump outlet, an inner cavity and a piston reciprocating in the inner cavity. The pump outlet is communicated with the inner cavity. The pump outlet is connected to the injection head (45) through a connecting pipe. The glue is placed in a glue space formed by the inner cavity and one end of the piston. The other end of the piston is fixedly connected with the glue pushing motor (41). A moving block is fixedly installed on the glue pushing motor (41). The bottom of the fixing frame (42) is connected with the moving block of the glue pushing motor (41). The output end of the glue pushing motor (41) is connected with the input end of the injection pump (43). The output end of the injection pump (43) is fixedly installed with the injection pipeline (44). The output end of the injection pipeline (44) is installed with the injection head (45).

5. A wide gum solution viscosity range electrical wire coating system according to claim 4, characterized in that: The writing and coating motion control module is used for controlling the composite motion of the injection head motion displacement mechanism (3) and / or the component motion displacement mechanism (5). The injection head motion displacement mechanism (3) is used for controlling the composite motion of the glue injection system (4). The component motion displacement mechanism (5) is used for controlling the composite motion of the component to be processed. The composite motion comprises the motion of at least two coordinate axes.

6. A wide gum solution viscosity range electrical wire coating system according to claim 5, characterized in that: The injection head motion displacement mechanism (3) comprises an injection head clamp (31), an injection head workbench (32) and an injection head motor (33) for driving the injection head workbench (32) to move in a composite manner. The injection pump (43) is fixed on the injection head workbench (32) through the injection head clamp (31). The injection head workbench (32) is a three-axis motion platform, i.e. an XYZ displacement table. The bottom of the injection head workbench (32) is fixed with the support plate (23) through screws. The injection head clamp (31) is installed on the top of the injection head workbench (32). The component motion displacement mechanism (5) comprises a component clamp (51), a component workbench (52) and a component motor (53). The component motor (53) is a digital control motor, which is used for driving the component workbench (52) to move in a composite manner. The component to be processed is fixed on the component workbench (52) through the component clamp (51). The component workbench (52) is an XY displacement table.

7. A wide gum solution viscosity range electrical wire coating system according to claim 4, characterized in that: The optical system (6) comprises an electron microscope and / or other optical path lenses and microscopic imaging optical path elements. A fixing support and an optical support rod are installed outside the optical system (6). The optical system (6) is fixed with the support plate (23) through the fixing support and the optical support rod. The eyepiece of the electron microscope is installed above and opposite to the injection outlet of the injection head (45) to monitor the writing and coating progress and / or quality of the conductive lead of the component to be processed in real time. The other optical path lens is an oblique incidence.

8. A method of coating electrical conductors over a wide range of dope viscosities, based on the system for coating electrical conductors over a wide range of dope viscosities according to any one of claims 1 to 7, characterized in that The method comprises the following steps: Step 1: Draw the lead structure of the conductive lead of the device to be processed by vector picture editing software, and before writing, import the pre-designed conductive lead pattern and the corresponding section of the glue type, i.e. low viscosity or high viscosity, into the central control system, automatically identify the required upright or inverted working mode of each section; Step 2: Convert the drawn lead structure into writing motion route information, form the corresponding writing path and switching instructions, and integrate the writing parameters including glue discharge speed and motion speed into a unified execution sequence; Step 3: Determine the writing parameters according to the line width of the device to be processed, including glue parameters and writing motion parameters, the glue parameters including glue concentration and glue discharge speed, and the writing motion parameters being writing speed; Step 4: Prepare the glue according to the glue concentration requirement or select the required glue, and select the upright or inverted writing mode according to the glue concentration, high viscosity glue using upright high pressure writing, low concentration glue selecting inverted low pressure writing; Step 5: Convert the writing motion parameters and writing mode into parameter instructions and transmit them to the writing motion system, and convert the glue discharge speed into parameter instructions and transmit them to the glue injection system; Step 6: Start writing, perform glue injection motion and compound motion according to the writing parameters, and write the conductive lead of the device to be processed until the writing is completed, wherein during the writing process, the coating system moves and injects glue according to the preset program, when it is detected that the glue type needs to be switched, the central control system instructs the upright and inverted conversion mechanism (2) to start, drives the support plate (23) to rotate 180° together with the glue injection and motion system, and automatically switches the upright and inverted mode. The whole switching process is completed at the preset pause point in the writing path. During the writing and switching process, the optical system (6) continuously monitors the glue coating state and lead forming quality. If it is found that the writing is abnormal or the writing parameters do not match, it will be paused and prompted for manual intervention in real time, or the writing parameters and switching strategy will be automatically adjusted according to the preset rules; Step 7: Real-time monitoring of the writing progress of the conductive lead by using the microscopic imaging system, and automatic analysis of the writing quality, combined with the preset quality threshold, to judge the state of the writing quality, to provide warning / state prompt information, and then to select manual intervention interruption and / or adjust the writing parameters.

9. A method of coating electrical wires over a wide range of adhesive solution viscosities according to claim 8, characterized in that: Step 0 is added before Step 1, which is parameter calibration. For each specific electrical lead coating system, under the condition that the inner diameter of the injection head (45) is determined, the linear relationship between the glue concentration and the writing parameters and the width of the device to be processed is optimized and determined by the test method and the least square method.

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