Multi-point punch forming device for mechanical die production

Abstract

The invention relates to the technical field of mechanical die machining, in particular to a multi-point punch forming device for mechanical die production. Comprising a base, an annular scrap collecting table is arranged on the base, four sets of stand columns are fixedly connected to the annular scrap collecting table, a top plate is fixedly connected to the top ends of the four sets of stand columns, a hydraulic cylinder is installed on the top plate, and the position of a lower pressing block is adjusted through two sets of longitudinal electric sliding tables and a transverse electric sliding table; a lower pressing block is driven by a first electric push rod to push a fixed-point punching part to move downwards, so that a punching head at a specified position can independently extend out, an automatic locking function is realized by combining a wedge-shaped clamping block and a propping spring, the punching head is fixed, and an upper die assembly is driven by a hydraulic cylinder to move downwards; and the stamping head conducts fixed-point stamping operation on the metal plate, so that automatic adjustment of the stamping position is achieved, the workload of workers is reduced, and meanwhile the stamping precision is improved.

Description

Technical Field

[0001] This invention belongs to the field of mechanical mold processing technology, and specifically relates to a multi-point stamping forming device for mechanical mold production. Background Technology

[0002] A mold is a structure used in industrial production to obtain the desired product through methods such as injection molding, blow molding, extrusion, die casting, smelting, and stamping. It is an important part of industrial production. Molds have many components. In addition to the main body that is originally milled, there are also water channels, guide structures, buffer structures, ejector structures, etc. composed of various components. Some structures need to be stamped into a specified shape or punched into holes by stamping the sheet metal during the production process.

[0003] Traditional die stamping equipment can only perform single-point stamping operations at a time. When multiple points need to be stamped on the die surface, the stamping position of the die needs to be manually adjusted and multiple stamping operations need to be performed, which increases the workload of workers and affects stamping efficiency.

[0004] A search revealed that in the prior art, patent document CN221983678U, published on November 12, 2024, discloses a stamping device for metal mold production. The device includes a base, with a lower mold fixedly mounted at each of the four corners of the base's top via first columns. An upper mold is movably mounted at the top of the lower mold, and a top plate is fixedly mounted at each of the four corners of the upper mold via second columns. Shaft supports are provided on the upper surfaces of both ends of one side of the base and the lower surfaces of both ends of one side of the top plate. Adjustment mechanisms are provided inside and outside the shaft supports. This invention utilizes a crank handle, worm gear, worm wheel, threaded rod, support plate, movable sleeve, support plate, stamping block, and stamping groove in cooperation. The movable sleeve at the top of the stamping block linearly pushes the stamping block downwards, adapting the exposed portion of the stamping block to the adjusted depth of the stamping groove. Adjustment allows for stamping metal molds to different depths, thereby increasing its applicability and avoiding resource waste.

[0005] However, the device still has the following drawbacks: although it can stamp metal molds to different depths, it can only perform single-point stamping operations at a time. When multiple points need to be stamped on the mold surface, the stamping position of the mold needs to be manually adjusted and multiple stamping operations need to be performed, which increases the workload of workers and affects stamping efficiency. Summary of the Invention

[0006] To address the above problems, the present invention provides a multi-point stamping forming device for mechanical mold production, including a base, an annular chip collection platform on the base, four sets of columns fixedly connected to the annular chip collection platform, a top plate fixedly connected to the top of the four sets of columns, a hydraulic cylinder mounted on the top plate, and an upper mold assembly drivenly connected to the output end of the hydraulic cylinder, the upper mold assembly including a housing. The top of the inner wall of the box is provided with a point adjustment mechanism. The point adjustment mechanism includes two sets of longitudinal electric slides and transverse electric slides. The output end of the transverse electric slide is driven to a first electric push rod, and the output end of the first electric push rod is driven to a pressing block. The inner wall of the box is fixedly connected to a partition, and the partition is provided with several sets of fixed-point stamping parts; The partition is provided with a reset drive mechanism and a reset mechanism. A chip suction mechanism is provided between the partition and the bottom of the inner wall of the box. The chip suction mechanism is connected to one end of the chip guide hose. A loading platform is provided at the center of the annular chip collection platform, and a lower mold base is provided on the loading platform.

[0007] Furthermore, four sets of limiting blocks are fixedly connected to the side wall of the box. Each of the four sets of limiting blocks has a limiting hole. Each of the four sets of limiting blocks has a buffer spring at its bottom end. The loading platform is fixedly connected to the bottom end of the four sets of buffer springs. The loading platform is provided with four sets of directional shafts. Each of the four sets of directional shafts is movably engaged with the limiting hole on the corresponding set of limiting blocks. Each of the four sets of buffer springs is sleeved on the corresponding set of directional shafts.

[0008] Furthermore, the partition plate is provided with several sets of through holes, each set of through holes corresponding to a set of fixed-point stamping parts. The bottom of the inner wall of the box is provided with several sets of stamping holes, each set of stamping holes being located directly below the set of fixed-point stamping parts.

[0009] Furthermore, the fixed-point stamping part includes a sliding shaft, which is movably fitted with a corresponding set of through holes. A stamping head is fixedly connected to the bottom end of the sliding shaft, and a linkage block is fixedly connected to the top end of the sliding shaft. A return spring is provided between the linkage block and the partition plate, and the return spring is sleeved on the sliding shaft.

[0010] Furthermore, the sliding shaft is provided with several sets of wedge-shaped blocks, and several sets of clearance grooves are provided on the sliding shaft. Each of the clearance grooves corresponds to one of the several sets of wedge-shaped blocks. A linkage shaft is fixedly connected to the side wall of each wedge-shaped block. Several sets of sliding grooves are provided on the sliding shaft, and each of the sliding grooves is movably engaged with a corresponding set of linkage shafts. An anti-collision spring is provided between the wedge-shaped blocks and the inner wall of the clearance grooves, and the anti-collision spring is sleeved on the linkage shaft.

[0011] Furthermore, the reset mechanism includes several sets of compression rings, with a connecting plate fixedly connected between each pair of adjacent compression rings, and a transmission plate fixedly connected between the several sets of compression rings located at the two side edges.

[0012] Furthermore, the reset drive mechanism includes two sets of abutment plates and two sets of cams. The bottom ends of the two sets of abutment plates are provided with two sets of connecting shafts. The bottom ends of the two sets of connecting shafts pass through the partition and are fixedly connected to the top end of the transmission plate. Two sets of compression springs are provided between the abutment plates and the partition, and the two sets of compression springs are respectively sleeved on the corresponding set of connecting shafts.

[0013] Furthermore, the partition plate is provided with two sets of transmission grooves, and the two sets of cams are rotatably connected to the inner wall of the corresponding set of transmission grooves. The two sets of cams abut against the corresponding set of abutting plates. A rotating shaft is fixedly connected to the center of the two sets of cams. A motor is installed on the partition plate, and the output end of the motor is connected to the center of the set of cams.

[0014] Furthermore, the chip removal mechanism includes a chip discharge pipe and a second electric push rod. One end of the chip discharge pipe extends to the outside of the housing. A snap ring is fixedly connected to the chip discharge pipe, and a drive block is fixedly connected to the snap ring. The drive block is drivenly connected to the output end of the second electric push rod. Several sets of chip removal pipes are connected to the chip discharge pipe, and several sets of chip removal heads are connected to the bottom ends of the several sets of chip removal pipes.

[0015] Furthermore, the annular chip collection platform has a hollow structure, a vacuum pump is installed on the annular chip collection platform, the air inlet of the vacuum pump extends into the annular chip collection platform, a filter screen is provided at the air inlet of the vacuum pump, and a chip guide hose is connected to the annular chip collection platform.

[0016] The beneficial effects of this invention are: 1. The position of the lower pressing block is adjusted by two sets of longitudinal and transverse electric slides. The lower pressing block is driven by the first electric push rod to move the fixed-point stamping part downward, so that the stamping head can be independently extended at the designated position. Combined with the wedge-shaped locking block and the contact spring, the automatic locking function is realized to fix the stamping head. The upper die assembly is driven by the hydraulic cylinder to move downward, so that the stamping head performs fixed-point stamping operation on the metal sheet. This realizes automatic adjustment of the stamping position, reduces the workload of workers and improves the stamping accuracy.

[0017] 2. When multi-point stamping operation is required on metal sheets, the point adjustment mechanism drives the lower pressing block to move sequentially to the underside of the corresponding set of fixed-point stamping parts, and sequentially moves the corresponding stamping heads downward to the bottom of the outer side of the box. By moving the box downward, multiple sets of stamping heads can simultaneously perform multi-point stamping operation on the metal sheets, thereby effectively improving stamping efficiency.

[0018] 3. The motor drives two sets of cams to rotate synchronously, so that the protrusions of the two sets of cams rotate to the top and abut against the two sets of abutting plates. The two sets of abutting plates drive the reset mechanism to move upward, so that several sets of extrusion rings are attached to the surface of the corresponding set of sliding shafts and move upward. During the movement, the wedge-shaped block is extruded and retracted into the relief groove. At this time, the wedge-shaped block no longer engages with the partition. Through the elastic potential energy of the reset spring, the sliding shaft drives the punch head to move upward, so that the punch head retracts into the inside of the housing, realizing the reset operation of the punch head, thereby enabling quick switching of the positioning punching position.

[0019] 4. The second electric push rod drives the chip discharge pipe to move horizontally, so that several sets of chip suction heads move synchronously to several sets of punching holes. The vacuum pump creates a vacuum inside the annular chip collection platform, so that the chips accumulated in the holes and grooves generated by punching are sucked into the chip discharge pipe through the chip suction head and finally enter the annular chip collection platform for centralized processing, thereby realizing automatic chip cleaning. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of the main structure according to an embodiment of the present invention is shown; Figure 2 A schematic diagram of the main body structure from another perspective according to an embodiment of the present invention is shown; Figure 3 A perspective view of the internal structure of the housing according to an embodiment of the present invention is shown; Figure 4 A schematic diagram of a portion of the partition structure according to an embodiment of the present invention is shown; Figure 5 An embodiment of the present invention is shown. Figure 4 Enlarged view of point A in the middle; Figure 6 A cross-sectional view of the internal structure of the slide shaft according to an embodiment of the present invention is shown; Figure 7 A schematic diagram showing the positions of the reset mechanism and the reset drive mechanism according to an embodiment of the present invention is provided. Figure 8 A schematic diagram showing the connection between the reset mechanism and the reset drive mechanism according to an embodiment of the present invention is shown; Figure 9 A top-view schematic diagram of a dust-collecting mechanism according to an embodiment of the present invention is shown.

[0022] In the diagram: 100, base; 200, annular chip collection table; 210, vacuum pump; 220, chip guide hose; 300, column; 400, top plate; 500, hydraulic cylinder; 600, upper mold assembly; 610, housing; 611, stamping hole; 620, limit block; 630, buffer spring; 640, chip suction mechanism; 641, chip discharge pipe; 642, second electric push rod; 643, snap ring; 644, drive block; 645, chip suction pipe; 646, chip suction head; 650, partition plate; 651, through hole; 652, transmission groove; 660, fixed-point stamping part; 661, sliding shaft; 662, stamping head; 663, linkage block; 664. Return spring; 665. Wedge-shaped block; 666. Linkage shaft; 667. Abutment spring; 668. Relief groove; 669. Slide groove; 670. Reset mechanism; 671. Extrusion ring; 672. Connecting plate; 673. Transmission plate; 680. Position adjustment mechanism; 681. Longitudinal electric slide; 682. Transverse electric slide; 683. First electric push rod; 684. Lower pressure block; 690. Reset drive mechanism; 691. Rotating shaft; 692. Cam; 693. Motor; 694. Abutment plate; 695. Connecting shaft; 696. Compression spring; 700. Loading platform; 800. Lower mold base; 900. Orientation shaft. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] This invention provides a multi-point stamping forming device for mechanical mold production, including a base 100; for example, such as... Figure 1 and Figure 2 As shown.

[0025] The base 100 is provided with an annular chip collection platform 200, which is a hollow structure. A vacuum pump 210 is installed on the annular chip collection platform 200. The air inlet of the vacuum pump 210 extends into the annular chip collection platform 200. A filter screen is provided at the air inlet of the vacuum pump 210. A chip guide hose 220 is connected to the annular chip collection platform 200. Four sets of columns 300 are fixedly connected to the annular chip collection platform 200. A top plate 400 is fixedly connected to the top of the four sets of columns 300. A hydraulic cylinder 500 is installed on the top plate 400. The output end of the hydraulic cylinder 500 is drivenly connected to the upper mold assembly 600. The upper mold assembly 600 includes a housing 610. Four sets of limiting blocks 620 are fixedly connected to the side wall of the housing 610. Each of the four sets of limiting blocks 620 has a limiting hole. Each of the four sets of limiting blocks 620 has a buffer spring 630 at its bottom. A loading platform 700 is provided at the center of the annular chip collection platform 200. The loading platform 700 is fixedly connected to the bottom end of four sets of buffer springs 630. A lower mold base 800 is provided on the loading platform 700. Four sets of directional shafts 900 are provided on the loading platform 700. The four sets of directional shafts 900 are respectively movably fitted with the limiting holes on the corresponding set of limiting blocks 620. The four sets of buffer springs 630 are respectively sleeved on the corresponding set of directional shafts 900. Specifically, the metal sheet to be processed is installed on the lower die base 800, and the upper die assembly 600 is driven to move downward by the hydraulic cylinder 500 to perform a stamping operation on the surface of the metal sheet. At the same time as the upper die assembly 600 moves downward, four sets of limit blocks 620 move downward along a corresponding set of directional shafts 900 to keep the upper die assembly 600 in balance during the stamping process. At the same time as the upper die assembly 600 moves downward, the four sets of limit blocks 620 move downward synchronously and squeeze the buffer spring 630 to buffer the stamping process.

[0026] For example, such as Figures 3-8 As shown.

[0027] The top of the inner wall of the housing 610 is provided with a position adjustment mechanism 680. The position adjustment mechanism 680 includes two sets of longitudinal electric slides 681 and transverse electric slides 682. Both sets of longitudinal electric slides 681 and transverse electric slides 682 are installed on the inner wall of the housing 610. The two ends of the transverse electric slide 682 are respectively connected to the output ends of the two sets of longitudinal electric slides 681. The output end of the transverse electric slide 682 is connected to a first electric push rod 683. The output end of the first electric push rod 683 is connected to a lower pressure block 684. The inner wall of the housing 610 is fixedly connected to a partition 650. The partition 650 is provided with a number of fixed-point stamping parts 660 and a number of through holes 651. The number of through holes 651 correspond one-to-one with the number of fixed-point stamping parts 660. The bottom of the inner wall of the housing 610 is provided with a number of stamping holes 611. The number of stamping holes 611 are respectively located directly below the number of fixed-point stamping parts 660. The fixed-point stamping part 660 includes a sliding shaft 661, which is movably fitted with a corresponding set of through holes 651. A stamping head 662 is fixedly connected to the bottom end of the sliding shaft 661, and a linkage block 663 is fixedly connected to the top end of the sliding shaft 661. A return spring 664 is provided between the linkage block 663 and the partition plate 650. The return spring 664 is sleeved on the sliding shaft 661. Several sets of wedge-shaped locking blocks 665 are provided on the sliding shaft 661. Several sets of clearance grooves 668 are provided, and each set of clearance grooves 668 corresponds to a set of wedge-shaped blocks 665. The side wall of each wedge-shaped block 665 is fixedly connected to a linkage shaft 666. Several sets of sliding grooves 669 are provided on the sliding shaft 661, and each set of sliding grooves 669 is movably fitted with a corresponding set of linkage shafts 666. An anti-contact spring 667 is provided between the inner wall of the wedge-shaped block 665 and the clearance groove 668, and the anti-contact spring 667 is sleeved on the linkage shaft 666. Specifically, two sets of longitudinal electric slides 681 drive the transverse electric slide 682 to move longitudinally, causing the transverse electric slide 682 to move the lower pressure block 684 to a preset position on the longitudinal coordinate axis. Then, the transverse electric slide 682 drives the lower pressure block 684 to a preset position on the transverse coordinate axis, thus moving the lower pressure block 684 directly above a set of fixed-point stamping parts 660. The first electric push rod 683 drives the lower pressure block 684 to move downward, causing the lower pressure block 684 to contact the linkage block 663 located directly below it and drive it to move downward. This causes the sliding shaft 661 to drive the stamping head 662 downward and extend it through the stamping hole 611 to the outer bottom of the housing 610. When the sliding shaft 661 moves downward, several sets of wedge-shaped locking blocks 665 move downward. It enters the through hole 651 and squeezes the wedge-shaped block 665 through the inner wall of the through hole 651, causing it to retract into the relief groove 668. When the wedge-shaped block 665 continues to move downward to the bottom of the partition 650, the tension of the contact spring 667 drives the wedge-shaped block 665 to move to the outside of the slide shaft 661, so that the wedge-shaped block 665 engages with the partition 650, preventing the slide shaft 661 from driving the punch head 662 to retract into the housing 610 under the tension of the return spring 664. Thus, after the pressing block 684 completes the pressing operation and resets, the punch head 662 remains at the bottom of the outer side of the housing 610. As the housing 610 moves downward, the punch head 662 can perform a fixed-point punching operation on the metal sheet located directly below it. Furthermore, when multi-point stamping operation is required on the metal sheet, the point adjustment mechanism 680 drives the lower pressing block 684 to move sequentially to directly below the corresponding set of fixed-point stamping parts 660, and sequentially moves the corresponding stamping head 662 downward to the outer bottom of the housing 610. By moving the housing 610 downward, multiple sets of stamping heads 662 can simultaneously perform multi-point stamping operation on the metal sheet.

[0028] The partition 650 is provided with a reset drive mechanism 690 and a reset mechanism 670. A chip suction mechanism 640 is provided between the partition 650 and the bottom of the inner wall of the housing 610. The chip suction mechanism 640 is connected to one end of the chip guide hose 220. The reset mechanism 670 includes several sets of compression rings 671, which are respectively sleeved on a corresponding set of sliding shafts 661. A connecting plate 672 is fixedly connected between each pair of adjacent compression rings 671, and a transmission plate 673 is fixedly connected between several sets of compression rings 671 located at the two side edges. The reset drive mechanism 690 includes two sets of abutment plates 694 and two sets of cams 692. The bottom ends of the two sets of abutment plates 694 are provided with two sets of connecting shafts 695. The bottom ends of the two sets of connecting shafts 695 pass through the partition plate 650 and are fixedly connected to the top end of the transmission plate 673. Two sets of compression springs 696 are provided between the abutment plates 694 and the partition plate 650. The two sets of compression springs 696 are respectively sleeved on the corresponding set of connecting shafts 695. The partition 650 has two sets of transmission grooves 652. The two sets of cams 692 are rotatably connected to the inner wall of the corresponding set of transmission grooves 652. The two sets of cams 692 abut against the corresponding set of abutting plates 694. A rotating shaft 691 is fixedly connected to the center of the two sets of cams 692. A motor 693 is installed on the partition 650. The output end of the motor 693 is connected to the center of the set of cams 692. Specifically, after the stamping operation is completed, the motor 693 drives the two sets of cams 692 to rotate synchronously, causing the protrusions of the two sets of cams 692 to rotate to the top, abutting against the two sets of abutting plates 694. This causes the two sets of abutting plates 694 to drive the reset mechanism 670 to move upward, causing several sets of extrusion rings 671 to move upward against the surface of the corresponding set of sliding shafts 661. During the movement, the wedge-shaped locking block 665 is squeezed, causing the wedge-shaped locking block 665 to retract into the relief groove 668. At this time, the wedge-shaped locking block 665 no longer engages with the partition plate 650. Through the elastic potential energy of the reset spring 664, the sliding shaft 661 drives the stamping head 6 62 moves upward, causing the stamping head 662 to retract into the housing 610, thus resetting the stamping head 662. This allows for quick switching of the stamping position. After the reset operation is completed, the motor 693 drives the two sets of cams 692 to continue rotating, causing the protrusions of the two sets of cams 692 to rotate directly downward. At this time, the cams 692 no longer abut against the contact plate 694. The reset mechanism 670 moves downward under its own gravity, causing the extrusion ring 671 to move downward synchronously. This prevents the extrusion ring 671 from pressing the wedge-shaped block 665 after the position switch is completed, thus preventing it from engaging with the bottom of the partition plate 650.

[0029] For example, such as Figure 9 As shown.

[0030] The chip removal mechanism 640 includes a chip discharge pipe 641 and a second electric push rod 642. One end of the chip discharge pipe 641 extends to the outside of the housing 610 and is connected to one end of the chip guide hose 220. A snap ring 643 is fixedly connected to the chip discharge pipe 641, and a drive block 644 is fixedly connected to the snap ring 643. The drive block 644 is drivenly connected to the output end of the second electric push rod 642. Several sets of chip removal pipes 645 are connected to the chip discharge pipe 641. The bottom ends of the several sets of chip removal pipes 645 are connected to several sets of chip removal heads 646. The several sets of chip removal heads 646 correspond one-to-one with several sets of punching holes 611. Specifically, in the initial state, several sets of the chip suction heads 646 are respectively located on one side of a corresponding set of punching holes 611 to avoid the chip suction heads 646 obstructing the extension of the punching head 662. After the punching operation is completed, the second electric push rod 642 drives the chip discharge pipe 641 to move horizontally, so that several sets of chip suction heads 646 move synchronously to several sets of punching holes 611. The vacuum pump 210 creates a vacuum inside the annular chip collection platform 200, so that the debris accumulated in the holes and grooves generated by punching is sucked into the chip discharge pipe 641 by the chip suction heads 646, and finally enters the annular chip collection platform 200 for centralized processing.

[0031] The working principle of the multi-point stamping forming device for mechanical mold production proposed in this invention is as follows: The metal sheet to be processed is installed on the lower die base 800. The upper die assembly 600 is driven to move downward by the hydraulic cylinder 500 to perform a stamping operation on the surface of the metal sheet. At the same time as the upper die assembly 600 moves downward, four sets of limit blocks 620 move downward along a corresponding set of directional shafts 900 to keep the upper die assembly 600 in balance during the stamping process. At the same time as the upper die assembly 600 moves downward, the four sets of limit blocks 620 move downward synchronously and squeeze the buffer spring 630 to buffer the stamping process.

[0032] Two sets of longitudinal electric slides 681 drive the transverse electric slide 682 to move longitudinally, causing the transverse electric slide 682 to move the lower pressure block 684 to a preset position on the longitudinal coordinate axis. Then, the transverse electric slide 682 drives the lower pressure block 684 to a preset position on the transverse coordinate axis, thus moving the lower pressure block 684 directly above a set of fixed-point stamping parts 660. The first electric push rod 683 drives the lower pressure block 684 to move downward, causing the lower pressure block 684 to contact the linkage block 663 located directly below it and drive it to move downward. This causes the sliding shaft 661 to drive the stamping head 662 downward and pass through the stamping hole 611 to extend to the outer bottom of the housing 610. When the sliding shaft 661 moves downward, several sets of wedge-shaped locking blocks 665 move downward and advance... The wedge-shaped locking block 665 is squeezed by the inner wall of the through hole 651, causing it to retract into the relief groove 668. When the wedge-shaped locking block 665 continues to move downward to the bottom of the partition 650, the tension of the anti-spring 667 drives the wedge-shaped locking block 665 to move to the outside of the slide shaft 661, so that the wedge-shaped locking block 665 locks the partition 650, preventing the slide shaft 661 from driving the punch head 662 to retract into the housing 610 under the tension of the return spring 664. Thus, after the pressing block 684 completes the pressing operation and resets, the punch head 662 remains at the bottom of the outer side of the housing 610. As the housing 610 moves downward, the punch head 662 can perform a fixed-point punching operation on the metal sheet located directly below it. When a multi-point stamping operation is required on a metal sheet, the point adjustment mechanism 680 drives the lower pressing block 684 to move sequentially to directly below the corresponding set of fixed-point stamping parts 660, and sequentially moves the corresponding stamping head 662 downward to the outer bottom of the housing 610. By moving the housing 610 downward, multiple sets of stamping heads 662 can simultaneously perform multi-point stamping operations on the metal sheet.

[0033] After the stamping operation is completed, the motor 693 drives the two sets of cams 692 to rotate synchronously, causing the protrusions of the two sets of cams 692 to rotate to the top, where they abut against the two sets of abutment plates 694. This causes the two sets of abutment plates 694 to drive the reset mechanism 670 to move upward, causing several sets of extrusion rings 671 to move upward against the surface of the corresponding set of sliding shafts 661. During the movement, the wedge-shaped locking block 665 is squeezed, causing the wedge-shaped locking block 665 to retract into the relief groove 668. At this time, the wedge-shaped locking block 665 no longer engages with the partition plate 650. Through the elastic potential energy of the reset spring 664, the sliding shaft 661 drives the stamping head 662. The upward movement causes the stamping head 662 to retract into the housing 610, thus resetting the stamping head 662. This allows for quick switching of the stamping position. After the reset operation is completed, the motor 693 drives the two sets of cams 692 to continue rotating, causing the protrusions of the two sets of cams 692 to rotate directly downwards. At this point, the cams 692 no longer abut against the contact plate 694. The reset mechanism 670 moves downwards under its own gravity, causing the extrusion ring 671 to move downwards synchronously. This prevents the extrusion ring 671 from pressing the wedge-shaped block 665 after the position switch is completed, thus preventing it from engaging with the bottom of the partition plate 650.

[0034] In the initial state, several sets of the chip suction heads 646 are respectively located on one side of a corresponding set of punching holes 611 to avoid the chip suction heads 646 obstructing the extension of the punching head 662. After the punching operation is completed, the second electric push rod 642 drives the chip discharge pipe 641 to move horizontally, so that several sets of chip suction heads 646 move synchronously to several sets of punching holes 611. The vacuum pump 210 creates a vacuum inside the annular chip collection table 200, so that the debris accumulated in the holes and grooves generated by punching is sucked into the chip discharge pipe 641 by the chip suction heads 646, and finally enters the annular chip collection table 200 for centralized processing.

[0035] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A multi-point stamping forming device for mechanical mold production, comprising a base, characterized in that: The base is provided with an annular chip collection platform, and four sets of columns are fixedly connected to the annular chip collection platform. The top of the four sets of columns is fixedly connected to a top plate. A hydraulic cylinder is installed on the top plate. The output end of the hydraulic cylinder is drivenly connected to an upper mold assembly. The upper mold assembly includes a housing. The top of the inner wall of the box is provided with a point adjustment mechanism. The point adjustment mechanism includes two sets of longitudinal electric slides and transverse electric slides. The output end of the transverse electric slide is driven to a first electric push rod, and the output end of the first electric push rod is driven to a pressing block. The inner wall of the box is fixedly connected to a partition, and the partition is provided with several sets of fixed-point stamping parts; The partition is provided with a reset drive mechanism and a reset mechanism. A chip suction mechanism is provided between the partition and the bottom of the inner wall of the box. The chip suction mechanism is connected to one end of the chip guide hose. A loading platform is provided at the center of the annular chip collection platform, and a lower mold base is provided on the loading platform.

2. The multi-point stamping forming device for mechanical mold production according to claim 1, characterized in that: The side wall of the box is fixedly connected with four sets of limiting blocks. Each of the four sets of limiting blocks has a limiting hole. Each of the four sets of limiting blocks has a buffer spring at its bottom. The loading platform is fixedly connected to the bottom of the four sets of buffer springs. The loading platform is provided with four sets of directional shafts. Each of the four sets of directional shafts is movably fitted with the limiting hole on the corresponding set of limiting blocks. Each of the four sets of buffer springs is sleeved on the corresponding set of directional shafts.

3. The multi-point stamping forming device for mechanical mold production according to claim 1, characterized in that: The partition plate has several sets of through holes, each set of through holes corresponding to a set of fixed-point stamping parts. The bottom of the inner wall of the box has several sets of stamping holes, each set of stamping holes located directly below a set of fixed-point stamping parts.

4. The multi-point stamping forming device for mechanical mold production according to claim 3, characterized in that: The fixed-point stamping part includes a sliding shaft, which is movably fitted with a corresponding set of through holes. A stamping head is fixedly connected to the bottom end of the sliding shaft, and a linkage block is fixedly connected to the top end of the sliding shaft. A return spring is provided between the linkage block and the partition plate, and the return spring is sleeved on the sliding shaft.

5. The multi-point stamping forming device for mechanical mold production according to claim 4, characterized in that... The sliding shaft is provided with several sets of wedge-shaped blocks, and several sets of clearance grooves are provided on the sliding shaft. Each of the clearance grooves corresponds to one of the several sets of wedge-shaped blocks. A linkage shaft is fixedly connected to the side wall of each wedge-shaped block. Several sets of sliding grooves are provided on the sliding shaft, and each of the sliding grooves is movably engaged with a corresponding set of linkage shafts. An anti-collision spring is provided between the wedge-shaped blocks and the inner wall of the clearance grooves, and the anti-collision spring is sleeved on the linkage shaft.

6. The multi-point stamping forming device for mechanical mold production according to claim 1, characterized in that: The reset mechanism includes several sets of compression rings, and a connecting plate is fixedly connected between each pair of adjacent compression rings. A transmission plate is fixedly connected between several sets of compression rings located at the two side edges.

7. The multi-point stamping forming device for mechanical mold production according to claim 1, characterized in that: The reset drive mechanism includes two sets of abutment plates and two sets of cams. The bottom ends of the two sets of abutment plates are provided with two sets of connecting shafts. The bottom ends of the two sets of connecting shafts pass through the partition and are fixedly connected to the top end of the transmission plate. Two sets of compression springs are provided between the abutment plates and the partition, and the two sets of compression springs are respectively sleeved on the corresponding set of connecting shafts.

8. The multi-point stamping forming device for mechanical mold production according to claim 7, characterized in that: The partition plate has two sets of transmission grooves. The two sets of cams are rotatably connected to the inner wall of the corresponding set of transmission grooves. The two sets of cams abut against the corresponding set of abutting plates. A rotating shaft is fixedly connected to the center of the two sets of cams. A motor is installed on the partition plate. The output end of the motor is connected to the center of the set of cams.

9. The multi-point stamping forming device for mechanical mold production according to claim 1, characterized in that: The chip removal mechanism includes a chip discharge pipe and a second electric push rod. One end of the chip discharge pipe extends to the outside of the housing. A snap ring is fixedly connected to the chip discharge pipe, and a drive block is fixedly connected to the snap ring. The drive block is drivenly connected to the output end of the second electric push rod. Several sets of chip removal pipes are connected to the chip discharge pipe, and several sets of chip removal heads are connected to the bottom ends of the several sets of chip removal pipes.

10. The multi-point stamping forming device for mechanical mold production according to claim 9, characterized in that: The annular chip collection platform has a hollow structure. A vacuum pump is installed on the annular chip collection platform. The air inlet of the vacuum pump extends into the annular chip collection platform. A filter screen is provided at the air inlet of the vacuum pump. A chip guide hose is connected to the annular chip collection platform.

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