Processing method applied to flame coating melting crystallizer copper plate coating

Abstract

The processing method comprises the following steps: firstly, taking a crystallizer copper plate, and carrying out supersonic speed coating and melting operation to obtain a primary product of the crystallizer copper plate; the crystallizer copper plate primary product is installed on a positioning tool; the crystallizer copper plate primary product is subjected to surface grinding till the required coating surface roughness is achieved; the crystallizer copper plate primary product is subjected to surface polishing and grinding till the required coating surface roughness is achieved, and machining is completed; surface precision deviation caused by unstable workpiece fixing in traditional machining is avoided; the basic roughness requirement is rapidly met through the efficient removal capacity of grinding, higher surface smoothness is achieved through fine treatment of polishing and grinding, the machining efficiency is greatly improved, the coating surface meeting the technological requirement can be stably obtained, the machining efficiency is remarkably improved, and the machining cost is reduced. The problem that in the prior art, the machining efficiency and the surface quality are difficult to consider at the same time can be effectively solved, and cooperative improvement of the coating surface quality and the machining efficiency is achieved.

Description

Technical Field

[0001] This application relates to the field of metallurgical processing technology, and in particular to a processing method for a copper plate coating applied to a flame-coated crystallizer. Background Technology

[0002] In the field of continuous casting of steel, the crystallizer is the core component of the continuous casting unit, and its performance directly affects the efficiency of continuous casting production and the quality of the cast billet. With the rapid development of high operating rates and high casting speeds, more stringent requirements have been placed on the wear resistance, corrosion resistance, and service life of the copper plate surface of the crystallizer.

[0003] Electroplating is a common process used in the industry to treat the surface of copper plates in crystallizers to improve their wear resistance. However, this process has gradually revealed obvious defects in practical applications: on the one hand, the performance of the resulting coating is no longer sufficient to meet the requirements of high-speed continuous casting production, and it cannot guarantee long-term stable production results; on the other hand, the electroplating process generates a large amount of waste liquid containing heavy metals, posing serious environmental hazards and contradicting the increasingly stringent environmental protection regulations, thus limiting its continued application in large-scale production.

[0004] To address the aforementioned issues, a solution using supersonic flame coating technology to prepare copper plates for crystallizers has emerged in the industry. The copper plate coating formed using this technology exhibits significant improvements in key performance indicators such as surface wear resistance and corrosion resistance, thus meeting, to some extent, the performance requirements of high-speed continuous casting for copper plates.

[0005] However, this brings with it the challenge of processing the coating on the copper plate surface, especially the coating processing for the copper plate of the crystallizer, which faces severe challenges. Due to the high hardness and excellent wear resistance of the coating, traditional processing methods are difficult to adapt: ​​if the focus is on ensuring the flatness, roughness and other key process requirements of the copper plate coating, the processing efficiency is extremely low and cannot meet the supply needs of large-scale production; if processing efficiency is blindly pursued, it will lead to the loss of control over the surface quality of the coating and make it difficult to meet the process standards of continuous casting production. Summary of the Invention

[0006] In view of the deficiencies in the prior art, this application provides a processing method for copper plate coating applied to flame-coated crystallizers, so as to solve the problems of poor stability and low efficiency in the processing of copper plate coatings in the prior art.

[0007] The above-mentioned objectives of this application are mainly achieved through the following technical solutions: A processing method for coating copper plates used in flame-coated crystallizers, the processing method comprising: The copper plate from the crystallizer is subjected to a supersonic coating process to obtain the initial product of the copper plate from the crystallizer. Install the initial copper plate of the crystallizer onto the positioning fixture; The initial copper plate of the crystallizer is subjected to surface grinding until the required surface roughness of the coating is achieved. The initial copper plate of the crystallizer is subjected to surface polishing until the required surface roughness of the coating is achieved, thus completing the processing.

[0008] In an optional embodiment, after obtaining the initial product of the crystallizer copper plate, the initial product of the crystallizer copper plate is leveled.

[0009] In an optional embodiment, the initial copper plate of the crystallizer is leveled using a gantry leveling machine until the surface flatness of the initial copper plate of the crystallizer is less than 0.5 mm.

[0010] In an optional embodiment, when installing the initial copper plate of the crystallizer onto the positioning fixture, the initial copper plate of the crystallizer is mounted onto the positioning fixture by a plurality of bolts.

[0011] In an optional embodiment, when installing the initial copper plate of the crystallizer onto the positioning fixture, multiple bolts are adjusted until the gap between the water tank surface of the initial copper plate of the crystallizer and the surface of the positioning fixture is less than 0.05 mm.

[0012] In an optional embodiment, the surface grinding of the initial copper plate of the crystallizer is performed by a CNC gantry milling machine, and the surface polishing of the initial copper plate of the crystallizer is performed by a CNC gantry grinding machine.

[0013] In an optional embodiment, when grinding the surface of the initial copper plate of the crystallizer, the initial copper plate of the crystallizer together with the positioning fixture is placed flat on the CNC gantry milling machine table, and the positioning fixture is straightened, leveled and clamped.

[0014] In an optional embodiment, when grinding and polishing the surface of the initial copper plate of the crystallizer, the milling cutter uses a CBN cubic boron nitride insert for climb milling and reserves a grinding allowance of 0.05mm to achieve a surface flatness of less than 0.03mm for the copper plate of the crystallizer.

[0015] In an optional embodiment, when polishing the surface of the initial copper plate of the crystallizer, the initial copper plate of the crystallizer and the positioning fixture are hoisted onto a CNC gantry grinding machine, and a chromium corundum grinding wheel is used for reciprocating grinding with a grinding depth of 0.01 mm until the surface roughness of the initial copper plate of the crystallizer is less than 0.8 μm and the surface flatness is less than <0.01 mm.

[0016] In an optional embodiment, after the chromium corundum grinding wheel completes the grinding, a diamond abrasive belt is replaced for fine polishing until the surface roughness of the initial copper plate of the crystallizer is less than 0.4 μm and the surface flatness is less than <0.01 mm.

[0017] Compared with the prior art, the advantages of this application are: The processing method in this application is applied to the processing of a copper plate coating for a flame-coated crystallizer. The processing method includes: taking a copper plate from the crystallizer and performing a supersonic melting operation to obtain a preliminary copper plate product; installing the preliminary copper plate product onto a positioning fixture; performing surface grinding on the preliminary copper plate product until the required surface roughness of the coating is achieved; and performing surface polishing on the preliminary copper plate product until the required surface roughness of the coating is achieved, thus completing the processing.

[0018] During processing, the initial copper plate of the crystallizer is firmly fixed by positioning fixtures to ensure the stability of the workpiece posture during processing and avoid processing errors caused by vibration or displacement. In the surface grinding stage, the grinding tool (such as a grinding wheel) rotates at high speed and feeds relative to the copper plate surface. The cutting action of the abrasive grains removes macroscopic unevenness and excess coating from the coating surface, quickly controlling the surface roughness within the expected range. By reasonably selecting grinding parameters (such as rotation speed and feed rate), this stage can ensure removal efficiency while laying a good flatness foundation for subsequent polishing. Entering the surface polishing stage, the polishing tool (such as a grinding head) contacts the coating surface with a higher linear speed and finer abrasive. Through the micro-cutting, squeezing, and sliding action of the abrasive grains, the fine traces left by the grinding process are further eliminated, and the microscopic protrusions on the coating surface are effectively smoothed, thereby significantly reducing roughness.

[0019] The application of positioning fixtures ensures the stability of the copper plate during processing, avoiding surface accuracy deviations caused by unstable workpiece fixation in traditional processing. The combination of grinding and polishing utilizes the efficient removal capability of grinding to quickly meet basic roughness requirements, while polishing achieves higher surface finish through fine processing, significantly improving processing efficiency. It can stably obtain coating surfaces that meet process requirements, with significantly improved processing efficiency, fully meeting the stringent standards for manufacturing and repairing wide-face copper plates in crystallizers, providing reliable component support for high-speed continuous casting production. It offers significant advantages in addressing the processing challenges of flame-coated crystallizer copper plate coatings, effectively solving the problem of balancing processing efficiency and surface quality in existing technologies, achieving a synergistic improvement in coating surface quality and processing efficiency, and fully adapting to the manufacturing and repair needs of crystallizer copper plates (especially wide-face copper plates). Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic flowchart illustrating the processing method provided in an embodiment of this application; Figure 2 This is a schematic diagram of surface grinding processing provided in an embodiment of this application; Figure 3 This is a schematic diagram of the surface polishing process provided in the embodiments of this application; In the diagram: 100, positioning fixture; 200, initial copper plate for crystallizer; 301, milling cutter; 302, grinding wheel. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that the description of these embodiments is intended to aid in understanding the invention, but does not constitute a limitation thereof. The specific structural and functional details disclosed herein are merely for describing exemplary embodiments of the invention. However, the invention can be embodied in many alternative forms and should not be construed as being limited to the embodiments described herein.

[0023] Figure 1 A schematic flowchart illustrating the processing method provided in an embodiment of this application; Figure 2 This is a schematic diagram of surface grinding processing provided in an embodiment of this application; Figure 3 This is a schematic diagram of the surface polishing process provided in the embodiments of this application.

[0024] like Figure 1 , Figure 2 as well as Figure 3 As shown, a processing method for coating copper plates used in flame-coated crystallizers, in some embodiments, includes: The copper plate from the crystallizer was subjected to a supersonic coating process to obtain 200 initial copper plates from the crystallizer. Install the initial copper plate 200 of the crystallizer onto the positioning fixture 100; The initial copper plate 200 of the crystallizer is subjected to surface grinding until the required surface roughness of the coating is achieved. The initial copper plate 200 of the crystallizer is polished until the required surface roughness of the coating is achieved, thus completing the processing.

[0025] This processing method for flame-coating copper plates in crystallizers, through a phased and refined process design, can efficiently process high-hardness coatings after supersonic flame coating, balancing processing quality and production efficiency. It is particularly suitable for the mass production and repair of wide-faced crystallizer copper plates. In specific implementation, a crystallizer copper plate substrate conforming to the specified dimensions is first selected. A supersonic flame coating device is then used for coating preparation. During the coating process, kerosene can be used as fuel and oxygen as the combustion-supporting gas. Tungsten carbide-based powder or nickel-based alloy powder is sprayed onto the copper plate surface at high speed to form a coating, resulting in a preliminary crystallizer copper plate 200. Subsequently, the preliminary copper plate is installed onto a positioning fixture 100. This fixture can have a structure with adjustable support components and a pneumatic clamping device. The pneumatic clamping force ensures stable fixation of the workpiece, avoiding surface quality defects caused by vibration during processing.

[0026] Entering the surface grinding stage, the abrasive grains cut the coating surface to quickly remove macroscopic defects such as protrusions and bubbles generated during the coating process, and initially control the surface roughness within the required range. After grinding, the process moves to the surface polishing process, where the abrasive grains perform micro-cutting, extrusion and sliding action on the coating surface to further eliminate grinding textures, so that the surface roughness finally reaches the high precision requirements and meets the lubrication and heat transfer requirements when the copper plate of the crystallizer comes into contact with the casting billet.

[0027] Furthermore, to adapt to the processing requirements of copper plates of different specifications, the support components of the positioning fixture 100 can be designed as a modular structure, allowing for rapid adjustment of the support height by replacing shims of different thicknesses. During the grinding and polishing processes, the CNC system can preset processing paths and parameters to achieve continuous automated processing of multiple copper plates, effectively increasing the output per unit time. This processing method ensures datum accuracy through fixture positioning, achieves precise surface quality control through progressive grinding and polishing, and integrates automation technology to improve efficiency. It comprehensively solves the problem of balancing quality and efficiency in high-hardness coating processing, providing a stable crystallizer component guarantee for high-speed continuous casting production lines.

[0028] In an optional embodiment, the processing method of this application is applied to the processing of a copper plate coating for a flame-coated crystallizer. The processing method includes: taking a copper plate from the crystallizer and performing a supersonic melting operation to obtain a preliminary copper plate 200; installing the preliminary copper plate 200 onto a positioning fixture 100; performing surface grinding on the preliminary copper plate 200 until the required surface roughness of the coating is achieved; and performing surface polishing on the preliminary copper plate 200 until the required surface roughness of the coating is achieved, thus completing the processing.

[0029] During processing, the initial copper plate 200 of the crystallizer is firmly fixed by the positioning fixture 100 to ensure the stability of the workpiece posture during processing and avoid processing errors caused by vibration or displacement. In the surface grinding stage, the grinding tool (such as the grinding wheel 302) rotates at high speed and feeds relative to the copper plate surface. The cutting action of the abrasive grains removes macroscopic unevenness and excess coating from the coating surface, quickly controlling the surface roughness within the expected range. In this stage, by reasonably selecting grinding parameters (such as rotation speed and feed rate), a good flatness foundation can be laid for subsequent polishing while ensuring removal efficiency. Entering the surface polishing stage, the polishing tool (such as the grinding head) contacts the coating surface with a higher linear speed and finer abrasive. Through the micro-cutting, squeezing, and sliding action of the abrasive grains, the fine traces left by the grinding process are further eliminated, and the microscopic protrusions on the coating surface are effectively smoothed, thereby significantly reducing the roughness.

[0030] The application of the positioning fixture 100 ensures the stability of the copper plate during processing, avoiding surface accuracy deviations caused by unstable workpiece fixation in traditional processing. The combination of grinding and polishing utilizes the efficient removal capability of grinding to quickly meet basic roughness requirements, while polishing achieves higher surface finish through fine processing, significantly improving processing efficiency. It can stably obtain coating surfaces that meet process requirements, with significantly improved processing efficiency, fully meeting the stringent standards for manufacturing and repairing wide-face copper plates in crystallizers, providing reliable component support for high-speed continuous casting production. It offers significant advantages in addressing the processing challenges of flame-coated crystallizer copper plate coatings, effectively solving the problem of balancing processing efficiency and surface quality in existing technologies, achieving a synergistic improvement in coating surface quality and processing efficiency, and fully adapting to the manufacturing and repair needs of crystallizer copper plates (especially wide-face copper plates).

[0031] In an optional embodiment, after obtaining the initial copper plate 200 of the crystallizer, the initial copper plate 200 of the crystallizer is leveled.

[0032] Due to the difference in thermal expansion coefficients between the coating and the copper substrate during supersonic flame coating, slight warping (typically within the range of 4-7 mm) is likely to occur after cooling. Directly proceeding to subsequent processing steps will result in uneven coating thickness distribution. Leveling should be performed after the initial copper plate has naturally cooled to room temperature (20-25℃), at which point the material stress is stable, preventing secondary deformation after leveling. Before leveling, a laser profilometer can be used to scan the copper plate surface to obtain three-dimensional deformation data, providing a basis for setting leveling parameters and ensuring a targeted leveling process.

[0033] In an optional embodiment, the initial copper plate 200 of the crystallizer is leveled using a gantry leveling machine until the surface flatness of the initial copper plate 200 of the crystallizer is less than 0.5 mm.

[0034] This gantry-type leveling machine is equipped with two rows of leveling rollers and uses a hydraulic drive. The leveling process is divided into two stages: pre-leveling and fine leveling. In the pre-leveling stage, a pressure of 10-15 MPa is used to counteract the macroscopic deformation of the copper plate through the reverse bending of the roller system. In the fine leveling stage, the pressure is reduced to 5-8 MPa for reciprocating leveling. After each reciprocating motion, the flatness is checked with a leveling device until it reaches below 0.5 mm. For local high-stress areas (such as coating overlaps), precise leveling can be achieved by individually controlling the pressure of the corresponding roller group, avoiding over-leveling that could lead to coating cracking.

[0035] In an optional embodiment, when the crystallizer copper plate 200 is installed onto the positioning fixture 100, the crystallizer copper plate 200 is mounted onto the positioning fixture 100 by a plurality of bolts.

[0036] High-strength bolts can be used, arranged in a matrix along the long and short edges of the copper plate in the crystallizer to ensure uniform stress on the copper plate. Elastic washers can be installed between the bolts and the copper plate to prevent indentations in the coating when the bolts are tightened, and to compensate for minor flatness errors in the copper plate through the elasticity of the washers. During installation, pre-tighten all bolts to prevent warping of the copper plate due to unilateral stress.

[0037] In an optional embodiment, when installing the crystallizer copper plate prototype 200 onto the positioning fixture 100, multiple bolts are adjusted until the gap between the water tank surface of the crystallizer copper plate prototype 200 and the surface of the positioning fixture 100 is less than 0.05mm.

[0038] As the core cooling area of ​​the copper plate in the crystallizer, the fit between the water tank surface and the tooling directly affects the stability of heat conduction during processing. During adjustment, feeler gauges are used to check point by point from the four corners of the water tank surface towards the center. First, all bolts are loosened, and then the bolts are finely adjusted to gradually bring the areas with excessive gaps into contact through the tension of the bolts, ultimately ensuring that the gap deviation of the entire water tank surface is controlled within the range of 0-0.05mm.

[0039] In an optional embodiment, the surface grinding of the initial copper plate 200 of the crystallizer is performed by a CNC gantry milling machine, and the surface polishing of the initial copper plate 200 of the crystallizer is performed by a CNC gantry grinding machine.

[0040] The CNC gantry milling machine features a solid cast iron bed, efficiently removing macroscopic unevenness from the coating surface; while the CNC gantry grinder is equipped with high-precision hydrostatic guideways, enabling micron-level polishing control to meet the stringent surface finish requirements of the crystallizer copper plates. The processes of both are seamlessly integrated using the same positioning fixture 100, avoiding positioning errors caused by secondary clamping.

[0041] In an optional embodiment, when grinding the surface of the initial copper plate 200 of the crystallizer, the initial copper plate 200 of the crystallizer, together with the positioning fixture 100, is placed flat on the CNC gantry milling machine table, and the positioning fixture 100 is straightened, leveled and clamped.

[0042] The straightening operation uses a dial indicator attached to the gantry milling beam, with the indicator head touching the long edge of the fixture. The worktable is moved to control the dial indicator pointer swing within a preset range, ensuring that the fixture is parallel to the worktable's feed direction. Leveling is achieved by adjusting the leveling bolts under the worktable to control the horizontal error of the fixture surface reasonably. The clamping operation uses a hydraulic clamping device to firmly fix the fixture to the worktable. After clamping, the flatness of the fixture is checked again to ensure that there is no deformation caused by excessive clamping force.

[0043] In an optional embodiment, when grinding and polishing the surface of the initial copper plate 200 of the crystallizer, the milling cutter 301 uses a CBN cubic boron nitride insert for climb milling and reserves a grinding allowance of 0.05mm to achieve a surface flatness of less than 0.03mm for the copper plate of the crystallizer.

[0044] The CBN inserts are made of integral polycrystalline cubic boron nitride, which effectively reduces cutting resistance to high-hardness coatings and minimizes tearing of the coating surface. During climb milling, the 301 milling cutter rotates in the same direction as the table feed, and the cutting force is directed inwards towards the workpiece to avoid upward lifting forces that could cause workpiece vibration. A 0.05mm grinding allowance is provided to offset minor deformation during subsequent polishing and to ensure that the final machined surface completely covers the coating area, preventing exposure of the copper substrate. After machining, a laser interferometer is used to check the flatness, ensuring that the flatness of all points is less than 0.03mm.

[0045] In an optional embodiment, when polishing the surface of the initial copper plate 200 of the crystallizer, the initial copper plate 200 and the positioning fixture 100 are hoisted onto a CNC gantry grinder, and a chromium corundum grinding wheel 302 is used for reciprocating grinding with a grinding depth of 0.01 mm until the surface roughness of the initial copper plate 200 of the crystallizer is less than 0.8 μm and the surface flatness is less than 0.01 mm.

[0046] Specialized balancing equipment is used during the hoisting process. Adjusting the lifting points helps prevent bending deformation due to gravity. The chromium corundum grinding wheel 302 operates in a zigzag trajectory during reciprocating grinding. After each pass, the wheel 302 is automatically dressed to ensure its surface sharpness. The grinding depth is set to 0.01mm to achieve minute removal of the coating, avoiding surface burns caused by excessive grinding. Grinding with the chromium corundum grinding wheel 302 stops when the surface roughness gauge shows a stable reading below 0.8μm, and the laser flatness meter detects that the flatness of all points is no greater than 0.01mm.

[0047] In an optional embodiment, after the chromium corundum grinding wheel 302 has completed grinding, a diamond abrasive belt is replaced for fine polishing until the surface roughness of the initial copper plate 200 of the crystallizer is less than 0.4 μm and the surface flatness is less than 0.01 mm.

[0048] The flexible contact between the diamond abrasive belt and the coating surface achieves the removal of microscopic protrusions. To avoid over-polishing of the edges, a white light interferometer is used to inspect the surface morphology during the fine polishing process. The entire polishing process is completed when the arithmetic mean deviation of the surface profile is less than 0.4 μm and the flatness remains below 0.01 mm. The finely polished surface can be observed under a scanning electron microscope, showing no microcracks inside the coating and a uniform mirror-like gloss, fully meeting the surface quality requirements of high-speed continuous casting for the crystallizer copper plate.

[0049] It should be understood that the terms "first," "second," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance. Although the terms "first," "second," etc., may be used herein to describe various units, these units should not be limited by these terms. These terms are only used to distinguish one unit from another. For example, a first unit may be referred to as a second unit, and similarly, a second unit may be referred to as a first unit, without departing from the scope of the exemplary embodiments of the invention.

[0050] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist simultaneously. The term " / and" in this article describes another relationship between related objects, indicating that two relationships can exist. For example, A / and B can mean: A exists alone, and A and B exist alone. In addition, the character " / " in this article generally indicates that the related objects before and after it are in an "or" relationship.

[0051] It should be understood that in the description of this invention, the terms "upper," "vertical," "inner," "outer," etc., indicate the orientation or positional relationship as commonly placed when the disclosed product is used, or the orientation or positional relationship commonly understood by those skilled in the art. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0052] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," and "connect" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0053] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments of the invention. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” “containing,” and / or “including” as used herein specify the presence of the stated features, integers, steps, operations, units, and / or components, and do not exclude the presence or addition of one or more other features, quantities, steps, operations, units, components, and / or combinations thereof.

[0054] Specific details are provided in the following description to provide a complete understanding of the exemplary embodiments. However, those skilled in the art will understand that the exemplary embodiments can be implemented without these specific details. In other embodiments, well-known processes, structures, and techniques may be omitted in the depiction of non-essential details to avoid obscuring the exemplary embodiments.

[0055] The above are merely specific embodiments of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

[0056] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art.

Claims

1. A processing method for coating copper plates used in flame-coated crystallizers, characterized in that, The processing method includes: The copper plate from the crystallizer is subjected to a supersonic coating process to obtain the initial product of the copper plate from the crystallizer. Install the initial copper plate of the crystallizer onto the positioning fixture; The initial copper plate of the crystallizer is subjected to surface grinding until the required surface roughness of the coating is achieved. The initial copper plate of the crystallizer is subjected to surface polishing until the required surface roughness of the coating is achieved, thus completing the processing.

2. The processing method for applying a coating to a copper plate in a flame-coated crystallizer as described in claim 1, characterized in that: After obtaining the initial product of the crystallizer copper plate, the initial product of the crystallizer copper plate is leveled.

3. The processing method for applying a coating to a copper plate in a flame-coated crystallizer as described in claim 2, characterized in that: When leveling the initial copper plate of the crystallizer, a gantry leveling machine is used to perform the leveling process until the surface flatness of the initial copper plate of the crystallizer is less than 0.5 mm.

4. The processing method for applying a coating to a copper plate in a flame-coated crystallizer as described in claim 1, characterized in that: When installing the initial copper plate of the crystallizer onto the positioning fixture, the initial copper plate of the crystallizer is installed onto the positioning fixture by multiple bolts.

5. The processing method for applying a coating to a copper plate in a flame-coated crystallizer as described in claim 4, characterized in that: When installing the initial copper plate of the crystallizer onto the positioning fixture, adjust multiple bolts until the gap between the water tank surface of the initial copper plate of the crystallizer and the surface of the positioning fixture is less than 0.05mm.

6. The processing method for applying a coating to a copper plate in a flame-coated crystallizer as described in claim 1, characterized in that: The surface grinding of the initial copper plate of the crystallizer is performed by a CNC gantry milling machine, and the surface polishing of the initial copper plate of the crystallizer is performed by a CNC gantry grinding machine.

7. The processing method for applying a coating to a copper plate in a flame-coated crystallizer as described in claim 6, characterized in that: When grinding the surface of the initial copper plate of the crystallizer, the initial copper plate of the crystallizer together with the positioning fixture is placed flat on the CNC gantry milling machine table, and the positioning fixture is straightened, leveled and clamped.

8. The processing method for applying a coating to a copper plate in a flame-coated crystallizer as described in claim 6, characterized in that: When grinding and polishing the surface of the initial copper plate of the crystallizer, the milling cutter uses CBN cubic boron nitride inserts for climb milling and leaves a grinding allowance of 0.05mm to achieve a surface flatness of less than 0.03mm for the copper plate of the crystallizer.

9. The processing method for applying a coating to a copper plate in a flame-coated crystallizer as described in claim 6, characterized in that: During the surface polishing of the initial copper plate of the crystallizer, the initial copper plate of the crystallizer and the positioning fixture are hoisted onto a CNC gantry grinder and a chromium corundum grinding wheel is used for reciprocating grinding with a grinding depth of 0.01 mm until the surface roughness of the initial copper plate of the crystallizer is less than 0.8 μm and the surface flatness is less than 0.01 mm.

10. The processing method for applying a coating to a copper plate in a flame-coated crystallizer as described in claim 9, characterized in that: After the chromium corundum grinding wheel completes the grinding, the diamond abrasive belt is replaced for fine polishing until the surface roughness of the initial copper plate of the crystallizer is less than 0.4 μm and the surface flatness is less than 0.01 mm.

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