Plate beating optimization device and method of automatic plate putting machine

Abstract

The invention discloses a board beating optimization device of an automatic board putting machine, and the device comprises a positioning assembly which is installed at the bottom of an installation plate and is used for positioning the position of a PCB; the putting mechanism is mounted at the inner top of the frame body and is used for putting the positioned PCBs; through the design of structures such as the positioning assembly and the putting mechanism, the position of the PCB before putting is positioned through the positioning assembly, so that the position of the PCB can be centered, the situation that the subsequent putting accuracy is affected due to the deviation of the PCB is prevented, the PCB can be put on the conveying equipment after being taken through the putting mechanism, the position of the PCB put on the conveying equipment can be dynamically adjusted, and the accuracy of subsequent putting is improved. The feeding position of the PCB each time is not fixed, the contact area of the board edge and the polish-brush can be dispersed at the feeding position of the PCB, the contact area is dispersed, the local abrasion rate of the polish-brush is reduced, strip-shaped abrasion is avoided, the board surface quality is improved, the replacement frequency of the polish-brush is reduced, the production cost is reduced, and meanwhile the service life of the polish-brush is prolonged.

Description

Technical Field

[0001] This invention belongs to the field of PCB manufacturing equipment technology, and more specifically, it relates to an optimization device and method for automatic board feeding machines. Background Technology

[0002] In PCB manufacturing, the board placement machine is a crucial piece of equipment, primarily replacing manual board placement. Traditional board placement methods typically include three modes: "left-right-center," "center," and "left-right." This involves a robotic arm placing the board and then using a board placement device to adjust it to a preset position. However, due to the significant differences in board dimensions, fixing the placement position presents the following problems: 1. Fixed-position placement leads to brush wear: Due to the differences in PCB board size, the traditional method of placing the board in a fixed position each time causes the board edge to always be in contact with and wear the brush in the same position. For example, when the PCB board width is different, after placement, the board edge is always pressed against the same horizontal area of ​​the brush, causing the bristles in that area to be continuously deformed and broken due to continuous stress. The damaged brush cannot polish the board surface evenly, resulting in uneven scratches and a rough copper surface, which affects the accuracy of subsequent processes such as electroplating and circuit etching, affects the quality of the PCB board surface, and significantly shortens the service life of the brush.

[0003] 2. Production efficiency and scratch risk issues: The traditional board-tapping method requires the board to be placed by the robotic arm of the board feeding machine, and then the board tapping device taps the board to the designated position. During the contact between the board tapping device and the PCB board, vibration or friction can easily cause scratches on the board surface. Therefore, we need to provide an optimized board-tapping device and method for an automatic board feeding machine. Summary of the Invention

[0004] The purpose of this invention is to solve the shortcomings of existing technologies, such as the PCB board edge always being fixed in the same position of the grinding brush for contact and wear, resulting in the grinding brush being damaged and unable to evenly grind the board surface, and the board surface being scratched due to vibration or friction during the contact between the board applicator and the PCB board. Therefore, this invention proposes an optimized board applicator device and method for an automatic board delivery machine.

[0005] To achieve the above objectives, the present invention provides the following technical solution: An optimization device for an automatic PCB dispensing machine includes: a frame, in which a lifting cylinder is fixedly installed, and a placement plate is fixedly installed at the telescopic end of the lifting cylinder; a mounting plate, fixedly installed on the inner wall of the frame and located directly above the placement plate, with a mounting frame fixedly connected to the bottom of the mounting plate; a positioning component, installed at the bottom of the mounting plate, for positioning the PCB board; and a dispensing mechanism, installed at the inner top of the frame, for dispensing the positioned PCB board.

[0006] Preferably, the positioning assembly includes a first positioning mechanism and a second positioning mechanism. The first positioning mechanism includes a first adjusting cylinder, a first rack, a connecting plate, a push plate, a first positioning plate, a second rack, a second positioning plate, and a transmission gear. The first adjusting cylinder is fixedly installed at the bottom of the mounting plate, the first rack is fixedly installed at one end of the connecting plate, the push plate is fixedly installed at the other end of the connecting plate, the telescopic end of the first adjusting cylinder is fixedly installed on the first rack, and the first positioning plate is fixedly installed at the end of the push plate.

[0007] Preferably, the second positioning plate is fixedly installed at the end of the second rack, and the transmission gear is movably installed at the bottom of the mounting plate, with both the first rack and the second rack meshing with the transmission gear.

[0008] Preferably, the second positioning mechanism includes a second adjusting cylinder and a third positioning plate. Both the second adjusting cylinder and the third positioning plate are provided in two sets. The two sets of second adjusting cylinders are symmetrically fixedly installed on the side of the mounting frame, and the third positioning plate is fixedly installed on the side of the second adjusting cylinder.

[0009] Preferably, the mounting frame has a second clearance groove on multiple sides, the first positioning plate, the second positioning plate, and the third positioning plate are all disposed in the second clearance groove, and the placement plate has multiple sets of first clearance grooves corresponding to the third positioning plate, the first positioning plate, and the second positioning plate on multiple sides.

[0010] Preferably, the first positioning mechanism further includes a first guide rail, a first slider, a second guide rail, and a second slider. The first guide rail is fixedly installed at the bottom of the mounting plate. The connecting plate is provided with two sets of first sliders, which are symmetrically fixedly installed at the top of the connecting plate. The first sliders are slidably installed on the first guide rail. The second guide rail and the second slider are each provided with two sets. The two sets of second guide rails are symmetrically fixedly installed at the bottom of the mounting plate, and the two sets of second guide rails are distributed on both sides of the mounting frame. One set of second sliders is fixedly installed at the top of the push plate, and the other set of second sliders is fixedly installed at the top of the second rack. The second sliders are slidably installed on the second guide rail.

[0011] Preferably, the delivery mechanism includes a first electric slide, a fixed plate, a second electric slide, a cylinder frame, a push cylinder, a lifting plate, a connecting pipe, and a vacuum suction cup. The first electric slide is fixedly installed on the inner top of the frame, the fixed plate is fixedly installed on the slider of the first electric slide, the second electric slide is fixedly installed on the bottom of the fixed plate, the cylinder frame is fixedly installed on the slider of the fixed plate, the push cylinder is fixedly installed inside the cylinder frame, the lifting plate is fixedly installed on the telescopic end of the push cylinder, the connecting pipe is fixedly installed on the bottom of the lifting plate, and the vacuum suction cup is connected to the connecting pipe.

[0012] Preferably, two sets of support plates are symmetrically fixedly installed on the side of the frame, a third guide rail is fixedly installed at the bottom of the two sets of support plates, a third slider is fixedly installed at the top of the fixed plate, and the third slider is slidably installed on the third guide rail.

[0013] Preferably, the side of the frame is provided with a conveying device for conveying PCB boards.

[0014] A method for optimizing the clapping mechanism of an automatic clapping machine includes the following steps: Step 1: Place the PCB board on top of the placement board, activate the lifting cylinder, and push the extension end of the lifting cylinder against the placement board to move the PCB board on top of the placement board into the mounting frame. Step 2: Activate the first adjusting cylinder. The retraction end of the first adjusting cylinder retracts, causing the first rack to move. When the first rack moves, it can drive the transmission gear to drive the second rack to move. When the connecting plate and the second rack move simultaneously, they can push the first positioning plate and the second positioning plate to position the PCB board and prevent the PCB board from shifting. Step 3: After the PCB board is positioned, the second adjusting cylinder is activated. The telescopic end of the second adjusting cylinder pushes the third positioning plate, allowing the third positioning plate to reposition the PCB board and center its position. This prevents the PCB board from shifting and affecting the accuracy of subsequent placement. After the PCB board is positioned, the first and second adjusting cylinders are activated. The telescopic end of the first adjusting cylinder extends and pushes the first rack, causing the transmission gear to drive the second rack to move, moving the second and first positioning plates away from the PCB board. The telescopic end of the second adjusting cylinder retracts, causing the third positioning plate to move away from the PCB board. Step 4: Activate the push cylinder to push the extension end of the cylinder against the lifting plate, so that the lifting plate moves the vacuum suction cup close to the PCB board. Then, the vacuum equipment evacuates the connecting tube, so that the vacuum suction cup can be attached to and fixed to the PCB board. Activate the push cylinder to retract the extension end of the cylinder, so that the lifting plate and the attached PCB board are away from the mounting plate. Step 5: Start the first and second electric slides, adjust the position of the PCB board according to the set program, align one side of the PCB board with the side of the brush, start the push cylinder, place the PCB board on the conveying equipment for conveying, and drive the push cylinder to reset through the first and second electric slides, so that the vacuum suction cup can return to the top of the placement board again. At this time, the placement of the PCB board is completed. Step 6: Repeat steps 3-5. After placing the second and Nth PCB boards at the set staggered intervals on the other side of the grinding brush, repeat the above actions from the other side of the grinding brush to this side, first from right to left, then from left to right, repeating the cycle. This makes the position of the PCB board on the PCB board not fixed each time, so that the placement position of the PCB board can disperse the contact area between the board edge and the grinding brush, disperse the contact area, reduce the local wear rate of the grinding brush, avoid strip wear, improve the board surface quality, reduce the frequency of grinding brush replacement, reduce production costs, and extend the life of the grinding brush. The PCB board is then conveyed by the conveying equipment to the PCB board surface treatment and grinding equipment for board surface grinding.

[0015] Technical effects and advantages of the present invention: The automatic dispensing plate optimization device and method provided by the present invention have the following advantages compared with the prior art: This invention, through the design of positioning components and delivery mechanisms, uses positioning components to locate the PCB board before delivery, ensuring the PCB board is centered and preventing it from shifting and affecting subsequent delivery accuracy. The delivery mechanism picks up the PCB board and places it onto the conveying equipment, and can dynamically adjust the position on the conveying equipment, so that the PCB board's delivery position is not fixed each time. This disperses the contact area between the board edge and the grinding brush, reducing the local wear rate of the grinding brush, avoiding strip wear, improving board surface quality, reducing the frequency of grinding brush replacement, lowering production costs, and extending the grinding brush life. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the frame structure of the present invention; Figure 3 This is a schematic diagram of the dispensing mechanism of the present invention; Figure 4 This is a schematic diagram of the mounting plate, mounting frame, and positioning components of the present invention; Figure 5 This is a schematic diagram of the positioning component structure of the present invention; Figure 6 This is a schematic diagram of the structure when the present invention is in use.

[0017] In the diagram: 1. Frame; 2. Lifting cylinder; 3. Placement plate; 4. First clearance groove; 5. Mounting plate; 6. Mounting frame; 7. Positioning assembly; 701. First adjusting cylinder; 702. First rack; 703. Connecting plate; 704. First guide rail; 705. First slider; 706. Push plate; 707. First positioning plate; 708. Second guide rail; 709. Second slider; 710. Second rack; 711. Second positioning plate; 712. Second adjusting cylinder; 713. Third positioning plate; 714. Transmission gear; 8. Second clearance groove; 9. Conveying equipment; 10. PCB board; 11. First electric slide; 12. Third guide rail; 13. Third slider; 14. Fixing plate; 15. Second electric slide; 16. Support plate; 17. Cylinder frame; 18. Push cylinder; 19. Lifting plate; 20. Connecting pipe; 21. Vacuum suction cup; 22. Industrial camera. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention.

[0019] This invention provides, for example Figure 1-6 The automatic PCB delivery machine's PCB optimization device includes: a frame 1, inside which a lifting cylinder 2 is fixedly installed, and a placement plate 3 is fixedly installed at the telescopic end of the lifting cylinder 2; a mounting plate 5, fixedly installed on the inner wall of the frame 1, and the mounting plate 5 is located directly above the placement plate 3, and a mounting frame 6 is fixedly connected to the bottom of the mounting plate 5; a positioning component 7, installed at the bottom of the mounting plate 5, for positioning the PCB board; and a delivery mechanism, installed at the inner top of the frame 1, for delivering the positioned PCB board.

[0020] It should be noted that the lifting cylinder 2 can push the placement plate 3 to feed the PCB board 10, so that the PCB board 10 can enter the mounting frame 6. The positioning component 7 centers the PCB board 10 to prevent the PCB board from shifting and affecting the accuracy of subsequent placement.

[0021] In an optional embodiment: such as Figures 4 to 5As shown, the positioning assembly 7 includes a first positioning mechanism and a second positioning mechanism. The first positioning mechanism includes a first adjusting cylinder 701, a first rack 702, a connecting plate 703, a push plate 706, a first positioning plate 707, a second rack 710, a second positioning plate 711, and a transmission gear 714. The first adjusting cylinder 701 is fixedly installed on the bottom of the mounting plate 5, the first rack 702 is fixedly installed on one end of the connecting plate 703, the push plate 706 is fixedly installed on the other end of the connecting plate 703, the telescopic end of the first adjusting cylinder 701 is fixedly installed on the first rack 702, and the first positioning plate 707 is fixedly installed on the end of the push plate 706. The second positioning plate 711 is fixedly installed at the end of the second rack 710, and the transmission gear 714 is movably installed at the bottom of the mounting plate 5. Both the first rack 702 and the second rack 710 mesh with the transmission gear 714.

[0022] It should be noted that, through the cooperation of the first adjusting cylinder 701, the first rack 702, the connecting plate 703, the push plate 706, the first positioning plate 707, the second rack 710, the second positioning plate 711 and the transmission gear 714, the first positioning plate 707 and the second positioning plate 711 are driven to approach the PCB board 10, and the PCB board 10 placed on the top of the placement plate 3 is positioned once.

[0023] In an optional embodiment: such as Figure 5 As shown, the second positioning mechanism includes a second adjusting cylinder 712 and a third positioning plate 713. Both the second adjusting cylinder 712 and the third positioning plate 713 are provided in two sets. The two sets of second adjusting cylinders 712 are symmetrically fixedly installed on the side of the mounting frame 6, and the third positioning plate 713 is fixedly installed on the side of the second adjusting cylinder 712.

[0024] It should be noted that by cooperating with the second adjusting cylinder 712 and the third positioning plate 713, the PCB board 10 placed on the top of the placement plate 3 can be positioned twice. By positioning the PCB board 10 before it is placed, the position of the PCB board 10 can be centered, preventing the PCB board 10 from shifting and affecting the accuracy of subsequent placement.

[0025] In an optional embodiment: such as Figures 4 to 5 As shown, the mounting frame 6 has multiple sides with second clearance grooves 8. The first positioning plate 707, the second positioning plate 711, and the third positioning plate 713 are all set in the second clearance grooves 8. The placement plate 3 has multiple sides with multiple sets of first clearance grooves 4 corresponding to the third positioning plate 713, the first positioning plate 707, and the second positioning plate 711.

[0026] It should be noted that, by setting the second clearance groove 8, when not in use, the first positioning plate 707, the second positioning plate 711, and the third positioning plate 713 are placed in the second clearance groove 8 to prevent the PCB board 10, which has not been positioned, from contacting the mounting frame 6 when pushed into the mounting frame 6 by the lifting cylinder 2 in the event of displacement, which would cause the PCB board 10 to fall. When positioning the PCB board 10 on the placement plate 3, the first positioning plate 707, the second positioning plate 711, and the third positioning plate 713 move within the first clearance groove 4 to prevent affecting the positioning of the PCB board 10.

[0027] In an optional embodiment: such as Figure 5 As shown, the first positioning mechanism also includes a first guide rail 704, a first slider 705, a second guide rail 708, and a second slider 709. The first guide rail 704 is fixedly installed at the bottom of the mounting plate 5. The connecting plate 703 is provided with two sets of first sliders 705, which are symmetrically fixedly installed at the top of the connecting plate 703. The first sliders 705 are slidably installed on the first guide rail 704. The second guide rail 708 and the second slider 709 are each provided with two sets. The two sets of second guide rails 708 are symmetrically fixedly installed at the bottom of the mounting plate 5, and the two sets of second guide rails 708 are distributed on both sides of the mounting frame 6. One set of second sliders 709 is fixedly installed at the top of the push plate 706, and the other set of second sliders 709 is fixedly installed at the top of the second rack 710. The second sliders 709 are slidably installed on the second guide rail 708.

[0028] It should be noted that the first guide rail 704, the first slider 705, the second guide rail 708 and the second slider 709 cooperate to support and guide the connecting plate 703, the second rack 710 and the push plate 706, so that the connecting plate 703, the second rack 710 and the push plate 706 can move stably.

[0029] In an optional embodiment: such as Figures 2 to 3 As shown, the delivery mechanism includes a first electric slide 11, a fixed plate 14, a second electric slide 15, a cylinder frame 17, a push cylinder 18, a lifting plate 19, a connecting pipe 20, and a vacuum suction cup 21. The first electric slide 11 is fixedly installed on the inner top of the frame 1. The fixed plate 14 is fixedly installed on the slider of the first electric slide 11. The second electric slide 15 is fixedly installed on the bottom of the fixed plate 14. The cylinder frame 17 is fixedly installed on the slider of the fixed plate 14. The push cylinder 18 is fixedly installed inside the cylinder frame 17. The lifting plate 19 is fixedly installed on the telescopic end of the push cylinder 18. The connecting pipe 20 is fixedly installed on the bottom of the lifting plate 19. The vacuum suction cup 21 is connected to the connecting pipe 20.

[0030] It should be noted that the output shaft end of the vacuum equipment is connected to the vacuum hose, which is connected to the connecting pipe 20. By evacuating the connecting pipe 20 through the vacuum equipment, the vacuum suction cup 21 can be used to adsorb and fix the PCB board 10, so as to facilitate the handling of the PCB board 10. An industrial camera 22 is fixedly mounted on the bottom of the lifting plate 19. The lifting cylinder 2, the first adjusting cylinder 701, the second adjusting cylinder 712, the conveying device 9, the first electric slide 11, the second electric slide 15, the pushing cylinder 18, and the industrial camera 22 are all electrically connected to a programmable logic controller. The actual size of the PCB board 10 and the position reference of the conveying equipment can be captured in real time by the industrial camera 22+ image recognition algorithm. The correction signal is fed back to the programmable logic controller to further optimize the accuracy of the placement position. The programmable logic controller calculates the target position for each placement according to the preset algorithm (such as the "spacing shrinkage cycle" logic) and sends the action command to the actuator.

[0031] In an optional embodiment: such as Figures 2 to 3 As shown, two sets of support plates 16 are symmetrically fixedly installed on the side of the frame 1. A third guide rail 12 is fixedly installed at the bottom of the two sets of support plates 16. A third slider 13 is fixedly installed at the top of the fixed plate 14. The third slider 13 is slidably installed on the third guide rail 12.

[0032] It should be noted that the support plate 16 serves to install the third guide rail 12, and the third guide rail 12 cooperates with the third slider 13 to support and position the second electric slide 15, so that the first electric slide 11 can stably drive the second electric slide 15 to move.

[0033] In an optional embodiment: such as Figure 1 As shown, the side of the frame 1 is equipped with a conveying device 9 for conveying PCB boards.

[0034] It should be noted that the PCB board 10 is transported by the conveying device 9.

[0035] A method for optimizing the clapping mechanism of an automatic clapping machine includes the following steps: Step 1: Place the PCB board 10 on top of the placement plate 3, start the lifting cylinder 2, and push the extension end of the lifting cylinder 2 against the placement plate 3 to move the PCB board 10 on top of the placement plate 3 into the mounting frame 6. Step 2: Start the first adjusting cylinder 701. The retraction end of the first adjusting cylinder 701 retracts, driving the first rack 702 to move. When the first rack 702 moves, it can drive the transmission gear 714 to drive the second rack 710 to move. When the connecting plate 703 and the second rack 710 move at the same time, they can push the first positioning plate 707 and the second positioning plate 711 to position the PCB board 10 and prevent the PCB board 10 from shifting position. Step 3: After the PCB board 10 is positioned once, the second adjusting cylinder 712 is activated. The telescopic end of the second adjusting cylinder 712 pushes the third positioning plate 713, so that the third positioning plate 713 can reposition the PCB board 10, so that the PCB board 10 is centered and prevents the PCB board 10 from shifting and affecting the accuracy of subsequent placement. After the PCB board 10 is positioned, the first adjusting cylinder 701 and the second adjusting cylinder 712 are activated, so that the telescopic end of the first adjusting cylinder 701 extends and pushes the first rack 702, so that the transmission gear 714 drives the second rack 710 to move, so that the second positioning plate 711 and the first positioning plate 707 move away from the PCB board 10. The telescopic end of the second adjusting cylinder 712 retracts and drives the third positioning plate 713 away from the PCB board 10. Step 4: Start the push cylinder 18, push the telescopic end of the push cylinder 18 to push the lifting plate 19, so that the lifting plate 19 drives the vacuum suction cup 21 to approach the PCB board 10. Then, the vacuum equipment evacuates the connecting pipe 20, so that the vacuum suction cup 21 can be adsorbed and fixed on the PCB board 10. Start the push cylinder 18, push the telescopic end of the push cylinder 18 to retract, and drive the lifting plate 19 and the adsorbed PCB board 10 away from the mounting plate 5. Step 5: Start the first electric slide 11 and the second electric slide 15, adjust the position of the PCB board 10 according to the set program, align one side of the PCB board 10 with the side of the grinding brush, start the push cylinder 18, place the PCB board 10 on the conveying device 9 for conveying, and drive the push cylinder 18 to reset through the first electric slide 11 and the second electric slide 15, so that the vacuum suction cup 21 can return to the top of the placement plate 3 again. At this time, the placement of the PCB board 10 is completed. Step 6: Repeat steps 3-5. After placing the second and Nth PCB boards 10 at the set staggered intervals on the other side of the grinding brush (e.g., Figure 6(As shown), then repeat the above actions from the other side of the brush back, first from right to left, then from left to right, repeating the cycle so that the position of the PCB board 10 on the conveyor 9 is not fixed each time. This allows the placement position of the PCB board 10 to disperse the contact area between the board edge and the brush, disperse the contact area, reduce the local wear rate of the brush, avoid strip wear, improve the board surface quality, reduce the brush replacement frequency, reduce production costs, and extend the brush life. The PCB board 10 is conveyed by the conveyor 9 to the PCB board surface treatment and grinding equipment for board surface grinding.

[0036] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A clapping optimization device for an automatic clapping machine, characterized in that, include: The frame (1) has a lifting cylinder (2) fixedly installed inside it, and the extension end of the lifting cylinder (2) is fixedly installed with a placement plate (3). Mounting plate (5) is fixedly installed on the inner wall of frame (1), and mounting plate (5) is located directly above placement plate (3). Mounting frame (6) is fixedly connected to the bottom of mounting plate (5). The positioning component (7) is installed on the bottom of the mounting plate (5) and is used to position the PCB board. The delivery mechanism is installed on the inner top of the frame (1) and is used to deliver the positioned PCB board.

2. The automatic dispensing board optimization device for an automatic dispensing board machine according to claim 1, characterized in that: The positioning component (7) includes a first positioning mechanism and a second positioning mechanism. The first positioning mechanism includes a first adjusting cylinder (701), a first rack (702), a connecting plate (703), a push plate (706), a first positioning plate (707), a second rack (710), a second positioning plate (711), and a transmission gear (714). The first adjusting cylinder (701) is fixedly installed at the bottom of the mounting plate (5). The first rack (702) is fixedly installed at one end of the connecting plate (703). The push plate (706) is fixedly installed at the other end of the connecting plate (703). The telescopic end of the first adjusting cylinder (701) is fixedly installed on the first rack (702). The first positioning plate (707) is fixedly installed at the end of the push plate (706).

3. The automatic dispensing board optimization device for an automatic dispensing board machine according to claim 2, characterized in that: The second positioning plate (711) is fixedly installed at the end of the second rack (710), and the transmission gear (714) is movably installed at the bottom of the mounting plate (5). The first rack (702) and the second rack (710) are both meshed with the transmission gear (714).

4. The automatic dispensing board optimization device for a machine according to claim 2, characterized in that: The second positioning mechanism includes a second adjusting cylinder (712) and a third positioning plate (713). Both the second adjusting cylinder (712) and the third positioning plate (713) are provided in two sets. The two sets of second adjusting cylinders (712) are symmetrically fixedly installed on the side of the mounting frame (6). The third positioning plate (713) is fixedly installed on the side of the second adjusting cylinder (712).

5. The automatic dispensing plate optimization device for an automatic plate-dispensing machine according to claim 4, characterized in that: The mounting frame (6) has a second clearance groove (8) on multiple sides. The first positioning plate (707), the second positioning plate (711), and the third positioning plate (713) are all located in the second clearance groove (8). The placement plate (3) has multiple sets of first clearance grooves (4) on multiple sides corresponding to the third positioning plate (713), the first positioning plate (707), and the second positioning plate (711).

6. The automatic dispensing plate optimization device for a machine according to claim 4, characterized in that: The first positioning mechanism further includes a first guide rail (704), a first slider (705), a second guide rail (708), and a second slider (709). The first guide rail (704) is fixedly installed at the bottom of the mounting plate (5). The connecting plate (703) is provided with two sets of first sliders (705) symmetrically fixedly installed at the top of the connecting plate (703). The first sliders (705) are slidably installed on the first guide rail (704). The second guide rail (708) and the second slider (709) are each provided with two sets. The two sets of second guide rails (708) are symmetrically fixedly installed at the bottom of the mounting plate (5), and the two sets of second guide rails (708) are distributed on both sides of the mounting frame (6). One set of second sliders (709) is fixedly installed at the top of the push plate (706), and the other set of second sliders (709) is fixedly installed at the top of the second rack (710). The second sliders (709) are slidably installed on the second guide rail (708).

7. The automatic dispensing plate optimization device for an automatic plate-dispensing machine according to claim 1, characterized in that: The delivery mechanism includes a first electric slide (11), a fixed plate (14), a second electric slide (15), a cylinder frame (17), a push cylinder (18), a lifting plate (19), a connecting pipe (20), and a vacuum suction cup (21). The first electric slide (11) is fixedly installed on the inner top of the frame (1). The fixed plate (14) is fixedly installed on the slider of the first electric slide (11). The second electric slide (15) is fixedly installed on the bottom of the fixed plate (14). The cylinder frame (17) is fixedly installed on the slider of the fixed plate (14). The push cylinder (18) is fixedly installed inside the cylinder frame (17). The lifting plate (19) is fixedly installed on the telescopic end of the push cylinder (18). The connecting pipe (20) is fixedly installed on the bottom of the lifting plate (19). The vacuum suction cup (21) is connected to the connecting pipe (20).

8. The automatic dispensing board optimization device for a machine according to claim 7, characterized in that: The frame (1) has two sets of support plates (16) fixedly installed symmetrically on its side. The bottom of the two sets of support plates (16) is fixedly installed with a third guide rail (12). The top of the fixed plate (14) is fixedly installed with a third slider (13). The third slider (13) is slidably installed on the third guide rail (12).

9. The automatic dispensing plate optimization device for an automatic plate-dispensing machine according to claim 1, characterized in that: The side of the frame (1) is provided with a conveying device (9) for conveying PCB boards.

10. A method for optimizing the clapping mechanism of the automatic dispensing machine according to claim 1, characterized in that: Includes the following steps: Step 1: Place the PCB board (10) on top of the placement plate (3), start the lifting cylinder (2), and push the extension end of the lifting cylinder (2) against the placement plate (3) to move the PCB board (10) on top of the placement plate (3) into the mounting frame (6); Step 2: Start the first adjusting cylinder (701). The retraction end of the first adjusting cylinder (701) retracts, causing the first rack (702) to move. When the first rack (702) moves, it can drive the transmission gear (714) to drive the second rack (710) to move. When the connecting plate (703) and the second rack (710) move at the same time, they can push the first positioning plate (707) and the second positioning plate (711) to position the PCB board (10) and prevent the PCB board (10) from shifting position. Step 3: After the PCB board (10) is positioned once, the second adjusting cylinder (712) is activated. The extension end of the second adjusting cylinder (712) pushes the third positioning plate (713) so that the third positioning plate (713) can reposition the PCB board (10) so that the PCB board (10) can be centered and prevent the PCB board (10) from shifting and affecting the accuracy of subsequent placement. After the PCB board (10) is positioned, the first adjusting cylinder (701) and the second adjusting cylinder (712) are activated so that the extension end of the first adjusting cylinder (701) extends and pushes the first rack (702) so that the transmission gear (714) drives the second rack (710) to move, so that the second positioning plate (711) and the first positioning plate (707) move away from the PCB board (10). The extension end of the second adjusting cylinder (712) retracts and drives the third positioning plate (713) away from the PCB board (10). Step 4: Start the push cylinder (18), push the extension end of the push cylinder (18) to push the lifting plate (19), so that the lifting plate (19) drives the vacuum suction cup (21) to approach the PCB board (10). Then, the vacuum equipment evacuates the connecting pipe (20), so that the vacuum suction cup (21) can be adsorbed and fixed on the PCB board (10). Start the push cylinder (18), push the extension end of the push cylinder (18) to retract and drive the lifting plate (19) and the adsorbed PCB board (10) away from the mounting plate (5). Step 5: Start the first electric slide (11) and the second electric slide (15), adjust the position of the PCB board (10) according to the set program, align one side of the PCB board (10) with the side of the brush, start the push cylinder (18), place the PCB board (10) on the conveying device (9) for conveying, and drive the push cylinder (18) to reset through the first electric slide (11) and the second electric slide (15), so that the vacuum suction cup (21) can return to the top of the placement plate (3) again. At this time, the placement of the PCB board (10) is completed. Step 6: Repeat steps 3-5. After the second and Nth PCB boards (10) are placed on the other side of the grinding brush through the set staggered spacing, repeat the above actions from the other side of the grinding brush to this side of the grinding brush, first from right to left, then from left to right, repeating the cycle so that the position of the PCB board (10) on the PCB board (10) is not fixed each time, so that the placement position of the PCB board (10) can disperse the contact area between the board edge and the grinding brush, disperse the contact area, reduce the local wear rate of the grinding brush, avoid strip wear, improve the board surface quality, reduce the frequency of grinding brush replacement, reduce production costs, and extend the grinding brush life. The PCB board (10) is conveyed to the PCB board surface treatment grinding equipment through the conveying equipment (9) for board surface grinding.

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