Sealing buffer rubber, sealing buffer adhesive tape and preparation method

Abstract

The invention discloses a sealing buffer adhesive, a sealing buffer adhesive tape and a preparation method. The sealing buffer adhesive is prepared from the following raw materials in parts by weight: 100 parts of pressure-sensitive adhesive, 20-50 parts of rubber, 0.3-1.5 parts of expanded microspheres, 6-15 parts of tackifying resin and 0.1-3 parts of curing agent. The sealing and buffering adhesive tape comprises a first release layer, a first adhesive layer, a base material layer, a second adhesive layer and a second release layer which are sequentially stacked, wherein the first adhesive layer and the second adhesive layer are both formed by sealing and buffering adhesive. According to the adhesive tape, the sealing and buffering performance of the adhesive tape is improved by adding the expansion microspheres into the adhesive layer, meanwhile, the cohesive force of the adhesive layer is greatly improved, the overall bonding strength is improved, the viscoelasticity of the adhesive layer is improved, the buffering and sealing effects are further improved, and the high-temperature bonding force and the water resistance of the adhesive tape are further improved.

Description

Technical Field

[0001] This invention belongs to the field of adhesive materials technology, specifically relating to a sealing buffer adhesive, a sealing buffer tape, and a preparation method thereof. Background Technology

[0002] With technological advancements, electronic products are developing rapidly. Mobile phones and tablets have entered the era of full touchscreens, and smart wearable devices are becoming widely popular. Traditionally, the bezels of mobile phones and tablets are bonded using double-sided adhesive. However, the trend towards narrower bezel designs has created a contradiction between the increasingly narrow bonding area and the need for higher bonding strength. For example, traditional frame tapes often use foam substrates (such as acrylic and PE foam), which have low tear strength and are prone to cracking under DuPont impact or drop tests in narrow bezel designs, affecting sealing and mechanical performance.

[0003] To improve the cushioning properties of double-sided tape, existing technologies enhance cushioning performance by adding expanded microspheres to the adhesive layer. However, this approach has the following drawbacks: when the amount of expanded microspheres added is small, the cushioning effect is insufficient and cannot meet the requirements; when the amount of expanded microspheres added is large, the effective bonding area of ​​the adhesive layer after foaming decreases, leading to a decrease in bonding strength.

[0004] Therefore, how to further optimize the double-sided adhesive suitable for narrow bezel structures of electronic devices in response to the above-mentioned defects is an urgent problem to be solved. Summary of the Invention

[0005] The purpose of this invention is to provide a sealing buffer adhesive, a sealing buffer tape, and a preparation method thereof. The sealing buffer tape has excellent bonding strength, impact resistance, and cushioning performance.

[0006] To achieve the above objectives, a specific embodiment of the present invention provides the following technical solution:

[0007] A sealing and buffering adhesive, wherein the raw materials of the sealing and buffering adhesive include the following components in parts by weight: 100 parts of pressure-sensitive adhesive, 20-50 parts of rubber, 0.3-1.5 parts of expanded microspheres, 6-15 parts of tackifying resin, and 0.1-3 parts of curing agent.

[0008] In one or more embodiments of the present invention, the expansion ratio of the expanded microspheres is 50 to 100 times.

[0009] In one or more embodiments of the present invention, the average particle size of the expanded microspheres is 5 μm-50 μm.

[0010] In one or more embodiments of the present invention, the initial expansion temperature of the expanded microspheres is 100°C-110°C.

[0011] In one or more embodiments of the present invention, the rubber is selected from one or more of natural rubber, styrene-butadiene rubber, cis-butadiene rubber, isoprene rubber, ethylene-propylene rubber, nitrile rubber, chloroprene rubber, butyl rubber, polyurethane rubber, SBS rubber, and hydrogenated SBS rubber; and / or,

[0012] The pressure-sensitive adhesive is selected from one or more of acrylic pressure-sensitive adhesives, polyurethane pressure-sensitive adhesives, and silicone pressure-sensitive adhesives; and / or,

[0013] The tackifying resin is selected from one or more of rosin resin, terpene resin, and petroleum resin; and / or,

[0014] The curing agent is selected from one or more of isocyanate curing agents, epoxy curing agents, metal salt curing agents, and aziridine curing agents.

[0015] Another specific embodiment of the present invention provides the following technical solution:

[0016] A method for preparing a sealing buffer adhesive includes: mixing pressure-sensitive adhesive, rubber, expanded microspheres, tackifying resin and curing agent according to a specified ratio to obtain the sealing buffer adhesive.

[0017] Another specific embodiment of the present invention provides the following technical solution:

[0018] A sealing and cushioning tape includes a first release layer, a first adhesive layer, a substrate layer, a second adhesive layer, and a second release layer stacked sequentially, wherein the first adhesive layer and the second adhesive layer are both formed of the sealing and cushioning adhesive according to any one of claims 1-5.

[0019] In one or more embodiments of the present invention, the thickness of the first adhesive layer is 70 μm-85 μm; and / or,

[0020] The thickness of the second adhesive layer is 70μm-85μm; and / or,

[0021] The thickness of the substrate layer is 40μm-60μm; and / or

[0022] The substrate layer is a PET substrate.

[0023] Another specific embodiment of the present invention provides the following technical solution:

[0024] A method for preparing a sealing cushioning tape, comprising:

[0025] Take the substrate layer;

[0026] A sealing buffer adhesive is applied to the substrate layer, and after drying and foaming, a first adhesive layer is formed. A first release layer is then laminated onto the first adhesive layer to obtain a semi-finished product.

[0027] Take the second release layer, apply a sealing buffer adhesive to the second release layer, and after drying and foaming, form the second adhesive layer;

[0028] The substrate layer of the semi-finished product is bonded to the second adhesive layer and cured to obtain a sealing and cushioning tape.

[0029] In one or more embodiments of the present invention, in the step of forming the first adhesive layer, the drying temperature is 60°C-110°C, and the drying time is 2 min-3 min; the foaming temperature is 110°C-130°C, and the foaming time is 2 min-5 min; and / or,

[0030] In the step of forming the second adhesive layer, the drying temperature is 60℃-110℃, and the drying time is 2min-3min; the foaming temperature is 110℃-130℃, and the foaming time is 2min-5min; and / or,

[0031] The curing conditions are 2-3 days at 50℃-55℃ or 5-7 days at room temperature.

[0032] Compared with existing technologies, this invention selects PET substrate instead of traditional foam substrate, which improves the overall tear resistance and dimensional stability of the tape. By adding expanded microspheres to the adhesive layer, the sealing and cushioning performance of the tape is improved. At the same time, the use of rubber significantly enhances the cohesion of the adhesive layer, improves the overall bonding strength, and enhances the viscoelasticity of the adhesive layer, further improving the cushioning and sealing effect. It also improves the high-temperature adhesion and water resistance of the tape.

[0033] This invention achieves an optimal balance between adhesive strength and cushioning effect by controlling the coating thickness, the thickness of the foamed adhesive layer, and the expansion ratio of the expanded microspheres. Furthermore, by selecting and controlling the proportions of raw materials, the formulation is optimized to achieve the best possible results. Detailed Implementation

[0034] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure are described clearly and completely below. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0035] A specific embodiment of the present invention provides a sealing buffer adhesive, the raw materials of which include the following components by weight: 100 parts pressure-sensitive adhesive, 20-50 parts rubber, 0.3-1.5 parts expanded microspheres, 6-15 parts tackifying resin, and 0.1-3 parts curing agent.

[0036] Specifically, by adding expanded microspheres to enhance the material's cushioning properties, and addressing the issues of insufficient cushioning effect with small amounts of expanded microspheres and decreased bonding strength with large amounts, this invention adds rubber to improve the material's cohesion and overall bonding strength. It also enhances the material's high-temperature adhesion and water resistance. Furthermore, by controlling the amounts of expanded microspheres and rubber in the system, they achieve a synergistic effect, ensuring the material remains elastic, providing cushioning and sealing effects while also exhibiting high bonding strength.

[0037] Pressure-sensitive adhesive, as the main component of the material, provides basic bonding functionality, enabling the material to adhere tightly to the surface of the object being bonded, while also exhibiting high stability. Tackifying resins help improve the material's adhesion, ensuring a long-term bond that is not easily detached after bonding. Curing agents enable cross-linking and curing of the material, guaranteeing that the cured material possesses a certain degree of cohesion, thus giving the material a certain level of bond strength.

[0038] Furthermore, the expansion ratio of the expanded microspheres is 50-100 times, the average particle size is 5μm-50μm, and the initial expansion temperature is 100℃-110℃.

[0039] Specifically, if the expansion ratio of the expandable microspheres is too high, they may rupture, resulting in a lack of elasticity in the material. If the expansion ratio is too low, the adhesive layer will be hard, with insufficient cushioning, making the tape prone to adhesion failure upon drop or impact. If the particle size of the expandable microspheres is too small, the improvement in material elasticity after expansion will be minimal; if the particle size is too large, they may protrude from the adhesive layer surface after expansion, affecting the bonding effect. If the initial expansion temperature of the expandable microspheres is too low, they are prone to overheating and cracking during coating and drying. If the initial expansion temperature is too high, the foaming temperature needs to be increased accordingly, affecting processing efficiency. Insufficient expansion ratio after expansion results in poor material cushioning. The optimal expansion temperature for expandable microspheres is preferably 130℃-140℃. Based on the optimal expansion temperature of the expandable microspheres, a suitable foaming temperature should be selected during foaming to ensure the expandable microspheres achieve the expected expansion effect and give the material better cushioning properties.

[0040] The expansion ratio of the expandable microspheres can be selected as 50, 60, 70, 80, 90, or 100 times, depending on the actual needs. The initial expansion temperature of the expandable microspheres can be selected as 100℃-105℃ or 105℃-110℃.

[0041] The average particle size of the expanded microspheres can be 5μm-10μm, 5μm-20μm, 9μm-15μm, 15μm-35μm, 10μm-20μm, 20μm-30μm, 30μm-50μm, 35μm-45μm, or 40μm-50μm, with the preferred average particle size being 5μm-20μm.

[0042] Furthermore, the pressure-sensitive adhesive is selected from one or more of acrylic pressure-sensitive adhesives, polyurethane pressure-sensitive adhesives, and silicone pressure-sensitive adhesives.

[0043] Specifically, the pressure-sensitive adhesive is preferably an acrylic pressure-sensitive adhesive, and preferably has one or more functional groups among carboxyl, hydroxyl, and epoxy groups in its side chains. This can increase the hydrogen bonding or chemical bonding between the acrylic pressure-sensitive adhesive and the rubber molecules, enhance compatibility, and provide reactive groups for subsequent cross-linking and curing, thereby increasing the molecular weight and glass transition temperature.

[0044] Furthermore, the rubber is selected from one or more of the following: natural rubber, styrene-butadiene rubber, cis-butadiene rubber, isoprene rubber, ethylene-propylene rubber, nitrile rubber, chloroprene rubber, butyl rubber, polyurethane rubber, SBS rubber, and hydrogenated SBS rubber.

[0045] Specifically, the preferred rubbers are styrene-butadiene rubber, chloroprene rubber, SBS rubber (thermoplastic styrene-butadiene rubber), and hydrogenated SBS rubber. Chloroprene rubber and styrene-butadiene rubber have high polarity, and their polar groups, such as -CN (cyano) and -CL (chlorine), are compatible with the ester groups in acrylic pressure-sensitive adhesives. SBS rubber and hydrogenated SBS rubber contain styrene segments, which are compatible with acrylic pressure-sensitive adhesives. After mixing, the liquid is stable and does not easily separate, which helps to ensure the stability of the adhesive layer after coating.

[0046] Furthermore, the tackifying resin is selected from one or more of rosin resin, terpene resin, and petroleum resin.

[0047] Specifically, the rosin resin can be selected from hydrogenated rosin, disproportionated rosin, or rosin ester; the terpene resin can be selected from α-pinene resin or β-pinene resin; and the petroleum resin can be selected from C5 petroleum resin, C9 petroleum resin, C5 / C9 copolymer petroleum resin, or hydrogenated petroleum resin. Terpene resin is preferred.

[0048] Furthermore, the curing agent is selected from one or more of isocyanate curing agents, epoxy curing agents, metal salt curing agents, and aziridine curing agents.

[0049] Another specific embodiment of the present invention provides a method for preparing a sealing buffer adhesive, wherein pressure-sensitive adhesive, rubber, expanded microspheres, tackifying resin and curing agent are mixed in a certain proportion to obtain a sealing buffer adhesive.

[0050] Another specific embodiment of the present invention provides a sealing buffer tape, comprising a first release layer, a first adhesive layer, a substrate layer, a second adhesive layer and a second release layer stacked sequentially, wherein the first adhesive layer and the second adhesive layer are both formed of the above-mentioned sealing buffer adhesive.

[0051] Specifically, the thickness of the first adhesive layer is 70μm-85μm, specifically 70μm, 75μm, 77μm, 80μm, or 85μm; the thickness of the second adhesive layer is 70μm-85μm, specifically 70μm, 75μm, 77μm, 80μm, or 85μm; the thickness of the substrate layer is 40μm-60μm, specifically 40μm, 45μm, 50μm, 55μm, or 60μm; the substrate layer is a PET substrate, which can improve the overall tear strength and dimensional stability of the tape.

[0052] Both the first and second release layers can be made of PET release film, PE release film, or PVC release film. There are no specific requirements for their thickness; they can be selected according to actual needs, as long as they meet the requirement of preventing the tape from sticking together during storage or transportation.

[0053] Another specific embodiment of the present invention provides a method for preparing a sealing buffer tape, including steps 1-3.

[0054] Step 1: Take the substrate layer, apply a sealing buffer adhesive to the substrate layer, and after drying and foaming, form the first adhesive layer. Then, laminate the first release layer onto the first adhesive layer to obtain the semi-finished product.

[0055] Specifically, the drying temperature is 60℃-110℃, and the drying time is 2-3 minutes; the foaming temperature is 110℃-130℃, and the foaming time is 2-5 minutes. First, drying allows the adhesive layer to initially cure and its shape to be initially fixed. Then, foaming expands the adhesive layer, which helps to obtain an adhesive layer with stable performance.

[0056] Step 2: Take the second release layer, apply sealing buffer adhesive to the second release layer, and after drying and foaming, form the second adhesive layer.

[0057] Specifically, the drying temperature is 60℃-110℃, and the drying time is 2min-3min; the foaming temperature is 110℃-130℃, and the foaming time is 2min-5min.

[0058] Step 3: Bond the substrate layer of the semi-finished product to the second adhesive layer, and allow it to cure to obtain the sealing buffer tape.

[0059] Specifically, the maturation conditions are 2-3 days at 50℃-55℃, or 5-7 days at room temperature.

[0060] The present invention will be further described in detail below with reference to specific embodiments.

[0061] The reagents used in this invention are sourced from: pressure-sensitive adhesive, TTT Korea, TT-2048; curing agent, TTT Korea, GT-45; rubber, Kronen, D1118; tackifying resin, Arakawa Chemical, A-115; and expanded microspheres, Matsumoto Chemical, F-50.

[0062] Example 1

[0063] The sealing buffer adhesive in this embodiment comprises the following components by weight: 100 parts pressure-sensitive adhesive, 33 parts rubber, 0.7 parts expanded microspheres, 9 parts tackifying resin, and 0.48 parts curing agent. The above components are mixed to obtain the sealing buffer adhesive.

[0064] The sealing buffer tape in this embodiment is prepared as follows:

[0065] Take a 50μm PET substrate, apply the sealing buffer adhesive to the surface of the PET substrate, dry it at 60℃ for 3min to obtain a 62μm dry adhesive, then place it in an oven and foam it at 110℃ for 5min to increase the adhesive thickness to 75μm. Then laminate a PET release film on the adhesive layer to obtain a semi-finished product.

[0066] Take another PET release film, coat its surface with sealing and cushioning adhesive, and dry it at 60°C for 3 minutes to obtain a 62μm dry adhesive. Then place it in an oven and foam it at 110°C for 5 minutes to increase the adhesive thickness to 75μm. Then bond the adhesive layer to the surface of the PET substrate of the above semi-finished product and cure it at 55°C for 2 days to obtain a sealing and cushioning tape.

[0067] Example 2

[0068] The sealing buffer adhesive in this embodiment comprises the following components by weight: 100 parts pressure-sensitive adhesive, 28 parts rubber, 0.7 parts expanded microspheres, 8 parts tackifying resin, and 0.48 parts curing agent. The above components are mixed to obtain the sealing buffer adhesive.

[0069] The sealing buffer tape in this embodiment is prepared as follows:

[0070] Take a 50μm PET substrate, apply the sealing buffer adhesive to the surface of the PET substrate, dry it at 60℃ for 3 minutes, and then place it in an oven to foam at 110℃ for 5 minutes to form a 75μm thick adhesive layer. Then, laminate a PET release film onto the adhesive layer to obtain a semi-finished product.

[0071] Take a separate PET release film, coat its surface with a sealing buffer adhesive, dry it at 60°C for 3 minutes, then place it in an oven and foam it at 110°C for 5 minutes to form a 75μm thick adhesive layer. Then, bond the adhesive layer to the surface of the PET substrate of the above semi-finished product and cure it at 55°C for 2 days to obtain a sealing buffer tape.

[0072] Example 3

[0073] The sealing buffer adhesive in this embodiment comprises the following components by weight: 100 parts pressure-sensitive adhesive, 20 parts rubber, 0.3 parts expanded microspheres, 15 parts tackifying resin, and 0.1 parts curing agent. The above components are mixed evenly to obtain the sealing buffer adhesive.

[0074] The sealing buffer tape in this embodiment is prepared as follows:

[0075] Take a 50μm PET substrate, apply the sealing buffer adhesive to the surface of the PET substrate, dry it at 110℃ for 2 minutes, and then place it in an oven to foam at 130℃ for 5 minutes to form a 70μm thick adhesive layer. Then, laminate a PET release film onto the adhesive layer to obtain a semi-finished product.

[0076] Take a separate PET release film, coat its surface with a sealing buffer adhesive, dry it at 110°C for 2 minutes, then place it in an oven and foam it at 130°C for 5 minutes to form a 70μm thick adhesive layer. Then, bond the adhesive layer to the surface of the PET substrate of the above semi-finished product and cure it at 50°C for 3 days to obtain a sealing buffer tape.

[0077] Example 4

[0078] The sealing buffer adhesive in this embodiment comprises the following components by weight: 100 parts pressure-sensitive adhesive, 50 parts rubber, 1.5 parts expanded microspheres, 6 parts tackifying resin, and 3 parts curing agent. The above components are mixed evenly to obtain the sealing buffer adhesive.

[0079] The sealing buffer tape in this embodiment is prepared as follows:

[0080] Take a 50μm PET substrate, apply the sealing buffer adhesive to the surface of the PET substrate, dry it at 100℃ for 3 minutes, then place it in an oven and foam it at 120℃ for 3 minutes to form an 85μm thick adhesive layer. Then laminate a PET release film onto the adhesive layer to obtain a semi-finished product.

[0081] Take a separate PET release film, coat its surface with a sealing buffer adhesive, dry it at 100°C for 3 minutes, then place it in an oven and foam it at 120°C for 3 minutes to form an 85μm thick adhesive layer. Then, bond the adhesive layer to the surface of the PET substrate of the above semi-finished product and cure it at 55°C for 2 days to obtain a sealing buffer tape.

[0082] Comparative Example 1

[0083] The only difference between this comparative example and Example 1 is that the sealing buffer adhesive, by weight, comprises the following components: 100 parts pressure-sensitive adhesive, 0.7 parts expanded microspheres, 9 parts tackifying resin, and 0.48 parts curing agent.

[0084] Comparative Example 2

[0085] The only difference between this comparative example and Example 1 is that the sealing buffer adhesive, by weight, comprises the following components: 100 parts pressure-sensitive adhesive, 33 parts rubber, 2 parts expanded microspheres, 9 parts tackifying resin, and 0.48 parts curing agent.

[0086] Comparative Example 3

[0087] The only difference between this comparative example and Example 1 is that the sealing buffer adhesive, by weight, comprises the following components: 100 parts pressure-sensitive adhesive, 10 parts rubber, 0.7 parts expanded microspheres, 9 parts tackifying resin, and 0.48 parts curing agent.

[0088] Comparative Example 4

[0089] The difference between this comparative example and Example 1 is that the sealing buffer adhesive, by weight, comprises the following components: 100 parts pressure-sensitive adhesive, 70 parts rubber, 0.7 parts expanded microspheres, 9 parts tackifying resin, and 0.48 parts curing agent.

[0090] Comparative Example 5

[0091] The difference between this comparative example and Example 1 is that the expansion ratio of the expanded microspheres is 130 times.

[0092] Comparative Example 6

[0093] The difference between this comparative example and Example 1 is that the average particle size of the expanded microspheres is 60 μm.

[0094] Comparative Example 7

[0095] The difference between this comparative example and Example 1 is that the substrate used in the sealing buffer tape is PE foam substrate.

[0096] Performance tests were conducted on the sealing cushioning tapes used in each embodiment and comparative example:

[0097] (1) The 180° peel force was tested in accordance with GB / T 2792-2014 Test Method for Glass Strength of Adhesive Tape.

[0098] (2) The shear force was tested in accordance with GB / T 33332-2016 Test Method for Dynamic Shear Strength of Adhesive Tape.

[0099] (3) Test the elongation at break according to ASTM D3759.

[0100] (4) DuPont impact test: Select a 304 stainless steel base plate and a 304 stainless steel pressure plate with a through hole in the middle. Cut the tape into a shape that matches the 304 stainless steel pressure plate and bond the stainless steel base plate and the stainless steel pressure plate together. The bonding area is 170mm. 2Press the stainless steel base plate and stainless steel pressure plate with 60N pressure for 10 seconds to ensure full adhesion. After standing at room temperature for 48 hours, use gravity balls of different weights to drop them from a height of 1m at a speed of 4.43m / s². 2 The ball is dropped at high speed and impacted through the through hole of the stainless steel pressure plate. The weight of the gravity ball used when the stainless steel base plate and the stainless steel pressure plate separate is recorded.

[0101] (5) Push-out force test: Select a 304 stainless steel base plate and a 304 stainless steel pressure plate with a through hole in the middle. Cut the tape into a shape that matches the 304 stainless steel pressure plate and bond the stainless steel base plate and the stainless steel pressure plate together. The bonding area is 170mm. 2 Press the stainless steel base plate and stainless steel pressure plate with a pressure of 60N for 10 seconds to ensure they are fully bonded. Let them stand at room temperature and 60℃ for 72 hours respectively. Then push the stainless steel base plate through the through hole of the stainless steel pressure plate at a speed of 10mm / min and record the pushing force when the stainless steel base plate and stainless steel pressure plate separate.

[0102] (6) Referring to ASTM D412-98, a 304 stainless steel column with a diameter of 12.5 mm and a height of 40 mm and a 304 stainless steel panel with a diameter of 25 mm × 25 mm × 5 mm were bonded together with tape and kept at 70°C for 72 h. Then the stainless steel column was stretched at a speed of 10 mm / min and the pull-out force when the stainless steel column and the stainless steel panel were separated was recorded.

[0103] (7) Refer to ASTM D3654 to test the high temperature holding force of the tape at 85°C and record the slip distance of the tape after a specified time of 24 hours.

[0104] Table 1. Performance test results of sealing buffer tape

[0105]

[0106] As can be seen from Table 1, in Comparative Example 1, no rubber was added, resulting in severe adhesive residue during peeling, and a decrease in shear force and DuPont impact. In contrast, the tape in Example 1 exhibited better adhesion and cushioning performance, indicating that adding rubber to the tape helps to improve the cohesion of the adhesive layer, enhance the overall bonding strength of the tape, and improve the cushioning performance of the tape.

[0107] Combining Comparative Example 2 and Example 1, insufficient use of expanded microspheres resulted in minimal improvement in the tape's cushioning performance. Furthermore, Comparative Examples 3 and 4 showed that insufficient rubber content led to inadequate tape cushioning and cohesiveness, affecting DuPont impact, pull-out, and high-temperature holding power; excessive rubber content, on the other hand, affected the tape's interfacial adhesion to the adhered objects, resulting in lower bond strength. Therefore, by controlling the amounts of expanded microspheres and rubber, the bond strength and cushioning performance of the tape can be synergistically improved.

[0108] Combined with Comparative Examples 5 and 6, the particle size and expansion ratio of the expanded microspheres have a certain influence on the performance of the tape. By selecting appropriate particle size and expansion ratio, the tape can have both excellent cushioning performance and bonding effect.

[0109] Comparative Example 7 used PE foam substrate, and the test results showed that the PE foam substrate broke. However, the PET substrate selected in the embodiment of the present invention performed well and can improve the overall tear strength and dimensional stability of the tape.

[0110] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from the spirit or essential characteristics of this disclosure. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this disclosure.

[0111] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A sealing and cushioning adhesive, characterized in that, The raw materials of the sealing buffer adhesive include the following components by weight: 100 parts pressure-sensitive adhesive, 20-50 parts rubber, 0.3-1.5 parts expanded microspheres, 6-15 parts tackifying resin, and 0.1-3 parts curing agent.

2. The sealing and cushioning adhesive according to claim 1, characterized in that, The expansion ratio of the expanded microspheres is 50 to 100 times.

3. The sealing and cushioning adhesive according to claim 1, characterized in that, The average particle size of the expanded microspheres is 5μm-50μm.

4. The sealing and cushioning adhesive according to claim 1, characterized in that, The initial expansion temperature of the expanded microspheres is 100℃-110℃.

5. The sealing and cushioning adhesive according to claim 1, characterized in that, The rubber is selected from one or more of the following: natural rubber, styrene-butadiene rubber, cis-butadiene rubber, isoprene rubber, ethylene-propylene rubber, nitrile rubber, chloroprene rubber, butyl rubber, polyurethane rubber, SBS rubber, and hydrogenated SBS rubber; and / or, The pressure-sensitive adhesive is selected from one or more of acrylic pressure-sensitive adhesives, polyurethane pressure-sensitive adhesives, and silicone pressure-sensitive adhesives; and / or, The tackifying resin is selected from one or more of rosin resin, terpene resin, and petroleum resin; and / or, The curing agent is selected from one or more of isocyanate curing agents, epoxy curing agents, metal salt curing agents, and aziridine curing agents.

6. A method for preparing a sealing buffer adhesive, characterized in that, The method for preparing the sealing buffer adhesive includes: mixing pressure-sensitive adhesive, rubber, expanded microspheres, tackifying resin and curing agent according to the specified ratio to obtain the sealing buffer adhesive.

7. A sealing and cushioning tape, characterized in that, It includes a first release layer, a first adhesive layer, a substrate layer, a second adhesive layer, and a second release layer stacked sequentially, wherein the first adhesive layer and the second adhesive layer are both formed of the sealing buffer adhesive as described in any one of claims 1-5.

8. The sealing and cushioning tape according to claim 7, characterized in that, The thickness of the first adhesive layer is 70μm-85μm; and / or, The thickness of the second adhesive layer is 70μm-85μm; and / or, The thickness of the substrate layer is 40μm-60μm; and / or The substrate layer is a PET substrate.

9. A method for preparing the sealing buffer tape according to claim 7, characterized in that, The method for preparing the sealing buffer tape includes: Take the substrate layer; A sealing buffer adhesive is applied to the substrate layer, and after drying and foaming, a first adhesive layer is formed. A first release layer is then laminated onto the first adhesive layer to obtain a semi-finished product. Take the second release layer, apply a sealing buffer adhesive to the second release layer, and after drying and foaming, form the second adhesive layer; The substrate layer of the semi-finished product is bonded to the second adhesive layer and cured to obtain a sealing and cushioning tape.

10. The method for preparing the sealing buffer tape according to claim 9, characterized in that, In the step of forming the first adhesive layer, the drying temperature is 60℃-110℃, and the drying time is 2min-3min; the foaming temperature is 110℃-130℃, and the foaming time is 2min-5min; and / or, In the step of forming the second adhesive layer, the drying temperature is 60℃-110℃, and the drying time is 2min-3min; the foaming temperature is 110℃-130℃, and the foaming time is 2min-5min; and / or, The curing conditions are 2-3 days at 50℃-55℃ or 5-7 days at room temperature.

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