Sensor substrate material, array sensor, preparation mold and preparation method

Abstract

The invention provides a sensor substrate material, an array sensor, a preparation mold and a preparation method, and belongs to the technical field of automobile safety testing, the array sensor comprises a sensor substrate and a wire layer, and the sensor substrate is formed by heating and curing the sensor substrate material and the special mold; the wire layer comprises a first wire layer and a second wire layer which are respectively adhered to the upper surface and the lower surface of the sensor substrate. According to the array sensor disclosed by the invention, the balance of high sensitivity and mechanical toughness of the array sensor is realized through reasonable proportioning of sensor substrate materials; through pretreatment of the wire, the elastic recovery capability of the wire in multidirectional stress scenes such as stretching, compression and shearing can be ensured, and the electrical property and the mechanical property of the wire are not affected.

Description

Technical Field

[0001] This invention relates to the field of automotive safety testing technology, and in particular to a sensor substrate material, an array sensor, a preparation mold, and a preparation method suitable for crash test dummy skin. Background Technology

[0002] Automotive crash testing is a core method for evaluating vehicle safety performance, and its sensor technology is evolving towards higher precision, distributed systems, and multi-scenario capabilities, especially in the field of bionic skin. In recent years, the types and numbers of external sensors used on humans, humanoid robots, or crash test dummies have increased significantly. Among these, bionic skin or artificial test skin with detection capabilities is becoming increasingly common in order to monitor or analyze the forces acting on different parts of the human skin.

[0003] Existing crash test solutions have limited applicability; some are suitable for testing on real human skin, while others are suitable for crash test dummies and humanoid robots, lacking versatility. Summary of the Invention

[0004] To address the problems existing in the prior art, this invention discloses an array-type sensor, its sensor substrate material, preparation method, and preparation mold.

[0005] On one hand, the present invention aims to provide a sensor substrate material comprising the following raw materials by weight percentage: Matrix material 34%-35%; Gallium-indium alloy 5%-6%; Nickel powder 43%-44%; Conductive ink 14%-15%.

[0006] Furthermore, the matrix material comprises the following raw materials in weight percentages: Polyvinyl chloride resin 35.5%-37.5%; Dioctyl terephthalate 47.5%-50.5%; Calcium carbonate 0.1%-2%; Epoxidized soybean oil 4%-7%; Antioxidant stabilizer 0.5%-3%.

[0007] Furthermore, the antioxidant stabilizer is triphenyl phosphite, which can prevent PVC from degrading due to oxidation during processing and use.

[0008] On the other hand, the present invention aims to provide an array sensor, including a sensor substrate and a wire layer, wherein the sensor substrate is cured and formed from the aforementioned sensor substrate material; the wire layer includes a first wire layer and a second wire layer, which are respectively adhered to the upper and lower surfaces of the sensor substrate.

[0009] Furthermore, the first conductor layer includes several conductor bundles distributed along the X direction for connecting sensor units in the same row; the second conductor layer includes several conductor bundles distributed along the Y direction for connecting sensor units in the same column.

[0010] Furthermore, the array sensor also has an insulating layer located outside the conductor layer.

[0011] In another aspect, the present invention aims to provide a manufacturing mold, including a base plate assembly, a first wire harness plate, and a second wire harness plate; The base plate assembly includes a base plate and a base prefabricated plate. The base prefabricated plate has a first assembly surface and a second assembly surface, and the base plate has a third assembly surface. The base prefabricated plate is detachably assembled to the base plate, and the base prefabricated plate has a plurality of through holes arranged in an array. When the base prefabricated plate is assembled with the base plate, the first assembly surface of the base prefabricated plate is in contact with the third assembly surface of the base plate. The first wire harness plate has a fourth assembly surface, which is detachably assembled to the second assembly surface of the substrate prefabricated plate for adhering the first wire layer to the upper surface of the sensor substrate; The second wire harness plate has a fifth assembly surface, which is detachably assembled to the fourth assembly surface of the first wire harness plate, for adhering the second wire layer to the lower surface of the sensor substrate.

[0012] Furthermore, the fourth assembly surface of the first wire harness plate is provided with a plurality of first wire grooves along the X direction, and the first wire grooves are correspondingly provided with through holes on the substrate prefabricated plate; when the first wire harness plate is assembled with the substrate prefabricated plate, the wire harness fixed on the fourth assembly surface is attached to the upper surface of the sensor substrate.

[0013] Furthermore, a plurality of second wire grooves are formed along the Y direction on the fifth assembly surface of the second wire harness plate, and the second wire grooves are correspondingly arranged with the through holes on the substrate prefabricated plate; when the second wire harness plate is assembled with the first wire harness plate, the wire harness fixed on the fifth assembly surface is attached to the lower surface of the sensor substrate.

[0014] Furthermore, a pressure layer is protruding from the center of the fifth assembly surface along the Y direction.

[0015] Furthermore, the third assembly surface of the base plate is provided with first slide rails on both sides along the X direction, and the first assembly surface of the base precast plate is provided with first slide grooves on both sides along the X direction. The first slide grooves are matched with the first slide rails so that when the base precast plate is assembled with the base plate, the first assembly surface and the third assembly surface are in contact.

[0016] Furthermore, the second assembly surface of the base prefabricated plate is provided with second slide rails on both sides along the X direction, and the fourth assembly surface of the first wire harness plate is provided with second slide grooves on both sides along the X direction. The second slide rails and the second slide grooves are matched so that when the first wire harness plate is assembled with the base prefabricated plate, the fourth assembly surface is in contact with the second assembly surface.

[0017] Furthermore, the preparation mold also has a guide rail bracket, which includes a guide rail and a guide groove. The guide rail is slidably assembled into the second slide groove. A third slide rail is provided on both sides of the fifth assembly surface of the second wire harness plate along the X direction. The third slide rail is slidably assembled into the guide groove. The guide rail bracket is matched with the second slide groove and the third slide rail, so that when the second wire harness plate is assembled with the first wire harness plate, the pressure layer abuts against the fourth assembly surface of the first wire harness plate.

[0018] Furthermore, a first injection groove and a first guide groove are also provided on the fourth assembly surface of the first wire harness plate. Two sets of the first injection groove are provided, located on both sides of the first wire groove respectively. One end of the first guide groove is flush with the first wire groove, and the other end opens at the edge of the first wire harness plate and forms a first injection hole. The first guide groove is connected to the flush end of the first injection groove and the first wire groove.

[0019] Furthermore, a second liquid injection groove and a second flow guide groove are provided on the fifth assembly surface of the second wire harness plate. Two sets of the second liquid injection groove are provided, located on both sides of the second wire guide groove respectively. One end of the second liquid injection groove opens at the edge of the second wire harness plate and forms a second liquid injection hole, while the other end is flush with the second wire guide groove. The second flow guide groove is connected to the flush end of the second liquid injection groove and the second wire guide groove.

[0020] Furthermore, the present invention aims to provide a method for fabricating an array-type sensor, comprising the following steps: S1. Assemble the substrate assembly by laying the pre-made sensor substrate material flat on the substrate prefabrication plate; S2. The substrate assembly is moved into a vacuum chamber for vacuum treatment; S3. Add sensor substrate material to fill the gaps; S4. The substrate assembly is placed in a heating box and heated to solidify, forming the sensor substrate; S5. Assemble and fix the first wire harness plate with the assembled wire harness to the base prefabricated plate, so that the wire harness is in contact with the upper surface of the sensor base; S6. Inject conductive adhesive into the junction of the first wire harness board and the sensor substrate; S7. Let stand until the conductive adhesive cures to form the first conductor layer; S8. Remove the base plate; S9. Separate the sensor substrate from the substrate prefabrication plate, wherein the sensor substrate is bonded to the first wire harness plate; S10. Assemble and fix the second wire harness plate with the wire harness assembled on it to the first wire harness plate, so that the wire harness is in contact with the lower surface of the sensor substrate; S11. Inject conductive adhesive into the junction of the second wire harness plate and the sensor substrate; S12. Let stand until the conductive adhesive cures to form the second conductor layer.

[0021] Compared with existing technologies, the advantages of this invention are as follows: The array sensor of this invention achieves a balance between high sensitivity and mechanical toughness through a reasonable ratio of sensor substrate materials; the pretreatment of the wires ensures its elastic recovery capability under multi-directional stress scenarios such as tension, compression, and shear, without affecting its electrical and mechanical properties. Furthermore, the mold structure of this invention is ingeniously designed; through a sandwich-like structure, multiple layers can be pressed together, achieving a modular manufacturing process and improving the product mass production qualification rate. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure and working principle of an array sensor shown in one embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of a precast substrate plate shown in another embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the base plate shown in another embodiment of the present invention; Figure 4 This is a schematic diagram of the assembly structure of the base plate and the base prefabricated plate shown in another embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of the first conductor plate shown in another embodiment of the present invention; Figure 6 This is a schematic diagram of the assembly structure of the first conductor board and substrate assembly shown in another embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of the second conductor plate shown in another embodiment of the present invention; Figure 8 This is a schematic diagram of the guide rail bracket according to another embodiment of the present invention; Figure 9 This is a schematic diagram of the assembly structure of the second guide plate, the guide rail bracket and the first guide plate shown in another embodiment of the present invention.

[0023] In the picture: 11-Sensor substrate; 121-First conductor layer; 121-Second conductor layer; 21-Base plate assembly; 211-Base plate; 2111-Third assembly surface; 21111-First slide rail; 212-Base prefabricated plate; 2121-First assembly surface; 21211-First slide groove; 2122-Second assembly surface; 21221-Second slide rail; 22-First wire harness plate; 221-Fourth assembly surface; 2211-First conductor groove; 2212-Second slide groove; 2213-First injection tank; 2214-First flow guide groove; 23-Second wire harness plate; 231-Fifth assembly surface; 2311-Second conductor groove; 2312-Third slide rail; 2313-Pressure layer; 2314-Second injection tank; 2315-Second flow guide groove; 24-Guide rail bracket; 241-Guide rail; 242-Guide groove. Detailed Implementation

[0024] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0026] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. Furthermore, the technical features involved in the different embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0027] Example 1: Figure 1The structural schematic diagram and working principle diagram of the array sensor according to an embodiment of the present invention are shown, which can be adapted to the curved surface encapsulation of a bionic dummy skin and are used to measure the pressure received by the dummy during a collision. Specifically, the array sensor is composed of a number of sensor units arranged in an array form, including a sensor substrate 11 and a wire layer 12. The wire layer 12 includes a first wire layer 121 and a second wire layer 122, which are respectively adhered to the upper surface and the lower surface of the sensor substrate 11. The sensor substrate 11 is prepared from the sensor substrate material and the mold to be elaborated in detail below, and will not be elaborated too much here. Further, the first wire layer 121 includes a number of wire bundles distributed in the X direction for connecting the sensor substrates 11 in the same row; the second wire layer 122 includes a number of wire bundles arranged in the Y direction for connecting the sensor substrates 11 in the same column. Through this row and column wire layout on the upper and lower surfaces, the first wire layer 121 and the second wire layer 122 jointly connect each sensor substrate 11 to the corresponding row wire bundle and column wire bundle. This structure not only realizes the complete function of the sensor array, but also significantly simplifies the wiring complexity and improves the reliability and stability of the entire sensor system. Among them, the preparation method of the wire bundle will be specifically elaborated below and will not be elaborated too much here.

[0028] Specifically, the core working principle of the array sensor of the present invention is based on the piezoresistive effect: when an external pressure acts on the sensor unit, the sensor unit undergoes deformation, resulting in a decrease in the average spacing of the conductive particles in the sensor substrate, forming a denser conductive network, thereby significantly reducing the resistance value of the sensor unit 111.

[0029] Specifically: R ij is the reference resistance value of the sensor unit in the i-th row and the j-th column at the initial height h; When the pressure causes the sensor unit to be compressed to the height h' (h' < h), its resistance value becomes R' ij ; Due to the characteristics of the piezoresistive material, the relationship is satisfied: R' ij < R ij And ΔR = ∣R' ij－ R ij ∣ is positively correlated with the pressure intensity.

[0030] By measuring the resistance change amount ΔR of each sensor unit in real time and based on the pre-calibrated "pressure-resistance change" mapping relationship, the pressure value received at this position can be accurately obtained. Combining the data independently measured by all sensor units in the array, the dynamic pressure distribution map on the surface of the dummy skin during the collision can be finally generated.

[0031] Furthermore, the sensor substrate material of this invention is composed of a matrix material and a conductive material, wherein the matrix material accounts for 34%-35% of the total weight of the formulation, and the conductive material accounts for 62%-65% of the total weight of the formulation. Specifically, the matrix material is composed of polyvinyl chloride resin, dioctyl terephthalate, calcium carbonate, epoxidized soybean oil, and an antioxidant stabilizer. Polyvinyl chloride resin forms the matrix skeleton, accounting for 37.5-40.5% of the total weight of the matrix material; dioctyl terephthalate is the main plasticizer, accounting for 47.5-50.5% of the total weight of the matrix material; calcium carbonate is a stability enhancer, accounting for 0.1-2% of the total weight of the matrix material; epoxidized soybean oil, as a plasticizer synergist, is used to improve the flexibility of the matrix material, accounting for 4-7% of the total weight of the matrix material; the antioxidant stabilizer can be triphenyl phosphite, which can prevent PVC from degrading due to oxidation during processing and use, accounting for 0.5-3% of the total weight of the matrix material. Furthermore, the conductive material is composed of nickel powder, gallium-indium alloy, and conductive ink. Nickel powder, acting as the conductive framework, provides the basic conductivity and accounts for 43%-44% of the total weight of the conductive material. The liquid properties of the gallium-indium alloy enhance the connectivity of the conductive network and reduce contact resistance, accounting for 5%-6% of the total weight of the conductive material. The conductive ink has the dual function of binding the nickel powder and assisting in conductivity, accounting for 14%-15% of the total weight of the conductive material. This invention's sensor substrate material, through a rational formulation of the matrix material and conductive material, enables the sensor unit to achieve a high-sensitivity response to minute deformations while maintaining the mechanical toughness of the matrix.

[0032] Furthermore, the preparation steps of the sensor substrate material of the present invention are as follows: Step 1: Mix the components of the matrix material according to their weight percentages and stir at 1500 rpm for about 2-3 hours. Step 2: Take out a portion of the well-mixed matrix material, weigh the gallium indium alloy, nickel powder and conductive ink by weight percentage, and stir with a stirrer at 1500 rpm for 15 minutes.

[0033] In the preparation process of the sensor substrate material of this invention, because the substrate material is relatively viscous, it needs to be thoroughly stirred first to ensure that the components are mixed evenly before adding the conductive material and stirring again. Furthermore, the viscous nature of the substrate material largely avoids the problem of sedimentation and stratification of the conductive material during subsequent vacuuming and heat curing processes.

[0034] Furthermore, the lead wire harness of the present invention includes a plurality of silver wires, a PDMS colloid wrapped around the silver wires, and a plurality of reinforcing fibers, wherein the reinforcing fibers are arranged side by side with the silver wires. Specifically, the preparation steps of the lead wire harness are as follows: Step 1: Prepare several silver wires of appropriate diameter and length; Step 2: Place the silver wire into the prepared PDMS colloid for initial coating, forming a wrap around the edges; Step 3: Add some reinforcing fibers to improve the mechanical strength of the conductor; Step 4: Use a hot press or hot air gun to heat and compact the silver wires and reinforcing fibers together. Step 5: Cool and solidify.

[0035] This invention's lead harness uses silver wire as its conductive core, ensuring low-impedance signal transmission. PDMS coating not only prevents the silver wire from sulfiding and oxidation but also mimics the "bionic nerves" of a collision-simulating dummy sensor, buffering stress. The addition of reinforcing fibers increases the signal stability of the lead harness under impact, solving the problem of traditional lead harnesses being prone to breakage during dynamic impacts. Through PDMS coating and reinforcing fiber treatment, this invention's lead harness not only meets the requirements of actual stress scenarios such as stretching, pulling, compressing, and cutting, but also, within a certain stress range, allows the lead harness to recover its original physical structure without affecting its performance and mechanical properties.

[0036] In summary, the array sensor of this invention achieves a balance between high sensitivity and mechanical toughness through the reasonable ratio of sensor substrate materials; the pretreatment of the wires ensures its elastic recovery ability under multi-directional stress scenarios such as tension, compression, and shear, without affecting its electrical and mechanical properties.

[0037] Example 2 To facilitate understanding of the subsequent fabrication process of the array sensor, this embodiment first describes the structural design of the dedicated mold. Combined with... Figures 2-9 As shown, the mold of the present invention includes a base plate assembly 21, a first wire harness plate 22, and a second wire harness plate 23. The base plate assembly 21 is used to form a sensor base 11. The first wire harness plate 22 is used to attach the wire harness to the upper surface of the sensor base 11 along the X direction. The second wire harness plate 23 is used to attach the wire harness to the lower surface of the sensor base 11 along the Y direction.

[0038] Specifically, such as Figures 2-4As shown, the substrate assembly 21 includes a substrate pressure plate 211 and a substrate prefabricated plate 212. The substrate prefabricated plate 212 has a first assembly surface 2121 and a second assembly surface 2122, and the substrate pressure plate 211 has a third assembly surface 2111. The substrate prefabricated plate 212 is detachably assembled to the substrate pressure plate 211, and a plurality of through holes are arrayed on the substrate prefabricated plate 212. When the substrate prefabricated plate 212 and the substrate pressure plate 211 are assembled and fixed, the first assembly surface 2121 of the substrate prefabricated plate 212 and the third assembly surface 2111 of the substrate pressure plate 211 are in contact, so that the through holes on the substrate prefabricated plate 212 and the third assembly surface 2111 of the substrate pressure plate 211 together form a microcavity for filling and curing the sensor substrate material. It should be noted that the detachable assembly of the substrate prefabricated plate 212 and the substrate pressure plate 211 can take various forms; here, a sliding assembly is used as an example for illustration. Specifically, as shown... Figure 4 As shown, the third assembly surface 2111 of the base plate 211 is provided with first slide rails 21111 on both sides along the X direction, and the first assembly surface 2121 of the base precast plate 212 is provided with first slide grooves 21211 on both sides along the X direction. The first slide rails 21111 can slide relative to the first slide grooves 21211 to complete the assembly and fixation of the base precast plate 212 and the base plate 211.

[0039] In use, the substrate plate 211 is placed horizontally on the worktable. The substrate prefabricated plate 212 is assembled and fixed onto the substrate plate 211 using the guiding engagement of the first slide rail 21111 and the first slide groove 21211. Then, the prefabricated sensor substrate material is spread on the surface of the substrate prefabricated plate 212, and a scraper is used to apply the slurry, ensuring it fully fills the microcavity array. The mold is then moved into a vacuum chamber for 40 minutes to remove air bubbles from the slurry. Slurry is added again to fill any air bubbles. Finally, the mold is placed in a 160°C heating oven for 2 hours to cure, thus completing the curing and molding of the sensor substrate. It should be noted that the mold can be made of CNC machined metal or using 3D printed or laser-etched acrylic sheets. In short, any manufacturing method that meets the requirements for manufacturing precision and high-temperature resistance during material preparation is acceptable.

[0040] Furthermore, such as Figure 6 As shown, by combining the first wire harness plate 22 with the substrate prefabricated plate 212, the wire harness fixed on the first wire harness plate 22 is adhered to the upper surface of the sensor substrate. Specifically, in conjunction with... Figure 5As shown, the first wire harness plate 22 has a fourth assembly surface 221. Several first wire guide grooves 2211 and two first liquid injection grooves 2213 are formed along the X direction on the fourth assembly surface 221. The first wire guide grooves 2211 are correspondingly arranged with through holes on the base prefabricated plate 212 to achieve precise positioning and transfer of the wire harness in the X direction. Here, through holes refer to through holes in the X direction. The two first liquid injection grooves 2213 are located on both sides of the first wire guide grooves 2211, with one end of each groove opening at the edge of the first wire harness plate 22 and forming a first liquid injection hole, and the other end flush with the first wire guide grooves 2211. A first guide groove 2214 is formed at the end flush with the first wire guide groove 2211.

[0041] Furthermore, to facilitate the assembly of the first wire harness plate 22 and the base prefabricated plate 212, the second assembly surface 2122 of the base prefabricated plate 212 is provided with second slide rails 21221 on both sides along the X direction, and the fourth assembly surface 221 of the first wire harness plate 22 is provided with second slide grooves 2212 on both sides along the X direction. The second slide rails 21221 and the second slide grooves 2212 are matched so that when the first wire harness plate 22 and the base prefabricated plate 212 are assembled, the fourth assembly surface 221 and the second assembly surface 2122 are in contact.

[0042] In use, the first wire harness plate 22 is assembled and fixed on the base prefabricated plate 212 through the guiding cooperation of the second slide groove 2212 and the second slide rail 21221. At this time, the fourth assembly surface 221 of the first wire harness plate 22 is in contact with the second assembly surface 2122 of the base prefabricated plate 212, so that the wire harness fixed in the first wire groove 2211 is in contact with the upper surface of the sensor base 11. Then, the assembled and fixed mold is placed vertically with the first injection hole facing upward, and conductive glue is injected into one of the injection holes so that the glue evenly wets the contact surface between the first wire harness plate 22 and the sensor base 11. Then, the mold is placed flat with the first wire harness plate 22 on top. After standing for a period of time, the wire harness on the first wire harness plate 22 can be adhered to the upper surface of the sensor base to form the first wire layer. It should be noted that the design of the first injection tank 2213 and the first guide tank 2214 utilizes the principle of communicating vessels. Conductive adhesive is injected through one injection hole, and when adhesive overflows from the other injection hole, it indicates that the adhesive has uniformly wetted the contact surface between the first wire harness plate 22 and the sensor substrate 11. This solves the problems of uneven conductive adhesive filling and adhesive overflow in traditional processes, improving the mass production yield. Furthermore, leveling the mold allows for better contact between the adhesive and the sensor substrate.

[0043] Furthermore, such as Figure 9 As shown, by combining the second wire harness plate 23 with the first wire harness plate 22, the wire harness fixed on the second wire harness plate 23 is adhered to the lower surface of the sensor substrate. Specifically, in conjunction with... Figure 7As shown, the second wire harness plate 23 has a fifth assembly surface 231. Several second wire guide grooves 2311 and two second liquid injection grooves 2314 are formed along the Y direction on the fifth assembly surface 231. The second wire guide grooves 2311 are correspondingly arranged with through holes on the base prefabricated plate 212 to achieve precise positioning and transfer of the wire harness in the Y direction. Here, through holes refer to through holes in the Y direction. The two second liquid injection grooves 2314 are located on both sides of the second wire guide grooves 2311, with one end of each groove opening at the edge of the second wire harness plate 23 and forming a second liquid injection hole. The other end is flush with the second wire guide groove 2311, and a second guide groove 2315 is formed at the flush end of the second wire guide groove 2311. It should be noted that before assembling the first wire harness plate 22 and the second wire harness plate 23, the base plate 211 needs to be removed first, and then the sensor base 11 needs to be separated from the base prefabricated plate 212. At this time, the sensor base 11 is bonded to the first wire harness plate 22. Then, the first wire harness plate 22 is placed flat on the worktable, and then the second wire harness plate 23 is assembled and fixed on the first wire harness plate 22 through the guiding cooperation of the guide rail bracket 24.

[0044] Specifically, in combination Figure 8 As shown, the guide rail bracket 24 includes a guide rail 241 and a guide groove 242. The guide rail 241 is slidably assembled in the second slide groove 2212. The second wire harness plate 23 has a third slide rail 2312 arranged on both sides of the fifth assembly surface 231 along the X direction. The third slide rail 2312 is slidably assembled in the guide groove 242. The guide rail bracket 24 is matched with the second slide groove 2212 and the third slide rail 2312, so that when the second wire harness plate 23 is assembled with the first wire harness plate 22, the fifth assembly surface 231 of the second wire harness plate 23 is in contact with the lower surface of the sensor substrate.

[0045] Furthermore, since the sensor substrate 11 is adhered to the fourth assembly surface 221 of the first wiring harness plate 22, i.e., the sensor substrate 11 protrudes from the fourth assembly surface 221, when conductive adhesive is injected between the fifth assembly surface 231 of the second wiring harness plate 23 and the sensor substrate 11, adhesive may become trapped in the gap between the sensor substrate 11 and the first wiring harness plate 22, causing the sensor unit to detach. In this invention, a pressure layer 2313 protrudes along the Y direction in the middle of the second wiring harness plate 23. The height of the pressure layer 2313 is 0.1 mm, approximately equal to the thickness of the sensor substrate 11. When the second wiring harness plate 23 is assembled and fixed to the first wiring harness plate 22, the pressure layer 2313 of the second wiring harness plate 23 presses against the fourth assembly surface of the first wiring harness plate 22, ensuring that each layer is in a certain interference fit state.

[0046] In summary, the mold of this invention has an ingenious structural design. Through the sandwich structure design, multiple layers can be pressed together to achieve a modular manufacturing process and improve the product mass production qualification rate. In addition, the guide cooperation of the slide rail and groove makes the mold positioning accurate and simple and convenient to operate.

[0047] Example 3 The steps for fabricating the array sensor using the above-mentioned mold in this invention are as follows: S1. Assemble the substrate assembly 21 by laying the prefabricated sensor substrate material flat on the substrate prefabricated plate 212; S2. The base plate assembly 21 is moved into a vacuum chamber for vacuum treatment; S3. Add sensor substrate material to fill the gaps; S4. The substrate assembly 21 is placed in a heating box and heated to solidify, forming the sensor substrate 11; S5. Assemble and fix the first wire harness plate 22 with the wire harness assembled on it to the base prefabricated plate 212, so that the wire harness is attached to the upper surface of the sensor base 11; S6. Inject conductive adhesive into the junction of the first wire harness plate 22 and the sensor substrate 11; S7. Let stand until the conductive adhesive cures to form the first conductor layer 121; S8. Remove the base plate 211; S9. Separate the sensor substrate 11 from the substrate prefabrication plate 212, wherein the sensor substrate 11 is bonded to the first wire harness plate 22; S10. Assemble and fix the second wire harness plate 23, which is equipped with the wire harness, to the first wire harness plate 22, so that the wire harness is in contact with the lower surface of the sensor substrate 11; S11. Inject conductive adhesive into the joint between the second wire harness plate 23 and the sensor substrate 11; S12. Let stand until the conductive adhesive cures to form the second conductor layer 122.

[0048] The fabrication method of the array sensor has been described in detail in Example 2, and will not be repeated here.

[0049] It should be emphasized that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention in any way. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A sensor substrate material, characterized in that, The raw materials include the following weight percentages: Matrix material 34%-35%; Gallium-indium alloy 5%-6%; Nickel powder 43%-44%; Conductive ink 14%-15%.

2. The sensor substrate material according to claim 1, characterized in that, The matrix material comprises the following raw materials by weight percentage: Polyvinyl chloride resin 35.5%-37.5%; Dioctyl terephthalate 47.5%-50.5%; Calcium carbonate 0.1%-2%; Epoxidized soybean oil 4%-7%; Antioxidant stabilizer 0.5%-3%.

3. The sensor substrate material according to claim 2, characterized in that, The antioxidant stabilizer is triphenyl phosphite, which can prevent PVC from degrading due to oxidation during processing and use.

4. An array-type sensor, characterized in that, The sensor substrate (11) is formed by curing the sensor substrate material according to any one of claims 1-3; the conductive layer (12) includes a first conductive layer (121) and a second conductive layer (122), which are respectively adhered to the upper and lower surfaces of the sensor substrate (11).

5. The array sensor according to claim 4, characterized in that, The first conductor layer (121) includes a plurality of conductor bundles distributed along the X direction for connecting sensor units in the same row; the second conductor layer (122) includes a plurality of conductor bundles distributed along the Y direction for connecting sensor units in the same column.

6. The array sensor according to claim 4, characterized in that, It also includes an insulating layer located outside the conductor layer.

7. A mold for fabricating the array sensor according to any one of claims 4-6, characterized in that, Includes a base plate assembly (21), a first wire harness plate (22), and a second wire harness plate (23); The base plate assembly (21) includes a base plate (211) and a base prefabricated plate (212). The base prefabricated plate (212) has a first assembly surface (2121) and a second assembly surface (2122), and the base plate (211) has a third assembly surface (2111). The base prefabricated plate (212) is detachably assembled to the base plate (211), and the base prefabricated plate (212) has a plurality of through holes arranged in an array. When the base prefabricated plate (212) is assembled with the base plate (211), the first assembly surface (2121) on the base prefabricated plate (212) is in contact with the third assembly surface (2111) of the base plate (211). The first wire harness plate (22) has a fourth assembly surface (221), which is detachably assembled to the second assembly surface (2122) of the substrate prefabricated plate (212) for adhering the first wire layer (121) to the upper surface of the sensor substrate (11); The second wire harness plate (23) has a fifth assembly surface (231), which is detachably assembled to the fourth assembly surface (221) of the first wire harness plate (22) for adhering the second wire layer (122) to the lower surface of the sensor substrate (11).

8. The mold for preparation according to claim 7, characterized in that, The fourth assembly surface (221) of the first wire harness plate (22) is provided with a plurality of first wire grooves (2211) along the X direction. The first wire grooves (2211) are correspondingly arranged with the through holes on the substrate prefabricated plate (212). When the first wire harness plate (22) is assembled with the substrate prefabricated plate (212), the wire harness fixed on the fourth assembly surface (221) is attached to the upper surface of the sensor substrate (11).

9. The preparation mold according to claim 7, characterized in that, The second wire harness plate (23) has a plurality of second wire grooves (2311) opened along the Y direction on the fifth assembly surface (2311) and the second wire grooves (2311) are corresponding to the through holes on the substrate prefabricated plate (212); when the second wire harness plate (23) is assembled with the first wire harness plate (22), the wire harness fixed on the fifth assembly surface (231) is attached to the lower surface of the sensor substrate (11).

10. The preparation mold according to claim 9, characterized in that, A pressure layer (2313) is provided in the middle of the fifth assembly surface (231) along the Y direction.

11. The preparation mold according to claim 8, characterized in that, The third assembly surface (2111) of the base plate (211) is provided with first slide rails (21111) on both sides along the X direction, and the first assembly surface (2121) of the base precast plate (212) is provided with first slide grooves (21211) on both sides along the X direction. The first slide grooves (21211) are matched with the first slide rails (21111) so that when the base precast plate (212) and the base plate (211) are assembled, the first assembly surface (2121) and the third assembly surface (2111) are in contact.

12. The preparation mold according to claim 10, characterized in that, The second assembly surface (2122) of the base prefabricated plate (212) is provided with a second slide rail (21221) on both sides along the X direction, and the fourth assembly surface (221) of the first wire harness plate (22) is provided with a second slide groove (2212) on both sides along the X direction. The second slide rail (21221) and the second slide groove (2212) are matched and configured so that when the first wire harness plate (22) is assembled with the base prefabricated plate (212), the fourth assembly surface (221) and the second assembly surface (2122) are in contact.

13. The preparation mold according to claim 12, characterized in that, It also includes a guide rail bracket (24), which includes a guide rail (241) and a guide groove (242). The guide rail (241) is slidably assembled in the second slide groove (2212). A third slide rail (2312) is provided on both sides of the fifth assembly surface (231) of the second wire harness plate (23) along the X direction. The third slide rail (2312) is slidably assembled in the guide groove (242). The guide rail bracket (24) is matched with the second slide groove (2212) and the third slide rail (2312) so that when the second wire harness plate (23) is assembled with the first wire harness plate (22), the pressure layer (2313) abuts against the fourth assembly surface (221) of the first wire harness plate (22).

14. The preparation mold according to claim 8, characterized in that, The fourth assembly surface (221) of the first wire harness plate (22) is also provided with a first liquid injection groove (2213) and a first flow guide groove (2214). The first liquid injection groove (2213) is provided in two sets, which are located on both sides of the first wire guide groove (2211). One end of the first flow guide groove (2214) is flush with the first wire guide groove (2211), and the other end opens at the edge of the first wire harness plate (22) and forms a first liquid injection hole. The first flow guide groove (2214) is connected to the flush end of the first liquid injection groove (2213) and the first wire guide groove (2211).

15. The preparation mold according to claim 9, characterized in that, The second wiring harness plate (23) has a second liquid injection groove (2314) and a second flow guide groove (2315) on its fifth assembly surface (231). The second liquid injection groove (2314) is provided in two sets, located on both sides of the second wire guide groove (2311). One end of the second liquid injection groove (2314) opens at the edge of the second wiring harness plate (23) and forms a second liquid injection hole, while the other end is flush with the second wire guide groove (2311). The second flow guide groove (2315) is connected to the flush end of the second liquid injection groove (2314) and the second wire guide groove (2311).

16. A method for fabricating an array sensor, using the mold described in any one of claims 7-15, characterized in that, Includes the following steps: S1. Assemble the substrate assembly (21) and lay the pre-made sensor substrate material flat on the substrate prefabricated plate (212); S2. The substrate assembly (21) is moved into a vacuum chamber for vacuum treatment; S3. Add sensor substrate material to fill the gaps; S4. The substrate assembly (21) is placed in a heating box and heated and cured to form the sensor substrate (11). S5. Assemble and fix the first wire harness plate (22) with the wire harness assembled on it to the base prefabricated plate (212) so that the wire harness is attached to the upper surface of the sensor base (11); S6. Inject conductive adhesive into the joint between the first wire harness plate (22) and the sensor substrate (11); S7. Let stand until the conductive adhesive cures to form the first conductor layer (121). S8. Remove the base plate (211). S9. Separate the sensor substrate (11) from the substrate prefabrication plate (212), and bond the sensor substrate (11) to the first wire harness plate (22); S10. Assemble and fix the second wire harness plate (23) with the wire harness assembled on it to the first wire harness plate (22), so that the wire harness is in contact with the lower surface of the sensor substrate (11); S11. Inject conductive adhesive into the joint between the second wire harness plate (23) and the sensor substrate (11); S12. Let stand until the conductive adhesive cures to form the second conductor layer (122).

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