Current distribution detection device for power electronic device

Abstract

The invention relates to the technical field of current distribution detection, and discloses a current distribution detection device for a power electronic device, the current distribution detection device comprises a device body and a current distribution detection assembly, the device body abuts against and fits the power electronic device along a first direction, and the current distribution detection assembly is arranged in the device body. The current distribution detection assembly comprises a plurality of induced current detection groups, the plurality of induced current detection groups are arranged in sequence along the second direction, each induced current detection group comprises a plurality of induced current detection units, the plurality of induced current detection units are arranged in sequence along the third direction, each induced current detection unit is used for sensing current change, the first direction, the second direction and the third direction are perpendicular to one another in pairs. Therefore, according to the non-intrusive current detection method, the sealing performance, the heat dissipation structure and the insulation performance of the device are protected fundamentally, and meanwhile, detection of internal current distribution of the whole wafer device can be achieved.

Description

Technical Field

[0001] This application relates to the field of current distribution detection technology, and in particular to a current distribution detection device for power electronic devices. Background Technology

[0002] Power electronic devices (such as IGBTs, IGCTs, and diodes) are widely used in various high-voltage and high-power applications due to their excellent double-sided heat dissipation capabilities and high reliability. These devices typically employ a multi-chip parallel structure to enhance current carrying capacity. However, during operation, uneven current distribution can easily occur among the parallel chips within the device, severely impacting its reliability and lifespan. Therefore, accurately detecting the internal current distribution of the device is crucial for preventing and resolving this problem.

[0003] In related technologies, the mainstream method for current distribution detection involves invasively inserting a Rogowski coil into the device by damaging its package. However, existing detection methods require intrusion into the device, which compromises the integrity of the package and can easily cause irreversible damage. Furthermore, damage to the package structure directly disrupts the device's multiphysics equilibrium system, leading to internal pressure vessel failure, seal damage, and potential failure of double-sided heat dissipation or decreased insulation performance. Additionally, for whole-wafer devices such as IGCTs and diodes, the structural characteristics prevent the use of embedded Rogowski coils for measurement. Summary of the Invention

[0004] This application provides a current distribution detection device for power electronic devices, which fundamentally protects the device's sealing, heat dissipation structure and insulation performance, ensuring that the device's multi-physics field balance system is not damaged. At the same time, the array structure design enables it to cover the entire effective cross section of the device under test, thereby realizing non-invasive detection of the current distribution inside the entire wafer device.

[0005] To achieve the above objectives, the main technical solutions adopted in this application include:

[0006] In a first aspect, embodiments of this application provide a current distribution detection device for power electronic devices, comprising:

[0007] The device body, along the first direction, is in contact and bonded with the power electronic device;

[0008] The current distribution detection component is located within the device body and includes multiple induced current detection groups arranged sequentially along the second direction. Each induced current detection group includes multiple induced current detection units arranged sequentially along the third direction. Each induced current detection unit is used to sense current changes. The first direction, the second direction, and the third direction are mutually perpendicular.

[0009] According to the embodiments of this application, a current distribution detection device for power electronic devices is proposed. This current distribution detection device integrates a current distribution detection component into the device body. The current distribution detection component includes multiple arrayed induced current detection units. When performing device current distribution detection, the device body is directly abutted against the device along a first direction so that the multiple induced current detection units are parallel to the device. In this way, each induced current detection unit can independently sense the current change in its corresponding area. This non-invasive current detection method avoids the operation of destroying the device package to implant sensors required by traditional methods, thereby fundamentally protecting the device's sealing, heat dissipation structure, and insulation performance, and ensuring that the device's multi-physics field balance system is not destroyed. At the same time, this array structure design allows it to cover the entire effective cross-section of the device under test, thereby realizing non-invasive detection of the current distribution inside the entire wafer device.

[0010] Optionally, multiple induced current detection groups are arranged sequentially at intervals along the second direction.

[0011] Optionally, multiple induced current detection units are arranged sequentially at intervals along a third direction.

[0012] Optionally, the device body includes a base and a cover plate. The base includes a base body, which is fixedly connected to the cover plate and forms an installation space. The current distribution detection component is fixed in the installation space.

[0013] Optionally, the base also includes multiple mounting assemblies, each of which is located in the mounting space. Along the second direction, the multiple mounting assemblies are arranged at intervals in sequence. Each mounting assembly includes multiple mounting parts. Along the third direction, the multiple mounting parts are arranged at intervals in sequence. Along the first direction, each mounting part is fixedly connected to the base body and protrudes in a direction away from the base body.

[0014] Each mounting section is equipped with a corresponding induced current detection unit, and each induced current detection unit is arranged around the corresponding mounting section.

[0015] Optionally, the mounting section can be constructed as a square column.

[0016] Optionally, the mounting section may be constructed as a cylinder.

[0017] Optionally, the current distribution detection assembly includes a mounting plate, which includes a plurality of mounting holes that correspond one-to-one with the mounting portions. Each mounting hole is fitted onto a corresponding mounting portion, and each mounting hole is provided with an induced current detection unit, so that each induced current detection unit surrounds the corresponding mounting portion.

[0018] Optionally, each induced current detection unit includes a Rogowski coil, each Rogowski coil being mounted on a mounting plate and arranged around a corresponding mounting hole.

[0019] Optionally, the mounting plate is a one-piece molded part. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 A schematic diagram of a clamping measuring device provided in one embodiment of this application;

[0022] Figure 2 This is a schematic diagram of a current distribution detection device provided in one embodiment of this application;

[0023] Figure 3 An assembly diagram of the base and mounting plate provided in one embodiment of this application;

[0024] Figure 4 A schematic diagram of a base provided in one embodiment of this application;

[0025] Figure 5 A schematic diagram of a mounting plate provided in one embodiment of this application;

[0026] Figure 6 An exploded view of a current distribution detection device provided in one embodiment of this application;

[0027] Figure 7 yes Figure 6 A magnified view of a portion of point A in the middle.

[0028] [Explanation of Labels in the Attached Image]

[0029] Clamping measuring device 1000;

[0030] Current distribution detection device 100;

[0031] Device body 1; base 11; base body 111; mounting part 112; cover plate 12;

[0032] Mounting plate 2; Mounting hole 21;

[0033] Inductive current detection unit 3;

[0034] Power electronic devices 200;

[0035] First clamping element 300;

[0036] Second clamping element 400;

[0037] Drive component 500;

[0038] Mounting bracket 600;

[0039] First direction X; second direction Y; third direction Z. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0041] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the description of this application is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms "comprising" and "having," and any variations thereof, in the description, claims, and accompanying drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the description, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy.

[0042] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0043] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0044] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0045] In this application, "multiple" refers to two or more (including two), and similarly, "multiple groups" refers to two or more (including two), and "multiple pieces" refers to two or more (including two).

[0046] It should be noted that, thanks to their advantages such as double-sided heat dissipation, high reliability, and high power density, power electronic devices have gradually become core components in high-voltage and high-power scenarios such as flexible DC transmission converter valves and DC circuit breakers, playing a key role in the construction of new energy power systems and large-scale grid connection of new energy.

[0047] To meet the ever-increasing demand for power transmission capacity, power electronic devices typically employ a multi-chip parallel structure to enhance current-carrying capacity. However, in a confined environment with coupled electrical, thermal, and mechanical fields, factors such as differences in chip manufacturing processes, asymmetric packaging parasitic parameters, uneven mechanical pressure distribution, and thermal deformation during operation can easily lead to an imbalance in the internal current distribution of the device. This current imbalance not only reduces the device's current-carrying limit and operational reliability but also causes localized overheating, accelerating chip aging and potentially leading to device failure. This severely impacts the device's reliability and lifespan. Therefore, accurately detecting the internal current distribution of the device is crucial for preventing and resolving this problem.

[0048] In the prior art, the method used to detect the internal current imbalance of press-fit power electronic devices is usually the intrusive Rogowski coil detection method. This method requires opening the device package, inserting the Rogowski coil into the device, and detecting the current of each chip separately.

[0049] However, the above-mentioned detection methods require penetration into the device, which will damage the integrity of the device package and easily cause irreversible damage to the device. Furthermore, the damage to the package structure will directly disrupt the device's multi-physics equilibrium system, leading to the failure of the internal pressure vessel and the damage to the sealing interface, which may easily result in the failure of the double-sided heat dissipation function or a decrease in insulation performance. At the same time, for whole-wafer devices, such as IGCTs and diodes, due to their structural characteristics, it is not possible to use the embedded Rogowski coil method for measurement.

[0050] Based on this, this application proposes a current distribution detection device 100 for a power electronic device 200. The current distribution detection device 100 integrates a current distribution detection component into the device body 1. The current distribution detection component includes multiple arrayed induced current detection units 3. When performing device current distribution detection, the device body 1 is directly abutted against the device along the first direction X, so that the multiple induced current detection units 3 are parallel to the device. In this way, each induced current detection unit 3 can independently sense the current change in its corresponding area. This non-invasive current detection method avoids the operation of destroying the device package to implant the sensor required by traditional methods, thereby fundamentally protecting the device's sealing, heat dissipation structure and insulation performance, and ensuring that the device's multi-physics field balance system is not destroyed. At the same time, this array structure design allows it to cover the entire effective cross section of the device under test, thereby realizing non-invasive detection of the current distribution inside the entire wafer device.

[0051] The current distribution detection device 100 for a power electronic device 200 proposed in this application is described below with reference to the accompanying drawings.

[0052] like Figures 1-7 As shown, the current distribution detection device 100 for a power electronic device 200 according to an embodiment of this application includes: a device body 1 and a current distribution detection component. Along the first direction X, the device body 1 abuts against and fits against the power electronic device 200. The current distribution detection component is disposed inside the device body 1 and includes multiple induced current detection groups. Along the second direction Y, the multiple induced current detection groups are arranged sequentially. Each induced current detection group includes multiple induced current detection units 3. Along the third direction Z, the multiple induced current detection units 3 are arranged sequentially. Each induced current detection unit 3 is used to sense current changes. The first direction X, the second direction Y, and the third direction Z are mutually perpendicular.

[0053] It should be noted that in this application, the first direction X is the height direction of the current distribution detection device 100, the second direction Y is the front-back direction of the current distribution detection device 100, and the third direction Z is the left-right direction of the current distribution detection device 100. In this application, the power electronic device 200 to be tested can be, but is not limited to, a crimp-type power electronic device.

[0054] Specifically, such as Figure 2 As shown, the current distribution detection device 100 includes a device body 1 and a current distribution detection component. The current distribution detection component is disposed inside the device body 1. The current distribution detection component includes multiple induced current detection groups arranged sequentially along the second direction Y, and each induced current detection group includes multiple induced current detection units 3 arranged sequentially along the third direction Z. That is, the current distribution detection component is composed of multiple horizontally arrayed induced current detection units 3.

[0055] When current distribution detection is required on the power electronic device 200, the device body 1 is first directly abutted against the power electronic device 200 along the first direction X. It can be understood that, in order to obtain better measurement results, the device body 1 abuts against the bottom or top surface of the power electronic device 200. For example, along the first direction X, the device body 1 has a first end face and a second end face that are set opposite to each other. The power electronic device 200 can abut against the first end face of the device body 1, and then pressure is applied to the device body 1 through the second end face to press it tightly onto the power electronic device 200. Alternatively, the power electronic device 200 can abut against the second end face of the device body 1, and then pressure is applied to the device body 1 through the first end face to press it tightly onto the power electronic device 200. This ensures that the device body 1 and the power electronic device 200 are completely attached, and at the same time, it also ensures that the multiple induced current detection units 3 inside the device body 1 are all parallel to the power electronic device 200.

[0056] Subsequently, a double-pulse signal is sent to the power electronic device 200 to control its power-on operation. During the operation of the power electronic device 200, each induced current detection unit 3 can independently sense the current in the corresponding area of ​​the power electronic device 200. Assuming i(t) is the measured current and Rt is the load impedance, according to Ampere's circuital law, the magnetic induction intensity B(r) induced by the changing current i(t) at a distance r from the coil is: B(r) = u0i / 2πr, where u0 is the permeability of free space. When the current changes, the induced electromotive force e(t) is: e(t) = Mdi / dt, where M is the mutual inductance coefficient, i.e. the sensitivity of the Rogowski coil. After processing by the integrator module, the actual current value is calculated. It is understandable that the corresponding area sensed by each current sensing unit 3 is the projection area of ​​the current sensing unit 3 along the first direction X on the power electronic device 200. With this setting, the actual current value of each part of the power electronic device 200 can be obtained by the cooperation of multiple current sensing units 3, so as to detect the current distribution inside the power electronic device 200. Moreover, this detection method does not require damaging the device to implant the sensor, thus fundamentally protecting the device's sealing, heat dissipation structure and insulation performance, so as to ensure that the device's multi-physics field balance system is not damaged.

[0057] Understandably, in order to obtain better measurement results, the device body 1 is in contact with the bottom or top surface of the power electronic device 200 so that the induced current detection unit 3 is parallel to the corresponding chip inside the power electronic device 200.

[0058] Furthermore, to enable those skilled in the art to better understand this solution, such as Figure 1 As shown, a clamping measuring device 1000, in conjunction with a current distribution detection device 100, is used to measure the current distribution of a power electronic device 200. The clamping measuring device 1000 includes a first clamping member 300, a second clamping member 400, a driving member 500, and a mounting bracket 600. The second clamping member 400 is placed at the bottom of the mounting bracket 600, and then the current distribution detection device 100 and the power electronic device 200 are placed sequentially at intervals along the first direction X. In this application, two power electronic devices 200 are clamped between the three current distribution detection devices 100, with the lowest current distribution detection device 100... The uppermost current distribution detection device 100 abuts against the upper surface of the second clamping member 400, and the uppermost current distribution detection device 100 abuts against the lower surface of the first clamping member 300. The driving member 500 is movably mounted on the mounting bracket 600 along the first direction X. The downward movement of the driving member 500 can press the first clamping member 300, thereby clamping and fixing the three current distribution detection devices 100 and the two power electronic devices 200 between the first clamping member 300 and the second clamping member 400. Subsequently, the power electronic devices 200 are powered on and operated, and the current distribution inside the power electronic devices 200 is obtained through multiple induced current detection units 3. This ensures that the current distribution detection devices 100 and the power electronic devices 200 are in close contact, ensuring efficient transmission of current signals.

[0059] In some embodiments of this application, the method of detecting the current distribution of the power electronic device 200 through multiple induced current detection units 3 in the device body 1 is a non-invasive current detection method, which is therefore more suitable for whole-wafer devices that cannot be measured by embedding Rogowski coils.

[0060] In some embodiments of this application, the projection of the current distribution detection component within the device body 1 along the first direction X is greater than or equal to the projection of the power electronic device 200 along the first direction X. This allows the multiple induced current detection units 3 in the array structure design to cover the entire device under test, thereby enabling more accurate acquisition of the current distribution within the power electronic device 200.

[0061] In summary, the current distribution detection device 100 for power electronic device 200 proposed in this application integrates a current distribution detection component within the device body 1. This component includes multiple arrayed induced current detection units 3. During device current distribution detection, the device body 1 is directly abutted against the device along the first direction X, ensuring that all induced current detection units 3 are parallel to the device. Thus, each induced current detection unit 3 can independently sense the current change in its corresponding region. This non-invasive current detection method avoids the need for damaging the device packaging and implanting sensors as required by traditional methods, thereby fundamentally protecting the device's sealing, heat dissipation structure, and insulation performance. It ensures that the device's multi-physics balance system is not disrupted. Furthermore, this array structure design allows it to cover the entire effective cross-section of the device under test, enabling non-invasive detection of the current distribution within the entire wafer device.

[0062] In some embodiments of this application, multiple induced current detection groups are arranged sequentially at intervals along the second direction Y. That is, adjacent induced current detection groups are arranged at intervals along the second direction Y. For example, the interval between adjacent induced current detection groups can be 2mm, 3mm, 4mm, 5mm, or 6mm. This can avoid magnetic field crosstalk between adjacent induced current detection groups and reduce the impact on the accuracy of current distribution detection.

[0063] In some embodiments of this application, multiple induced current detection units 3 are arranged sequentially at intervals along the third direction Z. That is, adjacent induced current detection units 3 in each induced current detection group are arranged at intervals along the third direction Z. For example, the interval distance between adjacent induced current detection units 3 can be 2mm, 3mm, 4mm, 5mm, or 6mm. Furthermore, when multiple induced current detection groups are also arranged sequentially at intervals along the second direction Y, the current distribution detection component consists of multiple horizontally arrayed and spaced induced current detection units 3. This arrangement can precisely control the electromagnetic coupling range, so that each induced current detection unit 3 only responds to the current change in its corresponding region, thereby accurately realizing the spatial resolution detection of the current distribution.

[0064] In some embodiments of this application, such as Figure 2 and Figure 6 As shown, the device body 1 includes a base 11 and a cover plate 12. The base 11 includes a base body 111. The base body 111 is fixedly connected to the cover plate 12 and forms an installation space. The current distribution detection component is fixed in the installation space.

[0065] Specifically, the base body 111 has multiple mounting slots on one end face along the first direction X. Each mounting slot corresponds to a current sensing unit 3. In other words, the multiple mounting slots are arranged in a horizontal array. Furthermore, the cover plate 12 is fixed to the end face of the base body 111 with multiple mounting slots by bolts and forms a sealed installation space. That is, the multiple mounting slots are set in the installation space. It should be noted that the dimensional accuracy of the installation space needs to be controlled within ±0.1mm to ensure the positioning stability of the internal components. The current sensing unit 3 in each mounting slot can be fixed by epoxy resin potting. This encapsulation method has both mechanical reinforcement and insulation protection functions, thereby preventing the current sensing unit 3 from shaking and further reducing the impact on the accuracy of current distribution detection.

[0066] In some embodiments of this application, such as Figure 3 , Figure 4 and Figure 6 As shown, the base 11 also includes multiple mounting parts 112 groups, each of which is located in the mounting space. Along the second direction Y, the multiple mounting parts 112 groups are arranged at intervals in sequence. Each mounting part 112 group includes multiple mounting parts 112. Along the third direction Z, the multiple mounting parts 112 are arranged at intervals in sequence. Along the first direction X, each mounting part 112 is fixedly connected to the base body 111 and protrudes in a direction away from the base body 111. Each mounting part 112 is provided with a corresponding induced current detection unit 3, and each induced current detection unit 3 is arranged around the corresponding mounting part 112.

[0067] Specifically, adjacent mounting portions 112 are spaced apart along the second direction Y. For example, the spacing between adjacent mounting portions 112 can be 2mm, 3mm, 4mm, 5mm, or 6mm. In each mounting portion 112 group, adjacent mounting portions 112 are spaced apart along the third direction Z. For example, the spacing between adjacent mounting portions 112 can be 2mm, 3mm, 4mm, 5mm, or 6mm. Thus, the base body 111 is provided with a plurality of horizontally arrayed mounting portions 112. Optionally, the plurality of mounting portions 112 are all the same size.

[0068] Furthermore, along the first direction X, each mounting part 112 is fixedly connected to the base body 111 and protrudes in a direction away from the base body 111. The protrusion height of the mounting part 112 is 2-5mm. The cover plate 12 is fixed to one end face of the base body 111 with multiple mounting parts 112 by bolts and forms a sealed installation space. That is, multiple mounting parts 112 are arranged in the installation space. Since each mounting part 112 is provided with a corresponding induced current detection unit 3, and each induced current detection unit 3 is arranged around the corresponding mounting part 112, this arrangement forms a current distribution detection assembly composed of multiple horizontally arrayed induced current detection units 3. The mounting part 112 serves as a mechanical positioning reference, which can improve the arrangement accuracy of the induced current detection units 3, thereby improving the current distribution detection accuracy.

[0069] In some embodiments of this application, the mounting part 112 is constructed as a square column. That is, the cross-sectional shape of the mounting part 112 can be a square column (e.g., with a side length of 3mm). Thus, the base body 111 is provided with a plurality of square columns arranged in a horizontal array, and each induced current detection unit 3 is arranged circumferentially around the corresponding square column. Optionally, the coaxiality deviation between the induced current detection unit 3 and the square column is ≤50μm. This allows the induced current detection unit 3 to be as close as possible to the path of the current being measured, thereby improving the signal-to-noise ratio and improving the accuracy of current distribution detection.

[0070] In some embodiments of this application, the mounting portion 112 is constructed as a cylinder. That is, the cross-sectional shape of the mounting portion 112 can be cylindrical (e.g., with a diameter of 3mm). Thus, the base body 111 is provided with a plurality of horizontally arrayed cylinders, and each induced current detection unit 3 is arranged circumferentially around the corresponding cylinder. Optionally, the coaxiality deviation between the induced current detection unit 3 and the cylinder is ≤50μm, which is beneficial to improving the signal-to-noise ratio and thus improving the accuracy of current distribution detection.

[0071] In some embodiments of this application, such as Figure 5 , Figure 6 and Figure 7 As shown, the current distribution detection component includes a mounting plate 2, which includes a plurality of mounting holes 21 that correspond one-to-one with the mounting part 112. Each mounting hole 21 is fitted onto the corresponding mounting part 112, and each mounting hole 21 is provided with an induced current detection unit 3, so that each induced current detection unit 3 surrounds the corresponding mounting part 112.

[0072] Specifically, such as Figure 5As shown, the mounting plate 2 includes a plurality of arrayed mounting holes 21, the number of which is the same as the number of mounting portions 112. Each mounting hole 21 corresponds to a mounting portion 112, and the diameter of each mounting hole 21 is 0.05-0.1 mm larger than the outer diameter of the corresponding mounting portion 112, thereby forming a clearance fit so that each mounting hole 21 is fitted onto the corresponding mounting portion 112. Figure 7 As shown, an induced current detection unit 3 is integrated around each mounting hole 21, forming a closed detection loop around the mounting part 112. When the mounting plate 2 and the base 11 are assembled together, a current distribution detection assembly composed of multiple horizontally arranged induced current detection units 3 can be formed. The positioning assembly between the mounting part 112 and the mounting hole 21 is conducive to further improving the arrangement accuracy of the induced current detection units 3, thereby improving the current distribution detection accuracy.

[0073] In some embodiments of this application, such as Figure 7 As shown, each induced current detection unit 3 includes a Rogowski coil, and each Rogowski coil is disposed on the mounting plate 2 and arranged around the corresponding mounting hole 21.

[0074] Specifically, the induced current detection unit 3 includes a Rogowski coil, which can be a wound Rogowski coil or a printed circuit board Rogowski coil. For example, this application uses a printed circuit board Rogowski coil, which is directly formed on the surface of the mounting plate 2 through PCB etching process. Specifically, a rectangular or circular copper foil coil with a line width of 0.2mm is etched around the mounting hole 21. The number of coil turns is 20-50 turns, and the mutual inductance coefficient M reaches 0.1-1μH, which can respond to current changes in the nanosecond range.

[0075] When the power electronic device 200 is energized, the Rogowski coil senses the current change of the power electronic device 200 in real time and generates a small voltage signal. When the current changes, the Rogowski coil induces an electromotive force. The induced electromotive force signal is processed by the integrator module in the induced current detection unit 3 and converted into the actual current value. Since each Rogowski coil outputs a signal independently, the current distribution cloud map of the cross section of the power electronic device 200 is finally reconstructed.

[0076] It should be noted that each Rogowski coil is wound around the four sides of the mounting hole 21. Since two adjacent mounting holes 21 share a side, there may be situations where two Rogowski coils are wound around the same side. This situation is not significantly different from the winding method of Rogowski coils that do not share sides and will not affect the operation of the Rogowski coil. Meanwhile, the operating temperature of press-fit power electronic devices 200 often reaches above 125℃. Intrusive sensors (such as wire-connected miniature probes) may experience solder joint fatigue or detachment due to differences in thermal expansion coefficients. This solution completely avoids the risk of package damage through non-invasive testing, requires no additional solder joints, has high reliability, and can withstand high-temperature environments up to 125℃.

[0077] In some embodiments of this application, the mounting plate 2 is a one-piece molded part. That is, the mounting plate 2 can be constructed as a one-piece stamped part or as a one-piece cast part, which facilitates the production of the mounting plate 2 and helps to save costs.

[0078] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0079] The various embodiments in this specification are described in a progressive manner. Similar or identical parts between embodiments can be referred to interchangeably. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0080] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

[0081] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A current distribution detection device for power electronic devices, characterized in that, include: The device body, along the first direction, is in contact and bonded with the power electronic device; A current distribution detection component is disposed within the device body. The current distribution detection component includes multiple induced current detection groups arranged sequentially along a second direction. Each induced current detection group includes multiple induced current detection units arranged sequentially along a third direction. Each induced current detection unit is used to sense current changes. The first direction, the second direction, and the third direction are mutually perpendicular.

2. The current distribution detection device for power electronic devices according to claim 1, characterized in that, Along the second direction, a plurality of the induced current detection groups are arranged sequentially at intervals.

3. The current distribution detection device for power electronic devices according to claim 1 or 2, characterized in that, Along the third direction, multiple induced current detection units are arranged sequentially at intervals.

4. The current distribution detection device for power electronic devices according to claim 1, characterized in that, The device body includes a base and a cover plate. The base includes a base body, which is fixedly connected to the cover plate and forms an installation space. The current distribution detection component is fixed in the installation space.

5. The current distribution detection device for power electronic devices according to claim 4, characterized in that, The base also includes multiple mounting parts, each of which is disposed in the mounting space. Along the second direction, the multiple mounting parts are arranged at intervals in sequence. Each mounting part includes multiple mounting parts. Along the third direction, the multiple mounting parts are arranged at intervals in sequence. Along the first direction, each mounting part is fixedly connected to the base body and protrudes in a direction away from the base body. Each of the mounting portions is provided with a corresponding induced current detection unit, and each induced current detection unit is arranged around the corresponding mounting portion.

6. The current distribution detection device for power electronic devices according to claim 4, characterized in that, The mounting section is constructed as a square column.

7. The current distribution detection device for power electronic devices according to claim 4, characterized in that, The mounting section is constructed as a cylinder.

8. The current distribution detection device for power electronic devices according to claim 5, characterized in that, The current distribution detection component includes a mounting plate, which includes a plurality of mounting holes that correspond one-to-one with the mounting portions. Each mounting hole is fitted onto the corresponding mounting portion, and each mounting hole is provided with an induced current detection unit, so that each induced current detection unit surrounds the corresponding mounting portion.

9. The current distribution detection device for power electronic devices according to claim 8, characterized in that, Each of the induced current detection units includes a Rogowski coil, and each Rogowski coil is disposed on the mounting plate and arranged around the corresponding mounting hole.

10. The current distribution detection device for power electronic devices according to claim 8, characterized in that, The mounting plate is a one-piece molded part.

Images