Butt-joint expansion device of small computer

Abstract

The invention provides a docking expansion device of a small computer. The small computer comprises a heat dissipation module, a mainboard and a first connector. The heat dissipation module is arranged on one side of the mainboard, and the first connector is arranged on the mainboard and faces the other side opposite to the heat dissipation module. A dockeable expansion device includes a chassis and a mobile peripheral component interconnect express module (MXM) expansion board. The MXM expansion board comprises a slot used for being connected with the MXM graphic module and a second connector. The second connector is adapted to the first connector and is disposed toward the opening of the housing. The first connector is exposed from a bottom surface of the small computer, and the second connector is configured to align the first connector when the small computer is docked with the dockeable expansion device.

Description

Technical Field

[0001] This disclosure relates to a computer device expansion technology, and more particularly to a dockable expansion device for a small computer. Background Technology

[0002] A minicomputer is a small personal computer widely used in space-constrained environments due to its compact size, low power consumption, and portability. The most well-known minicomputer products on the market are Intel's Next Unit of Computing (NUC) series, and many computer manufacturers also produce similar minicomputers based on its size. Typically, a minicomputer measures about 4x4 inches. Due to its small size, minicomputers face significant limitations in hardware expansion; the internal space is insufficient to support standard-sized expansion cards, resulting in limited potential for performance enhancement. Therefore, the system configuration of a minicomputer is usually fixed at the factory, making it difficult for users to flexibly upgrade the system according to their needs.

[0003] In contrast, traditional desktop computers have enough space to enhance performance by installing expansion cards, such as graphics cards, which can improve graphics processing capabilities and artificial intelligence (AI) computing capabilities.

[0004] Currently, graphics expansion cards on the market mainly come in two forms: fan-type and Mobile PCI Express Module (MXM). MXM cards are mostly used in laptops due to their compact size. However, due to the complexity of installation and heat dissipation requirements, it is difficult for users to replace or upgrade MXM graphics cards themselves, whether in laptops or small computers.

[0005] Therefore, it is necessary to address the shortcomings of existing minicomputers in terms of hardware expandability in order to provide more flexible solutions for application needs such as graphics processing and AI computing. Summary of the Invention

[0006] In view of this, this disclosure proposes a dockable expansion device for a small computer, allowing users to easily expand the computing power of the small computer as needed.

[0007] The first aspect of this disclosure provides a dockable expansion device for a small computer. The small computer includes a heatsink, a motherboard, and a first connector. The heatsink is disposed on one side of the motherboard, and the first connector is disposed on the motherboard and faces the opposite side of the heatsink. The dockable expansion device includes a chassis and a Mobile PCI Express Module (MXM) expansion board. The MXM expansion board includes a slot for connecting an MXM graphics module and a second connector. The second connector is adapted to the first connector and is disposed facing an opening in the chassis. The first connector protrudes from the bottom surface of the small computer, and the second connector is configured to align with the first connector when the small computer is docked with the dockable expansion device.

[0008] In some embodiments of the first aspect, the aforementioned slot is located on the side of the MXM expansion board away from the opening in the housing.

[0009] In some embodiments of the first aspect, the aforementioned housing includes an accommodating space located on the side of the MXM expansion board away from the opening.

[0010] In some embodiments of the first aspect, the length of the aforementioned housing is greater than or equal to 117 mm, the width of the housing is greater than or equal to 112 mm, and the height of the housing is greater than or equal to 50 mm.

[0011] In some embodiments of the first aspect, the length of the aforementioned accommodating space is greater than or equal to 102 mm, the width of the accommodating space is greater than or equal to 90 mm, and the height of the accommodating space is greater than or equal to 35 mm.

[0012] In some embodiments of the first aspect, the aforementioned dockable expansion device further includes a second heat dissipation module disposed within the accommodating space and used to dissipate heat from the MXM graphics module.

[0013] In some embodiments of the first aspect, the first connector described above includes a high-speed signal female connector, the second connector includes a high-speed signal male connector, and the second connector protrudes from the top surface of the dockable expansion device by a first height through an opening in the housing.

[0014] In some embodiments of the first aspect, the aforementioned dockable expansion device further includes a male alignment component that protrudes a second height from the top surface of the dockable expansion device toward the opening of the housing, and the second height is greater than the first height. Attached Figure Description

[0015] The accompanying drawings exemplify embodiments and form part of the specification, serving together with the textual description to explain exemplary implementations of the embodiments. Obviously, the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without creative effort. In all the drawings, the same reference numerals refer to similar but not necessarily identical elements.

[0016] Figure 1 This is a schematic diagram illustrating a small computer and a dockable expansion device according to an embodiment of the present disclosure.

[0017] Figure 2 This is a six-view view showing a small computer according to an embodiment of the present disclosure.

[0018] Figure 3 This is a six-view diagram showing a dockable expansion device according to an embodiment of the present disclosure.

[0019] Figure 4A This is a side view schematic diagram illustrating an accommodating space according to an embodiment of the present disclosure.

[0020] Figure 4B This is a top view schematic diagram showing an accommodating space according to an embodiment of the present disclosure.

[0021] Figure 5 This is a schematic diagram illustrating the docking of a small computer and a dockable expansion device according to an embodiment of the present disclosure.

[0022] Figure 6 This is an expansion schematic diagram illustrating a small computer, a dockable expansion device, and at least one expansion module according to an embodiment of the present disclosure. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this disclosure clearer, the disclosure will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0024] In this disclosure, the term "multiple" means two or more, unless otherwise stated. In this disclosure, the term "and / or" describes the relationship between related objects, encompassing any one of the listed objects and all possible combinations thereof. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship.

[0025] In this disclosure, unless otherwise stated, the terms “first,” “second,” etc., are used to distinguish similar objects and are not intended to limit their positional, temporal, or importance relationships. It should be understood that such terms may be used interchangeably where appropriate so that the embodiments of this disclosure described herein can be implemented in ways other than those illustrated or described herein.

[0026] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, system, product, or apparatus.

[0027] Figure 1 This is a schematic diagram showing a small computer 100 and a dockable expansion device 200 according to an embodiment of the present disclosure; Figure 2 This is a six-view view showing a small computer 100 according to an embodiment of the present disclosure; Figure 3 This is a six-view view showing a dockable expansion device 200 according to an embodiment of the present disclosure.

[0028] Please refer to Figure 1 and Figure 2 The minicomputer 100 includes a heat dissipation module 110, a motherboard 120, and a connector 130, wherein the connector 130 is disposed on the motherboard 120 and faces the side opposite to the heat dissipation module 110. Figure 1 Taking a specific perspective, the heat dissipation module 110 is located on the upper surface of the motherboard 120, while the connector 130 is located on the motherboard 120. Figure 1 and Figure 2 As can be seen, connector 130 faces the lower surface of motherboard 120 and protrudes from the bottom surface of minicomputer 100. For example, connector 130 on motherboard 120 is used to couple (e.g., directly or indirectly) expansion cards such as MXM graphics modules that can increase the computing power of minicomputer.

[0029] In some embodiments, the minicomputer 100 further includes multiple electronic components such as a processor and memory, which are disposed on the same side of the motherboard 120 as the heat dissipation module 110. In some embodiments, the heat dissipation module 110 is, for example, a fan module.

[0030] In some embodiments, multiple electronic components of the minicomputer 100 (e.g., heat dissipation module 110, motherboard 120, and connector 130) are disposed within the casing 140 of the minicomputer 100.

[0031] In some embodiments, the minicomputer 100 includes a Video Electronics Standards Association (VESA) mounting interface for mounting the minicomputer 100 to a display device (e.g., behind) such as a computer screen.

[0032] In some embodiments, the small computer 100 is also referred to as a mini personal computer (Mini PC).

[0033] Please refer to Figure 1 and Figure 3 The dockable expansion device 200 includes a Mobile PCI Express Module (MXM) expansion board 210 and a housing 240 for accommodating the various components of the dockable expansion device 200. Figure 1 Taking perspective as an example, refer to Figure 3 As can be seen, the housing 240 has an upward-facing opening 290, and the MXM expansion board 210 is provided with a connector 230, which faces the opening 290 of the housing 240, allowing the connector 230 to protrude from the top surface of the dockable expansion device 200. For example, the connector 230 can be provided on the upper surface of the MXM expansion board 210. On the other hand, the lower surface of the MXM expansion board 210 is provided with a slot 220 for connecting an MXM graphics module 280, such as an MXM graphics display card.

[0034] In some embodiments, the housing 240 of the expansion device 200 further includes a heat dissipation module 250 disposed on one side of the lower surface of the MXM expansion board 210 (e.g., on the side of the MXM expansion board 210 away from the opening 290) for heat dissipation of the MXM graphics module 280. In other words, the opening 290 of the housing 240 is located on one side of the MXM expansion board 210, while the slot 220 and the heat dissipation module 250 are located on the other side of the MXM expansion board 210. In some embodiments, the heat dissipation module 250 is, for example, a fan module.

[0035] In some embodiments, please refer to Figure 3 The side of the housing 240 of the expansion device 200 includes at least one side opening 270, the position of which is set to correspond to the output port of the MXM graphics module 280.

[0036] In some embodiments, the dockable expansion device 200 includes a VESA mounting interface for simultaneously mounting the minicomputer 100 and the dockable expansion device 200 to a display device such as a computer screen (e.g., at the rear). For example, both the MXM expansion board 210 and the housing 240 include VESA mounting interfaces, so the bottom surface of the dockable expansion device 200 can be mounted at the rear of the display device, and the bottom surface of the minicomputer 100 can be mounted at the top surface of the dockable expansion device 200, for example.

[0037] Please refer to the following at the same time Figure 1 , Figure 2 and Figure 3 The bottom surface of the minicomputer 100 can mate with the top surface of the dockable expansion device 200, and during docking, the connector 130 of the minicomputer 100 is aligned with the connector 230 of the dockable expansion device 200, wherein the connector 130 and the connector 230 are, for example, mated to each other.

[0038] In some embodiments, the connector 130 of the minicomputer 100 and the connector 230 of the dockable expansion device 200 are male and female connectors of the same specification. For example, connector 130 may be a high-speed signal female connector, and connector 230 may be a high-speed signal male connector. In some embodiments, such as Figure 2 and Figure 3 As shown, the bottom surface of the minicomputer 100 is provided with a recessed or female alignment component 160, and the top surface of the dockable expansion device 200 is provided with a protruding or male alignment component 260. The height of the alignment component 260 protruding from the top surface of the dockable expansion device 200 is greater than the height of the connector 230 protruding from the top surface of the dockable expansion device 200. Accordingly, the smoothness of docking can be improved.

[0039] In some embodiments, when a user has a need to expand the minicomputer 100, for example, a dockable expansion device 200 with an MXM graphics module 280 can be docked with the minicomputer 100, which is equivalent to plugging the MXM graphics module 280 into the motherboard 120 of the minicomputer 100, thereby expanding the computing power of the minicomputer 100.

[0040] In some embodiments, the bottom surface of the minicomputer 100 and the top surface of the dockable expansion device 200 have the same dimensions, for example.

[0041] In some embodiments, in order to accommodate the heat dissipation module 250 within the housing 240, the housing 240 is designed to include a receiving space of a specific size, such that this receiving space can be reserved for the heat dissipation module 250. In other words, this receiving space designed into the housing 240 is located on the other side of the MXM expansion board 210 relative to the housing opening or relative to the connector 230, and there are no structures other than the heat dissipation module 250 therein. In some embodiments, heat dissipation windows are provided on the housing 240 (e.g., on the sides and / or bottom) at locations corresponding to the aforementioned receiving space.

[0042] In some embodiments, the dimensions of the housing 240 are greater than or equal to 117 mm * 112 mm * 50 mm. Specifically, the length of the housing 240 is greater than or equal to 117 mm, the width of the housing 240 is greater than or equal to 112 mm, and the height of the housing 240 is greater than or equal to 50 mm.

[0043] In some embodiments, such as Figure 3 As shown, the dimensions of the housing 240 are approximately 120 mm * 117 mm * 50 mm. For example, the length of the housing 240 is approximately 120 mm, the width of the housing 240 is approximately 117 mm, and the height of the housing 240 is approximately 50 mm.

[0044] In some embodiments, the dimensions of the accommodating space within the housing 240 are greater than or equal to 102 mm * 90 mm * 35 mm. Specifically, the length of the accommodating space within the housing 240 is greater than or equal to 102 mm, the width of the accommodating space within the housing 240 is greater than or equal to 90 mm, and the height of the accommodating space within the housing 240 is greater than or equal to 35 mm.

[0045] Figure 4A This is a side view schematic diagram showing an accommodating space according to an embodiment of the present disclosure; Figure 4B This is a top view schematic diagram showing an accommodating space according to an embodiment of the present disclosure, wherein Figure 4A For example, it is with Figure 1 They share the same perspective.

[0046] Please refer to Figure 4A and Figure 4B In some embodiments, the housing 240 includes an MXM expansion board 210, and the MXM graphics module 280 is, for example, inserted into a slot 220 of the MXM expansion board 210. The accommodating space within the housing 240 is, for example, designed to be located below the MXM graphics module 280 and has dimensions of 102.5 mm * 93 mm * 37.8 mm.

[0047] Advantageously, when the MXM expansion board 210 and the MXM graphics module 280 are designed inside the housing 240, and a certain size of accommodating space is reserved at a specific location relative to the above-mentioned locations, it can be ensured that the heat dissipation module 250 can be placed in the accommodating space corresponding to the MXM graphics module 280 to effectively dissipate heat from the MXM graphics module.

[0048] More specifically, due to the high computing power of the MXM graphics module 280, adequate heat dissipation is necessary. Furthermore, the processing unit locations or areas with the highest heat dissipation requirements may differ between different brands or models of MXM graphics modules 280. Therefore, a well-designed internal space within the chassis 240 allows the interfacing expansion module 200 to accommodate a wider range of different MXM graphics modules 280, while ensuring that all these MXM graphics modules 280 are effectively cooled to achieve optimal operating performance.

[0049] It must be stated that, Figure 2 , Figure 3 , Figure 4A and Figure 4B All dimensions are indicated in millimeters and are for illustrative purposes only and are not intended to limit this disclosure.

[0050] Figure 5 This is a schematic diagram illustrating the docking of a small computer 100 and a dockable expansion device 200 according to an embodiment of the present disclosure. It should be noted that... Figure 5 The left side shows a perspective view of the small computer 100 docked with the dockable expansion device 200. However, to clearly show the components involved in the docking, Figure 5 On the right side, only the motherboard 120 of the minicomputer 100 and the MXM expansion board 210 that can be connected to the expansion device 200 are retained.

[0051] Please refer to Figure 5 The bottom surface of the minicomputer 100 can mate with the top surface of the dockable expansion device 200. During docking, the connector 130 of the minicomputer 100 protrudes from the housing 140 and aligns with the connector 230 of the dockable expansion device 200. Furthermore, the alignment component 260 on the top surface of the dockable expansion device 200 also aligns with the alignment component 160 (not shown) on the bottom surface of the minicomputer 100. Figure 5 Alignment is used as a guide during docking.

[0052] It is worth mentioning that, due to size constraints, the minicomputer 100 may have expansion needs beyond computing power, such as additional ports. Therefore, the dockable expansion device 200, in addition to providing... Figure 5 In addition to directly interfacing with the minicomputer 100, it can also be indirectly connected to the minicomputer 100 by interfacing with other expansion modules.

[0053] Figure 6 This is an expansion schematic diagram illustrating a small computer 100, a dockable expansion device 200, and at least one expansion module 300 according to an embodiment of the present disclosure.

[0054] Please refer to Figure 6 In some embodiments, the minicomputer 100 may first be connected in series with at least one expansion module 300, and then finally connected to the dockable expansion device 200. For example, at least one expansion module 300 may include one or more of, or a combination of, a Universal Serial Bus (USB) port expansion module, a COM port expansion module, a Digital Input / Output (DIO) port expansion module, and a Local Area Network (LAN) port expansion module.

[0055] In some embodiments, the expansion module 300 may include a module expansion board with corresponding ports and a housing. The top and bottom surfaces of the housing may both have openings. The module expansion board is provided with two connectors facing the top and bottom surfaces of the housing, one connector (e.g., a male connector) protruding from the top surface of the expansion module 300, and the other connector (e.g., a female connector) protruding from the bottom surface of the expansion module.

[0056] In some embodiments, the side of the housing of the expansion module 300 includes at least one opening, the position of which is set to correspond to a port (e.g., USB, COM, DIO, LAN, etc.) on the expansion board of the module.

[0057] Please refer to Figure 6 The bottom surface of the minicomputer 100 can mate with the top surface of an expansion module 300, and during mating, the connector 130 of the minicomputer 100 aligns and matches with the connector exposed on the top surface of the expansion module 300. Conversely, the bottom surface of the expansion module 300 can mate with the top surface of another expansion module 300, and during mating, the connector exposed on the bottom surface of the expansion module 300 aligns and matches with the connector exposed on the top surface of the other expansion module 300. Furthermore, the top surface of the dockable expansion device 200 can mate with the bottom surface of an expansion module 300, and during mating, the connector 230 of the dockable expansion module 200 aligns and matches with the connector exposed on the bottom surface of the expansion module 300.

[0058] In some embodiments, the connector 130 of the minicomputer, the connector 230 of the dockable expansion device 200, and the connector exposed on the top surface of the expansion module 300 are all male and female connectors of the same specification, and the two connectors exposed on the top and bottom surfaces of the expansion module 300 are also male and female connectors of the same specification. For example, the connector 130 and the connector exposed on the bottom surface of the expansion module 300 can be high-speed signal female connectors, and the connector 230 and the connector exposed on the top surface of the expansion module 300 can be high-speed signal male connectors.

[0059] In this way, the minicomputer 100, at least one expansion module 300, and dockable expansion device 200 can be docked with each other in a stacked manner and work together to achieve the goal of expanding the minicomputer 100 according to user needs.

[0060] In summary, the dockable expansion device for a small computer proposed in this disclosure, through its designed expansion board and connector arrangement, allows users to easily expand the computing power of the small computer according to their needs. In particular, for MXM graphics modules with high computing power and heat dissipation requirements, this disclosure provides sufficient space within the dockable expansion device to accommodate heat dissipation modules such as fans, effectively cooling the MXM graphics module in the corresponding locations.

[0061] While this document includes numerous details, these details should not be construed as limiting the scope of the claimed invention, but rather as descriptions of features specific to particular embodiments. Certain features described herein in the context of different embodiments may also be combined in a single embodiment. Conversely, various features described in the context of a single embodiment may be implemented separately or in any suitable sub-combination in multiple embodiments. Furthermore, while features may be described above as acting in certain combinations and even initially claimed, one or more features from a claimed combination may be removed from the combination in some cases, and the claimed combination may be for sub-combinations or variations thereof. Similarly, although operations are depicted in a specific order in the figures, this should not be construed as requiring such operations to be performed in the specific order shown or in a sequential order, or to perform all illustrated operations to achieve the desired result.

[0062] Only a few implementations and examples have been described, and other implementations, enhancements and variations may be made based on what is described and shown in this disclosure.

Claims

1. A dockable expansion device for a small computer, characterized in that, The minicomputer includes a first heat dissipation module, a motherboard, and a first connector. The first heat dissipation module is disposed on one side of the motherboard, and the first connector is disposed on the motherboard and faces the opposite side to the first heat dissipation module. The dockable expansion device includes: The casing has an opening; as well as The MXM expansion board for mobile high-speed peripheral component interconnect modules includes: Slots for connecting MXM graphics modules; as well as A second connector, adapted to the first connector and disposed toward the opening, wherein the first connector protrudes from the bottom surface of the minicomputer, and the second connector is configured to align with the first connector when the minicomputer is docked with the dockable expansion device.

2. The dockable expansion device as described in claim 1, characterized in that, The slot is located on the side of the MXM expansion board away from the opening.

3. The dockable expansion device as described in claim 1, characterized in that, The casing includes A accommodating space located on the side of the MXM expansion board away from the opening.

4. The dockable expansion device as described in claim 3, characterized in that, The length of the housing is greater than or equal to 117 mm, the width of the housing is greater than or equal to 112 mm, and the height of the housing is greater than or equal to 50 mm.

5. The dockable expansion device as described in claim 4, characterized in that, The length of the accommodating space is greater than or equal to 102 mm, the width of the accommodating space is greater than or equal to 90 mm, and the height of the accommodating space is greater than or equal to 35 mm.

6. The dockable expansion device as described in claim 3, characterized in that, Also includes: The second heat dissipation module is disposed within the accommodating space and is used to dissipate heat from the MXM graphics module.

7. The dockable expansion device as described in claim 1, characterized in that, The first connector includes a high-speed signal female connector, the second connector includes a high-speed signal male connector, and the second connector protrudes from the top surface of the dockable expansion device by a first height through the opening.

8. The dockable expansion device as described in claim 7, characterized in that, Also includes: The male alignment component protrudes a second height from the top surface in the direction of the opening of the opening. The second height is greater than the first height.

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