Numerical simulation method and device for silica gel failure of photovoltaic module and electronic equipment
By simulating the mechanical performance parameters of silicone in photovoltaic modules using a finite element analysis model, the failure time and state under load are predicted, solving the problem of unpredictable silicone failure time and improving the stability and water vapor intrusion resistance of the modules.
Patent Information
- Application Number
- CN202511093175.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-05
- Publication Date
- 2025-11-14
Smart Images
Figure CN120951683A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photovoltaic module technology, and in particular to a numerical simulation method, apparatus and electronic equipment for silicone failure in photovoltaic modules. Background Technology
[0002] Silicone plays a crucial role in photovoltaic (PV) modules, serving as a key material for ensuring module performance and stability. Currently, PV modules are subjected to various types of loads during operation, and silicone bears a significant portion of these mechanical loads. When silicone fails due to external factors, the PV module's frame and glass may separate, leading to module breakage. Silicone failure can also allow external moisture to enter the laminate, causing the solar cells to become damp and fail. Furthermore, predicting the timing and state of silicone failure during testing and daily use is challenging, making it impossible to foresee the moment of PV module failure and thus hindering the implementation of effective preventative measures. Summary of the Invention
[0003] The purpose of this application is to provide a numerical simulation method, apparatus, and electronic device for silicone failure in photovoltaic modules, so as to alleviate the above-mentioned technical problems existing in the prior art.
[0004] In a first aspect, the present invention provides a numerical simulation method for silicone failure in photovoltaic modules, the method comprising: The mechanical properties of silicone are obtained through silicone material parameter tests; the mechanical properties include at least one or more of peel strength, shear strength, and tensile strength. The mechanical properties of silicone are imported into the pre-established target finite element model of the photovoltaic module; the target finite element model is formed by adding cohesive control parameters to the initial finite element model to simulate the peeling state of silicone under load. Predict the failure time and state of photovoltaic modules under mechanical loads using a target finite element model.
[0005] In an optional implementation, when the mechanical property parameter is peel strength, the mechanical property parameters of the silicone are obtained through silicone material parameter tests, including: Cut out the test specimen and install it into the upper and lower clamps of the testing machine, ensuring that the silicone adhesive part is facing the clamping area of the testing machine. Set the test parameters on the testing machine. The test parameters should include at least the test speed, peel angle and maximum load. Start the testing machine and gradually apply force to the preset load boundary threshold or until the specimen completely fails, and record the current target stress; The mechanical properties of silicone are determined by the maximum load and the size of the test specimen.
[0006] In an optional implementation, the mechanical property parameters of the silicone are imported into a pre-established target finite element model of the photovoltaic module, including: An initial finite element model should be suggested in advance; Mesh the initial finite element model to generate the target mesh density in the model bonding region; By combining the cohesive model with the initial finite element model, a pre-established target finite element model of the photovoltaic module is obtained. The mechanical properties of silicone are imported into the pre-established target finite element model of the photovoltaic module.
[0007] In an optional implementation, the mechanical property parameters of the silicone are imported into a pre-established target finite element model of the photovoltaic module, including: Select the peel adhesion mode as the hybrid mode; the hybrid mode includes both shear mode and tensile mode failure modes. Cancel the simulation of tangential slip behavior; The maximum normal / tangential contact stress and the contact distance at which peeling is completed are determined as the target stress obtained from the peeling test. Determine the preset damping coefficient and power-law distribution index.
[0008] In an optional implementation, after importing the mechanical property parameters of the silicone into a pre-established target finite element model of the photovoltaic module, the method further includes: The silicone failure area of the target finite element model is defined as the preset contact area; wherein, the preset contact area includes the first adhesive surface inside the silicone and the second adhesive surface outside the laminate. When the tensile stress exceeds the preset stress or the shear strength exceeds the preset strength, the mesh failure and peeling in the contact area are determined.
[0009] In an optional implementation, the failure time and state of the photovoltaic module under mechanical load are predicted using a target finite element model, including: Appropriate boundary conditions and loads are applied to the target finite element model to simulate the stress state of the actual working environment of the photovoltaic module; Pre-set cohesive control parameters; the cohesive control parameters include at least one or more of the following: initial interface shear stress, interface strength, interface hardening rule, and damage evolution rule; Determine the failure simulation type, and simulate the response of the photovoltaic module under the corresponding load under the corresponding failure simulation type to predict the failure time and state of the photovoltaic module under a certain mechanical load; among which, the failure simulation type includes static simulation, dynamic simulation or fatigue simulation.
[0010] In an optional implementation, the method further includes: Post-processing of the analysis results for the silicone bonding area includes viewing stress, strain distribution, interface peel length, and energy dissipation; Use visual tools to visualize the peeling process and final state.
[0011] Secondly, the present invention provides a numerical simulation device for silicone failure in photovoltaic modules, the device comprising: The parameter acquisition module is used to obtain the mechanical property parameters of silicone through silicone material parameter tests; wherein the mechanical property parameters include at least one or more of peel strength, shear strength and tensile strength; The parameter import module is used to import the mechanical property parameters of silicone into the pre-established target finite element model of the photovoltaic module; the target finite element model is the initial finite element model with added cohesive force control parameters to simulate the peeling state of silicone under load. The prediction module is used to predict the failure time and state of photovoltaic modules under mechanical loads using a target finite element model.
[0012] Thirdly, the present invention provides an electronic device including a processor and a memory, the memory storing computer-executable instructions that can be executed by the processor, the processor executing the computer-executable instructions to implement the numerical simulation method for silicon failure of photovoltaic modules according to any of the foregoing embodiments.
[0013] Fourthly, the present invention provides a computer-readable storage medium storing computer-executable instructions, which, when called and executed by a processor, cause the processor to implement the numerical simulation method for silicon failure of photovoltaic modules according to any of the foregoing embodiments.
[0014] The numerical simulation method, apparatus, and electronic equipment for silicone failure in photovoltaic modules provided in this application obtain the mechanical property parameters of silicone through silicone material parameter tests. These mechanical property parameters include at least one or more of peel strength, shear strength, and tensile strength. The mechanical property parameters of the silicone are then imported into a pre-established target finite element model of the photovoltaic module. The target finite element model incorporates cohesive force control parameters into the initial finite element model to simulate the peeling state of the silicone under load. The failure time and state of the photovoltaic module under mechanical load are predicted using the target finite element model. This method, by incorporating cohesive force control parameters into the finite element analysis model to simulate the peeling state of silicone under load, predicts whether the current module will fail under a certain mechanical load, thereby improving the accuracy of predicting the silicone failure time and state. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0016] Figure 1 This is a schematic diagram of a groove gluing process provided in an embodiment of this application; Figure 2 This application provides a schematic diagram of silicone distribution after frame assembly. Figure 3 A flowchart illustrating a numerical simulation method for silicone failure in photovoltaic modules, provided in an embodiment of this application; Figure 4 This is a schematic diagram of a peel strength test provided in an embodiment of this application; Figure 5 This application provides a schematic diagram of importing finite element parameters into a CZM model. Figure 6 This is a schematic diagram of silicone bonding provided in an embodiment of this application; Figure 7 A schematic diagram of the inner adhesive surface of silicone provided in an embodiment of this application; Figure 8 This is a schematic diagram of the outer bonding surface of a laminate provided in an embodiment of this application; Figure 9 This is a schematic diagram comparing the deformation states of a model, provided as an embodiment of this application. Figure 10 A flowchart for numerical simulation of silicone failure provided in this application embodiment; Figure 11 A structural diagram of a numerical simulation device for silicone failure in photovoltaic modules provided in this application embodiment; Figure 12 This is a structural diagram of an electronic device provided in an embodiment of this application. Detailed Implementation
[0017] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0018] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0019] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0020] Silicone plays several crucial roles in photovoltaic (PV) modules, primarily including bonding, sealing, potting, weather resistance, insulation, and resistance to yellowing. As an adhesive, silicone bonds the solar cells, EVA film, glass, and backsheet together to form a stable and robust structure. Simultaneously, silicone acts as a sealant, forming a protective film to prevent moisture and gas ingress, thus maintaining the module's long-term performance and stability. Silicone possesses excellent weather resistance, resisting the effects of harsh environments such as ultraviolet radiation and acid rain, ensuring stable performance during long-term use. Therefore, silicone plays a vital role in PV modules and is one of the key materials for ensuring module performance and stability. As an important material for bonding laminates to the frame, silicone not only ensures the module's mechanical reliability to a certain extent but also plays a crucial role in isolating the internal solar cells from moisture.
[0021] During the framing process of photovoltaic modules, the adhesive applicator presses a certain amount of silicone onto the grooves in the frame. (See attached image.) Figure 1 As shown. After the silicone is squeezed onto all four sides of the frame, wrap the laminate with the grooves of the frame and apply pressure to make it fit together. When the frame assembly is complete, the silicone distribution in the grooves is basically as shown. Figure 2 As shown.
[0022] However, photovoltaic modules are subject to various types of loads during daily operation, such as static mechanical loads (including the module's own weight, wind and snow loads, etc.). During installation and operation, photovoltaic modules need to withstand their own weight and natural loads such as wind and snow; there are also dynamic loads, temperature loads, and some man-made mechanical loads, such as trampling and pulling. Silicone plays a crucial role in these mechanical load performance aspects. When silicone fails due to external factors, the module's frame and glass may separate, leading to module breakage. Silicone failure can also allow external moisture to enter the laminate, causing the solar cells to become damp and fail. Furthermore, predicting the timing and state of silicone failure during testing or daily use is quite challenging.
[0023] Based on this, the embodiments of this application provide a numerical simulation method, device and electronic equipment for silicone failure of photovoltaic modules. Using the finite element simulation method can reduce the cost of actual physical testing, while predicting the yield distribution and deformation of silicone under different loading conditions, environmental factors and material properties, and providing intuitive cloud maps of stress and strain distribution at the silicone bonding joint.
[0024] This application provides a numerical simulation method for silicone failure in photovoltaic modules. See [link to relevant documentation]. Figure 3 As shown, the method mainly includes the following steps: Step S110: Obtain the mechanical property parameters of silicone through silicone material parameter tests; wherein the mechanical property parameters include at least one or more of peel strength, shear strength and tensile strength.
[0025] In one embodiment, the mechanical properties of silicone can be obtained through peel strength / shear strength / tensile strength tests. This is achieved by bonding silicone to two materials and then performing peeling / shearing / stretching along the bond line. The corresponding peel / shear / tensile strengths of the silicone can be measured. Higher corresponding strengths indicate better adhesive performance of the silicone.
[0026] In an optional implementation, when the mechanical property parameter is peel strength, obtaining the mechanical property parameters of silicone through silicone material parameter testing may include the following steps: Step 1.1) Cut out the test specimen and install it into the upper and lower clamps of the testing machine, ensuring that the silicone adhesive part is facing the clamping area of the testing machine. Step 1.2): Set the test parameters on the testing machine. The test parameters should include at least the test speed, peel angle, and maximum load. Step 1.3), start the testing machine, gradually apply force to the preset load boundary threshold or until the specimen completely fails, and record the current target stress; Step 1.4) Determine the mechanical property parameters of silicone by using the maximum load and the size of the test specimen.
[0027] like Figure 4 The diagram illustrates a peel strength test. The peel strength test is a method used to assess the maximum force a material can withstand when its bonded interface is forcibly separated. The peel strength tester applies gradually increasing forces to test the peel strength of the material or bonded portion. When the applied force reaches a certain level, the bonded interface begins to break down; the force value recorded at this point is the peel strength. This force value is usually expressed in Newtons (N) or grams (g), reflecting the adhesive material's resistance to interface separation.
[0028] The experimental steps are as follows: 1. Sample preparation: Cut standard test specimens, the size and shape of which should be determined according to the testing standards or the requirements of the testing machine. For silicone, the specimens are usually rectangular or circular sheets, bonded to two pieces of tooling material; 2. Sample Installation: Install the prepared sample into the upper and lower clamps of the testing machine. Ensure that the silicone adhesive portion is aligned with the clamping area of the testing machine; 3. Parameter settings: Set the required test parameters on the testing machine, such as test speed, peel angle, maximum load, etc. 4. Test Recording: Start the testing machine and gradually apply force to the preset maximum load or until the sample is completely peeled off. During the test, the testing machine will automatically record the relationship between force and time. When the maximum load is reached or the sample peels off, the testing machine will stop and record the current force value.
[0029] 5. Data Analysis: Analyze the recorded data. The peel strength can be calculated by dividing the maximum load by the width of the sample.
[0030] Table 1 shows the silicone material parameters. Tensile strength and shear strength determine the delamination state between the adhesive layer and the bonding surface. These two important material parameters can be imported into the finite element parameters related to the silicone failure criterion (cohensive zonemateria). CZM (Cracked Zone Mechanism) plays a crucial role in limiting the toughness and ductility of multiphase materials (such as matrix-matrix composites and layered composite structures) by representing fracture or delamination along the interphase interface. Interfacial delamination is modeled using traditional fracture mechanics methods (such as nodal release techniques). A technique that directly introduces the fracture mechanism, employing the softening relationship between traction force and delamination, is used to introduce the critical fracture energy, which is also the energy required for interfacial surface fracture.
[0031] Table 1. Silicone Material Parameters
[0032] The Cohesive Zone Model (CZM) is a computational model used to simulate failure at material interfaces or bonded zones. The CZM model can simulate the interactions between materials and the damage and fracture processes at the interface. This model is particularly useful in analyzing composite materials, bonded joints, and interfacial fracture problems. The cohesive zone model describes a small cohesive region at the interface or bonded zone of a material, where the stress is a function of displacement. As the displacement increases, the stress within the cohesive zone also increases until a critical value is reached, leading to interfacial failure. The interfacial surface of a material can be represented by a set of special interfacial elements or contact elements, and the CZM model is used to describe the behavior of the interface. In this application, the critical stress of the cross-section is used as the criterion for delamination.
[0033] Step S120: Import the mechanical property parameters of silicone into the pre-established target finite element model of the photovoltaic module; the target finite element model is the initial finite element model with added cohesive force control parameters to simulate the peeling state of silicone under load.
[0034] The target finite element model mentioned above is the Cohesive Zone Method (CZM), which is used to handle contact problems in finite element analysis and is typically used to simulate the contact and interaction between two or more objects. In the CZM model, the contact surface is divided into contact and non-contact regions, and the mechanical behavior of the contact regions is described by a specific mathematical model.
[0035] 1. Contact Conditions: Contact conditions are typically determined by the properties of the contact pair, including normal contact force and tangential friction force. In CZM, these conditions are usually described by the following equations: Normal contact: f n =μ n *g, where f n It is the normal contact force, μ n is the normal friction coefficient, and g is the normal force on the contact surface; Tangential contact: f t =μ t *g, where f t It is the tangential contact force, μ t is the tangential friction coefficient, and g is the normal force on the contact surface; 2. Penalty Function: Used to introduce contact conditions in finite element analysis. This method forces the displacement on the contact surface to be zero by adding a penalty term to the energy function. This penalty term is typically expressed as: 0.5×K×δ 2 Where K is a constant and δ is the displacement on the contact surface.
[0036] In an optional implementation, importing the mechanical property parameters of silicone into a pre-established target finite element model of the photovoltaic module may include the following steps: Step 2.1), pre-suggest an initial finite element model; Step 2.2) Mesh the initial finite element model to generate the target mesh density in the model bonding region; Step 2.3) combines the cohesion model with the initial finite element model to obtain the pre-established target finite element model of the photovoltaic module; Step 2.4) imports the mechanical property parameters of silicone into the pre-established target finite element model of the photovoltaic module.
[0037] In another alternative implementation, importing the mechanical property parameters of silicone into a pre-established target finite element model of the photovoltaic module may include the following steps: Step 3.1) Select the peel adhesion mode as the hybrid mode; wherein, the hybrid mode includes both shear mode and tensile mode failure modes; Step 3.2), cancel the simulation of tangential slip behavior; Step 3.3) The maximum normal / tangential contact stress and the contact distance at which peeling is completed are determined as the target stress obtained from the peeling test. Step 3.4) Determine the preset damping coefficient and power-law distribution index.
[0038] In practical applications, the scheme of this application is applied to ANSYS software, wherein the numerical model processing is performed by the spaceClaim module in ANSYS, the physical field construction is performed by the mechanical module, and the calculation processing is performed by the static structural module.
[0039] In one implementation, the mechanical property parameters of the silicone are imported into a pre-established target finite element model of the photovoltaic module, see [link to relevant documentation]. Figure 5As shown, the first item, Debonding Interface Mode, is selected as Mixed. The Mixed mode is used to characterize interface failure, which includes both shear and tension modes. This means that the interface will experience both slip (shear) and separation (tension) simultaneously upon failure, which is more consistent with the failure mode of silicone in actual component load testing. The second item, Tangential slip under normal compression, is selected as NO because the tangential slip behavior of silicone or other adhesive materials is not significant under normal compression. Therefore, tangential slip is not considered to simplify the model and analysis. The maximum normal / tangential contact stress and the contact distance at which debonding is completed are both data obtained from the above debonding test. The artificial damping coefficient is defined as 0.001, which requires a certain degree of damping to ensure numerical stability and convergence. Too small a damping coefficient may lead to calculation instability, while too large a damping coefficient may lead to overly convergent results, losing the realism of the simulation. Therefore, this preferred result was selected through multiple experiments. The Power law exponent for mixed-mode debonding is the power law distribution of the stress-displacement relationship of the material during mixed-mode debonding. In this embodiment, it is selected as 2. The power-law distribution is an exponential distribution that describes the probabilistic distribution of a random variable within a certain range. In mechanics, the power-law distribution is often used to represent the distribution characteristics of material strength or failure behavior. This mechanical behavior is typically applicable to the stress-strain relationship near the material's yield point.
[0040] Step S130: Predict the failure time and state of the photovoltaic module under mechanical load using the target finite element model.
[0041] After importing the CZM finite element parameters, you can define the relevant silicone failure locations in the model, such as... Figure 6 This is a schematic diagram of the bonding area between silicone and the laminate in a finite element model. The contact method in this area is the software's built-in Bonded mode. The Bonded mode typically refers to a method of simulating the bonding or binding behavior between two or more adjacent parts. In this mode, adjacent parts are considered to be completely bonded together, without relative slippage or separation, until the maximum adhesive stress is reached, at which point the bond will fail.
[0042] Furthermore, after importing the mechanical property parameters of silicone into the pre-established target finite element model of the photovoltaic module, the silicone failure area of the target finite element model can be determined as the preset contact area; wherein, the preset contact area includes the first adhesive surface on the inner side of the silicone and the second adhesive surface on the outer side of the laminate; when the tensile stress is greater than the preset stress or the shear strength is greater than the preset strength, the mesh failure peeling of the contact area is determined.
[0043] in Figure 7 This is the adhesive surface on the inner side of the silicone. Figure 8 This refers to the bonding surface on the outer side of the laminate. The definition of the bonding surface is derived from the delineation of the silicone bonding area of the actual component; please refer to [reference needed]. Figure 2 A schematic diagram of silicone distribution after the middle frame assembly is completed. The failure area is applied to this contact area. According to the CZM material parameter definition, when the tensile stress is greater than 2.2 MPa or the shear strength is greater than 1.5 MPa, the mesh in this contact area will fail and peel off.
[0044] After determining the CZM failure interface, the original model and the silicone failure model with added parameters are calculated and solved. The original model refers to the model without silicone failure (CZM) parameter settings, and the silicone failure model with added parameters is the imported model. Figure 6 The parameter model was calculated, and the stress curves of the front and back glass, the maximum displacement of the component, and the tensile and shear stress curves of the silicone were viewed respectively.
[0045] The above-mentioned prediction of the failure time and state of photovoltaic modules under mechanical load using a target finite element model can include the following steps in its implementation: Step 4.1) Apply appropriate boundary conditions and loads to the target finite element model to simulate the stress state of the actual working environment of the photovoltaic module; Step 4.2), pre-set the cohesive control parameters; the cohesive control parameters shall include at least one or more of the following: initial interface shear stress, interface strength, interface hardening rule, and damage evolution rule; Step 4.3) Determine the failure simulation type, and simulate the response of the photovoltaic module under the corresponding load under the corresponding failure simulation type to predict the failure time and state of the photovoltaic module under a certain mechanical load; wherein, the failure simulation type includes static simulation, dynamic simulation or fatigue simulation.
[0046] Furthermore, to obtain the simulation results intuitively and accurately, the analysis results of the silicone bonding area can be post-processed, including viewing stress, strain distribution, interface peel length, and energy dissipation; the peeling process and final state can be visualized through viewing tools.
[0047] Table 2 shows a comparison of the parameters of the original model and the model after adding CZM under an upward load of 2400 Pa: Table 2 Comparison of model results parameters
[0048] The data above shows that the module glass and silicone sealant detach significantly at the bottom at certain times, leading to an increase in the displacement of the module's center and a significant decrease in the peak stress of the front and back glass. Furthermore, it can be concluded that when the peak stress in the silicone sealant contact area exceeds a set limit, significant detachment occurs in some locations, resulting in a decrease in the module's mechanical strength and a noticeable change in the module's deformation behavior. Figure 9 The image shows a comparison of the deformation states of the two models.
[0049] Figure 10 A flowchart illustrating a specific numerical simulation of silicone failure is presented. First, silicone material parameter experiments are conducted, as the adhesive strength of the silicone is crucial for ensuring the structural stability of the component. Higher adhesive strength results in stronger adhesion between the silicone and the frame and laminates, leading to greater stability of the component under external loads. Next, the silicone failure criteria for the component are investigated through a finite element simulation model, and finally, a comparative analysis of silicone failure simulations is performed.
[0050] The finite element model (FEM) setup in practice includes: 1. Establishing a finite element model of the photovoltaic module in simulation software, including the silicone bonding area and surrounding materials (such as glass, solar cells, etc.). Ensure the model is geometrically accurate and the boundary conditions are appropriately set to simulate actual operating conditions. 2. Defining material properties: Define appropriate material properties for the silicone and surrounding materials, such as elastic modulus, Poisson's ratio, and bond strength. For the CZM model, interface properties such as interface yield strength and tensile strength need to be defined. 3. Meshing: Use suitable meshing techniques to mesh the model, ensuring sufficient mesh density in the bonding area to capture local delamination behavior. 4. Applying boundary conditions and loads: Apply appropriate boundary conditions and loads to simulate the stress state in the actual working environment. 5. Setting CZM parameters: In the simulation analysis, CZM is implemented through special interface elements that simulate the interaction between materials in the bonding area. CZM parameters need to be set, including initial interface shear stress, interface strength, interface hardening rules, and damage evolution rules. 6. Select Analysis Type: Choose the appropriate analysis type, such as static, dynamic, or fatigue analysis, to simulate the component's response under specific loads. 7. Simulation Calculation and Post-processing: a. Run the analysis and check the results. Post-processing of the silicone adhesive area analysis results will be provided, including viewing stress and strain distribution, interface peel length, and energy dissipation. Use the viewing tools to visualize the peeling process and final state.
[0051] In summary, the entire numerical simulation process of silicone failure was achieved. Through experiments on silicone material properties, the definition of the CZM failure criterion, the construction of the finite element model, and comparative analysis, the mapping of silicone in different states can be obtained. This also provides data support for the simulation research of silicone's mechanical properties.
[0052] Based on the above method embodiments, this application also provides a numerical simulation device for silicone failure in photovoltaic modules, see [link to relevant documentation]. Figure 11 As shown, the device mainly includes the following parts: The parameter acquisition module 110 is used to obtain the mechanical property parameters of silicone through silicone material parameter tests; wherein the mechanical property parameters include at least one or more of peel strength, shear strength and tensile strength; The parameter import module 120 is used to import the mechanical property parameters of silicone into the pre-established target finite element model of the photovoltaic module; the target finite element model is the initial finite element model with added cohesive force control parameters to simulate the peeling state of silicone under load. The prediction module 130 is used to predict the failure time and state of photovoltaic modules under mechanical loads through the target finite element model.
[0053] In one feasible implementation, when the mechanical performance parameter is peel strength, the parameter acquisition module 110 is further configured to: Cut out the test specimen and install it into the upper and lower clamps of the testing machine, ensuring that the silicone adhesive part is facing the clamping area of the testing machine. Set the test parameters on the testing machine. The test parameters should include at least the test speed, peel angle and maximum load. Start the testing machine and gradually apply force to the preset load boundary threshold or until the specimen completely fails, and record the current target stress; The mechanical properties of silicone are determined by the maximum load and the size of the test specimen.
[0054] In one feasible implementation, the parameter import module 120 is further configured to: An initial finite element model should be suggested in advance; Mesh the initial finite element model to generate the target mesh density in the model bonding region; By combining the cohesive model with the initial finite element model, a pre-established target finite element model of the photovoltaic module is obtained. The mechanical properties of silicone are imported into the pre-established target finite element model of the photovoltaic module.
[0055] In one feasible implementation, the parameter import module 120 is further configured to: Select the peel adhesion mode as the hybrid mode; the hybrid mode includes both shear mode and tensile mode failure modes. Cancel the simulation of tangential slip behavior; The maximum normal / tangential contact stress and the contact distance at which peeling is completed are determined as the target stress obtained from the peeling test. Determine the preset damping coefficient and power-law distribution index.
[0056] In one feasible implementation, after importing the mechanical property parameters of the silicone into a pre-established target finite element model of the photovoltaic module, the device further includes: a failure peeling judgment module, used for: The silicone failure area of the target finite element model is defined as the preset contact area; wherein, the preset contact area includes the first adhesive surface inside the silicone and the second adhesive surface outside the laminate. When the tensile stress exceeds the preset stress or the shear strength exceeds the preset strength, the mesh failure and peeling in the contact area are determined.
[0057] In one feasible implementation, the prediction module 130 is further configured to: Appropriate boundary conditions and loads are applied to the target finite element model to simulate the stress state of the actual working environment of the photovoltaic module; Pre-set cohesive control parameters; the cohesive control parameters include at least one or more of the following: initial interface shear stress, interface strength, interface hardening rule, and damage evolution rule; Determine the failure simulation type, and simulate the response of the photovoltaic module under the corresponding load under the corresponding failure simulation type to predict the failure time and state of the photovoltaic module under a certain mechanical load; among which, the failure simulation type includes static simulation, dynamic simulation or fatigue simulation.
[0058] In one feasible embodiment, the above-described apparatus further includes: a visualization module, used for: Post-processing of the analysis results for the silicone bonding area includes viewing stress, strain distribution, interface peel length, and energy dissipation; Use visual tools to visualize the peeling process and final state.
[0059] The numerical simulation device for photovoltaic module silicone failure provided in this application has the same implementation principle and technical effect as the aforementioned method embodiment. For the sake of brevity, any parts not mentioned in the embodiment of the numerical simulation device for photovoltaic module silicone failure can be referred to the corresponding content in the aforementioned numerical simulation method embodiment for photovoltaic module silicone failure.
[0060] This application also provides an electronic device, such as... Figure 12 The diagram shows the structure of the electronic device 100, which includes a processor 121 and a memory 120. The memory 120 stores computer-executable instructions that can be executed by the processor 121. The processor 121 executes the computer-executable instructions to implement any of the above-mentioned numerical simulation methods for silicon carbide failure in photovoltaic modules.
[0061] exist Figure 12In the illustrated embodiment, the electronic device further includes a bus 122 and a communication interface 123, wherein the processor 121, the communication interface 123 and the memory 120 are connected via the bus 122.
[0062] The memory 120 may include high-speed random access memory (RAM) and may also include non-volatile memory, such as at least one disk storage device. Communication between this system network element and at least one other network element is achieved through at least one communication interface 123 (which can be wired or wireless), such as the Internet, wide area network, local area network, metropolitan area network, etc. The bus 122 may be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus, or an EISA (Extended Industry Standard Architecture) bus, etc. The bus 122 can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 12 The symbol is represented by a single double-headed arrow, but this does not mean that there is only one bus or one type of bus.
[0063] Processor 121 may be an integrated circuit chip with signal processing capabilities. In implementation, each step of the above method can be completed by the integrated logic circuitry in the hardware of processor 121 or by instructions in software form. Processor 121 can be a general-purpose processor, including a Central Processing Unit (CPU), a Network Processor (NP), etc.; it can also be a Digital Signal Processor (DSP), an Application Specific Integrated Circuit (ASIC), a Field-Programmable Gate Array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in the embodiments of this application can be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software modules in the decoding processor. The software modules can reside in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. The storage medium is located in the memory. The processor 121 reads the information in the memory and, in conjunction with its hardware, completes the steps of the numerical simulation method for the failure of silicone in photovoltaic modules as described in the aforementioned embodiment.
[0064] This application also provides a computer-readable storage medium storing computer-executable instructions. When these computer-executable instructions are called and executed by a processor, they cause the processor to implement the numerical simulation method for silicon carbide failure in photovoltaic modules. For specific implementation details, please refer to the foregoing method embodiments, which will not be repeated here.
[0065] The computer program product of the numerical simulation method, apparatus and electronic device for silicon carbide failure of photovoltaic modules provided in the embodiments of this application includes a computer-readable storage medium storing program code. The instructions included in the program code can be used to execute the methods described in the preceding method embodiments. For specific implementation, please refer to the method embodiments, which will not be repeated here.
[0066] Unless otherwise specifically stated, the relative steps, numerical expressions, and values of the components and steps described in these embodiments do not limit the scope of this application.
[0067] If the aforementioned functions are implemented as software functional units and sold or used as independent products, they can be stored in a processor-executable, non-volatile, computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.
[0068] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0069] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0070] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.
Claims
1. A numerical simulation method for silicone failure in photovoltaic modules, characterized in that, The method includes: The mechanical properties of silicone are obtained through silicone material parameter tests; wherein the mechanical properties include at least one or more of peel strength, shear strength and tensile strength. The mechanical property parameters of the silicone are imported into a pre-established target finite element model of the photovoltaic module; the target finite element model is an initial finite element model with added cohesive force control parameters to simulate the peeling state of the silicone under load. The failure time and state of photovoltaic modules under mechanical loads are predicted using the target finite element model.
2. The numerical simulation method for silicon carbide failure in photovoltaic modules according to claim 1, characterized in that, When the mechanical property parameter is peel strength, the mechanical property parameters of silicone are obtained through silicone material parameter tests, including: Cut out the test specimen and install it into the upper and lower clamps of the testing machine, ensuring that the silicone adhesive part is facing the clamping area of the testing machine. Set test parameters on the testing machine, including at least test speed, peel angle and maximum load; Start the testing machine and gradually apply force to the preset load boundary threshold or until the specimen completely fails, and record the current target stress; The mechanical properties of silicone are determined by the maximum load and the size of the test specimen.
3. The numerical simulation method for silicone failure in photovoltaic modules according to claim 2, characterized in that, The mechanical property parameters of the silicone are imported into a pre-established target finite element model of the photovoltaic module, including: An initial finite element model should be suggested in advance; The initial finite element model is meshed to generate a target mesh density in the model bonding region; The cohesive model is combined with the initial finite element model to obtain the pre-established target finite element model of the photovoltaic module; The mechanical property parameters of the silicone are imported into the pre-established target finite element model of the photovoltaic module.
4. The numerical simulation method for silicone failure in photovoltaic modules according to claim 3, characterized in that, Importing the mechanical property parameters of the silicone into the pre-established target finite element model of the photovoltaic module includes: Select the peel adhesion mode as the hybrid mode; the hybrid mode includes both shear mode and tensile mode failure modes. Cancel the simulation of tangential slip behavior; The maximum normal / tangential contact stress and the contact distance at which peeling is completed are determined as the target stress obtained from the peeling test. Determine the preset damping coefficient and power-law distribution index.
5. The numerical simulation method for silicone failure in photovoltaic modules according to claim 4, characterized in that, After importing the mechanical property parameters of the silicone into the pre-established target finite element model of the photovoltaic module, the method further includes: The silicone failure area of the target finite element model is defined as the preset contact area; wherein, the preset contact area includes a first adhesive surface on the inner side of the silicone and a second adhesive surface on the outer side of the laminate; When the tensile stress exceeds the preset stress or the shear strength exceeds the preset strength, the mesh failure and peeling of the contact area are determined.
6. The numerical simulation method for silicone failure in photovoltaic modules according to claim 2, characterized in that, Predicting the failure time and state of photovoltaic modules under mechanical loads using the target finite element model includes: Appropriate boundary conditions and loads are applied to the target finite element model to simulate the stress state of the actual working environment of the photovoltaic module; Pre-set cohesive force control parameters; the cohesive force control parameters include at least one or more of the following: initial interface shear stress, interface strength, interface hardening rule, and damage evolution rule; The failure simulation type is determined, and the response of the photovoltaic module under the corresponding load is simulated under the corresponding failure simulation type to predict the failure time and state of the photovoltaic module under mechanical load; wherein, the failure simulation type includes static simulation, dynamic simulation or fatigue simulation.
7. The numerical simulation method for silicone failure in photovoltaic modules according to claim 6, characterized in that, The method further includes: Post-processing of the analysis results for the silicone bonding area includes viewing stress, strain distribution, interface peel length, and energy dissipation; Use visual tools to visualize the peeling process and final state.
8. A numerical simulation device for silicone failure in photovoltaic modules, characterized in that, The device includes: The parameter acquisition module is used to obtain the mechanical property parameters of silicone through silicone material parameter tests; wherein, the mechanical property parameters include at least one or more of peel strength, shear strength and tensile strength; The parameter import module is used to import the mechanical property parameters of the silicone into a pre-established target finite element model of the photovoltaic module; the target finite element model is an initial finite element model with added cohesive force control parameters to simulate the peeling state of the silicone under load. The prediction module is used to predict the failure time and state of the photovoltaic module under mechanical load using the target finite element model.
9. An electronic device, characterized in that, The method includes a processor and a memory, the memory storing computer-executable instructions that can be executed by the processor, the processor executing the computer-executable instructions to implement the numerical simulation method for silicon failure of photovoltaic modules according to any one of claims 1 to 7.
10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when invoked and executed by a processor, cause the processor to implement the numerical simulation method for silicon failure of photovoltaic modules as described in any one of claims 1 to 7.