High-temperature and high-pressure semiconductor titanium container

Abstract

The invention belongs to the technical field of semiconductor titanium containers, and relates to a high-temperature and high-pressure semiconductor titanium container which comprises a container body, a supporting bottom plate is arranged below the container body, U-shaped side supporting plates are fixed to the two sides of the supporting bottom plate, U-shaped movable frames are movably connected to inner cavities of the U-shaped side supporting plates, a first air cylinder is arranged at the top of the supporting bottom plate, and a second air cylinder is arranged at the bottom of the first air cylinder. The inclination angle is detected through the inclination angle sensor, angle information is fed back to the control system, the stroke distance of the second air cylinder and action of the second air cylinder are controlled, the container body rotates with the rotating shaft at the joint of the connecting block and the connecting plate as the axis, and therefore the inclination angle of the container body is changed. The accurate angle adjusting function enables the container to meet different requirements for different angles in the semiconductor production process, in some chemical reactions, the specific container angle can ensure sufficient mixing and reaction efficiency of reactants, and the product quality is improved.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor titanium containers, and more particularly to a high-temperature, high-pressure semiconductor titanium container. Background Technology

[0002] Semiconductor titanium containers are not a standard term with a strict and single definition. Based on the literal meaning and possible related fields, it can be roughly defined as: container equipment made of titanium or titanium alloy as the main material, used in semiconductor-related production, processing, storage and other processes, and capable of meeting the stringent requirements of the semiconductor industry for material purity, corrosion resistance and stability.

[0003] In many industrial and scientific fields, accurate monitoring and control of container angles is crucial. For example, in chemical production, certain chemical reactions need to be carried out in containers at specific angles to ensure adequate mixing of reactants and reaction efficiency. Traditional methods for monitoring and adjusting container angles are inadequate. Adjusting through simple monitoring means, such as manual visual inspection or using simple measuring tools, is not only inefficient but also difficult to guarantee accuracy, failing to meet the needs of high-precision applications. Summary of the Invention

[0004] The purpose of this invention is to provide a high-temperature and high-pressure semiconductor titanium container to solve the technical problems of the shortcomings of traditional container angle monitoring and adjustment methods, so as to facilitate precise adjustment of the container angle.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A high-temperature, high-pressure semiconductor titanium container includes a container body, a supporting base plate at the bottom of the container body, U-shaped side support plates fixed on both sides of the supporting base plate, a U-shaped movable frame movably connected to the inner cavity of the U-shaped side support plates, a cylinder one at the top of the supporting base plate, a connecting horizontal plate fixed between the two U-shaped movable frames, the connecting horizontal plate being fixed to the output end of the cylinder one, two connecting blocks fixed at the bottom of the container body, a connecting plate fixed on the connecting horizontal plate, the connecting blocks being rotatably connected to the connecting plate, a tilt sensor mounted on the front side of the connecting block, a gravity vertical shaft rotatably mounted on the front side of the tilt sensor, a cylinder two inside the U-shaped movable frame, and a support rod fixed to the output end of the cylinder two.

[0007] As a preferred embodiment of the present invention, the container body is composed of a titanium alloy outer layer, a high-temperature ceramic intermediate layer, and a titanium alloy inner layer.

[0008] As a preferred embodiment of the present invention, the outer surface of the titanium alloy is coated with an anti-corrosion coating, which can effectively resist chemical corrosion that may exist in the semiconductor production environment and extend the service life of the container.

[0009] As a preferred embodiment of the present invention, the main body of the container is elliptical cylindrical, with annular reinforcing ribs provided in the middle and at the ends. The reinforcing ribs and the main body are integrally forged to avoid welding defects.

[0010] As a preferred embodiment of the present invention, both the front and rear sides of the U-shaped movable frame are in contact with the inner wall of the U-shaped side support plate.

[0011] As a preferred embodiment of the present invention, the tilt sensor is electrically connected to an external control system, which can monitor the angle change of the container in real time and feed the angle information back to the control system to control the stroke distance of cylinder two.

[0012] In a preferred embodiment of the present invention, the tilt sensor is connected to the gravity vertical shaft via a precision bearing, allowing the gravity vertical shaft to hang freely. The tilt sensor accurately measures the tilt angle of the container by detecting the tilt angle of the gravity vertical shaft.

[0013] As a preferred embodiment of the present invention, the surface of the support rod is provided with an anti-slip rubber sleeve, and the support rod abuts against the surfaces of the bottom two sides of the container body, providing stable support for the bottom two sides of the container body.

[0014] As a preferred embodiment of the present invention, the support rod is configured as an arc-shaped cylinder, the curvature of which is adapted to the curvature of the container surface.

[0015] As a preferred embodiment of the present invention, the bottom of the support rod is fixedly connected to two columns, and the columns are movably connected through the top of the corresponding U-shaped movable frame.

[0016] The beneficial effects of this invention are:

[0017] 1. This invention utilizes a gravity-driven vertical shaft that hangs freely. An inclination sensor detects the tilt angle of the vertical shaft to accurately measure the tilt angle of the container. This angle information is then promptly fed back to the control system. Based on the received angle data, the control system precisely controls the stroke distance of cylinder two. When cylinder two actuates, one support rod moves upward while the other moves downward, causing the container to rotate around the pivot point at the connection between the connecting block and the connecting plate. This changes the tilt angle of the container. This precise angle adjustment function allows the container to meet different angle requirements in semiconductor manufacturing processes. In certain chemical reactions, a specific container angle can ensure thorough mixing of reactants and improve reaction efficiency, thereby enhancing product quality.

[0018] 2. In this invention, when the height of the container needs to be adjusted, once the cylinder is started, its output end drives the connecting horizontal plate to move up and down. The up and down movement of the connecting horizontal plate will drive the U-shaped movable frame and the container body to move up and down, thereby realizing the adjustment of the container height. This height adjustment function can adjust the height position of the container according to different production equipment and process requirements, so as to better cooperate with other equipment, improve the degree of automation and efficiency of production, and provide more flexibility for production. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the present invention;

[0020] Figure 2 This is a bottom-view structural diagram of the present invention;

[0021] Figure 3 This is a partial structural schematic diagram of the present invention;

[0022] Figure 4 This is a partial cross-sectional structural diagram of the container body of the present invention.

[0023] Legend:

[0024] 1. Container body; 101. Titanium alloy outer layer; 102. High-temperature ceramic intermediate layer; 103. Titanium alloy inner layer; 2. Support base plate; 3. U-shaped side support plate; 4. U-shaped movable frame; 5. Cylinder 1; 6. Connecting horizontal plate; 7. Connecting block; 8. Connecting plate; 9. Tilt sensor; 10. Gravity vertical shaft; 11. Cylinder 2; 12. Support rod; 13. Column. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] Example:

[0027] like Figures 1 to 4As shown, a high-temperature and high-pressure semiconductor titanium container includes a container body 1, a supporting base plate 2 at the bottom of the container body 1, U-shaped side support plates 3 fixed on both sides of the supporting base plate 2, a U-shaped movable frame 4 movably connected to the inner cavity of the U-shaped side support plate 3, a cylinder 5 at the top of the supporting base plate 2, a connecting horizontal plate 6 fixed between the two U-shaped movable frames 4, the connecting horizontal plate 6 being fixed to the output end of the cylinder 5, two connecting blocks 7 fixed at the bottom of the container body 1, a connecting plate 8 fixed on the connecting horizontal plate 6, the connecting blocks 7 being rotatably connected to the connecting plate 8, an angle sensor 9 installed on the front side of the connecting block 7, a gravity vertical shaft 10 rotatably mounted on the front side of the angle sensor 9, a cylinder 11 inside the U-shaped movable frame 4, and a support rod 12 fixed to the output end of the cylinder 11.

[0028] like Figures 1 to 4 As shown, the container body 1 is composed of a titanium alloy outer layer 101, a high-temperature ceramic intermediate layer 102, and a titanium alloy inner layer 103. Titanium alloy possesses excellent properties such as high strength and corrosion resistance. The titanium alloy outer layer 101 and inner layer 103 provide the container with good structural strength and basic protection. The high-temperature ceramic intermediate layer 102 has excellent high-temperature resistance, effectively isolating high temperatures, enabling the container body 1 to adapt to semiconductor production in high-temperature environments and meeting the requirements for high-temperature and high-pressure containers. The surface of the titanium alloy outer layer 101 is coated with an anti-corrosion coating, which effectively resists chemical corrosion that may exist in the semiconductor production environment. The corrosion-resistant coating forms a protective barrier on the surface of the titanium alloy outer layer 101, preventing chemicals from directly contacting the titanium alloy, thereby reducing corrosion and effectively extending the service life of the container body 1. This also reduces production costs and maintenance frequency. The main body of the container body 1 is elliptical cylindrical, with annular reinforcing ribs at its middle and ends. The reinforcing ribs and the main body are integrally forged to avoid welding defects. The elliptical cylindrical container body 1 has certain structural advantages, enabling it to better withstand internal pressure. The annular reinforcing ribs at the middle and ends further enhance the structural strength of the container and improve its pressure resistance.

[0029] The front and rear sides of the U-shaped movable frame 4 are both in contact with the inner wall of the U-shaped side support plate 3. This contact design makes the movement of the U-shaped movable frame 4 within the U-shaped side support plate 3 more stable and smooth, reducing swaying and offset during movement and ensuring stability. The tilt sensor 9 is electrically connected to the external control system, enabling real-time monitoring of the angle change of the container body 1 and feeding the angle information back to the control system. This achieves real-time monitoring and automatic control of the angle of the container body 1, improving the automation level of production and controlling the stroke distance of the control cylinder 11. The tilt sensor 9 is connected to the gravity vertical shaft 10 through a precision bearing, allowing the gravity vertical shaft 10 to hang freely. The tilt sensor 9 accurately measures the tilt angle of the container body 1 by detecting the tilt angle of the gravity vertical shaft 10. The precision bearing connection ensures that the gravity vertical shaft 10 can hang freely and flexibly, reducing the influence of friction and resistance on the measurement. 9. The tilt angle of the container body 1 is measured by detecting the tilt angle of the vertical axis 10 under gravity. This measurement method is more accurate and reliable, and can provide precise angle data for the control system, which helps to achieve more precise angle control. The surface of the support rod 12 is provided with an anti-slip rubber sleeve, which protects the surface of the container body 1 and prevents the support rod 12 from directly contacting the container body 1 and causing wear. The support rod 12 abuts against the surfaces of the bottom two sides of the container body 1, providing stable support for the bottom two sides of the container body 1. The shape of the support rod 12 is set as an arc-shaped cylinder, and its curvature is adapted to the curvature of the surface of the container body 1, which increases the contact area, disperses the support force, and reduces local stress concentration. Two columns 13 are fixedly connected to the bottom of the support rod 12. The columns 13 are movably connected to the top of the corresponding U-shaped movable frame 4. The columns 13 provide additional support and guidance for the support rod 12, ensuring the accurate movement direction of the support rod 12 and reducing swaying and deviation.

[0030] In summary, when the angle needs to be adjusted, the vertical gravity shaft 10 hangs freely, and the tilt sensor 9 detects the tilt angle of the vertical gravity shaft 10 to accurately measure the tilt angle of the container body 1. The angle information is then fed back to the control system in a timely manner. Based on the received angle data, the control system precisely controls the stroke distance of cylinder 11, causing one side of cylinder 11 to rise and the other side to fall. This drives one side of the support rod 12 to rise and the other side to fall, causing the container body 1 to rotate around the pivot at the connection between the connecting block 7 and the connecting plate 8, thereby changing the tilt angle of the container body 1. When adjusting the height, cylinder 5 is activated, and its output end drives the connecting horizontal plate 6 to move up and down. The up and down movement of the connecting horizontal plate 6 will drive the U-shaped movable frame 4, cylinder 11, support rod 12, and the container body 1 to move up and down as a whole, thereby achieving the adjustment of the container height.

[0031] All the devices selected in this application are general standard parts or components known to those skilled in the art. Their structures and principles can be learned by those skilled in the art through technical manuals or conventional experimental methods.

[0032] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0033] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0034] Based on the above-described preferred embodiments of the present invention, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the inventive concept. The technical scope of this invention is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A high-temperature, high-pressure semiconductor titanium container, characterized in that, include: A container body (1) is provided with a supporting base plate (2) below the container body (1). U-shaped side support plates (3) are fixed on both sides of the supporting base plate (2). A U-shaped movable frame (4) is movably connected to the inner cavity of the U-shaped side support plate (3). A cylinder (5) is provided on the top of the supporting base plate (2). A connecting horizontal plate (6) is fixed between the two U-shaped movable frames (4). The connecting horizontal plate (6) is fixed to the output end of the cylinder (5). Two connecting blocks (7) are fixed at the bottom of the container body (1). A connecting plate (8) is fixed on the connecting horizontal plate (6). The connecting blocks (7) are rotatably connected to the connecting plate (8). An angle sensor (9) is installed on the front side of the connecting block (7). A gravity vertical shaft (10) is rotatably mounted on the front side of the angle sensor (9). A cylinder (11) is provided in the inner cavity of the U-shaped movable frame (4). A support rod (12) is fixed to the output end of the cylinder (11).

2. The high-temperature, high-pressure semiconductor titanium container as described in claim 1, characterized in that, The container body (1) is composed of a titanium alloy outer layer (101), a high-temperature ceramic intermediate layer (102), and a titanium alloy inner layer (103).

3. The high-temperature, high-pressure semiconductor titanium container as described in claim 2, characterized in that, The outer layer (101) of the titanium alloy is coated with an anti-corrosion coating, which can effectively resist chemical corrosion that may exist in the semiconductor production environment and extend the service life of the container (1).

4. The high-temperature, high-pressure semiconductor titanium container as described in claim 1, characterized in that, The container body (1) is an elliptical cylinder with annular reinforcing ribs in the middle and at the ends. The reinforcing ribs and the main body are integrally forged to avoid welding defects.

5. A high-temperature, high-pressure semiconductor titanium container as described in claim 1, characterized in that, The front and rear sides of the U-shaped movable frame (4) are both in contact with the inner wall of the U-shaped side support plate (3).

6. The high-temperature, high-pressure semiconductor titanium container as described in claim 1, characterized in that, The tilt sensor (9) is electrically connected to the external control system and can monitor the angle change of the container body (1) in real time and feed the angle information back to the control system to control the stroke distance of cylinder two (11).

7. A high-temperature, high-pressure semiconductor titanium container as described in claim 1, characterized in that, The tilt sensor (9) is connected to the gravity vertical shaft (10) by a precision bearing. The gravity vertical shaft (10) can hang freely. The tilt sensor (9) accurately measures the tilt angle of the container (1) by detecting the tilt angle of the gravity vertical shaft (10).

8. A high-temperature, high-pressure semiconductor titanium container as described in claim 1, characterized in that, The surface of the support rod (12) is provided with an anti-slip rubber sleeve, and the support rod (12) abuts against the surfaces of the bottom sides of the container body (1), providing stable support for the bottom sides of the container body (1).

9. A high-temperature, high-pressure semiconductor titanium container as described in claim 1, characterized in that, The support rod (12) is an arc-shaped cylinder, and its curvature is adapted to the curvature of the surface of the container body (1).

10. A high-temperature, high-pressure semiconductor titanium container as described in claim 1, characterized in that, The bottom of the support rod (12) is fixedly connected to two columns (13), and the columns (13) are movably connected to the top of the corresponding U-shaped movable frame (4).

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