Gluing system, coating equipment and coating method

Abstract

The invention discloses a gluing system, coating equipment and a coating method. The gluing system comprises a platform used for carrying a semiconductor substrate, a jacking device used for transferring the semiconductor substrate to the platform, and a guiding and aligning device used for guiding and aligning the semiconductor substrate carried on the ejector pin assembly. The vacuum adsorption device is used for adsorbing and fixing the semiconductor substrate on the platform, the coating knife horizontally moves relative to the platform so as to coat glue on the semiconductor substrate, the jacking device transfers the semiconductor substrate in the ascending or descending process, the operation is simple, the transfer is convenient, and the phenomenon of deformation of the semiconductor substrate can be prevented; the guiding and aligning device is used for guiding and aligning the semiconductor substrate so as to accurately guide the semiconductor substrate to the adsorption area of the platform, so that the phenomenon of deviation of a glue solution coated on the semiconductor substrate is avoided, the coating knife can accurately coat the semiconductor substrate conveniently, and by adopting the structure, the automation degree is high, and large-scale production is facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to a gluing system, and also relates to a coating device with the gluing system and a coating method applied in the coating device. BACKGROUND

[0002] The gluing system comprises a marble platform for placing a semiconductor substrate and a coating knife for gluing the semiconductor substrate. Before gluing, the semiconductor substrate needs to be sent to a gluing station on the marble platform so that the coating knife can glue the semiconductor substrate.

[0003] Since the semiconductor substrate is thin (about 10-30 μm), it is easy to deform during manual transfer to the marble platform. The semiconductor substrate cannot be accurately placed in the adsorption area of the marble platform, which causes the glue on the semiconductor substrate to deviate. Moreover, manual transfer of the semiconductor substrate is low in efficiency and cannot be mass-produced.

[0004] Therefore, there is an urgent need for a gluing system to solve the above problems. SUMMARY

[0005] The present application aims to overcome the shortcomings of the prior art and provide a gluing system, a coating device and a coating method, which can prevent deformation of the semiconductor substrate and guide and align the semiconductor substrate to accurately place the semiconductor substrate in the adsorption area of the marble platform, thereby avoiding deviation of the glue on the semiconductor substrate.

[0006] The present application is implemented as follows. A gluing system comprises:

[0007] a platform for placing a semiconductor substrate and having an adsorption area corresponding to the semiconductor substrate;

[0008] a lifting device having a lifting pin assembly slidingly arranged in the platform, the lifting pin assembly being moved from a first height position to a second height position for receiving a semiconductor substrate transferred by a robot, and being moved from the second height position to the first height position for placing the received semiconductor substrate on the platform;

[0009] a guiding and aligning device for guiding and aligning the semiconductor substrate placed on the lifting pin assembly to guide the semiconductor substrate to the adsorption area on the platform.

[0010] a vacuum adsorption device for communicating with the adsorption area and capable of generating a vacuum negative pressure for adsorbing and fixing the semiconductor substrate on the platform;

[0011] A coating knife capable of moving up and down and horizontally relative to the platform, the coating knife having a slot die for coating glue on the semiconductor substrate, wherein the suction area is located within the horizontal movement range of the coating knife.

[0012] Further, the platform has a plurality of guide holes through which the pin assembly passes and is spaced apart from the suction area, and a plurality of uniformly arranged vacuum suction holes, each of which communicates with the suction area.

[0013] The application also provides a coating device comprising the glue coating system described above, and further comprising:

[0014] A glue uniformizing system for removing excess glue at the glue outlet of the coating knife before the glue coating system coats glue.

[0015] The application also provides a coating method, characterized by comprising the following steps:

[0016] The step of receiving the semiconductor substrate;

[0017] The step of placing the received semiconductor substrate on the platform;

[0018] The step of suction-fixing the semiconductor substrate on the platform;

[0019] The step of horizontally moving the coating knife relative to the platform to uniformly coat glue on the semiconductor substrate.

[0020] The application provides a glue coating system, a coating device and a coating method, wherein the glue coating system comprises a platform on which a semiconductor substrate is placed, a lifting device for transferring the semiconductor substrate to the platform, a guide alignment device for guiding and aligning the semiconductor substrate placed on the pin assembly, a vacuum suction device for suction-fixing the semiconductor substrate on the platform, and a coating knife capable of horizontally moving relative to the platform to coat glue on the semiconductor substrate. The lifting device transfers the semiconductor substrate during lifting or lowering, which is simple to operate and convenient to transfer, and can prevent the semiconductor substrate from deforming. The guide alignment device guides and aligns the semiconductor substrate to accurately guide the semiconductor substrate to the suction area of the platform, avoiding the phenomenon that the glue coated on the semiconductor substrate is deviated, and facilitating the coating knife to accurately coat glue on the semiconductor substrate. The above structure is high in automation and is convenient for large-scale production. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the present application, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0022] Figure 1 is a structural diagram of a coating device provided by an embodiment of the present application.

[0023] Figure 2 is a structural diagram of a lifting device in a gluing system provided by an embodiment of the present application.

[0024] Figure 3 is Figure 2 is an enlarged view of A in FIG.

[0025] Figure 4 is a side view of a gluing system provided by an embodiment of the present application.

[0026] Figure 5 is a structural diagram of a top pin assembly moving from a first height position to a second height position in a gluing system provided by an embodiment of the present application.

[0027] Figure 6 is a structural diagram of a top pin assembly moving from a second height position to a first height position in a gluing system provided by an embodiment of the present application.

[0028] Figure 7 is a structural diagram of a vacuum adsorption device in a gluing system provided by an embodiment of the present application.

[0029] Figure 8 is a structural diagram of a platform in a gluing system provided by an embodiment of the present application.

[0030] Figure 9 is Figure 8 is an enlarged view of B in FIG.

[0031] Figure 10 is a structural diagram of a jacking device in a gluing system provided by an embodiment of the present application.

[0032] Figure 11 is a structural diagram of a sleeve cooperating with a positioning member in a jacking device provided by an embodiment of the present application.

[0033] Figure 12 is a structural diagram of a guiding and aligning device in a gluing system provided by an embodiment of the present application.

[0034] Figure 13 is a structural diagram of a roller in a guiding and aligning device provided by an embodiment of the present application.

[0035] Figure 14 is a structural diagram of a vacuum adsorption device in a gluing system provided by an embodiment of the present application.

[0036] Figure 15 is a structural diagram of a connecting member and a pipe joint in a vacuum adsorption device provided by an embodiment of the present application.

[0037] Figure 16A structure diagram of a glue uniformizing system provided by an embodiment of the present application.

[0038] Figure 17 A structure diagram of a glue uniformizing distance between a glue uniformizing wheel and a glue outlet of an applicator in a glue uniformizing system provided by an embodiment of the present application.

[0039] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings.

[0040] In the drawings, the reference signs are explained as follows:

[0041] Platform 100, adsorption area 110, transverse groove 111, longitudinal groove 112, guide opening 120, vacuum adsorption opening 130, adsorption surface 140, transverse accommodating groove 150, longitudinal accommodating groove 160, guide hole 170;

[0042] Semiconductor substrate 10;

[0043] Lifting device 200, ejector pin assembly 210, sleeve 211, positioning member 212, ejector pin 213, first power component 220, position detector 230, sliding guide 240, linear slide rail set 241, sliding block 242, channel 250, door-shaped structure 260, first support member 261, second support member 261', connecting plate 262, guide inlet 263, sliding connecting member 264, vertical section 2641, horizontal section 2642, two rollers (265, 265');

[0044] Vacuum adsorption device 300, first pipeline 310, second pipeline 320, vacuum pump 330, connecting member 340, pipe joint 350, first inlet 351, first outlet 352, longitudinal section 353, transverse section 354, first three-way valve 360, second inlet 361, second outlet 362, second three-way valve 370, third inlet 371, third outlet 372, anti-falling structure 380;

[0045] Applicator 400, glue outlet 410;

[0046] Guide alignment device 500, first guide alignment part 510, second guide alignment part 520, guide support assembly 530, bracket 531, sliding member 540, linear guide rail 541, guide block 542, second power component 550, position monitor 560;

[0047] Translation device 600, two first slide rails (610, 610'), two third power components (620, 620'), displacement sensor 630;

[0048] Lifting device 700, two bases (710, 710'), second sliding rails (720, 720'), fourth power components (730, 730'), support beam 740, connecting seat 750;

[0049] Rubbing wheel 800;

[0050] Rubbing part 900. DETAILED DESCRIPTION

[0051] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate the orientation or state relationship based on the orientation or state relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0052] In addition, in addition to indicating the orientation or state relationship, the above-mentioned partial terms may also be used to indicate other meanings, for example, the term "upper" may also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific circumstances.

[0053] In addition, the terms "mounting", "setting", "provided with", "connected", "connected" should be broadly understood. For example, it can be fixedly connected, detachably connected, or integrally constructed; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between two devices, elements or components. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0054] In addition, the terms "first", "second", and the like are mainly used to distinguish different devices, elements or components, and the specific type and structure may be the same or different, and are not intended to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise stated, the meaning of "multiple" is two or more.

[0055] In order to clearly indicate the direction relationship in the drawing, a coordinate system is appropriately marked with the vertical direction as the Z direction and the horizontal plane as the XY plane.

[0056] The technical solutions in the embodiments of the present application will be described clearly and completely in the embodiments of the present application in combination with the drawings.

[0057] Example of the glue applying system

[0058] AsFigures 1-5 As shown in the drawings, the embodiment of the present application provides a gluing system, which comprises:

[0059] a platform 100 for placing a semiconductor substrate 10 and having an adsorption area 110 corresponding to the semiconductor substrate 10;

[0060] a jacking device 200 having a needle assembly 210 slidingly arranged in the platform 100, the needle assembly 210 being moved from a first height position to a second height position for receiving the semiconductor substrate 10 transferred by a robot, and the needle assembly 210 being moved from the second height position to the first height position for placing the received semiconductor substrate 10 on the platform 100;

[0061] a guiding and aligning device 500 for guiding and aligning the semiconductor substrate 10 placed on the needle assembly 210 to guide the semiconductor substrate 10 to the adsorption area on the platform;

[0062] a vacuum adsorption device 300 for communicating with the adsorption area 110 and capable of generating a vacuum negative pressure for adsorbing and fixing the semiconductor substrate 10 on the platform 100;

[0063] a coating knife 400 capable of moving up and down and horizontally relative to the platform 100, the coating knife 400 having a slit glue outlet 410 for gluing the semiconductor substrate 10, wherein the adsorption area 110 is located within the horizontal moving range of the coating knife 400, and the glue in the embodiment is preferably photoresist.

[0064] After the glue outlet 410 completes the gluing work on the semiconductor substrate 10, the jacking device 200 is moved from the first height position to the second height position, so as to facilitate the robot to transfer the coated semiconductor substrate 10 to the next process; the jacking device 200 transfers the semiconductor substrate 10 during the rising or falling process, which is simple in operation, convenient in transfer, and capable of preventing the deformation of the semiconductor substrate 10, facilitating the coating knife 400 to uniformly glue the semiconductor substrate 10; the guiding and aligning device 500 guides and aligns the semiconductor substrate, which can accurately guide the semiconductor substrate to the adsorption area 110 of the platform 100, avoiding the deviation of the glue coated on the semiconductor substrate 10, facilitating the coating knife 400 to accurately glue the semiconductor substrate 10, and the above structure is high in automation and convenient for large-scale production.

[0065] Overview of the exemplary platform 100

[0066] As Figure 1 , Figure 8 and Figure 9As shown, further, the platform 100 has a plurality of guide holes 120 through which the pin assembly 210 can slide, and a plurality of uniformly arranged vacuum suction holes 130, the plurality of guide holes 120 are arranged at intervals from the suction area 110, and the upper end of each vacuum suction hole 130 is in communication with the suction area 110, wherein the plurality of guide holes 120 and the vacuum suction holes 130 are located within the suction area 110, in this embodiment, the platform 100 is preferably a marble platform 100 with high parallelism (such as ∥1 μm), thereby ensuring the parallelism of the semiconductor substrate 10; the semiconductor substrate 10 includes but is not limited to: a glass substrate for liquid crystal display devices, a glass substrate for PDP, a glass substrate for photomasks, a substrate for color filters, a substrate for recording discs, a substrate for solar cells, a substrate for electronic paper, and other precision electronic device substrates, rectangular glass substrates, flexible substrates for thin-film liquid crystals, substrates for organic EL, and various substrates, in this embodiment, a glass substrate is preferred.

[0067] As shown in Figure 8 The suction area 110 is arranged on the suction surface 140 of the platform 100, which is located on the front surface of the platform 100, and the suction area 110 includes a plurality of rows of transverse grooves 111 and a plurality of rows of longitudinal grooves 112 in communication with the transverse grooves 111, each row of transverse grooves 111 or each row of longitudinal grooves 112 is an adsorption channel, and the plurality of rows of transverse grooves 111 and the plurality of rows of longitudinal grooves 112 are in communication to form a plurality of uniform grid-shaped suction holes for adsorbing the semiconductor substrate 10, under the condition of vacuum suction force in the suction area 110, the plurality of grid-shaped suction holes can uniformly adsorb and fix the semiconductor substrate 10 on the suction surface 140, while avoiding the phenomenon of semiconductor substrate 10 concave, thereby ensuring the parallelism of the semiconductor substrate 10, and facilitating the doctor blade 400 to uniformly coat the glue solution on the semiconductor substrate 10.

[0068] The width of the transverse groove 111 and the longitudinal groove 112 is 0.5-1.5 mm, in this embodiment, the width of the transverse groove 111 and the longitudinal groove 112 is preferably 1 mm, and the depth is 1 mm, with this structure, the phenomenon of ultra-thin semiconductor substrate 10 deforming under the action of vacuum suction force can be avoided due to the large opening size of the transverse groove 111 and the longitudinal groove 112.

[0069] As shown in Figure 8 and Figure 9As shown, the plurality of vacuum suction ports 130 are arranged on the platform 100 in a manner that one end of each of the plurality of vacuum suction ports 130 is opposite to and communicates with the suction area 110, and the other end of each of the plurality of vacuum suction ports 130 extends to a side opposite to the suction area 110; the plurality of vacuum suction ports 130 are uniformly arranged on the platform 100, so that the vacuum negative pressure in the suction area 110 is uniform; in the embodiment, the plurality of guide ports 120 and the plurality of vacuum suction ports 130 are arranged on the longitudinal grooves 112 and have substantially the same size as the longitudinal grooves 112; the guide ports 120 are preferably 14, and each of the 14 guide ports 120 is arranged on a corresponding one of the seven rows of longitudinal grooves 112; two guide ports 120 are arranged on each of the seven rows of longitudinal grooves 112; of the 14 guide ports 120, eight are arranged at the middle of the four rows of longitudinal grooves 112, and the other six are arranged at the two ends of the three rows of longitudinal grooves 112; the four rows of longitudinal grooves 112 on which the guide ports 120 are arranged at the middle are arranged at a distance from the three rows of longitudinal grooves 112 on which the guide ports 120 are arranged at the two ends, so that the plurality of guide ports 120 are uniformly arranged, and the ejector pin assembly 210 uniformly supports the semiconductor substrate 10, thereby avoiding deformation of the semiconductor substrate 10 during the transfer process.

[0070] The vacuum suction ports 130 are preferably in the form of holes, and the inner diameter of each of the holes is substantially the same as the width of the transverse grooves 111; in another embodiment, the vacuum suction ports 130 can be uniformly arranged on the transverse grooves 111; or the vacuum suction ports 130 can be uniformly arranged on the transverse grooves 111 and the longitudinal grooves 112.

[0071] As shown in FIG. 1, the platform 100 further comprises: Figure 8

[0072] At least two transverse accommodating grooves 150 are arranged on two sides of the suction area 110 in a transverse manner, and are used to mount a first detection unit (not shown) for detecting the suction state between the X-direction suction surface 140 and the semiconductor substrate 10.

[0073] At least two longitudinal accommodating grooves 160 are arranged on two sides of the suction area 110 in a longitudinal manner, and are used to mount a second detection unit (not shown) for detecting the suction state between the Y-direction suction surface 140 and the semiconductor substrate 10.

[0074] In the embodiment, the transverse accommodating grooves 150 and the longitudinal accommodating grooves 160 are preferably four in number and are symmetrically and spacedly arranged in pairs.

[0075] The driving controller is configured to receive a control signal of the suction state between the X-direction suction surface 140 and the semiconductor substrate 10 fed back by the first detection unit and the second detection unit, and output a control signal and / or a prompt signal to the outside, wherein the control signal at least includes an alarm control signal for output to an alarm and / or communication data for output to a display, so that an operator can timely handle the semiconductor substrate 10 with an abnormal suction state.

[0076] ​Specifically, the driving controller stores thickness data information of the semiconductor substrate 10, and detects the current thickness of the semiconductor substrate 10 through the first detection unit and the second detection unit. When the detected thickness of the semiconductor substrate 10 deviates from the stored thickness of the semiconductor substrate 10, it is determined that the semiconductor substrate 10 and the adsorption platform 100 are not firmly adsorbed or have a gap.

[0077] Jacking device as an example

[0078] As shown in Figure 4 , preferably, the jacking device 200 comprises:

[0079] The first power component 220 is used to drive the up-and-down movement of the needle assembly 210, and the first power component 220 includes but is not limited to a telescopic motor, a screw motor or a telescopic cylinder. In the embodiment, the first power component 220 is preferably a screw motor.

[0080] As shown in Figure 5 , the first power component 220 rotates at a set first number of turns, a first rotation speed and a first direction, and the needle assembly 210 is moved from the first height position to the second height position to receive the semiconductor substrate 10 without coating the glue solution transferred by the mechanical hand.

[0081] As shown in Figure 6 , the first power component 220 rotates at a set second number of turns, a second rotation speed and a second direction, and the needle assembly 210 is moved from the second height position to the first height position to place the semiconductor substrate without coating the glue solution at the glue coating position of the platform 100.

[0082] In the embodiment, the first direction is opposite to the second direction, the first number of turns and the second number of turns are the same number of turns, and the first rotation speed and the second rotation speed are the same rotation speed, so that the first power component 220 can output uniform rotation power.

[0083] Preferably, the first power component 220 is two, symmetrically arranged at both sides of the lower end of the needle assembly 210, to uniformly bear the weight of the needle assembly 210, which is beneficial to the stability of the needle assembly 210.

[0084] Further, the jacking device 200 further comprises:

[0085] As shown in Figure 10 , a plurality of position detectors 230 are used to detect the first height position and the second height position of the needle assembly 210 respectively, and when the position detector 230 detects that the needle assembly 210 moves to the first height position or the second height position, it outputs a first height position signal or a second height position signal to the outside.

[0086] The driving controller controls the first power component 220 to start or stop working according to the received first height position signal or second height position signal, wherein the driving controller stores parameter information of the number of rotations, direction and speed of the first power component 220;

[0087] The first power component 220 rotates at the set first number of rotations, first speed and first direction, and the linkage needle assembly 210 moves the semiconductor substrate 10 coated with the glue solution from the first height position to the second height position, so as to facilitate the robot to transfer the semiconductor substrate 10 coated with the glue solution to the next process; the driving controller controls the first power component 220 to drive the needle assembly 210 to move to the first height position or the second height position according to the feedback of the first height position signal or the second height position signal of the position detector 230, and the above process is repeated to transfer different semiconductor substrates 10 in turn, which is simple to operate, convenient to transfer, high in automation, improves the efficiency of transferring the semiconductor substrate 10, and is convenient for mass production.

[0088] As shown in Figure 10 Further, the jacking device 200 further comprises two vertically and symmetrically arranged sliding guides 240, and the needle assembly 210 vertically slides on the two sliding guides 240, preferably, each of the two sliding guides 240 comprises two symmetrically arranged linear slide rail groups 241 and a sliding block 242 sliding on the linear slide rail group 241, and the two ends of the needle assembly 210 are directly or indirectly fixed on the two sliding blocks 242, and the first power component 220 drives the needle assembly 210 to uniformly ascend or descend along the linear slide rail group 241 at the set speed, number of rotations and direction.

[0089] As shown in Figure 10 Preferably, the needle assembly 210 comprises a plurality of rows of symmetrically arranged needle modules, each row of needle modules comprises a plurality of symmetrically arranged needle groups, the needle group comprises a needle 213, a sleeve 211 screwed to the lower end of the needle 213 and a positioning member 212 limiting the sleeve 211, and a channel 250 for the robot (not shown) to pass through is formed between two adjacent needle modules, and the above structure can support the semiconductor substrate 10 to move up and down on the top of the plurality of needles 213, and facilitates the robot to pass through the channel 250 to transfer the semiconductor substrate 10, thereby increasing the use function.

[0090] In this embodiment, the needle 213 and the guide hole 120 on the platform 100 are in clearance sliding fit, which facilitates the smooth sliding of the needle 213 in the guide hole 120.

[0091] Preferably, the plurality of needles 213 are located at the same height to form a flat placement site 213' on the top of the needle 213 for placing the semiconductor substrate 10, so as to stably support the semiconductor substrate 10.

[0092] As shown in Figure 11 positioning member 212 and the sleeve 211 is axially limited and radially slides, the positioning member 212 is directly or indirectly detachably fixed with the connecting plate 262, the structure of the axial limitation and the radial sliding is that the sleeve 211 is provided with a connecting position 2111 in the radial direction at the lower end, the positioning member 212 has a horizontal end 2121 which is in sliding fit with the upper surface of the connecting position 2111 and a vertical end 2122 which is directly or indirectly detachably fixed with the connecting plate 262, preferably, the horizontal end 2121 is perpendicularly connected with the vertical end 2122, the connecting position 2111 is annularly arranged on the outer circumferential surface of the sleeve 211, when the ejector pin 213 rotates along its axis by 360°, the horizontal end 2121 can axially limit the ejector pin 213.

[0093] Further, the horizontal end 2121 is provided with an avoiding opening 2123 through which the sleeve 211 passes, the avoiding opening 2123 can increase the contact area between the connecting position 2111 and the horizontal end 2121, expand the range of the translation of the connecting position 2111, and is suitable for adjusting the ejector pin 213 with large bending degree to the position corresponding to the guide opening 120.

[0094] Further, the bottom of the ejector pin 213 is an arc-shaped part 2112 which can reduce the contact area between the connecting plate 262, and the connecting position 2111 is arranged close to the arc-shaped part 2112 to improve the stability of the connecting position 2111 during the translation.

[0095] The translation of the connecting position 2111 of the sleeve 211 relative to the horizontal end 2121 (such as forward and backward movement or left and right movement) can adjust the sleeve 211 to the position corresponding to the guide opening 120 of the platform 100, at this time, the center of the ejector pin 213 and the center of the guide opening 120 are located at the same position, which facilitates the smooth sliding of the ejector pin 213 in the guide opening 120, and the verticality of the ejector pin 213 can be manually adjusted before or after the fixed connection of the positioning member 212 and the connecting plate 262, which is simple to operate and convenient to use.

[0096] In addition, in the process of the upward movement of the ejector pin assembly 210, the inner circumferential surface of the vertically arranged guide opening 120 applies a radial thrust force to the outer circumferential surface of the curved ejector pin 110, so that the ejector pin 110 moves to the position corresponding to the guide opening 120, which plays a role of automatically correcting the curved ejector pin 110.

[0097] As shown in Figure 10As shown, further, the jacking device 200 comprises a door-type structure 260 for adjusting the parallelism of the ejector pin assembly 210, the door-type structure 260 comprising two spaced-apart first and second support members 261, 261' and a connecting plate 262 arranged between the first and second support members 261, 261' for mounting the ejector pin assembly 210, in the embodiment, the first and second support members 261, 261' are arranged vertically, and the connecting plate 262 is arranged horizontally and parallel to the platform 100.

[0098] The first and second support members 261, 261' are respectively fixed on two sliders 242 which are directly or indirectly screwed with the power output lead screws of the two first power components 220.

[0099] One end of the connecting plate 262 is rotationally connected with the first support member 261, and the other end of the connecting plate 262 is fixed in the vertical direction and slidably connected in the horizontal direction with the second support member 261'.

[0100] The door-type structure 260 further comprises a guide inlet 263 arranged transversely on the second support member 261' and an L-shaped sliding member 264 which is slidably arranged in the guide inlet 263 at one end and is fixedly connected with the connecting plate 262 at the other end.

[0101] The vertical section 2641 of the sliding member 264 is fixedly connected with the connecting plate 262, and the horizontal section 2642 of the sliding member 264 is transversely slidably arranged in the guide inlet 263 and parallel to the connecting plate 262. With the above structure, when adjusting the parallelism of the ejector pin assembly 210, the second support member 261' and the connecting plate 262 can have a movable gap, which facilitates the rotation of the connecting plate 262 relative to the first support member 261. In the embodiment, the two rotating rollers (265, 265') also have a guiding effect, which facilitates the horizontal section 2642 of the sliding member 264 to quickly enter the guide inlet 263, thereby improving the mounting efficiency.

[0102] The first support member 261 or the second support member 261' is driven to move upward or downward by one of the first power components 220, so as to adjust the parallelism of the ejector pin assembly 210, thereby facilitating the smooth sliding of the ejector pin 213 in the guide inlet 120.

[0103] Overview of the exemplary guide alignment device

[0104] As shown in Figure 5 , Figure 6 and Figure 12As shown, further, the glue coating system also comprises:

[0105] The guiding and positioning device 500 comprises:

[0106] At least two first guiding and positioning parts 510 are arranged to guide and position the semiconductor substrate 10 in the length direction;

[0107] At least two second guiding and positioning parts 520 are arranged to guide and position the semiconductor substrate 10 in the width direction.

[0108] As shown, Figure 13 The first guiding and positioning part 510 and the second guiding and positioning part 520 each comprise a plurality of rolling wheels rotating along the axis thereof, the rolling wheels are symmetrically arranged around the semiconductor substrate 10, and a guiding surface 511 for guiding and positioning the semiconductor substrate 10 is formed between the vertical diameter D1 and the horizontal diameter D2 of the rolling wheels. Since the rolling friction is smaller than the sliding friction, the rotating rolling wheels can quickly guide the semiconductor substrate 10 to the glue coating position of the platform 100, thereby improving the efficiency of guiding and positioning.

[0109] In another embodiment, the rolling wheels can also be arranged not to rotate, and the guiding and positioning effect can also be achieved. Meanwhile, an inclined surface or an inclined surface combined with a curved surface can be arranged on the rolling wheels, and the guiding and positioning effect can also be achieved.

[0110] As shown, Figure 6 Preferably, the horizontal diameter D2 of the rolling wheels arranged in the X direction and the Y direction corresponds to the position for positioning the semiconductor substrate 10 in the length direction and the width direction. In this embodiment, the position corresponding to the horizontal diameter D2 of the rolling wheels is at the same height as the adsorption surface 140 of the platform 100, and the adsorption area 110 is arranged on the adsorption surface 140 of the platform 100. With this structure, the semiconductor substrate 10 can be guided to the glue coating position of the platform 100 at the fourth height position, which is beneficial to the accurate glue coating of the knife 400 on the semiconductor substrate 10.

[0111] As shown, Figure 8 and Figure 12 Further, the guiding and positioning device 500 comprises a vertically movable guiding and supporting assembly 530, which comprises a hollow bracket 531 and a plurality of slide rods 532 arranged on the bracket 531 for mounting the guiding and positioning assembly. The slide rods 532 are arranged in the guiding hole 170 of the platform 100, the bracket 531 is arranged below the platform 100, and the slide rods 532 are arranged around the semiconductor substrate 10.

[0112] As shown, Figure 12As shown, further, the guiding and aligning device 500 comprises two sliding members 540 at two ends of the bracket 531 for moving the bracket 531 up and down, each of the two sliding members 540 comprises two linear guides 541 (the other linear guide is not shown) symmetrically arranged along the Y direction and a guiding block 542 sliding on the linear guide 541, and the two ends of the bracket 531 are directly or indirectly fixed on the two guiding blocks 542.

[0113] As shown in Figure 12 , further, the guiding and aligning device 500 further comprises:

[0114] a second power component 550 for driving the guiding and supporting assembly 530 to move up and down (see the Z direction in Figure 12 ), the second power component 550 includes but is not limited to a telescopic motor, a screw motor or a telescopic cylinder, in the embodiment, the second power component 550 is preferably a screw motor.

[0115] The second power component 550 rotates at a set first number of turns, a first rotation speed and a first direction, the first guiding and aligning part 510 and the second guiding and aligning part 520 on the guiding and supporting assembly 530 move up from the third height position to the fourth height position, and the first guiding and aligning part 510 and the second guiding and aligning part 520 precisely guide the semiconductor wafer 10 at the first height position to the glue applying position of the platform 100 at the fourth height position.

[0116] The second power component 550 rotates at a set second number of turns, a second rotation speed and a second direction, the guiding and supporting assembly moves down from the fourth height position to the third height position, which is lower than the height of the glue applying knife 400 along the horizontal direction, so as to facilitate the glue applying knife 400 to precisely apply glue on the fixed semiconductor wafer 10.

[0117] As shown in Figure 12 , the guiding and aligning device 500 further comprises:

[0118] a first position monitor 560 for detecting the third height position of the first guiding and aligning part 510 and the second guiding and aligning part 520;

[0119] a second position monitor 570 for detecting the fourth height position of the first guiding and aligning part 510 and the second guiding and aligning part 520, when the position monitor 560 or the second position monitor 570 detects that the first guiding and aligning part 510 and the second guiding and aligning part 520 are at the third height position or the fourth height position, the third height position signal or the fourth height position signal is fed out.

[0120] The driving controller drives the second power component 550 to start or stop working according to the received third height position signal or fourth height position signal, wherein the driving controller stores parameter information of the second power component 550, such as rotating speed, direction and number of turns.

[0121] With the above structure, the guiding and aligning device 500 can intelligently control the guiding and aligning of the semiconductor substrate 10 at the set height, improving the efficiency of the guiding and aligning of the semiconductor substrate 10, and being simple and convenient to operate.

[0122] Vacuum suction device as an example

[0123] As shown in Figure 7 , Figure 14 and Figure 15 , preferably, the vacuum suction device 300 comprises:

[0124] A vacuum pipeline assembly comprising a plurality of first pipelines 310 and a plurality of second pipelines 320 for communicating with the vacuum suction ports 130 of the platform 100, the plurality of first pipelines 310 and the plurality of second pipelines 320 are arranged in parallel and close to the platform 100 to reduce the space occupied by the plurality of first pipelines 310 and the plurality of second pipelines 320;

[0125] A vacuum pump 330 for generating a vacuum negative pressure in the vacuum pipeline assembly to suck the semiconductor substrate 10.

[0126] The structure arranged in parallel and close to the platform comprises:

[0127] A plurality of connectors 340, each connector 340 is embedded in the platform 100 and in sealed communication with a corresponding vacuum suction port 130, in the embodiment, the connector 340 is located at the bottom of the platform 100, and the top of the platform 100 is used to place the semiconductor substrate 10;

[0128] A plurality of pipe joints 350, each pipe joint 350 has a first inlet 351 and a first outlet 352 in communication with the first inlet 351, and a plurality of first outlets 352 are in detachable sealed communication with a plurality of connectors 340;

[0129] Each first pipeline 310 has one end in sealed communication with a corresponding first inlet 351;

[0130] A plurality of first three-way valves 360, each first three-way valve 360 has two second inlets 361 and a second outlet 362 in communication with the two second inlets 361, wherein the two second inlets 361 are in communication with the other end of the two first pipelines 310;

[0131] a plurality of second three-way valves 370, each of which has two third inlets 371 and a third outlet 372 in communication with the two third inlets 371, wherein the two third inlets 371 are in communication with the two second outlets 362 through the second pipelines 320, and the plurality of first three-way valves 360 and the second three-way valves 370 are detachably fixedly connected with the platform 100 to support the plurality of first pipelines 310 and the second pipelines 320 in communication with the plurality of first three-way valves 360 and the second three-way valves 370 respectively, so that the plurality of first pipelines 310 are parallel and close to the platform 100.

[0132] The above structural design avoids the phenomenon that the pipeline assembly and the ejector assembly 210 interfere with each other and rub to damage the pipeline, which is conducive to the smooth movement of the ejector assembly 210 in the platform 100 and prolongs the service life of the pipeline assembly.

[0133] As shown in Figure 15 Preferably, the connecting piece 340 is a hollow mouthguard, and the inner periphery of the mouthguard is provided with an internal thread for screwing with the pipe joint 350. The threaded connection is convenient to disassemble and assemble.

[0134] Preferably, the pipe joint 350 includes a longitudinal section 353 and a transverse section 354 in communication with the longitudinal section 353, wherein the outer periphery of the longitudinal section 353 is provided with an external thread for screwing with the internal thread of the mouthguard.

[0135] Preferably, the transverse section 354 is provided with an anti-falling structure 380, and one end of the first pipeline 310 is in sealed communication with the anti-falling structure 380 to realize the sealed communication between the transverse section 354 and the first pipeline 310.

[0136] Preferably, the anti-falling structure 380 is an arc-shaped protruding part (not shown) protruding from the outer periphery of the transverse section 354, or is an elastic compression locking structure, which is mainly realized by a joint and a snap spring inside the transverse section 354. When the first pipeline 310 is pushed forward, the front end of the first pipeline 310 abuts against the front end of the joint, the front end of the joint is opened by the internal snap spring, and after the first pipeline 310 is continuously pushed to the rated position, the spring device is triggered, and the claws will quickly and automatically lock the first pipeline 310. At the same time, the front end of the joint is extruded with the end surface or the tapered surface of the first pipeline 310 to form a good sealing surface to complete the sealing process. This connection method not only has a simple structure, but also can guarantee the sealing effect and operation efficiency, and is convenient to disassemble and assemble.

[0137] In this embodiment, the inlets and outlets of the first three-way valves 360 and the second three-way valves 370 are provided with the above-mentioned anti-falling structure 380 for preventing the second pipeline 320 from falling off, which will not be described here.

[0138] Preferably, the second inlet 361, the second outlet 362, the third inlet 371 and the third outlet 372 are arranged in parallel with the platform 100, and in this way, the space occupied by the first three-way valve 360 and the second three-way valve 370 can be saved.

[0139] Overview of the translation device as an example

[0140] As shown in Figure 1 , further, the glue coating system further comprises a translation device 600 for driving the coating knife 400 to move horizontally, and the translation device 600 comprises:

[0141] Two first sliding rails (610, 610') are arranged in parallel and spaced apart on the platform 100 and located on both sides of the semiconductor substrate 10, and are used for guiding the coating knife 400 in the horizontal direction (refer to the Y direction in Figure 1 ).

[0142] Two third power components (620, 620') are used for driving the coating knife 400 to move along the two first sliding rails (610, 610'), and the third power component 620 is a magnetic linear third power component or a screw third power component, both of which can drive the coating knife 400 to translate, and in the embodiment, a magnetic linear third power component with high precision and long moving distance is preferred;

[0143] A displacement sensor 630 is used for detecting the current displacement speed of the coating knife 400 and outputting a displacement speed signal to the outside;

[0144] The driving controller stores preset standard displacement speed information, and when the displacement sensor 630 detects that the current displacement speed of the two third power components (620, 620') deviates from the standard displacement speed, the driving controller changes the size of the current supplied to the two third power components (620, 620') to make the coating knife 400 move horizontally at the standard displacement speed.

[0145] Overview of the lifting device as an example

[0146] As shown in Figures 1-3 , further, the glue coating system further comprises a lifting device 700 for driving the coating knife 400 to move up and down, and the lifting device 700 comprises:

[0147] Two bases (710, 710') are respectively slidably arranged on the corresponding two first sliding rails (610, 610');

[0148] Two groups of second sliding rails (720, 720') are respectively arranged vertically on the two bases 710, and are used for guiding the coating knife 400 vertically (refer to the Z direction in Figure 2 ).

[0149] Two fourth power components (730, 730') are arranged on the two bases (710, 710') respectively, and are used to drive the coating knife 400 to move up and down along the two sets of second sliding rails (720, 720'), the two fourth power components (730, 730') rotate in a set number of turns and a direction, so that the coating knife 400 moves to a set height position accurately; the two fourth power components (730, 730') include but are not limited to telescopic motors, screw rod motors or telescopic cylinders, in the embodiment, the two fourth power components (730, 730') are preferably screw rod motors, the distance of the movement of the coating knife 400 can be obtained by the product of the pitch of the screw rod and the number of turns of rotation.

[0150] One of the fourth power components 730 drives one end of the coating knife 400 to move on one set of second sliding rails 720 in a set number of turns and a direction, so as to adjust the parallelism of the glue outlet 410, which is beneficial to the uniform coating of the coating knife 400 on the semiconductor substrate 10;

[0151] As shown in Figure 2 , further, the coating knife 400 is detachably mounted on a support beam 740 arranged along the X direction, the two ends of the support beam 740 are respectively connected with connecting seats (750, 750') which are slidably arranged on the two sets of second sliding rails (720, 720'), the two connecting seats (750, 750') are respectively rotatably connected with the two ends of the support beam 740 through shafts 751, one of the connecting seats 750 is provided with a shaft guide opening 752 which allows the shaft 751 to translate, the shaft guide opening 752 and the shaft 751 are in clearance fit, when one of the fourth power components 730 drives one end of the coating knife 400 to move up and down to adjust the parallelism of the coating knife 400, the shaft 751 can rotate and translate in the shaft guide opening 752, which avoids the phenomenon that one end of the support beam 740 is stuck between the connecting seat 750 and / or the connecting seat 750' during the up and down movement.

[0152] The two fourth power components (730, 730') rotate in a set number of turns and a direction, simultaneously drive the connecting seats (750, 750') to slide on the two sets of second sliding rails (720, 720') by a set distance, and further drive the coating knife 400 to slide up and down, so as to adjust the coating knife 400 to a set height position.

[0153] Example uniform coating system overview

[0154] As shown in Figure 1 , Figure 16 and Figure 17 , the application also provides a coating device, which comprises the above glue coating system, and further comprises a uniform coating system used to remove excess glue liquid at the glue outlet 410 of the coating knife 400 in the glue coating system before glue coating by the glue coating system, the uniform coating system comprises:

[0155] The glue spreading wheel 800 is arranged in the moving range of the glue outlet 410, and rotates along its axis at the original position when the glue outlet 410 moves to the glue spreading position, so as to adhere the excess glue at the glue outlet 410 to the outer circumferential surface of the glue spreading wheel 800. Preferably, in the embodiment, the glue spreading position is directly above the glue spreading wheel 800, and the glue spreading distance L between the glue outlet 410 and the glue spreading wheel 800 is set.

[0156] The glue spreading system further comprises a glue scraping part 900 which is in sliding abutment with the outer circumferential surface of the glue spreading wheel 800. When the glue spreading wheel 800 rotates, the glue scraping part 900 scrapes the glue adhered to the outer circumferential surface of the glue spreading wheel 800, so as to keep the glue spreading distance L between the glue spreading wheel 800 and the glue outlet 410 within the set threshold, thereby ensuring that the glue amount coated on the semiconductor substrate 10 by the glue outlet 410 is uniform and consistent, and avoiding the phenomenon that the existing technology causes the consumption and wear powder to fall and pollute the semiconductor substrate 10 due to the movement of the cleaning part relative to the glue outlet 410.

[0157] An exemplary coating method is summarized

[0158] The present application also provides a coating method, comprising the following steps:

[0159] The step of receiving the semiconductor substrate 10;

[0160] The step of placing the received semiconductor substrate 10 on the platform 100;

[0161] The step of adsorbing and fixing the semiconductor substrate 10 on the platform 100;

[0162] The step of horizontally moving the coating knife 400 relative to the platform 100 to uniformly coat glue on the semiconductor substrate 10.

[0163] The step of adsorbing and fixing the semiconductor substrate 10 on the platform 100 further comprises the step of guiding the semiconductor substrate 10 to the glue coating position of the platform 100.

[0164] The step of horizontally moving the coating knife 400 relative to the platform 100 to uniformly coat glue on the semiconductor substrate 10 further comprises the step of removing the excess glue at the glue outlet 410 of the coating knife 400.

[0165] The above coating method has been embodied in the glue coating system and the glue spreading system, and will not be described here.

[0166] The above is the preferred embodiment of the present application, and it should be pointed out that those skilled in the art can make several improvements and refinements without departing from the principles of the present application, and these improvements and refinements are also considered to be within the protection scope of the present application.

Claims

1. A gluing system, characterized in that, The application relates to a semiconductor substrate coating device, which comprises the following parts: a platform for placing semiconductor substrates and having an adsorption area for adsorbing semiconductor substrates; a lifting device having a lifting pin assembly sliding through the platform, the lifting pin assembly being moved from a first height position to a second height position for receiving semiconductor substrates transferred by a mechanical hand, and being moved from the second height position to the first height position for placing the received semiconductor substrates on the platform; a guiding and aligning device for guiding and aligning the semiconductor substrates placed on the lifting pin assembly to guide the semiconductor substrates to the adsorption area on the platform; a vacuum adsorption device for communicating with the adsorption area and capable of generating a vacuum negative pressure for adsorbing and fixing the semiconductor substrates on the platform; a coating knife configured to move up and down and horizontally relative to the platform, the coating knife having a slit glue outlet for coating glue on the semiconductor substrates, wherein the adsorption area is located in the horizontal moving range of the coating knife.

2. The gluing system according to claim 1, characterized in that The platform has a plurality of guiding holes for the lifting pin assembly to slide through and being spaced from the adsorption channels of the adsorption area, and a plurality of vacuum adsorption holes uniformly arranged and respectively communicating with the adsorption channels of the adsorption area, and the guiding holes and the vacuum adsorption holes are all located in the adsorption area.

3. The gluing system according to claim 1, wherein The lifting device comprises: a first power component for driving the lifting pin assembly to move from the first height position to the second height position or driving the lifting pin assembly to move from the second height position to the first height position.

4. The gluing system according to claim 1, wherein The guiding and aligning device comprises: at least two first guiding and aligning parts for guiding and aligning the semiconductor substrates in the length direction; at least two second guiding and aligning parts for guiding and aligning the semiconductor substrates in the width direction.

5. The gluing system according to claim 4, wherein The first guiding and aligning part and the second guiding and aligning part both comprise a plurality of rolling wheels rotating around the axes, and the rolling wheels are symmetrically arranged around the semiconductor substrates, and the horizontal diameters of the rolling wheels are configured to be at the same height as the adsorption surface of the platform when the rolling wheels guide and align the semiconductor substrates.

6. The gluing system according to claim 1, wherein The vacuum adsorption device comprises: a vacuum pipeline assembly for communicating with the vacuum adsorption holes of the platform and being configured to be parallel to and close to the platform; a vacuum pump for generating a vacuum negative pressure in the vacuum pipeline assembly for adsorbing the semiconductor substrates.

7. The gluing system according to claim 1, wherein The application also relates to a translation device for driving the coating knife to horizontally move, which comprises: two first sliding rails parallelly and spacedly arranged on the platform and located at two sides of the semiconductor substrates for guiding the translation of the coating knife; a third power component for driving the coating knife to move along the first sliding rails; a displacement sensor for detecting the current displacement speed of the coating knife and outputting a displacement speed signal; a driving controller storing preset standard displacement speed information, when the detected current displacement speed deviates from the standard displacement speed, the driving controller changes the size of the current supplied to the third power component to make the coating knife horizontally move at the standard displacement speed.

8. The gluing system according to claim 1, wherein The application also relates to a lifting device for driving the coating knife to move up and down to different heights, which comprises: Two bases, respectively slidingly arranged on the corresponding two first sliding rails; Two groups of second sliding rails, respectively vertically arranged on the two bases, for vertically guiding the coating knife; Two second power components, respectively arranged on the two bases, for driving the coating knife between the two bases to move up and down along the second sliding rails.

9. A coating apparatus characterized by, The glue coating system of any one of claims 1 to 8, further comprising a glue uniformizing system for removing excess glue from the glue outlet of the coating knife before the glue coating system coats glue.

10. A coating method characterized by, The method comprising the steps of: receiving a semiconductor substrate; placing the received semiconductor substrate on a platform; sucking and fixing the semiconductor substrate on the platform; horizontally moving the coating knife relative to the platform to uniformly coat glue on the semiconductor substrate.

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