Evaporator magnetic alignment device and evaporator

Abstract

The invention provides an evaporator magnetic alignment device and an evaporator, and belongs to the field of display panel production. The magnetic alignment device of the evaporator is used for fixing a metal mask plate on a substrate to be evaporated, the magnetic alignment device of the evaporator comprises a back plate and a plurality of magnets fixed on the back plate, the magnets are provided with N poles and S poles, at least one row of magnets are arranged on the back plate, each row of magnets comprises first magnets and second magnets which are alternately arranged, and the first magnets and the second magnets are arranged on the back plate. The second magnet comprises two sub-magnets arranged side by side, the two sub-magnets comprise a first sub-magnet and a second sub-magnet, the N pole of the first sub-magnet is adjacent to the S pole of the second sub-magnet, the N pole of the second sub-magnet is adjacent to the S pole of the first sub-magnet, and the S pole of each first magnet is adjacent to the S pole of the adjacent sub-magnet; the N pole of each first magnet is adjacent to the N pole of the adjacent sub-magnet. The magnetic force of the magnetic alignment device of the evaporator can be increased, and evaporation shadows are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of display panel production, in particular to a magnetically aligned device of an evaporation machine and the evaporation machine. BACKGROUND

[0002] OLED (Organic Light-Emitting Diode) display devices have been listed as the next generation display technology with great development prospects due to their advantages of thinness, lightness, wide viewing angle, active light-emitting, continuous adjustable light-emitting color, low cost, fast response speed, small energy consumption, low driving voltage, wide operating temperature range, simple production process, high light-emitting efficiency, and flexible display.

[0003] In the evaporation process of an OLED display substrate, a metal mask plate matching the size of the display substrate is needed. In order to improve the fitting effect between the metal mask plate and the substrate to be evaporated, a magnetic device is generally arranged on the side of the evaporation machine far from the substrate to be evaporated to adsorb the metal mask plate on the substrate to be evaporated, thereby fixing the metal mask plate. The fitting degree of the metal mask plate and the substrate to be evaporated directly affects the evaporation Shadow, thereby affecting the product yield and yield. The magnetic force of the existing evaporation machine magnetic alignment device is small, resulting in a gap between the metal mask plate and the substrate to be evaporated, producing evaporation Shadow, and thus the product yield and yield are low. SUMMARY

[0004] The technical problem to be solved by the present application is to provide a magnetically aligned device of an evaporation machine and the evaporation machine, which can increase the magnetic force of the magnetically aligned device of the evaporation machine, so that the metal mask plate and the substrate to be evaporated are well fitted together, and the evaporation Shadow is reduced.

[0005] To solve the above technical problems, the technical solutions of the embodiments of the present application are as follows:

[0006] On the one hand, a magnetically aligned device of an evaporation machine is provided for fixing a metal mask plate on a substrate to be evaporated, the magnetically aligned device of the evaporation machine comprising a back plate and a plurality of magnets fixed on the back plate, the magnets having N and S poles, the back plate having at least one row of magnets arranged thereon, each row of magnets comprising first magnets and second magnets arranged alternately, the second magnets comprising two sub-magnets arranged side by side, the two sub-magnets comprising a first sub-magnet and a second sub-magnet, the N pole of the first sub-magnet being adjacent to the S pole of the second sub-magnet, the N pole of the second sub-magnet being adjacent to the S pole of the first sub-magnet, the S pole of each first magnet being adjacent to the S pole of the adjacent sub-magnet, and the N pole of each first magnet being adjacent to the N pole of the adjacent sub-magnet.

[0007] In some embodiments, the first magnets and the second magnets are rectangular, the length of the magnets in the same row is equal, and the width of the magnets in the same column is equal.

[0008] In some embodiments, the width of the magnets is 8.5-13 mm.

[0009] In some embodiments, the number of magnets in each row is 40-100.

[0010] In some embodiments, the distance between the adjacent first magnets and the second magnets is 1-3 mm.

[0011] In some embodiments, the material of the magnets is neodymium iron boron.

[0012] In some embodiments, the magnets are magnetically attached to the back plate, and the material of the back plate is SUS430.

[0013] In some embodiments, the back plate is rectangular, and the back plate is provided with a clamping groove for placing each magnet, the length and width of the clamping groove match the length and width of the magnet, and the height of the magnet is greater than the depth of the clamping groove.

[0014] In some embodiments, the edge of the back plate is provided with a plurality of semicircular notches for fixing.

[0015] Embodiments of the present application also provide a kind of evaporation machine, including evaporation source, mask plate, cooling plate and above-mentioned evaporation machine magnetic force alignment device which are sequentially arranged from bottom to top.

[0016] Embodiments of the present application have the following beneficial effects:

[0017] In the above scheme, at least one row of magnets is arranged on the back plate, each row of magnets includes alternately arranged first magnets and second magnets, the second magnets include two sub-magnets arranged side by side, the two sub-magnets include a first sub-magnet and a second sub-magnet, the N pole of the first sub-magnet is adjacent to the S pole of the second sub-magnet, and the N pole of the second sub-magnet is adjacent to the S pole of the first sub-magnet, the S pole of each first magnet is adjacent to the S pole of the adjacent sub-magnet, and the N pole of each first magnet is adjacent to the N pole of the adjacent sub-magnet; the magnet arrangement of the embodiment can effectively increase the magnetic force of the evaporation machine magnetic force alignment device and ensure the uniformity of the magnetic force, so that the metal mask plate and the to-be-evaporated substrate are well attached together, the evaporation shadow is reduced, and the product capacity and yield are improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A schematic view of the to-be-evaporated substrate placed above the metal mask plate after the evaporation machine alignment is completed;

[0019] Figure 2 A schematic view before the to-be-evaporated substrate is evaporated.

[0020] Figure 3 This is a schematic diagram illustrating how the adhesion between the substrate to be vapor-deposited and the metal mask affects the vapor deposition shadow.

[0021] Figure 4 This is a schematic diagram of the magnet arrangement in the magnetic alignment device of a vapor deposition machine in related technologies;

[0022] Figure 5 This is a schematic diagram of the magnet arrangement of the magnetic alignment device of the vapor deposition machine according to an embodiment of the present invention;

[0023] Figure 6 This is a cross-sectional schematic diagram of the magnetic alignment device of the vapor deposition machine according to an embodiment of the present invention;

[0024] Figure 7 This is a magnetic force simulation curve of the vapor deposition machine according to an embodiment of the present invention.

[0025] Figure Labels

[0026] 10 Metal mask plate

[0027] 20 Substrate to be vapor-deposited

[0028] 30 Cooling plate

[0029] 40 Magnetic alignment device for vapor deposition machine

[0030] 41 magnet

[0031] 42 Back panel

[0032] 43 First Lodestone

[0033] 44 Second magnet

[0034] 441 First Son Magnet

[0035] 442 Second Magnet Detailed Implementation

[0036] To make the technical problems, technical solutions and advantages of the embodiments of the present invention clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0037] like Figure 1 As shown, the vapor deposition machine includes a metal mask 10, a cooling plate 30, and a magnetic alignment device 40 arranged sequentially. After alignment, the substrate 20 to be deposited is placed above the metal mask 10, and will sag slightly due to gravity. To better fit the metal mask 10 and the substrate 20, the cooling plate 30 presses down on the substrate 20, and the magnetic alignment device 40 descends to attract the metal mask 10, lifting the substrate 20 upwards. Figure 2As shown, the metal mask plate 10 is attached to the substrate 20 to be evaporated.

[0038] Figure 3 The schematic diagram of the attachment of the metal mask plate 10 and the substrate 20 to be evaporated affecting the evaporation Shadow is shown in FIG. 3. Figure 3 As shown, when the attachment of the metal mask plate 10 and the substrate 20 to be evaporated is poor, the size d2 of the evaporation Shadow is large; when the attachment of the metal mask plate 10 and the substrate 20 to be evaporated is good, the size d1 of the evaporation Shadow is small. The evaporation Shadow is a phenomenon in the OLED manufacturing process due to the physical properties of the evaporation process, which refers to the phenomenon that the evaporation material cannot be accurately deposited to the target pixel area due to factors such as the structure of the metal mask plate, the evaporation angle, or the substrate spacing, but instead forms an unexpected thin film residue in the adjacent pixel area. The large size of the evaporation Shadow will cause pixel color mixing, resolution degradation, and poor display uniformity.

[0039] Figure 4 The schematic diagram of the magnet arrangement of the evaporation machine magnetic force alignment device in the related art is shown in FIG. 4. Figure 4 As shown, in the prior art, a plurality of rows of magnets 41 are arranged on the back plate 42, and in each row of magnets, the N and S poles of adjacent magnets 41 are opposite in direction. With this magnet arrangement, the evaporation magnetic force generated by the evaporation machine magnetic force alignment device is about 500 G (Gauss), which is relatively small, so that the attachment of the metal mask plate 10 and the substrate 20 to be evaporated is poor, and there is a gap between the metal mask plate 10 and the substrate 20 to be evaporated, resulting in a large evaporation Shadow, which affects the yield of the product. In addition, due to the structure of the evaporation machine, it is not possible to significantly increase the magnetic force of the evaporation machine magnetic force alignment device while ensuring that the limit distance of the magnet and the metal mask plate and the magnetic force uniformity do not exceed Spec 5%.

[0040] Embodiments of the present application provide an evaporation machine magnetic force alignment device and an evaporation machine, which can prevent the magnetic force of the evaporation machine magnetic force alignment device from being increased, so that the metal mask plate and the substrate to be evaporated are well attached together, and the evaporation Shadow is reduced.

[0041] Embodiments of the present application provide an evaporation machine magnetic force alignment device for fixing a metal mask plate on a substrate to be evaporated, which comprises a back plate and a plurality of magnets fixed on the back plate, the magnets having N and S poles, and at least one row of magnets arranged on the back plate, as shown in FIG. 5. Figure 5As shown, each row of magnets comprises first magnets 43 and second magnets 44 arranged alternately along the first direction, the second magnets 44 comprise two sub-magnets arranged side by side, the two sub-magnets comprise a first sub-magnet 441 and a second sub-magnet 442, the N pole of the first sub-magnet 441 is adjacent to the S pole of the second sub-magnet 442, and the N pole of the second sub-magnet 442 is adjacent to the S pole of the first sub-magnet 441, the S pole of each first magnet 43 is adjacent to the S pole of the adjacent sub-magnet, and the N pole of each first magnet 43 is adjacent to the N pole of the adjacent sub-magnet.

[0042] In the embodiment, at least one row of magnets is arranged on the back plate, each row of magnets comprises first magnets and second magnets arranged alternately, the second magnets comprise two sub-magnets arranged side by side, the two sub-magnets comprise a first sub-magnet and a second sub-magnet, the N pole of the first sub-magnet is adjacent to the S pole of the second sub-magnet, and the N pole of the second sub-magnet is adjacent to the S pole of the first sub-magnet, the S pole of each first magnet is adjacent to the S pole of the adjacent sub-magnet, and the N pole of each first magnet is adjacent to the N pole of the adjacent sub-magnet; the magnet arrangement mode of the embodiment can effectively increase the magnetic force of the magnetic force alignment device of the evaporation machine and ensure the uniformity of the magnetic force, so that the metal mask plate and the substrate to be evaporated are well attached together, the evaporation shadow is reduced, and the product yield and capacity are improved.

[0043] In the embodiment, the S pole of each first magnet 43 is adjacent to the S pole of the adjacent sub-magnet, that is, the part closest to the S pole of the first magnet 43 of the adjacent sub-magnet is the S pole of the sub-magnet; and the N pole of each first magnet 43 is adjacent to the N pole of the adjacent sub-magnet, that is, the part closest to the N pole of the first magnet 43 of the adjacent sub-magnet is the N pole of the sub-magnet, so that the S poles of the magnets are continuously distributed and the N poles of the magnets are continuously distributed, which can effectively increase the magnetic force of the magnetic force alignment device 40 of the evaporation machine.

[0044] Compared with the magnet arrangement mode of Figure 4 Without changing the size of the back plate and the magnets, the magnet arrangement mode of the embodiment can increase the magnetic force of the magnetic force alignment device 40 of the evaporation machine by more than 150%, greatly increasing the magnetic force of the magnetic force alignment device 40 of the evaporation machine, and ensuring that the uniformity of the magnetic force is within Spec 5%, wherein the magnetic force uniformity (also known as magnetic field uniformity) refers to the consistency degree of the strength and direction of the magnetic field in a specific space, and the magnetic force uniformity within Spec 5% means that the difference between the maximum magnetic force and the minimum magnetic force is not more than 5% of the maximum magnetic force. In addition, the technical solution of the embodiment does not need to increase the magnetic force by reducing the distance between the magnets and the metal mask plate 10, so there is no risk of equipment interference; the technical solution of the embodiment does not need to change the size of the magnets, so the back plate also does not need to be replaced, which can reduce the equipment modification cost; furthermore, compared with the magnet arrangement mode shown in Figure 4 Compared with the magnet arrangement mode shown in the embodiment, the technical solution of the embodiment only needs to replace half of the magnets, which can further reduce the modification cost.

[0045] In some embodiments, as shown in Figure 5 The first magnets 43 and the second magnets 44 can be rectangular, the length of the magnets in the same row is equal, and the width of the magnets in the same column is equal. The size of the first magnets 43 is the same as that of the second magnets 44. The size of each sub-magnet can be half of the first magnet 43. The thickness of the sub-magnet is the same as that of the first magnet 43. The length of the sub-magnet is the same as that of the first magnet 43. The width of the sub-magnet is half of the width of the first magnet 43. This is conducive to improving the uniformity of the magnetic force.

[0046] In some embodiments, the width of the magnets can be 8.5-13mm, that is, the width of the first magnets 43 and the second magnets 44 in the first direction can be 8.5-13mm. This can ensure that the evaporation machine magnetic force alignment device 40 can provide sufficient magnetic force to well adhere the metal mask plate 10 to the to-be-evaporated substrate 20.

[0047] In some embodiments, the number of magnets in each row can be 40-100. This can ensure that the evaporation machine magnetic force alignment device 40 can provide sufficient magnetic force to well adhere the metal mask plate 10 to the to-be-evaporated substrate 20, reduce evaporation Shadow, and improve product capacity and yield.

[0048] In some embodiments, the distance between adjacent first magnets 43 and second magnets 44 can be 1-3mm. In this embodiment, the distance between adjacent first magnets 43 and second magnets 44 is equal. This can ensure that the magnetic force is relatively uniform, thereby making the adsorption force between the evaporation machine magnetic force alignment device 40 and the metal mask plate 10 uniform, the adhesion between the metal mask plate 10 and the to-be-evaporated substrate 20 uniform, and improving the precision of evaporation and product yield.

[0049] In some embodiments, the material of the magnets can be neodymium iron boron, and the magnets are magnetically adsorbed to the back plate. The material of the back plate can be SUS430, which is a Japanese standard name for 430 stainless steel, a general-purpose steel with good corrosion resistance, a ferritic stainless steel, better thermal conductivity than austenitic, and smaller thermal expansion coefficient than austenitic.

[0050] Figure 6 FIG. 2 is a cross-sectional view of the evaporation machine magnetic force alignment device according to an embodiment of the present application, Figure 7 FIG. 3 is a magnetic force simulation curve of the evaporation machine magnetic force alignment device according to an embodiment of the present application. After magnetic force simulation of the evaporation machine magnetic force alignment device according to the embodiment, it is found that the magnetic force at positions 1, 2, 3, 4, 5, 6, 7, 8, 9 and 10 is the largest, as shown in Figure 7As shown, the magnetic force at position 1 can reach 1386G, the magnetic force at position 2 can reach 1255G, the magnetic force at position 3 can reach 1386G, the magnetic force at position 4 can reach 1259G, the magnetic force at position 5 can reach 1380G, the magnetic force at position 6 can reach 1258G, the magnetic force at position 7 can reach 1373G, the magnetic force at position 8 can reach 1287G, the magnetic force at position 9 can reach 1360G, the magnetic force at position 10 can reach 1292G, the magnetic force at position 11 can reach 1377G, the average magnetic force can reach 1328G, and the average magnetic force of the evaporation machine magnetic alignment device can reach 1328G. Figure 4 The arrangement shown can reach 254%, and the uniformity of the magnetic force can be ensured to be within Spec 4.96%.

[0051] In some embodiments, the back plate can be rectangular, and the back plate is provided with a clamping groove for placing each magnet, the length and width of the clamping groove match the length and width of the magnet, the height of the magnet is greater than the depth of the clamping groove, and the clamping groove can firmly fix the magnet on the back plate through friction, adhesion or a buckle structure, for example, a matching adhesive layer can be arranged in the clamping groove to firmly fix the magnet on the back plate through the adhesion of the adhesive layer, or a protrusion or a groove is designed on the inner wall of the clamping groove to cooperate with a clamping block arranged on the magnet to firmly fix the magnet on the back plate through elastic locking.

[0052] As shown in the figure, Figure 5 In the second magnet 44, the opposite poles of the first sub-magnet 441 and the second sub-magnet 442 are adjacent, so that the first sub-magnet 441 and the second sub-magnet 442 can be closely attached; the first sub-magnet 441 is adjacent to the same pole of the adjacent first magnet 43, the second sub-magnet 442 is adjacent to the same pole of the adjacent first magnet 43, and there is a certain repulsive force between the first sub-magnet 441 and the adjacent first magnet 43, and there is a certain repulsive force between the second sub-magnet 442 and the adjacent first magnet 43, but due to the fixing effect of the clamping groove, the first magnet 43 and the second magnet 44 can be firmly fixed on the back plate 42.

[0053] In some embodiments, in order to facilitate the fixation of the back plate 42, the edge of the back plate 42 can be provided with a plurality of semicircular notches for fixation.

[0054] Embodiments of the present application also provide an evaporation machine, which comprises an evaporation source, a mask plate, a cooling plate and the above-mentioned evaporation machine magnetic alignment device arranged in sequence from bottom to top. The magnetic force of the evaporation machine magnetic alignment device of the present embodiment is large, which can make the metal mask plate and the to-be-evaporated substrate well attached together, reduce the evaporation Shadow, and improve the production capacity and yield of display products.

[0055] It should be noted that each of the embodiments in the present specification is described in a progressive manner, and the same or similar parts between each embodiment can be mutually referred to, and each embodiment focuses on the difference from other embodiments. In particular, for the embodiments, since they are basically similar to the product embodiments, they are described more simply, and the relevant parts can be referred to the part of the description of the product embodiments.

[0056] Unless otherwise defined, technical terms or scientific terms used in the present disclosure shall have the ordinary meaning of those skilled in the art to which the present disclosure pertains. The terms "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. The terms "include", "comprise", and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and equivalents thereof, and do not exclude other elements or objects. The terms "connected" or "coupled" and similar terms do not limit to physical or mechanical connections or couplings, but can include electrical connections or couplings, whether direct or indirect. The terms "upper", "lower", "left", "right", and the like are used only to indicate relative positions, and when the absolute positions of the described objects are changed, the relative positions can also be changed accordingly.

[0057] It can be understood that when an element such as a layer, a film, a region, or a substrate is referred to as being "on" or "under" another element, it can be "directly" on or under the other element, or one or more intervening elements can also be present.

[0058] In the description of the above-described embodiments, specific features, structures, materials, or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0059] The above description is merely illustrative of the disclosure and does not limit the scope of the disclosure. Any skilled person in the art can easily think of changes or replacements within the technical scope disclosed by the present disclosure, which should be covered by the scope of the present disclosure. Therefore, the scope of the present disclosure should be subject to the scope of the claims.

Claims

1. A magnetic alignment device for a vapor deposition machine, used to fix a metal mask onto a substrate to be vapor-deposited, the magnetic alignment device comprising a back plate and a plurality of magnets fixed to the back plate, the magnets having N poles and S poles, characterized in that, The back plate is arranged with at least one row of magnets. Each row of magnets includes alternating first and second magnets. The second magnet includes two sub-magnets arranged side by side. The two sub-magnets include a first sub-magnet and a second sub-magnet. The N pole of the first sub-magnet is adjacent to the S pole of the second sub-magnet, and the N pole of the second sub-magnet is adjacent to the S pole of the first sub-magnet. The S pole of each first magnet is adjacent to the S pole of the adjacent sub-magnet, and the N pole of each first magnet is adjacent to the N pole of the adjacent sub-magnet.

2. The magnetic alignment device for a vapor deposition machine according to claim 1, characterized in that, The first and second magnets are rectangular, with magnets in the same row having equal lengths and magnets in the same column having equal widths.

3. The magnetic alignment device for a vapor deposition machine according to claim 1, characterized in that, The width of the magnet is 8.5-13mm.

4. The magnetic alignment device for a vapor deposition machine according to claim 1, characterized in that, The number of magnets in each row is 40-100.

5. The magnetic alignment device for a vapor deposition machine according to claim 1, characterized in that, The spacing between adjacent first and second magnets is 1-3 mm.

6. The magnetic alignment device for a vapor deposition machine according to claim 1, characterized in that, The magnet is made of neodymium iron boron.

7. The magnetic alignment device for a vapor deposition machine according to claim 6, characterized in that, The magnet is magnetically attracted to the back plate, and the back plate is made of SUS430.

8. The magnetic alignment device for a vapor deposition machine according to claim 1, characterized in that, The back plate is rectangular and has a slot for placing each magnet. The length and width of the slot match the length and width of the magnet, and the height of the magnet is greater than the depth of the slot.

9. The magnetic alignment device for a vapor deposition machine according to claim 8, characterized in that, The back plate has multiple semi-circular notches along its edge for fixing.

10. A vapor deposition machine, characterized in that: It includes an evaporation source, a mask plate, a cooling plate, and a magnetic alignment device for a vapor deposition machine as described in any one of claims 1-9, arranged sequentially from bottom to top.

Images