Copper deposition device and copper deposition method for automatic processing of multi-layer PCB (Printed Circuit Board)

Abstract

The invention discloses a copper deposition device and method for automatic processing of a multi-layer PCB. The copper deposition device comprises a copper deposition box, and a cover plate is arranged on the copper deposition box; the driving assembly is fixedly arranged on the cover plate; the device further comprises a moving assembly and a fastening assembly, the driving assembly drives the fastening assembly to reciprocate through the moving assembly, the fastening assembly is provided with a PCB double-sided board body, the PCB double-sided board body swings in the copper deposition box through the moving assembly, and flowing of copper deposition liquid in an opening of the PCB double-sided board body is increased. The driving assembly drives the fastening assembly to fasten, clamp and work the PCB double-sided board body, gas in the copper deposition box makes contact with the copper deposition liquid, the PCB double-sided board body fastened and clamped in the fastening assembly swings, the copper deposition liquid can flow in the reaction groove holes formed in the PCB double-sided board body, and the copper deposition liquid can flow in the reaction groove holes in cooperation with the high contact activity of the gas and the copper deposition liquid. And the reaction effect of the PCB double-sided board body in the copper deposition box is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB board production equipment, and particularly relates to a copper plating device and a copper plating method for multi-layer PCB board automatic processing. BACKGROUND

[0002] Copper plating, also known as hole metallization, is used to connect with two sides of the wire, and the chemical copper plating device for PCB double-sided board production is a kind of device that uses the method of chemical deposition to deposit a thin layer of chemical copper on the hole wall of the circuit board after drilling and pretreatment, and improves the conductivity of the subsequent electroplating thickening copper. It has been widely used in the field.

[0003] For example, a patent with the title of "A chemical copper plating device and method for PCB double-sided board production" with the publication number CN117042335A and the authorization publication date of November 10, 2023, which includes a support frame, a copper plating box, a sliding block connected to the top end of the support frame, and a jet flow inducer. The circulating flow disturbing member, the connection limiting assembly, the first drive motor, the first winding roller, the second winding rope, the second drive motor, the PCB double-sided board body, the copper plating tank, the gas pump, the gas pipe, the jet head, the third drive motor, and the intermittent start gas pump are arranged. When the second drive motor output end drives the first winding roller to release the second winding rope, the PCB double-sided board body is released into the copper plating tank for copper plating, and then the gas pump and the third drive motor are started intermittently. The gas pump sends the outside air to the gas pipe inside through the jet head to form high-pressure gas on the PCB double-sided board body, so that the copper plating solution around the PCB double-sided board body is disturbed, thereby interfering with the copper particles attached to the hole wall of the PCB double-sided board body, making them separate from the PCB double-sided board body, so that the PCB double-sided board body can be in contact with the copper plating solution in all directions, thereby improving the metallization effect of the hole wall of the PCB double-sided board body.

[0004] The existing technology has the following disadvantages: since the PCB double-sided board copper plating is to deposit a thin layer of chemical copper on the hole wall of the circuit board after drilling, it is necessary to improve the activity of the copper plating solution and the way of contact with the hole wall. The gas pump-in method can improve the activity of the copper plating solution, but it cannot achieve the effect of improving the reaction effect of the copper plating solution by driving the copper plating solution with gas for the reserved hole wall of the PCB double-sided board. If the gas is too large, it will cause damage to the reserved hole wall of the PCB double-sided board, or if the gas is too small, it will not have the desired effect. How to solve the problem of the reaction of the PCB double-sided board in the high-activity copper plating solution. SUMMARY

[0005] The present application aims to provide a copper plating device and a copper plating method for multi-layer PCB board automatic processing. The drive assembly drives the fastening assembly to fasten and clamp the PCB double-sided board body, the gas in the copper plating tank contacts the copper plating solution, the PCB double-sided board body fastened and clamped by the fastening assembly is swung, the copper plating solution flows in the reaction tank hole opened in the PCB double-sided board body, and the high activity of the gas contacting the copper plating solution improves the reaction effect of the PCB double-sided board body in the copper plating tank.

[0006] In order to achieve the above object, the application adopts the following technical scheme: a copper plating device and a copper plating method for automatic processing of multi-layer PCB boards, comprising a copper plating box, a cover plate arranged on the copper plating box; further comprising a driving assembly fixedly arranged on the cover plate; further comprising a moving assembly and a fastening assembly, the driving assembly drives the fastening assembly to reciprocate through the moving assembly, and the fastening assembly is provided with a PCB double-sided panel body which swings in the copper plating box through the moving assembly to increase the flow of copper plating liquid in the hole of the PCB double-sided panel body; further comprising an air pump and a communication assembly, the communication assembly sends the gas of the air pump into the fastening assembly and the copper plating box, and the PCB double-sided panel body is clamped and the activity of the copper plating liquid in the copper plating box is improved through the fastening assembly;

[0007] Further description of the above technical scheme:

[0008] The moving assembly comprises a moving plate, a connecting plate fixedly connected to the top end of the moving plate, a guide strip fixedly connected to one end of the connecting plate, and a support arm fixedly connected to the end of the moving plate through the connecting plate.

[0009] Further description of the above technical scheme:

[0010] The driving assembly comprises a bracket, the bracket is provided with a connecting shaft at both ends, the connecting shaft is provided with a transmission part at the bottom end, the transmission parts are provided with a motor shaft engaged between them, the motor shaft is provided with a driving motor at the bottom end, and the driving motor is fixed on the cover plate.

[0011] Further description of the above technical scheme:

[0012] The transmission part comprises a toothed disc, and the toothed disc is adapted to the motor shaft, the toothed disc is fixedly connected with an eccentric plate at the bottom end, the eccentric plate is fixedly connected with a lever at one end, and the lever is adapted to the notch in the guide strip.

[0013] Further description of the above technical scheme:

[0014] The fastening assembly comprises a sliding rod, and one end of the sliding rod is fixedly connected to the moving plate, the sliding rod is provided with an air bag body, the air bag body is provided with a clamping plate, the clamping plate is provided with a support ring at both ends, and the support ring is fixed in the sliding rod.

[0015] Further description of the above technical scheme:

[0016] The communication assembly comprises a shunt pipe, the shunt pipe is provided with a hose at both ends, and one end of the hose away from the shunt pipe is in communication with the air bag body.

[0017] Further description of the above technical scheme:

[0018] The first pipe body is provided at the bottom end of the shunt pipe penetrating through the cover plate, the first pipe body is provided with a piston cylinder at the bottom end, the piston cylinder is provided with an arc-shaped strip at the top end, the arc-shaped strip is provided with a piston block inside, the piston block is fixedly connected with a supporting spring at the top end, and the supporting spring is fixed on the shunt pipe.

[0019] As a further description of the above technical solution:

[0020] The piston cylinder is provided with a touch valve at the bottom end, the touch valve is provided with a connecting pipe at the bottom end, the connecting pipe is communicated with the air pump, the touch valve is provided with a stop lever inside, and the touch valve is provided with a ventilation groove.

[0021] As a further description of the above technical solution:

[0022] The air pump is provided with a gas filling plate at the end away from the connecting pipe, and the gas filling plate is arranged in the copper deposition tank.

[0023] A copper deposition method for automatic processing of a multi-layer PCB board is used for the copper deposition device, and characterized by comprising the following steps: step one: the material distribution equipment equally distributes the PCB board on the fastening assembly, and the PCB board is placed into the copper deposition tank through the mechanical arm; step two: the air pump is started, the air pump pumps air into the copper deposition tank to increase the activity of the copper deposition liquid, and the air pump fastens and clamps the PCB board through the fastening assembly; step three: the motor is started, the motor drives the fastening assembly to move, and the fastening assembly drives the PCB board to swing in the copper deposition tank; and step four: the copper deposition reaction is completed, and the cleaning is performed.

[0024] The application provides a copper deposition device and a copper deposition method for automatic processing of a multi-layer PCB board, which has the following beneficial effects:

[0025] In the application, the fastening assembly fastens and clamps the PCB double-sided panel body through the driving assembly, the gas in the copper deposition tank is in contact with the copper deposition liquid, the PCB double-sided panel body fastened and clamped in the fastening assembly swings, so that the copper deposition liquid flows in the reaction groove hole of the PCB double-sided panel body, the high activity of the gas in contact with the copper deposition liquid is combined, and the reaction effect of the PCB double-sided panel body in the copper deposition tank is improved. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 A structure schematic view of the copper deposition device and the copper deposition method for automatic processing of a multi-layer PCB board is provided in the application;

[0027] Figure 2 A structure schematic view of the unloading valve in the application is provided;

[0028] Figure 3 A structure schematic view of the communication assembly in the application is provided;

[0029] Figure 4This is a schematic diagram of the fastening assembly in this invention;

[0030] Figure 5 This is a schematic diagram of the air pump in this invention;

[0031] Figure 6 This is a schematic diagram of the structure of the airbag in this invention;

[0032] Figure 7 This is a schematic diagram of the structure of the moving component in this invention;

[0033] Figure 8 This is a schematic diagram of the driving component in this invention;

[0034] Figure 9 This is a schematic diagram of the transmission component in this invention.

[0035] Legend: 1. Copper plating box; 11. Air pump; 12. Connecting pipe; 121. Touch valve; 123. Stop lever; 124. Ventilation slot; 13. Air filling plate; 14. Discharge valve; 2. Cover plate; 3. Drive assembly; 31. Bracket; 32. Connecting shaft; 33. Transmission component; 331. Gear plate; 332. Eccentric plate; 333. Lever; 34. Motor shaft; 35. Drive motor; 4. Moving assembly; 41. Moving plate; 42. Support arm; 43. Connecting plate; 44. Guide bar; 45. Rotating wheel; 5. Fastening assembly; 51. Slide bar; 52. Clamping plate; 521. Support ring; 53. Airbag body; 6. PCB double-sided board body; 7. Connecting assembly; 71. Diverter pipe; 72. Hose; 73. First pipe body; 74. Arc strip; 75. Piston block; 76. Support spring; 77. Piston cylinder. Detailed Implementation

[0036] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0037] Reference Figures 1-9 A copper plating apparatus and method for automated processing of multilayer PCBs includes a copper plating tank 1 and a cover plate 2 on the copper plating tank 1; it also includes a drive assembly 3, which is fixedly mounted on the cover plate 2; it further includes a moving assembly 4 and a fastening assembly 5, wherein the drive assembly 3 drives the fastening assembly 5 to reciprocate through the moving assembly 4, and the fastening assembly 5 has a PCB double-sided panel body 6 that swings within the copper plating tank 1 through the moving assembly 4 to increase the flow of copper plating liquid in the opening of the PCB double-sided panel body 6; it also includes an air pump 11 and a connecting assembly 7, wherein the connecting assembly 7 sends air from the air pump 11 into the fastening assembly 5 and the copper plating tank 1, and the fastening assembly 5 clamps the PCB double-sided panel body 6 and improves the activity of the copper plating liquid in the copper plating tank 1;

[0038] Specifically, the copper plating box 1 has a rectangular structure. The top cover 2 of the copper plating box 1 adopts a separate structure from the copper plating box 1. The fastening component 5, which carries the PCB double-sided board body 6, is placed into the copper plating box 1 by a handling device or a robot, so that the cover 2 and the copper plating box 1 form a complete reaction chamber. The connecting component 7 fixedly connected in the cover 2 is connected to the air pump 11 fixed on one side of the copper plating box 1 through the connecting pipe 12. When the air pump 11 is started, the air pump 11 supplies air to the copper plating box 1 and the fastening component 5 connected through the connecting component 7, so that the fastening component 5 can fasten and clamp the PCB double-sided board body 6 and the gas in the copper plating box 1 to contact the copper plating liquid and increase its activity. When the cover 2 and the copper plating box 1 are closed, the drive component 3 drives the fastening component 5 through the moving component 4, so that the PCB double-sided board body 6 fastened and clamped in the fastening component 5 can swing, so that the copper plating liquid can flow in the reaction slots opened in the PCB double-sided board body 6, thereby improving the reaction effect of the PCB double-sided board body 6 in the copper plating box 1.

[0039] The moving component 4 includes a moving plate 41, a connecting plate 43 fixedly connected to the top of the moving plate 41, a guide strip 44 fixedly connected to one end of the connecting plate 43, and a support arm 42 symmetrically fixedly connected to the end of the moving plate 41 passing through the connecting plate 43. A rotating wheel 45 is symmetrically provided at one end of the support arm 42. The driving component 3 includes a bracket 31, a connecting shaft 32 symmetrically provided at both ends of the bracket 31, a transmission component 33 provided at the bottom end of the connecting shaft 32, a motor shaft 34 meshing between the two transmission components 33, a drive motor 35 provided at the bottom end of the motor shaft 34, and the drive motor 35 fixed on the cover plate 2. The transmission component 33 includes a gear 331, and the gear 331 is adapted to the motor shaft 34. An eccentric plate 332 is fixedly connected to the bottom end of the gear 331, and a lever 333 is fixedly connected to one end of the eccentric plate 332. The lever 333 is adapted to the slot opened in the guide strip 44.

[0040] Specifically, the movable plate 41 is supported by the support arm 42. The rotating wheel 45, which is movably connected to one end of the support arm 42, is movably installed in the directional groove opened in the sliding cover. When the drive motor 35 drives the shaft 34 of the motor 35 to rotate, the transmission components 33 that are symmetrically meshed at both ends of the motor shaft 34 rotate in opposite directions. The gear plate 331 in the transmission component 33 meshes with the motor shaft 34. The eccentric plate 332 fixedly connected to the bottom end of the gear plate 331 drives the lever 333 to move. The lever 333 is adapted to the guide bar 44 fixedly connected to the top end of the movable plate 41. When the gear plate 331 rotates, the lever 333 drives the movable bar to reciprocate through the guide bar 44, so that the fastening component 5 fixedly connected to the movable bar will fasten and clamp the PCB double-sided panel body 6 to move synchronously with the fastening component 5. This facilitates the copper plating liquid in the copper plating box 1 to improve the reaction effect of the PCB double-sided panel body 6 in the copper plating box 1 during the swinging process of the PCB double-sided panel body 6 itself.

[0041] The fastening assembly 5 includes a slide rod 51, one end of which is fixedly connected to the moving plate 41. An airbag 53 is located inside the slide rod 51, and a clamping plate 52 is located inside the airbag 53. Support rings 521 are symmetrically arranged at both ends of the clamping plate 52 and are fixed inside the slide rod 51. The connecting assembly 7 includes a diversion pipe 71, with flexible hoses 72 symmetrically arranged at both ends. The end of the flexible hose 72 away from the diversion pipe 71 is connected to the airbag 53. A first tube 73 is provided at the bottom end of the diversion pipe 71, penetrating the cover plate 2. A piston cylinder 7 is located at the bottom end of the first tube 73. 7. The piston cylinder 77 has an arc-shaped strip 74 at its top end, and a piston block 75 is provided inside the arc-shaped strip 74. A support spring 76 is fixedly connected to the top end of the piston block 75, and the support spring 76 is fixed on the diverter pipe 71. The piston cylinder 77 has a touch valve 121 at its bottom end, and a connecting pipe 12 is provided at the bottom end of the touch valve 121. The connecting pipe 12 is connected to the air pump 11. The touch valve 121 has a stop bar 123 inside, and a venting groove 124 inside the touch valve 121. The end of the air pump 11 away from the connecting pipe 12 has an air filling plate 13, and the air filling plate 13 is located inside the copper plating box 1.

[0042] Specifically, the slide bar 51 has a pre-drilled mounting slot after being cut into a cross shape. The airbag 53 is then fixed inside the slide bar 51 by a clamping plate 52 connected to the support ring 521. A hose 72 pressurizes and inflates the airbag 53, causing it to expand. The PCB double-sided panel body 6, positioned within the slide bar 51 by a fabric placing machine, is then securely clamped by the expanding airbag 53. This allows the airbag 53 to clamp the PCB double-sided panel body 6 at any position on the slide bar 51. Furthermore, when the slide bar 51 moves, the airbag 53 drives the PCB double-sided panel body 6 to move, achieving the desired PCB double-sided panel movement. The panel body 6 reacts efficiently with the copper plating solution in the copper plating tank 1. The airbag body 53 is connected to the air pump 11 via the diversion pipe 71 connected to the hose 72. When the cover plate 2 is closed with the copper plating tank 1, the stop bar 123 fixedly connected to one end of the copper plating tank 1 abuts against the piston block 75 in the piston cylinder 77, so that the piston block 75 squeezes the support spring 76 and moves to the first tube 73. The first tube 73 is connected to the diversion pipe 71 and the connecting pipe 12 through the piston cylinder 77, so that the air pump 11 can send gas into the airbag body 53 to clamp the PCB double panel body 6 and improve the stability of the PCB double panel body 6 during copper plating.

[0043] A method for automated copper plating of multilayer PCBs, using the aforementioned copper plating apparatus, is characterized by the following steps: Step 1: A material feeding device distributes the PCBs equidistantly on the fastening assembly 5, and a robotic arm places the PCBs into the copper plating tank; Step 2: An air pump 11 is started, pumping air into the copper plating tank 1 to increase the activity of the copper plating solution, and the air pump 11 clamps the PCBs securely through the fastening assembly 5; Step 3: A motor is started, driving the fastening assembly 5 to move, causing the PCBs to swing within the copper plating tank; Step 4: The copper plating reaction is completed, and the PCBs are cleaned.

[0044] Working principle: First, the handling equipment or robot puts the fastening component 5, which carries the PCB double-sided panel body 6, into the copper plating tank 1, so that the cover plate 2 and the copper plating tank 1 form a complete reaction chamber. The connecting component 7, which is fixedly connected in the cover plate 2, is connected to the air pump 11 fixed on one side of the copper plating tank 1 through the connecting pipe 12. The air pump 11 is started, and the air pump 11 supplies air to the copper plating tank 1 and the fastening component 5 connected by the connecting component 7, so that the fastening component 5 can fasten and clamp the PCB double-sided panel body 6 and the gas in the copper plating tank 1 to contact the copper plating liquid and increase its activity. When the cover plate 2 and the copper plating tank 1 are closed, the drive component 3 drives the fastening component 5 through the moving component 4, so that the PCB double-sided panel body 6 fastened and clamped in the fastening component 5 can swing, so that the copper plating liquid can flow in the reaction slots opened in the PCB double-sided panel body 6. Finally, after the copper plating reaction is completed, the cover plate 2, which carries the PCB double-sided panel body 6, is separated from the copper plating tank 1 by the handling equipment or robot, and the waste liquid in the copper plating tank 1 is discharged through the discharge valve 14.

[0045] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A copper plating apparatus for automated processing of multilayer PCB boards, characterized in that, include: A copper plating box (1) is provided with a cover plate (2); It also includes a drive assembly (3), which is fixedly mounted on the cover plate (2); It also includes a moving component (4) and a fastening component (5). The driving component (3) drives the fastening component (5) to reciprocate through the moving component (4). The fastening component (5) is provided with a PCB double-sided panel body (6) that swings in the copper plating box (1) through the moving component (4), increasing the flow of copper plating liquid in the opening of the PCB double-sided panel body (6). It also includes an air pump (11) and a connecting component (7), which sends the gas from the air pump (11) into the fastening component (5) and the copper plating box (1), and clamps the PCB double-sided board body (6) through the fastening component (5) and improves the activity of the copper plating liquid in the copper plating box (1).

2. The copper plating apparatus for automated processing of multilayer PCB boards according to claim 1, characterized in that, The moving component (4) includes a moving plate (41), a connecting plate (43) is fixedly connected to the top of the moving plate (41), a guide strip (44) is fixedly connected to one end of the connecting plate (43), and a support arm (42) is symmetrically fixedly connected to one end of the moving plate (41) near the connecting plate (43), and a rotating wheel (45) is symmetrically provided at one end of the support arm (42).

3. The copper plating apparatus for automated processing of multilayer PCB boards according to claim 1, characterized in that, The drive assembly (3) includes a bracket (31), with connecting shafts (32) symmetrically arranged at both ends of the bracket (31). A transmission component (33) is provided at the bottom end of the connecting shaft (32). A motor shaft (34) meshes between the two transmission components (33). A drive motor (35) is provided at the bottom end of the motor shaft (34), and the drive motor (35) is fixed on the cover plate (2).

4. The copper plating apparatus for automated processing of multilayer PCB boards according to claim 3, characterized in that, The transmission component (33) includes a gear plate (331), and the gear plate (331) is adapted to the motor shaft (34). An eccentric plate (332) is fixedly connected to the bottom end of the gear plate (331), and a lever (333) is fixedly connected to one end of the eccentric plate (332), and the lever (333) is adapted to the slot opened in the guide bar (44).

5. The copper plating apparatus for automated processing of multilayer PCB boards according to claim 1, characterized in that, The fastening assembly (5) includes a slide rod (51), one end of which is fixedly connected to the movable plate (41). An airbag (53) is provided inside the slide rod (51), and a clamping plate (52) is provided inside the airbag (53). Support rings (521) are symmetrically provided at both ends of the clamping plate (52), and the support rings (521) are fixed inside the slide rod (51).

6. The copper plating apparatus for automated processing of multilayer PCB boards according to claim 1, characterized in that, The connecting component (7) includes a diverter tube (71), with flexible tubes (72) symmetrically arranged at both ends of the diverter tube (71), and the end of the flexible tube (72) away from the diverter tube (71) is connected to the airbag body (53).

7. The copper plating apparatus for automated processing of multilayer PCB boards according to claim 6, characterized in that, The bottom end of the diversion pipe (71) passes through the cover plate (2) and is provided with a first pipe body (73). The bottom end of the first pipe body (73) is provided with a piston cylinder (77). The top end of the piston cylinder (77) is provided with an arc-shaped strip (74). The arc-shaped strip (74) is provided with a piston block (75). The top end of the piston block (75) is fixedly connected with a support spring (76), and the support spring (76) is fixed on the diversion pipe (71).

8. The copper plating apparatus for automated processing of multilayer PCB boards according to claim 7, characterized in that, The piston cylinder (77) is provided with a touch valve (121) at the bottom end. The touch valve (121) is provided with a connecting pipe (12) at the bottom end, and the connecting pipe (12) is connected to the air pump (11). The touch valve (121) is provided with a stop bar (123) and a ventilation groove (124).

9. The copper plating apparatus for automated processing of multilayer PCB boards according to claim 1, characterized in that, The air pump (11) is provided with an air filling plate (13) at the end away from the connecting pipe (12), and the air filling plate (13) is located inside the copper sink (1).

10. A method for automated processing of multilayer PCB boards using copper plating, for implementing the copper plating apparatus described in 1-9 above, characterized in that, Includes the following steps: Step 1: The fabric placement equipment distributes the PCB boards evenly on the fastening assembly (5), and then places the PCB boards into the copper plating box using a robotic arm; Step 2: Start the air pump (11) to pump air into the copper plating box to increase the activity of the copper plating solution. The air pump and the fastening assembly (5) clamp the PCB board tightly. Step 3: Start the motor, the motor drives the fastening assembly (5) to move, and the fastening assembly (5) causes the PCB board to swing inside the copper plating box; Step 4: The copper plating reaction is complete; clean up.

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